TW201800711A - Manufacturing method for chamber of temperature-unifying device and structure thereof characterized by ensuring the air tightness of the temperature-unifying device product and effectively solving the problem of high defect rate - Google Patents

Abstract

Disclosed is a manufacturing method for the chamber of a temperature-unifying device and the structure thereof. The manufacturing method includes the following steps: (1) providing a first plate and a second plate, wherein the second plate is equipped with a plurality of first hollowed parts arranged along the side of the second plate at regular intervals and penetrating through the second plate; (2) using a pre-fixing means to secure the first plate and the second plate together in a contact state, and forming a first chamber between the first and the second plates; (3) placing solder in each first hollowed part of the second plate; (4) heating and melting the solder in the first hollowed part so that the molten solder flows into the gap between the first and second plates by means of capillary phenomenon; and (5) cooling down and then sealing the gap between the first and the second plates by the solder located between the first and the second plates. The manufacturing method disclosed by the present invention can ensure the air tightness of the temperature-unifying device product and effectively solve the problem of high defect rate in the prior art.

Description

Manufacturing method and structure of cavity of uniform temperature device

The present invention relates to a heat dissipation device. In detail, it provides a "method for manufacturing a cavity of a temperature equalizing device and a structure thereof", which can greatly improve the yield of a product manufacturing process.

With the rapid development of technology, the power and efficiency of electronic components are increasing, and more heat is also generated during operation. However, the size and surface area of electronic components tend to become smaller, which is very detrimental to the heat dissipation of electronic components. Failure to dissipate this heat in a timely manner will cause the temperature of the electronic component to rise, affect its performance, and even deteriorate. In severe cases, the electronic component may be damaged.

In the early days, heat dissipation methods such as heat sinks, cooling fans, and heat pipes were used to remove heat from electronic products or semiconductor products. In order to solve the heat dissipation of electronic components more effectively, A kind of temperature equalizing device called a temperature equalizing plate or a vapor chamber is widely used, for example: China's M329760 "The temperature equalizing plate structure positioned through the capillary tissue as a support", M335720 "The temperature equalizing plate and Its supporting structure ", M342728" segmented temperature equalizing plate "and M422286" temperature equalizing plate structure "and other new patent cases.

Please refer to Figures 1 to 3, the conventional temperature equalizing device (10) has a first plate (11) and a second plate (12), and the peripheral sides of the first and second plates (11) (12) are covered by It is fixedly connected to form a closed chamber, and a capillary structure (13) and a working liquid are provided in the closed chamber.

According to the prior art, the first plate (11) and the second plate (12) are fixed by firstly applying solder paste on the top surfaces of the sides of the first plate (11), and then applying the second plate ( 12) Stacked on top of the first plate (11), so that the bottom surface of the peripheral side of the second plate (12) is attached to the top surface of the solder paste on the peripheral side of the first plate (11), and the first, The two plates (11) and (12) are sandwiched, and then put into a heating furnace for welding and sealing.

However, before welding, there is solder paste between the top surface of the first plate (11) and the bottom surface of the second plate (12), so the top surface of the first plate (11) Due to the presence of solder paste, the space between the bottom surface of the two sides of the second board (12) cannot be tightly attached. In the process of welding and sealing in a heating furnace, it is easy for the solder paste to melt and flow (or even lose). Occupying the volume again makes the space between the first plate (11) and the second plate (12) larger, which may cause a gap between the first plate (11) and the second plate (12) after welding and sealing There are gaps. These gaps will cause the internal cavity to communicate with the outside world and cause the entire product to fail. This finished product is a waste product. This situation of reduced yield has troubled manufacturers.

In order to solve the above technical problems, the present invention provides a method for manufacturing a cavity of a temperature equalizing device, which mainly includes the following steps: (1) preparing a first plate and a second plate, and setting a plurality of first plates on the second plate; A line of empty parts, the first lines of empty parts are spaced along the side of the second plate body and penetrate the second plate body; (2) the peripheral side of the first plate body and the periphery of the second plate body The side corresponds to the abutment, and the first and second plates are fixed in an abutting state by a pre-fixing means, and a first cavity is formed between the first and second plates; (3) an appropriate amount of solder is accommodated In each of the first strands of the second board; (4) heating to melt the solder located in the first strands of hollows and flow into the space between the first and second boards by capillary phenomenon; The gap; and (5) after cooling, the solder located between the first and second boards is to seal the gap between the first and second boards and firmly join the first and second boards.

The manufacturing method of the cavity disclosed in the present invention can ensure the airtightness of the cavity of the product of the uniform temperature device, thereby effectively solving the disadvantage of a high defective rate of the conventional manufacturing process.

In the following, a plurality of embodiments of the present invention will be disclosed graphically. For the sake of clarity, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner. Unless otherwise specified, the features of the various embodiments described herein may be combined with each other.

(Learn)

(10) ‧‧‧Conventional temperature equalization device

(11) ‧‧‧First board

(12) ‧‧‧Second Board

(this invention)

(20) ‧‧‧Equal temperature device

(21) ‧‧‧First plate

(211) ‧‧‧First

(212) ‧‧‧Second Side

(213) ‧‧‧Capillary structure

(22) ‧‧‧Second plate

(221) ‧‧‧ Third Side

(222) ‧‧‧ fourth

(223) ‧‧‧ the first ray

(224) ‧‧‧Capillary structure

(225) ‧‧‧Degassing tube

(23) ‧‧‧Capillary support

(24) ‧‧‧First cavity

(25) ‧‧‧Pre-fixing Department

(26) ‧‧‧The third plate

(261) ‧‧‧ Fifth Side

(262) ‧‧‧ sixth side

(263) ‧‧‧Exhaust

(264) ‧‧‧Capillary Structure

(265) ‧‧‧Second Cavity

(266) ‧‧‧ The fifth strand

(267) ‧‧‧ sixth strand

(27) ‧‧‧The fourth plate

(271) ‧ ‧ seventh

(272) ‧‧‧ Eighth

(273) ‧‧‧Second Ray

(274) ‧‧‧Capillary structure

(28) ‧‧‧Support

(281) ‧‧‧First Support

(282) ‧‧‧Second Support

(29) ‧‧‧The fifth plate

(291) ‧ ‧ ninth

(292) ‧ ‧ tenth side

(293) ‧‧‧ the third empty section

(294) ‧‧‧First through hole

(295) ‧‧‧Second through hole

(296) ‧ ‧ ‧ fourth strand

(297) ‧‧‧Third Cavity

(30) ‧‧‧Solder

Fig. 1: An external perspective view of a conventional temperature equalization device.

Figure 2: A bottom perspective view of Figure 1.

Fig. 3: An enlarged cross-sectional view taken along line 3-3 of Fig. 2.

FIG. 4 is a manufacturing flowchart of the first embodiment of the present invention.

FIG. 5 is a first step of the manufacturing process of the first embodiment of the present invention.

Fig. 6 is a sectional view taken along line 6-6 of Fig. 5.

FIG. 7 is a schematic diagram of step two of the manufacturing process of the first embodiment of the present invention.

FIG. 8 is an enlarged view of part A in FIG. 7.

FIG. 9 is a schematic diagram of step 3 in the manufacturing process of the first embodiment of the present invention.

Fig. 10 is an external perspective view of a temperature equalizing device made in the first embodiment of the present invention.

FIG. 11 is an exploded perspective view of FIG. 10.

FIG. 12 is an enlarged cross-sectional view taken along line 12-12 of FIG. 10.

Fig. 13 is an enlarged cross-sectional view taken along line 13-13 of Fig. 10;

FIG. 14 is a schematic view of another embodiment of the first strand of hollow portions (223).

Fig. 15 is an enlarged cross-sectional view of Fig. 14 along line 15-15.

FIG. 16 is a manufacturing flowchart of the second embodiment of the present invention.

FIG. 17 is a schematic diagram of steps 1 and 2 of the manufacturing process of the second embodiment of the present invention.

FIG. 18 is an enlarged sectional view taken along line 18-18 of FIG. 17.

Fig. 19 is an enlarged sectional view of Fig. 17 taken along line 19-19.

FIG. 20 is a schematic diagram of the relative relationship between the second strand of hollow portions (273), the third strand of hollow portions (293), and the fourth strand of hollow portions (296) of the second embodiment.

FIG. 21 is a first schematic diagram of the third step of the manufacturing process of the second embodiment of the present invention.

FIG. 22 is the second schematic diagram of the third step of the manufacturing process of the second embodiment of the present invention.

Fig. 23 is an enlarged sectional view of Fig. 22 along line 23-23.

FIG. 24 is a schematic diagram of step 4 in the manufacturing process of the second embodiment of the present invention.

FIG. 25 is a schematic diagram of steps 1 and 2 of the manufacturing process of the third embodiment of the present invention.

FIG. 26 is a schematic diagram showing the relative relationship between the second strand of empty portions (273), the fifth strand of empty portions (266) and the sixth strand of empty portions (267) in the third embodiment.

FIG. 27 is one of the third step diagrams of the manufacturing process of the third embodiment of the present invention.

FIG. 28 is the second schematic diagram of the third step of the manufacturing process of the third embodiment of the present invention.

(First Embodiment)

Please refer to FIG. 4 to FIG. 13, which are the first embodiment of the present invention. The manufacturing method provided includes the following steps:

Step 1: Prepare a first board and a second board.

As shown in FIG. 5, a first plate body (21) and a second plate body (22) are provided. The first plate body (21) has a first surface (211). A second surface (212) is provided on the opposite side, and the second plate (22) has a third surface (221), a fourth surface (222) is provided on the opposite side of the third surface (221).

A plurality of first strands (223) are provided on the second plate (22) by machining, and the first strands (223) are along the side of the second plate (22). They are arranged at intervals and penetrate the fourth surface (222) and the third surface (221) of the second plate body (22), and the first plate body (21) corresponds to the first strands (223). Everywhere is impermeable.

The first and second plates (21) and (22) in this step may be selected from materials with better thermal conductivity such as copper, aluminum or their alloys, and the mechanical processing may be selected from stamping, drilling or other processing. Any way.

In some embodiments, the first hollow portion (223) may be circular, square, or other geometric shapes.

In the illustrated embodiment, the first strands of hollow portions (223) are arranged at equal intervals, but the present invention is not limited to these. In other implementations, based on the need to provide other fixing holes (not shown) The distance between some first strands of empty portions (223) may not be equal.

Although the shapes of the first and second plates (21) and (22) in this embodiment are square, this does not limit the present invention. In some embodiments, the first and second plates (21) (22) It can also be rectangular, circular, oval or other geometric shapes.

Step 2: Place the first and second plates against each other and pre-fix them.

This step is after setting the capillary structure (213) (224) and the capillary supporting body (23) at a predetermined position on the inner side corresponding to the first and second plate bodies (21) (22), so that the first plate body (21) The peripheral side of the second surface (212) and the peripheral side of the third surface (221) of the second plate (22) are as close as possible, and then the first and second plates (21) (21) are fixed by a pre-fixing method ( 22) It is fixed in an abutting state, and a first cavity (24) is formed between the first and second plates (21) (22).

In an exemplary embodiment, the pre-fixing means is shown in Figs. 7 and 8 to perform a welding process on the end faces of the first and second plate bodies (21) (22) to form a predetermined number of pre-fixing means. The fixed part (25) achieves the purpose of pre-fixing.

However, the pre-fixing method is not limited to welding in practice. The temporary fixation can be performed by other feasible methods.

Preferably, the welding processing operation uses a laser welding method.

Step 3: The solder is contained in the first hollow portion of the second board.

In this step, as shown in FIG. 9, an appropriate amount of solder (30) is filled in each of the first hollow portions (223) of the second board (22).

In one embodiment, the solder (30) in each of the first strands (223) of the second plate body (22) is completely filled.

In an exemplary embodiment, the solder (30) is a solder paste.

In some embodiments, a doctor blade may be used to apply the solder (30).

It should be particularly noted that the top surface of the peripheral surface of the second surface (212) of the first plate (21) and the bottom surface of the peripheral surface of the third surface (221) of the second plate (22) are actually closely adhered. State, but for the convenience of explanation and understanding, in Fig. 8, Fig. 9, and Fig. 12, the top surface on the peripheral side of the second surface (212) of the first plate body (21) and the second plate body (22 The third side (221) is intentionally drawn with a slight gap between the bottom sides.

Step 4: Heating.

In this step, the first and second plates (21) and (22) are put into a heating furnace for heating. The solder in the first strands (223) will be melted, although the first plate (21) The top surface of the peripheral side and the bottom surface of the second plate (22) are in contact with each other. In fact, there is still a slight gap between them. Because the liquefied solder has sufficient fluidity, the molten solder (30) It will flow to the outside of the periphery of the bottom of the first strand (223) by capillary action, and flow into the gap between the first and second plates (21) (22), adjacent to the first strand (223). The solders will be connected to each other, that is, as shown in FIG. 12, the gap between the top surface of the peripheral side of the first plate (21) and the bottom surface of the second plate (22) will be soldered (30 ) Is fully filled, and the solder is partially located in the first hollow portions (223).

Step 5: Allow to cool.

This step is performed in a heating furnace. After cooling, The solder between the first and second plates (21) and (22) is to completely seal the gap between the first and second plates (21) and (22), and the first and second plates (21) are firmly sealed. ) (22).

In addition, the second plate body (22) is provided with a degassing pipe (225), and after degassing and filling with the working fluid, the finished product of the temperature equalizing device (20) can be made.

In this embodiment, the first strands of empty portions (223) are spaced from each other near the periphery, that is, the outermost points of the first strands of empty portions (223) and the peripheral edge of the second plate (22) are maintained. A short distance; however, in other embodiments, as shown in Fig. 14 and Fig. 15, the first strands of empty portions (223) are opened on the peripheral edge of the second plate (22). , And was lacking.

(Second Embodiment)

Please continue to refer to FIG. 16 to FIG. 24, which are the second embodiment of the present invention. The manufacturing method is mainly the same as the first embodiment. The differences are described below:

Step 1: Prepare a third board and a fourth board.

The third plate (26) provided in this step has a fifth surface (261), a sixth surface (262) is provided on the opposite side of the fifth surface (261), and the third plate (26) is at a predetermined position. There is another exhaust part (263).

The fourth plate (27) has a seventh surface (271). An eighth surface (272) is provided on the opposite side of the seventh surface (271). A majority of the fourth plate (27) is provided. The second strands of empty portions (273), the second strands of empty portions (273) are arranged at intervals along the peripheral side of the fourth plate (27) and penetrate the eighth surface of the fourth plate (27) (272) and the seventh surface (271), the third plate (26) corresponding to the second strands (273) are in an impermeable state, and in addition, the fourth plate ( 27) A support portion (28) is provided at a predetermined position.

In an exemplary embodiment, the support portion (28) includes a plurality of first supports (281) formed by bulging outward from a seventh surface (271) of the fourth plate (27), and a plurality of support portions (281) The second support (282) formed by the eighth surface (272) of the plate (27) bulging outward.

Step 2: Prepare a fifth plate.

This step provides a fifth plate (29). The fifth plate (29) has a ninth surface (291). A tenth surface (292) is provided on the opposite side of the ninth surface (291). The five-plate body (29) corresponds to the second strand of empty portions (273) of the fourth plate (27) and is provided with an equal number of third strands (293). The third strands (293) are along The fifth plate (29) is arranged at intervals on the peripheral side, and passes through the tenth surface (292) and the ninth surface (291) of the fifth plate (29). In addition, the fifth plate (29) ) Is provided with a first through hole portion (294) and a second through hole portion (295).

Preferably, a plurality of fourth strands (296) are provided at predetermined positions of the fifth plate (29) as shown in FIG. 20, and the fourth strands (296) are alternately located adjacent to each other. Between the third hollow portion (293) and passing through the tenth surface (292) and the ninth surface (291) of the fifth plate (29), and the fourth plate (27) corresponds to the first The four strands (296) are all impermeable.

Step 3: Place the third, fourth, and fifth plates against each other and pre-fix them.

This step is after the capillary structure (264) (274) is provided on the inner side corresponding to the third plate (26) and the fourth plate (27), and then the third plate (26) and the fourth plate are sequentially (27) and the fifth plate (29) are as close as possible to each other as shown in FIG. 22, and then the third plate (26) and the fourth plate (27) are fixed by a pre-fixing means. ) And the fifth plate (29) are fixed in abutting state, and a second cavity (265) is formed between the third plate (26) and the fourth plate (27), and the fourth plate ( 27) forms a third cavity (297) with the fifth plate (29).

Step 4: The solder is contained in each of the second strand, the third strand, and the fourth strand.

This step is shown in FIG. 24 on the second strand of the fourth plate (27), the third strand of the fifth plate (29), and the fourth strand of the fourth strand (293). An appropriate amount of solder (30) is filled in the hollow portion (296).

Step 5: Heating.

During heating, the molten solder (30) flows into the gap between the third plate body (26), the fourth plate body (27) and the fifth plate body (29) by capillary action. The gap, that is, the gap between the third plate body (26), the fourth plate body (27) and the fifth plate body (29) peripheral side will be fully filled by the solder (30), and the solder partly Located in the second strands (273) and the fourth strands (296).

Step 6: Cool.

After cooling, the solder located between the third, fourth, and fifth plates (26), (27), (29) is about the third, fourth, and fifth plates (26, 27, 29). The gap between the peripheral sides is completely sealed.

Subsequently, a second cavity (265) between the third plate (26) and the fourth plate (27) is degassed and filled with a working fluid, and the fourth plate (27) and the fifth The third cavity (297) between the plate body (29) allows cooling liquid such as water to enter and exit through the first through-hole portion (294) and a second through-hole portion (295), and flows through the third Cavity (297), which further provides liquid cooling.

(Third embodiment)

Please continue to refer to FIG. 25 to FIG. 28, which are the third embodiment of the present invention. The manufacturing method is mainly the same as the second embodiment. The differences are described below:

Step 1: Prepare a fourth board and a third board.

The fourth plate (27) provided in this step is the same as the second embodiment and has a seventh surface (271). An eighth surface (272) is provided on the opposite side of the seventh surface (271). The plate body (27) is provided with a plurality of second strands (273), and the second strands (273) are spaced along the peripheral side of the fourth plate (27) and run through the fourth The eighth surface (272) and the seventh surface (271) of the plate body (27).

The third plate (26) has a fifth surface (261), a sixth surface (262) is provided on the opposite side of the fifth surface (261), and the third plate (26) is also provided with an exhaust portion (263), which is different from the second embodiment in that the third plate body (26) corresponds to the second line space portion (273) of the fourth plate body (27) and is provided with an equal number of fifth line space portions (266), the fifth strands (266) are spaced apart along the peripheral side of the third plate (26), and pass through the sixth surface (262) and the first plate of the third plate (26) Five faces (261).

More preferably, as shown in FIG. 26, a plurality of sixth strands (267) are provided at predetermined positions of the third plate (26), and the sixth strands (267) are alternately located in the phase. Between the adjacent fifth strands (266) and passing through the sixth surface (262) and the fifth surface (261) of the third plate (26), and the fourth plate (27) corresponds to the The sixth hollow part (267) is in an impermeable state.

Step 2: Prepare a fifth plate.

This step provides a fifth plate (29). The fifth plate (29) has a ninth surface (291). A tenth surface (292) is provided on the opposite side of the ninth surface (291). The five plate body (29) is also provided with a first through hole portion (294) and a second through hole portion (295), and the fifth plate body (29) corresponds to the second strand portion (273). Everywhere is impermeable.

Step 3: Place the third, fourth, and fifth plates against each other and pre-fix them.

This step is the same as that of the second embodiment and will not be described in detail.

Step 4: The solder is contained in each of the fifth strand, the sixth strand, and the second strand.

This step is to fill an appropriate amount of solder into the fifth and sixth strands (265) (266) of the third board (26) and the second strands (273) of the fourth board (27). (30).

The subsequent step 5 for heating and step 6 for cooling are the same as those in the second embodiment, and will not be described in detail.

The present invention has been described in detail above, but the above are only preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention shall still fall within the scope of patent of the present invention.

(20) ‧‧‧Equal temperature device

(21) ‧‧‧First plate

(212) ‧‧‧Second Side

(213) ‧‧‧Capillary structure

(22) ‧‧‧Second plate

(222) ‧‧‧ fourth

(223) ‧‧‧ the first ray

(224) ‧‧‧Capillary structure

(225) ‧‧‧Degassing tube

(23) ‧‧‧Capillary support

Claims (16)

A method for manufacturing a cavity of a temperature equalizing device includes at least the following steps: (1) preparing a first plate body and a second plate body, the first plate body having a first surface, and the first surface is opposite A second surface is provided on the side, the second plate body has a third surface, a fourth surface is provided on the opposite side of the third surface, and a plurality of first strands are provided on a predetermined position of the second plate. The first strands of space are arranged at intervals along the sides of the second plate, and pass through the fourth and third faces of the second plate, and the first plate corresponds to the first strands of space. Everywhere is in a non-perforated state; (2) The second surface peripheral side of the first plate body and the third surface peripheral side of the second plate body are abutted correspondingly, and the first and second surfaces are fixed by a pre-fixing means. The board is fixed in an abutment state, and a first cavity is formed between the first and second boards; (3) an appropriate amount of solder is contained in each of the first hollow portions of the second board; (4) ) Heating to melt the solder located in the first hollow portions, and the molten solder flows into the gap between the first and second plates by capillary phenomenon; and (5) after cooling Located at the first solder between the two plates is about the first, the gap between the two plates to be sealed and securely engage the first and second plate. The method for manufacturing a cavity of a temperature equalizing device as described in claim 1, wherein: the pre-fixing means of step (2) is performed a welding process on the outer end faces of the first and second plates to form a predetermined number of pre-fixed parts . The method for manufacturing a cavity of a temperature equalizing device as described in claim 2, wherein: the welding process is a laser welding method. A cavity structure of a temperature equalizing device includes at least: a first plate having a first surface, a second surface opposite to the first surface, and a second plate having a third surface A fourth surface is provided on the opposite side of the third surface, and a plurality of first strands are arranged at predetermined positions on the second plate. The first strands are spaced along the side of the second plate. And penetrates the fourth and third faces of the second plate, and the first plate is impermeable to the first strands In an empty state, the second surface of the first plate body and the third surface of the second plate body are in contact with each other, and a first cavity is formed therebetween, and a predetermined number of spaces are formed on the outer end surfaces of the first and second plate bodies. The pre-fixed portion is filled with solder between the top surface of the peripheral side of the first plate and the bottom surface of the second plate. A method for manufacturing a cavity of a temperature equalizing device includes at least the following steps: (1) preparing a third plate and a fourth plate, the third plate having a fifth surface, and the fifth surface is opposite A sixth surface is provided on the side, an exhaust portion is provided at a predetermined position of the third plate, and the fourth plate has a seventh surface. An eighth surface is provided on the opposite side of the seventh surface. The four plate bodies are provided with a plurality of second strands of space, and the second strands of space are spaced along the peripheral side of the fourth plate and penetrate the eighth and seventh sides of the fourth plate. And the third plate body corresponding to the second strands of hollow parts is in a state of being impermeable; (2) a fifth plate body is provided, the fifth plate body has a ninth surface, and the ninth surface An opposite side is provided with a tenth surface. The fifth plate body is provided with an equal third third line portion corresponding to the second line portion of the fourth plate body. The third line portions penetrate the fifth plate body. On the tenth and ninth sides, a first through-hole portion and a second through-hole portion are additionally provided on the fifth plate body; (3) the third plate body, the fourth plate body, and the fifth plate are sequentially arranged; Body side Should be abutted, and the third plate body, the fourth plate body and the fifth plate body should be fixed in an abutting state by a pre-fixing means, and a second cavity is formed between the third plate body and the fourth plate body. A third cavity is formed between the fourth plate body and the fifth plate body; (4) an appropriate amount of solder is contained in each of the second and third hollow portions; (5) heating is performed so that The solder located in the second and third hollow portions is melted, and the molten solder flows into the gap between the third plate body, the fourth plate body, and the fifth plate body by the capillary phenomenon; And (6) after cooling, the solder located between the third, fourth, and fifth plates is to seal the gaps between the third, fourth, and fifth plates, and firmly seal the first Three, four, five plate joints. The method for manufacturing a cavity of a temperature equalizing device as described in claim 5, wherein: the first The fourth board has a plurality of fourth strands at a predetermined position. The fourth strands are alternately located between adjacent third strands and penetrate the tenth side of the fifth board. And the ninth side, and the fourth plate body corresponding to the fourth strands of the hollow portion is in a state of non-perforation. The method for manufacturing a cavity of a temperature equalizing device as described in claim 6 or 7, wherein: the pre-fixing means of step (3) is performed a welding process at intervals on the outer end faces of the third, fourth, and fifth plates to form a predetermined number The pre-fixing department. The method for manufacturing a cavity of a temperature equalizing device as described in claim 7, wherein the welding process is a laser welding method. A cavity structure of a temperature equalizing device includes at least: a third plate body having a fifth surface, a sixth surface is provided on the opposite side of the fifth surface, and a row is provided at a predetermined position of the third plate body. Air part; a fourth plate body having a seventh surface, an eighth surface is provided on the opposite side of the seventh surface, and a plurality of second strands of empty portions are provided at predetermined positions of the fourth plate body; The strands are arranged at intervals along the peripheral side of the fourth plate, and pass through the eighth and seventh sides of the fourth plate. The third plate corresponds to the second strands. A state of being impermeable to air; and a fifth plate body having a ninth surface, a tenth surface is provided on the opposite side of the ninth surface, and the fifth plate body corresponds to the second hollow portion of the fourth plate body An equal number of third strands of hollow portions are provided, and the third strands of hollow portions penetrate the tenth and ninth surfaces of the fifth plate body, and a first through hole portion and a first through hole portion are further provided on the fifth plate body. Two through-hole portions, the third plate body, the fourth plate body, and the fifth plate body are in contact with each other on the peripheral side, and a second cavity is formed between the third plate body and the fourth plate body. A third cavity is formed between the plate body and the fifth plate body, and a predetermined number of pre-fixed portions are formed at intervals on the outer end faces of the third, fourth, and fifth plate bodies. The fifth plate body is filled with solder between the peripheral sides. As described in claim 9, the cavity structure of the temperature equalizing device, wherein: the fourth plate is provided with a plurality of fourth strands in a predetermined position, and the fourth strands are alternately located in adjacent first sections. Between the three strands of hollow portions, and passing through the tenth and ninth sides of the fifth plate body, the fourth plate body is in an airtight state corresponding to the fourth strands of hollow portions. A method for manufacturing a cavity of a temperature equalizing device includes at least the following steps: (1) preparing a fourth plate and a third plate, the fourth plate having a seventh surface, and the seventh surface is opposite An eighth surface is provided on the side, and a plurality of second strands of hollow portions are arranged at predetermined positions of the fourth plate body. The second strands of hollow spaces are arranged along the peripheral side of the fourth plate body and run through the first plate. The eighth surface and the seventh surface of the four plate body; and the third plate body has a fifth surface, a sixth surface is provided on the opposite side of the fifth plate body, and the third plate body corresponds to the fourth plate body. The second strand of empty space is provided with an equal number of fifth strands of space. The fifth strands of space are arranged along the peripheral side of the third plate at intervals, and penetrate the sixth surface and the third plate of the third plate. There are five sides, and an exhaust part is provided at a predetermined position of the third plate; (2) A fifth plate is provided, the fifth plate has a ninth surface, and a first side is provided on the opposite side of the ninth surface. Ten sides, and the fifth plate body corresponding to the second strands of the air is in an impermeable state, and the fifth plate body is further provided with a first through hole portion and a second through hole portion; 3) In order, the third plate, the fourth plate, and the fifth plate are abutted on the peripheral side of each other in sequence, and the third plate, the fourth plate, and the fifth plate are fixed in abutting state by a pre-fixing method. A second cavity is formed between the third plate and the fourth plate, and a third cavity is formed between the fourth plate and the fifth plate; (4) an appropriate amount of solder is placed in the Inside each of the second strand and the fifth strand; (5) heating to melt the solder located in the second and fifth strands, and the molten solder flows into the first strand by capillary phenomenon; The gap between the three plate body, the fourth plate body and the fifth plate body; and (6) after cooling, the solder located between the third plate body, the fourth plate body and the fifth plate body is about to The gaps between the third, fourth, and fifth plates are sealed, and the third, fourth, and fifth plates are firmly joined. The method for manufacturing a cavity of a temperature equalizing device as described in claim 11, wherein a plurality of sixth strands are provided at predetermined positions of the third plate, and the sixth strands are alternately located adjacent to each other. Between the fifth strands and passing through the sixth and fifth faces of the third plate, and the fourth plate corresponding to the sixth strands is impermeable. Empty state. The method for manufacturing a cavity of a temperature equalizing device as described in claim 11 or 12, wherein: the pre-fixing means of step (3) is a welding process performed on the end faces of the third, fourth, and fifth plates to form a predetermined number The pre-fixing department. The method for manufacturing a cavity of a temperature equalizing device as described in claim 13, wherein the welding process uses a laser welding method. A cavity structure of a temperature equalizing device includes at least: a fourth plate body having a seventh surface, an eighth surface is provided on the opposite side of the seventh surface, and a plurality of The second strands of space are arranged along the periphery of the fourth plate at intervals, and pass through the eighth and seventh sides of the fourth plate; a third plate having A fifth surface, a sixth surface is provided on the opposite side of the fifth surface, and the third plate body is provided with an equal number of fifth strand portions corresponding to the second strand portions of the fourth plate body. The hollow portions are arranged at intervals along the peripheral side of the third plate, and pass through the sixth and fifth faces of the third plate, and an exhaust portion is provided at a predetermined position of the third plate; and A fifth plate body has a ninth surface, a ninth surface is provided on the opposite side of the ninth surface, and the fifth plate body is in a state of non-permeability corresponding to the second strands, The fifth plate body is further provided with a first through-hole portion and a second through-hole portion, and the third plate body, the fourth plate body, and the fifth plate body are in contact with each other on the peripheral side, corresponding to the third plate body. A second cavity is formed between the body and the fourth plate body, and a third cavity is formed between the fourth plate body and the fifth plate body. A predetermined number of spaces are formed at the outer end surfaces of the third, fourth, and fifth plate bodies. The pre-fixed portion is filled with solder between the third plate body, the fourth plate body, and the fifth plate body. The cavity structure of the temperature-equalizing device according to claim 15, wherein a plurality of sixth strands are provided at a predetermined position on the third plate, and the sixth strands are alternately located on adjacent fifths. Between the strands and through the sixth and fifth faces of the third plate, the fourth plate is in an airtight state corresponding to the sixth strands.