TWI820947B - Wafer container washing machine - Google Patents

Abstract

A wafer container washing machine is for washing a wafer container. The wafer container washing of the invention is, firstly, to inject a first washing liquid into a barrel, and to drive an ultrasonic generating device to generate an ultrasonic wave propagating to the first cleaning liquid, such that the first cleaning liquid ultrasonically rinses an interior and an exterior of a box of the wafer container. Next, the wafer container washing machine of the invention drives at least one first spray manifold to spray a second washing liquid through a plurality of through-holes of a tray to wash the interior of the box, drives at least one second spray manifold to spray the second washing liquid to wash the exterior of the box, and drives at least one third spray manifold to spray the second washing liquid to wash a cover of the wafer container.

Description

Wafer container cleaning machine

The present invention relates to a wafer container cleaning machine for cleaning wafer containers, and in particular to a wafer container cleaning machine that can clean internal and external wafer containers with different contours and simultaneously clean the box body and lid of the wafer container and the wafer container process. Wafer container cleaning machine with extremely high cleanliness after cleaning.

With the booming development of the semiconductor component manufacturing industry, the semiconductor component manufacturing process is very sensitive to external conditions such as dust or moisture. Therefore, it is increasingly important to handle accessories related to the semiconductor device manufacturing process to meet the dust or moisture requirements of the semiconductor device manufacturing process.

In the semiconductor device manufacturing process, wafer containers must be used to carry wafers at various stages of the process to facilitate transportation between different machines. The wafer container accordingly needs to be sealed and nearly dust-free. However, it is inevitable that dust will enter during the opening and closing process of the wafer container. Therefore, the wafer container that holds the wafers needs to be cleaned regularly to maintain the quality of the wafers it holds and not to affect the yield of the semiconductor device manufacturing process.

For the cleaning of wafer containers, wafer container cleaning machines have been developed and proposed. However, existing wafer containers have developed into various styles of wafer containers with different inner and outer contours. Regarding wafer container cleaning machines, there are previous technologies that design special spray manifolds for the outer contour of the wafer container, especially the grooves, to clean the structure of the outer contour that was previously difficult to clean. There is also a prior art in which a spray manifold is placed inside the box body of the wafer container to clean the inside of the box body of the wafer container.

However, existing wafer container cleaning machines have not yet been able to extensively clean wafer containers with different inner and outer contours. Moreover, in the prior art of wafer container cleaning machines, it is rare to see a design that simultaneously cleans the box body and lid of the wafer container. However, the cleanliness of the lid also affects the yield of the semiconductor device manufacturing process.

In addition, there is still room for improvement in the cleanliness of wafer containers cleaned by previous wafer container cleaning machines. There is no actual data to prove the cleanliness of wafer containers that have been cleaned periodically, let alone cleaning the wafer containers at the same time. Actual data on the cleanliness of the box body and behind the lid was revealed.

Generally, after the wafer container is cleaned, it must be air-dried and dried. However, the previous technology of wafer container cleaning machine does not have a one-stop cleaning, air drying and drying design. In addition, drying the wafer container requires energy to be heated, and there is no previous technology for a wafer container cleaning machine that has a cleaning function and a low-energy-consuming drying function at the same time.

Therefore, one of the technical problems to be solved by the present invention is to provide a wafer container that can clean the inner and outer wafer containers with different contours and simultaneously clean the box body and lid of the wafer container. The wafer container has extremely high cleanliness after cleaning. Wafer container cleaning machine. Another technical problem to be solved by the present invention is to provide a wafer container cleaning machine with cleaning function, air drying function and low energy consumption drying function.

A wafer container cleaning machine according to a preferred embodiment of the present invention is used to clean the wafer container. The wafer container includes a box body and a box cover. The box body of the wafer container has an opening. The wafer container cleaning machine according to the present invention includes a barrel, at least one ultrasonic generating element, a tray, a first auxiliary fixing member, a tubular body, a barrel cover, a second auxiliary fixing member, at least one first spray manifold, and at least one a second spray manifold and at least a third spray manifold. The barrel body has a barrel mouth. At least one ultrasonic generating element is arranged inside the barrel. The tray is rotatably arranged in the barrel and has a plurality of through holes. The first auxiliary fixing component is arranged on the pallet. The box system is fixed on the pallet through the first auxiliary fixing member, and the opening of the box body faces downward. The tubular body has an upper orifice and a lower orifice. The second auxiliary fixing component is disposed on the bottom surface of the bucket cover. The box lid is fixed on the bottom surface of the barrel lid through the second auxiliary fixing member. At least one first spray manifold is disposed in the barrel and located below the tray. At least one first spray manifold has a plurality of first nozzles facing the opening of the box. At least one second spray manifold is disposed in the barrel and close to the outside of the box fixed on the pallet. At least one second spray manifold has a plurality of second nozzles facing the box. At least a third spray manifold is disposed on the inner wall of the tubular body. The lower nozzle of the tubular body is fitted with the barrel mouth, and the barrel lid is closed on the upper nozzle of the tubular body, so that at least one third spray manifold has a plurality of third nozzles facing the lid and the box body. The wafer container cleaning machine according to the present invention first injects the first cleaning liquid into the barrel. Next, the wafer container cleaning machine according to the present invention drives at least one ultrasonic generating element to generate ultrasonic waves to the first cleaning liquid, so that the first cleaning liquid vibrates the outside and inside of the cleaning box. Then, the wafer container cleaning machine according to the present invention discharges the first cleaning liquid out of the barrel. Then, the wafer container cleaning machine according to the present invention drives the tray to rotate to drive the box body to rotate. Next, the wafer container cleaning machine according to the present invention drives at least one first spray manifold to spray the second cleaning liquid through a plurality of through holes of the tray, thereby cleaning the inside of the box. Next, the wafer container cleaning machine according to the present invention drives at least one second spray manifold to spray the second cleaning liquid, thereby cleaning the outside of the box. Next, the wafer container cleaning machine according to the present invention drives at least a third spray manifold to spray the second cleaning liquid, thereby cleaning the box cover and box body.

In a specific example, at least one ultrasonic wave generating element generates ultrasonic waves with a power density ranging from 5W/L to 15W/L.

Furthermore, the wafer container cleaning machine according to the present invention further includes a first air knife device, a second air knife device and a third air knife device. The first air knife device is arranged in the barrel and is located below the tray. The first blowing nozzle of the first air knife device faces the opening of the box body. The second air knife device is arranged in the barrel and is close to the outside of the box fixed on the pallet. The second blowing nozzle of the second air knife device faces the box body. The third air knife device is arranged on the inner wall of the tubular body. The lower mouth of the tubular body is fitted with the barrel mouth of the barrel, and the barrel lid is closed on the upper mouth of the tubular body, causing the third blowing nozzle of the third air knife device to face the lid. The wafer container cleaning machine according to the present invention further continues to drive the tray to rotate to drive the box body to rotate. Then, the wafer container cleaning machine according to the present invention drives the first air knife device to blow out the first air flow through the plurality of through holes of the tray, and then blows dry the inside of the box. Then, the wafer container cleaning machine according to the present invention drives the second air knife device to blow out the second air flow, and then dries the outside of the box. Then, the wafer container cleaning machine according to the present invention drives the third air knife device to blow out the third air flow, and then dries the box cover.

Furthermore, the wafer container cleaning machine according to the present invention further includes a fourth air knife device. The fourth air knife device is arranged on the inner wall of the tubular body. The lower mouth of the tubular body is fitted with the barrel mouth of the barrel, and the barrel lid is closed on the upper mouth of the tubular body, causing the fourth blowing nozzle of the fourth air knife device to face the box body. When the wafer container cleaning machine according to the present invention drives the second air knife device to blow out the second air flow and thereby dries the outside of the box, the wafer container cleaning machine according to the present invention drives the fourth air knife device to blow out the fourth air flow and then dries the outside of the box. Dry the outside of the box.

Furthermore, the wafer container cleaning machine according to the present invention also includes a plurality of heating devices. A plurality of heating devices are arranged in the barrel. When the lower tube opening of the tubular body is fitted with the barrel opening, and the barrel lid is closed on the upper tube opening of the tubular body, the barrel system, the tubular body and the box lid form a sealed cavity. The wafer container cleaning machine according to the present invention further evacuates the sealed cavity into a vacuum environment. Next, the wafer container cleaning machine according to the present invention drives a plurality of heating devices to generate heat energy, and then dries the box body and the box lid.

In a specific example, the second cleaning liquid may be water. The vacuum degree range of the vacuum environment can be equal to or less than 50Torr.

In a specific example, a plurality of heating devices generate thermal energy to heat the sealed cavity to a temperature ranging from 50°C to 60°C.

In a specific example, the dust-free level of the box body and the box lid after being cleaned, blown and dried by the wafer container cleaning machine according to the present invention is at least ISO Class 3.

Different from the prior art, the wafer container cleaning machine according to the present invention can clean the inner and outer wafer containers with different contours and simultaneously clean the box body and lid of the wafer container. The dust-free level of the box body and the box lid after being cleaned, blown and dried by the wafer container cleaning machine according to the present invention is at least ISO Class 3. The wafer container cleaning machine according to the present invention has cleaning functions, air drying functions and low energy consumption drying functions.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Please refer to FIGS. 1 to 5 , which schematically illustrate a wafer container cleaning machine 1 according to a preferred embodiment of the present invention. Figure 1 is an appearance view of the components and components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention in an open state, and the necessary components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention - The barrel 10 shows a partial cross-sectional view. Figure 2 is a side view of the components and components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention in an open state, and the necessary components of the wafer container cleaning machine 1 according to the preferred specific embodiment of the present invention - The barrel 10 shows a partial cross-sectional view. Figure 3 is a top view of the components and components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention in an open state, and the necessary components of the wafer container cleaning machine 1 according to the preferred specific embodiment of the present invention - The barrel body 10 is partially dissected. Figure 4 is an appearance view of the components and components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention in a closed state, and the necessary components of the wafer container cleaning machine 1 according to the preferred specific embodiment of the present invention - The barrel body 10, the tubular body 14, and the barrel cover 15 present a partial cross-sectional view. Figure 5 is a side view of the components and components of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention in a closed state, and the necessary components of the wafer container cleaning machine 1 according to the preferred specific embodiment of the present invention - The barrel body 10, the tubular body 14, and the barrel cover 15 present a partial cross-sectional view.

The wafer container cleaning machine 1 according to the preferred embodiment of the present invention is used to clean the wafer container 3 . The wafer container 3 includes a box body 30 and a box cover 32 . The box body 30 of the wafer container 3 has an opening 302 .

As shown in Figures 1 to 5, the wafer container cleaning machine 1 according to the present invention includes a barrel 10, at least one ultrasonic generating element 11, a tray 12, a first auxiliary fixing member 13, a tubular body 14, a barrel cover 15, The second auxiliary fixing member 16 , at least one first spray manifold 17 , at least one second spray manifold 18 and at least one third spray manifold 19 .

The barrel body 10 has a barrel mouth 102 . At least one ultrasonic generating element 11 is disposed in the barrel 10 . The tray 12 is rotatably disposed in the barrel 10 and has a plurality of through holes 122 . The first auxiliary fixing member 13 is provided on the tray 12 . The box body 30 is fixed on the tray 12 through the first auxiliary fixing member 13, and the opening 302 of the box body 30 faces downward.

The tubular body 14 has an upper orifice 142 and a lower orifice 144 . The second auxiliary fixing member 16 is disposed on the bottom surface 152 of the bucket cover 15 . The lid 32 is fixed on the bottom surface 152 of the bucket lid 15 through the second auxiliary fixing member 16 .

At least one first spray manifold 17 is disposed in the barrel 10 and located below the tray 12 . At least one first spray manifold 17 has a plurality of first nozzles 172 facing the opening 302 of the box body 30 .

At least one second spray manifold 18 is disposed in the barrel 10 and close to the outside of the box 30 fixed on the tray 12 . At least one second spray manifold 18 has a plurality of second nozzles 182 facing the box 30 .

At least one third spray manifold 19 is disposed on the inner wall of the tubular body 14 . The lower nozzle 144 of the tubular body 14 is fitted with the barrel nozzle 102, and the barrel cover 15 is closed on the upper nozzle 142 of the tubular body 14, so that at least one third spray manifold 19 has a plurality of third nozzles 192 Toward the box cover 32 and the box body 30 .

The box body 30 is first fixed on the tray 12 through the first auxiliary fixing member 13, and the box lid 32 is fixed on the bottom surface 152 of the bucket lid 15 through the second auxiliary fixing member 16, and then the tubular body 14 is The tube opening 144 is fitted with the barrel opening 102, and then the barrel cover 15 is closed on the tube opening 142 on the tubular body 14. In this way, the placement of the box 30 will not be interfered with by the at least one third spray manifold 19 .

The barrel body 10 is fixed on a rotating shaft (not shown in the figure), and the barrel cover 15 is also fixed on another rotating shaft (not shown in the figure). Thereby, the operation of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention can be automated.

Please refer to FIGS. 6 to 7 , which are side views of the components and components of the wafer container cleaning machine 1 in a closed state and in different cleaning stages according to a preferred embodiment of the present invention. 6 to 7 also present partial cross-sectional views of the barrel 10, the tubular body 14, and the barrel cover 15 to schematically show the internal conditions of the wafer container cleaning machine 1 in different cleaning stages according to the preferred embodiment of the present invention.

Regarding using the wafer container cleaning machine 1 according to the present invention to clean the wafer container 3, as shown in FIG. 6, the wafer container cleaning machine 1 according to the present invention first injects the first cleaning liquid into the barrel 10. Next, as shown in FIG. 6 , the wafer container cleaning machine 1 according to the present invention drives at least one ultrasonic generating element 11 to generate ultrasonic waves to the first cleaning liquid, so that the first cleaning liquid vibrates the outside and inside of the cleaning box 30 . Then, the wafer container cleaning machine 1 according to the present invention discharges the first cleaning liquid out of the barrel 10 . Next, as shown in FIG. 7 , the wafer container cleaning machine 1 according to the present invention drives the tray 12 to rotate to drive the box 30 to rotate. Next, as shown in FIG. 7 , the wafer container cleaning machine 1 according to the present invention drives at least one first spray manifold 17 to spray the second cleaning liquid through the plurality of through holes 122 of the tray 12 to thereby clean the box 30 interior. Next, as also shown in FIG. 7 , the wafer container cleaning machine 1 according to the present invention drives at least a second spray manifold 18 to spray the second cleaning liquid, thereby cleaning the outside of the box 30 . Next, as also shown in FIG. 7 , the wafer container cleaning machine 1 according to the present invention drives at least a third spray manifold 19 to spray the second cleaning liquid, thereby cleaning the box cover 32 and the box body 30 . Spraying the second cleaning liquid toward the third nozzle 192 of the box body 30 mainly cleans the top 304 of the box body 30 . The top 304 of the box 30 refers to the position relative to the opening 302 when the box 30 is fixed on the tray 12 .

In a specific example, the first cleaning liquid and the second cleaning liquid may be water.

In a specific example, at least one ultrasonic wave generating element 11 generates ultrasonic waves with a power density ranging from 5W/L to 15W/L.

Before using the wafer container cleaning machine 1 according to the present invention to clean the wafer container 3, you can use manual method or another cleaning machine to spray air on the box body 30 and the box cover 32 for preliminary cleaning.

Furthermore, as shown in FIGS. 1 to 5 , the wafer container cleaning machine 1 according to the present invention also includes a first air knife device 20 , a second air knife device 21 and a third air knife device 22 . The first air knife device 20 is installed in the barrel 10 and located below the tray 12 . The first blowing nozzle 202 of the first air knife device 20 faces the opening 302 of the box body 30 . The second air knife device 21 is disposed in the barrel 10 and is close to the outside of the box 30 fixed on the pallet 12 . The second blowing nozzle 212 of the second air knife device 21 faces the box body 30 . The third air knife device 22 is disposed on the inner wall of the tubular body 14 . The lower nozzle 144 of the tubular body 14 is fitted with the barrel nozzle 102 of the barrel 10, and the barrel lid 15 is closed on the upper nozzle 142 of the tubular body 14, so that the third blowing nozzle of the third air knife device 22 222 towards the lid 32.

Please refer to FIG. 8 . FIG. 8 is a side view of the wafer container cleaning machine 1 according to a preferred embodiment of the present invention, with the components and components closed and in the drying stage. As shown in FIG. 8 , the wafer container cleaning machine 1 according to the present invention further continues to drive the tray 12 to rotate to drive the box 30 to rotate. Next, the wafer container cleaning machine 1 according to the present invention drives the first air knife device 20 to blow the first airflow through the plurality of through holes 122 of the tray 12 to dry the inside of the box 30 . Then, the wafer container cleaning machine 1 according to the present invention drives the second air knife device 21 to blow out the second air flow, and then dries the outside of the box 30 . Then, the wafer container cleaning machine 1 according to the present invention drives the third air knife device 22 to blow out the third air flow, and then the box cover 32 is dried. The blow-drying process is mainly to miniaturize the water droplets remaining on the box body 30 and the box lid 32, so that the miniaturized water droplets can evaporate more easily in the subsequent drying stage.

Furthermore, in order to ensure that the blow-drying box 30 is relative to the top 304 of the opening 302 when it is fixed on the tray 12, also as shown in FIGS. 1 to 5, the wafer container cleaning machine 1 according to the present invention also includes a fourth Air knife device 23. The fourth air knife device 23 is disposed on the inner wall of the tubular body 14 . The lower nozzle 144 of the tubular body 14 is fitted with the barrel nozzle 102 of the barrel 10, and the barrel cover 15 is closed on the upper nozzle 142 of the tubular body 14, so that the fourth blowing nozzle of the fourth air knife device 23 232 toward the box 30. Also as shown in FIG. 8 , when the wafer container cleaning machine 1 according to the present invention drives the second air knife device 21 to blow out the second air flow to dry the outside of the box 30 , the wafer container cleaning machine 1 according to the present invention also At the same time, the fourth air knife device 23 is driven to blow out a fourth airflow to dry the outside of the box 30 , mainly allowing the fourth airflow to dry the top 304 of the box 30 .

Furthermore, as also shown in FIGS. 1 to 5 , the wafer container cleaning machine 1 according to the present invention also includes a plurality of heating devices 24 . A plurality of heating devices 24 are installed in the barrel 10 . When the lower tube opening 144 of the tubular body 14 is fitted with the barrel opening 102, and the barrel lid 15 is closed on the upper tube opening 142 of the tubular body 14, the barrel body 10, the tubular body 14, and the barrel lid 15 form an airtight seal. cavity.

Please refer to FIG. 9 . FIG. 9 is a side view of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention, with the components and components closed and in the drying stage. The wafer container cleaning machine 1 according to the present invention further evacuates the sealed cavity into a vacuum environment. Next, as shown in FIG. 9 , the wafer container cleaning machine 1 according to the present invention drives a plurality of heating devices 24 to generate heat energy, thereby drying the box body 30 and the box cover 32 .

In a specific example, the heating device 24 may be an infrared heater, a ceramic heater, or the like.

In a specific example, the second cleaning liquid may be water. The vacuum degree range of the vacuum environment can be equal to or less than 50Torr. According to the phase diagram of water, it can be understood that a drop in pressure can cause the evaporation temperature of water to drop, thereby reducing the energy consumed in the drying stage of the wafer container cleaning machine 1 according to the preferred embodiment of the present invention.

In a specific example, a plurality of heating devices 24 generate thermal energy to heat the sealed cavity to a temperature ranging from 50°C to 60°C.

There are currently no specifications or standards for measuring the cleanliness of the wafer container 3 . Here, the present invention borrows ISO's definition of clean room cleanliness level to represent the cleanliness of the wafer container 3 (including the box body 30 and the box cover 32 ) after being cleaned by the wafer container cleaning machine 1 according to the present invention. ISO’s definition of clean room class is shown in Table 1. It should be emphasized that the cleanliness of the wafer containers cleaned by the wafer container cleaning machine in the prior art has not been verified by actual data, let alone cleaning the box and the wafer container at the same time. Actual data on cleanliness behind the lid is revealed.

In a specific example, after the box body 30 and the box cover 32 are cleaned by the wafer container cleaning machine 1 according to the present invention, and then blown and dried, the dust-free level (cleanliness) meets at least ISO Class 3. It should be noted that the dust attached to the box body 30 and the box cover 32 after being cleaned by the wafer container cleaning machine 1 according to the present invention can be removed by vibration or other means before measurement. Moreover, even if the dust-free level of the box body 30 and the box cover 32 after being cleaned by the wafer container cleaning machine 1 according to the present invention meets ISO Class 3, because the dust attached thereto has not yet spread to the space, it is harmful to a certain space. The affected dust-free level is much lower than ISO Class 3.

Table 1 ISO dust-free rating The maximum particle size of dust particles is shown below with the maximum concentration limit (particles/m ³ ) 0.1μm 0.2μm 0.3μm 0.5μm ISO Class 1 10 2 ISO Class 2 100 twenty four 10 4 ISO Class 3 1000 237 102 35 ISO Class 4 10000 2370 1020 352 ISO Class 5 100000 23700 10200 3520 ISO Class 6 1000000 237000 102000 35200

From the above detailed description of the present invention, it can be clearly understood that the wafer container cleaning machine according to the present invention can clean wafer containers with different inner and outer contours and simultaneously clean the box body and lid of the wafer container. The dust-free level of the box body and the box lid after being cleaned, blown and dried by the wafer container cleaning machine according to the present invention is at least ISO Class 3. The wafer container cleaning machine according to the present invention has cleaning functions, air drying functions and low energy consumption drying functions.

Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, but the aspects of the present invention are not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements within the patentable scope of the present invention. Therefore, the patentable aspects of the present invention should be interpreted in the broadest possible light of the above description so as to cover all possible modifications and equivalent arrangements.

1: Wafer container cleaning machine 10: Barrel body 102:bucket mouth 11: Ultrasonic generating element 12: Tray 122:Through hole 13: First auxiliary fixing component 14: Tubular body 142: Upper nozzle 144: Lower nozzle 15: barrel cover 152: Bottom surface 16: Second auxiliary fixing component 17:First spray manifold 172:First nozzle 18: Second spray manifold 182:Second nozzle 19:Third spray manifold 192:Third nozzle 20:The first air knife device 202:First mouthpiece 21:Second air knife device 212: Second mouthpiece 22:The third air knife device 222:Third mouthpiece 23: The fourth air knife device 232:The fourth mouthpiece 24:Heating device 3: Wafer container 30:Box body 302:Open your mouth 304:Top 32:Lid

Figure 1 is an appearance view of the components and components of the wafer container cleaning machine according to the preferred embodiment of the present invention in an open state, and a necessary component of the wafer container cleaning machine according to the preferred embodiment of the present invention - the barrel. Presents a partial section view. Figure 2 is a side view of the components and components of the wafer container cleaning machine according to the preferred embodiment of the present invention in an open state, and the barrel is a necessary component of the wafer container cleaning machine according to the preferred embodiment of the present invention. Presents a partial section view. Figure 3 is a top view of the components and components of the wafer container cleaning machine in an open state according to the preferred embodiment of the present invention, and the barrel is a necessary component of the wafer container cleaning machine according to the preferred embodiment of the present invention. Presenting partial dissection. Figure 4 is an appearance view of the components and components of the wafer container cleaning machine in a closed state according to the preferred embodiment of the present invention, and the barrel is an essential component of the wafer container cleaning machine according to the preferred embodiment of the present invention. , the tubular body, and the lid are shown in partial cross-section views. Figure 5 is a side view of the components and components of the wafer container cleaning machine in a closed state according to the preferred embodiment of the present invention, and the barrel is a necessary component of the wafer container cleaning machine according to the preferred embodiment of the present invention. , the tubular body, and the lid are shown in partial cross-section views. 6 to 7 are side views of the wafer container cleaning machine in a closed state and in different cleaning stages according to a preferred embodiment of the present invention. A schematic diagram of the engagement relationship between the operating part of the lever of the first wafer container cleaning machine and the motherboard when it is in the lowest position according to the first preferred embodiment of the present invention. 8 is a side view of the wafer container cleaning machine according to the preferred embodiment of the present invention, with the components and components closed and in the drying stage. FIG. 9 is a side view of the wafer container cleaning machine according to the preferred embodiment of the present invention, with the components and components closed and in the drying stage.

1: Wafer container cleaning machine

10: Barrel body

102:bucket mouth

11: Ultrasonic generating element

12: Tray

13: First auxiliary fixing component

14: Tubular body

142: Upper nozzle

144: Lower nozzle

15: barrel cover

152: Bottom surface

16: Second auxiliary fixing component

17:First spray manifold

172:First nozzle

18: Second spray manifold

182:Second nozzle

19:Third spray manifold

192:Third nozzle

20:The first air knife device

202:First mouthpiece

21:Second air knife device

212: Second mouthpiece

22:The third air knife device

222:Third mouthpiece

23: The fourth air knife device

232:The fourth mouthpiece

24:Heating device

3: Wafer container

30:Box body

302:Open your mouth

304:Top

32:Lid

Claims (8)

A wafer container cleaning machine is used to clean a wafer container. The wafer container includes a box body and a box cover. The box body has an opening. The wafer container cleaning machine includes: A barrel has a barrel mouth; at least one ultrasonic generating element is arranged in the barrel; a tray is rotatably arranged in the barrel and has a plurality of through holes; a first auxiliary fixing component is It is arranged on the pallet, wherein the box system is fixed on the pallet through the first auxiliary fixing member and the opening faces downward; a tubular body with an upper tube opening and a lower tube opening; a bucket lid; a second An auxiliary fixing component is provided on a bottom surface of the bucket cover, wherein the lid is fixed on the bottom surface of the bucket cover through the second auxiliary fixing component; at least one first spray manifold is provided Inside the barrel and located below one of the trays, a plurality of first nozzles of the at least one first spray manifold face the opening; at least one second spray manifold is disposed inside the barrel and close to the opening fixed on the tray. On the outside of the box, a plurality of second nozzles of the at least one second spray manifold face the box; and at least one third spray manifold is disposed on an inner wall of the tubular body, wherein the tubular body The lower mouth of the body is fitted with the barrel mouth, and the barrel lid is closed on the upper mouth of the tubular body, causing a plurality of third nozzles of the at least one third spray manifold to face the lid And the box; wherein the wafer container cleaning machine performs the following steps: injecting a first cleaning liquid into the barrel; driving the at least one ultrasonic generating element to generate an ultrasonic wave to the first cleaning liquid, so that the first cleaning liquid The cleaning liquid vibrates to clean the outside and an inside of the box; discharges the first cleaning liquid to the outside of the barrel; drives the tray to rotate to drive the box to rotate; drives the at least one first spray manifold to spray a first Two cleaning liquids pass through the plurality of through holes of the tray to clean the inside of the box; drive the at least one second spray manifold to spray the second cleaning liquid to clean the outside of the box; and drive the at least one second spray manifold to spray the second cleaning liquid to clean the outside of the box; A third spray manifold sprays the second cleaning liquid to clean the box lid and the box body. The wafer container cleaning machine as described in claim 1 further includes: A first air knife device is arranged in the barrel and located below the tray, with a first blowing nozzle of the first air knife device facing the opening; a second air knife device is arranged in the barrel and close to The outside of the box fixed on the tray, a second blow nozzle of the second air knife device faces the box; and a third air knife device is arranged on the inner wall of the tubular body, The lower nozzle of the tubular body is fitted with the barrel mouth, and the barrel lid is closed on the upper nozzle of the tubular body, causing a third blowing nozzle of the third air knife device to face the box. Cover; wherein the wafer container cleaning machine further performs the following steps: continue to drive the tray to rotate to drive the box body to rotate; drive the first air knife device to blow out a first airflow through the plurality of through holes of the tray and then blow Dry the inside of the box; drive the second air knife device to blow out a second airflow to dry the outside of the box; and drive the third air knife device to blow out a third airflow to dry the box cover. The wafer container cleaning machine as described in claim 2, further comprising: a fourth air knife device disposed on the inner wall of the tubular body, wherein the lower nozzle of the tubular body is connected to the barrel mouth sleeve The lid is closed on the upper nozzle of the tubular body, causing the fourth blowing nozzle of the fourth air knife device to face the box body. When the wafer container cleaning machine drives the second air knife When the device blows out the second airflow to dry the outside of the box, the wafer container cleaning machine drives the fourth air knife device to blow out a fourth airflow to dry the outside of the box. The wafer container cleaning machine as described in claim 3 further includes: a plurality of heating devices, which are arranged in the barrel; wherein the lower nozzle of the tubular body is fitted with the barrel mouth, and the barrel cover is When the upper nozzle of the tubular body is covered, the barrel system, the tubular body and the barrel cover form a sealed cavity. The wafer container cleaning machine further performs the following steps: evacuating the sealed cavity. Create a vacuum environment; and drive the plurality of heating devices to generate heat energy to dry the box body and the box lid. The wafer container cleaning machine according to claim 4, wherein the second cleaning liquid system is water, and the vacuum degree range of the vacuum environment is equal to or less than 50 Torr. The wafer container cleaning machine as claimed in claim 4, wherein the plurality of heating devices generate the heat energy to heat the sealed cavity to a temperature ranging from 50°C to 60°C. The wafer container cleaning machine as described in claim 1, wherein the box body and the box cover are cleaned by the wafer container cleaning machine, and then blow-dried and dried to a dust-free level that meets at least ISO Class 3. The wafer container cleaning machine as claimed in claim 1, wherein the at least one ultrasonic generating element generates the ultrasonic waves at a power density ranging from 5W/L to 15W/L.

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