TWI900265B - Display panel - Google Patents

Abstract

A display panel includes a substrate, at least one microchip, a reflective cover and a plurality of light-emitting elements. The substrate has a first surface and a second surface. The at least one microchip is electrically connected with the substrate and is located on the first surface. The reflective cover covers the at least one microchip and includes a plurality of openings. The plurality of light-emitting elements are electrically connected with the substrate and are located on the first surface. The plurality of light-emitting elements are located in the plurality of openings. An exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to eliminate a bubble between the reflective cover and the at least one microchip.

Description

Display Panel

The present invention relates to a display panel, and in particular to a display panel with an exhaust structure.

Currently, direct-lit light panels are mostly based on glass fiber epoxy copper foil (FR4) or BT (Bismaleimide Triazine) resin substrates. The white ink on these two substrates has a reflectivity of approximately 70% to 75%. Increasing the reflectivity of light panels is one way to improve their operating efficiency. For example, attaching a reflective sheet to a direct-lit light panel can increase reflectivity by 8% to 14%.

However, when attaching the reflector to the light panel, air bubbles can easily become trapped between the reflector and the microchip, causing uneven attachment. While creating a riding seam where the reflector wraps around the microchip can address this problem, the riding seam is visible to the user when viewing the light panel, detracting from the overall aesthetic. Therefore, finding a way to simultaneously improve the reflectivity of the light panel while minimizing the overall aesthetic has been a major research goal for researchers in this field.

The present invention provides a display panel which can eliminate air bubbles between a reflective cover and a microchip.

The display panel of the present invention includes a substrate, at least one microchip, a reflective cover, and a plurality of light-emitting elements. The substrate has a first surface and a second surface. The at least one microchip is electrically connected to the substrate and located on the first surface. The reflective cover covers the at least one microchip. The reflective cover includes a plurality of openings. The plurality of light-emitting elements are electrically connected to the substrate and located on the first surface. The plurality of light-emitting elements are located in the plurality of openings. An exhaust structure is disposed within the substrate and penetrates from the first surface to the second surface to remove air bubbles between the reflective cover and the at least one microchip.

In one embodiment of the present invention, the exhaust structure is aligned with at least one side surface of at least one microchip.

In one embodiment of the present invention, the area of the exhaust structure is between 40% and 80% of the area of at least one microchip projected onto the substrate.

In one embodiment of the present invention, the display panel further includes a cover layer, and the plurality of light-emitting elements and at least one microchip reflective cover are located between the cover layer and the substrate.

In one embodiment of the present invention, the exhaust structure is a plurality of through holes, and the plurality of through holes are respectively disposed on two opposite sides of each of at least one microchip.

In one embodiment of the present invention, the exhaust structure is a plurality of through holes, and the plurality of through holes are respectively disposed on four sides of at least one microchip.

Based on the above, the display panel of the present invention includes a substrate, at least one microchip, a reflective cover, and multiple light-emitting elements. The at least one microchip and the multiple light-emitting elements are located on the first surface of the substrate. The reflective cover covers the at least one microchip, and the multiple light-emitting elements are located in multiple openings of the reflective cover. An exhaust structure is disposed within the substrate and penetrates from the first surface to the second surface to remove air bubbles between the reflective cover and the at least one microchip. Through this arrangement, the display panel of the present invention improves reflectivity while solving the problem of uneven reflective cover attachment and enhancing the overall aesthetics.

The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. As will be appreciated by those skilled in the art, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention.

In the accompanying drawings, for the sake of clarity, the thickness of layers, films, panels, regions, etc. is exaggerated. Throughout the specification, the same figure numbers represent the same elements. It should be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or an intermediate element can also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connection" can refer to physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" can refer to the presence of other elements between two elements.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and/or portions, these elements, components, regions, and/or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, a "first element," "component," "region," "layer," or "portion" discussed below could be termed a second element, component, region, layer, or portion without departing from the teachings herein.

Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of a device in addition to the orientation shown in the figures. For example, if a device in one of the figures is flipped over, an element described as being on the "lower" side of other elements would be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can encompass both "lower" and "upper" orientations, depending on the particular orientation of the figures. Similarly, if a device in one of the figures is flipped over, an element described as being "below" or "beneath" other elements would be oriented as being "above" the other elements. Thus, the exemplary term "below" or "beneath" can encompass both "upper" and "lower" orientations.

Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that those terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this invention, and will not be interpreted as idealized or overly formal meanings unless expressly defined as such herein.

Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic representations of idealized embodiments. Thus, variations from the shapes illustrated as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the specific shapes of regions as illustrated herein, but rather include deviations in shape that result, for example, from manufacturing. For example, a region illustrated or described as flat may typically have rough and/or nonlinear features. Furthermore, sharp corners that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the region and are not intended to limit the scope of the claims.

Figure 1 is a schematic cross-sectional view of a display panel according to the first embodiment of the present invention. It should be noted that Figure 1 schematically illustrates one microchip 120 and two light-emitting elements 140, but the number of microchips 120 and light-emitting elements 140 is not limited to this.

Referring to FIG. 1 , the display panel 100 of this embodiment is, for example, a direct-lit light panel and includes a substrate 110, at least one microchip 120, a reflective cover 130, a plurality of light-emitting elements 140, and a cover layer 160. The substrate 110 has a first surface 111 and a second surface 112. The at least one microchip 120 and the plurality of light-emitting elements 140 are electrically connected to the substrate 110 and located on the first surface 111. The reflective cover 130 covers the at least one microchip 120. The reflective cover 130 includes a plurality of openings 131, and the plurality of light-emitting elements 140 are located within the plurality of openings 131. The plurality of light-emitting elements 140, the at least one microchip 120, and the reflective cover 130 are located between the cover layer 160 and the substrate 110. In other words, the reflective cover 130 covers the microchip 120 but does not cover the light emitting element 140. By disposing the reflective cover 130 on the substrate 110, the reflectivity of the display panel 100 of this embodiment is improved.

In this embodiment, the display panel 100 further includes an exhaust structure 150. The exhaust structure 150 is disposed within the substrate 110 and extends from the first surface 111 to the second surface 112 to remove air bubbles B between the reflective cover 130 and the at least one microchip 120. The exhaust structure 150 may be, for example, a plurality of through holes. Specifically, when the reflective cover 130 is applied to the substrate 110, air bubbles B are easily retained in the gap S between the reflective cover 130 and the microchip 120. By providing multiple through holes in the substrate 110, air bubbles B can be exhausted from the gap S along the multiple through holes to the outside, thereby resolving the problem of uneven attachment of the reflective cover 130.

Furthermore, the exhaust structure 150 is disposed in the substrate 110 and is shielded by the reflective cover 130 when viewed from the first surface 111 toward the second surface 112. This arrangement prevents users from seeing the exhaust structure 150 when viewing the display panel 100, thereby enhancing the overall aesthetics.

In this embodiment, the exhaust structure 150 is aligned with at least one side surface 121 of at least one microchip 120. Specifically, as shown in FIG1 , the projection of the microchip 120 onto the substrate 110 is offset from and adjacent to the exhaust structure 150. This arrangement prevents the exhaust structure 150 from being covered by the reflective cover 130 and the microchip 120, allowing air bubbles B to be smoothly discharged from the gap S along the exhaust structure 150 to the outside.

Figure 2A is a top view of the display panel of Figure 1A. It should be noted that the arrangement of the exhaust structures 150, 150a, 150b, and 150c is not visible, and the reflective cover 130 is omitted in the top views of Figures 2A to 2D.

Referring to FIG. 2A , multiple through-holes (i.e., exhaust structures 150) are disposed on opposite sides of at least one microchip 120. Furthermore, the exhaust structure 150 has an area A2 between 40% and 80% of the area A1 of at least one microchip 120 (two microchips 120 are shown) projected onto the substrate 110. This arrangement ensures that air bubbles B are smoothly exhausted through the gap S between the reflective cover 130 and the microchip 120 along the exhaust structure 150, while also preventing the exhaust structure 150 from occupying an excessive amount of substrate 110 volume, thereby excessively reducing the available space on the substrate 110.

FIG2B is a top view of a display panel according to the second embodiment of the present invention. Referring to FIG2B , the difference between the display panel 100a of this embodiment and the display panel 100 of FIG2A is that the exhaust structures 150 and 150a are arranged in different positions. Specifically, the exhaust structure 150 of FIG2A is located between the microchip 120 and the light-emitting element 140. In other words, the microchip 120, the exhaust structure 150 and the light-emitting element 140 are arranged in a row. The exhaust structure 150a of FIG2B is not located in the arrangement direction of the microchip 120 and the light-emitting element 140. The arrangement direction of the exhaust structure 150a and the microchip 120 and the arrangement direction of the microchip 120 and the light-emitting element 140 are, for example, arranged vertically, but the present invention is not limited thereto.

FIG2C is a top view of a display panel according to the third embodiment of the present invention. Referring to FIG2C , the difference between the display panel 100b of this embodiment and the display panel 100 of FIG2A is that the through holes of the exhaust structure 150b of this embodiment are respectively arranged on the four sides of at least one microchip 120. In detail, the exhaust structure 150b of this embodiment is arranged in a manner that combines the exhaust structure 150 of FIG2A and the exhaust structure 150a of FIG2B . Part of the exhaust structure 150b is aligned with the microchip 120 and the light-emitting element 140, while another part of the exhaust structure 150b is arranged perpendicularly to the arrangement direction of the microchip 120 and the arrangement direction of the microchip 120 and the light-emitting element 140, so that the exhaust structure 150b has an appearance of, for example, a diamond shape. The arrangement of the exhaust structures 150, 150a, 150b (e.g., the through holes of the exhaust structures 150, 150a, 150b are arranged on two or four sides of the microchip 120) corresponds to different attachment methods of the reflective cover 130, different substrate 110 materials and thicknesses, etc., thereby improving the success rate of attaching the reflective cover 130 to the substrate 110. However, the present invention is not limited to its arrangement.

FIG2D is a top view of a display panel according to a fourth embodiment of the present invention. Referring to FIG2D , the difference between display panel 100c of this embodiment and display panel 100b of FIG2C is that exhaust structure 150b of FIG2C has an elongated strip shape, while exhaust structure 150c of FIG2D has a circular shape. However, the present invention is not limited to these shapes.

In summary, the display panel of the present invention comprises a substrate, at least one microchip, a reflective cover, and multiple light-emitting elements. The at least one microchip and the multiple light-emitting elements are located on the first surface of the substrate. The reflective cover covers the at least one microchip, and the multiple light-emitting elements are located within multiple openings in the reflective cover. An exhaust structure is disposed within the substrate, extending from the first surface to the second surface, to remove air bubbles between the reflective cover and the at least one microchip. Through this arrangement, the display panel of the present invention improves reflectivity while eliminating the problem of uneven reflective cover attachment and enhancing the overall aesthetics.

Furthermore, the exhaust structure is aligned with at least one side of at least one microchip, allowing air bubbles to be smoothly discharged through the gap between the reflective cover and the microchip, along the exhaust structure, to the outside. The exhaust structure's area is between 40% and 80% of the projected area of the at least one microchip onto the substrate, ensuring smooth air bubble discharge through the gap and along the exhaust structure while preventing excessive reduction in the substrate's available space.

100, 100a, 100b, 100c: Display panel 110: Substrate 111: First surface 112: Second surface 120: Microchip 121: Side surface 130: Reflective cover 131: Opening 140: Light-emitting element 150, 150a, 150b, 150c: Exhaust structure 160: Covering layer A1, A2: Area B: Bubble S: Space

Figure 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present invention. Figure 2A is a top view of the display panel of Figure 1A. Figure 2B is a top view of a display panel according to a second embodiment of the present invention. Figure 2C is a top view of a display panel according to a third embodiment of the present invention. Figure 2D is a top view of a display panel according to a fourth embodiment of the present invention.

100: Display Panel

110:Substrate

111: First Surface

112: Second Surface

120: Microchip

121:Side

130: Reflective cover

131: Opening

140: Light-emitting element

150: Exhaust structure

160: Covering layer

B: Bubbles

S: Gap

Claims (6)

A display panel comprises: a substrate having a first surface and a second surface; at least one microchip electrically connected to the substrate and located on the first surface; a reflective cover covering the at least one microchip, the reflective cover including a plurality of openings; and a plurality of light-emitting elements electrically connected to the substrate and located on the first surface, the light-emitting elements being located in the openings. An exhaust structure is disposed within the substrate and extends from the first surface to the second surface to remove air bubbles between the reflective cover and the at least one microchip. A display panel as described in claim 1, wherein the exhaust structure is aligned with at least one side of the at least one microchip. The display panel as described in claim 1, wherein the area of the exhaust structure is between 40% and 80% of the area of the at least one microchip projected onto the substrate. The display panel as described in claim 1 further includes a covering layer, and the light-emitting elements, the at least one microchip and the reflective cover are located between the covering layer and the substrate. A display panel as described in claim 1, wherein the exhaust structure is a plurality of through holes, and the through holes are respectively arranged on two opposite sides of each of the at least one microchip. The display panel as described in claim 1, wherein the exhaust structure is a plurality of through holes, and the through holes are respectively arranged on four sides of each of the at least one microchip.