TWI819554B - Miniature optoelectronic signal conversion and transmission device - Google Patents

Abstract

ABSTRACT OF THE DISCLOSURE:

The present invention discloses a miniature optoelectronic signal conversion and transmission device, which includes an optoelectronic signal module and an optical-fiber connector that are combined with each other. The optoelectronic signal module includes a silicon substrate and electrical connection is made toward a driver chip and an optoelectronic signal processor board in a stacked package. The silicon substrate is provided with a plurality of light-transmitting and light-receiving elements. Optical fibers that are provided on the optical-fiber connector are provided with a refraction surface at a signal receiving/transmitting terminal to correspond to and space from the light-transmitting and light-receiving elements. As such, the refraction surface provided at the terminal of the optical fibers such that when an optical signal is transmitted through the optical fibers toward the refraction surface, the optical signal is caused to change direction for transmitting toward the light-transmitting and light-receiving elements. Further, the silicon substrate is structured to serve as a conducting body, so that the optoelectronic signal module can be set in electrical connection with the driver chip and the optoelectronic signal processor board in a stacked package to thereby achieve an advanced efficacy of miniaturization of the entire structure of the optoelectronic signal conversion and transmission device.

Description

Micro photoelectric signal conversion and transmission device

The present invention relates to a micro-optical signal conversion and transmission device, in particular, a plurality of light-emitting and light-receiving elements are provided on a silicon substrate, and the silicon substrate (such as a silicon interposer) is used as a conductor, so that the silicon substrate, driver chip and photoelectric The signal processing board is electrically connected in a stacked package to form an optoelectronic signal module; the end of the optical fiber provided by the optical fiber connector is provided with a refractive surface, and the optical fiber is vertically spaced with the light-emitting and light-collecting components, so that the optical signal When transmitted to the refractive surface through the optical fiber, the optical signal can be redirected and transmitted to the light-emitting and light-receiving components, achieving the high efficiency of structural miniaturization of the overall photoelectric signal conversion and transmission device through stacking and packaging.

According to the long-term development of optical fiber communication, it refers to a way of transmitting information using light and optical fiber; therefore, optical fiber communication is a type of wired communication. At the same time, the optical fiber communication system has also had a revolutionary effect on the telecommunications industry, especially in In the digital age, it plays a very important role. The main reason is that optical fiber communication has multiple advantages and advantages such as large transmission capacity, speed and confidentiality...

Check, the invention patent of the Republic of China Announcement No. 1521248 discloses an optical transceiver (the applicant's previous patent), in which the connecting socket is connected to the circuit main board, the circuit sub-board is connected to the circuit main board using wire bonding, and the adapter board is located at the optical fiber connector and the circuit sub-board, the optoelectronic components are respectively coupled to the side of the adapter board facing the optical fiber connector, and the amplifier is electrically connected to the circuit sub-board. The board is connected to the optoelectronic component by wire bonding.

However, the above-mentioned conventional optical transceiver (that is, the applicant's previous patent) has many shortcomings, which are explained as follows:

1. It is known that the main electrical connection of the amplifier of the optical transceiver is located on the main circuit board, while the main electrical connection of the optoelectronic component is located on the adapter board. This causes the amplifier and the optoelectronic component to be located on different objects and appear separated. In this state, the number of amplifiers will inevitably increase. The length of the wire bonding with the optoelectronic component; however, the longer the wire bonding length, the greater the physical signal attenuation will be, thereby reducing the overall optical transceiver signal quality.

2. It is known that the main electrical connection of the amplifier of the optical transceiver is located on the circuit sub-board, and the circuit sub-board is connected to the circuit main board by wire bonding. This method will inevitably increase the wire bonding or conduction path between the amplifier and the circuit main board; in contrast, This will increase physical signal attenuation, thereby reducing the overall optical transceiver signal quality.

3. It is known that the amplifier of the optical transceiver is mainly designed and installed on the circuit motherboard, so that the corresponding area of the circuit motherboard must be relatively increased to accommodate multiple amplifier settings. This will inevitably cause the overall volume of the optical transceiver to be relatively large. It is too large to enter the realm of miniaturization.

Therefore, how to provide a method that can effectively reduce the distance between the wire bonding or the conduction path between the signal amplifier and the plurality of light-emitting components and the circuit motherboard, thereby reducing the attenuation of the physical signal and improving the overall signal transmission efficiency, is what the present invention intends to solve. the main topic.

In order to solve the above-mentioned problems and defects of the conventional technology, the present invention discloses a micro An optoelectronic signal conversion and transmission device includes an optoelectronic signal module and an optical fiber connector that are coupled to each other; the optoelectronic signal module includes a silicon substrate, a driver chip and an optoelectronic signal processor board that are electrically connected in sequence and stacked in sequence. The silicon substrate is electrically connected A plurality of light-emitting and light-receiving elements are connected, so that the plurality of light-emitting and light-receiving elements form electrical connections with the driver chip and the photoelectric signal processor board, and the light-emitting and light-receiving elements have an optical signal transceiver; the optical fiber connector A plurality of optical fibers are provided. One end of the optical fiber is provided with a signal transceiver end extending out of the optical fiber connector. The signal transceiver end extends to the photoelectric signal module and corresponds to the light-emitting and light-receiving components at longitudinal intervals. The signal transceiver end is provided with a refractive surface. , a gap is formed between the refractive surface and the optical signal transceiver and is vertically corresponding; when an optical signal is transmitted to the refractive surface through the optical fiber, the optical signal can be turned and conducted (guided) to the optical signal transceiver.

The technical feature of the present invention is that the silicon substrate is electrically connected with a plurality of light-emitting and light-receiving elements, and the silicon substrate (such as a silicon interposer) is used as a conductor to connect the silicon substrate, the driver chip and the optoelectronic signal processor board , can be electrically connected in a three-dimensional stacking package to form an optoelectronic signal module; then the end of the optical fiber provided by the optical fiber connector is provided with a refractive surface, and the optical fiber and the light-emitting and light-receiving components are spaced longitudinally (such as up and down) Correspondingly, when the optical signal is transmitted to the refractive surface through the optical fiber, the optical signal can be turned and conducted (guided) to the light-emitting and light-receiving components, achieving the overall photoelectric signal conversion and transmission device, and achieving the effect of structural miniaturization through three-dimensional stacking packaging. ; At the same time, it can effectively reduce the bonding distance between the driver chip and the plurality of light-emitting and light-receiving components and the photoelectric signal processing board, so as to reduce the attenuation of the physical signal and improve the overall signal transmission efficiency.

1: Photoelectric signal module

11:Silicon substrate

111: Positioning slot

112: First docking surface

113:Refraction part

12:Light-emitting and light-receiving components

121: Optical signal transceiver

13: Driver chip

14: Photoelectric signal processing board

15:Conduction bump

2: Optical fiber connector

21:Second docking surface

22: Optical fiber

221: Signal transceiver

222:Refraction surface

23:Transmission line

3: First positioning department

4: Second positioning department

5: Cover

D: spacing

The first figure shows the first embodiment of the miniature photoelectric signal conversion and transmission device of the present invention. Combined picture.

The second figure is an exploded view of the first embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

The third figure is a cross-sectional side view of the first embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

Figure 4: is an exploded view of the second embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

Figure 5: is a cross-sectional side view of the second embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

Figure 6: is an exploded view of the third embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

Figure 7: is a cross-sectional side view of the third embodiment of the micro-photoelectric signal conversion and transmission device of the present invention.

In order to allow the examiner to conveniently and simply understand other features and advantages of the present invention and the effects achieved by the present invention, the features and advantages of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are The viewpoints of the present invention are further described in detail, but the scope of the present invention is not limited in any viewpoint.

Please first refer to Figures 1, 2 and 3. The present invention discloses a first embodiment of a micro-optical signal conversion and transmission device, which includes an optoelectronic signal module 1 and an optical fiber connector 2.

The optoelectronic signal module 1 includes a silicon substrate 11, a plurality of light emitting and light collecting components 12, at least one driver chip 13 and an optoelectronic signal processing board 14; the silicon substrate 11 can be a silicon interposer. It can be preset with a plurality of silicon through holes, using the silicon substrate 11 as a conductor, so that the silicon substrate 11, the driver chip 13 and the optoelectronic signal processor board 14 can be electrically connected in a three-dimensional stacked packaging manner, for example: the silicon substrate 11 passes through the silicon through holes. It can connect the preset conductive bumps 15 (or metal micro-bumps) below, so that the silicon substrate 11, the driver chip 13 and the optoelectronic signal processor board 14 can form a three-dimensional stack of mutual electrical connections through the preset conductive bumps 15. connection. The top surface of the silicon substrate 11 is electrically connected with a plurality of light-emitting and light-collecting elements 12, so that the plurality of light-emitting and light-collecting elements 12 form electrical connections with the driving chip 13 and the photoelectric signal processor board 14, and the silicon substrate 11 is provided with a plurality of positioning grooves 111 on its top surface, and each positioning groove 111 corresponds to each light-emitting and light-collecting element 12; in addition, the silicon substrate 11 is provided with a first docking surface 112 on one side. The surface 112 is provided with at least two first positioning parts 3 . The light-emitting and light-receiving element 12 has an optical signal transceiver 121. For example, the optical signal transceiver 121 of the light-emitting and light-receiving element 12 can be placed upward. The driving chip 13 may be a laser diode (LD) driving chip, a light emitting diode (LED) driving chip or a transimpedance amplifier (transimpedance amplifier; TIA for short). The photoelectric signal processing board 14 is used for conversion processing of optical/electrical signals.

The fiber optic connector 2 is connected to the optoelectronic signal module 1. The fiber optic connector 2 is provided with a second mating surface 21 on the side facing the first mating surface 112 of the silicon substrate 11, and is provided with at least two mating surfaces 21 on the second mating surface 21. The second positioning part 4, and the optical fiber connector 2 is provided with a plurality of optical fibers 22. One end of each optical fiber 22 is provided with a signal transceiver end 221 extending out of the optical fiber connector 2. The signal transceiver end 221 extends to the optoelectronic signal module 1 and is connected with the The light-emitting and light-receiving components 12 are The longitudinal (upper and lower) intervals correspond to each other, and the signal transceiver end 221 is provided with a refractive surface 222. A distance D is formed between the refractive surface 222 and the optical signal transceiver 121 of the light-emitting and light-collecting element 12 and is vertically (upper and lower) opposite. Correspondingly, for example, the refractive surface 222 of the optical fiber 22 faces the optical signal transceiver 121 , and the refractive surface 222 of the optical fiber 22 is relatively located above the optical signal transceiver 121 . The other end of each optical fiber 22 forms a signal connection with the transmission line 23 provided with the optical fiber connector 2 .

The optical fiber 22 is beveled at the signal transceiver end 221 to form a refractive surface 222 (ie, light emitting/light incident beveled surface). The beveled angle of the refractive surface 222 may be between 10 and 80 degrees.

The optical fiber connector 2 and the optoelectronic signal module 1 are docked and combined with each other. The second positioning portion 4 (such as a columnar form) provided on the second docking surface 21 of the optical fiber connector 2 can be with the first docking surface 112 of the silicon substrate 11 The provided first positioning parts 3 (eg, in the form of jacks) are coupled to each other correspondingly, and the optical fiber 22 provided in the optical fiber connector 2 can be placed in the positioning groove 111 provided in the silicon substrate 11 .

The present invention further includes a cover 5 , which is disposed on top of the optoelectronic signal module 1 and the optical fiber connector 2 to cover and protect the plurality of optical fibers 22 .

The present invention illustrates the first embodiment. The electrical signal output by an external multimedia device can be converted into an optical signal through the photoelectric signal processor board 14 and the driver chip 13. The optical signal passes through the light emitting and light receiving components 12. The optical signal transceiver 121 emits upward and is transmitted to the refractive surface 222 of the optical fiber 22. The refractive surface 222 turns the optical signal so that the optical signal can enter the optical fiber 22 for transmission. On the contrary, when the optical signal received by the optical fiber connector 2 is transmitted to the refractive surface 222 through the optical fiber 22, the optical signal is turned (downwardly refracted) and conducted to the luminous and The optical signal transceiver 121 of the light-collecting element 12 finally converts the optical signal into an electrical signal through the driver chip 13 and the photoelectric signal processing board 14 for output to the multimedia device.

Therefore, the technical feature of the present invention is that the silicon substrate 11 is electrically connected with a plurality of light-emitting and light-collecting elements 12, and the silicon substrate 11 (such as a silicon interposer) is used as a conductor, so that the silicon substrate 11 emits light. The light collecting element 12, the driving chip 13 and the photoelectric signal processing board 14 can be electrically connected in a three-dimensional stacking package to form the photoelectric signal module 1; the end of the optical fiber 22 provided by the optical fiber connector 2 is provided with a refractive surface 222 , and the optical fiber 22 and the light-emitting and light-receiving element 12 are spaced apart in a longitudinal manner (such as up and down), so that when the optical signal is transmitted to the refractive surface 222 through the optical fiber 22, the optical signal can be turned and conducted (guided) to the light-emitting and light-receiving element 12. The light-collecting element 12 achieves the effect of structural miniaturization of the overall photoelectric signal conversion and transmission device through three-dimensional stacking and packaging; at the same time, it can effectively reduce the distance between the driver chip 13 and the plurality of light-emitting and light-collecting elements 12 and the photoelectric signal processing board 14 The wiring bonding distance can reduce the attenuation of physical signals and improve the overall signal transmission efficiency.

Please refer to the fourth and fifth figures. The present invention discloses a second embodiment of a micro-optical signal conversion and transmission device, which includes an optoelectronic signal module 1 and an optical fiber connector 2. The optoelectronic signal module 1 and the optical fiber connector 2 are basically the same structures as those disclosed in the first embodiment; the differences are:

The top surface of the silicon substrate 11 is electrically connected with a plurality of light-emitting and light-collecting elements 12. The light-emitting and light-collecting elements 12 have an optical signal transceiver 121, for example: the optical signal transceiver 121 of the light-emitting and light-collecting element 12. It can be set downward; the signal transceiver end 221 of the optical fiber 22 is provided with a refractive surface 222, and a distance D is formed between the refractive surface 222 and the optical signal transceiver 121 of the light-emitting and light-collecting element 12 and longitudinally (upper and lower). ) corresponds to, For example, the refractive surface 222 of the optical fiber 22 faces the optical signal transceiver 121 , and the refractive surface 222 of the optical fiber 22 is relatively located below the optical signal transceiver 121 .

The present invention illustrates the second embodiment. The electrical signal output by an external multimedia device can be converted into an optical signal through the photoelectric signal processor board 14 and the driver chip 13. The optical signal passes through the light emitting and light receiving components 12. The optical signal transceiver 121 emits downwards and is transmitted to the refractive surface 222 of the optical fiber 22. The refractive surface 222 turns the optical signal so that the optical signal can enter the optical fiber 22 for transmission. On the contrary, when the optical signal received by the optical fiber connector 2 is transmitted to the refractive surface 222 through the optical fiber 22, the optical signal is redirected (upward refracted) and transmitted to the optical signal transceiver 121 of the light-emitting and light-collecting element 12, and finally through the driving chip 13, The photoelectric signal processing board 14 converts optical signals into electrical signals for output to multimedia devices.

Please refer to Figures 6 and 7. The present invention discloses a third embodiment of a micro-optical signal conversion and transmission device, which includes an optoelectronic signal module 1 and an optical fiber connector 2. The optoelectronic signal module 1 and the optical fiber connector 2 are basically the same structures as those disclosed in the first embodiment; the differences are:

The top surface of the silicon substrate 11 is electrically connected with a plurality of light-emitting and light-collecting elements 12. The light-emitting and light-collecting elements 12 have an optical signal transceiver 121, for example: the optical signal transceiver 121 of the light-emitting and light-collecting element 12. It can be placed downward, and the silicon substrate 11 is provided with a bevel-shaped refractive portion 113 at the position corresponding to the light-emitting and light-receiving element 12 in the set slot 111. The bevel angle of the refractive portion 113 can be between 10 and 10 degrees. Between degrees ~80 degrees, a distance D is formed between the refractive portion 113 and the optical signal transceiver 121 of the light-emitting and light-receiving element 12 and corresponds vertically (up and down), for example: the refractive portion 113 of the silicon substrate 11 It faces the optical signal transceiver 121, and the refractive part 113 of the silicon substrate 11 is relatively located at the optical signal transceiver 121. below the hair generator 121.

The optical fiber 22 of the optical fiber connector 2 is relatively arranged in the positioning groove 111 provided on the silicon substrate 11 , and the cross section (ie, light output/light incident surface) of the signal transceiver end 221 of the optical fiber 22 is axially aligned with the refractive part 113 .

The present invention illustrates the third embodiment. The electrical signal output by an external multimedia device can be converted into an optical signal through the photoelectric signal processor board 14 and the driver chip 13. The optical signal passes through the light-emitting and light-receiving elements 12. The optical signal transceiver 121 emits downwards and is transmitted to the refractive part 113 of the silicon substrate 11. The refractive part 113 turns the optical signal so that the optical signal can enter the signal transceiver end 221 of the optical fiber 22 for transmission. On the contrary, when the optical signal received by the optical fiber connector 2 is transmitted to the refraction part 113 through the signal transceiver end 221 of the optical fiber 22, the optical signal is turned (upwardly refracted) and transmitted to the optical signal transceiver 121 of the light emitting and light collecting element 12, and finally The optical signal is converted into an electrical signal through the driver chip 13 and the photoelectric signal processor board 14 for output to the multimedia device.

To sum up, the technical feature of the present invention is to use the silicon substrate 11 (such as a silicon interposer) as a conductor, so that the silicon substrate 11, the light-emitting and light-collecting components 12, the driver chip 13 and the photoelectric signal processor board 14 can The three-dimensional stacked packaging method is electrically connected to form the optoelectronic signal module 1, and then the end of the optical fiber 22 provided in the optical fiber connector 2 is provided with a refractive surface 222, or a refractive portion 113 is provided on the silicon substrate 11, so that the optical fiber 22 transmits The optical signal can be deflected and conducted (guided) to the light-emitting and light-collecting elements 12 through the refractive surface 222 or the refractive portion 113, achieving the effect of structural miniaturization of the overall photoelectric signal conversion and transmission device using a three-dimensional stacked packaging method, thereby achieving the same effect. This effectively reduces the bonding distance between the driver chip 13 and the plurality of light-emitting and light-receiving components 12 and the photoelectric signal processor board 14, thereby reducing the physical Signal attenuation improves overall signal transmission efficiency.

1: Photoelectric signal module

11:Silicon substrate

111: Positioning slot

112: First docking surface

12:Light-emitting and light-receiving components

121: Optical signal transceiver

13: Driver chip

14: Photoelectric signal processing board

15:Conduction bump

2: Optical fiber connector

21:Second docking surface

22: Optical fiber

221: Signal transceiver

23:Transmission line

3: First positioning department

4: Second positioning department

5: Cover

Claims (6)

A miniature photoelectric signal conversion and transmission device, including: An optoelectronic signal module, which includes a silicon substrate, a driver chip and an optoelectronic signal processing board that are electrically connected in sequence. The silicon substrate is electrically connected with a plurality of light-emitting and light-receiving elements, so that the light-emitting and receiving elements are electrically connected. The optical element is electrically connected to the driver chip and the photoelectric signal processing board, and the light-emitting and light-receiving element has an optical signal transceiver; An optical fiber connector is connected to the optoelectronic signal module. The optical fiber connector is provided with a plurality of optical fibers. One end of the optical fiber is provided with a signal transceiver end extending from the outside of the optical fiber connector. The signal transceiver end extends to the optoelectronic signal module. It is spaced corresponding to the light-emitting and light-receiving elements, and the signal transceiver end is provided with a refractive surface, and a gap is formed between the refractive surface and the optical signal transceiver and corresponds thereto; When a predetermined optical signal is transmitted to the refractive surface through the optical fiber, the optical signal is turned and transmitted to the optical signal transceiver. The micro-optical signal conversion and transmission device as described in claim 1, wherein the optical signal transceiver of the light-emitting and light-receiving element is arranged upward, the refractive surface of the optical fiber faces the optical signal transceiver, and the refractive surface of the optical fiber Located above the optical signal transceiver, when the predetermined optical signal is transmitted to the refractive surface through the optical fiber, the optical signal is turned downward and conducted to the optical signal transceiver. The micro-optical signal conversion and transmission device as described in claim 1, wherein the optical signal transceiver of the light-emitting and light-receiving element is arranged downward, the refractive surface of the optical fiber faces the optical signal transceiver, and the refractive surface of the optical fiber Located below the optical signal transceiver, when the predetermined optical signal is transmitted to the refractive surface through the optical fiber, the optical signal is turned upward and conducted to the optical signal transceiver. The micro optoelectronic signal conversion and transmission device as claimed in claim 1, wherein the silicon substrate is provided with a first docking surface on one side, and at least two first positioning portions are provided on the first docking surface, and the optical fiber connector faces A second docking surface is provided on the side of the first docking surface of the silicon substrate, and at least two second positioning parts are provided on the second docking surface. The first positioning parts and the second positioning parts are correspondingly combined with each other. . The micro optoelectronic signal conversion and transmission device as claimed in claim 1, further comprising a cover disposed opposite the top of the optoelectronic signal module and the optical fiber connector to cover the optical fibers. The micro optoelectronic signal conversion and transmission device as described in claim 1, wherein the silicon substrate is provided with a plurality of positioning grooves on the top surface, each of the positioning grooves corresponds to each of the light-emitting and light-collecting components, and the optical fibers are relatively arranged on Such positioning slots.

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