TWI839023B - Non-contact testing apparatus with external circulation - Google Patents
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Abstract
Description
本發明涉及一種測試設備,尤其涉及一種外循環式非接觸測試設備。The present invention relates to a testing device, and in particular to an external circulation type non-contact testing device.
現有測試設備在對一待測電子元件進行測試時,需以溫控元件抵頂於所述待測電子元件,使得所述待測電子元件達到測試要求的溫度。然而,現有測試設備的接觸式測試方式已逐漸不符合電子產業日新月異的變化與需求。When testing an electronic component to be tested, the existing test equipment needs to use a temperature control element to press against the electronic component to make the electronic component to be tested reach the temperature required for the test. However, the contact test method of the existing test equipment has gradually failed to meet the ever-changing changes and needs of the electronics industry.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects.
本發明實施例在於提供一種外循環式非接觸測試設備,其能有效地改善現有測試設備所可能產生的缺陷。The present invention provides an external circulation non-contact testing device, which can effectively improve the defects that may be produced by the existing testing equipment.
本發明實施例公開一種外循環式非接觸測試設備,其包括:一機台本體;一測試裝置,其安裝於所述機台本體,並且所述測試裝置包含有:一第一測試腔體與一第二測試腔體,其皆安裝於所述機台本體;其中,所述第二測試腔體能與所述第一測試腔體沿一第一方向彼此相對地移動,以共同封閉形成有一測試空間;及一測試載座,設置於所述第二測試腔體,並且所述測試載座用以供一待測電子元件設置;一溫度調節裝置,其安裝於所述第一測試腔體與所述第二測試腔體的至少其中之一的外側,用以連通於所述測試空間;其中,所述溫度調節裝置包含有:一溫控機構,包含有一氣流腔室及配置於所述氣流腔室內的一溫控單元;一管路單元,連接所述氣流腔室與所述測試空間,以使其彼此連通而共同構成一循環空間;及一風扇機構,安裝於所述管路單元;其中,所述風扇機構能運轉而形成有於所述循環空間內流動且經過所述溫控單元的一循環氣流,並且所述循環氣流能通過所述溫控單元而具有一預設溫度;以及一供氣裝置,連通於所述循環空間;其中,所述供氣裝置用以通入一預定氣體至所述循環空間、並能使所述循環空間達到一預設氣壓,以使設置於所述測試載座的所述待測電子元件能在所述預設氣壓與所述預設溫度的環境下進行一非接觸測試作業。The embodiment of the present invention discloses an external circulation non-contact test equipment, which includes: a machine body; a test device, which is installed on the machine body, and the test device includes: a first test cavity and a second test cavity, both of which are installed on the machine body; wherein the second test cavity can move relative to the first test cavity along a first direction to form a test space together; and a test carrier, which is arranged in the second test cavity, and the test carrier is used for arranging an electronic component to be tested; a temperature adjustment device, which is installed on the outer side of at least one of the first test cavity and the second test cavity, and is connected to the test space; wherein the temperature adjustment device includes: a temperature control mechanism, including a gas A flow chamber and a temperature control unit arranged in the air flow chamber; a pipeline unit connecting the air flow chamber and the test space so that they are connected to each other and jointly constitute a circulation space; and a fan mechanism installed in the pipeline unit; wherein the fan mechanism can operate to form a circulation airflow flowing in the circulation space and passing through the temperature control unit, and the circulation airflow can have a preset temperature through the temperature control unit; and an air supply device connected to the circulation space; wherein the air supply device is used to introduce a predetermined gas into the circulation space and enable the circulation space to reach a preset air pressure, so that the electronic component to be tested arranged on the test carrier can perform a non-contact test operation in the environment of the preset air pressure and the preset temperature.
綜上所述,本發明實施例所公開的外循環式非接觸測試設備,其通過多個裝置(如:所述測試裝置、所述溫度調節裝置、及所述供氣裝置)之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述循環空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。In summary, the external circulation non-contact testing equipment disclosed in the embodiment of the present invention adopts the structural combination between multiple devices (such as: the testing device, the temperature regulating device, and the air supply device) so that at least one of the electronic components to be tested can adjust the test parameters (such as: temperature) in a non-contact manner (such as: the circulation space has the preset air pressure and the preset temperature).
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“外循環式非接觸測試設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is an explanation of the implementation of the "external circulation non-contact test equipment" disclosed in the present invention through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.
[實施例一][Example 1]
請參閱圖1至圖9所示,其為本發明的實施例一。如圖1至圖6所示,本實施例公開一種外循環式非接觸測試設備100,用以對至少一個待測電子元件200進行一非接觸測試作業。也就是說,所述外循環式非接觸測試設備100是通過非接觸方式來對所述待測電子元件200進行測試參數(如:溫度)調整。據此,以接觸方式來調整待測電子元件之溫度的任何測試設備,其皆不同於本實施例所指的所述外循環式非接觸測試設備100。Please refer to Figures 1 to 9, which are the first embodiment of the present invention. As shown in Figures 1 to 6, this embodiment discloses an external circulation type
所述外循環式非接觸測試設備100於本實施例中包含有一機台本體1、安裝於所述機台本體1的一測試裝置2、協助所述測試裝置2運作的一抽氣裝置3、安裝於所述測試裝置2的一溫度調節裝置4、及安裝於所述溫度調節裝置4的一供氣裝置5,但本發明不以此為限。The external circulation
舉例來說,在本發明未繪示的其他實施例中,所述外循環式非接觸測試設備100也可以省略所述抽氣裝置3;或者,所述測試裝置2能搭配所述抽氣裝置3而被獨立地運用(如:販賣)或進一步搭配其他構件使用;又或者,所述溫度調節裝置4可以被獨立地運用(如:販賣)或進一步搭配其他構件使用。For example, in other embodiments not shown in the present invention, the external circulation non-contact
於本實施例中,所述測試裝置2包含有一第一測試腔體21、對應於所述第一測試腔體21的一第二測試腔體22、設置於所述第二測試腔體22的一測試載座23、安裝於所述第一測試腔體21內部的兩個均流件24、位於所述第一測試腔體21與所述第二測試腔體22之間的一氣密墊圈25、及一密合機構26,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述外循環式非接觸測試設備100可依據設計需求而選擇性地採用兩個所述均流件24、所述氣密墊圈25、及所述密合機構26至少其中之一、或是以其他構件取代。In this embodiment, the
如圖1至圖4所示,所述第一測試腔體21與所述第二測試腔體22皆安裝於所述機台本體1,以使所述第二測試腔體22能與所述第一測試腔體21沿一第一方向D1(如:鉛錘方向)彼此相對地移動,以共同封閉形成有一測試空間S。需說明的是,所述第一測試腔體21與所述第二測試腔體22的具體結構可依設計需求而加以調整變化,所以下述僅說明其中一種可行的態樣。As shown in FIGS. 1 to 4 , the
所述第一測試腔體21包含有一第一容置部211、相連於所述第一容置部211周緣的一第一密合部212、及形成於所述第一容置部211外表面與所述第一密合部212外表面的多個第一強化肋條213。於本實施例中,所述第一容置部211大致呈矩形槽且於其兩側部位分別形成有連通於所述測試空間S的兩個貫孔2111(如:圖7),而兩個所述均流件24的位置分別對應於兩個所述貫孔2111,所述第一密合部212相連於所述第一容置部211的槽口而呈矩形環狀。The
再者,所述第一容置部211、所述第一密合部212、及多個所述第一強化肋條213共同形成有多個第一開放式隔間214。其中,多個所述第一開放式隔間214之中的四個分別位於所述第一測試腔體21的多個角落,並且所述第一測試腔體21以四個所述第一開放式隔間214安裝固定於所述機台本體1(也就是,所述第一測試腔體21於本實施例中不會相對於所述機台本體1移動),而兩個所述貫孔2111(如:圖7)則是分別連通於多個所述第一開放式隔間214之中的另外兩個。Furthermore, the first
所述第二測試腔體22包含有一第二容置部221、相連於所述第二容置部221周緣的一第二密合部222、及形成於所述第二容置部221外表面與所述第二密合部222外表面的多個第二強化肋條223。於本實施例中,所述第二容置部221大致呈矩形體,而所述測試載座23設置於所述第二容置部221,用以供至少一個所述待測電子元件200設置與進行電性測試;所述第二密合部222則是呈矩形環狀並形成有多個長形貫孔2221,並且所述第二密合部222形成有位於所述測試載座23與多個所述長形貫孔2221之間的一環形溝槽2222,以使所述氣密墊圈25嵌於所述環形溝槽2222內。The
再者,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,而所述氣密墊圈25位於所述第一密合部212與所述第二密合部222之間,並且多個所述第二強化肋條223的位置大致沿所述第一方向D1分別對應於多個所述第一強化肋條213。其中,所述第二容置部221、所述第二密合部222、及多個所述第二強化肋條223共同形成有多個第二開放式隔間224,並且多個所述第二開放式隔間224沿所述第一方向D1分別對應於多個所述第一開放式隔間214,而每個所述長形貫孔2221則是連通於一個所述第二開放式隔間224。Furthermore, the
依上所述,所述第一測試腔體21與所述第二測試腔體22能相對地移動,以使所述第一容置部211與所述第二容置部221共同包圍形成所述測試空間S,並且所述第一密合部212與所述第二密合部222夾持於所述氣密墊圈25,以實現一預合作業。As described above, the
進一步地說,所述第一測試腔體21與所述第二測試腔體22之間的作動於本實施例中是通過所述機台本體1來實現,以下說明所述機台本體1的其中一種可行態樣,但本發明不以此為限。Furthermore, the movement between the
如圖1至圖4所示,所述機台本體1包含有一軌道機構11(如:線性滑軌)與位置對應於所述軌道機構11的一升降機構12(如:氣壓缸或液壓缸)。其中,所述第二測試腔體22安裝於所述軌道機構11,以使所述第二測試腔體22能通過所述軌道機構11而沿垂直所述第一方向D1的一第二方向D2於一置料位置(如:圖1)與一作業位置(如:圖2和圖3)之間移動。As shown in FIGS. 1 to 4 , the
舉例來說,如圖1所示,當所述第二測試腔體22位於所述置料位置時,所述第二測試腔體22相對於所述第一測試腔體21呈錯位設置,以使安裝於所述第二測試腔體22的所述測試載座23能用以供至少一個所述待測電子元件200設置。For example, as shown in FIG. 1 , when the
如圖2和圖3所示,當所述第二測試腔體22位於所述作業位置時,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,所述升降機構12的位置對應於位在所述作業位置的所述第二測試腔體22,並且所述升降機構12能驅使位在所述作業位置的所述第二測試腔體22沿所述第一方向D1移動而實現所述預合作業(如:圖4)。As shown in FIGS. 2 and 3 , when the
如圖1至圖6所示,所述密合機構26包含一驅動器261、多個鎖合件262、及傳輸所述驅動器261動力至與多個所述鎖合件262的一傳動件263。其中,所述驅動器261安裝於所述機台本體1且鄰近於所述第一測試腔體21,並且所述驅動器261於本實施例中是以一驅動馬達來說明,其包含有作為動力輸出使用的一齒型部2611。As shown in FIGS. 1 to 6 , the
再者,每個所述鎖合件262具有分別位於相反兩端的一連動端部2621與一鎖合端部2622,並且多個所述鎖合件262可轉動地設置於所述第一測試腔體21的所述第一密合部212。於本實施例中,每個所述鎖合件262配置於一個所述第一開放式隔間214且直立地安裝於所述第一密合部212(也就是,多個所述連動端部2621的旋轉軸線彼此平行),並且每個所述鎖合件262的所述連動端部2621與所述鎖合端部2622是分別位於所述第一密合部212的相反兩側。Furthermore, each of the
更詳細地說,每個所述鎖合件262的所述連動端部2621為一齒輪,並且所述齒型部2611與多個所述連動端部2621配置在高於所述第一測試腔體21(也就是,遠離所述第二測試腔體22的所述第一測試腔體21一側)的一平面。此外,所述傳動件263連接所述驅動器261與多個所述鎖合件262的所述連動端部2621;也就是說,所述傳動件263於本實施例中為嚙合於所述齒型部2611與多個所述連動端部2621的一傳動鍊條,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述傳動件263與多個所述連動端部2621之間的配合也可以是採用皮帶與多個摩擦輪的方式實現;或者,所述驅動器261可以通過採用氣壓缸或液壓缸搭配其他構造來實現。In more detail, the
再者,多個所述鎖合端部2622的位置與形狀分別對應於多個所述長形貫孔2221的位置與形狀。 據此,於所述預合作業之後,如圖6和圖7所示,所述驅動器261能通過所述傳動件263而驅使多個所述鎖合件262同步轉動來實現一鎖合作業,以使每個所述鎖合件262的所述鎖合端部2622與所述第一密合部212分別夾持於所述第二密合部222的相反兩側。也就是說,每個所述鎖合端部2622於所述預合作業時穿過相對應的所述長形貫孔2221、並於所述鎖合作業時旋轉錯位於相對應的所述長形貫孔2221。Furthermore, the positions and shapes of the plurality of
需額外說明的是,基於所述密合機構26在實施所述鎖合作業之後,所述測試裝置2的所述測試空間S需能夠長時間維持在高壓環境,所以對於所述密合機構26的所述鎖合作業之密合度要求極高(如:所述驅動器261必須以極大的輸出動力來實現所述鎖合作業), 因而導致所述鎖合作業不易於實施。It should be further explained that, after the
據此,於所述預合作業之後,如圖5至圖7所示,所述外循環式非接觸測試設備100於本實施例中是進一步採用所述抽氣裝置3(如:幫浦)來對所述測試空間S進行一抽真空作業,以使所述測試空間S呈現負壓狀態、而令所述第一密合部212與所述第二密合部222更為緊密地抵接(或更為緊密地夾持所述氣密墊圈25),用以利於所述密合機構26接著實施所述鎖合作業(如:所述驅動器261能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間S能夠通過所述密合機構26而長時間維持在高壓環境。Accordingly, after the pre-matching operation, as shown in FIGS. 5 to 7 , the external circulation
更詳細地說,所述抽氣裝置3連通於所述第一容置部211與所述第二容置部221的至少其中之一(如:所述抽氣裝置3於本實施例中是以通過連接於所述溫度調節裝置4而連通於所述第一容置部211),據以連通於所述測試空間S而能夠實施所述抽真空作業。In more detail, the
所述溫度調節裝置4安裝於所述第一測試腔體21與所述第二測試腔體22的至少其中之一的外側,用以連通於所述測試空間S。於本實施例中,所述溫度調節裝置4是安裝於所述第一測試腔體21的外側、並通過兩個所述貫孔2111而連通於所述測試空間S,但本發明不受限於此。The
具體來說,如圖6至圖9所示,所述溫度調節裝置4包含有一溫控機構41、連接所述溫控機構41與所述第一測試腔體21的一管路單元42、安裝於所述管路單元42的一風扇機構43、及位於所述測試空間S之內的一加熱燈具44。其中,所述溫度調節裝置4於本實施例的圖式中是僅以連接於所述第一測試腔體21來繪示,但所述溫度調節裝置4也可依據設計需求而進一步固定於所述機台本體1。Specifically, as shown in FIGS. 6 to 9 , the
所述溫控機構41包含有一氣流腔室411及配置於所述氣流腔室411內的一溫控單元412。其中,所述氣流腔室411形成有一配置空間4111及連通所述配置空間4111的兩個出入口4112。於本實施例中,所述氣流腔室411包含有N個模組化管體4113及兩個外接管體4114,N為大於1的正整數(如:N=2)。其中,N個所述模組化管體4113具有大致相同的管徑且組接成一管狀結構,並且兩個所述外接管體4114分別安裝於所述管狀結構的兩端,以共同包圍形成所述配置空間4111,而每個所述外接管體4114各形成有一個所述出入口4112。The
再者,所述溫控單元412設置於所述配置空間4111內,並且所述溫控單元412包含有一升溫器4121(如:電熱器)與一降溫器4122(如:蒸發器)的至少其中之一,其位於兩個所述出入口4112之間。於本實施例中,所述溫控單元412包含有至少一個所述升溫器4121與至少一個所述降溫器4122,並且每個所述模組化管體4113之內配置有至少一個所述升溫器4121或至少一個所述降溫器4122,據以使所述溫控機構41能夠依據設計需求而通過多個所述模組化管體4113來快速地搭配需要的所述升溫器4121的數量與所述降溫器4122的數量。Furthermore, the
所述管路單元42連接所述氣流腔室411與所述測試空間S,以使其彼此連通而共同構成一循環空間C。所述管路單元42於本實施例中是以包含有一分叉管421及兩個連接管422來說明,但所述管路單元42的具體配置方式可依據設計需求而加以調整變化,本發明在此不加以限制。The
更詳細地說,所述分叉管421具有相互連通的一安裝孔4211及兩個氣流孔4212,所述風扇機構43安裝於所述安裝孔4211,並且所述分叉管421以其中一個所述氣流孔4212連接於所述氣流腔室411的其中一個所述出入口4112,而上述彼此連接的所述氣流孔4212與所述出入口4112之內壁彼此切齊。In more detail, the
兩個所述連接管422的一端分別連接於所述第一測試腔體21的兩個所述貫孔2111,並且兩個所述連接管422的另一端分別連接於所述分叉管421的其中另一個所述氣流孔4212以及所述氣流腔室411的其中另一個所述出入口4112,據以使所述氣流腔室411(或所述配置空間4111)能通過所述分叉管421與兩個所述連接管422而連通於所述測試空間S。One end of the two connecting
再者,兩個所述連接管422的至少其中之一形成有至少一個外接孔4221,並且至少一個所述外接孔4221的數量於本實施例中為多個,據以使所述抽氣裝置3與所述供氣裝置5各連接於至少一個所述外接孔4221而連通於所述循環空間C,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述抽氣裝置3及/或所述供氣裝置5也可依據設計需求、而通過所述第一測試腔體21或所述第二測試腔體22另行開設的孔洞而連通於所述循環空間C。Furthermore, at least one of the two connecting
所述風扇機構43能運轉而形成有於所述循環空間C內流動且經過所述溫控單元412的一循環氣流F,並且所述循環氣流F能通過所述溫控單元412而具有一預設溫度。其中,位於所述測試空間S之內的所述加熱燈具44能用以搭配所述溫控單元412(如:所述升溫器4121)來加熱所述循環氣流F,據以有效地提升加熱效率。The
進一步地說,所述風扇機構43較佳是要能避免影響所述循環空間C內的所述循環氣流F的溫度與壓力,所以所述風扇機構43於下述內容是以其中一種可行的態樣來說明,但本發明不受限於此。Furthermore, the
於本實施例中,所述風扇機構43包含有一框體431、安裝於所述框體431的一馬達432、安裝於所述框體431內的一阻隔層433、可轉動地穿設於所述阻隔層433的一轉軸434、固定於所述轉軸434的一扇葉435、位於所述框體431內的一隔熱聯軸器436、及一外殼437,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述外殼437也可依據設計需求而省略或以其他構件取代。In this embodiment, the
更詳細地說,所述框體431大致呈方管狀且其一端安裝於所述管路單元42(如:所述分叉管421的所述安裝孔4211),所述馬達432安裝於所述框體431的另一端,並且所述馬達432的一輸出軸4321位於所述框體431之內,而所述馬達432的本體位於所述框體431之外。再者,所述阻隔層433鄰近於所述框體431與所述分叉管421的交界處,以隔絕所述框體431內的空間與所述循環空間C之間的溫度與氣壓。In more detail, the
所述轉軸434的一端位於所述框體431之內,並且所述轉軸434的另一端位於所述循環空間C之內,而所述扇葉435固定於所述轉軸434的所述另一端。其中,所述輸出軸4321與所述轉軸434皆沿著一預設軸線L配置,並且所述隔熱聯軸器436連接所述輸出軸4321與所述轉軸434的所述一端。據此,所述輸出軸4321與所述轉軸434不但能通過所述隔熱聯軸器436而同步轉動,並且所述輸出軸4321與所述轉軸434還能通過所述隔熱聯軸器436而有效地降低熱能的彼此相互傳遞。One end of the
需額外說明的是,所述框體431較佳是形成有位置對應於所述隔熱聯軸器436的一拆裝孔4311,據以使所述隔熱聯軸器436能通過所述拆裝孔4311而於所述框體431內進行安裝或拆卸。再者,所述外殼437安裝於所述分叉管421且其包覆且封閉所述框體431與所述馬達432(如:所述本體)於內,據以使所述馬達432和所述隔熱聯軸器436能通過所述外殼437而與外部環境隔開。It should be further explained that the
此外,所述分叉管421相對於所述扇葉435與所述轉軸434對應關係可依設計需求而調整變化,以下列舉其中一種可行的態樣來說明。所述分叉管421的其中一個所述氣流孔4212的中心位於所述預設軸線L且其位置對應於所述扇葉435,並且其中另一個所述氣流孔4212的中心位於垂直所述預設軸線L的一徑向方向上且其位置對應於所述轉軸434。再者, 所述扇葉435的半徑較佳是不小於其所對應的所述氣流孔4212的最大內徑。In addition, the correspondence between the
依上所述,所述馬達432能以所述輸出軸4321、並通過所述隔熱聯軸器436與所述轉軸434而驅使所述扇葉435轉動,以形成於所述循環空間C內流動經過所述溫控單元412的所述循環氣流F。據此,所述溫度調節裝置4於本實施例中通過所述隔熱聯軸器436與所述阻隔層433,以使其所形成的氣流之溫度能夠不被所述馬達432影響,進而精準地被控制。As described above, the
需說明的是,所述扇葉435是指能夠通過轉動而形成氣流的構造,所以所述扇葉435的具體構造可依據設計需求而加以調整變化、並不受限於圖式所呈現的構造。舉例來說,在本發明未繪示的其他實施例中,所述扇葉435可以是利於機械增壓的渦輪構造。It should be noted that the
需額外說明的是,在實施所述鎖合作業之後,所述循環空間C大致呈真空狀態,所以所述外循環式非接觸測試設備100可以採用所述供氣裝置5通入一預定氣體至所述循環空間C、並能使所述循環空間C達到一預設氣壓,以使設置於所述測試載座23的至少一個所述待測電子元件200能在所述預設氣壓與所述預設溫度的環境下進行所述非接觸測試作業。It should be further explained that after the locking operation is performed, the circulating space C is substantially in a vacuum state, so the external circulation
依上所述,所述外循環式非接觸測試設備100於本實施例中是通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件200可以經由非接觸方式(如:所述循環空間C具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。As described above, the external circulation
此外,所述供氣裝置5所輸出的所述預定氣體可以依據需求而加以變化;舉例來說,所述預定氣體可以採用乾燥氣體或是分子量大於空氣的氣體(如:二氧化碳氣體),據以進一步形成具有預設溫度的所述循環氣流F,進而利於所述循環空間C快速地達到所述預設氣壓。再者,每個所述均流件24形成有多個孔洞,以使所述循環氣流F能夠更為均勻地分佈於所述測試空間S,進而有助於至少一個所述待測電子元件200達到測試要求的溫度。In addition, the predetermined gas output by the
[實施例二][Example 2]
請參閱圖10所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異主要在於:所述溫度調節裝置4。Please refer to FIG. 10 , which is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments will not be described in detail. The difference between this embodiment and the first embodiment mainly lies in: the
具體來說,所述溫控機構41與所述風扇機構43的相對位置可依據設計需求而加以調整變化;例如:於本實施例中,所述溫控單元412及兩個所述出入口4112皆位於所述預設軸線L上,並且所述扇葉435相鄰於所述氣流腔室411的其中一個所述出入口4112,而自其中一個所述出入口4112流入並由其中另一個所述出入口4112流出所述氣流腔室411的一氣流,其能通過所述溫控單元412而具有一預設溫度。Specifically, the relative positions of the
[本發明實施例的技術效果][Technical Effects of the Embodiments of the Invention]
綜上所述,本發明實施例所公開的外循環式非接觸測試設備,其通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述循環空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。In summary, the external circulation non-contact testing equipment disclosed in the embodiment of the present invention uses a structure combination between multiple devices so that at least one of the electronic components to be tested can adjust the test parameters (such as temperature) in a non-contact manner (such as: the circulation space has the preset air pressure and the preset temperature).
再者,本發明實施例所公開的外循環式非接觸測試設備,其進一步採用所述抽氣裝置來對所述測試空間進行抽真空作業,以使所述測試空間呈現負壓狀態、而令所述第一密合部與所述第二密合部更為緊密地抵接(或更為緊密地夾持所述氣密墊圈),用以利於所述密合機構接著實施所述鎖合作業(如:所述驅動器能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間能夠通過所述密合機構而長時間維持在高壓環境。Furthermore, the external circulation non-contact test equipment disclosed in the embodiment of the present invention further adopts the exhaust device to perform a vacuum operation on the test space, so that the test space is in a negative pressure state, and the first sealing part and the second sealing part are more closely abutted (or more closely clamped The airtight gasket is clamped), which is used to facilitate the sealing mechanism to subsequently implement the locking operation (such as: the driver can achieve the locking operation with a smaller output power), so that the test space can be maintained in a high-pressure environment for a long time through the sealing mechanism.
另外,本發明實施例所公開的溫度調節裝置,其通過所述隔熱聯軸器與所述阻隔層,以使其所形成的氣流之溫度能夠不被所述馬達影響,進而精準地被控制。In addition, the temperature regulating device disclosed in the embodiment of the present invention uses the insulating coupling and the barrier layer so that the temperature of the airflow formed by it is not affected by the motor and can be accurately controlled.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The above disclosed contents are only preferred feasible embodiments of the present invention and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.
100:外循環式非接觸測試設備 1:機台本體 11:軌道機構 12:升降機構 2:測試裝置 21:第一測試腔體 211:第一容置部 2111:貫孔 212:第一密合部 213:第一強化肋條 214:第一開放式隔間 22:第二測試腔體 221:第二容置部 222:第二密合部 2221:長形貫孔 2222:環形溝槽 223:第二強化肋條 224:第二開放式隔間 23:測試載座 24:均流件 25:氣密墊圈 26:密合機構 261:驅動器 2611:齒型部 262:鎖合件 2621:連動端部 2622:鎖合端部 263:傳動件 3:抽氣裝置 4:溫度調節裝置 41:溫控機構 411:氣流腔室 4111:配置空間 4112:出入口 4113:模組化管體 4114:外接管體 412:溫控單元 4121:升溫器 4122:降溫器 42:管路單元 421:分叉管 4211:安裝孔 4212:氣流孔 422:連接管 4221:外接孔 43:風扇機構 431:框體 4311:拆裝孔 432:馬達 4321:輸出軸 433:阻隔層 434:轉軸 435:扇葉 436:隔熱聯軸器 437:外殼 44:加熱燈具 5:供氣裝置 S:測試空間 C:循環空間 F:循環氣流 D1:第一方向 D2:第二方向 L:預設軸線 200:待測電子元件 100: External circulation non-contact test equipment 1: Machine body 11: Track mechanism 12: Lifting mechanism 2: Test device 21: First test chamber 211: First accommodating part 2111: Through hole 212: First sealing part 213: First reinforcing rib 214: First open compartment 22: Second test chamber 221: Second accommodating part 222: Second sealing part 2221: Long through hole 2222: Annular groove 223: Second reinforcing rib 224: Second open compartment 23: Test carrier 24: Flow equalizer 25: Airtight gasket 26: Sealing mechanism 261: Driver 2611: Toothed part 262: Locking part 2621: Linking end 2622: Locking end 263: Transmission part 3: Exhaust device 4: Temperature control device 41: Temperature control mechanism 411: Airflow chamber 4111: Configuration space 4112: Inlet and outlet 4113: Modular pipe body 4114: External pipe body 412: Temperature control unit 4121: Heater 4122: Cooler 42: Pipe unit 421: Branch pipe 4211: Mounting hole 4212: Airflow hole 422: Connecting pipe 4221: External hole 43: Fan mechanism 431: Frame 4311: Disassembly hole 432: Motor 4321: Output shaft 433: Barrier layer 434: Rotating shaft 435: Fan blade 436: Thermal insulation coupling 437: Housing 44: Heating lamp 5: Air supply device S: Test space C: Circulation space F: Circulating airflow D1: First direction D2: Second direction L: Default axis 200: Electronic component to be tested
圖1為本發明實施例一的外循環式非接觸測試設備的立體示意圖。FIG1 is a three-dimensional schematic diagram of an external circulation non-contact test device according to
圖2為圖1的後續作動的立體示意圖。FIG. 2 is a three-dimensional schematic diagram of the subsequent action of FIG. 1 .
圖3為圖2的平面剖視示意圖。FIG. 3 is a schematic plan cross-sectional view of FIG. 2 .
圖4為圖2的後續作動的立體剖視示意圖。FIG. 4 is a three-dimensional cross-sectional schematic diagram of the subsequent action of FIG. 2 .
圖5為圖4的後續作動的立體剖視示意圖。FIG. 5 is a three-dimensional cross-sectional schematic diagram of the subsequent action of FIG. 4 .
圖6為圖5的後續作動以使所述外循環式非接觸測試設備處於非接觸測試作業的立體剖視示意圖。FIG6 is a three-dimensional cross-sectional schematic diagram of the subsequent action of FIG5 to enable the external circulation non-contact test equipment to be in a non-contact test operation.
圖7為本發明實施例一的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(一)。FIG7 is a schematic plan cross-sectional view of the external circulation non-contact test equipment in the first embodiment of the present invention during the non-contact test operation (I).
圖8為本發明實施例一的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(二)。FIG8 is a schematic plan cross-sectional view of the external circulation non-contact test equipment in the first embodiment of the present invention during the non-contact test operation (II).
圖9為本發明實施例一的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(三)。FIG9 is a schematic plan cross-sectional view of the external circulation non-contact test equipment in the first embodiment of the present invention during the non-contact test operation (III).
圖10為本發明實施例一的溫度調節裝置的立體剖視示意圖。FIG10 is a schematic three-dimensional cross-sectional view of the temperature regulating device of the first embodiment of the present invention.
100:外循環式非接觸測試設備 100: External circulation non-contact test equipment
1:機台本體 1: Machine body
11:軌道機構 11: Track mechanism
2:測試裝置 2: Test equipment
21:第一測試腔體 21: First test chamber
2111:貫孔 2111: Through the hole
213:第一強化肋條 213: First reinforcement rib
214:第一開放式隔間 214: First open compartment
22:第二測試腔體 22: Second test chamber
23:測試載座 23: Test mount
24:均流件 24: Current balancing device
262:鎖合件 262: Locking parts
4:溫度調節裝置 4: Temperature control device
41:溫控機構 41: Temperature control mechanism
411:氣流腔室 411: Airflow chamber
4111:配置空間 4111:Configuration space
4112:出入口 4112: Entrance and exit
4113:模組化管體 4113: Modular tube body
4114:外接管體 4114: External pipe body
412:溫控單元 412: Temperature control unit
4121:升溫器 4121:Heater
4122:降溫器 4122: Cooler
42:管路單元 42: Pipeline unit
421:分叉管 421: Bifurcated tube
4211:安裝孔 4211:Mounting hole
4212:氣流孔 4212: Airflow hole
422:連接管 422:Connecting pipe
43:風扇機構 43: Fan mechanism
431:框體 431:Frame
432:馬達 432: Motor
4321:輸出軸 4321: Output shaft
433:阻隔層 433: Barrier layer
434:轉軸 434: Rotating axis
435:扇葉 435: Fan blades
436:隔熱聯軸器 436: Thermal insulation coupling
437:外殼 437: Shell
S:測試空間 S:Testing space
C:循環空間 C: Circulation space
F:循環氣流 F: Circulating airflow
D1:第一方向 D1: First direction
L:預設軸線 L: Default axis
200:待測電子元件 200: Electronic components to be tested
Claims (9)
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| TW111148379A TWI839023B (en) | 2022-12-16 | 2022-12-16 | Non-contact testing apparatus with external circulation |
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| TW111148379A TWI839023B (en) | 2022-12-16 | 2022-12-16 | Non-contact testing apparatus with external circulation |
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| TWI839023B true TWI839023B (en) | 2024-04-11 |
| TW202426935A TW202426935A (en) | 2024-07-01 |
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| TW202426935A (en) | 2024-07-01 |
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