TWI836431B - Substrate processing device and substrate processing method - Google Patents

Abstract

Provided are a substrate processing device and a substrate processing method that can fully ensure the bonding stability between a plurality of components and a substrate. The device comprises: a stage 30 on which a substrate 2 having a plurality of components 4a, 4b, and 4c arranged is placed; an upper member 21 covering the upper portion of the stage and forming a processing chamber 6 as a pressurized space between the stage and the upper member 21; a sheet holding portion 40 holding an elastic sheet 80 between the stage and the upper member 21; and a pressurization control portion 12 for pressurizing the processing chamber 6. The sheet holding portion 40 transports the elastic sheet 80 from one side of the stage 30 to the other side by means of a push shaft 41 and a winding roller 42 arranged on both sides of the stage 30, and arranges the elastic sheet 80 on the stage 30 so that the substrate 2 is covered.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate on which a plurality of components are arranged.

In the technology of forming an element array composed of a plurality of elements on a substrate, in order to improve the strength or bonding stability of the mechanical bonding between the plurality of elements and the substrate, a substrate processing device is used to press the plurality of elements into a substrate on which the plurality of elements are arranged using a flat plate. processing. In recent years, the height of components placed on a substrate has been miniaturized to the order of several μm. On the other hand, the flatness of the flat surface may vary by tens of μm. At this time, it is difficult to press the plurality of components on the substrate with a uniform force using the flat plate.

For example, Patent Document 1 describes a technology of covering electronic components and mounting boards with resin films. The resin film has the characteristic of deforming according to the shape of the plurality of components. When trying to solve the above problem, it should be considered that it is useful to press the plurality of components on the substrate with an elastic sheet such as a resin film. When using this technology, more thought is needed in order to press in multiple components with uniform force. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2002-217221

[Problem to be solved by the invention]

In view of this actual situation, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can fully ensure the stability of the bonding between a plurality of components and a substrate. [Means used to solve problems]

In order to achieve the above object, a substrate processing apparatus of the present invention includes: a stage on which a substrate with a plurality of components is arranged; an upper member covering the top of the stage and forming a pressurized space between the stage; and a sheet holding a section that holds the elastic sheet between the stage and the upper member; and a pressure control section that pressurizes the pressurized space; wherein the sheet holding section is controlled by push shafts and rolls arranged on both sides of the stage. The elastic sheet is conveyed around the roller from one side of the stage to the other side, and the elastic sheet is arranged on the stage so that the substrate is covered.

In the substrate processing device of the present invention, the pressurizing control unit pressurizes the pressurizing space, and the sheet holding unit transports the elastic sheet from one side of the stage to the other side through the push shaft and the winding roller arranged on both sides of the stage, and arranges the elastic sheet on the stage so that the substrate is covered. In the state where the elastic sheet is arranged on the stage so that the substrate is covered, the pressurizing control unit pressurizes the pressurizing space, and the elastic sheet can be pressed toward the substrate based on the pressure, so that the elastic sheet contacts the substrate or a plurality of components arranged on the substrate, and the plurality of components arranged on the substrate can be pressed in by the elastic sheet.

In addition, when the pressurized space is pressurized, the elastic sheet can be deformed along with the shapes of the plurality of components arranged on the substrate, so that the elastic sheet can be made to fit the plurality of components and the plurality of components can be pressed in with a uniform force by the elastic sheet. In addition, since the elastic sheet is transported from one side of the stage to the other side by the push shaft and the winding roller, the elastic sheet can be provided between the stage and the upper member by a small and simple structure. As described above, according to the substrate processing device of the present invention, the bonding stability of the plurality of components and the substrate can be fully ensured.

Preferably, each time the substrate is placed on the stage, the push shaft and the winding roller respectively deliver and wind the elastic sheet. With such a configuration, each time the substrate is placed on the stage, an unused portion of the elastic sheet is provided between the stage and the upper member, and the elastic sheet in an appropriate state can be used to press a plurality of components arranged on the substrate in a stable state.

Preferably, it further includes a plurality of lift pins that can be lifted and lowered through the inside of the stage, and the substrate is transported to the stage through the plurality of lift pins. With such a configuration, the substrate can be transferred from the transfer position to the stage in a stable state, and damage to the substrate during the transfer can be prevented.

Preferably, the sheet holding portion is relatively close to the stage, and the flexible sheet is arranged on the stage. With such a configuration, the flexible sheet can be arranged on the stage efficiently, and the operation line can be expected to be accelerated.

Preferably, the device further comprises a decompression control unit for decompressing the space inside the sheet surrounded by the elastic sheet and the carrier. When the elastic sheet is arranged on the carrier so that the substrate is covered, the elastic sheet is sucked toward the substrate by decompressing the space inside the sheet, so that the elastic sheet can be attached to the substrate or a plurality of components arranged on the substrate. In this state, the pressurized space is pressurized, and the elastic sheet is pressed toward the substrate based on the pressure, so that the elastic sheet can press the plurality of components arranged on the substrate with a uniform force.

Preferably, a sheet fixing portion for fixing the elastic sheet to the stage is provided at a position further away from the center of the stage than the installation area of the substrate. At the position of the sheet fixing part, with the elastic sheet fixed to the stage, by pressurizing the pressurized space, the elastic sheet can be pressed against the substrate in a stable state. Multiple components arranged on the substrate are pressed in with a more uniform force.

Preferably, the pressurization control unit pressurizes the pressurized space so that the air pressure inside the pressurized space is substantially twice the air pressure outside the pressurized space. With such a configuration, when the pressurized space is pressurized, the elastic sheet is pressed against the substrate with an appropriate pressure, and the plurality of components can be pressed into the substrate with an appropriate force by the elastic sheet. Therefore, the plurality of components can be prevented from falling off the substrate, and the bonding stability between the plurality of components and the substrate can be fully ensured.

In order to achieve the above object, the substrate processing method of the present invention includes the steps of: arranging a substrate with a plurality of components on a stage provided inside a pressurized space; arranging the elastic sheet on the stage to cover it The steps of the aforementioned substrate; the step of depressurizing the space within the sheet surrounded by the aforementioned elastic sheet and the aforementioned stage; and the step of pressurizing the aforementioned pressurized space.

In the substrate processing method of the present invention, there are steps of placing an elastic sheet on a stage to cover the substrate, depressurizing the space inside the sheet surrounded by the elastic sheet and the stage, and pressurizing the pressurized space. In a state where the elastic sheet is placed on the stage to cover the substrate, the elastic sheet is sucked toward the substrate by depressurizing the space inside the sheet, and the elastic sheet can contact the substrate or a plurality of components placed on the substrate. In this state, by pressurizing the pressurized space, the elastic sheet is pressed toward the substrate based on the pressure, and a plurality of components placed on the substrate can be pressed in by the elastic sheet.

In addition, when the space inside the sheet is depressurized or when the pressurized space is pressurized, the elastic sheet can be deformed according to the shape of the multiple components arranged on the substrate. Therefore, by making the elastic sheet fit the multiple components, the multiple components can be pressed into the elastic sheet with a uniform force. Therefore, according to the substrate processing method of the present invention, the bonding stability of the multiple components and the substrate can be fully ensured.

Preferably, the pressurized space is pressurized in a state where the elastic sheet is in contact with the plurality of elements arranged on the substrate. With such a configuration, as described above, when the elastic sheet is pressed against the substrate based on the air pressure of the pressurized space, the plurality of components arranged on the substrate can be efficiently pressed into the substrate using the elastic sheet.

Preferably, while the pressurized space is being pressurized, the substrate provided on the stage is heated by heating the pressurized space. With such a configuration, a plurality of elements arranged on the substrate can be bonded to the substrate satisfactorily. In addition, the elastic sheet becomes easy to deform according to the shape of the plurality of components arranged on the substrate. When the space inside the sheet is depressurized or the pressurized space is pressurized, the degree of adhesion between the elastic sheet and the plurality of components can be improved.

Preferably, while the pressurized space is being pressurized, the substrate mounted on the stage is heated by heating the stage. Even with such a configuration, a plurality of elements arranged on the substrate can be bonded to the substrate satisfactorily. In addition, the elastic sheet becomes easy to deform according to the shape of the plurality of components arranged on the substrate. When the space inside the sheet is depressurized or the pressurized space is pressurized, the degree of adhesion between the elastic sheet and the plurality of components can be improved.

The present invention is described below based on the embodiments shown in the drawings.

As shown in FIG. 1, a substrate processing apparatus 10 according to one embodiment of the present invention is an apparatus for forming an element array 4 (FIG. 3) composed of a plurality of elements 4a, 4b, 4c on a substrate 2, and is intended to enhance the strength or stability of the mechanical connection between the plurality of elements 4a, 4b, 4c and the substrate 2 by pressing the plurality of elements 4a, 4b, 4c into the substrate 2 on which the plurality of elements 4a, 4b, 4c are arranged by a specific means. That is, the substrate processing apparatus 10 provides a function as a pressurizing unit (pressurizing device) when forming the element array 4 on the substrate 2. The substrate processing apparatus 10 includes a chamber 20, a stage 30, and a sheet holding unit 40. In the figure, the X-axis corresponds to the width direction of the chamber 20 , the Y-axis corresponds to the depth direction of the chamber 20 , and the Z-axis corresponds to the height direction of the chamber 20 .

The chamber 20 is composed of a metal or other box body and includes an upper member 21 and a lower member 22 . The upper member 21 and the lower member 22 are arranged so as to be assembleable up and down (in the Z-axis direction). At least one of the upper member 21 and the lower member 22 is movable in the Z-axis direction. In this embodiment, the upper member 21 moves up and down relative to the lower member 22 . The processing chamber 6 is formed by combining the upper member 21 and the lower member 22 . The processing chamber 6 is a space formed inside the upper member 21 and the lower member 22 and is used as a pressurized space. Air, nitrogen, inert gas, etc. exist inside the processing chamber 6 .

When the substrate 2 and the like are carried into the chamber 20, the upper member 21 moves upward relative to the lower member 22 to open the processing chamber 6. When the processing chamber 6 is opened, a transport space 7 is formed between the upper member 21 and the lower member 22. The elastic sheet 80 described later is carried to the transport space 7 by the sheet holding portion 40 and is held.

When the substrate 2 on which the plurality of components 4a, 4b, 4c are arranged is subjected to a process of pressing the plurality of components 4a, 4b, 4c by a specific means, as shown in Fig. 9, the upper member 21 moves downward relative to the lower member 22 from the position shown in Fig. 1, and closes (seals) the processing chamber 6. Therefore, the processing chamber 6 constitutes a closed space and functions as a pressurized space in which the interior thereof can be pressurized.

As shown in FIG. 1 , the upper component 21 has a cross-sectional shape that is basically a C-shape, and includes a top plate portion 210 and an upper leg portion 211. The upper component 21 functions as a cover of the chamber 20. The top plate portion 210 constitutes the top of the upper component 21, and is composed of a plate body having a shape that is basically parallel to the XY plane. The top plate portion 210 is formed to cover the top of the carrier 30. The upper leg portion 211 extends basically in a vertical direction (downward) relative to the top plate portion 210, and is formed at the edge of the top plate portion 210. Although not shown in detail, when the upper member 21 is viewed from the negative Z-axis direction, the upper leg portion 211 is formed to surround the edge of the top plate portion 210 in a substantially ring shape (substantially square shape). The upper leg portion 211 supports the top plate portion 210.

A first space 212 is formed inside the upper member 21 (i.e., an area surrounded by the top plate 210 and the upper leg 211). When the upper member 21 is assembled to the lower member 22, the first space 212 constitutes a portion of the upper side of the processing chamber 6.

In the interior of the first space 212, an upper heating device 91 is provided on the ceiling portion 210. The upper heating device 91 is used to heat the internal atmosphere of the processing chamber 6, and is composed of, for example, a heater. As described later, the heat generated from the upper heating device 91 is conducted to the substrate 2 disposed on the stage 30, which helps to improve the bonding force between the substrate 2 and the plurality of components 4a, 4b, 4c disposed thereon. In addition, as described later, an elastic sheet 80 is disposed on the stage 30 to cover the substrate 2 (see FIG. 8 ), and the heat generated from the upper heating device 91 is also conducted to the elastic sheet 80, so that the shape of the elastic sheet 80 can be deformed along with the shapes of the plurality of components 4a, 4b, 4c disposed on the substrate 2.

The lower member 22 has a substantially symmetrical shape relative to the upper member 21 . The lower member 22 has a substantially C-shaped cross-sectional shape and includes a bottom portion 220 and a lower leg portion 221 . The bottom 220 constitutes the bottom of the lower member 22 and is composed of a plate body having a shape substantially parallel to the XY plane. A plurality of through-holes 220a are formed in the bottom 220, and a plurality of lift pins 50 (to be described later) are inserted into the plurality of through-holes 220a so as to be able to move up and down.

The lower leg 221 basically extends in a vertical direction (upward) relative to the bottom 220 and is formed at the edge of the bottom 220. Although detailed illustration is omitted, when the lower member 22 is viewed from the positive direction of the Z axis, the lower leg 221 is formed to surround the edge of the bottom 220 in a substantially ring shape (substantially square shape). As described later, when the upper member 21 is assembled to the lower member 22, the lower leg 221 contacts the upper leg 211 directly or through the elastic sheet 80 to support the upper member 21. In addition, the upper leg 211 and the lower leg 221 are preferably connected through a sealing member such as an O-ring.

The second space 222 is formed inside the lower member 22 (that is, the area surrounded by the bottom 220 and the lower leg portion 221). When the upper member 21 is assembled to the lower member 22 , the second space 222 constitutes a part of the lower side of the processing chamber 6 . That is, the processing chamber 6 is formed by combining the first space 212 and the second space 222 . In addition, a pipeline (not shown) is formed in the upper member 21 or the lower member 22, and gas is sent into the inside of the processing chamber 6 through this pipeline, so that the inside of the processing chamber 6 can be pressurized (set to a positive pressure).

The stage 30 is a platform for placing the substrate 2 on which the plurality of components 4a, 4b, and 4c are arranged, and is fixed to the inside of the chamber 20 (the upper leg portion 211 and the lower leg portion 221) by a support member (not shown). The stage 30 is made of, for example, a metal flat plate, and has a surface substantially parallel to the XY plane.

The width of the stage 30 in the X-axis direction is shorter than the width of the inner circumference of each of the upper leg 211 and the lower leg 221 in the X-axis direction (i.e., the width of each of the first space 212 and the second space 222 in the X-axis direction) by a specific length. The width of the stage 30 in the Y-axis direction is shorter than the width of the inner circumference of each of the upper leg 211 and the lower leg 221 in the Y-axis direction (i.e., the width of each of the first space 212 and the second space 222 in the Y-axis direction) by a specific length.

The top of the stage 30 is covered by the top plate 210 of the upper member 21, and the bottom 220 of the lower member 22 is arranged below the stage 30. The stage 30 is arranged above the positive side end (top) of the lower side foot 221 of the lower member 22 in the Z-axis direction, and when the upper member 21 is assembled to the lower member 22, the stage 30 is located inside the first space 212 of the upper member 21. The space formed between the stage 30 and the upper member 21 constitutes a part of the pressurized space (processing chamber 6).

In addition, the height position of the stage 30 is not particularly limited, and may be the same height as the end of the lower leg 221 on the positive direction side of the Z axis. Alternatively, the stage 30 may be arranged below the end (top) of the lower leg 221 on the positive direction side of the Z axis of the lower component 22.

In addition, the X-axis direction width of the stage 30 may be equal to the X-axis direction width of each inner circumferential surface of the upper leg 211 and the lower leg 221 , and the Y-axis direction width of the stage 30 may be equal to the upper leg 211 And the Y-axis direction width of each inner circumferential surface of the lower leg portion 221 is equal. At this time, the upper leg portion 211 is in contact with the edge portion (end surface) of the stage 30 , and a sealed space is formed by the stage 30 , the top plate portion 210 , and the upper leg portion 211 . This confined space can be utilized as a pressurized space.

A lower heating device 92 is provided on the back of the stage 30. The lower heating device 92 is used to heat the stage 30 and is composed of, for example, a heater. The heat generated from the lower heating device 92 is conducted to the substrate 2 provided on the stage 30, which helps to improve the bonding force between the substrate 2 and the plurality of components 4a, 4b, 4c arranged thereon. In addition, as described later, an elastic sheet 80 is arranged on the stage 30 to cover the substrate 2, and the heat generated from the lower heating device 92 is also conducted to the elastic sheet 80, so that the shape of the elastic sheet 80 can be deformed along with the shapes of the plurality of components 4a, 4b, 4c arranged on the substrate 2.

The carrier 30 includes a plurality of first suction holes 31, a second suction hole 32, and a sheet fixing portion 33 (FIG. 3). As shown in FIG. 2, each of the plurality of first suction holes 31 is formed at an outer edge portion 34a of a substrate setting area 34 of the carrier 30. The substrate setting area 34 is an area where the substrate 2 is set in the carrier 30 which is basically formed of a square, and has a shape that conforms to the shape of the substrate 2 (basically a square in the present embodiment). Although the details will be described later, in a state where the substrate 2 is set on the carrier 30, the carrier 30 is covered by an elastic sheet 80 (refer to FIG. 3), and a sheet space 8 is formed between the elastic sheet 80 and the carrier 30 (FIG. 5). The first suction hole 31 functions as a suction hole for sucking the gas (internal atmosphere) inside the space 8 inside the sheet, and is arranged at a position where the gas inside the space 8 inside the sheet can be sucked.

Regarding the size of the first suction hole 31, for example, when the shape of the first suction hole 31 is a rectangle, the length of the short side of the first suction hole 31 is preferably 0.3~10.0 mm, and more preferably 0.5~1.5 mm. In addition, the length of the long side of the first suction hole 31 is preferably 2.0 to 15.0 mm, and more preferably 3.0 to 5.0 mm.

When the short side length of the first suction hole 31 is set within the above range, the short side length of the first suction hole 31 will not be too short, and the gas inside the sheet inner space 8 (FIG. 5) can be efficiently sucked. In addition, when the gas inside the sheet inner space 8 is sucked through the first suction hole 31, although the elastic sheet 80 is sucked toward the first suction hole 31, it is possible to prevent the elastic sheet 80 from being excessively sucked through the first suction hole 31, and it is possible to prevent the occurrence of defects such as difficulty in peeling the elastic sheet 80 from the substrate 2 or the stage 30 after the substrate 2 using the elastic sheet 80 is pressurized.

In addition, when the long side length of the first suction hole 31 is set within the above range, the long side length of the first suction hole 31 will not be too short, and the gas inside the sheet inner space 8 can be efficiently sucked. In addition, the long side length of the first suction hole 31 will not be too long, which can prevent the temperature distribution in the surface of the substrate 2 from deviating, evenly maintain the suitability of each part of the substrate 2, and improve the bonding reliability between the substrate 2 and the plurality of components 4a, 4b, 4c arranged thereon.

In addition, when the shape of the first suction hole 31 is an ellipse, the length of the short side of the rectangle can be applied to the length of the short axis of the ellipse, and the length of the long side of the rectangle can be applied to the length of the long axis of the ellipse. In addition, when the shape of the first suction hole 31 is other shapes, the same is true. The length of the short side of the rectangle can be applied to the length of the first suction hole 31 in the Y-axis direction formed by other shapes, and the length of the long side of the rectangle can be applied to the length of the first suction hole 31 in the X-axis direction formed by other shapes.

In the example shown in the figure, some of the plurality of first suction holes 31 are arranged at specific intervals in the Y-axis direction along the first side 34a1 or the third side 34a3 of the substantially square substrate installation area 34. Linear shape. Some of the plurality of first suction holes 31 are linearly arranged at specific intervals in the X-axis direction along the second side 34a2 or the fourth side 34a4 of the substantially square substrate installation area 34.

The number of the first suction holes 31 is not limited to the number shown in the figure, and can be changed appropriately. In addition, the pitch of each of the plurality of first suction holes 31 may also be appropriately changed. For example, the pitch of each of the plurality of first suction holes 31 may be smaller than the diameter of each of the plurality of first suction holes 31 (along the outer edge portion 34a of the substrate installation area 34). diameter in the extending direction) are adjacently arranged at a shorter distance.

When the first suction hole 31 is viewed from the Z-axis direction, the first suction hole 31 has a substantially elliptical shape. However, the shape of the first suction hole 31 is not limited to this, and may be substantially elliptical, substantially triangular, substantially square, or other polygonal shapes. For example, the shape of the first suction hole 31 may be in a direction perpendicular to the extending direction of the outer edge 34a of the substrate installation area 34 (away from the outer edge 34a of the substrate installation area 34 along the X-axis direction or the Y-axis direction). direction) a slightly elliptical shape with a long axis. Alternatively, the width in the direction perpendicular to the extending direction of the outer edge portion 34 a of the first suction hole 31 may be larger than the width in the direction along the extending direction of the outer edge portion 34 a of the first suction hole 31 .

As shown in the enlarged view of the figure, each of the plurality of first suction holes 31 is formed across the outer edge portion 34 a of the substrate installation area 34 of the stage 30 . That is, a part of the first suction hole 31 is located further outside the outer edge 34a of the substrate installation area 34 (away from the center side of 30), and the remaining part of the first suction hole 31 is located farther than the substrate. The outer edge portion 34a of the area 34 is provided further inside (closer to the center side of the stage 30).

In the example shown in the figure, in the first suction hole 31, the area of the portion located outside the outer edge portion 34a of the substrate installation area 34 is larger than the area located inside the outer edge portion 34a of the substrate installation area 34. The area of the parts is smaller, but they can also be larger, or their areas can be equal.

When the substrate 2 is installed in the substrate installation area 34 , in each of the plurality of first suction holes 31 , a part of the first suction hole 31 located inside the outer edge 34 a of the substrate installation area 34 is covered by the substrate 2 . That is, when the substrate 2 is installed in the substrate installation area 34 , each of the plurality of first suction holes 31 spans the outer edge portion (edge portion) of the substrate 2 provided in the substrate installation area 34 .

Even if the substrate 2 is arranged to be slightly shifted toward the X-axis direction side and/or the Y-axis direction side from the outer edge portion 34a of the substrate installation area 34, the plurality of first suction holes 31 are formed so as not to cause obstruction. That is, since each of the plurality of first suction holes 31 is disposed across the outer edge 34 of the substrate installation region 34 , even if the substrate 2 is disposed further toward the X-axis than the outer edge 34 a of the substrate installation region 34 If the position of the direction side and/or the Y-axis direction side is offset, as long as the first suction hole 31 is not completely closed, suction can be performed through each of the plurality of first suction holes 31. In this way, by arranging the plurality of first suction holes 31 across the outer edge portion 34 of the substrate installation area 34 , positional deviation of the substrate 2 relative to the substrate installation area 34 can be tolerated.

When the substrate 2 is installed in the substrate installation area 34 , the portion of the first suction hole 31 located inward from the outer edge 34 of the substrate installation area 34 is closed by the substrate 2 . The outer edge portion 34 of the substrate installation area 34 is open. Therefore, suction through the first suction hole 31 of the sheet inner space 8 (Fig. 5) is mainly performed at a portion located outside the outer edge portion 34 of the substrate installation area 34.

In the example shown in the figure, although a plurality of first suction holes 31 are formed on the stage 30, the number of the first suction hole 31 may be 1. For example, a substantially annular first suction hole 31 extending along (or surrounding) the outer edge 34a of the substrate installation area 34 may be formed on the stage 30.

As shown in FIG. 1, each of the plurality of first suction holes 31 is connected to the first suction pipe 60. Each of the plurality of first suction pipes 60 extends downward, and a portion thereof is buried in the bottom 220 of the lower member 22. The gas sucked through the first suction hole 31 is discharged to the outside of the chamber 20 through the first suction pipe 60. Each of the plurality of first suction pipes 60 is connected to a suction device not shown. In addition, the plurality of first suction pipes 60 may be combined with each other to form one suction pipe. In this case, if the suction pipe can be sucked by the suction device, the number of suction devices can be reduced.

The second suction hole 32 is basically formed in the center of the stage 30 and is arranged inside the plurality of first suction holes 31 . In a state where the substrate 2 is placed on the stage 30 , by suctioning through the second suction hole 32 , the substrate 2 can be sucked to the stage 30 and fixed to the stage 30 by suction. In addition, the effect of adsorbing and fixing the substrate 2 to the stage 30 can also be obtained by suction through the plurality of first suction holes 31 .

As shown in FIG. 3 , the second suction hole 32 is formed inside the substrate placement area 34 of the stage 30 and is arranged further inside (close to the center side of the stage 30) than the first suction hole 31. It is preferable that the second suction hole 32 is arranged at a position where the center of the substrate 2 placed on the stage 30 can be sucked. The number of the second suction holes 32 may be one or more.

As shown in FIG. 1 , the second suction hole 32 is connected to the second suction pipe 70 . The second suction pipe 70 extends downward, and is partially buried in the bottom 220 of the lower member 22 . The gas sucked through the second suction hole 32 is discharged to the outside of the chamber 20 through the second suction pipe 70 . The second suction pipe 70 is connected to a suction device (not shown).

As shown in FIG. 3 , the sheet fixing portion 33 is basically formed in a square shape and is provided at a position further away from the center of the stage than the first suction holes 31 (outside the first suction holes 31 ). . The sheet fixing portion 33 is located further away from the center of the stage than the outer edge portion 34 a of the substrate installation area 34 (outside the outer edge portion 34 a ), and is provided inside the edge portion of the stage 30 . The sheet fixing part 33 is provided so as to surround the outer edge part 34a of the substrate installation area 34 and is disposed close to the outer edge part 34a. The shape of the sheet fixing part 33 is not limited to the shape shown in the figure, and can be changed appropriately.

As described later, in the present embodiment, in a state where the substrate 2 is placed on the stage 30, the stage 30 is covered with the elastic sheet 80 (FIG. 8). The sheet fixing portion 33 has a function of fixing the elastic sheet 80 disposed on the stage 30 to the stage 30. As shown in FIG. 5, the sheet fixing portion 33 is composed of, for example, a plurality of third suction holes 33a formed on the stage 30, and the elastic sheet 80 is attached to the stage 30 at the position of the sheet fixing portion 33 by suction through the plurality of third suction holes 33a, and is fixed to the stage 30. In addition, the third suction hole 33a is connected to the third suction pipe 100.

In the example shown in the figure, although a plurality of third suction holes 33a are provided in the sheet fixing portion 33, a single third suction hole 33a may be provided in the sheet fixing portion 33. In this case, the third suction hole 33a may be a substantially annular suction hole extending along (or surrounding) the sheet fixing portion 33.

In addition, the sheet fixing portion 33 may also be formed of a bonding member such as an adhesive (bonding portion) or a fastener, and the elastic sheet 80 may be fixed to the carrier 30 through these bonding members. In addition, a groove surrounding the sheet fixing portion 33 may be formed at the position of the sheet fixing portion 33, and a plurality of third suction holes 33a may be formed inside the groove. By setting such a structure, when the elastic sheet 80 is fixed to the carrier 30 at the position of the sheet fixing portion 33, the airtightness of the sheet inner space 8 described later can be improved, and gas can be prevented from entering the sheet inner space 8 from the outside of the sheet inner space 8.

The distance L between the sheet fixing part 33 and the outer edge part 34a of the substrate installation area 34 where the plurality of first suction holes 31 is arranged (see Figures 3 and 5) is preferably 5 to 25 mm, and 10 to 20 mm. For the better. In addition, the ratio L/T1 (refer to Figure 5) of the distance L and the thickness T1 of the substrate 2 is preferably 5 to 250, and more preferably 15 to 70. When the distance L or the ratio L/T1 is set in the above range, the distance L does not become too long, and the gas inside the sheet inner space 8 (Fig. 5) can be efficiently sucked. In addition, the above-mentioned distance L will not become too short, and the elastic sheet 80 can be prevented from biting into the outer edge 34a of the substrate 2, which can prevent the substrate 2 from being difficult to remove from the substrate 2 or the substrate 2 after the pressure treatment using the elastic sheet 80. Defects such as the elastic sheet 80 peeling off the stage 30 may occur. In addition, the thickness T1 of the substrate 2 (see Figure 4) is preferably 0.1 to 1.0 mm, and more preferably 0.3 to 0.7 mm.

As shown in FIG. 1 , a plurality of through holes 35 are formed in the stage 30 , and a plurality of lifting pins 50 are inserted into the plurality of through holes 35 in an upright state. The plurality of lifting pins 50 pass through the inside of the stage 30 so as to be able to move up and down. In addition, the plurality of lifting pins 50 are also inserted into the plurality of through holes 220a formed in the bottom 220 of the lower member 22, and pass through the inside of the bottom 220 in a manner that can lift and lower. The lifting pin 50 is composed of a rod-shaped member and has a specific length in the Z-axis direction.

The plurality of lift pins 50 supports the substrate 2 and also realizes the task of transferring the substrate 2. The plurality of lift pins 50 supports the substrate 2 at the inner side of the edge of the substrate 2 when the substrate 2 is arranged on the top thereof. The number of the plurality of lift pins 50 is not particularly limited as long as the substrate 2 can be supported in a stable state.

In a state where the transfer space 7 is formed between the upper member 21 and the lower member 22 , the substrate 2 is transferred from the outside of the chamber 20 to the inside of the processing chamber 6 through the transfer space 7 by, for example, a robot arm.

The substrate 2 transported to the processing chamber 6 is arranged on the top of the plurality of lift pins 50 and supported by the plurality of lift pins 50. At this time, the plurality of lift pins 50 protrude above the stage 30, and the top of the plurality of lift pins 50 is located at a position separated from the surface of the stage 30 by a specific distance. The substrate 2 is transported to the top of the plurality of lift pins 50 above the stage 30.

In this state, the plurality of lift pins 50 move downward, and when the tops of the plurality of lift pins 50 reach the top of the stage 30, the substrate 2 is placed on the stage 30, and the transfer of the substrate 2 is completed. In this way, by transferring the substrate 2 in the vertical direction toward the stage 30 through the plurality of lift pins 50, the substrate 2 can be transferred from the transfer position to the stage 30 in a stable state, and damage to the substrate 2 during the transfer can be prevented.

The sheet holding section 40 includes a push shaft 41, a winding roller 42, and a plurality of pulleys 43. The push shaft 41 is arranged on the negative side of the X-axis than the stage 30, and the winding roller 42 is arranged on the positive side of the X-axis than the stage 30. The plurality of pulleys 43 are arranged on the negative side of the X-axis of the stage 30 on which the push shaft 41 is arranged. Any of the push shaft 41, the winding roller 42, and the plurality of pulleys 43 are arranged on the outer side of the chamber 20, and the push shaft 41 and the winding roller 42 are held and tensioned between the stage 30 and the upper member 21 (a part of the transport space 7), so that the elastic sheet 80 is stretched in a state parallel to the XY plane.

The push shaft 41 and the winding roller 42 are each configured to be freely rotatable and simultaneously configured to be freely movable in the Z-axis direction (can be raised and lowered). The push shaft 41 sends the elastic sheet 80 out to the side where the winding roller 42 is arranged at a specific timing. The winding roller 42 winds the elastic sheet 80 sent out by the push shaft 41 at this timing. Therefore, the push shaft 41 and the winding roller 42 can transport the elastic sheet 80 from one side of the stage 30 in the X-axis direction to the other side through the transport space 7 .

The push shaft 41 and the winding roller 42 respectively feed and wind the elastic sheet 80 while holding the elastic sheet 80 in the conveyance space 7 every time the substrate 2 is placed on the stage 30 . In addition, the push shaft 41 and the winding roller 42 arrange the elastic sheet 80 on the stage 30 so that the substrate 2 is covered every time the substrate 2 is placed on the stage 30 .

More specifically, after feeding out and winding the elastic sheet 80 respectively, the push shaft 41 and the winding roller 42 move downward to approach the stage 30 as shown in FIG. 8 while covering the upper surface of the substrate 2 , while disposing the elastic sheet 80 on the stage 30 . The elastic sheet 80 may press the substrate 2 or the plurality of elements 4a, 4b, 4c arranged on the substrate 2 with a specific pressing force in a state where tension is applied by the push shaft 41 and the winding roller 42, or it may No pressing, just contact.

As shown in FIG. 3 , when the elastic sheet 80 is arranged on the stage 30 , the entire substrate 2 is covered with the elastic sheet 80 , and the elastic sheet 80 is fixed to the stage at the position of the sheet fixing part 33 . 30 above. Therefore, as shown in FIG. 5 , the sheet inner space 8 surrounded by the elastic sheet 80 and the stage 30 is formed inside the sheet fixing part 33 .

In more detail, the space 8 inside the sheet is formed between the sheet fixing portion 33 and the edge of the substrate 2 (the portion shown by L in the figure), and above the substrate 2. The space 8 inside the sheet is preferably hermetically sealed to the space outside it, and has high airtightness. Inside the space 8 inside the sheet, the back side of the elastic sheet 80 can also contact the multiple elements 4a, 4b, 4c arranged on the substrate 2.

The height of the space 8 in the sheet gradually increases from the position of the sheet fixing portion 33 toward the edge of the substrate 2. At the edge of the substrate 2, the thickness of the substrate 2 is approximately equal to the sum of the thicknesses of the plurality of elements 4a, 4b, and 4c. The length of the space 8 in the X-axis direction of the sheet is approximately equal to the width of the sheet fixing portion 33 in the X-axis direction, which is substantially square. The space 8 in the sheet extends from one end of the sheet fixing portion 33 in the X-axis direction to the other end. The length of the space 8 in the Y-axis direction of the sheet is approximately equal to the width of the sheet fixing portion 33 in the Y-axis direction. The space 8 in the sheet extends from one end of the sheet fixing portion 33 in the Y-axis direction to the other end.

Inside the sheet inner space 8, a part of the first suction hole 31 is covered by the edge of the substrate 2. On the other hand, since the remaining part of the first suction hole 31 is open, the first suction hole 31 is exposed through the first suction hole 31. The suction hole 31 can suck the gas inside the space 8 inside the sheet. Therefore, the internal pressure of the inner space 8 of the sheet is reduced (becomes a negative pressure), and the elastic sheet 80 is sucked (adsorbed) toward the substrate 2 as if it is attached to the edge of the substrate 2. At the same time, the component 4a arranged on the substrate 2 is moved along with the elastic sheet 80. , 4b, 4c are deformed in shape while contacting the elements 4a, 4b, 4c.

Therefore, after suction through the first suction hole 31, the volume of the space 8 in the sheet becomes smaller than before suction through the first suction hole 31. In the present embodiment, after suction through the first suction hole 31 reduces the volume of the space 8 in the sheet, as described later, by pressurizing the interior of the processing chamber 6 described later, the plurality of elements 4a, 4b, 4c arranged on the substrate 2 can be pressed in with a uniform force by the elastic sheet 80. In addition, it is preferable that the interior of the space 8 in the sheet is vacuumed by suction.

The elastic sheet 80 is formed of a long-shaped sheet (film) that is sufficiently thinner than the thickness of the substrate 2 . The thickness T2 (see Figure 4) of the elastic sheet 80 is preferably 10 to 100 μm, and more preferably 30 to 70 μm.

The elastic sheet 80 is made of a flexible film member, and a resin film such as PET film, fluorine-based film, or PEN is used. From the viewpoint of flexibility and heat resistance, it is preferable to use a fluorine-based film. By using the fluorine-based film, the elastic sheet 80 is bonded to the plurality of components 4a, 4b, and 4c arranged on the substrate 2, and the plurality of components 4a, 4b, and 4c arranged on the substrate 2 can be pressed relatively uniformly.

In addition, from the viewpoint of strength and heat resistance, it is preferable to use a PEN film as the elastic sheet 80. By using a PEN film as the elastic sheet 80, the plurality of elements 4a, 4b, 4c arranged on the substrate 2 can be pressed in with a relatively large force.

Elastic sheet 80 with good mold releasability is preferred. In this embodiment, the sheet holding portion 40 moves downward to contact the surface of the substrate 2. After the elastic sheet 80 is placed on the stage 30, the contact state between the stage 30 or the substrate 2 and the elastic sheet 80 is released. , moves upward. That is, the sheet holding part 40 is configured so that the elastic sheet 80 is detachable (peelable) from the stage 30 or the substrate 2 .

Therefore, in order to make the elastic sheet 80 easily detachable from the substrate 2 or the plurality of elements 4a, 4b, 4c arranged on the substrate 2, it is better to use a fluorine-based film with good mold releasability, or to form a release mold on the elastic sheet 80. layer, it is better to improve the mold releasability.

In the present embodiment, the material of the substrate 2 is a glass substrate coated with epoxy resin. However, the material of the substrate 2 is not limited thereto, and can be, for example, a glass epoxy substrate or silicon dioxide (SiO ₂ ) or alumina (Al ₂ O ₃ ) as a glass substrate, or, as a flexible substrate, can be made of the following: an elastic body such as a polymer of polyimide, polyamide, polypropylene, polyetheretherketone, urethane, silicone, polyethylene terephthalate, polyethylene naphthalate, etc., and can also be made of glass wool, etc.

For example, a conductive bonding material (not shown) is formed in advance on the surface of the substrate 2 . This conductive bonding material electrically and mechanically connects the substrate 2 to the components 4a, 4b, and 4c through anisotropic conductive particle connection or bump welding connection, and is hardened by heating. Examples of the conductive bonding material include ACF, ACP, NCF, and NCP. The thickness of the conductive bonding material is preferably 1.0~10000μm. In addition, a low melting point bonding material containing metal such as tin (Sn) may be used instead of the conductive bonding material for heat and pressure bonding. At this time, the thickness of the low melting point joining material is 0.1 to 10000 μm.

On the substrate 2, a circuit is formed in a specific pattern, and the electrodes of the components 4a, 4b, and 4c can be connected to the circuit through a conductive bonding material.

Elements 4a, 4b, 4c are arranged in an array on substrate 2. An array means that elements 4a, 4b, 4c are arranged in a plurality of rows and columns according to a determined pattern, and the spacing in the row direction and the column direction can be the same or different.

The elements 4a, 4b, and 4c are arranged on a display substrate as each pixel of RGB, or on a lighting substrate as a luminous body of a backlight. Element 4a is a red light element, element 4b is a green light element, and element 4c is a blue light element. However, the elements arranged on the substrate 2 are not limited to these elements.

In this embodiment, the components 4a, 4b, and 4c are micro-luminescent components (micro-LED components), and their dimensions (width × depth) are, for example, 5μm × 5μm to 50μm × 50μm. In addition, the thickness (height) of the components 4a to 4c is, for example, less than 50μm.

As shown in FIG. 6 , the substrate processing apparatus 10 includes a drive unit 11 , a pressure control unit 12 , a pressure reduction control unit 13 , and a temperature control unit 14 . The driving unit 11 performs a process for driving the upper member 21 of the chamber 20 or the sheet holding unit 40 or the plurality of lifting pins 50 so as to be able to move up and down in the vertical direction, for example. When the upper member 21 and the lower member 22 are combined to form a sealed space (pressurized space) inside the processing chamber 6 (see FIG. 9 ), the pressurization control unit 12 performs pressurizing the inside of the processing chamber 6 (setting it to a positive pressure). ) processing. It is preferable that the pressure control unit 12 pressurizes the processing chamber 6 so that the air pressure inside the processing chamber 6 is 10 Pa to 0.5 MPa.

The depressurization control unit 13 performs a suction process through the second suction hole 32 and the second suction pipe 70 when the substrate 2 is placed on the stage 30 (refer to FIG. 7). In addition, the depressurization control unit 13 performs a suction process through the third suction hole 33a and the third suction pipe 100 when the elastic sheet 80 is arranged on the stage 30 (refer to FIG. 5 and FIG. 8). In addition, the depressurization control unit 13 performs a process of depressurizing (setting to negative pressure) the interior of the sheet inner space 8 when the substrate 2 is covered by the elastic sheet 80 to form the sheet inner space 8 (refer to FIG. 8 and FIG. 9).

The temperature control unit 14 controls the heating temperature using the upper heating device 91 and the lower heating device 92 . Although the set temperature of each of the upper heating device 91 and the lower heating device 92 varies depending on the materials of the elastic sheet 80 and the bonding material, for example, it is 100~200°C.

Next, a method of forming the device array 4 on the substrate 2 will be described with reference to Fig. 1 and Fig. 7 to Fig. 9. The following description will focus on the process before and after the elastic sheet 80 is pressed into the plurality of devices 4a, 4b, 4c arranged on the substrate 2.

First, as shown in FIG. 1 , the upper leg portion 211 of the upper member 21 is disposed at a specific distance above the lower leg portion 221 of the lower member 22 , between the upper member 21 and the lower member 22 . Create a handling space7. In addition, the elastic sheet 80 is held by the sheet holding part 40 so that the elastic sheet 80 is arranged inside the conveyance space 7 . In addition, the elastic sheet 80 is fed out and wound by the push shaft 41 and the winding roller 42 in advance, and the unused portion of the elastic sheet 80 is arranged in the conveyance space 7 . The plurality of lift pins 50 are in a state of protruding above the stage 30 and are waiting in advance.

Next, a robot arm (not shown) is used to transport the substrate 2 (see FIG. 3 ) on which the plurality of components 4a, 4b, and 4c is arranged to the transport space 7 and place it on the top of the plurality of lifting pins 50.

Next, as shown in FIG. 7 , the plurality of lift pins 50 holding the substrate 2 are moved downward to place the substrate 2 on the stage 30 provided inside the processing chamber 6. The plurality of lift pins 50 move downward, and when the tops of the respective lift pins 50 reach the top of the stage 30, the substrate 2 is placed on the stage 30, and the transfer of the substrate 2 to the stage 30 is completed.

Next, suction is performed through the second suction hole 32 and the second suction pipe 70 to adsorb and fix the substrate 2 placed on the stage 30. In addition, suction through the second suction hole 32 and the second suction pipe 70 may be started before the substrate 2 is placed on the stage 30.

Next, as shown in FIG. 8 , the sheet holding part 40 waiting above the stage 30 is lowered by a specific distance, and the elastic sheet 80 is arranged on the stage 30 to cover the substrate 2 . The downward movement of the sheet holding unit 40 is performed by lowering the push shaft 41 , the winding roller 42 and the pulley 43 .

Next, as shown in FIG. 5 , the elastic sheet 80 is fixed to the stage 30 at the position of the sheet fixing part 33 . For example, by suction through the third suction hole 33a and the third suction pipe 100, the elastic sheet 80 provided on the stage 30 is suction-fixed to the stage 30, and the elastic sheet 80 provided on the stage 30 is fixed on the stage 30. The inner side forms an inner space 8 of the sheet. In addition, the suction through the third suction hole 33a and the third suction pipe 100 may be started before the elastic sheet 80 is installed on the stage 30.

Next, suction is performed through the plurality of first suction holes 31 and the plurality of first suction tubes 60 to suck the gas inside the sheet inner space 8 . Therefore, the inside of the sheet inner space 8 is decompressed, and the elastic sheet 80 forming the sheet inner space 8 is sucked toward the stage 30 or the substrate 2 . As a result, the volume of the space 8 inside the sheet is reduced, and the elastic sheet 80 is attracted to the edge of the substrate 2 . In addition, the elastic sheet 80 is in bonding contact with the plurality of elements 4a, 4b, and 4c arranged on the substrate 2.

In addition, the suction through the plurality of first suction holes 31 and the plurality of second suction tubes 70 may be started at a time point before the space 8 in the sheet is formed. The timing of suction through the third suction hole 33a and the like may be the same as the timing of suction through the first suction hole 31, or may be different. In this embodiment, after suction is performed through the second suction hole 32 and the like, suction through the third suction hole 33a and the like is started, and then suction through the first suction hole 31 and the like is started.

Next, as shown in FIG. 9 , the upper member 21 moves downward so that the upper leg portion 211 of the upper member 21 contacts the lower leg portion 221 of the lower member 22 with the elastic sheet 80 sandwiched therebetween. Therefore, the processing chamber 6 becomes a sealed space and functions as a pressurized space.

Next, with the elastic sheet 80 covering the substrate 2 (the elastic sheet 80 in contact with the plurality of elements 4a, 4b, and 4c arranged on the substrate 2), the pipelines (not shown) formed in the chamber 20 are passed through. The gas is sent into the inside of the processing chamber 6 to pressurize the inside of the processing chamber 6 . Therefore, the inside of the sheet inner space 8 is depressurized, while the outside of the sheet inner space 8 (the processing chamber 6 ) is pressurized, and the inside and outside of the sheet inner space 8 (Fig. 5) are There is a pressure difference between them.

As a result, the elastic sheet 80 forming the sheet inner space 8 is pressed into the substrate 2 or the plurality of components 4a, 4b, 4c arranged on the substrate 2 with a greater force, and the volume of the sheet inner space 8 is significantly reduced. In addition, the elastic sheet 80 deforms along with the shape of the plurality of components 4a, 4b, 4c arranged on the substrate 2, so that the elastic sheet 80 fits the plurality of components 4a, 4b, 4c with a high degree of adhesion, and the elastic sheet 80 can be pressed into the plurality of components 4a, 4b, 4c with a uniform force.

In addition, in this embodiment, the elastic sheet 80 is not pressed in by physical means (such as a flat plate or an elastic body), but is pressed based on the pressure difference between the inside and outside of the space 8 in the sheet. Therefore, the elastic sheet 80 can be pressed without being affected by unevenness or inclination formed on the surface of a flat plate, an elastomer, etc., and the plurality of elements 4a, 4b, 4c can be pressed in with a uniform and moderate force by the elastic sheet 80.

While the inside of the pressurized processing chamber 6 is being heated, the upper heating device 91 heats the inside of the processing chamber 6 and at the same time, the lower heating device 92 heats the stage 30 . Therefore, the upper surface side and the lower surface side of the substrate 2 provided on the stage 30 can be heated in a good balance, and the plurality of elements 4a, 4b, and 4c arranged on the substrate 2 can be well bonded to the substrate 2 through the conductive bonding material. In addition, by receiving heat from the upper heating device 91 and the lower heating device 92, the elastic sheet 80 becomes easy to deform in accordance with the shapes of the plurality of elements 4a, 4b, and 4c arranged on the substrate 2, and the elastic sheet 80 and the elastic sheet 80 can be improved. The fit of multiple components 4a, 4b, 4c.

When heating by the upper heating device 91 and the lower heating device 92, suction is also performed through the plurality of first suction holes 31. Therefore, along with the deformation of the elastic sheet 80 due to heating, it is possible to prevent the formation of a gap between the elastic sheet 80 and the substrate 2, and the adhesion between the elastic sheet 80 and the plurality of components 4a, 4b, 4c arranged on the substrate 2 can be improved. In addition, when heating by the upper heating device 91 and the lower heating device 92, although the bonding material (conductive bonding material) bonding the plurality of components 4a, 4b, 4c to the substrate 2 is decomposed and decomposition gas is generated, by maintaining the above-mentioned suction state, the gas can be decomposed and removed by suction through the plurality of first suction holes 31.

In addition, the heating by the upper heating device 91 and the lower heating device 92 can be performed simultaneously with the start of pressurization inside the processing chamber 6, or earlier than it.

As shown in FIG. 9 , after the substrate 2 is pressed in by the elastic sheet 80 for a specific time, the substrate 2 is taken out from the processing chamber 6. That is, as shown in FIG. 8 , the upper component 21 is moved upward only a specific distance to open the processing chamber 6. Next, as shown in FIG. 7 , the sheet holding portion 40 is raised only a specific distance and waits above the stage 30. Therefore, the elastic sheet 80 arranged on the stage 30 to cover the substrate 2 is detached (peeled off) from the stage 30. In addition, at this point in time, the elastic sheet 80 can also be sent out and wound by the push shaft 41 and the winding roller 42, and the unused portion of the elastic sheet 80 can be arranged in the transport space 7.

Next, as shown in FIG. 1, the plurality of lift pins 50 are moved upward. When the plurality of lift pins 50 move upward and the tops of the respective lift pins reach the top of the stage 30, the substrate 2 is placed on the tops of the plurality of lift pins 50 and supported by the plurality of lift pins 50. In this state, the plurality of lift pins 50 are raised to a position protruding only a certain distance above the stage 30 and are kept on standby. Afterwards, by using a robot arm (not shown) to take out the substrate 2 from the transport space 7, a component array 4 in which the plurality of components 4a, 4b, 4c are fixed to the substrate 2 with a uniform force can be obtained.

As described above, in the substrate processing device 10 according to the present embodiment, the pressurization control unit 12 shown in FIG. 6 pressurizes the processing chamber 6 shown in FIG. 9 , and as shown in FIG. 9 , the sheet holding unit 40 transports the elastic sheet 80 from one side of the carrier 30 to the other side via the push shaft 41 and the winding roller 42 arranged on both sides of the carrier 30, and arranges the elastic sheet 80 on the carrier 30 to cover the substrate 2. When the elastic sheet 80 is arranged on the stage 30 to cover the substrate 2, the processing chamber 6 is pressurized by the pressurization control unit 12, and the elastic sheet 80 can be pressed toward the substrate 2 based on the pressure. The elastic sheet 80 contacts the substrate 2 or the multiple components 4a, 4b, 4c arranged on the substrate 2, and the multiple components 4a, 4b, 4c arranged on the substrate 2 can be pressed in by the elastic sheet 80.

In addition, when the processing chamber 6 is pressurized, the elastic sheet 80 may deform along with the shapes of the plurality of components 4a, 4b, and 4c arranged on the substrate 2. Therefore, the elastic sheet 80 can be attached to the plurality of components 4a, 4b, and 4c. The plurality of components 4a, 4b, and 4c are pressed into the elastic sheet 80 with a uniform force. In addition, since the elastic sheet 80 is conveyed from one side of the stage 30 to the other side by the push shaft 41 and the winding roller 42, a small and simple structure can be used between the stage 30 and the upper member 21. An elastic sheet 80 is provided. As described above, according to the substrate processing apparatus 10 of this embodiment, the stability of the bonding between the plurality of elements 4a, 4b, and 4c and the substrate 2 can be sufficiently ensured.

In addition, in this embodiment, each time the substrate 2 is placed on the stage 30, the push shaft 41 and the winding roller 42 carry out feeding and winding of the elastic sheet 80, respectively. Therefore, every time the substrate 2 is placed on the stage 30, an unused portion of the elastic sheet 80 is provided between the stage 30 and the upper member 21. With the elastic sheet 80 in an appropriate state, the elastic sheet 80 can be placed in a stable state. The plurality of components 4a, 4b, and 4c arranged on the substrate 2 are press-fitted.

In addition, in this embodiment, the sheet holding part 40 is relatively close to the stage 30 , and the elastic sheet 80 is arranged on the stage 30 . Therefore, the process of arranging the elastic sheet 80 on the stage 30 can be efficiently performed, and an increase in the speed of the operation line can be expected.

In addition, this embodiment includes a decompression control unit 13 (Fig. 6) that depressurizes the inner space 8 of the sheet surrounded by the elastic sheet 80 and the stage 30. When the elastic sheet 80 is arranged on the stage 30 to cover the substrate 2 , by decompressing the inner space 8 of the sheet, the elastic sheet 80 is sucked toward the substrate 2 , so that the elastic sheet 80 can be attached to the substrate 2 or A plurality of elements 4a, 4b, and 4c are arranged on the substrate 2. In this state, the elastic sheet 80 is pressed against the substrate 2 based on the pressure of the pressurized processing chamber 6, and the plurality of components 4a, 4b, and 4c arranged on the substrate 2 can be pressed with a uniform force by the elastic sheet 80. Press in.

In addition, in this embodiment, as shown in FIG. 3 , an elastic sheet 80 is provided at a position further away from the center of the stage 30 than the substrate installation area 34 (outside the substrate installation area 34 ). The sheet fixing portion 33 of the stage 30 . At the position of the sheet fixing part 33, with the elastic sheet 80 fixed to the stage 30, the elastic sheet 80 can be pressed against the substrate 2 in a stable state by the pressurized processing chamber 6. The elastic sheet 80 presses the plurality of elements 4a, 4b, and 4c arranged on the substrate 2 with a more uniform force.

In addition, in the present embodiment, the pressurization control unit 12 shown in FIG. 6 pressurizes the processing chamber 6 so that the air pressure inside the processing chamber 6 shown in FIG. 1 is substantially twice the air pressure outside the processing chamber 6. Therefore, when the processing chamber 6 is pressurized, the elastic sheet 80 is pressed toward the substrate 2 with an appropriate pressing force, and the plurality of components 4a, 4b, 4c can be pressed into the substrate 2 with an appropriate force by the elastic sheet 80. Therefore, the plurality of components 4a, 4b, 4c can be prevented from falling off the substrate 2, and the bonding stability of the plurality of components 4a, 4b, 4c and the substrate 2 can be fully ensured.

In addition, the substrate processing method of this embodiment includes the steps of arranging the elastic sheet 80 on the stage 30 to cover the substrate 2; and decompressing the space inside the sheet surrounded by the elastic sheet 80 and the stage 30. Step 8; and step 6 of the pressurized processing chamber. When the elastic sheet 80 is placed on the stage 30 to cover the substrate 2 , the elastic sheet 80 is sucked toward the substrate 2 by decompressing the inner space 8 of the sheet, so that the elastic sheet 80 can contact the substrate 2 or A plurality of elements 4a, 4b, and 4c are arranged on the substrate 2. In this state, the elastic sheet 80 is pressed against the substrate 2 by the pressurized processing chamber 6 based on the pressure, and the plurality of components 4a, 4b, and 4c arranged on the substrate 2 can be pressed into the elastic sheet 80.

In addition, in this embodiment, the processing chamber 6 is pressurized in a state where the elastic sheet 80 is in contact with the plurality of elements 4a, 4b, and 4c arranged on the substrate 2. Therefore, as described above, when the elastic sheet 80 is pressed against the substrate 2 based on the air pressure of the processing chamber 6 , the plurality of components 4 a , 4 b , and 4 c arranged on the substrate 2 can be efficiently pressed in by the elastic sheet 80 .

In addition, the present invention is not limited to the above-mentioned implementation forms, and various changes can be made within the scope of the present invention.

In the above embodiment, the upper leg portion 211 or the lower leg portion 221 shown in FIG. 1 is located further away from the center of the stage 30 than the plurality of first suction holes 31 (for example, the edge of the stage 30 ). In contact with the stage 30, a pressurized space can also be formed. With such a configuration, the space surrounded by the stage 30 , the top plate 210 , and the upper leg 211 or the lower leg 221 can be used as a pressurized space. Since the volume of the pressurized space is smaller than the volume of the processing chamber 6 composed of the first space 212 and the second space 222, the air pressure of the pressurized space can be effectively increased. The pressure difference in the space 8 causes the elastic sheet 80 to press the plurality of components 4a, 4b, and 4c arranged on the substrate 2 with a moderate force.

In the above embodiment, as shown in FIG. 3 , the sheet fixing part 33 is provided on the stage 30 , but may also be provided on the chamber 20 . For example, the sheet fixing part 33 may be formed on the lower leg part 221 of the lower member 22 as shown in FIG. 1 . At this time, as an aspect of the sheet fixing part 33, in addition to the aspect described in the above embodiment, the following aspects are exemplified. For example, a concave portion is formed on the upper surface of the lower leg portion 221, and a protrusion or a clip is provided on the lower surface of the upper leg portion 211 at a position corresponding to the concave portion. In such a configuration, when the upper member 21 is lowered and comes into contact with the lower leg portion 221, the convex portion or the clip fitting recessed portion provided in the upper leg portion 211 is used. Therefore, since the elastic sheet 80 located between the upper leg 211 and the lower leg 221 is pressed into the recess formed in the lower leg 221 with the protrusion or clip formed on the upper leg 211, it is possible to The elastic sheet 80 is fixed between the upper leg 211 and the lower leg 221 .

In the above-described embodiment, as shown in FIG. 8 , the push shaft 41 and the winding roller 42 relatively approach the stage 30 , and the sheet holding part 40 arranges the elastic sheet 80 on the stage 30 to cover it. The method of covering the substrate 2 with the elastic sheet 80 is not limited to this. For example, the substrate processing apparatus 10 may include a laminating machine that covers the substrate 2 with the elastic sheet 80 .

In the above-mentioned embodiment, as shown in FIG. 3 , although the shape of the substrate 2 is basically a square, it may also be a circle or other polygons.

In the above embodiment, after the elastic sheet 80 is lowered to the position of the stage 30 as shown in FIG. 8, the upper member 21 is lowered to the position of the lower member 22 as shown in FIG. 9. However, the upper member 21 After lowering to the position of the lower member 22 and forming a sealed space (processing chamber 6 ) in the chamber 20 , the elastic sheet 80 may also be lowered to the position of the stage 30 .

In the above embodiment, although the substrate processing apparatus 10 includes two heating devices, the upper heating device 91 and the lower heating device 92, it may include only one of them. In addition, although the temperatures heated by the upper heating device 91 and the lower heating device 92 are preferably equal, they may also be different.

In the above embodiment, although the sheet holding part 40 is close to the stage 30 and the elastic sheet 80 is disposed on the stage 30 to cover the substrate 2 , the sheet holding part 40 may also be provided with a stage where the substrate 2 is placed. 30 is close to the sheet holding part 40 (or elastic sheet 80 ), and the sheet holding part 40 arranges the elastic sheet 80 on the stage 30 to cover the substrate 2 . Alternatively, when the plurality of lift pins 50 support the substrate 2 , the sheet holding part 40 may be brought close to the sheet holding part 40 (or the elastic sheet 80 ) to cover the substrate 2 with the elastic sheet 80 .

In the above embodiment, the plurality of first suction holes 31 and the sheet fixing portion 33 (third suction hole 33a) are arranged with a specific distance apart, but they may be arranged adjacent to each other.

2:Substrate

4: Component Array

6: Processing room

7:Transportation space

8: Space inside the sheet

4a, 4b, 4c: components

10: Substrate processing device

11:Drive Department

12: Pressurization control part

13:Decompression control department

14: Temperature control unit

20: Chamber

21: Upper member

22: Lower component

30: Carrier stage

31: 1st suction hole

32: Second suction hole

33: Sheet fixing part

33a: 3rd suction hole

34: Substrate installation area

34a: Outer edge part

34a1~34a4: Side 1~Side 4

35:Through hole

41: Push shaft

42: Roller

43:Pulley

40: Sheet holding part

50: Lift pin

60: 1st suction tube

70: Second suction tube

80: Elastic sheet

91: Upper heating device

92: Lower heating device

100: 3rd suction tube

210: Top plate

211: Upper foot

220: Bottom

220a:Through hole

221: Lower foot

212: Space 1

222: Second Space

T1, T2: thickness

L: Distance

[FIG. 1] FIG. 1 is a schematic cross-sectional view of a substrate processing device according to an embodiment of the present invention. [FIG. 2] FIG. 2 is a schematic plan view showing a state in which a substrate is set on a stage of the substrate processing device shown in FIG. 1. [FIG. 3] FIG. 3 is a schematic plan view showing a state in which a stage on which the substrate shown in FIG. 2 is set is covered with an elastic sheet. [FIG. 4] FIG. 4 is a schematic cross-sectional view showing a portion of the substrate shown in FIG. 3 and the elastic sheet at the same time. [FIG. 5] FIG. 5 is a schematic cross-sectional view showing a substrate shown in FIG. 3 and the elastic sheet set on the stage at the same time. [FIG. 6] FIG. 6 is a diagram showing the functional configuration of the substrate processing device shown in FIG. 1. [Figure 7] Figure 7 is a schematic cross-sectional view showing a step of pressing a plurality of components arranged on a substrate with an elastic sheet. [Figure 8] Figure 8 is a schematic cross-sectional view showing a step subsequent to Figure 7. [Figure 9] Figure 9 is a schematic cross-sectional view showing a step subsequent to Figure 8.

2: Substrate

6: Processing room

7: Transportation space

10:Substrate processing device

20: Chamber

21: Upper components

22: Lower components

30: Carrier stage

31: 1st suction hole

32: Second suction hole

35:Through hole

41: Push shaft

42: Roller

43: Pulley

40: Sheet fixing part

50: Lift pin

60: 1st suction pipe

70: Second suction tube

80: Elastic sheet

91: Upper heating device

92: Lower heating device

210:Roof part

211: Upper foot

212: 1st space

220: bottom

220a: Through hole

221: Lower foot

222:Second space

Claims (12)

A substrate processing device includes: a stage, on which a substrate having a plurality of components arranged thereon is placed; an upper member, which covers the upper portion of the stage and forms a pressurized space as a closed space between the stage and the upper member; a sheet holding portion, which holds an elastic sheet between the stage and the upper member; and a pressurization control portion, which pressurizes the pressurized space; wherein the sheet holding portion transports the elastic sheet from one side of the stage to the other side by means of a push shaft and a winding roller arranged on both sides of the stage, and arranges the elastic sheet on the stage so that the substrate is covered, wherein the pressurized space is pressurized by the pressurization control portion in a state where the elastic sheet is arranged on the stage to cover the substrate. The substrate processing apparatus of claim 1, wherein each time the substrate is placed on the stage, the push shaft and the winding roller carry out feeding and winding of the elastic sheet respectively. The substrate processing device of claim 1 or 2 further comprises: a plurality of lifting pins that can be lifted and lowered through the interior of the aforementioned carrier; wherein the aforementioned substrate is transported to the aforementioned carrier through the plurality of the aforementioned lifting pins. The substrate processing apparatus of claim 1 or 2, wherein the sheet holding portion is relatively close to the stage, and the elastic sheet is arranged on the stage. The substrate processing device of claim 1 or 2 further includes: a decompression control unit that depressurizes the space inside the sheet surrounded by the elastic sheet and the stage. A substrate processing device as claimed in claim 1 or 2, wherein a sheet fixing portion for fixing the elastic sheet to the carrier is provided at a position farther from the center of the carrier than the substrate setting area. A substrate processing device as claimed in claim 1 or 2, wherein the pressurization control unit pressurizes the pressurized space so that the air pressure inside the pressurized space is substantially twice the air pressure outside the pressurized space. A substrate processing method includes: placing a substrate with a plurality of components on a stage disposed inside a pressurized space that is a closed space; placing the elastic sheet on the stage to cover the substrate; depressurizing the space inside the sheet surrounded by the elastic sheet and the stage; and pressurizing the pressurized space, wherein the pressurized space is pressurized while the elastic sheet is placed on the stage to cover the substrate. According to the substrate processing method of claim 8, the pressurized space is pressurized in a state where the elastic sheet is in contact with the plurality of elements arranged on the substrate. The substrate processing method according to claim 8 or 9, wherein during the pressurization of the pressurized space, the substrate placed on the stage is heated by heating the pressurized space. A substrate processing method as claimed in claim 8 or 9, wherein during the period of pressurizing the pressurized space, the substrate placed on the carrier is heated by heating the carrier. A substrate processing method as claimed in claim 8 or 9, wherein the space in the sheet is depressurized while the pressurized space is pressurized.