TWI820525B - Vapor chamber lid and manufacturing method thereof - Google Patents

Abstract

The present disclosure is related to a vapor chamber lid. The vapor chamber lid includes a base plate and a top plate. The base plate includes a plate body, a frame, a plurality of supporting pillars and a chip accommodating portion. The frame surrounds the plate body to define a cooling space. The cooling space is configured to accommodate a working fluid. The supporting pillars are located in the cooling space. The chip accommodating portion is located on the plate body of the base plate and is facing away from the cooling space. The top plate is located on the frame of the base plate to seal the cooling space. An external sidewall of the frame of the base plate is coplanar with an external sidewall of the top plate.

Description

Wafer vapor chamber and manufacturing method thereof

The present disclosure relates to a wafer vapor chamber and a method for manufacturing the wafer vapor chamber.

As the functions of electronic products improve, the heat dissipation requirements of processors in electronic products are becoming higher and higher, so the application of vapor chambers is becoming more and more popular. However, the traditional vapor chamber has a tube body for filling the working fluid disposed at one end of its body. When the vapor chamber collides, the exposed pipe body is prone to rupture and leakage of the internal working fluid. In addition, as the appearance characteristics of processors in electronic products change, the appearance structure of the vapor chamber also needs to be changed. Otherwise, the vapor chamber will not be able to completely cover the processor, resulting in poor heat dissipation effect of the vapor chamber.

One technical aspect of the present disclosure is a wafer vapor chamber.

According to an embodiment of the present disclosure, a wafer vapor chamber includes a bottom plate and a top plate. The base plate includes a plate body, a frame, a plurality of support pillars and a chip accommodating part. A frame surrounds the board to define a space for heat dissipation. The heat dissipation space is configured to accommodate the working fluid. The support column is located in the heat dissipation space. The chip accommodating part is located on the plate body of the base plate and faces away from the heat dissipation space. The top plate sits on the frame of the bottom plate to seal the heat dissipation space. The outer side wall of the bottom plate frame is coplanar with the outer side wall of the top plate.

In an embodiment of the present disclosure, no tube connected to the heat dissipation space extends from the outer side wall of the frame of the base plate.

In an embodiment of the present disclosure, the entire outer side wall of the frame of the bottom panel completely overlaps the outer side wall of the top panel.

In an embodiment of the present disclosure, the periphery of the frame and the periphery of the top plate have the same outline.

In an embodiment of the present disclosure, the frame has a convex portion. The outer side wall of the frame is located between the outer side wall of the top plate and the convex portion of the frame.

In an embodiment of the present disclosure, the outer side walls of the frame of the bottom panel and the outer side walls of the top panel each have a recessed portion, and the two recessed portions overlap.

In an embodiment of the present disclosure, the recessed portion of the frame of the bottom plate is located between two adjacent corners of the bottom plate, and the recessed portion of the top plate is located between two adjacent corners of the top plate.

In an embodiment of the present disclosure, the above-mentioned support columns are separated from each other, and the frame surrounds the support columns.

In an embodiment of the present disclosure, the above-mentioned support column, plate body and frame are an integrally formed structure.

In an embodiment of the present disclosure, the above-mentioned wafer vapor chamber further includes a first structural plate and a second structural plate. The first structural panel is located in the heat dissipation space. The bottom of the support column is surrounded by the first structural plate. The first structural plate includes a plurality of first capillary structures. The first capillary structure faces the top plate. The second structural panel is located in the heat dissipation space. The top of the support column is surrounded by a second structural panel. The second structural plate includes a plurality of second capillary structures. The second capillary structure faces the plate body of the bottom plate.

Another technical aspect of the present disclosure is a method for manufacturing a wafer vapor chamber.

According to an embodiment of the present disclosure, a method for manufacturing a wafer vapor chamber includes: forming a base plate, wherein the base plate includes a plate body, a frame and a plurality of support columns, the frame surrounds the plate body to define a heat dissipation space, and the heat dissipation space is configured to accommodate work fluid; forming a through hole passing through the frame on the frame of the base plate; providing a top plate on the frame, wherein the outer side wall of the frame of the base plate is coplanar with the outer side wall of the top plate; closing and pressing the through hole to seal the heat dissipation space; and A chip accommodating portion is formed on the base plate, wherein the chip accommodating portion faces away from the heat dissipation space.

In an embodiment of the present disclosure, the above-mentioned through holes are pressed together by resistance welding, ultrasonic welding or high frequency welding.

In an embodiment of the present disclosure, the above method further includes: arranging a tube connected to the through hole and the heat dissipation space on a side of the frame facing away from the heat dissipation space; filling the working fluid into the heat dissipation space through the tube body and the through hole; and cutting off tube body.

In an embodiment of the present disclosure, the above method further includes forming a convex portion on the frame so that the outer side wall of the frame is located between the outer side wall of the top plate and the convex portion of the frame.

In an embodiment of the present disclosure, chemical mechanical planarization, milling, stamping or etching are used to form the wafer accommodating portion on the plate body of the base plate.

In an embodiment of the present disclosure, the above method further includes forming a recessed portion on each of the outer side walls of the frame of the bottom panel and the outer side wall of the top panel, wherein the two recessed portions overlap.

In an embodiment of the present disclosure, the above method further includes: arranging a first structural plate, wherein the bottom of the support column is surrounded by the first structural plate, the first structural plate includes a plurality of first capillary structures, and the first capillary structures face the top plate; And a second structural plate is provided, wherein the top of the support column is surrounded by the second structural plate, the second structural plate includes a plurality of second capillary structures, and the second capillary structures face the plate body of the bottom plate.

In the above embodiments of the present disclosure, the outer side walls of the bottom frame of the wafer vapor chamber are coplanar with the outer side walls of the top plate. That is to say, there is no tube extending from the frame of the bottom plate that is connected to the heat dissipation space. Since there is no tube body on the frame of the bottom plate of the wafer vapor chamber, the chance of the exposed tube body being broken due to collision is avoided, and the risk of leakage of the working fluid in the heat dissipation space due to tube body rupture is also reduced.

The following disclosure of embodiments provides many different implementations, or examples, for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present application. Of course, these examples are examples only and are not intended to be limiting. Additionally, reference symbols and/or letters may be repeated in each instance. This repetition is for simplicity and clarity and does not by itself specify a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein for convenience of description, to describe The relationship of one element or feature to another element or feature is illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Figure 1 is a perspective view of a wafer vapor chamber 100 according to an embodiment of the present disclosure. Figure 2 shows a cross-sectional view along line 2-2 of the wafer vapor chamber 100 in Figure 1 . Referring to FIGS. 1 and 2 simultaneously, the wafer vapor chamber 100 includes a bottom plate 110 and a top plate 120 . The base plate 110 includes a plate body 112, a frame 114, a plurality of support pillars 116, and a chip accommodating portion S2. The plate body 112 has a top surface 113 and a bottom surface opposite to the top surface 113 . The frame 114 surrounds the plate body 112 and the support column 116 to define a heat dissipation space S1. In addition, the bottom side of the frame 114 (eg, the side facing away from the top plate 120 ) may have an adhesive surface to adhere the wafer vapor chamber 100 to the substrate (not shown). The heat dissipation space S1 is configured to accommodate the working fluid. For example, the working fluid can be water, but is not limited thereto. The support pillars 116 are located in the heat dissipation space S1 and are separated from each other. In some embodiments, the chip accommodating portion S2 is located on the plate body 112 of the base plate 110 and faces away from the heat dissipation space S1. The chip accommodating part S2 is configured to accommodate a chip (not shown) to take away the heat energy generated by the chip during operation. In addition, the chip receiving portion S2 can change in appearance according to the size and thickness of different chips to provide a customized effect and allow the chip to be completely accommodated therein.

The top plate 120 is located on the frame 114 of the bottom plate 110 to seal the heat dissipation space S1. It is worth noting that the outer side wall 111 of the frame 114 of the bottom plate 110 is coplanar with the outer side wall 121 of the top plate 120 . The periphery of the frame 114 of the bottom panel 110 has the same contour as the periphery of the top panel 120 . In this embodiment, no tube extending from the outer wall 111 of the frame 114 of the bottom plate 110 connected to the heat dissipation space S1 completely overlaps with the outer wall 121 of the top plate 120 .

Specifically, since the outer side wall 111 of the frame 114 of the bottom plate 110 of the wafer vapor chamber 100 is coplanar with the outer side wall 121 of the top plate 120 , that is to say, there is no tube connected to the heat dissipation space S1 on the frame 114 of the bottom plate 110 Extending from it, this avoids the chance of the exposed pipe body being ruptured due to collision, and also reduces the risk of leakage of the working fluid in the heat dissipation space S1 due to the rupture of the pipe body. In addition, the support column 116, the frame 114 and the plate body 112 are an integrally formed structure, so the bottom plate 110 has good structural strength. In this way, when the wafer vapor chamber 100 is operating, the probability of the wafer vapor chamber 100 being deformed or even damaged due to heat can be effectively reduced, so that the operating performance and working life of the wafer vapor chamber 100 can be effectively improved.

Figure 3 shows an exploded view of the wafer vapor chamber 100 of Figure 1 . Referring to FIGS. 2 and 3 simultaneously, the wafer vapor chamber 100 further includes a first structural plate 130 and a second structural plate 140 . The first structural plate 130 is located in the heat dissipation space S1. The bottom 116a of the support column 116 is surrounded by the first structural plate 130. The first structural plate 130 includes a plurality of first capillary structures 132 . The first capillary structure 132 faces the top plate 120 . The second structural plate 140 is located in the heat dissipation space S1. The top 116b of the support column 116 is surrounded by a second structural panel 140. The second structural plate 140 includes a plurality of second capillary structures 142 . The second capillary structure 142 faces the plate body 112 of the bottom plate 110 .

According to actual application conditions, the first capillary structure 132 of the first structural plate 130 and the second capillary structure 142 of the second structural plate 140 can be tiny protruding structures, concave structures or mesh structures, etc., but this is not the case. limit. For example, when the wafer vapor chamber 100 is operating, the working fluid contained in the heat dissipation space S1 will change its phase by repeatedly evaporating and condensing, thereby providing a heat dissipation effect. The first capillary structure 132 of the first structural plate 130 and the second capillary structure 142 of the second structural plate 140 are configured to improve the efficiency of evaporation and condensation of the working fluid in the heat dissipation space S1.

It should be understood that the connection relationships and functions of the components that have been described will not be repeated and will be explained first. In the following description, other forms of wafer vapor chambers will be described.

Figure 4A illustrates a perspective view of a wafer vapor chamber 100a according to another embodiment of the present disclosure. Figure 4B illustrates a cross-sectional view along line segment 4B-4B of the wafer vapor chamber 100a of Figure 4A. Referring to Figures 4A and 4B simultaneously, the plate body 112 of the bottom plate 110 of the wafer vapor chamber 100a has a wafer accommodating portion S2, and the wafer accommodating portion S2 faces away from the heat dissipation space S1. The chip accommodating part S2 can take away the heat energy generated by the chip during operation. The difference between the embodiment shown in FIG. 4A and the embodiment shown in FIG. 1 is that the frame 114 of the bottom plate 110 of the wafer vapor chamber 100 a has a convex portion 115 . The outer side wall 111 of the frame 114 of the bottom panel 110 is located between the outer side wall 121 of the top panel 120 and the convex portion 115 of the frame 114 . For example, the convex portion 115 of the frame 114 of the bottom plate 110 of the wafer vapor chamber 100a can abut against a locking mechanism (not shown) to provide a fixing effect.

Figure 5 illustrates a perspective view of a wafer vapor chamber 100b according to yet another embodiment of the present disclosure. Although not shown in the figure, the bottom plate 110 of the wafer vapor chamber 100b may have a wafer accommodating portion S2 as shown in FIG. 2 . The chip accommodating part S2 can take away the heat energy generated by the chip during operation. The difference from the embodiment in FIG. 1 is that the outer side wall 111 of the frame 114 of the bottom plate 110 of the wafer vapor chamber 100 b and the outer side wall 121 of the top plate 120 have recesses 117 and 127 respectively. The recess 117 of the frame 114 of the bottom plate 110 overlaps the recess 127 of the top plate 120 . The recess 117 of the frame 114 of the bottom plate 110 is located between two adjacent corners of the bottom plate 110 . The recess 127 of the top plate 120 is located between two adjacent corners of the top plate 120 .

In the following description, a method of manufacturing the wafer vapor chamber will be explained.

FIG. 6 illustrates a flow chart of a method for manufacturing a wafer vapor chamber according to an embodiment of the present disclosure. The manufacturing method of the wafer vapor chamber includes the following steps. First, in step 500, a base plate is formed, where the base plate includes a plate body, a frame, and a support column. The frame surrounds the plate body to define a heat dissipation space, and the heat dissipation space is configured to accommodate the working fluid. Next, in step 600, a through hole passing through the frame is formed on the frame of the base plate. Next, in step 700, a top plate is set on the frame, wherein the outer side wall of the frame of the bottom plate is coplanar with the outer side wall of the top plate. Then in step 800, the through holes are closed and pressed to seal the heat dissipation space. Next, in step 900, a wafer accommodating portion is formed on the plate body of the base plate, wherein the wafer accommodating portion faces away from the heat dissipation space. In the following description, each of the above steps will be explained in detail.

FIG. 7 shows a schematic diagram of the base plate 110 and the top plate 120 before being assembled according to an embodiment of the present disclosure. FIG. 8 shows a schematic diagram of the bottom plate 110 and the top plate 120 of FIG. 7 after assembly. Referring to FIGS. 7 and 8 simultaneously, a base plate 110 is formed, where the base plate 110 includes a plate body 112 , a frame 114 and a support column 116 . The frame 114 surrounds the board body 112 to define a heat dissipation space S1. The heat dissipation space S1 is configured to accommodate the working fluid. For example, the working fluid can be water, but is not limited thereto. In this embodiment, the support column 116, the frame 114 and the plate body 112 are integrally formed, so the bottom plate 110 has good structural strength. In this way, when the wafer vapor chamber 100 is operating, the probability of the wafer vapor chamber 100 being deformed or even damaged due to heat can be effectively reduced, so that the operating performance and working life of the wafer vapor chamber 100 can be effectively improved. After the base plate 110 is formed, a through hole H passing through the frame 114 is formed on the frame 114 of the base plate 110 .

Next, referring to Figures 2, 7 and 8 simultaneously, the manufacturing method further includes: setting a first structural plate 130, wherein the bottom 116a of the support column 116 is surrounded by the first structural plate 130, and the first structural plate 130 includes a first structural plate 130. a capillary structure 132, the first capillary structure 132 facing the top plate 120; and a second structural plate 140 is provided, wherein the top 116b of the support column 116 is surrounded by the second structural plate 140, the second structural plate 140 includes the second capillary structure 142, The two capillary structures 142 face the plate body 112 of the bottom plate 110 .

Next, a top plate 120 is disposed on the frame 114 to seal the heat dissipation space S1 to form a structure as shown in FIG. 8 . It is worth noting that the outer side wall 111 of the frame 114 of the bottom plate 110 is coplanar with the outer side wall 121 of the top plate 120 . The periphery of the frame 114 of the bottom panel 110 has the same contour as the periphery of the top panel 120 . The outer side wall 111 of the bottom plate 110 has no tube extending from it that is connected to the heat dissipation space S1, and the outer side wall 111 of the frame 114 of the bottom plate 110 completely overlaps the outer side wall 121 of the top plate 120. Then, the heat dissipation space S1 can be evacuated through the through hole H, and the working fluid can be filled into the heat dissipation space S1 through the through hole H. After the working fluid is filled into the heat dissipation space S1, the through hole H is closed and pressed to seal the heat dissipation space S1. In this embodiment, the through hole H is pressed by resistance welding, ultrasonic welding or high frequency welding.

Next, the manufacturing method further includes forming the wafer accommodating portion S2 on the plate body 112 of the base plate 110 . The chip accommodating part S2 faces away from the heat dissipation space S1. For example, chemical mechanical planarization, milling, stamping or etching may be used to form the wafer accommodating portion S2. In addition, the chip accommodating portion S2 can be formed according to the size and thickness of different chips to provide a customized effect and enable the chip to be completely accommodated in the chip accommodating portion S2.

FIG. 9 illustrates a schematic diagram of the base plate 110 and the top plate 120 before being assembled according to another embodiment of the present disclosure. Figure 10 shows a schematic diagram of the bottom plate 110 and the top plate 120 of Figure 9 after assembly. Referring to Figures 9 and 10 at the same time, the difference between the embodiment shown in Figure 9 and the embodiment shown in Figure 8 is that the manufacturing method also includes disposing a side of the frame 114 of the base plate 110 facing away from the heat dissipation space S1 Tube body 150. The tube body 150 has an opening communicating with the through hole H and the heat dissipation space S1. The opening is exposed outside the bottom plate 110 . After the tube body 150 is installed, the heat dissipation space S1 can be evacuated through the opening of the tube body 150 , and the working fluid can be filled into the heat dissipation space S1 through the tube body 150 and the through hole H. After the working fluid is filled into the heat dissipation space S1, the through hole H is closed and pressed to seal the heat dissipation space S1. After the through hole H is pressed, the tube body 150 is cut off, and a chip receiving portion S2 as shown in FIG. 2 is formed on the plate body 112 of the bottom plate 110 . The chip accommodating part S2 faces away from the heat dissipation space S1.

Referring to Figures 4A and 4B, the manufacturing method also includes: forming a protrusion 115 on the frame 114 of the bottom plate 110, so that the outer wall 111 of the frame 114 is located between the outer wall 121 of the top plate 120 and the protrusion 115 of the frame 114. . As a result, the wafer vapor chamber 100a has an appearance different from the wafer vapor chamber 100 in FIG. 1 . Specifically, the frame 114 of the wafer vapor chamber 100a has a step difference, and the convex portion 115 of the frame 114 of the bottom plate 110 of the wafer vapor chamber 100a can abut with the buckling mechanism (not shown) to provide a fixing effect.

Referring to FIG. 5 , the manufacturing method also includes forming recesses 117 and 127 on the outer side wall 111 of the frame 114 of the bottom plate 110 and the outer side wall 121 of the top plate 120 respectively. The recess 117 of the frame 114 of the bottom plate 110 is located between two adjacent corners of the bottom plate 110 . The recess 127 of the top plate 120 is located between two adjacent corners of the top plate 120 . The recess 117 of the frame 114 of the bottom plate 110 overlaps the recess 127 of the top plate 120 . In this way, the wafer vapor chamber 100b has a different appearance from the wafer vapor chamber 100 in Figure 1 to achieve a customized effect.

To sum up, the outer wall of the frame of the bottom plate of the wafer vapor chamber is coplanar with the outer wall of the top plate. That is to say, there is no tube connected to the heat dissipation space extending from the frame of the base plate. Since there is no tube body on the frame of the bottom plate of the wafer vapor chamber, the chance of the exposed tube body being broken due to collision is avoided, and the risk of leakage of the working fluid in the heat dissipation space due to tube body rupture is also reduced.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can be variously changed, substituted, and altered herein without departing from the spirit and scope of the present disclosure.

100: Wafer vapor chamber 100a: Wafer vapor chamber 100b: Wafer vapor chamber 110: Bottom plate 111:Outside wall 112:Plate body 113:Top surface 114:Border 115:convex part 116:Support column 116a: bottom 116b:Top 117: concave part 120:top plate 121:Outside wall 123:Top surface 127: concave part 130:First structural plate 132: First capillary structure 140:Second structural plate 142: Second capillary structure 150:tube body 500: steps 600: Steps 700: Steps 800: Step 900: steps H:Through hole S1: heat dissipation space S2: Chip accommodating part 2-2: Line segment 4B-4B: line segment

One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, in accordance with standard industry practice, various features are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a perspective view of a chip vapor chamber according to an embodiment of the present disclosure. Figure 2 shows a cross-sectional view along line 2-2 of the wafer vapor chamber in Figure 1 . Figure 3 shows an exploded view of the wafer vapor chamber in Figure 1 . Figure 4A is a perspective view of a wafer vapor chamber according to another embodiment of the present disclosure. Figure 4B illustrates a cross-sectional view along line 4B-4B of the wafer vapor chamber in Figure 4A. Figure 5 is a perspective view of a chip vapor chamber according to another embodiment of the present disclosure. FIG. 6 illustrates a flow chart of a method for manufacturing a wafer vapor chamber according to an embodiment of the present disclosure. FIG. 7 is a schematic diagram of the base plate and the top plate before being assembled according to an embodiment of the present disclosure. Figure 8 shows a schematic diagram of the bottom plate and top plate of Figure 7 after assembly. FIG. 9 is a schematic diagram of the base plate and the top plate before being assembled according to another embodiment of the present disclosure. Figure 10 shows a schematic diagram of the bottom plate and top plate of Figure 9 after assembly.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100: Wafer vapor chamber

110: Bottom plate

111:Outside wall

120:top plate

121:Outside wall

123:Top surface

2-2: Line segment

Claims (17)

A wafer vapor chamber, including: a bottom plate, including: a plate body; a frame surrounding the plate body to define a heat dissipation space and a wafer accommodating part, wherein the heat dissipation space is configured to accommodate a working fluid, the The chip accommodating part is located on the side of the plate body facing away from the heat dissipation space; and a plurality of support pillars are located in the heat dissipation space; and a top plate is located on the frame of the bottom plate to seal the heat dissipation space, wherein the bottom plate An outer side wall of the frame is coplanar with an outer side wall of the top plate, wherein the outer side wall of the bottom plate has a first part and a second part adjacent to the first part, and the first part is closer to the second part than the second part. The top plate, the entire first part of the outer side wall of the bottom plate and the entire outer side wall of the top plate are aligned with each other, and the frame extends from a bottom surface of the top plate to a position beyond a bottom surface of the plate body, so that the heat dissipation space and the chip accommodating part are surrounded by the frame. The wafer vapor chamber according to claim 1, wherein no tube connected to the heat dissipation space extends from the outer wall of the frame of the base plate. The wafer vapor chamber according to claim 1, wherein the outer side wall of the frame completely overlaps the outer side wall of the top plate. The wafer vapor chamber according to claim 1, wherein the periphery of the frame and the periphery of the top plate have the same outline. The wafer vapor chamber according to claim 1, wherein the frame has a convex portion, and the outer wall of the frame is located between the outer wall of the top plate and the convex portion of the frame. The wafer vapor chamber according to claim 1, wherein the outer side wall of the frame of the bottom plate and the outer side wall of the top plate each have a recess, and the two recesses overlap. The wafer vapor chamber according to claim 6, wherein the recessed portion of the frame of the bottom plate is located between two adjacent corners of the bottom plate, and the recessed portion of the top plate is located between two adjacent corners of the top plate. The wafer vapor chamber according to claim 1, wherein the support pillars are separated from each other, and the frame surrounds the support pillars. The wafer vapor chamber according to claim 1, wherein the support pillars, the plate body and the frame are an integrally formed structure. The chip vapor chamber as described in claim 1 further includes: a first structural plate located in the heat dissipation space, in which the support columns The bottom is surrounded by the first structural plate, which includes a plurality of first wick structures facing the top plate; and a second structural plate located in the heat dissipation space, in which the support columns The top is surrounded by the second structural plate, the second structural plate includes a plurality of second wick structures, and the second wick structures face the plate body of the bottom plate. A method of manufacturing a wafer vapor chamber, including: forming a bottom plate, wherein the bottom plate includes a plate body, a frame and a plurality of support pillars. The frame surrounds the plate body to define a heat dissipation space. The heat dissipation space is configured to accommodate A working fluid is placed; a through hole is formed on the frame through the frame; a top plate is provided on the frame, wherein an outer side wall of the frame of the bottom plate is coplanar with an outer side wall of the top plate; closed and pressed The through hole is used to seal the heat dissipation space; and a chip accommodating part is formed on the plate body of the base plate, wherein the chip accommodating part is located on the side of the plate body facing away from the heat dissipation space, and the frame surrounds the plate The body is used to define the chip accommodating part, and the frame extends from a bottom surface of the top plate to a position beyond a bottom surface of the plate body, so that the heat dissipation space and the chip accommodating part are both surrounded by the frame. The method of claim 11, wherein the through hole is pressed by resistance welding, ultrasonic welding or high frequency welding. The method described in request 11 further includes: A tube connected to the through hole and the heat dissipation space is provided on a side of the frame facing away from the heat dissipation space; the working fluid is filled into the heat dissipation space through the tube and the through hole; and the tube is cut off. The method of claim 11 further includes: forming a convex portion on the frame so that the outer wall of the frame is located between the outer wall of the top plate and the convex portion of the frame. The method of claim 11, wherein forming the wafer accommodating portion on the plate body of the base plate uses chemical mechanical planarization, milling, stamping or etching. The method of claim 11, further comprising: forming a recess on each of the outer wall of the frame of the bottom plate and the outer wall of the top plate, wherein the two recesses overlap. The method of claim 11, further comprising: arranging a first structural plate, wherein the bottoms of the support columns are surrounded by the first structural plate, the first structural plate includes a plurality of first capillary structures, and the first structural plate A capillary structure faces the top plate; and a second structural plate is provided, wherein the tops of the support columns are surrounded by the second structural plate, the second structural plate includes a plurality of second capillary structures, the The second capillary structure faces the plate body of the bottom plate.

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