TW201432336A - High density optical transceiver module - Google Patents

Abstract

A high density optical transceiver module is provided for parallel transmission and reception of high-speed data, including a circuit board, an optical module and at least one optical fiber carrier. The circuit board has a substrate attached on it having electro-optical (EO) components coupled or connected to a same side of the substrate. The optical module contains a multi-port lens systems and a host platform. The optical module is mounted on the substrate to align the lens with the EO components. The optical fiber sets are separated and fixed in the grooved structure of the optical fiber carrier, which is accommodated by the host platform. Employing the multi-port lens systems of the module enables the alignment and coupling between the EO components and the optical fibers. Moreover, the overall transmission capacity can be expanded by the unique stackable design of the optical fiber carrier.

Description

High-density optical transceiver module

The invention relates to the technical field of an optical transceiver module, in particular to an optical connecting device for high-speed data transmission, which is applied to an active optical cable.

With the advancement of information technology, the digital content has become larger and larger, and the data flow rate has been increasing. The traditional copper cable for transmitting data is still weak in the past due to better conductivity and good high frequency design. It can load low-speed data transmission, but it is limited by the inherent limitation of the copper cable itself. In the future high-speed (>10Gb/s), the signal will be easily degraded and distorted, and the transmission will not be carried out correctly and effectively. And occupying space, in the era of high-speed transmission, it is inevitable to use optical cables to replace the traditional copper cables with the characteristics that the optical signals are not easily distorted and low-loss, and the design of the active optical cables can replace the original copper cables to achieve high speed. The effective transmission of the signal, through the optical connector at one end, can be connected to the traditional electronic connector, and can be easily compatible with the existing device motherboard and peripheral devices.

The optical connector of the prior art has substantially at least one circuit board and an optical carrier, and the circuit board has photoelectric elements. The optical carrier is mounted on a circuit board. The optical carrier is responsible for docking with the fiber optic connector and has a further set of optical lens groups that are capable of aligning the optical fibers of the optical fiber with the optoelectronic component. At present, some optical carriers are integrally formed, such as "OPTICAL ENGINE FOR ACTIVE OPTICAL CABLE" of US Publication No. 2011/0123150, which has a small number of components, easy alignment of optical fibers, and simple assembly process, but its main The shape and the fitting are too singular. After the product is formed, due to the limitation of the injection molding release technology, a set of lens arrays cannot be formed on the side of the fiber end face, thereby causing the beam to diverge, reducing the coupling efficiency and affecting the light transmission and The quality of the reception. Therefore, some optical lens groups are independently produced, and then mounted in the optical carrier alignment frame, and thereby the alignment frame is used to connect the optical fiber connectors. For example, the alignment frame is used to align the lens carrier and the metal. Hoop, this design allows the optical lens assembly and the fiber connector to be separate components, so that the optical lens assembly can produce two sets of matching lens arrays by injection molding technology, achieving ideal coupling efficiency, but the number of components is large, which makes assembly. The process is cumbersome and it takes a lot of time to process the end face grinding of the fiber joint. Furthermore, as the demand for data transmission continues to increase, it is necessary to be able to expand the number of channels that can be transmitted. At present, some optical connectors have adopted two rows of upper and lower optical fiber arrays, which are more complicated in structure and more difficult to assemble.

The main object of the present invention is to provide a high-density optical transceiver module, which is mainly for accurately positioning the components by passive alignment during assembly, thereby reducing the process technology and time required for alignment. And ensure the degree of alignment accuracy of the degree of phase. In addition, through the stackable architecture of the present invention, the number of optical fibers that can be connected can be easily increased, and the number of more transmittable channels can be further expanded to achieve a higher density optical transceiver connection mode.

In order to achieve the above, the present invention mainly includes a circuit substrate, an optical module, and at least one optical fiber receiving platform. The circuit substrate is loaded with a carrier plate for mounting a photoelectric component, and the carrier has At least two positioning holes for engaging and aligning with the positioning posts at the bottom of the optical module, so that the lenses of the optical module can be aligned and coupled with the photoelectric components mounted on the carrier. The optical module comprises an optical lens set and a carrying platform, and the whole body is integrally formed. Hosting platform The top has at least one pair of links. The bottom of the fiber receiving platform has at least one matching rail, and the top has a plurality of positioning slots, and the plurality of positioning slots are used to carry a plurality of optical fibers. The mating rail is complementary to the shape of the mating rail and is slidably engaged. When the fiber receiving platform is pushed and slid to the positioning of the carrying platform, the optical fiber array can be positioned not only on the carrying platform but also through a good optical mechanism. The fiber end face is placed just above the focal point of the lens coupling such that the optical lens assembly aligns the fiber with the optoelectronic component.

In the present invention, the carrier board can form at least two positioning alignment holes by using a high-precision process, and the bottom of the carrier platform forms at least two positioning pillars, and the positioning pillars are embedded in the positioning alignment holes, thereby not only allowing the optical When the module is fixed on the carrier board, the position between the components can be ensured with considerable precision, and the fiber accommodating platform is mounted on the bearing platform by using the track rails, so as to utilize a simple and time-saving passive type. The coupling method achieves the assembly and positioning of each component. In the present invention, the carrier board and the circuit board are made of different materials, for example, materials such as tantalum, ceramics, and metal, but are not limited thereto. A set of alignment marks can be fabricated on the carrier by using a semiconductor process, and the alignment mark can be used as a reference during the packaging process to provide a registration basis for packaging the photovoltaic elements, and the carrier is provided on the carrier. The positioning alignment holes also provide the same function.

The optical fiber accommodating platform of the present invention can be stacked and mounted on the carrying platform of the optical module. If the number of the optical fiber receiving platforms is two, the upper and lower two rows of optical fibers can be connected, and the optical fibers and the optical components are connected. The signals are also coupled through the optical lens group to expand the amount of transmission, and thus can be applied to a variety of optical connectors under the architecture of the present invention to reduce development costs.

The optical module and the optical fiber accommodating platform of the invention are two independent members, and both types can be simply produced by injection molding technology, so that the independent component design can make the optical module not limited by the injection molding technology. With the release of the mold, you can have two sets of lens arrays that match each other. In addition to the coupling efficiency, the independent fiber-optic receiving platform design is also scalable. The optical module and the optical fiber receiving platform are typically made of an optically transparent material such as PMMA, acrylic, but not limited to this material. The utility model has the characteristics of easy production and shape deformation, and the lens profile of the optical lens group in the optical module can be optimized in optical design and easy to be injection-molded, so that the photoelectric element and the optical fiber can reach the most Good coupling efficiency.

The invention will be described in detail below in conjunction with its preferred embodiments and the accompanying drawings. It should be understood by those skilled in the art that the preferred embodiments of the invention are intended to be illustrative only and not limiting. Therefore, the invention may be applied to other embodiments in addition to the preferred embodiments. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

1‧‧‧ circuit substrate

11‧‧‧ Carrier Board

111‧‧‧ Positioning Alignment Hole

12‧‧‧Circuit wiring

13‧‧‧Electronic Control Wafer

131‧‧‧Laser drive wafer

132‧‧‧Transistor amplification chip

14‧‧‧ Gold wire

15‧‧‧Optoelectronic components

151‧‧‧Surface laser array

152‧‧‧Detecting diode array

2‧‧‧Optical module

21‧‧‧Optical lens group

211‧‧‧First lens array

212‧‧‧Second lens array

213‧‧‧Mirror

22‧‧‧Loading platform

221‧‧‧Connected

222‧‧‧ positioning column

23‧‧‧ Cover

3‧‧‧Fiber receiving platform

31‧‧‧ positioning slot

32‧‧‧With rail

33‧‧‧ Pressure plate

34‧‧‧Connected

4‧‧‧Fiber Array

41‧‧‧Fiber

5‧‧‧Metal cover

6‧‧‧Metal lower cover

21A‧‧‧Optical Module

The first figure is an exploded view of the first embodiment of the present invention.

The second figure is a perspective view of a partial cross section of the first embodiment of the present invention.

The third figure is a front view of the optical module of the first embodiment of the present invention.

Figure 4A is a perspective view of the optical fiber carrying platform of the first embodiment of the present invention.

FIG. 4B is a cross-sectional view showing the optical fiber carrying platform loading fiber according to the first embodiment of the present invention.

Fig. 5 is a cross-sectional view showing the operational state of the optical fiber when the optical fiber is actually mounted in the first embodiment of the present invention.

The sixth figure uses an exploded perspective view of the optical transceiver module of the present invention.

Figure 7 is a front elevational view of an optical module in accordance with a second embodiment of the present invention.

Figure 8 is a cross-sectional view showing the operational state of the optical fiber mounted in the second embodiment of the present invention.

As shown in the first figure, a perspective view of the present invention, the optical transceiver module of the present invention includes a circuit a substrate 1, a carrier 11, a group of photovoltaic elements 15, an optical module 2, and at least one fiber receiving platform 3, the optical module 2 and the set of photovoltaic elements 15 are mounted on the carrier 11, the carrier 11 is placed on the circuit board 1 , and the fiber receiving platform 3 is mounted on the optical module 2 .

The circuit board 1 is a printed circuit board in this embodiment, on which a carrier board 11 is mounted, and a circuit wiring 12, an electronic control chip 13, a gold wire 14, and a photovoltaic element 15 are further distributed. The circuit wiring 12 is configured to transmit a high-speed electrical signal between the electronic connector and the electronic control chip 13. The electronic control chip 13 includes a laser driver IC 131 and a transimpedance amplifier chip 132 (Trans) -Impedance Amplifier, TIA). The photo-electric component 15 is disposed on the carrier 11 and includes a one-shot laser array 151 (VCSEL array) and a photodiode array 152 (PD array). The gold wire 14 is electrically connected to the The wafer 13 and the photovoltaic element 15 are electronically controlled. The laser driving chip 131 cooperates with the surface-emitting laser array 151, and the transimpedance amplifying chip 132 cooperates with the light-detecting diode array 152.

In the present embodiment, the carrier 11 and the circuit board 1 are made of different materials, and the material thereof may be a material such as tantalum, ceramic, or metal, but is not limited thereto. The carrier 11 is such that the photovoltaic element 15 and the optical module 2 can be accurately mounted thereto. In this embodiment, a surface of the carrier 11 can be fabricated by using a semiconductor process to form a set of alignment marks. The alignment mark is not shown in the embodiment, and the alignment mark can be packaged on the carrier 11 as the photovoltaic element 15. Positioning benchmark. Furthermore, the carrier board 11 further has at least two positioning alignment holes 111 for cooperating with the positioning posts 222 of the optical module 2. The positioning alignment hole 111 is manufactured based on the alignment mark, thereby reducing the error in alignment with the photoelectric element 15 when the optical module 2 is assembled, thereby transmitting passive alignment during assembly. A comparable optical coupling efficiency can be achieved.

The optical module 2 includes: an optical lens group 21 and a carrying platform 22, which are integrated into one body. forming. The top of the carrying platform 22 has at least one butt rail 221 and the bottom has at least two positioning posts 222. In this embodiment, the number of the butt rails 221 is two, and the shape is a wedge-shaped convex rail, that is, the upper width and the lower narrow design, and is used for splicing the optical fiber receiving platform 3, but the shape is not limited thereto. The number of the positioning posts 222 is four, which are inserted into the positioning alignment holes 111 to accurately fix the optical module 2 on the carrier board 11. As shown in the second figure, the optical lens group 21 includes a first lens array 211, a second lens array 212, and a mirror 213. The first lens array 211 is located at a lower end surface of the optical lens group 21, facing the photoelectric The second lens array 212 is located on the side end surface of the optical lens group 21 and faces the optical fiber receiving platform 3. In this embodiment, the number and the pitch of the lenses of the first and second lens arrays 211 and 212 are the same and correspond one-to-one. As shown in the third figure, the number of lenses in the present embodiment is 12, adjacent. A typical distance between the two lens pitches D is 250 μm, and the mirror 213 has 45. Reflective surface. In this way, when the signal light generated by the surface-emitting laser array 151 of the photovoltaic element 15 is collimated by the first lens array 211, it enters the inside of the optical lens group 21 (as indicated by the direction of the arrow in the second figure). The mirror 213 is rotated by 90° in the direction of travel of the signal light, and then focused by the lens of the second lens array 212 to be coupled into the optical fiber (not shown). On the contrary, the signal light emitted from the end face of an optical fiber also enters the optical lens group 21 through the lens of the second lens array 212, and the direction of the signal light is rotated by 90° via the mirror 213, and finally by the first lens array 211. The lens is focused and coupled into the photodetector array 152 of the optoelectronic component 15. Furthermore, the optical module 2 further includes a cover 23 on the side of the optical lens group 21 for covering the electronic control chip 13 and the gold wire 14 during assembly.

As shown in FIG. 4A and FIG. 4B, respectively, it is an exploded schematic view and an enlarged cross-sectional view of the optical fiber receiving platform 3 of the present invention. In the figure, the fiber array 4 used together is drawn to Learn how it is assembled. The top of the fiber receiving platform 3 has a plurality of positioning slots 31, and the bottom has at least one matching rail 32. The fitting rail 32-shaped body has a wedge-shaped concave rail, that is, a design that is wide and narrow, but the shape is not limited thereto. The adjacent two positioning slots 31 have the same center-to-center spacing, typically 250 μm, for carrying the optical fibers 41 of the fiber array 4. In this embodiment, the number of the positioning slots 31 is 12 for carrying 12 optical fibers, but the number is not limited thereto. In the embodiment, the positioning groove 31 is a V-groove, so that the lateral position of the optical fiber 41 can be automatically and accurately positioned, but is not limited to a V-shaped groove. When the optical fiber 41 of the optical fiber array 4 is placed on the plurality of positioning slots 31, a pressure plate 33 is fixedly applied to the optical fibers 41 that have been placed in the positioning slots 31 to further fix the longitudinal direction of the optical fibers 41. The position is thereafter infiltrated into the gap between the pressure plate 33 and the positioning groove 31 by the viscous capillary, so that the adhesive can completely cover the plurality of optical fibers 41 and fill the pressure plate 33 and the positioning groove 31, and then the adhesive is cured. After that, the members can be bonded to each other. As shown in FIG. 4B, the gap between the number of optical fibers 41 and the positioning groove 31 is the area where the adhesive is distributed. In this embodiment, the two sides of the bottom of the bottom of the fiber receiving platform 3 have a pair of matching rails 32. The shape of the matching rails 32 is a wedge-shaped concave rail, but is not limited thereto. The matching rails 32 are matched with the mating rails 221 of the optical module 2, and the optical fiber receiving platform 3 can be slidably slid into the carrying platform 22 by the butting rails 221, and the end faces of the optical fibers 41 of the optical fiber array 4 are connected. Optical coupling is achieved by the second lens array 212 proximate the optical lens group 21. In addition, the fiber receiving platform 3 has a pair of abutting rails 34 on both sides of the plurality of positioning slots 31. The mating rail 34 is a wedge-shaped rail, but the shape is not limited thereto. The shape of the docking rail 34 corresponds to the mating rail 32. Thus, the present invention can mount a plurality of fiber optic receiving platforms 3 on the loading platform 22 in a stacked configuration.

In the above embodiment, the top of the carrying platform 22 and the top of the optical fiber receiving platform 3 are connected by a matching rail of a convex rail, and the engaging rail of the concave rail of the engaging member of the engaging member is engaged, but not To this end, the docking rail can also be a concave rail, and at this time, the mating rail is a convex rail.

Next, a description will be given of the overall operation of the present invention. As shown in FIG. 5, when the electrical signal fed by the electronic connector is transmitted to the electronic control chip 13 via the circuit wiring 12 of the circuit substrate 1, the laser driving chip is driven. The 131 process generates a driving current to drive the surface-emitting laser array 151 in the photoelectric element 15 to convert the electrical signal into an optical signal, and the upward illumination enters the optical module 2, and the signal light passes through the optical lens group. The lens of the first lens array 211 of 21 becomes a collimated beam, so that the light beam does not diverge, and a light path can be passed inside the optical lens group 21, during which the signal light encounters a 45° mirror 213 The direction of travel of the light is turned parallel to the direction of the carrier 11, and then the lens entering the second lens array 212 converts the collimated beam into a focused beam that is coupled into the end face of the optical fiber 41 and transmitted to the other via the optical fiber 41. The optical connection device at one end receives. On the contrary, the signal light transmitted from the optical connection device at the other end of the optical fiber 41 is collimated via the second lens array 212, then turned downward through the mirror 213, and then coupled into the optoelectronic component 15 via the lens focusing beam of the first lens array 211. The photodiode array 152 converts the received optical signal into a photocurrent through the gold wire 14 and sends it to the transimpedance amplifying chip 132 in the electronic control chip 13 for photocurrent processing to form a differential signal. The circuit wiring 12 is sent to the electronic connector at the back end to take out the signal.

As shown in the sixth figure, the assembly diagram of the high-density optical transceiver module of the present invention is used. When it is desired to be a high-density optical transceiver module, a metal upper cover 5 and a metal lower cover 6 are additionally included. After the two are combined, the space formed therein is for accommodating the circuit substrate 1 and the optical module. 2 and the fiber-receiving platform 3 and the front section of the fiber array 4. The front end of the optical fiber array 4 is fixedly mounted in the optical connector via the optical fiber receiving platform 3, and the optical fiber array 41 is followed by an optical cable. After the optical cable extends for a distance, the optical fiber cable is connected to the other end and has the same high density as the foregoing. Optical transceiver module to form a fiber optic cable Both ends of the line are equipped with a high-density optical transceiver module that can transmit unidirectional or bidirectional active optical cable.

In the above embodiment, the fiber accommodating platform 3 has only one layer. However, with the design of the present invention, a plurality of fiber accommodating platforms 3 may be assembled on the optical module 2 in a stacked manner, thereby forming another layer. A higher density optical transceiver module, and the amount of data transmitted will also grow several times with the number of optical fiber receiving platforms. As shown in the seventh and eighth figures. In the present embodiment, the description is mainly made by using two optical fiber receiving platforms 3, but it is not limited to use only two groups. In the present embodiment, the circuit board 1, the optical module 2, and the optical fiber receiving platform 3 are mainly included. Since the assembly method and the structural principle are the same as those of the first embodiment, only differences will be described below.

In this embodiment, two sets of optical fiber accommodating platforms 3 are used, so that the upper and lower two rows of optical fiber arrays are disposed on the optical fiber accommodating platform 3, so the shape of the optical module 2 is somewhat different, and the difference lies in The optical lens group 21A includes two sets of first lens arrays 211, two sets of second lens arrays 212, and a mirror 213. The second lens arrays 212 are arranged in a vertical row, and the first lens arrays 211 are laterally arranged side by side. The number and position of each row of lenses are one-to-one corresponding to the lenses of the other lens array. In contrast, the carrier 11 of the circuit substrate 1 has two rows of photovoltaic elements 15, each of which corresponds to a first lens array 211. In this embodiment, one of the rows is a surface-emitting type of lightning. The array 151 is arrayed, and the other row is the light-detecting diode array 152, but the arrangement is not limited thereto.

The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to impose any form of limitation on the present invention, and any modification or alteration relating to the present invention made in the spirit of the same invention. They should still be included in the scope of this creative intent.

1‧‧‧ circuit substrate

11‧‧‧ Carrier Board

111‧‧‧ Positioning Alignment Hole

12‧‧‧Circuit wiring

13‧‧‧Electronic Control Wafer

131‧‧‧Laser drive wafer

132‧‧‧Transistor amplification chip

14‧‧‧ Gold wire

15‧‧‧Optoelectronic components

151‧‧‧Surface laser array

152‧‧‧Detecting diode array

2‧‧‧Optical module

21‧‧‧Optical lens group

22‧‧‧Loading platform

221‧‧‧Connected

222‧‧‧ positioning column

3‧‧‧Fiber receiving platform

32‧‧‧With rail

34‧‧‧Connected

Claims (14)

A high-density optical transceiver module includes: a circuit substrate on which a carrier board is mounted, the carrier board is provided with a photoelectric component; an optical module includes an optical lens group and a carrier platform, and the whole system is Integrally formed, the top of the carrying platform has at least one butt rail, the optical module is mounted on the carrier, and the optical lens assembly is aligned with the photoelectric component; at least one optical fiber receiving platform has at least a bottom portion And a plurality of positioning slots, wherein the plurality of positioning slots are configured to carry the positioning fiber array, the matching rails are complementary in shape and slidingly engaged, and the fiber receiving platform is coupled to the carrier At the time of the platform, the positions of the two are also accurately positioned to align the coupled fiber array with the optoelectronic components on the carrier through the optical lens assembly. The high-density optical transceiver module according to claim 1, wherein when the top surface of the carrying platform is a butt rail, the bottom of the optical fiber receiving platform is a concave rail. . The high-density optical transceiver module according to claim 1, wherein when the top surface of the carrying platform is a butt rail, the bottom of the optical fiber receiving platform is a convex rail at the bottom of the supporting rail. . The high-density optical transceiver module of claim 1, wherein the optical module further comprises a cover body integrally formed with the optical lens assembly and the carrying platform. The high-density optical transceiver module of claim 1, wherein the carrier has at least two positioning alignment holes, and the bottom of the optical module has at least two positioning posts, and the positioning alignment is embedded in the positioning alignment column. In the hole, the position of the optical module is accurately fixed on the carrier. The high-density optical transceiver module of claim 1, wherein the carrier board and the circuit board are made of different materials, and the material is at least one of tantalum, ceramic, and metal. The high-density optical transceiver module of claim 1, wherein the photovoltaic component comprises at least one of a surface-emitting laser diode array and at least one of the light-detecting diode arrays. The high-density optical transceiver module according to claim 7, wherein the circuit substrate is provided with a laser driving chip and a transimpedance amplifying chip, and respectively, and a surface-emitting laser array and a check on the carrier board The photodiode arrays are corresponding to each other and electrically connected, wherein the laser driving chip is responsible for driving the surface-emitting laser array, and the transimpedance amplifying chip is configured to receive the photocurrent generated by the photodetector array and generate a differential Telecommunications signal. The high-density optical transceiver module of claim 1, wherein the optical lens group comprises at least a first group of lens arrays, at least a second group of lens arrays, and a mirror, the first The lens array is located on the bottom surface of the optical lens group facing the photoelectric element on the carrier plate; the second lens array is located on the side of the optical lens group facing the optical fiber carried by the optical fiber receiving platform. The two single mirrors corresponding to each other in the first lens array and the second lens array have their optical axes perpendicular to each other, and the intersection is located at the mirror. The high-density optical transceiver module of claim 1, wherein the fiber-receiving platform further has a pressure plate, wherein the pressure plate is located on the fiber array when the plurality of positioning slots carry the fiber array. The high-density optical transceiver module of claim 1, wherein the optical fiber receiving platform has at least one butt rail in addition to the plurality of positioning slots, and the bottom of the fiber receiving platform is matched. When the rail is a concave rail, the top butt rail is a convex rail, and when the bottom of the optical fiber receiving platform is a convex rail, the top butt rail is a concave rail. The high-density optical transceiver module according to claim 11, wherein when the plurality of optical fiber receiving platforms are plural, the upper and lower stacking structures are adopted, that is, the optical fiber receiving platform located above is matched by the bottom thereof. The rail is connected to the docking rail at the top of the fiber receiving platform. The high-density optical transceiver module of claim 12, wherein the optical lens group comprises an array of a first group of lens arrays, an array of second group of lens arrays, and a mirror, wherein the optical fiber receiving platform is plural At the same time, the number of the first group of lens arrays and the second group of lens arrays of the optical lens group is also the same as the number of the fiber receiving platforms, and the first group of transparent arrays of the multiple arrays are laterally side by side, and the second array of the second array The group of lenses are taken side by side. The high-density optical transceiver module of claim 13, wherein the first group of lens arrays is plural, and the carrier board also has a relative number of photovoltaic elements.