201140088 六、發明說明： 【韻^明戶斤屬今_控_冬好々貝】 參考交叉申請案 本案請求美國臨時專利申請案第61/291,826號申請曰 2009年12月31日（代理人檔號P352_pRV)及美國臨時專利申 請案第61/295,945號申請曰2〇1〇年1月18日（代理人檔號 P352-PRV2)之權益。前述具有案號第61/291，826及 61/295,945號之美國臨時專利申請案全部係以引用方式併 入此處。 發明領域 本發明係有騎心測試電子裝置之職綠及方法。 L先前技彻^】 發明背景 、至节需要阅忒新製的電子裝置來驗證裝置的適當操 作/貝!疋裝置之操作能力等。包含導電探針之接觸器裝置 可用來達成_等裝置之終端的暫雜電連結，及測試信 號可透過探針而來回提供。對裝置所進行的測試可包括例 如/則式裝置之功能操作，測定裝置之操作參數(例如速度) 範圍’對裝置加應力來刺激裝置之延伸操作等。此種電子 裝置之測試可提高此種電子U的製造成本。如此較佳係 藉簡化測試、提高_之自動化及/或並行程度及/或其類來 提咼電子裝置之測試效率。 【發明内容】 發明概要 201140088 於若干實施例，受測裝置（DUT)可在包括一對齊器 (aligner)及多個測試單元之一種測試系統接受測試。受測裝 置可設置且夾緊在對齊器的載具上之一對齊位置。於該對 齊位置，受測裝置的導電終端可在相對於該載具之載具對 齊特徵結構之預定位置。當受測裝置係夾緊在載具上的對 齊位置時，載具可移動至測試單元，其可包括具有導電探 針及載具對齊特徵結構之一接觸器。載具之載具對齊特徵 結構可機械式耦聯接觸器之接觸器對齊特徵結構，其可將 受測裝置之終端與接觸器之探針對齊。然後，受測裝置可 於測試單元内測試。 於本發明之若干實施例，一種受測裝置測試系統可包 括一對齊器、測試單元及一移動器。對齊器可包括一移動 機構，其可將受測裝置定位在載具上的對齊位置，其中相 對於該載具之載具對齊特徵結構，該受測裝置之導電終端 係位在預定位置。各個測試單元包含一接觸器，該接觸器 具有導電探針及接觸器對齊特徵結構。其中將該載具之載 具對齊特徵結構與該接觸器之接觸器對齊特徵結構機械式 耦聯，可將該受測裝置之終端與該接觸器之探針對齊。移 動器可包括一機器人機構，其係組配來將具有該受測裝置 夾緊在該對齊位置之該載具從該對齊器移動至該等測試單 元中之一者。 圖式簡單說明 第1圖顯示依據本發明之若干實施例一種受測裝置測 試系統之實例。 201140088 第2A圖顯示依據本發明之實施例可用於第1圖之受測 裝置測試系統之載具及受測裝置之頂視圖。 第2B圖顯示第2A圖之載具及受測裝置之側視圖。 第3圖顯示依據本發明之若干實施例第1圖之受測裝置 測試系統之對齊器實例。 第4A及4B圖顯示依據本發明之若干實施例第1圖之受 測裝置測試系統之測試單元實例之側視圖。 第5A圖顯示一種定位盤載具之頂視圖，其可為依據本 發明之若干實施例第1圖之受測裝置測試系統之載具實例。 第5B圖顯示第5A圖之定位盤載具之底視圖。 第5C圖顯示第5A圖之定位盤載具之剖面側視圖。 第6A圖顯示依據本發明之若干實施例第1圖之受測裝 置測試系統之對齊器實例之頂視圖，其可將受測裝置對齊 在定位盤載具上。 第6B圖顯示第6A圖之對齊器之剖面側視圖。 第7A及7B圖顯示依據本發明之若干實施例，在第6A及 6B圖之對齊器内，載荷一受測裝置至第5A至5C圖之定位盤 載具實例。 第8A圖顯示依據本發明之若干實施例第1圖之受測裝 置測試系統之一測試單元實例之頂視圖，其可測試在一定 位盤載具上的一受測裝置。 第8B圖顯示第8A圖之測試單元之剖面側視圖。 第9A及9B圖顯示依據本發明之若干實施例，將第5A至 5C圖之定位盤載具上之一受測裝置載荷至第8A及8B圖之 201140088 測試單元之實例。 第10A圖為一種膜載具之頂、a /、又頂硯圖，該膜載具可為依摅 發明之若干實施例第1圖之受.、丨 來本 又州裴置測試系統之載具實例。 第10B圖顯不第10A圖之勝# 嗎栽具之剖面側視圖。 第11A及11B圖顯示依攄太处 _ 本發明之若干實施例第1圖 受測裝置測試系統之對齊器警办， ^ 片裔貧例之側視圖，其可將受 置對齊在膜載具上。 、 第12A及12B圖顯示依據本發明之若干實施例約圖之 受測裝置測試系統之-測試單元實例之側視圖，其可_ 在膜載具上的一受測裝置。 第13圖顯示依據本發明之若干實施例一種用以在第i 圖之受測裝置測試系統中測試受測裝置之方法實例。 第14圖顯示依據本發明之若干實施例一種用以在第i 圖之受測裝置測試系統的對齊器内對齊一受測裝置與一載 具之方法實例。 第15圖顯示依據本發明之若干實施例一種用以在第1 圖之受測裝置測試系統中測試受測裝置之方法實例。 第16圖顯示依據本發明之若干實施例一種用用於受測 裝置之測試後處理之方法實例。 t實施方或】 較佳實施例之詳細説明 本說明書描述本發明之具體實施例及應用。但本發明 並非囿限於此等臭赠實施例及應用或此等具體實施例及應 用操作或在此處所述之方式。此外，圖式顯示簡化視圖或 201140088 部分視圖，且圖式内的元件尺寸可誇大或以其它方式未照 比例繪製財清晰。此外，t術語「在其上」、「附接至」 或「耦接至」用在此處時，—個物件(例如—種材料、一層、 一基板等)可「在其上」、「附接至」或「麵接至」另一物:， 而與一個物件係直接在其上、附接至或_至另—物件， =有一或多個中介物件在該-個物件與另—物件間獨立無 關。又若提供有方向（例如上、下、頂、底、側、向上、向 下、在其上方、在其下方、較高、較低、水平、垂直、「X」、 「y」、「z」等），則該等方向為相對方向，只為了舉例說明 及為了方便例示討論而提供’絕非限制性1外，者述及 一串列元件(例如元件a、b、〇時，此種敘述係意圖L所 列舉的元件中之任-者其本身、少於所列舉的元件全部之 任一種組合及/或所列舉的元件全部之組合。 第1圖顯示依據本發明之若干實種用以測試受 測裝置m之多受測裝置測試系統·之實例。如圖所示， 多受測裝置測試系統100可包括I載器102、對齊器1〇4及移 動器106以及測試單元則。測試單元則可為測試單元1〇8 中之一者的貫例。如此，測試單元108包含多個（例如2、3、 4、5、10、20或更多）測試單元11〇。對齊器1〇4可包括一或 多個接取門122,及測試單元11〇可包括一或多個接取門 124。 DUT其可為受測裝置之頭字語，DUTU2可裝載入裝載 器102内部及置於載具116上，其實例係顯示於第2八及26 圖。DUT 112在載具116上之位置可於對齊器1〇4調整，使得 7 201140088 DUT 112的輸入及/或輸出終端114係相對於載具116上的載 具對齊特徵結構118為對齊（參考第2A及2B圖）。然後，在載 具116上對齊的DUT 112可置於測試單元11〇内，其實例係例 示說明於第4A及4B圖。測試單元11〇可包括具有相對於導 電探針410位在預定位置之接觸器對齊特徵結構412的接觸 器408。載具116上的載具對齊特徵結構118可機械式耦接測 試單元110内的接觸器對齊特徵結構412，其可使得接觸器 408的探針410充分對齊DUT 112終端114,足夠使得探針41〇 與終端114做實體接觸，及藉此建立探針41〇與終端114間之 電連結。然後，測s式彳s號可經由接觸器而來回提供給 DUT 112而來測試DUT 112。已測試的DUT 112然後可從測 試單元110移出及最終，從多受測裝置測試系統例如透 過裝載器102移出。移動器106可包括一或多個機器手臂 120，載具116環繞多受測裝置測試系統1〇〇而移動dut 112 及DUT 112/載具116。如圖所示，多受測裝置測試系統1〇〇 也可包括控制器126及記憶體128。 DUT 112可為包含輸入及/或輸出終端114之一或多個 電子裝置。舉例言之’DUT 112可為包含未經單一化半導體 晶粒的半導體晶圆。至於另一實例，DUT 112可包含設置在 固定座上或内的單一化晶粒（已封裝或未封裝至於又另一 實例’ DUT 112可為設置在固定座上或内的其它類型電子裴 置◊如第2A及2B圖所示，DUT 112也可包括位在相對於终 端114之已知位置的一或多個DUT對齊特徵結構212。於若 干實施例’ DUT對齊特徵結構212可包含終端114中之—或 201140088 多者。舉例言之，DUT對齊特徵結構212可包含一成多個終 端114之一或多個邊緣或角隅。於圖式例示說明之實例中， 對齊特徵結構212對應終端114中之一或多者，因而ϋ未例 示說明分開的對齊特徵結構212。但如所瞭解，對齊特徵結 構212另外可為在DUT 112上之分開的記號、邊緣、角隅及/ 或結構（圖中未顯示）及/或位在與終端114中之一成多者偏 移位置之DUT固定座（圖中未顯示）。如圖所示，於若干實施 例’0!1丁112可具有一定位標記132。於若干實施例’定位 標s己132可為DUT 112邊緣130的不規則部分。如所述，DUT 112可為半導體晶圓，而定位標記132可為晶圓之邊緣丨3〇的 修剪部分。 第2Α及2Β圖例示說明之dut 112僅為其中一例，而 DUT 112可與所示者不同。舉例言之，DUT U2可為其它形 狀。至於另一實例，DUT 112無需包括所示全部特徵結構(例 如DUT 112可能缺對齊特徵結構212及/或定向標記132)。至 於又另一實例’ DUT 112可具有與所示者不同的定向標記 132，且可具有多於一個定向標記132。至於又另一實例， DUT 112可具有圖中未顯示的額外特徵結構。至於又另一實 例，可有比較圖中顯示者更多或更少的終端114〇 裝載器102可包含可接納dut 112之設備。舉例言之， 若DUT 112為包含半導體晶粒之半導體晶圓，則裝載器1〇2 可包含接納此種晶圓之設備。例如，裝載器1〇2可包含諸如 業界已知的機器臂手柄。至於另一實例，裝載器1〇2可包含 諸如業界已知之一或多個EFEM(設備前端模組）。雖言如 201140088 此’ DUT 112可放置在裝載器102内的載具116上，及移動器 106可將DUT 112與載具116的組合從裝載器1〇2移動至對齊 器104，於該處DUT 112可對齊載具116。另外，112可放置 於對齊器104内的載具116上且對齊載具。此種情況下，移 動器106可將DUT II2從裝載器1〇2移動入對齊器1〇4。 移動器106可包含可環繞多受測裝置測試系統1〇〇而移 動DUT 112、載具116，及DUT 112/載具116組合之設備。舉 例言之，移動器106可包含用以移動DUT 112、載具116，及 DUT 112/載具116組合之一或多個輸送器（圖中未顯示）及/ 或升降機（圖中未顯示）。如第1圖所示，移動器106也可包括 一或多個機器手臂120,其各自可抓握DUT 112、載具116， 及DUT 112/載具116組合，且將DUT 112、載具116，及DUT 112/載具116組合移入或移出裝載器1〇2、對齊器1〇4及/或測 試單元110。雖然於附圖中並未顯示，但DUT 112及/或載具 116(包括此處揭示之載具116的任一種組合）可包括手柄（圖 中未顯示）或手臂120可抓握的其它特徵結構。 依據本發明之若干實施例，載具116之一實例係例示說 明第2A及2B圖。如圖所示’載具116可包含具有承載表面 204而DUT 112可放置其上之一基板2〇2(例如一材料塊）。適 當載具之非限制性實例包括金屬或陶瓷板等。於若干實施 例’基板202之厚度Tc可大於DUT 112之厚度TD。舉例言 之’厚度Tc可為DUT 112之厚度TD的2、5、8、9、1〇或更 多倍。另外’厚度Tc可等於或小於厚度Td。 夾緊機構208可選擇性地釋放DUT 112，使得DUT 112 10 ⑤ 201140088 可在承載表面204上移動，及夹緊機構2〇8可選擇性地在承 載表面204上夾緊DUT 112定位。如此，當夾緊機構綱係在 釋放狀態時，DUTm係在承載表面2〇4上自由移動（或被移 動）’但當夾緊機構208係在夾緊狀態時，夾緊機構2〇8係在 承載表面204上固持（或夾緊)DUT 112定位，使得DUT 112 係在承載表面204上不能移動（或被移動）。夾緊機構2〇8可為 適合用以選擇性地夾緊及釋放£)171 112之機構。夾緊機構 208之非限制性實例包括於承載表面2〇4之一或多個真空槽 (圖中未顯示）、靜電機構(例如夾具)(圖中未顯示）、機械夾 具（圖中未顯示）等。 載具116可包含載具對齊特徵結構118，如後文得知， 該特徵結構可耦聯（例如機械式）測試單元11〇内的對應接觸 器對齊特徵結構412(參考第4A及4B圖）。當載具對齊特徵結 構118與接觸器對齊特徵結構412耦聯時，載具116係位在相 對於測試單元110内的接觸器408之探針410的預定方向。如 此’DUT 112可位在承載表面204上使得當DUT 112/載具116 組合置於測試單元110内時，DUT 112之終端114係對齊及如 此而接觸且電連結接觸器408之探針410。如此處使用，當 DUT 112係位在載具116上，而終端114係相對於載具對齊特 徵結構(例如載具對齊特徵結構118)設置時，DUT 112係「對 齊於」、「對齊其上」或與載具116「於對齊位置」，使得當 載具116之載具對齊特徵結構（例如118)係機械式耦聯接觸 器408之接觸器對齊特徵結構412(例如如第4B圖所示）時， DUT 112之終端114及接觸器408之探針410係充分對齊而做 201140088 接觸，及藉此建立終端與探針410間的電連結。 載具對齊特徵結構118可為機械特徵結構，諸如延伸部 其可嵌合人及如此_對應關器對㈣徵結構412，其可 為機械容座。另外，接觸器對齊特徵結構412可為延伸部其 可嵌合入及如此耦接對應載具對齊特徵結構118，其可為容 座。雖言如此，第2A及2B圖所示載具對齊特徵結構ιΐ8之 數目及位置僅供舉例說明之用，可有多於或少於三個載具 對齊特徵結構118，其可位在與第2八及四圖所示之不同位 置及/或不同樣式。於若干實施例，載具對齊特徵結構ιΐ8 之數目及位置可為例如以六度自由度，或另外，於大致平 行DUT 112終端114之平面以三度自由度，動態對齊載具116 與接觸器408。如此處使用’動態對齊表示使用最少數的成 對對齊特徵結構（各對為一個載具對齊特徵結構丨18及一個 接觸器對齊特徵結構412)而對齊。舉例言之，於二維平面 為3對齊特徵結構對，而於三維平面為6對齊特徵結構對。 DUT 112可直接對齊載具對齊特徵結構118❶但於若干 實施例’載具116可包括相對於載具對齊特徵結構118位在 已知位置的偏位對齊特徵結構206，及DUT 112可直接對齊 偏位對齊特徵結構206及如此而間接對齊載具對齊特徵結 構118。偏位對齊特徵結構2〇6用於對齊為最佳化。舉例言 之’偏位對齊特徵結構206可為在承載表面204的拍攝影像 中容易識別的特徵結構。如此，於若干實施例，偏位對齊 特徵結構206可包含在DUT 112之承載表面204之數位化影 像中容易識別的形狀、色彩、樣式等。 12 ⑤ 201140088 如第2B圖所示，載具116可包括一或多個溫度控制裝置 210。溫度控制裝置210可選擇性地將DUT 112調整至及/或 將DUT 112維持在可能溫度範圍之期望溫度。溫度控制裝置 210例如可包含一或多個加熱裝置及/或冷卻裝置。舉例言 之，溫度控制裝置210可包含一或多個電阻加熱元件（圖中 未顯示），在基板202内或上的通道（圖中未顯示），加熱或冷 卻流體(例如液體、氣體等）可循環通過該等通道。於若干實 施例’溫度控制裝置210可自容(be self contained)在載具116 上。換言之，溫度控制裝置210可操作歷經至少一段時間而 未連結至在載具116及/或DUT 112上或構成其一部分的設 備。於其它實施例，溫度控制裝置210對未自容在載具116 上，反而係連結至非屬在載具116及/或DUT 112上或構成其 一部分的設備（例如電源供應器、加熱或冷卻流體源等圖 中未顯示）。於若干實施例，基板2〇2之材料及/或結構可經 選擇來協助加熱或冷卻DUT 112。 如第2A及2B圖所示之載具116僅供舉例說明之用。如 此例如，載具116無需包括全部如第2A&2B圖所例示說明 之特徵結構或元件；載具116可具有未顯示於第2八及2^圖 之額外特徵結構或元件；及载具116可具有與如第2八及2^ 2所示不同的特徵結構或元件.舉例言之，如前文概略討 _，栽具116無需包括偏位對齊特徵結構2〇6。舉另一實例， 載具116無需包括溫度控制裝置21〇。舉又另一實例，栽具 116可包括一蓋（圖中未顯示）及密封機構（圖中未顯示），其 可提供環繞DUT 112之自容式潔淨室環境。至於又另一實 13 201140088 例’下列裝置或特徵結構中之一或多者可含括於載具116之 若干實施例：電動、氣動、液壓及/或真空連接器等；及/ 或一或多個感測器、電子式控制器、電子式記憶裝置及/或 其它電子電路。 依據本發明之若干實施例，對齊器104之一實例係例示 說明於第3圖。如圖所示，對齊器104可包括一殼體3〇2，其 可包括一接取門122，透過此接取門122，DUT 112、載具116 及/或DUT 112與載具116之組合可置於對齊器1〇4内。於若 干實施例’殼體302可充分密封或可密封而當接取門122關 閉時’可提供自容式潔淨室圍場。對齊器104也可包括或連 結至控制器308及記憶體316。控制器308可控制對齊器104 的全部或部分操作且可依據儲存在記憶體316的程式碼（定 義如下）而操作。另外或此外’控制器308可全部或部分依 據有線電路操作。控制器308可為下文就控制器126所識別 的控制器任一類型中的一或多者’而記憶體316可為下文就 記憶體128所識別的記憶體裝置任一類型中之一或多者。 如前述，DUT 112可放置在裝載器1〇2或對齊器1〇4的載 具116上。載具116可設置於對齊器104的任何固持機構或結 構（圖中未顯示）上。舉例言之’載具116可設置在如第3圖所 示殼體302底部、平台（圖中未顯示）等。 對齊器104可包括用以將載具116導引入對齊器104的 特定位置及/或方向的機構318。舉例言之，導引機構318可 包含導轨、凹部、止動結構及/或其類，其係將載具116導 引入對齊器104的一個粗略位置或方向。於若干實施例，舉 ⑤ 14 201140088 例言之’導引機構可包含導轨(圖中未顯示）及止動結_ 中未顯示）。當載具被裝載人殼體内時，此等導軌(圖中未顯 示）可導引載具ι16;及當載具116係在殼體3〇2的期望位置 及/或方㈣，止祕構⑽巾未顯示）可沿導㈣圖巾未顯示> 停止載具116的移動。 如第3圖所示’對齊器1〇4可包括一移動機構遍，其可 被作動來相對於载具116移動DUT 112。舉例言之，移動機 構306可移動dut m而未移動載具116 ;移動載具116而未 移動DUT 112 ;及/或獨立地移動DUT 112及載具116。載具 116的夾緊機構208可釋放DUT 112，使得移動機構3〇6可在 基板202之承載表面204上移動DUT 112。移動機構306之非 限制性實例包括一或多個馬達傳動平台、壓電平台、壓電 步進梁平台等。其它移動機構306實例包括用以選擇性地導 引空氣喷射在DUT 112之部分上用來相對於載具116移動 DUT 112之設備；用以選擇性地形成靜電荷而用來相對於栽 具116移動DUT 112之設備；等。 對齊器104也可包括一或多部攝影機304，其可拍攝 DUT 112及/或載具116之一或多個電子（例如數位）影像。該 等影像可用來將DUT 112移動至載具116上的對齊位置。使 用人（圖中未顯示）可手動控制移動機構306來相對於栽具 116移動DUT 112,直至DUT 112係在載具116上的對齊伋 置。另外或此外，控制器308可接收DUT 112及/或載具U6 之影像且可控制移動器306來相對於載具116移動D\jt 112(如前文討論）而將DUT 112移動至載具ι16上的對齊位 15 201140088 置。移動DUT 112至載具116上的對齊位置可能涉及多於一 系列拍攝DUT 112及/或載具116影像，及然後在載具116上 移動DUT 112。無論移動機構306係如何致動來在載具116 上移動DUT 112，一旦DUT 112係在載具116上的對齊位置 時，夾緊機構208可在承載表面204上的對齊位置 112。 如第3圖所示，於若干實施例 攝影機對齊特徵結構312之攝影機座310，其可耦接(例如機 械式）載具對齊特徵結構118或載具116之其它對齊特徵結 構（圖中未顯示）。攝影機3〇4可安裝在攝影機座310上在相對 於攝影機對齊特徵結構312的已知(例如已校準）位置，使得 當攝影機對齊特徵結構312與載具對齊特徵結構118係如第 3圖所示耦接時，攝影機3〇4係在相對於載具對齊特徵結構 118的已知（或6校準)位置。此種情況下，攝影機304可拍攝 DUT對齊特徵結構212中之一或多者的影像，及此等影像可 使用（例如由控制器308)來將DUT 112移動至載具ιΐ6上的 對背位置冑影機304無需拍攝載具對齊特徵結構118或載 具116之任何其它特徵結構或元件的影像。舉例言之，控制 器308(例如操作人M)可利用拍攝得_靖齊特徵 212影像及攝影義4相對於載具對齊特徵結細之L 位置而將贿U2相對於載具116移動至載具ιΐ6上的對齊 位置。移動機構314可將攝影機細移進與移出與載具對 ㈣⑽聯。舉例言之，攝影機座训在 虛線顯不在攝影機座31G(特賴影機對齊特徵結構312)與 201140088 載具對齊特徵結構118解耦位置；而與載具對齊特徵結構 118耦聯的攝影機座310在第3圖係以實繳顯示。另外，載具 116(及如此DUT 112)可移動，或攝影機座31〇及载具116可 移動至耦接載具對齊特徵結構丨18及攝影機對齊特徵結構 312。 於其它實施例，對齊器1〇4無需包括耦聯攝影機3〇4至 載具對齊特徵結構118的特徵結構(例如攝影機對齊特徵結 構312)。舉例言之，攝影機304可安裝在殼體302或殼體302 内的其它結構（圖中未顯示）。此種情況下，攝影機3〇4相對 於載具對齊特徵結構118的位置可能非已知，而攝影機3〇4 可拍攝DUT對齊特徵結構212(例如終端114中之一者）及載 具對齊特徵結構118二者的影像，及該等影像可由控制器 3〇8(及/或操作人員）用來將DUT 112移動至載具116上的對 齊位置。至於另一實例，攝影機304可位在相對於夾具（圖 中未顯示）或殼體302内之類似裝置但未直接耦接攝影機 304之對齊特徵結構（圖巾未顯*但可能類似攝影機對齊特 徵結構3丨2)的已知位置。該等對齊特徵結構（圓巾未顯示） 可搞接載具對齊特徵結構H8，及藉此將載具116移動至一 位置’其中載具對齊特徵結構118係位在相對於攝影機3〇4 的已知位置。 攝影機3〇4可為用以拍攝DUT ιη及/或載具⑽影像 (例如數位影像)之任何攝影機或其它裝置。義於圖中未顯 示’用以移動攝影機3〇4之機構可含括於對齊器祕。例如 攝影機304可在攝影機座31〇上移動。 17 201140088 攝影機對齊特徵結構312可為機械特徵結構，諸如延伸 部其係嵌合進絲此祕對輕㈣_徵結_8，其可 為機械容座。另外，攝影機對齊特徵結構312可為對床載旦 對齊特徵結構118(其可為延伸部)嵌合其巾的容座。雖言如 此，第3圖所示攝影機對齊特徵結構312之數目及位置縣 舉例說明之用，可有比如圖料〇數或更少數。此外， 攝影機對齊特徵結構312可為與如第3圖所示不同位置及/ 或不同樣式。於若干實施例，攝影機對齊特徵結構312之數 目及位置可為諸如在三度空間以六度自由度，或另外在 大致平行DUT 112之終端114平面以三度自由度，動態對齊 載具116及攝影機座31〇(及如此攝影機3〇4)。 如第3圖所示之對齊器1〇4僅供舉例說明之用。如此例 如對齊器1 無需包括全部如第3圖所例示說明之特徵結 構或元件；對齊器104可具有未顯示於第3圖之額外特徵結 構或元件；及對齊器104可具有與如第3圖所示不同的特徵 結構或元件。舉例言之’如前文概略討論，對齊器1〇4無需 包括攝影機對齊特徵結構312、攝影機座310或移動機構 314(例如攝影機304可安裝在殼體302或殼體302内其它結 構（圖中未顯示））。舉另一實例，如前文也已概略討論，在 殼體302可有機械耦聯機構（圖中未顯示），其係機械式麵聯 載具對齊特徵結構118及因而將載具116移動至相對於攝影 機304的預定位置。舉又另一實例，可只有一部攝影機3〇4， 或可有多於如第3圖所示之兩部攝影機304。 如前文討論，第1圖所示測試單元108可包含二或多個 ⑤ 18 201140088 測試單元，測試單元11〇可為其中一例。依據本發明之若干 實施例，測試單元110之實例係例示說明於第4A及4B圖。 如圖所示，測試單元11〇可包括一殼體402，其可包括 一接取門124,透過該門DUT 112與載具116之組合可放置於 測試單元110内。於若干實施例’殼體402可充分密封來當 接取門124關閉時提供自容式潔淨室圍場。測試單元110也 可包括或可連結至控制器418及記憶體420。控制器418可控 制測試單元110的全部或部分操作且可依據儲存在記憶體 420之程式碼（定義如下）操作。另外或此外，控制器418可全 部或部分依據有線電路操作。控制器418可為下文就控制器 126所識別的控制器任一類型中的一或多者，而記憶體420 可為下文就記憶體128所識別的記憶體裝置任一類型中之 一或多者。 也如圖所示，測試單元11〇可包括接觸器4〇8，其可包 含導電探針410。探針41〇可為適合用以接觸dut 112之終端 114及因而與終端114作接觸的任一結構。適當探針41〇之實 例包括彈簧探針、短柱、凸塊等。接觸器4〇8可電連結至電 連結4〇4 ’透過此電連結，電力及地電位、控制及測試信號 等可提供給接觸器4G8 ’其可包括電連結（圖巾未顯示）至探 針410。如此’電力、土也電位、控似測試信號等可經由接 觸器408而提供_υτ 112。同理，來自ιΐ2之信號可 經由接觸器408提供給電連結4〇4。 接觸器408可為任—種適合用以提供與探針41〇彼此電 連結之電子裝置。舉例言之，接觸器4〇8可包含一探針卡總 19 201140088 成、一探針頭總成、一膜接觸器、一裝載板等。於若干實 施例，接觸器408可包含一或多個電路板、加勁件 '探針頭、 中介件及/或其類之組合。 如所述，測試單元110也可包括接觸器對齊特徵結構 412，其可耦聯接觸器408 '殼體402或測試單元11〇之其它 元件。也如前文討論，接觸器對齊特徵結構412可機械式耦 接載具116上的對應載具對齊特徵結構118，使得探針41〇充 分地對齊終端114允許探針41〇接觸且做電連結至終端 114如此接觸器408架設在（或至）殼體4〇2在相對於接觸器 對齊特徵結構412，當載具116上的載具對齊特徵結構118係 耦聯接觸器408上的接觸器對齊特徵結構412時，對齊探針 410與終端114的位置。 測試單元110可包括導引機構422用以將載具116導引 至測試單元110的特定位置及/或方向。舉例言之，導引機 構422可包含導軌、凹部、止動結構及/或其類，其係將載 具116導引入測試單元11〇的一個粗略位置或方向。於若干 實施例，舉例言之，導引機構422可包含導軌（圖中未顯示） 及止動結構（圖中未顯示）。當載具被裝载入殼體4〇2内時， 此等導軌(圖中未顯示）可導引載具116;及當載具116係在殼 體302的期望位置及/或方向時，止動結構（圖中未顯示）可沿 導軌（圖中未顯示）停止載具116的移動。期望位置可能粗 略，但雖言如此足夠載具對齊特徵結構118與接觸器對齊特 徵結構412對齊，用以當升降機4〇6(容後詳述)移動載具 時，如第4B圖例示說明，載具對齊特徵結構118機械式耦聯 ⑤ 20 201140088 接觸器對齊特徵結構412。 也如第4A及4B圖所示，測試單元110可包括升降機 406。也如第4A圖所示，DUT 112與載具116之組合可置於 升降機406上，及也如第4B圖所示，升降機406可移動DUT 112與載具116之組合，使得機械式耦聯接觸器對齊特徵結 構412及終端114的載具對齊特徵結構118係接觸探針41〇。 如第4A及4B圖所示’升降機406可於「z」方向移動。於若 干實施例’升降機406也可於「x，y」平面移動且也可繞「χ」、 「y」及/或「z」軸中之一或多者旋轉。雖然本發明並非囿 限於此’但附圖例示說明之實例中，「z」方向或2軸大致上 垂直載具116之承載表面204，及「X」及「y」方向或軸（及 如此「x，y」平面）大致上平行載具116之承載表面304<)升降 機406可為適合承載與移動載具116之任何機構。例如，升 降機406可為移動式平台。適當升降機之實例包括氣動、馬 達或液壓傳動平台。 測試單元110可包括或係連結至可調整氣壓的壓力控 制器416。舉例言之，壓力控制器416可選擇性地減低及/或 增尚氣壓至期望程度。如圖所示，一或多個氣密封414可配 置在接觸器408與DUT 112間。封414可在接觸器4〇8與DUT U2間形成氣密封，及壓力控制器416可選擇性地設定在接 觸器408與DUT 112間的氣壓至期望位準。如此，壓力控制 器416可在接觸器4〇8與DUT 112間選擇性地形成真空，其例 如可將接觸器408與DUT 112接在-起。壓力控制器416也可 選擇性地提高在接觸器408與DUT 112間之空間氣壓，其例 21 201140088 如可將接觸器408與1)1；丁 112推開。如此壓力控制器416可選 擇性地調節（例如增或減）朝向DUT 112之終端114的探針 410力（例如總合力）’其可調節在DUT 112之終端ιΐ4與接觸 器408間之總力（壓力）。舉例言之，壓力控制器416可使得在 DUT終端iu與接觸器4〇8間之總力為選定量，包括零。 於若干實施例’升降機406可移動載具116，使得終端 114係在探針41〇附近或初步接觸。然後壓力控制器416可在 DUT 112與接觸器408間之空間形成真空，來以足夠力將接 觸器408與DUT 112拉在一起而形成終端114與探針410間之 電連結。 第4A及4B圖所示測試單元n〇僅供舉例說明之用。如 此’例如測試單元11〇無需包括第4A及4B圖所示全部特徵 結構或元件；測試單元HO可具有第4A及4B圖所未顯示的 額外特徵結構或元件；及測試單元110可具有與第4A及4B 圖所示不同的額外特徵結構或元件。舉例言之，測試單元 110可包括一或多個電源供應器、控制及測試信號產生器 (類比及/或數位）、溫度控制裝置等（圖中未顯示）。此等電源 供應器及信號產生器（圖中未顯示）可透過連結404而連結至 接觸器408，或另外，可為接觸器408之一部分，且可透過 接觸器408而連結至探針410。舉另一實例，測試單元110可 包括特徵結構（圖中未顯示），其允許其允許接觸器408被移 除且以不同接觸器取代。至於又另一實例’測試單元110無 需包括封414或壓力控制器416。至於又另一實例，測試單 元110可包括導引機構(圖中未顯示），其協助DUT 112/載具 ⑤ 22 201140088 116之組合裝載入測試單元110及將DUT 112/載具116之組 合從測試單元UO移出。此外，此種導引機構（圖中未顯示） 可導引DUT II2/載具116之組合至充分對齊接觸器408之位 置’使得升降機406可移動DUT 112/載具116之組合，因而 載具對齊特徵結構118與接觸器對齊特徵結構412的耦接而 未使用攝影機或其它此等機構。例如此等導引機構可包括 導轨、凹部 '止動結構及/或其類（圖中未顯示）。 控制器126可控制部分或全部多-DUT測試系統100之 操作。舉例言之，控制器126可通訊式連結至裝載器1〇2、 對齊器104、測試單元1〇8及/或移動器1〇6。控制器126可接 收狀態信號其係來自及/或發送控制信號至裝載器1〇2、對 齊器104、測試單元1〇8及/或移動器106中之一或多者。 控制器126可包含一或多個處理器（例如微處理器或微 控制器）、電腦等，其可依據儲存在數位記憶體128的程式 碼操作，數位記憶體12 8可包含任何記憶體裝置包括但非限 於半導體記憶體裝置、磁性記憶體裝置、光學記憶體裝置 等。另外或此外，控制器126可包含有線電路，及控制器126 可部分或全部依據此種有線電路操作。如此處使用「程式 碼」係指可儲存在記憶體128而由控制器126執行的機器可 讀取指令。程式碼之非限制性實例包括軟體、微碼、韌體、 腳本等。 於第1至4B圖，控制器126係顯示控制DUT測試系統j 1〇 之王。P元件，而對齊器1〇4及各個測試單元則係顯示為分 别包括或連結至控制器308及418。前述組態僅為其中一 23 201140088 例，預期可有變化例。舉例言之，控制器126可執行全部或 部分功能及由控制器3〇8及/或控制器418執行的控制。至於 另一實例，可含括額外控制器，其分開控制例如裝載器1〇2 及/或移動器1〇6。 多-DUT/則试系統1 〇〇之概略描述連同dut 1 ]_2、带載器 102對齊器1〇4、移動器106及測試單元11〇之實例係例示 說明於第1至4B圖且討論如前。如前文討論瞭解，例示說明 於第1至4B圖且討論如前的實例僅供舉例說明之用而非意 圖限制性。確實，許多變化例皆屬可能，而其中部分特別 就載具116、對齊器104及測試單元11〇加以瞭解。多_dut 測試系統100的多項其它變化例亦屬可能。舉例言之，可有 多於一個裝載器102、對齊器104及/或移動器106。舉另一 實例，裝載器102與對齊器104無需為分開元件。換言之， 例如對齊器104可為裝載器102之一部分。至於另一實例， 裝載器102無需含括於多-DUT測試系統1〇〇，而DUT 112可 透過對齊器104而裝載進系統100及由其中取出。舉測試系 統100變化例之又另一實例，測試單元1〇8可配置在多個位 置（例如環繞移動器106)。至於又另一實例，可含括額外元 件於多-DUT測試系統100,諸如儲存裝置（圖中未顯示）其可 例如存放DUT 112(已經測試或未經測試）、載具116等。 第5A至12B圖例示說明依據本發明之若干實施例，載 具116實施例及該等載具116之對齊器104與測試單元110的 實施例之額外實例。第13至15圖例示說明依據本發明之若 干實施例，用以於多-DUT測試系統100測試DUT 112之實例。 ⑤ 24 201140088 第5 A至5C圖例示說明呈定位盤載具500形式之載具 116實施例之實例。第6A至7B圖例示說明組配用於定位盤 載具500之對齊器104之實施例，及第8A至9B圖例示說明組 配用於定位盤載具500之測試單元110之實施例。 如前述，第5A至5C圖之定位盤載具500為依據本發明 之若干實施例載具116之實例。於第1至4B圖中之任一者及 於該等圖之前文討論中，定位盤載具500可置換載具116。 此外，定位盤載具500可包括此處就載具116討論之特徵結 構或變化例’即便並未就定位盤載具5〇〇特別敘述亦如此。 如圖所示，定位盤載具500可包含一定位盤5〇2 ,其具 有DUT 112(第5A及5C圖以虛線顯示）可置放其上的承載表 面504。定位盤502可包含一基板(例如一塊材料）等。舉例言 之，定位盤502可包含一金屬板、陶瓷板等。於若干實施例， 定位盤502厚度TP可大於DUT 112厚度Td。例如，厚度^可 為DUT 112厚度TD之2、5、8、9、1〇或更多倍。另外，厚 度TP可等於或小於厚度td。 -或多個真空槽506可設置於承載表面5〇4。機構（圖中 未顯示）及其它設備（圖中未顯㈣可_性地設置來在㈣ 槽504形成、保持與解除真空。此等機構（圖中未顯示）可包 括-或辣連結喷嘴（时未顯示），及射嘴（圖巾未顯示） 至真空槽504的通道。槽506的真空可將dutii2在承載表面 5〇4上夾緊定位’及解除真空可釋放贿112,使得⑽⑴ 可在承載表®5G4上移動。真空槽5()4及用以駭與解除真 空的相關機構如此可為第2八及23圖之炎緊機構實例。定位 201140088 盤502另外可包括不同型夹緊機構，諸如機械夾具等。第5A 及5C圖所示真空槽504之數目、形狀及/或樣式僅為一例且 可有不同者》 如第5A及5C圖可知，承載表面5〇4可小於DUT 112，使 得DUT 112延伸超出承載表面5〇4。於若干實施例’承載表 面504之面積可為DUT 112面積之3/4或以下，2/3或以下， 1/2或以下，1/3或以下，1/4或以下。於若干實施例，承載 表面504之面積可為DUT 112面積之1/25或以下，1/50或以 下’或1/75或以下。承載表面504面積係小於DUT 112之對 應面積可允許定位盤載具5〇〇具有比載具116(其為較大）更 小的尺寸及/或熱質量◊定位盤載具5〇〇如此可較小，於若 干實施例，可提供優點諸如製造成本減低及熱質量減低。 無論承載表面504之相對大小如何，定位盤5〇2可具有厚度 ΤΡ，谷後#述，其可約略等於對齊器1〇4中之卡盤6〇2及測 試單兀110中之卡盤802内空腔6〇6及8〇6之深度d。 定位盤對齊特徵結構51〇可配置在位盤502之對側表 面508上。例如定位盤對齊特徵結構51〇可為延伸部，其係 從對側表面508延伸出，或為容座其係延伸進人對側表面 508。如圖可知，定位盤對齊特徵結構51〇於第从至祁圖例 示說明之對齊器104組態中係對應卡盤的空腔對齊特徵 結構610,及對應第从㈣圓例示說明之測試單元刪且態 中的類似卡_2之空腔對齊特徵結構⑽。定位盤對齊特 微結構51G可為機械特徵結構，諸如延伸部或嵌合其中之容 座’及如此綱空腔對齊特徵結構_及⑽而後二者可為 26 ⑤ 201140088 機械容座或延伸部。 第5B圖所示定位殽 供舉例說明之用，可有^特徵結構51G之數目及位置僅 ^ ’夕於或少於三個定位盤對齊特徵結 構510，其可在與第 式。於若干實施例，定位f圖所示不同位置及/或不同樣 ^ 位盤對齊特徵結構510之數目及位置 可為诸如在三度空間 ^ . “度自由度，或另外，在大致平行 疋位盤502之承載表面 ,n 4千面以三度自由度，動態對齊定 位盤載具500在第6a β圖例示說明之對齊器104的卡盤 602及第8Α至9Β®例示朗在測試單元削巾的卡盤顧。 士第5Α及5(：圖例不說明，升降機耦聯機構512可設置 在定位盤502對側表面5Q8上或内。如後文瞭解，升降機搞 聯機構512可耗接如第6AJ_7B圖例示說明之對齊器⑽的 ^降機618及如第8Α·圖例示說明在測試單元ιι〇中的 疋位盤升降機818。升降機輕聯機構512及升降機618可具有 相似互鎖的不規則形狀’其係將定位盤5Q2定位於特定方向。 如第5A至5C圖例示說明之定位盤載具5〇〇僅供舉例說 明之用。如此，例如500無需含括如第5八至5(：圖例示說明 之全部特徵結構或元件；定位盤載具500可具有未顯示於第 5A至5C圖之額外特徵結構或元件；及定位盤載具5〇〇可具 有與如第5A至5C圖例示說明者不同的特徵結構或元件。舉 例言之，如第5C圖所示，定位盤載具500可包括一或多個溫 度控制裝置210(說明見前文）。另外，定位盤載具5〇〇可不包 括溫度控制裝置210。至於另一實例，定位盤載具5〇〇可包 括一蓋及密封機構（圖中未顯示），其可提供環繞131111 112的 27 201140088 自谷式潔淨室環境。至於又另一實例，DUT112可藉其它類 型夾緊機構諸如機械夾具等而夾緊至定位盤5〇2之承載表 面504。如此真空槽506可以其它類型夾緊機構置換。 第6A至6B圖例示說明依據本發明之若干實施例，可用 來將DUT 112在定位盤載具500上對齊的對齊器1〇4組態實 例。第6A圖之切出部600顯示對齊器1〇4之内側部分。如圖 所示，第6A至6B圖之對齊器104可包括具有接取門122之殼 體302 ’大致如前文就第3圖討論。對齊器1〇4也可包括一或 多個攝影機304、附有攝影機對齊特徵結構312的攝影機座 310,及用以移動攝影機座31〇之一移動機構314，大致如前 文就第3圖討論。第6A至6B圖之對齊器1〇4可包括控制器 408及記憶體316，大致如前文就第3圖討論。但與第3圖相 異，第6A至6B圖例示說明之對齊器1〇4可包括一平台616、 一升降機618及一活動式卡盤602,其可為第3圖之移動機構 3 06實例。 如第6A及6B圖所示，卡盤602可具有一上表面6〇4，及 上表面604有一空腔606其中可置放定位盤載具5〇〇。空腔 6〇6之下表面608可具有空腔對齊特徵結構61〇，其如前文討 淪可對應定位盤502之定位盤對齊特徵結構51〇。空腔6〇6可 具有約略等於定位盤502厚度Tp之深度D，使得如第73圖例 示說明’當疋位盤對齊特徵結構輕接空腔對齊特徵結構 610時，卡盤602之上表面604與定位盤502之承載表面5〇4為 實質上（亦即近似）共面。若DUT 112當設置於上表面6〇4與 承載表面504二者上在對齊器1〇4接受對齊時並未受損或破 ⑤ 201140088 損，則上表面604與承載表面504係實質上共面。另外，定 位盤502之承載表面504、卡盤6〇2之上表面6〇4、空腔6〇6之 下表面608及/或定位盤對齊特徵結構51〇中之一或多者可 於附圖中在「ζ」方向充分隨形服貼（例如可撓性），來允許 上表面604及/或承載表面5〇4移動因而上表面6〇4與承載表 面504實質上共面。 也如第6Α及6Β圖所示，在卡盤6〇2上表面6〇4可有一或 夕個真空槽614。機構（圖中未顯示）及其它設備（圖中未顯示） 可選擇性地設置來在真空槽614形成、保持與解除真空。此 等機構（圖中未顯示）可包括一或多個連結喷嘴（圖中未顯 示），及從喷嘴（®中未顯示）至真空槽614的通道^槽㈣的 真空可將DUT 112在上表面604上夾緊定位，及解除真空可 釋放DUT 112,使得DUT 112可在上表面6〇4上移動或移 開。第6八細圖所示真空槽614之數目、形狀及/或樣式僅 為一例且可為與所示不同者。 也如第6A及6B圖例示說明，卡盤6〇2可具有卡盤對齊 特徵結構㈣其可_攝影機脑G之攝影機賴特徵結構 2田載具對齊特徵結構118係如前文就第3圖之攝影機對 齊特徵結構312所述時，卡盤對齊特徵結構620之結構上及 功能上可與載具對齊特徵結構118相同或相似。舉例言之， 卡盤對齊特徵結構62〇可相對於空腔對齊特徵結構_免置 盤〇2上{吏得卡盤對齊特徵結構係在相對於定位 盤5〇2的已知位置’同時定位盤對齊特徵結構則係搞接空 腔對齊特徵結構610。然後，當攝影機對齊特徵結構312係 29 201140088 耦接卡盤對齊特徵結構620,攝影機304係相對於定位盤502 在已知位置，其位置及方向可藉定位盤對齊特徵結構510及 空腔對齊特徵結構610定義。 升降機618可為移動機構，其可將定位盤5〇2移進及移 出二腔606。如所瞭解，定位盤5〇2的升降機轉聯機構512及 升降機618可具有類似的互鎖不規則形狀，其將定位盤502 定向於特定方向。卡盤602可為活動式平台’例如可於「x，y」 平面方向移動及環繞rz」軸旋轉。平台616可包括傳動機 構（圖中未顯示）用以致動及/或控制升降機618及卡盤602。 第7Α及7Β圖例示說明在對齊器1〇4内帶有DUT 112/定 位盤載具500之第6八及昍圖的對齊器1〇4。如圖所示定位 盤502可配置在升降機618上（例如升降機618可如圖所示而 耦聯升降機耦聯機構512)，及升降機618可將定位盤5〇2移 進（第7B圖）與移出（第7八圖）卡盤6〇2上的空腔6〇6。雖然圖中 未顯示，可設置導引機構(例如類似導引機構318)用以將定 位盤502置於對齊器1〇4於初始粗略方向，使得當升降機618 移動定位盤502進入空腔606時，例如定位盤對齊特徵結構 510係粗略地但充分地對齊空腔對齊特徵結構6丨〇來耦聯 之。舉例s之，大致上如前文瞭解，升降機耦聯機構512及 升降機618可具有相似的互鎖不規則形狀，其定向定位盤 502使得當定位盤502耦聯升降機618時，定位盤5〇2及因而 疋位盤對齊特徵結構510係以粗略初始方向定向。升降機柄 聯機構512及升降機618如此可為第3圖導引機構318之實例。 移動機構314可移動攝影機座31〇，使得攝影機對齊特 ⑤ 30 201140088 徵結構M2係移進(第则）與移圖成接卡盤對齊特 徵結構620。如前述，當枝盤對齊特徵結構5iq與空腔對 齊特徵結構6_接及攝影機對齊特徵結構3㈣卡盤對齊 特徵結構6_接時(如第7B圖所示），攝影機_與定位盤 對齊特徵結構510係相對於彼此位在已知位置。 如前述，對齊器顺無需包括攝影機綱耗接載具對齊 ’徵結構118的特徵結構(例如攝影機對齊特徵結構⑽。舉 例言之’攝影機304可安裝在殼體地或殼體3_的其它結 構(圖中未顯示）。此種情況下，攝影機3G4相對於載具對齊 特徵結構118的位置可能非已知’而攝影機綱可拍攝贿 ^齊特徵結構m(例如終端114中之一者）及載具對齊特徵 冓118一者的影像’及該等影像可由控制器(及/或操作 人員）用來將DUT 112移動至載具116上的對齊位置。 *如前文瞭解，DUT 112可藉由在真空槽形成或解除 a而夾緊至定位盤502之承載表面5〇4及從該表面的夾緊 釋故。同理，DUT 112可藉由在真空槽614形成或解除真空 而爽緊至卡盤602之上表面604及從該表面的夾緊釋放。當 爽緊至卡盤602之上表面604及從定位盤502之承載表面5〇4 釋故，卡盤602可相對於定位盤502移動DUT 112來相對於定 位盤斟齊特徵結構510定位DUT對齊特徵結構212，對齊特 徵結構510可為第2A及2B圖之載具對齊特徵結構118的相 當物。如此卡盤將DUT 112移動至定位盤載具500上的對 位置。 第6A至7B圖所示對齊器1〇4之組態僅供舉例說明之 31 201140088 用。如此，例如對齊器104無需包括如第6A至糊例示說 明的全部特徵結構或元件；對齊器刚可具有未顯示於第从 至7B圖的額外特徵結構或元件；及對齊器刚可具有與第 6A至7BH所示不_特徵結構或元件。舉财之大致如 前文就第3圖討論’對齊器1〇4無需包括攝影機對齊特徵結 構312、攝影機座310或移動機構3M(例如攝影機3〇4可架設 在殼體3G2或殼體302内的其它結構(圖中未顯示)）^此種情 況下，卡盤602無需包括卡盤對齊特徵結構62〇。至於另一 實例，雖然顯示二攝影機3 〇4，但另外可只有一部攝影機3 〇4 或多於兩部攝影機3〇4。至於又另一實例，不含〇1^ U2之 定位盤502可初始配置在空腔6〇6(例如帶有定位盤對齊特 徵結構510耦接空腔對齊特徵結構61〇)，及〇11丁 112隨後藉 由插入對齊器104而置放在定位盤502承載表面504上及卡 盤602之上表面604上。至於又另一實例，DUT 112可藉其它 類型夾緊機構諸如機械夾具、靜電夾具等而夾緊至卡盤6〇2 之上表面604。真空槽614可以另一型夾緊機構置換。至於 另一實例’活動式升降機U〇2及/或平台1104可以用以將 DUT 112相對於膜載具1000移動的其它型移動機構置換。舉 例言之，馬達傳動平台或卡盤等可置換活動式升降機11〇2 及/或平台1104。至於另一實例，用以選擇性地導引空氣喷 射在DUT 112部分而在膜載具1〇〇〇之承載表面1〇〇4上移動 DUT 112之設備可置換升降機11〇2及/或平台11〇4。至於又 另一實例，用以選擇性地形成將DUT 112在承載表面1〇〇4 上移動的靜電荷之設備可置換升降機1102及/或平台11〇4。 ⑤ 32 201140088 前述升降機1102及/或平台1104之置換物的全部實例可為第 3圖之移動機構306之實例。 第8A及8B圖例示說明依據本發明之若干實施例，可用 來測試DUT 112/定位盤載具500之組合之一種測試單元110 組態實例。第8A圖之切出部800顯示測試單元110之内側部 分。如圖所示，第8A及8B圖之測試單元110可包括具有接 取門124之一殼體402，大致上如前文就第4A及4B圖討論。 測試單元110也包括電連結404、具有探針410之接觸器 408 '接觸器對齊特徵結構412、封414及壓力控制器裝置 416，大致上如前文就第4A及4B圖討論。第8A及8B圖之測 試單元110也包括如前文就第4A及4B圖討論的控制器418 及記憶體420。但與第4A及4B圖不同，第8A及8B圖所示測 試單元110也包括卡盤802、卡盤升降機816及定位盤升降機 818，其可為第4A及4B圖之升降機406實例》 卡盤802可類似卡盤6 〇 2且可具有相似元件及特徵結 構。舉例言之，如圖所示，卡盤8〇2具有上表面8〇4，及其 可具有定位盤載具500可置放其中的在上表面8〇4之一空腔 806。空腔806可具有空腔對齊特徵結構81〇，其可對應於及 耗接定位盤502之定位盤對齊特徵結構51〇。空腔8〇6可具有 約略等於定位盤502厚度Tp之深度D，大致上如第9B圖例示 忒明，當定位盤對齊特徵結構51〇耦接空腔對齊特徵結構 810時’卡盤802之上表面8〇4與定位盤5〇2之承載表面5〇4為 實質上（亦即近似）共面。若DUT 112當設置於上表面8〇4與 承載表面504二者上當接觸探針41㈣並未受損或破損，則 33 201140088 上表面804與承載表面504係實質上共面。 也如第8A及8B圖所示，在卡盤8〇2之上表面8〇4可有一 或多個真空槽814。可選擇j生地提供機構（圖中未顯示）及其 匕"又備（圖中未顯示）來在真空槽814形成保持與解除真 二。此等機構（圖中未顯示）可包括一或多個連結喷嘴（圖中 未顯不）’及從喷嘴（圖中未顯示）至真空槽814的通道。槽814 的真空可將DUT 112在上表面804上夾緊定位，及解除真空 可從上表面804釋放DUT 112。第8八及肋圖所示真空槽814 之數目、形狀及/或樣式僅為一例且可有與所示不同者。 也如第8A及8B圖所例示說明，卡盤8〇2可具有卡盤對 齊特徵結構820’其可綱接觸器對齊特徵結構412。卡盤 對齊特徵結構82〇於結構上及魏上可與前城第从及犯 圖所述载具對齊特徵結構118相同或類似。舉例言之，卡盤 對齊特徵結構820可相對於空腔對齊特徵結構⑽定位在卡 盤8〇2上，使得當定位盤對齊特徵結構510耦接空腔對齊特 '、’構810時，卡盤對齊特徵結構82〇相對於定位盤$⑽係在 置如刖文瞭解，探針410可位在相對於接觸器對齊 特徵結構412及空腔對齊特徵結構⑽的已知位置；及贿 對背特徵結構212，及如此謝112之終端ιΐ4，係在對齊器 =4相對於定位盤對齊特徵結構$職齊已知位置。如此， 接觸器對齊特徵結構犯搞接卡盤對齊特徵結構㈣而定 位盤對齊特徵結構51喻接空腔對齊特徵結構⑽時，探 410對齊終端114。 升降機818可為將定位㈣2移域移出空賴6之移 34 201140088 動機構。卡盤升降機816可移動卡盤8〇2及如此，而移動卡 盤對齊特徵結構802移進與移出與接觸器對齊特徵結構412 的耦聯。 第9A及9B圖例示說明第8 A及8B圖所例示說明之測試 單元110，具有DUT 112/定位盤載具5〇〇之組合在測試單元 110。升降機818可類似前述升降機618。換言之，定位盤502 可配置在升降機818(例如如圖所示，升降機818可耦接升降 機耦聯機構512)，及升降機818可將定位盤502移進(類似第 7B圖）及移出（類似第7A圖）卡盤802的空腔806。雖然圖中未 顯示，但可設置導引機構(例如類似導引機構422)用以將定 位盤502置於測試單元110於初始粗略方向，使得當升降機 818移動定位盤502進入空腔806時，例如定位盤對齊特徵結 構510係粗略地但充分地對齊空腔對齊特徵結構81〇來輕聯 之。舉例言之，升降機耦聯機構512及升降機818可具有相 似的互鎖不規則形狀’其定向定位盤502使得當定位盤502 麵聯升降機818時’定位盤502及因而定位盤對齊特徵結構 510係以粗略初始方向定向。升降機耦聯機構512及升降機 818如此可為第4圖導引機構422之實例。此等導引機構（圖 中未顯示)之其它實例可包括導轨(圖中未顯示）等。 卡盤升降機816可移動卡盤802，使得卡盤對齊特徵結 構820可移開與接觸器對齊特徵結構412的輕聯，如第9A圖 所示。卡盤升降機816也可移動卡盤802，使得卡盤對齊特 徵結構820可移進與接觸器對齊特徵結構412的耦聯，如第 9B圖所示。如前文瞭解，壓力控制器416可增或減接觸器4〇8 35 201140088 與DUT 112間之氣壓。 如刖文瞭解’藉由形成或解除真空槽506的真空，DUT 112可炎緊與解除爽緊定位盤502之承載表面504 。同理，藉 由形成或解除真空槽814的真空，DUT 112可夾緊與解除夾 緊定位盤802之上表面8〇4。 第8A至9B圖例示說明之測試單元丨1〇組態僅為其中— 實例。如此，例如測試單元110無需包括第8A至9B圖例示 說明之全部特徵結構或元件；測試單元110可具有未顯示於 第8A至9B圖之額外特徵結構或元件；及測試單元11〇可具 有與第8A至9B圖所示者不同的特徵結構或元件。舉例言 之，DUT 112可藉其它類型夾緊機構諸如機械式夾具等而夹 緊至卡盤802之上表面804。真空槽814如此可以另一型夾緊 機構置換。至於另一實例，測試單元110無需包括壓力控制 器416或封414。 第10A及10B圖例示說明載具116實施例呈膜載具1〇〇〇 形式之一實例。第11A及11B圖例示說明組配用於膜載具 1000之對齊器104之一實施例，及第12A及12B圖例示說明 組配用於膜載具1000之測試單元110之一實施例。 如前述，第10A及10B圖之膜載具1〇〇〇為依據本發明之 若干實施例之載具116實例。如此，膜載具1〇〇〇可在第14B 圖中之任一者及該等圖式之前文討論中置換載具116。此 外’膜載具1000可包括此處就載具116討論之特徵或變化’ 即便並未就膜載具1000特別陳述亦如此。 如圖所示，膜載具可包含一膜基板1002 ’其具有 36 ⑤ 201140088 可放置DUT 112(第10A及10B圖中虛線顯示）於其上之承載 表面1004。膜基板1002可包含基板(例如一塊材料）等。舉例 言之，膜基板1002可包含可包含一金屬板 '陶瓷板等。於 若干實施例’膜基板1002厚度7^可等於或小於DUT 112厚 度TD。舉例言之，厚度τΜ可為90%、80%、70%、60%、50%、 40%或小於DUT 112厚度TD。另外，厚度TM可為厚度凡的 不同百分比，或厚度1^可等於或大於厚度TD。膜基板1〇〇2 厚度TM可為相當小，允許比較有較大值的載具116,膜載具 5〇〇具有較小尺寸及/或熱質量。如此膜載具1〇〇〇可較小可 於若干實施例提供優點，諸如減低製造成本及減低熱質量。 一或多個真空槽1〇〇6可設置於承載表面1〇〇4。可選擇 性地提供機構（圖中未顯示）及其它設備（圖中未顯示）來在 真空槽1004形成、保持與解除真空。此等機構(圖中未顯示） 可包括一或多個連結噴嘴（圖中未顯示），及從噴嘴（圖中未 顯示）至真空槽1006的通道。槽1〇〇6的真空可將DUT 112在 承載表面1004上夾緊定位，及解除真空可從承載表面1〇〇4 釋放DUT 112使得DUT 112可在承載表面1004上移動。如 此’真空槽1006及相關聯之用以形成與解除真空機構可為 第2A及2B圖之夾緊機構2〇8之實例。膜基板1〇〇2另外可包 括不室型夾緊機構，諸如機械式夾具等。第10A及10B圖所 示真空槽1006之數目、形狀及/或樣式僅為一例且可有與所 示不同者。 如圖所示，膜基板1002之承載表面1004可大於DUT 112 尺寸。也如圖所示，膜基板1002可包括諸如前文討論之載 37 201140088 具對齊特徵結構118。載具對齊特徵結構us可配置在其上 設置DUT 112的承載表面1〇〇4該區外側》膜基板1〇〇2也可包 括升降機孔1008,其係配置在其上設置DUT 112的承載表面 1004該區内部。如後文將瞭解’升降機孔1〇〇8可允許活動 式升降機1102(參考第11A及11B圖）通過膜基板1〇〇2而將 DUT 112舉升離膜基板1002的承載表面11 〇4。也如後文將瞭 解，升降機孔1008可大於活動式升降機11〇2，其允許活動 式升降機1102，及如此允許DUT 112，相對於膜基板1〇〇2 於「X，y平面移動及環繞「z」軸旋轉。當然升降機孔升降機 孔1008與活動式升降機1102之尺寸差異愈大，則活動式升 降機1102相對於膜基板1002可移動之距離愈大。於若干實 施例’各個升降機孔1008可為活動式升降機11〇2尺寸之 1·25、1.5、1.75、2.8或更多倍。 如第10Α及10Β圖所示膜載具1〇〇〇僅為一實例。如此例 如’膜載具1000無需包括第10Α及10Β圖所示全部特徵結構 或元件；膜載具1000可具有未顯示於第10Α及10Β圖之額外 特徵結構或元件；及膜載具1000可具有與第10Α及10Β圖所 示者不同的特徵結構或元件。舉例言之，如第10Β圖所示， 膜載具1000可包括一或多個溫度控制裝置21〇(已如前文說 明）。另外’膜載具1000不包括溫度控制裝置210。至於另 —實例，膜載具1000包括一蓋及密封機構（圖中未顯示），其 可提供環繞DUT 112之自容式潔淨室環境。至於又另一實 例’ DUT 112可藉其它型夾緊機構，諸如機械式夾具等而夾 緊至骐基板1002之承載表面1〇〇4。如此，真空槽1〇〇6可以 ⑤ 38 201140088 另一型夾緊機構置換。至於又另一實例，升降機孔1008及/ 或載具對齊特徵結構118之數目、配置及樣式可與如第i〇A 及10B圖所示者不同。 第11A及11B圖顯示依據本發明之若干實施例，可用來 在膜載具1000上對齊DUT 112之對齊器104組態實例。如圖 所示，第11A及11B圖之對齊器1〇4可包括具有接取門122之 一殼體302，大致上如前文就第3圖討論。對齊器1〇4也可包 括一或多個攝影機304、具有攝影機對齊特徵結構312之攝 影機座310，及用以移動攝影機座310之移動機構314，也大 致上如前文就第3圖討論。第11A及1B圖之對齊器1〇4也包 括控制器308及記憶體316 ’大致上如前文就第3圖討論。但 與第3圖相異，第11A及11B圖例示說明之對齊器1〇4實施例 可包括平台1104及活動式升降機11〇2，其可為第3圖之移動 機構306之實例。 如第11A及11B圖所示，平台11〇4可固定膜載具1〇〇〇。 如此，膜載具1000放置在平台1104上，如第ha圖所示，使 得活動式升降機1102從平台1104延伸進入或貫穿膜載具 1000的升降機孔1008，也如第11A圖所示。（第11A圖中，升 降機孔1008係以虛線顯示，原因在於升降機孔升降機孔 1008於第11A及11B圖所示視圖可為内側膜基板励2 ;屬於 内側升降機孔1008的活動式升降機11〇2部分也以虛線顯 示。）如前文瞭解’藉由形成或解除真空槽的真空，DUT 112可夾緊至及從膜基板1002之承栽表面1〇〇4解除夾緊。 平台1104可包括用以沿「z」軸（其可垂直膜基板1〇〇2 39 201140088 之承載表面1004，如圖所示）移動活動式升降機1102之機構 (圖中未顯示），及如此舉升DUT 112離開承載表面1004，如 第11B圖所示。平台11〇4可包括用以於「x，y」平面（其可平 行膜基板1002之承載表面1004，如圖所示）移動活動式升降 機1102及/或環繞「z」軸旋轉活動式升降機11〇2之機構（圖 中未顯示）。如前文討論’直至膜基板1002的升降機孔1008 係大於活動式升降機1102的程度，如此，平台11 〇4可相對 於膜基板1002於「x，y」平面移動DUT 112及/或環繞「z」軸 旋轉DUT 112。藉由重複如下說明二次或更多次，DUT 112 可相對於膜基板1002移動大於升降機孔1〇〇8與活動式升降 機1102間之大小差異的距離：活動式升降機11〇2在升降機 孔1008内部第一位置’舉升DUT 112離開膜基板1002之承載 表面1004，相對於膜基板1002移動活動式升降機1102(及如 此而移動DUT 112)，將DUT 112降回至承載表面1004上， 及將活動式升降機丨1〇2移回至升降機孔1〇〇8内部第一位 置。如此’當真空槽1006無真空而如此DUT U2從膜基板 1002之承載表面1〇〇4解除夾緊時，平台1104可藉由移動活 動式升降機1102而將DUT 112移動至膜基板1002之承載表 面1004上相對於載具對齊特徵結構118的對齊位置。 如第UA及UB圖所示，移動機構314可將攝影機座31〇 之攝影機對齊特徵結構312移進與移出與載具對齊特徵結 構118的機械輕聯。大致如前文上討論，攝影機304可在相 對於攝影機對齊特徵結構312的已知位置，如此，當攝影機 對齊特徵，％構312㈣具對齊特徵結構118搞聯時 ，攝影機 40 ⑤ 201140088 304也與載具對齊特徵結構118對齊。如此，藉攝影機取拍 攝的DUT對背特徵結構如前文討論，可為終端1丨4部分) 之影像可用來將可用以將DUT 112移動至膜基板臟之承 載表面1004的對齊位置。 如前文瞭解，對齊器1〇4無需包括攝影機304耦接載具 對齊特徵結構118之特徵結構（例如攝影機對齊特徵結構 312)。舉例言之，攝影機304可安裝於殼體302或殼體302的 其它結構(圖中未顯示）。此種情況下，攝影機3G4位置可能 並非相對於載具對齊特徵結構⑽為已知，及攝影機304可 拍攝DUT對齊特徵結構212(例如終端114中之-者）及載具 對齊特徵結構118二者影像，及料影像可由控制器3〇8(及 /或操作人員）用來將DUT 112移動至載具116上的對齊位 至於另貫例，攝影機304可位在相對於對齊特徵结構 118及位在殼體302内但未直接耦聯攝影機304的夾具（圖中 未顯示）或類似裝置之對齊特徵結構（圖中未顯示，但可為例 如攝影機對齊特徵結構犯)的已知位置。夹緊機構或其它 裝置（圖中未顯示）之該等對齊特徵結構（圖中未顯示）可耦 聯載具對齊特徵結構118，及因而將膜載具1〇〇〇移動至一位 置，其中載具對齊特徵結構118係位在相對於攝影機3〇4的 已知位置。 第ΠΑ及11B圖所示對齊器104之組態僅為其中一實 例。如此例如，對齊器1〇4無需包括第11A及11B圖例示說 明之全部特徵結構或元件；對齊器104可具有未顯示於第 11A及11B圖之額外特徵結構或元件；及對齊器1〇4可具有 41 201140088 與第11A及11B圖所示不同的特徵結構或元件。舉例言之， 大致上如前文就第3圖討論’對齊器1〇4無需包括攝影機對 齊特徵結構312、攝影機座310或移動機構314(例如攝影機 304可架設在殼體302或殼體302内的其它結構（圖中未顯 示））。舉另一實例’如前文討論，在殼體302内可有機械耦 聯機構（圖中未顯示）’其係機械式耦接118及藉此移動膜載 具1000進入相對攝影機304的預定位置。至於另一實例，雖 然顯示二攝影機304，但另外可只有一部攝影機3〇4或多於 兩部攝影機304。至於又另一實例，可具有比第HA及iiB 圖所示更多或更少的活動式升降機1102，及活動式升降機 1102可配置在與第11A及11B圖所示者不同位置或樣式。201140088 VI. Description of the invention: [Rhyme ^Ming Hu Jin is now _ control _ winter good mussel] Reference cross-application request for the US provisional patent application No. 61/291,826 application on December 31, 2009 (agent file No. P352_pRV) and US Provisional Patent Application No. 61/295,945 is filed on January 18, 2010 (agent number P352-PRV2). The above-mentioned U.S. Provisional Patent Application Serial No. 61/291,826, the entire entire entire entire entire entire entire entire entire entire entire entire FIELD OF THE INVENTION The present invention relates to the green and method of riding a heart test electronic device. L. Prior to the invention background, it is necessary to read the new electronic device to verify the proper operation of the device, the operation capability of the device, and the like. A contactor device comprising a conductive probe can be used to achieve a temporary electrical connection to the terminal of the device, and the test signal can be provided back and forth through the probe. Testing of the device may include, for example, functional operation of the device, such as measuring the operating parameters (e.g., speed) of the device, stressing the device to stimulate the extended operation of the device, and the like. Testing of such an electronic device can increase the manufacturing cost of such an electronic U. Such a preference is to improve the testing efficiency of the electronic device by simplifying the test, improving the automation and/or degree of parallelism and/or the like. SUMMARY OF THE INVENTION 201140088 In several embodiments, a device under test (DUT) can be tested in a test system that includes an aligner and a plurality of test cells. The device under test can be set and clamped in one of the aligned positions on the aligner's carrier. In the aligned position, the conductive termination of the device under test can be at a predetermined location relative to the carrier aligning feature of the carrier. When the device under test is clamped to the aligned position on the carrier, the carrier can be moved to the test unit, which can include a contactor having a conductive probe and a carrier alignment feature. Carrier Alignment Features of the Carrier A contactor alignment feature of the mechanically coupled contactor that aligns the end of the device under test with the probe of the contactor. The device under test can then be tested in the test unit. In some embodiments of the invention, a device under test system can include an aligner, a test unit, and a mover. The aligner can include a movement mechanism that positions the device under test in an aligned position on the carrier, wherein the conductive termination of the device under test is in a predetermined position relative to the carrier alignment feature of the carrier. Each test unit includes a contactor having a conductive probe and contactor alignment features. The carrier alignment feature of the carrier is mechanically coupled to the contactor alignment feature of the contactor to align the terminal of the device under test with the probe of the contactor. The mover can include a robotic mechanism that is configured to move the carrier having the device under test in the aligned position from the aligner to one of the test units. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows an example of a test system for a device under test in accordance with several embodiments of the present invention. 201140088 Figure 2A shows a top view of a vehicle and a device under test that can be used in the test device test system of Figure 1 in accordance with an embodiment of the present invention. Figure 2B shows a side view of the carrier and the device under test in Figure 2A. Figure 3 is a diagram showing an example of an aligner of a test system of a device under test according to Figure 1 of several embodiments of the present invention. 4A and 4B are side views showing an example of a test unit of the test apparatus test system according to Fig. 1 of several embodiments of the present invention. Figure 5A shows a top view of a locating disc carrier, which may be an example of a carrier test system for a device under test according to Figure 1 of several embodiments of the present invention. Figure 5B shows a bottom view of the locating disc carrier of Figure 5A. Figure 5C shows a cross-sectional side view of the locating disc carrier of Figure 5A. Fig. 6A is a top plan view showing an example of an aligner of the device under test system of Fig. 1 in accordance with several embodiments of the present invention, which aligns the device under test on the locator disk carrier. Figure 6B shows a cross-sectional side view of the aligner of Figure 6A. Figures 7A and 7B show an example of a locating disc carrier that loads a device under test to 5A through 5C in the aligners of Figs. 6A and 6B in accordance with several embodiments of the present invention. Fig. 8A is a top plan view showing an example of a test unit of a test device test system according to Fig. 1 of several embodiments of the present invention, which can test a device under test on a fixed disk carrier. Figure 8B shows a cross-sectional side view of the test unit of Figure 8A. Figures 9A and 9B show an example of loading a device under test on the locating disc carrier of Figures 5A through 5C to the 201140088 test unit of Figures 8A and 8B in accordance with several embodiments of the present invention. Figure 10A is a top, a / and top view of a film carrier, which may be carried out according to the first embodiment of the invention according to the first embodiment of the invention. With examples. Figure 10B shows the cross section of the 10th figure. 11A and 11B are diagrams showing a singularity of a test device test system according to several embodiments of the present invention, a side view of a poorly-formed patient, which can be aligned on a film carrier on. 12A and 12B are side views of an example of a test unit of a test device test system according to several embodiments of the present invention, which may be a device under test on a film carrier. Figure 13 shows an example of a method for testing a device under test in the device under test of the device of Figure i in accordance with several embodiments of the present invention. Figure 14 shows an example of a method for aligning a device under test and a carrier in the aligner of the device under test of the device under test in accordance with some embodiments of the present invention. Figure 15 shows an example of a method for testing a device under test in the device under test of Figure 1 in accordance with several embodiments of the present invention. Figure 16 shows an example of a method for post-testing processing for a device under test in accordance with several embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present specification describes specific embodiments and applications of the present invention. However, the invention is not limited to such scented embodiments and applications, or the specific embodiments and application operations or methods described herein. In addition, the drawings show a simplified view or a partial view of 201140088, and the dimensions of the components within the drawings may be exaggerated or otherwise unbalanced. In addition, when the term "on", "attached to" or "coupled to" is used herein, an object (eg, a material, a layer, a substrate, etc.) may be "on it", " Attached to or "face to" another item: and with an item directly on it, attached to or from _ to another item, = one or more intervening items in the - item and another - Objects are independent of each other. If provided, there are directions (such as top, bottom, top, bottom, side, up, down, above, below), higher, lower, horizontal, vertical, "X", "y", "z And so on, the directions are relative directions, and are provided for illustrative purposes only and for the sake of convenience of the discussion, which is by no means limiting, and when referring to a series of elements (eg, elements a, b, 〇, such The description refers to any of the elements listed in the intent L, less than any combination of all of the listed elements, and/or all combinations of the listed elements. Figure 1 shows several practical uses in accordance with the present invention. To test an example of a multi-test device test system of the device under test m. As shown, the multi-test device test system 100 can include an I-carrier 102, an aligner 1 及 4 and a mover 106, and a test unit. The test unit can then be a consistent example of one of the test units 1 8. Thus, the test unit 108 includes a plurality (eg, 2, 3, 4, 5, 10, 20 or more) of test units 11 〇. 1〇4 may include one or more access gates 122, and the test unit 11〇 may include one or more Access door 124. The DUT can be the head of the device under test, DUTU2 can be loaded into the loader 102 and placed on the carrier 116, examples of which are shown in Figures 2 and 26. The DUT 112 is in the vehicle. The position on 116 can be adjusted at aligner 1〇4 such that the input and/or output terminal 114 of the 7201140088 DUT 112 is aligned with respect to the carrier alignment feature 118 on the carrier 116 (see Figures 2A and 2B). The DUT 112 aligned on the carrier 116 can then be placed in the test unit 11A, examples of which are illustrated in Figures 4A and 4B. The test unit 11 can include a position at a predetermined position relative to the conductive probe 410. The contactor is aligned with the contactor 408 of the feature 412. The carrier alignment feature 118 on the carrier 116 can be mechanically coupled to the contactor alignment feature 412 within the test unit 110, which can cause the probe 410 of the contactor 408 Fully aligning the DUT 112 terminal 114 is sufficient for the probe 41 to make physical contact with the terminal 114 and thereby establish an electrical connection between the probe 41 and the terminal 114. Then, the s type s can be measured back and forth via the contactor Provided to the DUT 112 to test the DUT 112. Tested The DUT 112 can then be removed from the test unit 110 and, ultimately, removed from the multi-test device test system, such as through the loader 102. The mover 106 can include one or more robotic arms 120 that surround the multi-test device test system The dut 112 and the DUT 112/carrier 116 are moved. As shown, the multi-device test system 1 can also include a controller 126 and a memory 128. The DUT 112 can include input and/or output. One or more electronic devices of the terminal 114. For example, the 'DUT 112 can be a semiconductor wafer containing un-singulated semiconductor dies. As another example, the DUT 112 can include a singulated die (either packaged or unpackaged to yet another example) disposed on or in the mount. The DUT 112 can be other types of electronic devices disposed on or in the mount. As shown in Figures 2A and 2B, DUT 112 may also include one or more DUT alignment features 212 located at known locations relative to terminal 114. In several embodiments, DUT alignment feature 212 may include terminal 114. In other words, or more than 201140088. For example, the DUT alignment feature 212 can include one or more edges or corners of the plurality of terminals 114. In the illustrated example, the alignment feature 212 corresponds to the terminal. One or more of 114, and thus the separate alignment features 212 are not illustrated. However, as will be appreciated, the alignment features 212 can additionally be separate marks, edges, corners, and/or structures on the DUT 112 ( Not shown in the drawing) and/or a DUT mount (not shown) located at an offset position from one of the terminals 114. As shown, in some embodiments '0!1' 112 may have a positioning mark 132. The embodiment 'positioning tag 132 can be an irregular portion of the edge 130 of the DUT 112. As noted, the DUT 112 can be a semiconductor wafer and the alignment mark 132 can be a trimmed portion of the edge of the wafer. The illustrated butt 112 is only one example, and the DUT 112 may be different from the one shown. For example, the DUT U2 may be other shapes. As another example, the DUT 112 need not include all of the features shown (eg, The DUT 112 may be missing the alignment feature 212 and/or the orientation marker 132). As yet another example, the DUT 112 may have an orientation marker 132 that is different than shown, and may have more than one orientation marker 132. For example, DUT 112 may have additional features not shown in the figures. As yet another example, there may be more or fewer terminals 114 in the comparison graph, loader 102 may include a device that can accept dut 112. In other words, if the DUT 112 is a semiconductor wafer containing semiconductor dies, the loader 1 〇 2 can include devices that accept such wafers. For example, the loader 1 〇 2 can include a robotic arm handle such as is known in the art. As for another reality For example, the loader 1〇2 may include one or more EFEMs (Device Front End Modules) as known in the industry. Although such as 201140088, the 'DUT 112 may be placed on the carrier 116 within the loader 102, and the mover 106 The combination of DUT 112 and carrier 116 can be moved from loader 1〇2 to aligner 104 where DUT 112 can be aligned with carrier 116. Additionally, 112 can be placed on carrier 116 within aligner 104 and aligned vehicle. In this case, the mover 106 can move the DUT II 2 from the loader 1〇2 into the aligner 1〇4. The mover 106 can include a device that can wrap around the multi-device test system 1 to move the DUT 112, the carrier 116, and the DUT 112/carrier 116 combination. For example, the mover 106 can include one or more conveyors (not shown) and/or elevators (not shown) for moving the DUT 112, the carrier 116, and the DUT 112/carrier 116 combination. . As shown in FIG. 1, the mover 106 can also include one or more robotic arms 120, each of which can grip the DUT 112, the carrier 116, and the DUT 112/carrier 116 combination, and the DUT 112, carrier 116 And the DUT 112/carrier 116 is moved in or out of the loader 1, 2, the aligner 1 〇 4 and/or the test unit 110. Although not shown in the drawings, DUT 112 and/or carrier 116 (including any combination of carriers 116 disclosed herein) can include a handle (not shown) or other features that arm 120 can grip. structure. In accordance with several embodiments of the present invention, an example of carrier 116 is illustrated in Figures 2A and 2B. As shown, the carrier 116 can include a substrate 2〇2 (e.g., a block of material) having a carrier surface 204 on which the DUT 112 can be placed. Non-limiting examples of suitable carriers include metal or ceramic plates and the like. The thickness Tc of the substrate 202 may be greater than the thickness TD of the DUT 112 in several embodiments. For example, the thickness Tc can be 2, 5, 8, 9, 1 or more times the thickness TD of the DUT 112. Further, the thickness Tc may be equal to or smaller than the thickness Td. The clamping mechanism 208 can selectively release the DUT 112 such that the DUT 112 10 5 201140088 can move over the load bearing surface 204 and the clamping mechanism 2〇8 can selectively clamp the DUT 112 on the load bearing surface 204. Thus, when the clamping mechanism is in the released state, the DUTm is freely moved (or moved) on the bearing surface 2〇4. However, when the clamping mechanism 208 is in the clamped state, the clamping mechanism 2〇8 is The DUT 112 is held (or clamped) on the load bearing surface 204 such that the DUT 112 cannot be moved (or moved) on the load bearing surface 204. The clamping mechanism 2〇8 can be a mechanism suitable for selectively clamping and releasing the £171112. Non-limiting examples of the clamping mechanism 208 include one or more vacuum grooves (not shown) of the load bearing surface 2〇4, electrostatic mechanisms (such as clamps) (not shown), mechanical clamps (not shown) )Wait. The carrier 116 can include a carrier alignment feature 118 that can be coupled (e.g., mechanically) to a corresponding contactor alignment feature 412 within the test unit 11 (see Figures 4A and 4B). . When the carrier alignment feature 118 is coupled to the contactor alignment feature 412, the carrier 116 is positioned in a predetermined direction relative to the probe 410 of the contactor 408 within the test unit 110. Thus, the 'DUT 112 can be positioned on the carrier surface 204 such that when the DUT 112/carrier 116 combination is placed within the test unit 110, the terminal 114 of the DUT 112 is aligned and thus contacts and electrically couples the probe 410 of the contactor 408. As used herein, when the DUT 112 is positioned on the carrier 116 and the terminal 114 is positioned relative to the carrier alignment feature (eg, the carrier alignment feature 118), the DUT 112 is "aligned" to "aligned" Or "aligned with the carrier 116" such that when the carrier alignment feature (eg, 118) of the carrier 116 is a contactor alignment feature 412 of the mechanical coupling contact 408 (eg, as shown in FIG. 4B) When the terminal 114 of the DUT 112 and the probe 410 of the contactor 408 are fully aligned to make a 201140088 contact, and thereby establish an electrical connection between the terminal and the probe 410. The carrier alignment feature 118 can be a mechanical feature such as an extension that can be fitted to the person and such a pair of (4) sign structures 412, which can be mechanical receptacles. Additionally, the contactor alignment feature 412 can be an extension that can be mated into and so coupled to a corresponding carrier alignment feature 118, which can be a receptacle. In spite of this, the number and position of the carrier alignment features ι 8 shown in Figures 2A and 2B are for illustrative purposes only, and there may be more or less than three carrier alignment features 118, which may be located Different positions and/or different styles as shown in Figures 2 and 4. In several embodiments, the number and location of the carrier alignment features ι 8 can be, for example, six degrees of freedom, or alternatively, the carrier 116 and the contactor are dynamically aligned at a three degree of freedom in the plane of the substantially parallel DUT 112 terminal 114. 408. As used herein, the 'dynamic alignment' alignment is aligned using the least number of pairs of aligned features (each pair being a carrier alignment feature 丨 18 and a contactor alignment feature 412). For example, the two-dimensional plane is a 3-aligned feature pair, and the three-dimensional plane is a 6-aligned feature pair. The DUT 112 can be directly aligned with the carrier alignment feature 118, but in several embodiments the carrier 116 can include a misalignment alignment feature 206 at a known location relative to the carrier alignment feature 118, and the DUT 112 can be directly aligned. The bit alignment feature 206 and thus indirectly aligns the carrier alignment feature 118. The offset alignment feature 2〇6 is used for alignment optimization. For example, the 'bias alignment feature 206 can be a feature that is readily identifiable in the captured image of the carrier surface 204. As such, in several embodiments, the offset alignment feature 206 can include shapes, colors, patterns, and the like that are readily identifiable in the digitized image of the carrier surface 204 of the DUT 112. 12 5 201140088 As shown in FIG. 2B, the carrier 116 can include one or more temperature control devices 210. Temperature control device 210 can selectively adjust DUT 112 to and/or maintain DUT 112 at a desired temperature within a range of possible temperatures. Temperature control device 210 may, for example, comprise one or more heating devices and/or cooling devices. For example, temperature control device 210 can include one or more resistive heating elements (not shown), channels (not shown) in or on substrate 202, heating or cooling fluids (eg, liquids, gases, etc.) It can be circulated through these channels. In some embodiments, the temperature control device 210 can be self contained on the carrier 116. In other words, temperature control device 210 can operate for at least a period of time without being coupled to or forming part of carrier 116 and/or DUT 112. In other embodiments, the pair of temperature control devices 210 are not self-contained on the carrier 116, but instead are coupled to devices that are not part of or on the carrier 116 and/or the DUT 112 (eg, power supply, heating, or cooling). The fluid source is not shown in the figure). In several embodiments, the material and/or structure of substrate 2〇2 can be selected to assist in heating or cooling DUT 112. The carrier 116 as shown in Figures 2A and 2B is for illustrative purposes only. Thus, for example, carrier 116 need not include all of the features or elements as illustrated in Figures 2A &2B; carrier 116 may have additional features or elements not shown in Figures 2 and 2; and carrier 116 There may be different features or elements than those shown in Figures 2 and 2^. For example, as previously discussed, the device 116 need not include a misalignment alignment feature 2〇6. As another example, the carrier 116 need not include a temperature control device 21A. As yet another example, the implant 116 can include a cover (not shown) and a sealing mechanism (not shown) that provides a self-contained clean room environment surrounding the DUT 112. As for another example, one or more of the following devices or features may be included in several embodiments of the carrier 116: electric, pneumatic, hydraulic, and/or vacuum connectors, etc.; and/or one or Multiple sensors, electronic controllers, electronic memory devices, and/or other electronic circuits. An example of an aligner 104 is illustrated in Figure 3 in accordance with several embodiments of the present invention. As shown, the aligner 104 can include a housing 3〇2 that can include a pick-up door 122 through which the DUT 112, the carrier 116, and/or the DUT 112 and the carrier 116 are combined. Can be placed in the aligner 1〇4. For example, the housing 302 may be sufficiently sealed or sealable to provide a self-contained clean room enclosure when the access door 122 is closed. Aligner 104 can also include or be coupled to controller 308 and memory 316. Controller 308 can control all or part of the operation of aligner 104 and can operate in accordance with the code stored in memory 316 (defined below). Additionally or alternatively, the controller 308 can operate in whole or in part in accordance with a wired circuit. Controller 308 can be one or more of any of the types of controllers identified below for controller 126' and memory 316 can be one or more of any of the types of memory devices identified below for memory 128. By. As previously mentioned, the DUT 112 can be placed on the carrier 116 of the loader 1〇2 or the aligner 1〇4. The carrier 116 can be disposed on any of the retaining mechanisms or structures (not shown) of the aligner 104. For example, the carrier 116 may be disposed at the bottom of the housing 302 as shown in Fig. 3, a platform (not shown), and the like. The aligner 104 can include a mechanism 318 to guide the carrier 116 into a particular position and/or orientation of the aligner 104. For example, the guide mechanism 318 can include rails, recesses, stop structures, and/or the like that guide the carrier 116 into a rough position or orientation of the aligner 104. In several embodiments, the guide mechanism may include a guide rail (not shown) and a stop knot _ not shown. When the carrier is loaded into the housing of the loader, the guide rails (not shown) can guide the carrier ι16; and when the carrier 116 is attached to the desired position and/or side of the housing 3〇2, The structure (10) towel is not shown) can be stopped along the guide (four) towel > The movement of the carrier 116 is stopped. As shown in Fig. 3, the aligner 1 4 can include a moving mechanism pass that can be actuated to move the DUT 112 relative to the carrier 116. For example, mobile mechanism 306 can move but m without moving carrier 116; move carrier 116 without moving DUT 112; and/or independently move DUT 112 and carrier 116. The clamping mechanism 208 of the carrier 116 can release the DUT 112 such that the moving mechanism 3〇6 can move the DUT 112 over the carrier surface 204 of the substrate 202. Non-limiting examples of moving mechanism 306 include one or more motor drive platforms, piezoelectric platforms, piezoelectric step beam platforms, and the like. Examples of other moving mechanisms 306 include means for selectively directing air jets on portions of the DUT 112 for moving the DUT 112 relative to the carrier 116; for selectively forming electrostatic charges for use with respect to the implant 116 The device that moves the DUT 112; and so on. The aligner 104 can also include one or more cameras 304 that can capture one or more electronic (e.g., digital) images of the DUT 112 and/or the carrier 116. These images can be used to move the DUT 112 to an aligned position on the carrier 116. The user (not shown) can manually control the moving mechanism 306 to move the DUT 112 relative to the implant 116 until the alignment of the DUT 112 on the carrier 116. Additionally or alternatively, the controller 308 can receive images of the DUT 112 and/or the carrier U6 and can control the mover 306 to move the D\jt 112 relative to the carrier 116 (as discussed above) to move the DUT 112 to the carrier ι 16 Alignment bit 15 on 201140088. Moving the DUT 112 to the aligned position on the carrier 116 may involve more than one series of imaging DUT 112 and/or carrier 116 images, and then moving the DUT 112 on the carrier 116. Regardless of how the moving mechanism 306 is actuated to move the DUT 112 on the carrier 116, the clamping mechanism 208 can be in the aligned position 112 on the load bearing surface 204 once the DUT 112 is in the aligned position on the carrier 116. As shown in FIG. 3, the camera mount 310 of the camera alignment feature 312 in several embodiments may be coupled (eg, mechanically) to the carrier alignment feature 118 or other alignment features of the carrier 116 (not shown) ). The camera 3〇4 can be mounted on the camera mount 310 at a known (e.g., calibrated) position relative to the camera alignment feature 312 such that when the camera alignment feature 312 and the carrier alignment feature 118 are as shown in FIG. When coupled, the camera 3〇4 is in a known (or 6-calibrated) position relative to the carrier alignment feature 118. In this case, camera 304 can capture images of one or more of DUT alignment features 212, and such images can be used (eg, by controller 308) to move DUT 112 to the opposite position on carrier ι6 The camera 304 does not need to capture an image of the carrier alignment feature 118 or any other feature or component of the carrier 116. For example, the controller 308 (e.g., operator M) can move the bribe U2 relative to the carrier 116 using the L position of the captured image and the photographic feature 4 relative to the alignment feature of the carrier. With the alignment position on ιΐ6. The moving mechanism 314 can fine-tune the camera into and out of the vehicle pair (4) (10). For example, the camera seat is in a dotted line that is not in the camera stand 31G (the camera alignment feature 312) and the 201140088 carrier alignment feature 118 decoupling position; and the camera mount 310 coupled to the carrier alignment feature 118 In Figure 3, the actual payment is shown. Additionally, the carrier 116 (and thus the DUT 112) can be moved, or the camera housing 31 and the carrier 116 can be moved to couple the carrier alignment feature 18 and the camera alignment feature 312. In other embodiments, the aligner 1〇4 need not include features that couple the camera 〇4 to the carrier alignment feature 118 (e.g., camera alignment feature 312). For example, camera 304 can be mounted in housing 302 or other structure within housing 302 (not shown). In this case, the position of the camera 3〇4 relative to the carrier alignment feature 118 may not be known, and the camera 3〇4 may capture the DUT alignment feature 212 (eg, one of the terminals 114) and the carrier alignment feature. Images of both structures 118, and such images, may be used by controller 3〇8 (and/or operator) to move DUT 112 to an aligned position on carrier 116. As another example, camera 304 can be positioned in a similar device relative to a fixture (not shown) or housing 302 but is not directly coupled to the alignment features of camera 304 (the towel is not visible* but may be similar to camera alignment features) Known position of structure 3丨2). The alignment features (not shown) can engage the carrier alignment feature H8 and thereby move the carrier 116 to a position where the carrier alignment feature 118 is positioned relative to the camera 3〇4 Known location. Camera 3〇4 can be any camera or other device used to capture DUT ιη and/or vehicle (10) images (eg, digital images). It is not shown in the figure that the mechanism for moving the camera 3〇4 can be included in the aligner. For example, the camera 304 can be moved on the camera base 31A. 17 201140088 Camera alignment feature 312 can be a mechanical feature, such as an extension that is fitted into the wire, which is a light (four) _ _ _8, which can be a mechanical receptacle. Additionally, camera alignment feature 312 can be a receptacle for a bed-to-bed alignment feature 118 (which can be an extension). Having said that, the number of camera alignment features 312 shown in Figure 3 and the location of the county can be used for example, for example, or a few. Moreover, camera alignment feature 312 can be in a different position and/or different style than shown in FIG. In some embodiments, the number and location of camera alignment features 312 can be such as to move the receiver 116 with three degrees of freedom, such as in a three degree space, or additionally at a degree of freedom of the terminal 114 plane of the substantially parallel DUT 112. Camera stand 31〇 (and such camera 3〇4). The aligner 1〇4 as shown in Fig. 3 is for illustrative purposes only. Thus, for example, aligner 1 need not include all of the features or elements illustrated as illustrated in FIG. 3; aligner 104 may have additional features or elements not shown in FIG. 3; and aligner 104 may have the same as FIG. 3 Different features or elements are shown. For example, as discussed above, the aligner 1 4 need not include a camera alignment feature 312, a camera mount 310, or a moving mechanism 314 (eg, the camera 304 can be mounted in the housing 302 or other structure within the housing 302 (not shown) display)). As another example, as discussed above, the housing 302 can have a mechanical coupling mechanism (not shown) that is a mechanical surface-to-surface carrier alignment feature 118 and thus moves the carrier 116 to the opposite side. At a predetermined position of the camera 304. As another example, there may be only one camera 3〇4, or there may be more than two cameras 304 as shown in FIG. As discussed above, the test unit 108 shown in FIG. 1 may include two or more 5 18 201140088 test units, and the test unit 11 may be one of them. In accordance with several embodiments of the present invention, examples of test unit 110 are illustrated in Figures 4A and 4B. As shown, the test unit 11A can include a housing 402 that can include an access door 124 through which the combination of the DUT 112 and the carrier 116 can be placed within the test unit 110. In several embodiments, the housing 402 can be sufficiently sealed to provide a self-contained clean room enclosure when the access door 124 is closed. Test unit 110 may also include or be coupled to controller 418 and memory 420. Controller 418 can control all or part of the operation of test unit 110 and can operate in accordance with the code stored in memory 420 (as defined below). Additionally or alternatively, controller 418 can operate in whole or in part in accordance with a wired circuit. Controller 418 can be one or more of any of the types of controllers identified below for controller 126, and memory 420 can be one or more of any of the types of memory devices identified below for memory 128. By. As also shown, the test unit 11A can include a contactor 4A8 that can include a conductive probe 410. The probe 41A can be any structure suitable for contacting the terminal 114 of the dut 112 and thus the terminal 114. Examples of suitable probes 41〇 include spring probes, stubs, bumps, and the like. The contactor 4〇8 can be electrically connected to the electrical connection 4〇4' through this electrical connection, power and ground potential, control and test signals, etc. can be provided to the contactor 4G8 'which can include electrical connections (not shown) to the probe Needle 410. Thus, the electric power, the earth potential, the control-like test signal, and the like can be supplied via the contactor 408 to _υτ 112. Similarly, the signal from ιΐ2 can be supplied to the electrical connection 4〇4 via the contactor 408. Contactor 408 can be any type of electronic device suitable for providing electrical connection to probe 41A. For example, the contactor 4A8 can include a probe card assembly, a probe head assembly, a membrane contactor, a loading plate, and the like. In some embodiments, the contactor 408 can include one or more circuit boards, stiffeners 'probe heads, interposers, and/or combinations thereof. As mentioned, the test unit 110 can also include a contactor alignment feature 412 that can couple the contactor 408 'housing 402 or other components of the test unit 11'. As also discussed above, the contactor alignment feature 412 can mechanically couple the corresponding carrier alignment feature 118 on the carrier 116 such that the probe 41 is sufficiently aligned with the terminal 114 to allow the probe 41 to contact and electrically connect to The terminal 114 is such that the contactor 408 is mounted (or to) the housing 4〇2 in alignment with the contactor feature 412, when the carrier alignment feature 118 on the carrier 116 is coupled to the contactor on the contactor 408. The feature structure 412 aligns the position of the probe 410 with the terminal 114. Test unit 110 can include a guide mechanism 422 for directing carrier 116 to a particular location and/or orientation of test unit 110. For example, the guiding mechanism 422 can include rails, recesses, stop structures, and/or the like that guide the carrier 116 into a rough position or orientation of the test unit 11A. In some embodiments, for example, the guide mechanism 422 can include a rail (not shown) and a stop structure (not shown). When the carrier is loaded into the housing 4〇2, the rails (not shown) can guide the carrier 116; and when the carrier 116 is in the desired position and/or orientation of the housing 302, A stop structure (not shown) can stop the movement of the carrier 116 along the rails (not shown). The desired position may be rough, although it is so sufficient that the carrier alignment feature 118 is aligned with the contactor alignment feature 412 for moving the carrier when the elevator 4〇6 (described in detail later), as illustrated in FIG. 4B, The carrier alignment feature 118 is mechanically coupled 5 20 201140088 contactor alignment feature 412. As also shown in Figures 4A and 4B, test unit 110 can include an elevator 406. As also shown in FIG. 4A, the combination of DUT 112 and carrier 116 can be placed on elevator 406, and as also shown in FIG. 4B, elevator 406 can move the combination of DUT 112 and carrier 116 for mechanical coupling. The contactor alignment feature 412 and the carrier alignment feature 118 of the terminal 114 are in contact with the probe 41A. As shown in Figures 4A and 4B, the elevator 406 can be moved in the "z" direction. In the embodiment, the elevator 406 can also be moved in the "x, y" plane and can also be rotated around one or more of the "χ", "y" and/or "z" axes. Although the present invention is not limited to this, in the example illustrated by the drawings, the "z" direction or the two axes substantially perpendicular to the bearing surface 204 of the carrier 116, and the "X" and "y" directions or axes (and thus) The x, y" plane) is substantially parallel to the load bearing surface 304 of the carrier 116 <) The elevator 406 can be any mechanism suitable for carrying and moving the carrier 116. For example, the elevator 406 can be a mobile platform. Examples of suitable lifts include pneumatic, motor or hydraulic drive platforms. Test unit 110 can include or be coupled to a pressure controller 416 that can adjust the air pressure. For example, pressure controller 416 can selectively reduce and/or increase air pressure to a desired level. As shown, one or more hermetic seals 414 can be disposed between contactor 408 and DUT 112. The seal 414 can form a hermetic seal between the contactor 4A8 and the DUT U2, and the pressure controller 416 can selectively set the air pressure between the contactor 408 and the DUT 112 to a desired level. As such, the pressure controller 416 can selectively create a vacuum between the contactor 4A8 and the DUT 112, which can, for example, connect the contactor 408 to the DUT 112. The pressure controller 416 can also selectively increase the space air pressure between the contactor 408 and the DUT 112, as in the case of Example 21 201140088. The contactors 408 and 1) 1 can be pushed away. Such pressure controller 416 can selectively adjust (e.g., increase or decrease) probe 410 force (e.g., total force) toward terminal 114 of DUT 112, which can adjust the total force between terminal ι4 and contactor 408 of DUT 112. (pressure). For example, the pressure controller 416 can cause the total force between the DUT terminal iu and the contactor 4A to be a selected amount, including zero. In several embodiments, the elevator 406 can move the carrier 116 such that the terminal 114 is adjacent to or in initial contact with the probe 41A. The pressure controller 416 can then create a vacuum in the space between the DUT 112 and the contactor 408 to pull the contactor 408 and the DUT 112 together with sufficient force to form an electrical connection between the terminal 114 and the probe 410. The test unit n〇 shown in Figures 4A and 4B is for illustrative purposes only. Thus, for example, the test unit 11 does not need to include all of the features or elements shown in FIGS. 4A and 4B; the test unit HO may have additional features or elements not shown in FIGS. 4A and 4B; and the test unit 110 may have the same Different additional features or components shown in Figures 4A and 4B. For example, test unit 110 may include one or more power supplies, control and test signal generators (analog and/or digits), temperature control devices, etc. (not shown). The power supplies and signal generators (not shown) may be coupled to contactor 408 via connection 404 or, in addition, may be part of contactor 408 and may be coupled to probe 410 via contactor 408. As another example, test unit 110 can include features (not shown) that allow it to allow contactor 408 to be removed and replaced with a different contactor. As yet another example, the test unit 110 need not include a seal 414 or a pressure controller 416. As yet another example, the test unit 110 can include a guiding mechanism (not shown) that assists in loading the combination of the DUT 112/carrier 5 22 201140088 116 into the test unit 110 and the combination of the DUT 112/carrier 116. Removed from the test unit UO. In addition, such a guiding mechanism (not shown) can direct the combination of the DUT II2/carrier 116 to a position sufficient to properly align the contactor 408 such that the elevator 406 can move the combination of the DUT 112/carrier 116, thus the vehicle The alignment feature 118 is coupled to the contactor alignment feature 412 without the use of a camera or other such mechanism. For example, such guiding mechanisms can include rails, recesses, stop structures, and/or the like (not shown). Controller 126 can control the operation of some or all of multi-DUT test system 100. For example, controller 126 can be communicatively coupled to loader 1, aligner 104, test unit 〇8, and/or mover 〇6. The controller 126 can receive status signals from and/or send control signals to one or more of the loader 1, the aligner 104, the test unit 〇8, and/or the mover 106. The controller 126 can include one or more processors (eg, a microprocessor or microcontroller), a computer, etc., which can operate in accordance with code stored in the digital memory 128, and the digital memory 128 can include any memory device. These include, but are not limited to, semiconductor memory devices, magnetic memory devices, optical memory devices, and the like. Additionally or alternatively, controller 126 can include wired circuitry, and controller 126 can operate in part or in whole in accordance with such wired circuitry. As used herein, "code" refers to a machine readable instruction that can be stored in memory 128 and executed by controller 126. Non-limiting examples of code include software, microcode, firmware, scripts, and the like. In Figures 1 through 4B, controller 126 is shown to control the king of the DUT test system j1〇. The P component, while the aligner 1〇4 and each test unit are shown as being included or coupled to controllers 308 and 418, respectively. The foregoing configuration is only one of the 23 201140088 examples, and variations are expected. For example, controller 126 may perform all or part of the functions and controls performed by controllers 〇8 and/or controller 418. As another example, an additional controller may be included that separately controls, for example, the loader 1〇2 and/or the mover 1〇6. An overview of the multi-DUT/test system 1 连同 along with the dut 1 ]_2, the loader 102 aligner 1〇4, the mover 106, and the test unit 11〇 are illustrated in Figures 1 through 4B and discussed. As before. As discussed above, the examples illustrated in Figures 1 through 4B and discussed above are for illustrative purposes only and are not intended to be limiting. Indeed, many variations are possible, some of which are specifically understood for the carrier 116, the aligner 104, and the test unit 11. Many other variations of the multi-dut test system 100 are also possible. For example, there may be more than one loader 102, aligner 104, and/or mover 106. As another example, the loader 102 and the aligner 104 need not be separate components. In other words, for example, the aligner 104 can be part of the loader 102. As another example, the loader 102 need not be included in the multi-DUT test system, and the DUT 112 can be loaded into and removed from the system 100 through the aligner 104. As yet another example of a variation of test system 100, test unit 108 can be configured in a plurality of locations (e.g., surround mover 106). As yet another example, additional components may be included in the multi-DUT test system 100, such as a storage device (not shown) that may, for example, store the DUT 112 (already tested or untested), the carrier 116, and the like. 5A through 12B illustrate additional examples of embodiments of the carrier 116 embodiment and the aligner 104 and test unit 110 of the carrier 116 in accordance with several embodiments of the present invention. 13 through 15 illustrate an example of testing the DUT 112 for the multi-DUT test system 100 in accordance with some embodiments of the present invention. 5 24 201140088 Figures 5A through 5C illustrate an example of an embodiment of a carrier 116 in the form of a locator disk carrier 500. 6A through 7B illustrate an embodiment in which the aligner 104 for positioning the disk carrier 500 is assembled, and Figs. 8A through 9B illustrate an embodiment in which the test unit 110 for positioning the disk carrier 500 is assembled. As previously mentioned, the locating disc carrier 500 of Figures 5A through 5C is an example of a carrier 116 in accordance with several embodiments of the present invention. The locating disc carrier 500 can replace the carrier 116 in any of Figures 1 through 4B and in the foregoing discussion of the figures. In addition, the locator tray carrier 500 can include the features or variations discussed herein with respect to the carrier 116, even if it is not specifically described with respect to the locating disc carrier. As shown, the locator tray carrier 500 can include a locating disc 5〇2 having a DUT 112 (shown in phantom in Figures 5A and 5C) on which the carrier surface 504 can be placed. The positioning disk 502 can include a substrate (eg, a piece of material) or the like. For example, the positioning disk 502 can comprise a metal plate, a ceramic plate, or the like. In some embodiments, the locating disc 502 thickness TP can be greater than the DUT 112 thickness Td. For example, the thickness ^ can be 2, 5, 8, 9, 1 or more times the thickness TD of the DUT 112. In addition, the thickness TP may be equal to or smaller than the thickness td. - or a plurality of vacuum slots 506 may be provided on the bearing surface 5 〇 4 . A mechanism (not shown) and other devices (not shown in the figure (4) are arbitrarily arranged to form, hold and release vacuum in the (four) slot 504. Such mechanisms (not shown) may include - or a spicy joint nozzle ( Not shown), and the nozzle (not shown) to the passage of the vacuum chamber 504. The vacuum of the groove 506 can clamp the dutii2 on the bearing surface 5〇4 and release the vacuum to release the bribe 112, so that (10)(1) can Move on the load meter®5G4. The vacuum tank 5()4 and the mechanism for smashing and relieving the vacuum can be an example of the squeezing mechanism of Figures 2 and 23. Positioning 201140088 The disc 502 can additionally comprise different types of clamping Mechanisms, such as mechanical clamps, etc. The number, shape and/or pattern of the vacuum grooves 504 shown in Figures 5A and 5C are only one example and may vary. As can be seen from Figures 5A and 5C, the bearing surface 5〇4 may be smaller than the DUT. 112, such that the DUT 112 extends beyond the load bearing surface 5〇4. The area of the load bearing surface 504 of several embodiments may be 3/4 or less of the area of the DUT 112, 2/3 or less, 1/2 or less, 1/3 Or below, 1/4 or less. In several embodiments, the area of the load bearing surface 504 can be 1/50 or less of the DUT 112 area, 1/50 or less 'or 1/75 or less. The bearing surface 504 area is smaller than the corresponding area of the DUT 112 to allow the locating disk carrier 5 〇〇 to have a specific carrier 116 ( It is a larger) smaller size and/or thermal mass, positioning disk carrier 5, which may be smaller, and in several embodiments may provide advantages such as reduced manufacturing costs and reduced thermal mass. Regardless of the relative bearing surface 504 Depending on the size, the positioning disk 5〇2 may have a thickness ΤΡ, 谷后#, which may be approximately equal to the chuck 6〇2 in the aligner 1〇4 and the cavity 〇6 in the chuck 802 in the test unit 110 And a depth d of 8〇6. The locating disc alignment feature 51〇 can be disposed on the opposite side surface 508 of the platter 502. For example, the locating disc alignment feature 51 can be an extension that extends from the opposite side surface 508. Or for the receptacle to extend into the opposite side surface 508. As can be seen, the locating disc alignment feature 51 corresponds to the cavity alignment feature of the corresponding chuck in the configuration of the aligner 104 from the illustration to the illustration. Structure 610, and corresponding to the test unit deleted from the (four) circle exemplified The cavity alignment feature (10) of the card 2. The positioning disk alignment special microstructure 51G may be a mechanical feature such as an extension or a receptacle in which it fits and such a cavity alignment feature _ and (10) The mechanical housing or extension is 26 5 201140088. The positioning confusion shown in Fig. 5B is for illustrative purposes, and the number and position of the characteristic structure 51G may be only one or less than three positioning disk alignment features 510. The number and position of the disk alignment features 510 may be, for example, in a three degree space, in a number of embodiments, different locations shown in the location f and/or different locations. "degree of freedom, or in addition, on the load-bearing surface of the substantially parallel clamp disk 502, n 4 thousand faces with three degrees of freedom, dynamically aligning the chuck of the aligner 104 of the locator carrier 500 illustrated in Fig. 6a 602 and 8th to 9th® exemplify the chucks of the test unit wipes. 5th and 5th (: The illustration does not indicate that the lift coupling mechanism 512 can be disposed on or within the opposite side surface 5Q8 of the positioning plate 502. As will be understood later, the elevator engaging mechanism 512 can consume the lowering machine 618 of the aligner (10) as illustrated in the figure 6AJ_7B and the position disk lift 818 in the test unit ιι as shown in Fig. 8. The elevator is light. The linkage 512 and the elevator 618 may have a similarly interlocking irregular shape 'which positions the positioning disk 5Q2 in a particular direction. The positioning disk carrier 5'' as illustrated in Figures 5A through 5C is for illustrative purposes only. Thus, for example, 500 need not include all of the features or elements as described in Figures 5-8 (the illustrated illustration; the locating disc carrier 500 can have additional features or elements not shown in Figures 5A through 5C; and locating discs) The carrier 5〇〇 can have the same as the figure 5A to 5C Illustrators have different features or elements. For example, as shown in Figure 5C, the locator carrier 500 can include one or more temperature control devices 210 (described above). Additionally, the locator carrier 5 〇 The temperature control device 210 may not be included. As another example, the locator disk carrier 5 may include a cover and sealing mechanism (not shown) that provides a 27 201140088 self-valley clean room environment around 131111 112. As yet another example, the DUT 112 can be clamped to the carrier surface 504 of the locating disc 5〇2 by other types of clamping mechanisms, such as mechanical clamps, etc. Thus the vacuum slot 506 can be replaced by other types of clamping mechanisms. Figures 6A-6B illustrate An example of an aligner 1 〇 4 that can be used to align the DUT 112 on the locating disc carrier 500 is illustrated in accordance with several embodiments of the present invention. The cut-out portion 600 of Figure 6A shows the inner portion of the aligner 1〇4. As shown, the aligner 104 of Figures 6A-6B can include a housing 302 having a access door 122 substantially as discussed above with respect to Figure 3. The aligner 1-4 can also include one or more cameras 304, Camera alignment The camera base 310 of the structure 312 and the moving mechanism 314 for moving the camera base 31 are substantially as discussed above with respect to FIG. 3. The aligner 1〇4 of FIGS. 6A-6B may include the controller 408 and the memory 316. , as discussed above with respect to FIG. 3 , but differs from FIG. 3 , the aligner 1 〇 4 illustrated in FIGS. 6A to 6B may include a platform 616 , an elevator 618 , and a movable chuck 602 . An example of the moving mechanism 306 of Figure 3. As shown in Figures 6A and 6B, the chuck 602 can have an upper surface 6〇4, and the upper surface 604 has a cavity 606 in which the positioning disk carrier can be placed. Hey. The lower surface 608 of the cavity 6〇6 may have a cavity alignment feature 61〇 which, as previously discussed, may correspond to the alignment disk alignment feature 51 of the positioning disk 502. The cavity 6〇6 can have a depth D that is approximately equal to the thickness Tp of the locating disc 502 such that the upper surface 604 of the chuck 602 when the 盘position alignment feature is lightly coupled to the cavity alignment feature 610 as illustrated in FIG. The bearing surface 5〇4 of the positioning disk 502 is substantially (ie, approximately) coplanar. If the DUT 112 is not damaged or broken 5 201140088 when it is placed on both the upper surface 6〇4 and the load bearing surface 504, the upper surface 604 is substantially coplanar with the load bearing surface 504. . In addition, one or more of the bearing surface 504 of the positioning disk 502, the upper surface 6〇4 of the chuck 6〇2, the lower surface 608 of the cavity 6〇6, and/or the positioning disk alignment feature 51〇 may be attached. The figure is sufficiently conformed (e.g., flexible) in the "ζ" direction to allow the upper surface 604 and/or the load bearing surface 5〇4 to move such that the upper surface 6〇4 is substantially coplanar with the load bearing surface 504. As also shown in Figures 6 and 6, the upper surface 6〇4 of the chuck 6〇2 may have a vacuum chamber 614. Mechanisms (not shown) and other devices (not shown) may be selectively provided to form, hold, and release vacuum in the vacuum chamber 614. Such mechanisms (not shown) may include one or more joining nozzles (not shown), and a vacuum from the nozzle (not shown in the ®) to the channel (four) of the vacuum chamber 614 may place the DUT 112 on Clamping the surface 604 and releasing the vacuum release the DUT 112 such that the DUT 112 can be moved or removed over the upper surface 6〇4. The number, shape and/or pattern of the vacuum grooves 614 shown in the eighth detail diagram are merely examples and may be different from those shown. As also exemplified in FIGS. 6A and 6B, the chuck 6〇2 may have a chuck alignment feature (4), which may be a camera brain G feature structure 2 field carrier alignment feature 118 is as previously described in FIG. When the camera alignment feature 312 is described, the chuck alignment feature 620 can be identical or similar in structure and function to the carrier alignment feature 118. For example, the chuck alignment feature 62 can be positioned relative to the cavity alignment feature on the free disk 2 (the known chuck alignment feature is positioned at a known position relative to the positioning disk 5〇2) The disc alignment feature structure engages the cavity alignment feature 610. Then, when the camera alignment feature 312 system 29 201140088 is coupled to the chuck alignment feature 620, the camera 304 is in a known position relative to the positioning disk 502, the position and orientation of which can be positioned by the alignment plate alignment feature 510 and the cavity alignment feature. Structure 610 is defined. The elevator 618 can be a moving mechanism that moves the positioning disk 5〇2 into and out of the two chambers 606. As will be appreciated, the elevator transfer mechanism 512 and lift 618 of the locating disc 5〇2 can have similar interlocking irregularities that orient the locating disc 502 in a particular direction. The chuck 602 can be a movable platform' for example, movable in the "x, y" plane direction and rotated around the rz" axis. Platform 616 can include a transmission mechanism (not shown) for actuating and/or controlling elevator 618 and chuck 602. The seventh and seventh drawings illustrate the aligners 1〇4 of the sixth and eighth figures of the DUT 112/positioning plate carrier 500 in the aligner 1〇4. As shown, the locating disc 502 can be disposed on the elevator 618 (e.g., the elevator 618 can be coupled to the elevator coupling mechanism 512 as shown), and the elevator 618 can move the locating disc 5 〇 2 into (Fig. 7B) and Remove (v. 7-8) the cavity 6〇6 on the chuck 6〇2. Although not shown, a guide mechanism (e.g., similar guide mechanism 318) can be provided to position the locating disc 502 in the initial coarse direction such that when the elevator 618 moves the locating disc 502 into the cavity 606. For example, the locating disc alignment feature 510 is coupled to the cavity alignment feature 6a roughly but sufficiently. For example, as previously discussed, the elevator coupling mechanism 512 and the elevator 618 may have similar interlocking irregularities, and the orientation positioning disk 502 is such that when the positioning disk 502 is coupled to the elevator 618, the positioning disk 5〇2 and The clamp disc alignment feature 510 is thus oriented in a rough initial orientation. The elevator shank mechanism 512 and the elevator 618 can be an example of the guiding mechanism 318 of FIG. The moving mechanism 314 can move the camera mount 31 〇 such that the camera aligns the structure 620 with the shifting structure of the M2 system. As described above, when the disc alignment feature 5iq is aligned with the cavity alignment feature 6_ and the camera alignment feature 3 (4) the chuck alignment feature 6_ (as shown in FIG. 7B), the camera _ and the alignment plate alignment feature Structures 510 are located at known locations relative to one another. As previously mentioned, the aligner does not need to include the feature of the camera consumable carrier alignment feature 118 (eg, camera alignment feature (10). For example, the camera 304 can be mounted to the housing or other structure of the housing 3_ (not shown). In this case, the position of the camera 3G4 relative to the carrier alignment feature 118 may not be known 'and the camera can capture the bribe feature m (eg, one of the terminals 114) and The image of the carrier alignment feature ' 118 and the images can be used by the controller (and/or operator) to move the DUT 112 to the aligned position on the carrier 116. * As previously understood, the DUT 112 can be used by The bearing surface 5〇4 clamped to the positioning plate 502 and the clamping from the surface are formed or removed in the vacuum groove. Similarly, the DUT 112 can be cooled by forming or releasing the vacuum in the vacuum chamber 614. The upper surface 604 of the chuck 602 and the clamping from the surface are released. When the surface 604 is tightened to the upper surface 604 of the chuck 602 and released from the bearing surface 5〇4 of the positioning plate 502, the chuck 602 can be aligned with respect to the positioning plate 502. Moving the DUT 112 to align with the positioning plate The 510 is positioned to position the DUT alignment feature 212, which can be the equivalent of the carrier alignment feature 118 of Figures 2A and 2B. Thus the chuck moves the DUT 112 to the opposite position on the locator carrier 500. The configuration of the aligner 1〇4 shown in Figures 6A to 7B is for illustrative purposes only 31 201140088. Thus, for example, the aligner 104 need not include all of the features or elements as illustrated by the 6A to the paste; the aligner may have Additional features or elements not shown in Figures 7B; and aligners may have non-characteristic structures or elements as shown in Figures 6A through 7BH. As discussed above, Figure 3 is discussed above with respect to Figure 3 The 〇4 need not include the camera alignment feature 312, the camera base 310 or the moving mechanism 3M (for example, other structures (not shown) in which the camera 3〇4 can be mounted in the housing 3G2 or the housing 302). The chuck 602 need not include the chuck alignment feature 62. For another example, although the two cameras 3 〇 4 are displayed, there may be only one camera 3 〇 4 or more than two cameras 3 〇 4. Example, without 〇1^ U2 The locating disc 502 can be initially disposed in the cavity 6 〇 6 (eg, with the locating disc alignment feature 510 coupled to the cavity alignment feature 61 〇), and the 〇 11 112 112 is then placed by inserting the aligner 104 The locating disc 502 carries the surface 504 and the upper surface 604 of the chuck 602. As yet another example, the DUT 112 can be clamped onto the chuck 6 〇 2 by other types of clamping mechanisms such as mechanical clamps, electrostatic clamps, and the like. Surface 604. Vacuum slot 614 may be replaced by another type of clamping mechanism. As another example, mobile lift U2 and/or platform 1104 may be used to replace other types of moving mechanisms that move DUT 112 relative to film carrier 1000. . For example, a motorized drive platform or chuck can replace the movable elevator 11〇2 and/or the platform 1104. As another example, a device for selectively directing air jets in the DUT 112 portion to move the DUT 112 on the load bearing surface 1〇〇4 of the film carrier 1 can replace the elevator 11〇2 and/or the platform. 11〇4. As yet another example, an apparatus for selectively forming an electrostatic charge that moves the DUT 112 over the load bearing surface 1〇〇4 can replace the elevator 1102 and/or the platform 11〇4. 5 32 201140088 All examples of the replacement of the aforementioned elevator 1102 and/or platform 1104 may be an example of the moving mechanism 306 of FIG. 8A and 8B illustrate a configuration example of a test unit 110 that can be used to test a combination of DUT 112/positioning disk carrier 500 in accordance with several embodiments of the present invention. The cut-out portion 800 of Fig. 8A shows the inner portion of the test unit 110. As shown, the test unit 110 of Figures 8A and 8B can include a housing 402 having an access door 124, generally as discussed above with respect to Figures 4A and 4B. Test unit 110 also includes electrical connections 404, contactors 408 with probes 410, contactor alignment features 412, seals 414, and pressure controller devices 416, as generally discussed above with respect to Figures 4A and 4B. The test unit 110 of Figures 8A and 8B also includes the controller 418 and the memory 420 as discussed above with respect to Figures 4A and 4B. However, unlike the 4A and 4B drawings, the test unit 110 shown in FIGS. 8A and 8B also includes a chuck 802, a chuck lift 816, and a locator lift 818, which may be an elevator 406 example of the 4A and 4B drawings. The 802 can be similar to the cartridge 6 〇 2 and can have similar components and features. For example, as shown, the chuck 8〇2 has an upper surface 8〇4 and may have a cavity 806 on the upper surface 8〇4 in which the locating disc carrier 500 can be placed. The cavity 806 can have a cavity alignment feature 81A that can correspond to and dissipate the locating disk alignment feature 51 of the locating disk 502. The cavity 8〇6 may have a depth D that is approximately equal to the thickness Tp of the positioning disk 502, substantially as illustrated in FIG. 9B, when the positioning disk alignment feature 51 is coupled to the cavity alignment feature 810. The upper surface 8〇4 and the bearing surface 5〇4 of the positioning disk 5〇2 are substantially (ie, approximately) coplanar. If the DUT 112 is disposed on both the upper surface 8〇4 and the load bearing surface 504 when the contact probe 41(4) is not damaged or damaged, then the upper surface 804 is substantially coplanar with the load bearing surface 504. As also shown in Figures 8A and 8B, there may be one or more vacuum slots 814 on the surface 8〇4 of the chuck 8〇2. It is possible to select a j-providing mechanism (not shown) and its 匕" (also not shown) to form a holding and releasing true two in the vacuum chamber 814. Such mechanisms (not shown) may include one or more joining nozzles (not shown) and passages from the nozzles (not shown) to the vacuum slots 814. The vacuum of the slot 814 can clamp the DUT 112 on the upper surface 804 and release the vacuum to release the DUT 112 from the upper surface 804. The number, shape and/or pattern of the vacuum grooves 814 shown in the eighth and rib diagrams are merely examples and may differ from those shown. As also illustrated by Figures 8A and 8B, the chuck 8〇2 can have a chuck alignment feature 820' which can be a contactor alignment feature 412. The chuck alignment feature 82 can be identical or similar to the vehicle alignment feature 118 as described above. For example, the chuck alignment feature 820 can be positioned on the chuck 8〇2 relative to the cavity alignment feature (10) such that when the alignment disk alignment feature 510 is coupled to the cavity alignment feature, the card is 810 The disc alignment feature 82 is relative to the locating disc $(10). The probe 410 can be positioned at a known position relative to the contactor alignment feature 412 and the cavity alignment feature (10); The feature structure 212, and thus the terminal ι4 of 112, is at the known position of the aligner = 4 relative to the locating disk alignment feature. Thus, the contactor alignment feature engages the chuck alignment feature (4) and the orientation disk alignment feature 51 refers to the cavity alignment feature (10) when the probe 410 is aligned with the terminal 114. The lift 818 can move the positioning (4) 2 shifting area out of the empty space. The chuck elevator 816 can move the chuck 8〇2 and as such, while the moving chuck alignment feature 802 moves into and out of the coupling with the contactor alignment feature 412. Figures 9A and 9B illustrate a test unit 110 illustrated in Figures 8A and 8B with a combination of DUT 112/positioning disk carrier 5A in test unit 110. The elevator 818 can be similar to the aforementioned elevator 618. In other words, the locating disc 502 can be disposed on the elevator 818 (eg, as shown, the elevator 818 can be coupled to the elevator coupling mechanism 512), and the elevator 818 can move the locating disc 502 into (similar to Figure 7B) and remove (like the first 7A) Cavity 806 of chuck 802. Although not shown in the drawings, a guiding mechanism (e.g., similar to guiding mechanism 422) can be provided to place the positioning disk 502 in the initial coarse direction of the test unit 110 such that when the elevator 818 moves the positioning disk 502 into the cavity 806, For example, the locating disc alignment feature 510 is roughly but sufficiently aligned with the cavity alignment feature 81 to be lightly coupled. For example, the elevator coupling mechanism 512 and the elevator 818 can have similar interlocking irregular shapes 'the orientation of the positioning disk 502 such that when the positioning disk 502 is coupled to the elevator 818, the positioning disk 502 and thus the positioning disk alignment feature 510 are Oriented in a rough initial direction. The elevator coupling mechanism 512 and the elevator 818 can be an example of the guiding mechanism 422 of FIG. Other examples of such guiding mechanisms (not shown) may include rails (not shown) and the like. The chuck elevator 816 can move the chuck 802 such that the chuck alignment feature 820 can remove the light linkage with the contactor alignment feature 412, as shown in Figure 9A. Chuck lift 816 can also move chuck 802 such that chuck alignment feature 820 can be moved into coupling with contactor alignment feature 412, as shown in Figure 9B. As previously discussed, the pressure controller 416 can increase or decrease the air pressure between the contactor 4〇8 35 201140088 and the DUT 112. As the text is understood, by forming or releasing the vacuum of the vacuum chamber 506, the DUT 112 can squash and relieve the load bearing surface 504 of the aligning plate 502. Similarly, by forming or releasing the vacuum of the vacuum chamber 814, the DUT 112 can clamp and unwind the upper surface 8〇4 of the clamping disk 802. The test unit 丨1〇 illustrated in Figures 8A through 9B is only for example - an example. Thus, for example, test unit 110 need not include all of the features or elements illustrated in the FIGS. 8A-9B diagram; test unit 110 may have additional features or elements not shown in FIGS. 8A-9B; and test unit 11A may have Different features or elements are shown in Figures 8A through 9B. For example, the DUT 112 can be clamped to the upper surface 804 of the chuck 802 by other types of clamping mechanisms, such as mechanical clamps or the like. The vacuum chamber 814 can be replaced by another type of clamping mechanism. As another example, test unit 110 need not include pressure controller 416 or seal 414. 10A and 10B illustrate an example of the embodiment of the carrier 116 in the form of a film carrier. 11A and 11B illustrate an embodiment of the aligner 104 assembled for the film carrier 1000, and FIGS. 12A and 12B illustrate an embodiment of the test unit 110 assembled for the film carrier 1000. As previously mentioned, the film carrier 1A of Figures 10A and 10B is an example of a carrier 116 in accordance with several embodiments of the present invention. As such, the film carrier 1 can replace the carrier 116 in any of the 14B drawings and discussed above in the drawings. Further, the film carrier 1000 can include features or variations discussed herein with respect to the carrier 116 even if the film carrier 1000 is not specifically stated. As shown, the film carrier can include a film substrate 1002' having a load surface 1004 on which the DUT 112 (shown in phantom in Figures 10A and 10B) can be placed. The film substrate 1002 may include a substrate (for example, a piece of material) or the like. For example, the film substrate 1002 may comprise a metal plate 'ceramic plate or the like. The film substrate 1002 thickness 7^ may be equal to or less than the DUT 112 thickness TD in several embodiments. For example, the thickness τ Μ may be 90%, 80%, 70%, 60%, 50%, 40% or less than the DUT 112 thickness TD. Alternatively, the thickness TM may be a different percentage of the thickness, or the thickness 1^ may be equal to or greater than the thickness TD. The film substrate 1 〇〇 2 thickness TM can be relatively small, allowing comparison of the carrier 116 with a larger value, the film carrier 5 〇〇 having a smaller size and/or thermal mass. Such a film carrier can be less advantageous in several embodiments, such as reducing manufacturing costs and reducing thermal mass. One or more vacuum chambers 1〇〇6 may be disposed on the bearing surface 1〇〇4. A mechanism (not shown) and other devices (not shown) are optionally provided to form, hold, and release vacuum in the vacuum chamber 1004. Such mechanisms (not shown) may include one or more joining nozzles (not shown) and passages from the nozzles (not shown) to the vacuum chamber 1006. The vacuum of the slot 1 〇〇 6 can clamp the DUT 112 on the load bearing surface 1004 and release the vacuum to release the DUT 112 from the load bearing surface 1 使得 4 such that the DUT 112 can move over the load bearing surface 1004. Thus, the vacuum chamber 1006 and associated clamping mechanism 2〇8 for forming and releasing the vacuum mechanism may be FIGS. 2A and 2B. The film substrate 1 2 may additionally include a non-chamber type clamping mechanism such as a mechanical jig or the like. The number, shape and/or pattern of the vacuum chambers 1006 shown in Figures 10A and 10B are merely examples and may differ from those shown. As shown, the load bearing surface 1004 of the film substrate 1002 can be larger than the DUT 112 size. As also shown, the film substrate 1002 can include an alignment feature 118 such as that discussed above. The carrier alignment feature us can be configured with a load bearing surface on which the DUT 112 is disposed. The outside of the region. The film substrate 1〇〇2 can also include an elevator hole 1008 on which a load bearing surface on which the DUT 112 is disposed is disposed. 1004 inside the area. As will be understood later, the elevator jacks 1〇〇8 allow the movable elevator 1102 (refer to Figs. 11A and 11B) to lift the DUT 112 from the bearing surface 11 〇4 of the film substrate 1002 through the film substrate 1〇〇2. As will be appreciated later, the elevator aperture 1008 can be larger than the mobile elevator 11〇2, which allows the mobile elevator 1102, and thus allows the DUT 112 to move and surround the X, y plane relative to the membrane substrate 1〇〇2. z" axis rotation. Of course, the greater the difference in size between the lift hole lifter hole 1008 and the movable lift 1102, the greater the distance that the movable lifter 1102 can move relative to the film substrate 1002. In some embodiments, each of the elevator apertures 1008 can be 1·25, 1. of the size of the movable elevator 11〇2. 5, 1. 75, 2. 8 or more times. The film carrier 1 所示 shown in Figures 10 and 10 is only an example. Thus, for example, the film carrier 1000 need not include all of the features or elements shown in Figures 10 and 10; the film carrier 1000 can have additional features or elements not shown in Figures 10 and 10; and the film carrier 1000 can have A feature or component that is different from those shown in Figures 10 and 10. For example, as shown in Figure 10, the film carrier 1000 can include one or more temperature control devices 21 (as previously described). Further, the film carrier 1000 does not include the temperature control device 210. As another example, the film carrier 1000 includes a cover and sealing mechanism (not shown) that provides a self-contained clean room environment surrounding the DUT 112. As yet another example, the DUT 112 can be clamped to the bearing surface 1〇〇4 of the 骐 substrate 1002 by other types of clamping mechanisms, such as mechanical clamps or the like. Thus, the vacuum chamber 1〇〇6 can be replaced by another type of clamping mechanism 5 38 201140088. As yet another example, the number, configuration, and pattern of elevator apertures 1008 and/or carrier alignment features 118 can vary from those shown in Figures iA and 10B. 11A and 11B show an example of a configuration of an aligner 104 that can be used to align the DUT 112 on a film carrier 1000 in accordance with several embodiments of the present invention. As shown, the aligner 1A of Figures 11A and 11B can include a housing 302 having access doors 122, as generally discussed above with respect to Figure 3. The aligner 1 〇 4 may also include one or more cameras 304, a camera mount 310 having camera alignment features 312, and a moving mechanism 314 for moving the camera mount 310, as also discussed above in connection with FIG. The aligner 1 〇 4 of Figures 11A and 1B also includes controller 308 and memory 316' as generally discussed above with respect to Figure 3. However, unlike FIG. 3, the aligner 1 〇 4 embodiment illustrated in FIGS. 11A and 11B may include a platform 1104 and a movable elevator 11〇2, which may be an example of the moving mechanism 306 of FIG. As shown in Figures 11A and 11B, the platform 11〇4 can hold the film carrier 1〇〇〇. Thus, the film carrier 1000 is placed on the platform 1104, as shown in Figure ha, such that the movable elevator 1102 extends from the platform 1104 into or through the elevator aperture 1008 of the film carrier 1000, as also shown in Figure 11A. (In Figure 11A, the elevator aperture 1008 is shown in phantom because the elevator aperture lift aperture 1008 can be the inner membrane substrate 2 in the views shown in Figures 11A and 11B; the movable elevator 11 属于 2 belonging to the inner elevator aperture 1008. The portion is also shown in dashed lines.) As previously understood, 'by forming or removing the vacuum of the vacuum chamber, the DUT 112 can be clamped to and released from the bearing surface 1〇〇4 of the film substrate 1002. The platform 1104 can include a mechanism (not shown) for moving the mobile lift 1102 along the "z" axis (which can be perpendicular to the load bearing surface 1004 of the film substrate 1〇〇2 39 201140088, as shown), and so The rise DUT 112 exits the load bearing surface 1004 as shown in FIG. 11B. The platform 11〇4 may include a mobile lift 1102 for moving the movable lift 1102 and/or a “z” axis around the “x, y” plane (which may be parallel to the load bearing surface 1004 of the film substrate 1002). 〇 2 mechanism (not shown). As discussed above, until the elevator aperture 1008 of the membrane substrate 1002 is greater than the movable elevator 1102, the platform 11 〇4 can move the DUT 112 and/or surround the "z" in the "x, y" plane relative to the membrane substrate 1002. The shaft rotates the DUT 112. By repeating the following two or more times, the DUT 112 can move relative to the film substrate 1002 by a distance greater than the difference in size between the elevator aperture 1〇〇8 and the movable elevator 1102: the movable elevator 11〇2 is in the elevator aperture 1008 The internal first position 'lifts the DUT 112 away from the bearing surface 1004 of the film substrate 1002, moves the movable elevator 1102 relative to the film substrate 1002 (and thus moves the DUT 112), lowers the DUT 112 back onto the carrying surface 1004, and The movable elevator 丨1〇2 is moved back to the first position inside the elevator hole 1〇〇8. Thus, when the vacuum chamber 1006 has no vacuum and the DUT U2 is unclamped from the bearing surface 1〇〇4 of the film substrate 1002, the stage 1104 can move the DUT 112 to the bearing surface of the film substrate 1002 by moving the movable elevator 1102. The aligned position of the feature 118 is aligned with respect to the carrier on 1004. As shown in Figures UA and UB, the moving mechanism 314 can move the camera alignment feature 312 of the camera base 31 into and out of the mechanical linkage with the carrier alignment feature 118. As generally discussed above, the camera 304 can be in a known position relative to the camera alignment feature 312, such that when the camera alignment feature, the % configuration 312 (four) has the alignment feature 118 engaged, the camera 40 5 201140088 304 is also associated with the vehicle The alignment features 118 are aligned. Thus, the image of the DUT back-to-back feature taken by the camera as discussed above, which can be part of the terminal 1 丨 4) can be used to move the DUT 112 to the aligned position of the load-bearing surface 1004 of the film substrate. As previously discussed, the aligner 1〇4 need not include the camera 304 coupled to the features of the carrier alignment feature 118 (e.g., camera alignment feature 312). For example, camera 304 can be mounted to housing 302 or other structure of housing 302 (not shown). In this case, the camera 3G4 position may not be known relative to the carrier alignment feature (10), and the camera 304 may capture both the DUT alignment feature 212 (eg, in the terminal 114) and the carrier alignment feature 118. The image and material images may be used by the controller 3〇8 (and/or the operator) to move the DUT 112 to the alignment position on the carrier 116 for another example, and the camera 304 may be positioned relative to the alignment feature 118 and The known features of the alignment features (not shown in the drawings, but may be, for example, camera alignment features) within the housing 302 but not directly coupled to the fixture (not shown) of the camera 304 or the like. The alignment features (not shown) of the clamping mechanism or other device (not shown) can couple the carrier alignment feature 118 and thereby move the film carrier 1 to a position, wherein The carrier alignment feature 118 is tied to a known position relative to the camera 3〇4. The configuration of the aligner 104 shown in Figures 1 and 11B is only one example. Thus, for example, the aligner 1〇4 need not include all of the features or elements illustrated in the FIGS. 11A and 11B; the aligner 104 can have additional features or elements not shown in FIGS. 11A and 11B; and the aligner 1〇4 There may be 41 201140088 different features or elements than those shown in Figures 11A and 11B. For example, generally as discussed above with respect to FIG. 3, the aligner 1 4 need not include a camera alignment feature 312, a camera mount 310, or a moving mechanism 314 (eg, the camera 304 can be mounted within the housing 302 or housing 302). Other structure (not shown)). As another example, as discussed above, there may be a mechanical coupling mechanism (not shown) within the housing 302 that mechanically couples 118 and thereby moves the film carrier 1000 into a predetermined position relative to the camera 304. As another example, although the second camera 304 is displayed, there may be only one camera 3〇4 or more than two cameras 304. As yet another example, there may be more or fewer mobile lifts 1102 than shown in Figures HA and iiB, and the mobile lift 1102 may be configured in a different position or style than those shown in Figures 11A and 11B.
第12A及12B圖例示說明依據本發明之若干實施例，可 用來測試DUT 112/膜載具1000之組合的測試單元11〇之一 組態實例。如圖所示，第12A及12B圖之測試單元110可包 括具有一接取門124之殼體402，大致上如前文就第4A及4B 圖討論。測試單元110也可包括電連結404、具有探針410之 接觸器408、接觸器對齊特徵結構412、封414及壓力控制裝 置416，也大致上如前文就第4A及4B圖討論。第12A及12B 圖之測試單元110也可包括控制器418及記憶體420,也如前 文就第4A及4B圖討論。但與第4A及4B圖不同，第12A及12B 圖例示說明測試單元11 〇之實施例可包括卡盤1202及卡盤 升降機1204，其可為第4A及4B圖所示升降機406之實例。 如第12A及12B圖所示，平台1104可固持DUT 112/膜載具 1000之組合，其具有受測裝置已經移動至且夾緊於第11A ⑤ 42 201140088 及11B圖所示對齊器1〇4之膜基板1002的承載表面1004。如 此，DUT II2/膜載具1〇〇〇可置放在平台1104上，如第11Α 圖所示。 雖然圖中未顯示，導引機構可設置在殼體4〇3用以導引 測試單元11〇的DUT 112/膜載具1000在初始粗略方向，使得 例如’載具對齊特徵結構118粗略地但充分地對齊接觸器對 齊特徵結構412。此等導引機構（圖中未顯示）實例可包括導 軌、止動結構等（圖中未顯示）。 如圖所示，卡盤升降機1204可移動卡盤12〇2，使得載 具對齊特徵結構118可移出與接觸器對齊特徵結構412耦 聯，如第12Α圖所示。卡盤升降機12〇4也可移動卡盤12〇2， 使得載具對齊特徵結構118可移進而與接觸器對齊特徵結 構412耦聯，如第12Β圖所示。如前文討論，壓力控制器416 可增減接觸器408與DUT 112間之氣壓。 第12 Α及12 Β圖例示說明之測試單元i i 〇組態僅為其中 一實例。如此，例如測試單元11〇無需包括第12A及l2B圖 例不說明的全部特徵結構或元件；測試單元則可具有第 ΠΑ及1测所未顯示的額外特徵結構或元件：及測試單元 110可具有第12A及12B®不示不同的特徵結構或元件。至 於另-實例，測試單itlio無需包括壓力控制器416或封 414。 依據本發明之若干實施例多_ D U τ測試系統廳之一實 例及多-DUT測試系統刚之實施例的多個實例已如上舉例 說月現在將就第13至第is圖討論用以於多加下測試系統 43 201140088 100測試DUT 112之方法。但多-DUT測試系統100並未囿限 於依據第13至15圖例示說明之方法操作’該等方法係僅供 舉例說明之用。 大致上如前文討論，多個DUT 112可在多-DUT測試系 統100測試之方式係藉由在對齊器104將DUT 112對齊在載 具116上，及然後將DUT 112/載具116組合裝載入測試單元 110，此處測試DUT 112。如後文將瞭解，多-DUT測試系統 100並非限於串列地測試多個DUT 112。反而多-DUT測試系 統100可並排測試多個DUT 112。 第13圖例示說明依據本發明之若干實施例，一種用以 操作第1圖之多-DUT測試系統100之方法。於若干實施例， 方法1300可在控制器126上執行。例如，依據儲存在記憶體 128及/或有線電路（圖中未顯示）之程式碼操作，控制器126 可實施方法1300。如此，方法1300可全體或部分作為儲存 在記憶體128之程式碼具體實施。另外，方法13〇〇可在第i 圖未顯示的其它設備上執行。至於又另一實例，方法13〇〇 可全部或部分由操作人員執行》 任何給定時間在多-DUT測試系統1 〇〇可有多個DUT 112(例如2、3、5、10、20或更多），及DUT 112可在系統1〇〇 的不同時間點。參照第13圖，方法1300可包含迴路或類似 的操作特徵結構(例如中斷傳動操作特徵結構），其中方法 1300等候一或多個DUT 112係位在多-DUT測試系統1〇〇之 特定點，其中DUT 112準備移動至一不同點的指示。三個此 等點係例示說明於第13圖之實例。於步驟13〇2，方法13〇〇 44 201140088 可判定是否有一或多個新DUT 112。新DUT 112例如可為裝 載在裝載器102上的DUT 112。於步驟1306，方法1300可判 定一或多個DUT 112是否已經排齊對齊器1〇4内的載具 U6，及於步驟1310，方法1300可判定一或多個DUT 112是 否已經在測試單元110内完成測試。 於步驟1310，方法1300可判定是否有一個DUT 112(或 多個DUT 112)已經準備測試。當新DUT 112係載荷入裝載 器102時’裝載器1〇2可發送一信號、訊息等給控制器126。 如此，例如藉由測定是否已經從裝載器1〇2此種信號或訊 息。舉另一實例，方法13〇〇可在步驟丨3〇2查詢裝載器1〇2檢 測是是否有一或多個新DUT 112。若方法在步驟1302判定有 個新DUT 112準備供測試’則方法13〇〇可在步驟1304開始將 該新DUT 112在對齊器104内的載具116上對齊之處理程 序。如後文將瞭解，第14圖之方法1400為一種用以在對齊 器104對齊DUT 112之方法實例，及方法13〇〇可在步驟1304 開始方法1400。 於步驟1306，方法1300可判定在對齊器1〇4是否有一個 DUT 112已經移動至載具116上的對齊位置。當對齊器104 完成DUT 112對齊載具116之處理程序時，對齊器104可發送 信號、訊息等給控制器126。如此，例如藉由判定此種信號 或訊息是否已經接收自對齊器104而實施步驟1306。至於另 一實例，方法1300可在步驟1306查詢對齊器104而判定一或 多個DUT 112是否已經排齊對齊器104内的載具116。若方法 在步驟1306判定有個DUT 112係在對齊器104内的載具116 45 201140088 上的對齊位置’則方法1300可於步驟1308開始在測試單元 U〇測試對齊的DUT 112之處理程序。如後文將瞭解，第15 圖之方法1500為一種用以在測試單元110測試DUT 112之方 法實例’及方法1300可在步驟1308開始方法1500。 於步驟1310,方法1300可判定在測試單元110是否有已 經完成測試的DUT 112。當測試單元11〇完成測試DUT之處 理程序時，測試單元110可發送信號、訊息等給控制器126。 如此藉由判定此種信號或訊息是否已經從測試單元110接 收可實施步驟1310。至於另一實例，方法13〇〇可在步驟 1310查詢剛試單元11 〇判定是否已經在測試單元11 〇完成測 °式若方法在步驟13丨〇已經測定在測試單元110有個已測試 DUT 112’則方法13〇〇可在步驟1312開始已測試DUT 112之 測忒後處理，其可如同從測試系統100移開已測試DUT 112，或可包括獲得有關DUT 112之資訊。如後文將瞭解， 第16圖之方法16〇〇為一種用以後測試處理〇υτ U2之方法 實例’及方法1300可在步驟1312開始方法1600。 仍然參考第13圖’如圖所示，方法13〇〇可包括設定〇υτ 112之溫度之步驟1314。溫度例如可為dut 112將在測試單 元110測試之溫度。步驟1314在第13圖係浮動顯示，原因在 於步驟1314可在方法13〇〇期間的任何時間執行。舉例言 之，步驟1314可在DUT 112置放在載具116之後而在DUT 112在載具116上對齊之前進行，使得dut 112約略係在DUT 112將在測試單元110内測試之溫度。舉另一實例，步驟1314 可在DUT 112對齊載具116之後(例如在步驟13〇4之始），但 ⑤ 46 201140088 在DUT 112/載具116之組合載荷至測試單元丨〖〇之前（例如 在步驟1308之始）進行。無論與何時執行，步驟1314可包含 致動溫度控制裝置210(參考第3、5A、5BA10圖）來將DUT 112調整至期望溫度(例如DUT 112將在測試單元丨1〇測試之 溫度）。於若干實施例，步驟1300無需包括步驟1314，或在 方法1300之給定執行期間無需施行步驟丨3丨4。 方法1300僅為在多-DUT測試系統1〇〇中用以測試DUT 112之方法實施例之一實例。舉例言之，方法1300可具有第 13圖未顯示的額外步驟；方法1300無需具有第13圖所示全 部步驟；方法1300可具有與第13圖所示不同步驟；及/或圖 1300所示步驟順序可有不同。 如所述，第14圖例示說明一種用以在對齊器1〇4内將 DUT 112對齊載具116之方法1400之一實例，及方法1400可 始於方法1300之步驟1304。於若干實施例，方法1400可藉 對A器104之控制器3〇8及/或測試單元no之控制器126執 行。舉例言之，步驟14〇2可藉控制器126實現，而步驟 1404-1410可藉控制器308實現。於若干實施例，方法1400 可藉依據儲存在記憶體316、記憶體128及/或有線電路（圖中 未顯不）之程式碼操作的控制器308及/或控制器126實現。如 此’方法_可全部或部分實現為儲存在記憶體316及/或 128的程式碼。另外，方法丨可在關未顯示之其它設備 執行。至於又另-替代之道，方法剛可全部或部分由操 作人員執行。 如前述，方法1300在步驟13〇2判定有個新DUT欲測試 47 201140088Figures 12A and 12B illustrate one configuration example of a test unit 11 that can be used to test a combination of DUT 112 / film carrier 1000 in accordance with several embodiments of the present invention. As shown, the test unit 110 of Figures 12A and 12B can include a housing 402 having a access door 124, generally as discussed above with respect to Figures 4A and 4B. Test unit 110 may also include electrical connections 404, contactors 408 having probes 410, contactor alignment features 412, seals 414, and pressure control devices 416, also generally as discussed above with respect to Figures 4A and 4B. The test unit 110 of Figures 12A and 12B may also include a controller 418 and a memory 420, as discussed above with respect to Figures 4A and 4B. However, unlike Figures 4A and 4B, Figures 12A and 12B illustrate an embodiment of the test unit 11 that may include a chuck 1202 and a chuck lift 1204, which may be an example of an elevator 406 as shown in Figures 4A and 4B. As shown in Figures 12A and 12B, the platform 1104 can hold a combination of the DUT 112/membrane carrier 1000 with the device under test having been moved to and clamped to the aligner 1〇4 shown in Figures 11A 5 42 201140088 and 11B. The bearing surface 1004 of the film substrate 1002. Thus, the DUT II2/membrane carrier 1 can be placed on the platform 1104 as shown in Figure 11. Although not shown in the drawings, the guiding mechanism can be disposed in the housing 4〇3 to guide the DUT 112/film carrier 1000 of the test unit 11〇 in an initial coarse direction such that, for example, the carrier alignment feature 118 is roughly but The contactor alignment feature 412 is fully aligned. Examples of such guiding mechanisms (not shown) may include rails, stop structures, etc. (not shown). As shown, the chuck lifter 1204 can move the chuck 12〇2 such that the carrier alignment feature 118 can be removed for coupling with the contactor alignment feature 412, as shown in FIG. The chuck elevator 12〇4 can also move the chuck 12〇2 such that the carrier alignment feature 118 can be moved to couple with the contactor alignment feature 412, as shown in FIG. As discussed above, the pressure controller 416 can increase or decrease the air pressure between the contactor 408 and the DUT 112. The test unit i i 〇 configuration illustrated in the 12th and 12th drawings is only one example. Thus, for example, the test unit 11 does not need to include all the features or components not illustrated in the 12A and 12B legends; the test unit may have additional features or components not shown in the first and second measurements: and the test unit 110 may have the 12A and 12B® do not show different features or components. As for the other example, the test single itlio does not need to include the pressure controller 416 or the seal 414. An example of a multi-DU τ test system hall and a plurality of examples of a multi-DUT test system according to several embodiments of the present invention have been exemplified above, and will now be discussed for the thirteenth to the is. Next test system 43 201140088 100 method of testing DUT 112. However, the multi-DUT test system 100 is not limited to operation in accordance with the methods illustrated in Figures 13 through 15 and the methods are for illustrative purposes only. Roughly as discussed above, multiple DUTs 112 may be tested in the multi-DUT test system 100 by aligning the DUT 112 on the carrier 116 at the aligner 104, and then loading the DUT 112/carrier 116 in combination. The test unit 110 is entered, where the DUT 112 is tested. As will be appreciated later, the multi-DUT test system 100 is not limited to testing a plurality of DUTs 112 in series. Instead, the multi-DUT test system 100 can test multiple DUTs 112 side by side. Figure 13 illustrates a method for operating the multi-DUT test system 100 of Figure 1 in accordance with several embodiments of the present invention. Method 1300 can be performed on controller 126 in several embodiments. For example, controller 126 may implement method 1300 in accordance with code operations stored in memory 128 and/or wired circuitry (not shown). Thus, method 1300 can be implemented in whole or in part as a code stored in memory 128. Alternatively, method 13 can be performed on other devices not shown in FIG. As yet another example, method 13 can be performed in whole or in part by an operator. There can be multiple DUTs 112 (eg, 2, 3, 5, 10, 20 or at any given time in the multi-DUT test system 1). More), and the DUT 112 can be at different points in the system. Referring to Figure 13, method 1300 can include a loop or similar operational feature (e.g., interrupting the operational characteristics of the operation), wherein method 1300 waits for one or more DUTs 112 to be tied at a particular point in the multi-DUT test system. The DUT 112 is ready to move to an indication of a different point. Three such points are illustrated by way of example in Figure 13. In step 13〇2, method 13〇〇 44 201140088 may determine whether there are one or more new DUTs 112. The new DUT 112 can be, for example, a DUT 112 that is loaded on the loader 102. At step 1306, method 1300 can determine whether one or more DUTs 112 have aligned the carrier U6 within aligner 1-4, and at step 1310, method 1300 can determine whether one or more DUTs 112 are already in test unit 110. Complete the test within. At step 1310, method 1300 can determine if a DUT 112 (or multiple DUTs 112) is ready to test. When the new DUT 112 is loaded into the loader 102, the loader 1〇2 can send a signal, message, etc. to the controller 126. Thus, for example, by measuring whether such a signal or message has been received from the loader 1 . As another example, the method 13 can query the loader 1〇2 at step 〇2 to check if there is one or more new DUTs 112. If the method determines in step 1302 that a new DUT 112 is ready for testing, then method 13 may begin processing the new DUT 112 on the carrier 116 within the aligner 104 at step 1304. As will be appreciated later, the method 1400 of FIG. 14 is an example of a method for aligning the DUT 112 at the aligner 104, and the method 13 can begin the method 1400 at step 1304. At step 1306, method 1300 can determine if aligner 1 〇 4 has a DUT 112 that has moved to an aligned position on carrier 116. When the aligner 104 completes the processing of the DUT 112 aligning the carrier 116, the aligner 104 can send signals, messages, etc. to the controller 126. Thus, step 1306 is implemented, for example, by determining if such a signal or message has been received from aligner 104. As another example, method 1300 can query aligner 104 at step 1306 to determine if one or more DUTs 112 have aligned carriers 116 within aligner 104. If the method determines in step 1306 that there is a DUT 112 tied to the alignment position on the carrier 116 45 201140088 in the aligner 104, then the method 1300 can begin testing the aligned DUT 112 processing at the test unit U at step 1308. As will be appreciated later, the method 1500 of FIG. 15 is a method example for testing the DUT 112 at the test unit 110 and the method 1300 can begin the method 1500 at step 1308. At step 1310, method 1300 can determine if there is a DUT 112 at test unit 110 that has completed testing. When the test unit 11 〇 completes testing the DUT procedure, the test unit 110 may send a signal, message, etc. to the controller 126. Step 1310 can be implemented by determining if such a signal or message has been received from test unit 110. As another example, the method 13 can query the just-test unit 11 in step 1310 to determine whether the test unit 11 has completed the measurement. If the method has been determined in step 13, the test unit 110 has a tested DUT 112. The method 13 may begin the post-test processing of the tested DUT 112 at step 1312, which may be like removing the tested DUT 112 from the test system 100, or may include obtaining information about the DUT 112. As will be appreciated later, the method 16 of FIG. 16 is a method for processing 〇υτ U2 with subsequent tests. The method ’ and the method 1300 can begin the method 1600 at step 1312. Still referring to Fig. 13' as shown, method 13A can include a step 1314 of setting the temperature of 〇υτ 112. The temperature can be, for example, the temperature at which dut 112 will be tested at test unit 110. Step 1314 is shown floating in Figure 13 for the reason that step 1314 can be performed at any time during method 13A. For example, step 1314 can be performed after DUT 112 is placed on carrier 116 and before DUT 112 is aligned on carrier 116 such that dut 112 is approximately tied to the temperature at which DUT 112 will be tested within test unit 110. As another example, step 1314 may be after DUT 112 aligns carrier 116 (eg, at the beginning of step 13〇4), but 5 46 201140088 before the combined load of DUT 112/carrier 116 is loaded to test unit ( 〇 (eg, This is done at the beginning of step 1308. Regardless of when and when executed, step 1314 can include actuating temperature control device 210 (refer to Figures 3, 5A, 5BA10) to adjust DUT 112 to a desired temperature (e.g., the temperature at which DUT 112 will be tested at test unit 丨1〇). In several embodiments, step 1300 need not include step 1314, or step 丨3丨4 is not required during a given execution of method 1300. Method 1300 is merely one example of a method embodiment for testing DUT 112 in a multi-DUT test system. For example, method 1300 can have additional steps not shown in FIG. 13; method 1300 need not have all of the steps shown in FIG. 13; method 1300 can have different steps than shown in FIG. 13; and/or steps shown in FIG. The order can vary. As illustrated, FIG. 14 illustrates an example of a method 1400 for aligning the DUT 112 with the carrier 116 within the aligner 1-4, and the method 1400 can begin at step 1304 of the method 1300. In some embodiments, method 1400 can be performed by controller 〇8 of controller 104 and/or controller 126 of test unit no. For example, step 14〇2 can be implemented by controller 126, and steps 1404-1410 can be implemented by controller 308. In some embodiments, method 1400 can be implemented by controller 308 and/or controller 126 that operates in accordance with code stored in memory 316, memory 128, and/or wired circuitry (not shown). Thus, the method may be implemented in whole or in part as a code stored in the memory 316 and/or 128. In addition, the method can be executed on other devices that are not displayed. As for the alternative-alternative approach, the method can only be performed in whole or in part by the operator. As described above, the method 1300 determines in step 13〇2 that there is a new DUT to test 47 201140088
後，可藉方法1300於步驟1304開始方法1400。如第14圖所 示，於步驟1402，新DUT 112可裝載入對齊器104。新DUT 112可以前述任一方式裝載入對齊器104。舉例言之，新DUT 112可置放在對齊器104外側的載具116上（例如裝载器102 内），及DUT 112/載具116之組合可裝載入對齊器104。另 外’新DUT 112可裝載入對齊器104及置放在已經在對齊器 104内的載具116上。雖言如此，包括機器手臂12〇之移動器 106可將新DUT 112或DUT 112/載具116之組合從裝載器1〇2 移動至對齊器104。結果可為如第3圖例示說明之在對齊器 104内的DUT 112/載具116之組合；如第7B圖所示DUT 112/ 定位盤載具500之組合，其中定位盤502係配置在具有定位 盤對齊特徵結構510耦聯空腔對齊特徵結構的空腔6〇6 ;或 如第11A圖所示’ DUT 112/膜載具1〇〇〇之組合其它膜基板 1002係設置在平台1104上。 若並無對齊器104可資利用（例如在對齊器ι〇4有另一 DUT)，則方法1400可經組配來將新DUT 112移動至固持位 置（圖中未顯示）’或將DUT 112留在裝載器1〇2直至對齊器 104變成可資利用為止。如前文瞭解，在多_Dut測試系統 100可有多於一個對齊器104。 如前文就第3圖討論，對齊器1〇4可包括包含移動機構 314之攝影機系統，及耗接至具有攝影機對齊特徵結構312 的攝影機座310之一或多個攝影機3〇4。於步驟14〇4，方法 1400對接(docking)攝影機系統，使得攝影機3〇4係在相對於 載具116的已知位置。舉例言之，於第3圖所示對齊器1〇4之 ⑤ 48 201140088 實施例，移動機構314可移動攝影機座31〇，使得攝影機對 齊特徵結構312耦接載具對齊特徵結構118，如第3圖所示。 如前文討論，此時攝影機304係在相對於載具對齊特徵纟士構 118的已知位置。舉另一實例’於第6八及祕圖所示對齊器 1〇4之實施例中（其利用第5八至5〇：圖例示說明之定位盤載具 5〇〇)，移動機構314可移動攝影機座31〇，使得攝影機對齊 特徵結構312辆接卡盤對齊特徵結構62〇，如第78圖所示。 如前文討論，此時攝影機304係位在相對於卡盤對齊特徵結 構620的已知位置。至於又另一實例，於第Ua&iib圖^ 示對齊器104之實施例中（其利用第1〇Α及1〇Β圖例示說明之 膜載具1000)，移動機構314可移動攝影機座31〇，使得攝影 機對齊特徵結構312耦接載具對齊特徵結構U8，如第 及11B圖所示。如前文討論，此時攝影機3〇4係位在相對於 載具對齊特徵結構118的已知位置。 步驟M〇4另外可如i文討論，藉由將失具或對齊器ι〇4 内的其它裝置（圖中未顯示）之耦聯機構移動至與載具對齊 特徵結構118耦聯。此種耦聯機構（圖中未顯示）可位在相對 於攝影_4的已知位置’及與載具對齊特徵結則職聯 可將載具對齊特徵結構118及如此將魅116(包括此處揭 示的載具116之任一實施例，諸如定位盤载具5〇〇及膜載具 1000)移至相對於攝影機304的已知位置。 但如前文討論，對齊器104之若干實施例可具有缺對接 能力的攝影機系統。舉例言之，此等對齊器1〇4實施例可包 含安裝在殼體302之一或多個攝影機304，或對齊器1〇4之另 49 201140088 一結構但缺攝衫機對齊特徵結構312。對對齊器i〇4之若干 實施例，可跳過步驟1404或從方法1400中遺漏該步驟。 於第Μ圖之步驟1406，方法1400可拍攝如在載具116上 對齊DUT 112所需的全部或部分DUT 112及/或載具116之影 像(例如數位影像）。對齊器丨04内的攝影機系統具有前文就 步驟1404所討論的對接能力，方法丨4〇〇可只拍攝DUT對齊 特徵結構212影像。（如前文瞭解，附圖中，dut對齊特徵 結構212乃全部或部分DUT 112之終端114中之一或多者，但 對齊特徵結構可為具有與終端114中之一或多者偏位的分 開的結構、形狀、記號等）。因攝影機304係位在相對於載 具116的已知位置’DUT 112可只使用對齊特徵結構212影像 而在載具112上對齊。 另一方面，若對齊器104缺乏前文就步驟14〇4所討論的 對接能力’則方法1400可於步驟1406拍攝DUT對齊特徵結 構212及步驟1406中載具116上的對齊特徵結構影像。舉例 言之，若第3圖所示對齊器1〇4之實施例並未包括攝影機對 齊特徵結構312，則可在步驟1406拍攝DUT對齊特徵結構 212及載具對齊特徵結構118之影像。至於另一實例，若第 6A及6B圖所示對齊器1〇4之實施例並未包括攝影機對齊特 徵結構312，則DUT對齊特徵結構212及卡盤對齊特徵結構 620之影像可在步驟14〇6獲得。舉又另一實例，若第UA及 1B圖所示對齊器104之實施例不包括攝影機對齊特徵結構 312 ’則可在步驟14〇6拍攝dut對齊特徵結構212及載具對 齊特徵結構118之影像。 ⑤ 50 201140088 與步驟1406之執行方式獨立無關 ，於若干實施例，藉 攝影機304拍攝的影像可包括全職料DUT 112之邊緣 130。舉例言之’影像可包含全部邊緣130或包括定向標記 132的部分邊緣13Q，如前文討冑，其可為邊緣⑽之不規則 部分。此種實施例中’步驟14〇6可包括識別Dut 112之〇111 對齊特徵結構212(例如終端114)相對於dut 112之部分或Method 1400 can then be initiated at step 1304 by method 1300. As shown in Figure 14, at step 1402, the new DUT 112 can be loaded into the aligner 104. The new DUT 112 can be loaded into the aligner 104 in any of the ways described above. For example, the new DUT 112 can be placed on the carrier 116 outside of the aligner 104 (eg, within the loader 102), and the combination of the DUT 112/carrier 116 can be loaded into the aligner 104. Additionally, the new DUT 112 can be loaded into the aligner 104 and placed on the carrier 116 already within the aligner 104. Although so, the mover 106, including the robotic arm 12, can move the new DUT 112 or DUT 112/carrier 116 combination from the loader 1〇2 to the aligner 104. The result may be a combination of DUT 112/carrier 116 within aligner 104 as illustrated in FIG. 3; a combination of DUT 112/positioning disk carrier 500 as shown in FIG. 7B, wherein locating disk 502 is configured to have The locating disc alignment feature 510 couples the cavity 6〇6 of the cavity alignment feature; or the combination of the DUT 112/film carrier 1 其它 as shown in FIG. 11A is disposed on the platform 1104. . If no aligner 104 is available (e.g., there is another DUT in aligner ι 4), method 1400 can be assembled to move new DUT 112 to a holding position (not shown) or to DUT 112 It remains in the loader 1〇2 until the aligner 104 becomes available. As previously discussed, there may be more than one aligner 104 in the multi-Dut test system 100. As discussed above with respect to FIG. 3, the aligner 1-4 may include a camera system including a moving mechanism 314 and one or more cameras 3-4 that are consuming to a camera base 310 having a camera alignment feature 312. At step 14A4, method 1400 docks the camera system such that camera 3〇4 is in a known position relative to carrier 116. For example, in the embodiment of the aligner 1 4 of FIG. 3, the mobile unit 314 can move the camera base 31〇 such that the camera alignment feature 312 is coupled to the carrier alignment feature 118, such as the third. The figure shows. As previously discussed, camera 304 is now in a known position relative to the vehicle alignment feature gentleman 118. As another example, in the embodiment of the aligner 1-4 shown in the sixth and third figures (which utilizes the fifth to fifth 〇: locating disk carrier 5 图 illustrated), the moving mechanism 314 can The camera mount 31 is moved such that the camera alignment feature 312 is coupled to the chuck alignment feature 62, as shown in FIG. As discussed above, camera 304 is now in a known position relative to chuck alignment feature 620. As yet another example, in a Ua&iib embodiment of the aligner 104 (which utilizes the film carrier 1000 illustrated in Figures 1 and 1), the moving mechanism 314 can move the camera mount 31. That is, the camera alignment feature 312 is coupled to the carrier alignment feature U8 as shown in FIGS. 11B. As discussed above, the camera 3〇4 is now in a known position relative to the carrier alignment feature 118. Step M〇4 can additionally be discussed as discussed in i by coupling the coupling mechanism of the misalignment or other means (not shown) in the aligner ι 4 to the carrier alignment feature 118. Such a coupling mechanism (not shown) can be positioned at a known position relative to the camera _4 and the alignment feature with the carrier can align the carrier with the feature 118 and thus the charm 116 (including this Any of the disclosed embodiments of the carrier 116, such as the locator disk carrier 5 and the film carrier 1000, are moved to a known position relative to the camera 304. However, as discussed above, several embodiments of aligner 104 may have a camera system that lacks docking capabilities. For example, such aligner 1 〇 4 embodiments may include one or more cameras 304 mounted to housing 302, or another of the aligners 1 2011 4 201140088, but lacking the camera alignment feature 312. For several embodiments of aligner i 〇 4, step 1404 may be skipped or omitted from method 1400. At step 1406 of the figure, method 1400 can capture images (e.g., digital images) of all or a portion of DUT 112 and/or carrier 116 as needed to align DUT 112 on carrier 116. The camera system in the aligner 丨04 has the docking capability discussed above with respect to step 1404, and the method 拍摄4〇〇 can only capture the DUT alignment feature 212 image. (As previously appreciated, in the figures, the dut alignment feature 212 is one or more of all or part of the terminal 114 of the DUT 112, but the alignment feature may be separate from one or more of the terminals 114. Structure, shape, mark, etc.). Since the camera 304 is in a known position relative to the carrier 116, the DUT 112 can be aligned on the carrier 112 using only the alignment feature 212 image. On the other hand, if the aligner 104 lacks the docking capability discussed above with respect to step 14〇4, the method 1400 can capture the DUT alignment feature 212 at step 1406 and the alignment feature image on the carrier 116 in step 1406. For example, if the embodiment of the aligner 1 〇 4 shown in FIG. 3 does not include the camera alignment feature 312, the image of the DUT alignment feature 212 and the carrier alignment feature 118 can be taken at step 1406. As another example, if the embodiment of the aligner 1 〇 4 shown in FIGS. 6A and 6B does not include the camera alignment feature 312, the image of the DUT alignment feature 212 and the chuck alignment feature 620 may be in step 14. 6 obtained. As another example, if the embodiment of the aligner 104 shown in Figures UA and 1B does not include the camera alignment feature 312', the image of the dut alignment feature 212 and the carrier alignment feature 118 can be captured at step 14〇6. . 5 50 201140088 Independent of the manner in which step 1406 is performed, in some embodiments, images captured by camera 304 may include edges 130 of full-time DUT 112. For example, the image may include all of the edges 130 or a portion of the edge 13Q including the orientation marks 132, which may be an irregular portion of the edge (10) as previously discussed. In this embodiment, 'step 14〇6' may include identifying a portion of the 〇111 alignment feature 212 (e.g., terminal 114) of Dut 112 relative to dut 112 or
全部邊緣130之位置。舉例言之，步驟14〇6可包括識別dUT 112之DUT對齊特徵結構2丨2(例如終端丨丨4)相對於定向特徵 結構132(例如邊緣13〇之不規則部分）之位置。又作為步驟 1406之一部分，該等識別出的位置可儲存(例如在記憶體(例 如記憶體316及/或記憶體128))及用在方法14〇〇之未來執行 而找出對齊器104内對齊的未來DUT 112之對齊特徵結構 212(例如終端114)。舉例言之，方法1400可找出對齊器1〇4 内對齊的下一個DUT 112之對齊特徵結構212(例如終端The position of all edges 130. For example, step 14A6 may include identifying the location of the DUT alignment feature 2丨2 of the dUT 112 (e.g., terminal 丨丨4) relative to the directional feature 132 (e.g., the irregular portion of the edge 13〇). As part of step 1406, the identified locations can be stored (e.g., in memory (e.g., memory 316 and/or memory 128)) and used in future execution of method 14 to find aligner 104. The alignment feature 212 of the aligned future DUT 112 (e.g., terminal 114). For example, method 1400 can find alignment feature 212 of the next DUT 112 aligned within aligner 1-4 (eg, a terminal
U4)，其方式係藉由找出攝影機3〇4拍攝的影像中的DUT 112之邊緣130或部分邊緣130(例如定向標記132)，及然後，U4) by finding the edge 130 or part of the edge 130 of the DUT 112 (eg, the orientation mark 132) in the image taken by the camera 3〇4, and then,
利用所儲存的對齊特徵結構212位置而相對於前一個DUT 112之邊緣130或部分邊緣130(例如定向標記132)，定位對齊 特徵結構212。 於第14圖步驟1408，方法1400可利用在止驟1406所拍 攝影像而將DUT 112移動至載具116上的對齊位置。於第3 圖例示說明之對齊器104實施例，步驟1406可如下完成。夾 緊機構208可釋放DUT 112,使得DUT 112可在載具116的承 栽表面204上自由移動。然後移動機構306可相對載具116移 51 201140088 動DUT 112直至DUT係在載具116上的對齊位置。如前文討 論，移動機構306可致動地移動DUT 112、載具116, 112與載具116。一旦DUT 112係在載具116上的對齊位置， 則夾緊機構208可齧合而夾緊DUT 112在載具116上的對齊 位置。 第6A及6B圖例示說明之用於定位盤載具500的對齊器 104之實施例中，步驟1408可如下完成。參考第7B圖，在定 位盤502承載表面504的真空槽506内的真空可解除，使得 DUT 112係在承載表面504上自由移動；而在卡盤6〇2之上表 面604的真空槽614可形成真空’使得DUT 112被夾緊至上表 面604。然後卡盤602可相對於定位盤502移動DUT 112直至 DUT係在定位盤載具500上的對齊位置為止。一旦DUT 112 係在定位盤載具500上的對齊位置，藉由在真空槽506形成 真空，DUT 112可被夾緊至定位盤502的承載表面504。真空 槽614的真空可解除將DUT 112從卡盤602之上表面604釋 放。如前文瞭解，真空槽506及/或真空槽614可以另一型夾 緊機構諸如機械夾具等置換。 如第10A及10B圖例示說明之用於膜載具1〇〇〇的對齊 器104實施例，步驟1408可如下完成。參考第11A圖，在膜 基板1002之承載表面10〇4的真空槽之真空可經解除， 因而DUT 112係自由地在承載表面1〇〇4上移動。活動式升降 機1102然後將DUT 112舉升離開膜基板1〇〇2之承載表面 1004 ’如第11B圖所示。平台11〇4可相對於載具對齊特徵結 構118，移動活動式升降機11〇2及如此移動DUT 112，直至 ⑤ 52 201140088 DUT係在相對於膜載具looo上載具對齊特徵結構1 a的對 齊位置。活動式升降機1102然後可將DUT 112降回膜基板 1102之承載表面1004。前文說明可視需要重複直至dut ιι2 係在膜載具1000上的對齊位置。然後，藉由在真空槽1〇〇6 形成真空，DUTU2可被夾緊至承載表面1〇〇4的對齊位置。 如前文瞭解，真线驅可以另—型夾緊機構諸如機械夹 具等置換。 於步驟1408，DUT 112係炎緊至載具116在位。如前文 瞭解’對齊的」或「對齊位置」表示DUT 112係位在載具 116(或此處所述載具H6之任何實施例，包括定位盤載具 500及膜載具1 〇〇〇)上相對於載具的對齊特徵結構(例如載具 對齊特徵結構118或定位盤載具500)，其將對接測試單元 110中的對應接觸器對齊特徵結構(例如接觸器對齊特徵結 構412或空腔對齊特徵結構81〇)位置’使得dUT U2之終端 114係充分地對齊接觸器4〇8之探針41〇，因而終端114與探 針410作接觸而藉此建立電連結。 於步驟1410’方法14〇〇可發送對齊已完成之信號或訊 息。舉例言之，方法14〇〇可發送此種信號或訊息給控制器 126 ’其然後使得第13圖之方法13〇〇在下次執行步驟13〇6時 做肯定判定’及分支至步驟13〇8而裝載載具116/DUt組合 至測試單元11〇内。 方法1400僅為一種用以在對齊器104内在載具116對齊 DUT 112之方法之實施例其中一例。舉例言之，方法1400 可具有第14圖未顯示的額外步驟；方法1400無需具有第14 53 201140088 圖所示全部步驟；方法1400可具有與第13圖所示不同步 驟；及/或數字1400所示步驟順序可不同。舉例言之，步驟 1406及1408可在執行方法14〇〇期間視需要而重複，例如在 執行方法1400期間，於步驟1406可拍攝DUT對齊特徵結構 212影像’ DUT 112可於步驟1408在載具116上移動，及藉由 重複步驟1406而拍攝DUT對齊特徵結構212的新影像。然 後’步驟1408及然後1406可重複直至DUT 112係在載具116 上的對齊位置，如步驟1406拍攝的DUT對齊特徵結構212之 新影像指示。 如所述，第15圖例示說明一種用於在測試單元11()内測 試在載具116上對齊的DUT 112之方法1500之實例。於若干 實施例’方法1500可藉測試單元11〇之控制器418及/或測試 單元110之控制器126執行。舉例言之，步驟15〇2可藉控制 器126實現，及步驟1504-1510可藉控制器418實現。於若干 實施例’方法1500可藉依據儲存在記憶體420、記憶體128 及/或有線電路（圖中未顯示）之程式碼而操作的控制器418 及/或控制器126實現。如此’方法15〇〇可全部或部分以儲 存在記憶體420及/或記憶體128的程式碼具體實施。另外， 方法1500可在圖式中未顯示的其它設備上跑。至於又另一 實例’方法1500可全部或部分藉操作人員執行。 如前述’方法1500可始於方法13〇〇步驟1308在方法 1300於步驟1306判定DUT 112已經在對齊器1〇4内對齊載具 116上之後。如第15圖所示，藉對齊器1〇4而對齊的DUT 112/ 載具116之組合可於步驟1502從對齊器1〇4移動且裝載入測 ⑧ 54 201140088 試單元110。DUT 112/載具116之組合可以前述任一方式從 對齊器104移開而裝載入測試單元110。舉例言之，包括一 或多個機器手臂之移動器106可將DUT 112/載具116之組合 從對齊器104移開，及將DUT 112/載具116之組合裝載入測 試單元110。結果可為在測試單元110之DUT 112/載具116之 組合，如第4A圖例示說明；DUT 112/定位盤載具500組合， 其中定位盤502係配置在空腔806而定位盤對齊特徵結構 510係耦接空腔對齊特徵結構81〇，如第9B圖所示；或DUT 112/膜載具1〇〇〇組合附有裝載器1〇2在卡盤1202上而載具對 齊特徵結構118係耦接升降機耦聯機構512,如第12B圖所示。 若並無測試單元110可資利用（例如在全部測試單元 110皆有DUT 112/載具116之組合），則方法1500可經組配來 將OUT 112/載具110之組合從對齊器104移動至固持位置 (圖中未顯示）’或將DUT 112/載具116之組合留在對齊器104 直到測試單元110變成可資利用為止。 於步驟1504，方法1500可在測試單元11〇對接載具 116(具有DUT 112夾緊在載具116上的對齊位置），使得DUT 之終端114係對齊接觸器408之探針410。於第4A及4B圖例 示說明之測試單元110之實施例，步驟1504可藉由移動載具 116使得載具對齊特徵結構丨丨卩耦聯接觸器對齊特徵結構 412完成，如第4B圖所示。如前文瞭解，DUT 112係對齊載 具116 ’使得載具對齊特徵結構118與接觸器對齊特徵結構 412的耦聯對齊終端114與探針410。 於第8 A及8B圖例示說明之測試單元11 〇之實施例，步 55 201140088 驟15〇4可藉*如下力成，藉錢得包升降機8丨6移動卡盤 8〇2’及如此移動DUT 112/定位盤载具5〇〇之組合，因而卡 盤對齊特徵結構耦聯接觸器對_結構—The alignment feature 212 is positioned relative to the edge 130 of the previous DUT 112 or a portion of the edge 130 (e.g., orientation mark 132) using the stored alignment feature 212 position. At step 1408 of FIG. 14, method 1400 can utilize the photographic image taken at stop 1406 to move DUT 112 to the aligned position on carrier 116. In the embodiment of the aligner 104 illustrated in FIG. 3, step 1406 can be accomplished as follows. The clamping mechanism 208 can release the DUT 112 such that the DUT 112 can move freely over the carrier surface 204 of the carrier 116. The moving mechanism 306 can then move the DUT 112 relative to the carrier 116 until the DUT is in an aligned position on the carrier 116. As discussed above, the mobile mechanism 306 can actuately move the DUT 112, the carriers 116, 112, and the carrier 116. Once the DUT 112 is in the aligned position on the carrier 116, the clamping mechanism 208 can engage to clamp the aligned position of the DUT 112 on the carrier 116. In the embodiment illustrated in Figures 6A and 6B for aligning the aligner 104 of the disc carrier 500, step 1408 can be accomplished as follows. Referring to FIG. 7B, the vacuum in the vacuum chamber 506 of the carrier surface 504 of the positioning disk 502 can be released, so that the DUT 112 is free to move on the bearing surface 504; and the vacuum groove 614 on the surface 604 of the upper surface 604 of the chuck 6? Forming a vacuum ' causes the DUT 112 to be clamped to the upper surface 604. The chuck 602 can then move the DUT 112 relative to the locating disc 502 until the DUT is in an aligned position on the locating disc carrier 500. Once the DUT 112 is in the aligned position on the locating disc carrier 500, the DUT 112 can be clamped to the load bearing surface 504 of the locating disc 502 by creating a vacuum in the vacuum slot 506. The vacuum of the vacuum slot 614 releases the DUT 112 from the upper surface 604 of the chuck 602. As previously discussed, the vacuum chamber 506 and/or the vacuum chamber 614 can be replaced by another type of clamping mechanism such as a mechanical clamp or the like. As an embodiment of the aligner 104 for the film carrier 1 例 illustrated in Figures 10A and 10B, step 1408 can be accomplished as follows. Referring to Fig. 11A, the vacuum in the vacuum chamber of the bearing surface 10〇4 of the film substrate 1002 can be released, so that the DUT 112 is free to move on the bearing surface 1〇〇4. The movable elevator 1102 then lifts the DUT 112 away from the bearing surface 1004' of the film substrate 1'' as shown in Fig. 11B. The platform 11〇4 is movable relative to the carrier alignment feature 118, moving the mobile elevator 11〇2 and thus moving the DUT 112 until the 5 52 201140088 DUT is in an aligned position relative to the film carrier looo loading alignment feature 1 a . The movable elevator 1102 can then lower the DUT 112 back to the load bearing surface 1004 of the film substrate 1102. The foregoing description may be repeated as needed until the dut ιι2 is attached to the film carrier 1000. Then, by forming a vacuum in the vacuum chamber 1〇〇6, the DUTU 2 can be clamped to the aligned position of the bearing surface 1〇〇4. As previously understood, the true line drive can be replaced by another type of clamping mechanism such as a mechanical clamp. At step 1408, the DUT 112 is inflamed until the carrier 116 is in place. As previously understood, 'aligned' or 'aligned position' means that the DUT 112 is in the carrier 116 (or any embodiment of the carrier H6 described herein, including the locator carrier 500 and the film carrier 1). Aligning features relative to the carrier (eg, carrier alignment feature 118 or locator disk carrier 500) that will align corresponding contact alignment features in the test unit 110 (eg, contactor alignment features 412 or cavities) The alignment feature 81〇) is positioned such that the terminal 114 of the dUT U2 is sufficiently aligned with the probe 41〇 of the contactor 4〇8 such that the terminal 114 makes contact with the probe 410 thereby establishing an electrical connection. At step 1410, method 14 can send a signal or message that the alignment has been completed. For example, method 14A may send such a signal or message to controller 126 'which then causes method 13 of FIG. 13 to make a positive determination at the next step 13 〇 6 and branch to step 13 〇 8 The loading carrier 116/DUt is combined into the test unit 11A. Method 1400 is but one example of an embodiment of a method for aligning DUT 112 with carrier 116 within aligner 104. For example, method 1400 can have additional steps not shown in FIG. 14; method 1400 need not have all of the steps shown in FIG. 14 53 201140088; method 1400 can have different steps than shown in FIG. 13; and/or number 1400 The order of the steps can be different. For example, steps 1406 and 1408 may be repeated as needed during execution of method 14 ,. For example, during execution of method 1400, DUT alignment feature 212 may be captured at step 1406. Image DUT 112 may be at step 1408 at carrier 116. Move up, and take a new image of the DUT alignment feature 212 by repeating step 1406. Then, steps 1408 and then 1406 can be repeated until the DUT 112 is aligned on the carrier 116, as indicated by the new image indication of the DUT alignment feature 212 taken at step 1406. As illustrated, FIG. 15 illustrates an example of a method 1500 for testing the DUT 112 aligned on the carrier 116 within the test unit 11(). Method 1500 may be performed by controller 418 of test unit 11 and/or controller 126 of test unit 110 in a number of embodiments. For example, step 15〇2 can be implemented by controller 126, and steps 1504-1510 can be implemented by controller 418. The method 1500 can be implemented by a controller 418 and/or controller 126 that operates in accordance with code stored in memory 420, memory 128, and/or a wired circuit (not shown). Thus, the method 15 can be implemented in whole or in part in the code stored in the memory 420 and/or the memory 128. Additionally, method 1500 can be run on other devices not shown in the drawings. As yet another example, the method 1500 can be performed in whole or in part by an operator. The method 1500 can begin at method 13 〇〇 step 1308 after method 1300 determines at step 1306 that DUT 112 has been aligned on carrier 116 within aligner 1-4. As shown in Fig. 15, the combination of the DUT 112/carrier 116 aligned by the aligner 1〇4 can be moved from the aligner 1〇4 and loaded into the test unit 110 at step 1502. The combination of DUT 112/carrier 116 can be removed from aligner 104 in any of the manners described above and loaded into test unit 110. For example, a mover 106 including one or more robotic arms can move the combination of DUT 112/carrier 116 away from aligner 104 and load a combination of DUT 112/carrier 116 into test unit 110. The result may be a combination of the DUT 112/carrier 116 at the test unit 110, as illustrated in FIG. 4A; the DUT 112/positioning disk carrier 500 combination, wherein the positioning disk 502 is disposed in the cavity 806 while positioning the disk alignment feature The 510 series is coupled to the cavity alignment feature 81A as shown in FIG. 9B; or the DUT 112/membrane carrier 1〇〇〇 is attached with the loader 1〇2 on the chuck 1202 and the carrier alignment feature 118 The elevator coupling mechanism 512 is coupled as shown in FIG. 12B. If no test unit 110 is available (eg, all of the test units 110 have a combination of DUTs 112/carriers 116), the method 1500 can be assembled to move the combination of the OUT 112/carriers 110 from the aligner 104. To the holding position (not shown) or leave the combination of DUT 112/carrier 116 in aligner 104 until test unit 110 becomes available. At step 1504, method 1500 can dock the carrier 116 (with the alignment position of DUT 112 clamped on carrier 116) at test unit 11 such that terminal 114 of the DUT is aligned with probe 410 of contactor 408. In an embodiment of the test unit 110 illustrated in FIGS. 4A and 4B, the step 1504 can be accomplished by moving the carrier 116 such that the carrier alignment feature is coupled to the contactor alignment feature 412, as shown in FIG. 4B. . As previously appreciated, the DUT 112 is aligned with the carrier 116' such that the carrier alignment feature 118 and the contactor alignment feature 412 are coupled to the terminal 114 and the probe 410. The embodiment of the test unit 11 exemplified in Figs. 8A and 8B, step 55 201140088, step 15〇4 can be borrowed as follows, borrowing money to lift the elevator 8丨6 mobile chuck 8〇2' and so moving The DUT 112/positioning disc carrier is a combination of 5 turns, so the chuck alignment feature is coupled to the contactor pair _ structure -
，如第9B 圖所示。如前文瞭解，卡盤對齊特徵結構㈣相對於定位盤 對齊特徵結構別可位在與卡㈣⑽徵結構㈣相同位 置因此售定位盤對齊特徵結構Μ〇輕聯測試單元11〇内的 空腔對齊特徵結構81G時’終仙顿與探針梢對齊。另 外比較卡盤對齊特徵結構620，卡盤對齊特徵結構82〇可 位在相對於疋位盤對齊特徵結構51〇之偏位位置。於組配用 於定位盤載具500之測試單元11〇的#干實施例（參考第8八 及8B圖）’當疋位盤對齊特徵結構5丨〇輕聯空腔對齊特徵結 構810時，接觸器408可在終端114係與探針41〇對齊位置耦 接測试單元。於此等實施例，卡盤對齊特徵結構82〇及接觸 器對齊特徵結構412無需使用或含括於測試單元11〇。 於第12 A及12 B圖例示說明之測試單元丨丨〇之實施例， 步驟1504可如下完成，藉由使得卡盤升降機12〇4移動卡盤 1202，及如此移動DUT 112/膜載具1〇〇〇組合，因而載具對 齊特徵結構118耦聯接觸器對齊特徵結構412,如第12B圖所 不。如前文瞭解，DUT 112係對齊膜載具1000，使得載具對 齊特徵結構118與接觸器對齊特徵結構412的耦聯將終端 與探針410對齊。 於步驟1506，終端114與探針410間之接觸可視需要或 期望而加以調整。舉例言之，接觸可經調整或調節來確保 終端114與探針410間形成足夠導電性之電連結而妥當測試 ⑤ 56 201140088 DUT 112。至於另一實例，接觸可經調整或調節使得作用在 終端114及/或探針上的力係維持在不可能損害終端 114、DUT 112或探針41〇之範圍。如前文討論，測試單元11〇 可包括在接觸H4G8與DUT 11G間的氣密封414，及壓力控制 器416裝置可選擇性地控制接觸器侧與加丁 11〇間之空間 的氣壓而選擇性地將接觸器彻與DUT削移動成彼此更接 近或更遠離，其可改變接觸器4〇8與1)1；11 11〇間之接觸力。 於步驟1508’可測試DUTll〇。舉例言之，如前文討論， 測試信號可經由探針410提供&DUT 11〇 ’及由DUT回應於 測》式4號所產生的回應信號可經由探針41〇而得自DUT 110。測號（包括例如電力及地電位、控制信號、資料 信號等）可藉在接觸器408上的電路（圖中未顯示）產生及/或 從其它設備（圖中未顯示）透過電連結4〇4而提供給接觸器 4〇8。響應信號可經評估來判定DUT 11〇是否如所預期藉接 觸器408上的電路（圖中未顯示）而操作及/或透過電連結4〇4 而提供給其它設備（圖中未顯示）。 於步驟1510，方法1500可發送測試完成的信號或訊 心舉例s之’方法1500可發送此種信號或訊息給控制器 126 ’其然後可使得第13圖之方法13〇〇在步驟131〇的下次執 仃時做肯定判定，來分支至步驟1312而從測試單元110移開 已接受測試的DUT 112及载具116。 方法1500僅為一種用以在測試單元11〇測試dut 112之 方法實施例之一例。舉例言之，方法1500可具有第15圖所 未顯示的額外步驟；方法15〇〇無需具有第15圖所示全部步 57 201140088 驟；方法1500可具有與第15圖所示之不同步驟；及/或第15 圖所示步驟順序可有不同。 如前述，第16圖例示說明之用於DUT 112之測試後處理 之方法1600之實例。於若干實施例，方法1600可藉測試系 統100之控制器126、對齊器104之控制器308及/或測試單元 110之控制器418執行。於若干實施例，方法1600可藉依據 儲存在記憶體128、記憶體316、記憶體420及/或有線電路（圖 中未顯示）之程式碼操作的控制器126、控制器308及/或控制 器418執行。如此，方法16〇〇可全部或部分作為儲存在記憶 體128、記憶體316及/或記憶體420的程式碼實施。另外， 方法1600可在圖中未顯示的其它設備上跑。至於又另一替 代例’方法1600可全部或部分由操作人員執行。 如所述，方法1600可始於方法13〇〇步驟1312，在方法 1300在步驟1310判定DUT 112已經完成在測試單元11〇之測 試之後。如第16圖所示，有關測試資料可於步驟16〇2獲得。 舉例言之，表示測試DUT 112結果之資料可於步驟16〇2獲 得。至於另-實例’可於步驟1402獲得藉由終端114接觸探 針410而在DUT 112之終端114形成刮擦記號的位置。於若干 實施例，如此可藉由從測試單元11〇移開DUT 112/載具ιι6 之組合及將腿112/載具116之組合裝載人對齊器ι〇4而完 成。然後利用對齊器104的攝影機3〇4來拍攝終端114影像。 終端114上的刮擦記號（圖中未顯示）可得自所拍攝的影像， 而終端114上關擦記置可_存(例如存在數位記憶 體）。終端114上的到擦記號位置可用來調整在對齊器刚内 58 ⑤ 201140088 對齊載具116上的新DUT 112之處理程序（例如方法1400)。 舉例言之，若刮擦記號（圖中未顯示）係非於已接受測試的 DUT 112之終端114上的期望位置，則在對齊器1〇4未來DUT 112在載具116上被移至的對齊位置可經調整，使得在該等 DUT 112終端上產生的刮擦記號係在期望位置。 於步驟1604，已接受測試的DUT 112可從載具116移開 及然後，從測試系統100移開。舉例言之，在測試單元110、 在對齊器104、在裝載器102、在移動器106，或在測試系統 100之其它位置，已接受測試的DUT 112可從載具116移開。 其中DUT 112為已接受測試的DUT 112之該等DUT 112/載 具116之組合及/或D U T 112可以前述任一方式環繞測試系 統100移動。舉例言之，包括一或多個機器手臂120之移動 器106可環繞測試系統100移動DUT 112/載具116之組合及/ 或 DUT 112。 方法1600僅屬用於已接受測試的DUT 112之後測試處 理方法之實施例的一例。舉例言之，方法1600可具有第16 圖所未顯示的額外步驟；方法1600無需具有第16圖所示全 部步驟；方法1600可具有與第16圖所示之不同步驟；及/或 第16圖所示步驟順序可有不同。 實施方法 1300、1400、1500及 1600中，一第一DUT 112 可於步驟1304裝載入對齊器104，及第一DUT 112例如可藉 方法1400而在對齊器104内移動至第一載具116上的對齊位 置。然後第一DUT 112/第一載具116之組合可於步驟1308裝 載入第一測試單元110，此處例如可藉方法1500測試第一 59 201140088 DUT 112。第二DUT 112可於步驟13〇4裝載入對齊器1〇4(例 如在第一 DUT/第一載具116已經從對齊器移開之後），及第 二DUT 112例如藉方法1400可在對齊器104内移動至第二載 具116上的對齊位置》於步驟1304第二DUT 112裝载入對齊 器104可發生在第一測試單元11〇的第一DUT全部測試完成 前(例如藉方法1500)。確實，第二DUT 112移動至第二載具 116的對齊位置（例如藉方法1400)可發生在第一測試單元 110的第一 DUT測試完成前（例如藉方法1500)。然後第二 DUT 112/第二載具116之組合可於步驟1308裝載入第二測 試單元110，此處例如可藉方法1500測試第二DUT 112。在 第二測試單元11〇之第二DUT 112的測試(例如藉方法1500) 可始於在第一測試單元110之第一 D U T 112的測試（例如藉 方法1500)完成之前。方法1300可啟動方法14001500及1600 之多例，使得在任何給定時間，於測試系統100之多個位置 可有多個DUT 112及DUT 112/載具116之組合。舉例言之， 在不同測試單元110可有多個DUT 112/載具116之組合正在 接受測試，同時對齊器104正在排齊對齊器104内的DUT 112 與載具116。 雖然本說明書已經描述本發明之特定實施例及應用， 但此等實施例及應用僅供舉例說明之用，而許多變化例皆 屬可能。 【圖式簡單說明】 第1圖顯示依據本發明之若干實施例一種受測裝置測 試系統之實例》 60 ⑧ 201140088 第2A圖顯示依據本發明之實施例可用於第1圖之受測 裝置測試系統之載具及受測裝置之頂視圖。 第2B圖顯示第2A圖之載具及受測裝置之側視圖。 第3圖顯示依據本發明之若干實施例第1圖之受測裝置 測試系統之對齊器實例。 第4A及4B圖顯示依據本發明之若干實施例第1圖之受 測裝置測試系統之測試單元實例之側視圖。 第5A圖顯示一種定位盤載具之頂視圖，其可為依據本 發明之若干實施例第1圖之受測裝置測試系統之載具實例。 第5B圖顯示第5A圖之定位盤載具之底視圖。 第5C圖顯示第5A圖之定位盤載具之剖面側視圖。 第6A圖顯示依據本發明之若干實施例第1圖之受測裝 置測試系統之對齊器實例之頂視圖，其可將受測裝置對齊 在定位盤載具上。 第6B圖顯示第6A圖之對齊器之剖面側視圖。 第7A及7B圖顯示依據本發明之若干實施例，在第6A及 6B圖之對齊器内，載荷一受測裝置至第5A至5C圖之定位盤 載具實例。 第8A圖顯示依據本發明之若干實施例第1圖之受測裝 置測試系統之一測試單元實例之頂視圖，其可測試在一定 位盤載具上的一受測裝置。 第8B圖顯示第8A圖之測試單元之剖面側視圖。 第9A及9B圖顯示依據本發明之若干實施例，將第5A至 5C圖之定位盤載具上之一受測裝置載荷至第8A及8B圖之 61 201140088 測試單元之實例。 第10A圖為一種膜載具之頂視圖，該膜載具可為依據本 發明之若干實施例第1圖之受測裝置測試系統之載具實例。 第10B圖顯示第10A圖之膜載具之剖面側視圖。 第11A及11B圖顯示依據本發明之若干實施例第1圖之 受測裝置測試系統之對齊器實例之側視圖，其可將受測裝 置對齊在膜載具上。 第12A及12B圖顯示依據本發明之若干實施例第1圖之 受測裝置測試系統之一測試單元實例之側視圖，其可測試 在膜載具上的一受測裝置。 第13圖顯示依據本發明之若干實施例一種用以在第1 圖之受測裝置測試系統中測試受測裝置之方法實例。 第14圖顯示依據本發明之若干實施例一種用以在第1 圖之受測裝置測試系統的對齊器内對齊一受測裝置與一載 具之方法實例。 第15圖顯示依據本發明之若干實施例一種用以在第1 圖之受測裝置測試系統中測試受測裝置之方法實例。 第16圖顯示依據本發明之若干實施例一種用用於受測 裝置之測試後處理之方法實例。 【主要元件符號說明】 100.. .多受測裝置測試系統、多 106...移動器 -DUT測試系統 108、110…測試單元 102.. .裝載器 112…受測裝置 104.. .對齊器 114·.·輸入及/或輸出終端 62 201140088 502、612、812...定位盤 506、614、820、814、1006. 504、1〇〇4、11〇4承載 真空槽、槽 508…對側表面 510…定位盤對齊特徵結構 512…升降機耦聯機構 600、800...切出部 602、802、1202·..卡盤 604、804...上表面 606、806...空腔 116…載具 118…載具對齊特徵結構 120…機器手臂 122、124···接取門 126、308、418...控制器 128、316、420...記憶體 130…邊緣 132…定位標記 202.. ·基板 204 表面 206···偏位校準機構 208…夾緊機構 210.··溫度控制裝置 212.. .受測裝置對齊特徵結 構、DUT對齊特徵結構 302、402·.·殼體 304…攝影機 306、314…移動機構 310…攝影機座 312.. .攝影機對齊特徵結構 318、422.··導引機構 404…電連結 406、618、1102..·升降機 408··.接觸器 410…探針、導電探針 412…接觸器對齊特徵結構 414..·氣密封 416…壓力控制器、壓力控制器 裝置 500…定位盤載具 608、806.··下表面 610、810…空腔對齊特徵結構 616、1104...平台 620…卡盤對齊特徵結構 816、1204…卡盤升降機 818...定位盤升降機 1000···膜載具 63 201140088 1002. 1008. 1102.. .膜基材 1300、1400、1500、1600...方法 .升降機孔 1302〜1314、1402〜1410、1502 •活動式升降機 〜1510、1602〜1604...步驟 64 ⑧As shown in Figure 9B. As understood from the foregoing, the chuck alignment feature (4) can be positioned at the same position as the card (4) (10) sign structure (4) with respect to the positioning plate alignment feature structure, thus selling the cavity alignment feature structure and the cavity alignment feature in the light link test unit 11 At the 81G structure, the final singer is aligned with the probe tip. In addition to comparing the chuck alignment feature 620, the chuck alignment feature 82 can be positioned at a offset relative to the clamp alignment feature 51. For the dry configuration of the test unit 11A for locating the disk carrier 500 (refer to Figures 8 and 8B), when the clamp disk alignment feature 5 is lightly coupled to the cavity alignment feature 810, The contactor 408 can be coupled to the test unit at a position where the terminal 114 is aligned with the probe 41. In these embodiments, the chuck alignment feature 82 and the contact alignment feature 412 need not be used or included in the test unit 11A. In an embodiment of the test unit illustrated in Figures 12A and 12B, step 1504 can be accomplished by causing the chuck lift 12〇4 to move the chuck 1202, and thus moving the DUT 112/membrane carrier 1 The cymbal combination, and thus the carrier alignment feature 118, couples the contactor alignment feature 412 as shown in FIG. 12B. As previously appreciated, the DUT 112 is aligned with the film carrier 1000 such that coupling of the carrier alignment feature 118 to the contactor alignment feature 412 aligns the terminal with the probe 410. At step 1506, the contact between terminal 114 and probe 410 can be adjusted as needed or desired. For example, the contacts can be adjusted or adjusted to ensure that a sufficient electrical connection between the terminal 114 and the probe 410 is formed to properly test the 5 56 201140088 DUT 112. As another example, the contacts can be adjusted or adjusted such that the forces acting on the terminals 114 and/or the probes are maintained in a range that is unlikely to damage the terminal 114, the DUT 112, or the probes 41. As discussed above, the test unit 11A can include a hermetic seal 414 between the contact H4G8 and the DUT 11G, and the pressure controller 416 device can selectively control the air pressure in the space between the contactor side and the galactic 11 而 selectively The contactors are moved closer to or closer to each other than the DUT, which changes the contact force between the contactors 4〇8 and 1)1; 11 11〇. DUTll〇 can be tested at step 1508'. For example, as discussed above, the test signal can be provided via the probe 410 & DUT 11 〇 ' and the response signal generated by the DUT in response to the test No. 4 can be obtained from the DUT 110 via the probe 41 。. The measurement signals (including, for example, power and ground potential, control signals, data signals, etc.) may be generated by a circuit (not shown) on the contactor 408 and/or through other electrical devices (not shown) through the electrical connection. 4 is supplied to the contactor 4〇8. The response signal can be evaluated to determine if the DUT 11 is operating as expected by circuitry (not shown) on the contactor 408 and/or is provided to other devices (not shown) via the electrical connection 4〇4. At step 1510, method 1500 can send a test completed signal or a heartbeat example s. Method 1500 can send such a signal or message to controller 126, which can then cause method 13 of FIG. 13 to be in step 131. A positive decision is made at the next execution, branching to step 1312 to remove the DUT 112 and the carrier 116 that have been tested from the test unit 110. Method 1500 is but one example of a method embodiment for testing dut 112 at test unit 11. For example, method 1500 can have additional steps not shown in FIG. 15; method 15 does not need to have all steps 57 201140088 shown in FIG. 15; method 1500 can have different steps than shown in FIG. 15; / or the sequence of steps shown in Figure 15 can be different. As previously described, FIG. 16 illustrates an example of a method 1600 for post-test processing of the DUT 112. In some embodiments, method 1600 can be performed by controller 126 of test system 100, controller 308 of aligner 104, and/or controller 418 of test unit 110. In some embodiments, the method 1600 can be performed by the controller 126, the controller 308, and/or the control based on the code stored in the memory 128, the memory 316, the memory 420, and/or the wired circuit (not shown). The 418 is executed. Thus, method 16 can be implemented in whole or in part as a code stored in memory 128, memory 316, and/or memory 420. Additionally, method 1600 can be run on other devices not shown. As yet another alternative, the method 1600 can be performed in whole or in part by an operator. As described, method 1600 can begin at method 13 〇〇 step 1312, where method 1300 determines at step 1310 that DUT 112 has completed testing at test unit 11〇. As shown in Figure 16, the relevant test data can be obtained in step 16〇2. For example, information indicating the results of testing DUT 112 can be obtained at step 16〇2. As for the other example, a position where the scratch mark is formed at the terminal 114 of the DUT 112 by the terminal 114 contacting the probe 410 can be obtained in step 1402. In several embodiments, this can be accomplished by removing the combination of DUT 112/vehicle ιι from test unit 11 及 and loading the combination of leg 112/carrier 116 with human aligner ι 4 . The camera 114 image is then taken using the camera 3〇4 of the aligner 104. A scratch mark (not shown) on the terminal 114 can be obtained from the captured image, and the eraser can be stored on the terminal 114 (e.g., there is a digital memory). The wipe to position on terminal 114 can be used to adjust the processing of the new DUT 112 on the carrier 116 (e.g., method 1400) just after the aligner 58 5 201140088. For example, if the scratch mark (not shown) is not the desired position on the terminal 114 of the DUT 112 that has been tested, then the future DUT 112 is moved on the carrier 116 at the aligner 1〇4. The alignment position can be adjusted such that the scratch marks generated on the terminals of the DUTs 112 are in the desired position. At step 1604, the DUT 112 that has been tested can be removed from the carrier 116 and then removed from the test system 100. For example, at test unit 110, at aligner 104, at loader 102, at mover 106, or at other locations of test system 100, DUT 112 that has been tested can be removed from carrier 116. The DUT 112 is a combination of the DUTs 112/carriers 116 of the DUT 112 that has been tested and/or the D U T 112 can be moved around the test system 100 in any of the manners described above. For example, a mover 106 including one or more robotic arms 120 can move the DUT 112/carrier 116 combination and/or DUT 112 around the test system 100. Method 1600 is only one example of an embodiment of a test processing method for DUT 112 that has been tested. For example, method 1600 can have additional steps not shown in FIG. 16; method 1600 need not have all of the steps shown in FIG. 16; method 1600 can have different steps than shown in FIG. 16; and/or FIG. The order of the steps shown can vary. In the implementation methods 1300, 1400, 1500, and 1600, a first DUT 112 can be loaded into the aligner 104 in step 1304, and the first DUT 112 can be moved to the first carrier 116 in the aligner 104, for example, by method 1400. The alignment position on the top. The combination of the first DUT 112/first carrier 116 can then be loaded into the first test unit 110 in step 1308, where the first 59 201140088 DUT 112 can be tested, for example, by method 1500. The second DUT 112 can be loaded into the aligner 1〇4 at step 13〇4 (eg, after the first DUT/first carrier 116 has been removed from the aligner), and the second DUT 112 can be Moving into the alignment position on the second carrier 116 in the aligner 104", in step 1304, loading the second DUT 112 into the aligner 104 may occur before all of the first DUTs of the first test unit 11 are tested (eg, by method) 1500). Indeed, the alignment of the second DUT 112 to the second carrier 116 (e.g., by method 1400) may occur prior to completion of the first DUT test of the first test unit 110 (e.g., by method 1500). The combination of the second DUT 112/second carrier 116 can then be loaded into the second test unit 110 at step 1308, where the second DUT 112 can be tested, for example, by method 1500. The testing of the second DUT 112 at the second test unit 11 (e.g., by method 1500) may begin prior to completion of the test (e.g., by method 1500) of the first D U 112 of the first test unit 110. Method 1300 can initiate multiple instances of methods 14001500 and 1600 such that at any given time, there can be multiple DUTs 112 and DUTs 112/carriers 116 in multiple locations at test system 100. For example, a plurality of DUTs 112/carriers 116 combinations may be tested at different test units 110 while the aligner 104 is aligning the DUTs 112 and carriers 116 within the aligners 104. Although the specification has described specific embodiments and applications of the present invention, such embodiments and applications are for illustrative purposes only, and many variations are possible. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an example of a test system for a device under test according to several embodiments of the present invention. 60 8 201140088 FIG. 2A shows a test system for a device under test according to FIG. 1 according to an embodiment of the present invention. Top view of the vehicle and the device under test. Figure 2B shows a side view of the carrier and the device under test in Figure 2A. Figure 3 is a diagram showing an example of an aligner of a test system of a device under test according to Figure 1 of several embodiments of the present invention. 4A and 4B are side views showing an example of a test unit of the test apparatus test system according to Fig. 1 of several embodiments of the present invention. Figure 5A shows a top view of a locating disc carrier, which may be an example of a carrier test system for a device under test according to Figure 1 of several embodiments of the present invention. Figure 5B shows a bottom view of the locating disc carrier of Figure 5A. Figure 5C shows a cross-sectional side view of the locating disc carrier of Figure 5A. Fig. 6A is a top plan view showing an example of an aligner of the device under test system of Fig. 1 in accordance with several embodiments of the present invention, which aligns the device under test on the locator disk carrier. Figure 6B shows a cross-sectional side view of the aligner of Figure 6A. Figures 7A and 7B show an example of a locating disc carrier that loads a device under test to 5A through 5C in the aligners of Figs. 6A and 6B in accordance with several embodiments of the present invention. Fig. 8A is a top plan view showing an example of a test unit of a test device test system according to Fig. 1 of several embodiments of the present invention, which can test a device under test on a fixed disk carrier. Figure 8B shows a cross-sectional side view of the test unit of Figure 8A. Figures 9A and 9B show an example of loading a device under test on the locating disc carrier of Figures 5A through 5C to the 61 201140088 test unit of Figures 8A and 8B in accordance with several embodiments of the present invention. Figure 10A is a top plan view of a film carrier which may be an example of a carrier test system for a device under test according to Figure 1 of several embodiments of the present invention. Figure 10B shows a cross-sectional side view of the film carrier of Figure 10A. 11A and 11B are side views showing an example of an aligner of the device under test of the device under test according to Fig. 1 of several embodiments of the present invention, which can align the device under test on the film carrier. 12A and 12B are side views showing an example of a test unit of a test device test system according to Fig. 1 of several embodiments of the present invention, which can test a device under test on a film carrier. Figure 13 shows an example of a method for testing a device under test in the device under test of Figure 1 in accordance with several embodiments of the present invention. Figure 14 is a diagram showing an example of a method for aligning a device under test and a carrier in the aligner of the device under test of the device of Figure 1 in accordance with several embodiments of the present invention. Figure 15 shows an example of a method for testing a device under test in the device under test of Figure 1 in accordance with several embodiments of the present invention. Figure 16 shows an example of a method for post-testing processing for a device under test in accordance with several embodiments of the present invention. [Main component symbol description] 100.. .Multi-test device test system, multi-106...mover-DUT test system 108,110...test unit 102..loader 112...device under test 104..align 114··· Input and/or output terminal 62 201140088 502, 612, 812... positioning disk 506, 614, 820, 814, 1006. 504, 1〇〇4, 11〇4 carrying vacuum slot, slot 508... Opposite surface 510... locating disc alignment feature 512... elevator coupling mechanism 600, 800... cutout 602, 802, 1202.. chuck 604, 804... upper surface 606, 806... empty Cavity 116...Carriage 118...Carrier Alignment Feature 120...Machine Arms 122, 124··· Access Doors 126, 308, 418... Controllers 128, 316, 420... Memory 130... Edge 132... Positioning mark 202.. · Substrate 204 Surface 206 · · · Offset calibration mechanism 208 ... Clamping mechanism 210. · Temperature control device 212.. Test device alignment feature structure, DUT alignment feature structure 302, 402 ·. Housing 304...camera 306, 314...moving mechanism 310...camera mount 312..camera alignment feature 318,422........guide mechanism 404...electrical 406, 618, 1102.. lifter 408·.. contactor 410...probe, conductive probe 412...contactor alignment feature 414..·gas seal 416...pressure controller, pressure controller device 500...positioning plate Carrier 608, 806..... Lower surface 610, 810... Cavity alignment feature 616, 1104... Platform 620... Chuck alignment feature 816, 1204... Chuck lift 818... Locator lift 1000·· Film carrier 63 201140088 1002. 1008. 1102.. Film substrate 1300, 1400, 1500, 1600... Lifting holes 1302~1314, 1402~1410, 1502 • Mobile lifts ~1510, 1602~1604 ...Step 64 8