TWM657863U - Substrate processing apparatus with recycling device - Google Patents

Abstract

A substrate processing apparatus with a recycling device is disclosed. The apparatus includes a spin chuck, a liquid supply device, and the recycling device. The spin chuck is designed for the placement of a substrate. The liquid supply device is positioned above the spin chuck to apply a plurality of process liquids to the substrate. The plurality of process liquids include a first process liquid and a second process liquid. The recycling device is configured to reclaim the first process liquid and the second process liquid and includes a first recycling ring and a second recycling ring. The first recycling ring is disposed around the spin chuck and is vertically movable relative to the spin chuck. The second recycling ring is disposed around the spin chuck, positioned below the first recycling ring, and is vertically movable relative to the spin chuck.

Description

Substrate processing equipment with recovery device

The present application relates to a substrate processing device with a recovery device, and in particular to a substrate processing device that can sequentially recover process liquids used to clean a substrate.

In the semiconductor manufacturing process, wafer cleaning is an important process. In particular, if the contamination caused by processes such as wafer cutting or etching is not completely cleaned, the residual contaminants will seriously affect the progress of subsequent processes, ultimately resulting in a decrease in chip yield.

In addition, if the cleaning liquid splashes during cleaning, it will cause contamination of the chamber. For example, when a wafer needs to be cleaned, a cleaning liquid, such as deionized water, will be used. If these cleaning liquids splash onto the devices on the cleaning equipment, such as the recovery ring, other chemicals, such as cleaning liquid, etching liquid, etc., will be contaminated, affecting the cleaning or etching process.

However, with the development of semiconductor manufacturing process, the structure of chip becomes more complex, and the line width and line spacing become smaller and smaller, the surface structure becomes more three-dimensional, and the aspect ratio is greatly improved. In this case, as shown in FIG1, since the groove 72 between the grains 71 becomes deeper, when the liquid is sprayed on the substrate through the nozzle 70, the substrate surface will no longer be flat due to the aspect ratio, which will cause the liquid to easily splash. Furthermore, the opening size of the recovery rings 81 and 82 of the known conductor process is fixed, and they move synchronously in the vertical direction, so the opening cannot be closed, causing adjacent recovery rings to easily cross-contaminate each other when recovering liquid, so it is not suitable for semiconductor processes with large height differences of components on the wafer surface. Therefore, a substrate processing device with a recycling device is needed to solve the above problems.

In order to solve the above problems of the prior art, the present application provides a substrate processing device with a recovery device, which includes a turntable, a liquid supply device and a recovery device. The turntable is used to place a substrate; the liquid supply device is arranged above the turntable, and applies a plurality of process liquids to the substrate, and the plurality of process liquids include a first process liquid and a second process liquid; the recovery device is used to recover the first process liquid and the second process liquid, and includes a first recovery ring and a second recovery ring; the first recovery ring is arranged around the turntable and moves in a vertical direction relative to the turntable; the second recovery ring is arranged around the turntable, configured below the first recovery ring, and moves in a vertical direction relative to the turntable. The first recycling ring and the second recycling ring move in the vertical direction in sequence and form a first opening and a second opening in sequence. The first opening is formed between the first recycling ring and the second recycling ring, and the second opening is formed between the second recycling ring and the rotating table.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, the first recovery ring has a first ring wall and a stop wall, one end of the first ring wall is adjacent to the turntable, and the other end is connected to the stop wall.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, the first annular wall is inclined relative to the turntable.

In a preferred embodiment of the substrate processing apparatus with a recovery device of the present application, the first thickness of the first ring wall gradually increases in a direction away from the turntable.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, the second recovery ring has a second ring wall, a third ring wall and a fourth ring wall, the third ring wall is located between the second ring wall and the fourth ring wall, and the second ring wall is closer to the turntable than the third ring wall and the fourth ring wall.

In a preferred embodiment of the substrate processing apparatus with a recovery device of the present application, the second thickness of the second ring wall gradually increases in a direction away from the turntable.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, when the first opening is formed, the second annular wall is tightly matched with the side of the turntable, and the second opening is closed.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, the first annular wall and the second annular wall are in close contact and the first opening is closed.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, the third annular wall and the fourth annular wall are inclined in different directions and form a first groove with an opening toward the stop wall.

In a preferred embodiment of the substrate processing equipment with a recovery device of the present application, when the first recovery ring moves to the highest position in the vertical direction and the second recovery ring is at the lowest position, the first process liquid flows from the first opening into between the first recovery ring and the second recovery ring.

Preferably, the substrate processing equipment with a recovery device of the present application further includes a first recovery pipeline and a first recovery device, and the first process liquid flows from between the first recovery ring and the second recovery ring to the first recovery pipeline and is recovered by the first recovery device.

Preferably, the substrate processing equipment with a recovery device of the present application further includes a fixed ring wall, which is arranged below the recovery device and forms a second groove with an opening facing the recovery device.

Preferably, when the first recovery ring and the second recovery ring move to the highest position in the vertical direction, the second process liquid flows from the second opening to the second groove.

Preferably, the substrate processing equipment with a recovery device of the present application further includes a second recovery pipeline and a second recovery device, and the second process liquid flows from the second groove to the second recovery pipeline and is recovered by the second recovery device.

Preferably, the substrate processing equipment with a recovery device of the present application further includes a drive motor, which drives the turntable to rotate and is disposed under the turntable.

Preferably, the substrate processing equipment with a recovery device of the present application further includes a lifting drive device, which drives the first recovery ring and the second recovery ring to move up and down in the vertical direction.

In this application, in addition to being able to rise and fall in the vertical direction to recycle process chemicals, when washing wafers with deionized water (DI Water), the recovery ring at the bottom can move upward to seal the chemical recovery port between the two with the recovery ring at the top, thereby preventing the deionized water from spraying from the rotating wafer surface to other adjacent chemical recovery ports. Therefore, in this application, the chemical collected by the chemical recovery ring is not easily contaminated, and can then flow to the corresponding recovery pipeline to facilitate subsequent recovery or discharge, and the deionized water can be directly collected through the corresponding waste water recovery pipe. The two are recovered in different pipelines, thereby avoiding the problem of cross contamination between the recovered chemical and the waste water.

In order to facilitate understanding of the technical features, content and advantages of this application and the effects that can be achieved, this application is hereby accompanied by the attached drawings and described in detail with embodiments as follows. The drawings used are only for illustration and auxiliary explanation purposes, and may not be the true proportions and precise configurations of this application. Therefore, the proportions and configurations of the drawings should not be used to interpret or limit the scope of rights of this application in actual implementation. The following will refer to the relevant drawings to describe the embodiments of this application. For ease of understanding, the same components in the following embodiments are marked with the same symbols.

Refer to FIG. 2 , which is a first top view of a substrate processing device according to an embodiment of the present application. In the present application, the substrate 2 may be a wafer product. Due to the complexity of current semiconductor manufacturing processes, and due to wafer cutting and structure stacking, the substrate 2 forms an uneven surface. As shown in the embodiment of FIG. 2 , the substrate 2 includes a three-dimensional chip (3D Integrated Circuit, 3D-IC) stacking structure. Generally, 3D-IC wafer stacking can be divided into three technologies: (1) chip to chip (C2C) stacking, (2) chip to wafer (C2W) stacking, and (3) wafer to wafer (W2W) stacking. Wafer stacking will cause the surface of the wafer to have an uneven surface with a high aspect ratio (High Aspect Ratio).

When a cleaning process is performed on a substrate 2 with an uneven surface, the process liquid (e.g., deionized water (DI Water), cleaning solution, etc.) is prone to splashing, and cleaning solutions, such as etching solutions, have a relatively high cost. If the recovery device is not well-equipped, different process liquids may be cross-contaminated. For example, the splashing of deionized water may contaminate the recovery unit used to recover the cleaning solution, which will reduce the recovery efficiency of the cleaning solution.

As shown in FIG. 2 , the present application provides a substrate processing device 1 with a recovery device 30, the substrate processing device 1 comprises a rotating table 10, a liquid supply device 20 and a recovery device 30. The rotating table 10 is used to place a substrate 2, the liquid supply device 20 is disposed on the rotating table 10, and a plurality of process liquids are applied to the substrate 2, and the plurality of process liquids include a first process liquid and a second process liquid. In one embodiment, the first process liquid can be an etching or cleaning liquid, and the second process liquid can be deionized water.

In addition, although only one liquid supply device 20 is shown in FIG. 2 , the number of liquid supply devices 20 is not limited to only one and can be adjusted according to demand.

To further explain, the recovery device 30 can recover liquid (such as the process liquid mentioned above), and may also include components for collecting waste gas (such as waste gas or water vapor generated when cleaning the substrate 2). In the drawings of this application, only components for recovering liquid are shown.

As shown in FIG3 , the substrate processing apparatus 1 of the present application further includes a driving motor 60, which can be connected to the rotating table 10 via a rotating shaft to drive the rotating table 10 to rotate. Therefore, when the substrate 2 is cleaned, the process liquid will move toward the periphery of the substrate due to the centrifugal force, and the recovery device 30 can recover the first process liquid and the second process liquid, and includes a first recovery ring 301 and a second recovery ring 302. In other embodiments, more recovery rings may be included.

In one embodiment, the substrate processing apparatus 1 of the present application further comprises a lifting drive device 50, which may comprise a single or multiple drive units, such as servo motors, to drive the first recycling ring 301 and the second recycling ring 302 to move in the vertical direction respectively. In other words, in the present application, the first recycling ring 301 and the second recycling ring 302 move independently, rather than synchronously, and thus can move in the vertical direction sequentially.

To further explain, as shown in FIG3 , the first recycling ring 301 and the second recycling ring 302 are disposed around the turntable 10, and the second recycling ring 302 is disposed below the first recycling ring 301 and moves in a vertical direction relative to the turntable 10. Before the etching or cleaning process begins, the first recycling ring 301 and the second recycling ring 302 are both located at the lowest initial position, and the first ring wall 3011 and the second ring wall 3021 are tightly fitted, waiting for the robot arm (not shown) to grab the substrate 2 and place it on the turntable 10.

The detailed structure of the above components is further described below. As shown in FIG. 4A and FIG. 4B , the first recycling ring 301 has a first ring wall 3011 and a stop wall 3012, one end of the first ring wall 3011 is adjacent to the rotating table 10, and the other end is connected to the stop wall 3012; the second recycling ring 302 has a second ring wall 3021, a third ring wall 3022 and a fourth ring wall 3023, the third ring wall 3022 is located between the second ring wall 3021 and the fourth ring wall 3023, and the second ring wall 3021 is closer to the rotating table 10 than the third ring wall 3022 and the fourth ring wall 3023.

The third annular wall 3022 and the fourth annular wall 3023 are inclined in different directions and form a first groove 3024 opening toward the stop wall 3012 .

The first ring wall 3011 is inclined relative to the rotating table 10 , so when the first recovery ring 301 rises, the first ring wall 3011 inclined toward the rotating table 10 can effectively block the splashing liquid and make it flow into the first opening 303 .

In addition, the substrate processing apparatus 1 of the present application further includes a fixed ring wall 306 , which is disposed below the recovery device 30 and forms a second groove 3061 opening toward the recovery device 30 .

The first thickness of the first annular wall 3011 gradually increases in the direction away from the rotating table 10, and the second thickness of the second annular wall 3021 gradually increases in the direction away from the rotating table 10. In other words, the first annular wall 3011 and the second annular wall 3021 have the thinnest thickness at the position closest to the rotating table 10. As shown in FIG. 5, when the first annular wall 3011 and the second annular wall 3021 are in close contact (when the first opening 303 is closed), mechanical interference can be avoided and it is also beneficial for the fluid to flow into the second opening 304.

As shown in FIG. 4A and FIG. 5 , the first recycling ring 301 and the second recycling ring 302 rise in sequence and form the first opening 303 and the second opening 304 in sequence, and when the first opening 303 is formed, the second ring wall 3021 is tightly matched with the side of the rotating table 10, and the second opening 304 is closed. When the second opening 304 is formed, the first ring wall 3011 and the second ring wall 3021 are in close contact, and the first opening 303 is closed. In one embodiment, the first opening 303 is formed between the first recycling ring 301 and the second recycling ring 302, and the second opening 304 is formed between the second recycling ring 302 and the rotating table 10.

It is worth mentioning that in one embodiment, different process liquids (such as cleaning solution and etching solution) are recovered through different openings. Therefore, since the openings are closed in sequence, cross contamination between different process liquids can be avoided.

In detail, since the third annular wall 3022 and the fourth annular wall 3023 are inclined in different directions, it is beneficial for the process liquid (such as etching liquid or cleaning liquid) to flow to the bottom of the first groove 3024, so that the process liquid can flow smoothly to the recovery pipeline. Furthermore, the setting of the stop wall 3012 can further prevent the recovered liquid or other process liquid (such as deionized water) from unexpectedly entering and exiting the first opening 303 after the first opening 303 is closed.

For example, in some cases, although the first opening 303 is closed, there may be a tiny gap. At this time, the backwash deionized water may flow in through the gap, causing the recovered process liquid (such as etching solution or cleaning solution) to be contaminated; or, the recovered process liquid (such as etching solution or cleaning solution) may drip from the first opening 303 under certain circumstances, such as machine shaking, residual liquid not completely removed, etc., which will cause contamination to the substrate 2 that is undergoing subsequent processes. Therefore, the stop wall 3012 can avoid the above situation.

In addition, since the stop wall 3012 extends toward the bottom of the first groove 3024, when the fluid flows into the first opening 303, the fluid can be guided toward the first groove 3024, thereby increasing the recovery efficiency.

To further explain, after the process liquid flows in from the first opening 303 or the second opening 304, it will enter the corresponding recovery device through other pipelines for recovery. The recovery pipeline and recovery device of this application will be further explained below.

As shown in FIG. 6 , in one embodiment, the substrate processing apparatus 1 of the present application further includes a first recovery pipeline 401 , a first recovery device 402 , and a second recovery pipeline 403 .

One end of the first recovery line 401 is connected to the bottom of the first groove 3024, so that the first process liquid (such as etching liquid or cleaning solution) can flow smoothly into the first recovery line 401. The other end of the first recovery line 401 is connected to the first recovery device 402 to receive the first process liquid flowing into the first recovery line 401.

To further explain, in one embodiment, the first recovery device 402 includes components such as a pump, a flow meter, and a filter unit to recycle the first process liquid for reuse, thereby achieving a cost saving effect.

As shown in FIG7 , one end of the second recovery line 403 is connected to the bottom of the second groove 3061, so that the second process liquid (e.g., deionized water after cleaning the substrate 2) can flow smoothly into the second recovery line 403. The other end of the second recovery line 403 is connected to the second recovery device 404 to receive the second process liquid flowing into the second recovery line 403.

To further explain, in one embodiment, the second recovery device 404 includes a waste water recovery tank, a waste water treatment unit and other components to treat pollutants contained in the second process liquid to avoid polluting the environment.

In addition, it is worth mentioning that the first recovery pipeline 401 and the second recovery pipeline 403 can be arranged alternately and respectively connected to different first grooves 3024 and second grooves 3061. In other words, the two are independent pipelines, and thus different process liquids can be recovered independently.

The following will further describe the recycling process of the process liquid of the present application. Please refer to FIG3 , when the process liquid has not yet been recycled, the first recycling ring 301 and the second recycling ring 302 can both be located at the lowest position, and when the first recycling ring 301 and the second recycling ring 302 are both located at the lowest position, the first ring wall 3011 and the second ring wall 3021 are in close contact, and the first opening 303 is closed by the first ring wall 3011 and the second ring wall 3021.

As shown in FIG. 4 , when the first process liquid (such as etching solution or other cleaning solution) needs to be recovered, the first recovery ring 301 can be raised first. When the first recovery ring 301 moves to the highest position in the vertical direction and the second recovery ring 302 is at the lowest position, a first opening 303 is formed between the first recovery ring 301 and the second recovery ring 302. At this time, the first process liquid will enter the first opening 303 from the substrate 2 due to the centrifugal force.

Then, as shown in Figures 4A and 6, the first process liquid flows from the first opening 303 into the space between the first recovery ring 301 and the second recovery ring 302, and is guided by the above-mentioned stop wall 3012 to flow toward the first groove 3024, so that the first process liquid flows from the space between the first recovery ring 301 and the second recovery ring 302 to the first recovery pipeline 401, and is recovered by the first recovery device 402.

As shown in FIG5 , when the second process liquid (e.g., deionized water after cleaning the substrate 2) needs to be recovered, the second recovery ring 302 can be raised again. When the second recovery ring 302 moves to the highest position in the vertical direction (at this time, the first recovery ring 301 and the second recovery ring 302 are both at the highest position), the first ring wall 3011 and the second ring wall 3021 are in close contact, and the second opening 304 is formed between the second recovery ring 302 and the turntable 10. At this time, the second process liquid will enter the second opening 304 from the substrate 2 due to the centrifugal force.

Then, as shown in FIG. 7 , the second process liquid flows from the second opening 304 into between the second recovery ring 302 and the rotary table 10 and flows toward the second groove 3061 , so that the second process liquid flows to the second recovery pipeline 403 and is recovered by the second recovery device 404 .

In summary, in this application, in addition to being able to rise and fall in the vertical direction to recover process chemicals, when washing wafers with deionized water, the recovery ring at the bottom can move upward to seal the chemical recovery port between the recovery ring at the top, thereby preventing the deionized water from being sprayed from the rotating wafer surface to the adjacent chemical recovery port. Therefore, in this application, the chemical collected by the chemical recovery ring is not easily contaminated, and can then flow to the corresponding recovery pipeline to facilitate subsequent recovery or discharge, and the deionized water can be directly collected through the corresponding waste water recovery pipe, and the two are recovered in different pipelines, thereby avoiding the problem of cross-contamination between the recovered chemical and the waste water.

The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made to the present application without departing from the spirit and scope of the present application shall be included in the scope of the patent application attached hereto.

1: substrate processing equipment 10: rotary table 20: liquid supply device 30: recovery device 301: first recovery ring 3011: first ring wall 3012: stop wall 302: second recovery ring 3021: second ring wall 3022: third ring wall 3023: fourth ring wall 3024: first groove 303: first opening 304: second opening 306: fixed ring wall 3061: second groove 401: first recovery pipeline 402: first recovery device 403: second recovery pipeline 404: second recovery device 50: lifting drive device 60: drive motor 70: nozzle 71: grain 72: Groove 81,82: Recovery ring 2: Substrate

FIG. 1 is a schematic diagram of a substrate processing apparatus according to prior art.

FIG. 2 is a first top view of a substrate processing apparatus according to an embodiment of the present application.

FIG3 is a first cross-sectional view of a substrate processing apparatus according to an embodiment of the present application.

FIG. 4A is a second cross-sectional view of a substrate processing apparatus according to an embodiment of the present application.

FIG. 4B is an enlarged cross-sectional view of a recovery device of a substrate processing apparatus according to an embodiment of the present application.

FIG5 is a third cross-sectional view of the substrate processing apparatus according to the embodiment of the present application.

FIG6 is a fourth cross-sectional view of the substrate processing apparatus according to an embodiment of the present application.

FIG. 7 is a fifth cross-sectional view of the substrate processing apparatus according to an embodiment of the present application.

1: Substrate processing equipment

10: Rotating table

20: Liquid supply device

30: Recovery device

301: First recycling ring

3011: First Ring Wall

3012: Stop wall

302: Second recycling ring

3021: Second ring wall

3022: The third ring wall

3023: The fourth ring wall

3024: First groove

303: First opening

306: Fixed ring wall

3061: Second groove

60: Driving motor

2: Substrate

Claims (16)

A substrate processing device with a recovery device comprises: a rotating table for placing a substrate; a liquid supply device arranged above the rotating table for applying a plurality of process liquids to the substrate, wherein the plurality of process liquids comprises a first process liquid and a second process liquid; and a recovery device for recovering the first process liquid and the second process liquid, comprising: a first recovery ring arranged around the rotating table and relative to the rotating table. a vertical direction; and a second recycling ring, which is arranged around the rotating table, disposed below the first recycling ring, and moves in the vertical direction relative to the rotating table; wherein the first recycling ring and the second recycling ring move in the vertical direction in sequence, and form a first opening and a second opening in sequence; the first opening is formed between the first recycling ring and the second recycling ring, and the second opening is formed between the second recycling ring and the rotating table. The substrate processing equipment with a recovery device as described in claim 1, wherein the first recovery ring has a first ring wall and a stop wall, one end of the first ring wall is adjacent to the turntable, and the other end is connected to the stop wall. The substrate processing equipment with a recovery device as described in claim 2, wherein the first annular wall is inclined relative to the turntable. A substrate processing apparatus equipped with a recovery device as described in claim 2, wherein a first thickness of the first ring wall gradually increases in a direction away from the turntable. The substrate processing equipment with a recovery device as described in claim 2, wherein the second recovery ring has a second ring wall, a third ring wall and a fourth ring wall, the third ring wall is located between the second ring wall and the fourth ring wall, and the second ring wall is closer to the turntable than the third ring wall and the fourth ring wall. A substrate processing apparatus equipped with a recovery device as described in claim 5, wherein a second thickness of the second ring wall gradually increases in a direction away from the turntable. The substrate processing equipment with a recovery device as described in claim 5, wherein when the first opening is formed, the second annular wall is tightly matched with the side of the turntable, and the second opening is closed. The substrate processing equipment with a recovery device as described in claim 5, wherein when the second opening is formed, the first annular wall and the second annular wall are in close contact and the first opening is closed. The substrate processing equipment with a recovery device as described in claim 5, wherein the third annular wall and the fourth annular wall are inclined in different directions and form a first groove opening toward the stop wall. The substrate processing equipment with a recovery device as described in claim 1, wherein when the first recovery ring moves to the highest position in the vertical direction and the second recovery ring is at the lowest position, the first process liquid flows from the first opening into the space between the first recovery ring and the second recovery ring. The substrate processing equipment with a recovery device as described in claim 9 further includes a first recovery pipeline and a first recovery device, and the first process liquid flows from between the first recovery ring and the second recovery ring to the first recovery pipeline and is recovered by the first recovery device. The substrate processing equipment with a recovery device as described in claim 1 further includes a fixed ring wall, which is arranged below the turntable and forms a second groove opening toward the recovery device. The substrate processing equipment with a recovery device as described in claim 12, wherein when the first recovery ring and the second recovery ring move to the highest position in the vertical direction, the second process liquid flows from the second opening to the second groove. The substrate processing equipment with a recovery device as described in claim 12 further includes a second recovery pipeline and a second recovery device, and the second process liquid flows from the second groove to the second recovery pipeline and is recovered by the second recovery device. The substrate processing equipment with a recovery device as described in claim 11 further includes a drive motor, which drives the turntable to rotate and is arranged under the turntable. The substrate processing equipment with a recovery device as described in claim 1 further includes a lifting drive device, which drives the first recovery ring and the second recovery ring to move in the vertical direction.