TWI900201B - Wet process apparatus - Google Patents
Wet process apparatusInfo
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Abstract
Description
本申請涉及一種濕製程設備,特別是關於一種單晶圓濕製程設備。This application relates to a wet process equipment, in particular to a single wafer wet process equipment.
在半導體晶圓、封裝、顯示面板、發光二極體等產品的製造過程中,需要經過一晶圓(基板)處理系統,以對基板的表面供給處理液,例如化學品或去離子水等,進行蝕刻、清洗、塗布等處理程序,而在該基板處理系統中,則必須藉由一濕處理設備來針對使用過之製程液進行收集、排液、回收等後續處理。The manufacturing process for products such as semiconductor wafers, packages, display panels, and LEDs requires a wafer (substrate) processing system to supply processing fluids, such as chemicals or deionized water, to the substrate surface for etching, cleaning, and coating. Within this substrate processing system, wet processing equipment is required to collect, drain, and recycle the used process fluids.
現有的晶圓(基板)濕處理設備於處理不同製程時,不同製程使用之製程液體無法單獨回收,浪費製程液體,增加回收難度及費用。針對上述問題,有業者採用不同回收環的設計,但這些設計對氣液混合物無法獨立收集,且設備規格相當複雜。由於不同的氣液混合物含有(例如酸、鹼、溶劑等)不同性質的藥液,如果混雜在一起容易產生額外的化學反應,進而造成人員或機台的傷害,並且還會增加處理回收氣體的困難度。再者,倘若混雜在一起的混合物回流到多個液體回收模組內部時,則會造成液體回收模組收集到的化學液體與混合物之間發生交叉汙染之問題。When existing wafer (substrate) wet processing equipment handles different processes, the process liquids used in different processes cannot be recovered separately, which wastes process liquids and increases the difficulty and cost of recycling. In response to the above problems, some companies have adopted different recovery loop designs, but these designs cannot independently collect gas-liquid mixtures, and the equipment specifications are quite complex. Because different gas-liquid mixtures contain liquids of different properties (such as acids, bases, solvents, etc.), if they are mixed together, it is easy to produce additional chemical reactions, which in turn causes harm to personnel or equipment, and also increases the difficulty of handling recovered gases. Furthermore, if the mixed mixture flows back into multiple liquid recovery modules, it will cause cross-contamination between the chemical liquids collected by the liquid recovery modules and the mixture.
本申請之一目的在於提供一種應用於晶圓(基板)的處理製程的濕製程設備,其可在同一機台處理多種製程,並可分開獨立回收這些製程中的製程液體及製程氣體,以提升回收效率。One purpose of this application is to provide a wet process equipment for use in wafer (substrate) processing, which can process multiple processes in the same machine and can separately and independently recover the process liquids and process gases in these processes to improve recovery efficiency.
本申請之另一目的在於提供一種濕製程設備,其具有可替換的過濾元件的氣體回收裝置,並可過濾排除氣液混合物中的液體,以避免氣液混合物交叉汙染。Another object of the present application is to provide a wet process equipment having a gas recovery device with a replaceable filter element, which can filter and remove liquid from the gas-liquid mixture to avoid cross-contamination of the gas-liquid mixture.
為達上述目的,本申請提供一種濕製程設備,係應用於一晶圓或基板的處理製程中。該濕製程設備包括一旋轉台、一液體供給裝置及一回收單元。該旋轉台用於承載該晶圓或基板。該液體供給裝置設置在該旋轉台的上方,用於供應多種製程液體至該晶圓或基板上。該回收單元環繞地設置在該旋轉台的周圍,並可沿著一第一方向相對該旋轉台移動,且該回收單元包括多個回收環,每一該回收環用於收集其中一種製程液體及其夾帶氣液混合物。每一該回收環包括:至少一液體回收裝置,包括一排液口及一排液管,該排液管連接於該排液口,且該製程液體由該排液口流至該排液管;及至少一氣體回收裝置,包括一排氣口、一排氣管及一過濾元件,該排氣管連接於該排氣口,且該排氣口位於該排液口的上方,該過濾元件設置於該排氣管中,並用於過濾並排除該氣液混合物中的液體由該排氣管排出。To achieve the above-mentioned purpose, the present application provides a wet process equipment, which is applied to a processing process of a wafer or substrate. The wet process equipment includes a turntable, a liquid supply device and a recovery unit. The turntable is used to support the wafer or substrate. The liquid supply device is arranged above the turntable and is used to supply a variety of process liquids to the wafer or substrate. The recovery unit is arranged around the turntable and can be moved relative to the turntable along a first direction, and the recovery unit includes a plurality of recovery rings, each of which is used to collect one of the process liquids and its entrained gas-liquid mixture. Each recovery loop includes: at least one liquid recovery device, including a drain port and a drain pipe, the drain pipe is connected to the drain port, and the process liquid flows from the drain port to the drain pipe; and at least one gas recovery device, including an exhaust port, an exhaust pipe and a filter element, the exhaust pipe is connected to the exhaust port, and the exhaust port is located above the drain port. The filter element is arranged in the exhaust pipe and is used to filter and remove the liquid in the gas-liquid mixture from the exhaust pipe.
較佳地,該液體回收裝置的排液口及該氣體回收裝置的排氣口在一水平面上的正投影位置交錯設置。Preferably, the liquid discharge port of the liquid recovery device and the gas discharge port of the gas recovery device are arranged at staggered positions in their orthographic projections on a horizontal plane.
較佳地,該液體回收裝置及該氣體回收裝置的數量分別為複數個,且該複數個液體回收裝置的複數個排液口與該複數個氣體回收裝置的複數個排氣口在該水平面上的正投影位置交錯設置。Preferably, the number of the liquid recovery device and the gas recovery device is plural, and the orthographic projection positions of the plurality of liquid recovery devices and the plurality of exhaust ports of the plurality of gas recovery devices on the horizontal plane are staggered.
較佳地,該排液管相對於該旋轉台的頂面朝下傾斜,該排氣管相對於該旋轉台的頂面朝上傾斜。Preferably, the liquid drain pipe is tilted downward relative to the top surface of the turntable, and the exhaust pipe is tilted upward relative to the top surface of the turntable.
較佳地,該排氣管包括一連接管部及一延伸管部,該過濾元件設置在該連接管部及該延伸管部之間,並緊靠於該排氣管的一內壁面。Preferably, the exhaust pipe includes a connecting pipe portion and an extending pipe portion, and the filter element is disposed between the connecting pipe portion and the extending pipe portion and is closely attached to an inner wall surface of the exhaust pipe.
較佳地,該氣體回收裝置還包括一套管,該套管可拆離地套接於該連接管部及該延伸管部之間,且該過濾元件設置在該套管內。Preferably, the gas recovery device further includes a sleeve, which is detachably sleeved between the connecting pipe portion and the extension pipe portion, and the filter element is disposed in the sleeve.
較佳地,該套管的相對二端分別包覆該連接管部及該延伸管部的外表面。Preferably, the opposite ends of the sleeve respectively cover the outer surfaces of the connecting tube portion and the extension tube portion.
較佳地,該排氣管還包括一罩蓋及一替換開口,該罩蓋可活動地且密封地罩蓋該替換開口,且該過濾元件可替換地由該替換開口設置在該排氣管內。Preferably, the exhaust pipe further includes a cover and a replacement opening, the cover can movably and sealingly cover the replacement opening, and the filter element can be replaceably disposed in the exhaust pipe through the replacement opening.
較佳地,該過濾元件與該排氣口之間具有一退縮空間。Preferably, there is a retreat space between the filter element and the exhaust port.
較佳地,每一該回收環包括一底板,該底板包括一導流面,且該導流面相對於該底板朝下傾斜並鄰接於該排液口,其中該排液管相對於該底板的位置低於該導流面。Preferably, each of the recovery rings includes a bottom plate, the bottom plate includes a guide surface, and the guide surface is inclined downward relative to the bottom plate and adjacent to the drain port, wherein the drain pipe is located lower than the guide surface relative to the bottom plate.
較佳地,該濕製程設備還包括一基座、多個支撐柱及一驅動機構,其中該多個支撐柱設置在該基座上並串接該多個回收環,且該驅動機構用於驅動該多個支撐柱同步沿著該第一方向相對該旋轉台移動。Preferably, the wet process equipment further includes a base, a plurality of supporting columns and a driving mechanism, wherein the plurality of supporting columns are arranged on the base and connected in series to the plurality of recovery rings, and the driving mechanism is used to drive the plurality of supporting columns to move synchronously along the first direction relative to the turntable.
在本申請實施例中,濕製程設備的氣體回收裝置與液體回收裝置在各個回收環的橫向及縱向上交錯設置,避免氣液混合物交叉汙染,且各層回收環獨立設置,保養維修時可獨立處理或更換維修其中一層,更可增加回收效率。尤其,氣體回收裝置內設置有可替換的過濾元件,可有效過濾並排除氣液混合物中的液體,進而避免氣液混合物中的液體由排氣管排出。In the embodiments of this application, the gas recovery device and liquid recovery device of the wet process equipment are staggered horizontally and vertically within each recovery loop to prevent cross-contamination of the gas-liquid mixture. Furthermore, each layer of recovery loops is independently installed, allowing for independent maintenance or replacement of individual layers, further increasing recovery efficiency. In particular, the gas recovery device is equipped with a replaceable filter element that effectively filters and removes liquid from the gas-liquid mixture, thereby preventing it from being discharged through the exhaust pipe.
以下各實施例的說明是參考附加的圖式,用以例示本申請可用以實施的特定實施例。本申請所提到的方向用語,例如“上”、“下”、“前”、“後”、“左”、“右”、“內”、“外”、“側面”等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本申請,而非用以限制本申請。The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present application may be implemented. Directional terms used in this application, such as "upper," "lower," "front," "back," "left," "right," "inner," "outer," and "side," refer only to the directions in the accompanying drawings. Therefore, these directional terms are intended to facilitate explanation and understanding of this application and are not intended to limit this application.
本申請特別以下述例子加以描述,這些例子僅係用以舉例說明而已,因為對於熟習此技藝者而言,在不脫離本揭示內容之精神和範圍內,當可作各種之更動與潤飾,因此本揭示內容之保護範圍當視後附之申請專利範圍所界定者為準。在通篇說明書與申請專利範圍中,除非內容清楚指定,否則「一」以及「所述」的意義包含這一類敘述包含「一或至少一」所述元件或成分。此外,如本申請所用,除非從特定上下文明顯可見將複數個排除在外,否則單數冠詞亦包含複數個元件或成分的敘述。而且,應用在此描述中與下述之全部申請專利範圍中時,除非內容清楚指定,否則「在其中」的意思可包含「在其中」與「在其上」。This application is particularly described with the following examples, which are used for illustration only. For those skilled in the art, various changes and modifications can be made without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended patent claims. Throughout the specification and patent claims, unless the content clearly indicates otherwise, the meaning of "a" and "the" includes that such description includes "one or at least one" of the elements or components. In addition, as used in this application, unless it is clear from the specific context that the plural is excluded, the singular article also includes the description of plural elements or components. Moreover, when applied in this description and throughout the following patent claims, unless the content clearly indicates otherwise, the meaning of "in which" may include "in which" and "on which".
下面將結合本申請實施例中的附圖,對本申請實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅是本申請一部分實施例,而不是全部的實施例。基於本申請中的實施例,本領域技術專員在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬本申請保護的範圍。The following clearly and completely describes the technical solutions in the embodiments of this application, in conjunction with the accompanying figures. Obviously, the described embodiments are only a portion of the embodiments of this application, not all of them. All other embodiments derived by technical experts based on the embodiments of this application without inventive effort are also within the scope of protection of this application.
本申請提供一種單晶圓或基板濕製程設備,可應用於半導體前段製程、半導體先進封裝製程、化合物半導體製程、光電製程等。參照圖1及圖2,圖1為本申請實施例的濕製程設備1的立體結構示意圖,圖2為圖1的濕製程設備1的俯視圖。如圖1及圖2所示,本申請的濕製程設備1包括一旋轉台10、一回收單元20、一基座50及一液體供給裝置60(如圖3所示)。詳細地,旋轉台10及回收單元20設置在基座50上,且液體供給裝置60可活動地設置在旋轉台10的上方。在一些實施例中,旋轉台10的頂部包含真空吸盤,並且藉由真空吸盤的施加的吸力,使得晶圓或基板(未圖示)可被固定在旋轉台10的頂部。旋轉台10配置有驅動機構,用於驅使旋轉台10繞軸樞轉。在其他實施例中亦可採用其他的方式來將晶圓固定在旋轉台上,例如採用夾持裝置等。另一方面,液體供給裝置60可透過噴嘴對晶圓施加複數種製程液體。具體來說,液體供給裝置60還包含多條液體傳輸管線。藉此設計,可根據製程需求來控制液體供給裝置60施加對應的製程液體至旋轉台10上的晶圓(基板),以對晶圓進行蝕刻或清洗等不同製程。The present application provides a single wafer or substrate wet process equipment that can be applied to semiconductor front-end processes, semiconductor advanced packaging processes, compound semiconductor processes, optoelectronic processes, etc. Referring to Figures 1 and 2, Figure 1 is a schematic diagram of the three-dimensional structure of the wet process equipment 1 of an embodiment of the present application, and Figure 2 is a top view of the wet process equipment 1 of Figure 1. As shown in Figures 1 and 2, the wet process equipment 1 of the present application includes a turntable 10, a recovery unit 20, a base 50 and a liquid supply device 60 (as shown in Figure 3). In detail, the turntable 10 and the recovery unit 20 are arranged on the base 50, and the liquid supply device 60 can be movably arranged above the turntable 10. In some embodiments, the top of the turntable 10 includes a vacuum chuck, and the suction force applied by the vacuum chuck allows a wafer or substrate (not shown) to be fixed to the top of the turntable 10. The turntable 10 is equipped with a drive mechanism for driving the turntable 10 to rotate around the axis. In other embodiments, other methods can also be used to fix the wafer on the turntable, such as using a clamping device. On the other hand, the liquid supply device 60 can apply a plurality of process liquids to the wafer through a nozzle. Specifically, the liquid supply device 60 also includes a plurality of liquid transmission pipelines. With this design, the liquid supply device 60 can be controlled to apply the corresponding process liquid to the wafer (substrate) on the turntable 10 according to the process requirements, so as to perform different processes such as etching or cleaning on the wafer.
參照圖3及圖4並配合圖1及圖2,圖3及圖4分別為本申請濕製程設備1的剖面示意圖。如圖1至圖3所示,回收單元20環繞地設置在旋轉台10的周圍,並可沿著一第一方向D1相對旋轉台10移動。在此實施例中,第一方向D1為垂直於基座50的方向。如圖1所示,回收單元20包括多個回收環21,每一回收環21用於收集從旋轉台10上的晶圓表面因離心力甩出的製程液體,並且將製程液體排出,同時還將該製程液體夾帶氣液混合物也排出。在一些實施例中,如圖1所示,多個回收環21沿第一方向D1由上而下依序為第一回收環211、第二回收環212、第三回收環213及第四回收環214。在其他實施例中亦可視製程需要採用不同數量的回收環。詳細地,在此實施例中,第一回收環211、第二回收環212、第三回收環213及第四回收環214在使用時分別對應的製程為第一次蝕刻、第一次清洗(在第一次蝕刻後)、第二次蝕刻及第二次清洗(在第二次蝕刻後)的製程,但不侷限於此。在其他實施例中,如果二次蝕刻後要進行去光阻,則可以另外增加去光阻及去光阻後清洗二層回收環。Referring to Figures 3 and 4 in conjunction with Figures 1 and 2, Figures 3 and 4 are schematic cross-sectional views of the wet process equipment 1 of the present application, respectively. As shown in Figures 1 to 3, the recovery unit 20 is disposed around the turntable 10 and is movable relative to the turntable 10 along a first direction D1. In this embodiment, the first direction D1 is a direction perpendicular to the base 50. As shown in Figure 1, the recovery unit 20 includes a plurality of recovery rings 21, each of which is used to collect process liquid thrown out from the wafer surface on the turntable 10 due to centrifugal force, and discharge the process liquid, and at the same time, discharge the gas-liquid mixture entrained in the process liquid. In some embodiments, as shown in FIG1 , a plurality of recycling rings 21 are sequentially arranged from top to bottom along the first direction D1 as a first recycling ring 211, a second recycling ring 212, a third recycling ring 213, and a fourth recycling ring 214. In other embodiments, a different number of recycling rings may be used depending on the process requirements. Specifically, in this embodiment, the first recycling ring 211, the second recycling ring 212, the third recycling ring 213, and the fourth recycling ring 214 respectively correspond to the processes of the first etching, the first cleaning (after the first etching), the second etching, and the second cleaning (after the second etching) when in use, but are not limited thereto. In other embodiments, if photoresist stripping is required after the second etching, a second layer of recycling rings for photoresist stripping and post-photoresist stripping cleaning may be added.
參照圖3,每一回收環21,也就是第一回收環211、第二回收環212、第三回收環213及第四回收環214分別包括環形底板22及對應環形底板22設置的環形上蓋23。應當注意的是,本申請實施僅例示性地繪示回收環的主要結構,對於熟知此技藝者所已知的回收環之其他基本構造,在此並不詳述。如圖1、圖3及圖4所示,每一回收環21包括一個液體回收裝置30及多個氣體回收裝置40。在此實施例中以四個氣體回收裝置40為例。在一些實施例中,每一回收環21具有的液體回收裝置30的數量及氣體回收裝置40的數量相對應,兩者的數量可視設計所需而不同。較佳地,複數個液體回收裝置30及複數個氣體回收裝置40的設置可以增加排液效率及排氣效率。Referring to FIG3 , each recovery ring 21 , namely the first recovery ring 211 , the second recovery ring 212 , the third recovery ring 213 , and the fourth recovery ring 214 , respectively, includes an annular base plate 22 and an annular upper cover 23 provided corresponding to the annular base plate 22 . It should be noted that this embodiment of the application only illustrates the main structure of the recovery ring for illustrative purposes, and other basic structures of the recovery ring known to those skilled in the art are not described in detail herein. As shown in FIG1 , FIG3 , and FIG4 , each recovery ring 21 includes a liquid recovery device 30 and a plurality of gas recovery devices 40 . In this embodiment, four gas recovery devices 40 are used as an example. In some embodiments, each recovery ring 21 has a corresponding number of liquid recovery devices 30 and a corresponding number of gas recovery devices 40, and the number of the two can be different depending on the design requirements. Preferably, the provision of a plurality of liquid recovery devices 30 and a plurality of gas recovery devices 40 can increase the liquid discharge efficiency and the exhaust efficiency.
參照圖5並配合圖3至圖4,圖5為液體回收裝置30及氣體回收裝置40的平面配置示意圖。在一些實施例中,每一液體回收裝置30包括一排液口31及一排液管32。具體地,排液口31形成在回收環21的上蓋23及底板22之間,且排液管32透過接頭33連接於排液口31,使製程液體由排液口31流至排液管32。在此實施例中,排液管32可使用軟管,且軟管材料的排液管32常態下透過接頭33固定套接於回收環21,待需保養時可拆離清潔或替換。如圖3所示,每一回收環21的排液管32個別獨立設置,可增加製程液體回收率。Referring to Figure 5 and in conjunction with Figures 3 to 4, Figure 5 is a schematic diagram of the planar configuration of the liquid recovery device 30 and the gas recovery device 40. In some embodiments, each liquid recovery device 30 includes a drain port 31 and a drain pipe 32. Specifically, the drain port 31 is formed between the upper cover 23 and the bottom plate 22 of the recovery ring 21, and the drain pipe 32 is connected to the drain port 31 through a connector 33, so that the process liquid flows from the drain port 31 to the drain pipe 32. In this embodiment, a hose can be used for the drain pipe 32, and the drain pipe 32 made of the hose material is fixedly connected to the recovery ring 21 through the connector 33 under normal conditions, and can be removed for cleaning or replacement when maintenance is required. As shown in Figure 3, the drain pipe 32 of each recovery ring 21 is independently provided, which can increase the process liquid recovery rate.
參照圖6,圖6為回收環21的剖面示意圖。在一些實施例中,如圖6所示,回收環21的底板22包括一導流面221,且導流面221相對於底板22朝下傾斜並鄰接於排液口31。具體地,如圖3所示,排液管32的一端透過接頭33連接於具向下傾斜外邊緣的回收環21,使排液管32相對於旋轉台10的頂面朝下傾斜,並且排液管32相對於底板22的位置低於導流面221(如圖6所示),以利於製程液體由底板22經由導流面221流入排液管32。Referring to FIG. 6 , FIG. 6 is a schematic cross-sectional view of the recovery ring 21. In some embodiments, as shown in FIG. 6 , the bottom plate 22 of the recovery ring 21 includes a guide surface 221 that is tilted downward relative to the bottom plate 22 and adjacent to the drain port 31. Specifically, as shown in FIG. 3 , one end of a drain pipe 32 is connected to the recovery ring 21, which has a downwardly tilted outer edge, via a connector 33. This allows the drain pipe 32 to tilt downward relative to the top surface of the turntable 10, and the position of the drain pipe 32 relative to the bottom plate 22 is lower than the guide surface 221 (as shown in FIG. 6 ). This facilitates the flow of process liquid from the bottom plate 22 through the guide surface 221 into the drain pipe 32.
在另一些實施例中,亦可採用非軟管材料的排液管(例如硬管)。具體地,硬質材料的排液管及回收環可分別設置有相對應的快接裝置。在使用時,如圖9所示,排液管32可透過套接方式(例如卡套結構)直接快速地套接於回收環,而使排液管在常態下不用固定於回收環,利於於每次製程後的維護及清潔。此外,排液管的快接裝置於脫離時,可透過卡榫作動將排液管封住,避免液體洩漏。In other embodiments, a drain tube made of a non-soft tubing material (e.g., a rigid tube) may also be used. Specifically, the rigid drain tube and recovery ring may each be equipped with a corresponding quick-connect device. During use, as shown in Figure 9, the drain tube 32 can be quickly and directly connected to the recovery ring using a sleeve connection (e.g., a ferrule structure). This allows the drain tube to remain securely attached to the recovery ring under normal circumstances, facilitating maintenance and cleaning after each process. Furthermore, when the drain tube's quick-connect device is disconnected, it can be sealed by a latch to prevent liquid leakage.
如圖3至圖5所示,每一氣體回收裝置40,包括一排氣口41、一排氣管42及一過濾元件43。具體地,排氣口41形成在回收環21的上蓋23處,且排氣管連42的一端接於排氣口41,另一端用於連接於抽氣設備,並各自以獨立抽氣系統進行氣體收集與排放,避免不同性質之化學藥水(例如酸、鹼、有機溶劑等)之氣體發生交互反應,影響工業安全。在此實施例中,如圖1所示,每一回收環21配置有四個氣體回收裝置40,其等距環繞旋轉台10排列,以針對回收環21四周各區域收集氣體,增加排氣效率。如圖3至圖4及圖6所示,排氣管42相對於旋轉台10的頂面朝上傾斜,以利氣體的排出,且排氣口41位於排液口31的上方。進一步說,排氣口41與排液口31分開設置,用以避免排氣管42在抽氣過程時可能將流經排液口31的製程液體抽走的情況。As shown in Figures 3 to 5, each gas recovery device 40 includes an exhaust port 41, an exhaust pipe 42, and a filter element 43. Specifically, the exhaust port 41 is formed on the upper cover 23 of the recovery ring 21, and one end of the exhaust pipe 42 is connected to the exhaust port 41, and the other end is used to connect to the exhaust equipment. Each uses an independent exhaust system to collect and discharge gas, preventing the interaction of gases from chemical solutions of different properties (such as acids, bases, organic solvents, etc.) and affecting industrial safety. In this embodiment, as shown in Figure 1, each recovery ring 21 is equipped with four gas recovery devices 40, which are arranged at equal distances around the turntable 10 to collect gas from various areas around the recovery ring 21 and increase exhaust efficiency. As shown in Figures 3-4 and 6, the exhaust pipe 42 is tilted upward relative to the top of the turntable 10 to facilitate gas discharge, and the exhaust port 41 is located above the liquid discharge port 31. Furthermore, the exhaust port 41 is separated from the liquid discharge port 31 to prevent the exhaust pipe 42 from extracting process liquid flowing through the liquid discharge port 31 during the pumping process.
在一些實施例中,如圖5所示,回收環21設置有多個液體回收裝置30。詳細地,液體回收裝置30的排液口31及氣體回收裝置40的排氣口41在一水平面上的正投影位置交錯設置。也就是說,回收環21的複數個排液口31與複數個排氣口41在水平面上的正投影位置交錯設置,進一步避免氣體回收裝置40在抽氣過程時可能將流經排液口31的製程液體抽走的情況。In some embodiments, as shown in FIG5 , the recovery ring 21 is equipped with multiple liquid recovery devices 30. Specifically, the drain ports 31 of the liquid recovery devices 30 and the exhaust ports 41 of the gas recovery devices 40 are arranged in a staggered arrangement relative to their orthographic projections on a horizontal plane. In other words, the staggered arrangement of the multiple drain ports 31 and the multiple exhaust ports 41 of the recovery ring 21 further prevents the gas recovery devices 40 from draining process liquids flowing through the drain ports 31 during the pumping process.
參照圖7配合圖4,圖7為圖4的濕製程設備1的A部分的局部放大示意圖。特別說明的是,在本申請實施例,排氣管42內設置有過濾元件43,用於過濾並排除氣液混合物中的液體,進而避免氣液混合物中的液體由排氣管42排出。詳細地,過濾元件43可被更換地設置在排氣管42的排氣通道上,且過濾元件43的材質可為耐酸鹼的材料,視製程需要可使用包含但不限於聚丙烯(polypropylene, PP), 聚苯乙烯 ( polystyrene, PS), PFA,聚四氟乙烯 (polytetrafluoroethene, PTFE), 聚偏二氟乙烯 (polyvinylidene difluoride, PVDF) 等材料。如圖4及圖7所示,排氣管42包括一連接管部421及一延伸管部422,且過濾元件43設置在連接管部421及延伸管部422之間,並緊靠於排氣管42的一內壁面42a。在此實施例中,氣體回收裝置40還包括一套管45,且過濾元件43設置在套管45內。具體地,套管45可透過緊配合、旋緊或卡接等方式可拆離地套接於連接管部421及延伸管部422之間。較佳地,套管45的相對二端分別包覆連接管部421及延伸管部422的外表面42b,以確保套管45與排氣管42的緊密配合。當過濾元件43需要替換時,僅需將套管45由排氣管42拆離即可輕易又快速地完成過濾元件43的替換作業。Referring to FIG. 7 in conjunction with FIG. 4 , FIG. 7 is a partially enlarged schematic diagram of portion A of the wet process equipment 1 of FIG. Specifically, in the embodiment of the present application, a filter element 43 is disposed within the exhaust pipe 42 to filter and remove liquid from the gas-liquid mixture, thereby preventing the liquid from being discharged through the exhaust pipe 42 . Specifically, the filter element 43 can be replaceably disposed within the exhaust passage of the exhaust pipe 42 . The filter element 43 can be made of an acid- and alkali-resistant material, including but not limited to polypropylene (PP), polystyrene (PS), PFA, polytetrafluoroethylene (PTFE), and polyvinylidene difluoride (PVDF), depending on process requirements. As shown in Figures 4 and 7, the exhaust pipe 42 includes a connecting pipe portion 421 and an extension pipe portion 422, and the filter element 43 is disposed between the connecting pipe portion 421 and the extension pipe portion 422, and is closely attached to an inner wall surface 42a of the exhaust pipe 42. In this embodiment, the gas recovery device 40 further includes a sleeve 45, and the filter element 43 is disposed within the sleeve 45. Specifically, the sleeve 45 can be detachably sleeved between the connecting pipe portion 421 and the extension pipe portion 422 by means of a tight fit, screwing, or snap connection. Preferably, the opposite ends of the sleeve 45 respectively cover the outer surfaces 42b of the connecting pipe portion 421 and the extension pipe portion 422 to ensure a tight fit between the sleeve 45 and the exhaust pipe 42. When the filter element 43 needs to be replaced, the filter element 43 can be replaced easily and quickly by simply removing the sleeve 45 from the exhaust pipe 42 .
參照圖8A及圖8B,圖8A為本申請另一實施例的濕製程設備的排氣管及罩蓋的局部放大示意圖,圖8B為圖8A的罩蓋開啟的立體示意圖。在此實施例中,排氣管42包括一罩蓋423及一替換開口424。詳細地,替換開口424形成在排氣管42上,且罩蓋423可活動地且密封地罩蓋替換開口424。利用上述結構,過濾元件43可直接由替換開口424設置在排氣管42內。當過濾元件43需要替換時,僅需將罩蓋423打開即可輕易又快速地完成過濾元件43的替換作業。特別說明的是,本申請圖7及圖8A及8B實施例所示的過濾元件43皆與排氣口41之間具有一退縮空間401(如圖6及圖7所示),其離排氣管42與回收環21的上蓋23的轉角處例如至少0.5公分以上,較佳為1公分或是以上。藉由退縮空間401的設置可避免製程液體直接接觸到過濾元件43。Referring to Figures 8A and 8B, Figure 8A is a partially enlarged schematic diagram of an exhaust duct and a cover of a wet process equipment according to another embodiment of the present application, and Figure 8B is a three-dimensional schematic diagram of Figure 8A with the cover opened. In this embodiment, the exhaust duct 42 includes a cover 423 and a replacement opening 424. Specifically, the replacement opening 424 is formed on the exhaust duct 42, and the cover 423 can movably and sealingly cover the replacement opening 424. Utilizing the above structure, the filter element 43 can be directly placed in the exhaust duct 42 through the replacement opening 424. When the filter element 43 needs to be replaced, the filter element 43 can be easily and quickly replaced by simply opening the cover 423. Specifically, the filter element 43 shown in the embodiments of Figures 7 and 8A and 8B of this application has a setback space 401 (as shown in Figures 6 and 7 ) between it and the exhaust port 41. This setback space 401 is, for example, at least 0.5 centimeters, and preferably 1 centimeter or more, from the corner between the exhaust pipe 42 and the upper cover 23 of the recovery ring 21. The provision of setback space 401 prevents process fluid from directly contacting the filter element 43.
繼續參照圖3至圖4,本申請的濕製程設備1還包括多個支撐柱51及一驅動機構52。具體地,多個支撐柱51設置在基座50上並串接多個回收環21。單一驅動機構52用於驅動多個支撐柱51同步沿著第一方向D1相對旋轉台10移動,同時帶動回收環21沿著第一方向D1相對旋轉台10升降移動。並且,由於每一個回收環21包括一個液體回收裝置30及四個氣體回收裝置40,故當回收環21升降時,連帶地液體回收裝置30及氣體回收裝置40會一起上升或下降。藉由驅動機構52及支撐柱51構成的升降裝置的控制,可使指定之第一回收環211、第二回收環212、第三回收環213或第四回收環214移動至與旋轉台10對準,其中對準是指其中之一第一回收環211、第二回收環212、第三回收環213或第四回收環214的排液口31與旋轉台10上的晶圓(基板)相鄰,使得當液體供給裝置60施加製程液體至旋轉台10上的晶圓(基板),且旋轉台10旋轉時,晶圓(基板)表面因離心力甩出的製程液體可被相鄰的其中之一第一回收環211、第二回收環212、第三回收環213或第四回收環214收集,同時還將製程液體夾帶氣液混合物也由排氣口41排出。Continuing with reference to Figures 3 and 4, the wet process equipment 1 of the present application further includes a plurality of support columns 51 and a drive mechanism 52. Specifically, the plurality of support columns 51 are disposed on the base 50 and are connected in series to the plurality of recovery rings 21. The single drive mechanism 52 is used to drive the plurality of support columns 51 to move synchronously along the first direction D1 relative to the turntable 10, while simultaneously driving the recovery ring 21 to move up and down along the first direction D1 relative to the turntable 10. Furthermore, since each recovery ring 21 includes a liquid recovery device 30 and four gas recovery devices 40, when the recovery ring 21 is raised or lowered, the liquid recovery device 30 and the gas recovery device 40 will also rise or fall together. By controlling the lifting device composed of the driving mechanism 52 and the supporting column 51, the designated first recovery ring 211, the second recovery ring 212, the third recovery ring 213 or the fourth recovery ring 214 can be moved to align with the turntable 10, wherein alignment means that the drain port 31 of one of the first recovery ring 211, the second recovery ring 212, the third recovery ring 213 or the fourth recovery ring 214 is aligned with the wafer on the turntable 10 ( The liquid supply device 60 applies process liquid to the wafer (substrate) on the turntable 10, and when the turntable 10 rotates, the process liquid thrown off the surface of the wafer (substrate) due to centrifugal force can be collected by one of the adjacent first recovery ring 211, second recovery ring 212, third recovery ring 213 or fourth recovery ring 214. At the same time, the gas-liquid mixture entrained in the process liquid is also discharged from the exhaust port 41.
綜上所述,本申請揭示的濕製程設備的氣體回收裝置與液體回收裝置在各個回收環的橫向及縱向上交錯設置,避免氣液混合物交叉汙染,且各層回收環獨立設置,保養維修時可獨立處理或更換維修其中一層,更可增價回收效率。尤其,氣體回收裝置內設置有可替換的過濾元件,可有效過濾並排除氣液混合物中的液體,進而避免氣液混合物中的液體由排氣管排出。In summary, the gas recovery device and liquid recovery device of the wet process equipment disclosed in this application are staggered horizontally and vertically within each recovery loop to prevent cross-contamination of the gas-liquid mixture. Furthermore, each layer of recovery loops is independently installed, allowing for independent maintenance or replacement of individual layers, further increasing recovery efficiency. In particular, the gas recovery device is equipped with a replaceable filter element that effectively filters and removes liquid from the gas-liquid mixture, thereby preventing it from being discharged through the exhaust pipe.
雖然本申請已以優選實施例闡述如上,但上述優選實施例並非用以限制本申請,本領域的普通技術人士在不脫離本申請的精神和範圍內,均可作各種更動與潤飾,因此本申請的保護範圍以請求項界定的範圍為準。Although this application has been described above with reference to preferred embodiments, the aforementioned preferred embodiments are not intended to limit this application. Persons skilled in the art may make various changes and modifications without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be based on the scope defined in the claims.
以上對本申請實施例所提供用於晶圓及基板的處理製程中的濕製程設備詳細介紹,本文中應用了具體個例對本申請的原理及實施方式進行了闡述,以上實施例的說明只是用於幫助理解本申請的方法及其核心思想。同時,對於本領域的技術人員,依據本申請的思想,在具體實施方式及應用範圍上均會有改變的地方,綜上所述,本說明書內容不應理解為對本申請的限制。The above detailed description of the wet process equipment for wafer and substrate processing provided by the embodiments of this application is provided. Specific examples are used herein to illustrate the principles and implementation of this application. The description of the above embodiments is intended solely to facilitate understanding of the method and core concepts of this application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation and scope of application may occur based on the principles of this application. In summary, this description should not be construed as limiting this application.
1:濕製程設備 10:旋轉台 20:回收單元 21:回收環 211:第一回收環 212:第二回收環 213:第三回收環 214:第四回收環 22:底板 221:導流面 23:上蓋 30:液體回收裝置 31:排液口 32:排液管 33:接頭 40:氣體回收裝置 401:退縮空間 41:排氣口 42:排氣管 42a:內壁面 42b:外表面 421:連接管部 422:延伸管部 423:罩蓋 424:替換開口 43:過濾元件 45:套管 50:基座 51:支撐柱 52:驅動機構 60:液體供給裝置 D1:第一方向 1: Wet process equipment 10: Rotating table 20: Recovery unit 21: Recovery ring 211: First recovery ring 212: Second recovery ring 213: Third recovery ring 214: Fourth recovery ring 22: Bottom plate 221: Flow guide surface 23: Top cover 30: Liquid recovery device 31: Drain port 32: Drain pipe 33: Connector 40: Gas recovery device 401: Recessed space 41: Exhaust port 42: Exhaust pipe 42a: Inner wall 42b: Outer surface 421: Connecting tube 422: Extension tube 423: Cover 424: Replacement opening 43: Filter element 45: Casing 50: Base 51: Support Column 52: Drive Mechanism 60: Liquid Supply Device D1: First Direction
圖1為本申請濕製程設備的立體結構示意圖。 圖2為圖1的濕製程設備的俯視圖。 圖3為本申請濕製程設備的剖面示意圖。 圖4為本申請濕製程設備的另一剖面示意圖。 圖5為本申請濕製程設備的液體回收裝置及氣體回收裝置的平面配置示意圖。 圖6為本申請濕製程設備的回收環的剖面示意圖。 圖7為圖4的濕製程設備的A部分的局部放大示意圖。 圖8A為本申請濕製程設備的排氣管及罩蓋的局部放大示意圖。 圖8B為圖8A的罩蓋開啟的立體示意圖。 圖9為本申請濕製程設備在俯視角度下的作動示意圖。 Figure 1 is a schematic diagram of the three-dimensional structure of the wet process equipment of this application. Figure 2 is a top view of the wet process equipment of Figure 1. Figure 3 is a schematic cross-sectional view of the wet process equipment of this application. Figure 4 is another schematic cross-sectional view of the wet process equipment of this application. Figure 5 is a schematic diagram of the planar layout of the liquid recovery device and gas recovery device of the wet process equipment of this application. Figure 6 is a schematic cross-sectional view of the recovery ring of the wet process equipment of this application. Figure 7 is a schematic enlarged partial view of section A of the wet process equipment of Figure 4. Figure 8A is a schematic enlarged partial view of the exhaust pipe and cover of the wet process equipment of this application. Figure 8B is a schematic three-dimensional view of the cover of Figure 8A with the cover opened. Figure 9 is a top-down diagram of the wet process equipment in this application.
1:濕製程設備 1: Wet process equipment
10:旋轉台 10: Rotating table
20:回收單元 20: Recycling Unit
21:回收環 21: Recycling Ring
211:回收環 211: Recycling Ring
212:回收環 212: Recycling Ring
213:回收環 213: Recycling Ring
214:回收環 214: Recycling Ring
30:液體回收裝置 30: Liquid recovery device
32:排液管 32:Drain pipe
40:氣體回收裝置 40: Gas recovery device
42:排氣管 42: Exhaust pipe
45:套管 45: Casing
50:基座 50: Base
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113132691A TWI900201B (en) | 2024-08-29 | 2024-08-29 | Wet process apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113132691A TWI900201B (en) | 2024-08-29 | 2024-08-29 | Wet process apparatus |
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| Publication Number | Publication Date |
|---|---|
| TWI900201B true TWI900201B (en) | 2025-10-01 |
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| TW113132691A TWI900201B (en) | 2024-08-29 | 2024-08-29 | Wet process apparatus |
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| TW (1) | TWI900201B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM582233U (en) * | 2019-05-06 | 2019-08-11 | 弘塑科技股份有限公司 | Single wafer wet processing apparatus |
| TWM596133U (en) * | 2020-01-03 | 2020-06-01 | 弘塑科技股份有限公司 | Substrate wet processing apparatus and recycle ring |
| TWI756030B (en) * | 2014-11-25 | 2022-02-21 | 美商應用材料股份有限公司 | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
| TWM663455U (en) * | 2024-08-29 | 2024-11-21 | 增縉精機股份有限公司 | Wet process apparatus |
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2024
- 2024-08-29 TW TW113132691A patent/TWI900201B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756030B (en) * | 2014-11-25 | 2022-02-21 | 美商應用材料股份有限公司 | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
| TWM582233U (en) * | 2019-05-06 | 2019-08-11 | 弘塑科技股份有限公司 | Single wafer wet processing apparatus |
| TWM596133U (en) * | 2020-01-03 | 2020-06-01 | 弘塑科技股份有限公司 | Substrate wet processing apparatus and recycle ring |
| TWM663455U (en) * | 2024-08-29 | 2024-11-21 | 增縉精機股份有限公司 | Wet process apparatus |
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