TWI837292B - Bendable vapor chamber structure - Google Patents

Abstract

A bendable heat balancing plate structure includes: a first plate body and a second plate body group; the first plate body has a first side surface and a second side surface on the upper and lower sides; the second plate body group has a plurality of plates and at least one bendable connecting body, the bendable connecting body is arranged between the plates and interconnected with the plates, the second plate body group and the first plate body correspond to cover and jointly define a containing space, a first capillary structure and a working fluid are arranged in the containing space, and the heat balancing plate can achieve a bendable effect through the present invention.

Description

Bendable temperature-averaging plate structure

A bendable heat absorbing plate structure, especially a bendable heat absorbing plate structure that can be bent and stacked.

As current handheld devices are gradually developing higher and higher performance, the internal electronic components are generating more and more heat. In addition, handheld devices or mobile devices are also developing towards large-sized touch screen operating interfaces, so it is not convenient to carry them around.

Therefore, the first problem that people in this field need to solve is the heat dissipation of internal electronic components. Therefore, a large number of thin heat pipes or thin temperature-averaging plates and other heat-conducting components are used internally to quickly conduct the heat of electronic components to a remote location for heat dissipation.

Furthermore, in order to improve the inconvenience of carrying large-sized handheld or mobile devices, people in this field have been trying to provide foldable devices that can be unfolded or folded by means of hinges or hinges to reduce the inconvenience of carrying handheld or mobile devices. Although the problem of the screen and other components being bendable is overcome to achieve the effect of reducing the volume, the thermal conductive components (thin vapor chamber, thin heat pipe) have not yet been proposed to be bendable. The solution is that although the thin heat spreader and heat pipe can be bent after being thinned, the curvature cannot be too large or cannot reach a 90-degree fold, which will cause the thin heat spreader and heat pipe to crack or break, causing the working fluid to leak out and lose the internal vacuum or the capillary structure to fall off, causing the capillary phenomenon to fail. Therefore, how to solve the deficiencies and problems brought about by the knowledge is the most important goal of the industry.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a bendable heat balancing plate structure, which effectively provides the handheld device with a heat balancing plate body structure that is not damaged when folding during folding and unfolding, and can still operate normally for heat conduction.

To achieve the above-mentioned purpose, the present invention provides a bendable temperature-averaging plate structure, which includes: a first plate body and a second plate body set; the first plate body has a first side surface and a second side surface on the upper and lower sides.

The second plate body set has a plurality of plates and at least one first bendable connecting body, the first bendable connecting body is disposed between the plates and connected to the plates, the second plate body set and the first plate body correspond to each other and cover and jointly define a containing space, the containing space is provided with a first capillary structure and filled with working liquid.

To achieve the above-mentioned purpose, the present invention provides a bendable temperature-averaging plate structure, which includes: a first plate group and a second plate group; the first plate group has a plurality of first plates, and the first plates are connected through at least one first bendable connector; the second plate group has a plurality of second plates and at least one second bendable connector, and the second plates are connected through the second bendable connector, and the second plate group and the first plate group correspond to each other and cover and jointly define a containing space, and a first capillary structure and a working fluid are arranged in the containing space.

The bendable heat absorbing plate structure of the present invention can solve the problem that the conventional heat absorbing plate cannot be bent or the heat absorbing plate can be folded horizontally to be collapsed and unfolded.

11: First plate

111: First side

1111: First capillary structure

112: Second side

12: Second plate group

121: Board

121a: Connection part

122: First bendable connector

1221: Second capillary structure

1222: Support structure

123: Second bendable connector

13: Storage space

14: First plate group

141: First plate

141a: First connection part

1411: First capillary structure

142: First bendable connector

1421: Second capillary structure

1422:Support structure

15: Second plate group

151: Second plate

151a: Second connection part

152: Second bendable connector

1521: The third capillary structure

1522:Support structure

16: Storage space

17: The third bendable connector

18: Middle layer

2: Working fluid

Figure 1 is a three-dimensional exploded view of the first embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 2 is a combined cross-sectional view of the first embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 3 is a combined cross-sectional view of the second embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 4 is a combined cross-sectional view of the third embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 5 is a combined cross-sectional view of the fourth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 6 is a three-dimensional exploded view of the fifth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 7 is a three-dimensional exploded view of the sixth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 8 is a combined cross-sectional view of the sixth embodiment of the bendable temperature-averaging plate structure of the present invention ; Figure 9 is a combined cross-sectional view of the seventh embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 10 is a combined cross-sectional view of the eighth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 11 is a combined cross-sectional view of the ninth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 12 is a three-dimensional exploded view of the tenth embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 13 is a three-dimensional exploded view of the eleventh embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 14 is a combined cross-sectional view of the eleventh embodiment of the bendable temperature-averaging plate structure of the present invention; Figure 15 is a schematic diagram of the bendable temperature-averaging plate structure in action; Figure 16 is a schematic diagram of the bendable temperature-averaging plate structure in action.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be explained according to the preferred embodiments of the attached drawings.

Please refer to Figures 1 and 2, which are three-dimensional exploded and assembled cross-sectional views of the first embodiment of the bendable temperature-averaging plate structure of the present invention. The bendable temperature-averaging plate structure of the present invention includes: a first plate body 11 and a second plate body assembly 12; the first plate body 11 has a first side surface 111 and a second side surface 112 on the upper and lower sides.

The second plate group 12 has a plurality of second plates 121 and a first bendable connecting body 122. The first bendable connecting body 122 is disposed between the second plates 121 and is horizontally connected to the second plates 121 to form the second plate group 12. The second plate group 12 corresponds to and covers the first plate 11 and defines a connected accommodation space 13. The accommodation space 13 is not blocked at the turning point. A first capillary structure 1111 is disposed in the accommodation space 13. The first capillary structure 1111 is selectively disposed on the surface of the first plate 11 or the second plate group 12 or between the first plate 11 and the second plate group 12. The accommodation space 13 is filled with a working liquid 2.

Please refer to Figure 3, which is a cross-sectional view of the second embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the first embodiment, so it will not be described here in detail. However, this embodiment is different from the first embodiment in that the first bendable connector 122 is overlapped and arranged on the other side of the second plate assembly 12 relative to the first plate 11, that is, it does not correspond to the first side surface 111 of the first plate 11.

Please refer to Figure 4, which is a cross-sectional view of the third embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the first embodiment, so it will not be described here. However, this embodiment is different from the first embodiment in that the first bendable connector 122 is overlapped and arranged on one side of the second plate assembly 12 opposite to the first plate 11, that is, it is arranged opposite to the first side surface 111 of the first plate 11.

Please refer to Figure 5, which is a combined cross-sectional view of the fourth embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned third embodiment, so it will not be described in detail here. However, this embodiment is different from the aforementioned third embodiment in that the other side (corresponding side) opposite to the place where the first bendable connecting body 122 is set has a second bendable connecting body 123, that is, the second side of the second plate body 121 where the first bendable connecting body 122 is set has the second bendable connecting body 123 (that is, the first bendable connecting body 122 and the second bendable connecting body 123 are set opposite to each other).

Please refer to Figure 6, which is a three-dimensional exploded view of the fifth embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the first embodiment, so it will not be described here in detail. However, this embodiment is different from the first embodiment in that the outer edges of the second plates 121 have a connecting portion 121a, and the connecting portions 121a are connected to the first bendable connecting body 122. The structural strength of the entire structure when bent can be enhanced through the connecting portion 121a.

The first and second bendable connectors 122 and 123 in the first to fifth embodiments are a flexible polymer material such as polypropylene (PP), polyethylene (PE), polystyrene (PS), polyimide (PI), polyethylene terephthalate (PET), flexible printed circuit board (FPC) or flexible metal or alloy. The first and second bendable connectors 122 and 123 in the first to fifth embodiments are illustrative examples of flexible printed circuit board (FPC), but are not limited thereto.

The first bendable connecting body 122 is provided with a second capillary structure 1221 on one side of the first plate body 11, and the first plate body 11 or the second plate body set 12 or the first bendable connecting body 122 is provided with a plurality of supporting structures 1222.

The first and second capillary structures 1111 and 1221 are any of grooves, powder sintered bodies, grid bodies, fiber bodies, and corrugated plates, and the supporting structures 1222 are any of convex columns and bumps.

The first plate 11 and the second plate group 12 are any one of gold, silver, copper, aluminum, iron, stainless steel, titanium, commercially pure titanium, titanium alloy, copper alloy, aluminum alloy, etc. The first plate 11 and the second plate group 12 can be made of the same material or different materials, and the plates 121 of the second plate group 12 can also be made of the same or different materials.

Please refer to Figures 7 and 8, which are three-dimensional exploded and assembled cross-sectional views of the sixth embodiment of the bendable temperature-averaging plate structure of the present invention. The bendable temperature-averaging plate structure of the present invention includes: a first plate group 14 and a second plate group 15; the first plate group 14 has a plurality of first plates 141, and the first plates 141 are connected through at least one first bendable connector 142.

The second plate group 15 has a plurality of second plates 151 and at least one second bendable connecting body 152, and the second plates 151 are horizontally connected to each other through the second bendable connecting body 152. The second plate group 15 and the first plate group 14 correspond to each other and cover and jointly define a containing space 16, and are provided with a first capillary structure 1411 and filled with working fluid 2. The first capillary structure 1411 is selectively provided on any surface of the first and second plate groups 14 and 15 or both.

Please refer to Figure 9, which is a cross-sectional view of the seventh embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned sixth embodiment, so it will not be described in detail here. However, this embodiment is different from the aforementioned sixth embodiment in that the first bendable connector 142 is provided on the opposite side of the first plate group 14 relative to the second plate group 15, and the second bendable connector 152 is provided on the opposite side of the second plate group 15 relative to the first plate group 14.

Please refer to Figure 10, which is a cross-sectional view of the eighth embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned sixth embodiment, so it will not be described in detail here. However, this embodiment is different from the aforementioned sixth embodiment in that the second bendable connector 152 is provided on one side of the second plate group 15 relative to the first plate group 14, and the first bendable connector 142 is provided on one side of the first plate group 14 relative to the second plate group 15.

Please refer to Figure 11, which is a combined cross-sectional view of the ninth embodiment of the bendable temperature equalizing plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned sixth embodiment, so it will not be described in detail here. However, this embodiment is different from the aforementioned sixth embodiment in that the other side opposite to the first and second bendable connecting bodies 142 and 152 is provided with a third bendable connecting body 17, that is, the third bendable connecting body 17 can be provided correspondingly to the first and second bendable connecting bodies 142 and 152.

Please refer to Figure 12, which is a three-dimensional exploded view of the tenth embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned sixth embodiment, so it will not be described in detail here. However, this embodiment is different from the aforementioned sixth embodiment in that the outer edges of the first plate bodies 141 have a plurality of first connecting parts 141a, and the outer edges of the second plate bodies 151 have a plurality of second connecting parts 151a. The first connecting parts 141a are connected to the first bendable connecting bodies 142, and the second connecting parts 151a are connected to the second bendable connecting bodies 152. The first and second connecting parts 141a and 151a can enhance the structural strength of the entire structure when it is bent.

In the sixth to tenth embodiments, the first, second and third bendable connectors 143, 153 and 17 are a kind of flexible polymer material such as polypropylene (PP), polyethylene (PE), polystyrene (PS), polyimide (PI), polyethylene terephthalate (PET), flexible printed circuit board (FPC) or any one of them or flexible metal or alloy. The first, second and third bendable connectors 143, 153 and 17 in the sixth to tenth embodiments are illustrated by flexible printed circuit board (FPC), but are not limited thereto. The first plate group 14 and the second plate group 15 are any one of gold, silver, copper, aluminum, iron, stainless steel, titanium, commercially pure titanium, titanium alloy, copper alloy, and aluminum alloy. The first plate group 14 and the second plate group 15 can be made of the same material or different materials. The first plates 141 of the first plate group 14 can be made of the same material or different materials, and the second plates 151 of the second plate group 15 can be made of the same material or different materials.

The first bendable connecting body 142 is provided with a second capillary structure 1421 and a plurality of supporting structures 1422 on one side opposite to the second plate assembly 15.

A third capillary structure 1521 is provided on one side of the second bendable connector 152 opposite to the first plate group 14, and a plurality of supporting structures 1522 are provided on the surfaces of the first plate group 14, the second plate group 15, and the first and second bendable connectors 142 and 152.

The first, second and third capillary structures 1411, 1421 and 1521 are any of grooves, powder sintered bodies, grid bodies, fiber bodies and corrugated plates, and the supporting structures 1422 and 1522 are any of convex columns and bumps.

The first, second and third bendable connectors 142, 152 and 17 are transparent or non-transparent.

The first, second and third hair structures 1411, 1421 and 1521 can be formed by printing, etching, electroplating, mechanical processing (stamping, laser engraving, in-mold injection) and the like.

Please refer to Figures 13 and 14, which are three-dimensional exploded and assembled cross-sectional views of the eleventh embodiment of the bendable temperature-averaging plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned sixth embodiment, so it will not be described here in detail. However, this embodiment is different from the aforementioned sixth embodiment in that there is an intermediate layer 18 between the first plate group 14 and the second plate group 15. In this embodiment, the intermediate layer 18 is clamped in the middle by the first and second plate groups 14 and 15, that is, the intermediate layer 18 is filled in the accommodation space 16 (see Figure 8) formed after the first and second plate groups 14 and 15 are covered. The intermediate layer 18 is a sheet with a plurality of through holes 181 and a capillary structure of a groove 182 on one side.

Please refer to Figures 15 and 16, which are schematic diagrams of the bendable heat balancing plate structure of the present invention. As shown in the figure, please also refer to the description of the first to eleventh embodiments and Figures 1-14. The bendable heat balancing plate structure of the present invention is mainly to solve the problem that the known heat balancing plate or heat pipe cannot be bent or folded. For example, the first embodiment of the present invention is to combine at least three metal plates, and the plates 121 of the second plate group 12 are connected to each other. After the plates 121 are connected by using a first bendable connector 122 (a flexible polymer material), the second plate group 12 is then covered with the first plate group 11 to perform edge sealing, water filling, vacuum sealing and other procedures. Since the first plate 11 is quite thin, it can be bent and folded. The second plate group 12 achieves the bendable temperature-averaging plate structure disclosed in the first embodiment to achieve a bendable and foldable effect through the provision of the first bendable connector 122.

The structure disclosed in the sixth embodiment of the present invention is assembled through four metal plates, and the first plates 141 of the first plate group 14 are connected through the first bendable connector 142, and the second plates 151 of the second plate group 15 are connected through the second bendable connector 152. Then, the first plate group 14 and the second plate group 15 are correspondingly covered, sealed, filled with water, and vacuum-sealed, and the first and second bend connectors 142 and 152 can be bent, folded, folded, and unfolded.

The present invention can improve the defect that the conventional thin heat spreader or thin heat pipe cannot be bent or folded horizontally, and provide users with the bendable heat spreader structure of the present invention to be applied to handheld devices that need to be folded or bent to be folded and unfolded, without being restricted by bending and folding.

11: First plate

111: First side

1111: first capillary structure

112: Second side

12: Second plate group

121: Board

122: first bendable connector

13: Storage space

Claims (18)

A bendable temperature-averaging plate structure includes: a first plate body, which is a thin plate with bendable characteristics, and has a first side surface and a second side surface on its upper and lower sides; a second plate body group, which has a plurality of second plates and at least one first bendable connecting body, wherein the first bendable connecting body is disposed between the two second plates and interconnected with the two second plates to form the second plate body group, wherein the second plate body group and the aforementioned first plate body are correspondingly covered and jointly define a connected accommodation space, and the accommodation space at the turning point is not blocked, and the accommodation space is provided with a first capillary structure and filled with a working liquid, and the second plate body group is provided through the first bendable connecting body so that the bendable temperature-averaging plate structure can be bent at an angle greater than or equal to 0 degrees and less than or equal to 180 degrees. The bendable temperature equalizing plate structure as described in item 1 of the patent application scope, wherein the first bendable connector is a flexible polymer material such as any one of polypropylene (PP), polyethylene (PE), polystyrene (PS), polyimide (PI), polyethylene terephthalate (PET), and flexible printed circuit board (FPC). As described in the first item of the patent application, the bendable temperature-averaging plate structure, wherein the first bendable connector is provided with a second capillary structure and a plurality of supporting structures on one side of the first plate body, the first and second capillary structures are any of grooves, powder sintered bodies, grid bodies, fiber bodies, and corrugated plates, and the supporting structures are any of convex columns and protrusions. As described in item 1 of the patent application scope, the bendable temperature-averaging plate structure, wherein the first plate and the second plate group are any one of gold, silver, copper, aluminum, iron, stainless steel, titanium, commercially pure titanium, titanium alloy, copper alloy, aluminum alloy, etc., the first plate and the second plate group can be made of the same material or different materials, and the plates of the second plate group can be made of the same or different materials. The bendable temperature-averaging plate structure as described in item 1 of the patent application, wherein the first bendable connecting body is disposed on one side or the opposite side of the second plate assembly relative to the first plate assembly. The bendable temperature equalizing plate structure as described in Item 1 of the patent application scope, wherein the other side opposite to where the first bendable connecting body is arranged has a second bendable connecting body. As described in item 1 of the patent application scope, the bendable temperature-averaging plate structure, wherein the outer edges between the second plate bodies have a connecting portion, and the connecting portions are connected to the first bendable connecting body. The bendable temperature-averaging plate structure as described in Item 1 of the patent application scope, wherein the first capillary structure is selectively arranged on the surface of the first plate body or the second plate body group. A bendable temperature-averaging plate structure includes: a first plate group having a plurality of first plates, and the first plates are connected through at least one first bendable connector; a second plate group having a plurality of second plates and at least one second bendable connector, and the second plates are connected through the second bendable connector, the second plate group and the first plate group correspond to each other and cover and jointly define a containing space, and are provided with a first capillary structure and filled with working liquid. As described in item 9 of the patent application, the first and second bendable connectors are a flexible polymer material such as polypropylene (PP), polyethylene (PE), polystyrene (PS), polyimide (PI), polyethylene terephthalate (PET), or a flexible printed circuit board (FPC). As described in item 9 of the patent application, the bendable temperature-averaging plate structure, wherein the first plate group and the second plate group are any one of gold, silver, copper, aluminum, iron, stainless steel, titanium, commercially pure titanium, titanium alloy, copper alloy, aluminum alloy, etc., the first plate group and the second plate group can be made of the same material or different materials, and the first plates of the first plate group can be made of the same or different materials, and the second plates of the second plate group can be made of the same or different materials. As described in item 9 of the patent application, the bendable temperature-averaging plate structure, wherein the first bendable connector is provided with a second capillary structure and a plurality of supporting structures on one side of the second plate group, the second capillary structure is any one of a groove, a powder sintered body, a grid body, a fiber body, and a corrugated plate, and the supporting structures are any one of a convex column and a convex point. As described in item 12 of the patent application, the bendable temperature-averaging plate structure, wherein the second bendable connector is provided with a third capillary structure and a plurality of supporting structures on one side of the first plate group, the third capillary structure is any one of a groove, a powder sintered body, a grid body, a fiber body, and a corrugated plate, and the supporting structures are any one of a convex column and a convex point, and the first, second, and third capillary structures can be formed by printing, etching, electroplating, mechanical processing (stamping, laser engraving, in-mold injection, etc.). As described in item 9 of the patent application, the first bendable connecting body is arranged on one side or the other side of the first plate group relative to the second plate group; the second bendable connecting body is arranged on one side or the other side of the second plate group relative to the first plate group. As described in item 9 of the patent application, the bendable temperature equalizing plate structure has a third bendable connecting body on the other side opposite to where the first and second bendable connecting bodies are arranged, and the first, second and third bendable connecting bodies are transparent or non-transparent. As described in item 9 of the patent application, the bendable temperature-averaging plate structure, wherein the outer edges between the first plate bodies have a plurality of first connecting parts, and the outer edges between the second plate bodies have a plurality of second connecting parts, the first connecting parts are connected to the first bendable connecting bodies, and the second connecting parts are connected to the second bendable connecting bodies. As described in item 9 of the patent application, the bendable temperature-averaging plate structure has an intermediate layer between the first and second plate groups. As described in item 9 of the patent application, the bendable temperature-averaging plate structure, wherein the first capillary structure is selectively arranged on any surface of the first or second plate group.

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