TWI900940B - Photosensitive resin composition, photosensitive resin layer, color filter, and cmos image sensor - Google Patents

Abstract

This disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the same, a color filter and a CMOS image sensor. An embodiment provides a photosensitive resin composition including (A) a photopolymerization initiator; (B) a photopolymerizable compound; (C) a colorant; and (D) a solvent, wherein the photopolymerization initiator includes a first photopolymerization initiator represented by Chemical Formula 1 and a second photopolymerization initiator represented by Chemical Formula 2. Chemical Formulas 1 and 2 are defined in the specification. This disclosure improves a shape and a profile of a CIS pattern.

Description

Photosensitive resin composition, photosensitive resin layer, color filter and CMOS image sensor

The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the same, a color filter, and a CMOS image sensor.

[Cross-reference to related applications]

This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0040646, filed on March 28, 2023, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference.

An image sensor is a semiconductor that converts photons into electrons and displays them on a display device or stores them in a storage device.

Image sensors are categorized into charge coupled device (CCD) image sensors and complementary metal-oxide semiconductor (CMOS) image sensors based on their manufacturing process and application methods.

A CMOS image sensor (CIS) is a semiconductor that converts images received by a camera into digital signals. It consists of a collection of pixels, color filters, photodiodes, and amplifiers.

Color filters consist of filter segments that are a composite of red, green, and blue primary colors. They are manufactured by repeating a series of processes: coating a photosensitive resin composition containing a colorant on a substrate or underlying photosensitive resin layer, exposing the pattern to be formed, developing it, and thermally curing it through a post-baking process to form a photosensitive resin layer.

If the shape of the final CIS pattern is irregular after completing all of the above processes, or if the target size and the size of the final CIS pattern are different, the performance of the CIS device will be affected.

The embodiment provides a photosensitive resin composition that can improve the shape and outline of a CIS pattern.

In an embodiment, a photosensitive resin composition comprises: (A) a photopolymerization initiator; (B) a photopolymerizable compound; (C) a colorant; and (D) a solvent, wherein the photopolymerization initiator comprises a first photopolymerization initiator represented by Chemical Formula 1 and a second photopolymerization initiator represented by Chemical Formula 2: [Chemical Formula 1]

Wherein, in Chemical Formula 1, ^X1 is ^CRaRb or ^NRc , wherein ^Ra , ^Rb, and ^Rc are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group; ^R1 to ^R4 are each independently ^a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group; and ^R5 to ^R8 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted C1 to C20 alkyl group, or a substituent represented by Chemical Formula A, provided that at least one of ^R5 to ^R8 is a substituent represented by Chemical Formula A;

Wherein, in Chemical Formula A, ^L1 is a single bond or *-C(=O)-*, and ^R9 and ^R10 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group; [Chemical Formula 2]

wherein, in Chemical Formula 2, ^X2 is ^CRdRe or ^NRf , wherein ^Rd , ^Re, and ^Rf are each independently a hydrogen atom or a substituted or unsubstituted C1-C20 alkyl group; ^R11 to ^R14 are each independently ^a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, or *-C(=O) ^-Rg , wherein ^Rg is a substituted or unsubstituted C6-C20 aryl group, with the proviso that at least one of ^R11 to ^R14 is a nitro group or *-C(=O) ^-Rg ; and ^R15 to ^R18 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted C1-C20 alkyl group, or a substituent represented by Chemical Formula B, with the proviso that at least one of ^R15 to ^R18 is a substituent represented by Chemical Formula B;

In Formula B, L ² is a single bond or *-C(=O)-*, and R ¹⁹ and R ²⁰ are each independently a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group.

^Ra , ^Rb, and ^Rc may each independently be a methyl group or an n-butyl group.

X ¹ can be C(n-Bu) ₂ or N(Et).

All of R ¹ to R ⁴ may be hydrogen atoms.

R ⁶ may be a substituent represented by Chemical Formula A.

All of R ⁵ , R ⁷ and R ⁸ may be hydrogen atoms.

The first photopolymerization initiator can be represented by any one of Chemical Formulas 1-1 to 1-4:

[Chemical formula 1-4]

In Chemical Formulae 1-1 to 1-4, R ¹ to R ⁵ , R ⁷ to R ¹⁰ and ^Ra to R ^c are the same as defined above.

The first photopolymerization initiator can be selected from the following groups:

[Chemical formula 1-3-1]

R ^d , ^Re and R ^f may each independently be ethyl or n-butyl.

X ² can be C(n-Bu) ₂ or N(Et).

R ¹³ may be a nitro group or *-C(=O)-R ^g ; and all of R ¹¹ , R ¹² , and R ¹⁴ may be hydrogen atoms.

R ¹⁶ may be a substituent represented by Chemical Formula B; and all of R ¹⁵ , R ¹⁷ , and R ¹⁸ may be hydrogen atoms.

The second photopolymerization initiator can be represented by any one of Chemical Formulas 2-1 to 2-8: [Chemical Formula 2-1]

[Chemical formula 2-5]

In Chemical Formulae 2-1 to 2-8, R ¹¹ , R ¹² , R ¹⁴ , R ¹⁵ , R ¹⁷ to R ²⁰ and R ^d to R ^g have the same definitions as described above.

The second photopolymerization initiator can be selected from the following groups:

[Chemical formula 2-4-1]

[Chemical formula 2-7-1]

The first photopolymerization initiator and the second photopolymerization initiator may be included in a weight ratio of 70:30 to 95:5.

The total photopolymerization initiator may be included in an amount of 0.1 wt% to 5 wt% based on the total amount of the photosensitive resin composition.

Based on the total weight of the photosensitive resin composition, the photosensitive resin composition may include: 0.1 wt% to 5 wt% of (A) a photopolymerization initiator; 0.1 wt% to 10 wt% of (B) a photopolymerizable compound; 40 wt% to 90 wt% of (C) a colorant; and the remainder (D) a solvent.

The photosensitive resin composition may further include (E) a binder resin.

Another embodiment provides a photosensitive resin layer made using a photosensitive resin composition.

Another embodiment provides a color filter comprising a photosensitive resin layer.

Another embodiment provides a CMOS image sensor including a color filter.

Other embodiments of the present invention are included in the following detailed description.

The photosensitive resin composition of some exemplary embodiments can improve the shape and outline of CIS patterns by combining two types of photopolymerization initiators.

Figure 1 shows the 0.8 μm pattern CD image of Example 4.

Figure 2 shows the 0.8 μm pattern CD image of Example 5.

Figure 3 shows the 0.8 μm pattern CD image of Comparative Example 2.

Figure 4 shows the FE-SEM image of Example 4.

Figure 5 shows the FE-SEM image of Example 5.

Figure 6 shows the FE-SEM image of Comparative Example 2.

The following describes embodiments of the present invention in detail. However, these embodiments are exemplary and the present invention is not limited thereto and is defined by the scope of the patent application.

(Photosensitive resin composition)

The embodiment provides a photosensitive resin composition comprising: (A) a photopolymerization initiator; (B) a photopolymerizable compound; (C) a colorant; and (D) a solvent.

(A) Photopolymerization initiator

The photosensitive resin composition of the embodiment can improve the shape and outline of the CIS pattern by combining two types of photopolymerization initiators.

In particular, the photopolymerization initiator comprises a first photopolymerization initiator represented by Chemical Formula 1 and a second photopolymerization initiator represented by Chemical Formula 2:

In Chemical Formula 1, ^X1 is ^CRaRb or ^NRc , wherein ^Ra , ^Rb, and ^Rc are each independently a hydrogen atom or a substituted or unsubstituted C1-C20 alkyl group; ^R1 to ^R4 are each independently ^a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1-C20 alkyl group; and ^R5 to ^R8 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted C1-C20 alkyl group, or a substituent represented by Chemical Formula A, provided that at least one of ^R5 to ^R8 is a substituent represented by Chemical Formula A;

Wherein, in Chemical Formula A, ^L1 is a single bond or *-C(=O)-*, and ^R9 and ^R10 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group;

wherein, in Chemical Formula 2, ^X2 is ^CRdRe or ^NRf , wherein ^Rd , ^Re, and ^Rf are each independently a hydrogen atom or a substituted or unsubstituted C1-C20 alkyl group; ^R11 to ^R14 are each independently ^a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, or *-C(=O) ^-Rg , wherein ^Rg is a substituted or unsubstituted C6-C20 aryl group, with the proviso that at least one of ^R11 to ^R14 is a nitro group or *-C(=O) ^-Rg ; and ^R15 to ^R18 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted C1-C20 alkyl group, or a substituent represented by Chemical Formula B, with the proviso that at least one of ^R15 to ^R18 is a substituent represented by Chemical Formula B;

In Formula B, L ² is a single bond or *-C(=O)-*, and R ¹⁹ and R ²⁰ are each independently a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group.

The first and second photopolymerization initiators typically comprise: a fluorene or oxazole parent moiety; and an oxime ester substituent substituted on one benzene ring of the parent moiety. Alternatively, the first and second photopolymerization initiators differ in the other benzene ring of the parent moiety.

In particular, since the nitro group or *-C(=O)-R ^g is always substituted on the other benzene ring of the parent moiety, the second photopolymerization initiator can exhibit a sensitivity characteristic corresponding to "high" on a scale of high/medium/low. Therefore, in some cases, the second photopolymerization initiator can be referred to as a "high-sensitivity initiator."

On the other hand, a first photopolymerization initiator not substituted with the above substituents (nitro or *-C(=O)-R ^g ) may exhibit a sensitivity characteristic corresponding to "medium" among high/medium/low. Therefore, in some cases, the first photopolymerization initiator may be referred to as a "medium-sensitivity initiator."

Therefore, since the first photopolymerization initiator and the second photopolymerization initiator complement each other in terms of sensitivity, when used together, the shape and outline of the CIS pattern can be improved.

Chemical Formula 1 is described as follows: ^Ra , ^Rb, and ^Rc may each independently be ethyl or n-butyl.

X ¹ can be C(n-Bu) ₂ or N(Et). Herein, "n-Bu" means "n-butyl" and "Et" means "ethyl".

All of R ¹ to R ⁴ may be hydrogen atoms.

R ⁶ may be a substituent represented by Chemical Formula A; and all of R ⁵ , R ⁷ and R ⁸ may be hydrogen atoms.

In particular, the first photopolymerization initiator can be represented by any one of Chemical Formulas 1-1 to 1-4:

[Chemical formula 1-4]

In Chemical Formulae 1-1 to 1-4, R ¹ to R ⁵ , R ⁷ to R ¹⁰ and ^Ra to R ^c are the same as defined above.

Representative examples of the first photopolymerization initiator are as follows:

[Chemical formula 1-3-1]

Chemical formula 2 is described as follows: R ^d , ^Re and R ^f may each independently be ethyl or n-butyl.

X ² can be C(n-Bu) ₂ or N(Et). Herein, "n-Bu" means "n-butyl" and "Et" means "ethyl".

R ¹³ may be a nitro group or *-C(=O)-R ^g ; and all of R ¹¹ , R ¹² , and R ¹⁴ may be hydrogen atoms.

R ¹⁶ may be a substituent represented by Chemical Formula B; and all of R ¹⁵ , R ¹⁷ , and R ¹⁸ may be hydrogen atoms.

The second photopolymerization initiator can be represented by any one of Chemical Formulas 2-1 to 2-8: [Chemical Formula 2-1]

[Chemical formula 2-5]

In Chemical Formulae 2-1 to 2-8, R ¹¹ , R ¹² , R ¹⁴ , R ¹⁵ , R ¹⁷ to R ²⁰ and R ^d to R ^g have the same definitions as described above.

Representative examples of the second photopolymerization initiator are as follows:

[Chemical formula 2-4-1]

[Chemical formula 2-7-1]

In the photosensitive resin composition of the embodiment, the sensitivity can be supplemented by including a small amount of a second photopolymerization initiator with a high sensitivity and an excess of a first photopolymerization initiator with a medium sensitivity.

In particular, in the photosensitive resin composition of the embodiment, the first photopolymerization initiator and the second photopolymerization initiator may be contained in a weight ratio of 70:30 to 99:1, and particularly 80:20 to 95:5.

The total photopolymerization initiator may be included in an amount of 0.1 wt% to 5 wt%, particularly 0.2 wt% to 3 wt%, for example 0.3 wt% to 1 wt%, based on the total amount of the photosensitive resin composition.

If the photopolymerization initiator is within this range, sufficient photopolymerization occurs during exposure in the patterning process, achieving excellent reliability, improving the pattern's heat resistance, light resistance, and chemical resistance, as well as resolution and close contact properties, while preventing transmittance reduction caused by unreactive initiators.

In addition, the photopolymerization initiator may further include an initiator commonly used in photosensitive resin compositions, such as acetophenone compounds, benzophenone compounds, thioxanone compounds, benzoin compounds, triazine compounds, oxime compounds, or combinations thereof.

Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 4-tert-butyltrichloroacetophenone, 4-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

Examples of benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

Examples of thiothione compounds include thiothione, 2-methylthiothione, isopropylthiothione, 2,4-diethylthiothione, 2,4-diisopropylthiothione, and 2-chlorothiothione.

Examples of benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine. -s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-sunflower-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxyphenylvinyl)-s-triazine, etc.

Examples of oxime compounds include O-acyloxime compounds, 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-oxazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of o-acyl oxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-pyrrolidone-4-ylphenyl)-butan-1-one, 1-(4-phenylhydrothiophenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylhydrothiophenyl)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylhydrothiophenyl)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylhydrothiophenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylhydrothiophenyl)-butan-1-one oxime-O-acetate.

In addition to the aforementioned compounds, photopolymerization initiators may include oxazole compounds, diketone compounds, cobalt borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, fluorene compounds, etc.

Photopolymerization initiators can be used together with photosensitizers that absorb light, become excited, and then transfer its energy to cause a chemical reaction.

Examples of photosensitizers include tetraethylene glycol di-3-butyl propionate, pentaerythritol tetra-3-butyl propionate, dipentaerythritol tetra-3-butyl propionate, etc.

(B) Photopolymerizable compound

The photopolymerizable compound may be a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

The photopolymerizable compound has ethylenically unsaturated double bonds, which allows it to form patterns with excellent heat resistance, light resistance, and chemical resistance by inducing sufficient polymerization during exposure in the pattern formation process.

Specific examples of the photopolymerizable compound include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol bis(meth)acrylate, bisphenol A di ... Pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, tri(meth)acryloyloxyethyl phosphate, novolac epoxy(meth)acrylate, etc.

Examples of commercially available photopolymerizable compounds are as follows. Monofunctional (meth)acrylates include Aronix M- ^101® , Aronix M- ^111® , and Aronix M- ^114® (Toagosei Chemical Industry Co., Ltd.); KAYARAD TC- ^110S® and KAYARAD TC- ^120S® (Nippon Kayaku Co., Ltd.); and V- ^158® and V- ^2311® (Osaka Organic Chemical Ind., Ltd.). Examples of difunctional (meth)acrylates include Anix M- ^210® , Anix M- ^240® , Anix M-6200® (Toagosei Chemical Industry Co., Ltd.), Caylard ^HDDA® , Caylard HX- ^220® , Caylard R- ^604® (Nippon Kayaku Co., Ltd.), V- ^260® , V- ^312® , V-335 ^HP® (Osaka Organic Chemical Industry Co., Ltd. ⁾ , and the like. Examples of trifunctional (meth)acrylates include Anix M- ^309® , Anix M- ^400® , Anix M- ^405® , Anix M- ^450® , Anix M- ^710® , Anix M- ^8030® , Anix M- ^8060® (Toagosei Chemical Industry Co., Ltd.); Cayalade ^TMPTA® , Cayalade DPCA- ^20® , Cayalade DPCA- ^30® , Cayalade DPCA- ^60® , Cayalade DPCA- ^120® (Nippon Kayaku Co., Ltd.); V- ^295® , V- ^300® , V- ^360® , V- ^GPT® , V- ^3PA® , V- ^400® (Osaka Yuki Kayaku Kogyo Co. Ltd.), etc. These may be used alone or in admixture of two or more.

Photopolymerizable compounds can be treated with anhydrides or modified with ethylene oxide to impart better developing properties.

The photopolymerizable compound may be included in an amount of 0.1 to 10 wt %, particularly 0.5 to 5 wt %, and for example, 1 to 3 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerizable compound is included within the above range, sufficient curing occurs during exposure during the patterning process, resulting in excellent reliability and excellent developability using an alkaline developer.

(C) Colorant

The photosensitive resin composition of the embodiment may contain a pigment as a colorant.

The pigments may be red, purple, green, blue, yellow, black, etc.

The red pigment may be C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, etc. in the Color Index. These pigments may be used alone or in mixtures of two or more, but the present invention is not limited thereto.

The purple pigment may be C.I. Purple Pigment 23 (V.23), C.I. Purple Pigment 29, Diaxazine Violet, First Violet B, Methyl Deep Purple, Indanthrene Brilliant Violet, etc. in the Color Index. These pigments may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

The green pigment may be C.I. Green Pigment 7, C.I. Green Pigment 36, C.I. Green Pigment 58, C.I. Green Pigment 59, etc. in the Color Index. These may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

The blue pigment may be a copper phthalocyanine pigment, such as C.I. Blue Pigment 15:6, C.I. Blue Pigment 15, C.I. Blue Pigment 15:1, C.I. Blue Pigment 15:2, C.I. Blue Pigment 15:3, C.I. Blue Pigment 15:4, C.I. Blue Pigment 15:5, C.I. Blue Pigment 15:6, and C.I. Blue Pigment 16 in the Color Index. These pigments may be used alone or as a mixture of two or more, but the present invention is not limited thereto.

The yellow pigment may be an isoindoline pigment listed in the Color Index, such as C.I. Yellow Pigment 185 and C.I. Yellow Pigment 139; a quinoline yellow pigment, such as C.I. Yellow Pigment 138; or a nickel composite pigment, such as C.I. Yellow Pigment 150. These pigments may be used alone or in mixtures of two or more, but the present invention is not limited thereto.

The black pigment may be aniline black, perylene black, titanium black, carbon black, etc. in the color index. They may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

In particular, the colorant may achieve a blue color by including a blue pigment, a purple pigment, or a combination thereof. More particularly, the pigment may be a mixture comprising a blue pigment and a purple pigment in a weight ratio of 99:1 to 50:50 or 90:10 to 60:40.

The pigment can be contained in the near-infrared absorbing resin composition in the form of a dispersion. This pigment dispersion can be composed of a pigment, a solvent, a dispersant, a dispersing resin, etc.

The solvent may include ethylene glycol acetate, ethyl cellulose, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc., and among them, propylene glycol methyl ether acetate.

Dispersants help evenly disperse the pigment in the dispersion, and nonionic, anionic, or cationic dispersants can be used. In particular, polyalkylene glycols or their esters, polyalkylene oxides, polyol ester epoxide adducts, alcohol epoxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide epoxide adducts, and alkylamines can be used. These can be used alone or in mixtures of two or more.

The dispersing resin may be an acrylic resin containing a carboxyl group, which can improve the stability of the pigment dispersion and also improve the pixel patterning ability.

The coloring agent may further include a dye and a pigment. Furthermore, the dye is not particularly limited but may include a metal complex dye.

Metal complex dyes can be compounds with maximum absorbance in the wavelength range of 200 nm to 650 nm. If the compound has absorbance within this range, color coordinates can be matched to the dye combination, allowing metal complex dyes of all colors dissolved in an organic solvent to be used.

In particular, the metal complex dye may be a green dye having a maximum absorbance in the wavelength range of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength range of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength range of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength range of 500 nm to 650 nm, or a combination thereof.

Metal complex dyes can be direct dyes, acid dyes, alkaline dyes, acid mordant dyes, sulfur dyes, vat dyes, azo dyes, disperse dyes, reactive dyes, oxidation dyes, oil-soluble dyes, azo dyes, anthraquinone dyes, indigo dyes, carbonium ion dyes, phthalocyanine dyes, nitro dyes, quinoline dyes, cyanine dyes, polymethine dyes, or combinations thereof.

The metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

The metal complex dye may be a complex with a metal ion selected from the group consisting of: C.I. solvent dyes, such as C.I. solvent green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, etc.; C.I. acid dyes, such as C.I. acid green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14 , 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109, etc.; C.I. direct dyes, such as C.I. Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82, etc.; C.I. alkaline dyes, such as C.I. Alkaline Green 1, etc.; C.I. mordant dyes, such as C.I. Mordant Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41, 43, 53, etc.; C.I. green pigments, such as Pigment Green 7, 36, 58, etc. Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132, and Solvent Red 218.

The solubility of the metal complex dye in the solvent used in the photosensitive resin composition according to some embodiments (i.e., the solvent to be described later) can be greater than or equal to 5, particularly 5 to 10. The solubility can be achieved by the amount (grams) of dye dissolved in 100 grams of the solvent. If the solubility of the metal complex dye is within the above range, compatibility with other components of the photosensitive resin composition according to some embodiments and coloring power can be ensured, and dye precipitation can be prevented.

The solvent may be, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

Since the solvent has the above specific range, it is suitable for color filters that exhibit high brightness and high contrast in the desired color coordinates, such as LCDs and LEDs.

The metal complex dye may be included in an amount of 0.01 to 1% by weight, for example, 0.01 to 0.5% by weight, based on the total weight of the photosensitive resin composition. Using the metal complex dye within this range can achieve high brightness and contrast within the desired color coordinates.

When dyes and pigments are mixed and used, they can be mixed in a weight ratio of about 0.1:99.9 to about 99.9:0.1, and particularly about 1:9 to about 9:1. Mixing within the above weight ratio ranges allows for control of chemical resistance and maximum absorption wavelength within appropriate ranges, while achieving high brightness and contrast within desired color coordinates.

The colorant may be included in an amount of 40% to 90% by weight, particularly 50% to 85% by weight, for example 60% to 80% by weight, based on the total amount of the photosensitive resin composition. If the colorant is included within the above range, the coloring effect and developing properties are improved.

(D) Solvent

The solvent can be a material that is compatible with the additive, binder resin, photopolymerizable compound, or photopolymerization initiator but does not react with them.

Examples of the solvent may include: alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc.; thiocyanate acetates such as methylthiocyanate acetate, ethylthiocyanate acetate, diethylthiocyanate acetate, etc.; carbitols such as methylethylcarbitol, diethylcarbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates, Such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; aromatic hydrocarbons, such as toluene, xylene, etc.; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-acetone, methyl-n-butyl ketone, methyl-n-pentanone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters, such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters, such as methyl methoxyacetate Ester, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; alkyl 3-oxypropionate, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionate, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionate, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionate, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionic acid esters, such as 2-oxy-2-methylmethyl propionate, 2-oxy-2-methylethyl propionate, etc.; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylalkyl propionates, such as 2-methoxy-2-methylmethyl propionate, 2-ethoxy-2-methylethyl propionate, etc.; esters, such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, 2-hydroxy-3-methylmethyl butyrate, etc.; ketoesters, such as ethyl pyruvate, etc. In addition, high-boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethyl carbonate, propyl carbonate, phenyl celecoxib, etc. can also be used.

Among them, considering compatibility and reactivity, ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl saloxaline acetate; esters such as 2-hydroxyethyl propionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; and ketones such as cyclohexanone can be used.

For example, the solvent may include two or more solvents with different boiling points. The "boiling point" of a liquid material is the temperature at which the vapor pressure of the liquid material becomes equal to the external pressure and begins to boil, and it changes depending on the external pressure. Some embodiments address the boiling point at 1 standard atmosphere.

Because the photosensitive resin composition of some embodiments includes two solvents with different boiling points, the solvent volatility rate and volatility location can be coordinated and controlled during the process of coating the photosensitive resin composition on a substrate or an underlying photosensitive resin layer. By allowing solvent volatility to occur primarily on the surface rather than beneath the coating, filling properties, surface roughness, and other properties can be improved.

For example, the solvent may include two or more solvents of propylene glycol monomethyl ether acetate (PGMEA), n-butyl acetate (n-BA), and diethylene glycol methyl ethyl ether (MEDG). Of course, all three types of solvents may be included, and in this case, the synergistic effect is greatest.

The solvent may be included in an amount of, for example, 5% to 30% by weight, for example, 10% to 20% by weight, based on the total weight of the photosensitive resin composition. If the solvent is included within the above range, it is possible to obtain a coating film having excellent coatability and excellent flatness of the photosensitive resin composition.

(E) Adhesive resin

The photosensitive resin composition may include a binder resin, and the binder resin may include an acrylic binder resin.

The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer (which is copolymerizable with the first ethylenically unsaturated monomer), and is a resin containing at least one acrylic repeating unit.

The first ethylenically unsaturated monomer may be an ethylenically unsaturated monomer containing at least one carboxyl group, and examples of the monomer may include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, and combinations thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic adhesive resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound, such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound, such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl Ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; vinyl carboxylate compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These compounds may be used alone or in a mixture of two or more.

Specific examples of acrylic resins include, but are not limited to, (meth)acrylic acid/benzyl methacrylate copolymers, (meth)acrylic acid/benzyl methacrylate copolymers, (meth)acrylic acid/benzyl methacrylate/styrene copolymers, (meth)acrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate copolymers, and (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymers. These may be used alone or in mixtures of two or more.

The adhesive resin may include an epoxy-based adhesive resin.

The adhesive resin may further include an epoxy-based adhesive resin to improve heat resistance. The epoxy-based adhesive resin may be, for example, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin, or a combination thereof, but is not limited thereto.

Furthermore, the binder resin including the epoxy-based binder resin ensures the dispersion stability of a colorant such as a pigment, which will be described later, and helps form pixels with desired resolution during the development process.

The epoxy adhesive resin may be included in an amount of 1 to 10 wt%, for example, 5 to 10 wt%, based on the total amount of the adhesive resin. If the epoxy adhesive resin is included within the above range, film retention and chemical resistance can be significantly improved.

The epoxy equivalent weight of the epoxy resin can be 150 to 200 g/equivalent. Including an epoxy adhesive resin having an epoxy equivalent weight within this range in the adhesive resin has the beneficial effect of improving the degree of curing of the formed pattern and fixing the colorant in the structure of the formed pattern.

The binder resin can be dissolved in a solid form in a solvent (described later) to form a photosensitive resin composition. In this case, the solid binder resin may account for 10% to 50% by weight, for example, 20% to 40% by weight, based on the total weight of the binder resin solution dissolved in the solvent.

The binder resin may be included in an amount of 1 to 20 wt %, particularly 2 to 15 wt %, for example 3 to 10 wt %, based on the total amount of the photosensitive resin composition. If the binder resin is included within the above range, it is possible to achieve excellent surface smoothness due to excellent development and improved crosslinking properties during the production of the color filter.

(F) Other additives

The photosensitive resin composition may further include at least one additive selected from the following: malonic acid; 3-amino-1,2-propanediol; a coupling agent containing a vinyl or (meth)acryloyloxy group; and a free radical polymerization initiator to prevent smearing or spotting during coating, improve leveling performance, and prevent the generation of undeveloped residues.

Additives can be easily adjusted according to the desired physical properties.

The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent include trimethoxysilylbenzoic acid, γ-methacryloylpropyloxytrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and β-epoxycyclohexylethyltrimethoxysilane. These coupling agents may be used alone or as a mixture of two or more types.

Based on 100 parts by weight of the photosensitive resin composition, the silane coupling agent can be used in an amount of 0.01 to 1 parts by weight.

In addition, if necessary, the photosensitive resin composition used for the color filter may further contain a surfactant, such as a fluorine-based surfactant.

Examples of fluorine-based surfactants include, but are not limited to, F-482, F-484, and F-478 from Dainippon Ink & Chemicals Co., Ltd. (DIC Co., Ltd.).

The surfactant may be contained in an amount of 0.01 to 5% by weight, preferably 0.01 to 2% by weight, based on the total amount of the photosensitive resin composition. Exceeding the above range may cause the problem of unwanted generation of foreign matter after development.

In addition, a certain amount of other additives (such as antioxidants, stabilizers, etc.) can be added to the photosensitive resin composition within a range that does not damage the physical properties.

(Photosensitive resin layer, color filter, and CMOS image sensor)

Another embodiment provides a photosensitive resin layer manufactured using the photosensitive resin composition according to another embodiment.

Another embodiment provides a color filter made using the aforementioned photosensitive resin composition.

The method for manufacturing color filters is as follows.

The aforementioned photosensitive resin composition is applied by an appropriate method, such as spin coating, roll coating, spray coating, etc., to form a photosensitive resin composition layer with a thickness of 0.5 microns to 10 microns on the glass substrate.

The substrate with the photosensitive resin layer is then irradiated with light to form the desired color filter pattern. This irradiation can be performed using UV light, electron beams, or X-rays. UV light can be applied to a region between 190 and 450 nanometers, for example, or between 200 and 400 nanometers. Irradiation can also be performed using a photoresist mask. Following this irradiation process, the exposed photosensitive resin layer is treated with a developer. The non-exposed areas of the photosensitive resin layer dissolve, forming the color filter pattern. This process can be repeated as many times as desired to obtain a color filter with the desired pattern. In addition, if the image pattern obtained by development in the above process is cured by reheating or irradiating it with actinic radiation, crack resistance and solvent resistance can be improved.

According to another embodiment, a CMOS image sensor including the aforementioned color filter is provided.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are merely preferred examples of the present invention, and the present invention is not limited to the following examples.

(Preparation of photosensitive resin composition)

Examples 1 to 5 and Comparative Examples 1 and 2

The compound represented by Chemical Formula 1-3-1 as a first photopolymerization initiator and the compound represented by Chemical Formula 2-1-1 as a second photopolymerization initiator were mixed with the composition shown in Table 1 to prepare a photosensitive resin composition.

Specifically, a photopolymerization initiator is added to a solvent and stirred at room temperature for 30 minutes. A photopolymerizable compound and a colorant (pigment dispersion) are then added and stirred at room temperature for 30 minutes. Other additives are then added and stirred at room temperature for 30 minutes. The resulting product is then filtered twice to remove impurities, producing a photosensitive resin composition.

Each component used in Table 1 is as follows.

(A) Photopolymerization initiator

(A-1) The first photopolymerization initiator represented by chemical formula 1-3-1

(A-2) A second photopolymerization initiator represented by chemical formula 2-1-1

(B) Photopolymerizable compounds

(B-1) Dipentatriol hexaacrylate (DPHA, viscosity: 5,500 to 8,000 centipoise at 25°C, manufacturer: Nippon Kayaku Co., Ltd.)

(C) Colorant

(C-1) Pigment B 15:6 pigment dispersion (dispersing solvent: PGMEA, manufacturer: Sanyo)

(C-2) Pigment V 23 Pigment Dispersion (Dispersing Solvent: PGMEA, Manufacturer: Sanyo)

(D)Solvent

(D-1) Propylene glycol monomethyl ether acetate (PGMEA, boiling point: 146.4°C at 1 standard atmosphere, manufacturer: Sigma-Aldrich Co., Ltd.)

(F) Other additives

(F-1) Fluorine-based surfactant (F-556, manufacturer: Dainippon Ink & Chemicals Co., Ltd.)

(F-2) Non-aminosilane coupling agent (KBM503, manufacturer: Shin-etsu)

(evaluate)

(1) Preparation of color filter samples

Each of the photosensitive resin compositions according to Examples 1 to 5 and Comparative Examples 1 and 2 was coated to a thickness of 0.6 μm on an 8-inch silicon wafer using a spin coater (Opticoat MS-A150, Mikasa Co., Ltd.), soft-baked on a hot plate at 100°C for 3 minutes, and then sintered using an i-line stepper (NSR-2005i10C, Nikon Corporation). Corp.) was exposed to light at 500 mW with appropriately controlled time to obtain a pattern with a deviation of 0.1 μm. The exposed substrate was developed in a 0.2% TMAH (tetramethylammonium hydroxide) aqueous solution at room temperature for 120 seconds and hard-baked in a convection oven at 200°C for 5 minutes to obtain a color filter sample having a 4500 angstrom thick photosensitive resin layer on a glass substrate.

(2) Resolution and residue evaluation

The resolution and residue of the color filter samples according to Examples 1 to 5 and Comparative Examples 1 and 2 were evaluated using a CD-SEM (S-9000, Hitachi, Ltd.), and the results are shown in Table 2.

The resolution is evaluated by recording the minimum size of a feasible Bayer pattern.

Residue was evaluated by measuring the CD of a 0.8-μm pattern using a CD-SEM (S-9380-2, Hitachi, Ltd.) and then using the result to digitize the connectivity level between patterns on a scale of 0 to 5 (where 5 is assumed for complete connectivity and 0 for incomplete connectivity). Herein, a residue evaluation result of 0 to 1 is considered excellent residue suppression.

For reference, the CD results for 0.8 μm patterns in Examples 1 to 5, Comparative Examples 1 and 2, Examples 4 and 5, and Comparative Example 2 are shown in Figures 1 to 3, respectively.

(3) Evaluation of pattern angles

The pattern side angle of each of the color filter samples according to Examples 1 to 5 and Comparative Examples 1 and 2 was representatively evaluated using FE-SEM (S-4300, Hitachi, Ltd.), and the results are shown in Table 2.

For reference, among Examples 1 to 5 and Comparative Examples 1 and 2, FE-SEM images of Examples 4 and 5, and Comparative Example 2 are representatively shown in Figures 4 to 6.

Referring to Table 2, there is a trade-off between CIS pattern resolution and residue. However, compared to the comparative example color filter sample, the example color filter sample exhibits relatively improved CIS pattern resolution, residue, and pattern angle. Therefore, the photosensitive resin composition of one embodiment, represented by the example, is shown to improve the shape and outline of the CIS pattern.

On the other hand, in practical examples, it has been shown that the resolution, residue, and pattern angle of the CIS pattern vary depending on the mixing ratio of the first and second photopolymerization initiators. Therefore, the mixing ratio of the first and second photopolymerization initiators can be varied depending on the shape and outline of the target CIS pattern.

While the present invention has been described in connection with what are presently considered to be practical example embodiments, it should be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalent arrangements within the spirit and scope of the appended claims.

without.

Claims (18)

A photosensitive resin composition comprising (A) a photopolymerization initiator; (B) a photopolymerizable compound; (C) a colorant; and (D) a solvent, wherein the (A) photopolymerization initiator comprises a first photopolymerization initiator represented by Chemical Formula 1 and a second photopolymerization initiator represented by Chemical Formula 2: [Chemical Formula 1] Wherein, in Chemical Formula 1, ^X1 is ^CRaRb or ^NRc , wherein ^Ra , Rb ^, and ^Rc are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group; ^R1 to ^R4 are each independently ^a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group; and ^R5 to ^R8 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group, or a substituent represented by Chemical Formula A, provided that at least one of ^R5 to ^R8 is a substituent represented by Chemical Formula A; [Chemical Formula A] Wherein, in Chemical Formula A, ^L1 is a single bond or *-C(=O)-*, and ^R9 is a hydrogen atom, a halogen atom, or a hydroxyl group, and ^R10 is a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group; [Chemical Formula 2] Wherein, in Chemical Formula 2, ^X2 is ^CRdRe or ^{NRf ,} wherein ^Rd , ^Re, and ^Rf are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group; ^R11 to ^R14 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, or *-C(=O) ^-Rg , wherein ^Rg is a substituted or unsubstituted C6 to C20 aryl group, with the proviso that at least one of ^R11 to ^R14 is a nitro group or *-C(=O) ^-Rg ; and ^R15 to ^R18 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted C1 to C20 alkyl group, or a substituent represented by Chemical Formula B, with the proviso that at least one of ^R15 to ^R18 is a substituent represented by Chemical Formula B; [Chemical Formula B] Wherein, in Chemical Formula B, L ² is a single bond or *-C(=O)-*, R ¹⁹ is a hydrogen atom, a halogen atom, or a hydroxyl group, and R ²⁰ is a hydrogen atom, a halogen atom, a hydroxyl group, or a substituted or unsubstituted C1 to C20 alkyl group. The photosensitive resin composition according to claim 1, wherein ^Ra , ^Rb, and ^Rc are each independently a methyl group or an n-butyl group. The photosensitive resin composition of claim 1, wherein X ¹ is C(n-Bu) ₂ or N(Et). The photosensitive resin composition of claim 1, wherein all of R ¹ to R ⁴ are hydrogen atoms. The photosensitive resin composition of claim 1, wherein R ⁶ is a substituent represented by chemical formula A; and all of R ⁵ , R ⁷ and R ⁸ are hydrogen atoms. The photosensitive resin composition of claim 1, wherein the first photopolymerization initiator is represented by any one of Chemical Formulas 1-1 to 1-4: [Chemical Formula 1-1] [Chemical formula 1-2] [Chemical formula 1-3] [Chemical formula 1-4] In Chemical Formulae 1-1 to 1-4, R ¹ to R ⁵ , R ⁷ to R ¹⁰ , and ^Ra to R ^c have the same definitions as in claim 1. The photosensitive resin composition of claim 1, wherein R ^d , ^{Re ,} and R ^f are each independently ethyl or n-butyl. The photosensitive resin composition of claim 1, wherein X ² is C(n-Bu) ₂ or N(Et). The photosensitive resin composition of claim 1, wherein R ¹³ is a nitro group or *-C(=O)-R ^g ; and all of R ¹¹ , R ¹² , and R ¹⁴ are hydrogen atoms. The photosensitive resin composition of claim 1, wherein R ¹⁶ is a substituent represented by Chemical Formula B; and all of R ¹⁵ , R ¹⁷ , and R ¹⁸ are hydrogen atoms. The photosensitive resin composition of claim 1, wherein the second photopolymerization initiator is represented by any one of Chemical Formulas 2-1 to 2-8: [Chemical Formula 2-1] [Chemical formula 2-2] [Chemical formula 2-3] [Chemical formula 2-4] [Chemical formula 2-5] [Chemical formula 2-6] [Chemical formula 2-7] [Chemical formula 2-8] In Chemical Formulae 2-1 to 2-8, R ¹¹ , R ¹² , R ¹⁴ , R ¹⁵ , R ¹⁷ to R ²⁰ , and R ^d to R ^g have the same definitions as in claim 1. The photosensitive resin composition of claim 1, wherein the first photopolymerization initiator and the second photopolymerization initiator are contained in a weight ratio of 70:30 to 95:5. The photosensitive resin composition of claim 1, wherein the photopolymerization initiator is contained in an amount of 0.1% to 5% by weight based on the total weight of the photosensitive resin composition. The photosensitive resin composition of claim 1, wherein: Based on the total weight of the photosensitive resin composition, the photosensitive resin composition comprises: 0.1% to 5% by weight of the (A) photopolymerization initiator; 0.1% to 10% by weight of the (B) photopolymerizable compound; 40% to 90% by weight of the (C) colorant; and the remainder of the (D) solvent. The photosensitive resin composition of claim 1, wherein the photosensitive resin composition further comprises (E) a binder resin. A photosensitive resin layer is produced using the photosensitive resin composition described in any one of claims 1 to 15. A color filter comprising the photosensitive resin layer according to claim 16. A CMOS image sensor comprises the color filter as claimed in claim 17.