TWI900880B - Method for manufacturing a die-cut-die-bond integrated tape, and method for manufacturing a semiconductor device - Google Patents

Abstract

The present invention discloses a method for manufacturing an adhesive sheet, comprising: preparing an adhesive sheet pre-coat having a substrate and an adhesive layer disposed on the substrate; and performing a plasma treatment on a side of the adhesive layer in the adhesive sheet pre-coat opposite to the substrate.

Description

Method for manufacturing a die-cut-die-bond integrated tape, and method for manufacturing a semiconductor device

The present invention relates to a method for manufacturing an adhesive sheet, a method for manufacturing a die-cut-and-bond integrated tape, a method for manufacturing a semiconductor device, a method for processing an adhesive, a method for fixing an adherend, and a method for peeling an adherend.

Adhesives are used in a variety of industrial applications. In industry, the adhesion force is often controlled by adjusting the crosslink density (bulk properties of the adhesive itself, such as crosslink density).

Meanwhile, methods are known for improving the adhesion between an adherend and an adhesive by performing surface treatment on the adherend. For example, Patent Document 1 describes improving the adhesion between a synthetic resin product (adherend) and a coating film by performing plasma treatment on the adherend. Furthermore, Patent Document 2 describes improving the anchoring properties of the plastic film substrate (adherend) surface to the adhesive layer in an adhesive sheet by performing plasma treatment on the plastic film substrate. These patent documents all disclose surface treatment of the adherend from the perspective of improving adhesion. [Prior Art Documents] [Patent Documents]

Patent Document 1: Japanese Patent Publication No. 59-100143 Patent Document 2: Japanese Patent Publication No. 2011-068718

[Problem to be Solved by the Invention] However, existing adhesives still have room for improvement in terms of adhesion. Therefore, the main object of the present invention is to provide a method for producing an adhesive sheet that can produce an adhesive layer having excellent adhesion. [Means for Solving the Problem]

Factors influencing the adhesion between an adherend and an adhesive include not only the adhesive's tack (the adhesive's inherent physical properties) but also its affinity for the adherend (its wettability). However, research by the present inventors has revealed that when controlling the adhesive's tack by adjusting its crosslink density, there is a so-called trade-off between tack and wettability. For example, adjusting the crosslink density to increase tack tends to decrease the adhesive's wettability for the adherend. Furthermore, further research based on this insight revealed that by plasma treating the adhesive layer rather than the adherend, the contact angle of the treated surface can be reduced and the adhesion can be improved, thus completing the present invention.

One aspect of the present invention provides a method for manufacturing an adhesive sheet, comprising: preparing an adhesive sheet precursor having a substrate and an adhesive layer disposed on the substrate; and performing a plasma treatment on a side of the adhesive layer in the adhesive sheet precursor opposite to the substrate.

The plasma treatment may be performed using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be lower than the lower melting point of the substrate or the melting point of the adhesive layer.

The method for manufacturing an adhesive sheet may further include the step of attaching a protective material to the surface of the plasma-treated adhesive layer opposite to the substrate. The protective material may be a material that has been treated by plasma treatment and is attached to the surface of the plasma-treated adhesive layer.

In another aspect, the present invention provides an adhesive sheet obtained by the manufacturing method.

In another aspect, the present invention provides a method for manufacturing a die-cut and die-bond tape, comprising: forming an adhesive layer on the surface of the plasma-treated adhesive layer on the side opposite to the substrate of the adhesive sheet obtained by the manufacturing method.

In another aspect, the present invention provides a die-cut and die-bonded ribbon obtained by the manufacturing method.

On the other hand, the present invention provides a method for manufacturing a semiconductor device, comprising: attaching an adhesive layer of a die-cut and die-bonded tape obtained by the manufacturing method to a semiconductor wafer; singulating the semiconductor wafer, the adhesive layer, and the plasma-treated adhesive layer; picking up a semiconductor element to which the adhesive layer is attached from the plasma-treated adhesive layer; and bonding the semiconductor element to a supporting substrate for mounting the semiconductor element via the adhesive layer.

In another aspect, the present invention provides a method for treating an adhesive, comprising: performing a plasma treatment on the adhesive. The plasma treatment may be performed using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be lower than the melting point of the adhesive.

In another aspect, the present invention provides a method for securing an adherend, comprising: attaching a second adherend to a first adherend via an adhesive treated by the method. Furthermore, in another aspect, the present invention provides a method for peeling an adherend, comprising: treating at least one of the interface between the first adherend and the adhesive or the interface between the second adherend and the adhesive, with water, to peel the first and second adherends. [Effects of the Invention]

The present invention provides a method for manufacturing an adhesive sheet capable of producing an adhesive layer having excellent adhesive strength. Furthermore, the present invention provides a method for manufacturing a cut-and-bond tape using the adhesive sheet obtained by this manufacturing method. Furthermore, the present invention provides a method for manufacturing a semiconductor device using the cut-and-bond tape obtained by this manufacturing method. Furthermore, the present invention provides an adhesive processing method, an adherend fixing method, and an adherend removal method.

The following description will describe embodiments of the present invention with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Except where otherwise indicated, the components (including steps, etc.) in the following embodiments are not required. The sizes of the components in the drawings are conceptual, and the relative sizes of the components are not limited to those shown in the drawings.

The same applies to the numerical values and their ranges in this specification, which do not limit the present invention. In this specification, numerical ranges indicated by "~" indicate a range that includes the numerical values listed before and after the "~" as the minimum and maximum values, respectively. Within numerical ranges listed at different stages in this specification, the upper or lower limit of one numerical range may be replaced by the upper or lower limit of another numerical range listed at a different stage. Additionally, within numerical ranges listed in this specification, the upper or lower limit of the numerical range may be replaced by the values shown in the examples.

In this specification, (meth)acrylate refers to acrylate or its corresponding methacrylate.

[Adhesive Sheet Manufacturing Method] Figures 1(a) to 1(d) are cross-sectional views schematically illustrating one embodiment of a method for manufacturing an adhesive sheet. This method includes: preparing an adhesive sheet precursor comprising a substrate and an adhesive layer disposed on the substrate (adhesive sheet precursor preparation step); and plasma-treating the surface of the adhesive layer in the adhesive sheet precursor opposite to the substrate (plasma treatment step). This method may further include attaching a protective material to the plasma-treated surface of the adhesive layer opposite to the substrate (protective material placement step).

<Adhesive Sheet Precursor Preparation Step> In this step, an adhesive sheet precursor 100 (see Figure 1(a) ) is prepared as the target for plasma treatment. The adhesive sheet precursor 100 includes a substrate 10 and an adhesive layer 20 disposed on the substrate 10.

The substrate 10 is not particularly limited, as long as it has a melting point (or decomposition point or softening point) higher than the heat generated by the plasma treatment. Any substrate film used in the adhesive field can be used. Preferably, the substrate film is capable of expanding during the die bonding step. Examples of such substrate films include polyester films such as polyethylene terephthalate films; polyolefin films such as polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, and polyvinyl acetate films; and plastic films such as polyvinyl chloride films and polyimide films. The surface of the substrate 10 on which the adhesive layer 20 is to be formed may be subjected to surface treatment such as a corona treatment.

The adhesive layer 20 is a layer containing an adhesive component. The adhesive component constituting the adhesive layer 20 is not particularly limited, as long as it has a melting point (or decomposition point or softening point) higher than the heat generated by the plasma treatment. Preferably, it exhibits adhesion at room temperature (25°C) and provides strong adhesion to layers deposited on the adhesive layer 20 (e.g., the adhesive layer described below). The adhesive component constituting the adhesive layer 20 may also contain a base resin. Examples of base resins include acrylic resins, synthetic rubbers, natural rubbers, and polyimide resins. From the perspective of reducing adhesive residue, the base resin preferably has functional groups such as hydroxyl and carboxyl groups that react with the crosslinking agent described below. The base resin can be cured by high-energy radiation such as ultraviolet rays or radioactive radiation, or by heat. The base resin is preferably cured by high-energy radiation, and more preferably by ultraviolet rays (UV-curing base resin).

When using a resin that cures with high-energy radiation as the base resin, a photopolymerization initiator may be used as needed. Examples of photopolymerization initiators include aromatic ketone compounds, benzoin ether compounds, benzyl compounds, ester compounds, acridine compounds, and 2,4,5-triarylimidazole dimers.

To adjust adhesion, the adhesive component may also contain a crosslinking agent capable of forming a crosslinked structure with the functional groups of the base resin. The crosslinking agent preferably has at least one functional group selected from the group consisting of an epoxy group, an isocyanate group, an aziridine group, and a triazine group. A single crosslinking agent may be used alone, or a combination of two or more may be used.

To maintain the effects of plasma treatment, it is effective to adjust the crosslinking agent content. The crosslinking agent content is preferably 5 parts by mass or greater, more preferably 7 parts by mass or greater, and even more preferably 10 parts by mass or greater, per 100 parts by mass of the base resin. A crosslinking agent content of 5 parts by mass or greater per 100 parts by mass of the base resin tends to suppress the effects of plasma treatment. The crosslinking agent content can be 30 parts by mass or less per 100 parts by mass of the base resin. If the crosslinking agent content is 30 parts by mass or less relative to 100 parts by mass of the base resin, the effects of the plasma treatment tend to be more easily maintained, and a decrease in the adhesion between the adhesive layer and the protective material tends to be suppressed.

Adhesives may also contain other ingredients. Examples of these include catalysts such as amines and tin, which are added to promote the crosslinking reaction between the base resin and the photopolymerization initiator; tackifiers such as rosin and terpene resins, which are added to appropriately adjust the adhesive properties; and various surfactants.

In one embodiment, the adhesive layer 20 may be a layer comprising an adhesive component including an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group.

The acrylic resin having a hydroxyl group as the base resin can be obtained by polymerizing a monomer component containing a (meth)acrylate having a hydroxyl group. The polymerization method can be appropriately selected from various known polymerization methods such as free radical polymerization, and examples thereof include suspension polymerization, solution polymerization, and bulk polymerization.

When polymerizing the monomer components in the polymerization method, a polymerization initiator may be used as needed. Examples of such polymerization initiators include ketone peroxides, peroxyketal, hydrogen peroxide, dialkyl peroxides, diacyl peroxides, peroxycarbonates, peroxyesters, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile).

The adhesive sheet precursor 100 having the adhesive layer 20 can be manufactured using known methods. For example, the adhesive sheet precursor 100 can be obtained by the following manufacturing method, which includes: preparing a varnish by diluting the adhesive layer material with a dispersion medium; applying the resulting varnish to the substrate 10; and removing the dispersion medium from the applied varnish.

The thickness of the adhesive layer 20 in the adhesive sheet precursor 100 can be 0.1 μm to 30 μm. A thickness of 0.1 μm or greater tends to ensure sufficient adhesion. A thickness of 30 μm or less tends to be economically advantageous.

The thickness of the adhesive sheet front drive 100 (the total thickness of the substrate 10 and the adhesive layer 20) can be 5 μm to 150 μm, 50 μm to 150 μm, or 100 μm to 150 μm.

Before the plasma treatment, the adhesive sheet precursor 100 may have a protective material attached to the surface of the adhesive layer 20 opposite to the substrate 10. The protective material may be the same as that exemplified in the protective material 30 described below.

<Plasma Treatment Step> In this step, a plasma treatment (A in Figure 1(b)) is performed on the surface of the adhesive layer 20 of the adhesive sheet precursor 100 opposite the substrate 10 (see Figure 1(b)). This produces an adhesive sheet 110 having an adhesive layer subjected to plasma treatment A (plasma-treated adhesive layer 20A) (see Figure 1(c)).

Plasma is a state in which the molecules that make up the gas are partially or completely ionized, separating into cations and electrons that move freely. By using plasma-state gas to treat the adhesive layer's surface opposite the substrate, a chemical reaction occurs on the adhesive layer's surface, imparting oxygen-containing hydrophilic groups. This reduces the contact angle of the treated surface and improves wettability. This reaction enhances the adhesion of the adhesive layer 20 to the adhesive sheet front drive.

The plasma treatment is not particularly limited. From the perspectives of cost, processing capacity, and damage reduction, atmospheric pressure plasma treatment is preferred. Plasma treatment using atmospheric pressure plasma can be performed using, for example, an ultra-high-density atmospheric pressure plasma unit (Fuji Kikai Co., Ltd., trade name: FPB-20 Type II).

To avoid damaging the substrate 10 and adhesive layer 20 during the plasma treatment, the plasma treatment temperature is preferably set below the lower of the melting points of the substrate 10 or the adhesive layer 20. Plasma treatment is preferably performed while adjusting the treatment temperature and speed to prevent wrinkles or warping of the adhesive sheet precursor 100 (substrate 10 and adhesive layer 20) during the treatment. In other words, the adhesive sheet does not significantly deform due to heat. Wrinkles or warping can interfere with the operation of the device during the plasma treatment. The temperature condition of the plasma treatment may be, for example, 300° C. or less, 250° C. or less, or 200° C. or less.

Plasma treatment allows for adjustment of the treatment area. Therefore, plasma treatment can be performed on a portion or the entire surface of the adhesive layer 20 in the adhesive sheet precursor 100, which faces away from the substrate 10. Plasma treatment of a portion of the adhesive layer 20 allows for adjustment of the contact angle of the treated surface, making it easy to separate portions with a low contact angle (i.e., portions of the adhesive layer with high adhesion) from portions with a high contact angle (i.e., portions of the adhesive layer with low adhesion) on the same surface.

<Protective Material Application Step> In this step, a protective material 30 is attached to the surface of the plasma-treated adhesive layer (plasma-treated adhesive layer 20A) opposite the substrate 10 (see Figure 1(d)). This produces an adhesive sheet 120 with a protective material. The protective material 30 can be attached using known methods.

There are no particular limitations on the protective material 30, and protective films used in the adhesive field can be used. Examples of protective films include polyester films such as polyethylene terephthalate films; polyolefin films such as polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, and polyvinyl acetate films; and plastic films such as polyvinyl chloride films and polyimide films. Furthermore, protective films can be made of paper, nonwoven fabrics, or metal foil. The adhesive layer 20A side of the protective material 30, after plasma treatment, can also be treated with a release agent such as a silicone-based stripping agent, a fluorine-based stripping agent, or a long-chain alkyl acrylate-based stripping agent.

The protective material 30 may be a material that has been treated by plasma treatment on the side of the protective material 30 that is attached to the plasma-treated adhesive layer 20A. Using a material that has been treated by plasma treatment as the protective material 30 tends to maintain the improved wettability of the plasma-treated adhesive layer 20A for a long period of time.

The thickness of the protective material 30 is not particularly limited and may be 5 μm to 500 μm, 10 μm to 200 μm, or 15 μm to 100 μm.

[Method for Manufacturing a Die-Cut and Die-Bond Integrated Tape] Figures 2(a) to 2(c) are cross-sectional views schematically illustrating one embodiment of a method for manufacturing a die-cut and die-bond integrated tape. The method for manufacturing a die-cut and die-bond integrated tape 130 of this embodiment includes forming an adhesive layer 40 on the surface of the plasma-treated adhesive layer 20A opposite to the substrate 10 (the plasma-treated surface) of the adhesive sheet 110 obtained by the aforementioned manufacturing method (see Figures 2(a) and 2(b)).

Adhesive layer 40 is a layer containing an adhesive component. Examples of adhesive components constituting adhesive layer 40 include thermosetting adhesive components, light-curing adhesive components, thermoplastic adhesive components, and oxygen-reactive adhesive components. From the perspective of adhesion, the adhesive layer preferably contains a thermosetting adhesive component.

From the perspective of adhesion, the thermosetting adhesive composition preferably includes an epoxy resin and a phenolic resin that can serve as a hardener for the epoxy resin.

Epoxy resins can be used without particular limitation as long as they have an epoxy group in the molecule. Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol A novolac type epoxy resins, bisphenol F novolac type epoxy resins, epoxy resins containing dicyclopentadiene skeletons, Examples include styrene-based epoxy resins, triazine-based epoxy resins, fluorene-based epoxy resins, trisphenolmethane-based epoxy resins, biphenyl-based epoxy resins, xylylene-based epoxy resins, biphenylaralkyl-based epoxy resins, naphthalene-based epoxy resins, and diglycidyl ether compounds of polycyclic aromatic compounds such as polyfunctional phenols and anthracene. These can be used alone or in combination. The epoxy resin content can be 2% to 50% by mass based on the total weight of the adhesive layer.

Phenolic resins can be used without particular limitation as long as they have a phenolic hydroxyl group in the molecule. Examples of phenolic resins include novolac-type phenolic resins obtained by condensing or co-condensing phenols such as phenol, cresol, resorcinol, o-catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and/or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene with a compound having an aldehyde group such as formaldehyde under an acidic catalyst; and phenol aralkyl resins and naphthol aralkyl resins synthesized from phenols such as allylated bisphenol A, allylated bisphenol F, allylated naphthalene diol, phenol novolac, phenol, and/or naphthols with dimethoxy-p-xylene or bis(methoxymethyl)biphenyl. These can be used alone or in combination. The content of the phenolic resin can be 2% to 50% by mass based on the total weight of the adhesive layer.

As other ingredients, the adhesive layer 40 may also include: curing accelerators such as tertiary amines, imidazoles, and quaternary ammonium salts; and inorganic fillers such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, boron nitride, crystalline silica, and amorphous silica. The content of these other ingredients may be 0% to 20% by mass based on the total weight of the adhesive layer.

In the adhesive sheet 110, a portion or all of the surface of the adhesive layer 20 opposite the substrate 10 is plasma-treated. When a portion of the surface of the adhesive layer 20 opposite the substrate 10 is plasma-treated, the adhesive layer 40 can be formed to cover a portion or all of the plasma-treated surface of the adhesive layer 20, or a portion or all of the non-plasma-treated surface of the adhesive layer 20. Alternatively, the adhesive layer 40 can be formed to cover a portion or all of both the plasma-treated surface and the non-plasma-treated surface of the adhesive layer 20. When the entire adhesive layer 20 is subjected to plasma treatment, the adhesive layer 40 may be formed so as to cover a portion or the entire surface of the adhesive layer 20 on which the plasma treatment has been performed.

An example of a method for forming the adhesive layer 40 on the side of the plasma-treated adhesive layer 20A opposite to the substrate 10 is to form an adhesive component into a film using a known method and then adhere the resulting film-shaped adhesive to the side of the plasma-treated adhesive layer 20A opposite to the substrate 10. This produces a die-cut and die-bond integrated tape 130 (see FIG. 2( b )).

The die-cutting and die-bonding tape 130 can be provided with a protective material 50 on the surface of the adhesive layer 40 opposite the adhesive layer 20A. The protective material 50 is not particularly limited, and protective films used in die-cutting and die-bonding tapes can be used. Examples of protective films include polyester films such as polyethylene terephthalate films; polyolefin films such as polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, and polyvinyl acetate films; and plastic films such as polyvinyl chloride films and polyimide films. As described above, a die-cutting and die-bonding tape 140 with a protective material is obtained (see FIG. 2( c )).

[Method for Manufacturing a Semiconductor Device (Semiconductor Package)] Figures 3(a) to 3(f) are cross-sectional views schematically illustrating one embodiment of a method for manufacturing a semiconductor device. The manufacturing method of the semiconductor device of this embodiment includes: a step of attaching the adhesive layer 40 of the die-cut and die-bonded integrated tape 130 obtained by the above-mentioned manufacturing method to the semiconductor wafer W (wafer layer pressing step, see FIG3 (a), FIG3 (b)); a step of singulating the semiconductor wafer W, the adhesive layer 40 and the adhesive layer that has been subjected to plasma treatment (the adhesive layer 20A after plasma treatment) (die-cutting step, see FIG3 (c)); and optionally, performing a die-cutting on the adhesive layer that has been subjected to plasma treatment (the adhesive layer 20A after plasma treatment). A) irradiating ultraviolet rays (UV irradiation step, see FIG3(d)) through the substrate 10; picking up the semiconductor device Wa (semiconductor device 60 with a bonding agent layer) with the bonding agent layer 40a attached from the adhesive layer (adhesive layer 20Aa) subjected to plasma treatment (picking up step, see FIG3(e)); and bonding the semiconductor device 60 with the bonding agent layer to the semiconductor device supporting substrate 80 via the bonding agent layer 40a (semiconductor device bonding step, see FIG3(f)).

<Wafer Lamination Step> First, the cut-and-bond integrated tape 130 is placed in a predetermined device. Next, the cut-and-bond integrated tape 130 is attached to the main surface Ws of the semiconductor wafer W via an adhesive layer 40 (see Figures 3(a) and 3(b)). The conductive surface of the semiconductor wafer W is preferably located on the side opposite the main surface Ws.

<Dicing Step> Next, the semiconductor wafer W, the adhesive layer 40, and the plasma-treated adhesive layer 20A are sliced (see Figure 3(c)). At this point, a portion of the substrate 10 may also be sliced. In this way, the integrated dicing and bonding tape 130 also functions as a dicing wafer.

<UV Irradiation Step> The plasma-treated adhesive layer 20A may be irradiated with UV light (via the substrate 10) as needed (see Figure 3(d)). If the base resin in the adhesive composition is UV-curable (UV-curable base resin), the hardening of the adhesive layer 20A may reduce the bonding strength between the adhesive layer 20A and the adhesive layer 40. For UV irradiation, a wavelength of 200 nm to 400 nm is preferably used. The optimal UV irradiation conditions are to adjust the illumination and irradiation dose to the range of 30 mW/ ^cm2 to 240 mW/ ^cm2 and 200 mJ/ ^cm2 to 500 mJ/ ^cm2 , respectively.

<Pick-up Step> Next, the substrate 10 is expanded to separate the cut semiconductor devices 60 with adhesive layers. The semiconductor devices 60 with adhesive layers, lifted from the substrate 10 by the ejector pins 72, are then suctioned by the suction chuck 74 and picked up from the adhesive layer 20Aa (see Figure 3(e)). When plasma treatment is performed on a portion of the surface of the adhesive layer 20 opposite the substrate 10, the surface of the adhesive layer 20Aa on the adhesive layer 40a side may be the plasma-treated surface, the non-plasma-treated surface, or a combination of both the plasma-treated and non-plasma-treated surfaces. Furthermore, the semiconductor device 60 with an adhesive layer includes a semiconductor device Wa and an adhesive layer 40a. The semiconductor device Wa is obtained by dicing the semiconductor wafer W, and the adhesive layer 40a is obtained by dicing the adhesive layer 40. Adhesive layer 20Aa is formed by separating the plasma-treated adhesive layer 20A through wafer dicing. When picking up the semiconductor device 60 with the adhesive layer, adhesive layer 20Aa may remain on substrate 10. While expanding substrate 10 during the pickup step is not necessary, doing so can further improve pickup performance.

The amount of lift generated by the ejector pins 72 can be appropriately set. Furthermore, to ensure sufficient pickup performance even for extremely thin wafers, a two-stage or three-stage lift can be used. Furthermore, the semiconductor device 60 with the adhesive layer can be picked up using methods other than the suction chuck 74.

<Semiconductor Component Bonding Step> After picking up the semiconductor component 60 with the adhesive layer, it is bonded to the semiconductor component mounting support substrate 80 via the adhesive layer 40a by heat pressing (see Figure 3(f)). Multiple semiconductor components 60 with the adhesive layer can be bonded to the semiconductor component mounting support substrate 80.

The manufacturing method of the semiconductor device of this embodiment may further include, as needed: a step of electrically connecting the semiconductor element Wa to the semiconductor element supporting substrate 80 by wire bonding wires 70; and a step of resin sealing the semiconductor element Wa on the surface 80a of the semiconductor element supporting substrate 80 using a resin sealing material 92.

Figure 4 is a cross-sectional view schematically illustrating one embodiment of a semiconductor device. Semiconductor device 200 shown in Figure 4 can be manufactured through the aforementioned steps. Semiconductor device 200 may also have solder balls 94 formed on the surface of semiconductor element mounting support substrate 80 opposite to surface 80a for electrical connection to an external substrate (motherboard).

[Adhesive Treatment Method] One embodiment of the adhesive treatment method includes the step of plasma treating the adhesive. The adhesive may be the same as the adhesive described above in the adhesive sheet manufacturing method. The plasma treatment may be the same as the plasma treatment described above in the adhesive sheet manufacturing method. The plasma treatment may be performed using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be below the melting point of the adhesive.

[Adherend Securing Method] One embodiment of the adherend securing method includes attaching a second adherend to a first adherend via an adhesive treated by the method. The first and second adherends are not particularly limited, and examples thereof include metal adherends (such as stainless steel (SUS) and aluminum) and non-metallic adherends (such as polycarbonate and glass). The adherend securing conditions can be appropriately determined based on the type of adhesive and the types of the first and second adherends.

[Adherend Removal Method] One embodiment of the adherend removal method includes treating (exposing to water) at least one of the interface between a first adherend and an adhesive or an interface between a second adherend and an adhesive, which adherends have been fixed by the method, with water to remove the first and second adherends. Plasma-treated adhesives have a higher hydrophilicity than untreated adhesives, and treatment with water (exposing to water) tends to facilitate removal. Furthermore, when peeling the first adherend and the second adherend, the adhesive can adhere to either the first adherend or the second adherend, and can also be detached from both the first adherend and the second adherend. [Example]

Hereinafter, the present invention will be described in detail based on embodiments, but the present invention is not limited to these embodiments.

(Example 1) [Adhesive Sheet Preparation] <Preparation of Adhesive Sheet Precursor> 2-ethylhexyl acrylate and methyl methacrylate as monomers, and hydroxyethyl acrylate and acrylic acid as functional group-containing monomers, were polymerized by solution polymerization to obtain an acrylic resin having a hydroxyl group. The acrylic resin having a hydroxyl group had a weight-average molecular weight of 400,000 and a glass transition temperature of -38°C.

The weight-average molecular weight (Mw) was determined using a Tosoh SD-8022/DP-8020/RI-8020 gel permeation chromatography (GPC) apparatus, a Hitachi Chemical Gel Pack GL-A150-S/GL-A160-S column, and tetrahydrofuran as the eluent.

The glass transition point is calculated using the following relationship (FOX equation): 1/Tg = Σ( _Xi / _Tgi ) [In this equation, Tg represents the glass transition point (K) of the copolymer. _Xi represents the mass fraction of each monomer, where _X1 + _X2 +…+ _Xi +…+ _Xn = 1. _Tgi represents the glass transition point (K) of the homopolymer of each monomer.]

Using a three-in-one motor and a stirring blade, 12 parts by mass of a multifunctional isocyanate crosslinker (Mitsubishi Chemical Co., Ltd., trade name "MITEC NY730A-T") was mixed with 100 parts by mass of a hydroxyl-containing acrylic resin and stirred to obtain a varnish for forming an adhesive layer.

Using an applicator, the resulting adhesive layer-forming varnish was applied to Base Film A (38 μm thick polyethylene terephthalate film) while adjusting the gap to achieve a 10 μm thickness. After drying the applied adhesive layer varnish at 80°C for 5 minutes, Base Film B (80 μm thick polyolefin film) with a corona-treated surface was pressed onto the adhesive layer and allowed to stand at room temperature (25°C) for two weeks for sufficient aging. This yielded an adhesive sheet precursor having a structure of Base Film A/Adhesive Layer/Base Film B.

<Plasma Treatment> The base film A of the adhesive sheet precursor was removed, and the adhesive layer of the adhesive sheet precursor, on the side opposite to the base film B, was plasma treated using an ultra-high-density atmospheric pressure plasma unit (Fuji Machinery Co., Ltd., trade name: FPB-20 TYPE II) to produce an adhesive sheet. A protective material (polyethylene terephthalate (PET) film) was then placed on the plasma-treated surface of the adhesive layer, yielding the protective material-attached adhesive sheet of Example 1.

(Plasma Treatment Conditions) Heater Used: Not Used Irradiation Speed: 500 mm/s Irradiation Distance: 5 mm Slit Nozzle: 20 mm Width Gases Used: Nitrogen and Air Gas Flow Rate: Nitrogen 60 L/min, Air 21 L/min Number of Repeats: 1 (Irradiation Pattern: 20 mm Width × 8 Lines) Sample Size: 150 mm × 150 mm In addition, adjust the irradiation distance, irradiation speed, and heater settings, and set the treatment temperature to 100°C or below, so that the adhesive sheet substrate 100 (substrate 10 and adhesive layer 20) does not wrinkle or warp during the treatment.

(Example 2) Example 2 produced an adhesive sheet with a protective material in the same manner as in Example 1, except that the adhesive layer side of the protective material was subjected to the same plasma treatment as that applied to the adhesive layer (number of repetitions: 1).

(Example 3) Example 3 produced an adhesive sheet with a protective material in the same manner as Example 2, except that the number of repetitions of the plasma treatment of the protective material was changed from 1 to 4.

(Example 4) Example 4 was performed in the same manner as Example 1, except that the number of repetitions of the plasma treatment of the adhesive layer was changed from 1 to 4. The adhesive sheet with protective material of Example 2 was obtained.

(Example 5) Example 5 produced an adhesive sheet with a protective material in the same manner as in Example 4, except that the surface of the protective material facing the adhesive layer was subjected to the same plasma treatment as that applied to the adhesive layer (number of repetitions: 1).

(Example 6) Example 6 was performed in the same manner as Example 5, except that the number of repetitions of the plasma treatment of the protective material was changed from 1 to 4. A protective material-attached adhesive sheet of Example 6 was obtained.

(Comparative Example 1) Except for not performing plasma treatment on the adhesive layer, the same procedures as in Example 1 were followed to obtain an adhesive sheet with a protective material according to Comparative Example 1.

[Evaluation] <Measurement of the contact angle of water on the plasma-treated surface of the adhesive layer> The contact angle of water on the plasma-treated surface of the adhesive sheets with protective material used in Examples 1 to 6 and Comparative Example 1 was measured. A contact angle meter (Drop Master 300, manufactured by Kyowa Interface Chemicals Co., Ltd.) was used for the measurement. The protective material of the adhesive sheet with protective material was removed, and water was dripped onto the plasma-treated surface of the adhesive layer as a probe liquid. The measurement conditions were a temperature of 23°C to 28°C, a probe liquid drop volume of 1.5 μL, and a measurement time of 5 seconds after the probe liquid was dropped. The number of measurement trials was set to 10, and the median of the obtained values was calculated as the contact angle θ. The results are shown in Table 1.

[Table 1] Number of plasma treatments on the adhesive layer (times) Number of plasma treatments on protective materials (times) Contact angle θ (°) Example 1 1 0 94 Example 2 1 1 96 Example 3 1 4 94 Example 4 4 0 85 Example 5 4 1 86 Example 6 4 4 85 Comparative example 1 0 0 98

<Measurement of the Peel Strength of the Adhesive Layer from the SUS Substrate> The adhesive sheets with protective material used in Examples 1, 2, and Comparative Example 1 were cut into pieces with a width of 10 mm and a length of at least 70 mm. The protective material was peeled off the adhesive sheets and attached to a SUS plate (SUS430BA) to serve as initial measurement samples. While attached to the SUS plate, a 3 kg hammer roller was moved back and forth three times over the sample. A peeling guide tape (EC tape, manufactured by Ojitac) was cut into a width of 10 mm and attached approximately 10 mm from the tip of the sample. The tape was then fixed to the tip of a load cell. The load cell position was finely adjusted so that the progress of the peeling was parallel to the tape width. Initial test samples were stored refrigerated (5°C) for three months, creating three-month test samples. For these test samples, the SUS substrate and adhesive layer were peeled at a peeling angle of 30 degrees and a peeling speed of 50 mm/min to determine the peel strength. The SUS substrates were cleaned with acetone before use. The results are shown in Table 2. The values in Table 2 are relative to the peel strength values of Comparative Example 1.

[Table 2] Initial peeling strength (relative value based on Comparative Example 1) Peel strength after 3 months (relative value based on Comparative Example 1) Example 1 2.4 1.0 Example 2 3.1 1.4 Comparative example 1 1.0 1.0

It can be inferred that the same effect can be obtained when using other acrylic resins, synthetic rubbers, natural rubbers, polyimide resins, etc. as base resins instead of the adhesive layer in the adhesive sheets with protective materials of Examples 1 to 6.

Compared to the protective adhesive sheet of Comparative Example 1, the contact angle of the plasma-treated surface of the adhesive layer in Examples 1 through 6 was reduced, improving the wettability of the adhesive layer. Furthermore, compared to the protective adhesive sheet of Comparative Example 1, the protective adhesive sheets of Examples 1 and 2 exhibited improved peel strength and adhesion. Furthermore, a comparison between Examples 1 and 2 demonstrates that plasma treatment of the protective material maintains the effects of the plasma treatment over a long period of time. These results confirm that the manufacturing method of the present invention is capable of producing adhesive sheets with excellent adhesion.

10: Substrate 20, 20Aa: Adhesive layer 20A: Adhesive layer after plasma treatment 30, 50: Protective material 40, 40a: Adhesive layer 60: Semiconductor component with adhesive layer 70: Wire bonding wire 72: Ejector pin 74: Suction chuck 80: Support substrate for semiconductor component mounting 80a: Surface 92: Resin sealant 94: Solder balls 100: Adhesive sheet front driver 110: Adhesive sheet 120: Adhesive sheet with protective material 130: Die-bond integrated tape 140: Die-bond integrated tape with protective material 200: Semiconductor device A: Plasma treatment W: Semiconductor wafer Wa: Semiconductor element Ws: Main surface

Figures 1(a) to 1(d) are cross-sectional views schematically illustrating an embodiment of a method for manufacturing an adhesive sheet. Figures 1(a), 1(b), 1(c), and 1(d) are cross-sectional views schematically illustrating each step. Figures 2(a) to 2(c) are cross-sectional views schematically illustrating an embodiment of a method for manufacturing a die-cut and die-bonded integrated tape. Figures 2(a), 2(b), and 2(c) are cross-sectional views schematically illustrating each step. Figures 3(a) to 3(f) are cross-sectional views schematically illustrating an embodiment of a method for manufacturing a semiconductor device. Figures 3(a), 3(b), 3(c), 3(d), 3(e), and 3(f) are cross-sectional views schematically illustrating each step. FIG4 is a cross-sectional view schematically showing one embodiment of a semiconductor device.

10: Base material

20: Adhesive layer

20A: Adhesive layer after plasma treatment

30:Protective material

100: Adhesive film front drive

110: Adhesive sheet

120: Adhesive sheet with protective material

A: Plasma treatment

Claims (7)

A method for manufacturing a die-cutting and die-bonding integrated tape includes: a first step of preparing an adhesive sheet precursor having a substrate and an adhesive layer disposed on the substrate; a second step of plasma-treating a portion or all of the surface of the adhesive layer in the adhesive sheet precursor opposite to the substrate to obtain an adhesive sheet; and a third step of forming an adhesive layer in the adhesive sheet so as to cover a portion or all of the plasma-treated surface of the adhesive layer on the side opposite to the substrate. The method for manufacturing a die-cut and die-bond integrated ribbon as described in claim 1, wherein the plasma treatment is plasma treatment using atmospheric pressure plasma. The method for manufacturing a die-cut and die-bond integrated tape as described in claim 1 or claim 2, wherein the treatment temperature of the plasma treatment is lower than the melting point of the substrate or the melting point of the adhesive layer, whichever is lower. The method for manufacturing a die-cut and die-bond integrated tape as described in claim 1 or claim 2 further comprises, between step 2 and step 3, the steps of: attaching a protective material to the surface of the plasma-treated adhesive layer opposite to the substrate; and peeling the protective material from the plasma-treated adhesive layer. The method for manufacturing a die-cut and die-bond tape as described in claim 4, wherein the surface of the protective material that is attached to the plasma-treated adhesive layer is treated by plasma treatment. The method for manufacturing a die-cut and die-bond tape as described in claim 1 or claim 2 includes: the adhesive layer is a layer comprising an adhesive component, wherein the adhesive component contains an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group. A method for manufacturing a semiconductor device comprises: attaching the adhesive layer of a die-bond tape obtained by the method for manufacturing a die-bond tape according to any one of claims 1 to 6 to a semiconductor wafer; singulating the semiconductor wafer, the adhesive layer, and the plasma-treated adhesive layer; picking up a semiconductor element to which the adhesive layer is attached from the plasma-treated adhesive layer; and bonding the semiconductor element to a semiconductor element mounting support substrate via the adhesive layer.