TWI408013B - Easy-guiding element cleaning machine - Google Patents
Easy-guiding element cleaning machine Download PDFInfo
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- TWI408013B TWI408013B TW99132401A TW99132401A TWI408013B TW I408013 B TWI408013 B TW I408013B TW 99132401 A TW99132401 A TW 99132401A TW 99132401 A TW99132401 A TW 99132401A TW I408013 B TWI408013 B TW I408013B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 97
- 239000012530 fluid Substances 0.000 claims abstract description 38
- 238000005507 spraying Methods 0.000 claims description 9
- 238000001694 spray drying Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 13
- 239000007921 spray Substances 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 45
- 239000012535 impurity Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000013022 venting Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000000861 blow drying Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
本發明係提供一種可導引清洗乾燥之元件於旋轉中甩出之清洗流體向下吸入流動排出，使得元件迅速清洗乾燥，而提升乾燥效能及縮短作業時間之元件清洗機。The invention provides a component cleaning machine which can guide the cleaning and drying of the cleaning fluid to be sucked out by the cleaning fluid in the rotation, so that the components are quickly cleaned and dried, thereby improving the drying performance and shortening the working time.
在現今，半導體晶圓、鏡片、玻璃、印刷電路板、面板或醫療儀器等元件，於製作過程或使用一段時間後，元件之表面均會附著有雜質、污垢等，而影響元件之潔淨度及品質，為避免影響元件之製作良率及品質，業者係以清洗機清洗附著於元件表面之雜質等，以晶圓為例，係必須歷經多道製程，導致晶圓之表面會附著雜質、微粒或化合物等，因此，晶圓於不同製程之前後，必須執行清洗表面作業，例如晶圓在進入熱爐管(furnace)以進行擴散或氧化製程前、進行薄膜沈積前或蝕刻程序後，均需以晶圓清洗機清洗晶圓，以去除晶圓表面之雜質、微粒或化合物等，再將晶圓除濕乾燥，使得晶圓之表面具有高潔淨度，以提升晶圓製作品質。In today's semiconductor wafers, lenses, glass, printed circuit boards, panels or medical instruments, after the manufacturing process or after a period of use, the surface of the components will be attached with impurities, dirt, etc., which will affect the cleanliness of the components. In order to avoid affecting the production yield and quality of components, the manufacturer cleans the impurities attached to the surface of the device with a cleaning machine. For example, in the case of wafers, it is necessary to go through multiple processes, resulting in adhesion of impurities and particles to the surface of the wafer. Or compounds, etc., therefore, the wafer must be cleaned before the different processes, such as before the wafer enters the hot furnace for diffusion or oxidation process, before film deposition or after the etching process. The wafer is cleaned by a wafer cleaning machine to remove impurities, particles or compounds on the surface of the wafer, and the wafer is dehumidified and dried to make the surface of the wafer highly clean to improve wafer fabrication quality.
請參閱第1圖，係為一種晶圓清洗機，其係於機台11上設有一上方具開口121之清洗槽12，該清洗槽12之底面係連通排水管13，用以排出清洗流體，一裝配於清洗槽12下方之旋轉裝置14，其轉軸141係凸伸於清洗槽12之內部，用以連結一旋轉台15，該旋轉台15則可承載待清洗之晶圓，另設有一位於清洗槽12上方之噴管16，用以噴灑清洗流體(如離子水或氣體等)，於執行清洗晶圓17作業時，可將待清洗之晶圓17置放於旋轉台15上，該旋轉台15即真空吸附待清洗之晶圓17定位，接著旋轉裝置14之轉軸141係帶動旋轉台15及待清洗之晶圓17旋轉作動，並控制噴管16將清洗流體噴灑於待清洗之晶圓17上，進而清洗附著於晶圓17表面之雜質、微粒或化合物等，並利用旋轉台15旋轉之離心力將晶圓17表面之清洗流體向外甩出，而被甩出之清洗流體則由清洗槽12之排水管13排出，於清洗完畢後，該噴管16係停止噴灑清洗流體而改以噴灑氣體，由於旋轉台15仍帶動晶圓17旋轉，而可持續利用旋轉台15旋轉之離心力將晶圓17表面乾燥，達到清洗及乾燥晶圓17之目的；惟，該清洗機雖可使晶圓17利用旋轉時所產生之離心力將表面之清洗流體向外甩出，但清洗流體被甩出後，即會撞擊到清洗槽12之內壁面，而此一撞擊，又會使部份之清洗流體噴濺回晶圓17之表面，以致晶圓17無法迅速旋乾表面，不僅乾燥效率不佳，亦增加乾燥作業時間，造成降低生產效能之缺失。Referring to FIG. 1 , a wafer cleaning machine is provided on the machine table 11 with a cleaning tank 12 having an opening 121. The bottom surface of the cleaning tank 12 is connected to the drain pipe 13 for discharging the cleaning fluid. A rotating device 14 is disposed under the cleaning tank 12, and the rotating shaft 141 protrudes from the inside of the cleaning tank 12 for connecting to a rotating table 15, which can carry the wafer to be cleaned, and another The nozzle 16 above the cleaning tank 12 is used for spraying a cleaning fluid (such as ionized water or gas). When performing the cleaning of the wafer 17, the wafer 17 to be cleaned can be placed on the rotating table 15, and the rotation is performed. The stage 15 is vacuum-adsorbed to position the wafer 17 to be cleaned, and then the rotating shaft 141 of the rotating device 14 drives the rotating table 15 and the wafer 17 to be cleaned to rotate, and controls the nozzle 16 to spray the cleaning fluid onto the wafer to be cleaned. 17, further cleaning impurities, particles or compounds adhering to the surface of the wafer 17, and using the centrifugal force of the rotation of the rotating table 15 to sweep out the cleaning fluid on the surface of the wafer 17, and the cleaning fluid that is taken out is cleaned. The drain pipe 13 of the tank 12 is discharged, and the cleaning is completed. After that, the nozzle 16 stops spraying the cleaning fluid and changes the spraying gas. Since the rotating table 15 still drives the wafer 17 to rotate, the surface of the wafer 17 can be dried by the centrifugal force of the rotation of the rotating table 15 to clean and dry the crystal. The purpose of the circle 17; however, the cleaning machine can cause the wafer 17 to use the centrifugal force generated by the rotation to pull out the cleaning fluid on the surface, but after the cleaning fluid is thrown out, it will impinge into the cleaning tank 12. The wall surface, and this impact, will cause some of the cleaning fluid to splash back onto the surface of the wafer 17, so that the wafer 17 cannot quickly spin dry the surface, which not only has poor drying efficiency, but also increases the drying time and reduces the production efficiency. Missing.
故，如何設計一種可迅速清洗乾燥元件，而提升乾燥效能及縮短作業時間之元件清洗機，即為業者研發之標的。Therefore, how to design a component cleaning machine that can quickly clean the drying components and improve the drying efficiency and shorten the working time is the standard developed by the industry.
本發明之目的一，係提供一種易於導流之元件清洗機，包含有清洗槽、旋轉裝置、旋轉台及噴灑吹乾裝置，該清洗槽之內部係設有導流盤，並開設有排放口，該旋轉裝置係設有一由驅動源驅動旋轉之轉軸，轉軸端部則連結一位於導流盤內之旋轉台，該旋轉台係用以承載待清洗之元件，噴灑吹乾裝置係設有一可噴灑清洗流體之噴管，用以清洗元件；其中，於旋轉台下方之轉軸上裝設有風扇，並使該風扇可與旋轉台同步由旋轉裝置帶動旋轉；藉此，於旋轉元件清洗乾燥時，可利用風扇於旋轉台之周圍產生一導引氣流，而可導引元件旋轉甩出之清洗流體依導引氣流流動路徑排出，以使元件迅速乾燥，達到提升乾燥效能之實用效益。A first object of the present invention is to provide a component cleaning machine which is easy to conduct, and includes a cleaning tank, a rotating device, a rotating table and a spray drying device, and the inside of the cleaning tank is provided with a deflector and a discharge port is opened. The rotating device is provided with a rotating shaft driven by a driving source, and the rotating shaft end is coupled to a rotating table located in the guiding plate, the rotating table is for carrying the component to be cleaned, and the spraying and drying device is provided with a Spraying a cleaning fluid nozzle for cleaning the component; wherein a fan is mounted on the rotating shaft below the rotating table, and the fan can be rotated by the rotating device in synchronization with the rotating table; thereby, when the rotating component is cleaned and dried The fan can be used to generate a guiding airflow around the rotating table, and the cleaning fluid that can be rotated by the guiding component is discharged according to the guiding airflow flow path, so that the component is quickly dried, thereby achieving the practical benefit of improving the drying performance.
本發明之目的二，係提供一種易於導流之元件清洗機，其係於旋轉台之下方配置有風扇，該風扇可由轉軸驅動而與旋轉台同步旋轉作動，以抽取清洗槽之外部空氣，而於旋轉台之周圍產生一導引氣流，而可導引元件旋轉甩出之清洗流體依導引氣流流動路徑排出，以防止清洗流體噴濺回元件上，使得元件迅速乾燥，以有效縮短乾燥作業時間，達到提升清洗產能之實用效益。A second object of the present invention is to provide a component cleaning machine that is easy to conduct, and is disposed below a rotating table with a fan that can be driven by a rotating shaft to rotate in synchronization with the rotating table to extract the outside air of the cleaning tank. A guiding airflow is generated around the rotating table, and the cleaning fluid that can be rotated by the guiding element is discharged according to the guiding airflow flow path to prevent the cleaning fluid from splashing back onto the component, so that the component is quickly dried to effectively shorten the drying operation. Time, to achieve practical benefits of improving cleaning capacity.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如后：請參閱第2、3圖，該元件清洗機係於機台20上配置有清洗槽30、旋轉裝置40、旋轉台50、風扇60及噴灑吹乾裝置70，該清洗槽30係為一內部具容置空間之容器，於本實施例中，該清洗槽30係於頂面設有一具通風口311之上蓋31，並開設有排放口32，於本實施例中，係於清洗槽30之側面近底部開設有排放口32，用以排出清洗流體，另於清洗槽30之內部固設有排水盤33，該排水盤33係呈階級狀，而於內部形成一承置部331，並於側面開設有相通至排放口32之通孔332，又該排水盤33之承置部331上係固設有一導流盤34，該導流盤34之底面係開設有穿孔341，該穿孔341則相通於排水盤33之通孔332，於本實施例中，該導流盤34之底面係具有導斜面342，用以導引清洗流體向下流動，該旋轉裝置40係設有一為馬達41之驅動源，於本實施例中，該馬達41係驅動一為皮帶輪組42之傳動組作動，並以皮帶輪組42傳動一位於清洗槽30下方之轉軸43旋轉作動，該轉軸43之一端則凸伸出於導流盤34之穿孔341，用以裝配連結一旋轉台50，該旋轉台50可承載待清洗之元件(如晶圓)，於本實施例中，該旋轉台50可真空吸附待清洗之元件定位，並於頂面之周側設有複數個定位件，用以定位待清洗之元件，於本實施例中，該旋轉台50之周圍係設有複數個為扣具51之定位件，用以扣掣待清洗之元件定位，一具複數個扇葉61之風扇60，係位於旋轉台50之下方，於本實施例中，該風扇60係位於排水盤33與導流盤34之間，並設有一為軸孔之套接部62，用以套置連結於旋轉裝置40之轉軸43上，而可以轉軸43帶動風扇60與旋轉台50同步旋轉，該噴灑吹乾裝置70係設有一可噴灑清洗流體之噴管71，用以清洗元件。In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing are described in detail as follows: Please refer to Figures 2 and 3, the component cleaning machine is disposed on the machine table 20 The cleaning tank 30, the rotating device 40, the rotating table 50, the fan 60, and the spray drying device 70 are a container having an internal accommodating space. In the embodiment, the cleaning tank 30 is attached to the top surface. A venting opening 311 is provided on the upper surface of the venting opening 311, and a venting opening 32 is formed in the side of the cleaning tank 30. The venting opening 32 is provided at the bottom of the cleaning tank 30 for discharging the cleaning fluid, and the cleaning tank 30 is further disposed. A drain pan 33 is disposed inside, and the drain pan 33 is in the form of a column, and a receiving portion 331 is formed therein, and a through hole 332 communicating with the discharge port 32 is opened on the side surface, and the drain pan 33 is mounted. A guide plate 34 is fixed to the portion 331. The bottom surface of the guide plate 34 is provided with a through hole 341. The through hole 341 is connected to the through hole 332 of the drain pan 33. In the embodiment, the guide plate 34 is provided. The bottom surface has a guiding slope 342 for guiding the cleaning fluid to flow downward, and the rotating device 40 is A drive source for the motor 41 is provided. In the embodiment, the motor 41 drives a drive set of the pulley set 42 and drives the drive shaft 43 to rotate the rotary shaft 43 below the cleaning slot 30. One end of the protrusion 43 is protruded from the through hole 341 of the deflector 34 for assembling and connecting a rotating table 50, and the rotating table 50 can carry an element (such as a wafer) to be cleaned. In this embodiment, the rotating table The position of the component to be cleaned can be vacuum-adsorbed, and a plurality of positioning members are disposed on the circumferential side of the top surface for positioning the component to be cleaned. In this embodiment, a plurality of components are arranged around the rotary table 50. The positioning member of the buckle 51 is used for fastening the component to be cleaned. A fan 60 of a plurality of blades 61 is located below the rotary table 50. In the embodiment, the fan 60 is located on the drain pan 33. A sleeve portion 62 is defined as a shaft hole, and is sleeved on the rotating shaft 43 of the rotating device 40. The rotating shaft 43 can drive the fan 60 to rotate synchronously with the rotating table 50. The blow drying device 70 is provided with a spray nozzle 71 capable of spraying the cleaning fluid. Cleaning elements.
請參閱第4圖，本發明之元件清洗機可應用於清洗半導體晶圓、鏡片、玻璃、印刷電路板、面板或醫療儀器等元件，於本實施例中，該清洗機係應用於清洗晶圓80，於執行清洗作業時，係可將待清洗之晶圓80置放於旋轉台50上，並以旋轉台50之複數個扣具51將待清洗之晶圓80扣掣定位；請參閱第5圖，該旋轉裝置40之馬達41係利用皮帶輪組42驅動轉軸43轉動，該轉軸43則帶動旋轉台50、風扇60及待清洗之晶圓80同步旋轉，並使風扇60利用清洗槽30之通風口311抽取外部空氣，而於旋轉台50之周圍形成向下流動之導引氣流；請參閱第6圖，當旋轉台50帶動待清洗之晶圓80旋轉時，該噴灑吹乾裝置70之噴管71係可對旋轉中之待清洗晶圓80噴灑清洗流體(如清洗用之離子水)，以清洗附著於晶圓80表面上之雜質、微粒或化合物等，並使晶圓80利用旋轉之離心力將雜質等由清洗流體噴流向外甩出，此時，可利用風扇60於旋轉台50周圍形成向下吸入流動之導引氣流，導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑排出，若部份被甩出之清洗流體穿過導引氣流而撞擊至導流盤34之內壁面時，由於導引氣流位於晶圓80與導流盤34之間，此時，該風扇60亦可利用導引氣流直接導引反彈噴濺之清洗流體向下流動，並不會使撞擊導流盤34之清洗流體噴濺回晶圓80上，再使清洗流體順沿導流盤34之導斜面342，且經由穿孔341而流入於風扇60上，該風扇60之各扇葉61再將清洗流體排入至排水盤33內，並由排水盤33之通孔332排出；請參閱第7圖，於清洗晶圓80完畢後，可控制噴灑吹乾裝置70之噴管71停止噴灑清洗流體，而改以噴灑另一種清洗流體(如乾燥用之氣體)，由於旋轉裝置40之轉軸43仍帶動旋轉台50及風扇60同步轉動，該旋轉台50可帶動晶圓80旋轉，並利用離心力將表面之清洗流體向外甩出，此時，相同的可利用風扇60於旋轉台50周圍形成向下吸入流動之導引氣流，導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑排出，進而使晶圓80迅速將清洗流體甩乾，以縮短乾燥作業時間，達到提升乾燥效能之實用效益。Referring to FIG. 4, the component cleaning machine of the present invention can be applied to cleaning semiconductor wafers, lenses, glass, printed circuit boards, panels or medical instruments. In this embodiment, the cleaning machine is used for cleaning wafers. 80. When performing the cleaning operation, the wafer 80 to be cleaned may be placed on the rotating table 50, and the wafers 80 to be cleaned are positioned by the plurality of fasteners 51 of the rotating table 50; 5, the motor 41 of the rotating device 40 drives the rotating shaft 43 to rotate by the pulley set 42. The rotating shaft 43 drives the rotating table 50, the fan 60 and the wafer 80 to be cleaned to rotate synchronously, and the fan 60 utilizes the cleaning tank 30. The vent 311 extracts the outside air, and forms a downwardly flowing guiding airflow around the rotating table 50. Referring to FIG. 6, when the rotating table 50 drives the wafer 80 to be cleaned to rotate, the spray drying device 70 The nozzle 71 can spray a cleaning fluid (such as ion water for cleaning) on the wafer 80 to be cleaned during rotation to clean impurities, particles or compounds attached to the surface of the wafer 80, and rotate the wafer 80. Centrifugal force to remove impurities and the like from the cleaning fluid The flow is outwardly ejected. At this time, the fan 60 can be used to form a guiding airflow that flows downwardly around the rotating table 50, and the cleaning fluid that guides the wafer 80 to rotate out is discharged according to the guiding airflow path. When the scavenging cleaning fluid passes through the guiding airflow and impinges on the inner wall surface of the deflector 34, since the guiding airflow is located between the wafer 80 and the deflector 34, the fan 60 can also utilize the guiding airflow. The cleaning fluid directly guiding the rebound splatter flows downward, and does not cause the cleaning fluid of the impinging deflector 34 to be sprayed back onto the wafer 80, and then the cleaning fluid passes along the guiding slope 342 of the guiding plate 34, and via The perforations 341 flow into the fan 60. The blades 61 of the fan 60 discharge the cleaning fluid into the drain pan 33 and are discharged through the through holes 332 of the drain pan 33. Please refer to FIG. 7 for cleaning the wafer. After the 80 is completed, the nozzle 71 of the spray drying device 70 can be controlled to stop spraying the cleaning fluid, and the other cleaning fluid (such as the drying gas) can be sprayed, because the rotating shaft 43 of the rotating device 40 still drives the rotating table 50 and the fan. 60 synchronous rotation, the rotary table 50 can drive the wafer 80 to rotate, and benefit The cleaning fluid of the surface is extracted outward by centrifugal force. At this time, the same usable fan 60 forms a guiding airflow that flows downwardly around the rotating table 50, and the cleaning fluid that guides the wafer 80 to rotate out is guided. The airflow flow path is exhausted, so that the wafer 80 quickly dries the cleaning fluid to shorten the drying operation time and achieve the practical benefit of improving the drying performance.
據此，本發明元件清洗機可導引元件於旋轉清洗乾燥中甩出之清洗流體向下流動排出，使元件迅速清洗乾燥，而提升乾燥效能及縮短作業時間，實為一深具實用性及進步性之設計，然未見有相同之產品及刊物公開，從而允符發明專利申請要件，爰依法提出申請。Accordingly, the component cleaning device of the present invention can guide the component to discharge downwardly from the cleaning fluid which is ejected in the rotary cleaning and drying, so that the component can be quickly cleaned and dried, thereby improving the drying efficiency and shortening the working time, which is practical and practical. Progressive design, but did not see the same product and publications open, thus allowing the invention patent application requirements, 提出 apply in accordance with the law.
11．．．機台11. . . Machine
12．．．清洗槽12. . . Cleaning tank
121．．．開口121. . . Opening
13．．．排水管13. . . Drain pipe
14．．．旋轉裝置14. . . Rotating device
141．．．轉軸141. . . Rotating shaft
15．．．旋轉台15. . . Rotary table
16．．．噴管16. . . Nozzle
17．．．晶圓17. . . Wafer
20．．．機台20. . . Machine
30．．．清洗槽30. . . Cleaning tank
31．．．上蓋31. . . Upper cover
311．．．通風口311. . . Vent
32．．．排放口32. . . exhaustion hole
33．．．排水盤33. . . Drainage tray
331．．．承置部331. . . Bearing department
332．．．通孔332. . . Through hole
34．．．導流盤34. . . Guide disc
341．．．穿孔341. . . perforation
342．．．導斜面342. . . Bevel
40．．．旋轉裝置40. . . Rotating device
41．．．馬達41. . . motor
42．．．皮帶輪組42. . . Pulley set
43．．．轉軸43. . . Rotating shaft
50．．．旋轉台50. . . Rotary table
51．．．扣具51. . . Buckle
60．．．風扇60. . . fan
61．．．扇葉61. . . Fan blade
62．．．套接部62. . . Socket
70．．．噴灑吹乾裝置70. . . Spray drying device
71．．．噴管71. . . Nozzle
80．．．晶圓80. . . Wafer
第1圖：習式晶圓清洗機之示意圖。Figure 1: Schematic diagram of a conventional wafer washer.
第2圖：本發明元件清洗機之示意圖。Figure 2: Schematic diagram of the component cleaning machine of the present invention.
第3圖：本發明元件清洗機之局部零件分解示意圖。Fig. 3 is a partially exploded perspective view of the component cleaning machine of the present invention.
第4圖：本發明元件清洗機之使用示意圖(一)。Figure 4: Schematic diagram of the use of the component cleaning machine of the present invention (1).
第5圖：本發明元件清洗機之使用示意圖(二)。Figure 5: Schematic diagram of the use of the component cleaning machine of the present invention (2).
第6圖：本發明元件清洗機之使用示意圖(三)。Figure 6: Schematic diagram of the use of the component cleaning machine of the present invention (3).
第7圖：本發明元件清洗機之使用示意圖(四)。Figure 7: Schematic diagram of the use of the component cleaning machine of the present invention (4).
20．．．機台20. . . Machine
30．．．清洗槽30. . . Cleaning tank
31．．．上蓋31. . . Upper cover
311．．．通風口311. . . Vent
32．．．排放口32. . . exhaustion hole
33．．．排水盤33. . . Drainage tray
331．．．承置部331. . . Bearing department
332．．．通孔332. . . Through hole
34．．．導流盤34. . . Guide disc
341．．．穿孔341. . . perforation
342．．．導斜面342. . . Bevel
40．．．旋轉裝置40. . . Rotating device
41．．．馬達41. . . motor
42．．．皮帶輪組42. . . Pulley set
43．．．轉軸43. . . Rotating shaft
50．．．旋轉台50. . . Rotary table
51．．．扣具51. . . Buckle
60．．．風扇60. . . fan
62．．．套接部62. . . Socket
70．．．噴灑吹乾裝置70. . . Spray drying device
71．．．噴管71. . . Nozzle
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99132401A TWI408013B (en) | 2010-09-24 | 2010-09-24 | Easy-guiding element cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99132401A TWI408013B (en) | 2010-09-24 | 2010-09-24 | Easy-guiding element cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201213020A TW201213020A (en) | 2012-04-01 |
| TWI408013B true TWI408013B (en) | 2013-09-11 |
Family
ID=46786117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99132401A TWI408013B (en) | 2010-09-24 | 2010-09-24 | Easy-guiding element cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI408013B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202219903A (en) * | 2020-11-09 | 2022-05-16 | 綠霸生物科技股份有限公司 | Air purifier and intelligent air quality management system using the same include a casing, a filter unit, an air sensor, a thermal imaging unit, and a control unit |
| CN113808624A (en) * | 2021-10-15 | 2021-12-17 | 深圳市康得森电器有限公司 | A kind of ultrasonic vinyl record cleaning device and cleaning method |
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|---|---|---|---|---|
| US5762709A (en) * | 1995-07-27 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin coating apparatus |
| US20010011640A1 (en) * | 2000-01-28 | 2001-08-09 | Ebara Corporation | Substrate container and method of dehumidifying substrate container |
| TW498396B (en) * | 1999-07-27 | 2002-08-11 | Shibaura Mechatronics Corp | Spin processing apparatus |
| TW518648B (en) * | 2000-12-27 | 2003-01-21 | Shibaura Mechatronics Corp | Rotary processing device |
| JP2006202983A (en) * | 2005-01-20 | 2006-08-03 | Dainippon Screen Mfg Co Ltd | Substrate processing device and cleaning method in processing chamber |
| TW200922701A (en) * | 2007-10-17 | 2009-06-01 | Ebara Corp | Substrate cleaning apparatus |
| TW200922699A (en) * | 2007-10-11 | 2009-06-01 | Semes Co Ltd | Brush assembly and apparatus for cleaning a substrate having the same |
| KR20100059457A (en) * | 2008-11-26 | 2010-06-04 | 세메스 주식회사 | Single Sheet Substrate Processing Equipment |
-
2010
- 2010-09-24 TW TW99132401A patent/TWI408013B/en not_active IP Right Cessation
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762709A (en) * | 1995-07-27 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin coating apparatus |
| TW498396B (en) * | 1999-07-27 | 2002-08-11 | Shibaura Mechatronics Corp | Spin processing apparatus |
| US20010011640A1 (en) * | 2000-01-28 | 2001-08-09 | Ebara Corporation | Substrate container and method of dehumidifying substrate container |
| TW518648B (en) * | 2000-12-27 | 2003-01-21 | Shibaura Mechatronics Corp | Rotary processing device |
| JP2006202983A (en) * | 2005-01-20 | 2006-08-03 | Dainippon Screen Mfg Co Ltd | Substrate processing device and cleaning method in processing chamber |
| TW200922699A (en) * | 2007-10-11 | 2009-06-01 | Semes Co Ltd | Brush assembly and apparatus for cleaning a substrate having the same |
| TW200922701A (en) * | 2007-10-17 | 2009-06-01 | Ebara Corp | Substrate cleaning apparatus |
| KR20100059457A (en) * | 2008-11-26 | 2010-06-04 | 세메스 주식회사 | Single Sheet Substrate Processing Equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201213020A (en) | 2012-04-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |