TWI889127B - Photosensitive resin composition, resin layer, color filter, and cmos image sensor - Google Patents

Abstract

This disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the same, a color filter, and a CMOS image sensor. An embodiment provides a photosensitive resin composition including (A) an additive; (B) a binder resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a colorant; and (F) a solvent, wherein the additive includes a leveling agent, and the leveling agent is included in an amount of 50 ppm to 1,000 ppm based on a total amount of the photosensitive resin composition. The disclosure has effects of improving coating characteristics of the color filter - uniformity of the coating.

Description

Photosensitive resin composition, resin layer, color filter and CMOS image sensor

The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer made using the same, a color filter, and a CMOS image sensor.

This application claims priority to and the benefits of Korean Patent Application No. 10-2023-0045617 filed on April 6, 2023 with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference.

Image sensors are semiconductors that convert photons into electrons and display them on a display device or store them in a storage device.

Image sensors are classified into charge coupled device (CCD) image sensors and complementary metal-oxide semiconductor (CMOS) image sensors based on the manufacturing process and application method.

A CMOS image sensor (CIS), which is a non-memory semiconductor that converts images received by a camera into digital signals, is a collection of pixels, such as color filters, photodiodes, amplifiers, etc.

The color filter includes filter segments of superimposed mixed primary colors of red, green and blue. The color filter can be manufactured by repeating a series of processes such as coating a photosensitive resin composition containing a coloring agent on a base or lower photosensitive resin layer, exposing a pattern to be formed, developing it and thermally curing it through a post-baking process to form a photosensitive resin layer.

Coating can be performed by generally using spin coating, which has the advantage of forming a uniform thin film at a low cost but is not susceptible to phenomena that deteriorate coating properties, such as an edge bead phenomenon in which the photosensitive resin composition agglomerates at the edge of the substrate or the lower photosensitive resin layer, a spreading phenomenon in which the photosensitive resin composition spreads on the uneven surface of the substrate or the lower photosensitive resin layer and generates defects, and the like.

Generally, these phenomena are prevented by pre-treating the substrate or the photosensitive resin layer, such as an edge bead removal (EBR) process for removing the edge portion with a thinner, a cleaning process, etc. However, there is a problem of increasing the cost due to the pre-treatment of the substrate or the lower photosensitive resin layer, and in addition, the pre-treatment, regardless of the cost, still has a limit to improving the coating characteristics.

The embodiment improves the coating characteristics of the color filter by controlling the leveling agent content in the photosensitive resin composition instead of pre-treating the wafer.

In an embodiment, the photosensitive resin composition comprises: (A) an additive; (B) a colorant; (C) a binder resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent, wherein the additive comprises a leveling agent, and the leveling agent is included in an amount of 50 parts per million (ppm) to 1,000 parts per million based on the total amount of the photosensitive resin composition.

The leveling agent may be contained in an amount of 100 ppm to 400 ppm based on the total amount of the photosensitive resin composition.

The leveling agent may be a fluorine-based surfactant.

The fluorine-based surfactant may be a non-ionic fluorine-based surfactant.

The additive may further include a silane coupling agent, an antioxidant, a dispersing medium or a combination thereof.

The additive may include 1 wt % to 50 wt % of a leveling agent, 30 wt % to 80 wt % of a silane coupling agent, and 10 wt % to 30 wt % of an antioxidant, based on the total amount of solids excluding a dispersion medium.

The adhesive resin may include an acrylic adhesive resin, an epoxy adhesive resin, or a combination thereof.

The weight average molecular weight of the binder resin may be 5,000 g/mol to 15,000 g/mol.

The weight ratio of the leveling agent to the coloring agent may be from about 0.01:100 to about 1:100.

The colorant may include a blue pigment, a purple pigment, or a combination thereof.

The solvent may contain two or more types of solvents having different boiling points.

The solvent may include two or more of propylene glycol monomethyl ether acetate (PGMEA), n-butyl alcohol (n-BA), and diethylene glycol methyl ethyl ether (MEDG).

Based on the total amount of the photosensitive resin composition, the photosensitive resin composition includes 1,600 ppm to 3,000 ppm of (A) additive; 30 wt % to 70 wt % of (B) colorant; 1 wt % to 20 wt % of (C) binder resin; 1 wt % to 20 wt % of (D) photopolymerizable compound; 0.1 wt % to 5 wt % of (E) photopolymerization initiator; and the remainder of (F) solvent.

The photosensitive resin composition may have a viscosity of 1.5 centipoise to 3.8 centipoise at 25°C.

Another embodiment provides a photosensitive resin layer made using the photosensitive resin composition.

Another embodiment provides a color filter including a photosensitive resin layer.

Another embodiment provides a CMOS image sensor including a color filter.

Other embodiments of the present invention are included in the following detailed description.

The embodiment has the effect of improving the coating characteristics (coating uniformity) of the color filter. In particular, the embodiment can improve the coating uniformity while improving the coating uniformity by controlling the leveling agent content in the photosensitive resin composition instead of pre-treating the wafer.

Therefore, the photosensitive resin layer and the color filter manufactured using the photosensitive resin composition of the embodiment have excellent surface smoothness and can help achieve a certain level of image quality of the image sensor.

Embodiments of the present invention are described in detail below. However, these embodiments are exemplary, the present invention is not limited thereto and the present invention is defined by the scope of the patent application.

（ Photosensitive resin composition ）

The embodiment provides a photosensitive resin composition, comprising: (A) an additive; (B) a colorant; (C) a binder resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent.

（ A ） Additives

Additives include levelers.

Herein, "leveling agent" refers to an additive that improves the fluidity of the photosensitive resin composition by adjusting the evaporation rate of the solvent or preventing the agglomeration of the coloring agent.

As previously described, during the process of coating a photosensitive resin composition on a substrate or an underlying photosensitive resin layer, various phenomena occur that deteriorate coating properties.

The embodiments are directed to improving the coating properties of color filters by controlling the leveling agent content in the photosensitive resin composition instead of pre-treating the wafer.

It is generally known that adding a leveling agent to a photosensitive resin composition helps to evenly coat a base or a lower photosensitive resin layer. However, the uniformity of coating may vary depending on the content of the leveling agent in the photosensitive resin composition.

In the embodiment, the photosensitive resin composition can be uniformly coated on the substrate or the lower photosensitive resin layer by using a leveling agent and optimizing its content. Therefore, the photosensitive resin layer and the color filter manufactured using the photosensitive resin composition of the embodiment have excellent surface smoothness and can help achieve a certain level of image quality of the image sensor.

In an embodiment, the leveler defines only materials in solid form.

As the leveling agent content increases, the surface tension of the photosensitive resin composition increases, and the intra-wafer thickness distribution of the color filter sample decreases, while the contact angle and stain increase. In this paper, the contact angle and stain of the color filter sample are traded off with the intra-wafer thickness distribution.

In particular, if the content of the leveling agent based on the total amount of the photosensitive resin composition is less than 50 ppm, the in-wafer thickness distribution of the color filter sample is significantly high. On the other hand, if the content of the leveling agent based on the total amount of the photosensitive resin composition exceeds 1,000 ppm, the contact angle and stain of the color filter sample are significantly increased, thereby reducing the yield.

More particularly, the leveling agent is contained in an amount of 50 ppm to 1,000 ppm, specifically 50 ppm to 800 ppm, for example 100 ppm to 400 ppm, based on the total amount of the photosensitive resin composition.

Within the above range, as the leveling agent content increases, the thickness distribution within the wafer decreases, the dehydration property increases, and a pattern with uniform overall thickness can be obtained.

A more detailed description will be given later, but the embodiment provides a red photosensitive composition. When a pattern in which green, blue and red are stacked in sequence is formed, a red photosensitive resin layer having excellent surface smoothness can be formed simultaneously with the formation of a green lower photosensitive resin layer and a blue lower photosensitive resin layer.

Therefore, the (red) photosensitive resin layer and the color filter manufactured using the photosensitive resin composition of the embodiment have excellent surface smoothness and can help achieve a certain level of image quality of the image sensor.

The leveling agent may be a fluorine-based surfactant.

Fluorine-based surfactants can be prepared by substituting a water-soluble reactive group at the end of a hydrophobic molecule containing a fluorine atom, and can have surface tension resistance superior to any other surfactants.

Meanwhile, surfactants can be generally classified into ionic surfactants and nonionic surfactants, depending on whether the hydrophilic part is ionic or not. Fluorinated surfactants are nonionic fluorinated surfactants in which the hydrophilic part is not ionic.

For example, the non-ionic fluorine-based surfactant may include F-556, F-554, F-557, F-559, F-560, F-563, RS-72-K, R-40, R-41, R-43, etc. of DIC Co., Ltd.

In addition to the leveling agent, the additive may further include a silane coupling agent, an antioxidant, a dispersing medium or a combination thereof.

The total additives may include, based on the total amount of solids excluding the dispersion medium, a leveling agent in an amount of 1 wt % to 50 wt %, 3 wt % to 40 wt %, or 5 wt % to 25 wt %; a coupling agent in an amount of 30 wt % to 80 wt %, 40 wt % to 75 wt %, or 55 wt % to 70 wt %; and an antioxidant in an amount of 10 wt % to 30 wt %, 15 wt % to 28 wt %, or 20 wt % to 25 wt %.

When the content of each component in the total additive satisfies the above range, the leveling agent is uniformly dispersed in the photosensitive resin composition, and in addition, the surface smoothness of the photosensitive resin layer and the color filter manufactured using the photosensitive resin composition can be increased.

The coupling agent may have reactive substituents to improve adhesion to the substrate or underlying photosensitive resin layer.

The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent may include trimethoxysilylbenzoic acid, γ-methacryloylpropoxytrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, which may be used alone or as a mixture of two or more types.

Since the antioxidant can remove acrylate radicals generated when the device (e.g., CIS) is driven, it can prevent the room temperature operating life of the device from being reduced. Specifically, acrylate radicals are generated by heat, and the antioxidant does not play the role of an antioxidant before thermal curing, but plays the role of an antioxidant only after thermal curing, so that it can prevent the life characteristics of the device from being reduced without significantly affecting another device characteristic.

Particularly, the antioxidant may include hydroquinone, hydroquinone monomethyl ether, pyrogallol, and tert-butylcatechol, which may be used alone or in combination of two or more.

In an embodiment, the leveling agent and the coloring agent only define materials in solid form, and the weight ratio of the leveling agent to the coloring agent may be 0.01:100 to 1:100, in particular 0.1:100 to 0.8:100, or 0.3:100 to 0.6:100.

In the above range, the content of the leveling agent relative to the coloring agent is appropriately controlled so that the photosensitive resin composition can be uniformly coated on the substrate or the lower photosensitive resin layer. However, in the above range, as the content of the leveling agent relative to the coloring agent increases, the uniformity increases, and as it decreases, the uniformity may also decrease.

Taking this trade-off into consideration, the weight ratio of the leveling agent to the coloring agent can be selected within the above range.

The additive may further include an additive such as malonic acid, 3-amino-1,2-propanediol, a surfactant, a free radical polymerization initiator or a combination thereof.

The total additive may be included in an amount of 1,000 ppm to 3,000 ppm, particularly 1,500 ppm to 2,500 ppm, for example 1,600 ppm to 1,900 ppm, based on the total amount of the photosensitive resin composition. Within this range, the photosensitive resin layer and the color filter manufactured using the photosensitive resin composition have excellent surface smoothness and can help achieve a certain level of image quality of the image sensor.

（ B ）Coloring agent

The photosensitive resin composition of the embodiment may contain a pigment as a coloring agent.

The pigment may be red pigment, purple pigment, green pigment, blue pigment, yellow pigment, black pigment, etc.

The red pigment may be C.I. red pigment 254, C.I. red pigment 255, C.I. red pigment 264, C.I. red pigment 270, C.I. red pigment 272, C.I. red pigment 177, C.I. red pigment 89, etc. in the color index, and they may be used alone or as a mixture of two or more, but the present invention is not limited thereto.

The purple pigment may be C.I. Purple Pigment 23 (V.23), C.I. Purple Pigment 29, dioxazine purple, first purple B, methyl deep purple red, indanthrene brilliant purple, etc. in the color index, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

The green pigment may be C.I. Green Pigment 7, C.I. Green Pigment 36, C.I. Green Pigment 58, C.I. Green Pigment 59, etc. in the color index, and may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

The blue pigment may be a copper phthalocyanine pigment, such as C.I. Blue Pigment 15:6, C.I. Blue Pigment 15, C.I. Blue Pigment 15:1, C.I. Blue Pigment 15:2, C.I. Blue Pigment 15:3, C.I. Blue Pigment 15:4, C.I. Blue Pigment 15:5, C.I. Blue Pigment 15:6, C.I. Blue Pigment 16 in the color index, which may be used alone or as a mixture of two or more, but the present invention is not limited thereto.

The yellow pigment may be an isoindoline pigment in the color index, such as C.I. Yellow Pigment 185, C.I. Yellow Pigment 139, etc.; a quinoline yellow pigment, such as C.I. Yellow Pigment 138; a nickel composite pigment, such as C.I. Yellow Pigment 150, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

The black pigment may be aniline black, perylene black, titanium black, carbon black, etc. in the color index, and may be used alone or in a mixture of two or more, but the present invention is not limited thereto.

Especially, coloring agent can realize blue by comprising blue pigment, violet pigment or its combination.More especially, pigment can be the mixture of blue pigment and violet pigment comprising weight ratio is 95:5 to 60:40, 90:10 to 70:30 or 85:15 to 75:25.

The pigment can be contained in the near-infrared absorbing resin composition in the form of a dispersion. Such a pigment dispersion can be composed of a pigment, a solvent, a dispersant, a dispersing resin, etc.

The solvent may be ethylene glycol acetate, ethyl cellulose, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc., and among them, propylene glycol methyl ether acetate may be preferably used.

The dispersant helps the pigment to be uniformly dispersed in the dispersion, and all nonionic, anionic or cationic dispersants can be used. In particular, polyalkylene glycol or its ester, polyalkylene oxide, polyol ester epoxide adduct, alcohol epoxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkylamide epoxide adduct, alkylamine, etc. can be used, and these can be used alone or in combination of two or more.

As dispersion resin, acrylic resin containing carboxyl groups can be used, which can improve the stability of the pigment dispersion and the patterning ability of the pixel.

The coloring agent can include pigment and can further include dye, and in this case, the resin composition of the embodiment can be a mixed composition. In addition, the dye is not subject to specific restrictions, but can include metal complex dye.

The metal complex dye may be a compound having maximum absorbance in the wavelength range of 200 nm to 650 nm, and if the compound has absorbance in the above range so as to match the color coordinates with the combination of dyes, metal complex dyes of all colors dissolved in an organic solvent may be used.

In particular, the metal complex dye can be a green dye having a maximum absorbance in the wavelength range of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength range of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength range of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength range of 500 nm to 650 nm, or a combination thereof.

The metal complex dye can be a direct dye, an acid dye, an alkaline dye, an acid mordant dye, a sulfur dye, a vat dye, an azo dye, a disperse dye, a reactive dye, an oxidation dye, an oil-soluble dye, an azo dye, an anthraquinone dye, an indigo dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye or a combination thereof.

The metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd and Fe.

The metal complex dye may be at least one complex with a metal ion selected from the group consisting of: C.I. solvent dyes, such as C.I. solvent green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, etc.; C.I. acid dyes, such as C.I. acid green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109, etc.; C.I. direct dyes, such as C.I. direct green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79 , 82, etc.; C.I. alkaline dyes, such as C.I. Alkaline Green 1, etc.; C.I. mordant dyes, such as C.I. Mordant Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41, 43, 53, etc.; C.I. green pigments, such as Pigment Green 7, 36, 58, etc. ; Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132 and Solvent Red 218.

The solubility of the metal complex dye in the solvent used in the photosensitive resin composition according to some embodiments (i.e., the solvent to be described later) may be greater than or equal to 5, especially 5 to 10. The solubility can be obtained by the amount (gram) of the dye dissolved in 100 grams of the solvent. If the solubility of the metal complex dye is within the above range, compatibility and coloring power with other components constituting the photosensitive resin composition according to some embodiments can be ensured, and precipitation of the dye can be prevented.

The solvent may be, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

Since the solvent has the above specific range, it can be applied to color filters that express high brightness and high contrast in desired color coordinates, such as LCDs and LEDs.

The metal complex dye can be included in an amount of 0.01 wt % to 1 wt %, for example 0.01 wt % to 0.5 wt %, based on the total amount of the photosensitive resin composition. If the metal complex dye is used within the above range, high brightness and contrast can be exhibited in the desired color coordinates.

If the dye and the pigment are mixed and used, the dye and the pigment may be mixed in a weight ratio of about 0.1:99.9 to about 99.9:0.1, and particularly about 1:9 to about 9: 1. If mixed within the above weight ratio range, chemical resistance and maximum absorption wavelength may be controlled within appropriate ranges, and high brightness and contrast may be exhibited in desired color coordinates.

The colorant may be contained in an amount of 30 wt % to 70 wt %, particularly 35 wt % to 65 wt %, for example 40 wt % to 50 wt %, based on the total amount of the photosensitive resin composition. If the colorant is contained within the above range, the coloring effect and developing property are improved.

（ C ） Adhesive resin

The photosensitive resin composition may include a binder resin, and the binder resin may include an acrylic binder resin.

The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable with the first ethylenically unsaturated monomer, and is a resin containing at least one acrylic acid repeating unit.

The first ethylenically unsaturated monomer may be an ethylenically unsaturated monomer including at least one carboxyl group, and examples of the monomer may include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, and combinations thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5 wt % to 50 wt %, for example, 10 wt % to 40 wt %, based on the total amount of the acrylic adhesive resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound, such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound, such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkane The present invention relates to vinyl ester compounds, such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate, etc.; carboxylic acid vinyl ester compounds, such as vinyl acetate, vinyl benzoate, etc.; unsaturated carboxylic acid glyceryl ester compounds, such as (meth)acrylate glyceryl ester, etc.; vinyl cyanide compounds, such as (meth)acrylonitrile, etc.; unsaturated amide compounds, such as (meth)acrylamide, etc., and they can be used alone or in the form of a mixture of two or more.

Specific examples of the acrylic resin may be (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, and the like, but are not limited thereto, and these may be used alone or in the form of a mixture of two or more.

The adhesive resin may include an epoxy-based adhesive resin.

The adhesive resin may be improved in heat resistance by further including an epoxy-based adhesive resin. The epoxy-based adhesive resin may be, for example, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin or a combination thereof, but is not limited thereto.

In addition, the binder resin including the epoxy-based binder resin ensures dispersion stability of a coloring agent such as a pigment, which will be described later, and helps to form pixels with desired resolution during a development process.

The epoxy adhesive resin may be included in an amount of 1 wt % to 10 wt %, for example, 5 wt % to 10 wt %, based on the total amount of the adhesive resin. If the epoxy adhesive resin is included within the above range, film residual rate and chemical resistance may be greatly improved.

The epoxy equivalent of the epoxy resin may be 150 g/equivalent to 200 g/equivalent. If the epoxy adhesive resin having the epoxy equivalent within the above range is contained in the adhesive resin, there is an advantageous effect of improving the curing degree of the formed pattern and fixing the coloring agent in the structure forming the pattern.

The binder resin can be dissolved in a solvent to be described later in a solid form to form a photosensitive resin composition. In this case, the binder resin in a solid form can be 10 wt % to 50 wt %, for example 20 wt % to 40 wt %, based on the total amount of the binder resin solution dissolved in the solvent.

The binder resin may be included in an amount of 1 wt % to 20 wt %, particularly 2 wt % to 15 wt %, for example 3 wt % to 10 wt %, based on the total amount of the photosensitive resin composition. If the binder resin is included within the above range, it is possible to obtain excellent surface smoothness due to excellent developing properties and improved crosslinking characteristics during the manufacture of the color filter.

（ D ） Photopolymerizable compounds

As the photopolymerizable compound, there may additionally be used a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

The photopolymerizable compound has an ethylenic unsaturated double bond, so that it can form a pattern having excellent heat resistance, light resistance, and chemical resistance by causing sufficient polymerization during exposure in the pattern formation process.

Specific examples of the photopolymerizable compound include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tet(meth)acrylate, and bisphenol A di(meth)acrylate. dipentatriol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, tri(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, etc.

Examples of commercially available products of photopolymerizable compounds are as follows. Monofunctional (meth)acrylates may include Aronix M- ^101® , Aronix M- ^111® , Aronix M- ^114® (Toagosei Chemistry Industry Co., Ltd.); KAYARAD TC- ^110S® , KAYARAD TC- ^120S® (Nippon Kayaku Co., Ltd.); V- ^158® , V- ^2311® (Osaka Organic Chemical Ind., Ltd.), etc. Examples of difunctional (meth)acrylates may include Aniks M- ^210® , Aniks M- ^240® , Aniks M- ^6200® (Toagosei Chemical Industry Co., Ltd.), Caylard ^HDDA® , Caylard HX- ^220® , Caylard R- ^604® (Nippon Kayaku Co., Ltd.), V- ^260® , V- ^312® , V-335 ^HP® (Osaka Organic Chemical Industry Co., Ltd.), and the like. Examples of trifunctional (meth)acrylates include Aniks M- ^309® , Aniks M- ^400® , Aniks M- ^405® , Aniks M- ^450® , Aniks M- ^710® , Aniks M-8030®, Aniks M- ^8060® (Toa Gosei Chemical Industry Co., Ltd.); Caylade ^TMPTA® , Caylade DPCA- ^20® , Caylade DPCA- ^30® , Caylade DPCA- ^60® , Caylade DPCA- ^120® (Nippon Kayaku Co., Ltd.); V- ^{295® ,} V- ^300® , V- ^360® , V- ^GPT® , V- ^3PA® , V- ^400® (Osaka Yuki Kayaku Kogyo Co. Ltd.), etc. These may be used alone or in admixture of two or more.

The photopolymerizable compound may be treated with anhydride or may be oxirane modified to impart better developability.

The photopolymerizable compound may be contained in an amount of 1 wt % to 20 wt %, particularly 1 wt % to 4 wt %, for example 1 wt % to 3 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerizable compound is contained within the above range, sufficient curing occurs during the exposure in the pattern formation process, resulting in excellent reliability and excellent developability using an alkaline developer.

（ E ） Photopolymerization initiator

The photopolymerization initiator may be an initiator generally used in photosensitive resin compositions, such as acetophenone compounds, benzophenone compounds, thiophenone compounds, benzoin compounds, triazine compounds, oxime compounds or combinations thereof.

Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.

Examples of benzophenone compounds include benzophenone, benzoyl benzoate, benzoyl methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

Examples of the thiothione compounds include thiothione, 2-methylthiothione, isopropylthiothione, 2,4-diethylthiothione, 2,4-diisopropylthiothione, 2-chlorothiothione and the like.

Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-(bistrichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, -s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-sunflower-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxyphenylvinyl)-s-triazine, etc.

Examples of oxime compounds include O-acyloxime compounds, 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-oxazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, and the like. Specific examples of o-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-pyrrolidone-4-yl-phenyl)-butan-1-one, 1-(4-phenylthiohydrogenophenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiohydrogenophenyl)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiohydrogenophenyl)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiohydrogenophenyl)-octane-1-one oxime-O-acetate, 1-(4-phenylthiohydrogenophenyl)-butan-1-one oxime-O-acetate, and the like.

In addition to the above compounds, the photopolymerization initiator may include oxazole compounds, diketone compounds, cobalt borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, fluorene compounds, and the like.

The photopolymerization initiator may be used together with a photosensitizer capable of causing a chemical reaction by absorbing light and becoming excited and then transmitting its energy.

Examples of the photosensitizer may include tetraethylene glycol di-3-butyl propionate, pentaerythritol tetra-3-butyl propionate, dipentaerythritol tetra-3-butyl propionate, and the like.

The photopolymerization initiator may be included in an amount of 0.1 wt % to 5 wt %, particularly 0.3 wt % to 4 wt %, for example 0.5 wt % to 3 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerization initiator is included within the range, sufficient photopolymerization occurs during exposure in the pattern formation process, excellent reliability can be achieved, heat resistance, light resistance and chemical resistance, resolution and close contact properties of the pattern can be improved, and a decrease in transmittance caused by a non-reactive initiator can be prevented.

（ F ) Solvent

The solvent may be a material that is compatible with the additive, the binder resin, the photopolymerizable compound, or the photopolymerization initiator but does not react therewith.

Examples of the solvent may include: alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc.; thiourea acetates such as methyl thiourea acetate, ethyl thiourea acetate, diethyl thiourea acetate, etc.; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates, Such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; aromatic hydrocarbons, such as toluene, xylene, etc.; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-acetone, methyl-n-butyl ketone, methyl-n-pentanone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters, such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters, such as methyl methoxyacetate esters, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; alkyl 3-oxypropionates, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionates, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionates, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionates, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-oxypropionate, etc. ethyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionic acid esters, such as 2-oxy-2-methylmethyl propionate, 2-oxy-2-methylethyl propionate, etc.; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylalkyl propionates, such as 2-methoxy-2-methylmethyl propionate, 2-ethoxy-2-methylethyl propionate, etc.; esters, such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, 2-hydroxy-3-methylmethyl butyrate, etc.; keto acid esters, such as ethyl pyruvate, etc. In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethyl carbonate, propyl carbonate, phenyl celoxylate acetate, etc. can also be used.

Among them, ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl thiourea acetate; esters such as 2-hydroxyethyl propionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; and ketones such as cyclohexanone can be used in view of compatibility and reactivity.

For example, the solvent may include two or more solvents having different boiling points. The "boiling point" of a liquid material is the temperature at which the vapor pressure of the liquid material becomes equal to the external pressure and starts to boil, and it changes according to the external pressure. In an embodiment, the boiling point can be obtained at 1 standard atmosphere.

Since the photosensitive resin composition of some embodiments includes two solvents having different boiling points, the evaporation rate and evaporation position of the solvent can be coordinately controlled during the process of coating the photosensitive resin composition on a substrate or an underlying photosensitive resin layer, and by allowing solvent volatility to occur primarily on the surface rather than under the coating, filling characteristics, surface roughness, etc. can be improved.

For example, the solvent may include two or more solvents of propylene glycol monomethyl ether acetate (PGMEA), n-butyl acetate (n-BA), and diethylene glycol methyl ethyl ether (MEDG). Of course, all three types of solvents may be included, and in this case, the synergistic effect is the highest.

The solvent may be contained in an amount of, for example, 30% to 70% by weight, for example, 40% to 60% by weight, based on the total amount of the photosensitive resin composition. If the solvent is contained within the above range, it is possible to obtain a coating film having excellent coatability and excellent flatness of the photosensitive resin composition.

The photosensitive resin composition can be applied to a color filter of a CMOS image sensor, and more specifically, to a blue filter of the CMOS image sensor.

（ Photosensitive resin layer, color filter and CMOS Image sensor ）

Another embodiment provides a photosensitive resin layer made using the photosensitive resin composition.

Another embodiment provides a color filter made using a photosensitive resin composition.

Another embodiment provides a CMOS image sensor including a color filter.

The method of manufacturing the color filter is as follows.

The aforementioned photosensitive resin composition is applied by an appropriate method, such as spin coating, rolling coating, spraying, etc., to form a photosensitive resin composition layer having an appropriate thickness on the glass substrate.

Subsequently, the substrate with the photosensitive resin composition layer can be irradiated to form the pattern required for the color filter. The irradiation can be performed by using UV, electron beam or X-ray as a light source, and the UV can be, for example, in the region of 190 nm to 450 nm, and for example, 200 nm to 400 nm. The irradiation can be performed by further using a photoresist mask. After the irradiation process is performed in this manner, the photosensitive resin composition layer exposed to the light source is treated with a developer. Herein, the non-exposed area in the photosensitive resin composition layer dissolves and forms a pattern for the color filter. This process can be repeated as many times as the number of desired colors, thereby obtaining a color filter with the desired pattern. In addition, if the image pattern obtained by development in the above process is cured by reheating or irradiating actinic rays thereto, crack resistance, solvent resistance, etc. can be improved.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are only preferred examples of the present invention, and the present invention is not limited to the following examples.

(Preparation of photosensitive resin composition)

Examples 1 To the instance 6 And comparative examples 1 To comparison example 4

Each photosensitive resin composition was prepared by mixing the compositions shown in Table 1 and Table 2.

In particular, a photopolymerization initiator is dissolved in a solvent and stirred at room temperature for 30 minutes, and then a binder resin is added thereto and stirred at room temperature for 60 minutes. Then, a photopolymerizable compound and a coloring agent (pigment dispersion) are added to the obtained reactant and stirred at room temperature for 30 minutes. In addition, an additive is added and stirred at room temperature for 30 minutes. Subsequently, the obtained product is filtered twice to remove impurities and prepare a photosensitive resin composition.

(Table 1)

(Unit: weight %) Components Material Solid content (wt%) Comparative example 1 Comparative example 2 Example 1 Example 2 Example 3 （A）Additives A-1 10 - 0.001 0.005 0.01 0.02 A-2 10 0.11 0.11 0.11 0.11 0.11 A-3 10 0.04 0.04 0.04 0.04 0.04 (B) Coloring agent B-1 30 43.15 43.15 43.15 43.15 43.15 (C) Adhesive resin C-1 100 3.73 3.75 3.75 3.75 3.74 (D) Photopolymerizable compounds D-1 100 1.45 1.45 1.45 1.45 1.45 (E) Photopolymerization initiator E-1 20 0.55 0.55 0.55 0.55 0.55 (F) Solvent F-1 - 15.53 15.509 15.505 15.50 15.50 F-2 - 26.58 26.58 26.58 26.58 26.58 F-3 - 8.86 8.86 8.86 8.86 8.86 Total 30 100 100 100 100 100

(Table 2)

(Unit: weight %) Components Material Solid content (wt%) Example 4 Example 5 Example 6 Comparative example 3 Comparative example 4 （A）Additives A-1 10 0.04 0.08 0.1 0.3 0.5 A-2 10 0.11 0.11 0.11 0.11 0.11 A-3 10 0.04 0.04 0.04 0.04 0.04 (B) Coloring agent B-1 30 43.15 43.15 43.15 43.15 43.15 (C) Adhesive resin C-1 100 3.71 3.66 3.65 3.55 3.45 (D) Photopolymerizable compounds D-1 100 1.43 1.41 1.40 1.30 1.20 (E) Photopolymerization initiator E-1 20 0.55 0.55 0.55 0.55 0.55 (F) Solvent F-1 - 15.53 15.56 15.56 15.56 15.56 F-2 - 26.58 26.58 26.58 26.58 26.58 F-3 - 8.86 8.86 8.86 8.86 8.86 Total 30 100 100 100 100 100

Each component used in Table 1 and Table 2 above is as follows:

（A）Additives

(A-1) Fluorine-based surfactant (product name: F-556, manufacturer: Dainippon Ink & Chemicals Co., Ltd.) diluted solution (dispersion medium: PGMEA)

(A-2) Silane coupling agent (product name: KBM-503, manufacturer: Shinetsu)

(A-3) Antioxidant (product name: MHQ, manufacturer: JHChem) diluted solution (dispersion medium: PGMEA)

(B) Coloring agent

(B-1) A mixed pigment dispersion containing Pigment B 15:6 and Pigment V 23 in a weight ratio of 77:23 (dispersing solvent: PGMEA, manufacturer: Sanyo)

(C) Adhesive resin

(C-1) A dispersion of a hydrophilic acrylic binder resin (weight average molecular weight measured by GPC method: 5,000 g/mol to 15,000 g/mol, acid value: 88 KOH/g) (solvent: PGMEA)

(D) Photopolymerizable compounds

(D-1) Dipentaethrol hexaacrylate (DPHA, viscosity: 5,500 to 8,000 cps at 25°C, manufacturer: Nippon Kayaku Co., Ltd.).

(E) Photopolymerization initiator

(E-1) Oxime initiator (OXE-01 series, product name: SPI-03, manufacturer: Samyang Corporation)

(F) Solvent

(F-1) Propylene glycol monomethyl ether acetate (PGMEA, 146.4°C at 1 standard atmosphere, manufacturer: Sigma-Aldrich)

(F-2) n-Butanol (n-BA, boiling point: 117.7°C at 1 standard atmosphere, manufacturer: Sigma-Aldrich)

(F-3) Diethylene glycol methyl ethyl ether (MEDG, boiling point: 176°C at 1 standard atmosphere, manufacturer: Toho Co., Ltd. (TOHO))

（ Evaluation Examples 1 : Viscosity of photosensitive resin composition ）

The photosensitive resin compositions according to Examples 1 to 6 and Comparative Examples 1 to 4 were applied at 25° C., and the viscosity was evaluated using a rheometer. The evaluation results are listed in Table 3.

(Table 3) Leveler content in photosensitive resin composition (ppm) Viscosity of photosensitive resin composition (centipoise at 25°C) Comparative example 1 - 1.92 Comparative example 2 10 1.91 Example 1 50 1.92 Example 2 100 1.92 Example 3 200 1.91 Example 4 400 1.91 Example 5 800 1.93 Example 6 1,000 1.92 Comparative example 3 3,000 1.94 Comparative example 4 5,000 1.95

（ Evaluation Examples 2 : Surface properties of color filters)

The surface properties of the color filter samples were evaluated in the following manner, and the results are listed in Tables 3 and 4.

(1) In-wafer distribution measurement and contact angle evaluation

Each of the photosensitive resin compositions according to Examples 1 to 6 and Comparative Examples 1 to 4 (blue photoresist, hereinafter referred to as "blue PR") was coated to a thickness of 4500 angstroms on the upper surface of an 8-inch Si wafer surface-treated with HMDS. Subsequently, pre-baking (soft baking) was performed on a heating plate set at 100°C for 3 minutes.

Next, the thickness obtained therefrom was measured at 20 points horizontally in the center of the pattern by using ST-5000 (optical thickness measuring device).

After measuring the thickness and intra-wafer distribution, a square pattern (50 mm x 50 mm) was exposed after removing the resize mask using an I-line stepper at a dose of 750 ms and a focus of -0.2. After exposure, development was performed using a tetramethylammonium hydroxide (TMAH) solution to remove the PR that does not contain the pattern portion. After development, post-baking (hard baking) was performed on a hot plate set at 200°C for 5 minutes to complete the formation of the pattern for measuring the contact angle.

The contact angle of the DI wafer patterned on the square patterned blue PR after the pattern for measuring the contact angle is fixed to the contact goniometer.

(2) Measurement of the degree of stain (paint stain)

The photosensitive resin composition of Example 3 was spin-coated to a thickness of 5500 angstroms on the upper surface of an 8-inch Si wafer surface treated with HMDS. Subsequently, soft-baking (SB) was performed on a heating plate set at 100°C for 3 minutes. Next, exposure of a pattern for forming a partition wall on a lower substrate was performed using an I-line stepper under conditions of a dose of 800 milliseconds and a focus of -0.3. After exposure, development was performed using a TMAH solution to remove the PR that did not contain the pattern portion. After development, hard-baking (HB) was performed on a heating plate set at 200°C for 5 minutes to produce a lower substrate for stain evaluation.

Subsequently, each of the photosensitive resin compositions of Examples 1 to 6 was spin-coated to a thickness of 4500 angstroms on the lower substrate. Next, soft baking (SB) was performed on a hot plate set at 100° C. for 3 minutes. The stain of the obtained substrate was measured by using an optical microscope and a Tencor device.

(Table 4) Comparative example 1 Comparative example 2 Example 1 Example 2 Example 3 Distribution within wafer (Angstroms) - 82.3 59.6 36.2 37 Contact angle (°) 74 72.5 73.3 79.0 75 Stain measurement area (micrometers) - 18 twenty three 52 35

(Table 5) Example 4 Example 5 Example 6 Comparative example 3 Comparative example 4 Distribution within wafer (Angstroms) 36.2 33.4 35.7 90.4 85.7- Contact angle (°) 79.0 82.2 83.1 82.5 81.9 Stain measurement area (micrometers) 52 64 69 78 76

Referring to Tables 3 to 5, the properties of the photosensitive resin compositions and the color filter samples respectively containing the same vary depending on the content of the leveling agent.

According to Table 3, as the content of the leveling agent increases, the viscosity of the photosensitive resin composition increases slightly.

On the other hand, referring to Tables 4 and 5, as the content of the leveling agent increases, the surface tension of the photosensitive resin composition increases, which reduces the intra-wafer thickness distribution of the color filter sample but increases the contact angle and stain. In this paper, the contact angle and stain of the color filter sample have a trade-off relationship with the intra-wafer thickness distribution.

In particular, when the content of the leveling agent is less than 50 ppm based on the total amount of the photosensitive resin composition, the color filter sample exhibits a significantly high intra-wafer thickness distribution. In contrast, when the content of the leveling agent is greater than 1,000 ppm based on the total amount of the photosensitive resin composition, the contact angle and stain of the color filter sample increase significantly, thereby reducing the yield.

However, when the content of the leveling agent is within a range of 50 ppm to 1,000 ppm based on the total amount of the photosensitive resin composition, as the content of the leveling agent increases, the thickness distribution within the wafer can be reduced, but the dehydration property can be increased, thereby obtaining a pattern with an overall uniform thickness.

While the present invention has been described in conjunction with what are presently considered to be practical example embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended patent applications.

without

FIG1 schematically illustrates an exposure pattern according to an evaluation example.

Claims (14)

A photosensitive resin composition, comprising (A) an additive; (B) a colorant; (C) a binder resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent, wherein the additive comprises a leveling agent, a silane coupling agent, an antioxidant, a dispersing medium or a combination thereof, the leveling agent is contained in an amount of 50 parts per million to 1,000 parts per million based on the total amount of the photosensitive resin composition, the leveling agent is a fluorine-based surfactant, and Based on the total amount of solids excluding the dispersion medium, the additive includes 1 wt% to 50 wt% of the leveling agent, 30 wt% to 80 wt% of the silane coupling agent, and 10 wt% to 30 wt% of the antioxidant. The photosensitive resin composition as described in claim 1, wherein the leveling agent is contained in an amount of 100 parts per million to 400 parts per million based on the total amount of the photosensitive resin composition. The photosensitive resin composition as described in claim 1, wherein the fluorine-based surfactant is a non-ionic fluorine-based surfactant. The photosensitive resin composition as described in claim 1, wherein the adhesive resin comprises an acrylic adhesive resin, an epoxy adhesive resin or a combination thereof. The photosensitive resin composition as described in claim 1, wherein the weight average molecular weight of the binder resin is 5,000 g/mol to 15,000 g/mol. The photosensitive resin composition as described in claim 1, wherein the weight ratio of the leveling agent to the coloring agent is 0.01:100 to 1:100. The photosensitive resin composition as described in claim 1, wherein the colorant comprises a blue pigment, a purple pigment or a combination thereof. A photosensitive resin composition as described in claim 1, wherein the solvent comprises two or more types of solvents having different boiling points. The photosensitive resin composition as described in claim 8, wherein the solvent comprises two or more of propylene glycol monomethyl ether acetate (PGMEA), n-butyl alcohol (n-BA) and diethylene glycol methyl ethyl ether (MEDG). A photosensitive resin composition as described in claim 1, wherein the photosensitive resin composition comprises, based on the total amount of the photosensitive resin composition, 1,600 ppm to 3,000 ppm of the additive; 30 wt% to 70 wt% of the colorant; 1 wt% to 20 wt% of the binder resin; 1 wt% to 20 wt% of the photopolymerizable compound; 0.1 wt% to 5 wt% of the photopolymerization initiator; and the remainder of the solvent. The photosensitive resin composition as described in claim 1, wherein the photosensitive resin composition has a viscosity of 1.5 centipoise to 3.8 centipoise at 25°C. A photosensitive resin layer is manufactured using the photosensitive resin composition described in any one of claims 1 to 11. A color filter comprises the photosensitive resin layer as described in claim 12. A CMOS image sensor comprises the color filter as described in claim 13.