TWI823461B - Package structure and manufacturing method thereof, and display assembly - Google Patents

Abstract

The present application provides a method for manufacturing a package structure, including the following steps: providing a circuit substrate, the circuit substrate includes a first base layer and inner circuit layers disposed on opposite sides of the first base layer, and the inner circuit layer includes thin lines. Mounting electronic components on thin lines; pressing and bonding an adhesive structure on the inner circuit layer, and the adhesive structure includes a second base layer, a first adhesive layer and a second adhesive layer, the first adhesive layer and the second adhesive layer are respectively disposed on opposite sides of the second base layer, the first adhesive layer is arranged towards the inner circuit layer. A plurality of outer conductors are arranged through the adhesive structure, and the outer conductor is connected to the inner circuit layer. The circuit carrier board is pressed on the second adhesive layer, the circuit carrier board includes a carrier board and an external circuit layer arranged on the carrier board, the external circuit layer includes a plurality of conductive connection pads which are embedded in the first adhesive layer, and the conductive connection pad is electrically connected to the inner circuit layer through the outer conductor. The carrier board is removed to obtain the package structure. The present application also provides a packaging structure and a display assembly.

Description

Packaging structure and manufacturing method, display component

The present application relates to a packaging structure, a manufacturing method thereof, and a display component.

Micro-LED displays are regarded as the mainstream technology for next-generation displays due to their performance advantages such as high contrast and energy saving. Currently, flexible displays can be produced through the vertical packaging process of flexible circuit boards and screen modules. The packaging process mainly includes steps: first, the driver chip is placed on the thin line on one side of the flexible packaging structure through crimping; then, the display screen is placed on the input on the other side of the flexible packaging structure through crimping output terminal.

In general, in order to avoid unevenness or ripples produced after the display screen is connected to the flexible packaging structure, which may affect the display, the surface of the flexible packaging structure that needs to be pressed against the display screen should have good flatness (<2.0 μm). The existing technology cannot realize the pressure bonding of a double-sided display screen while ensuring flatness, and the flexible display screen cannot realize double-sided display and touch control.

In view of this, the present application provides a method for manufacturing a packaging structure that can solve the above problems.

In addition, it is necessary to provide a packaging structure.

In addition, it is necessary to provide a display component.

The present application provides a method for manufacturing a packaging structure, which includes the following steps: providing a circuit substrate, which includes a first base material layer and two inner circuit layers disposed on opposite sides of the first base material layer, each The inner circuit layer includes thin circuits; electronic components are provided on the thin circuits; an adhesive structure is provided on the inner circuit layer, and the adhesive structure includes a second base material layer, a first adhesive layer and a third adhesive layer. Two adhesive layers, the first adhesive layer and the second adhesive layer are respectively disposed on opposite sides of the second base material layer, and the first adhesive layer is disposed toward the inner circuit layer; A plurality of outer conductive bodies are provided through the adhesive structure, and the outer conductive bodies are connected to the inner circuit layer; a circuit carrier board is provided on the second adhesive layer, and the circuit carrier board includes a carrier board and a device On the external circuit layer on one side of the carrier board, the external circuit layer includes a plurality of conductive connection pads, the conductive connection pads are embedded in the second adhesive layer, and the conductive connection pads are conductive through the outside The body is electrically connected to the inner circuit layer; the carrier board is removed to obtain the packaging structure.

In some embodiments, a surface of the conductive connection pad facing away from the second adhesive layer is substantially flush with a surface of the second adhesive layer facing away from the second base material layer.

In some embodiments, the outer conductive body is made of solder paste with magnetic particles added thereto.

In some embodiments, before the step of "arranging electronic components on the thin lines", the step further includes: placing a conductive paste on the thin lines. The conductive paste is made of solder paste with magnetic particles added.

In some embodiments, the step of "pressing and bonding the adhesive structure on the inner circuit layer" includes: opening an opening through the first adhesive layer, the opening corresponding to the electronic component; A plurality of through holes are opened in the bonding structure, and part of the inner circuit layer is exposed from the bottom of the through holes. Conductive paste is filled in the through holes to form the outer conductive body, and the outer conductive body is The body is connected to the inner circuit layer and the conductive connection pad.

In some embodiments, the manufacturing method of the circuit substrate includes the following steps: providing a double-sided copper clad laminate, the double-sided copper clad laminate including a first base material layer and a first base material layer disposed on opposite sides of the first base material layer. two first copper foil layers; disposing a first dry film on each first copper foil layer; exposing and developing the first dry film, and then etching the first copper foil layer to form the Inner circuit layer, the inner circuit layer includes a plurality of thin circuits, a plurality of first circuits and a plurality of second circuits, remove the first dry film; on the first base material layer and one of the inner circuit layers A through opening is opened, and copper is filled in the opening to form an inner conductive body. The inner conductive body is electrically connected to the second lines on opposite sides of the first base material layer, that is, the above-mentioned Circuit substrate.

In some embodiments, the manufacturing method of the circuit carrier board includes: providing a single-sided copper clad board, the single-sided copper clad board includes a carrier board and a second copper foil layer disposed on a surface of the carrier board; A second dry film is disposed on the second copper foil layer; the second dry film is exposed and developed, and the second copper foil layer is etched to form the outer circuit layer. The outer circuit layer includes a plurality of The conductive connection pad is removed, and the second dry film is removed to obtain the circuit carrier board.

The application also provides a packaging structure, including: a circuit substrate. The circuit substrate includes a first base material layer and two inner circuit layers. The two inner circuit layers are respectively provided on opposite sides of the first base material layer. , each inner circuit layer includes a plurality of thin circuits, a plurality of first circuits and a plurality of second circuits; electronic components, the electronic components are provided on the thin circuits; Adhesive structure, the adhesive structure includes a second base material layer, a first adhesive layer and a second adhesive layer, the first adhesive layer and the second adhesive layer are respectively arranged on the second base material On opposite sides of the material layer, the first adhesive layer is connected to the inner circuit layer, and a through opening is provided on the first adhesive layer, and the opening is provided corresponding to the electronic component; through the The bonding structure is provided with a plurality of outer conductive bodies, the conductive bodies are connected to the first line and the second line; an outer line layer, the outer line layer includes a plurality of conductive connection pads, the conductive connection pads The surface of the second adhesive layer facing away from the second base material layer is substantially flush with the surface of the second adhesive layer facing away from the second base material layer. The conductive connection pad is electrically connected to the inner side through the outer conductive body. line layer.

In some embodiments, the packaging structure further includes a conductive paste, the conductive paste is disposed between the thin circuit and the electronic component, and the conductive paste and the outer conductive body are both made of Solder paste with added magnetic particles.

This application also provides a display component, including a display screen module and the packaging structure. The display screen module is disposed on the outer circuit layer, and the display screen module is electrically connected to the conductive connection pad; The electronic component is a driver chip.

Compared with the existing technology, the manufacturing method of the packaging structure provided by this application can make the conductive connection by pressing the adhesive structure on both sides and embedding the outer circuit layer in the second adhesive layer. The pads have better flatness, and the height difference of multiple conductive connection pads can be controlled within 1 micron, which makes the subsequent connection with the display module extremely flat and helps prevent water ripples from being generated during docking. Improve product quality. By directly mounting the electronic components on the thin lines of the circuit substrate, embedding the electronic components on both sides, and arranging the conductive connection pads on both sides, double-sided display and touch control of the subsequent display screen can be achieved.

In addition, by partially embedding the electronic components, the packaging structure will not lose its degree of freedom, and the wiring area of the packaging structure will not be occupied. By arranging the conductive paste and the outer conductive body, and setting the materials of the conductive paste and the outer conductive body to solder paste with added magnetic particles, it is beneficial to improve the overall dimensional stability of the packaging structure. , improve product yield. and, The fine spacing between the plurality of thin lines and the conductive connection pads can be achieved through simple etching, which is beneficial to improving integration and miniaturization.

100:Package structure

10: Circuit substrate

10a: Double-sided copper clad laminate

101: First copper foil layer

102: First dry film

103:Opening

11: First base material layer

12:Inside circuit layer

121: thin line

122:First line

123:Second line

13:Inner conductor

20: Conductive paste

21:Electronic components

30: Bonding structure

31: Second base material layer

32: First adhesive layer

33: Second adhesive layer

34:Open your mouth

35:Through hole

36:Outer conductor

40:First intermediate

50: Line carrier board

50a:Single side copper clad laminate

502: Second copper foil layer

503: Second dry film

51: Carrier board

52:Outside line layer

53: Conductive connection pad

60:Second intermediate

200:Display component

70: Conductive adhesive layer

80:Display module

FIG. 1 is a schematic cross-sectional view of a circuit substrate provided by an embodiment of the present application.

Figures 2a to 2c are schematic diagrams of the manufacturing process of the circuit substrate shown in Figure 1.

FIG. 3 is a schematic diagram of the manufacturing process of arranging electronic components on the circuit substrate shown in FIG. 1 and pressing and bonding the structure to form a first intermediate body.

Figure 4 is a schematic cross-sectional view of the first intermediate obtained by the manufacturing process shown in Figure 3.

FIG. 5 is a schematic diagram of the manufacturing process of laminating circuit carrier boards on both sides of the first intermediate body shown in FIG. 4 to form a second intermediate body.

Figure 6 is a schematic cross-sectional view of the second intermediate obtained by the manufacturing process shown in Figure 5.

Figures 7a to 7c are schematic diagrams of the manufacturing process of the circuit carrier board shown in Figure 6.

FIG. 8 is a schematic cross-sectional view of the package structure obtained after removing the carrier board shown in FIG. 6 .

FIG. 9 is a top view of the packaging structure shown in FIG. 8 .

FIG. 10 is a schematic diagram of the manufacturing process of laminating the conductive adhesive layer and the display screen module on the packaging structure shown in FIG. 8 to form a display component.

FIG. 11 is a schematic cross-sectional view of the display component obtained through the manufacturing process shown in FIG. 10 .

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application. Not all examples. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing specific embodiments only and is not intended to limit the application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features in the embodiments may be combined with each other without conflict.

Referring to Figures 1 to 6, one embodiment of the present application provides a method for manufacturing a packaging structure 100 (see Figure 8), which includes the steps:

Step S11: Referring to Figure 1, a circuit substrate 10 is provided. The circuit substrate 10 includes a first base material layer 11 and two inner circuit layers 12. The two inner circuit layers 12 are respectively disposed on the first base material. Opposite sides of layer 11.

Specifically, each inner circuit layer 12 includes a plurality of thin circuits 121 , a plurality of first circuits 122 and a plurality of second circuits 123 . A plurality of inner conductive bodies 13 are provided through the first base material layer 11 , and the inner conductive bodies 13 are electrically connected to the second lines 123 on opposite sides of the first base material layer 11 .

The material of the first base material layer 11 can be polyimide (PI), polyester resin (Polyethylene terephthalate, PET), poly(ethylene 2,6-naphthalenedi). -carboxylate), PEN), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, MPI) at least one. In this embodiment, the first base material layer 11 is made of polyimide.

Among them, the two inner circuit layers 12 can be produced on the first base material layer 11 by pressing a photosensitive film, exposure and development, and etching, which specifically includes the following steps:

Step S111: Referring to Figure 2a, a double-sided copper clad laminate 10a is provided. The double-sided copper clad laminate 10a includes a first base material layer 11 and two first copper plates disposed on opposite sides of the first base material layer 11. Foil layer 101.

Step S112: Referring to FIG. 2b, a first dry film 102 is pressed on each of the first copper foil layers 101.

Step S113: Referring to FIG. 2c, the first dry film 102 is exposed and developed, and then the first copper foil layer 101 is etched to form the inner circuit layer 12. The inner circuit layer 12 includes a plurality of fine circuits. 121. A plurality of first lines 122 and a plurality of second lines 123. Remove the first dry film 102 to obtain the circuit substrate 10.

Among them, after step S113, it also includes: opening a through opening 103 on the first base material layer 11 and one of the inner circuit layers 12, filling the opening 103 with copper to form the inner conductive body 13, The inner conductive body 13 is electrically connected to the second lines 123 on opposite sides of the first base material layer 11 .

In this embodiment, through a simple etching process, fine pitch between the thin lines 121 can be achieved, which is beneficial to the high integration of subsequent mounted devices.

Step S12: Referring to Figures 3 and 4, electronic components 21 are mounted on the thin circuits 121, and then an adhesive structure 30 is pressed on the inner circuit layer 12 to obtain a first intermediate body 40.

Specifically, the step S12 includes the following steps:

Step S121: Set a conductive paste 20 on the thin line 121, and mount the electronic component 21 on the conductive paste 20.

In this embodiment, the conductive paste 20 is made of solder paste with magnetic particles added, which is advantageous for mounting special electronic components, such as special electronic components that cannot withstand high temperatures. The electronic component 21 may be a driving chip, a capacitor, an inductor, etc.

Step S122: Press an adhesive structure 30 on each inner circuit layer 12.

Wherein, the adhesive structure 30 includes a second base material layer 31, a first adhesive layer 32 and a second adhesive layer 33. The first adhesive layer 32 and the second adhesive layer 33 are respectively provided on Opposite sides of the second base material layer 31 . The first adhesive layer 32 is disposed toward the inner circuit layer 12 . The first adhesive layer 32 has a through opening 34 , and the opening 34 is provided corresponding to the electronic component 21 .

A plurality of through holes 35 are drilled through the bonding structure 30, and some of the first lines 122 and the second line 123 are exposed from the bottom of the through hole 35 .

In this embodiment, the opening 34 and the through hole 35 may be formed by laser cutting or mechanical drilling.

Step S123: Fill the through holes 35 with conductive paste to form a plurality of outer conductive bodies 36. The outer conductive bodies 36 are connected to the first line 122 and the second line 123 to obtain the first Intermediate 40.

The material of the conductive paste may be solder paste, copper paste, etc. with magnetic particles added. In this embodiment, the conductive paste is made of solder paste with added magnetic particles, which is beneficial to improving the dimensional stability of the flexible circuit board.

Step S13: Referring to Figures 5 and 6, a circuit carrier board 50 is pressed on both sides of the first intermediate body 40 to obtain a second intermediate body 60.

The circuit carrier board 50 includes a carrier board 51 and an outer circuit layer 52 disposed on a surface of the carrier board 51. The outer circuit layer 52 includes a plurality of conductive connection pads 53, and a plurality of conductive connection pads 53. The connection pad 53 is disposed toward the first intermediate body 40 , and the conductive connection pad 53 is flush toward one side of the first intermediate body 40 .

After pressing, the conductive connection pad 53 is embedded in the second adhesive layer 33 , and the conductive connection pad 53 connects the surface of the carrier 51 and the second adhesive layer 33 away from the third adhesive layer 33 . The surfaces of the two base material layers 31 are substantially flush, and the conductive connection pad 53 is connected to the outer conductive body 36 , that is, the conductive connection pad 53 is electrically connected to the inner circuit layer 12 through the outer conductive body 36 .

Wherein, the carrier board 51 supports or loads the outer circuit layer 52 so that the outer circuit layer 52 has better flatness, thereby allowing the plurality of conductive connection pads 53 to have better flatness. After regular surface treatment, the conductive connection pad 53 embedded in the second adhesive layer 33 can still maintain a good flatness. Specifically, the height difference (not labeled) of the plurality of conductive connection pads 53 on one side facing the carrier board 51 is within 1 micron.

In this embodiment, the outer circuit layer 52 can be produced on the carrier 51 by pressing a photosensitive film, exposure and development, and etching, which specifically includes the following steps:

Step S131: Refer to FIG. 7a to provide a single-sided copper-clad plate 50a. The single-sided copper-clad plate 50a includes a carrier board 51 and a second copper foil layer 502 disposed on a surface of the carrier board 51.

Step S132: Referring to FIG. 7b, a second dry film 503 is pressed on the second copper foil layer 502.

Step S133: Referring to Figure 7c, the second dry film 503 is exposed and developed, and the second copper foil layer 502 is etched to form the outer circuit layer 52. The outer circuit layer 52 includes a plurality of conductive connection pads. 53. Remove the second dry film 503 to obtain the circuit carrier board 50.

In this embodiment, a fine pitch between the conductive connection pads 53 can be achieved through a simple etching process.

In this embodiment, the second base material layer 31 and the carrier plate 51 are both flexible, and their materials include polyimide (PI), polyester resin (Polyethylene terephthalate, PET), polynaphthalene At least one of poly(ethylene 2,6-naphthalenedi-carboxylate) (PEN), liquid crystal polymer (LCP) and modified polyimide (MPI) One kind.

In this embodiment, the second base material layer 31 and the carrier plate 51 are both made of polyimide, and the first adhesive layer 32 and the second adhesive layer 33 are made of pure glue.

Step S14: Referring to FIG. 8 , remove the carrier board 51 to obtain the package structure 100 .

Specifically, the carrier board 51 can be removed by etching to obtain the packaging structure 100 with conductive connection pads 53 on both sides.

In this application, by directly mounting the electronic component 21 on the thin circuit 121 of the circuit substrate 10, the double-sided embedded electronic component 21 can be realized. Then, the adhesive structure 30 is pressed on both sides, and the outer circuit layer 52 is embedded in the second adhesive layer 33, so that the conductive connection pad 53 has better flatness, and multiple The height difference of the conductive connection pad 53 can be controlled within 1 micron, which enables ultra-high flatness when connected to the display module, which is beneficial to preventing water ripples during docking, thereby improving product quality. Through the double-sided embedded electronic components 21 and the conductive connection pads 53, double-sided display and touch control of the subsequent display screen can be realized.

In addition, by partially embedding the electronic component 21 , the package structure 100 will not lose its degree of freedom, and the wiring area of the package structure 100 will not be occupied.

In addition, by arranging the conductive paste 20 and the outer conductive body 36, and setting the materials of the conductive paste 20 and the outer conductive body 36 to solder paste with added magnetic particles, it is beneficial to improve the packaging The overall dimensional stability of the structure 100 improves product yield.

In addition, the fine spacing between the plurality of fine lines 121 and the conductive connection pads 53 can be achieved through simple etching, which is beneficial to improving integration and miniaturization.

Referring to Figures 8 and 9, the present application also provides a packaging structure 100 prepared using the above manufacturing method. The packaging structure 100 includes a circuit substrate 10, two electronic components 21, two bonding structures 30 and two outer circuit layers 52 . The two electronic components 21 are mounted on both sides of the circuit substrate 10 respectively, the two adhesive structures 30 are respectively pressed on the opposite sides of the circuit substrate 10, and each of the outer circuit layers 52 is embedded in one of the bonding structures 30 .

The circuit substrate 10 includes a first base material layer 11 and two inner circuit layers 12 . The two inner circuit layers 12 are respectively disposed on opposite sides of the first base material layer 11 . Each inner circuit layer 12 includes a plurality of thin circuits 121 , a plurality of first circuits 122 and a plurality of second circuits 123 . A plurality of inner conductive bodies 13 are provided through the first base material layer 11 , and the inner conductive bodies 13 are electrically connected to the second lines 123 on opposite sides of the first base material layer 11 .

A conductive paste 20 is disposed on the thin circuit 121 , and each of the electronic components 21 is mounted on a plurality of fine circuits 121 of the inner circuit layer 12 through the conductive paste 20 . In this embodiment, the two electronic components 21 are both driver chips, and the conductive paste 20 is made of solder paste with magnetic particles added thereto.

The adhesive structure 30 includes a second base material layer 31, a first adhesive layer 32 and a second adhesive layer 33. The first adhesive layer 32 and the second adhesive layer 33 are respectively disposed on the first adhesive layer 32. On opposite sides of the two base material layers 31 , the first adhesive layer 32 is connected to the inner circuit layer 12 . The first adhesive layer 32 has a through opening 34 , and the opening 34 is provided corresponding to the electronic component 21 . A plurality of outer conductive bodies 36 are provided through the bonding structure 30 , and the outer conductive bodies 36 are connected to the first line. road 122 and the second line 123. Each outer circuit layer 52 includes a plurality of conductive connection pads 53 . The surface of the conductive connection pads 53 facing away from the outer conductive body 36 and the surface of the second adhesive layer 33 facing away from the second base material layer 31 The surface is substantially flat, and the conductive connection pad 53 is connected to the outer conductive body 36 , that is, the conductive connection pad 53 is electrically connected to the inner circuit layer 12 through the outer conductive body 36 .

The material filled in the outer conductive body 36 is solder paste with magnetic particles added. The plurality of conductive connection pads 53 embedded in the second adhesive layer 33 have better flatness. Specifically, the height difference of the plurality of conductive connection pads 53 on the side away from the outer conductive body 36 is 1 Within microns.

Referring to Figures 10 and 11, the present application also provides a method for manufacturing a display component, which includes the following steps: sequentially pressing a conductive adhesive layer 70 and a display screen module 80 on both sides of the packaging structure 100. The display screen module 80 is electrically connected to the conductive connection pad 53 through the conductive adhesive layer 70 to obtain the display component 200 .

Wherein, the conductive adhesive layer 70 is anisotropic conductive film (ACF), and the display screen module 80 is a Micro-LED module.

Please refer to Figure 11. This application also provides a display component 200. The display component 200 includes the packaging structure 100, two conductive adhesive layers 70 and two display screen modules 80. Each of the conductive adhesive layers 70 and the The display screen modules 80 are sequentially pressed on the opposite sides of the packaging structure 100 , and each of the display screen modules 80 is electrically connected to the conductive connection pad 53 through the conductive adhesive layer 70 .

The above are only the preferred embodiments of the present application and are not intended to limit the present application in any form. Although the preferred embodiments of the present application are disclosed above, they are not intended to limit the present application. Any skilled person familiar with this field will , without departing from the scope of the technical solution of this application, when the technical content disclosed above can be used to make some changes or modifications to equivalent implementations with equivalent changes, but without departing from the content of the technical solution of this application, according to the technical essence of this application Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present application.

100:Package structure

10: Circuit substrate

11: First base material layer

12:Inside circuit layer

121: thin line

122:First line

123:Second line

13:Inner conductor

20: Conductive paste

21:Electronic components

30: Bonding structure

31: Second base material layer

32: First adhesive layer

33: Second adhesive layer

36:Outer conductor

53: Conductive connection pad

Claims (10)

A method for manufacturing a packaging structure, the improvement of which includes the step of: providing a circuit substrate, the circuit substrate includes a first base material layer and two inner circuit layers disposed on opposite sides of the first base material layer, each The inner circuit layer includes thin circuits; electronic components are provided on the thin circuits; an adhesive structure is provided on the inner circuit layer, and the adhesive structure includes a second base material layer, a first adhesive layer and a third adhesive layer. Two adhesive layers, the first adhesive layer and the second adhesive layer are respectively disposed on opposite sides of the second base material layer, and the first adhesive layer is disposed toward the inner circuit layer; A plurality of outer conductive bodies are provided through the adhesive structure, and the outer conductive bodies are connected to the inner circuit layer; a circuit carrier board is provided on the second adhesive layer, and the circuit carrier board includes a carrier board and a device On the external circuit layer on one side of the carrier board, the external circuit layer includes a plurality of conductive connection pads, the conductive connection pads are embedded in the second adhesive layer, and the conductive connection pads are conductive through the outside The body is electrically connected to the inner circuit layer; the carrier board is removed to obtain the packaging structure. The manufacturing method of claim 1, wherein a surface of the conductive connection pad facing away from the second adhesive layer is substantially flush with a surface of the second adhesive layer facing away from the second base material layer. The manufacturing method according to claim 1, wherein the outer conductive body is made of solder paste with magnetic particles added thereto. The manufacturing method as described in claim 1, wherein before the step of "arranging electronic components on the thin lines", it further includes: setting a conductive paste on the thin lines, and the material of the conductive paste is tin with magnetic particles added. paste. The manufacturing method according to claim 1, wherein the step "pressing and bonding the adhesive structure on the inner circuit layer" includes: opening an opening through the first adhesive layer, the opening corresponding to the electronic Component arrangement; a plurality of through holes are opened in the bonding structure, and part of the inner circuit layer is formed from the through holes. The bottom is exposed, and conductive paste is filled in the through hole to form the outer conductive body. The outer conductive body is connected to the inner circuit layer and the conductive connection pad. The manufacturing method of claim 1, wherein the manufacturing method of the circuit substrate includes the following steps: providing a double-sided copper clad laminate, the double-sided copper clad laminate including a first base material layer and a Two first copper foil layers on opposite sides of the base material layer; a first dry film is provided on each first copper foil layer; the first dry film is exposed and developed, and then the first dry film is etched The copper foil layer forms the inner circuit layer. The inner circuit layer includes a plurality of thin circuits, a plurality of first circuits and a plurality of second circuits. Remove the first dry film; on the first base material layer and A through opening is opened on one of the inner circuit layers, and copper is filled in the opening to form an inner conductive body. The inner conductive body is electrically connected to the second second base material layer on opposite sides of the first base material layer. circuit, that is, the circuit substrate is obtained. The manufacturing method according to claim 1, wherein the manufacturing method of the circuit carrier board includes: providing a single-sided copper-clad board, the single-sided copper-clad board includes a carrier board and a third surface disposed on a surface of the carrier board. two copper foil layers; disposing a second dry film on the second copper foil layer; exposing and developing the second dry film, and etching the second copper foil layer to form the outer circuit layer, The outer circuit layer includes a plurality of conductive connection pads, and the second dry film is removed to obtain the circuit carrier board. A packaging structure, which is improved in that it includes: a circuit substrate, the circuit substrate includes a first base material layer and two inner circuit layers, the two inner circuit layers are respectively arranged on opposite sides of the first base material layer , each inner circuit layer includes a plurality of thin circuits, a plurality of first circuits and a plurality of second circuits; electronic components, the electronic components are provided on the thin circuits; Adhesive structure, the adhesive structure includes a second base material layer, a first adhesive layer and a second adhesive layer, the first adhesive layer and the second adhesive layer are respectively arranged on the second base material On opposite sides of the material layer, the first adhesive layer is connected to the inner circuit layer, and a through opening is provided on the first adhesive layer, and the opening is provided corresponding to the electronic component; through the The bonding structure is provided with a plurality of outer conductive bodies, the conductive bodies are connected to the first line and the second line; an outer line layer, the outer line layer includes a plurality of conductive connection pads, the conductive connection pads The surface of the second adhesive layer facing away from the second base material layer is substantially flush with the surface of the second adhesive layer facing away from the second base material layer. The conductive connection pad is electrically connected to the inner side through the outer conductive body. line layer. The packaging structure according to claim 8, wherein the packaging structure further includes a conductive paste, the conductive paste is disposed between the thin circuit and the electronic component, the conductive paste and the outer side The material of the conductive body is solder paste with magnetic particles added. A display component, the improvement of which is that it includes a display screen module and a packaging structure as described in any one of claims 8 to 9, the display screen module is disposed on the outer circuit layer, and the display screen module The group is electrically connected to the conductive connection pad; the electronic component is a driving chip.

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