TWI812985B - Mask for forming oled picture element and template for supporting mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method for manufacturing an OLED pixel forming mask, a mask supporting template, and a frame-integrated mask. A mask for OLED pixel formation according to the present invention is supported by a mask support template and attached to a frame, wherein the mask includes a mask unit formed with a plurality of mask patterns and a dummy portion around the mask unit, The mask has a pair of long sides and a pair of short sides. On any straight line parallel to the long or short sides of the mask, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is compared to In the mask using the predetermined design value, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is 0.1 μm to 20.0 μm larger.

Description

Method for manufacturing OLED pixel formation mask, mask support template and frame-integrated mask

Field of invention

The present invention relates to a method for manufacturing an OLED pixel forming mask, a mask supporting template, and a frame-integrated mask. More specifically, the present invention relates to a device that can stably support and move a mask without deformation and improve positioning accuracy by reducing the deformation of the mask when attaching the mask to a frame, thereby enabling accurate alignment. A method for manufacturing an OLED pixel forming mask, a mask support template, and a frame-integrated mask for each mask.

Background of the invention

As a technology for forming pixels in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used. This method attaches a metal mask (Shadow Mask) in the form of a thin film to the substrate and places it where required. Evaporate organic matter on the position.

In the existing OLED manufacturing process, after the mask is manufactured into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel evaporation frame and used. One mask can have multiple cells corresponding to one display. In addition, in order to manufacture large-area OLEDs, multiple masks can be fixed to the OLED pixel evaporation frame. During the process of fixing to the frame, each mask is stretched to become flat. Adjusting the tensile force to flatten an entire portion of the mask is a very difficult task. In particular, in order to align a mask pattern with a size of several to tens of μm while flattening each unit, it is necessary to perform the following difficult operations: finely adjusting the tensile force applied to each side of the mask and checking in real time. Alignment status.

Nevertheless, in the process of fixing multiple masks to a frame, there is still a problem of poor alignment between masks and between mask units. In addition, during the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem that the mask sag or twist due to the load; wrinkles and burrs are generated in the welded parts during the welding process. (burr), etc., causing misalignment of the mask unit, etc.

Among ultra-high-definition OLEDs, the existing QHD picture quality is 500-600PPI (pixels per inch, pixels per inch), and the pixel size reaches about 30-50 μm, while 4K UHD and 8K UHD high-quality pictures have higher Resolutions of ~860PPI, ~1600PPI, etc. In this way, considering the pixel size of ultra-high-definition OLEDs, the alignment error between units needs to be reduced to about a few μm. Exceeding this error will lead to product defects, so the yield may be extremely low. Therefore, there is a need to develop technology that can prevent deformation such as sagging or twisting of the mask and achieve accurate alignment, as well as technology that can fix the mask to the frame.

[Technical Issue]

Therefore, the present invention has been proposed in order to solve the various problems of the prior art as described above, and its object is to provide a mask that can be stably supported and moved without deformation, and can prevent the mask from deforming such as sagging or twisting. A method for manufacturing an integrated mask, a mask support template, and a frame for forming OLED pixels that can be accurately aligned.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that can significantly shorten the manufacturing time and significantly improve the productivity. [Technical solution]

The above object of the present invention is achieved by a mask for forming OLED pixels, which is supported by a mask supporting template and attached to a frame, wherein the mask includes a mask formed with a plurality of mask patterns. The mask unit and the dummy part around the mask unit, the mask has a pair of long sides and a pair of short sides, on any straight line parallel to the long side or short side of the mask, from the mask pattern arranged at one end to the The distance of the mask pattern at the other end is 0.1 μm to 20.0 μm larger than the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end in the mask using the predetermined design value.

When the mask is divided into three equal areas along the long side, any straight line is extended in each area in a direction perpendicular to the long side, and any straight line is drawn from the mask pattern arranged at one end to the mask pattern arranged at the other end. The average distance of the mold pattern is set to A. When the mask is divided into three equal areas along the short side direction, any straight line is extended in the direction perpendicular to the short side in each area, and any straight line is arranged from one end to the other. The average distance from the mask pattern to the mask pattern arranged at the other end is set to B. In the case of using a mask with a predetermined design value, when the mask is equally divided into three areas along the length direction, in each area Make any straight line extend in the direction perpendicular to the long side, set the average distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end to be C, and divide the mask equally along the short side direction. When there are three areas, extend any straight line in the direction perpendicular to the short side in each area, and set the average distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end as D , at this time the values of A-C and B-D can be positive numbers respectively.

The values of A-C may range from 0.1 μm to 20.0 μm, and the values of B-D may range from 0.1 μm to 15.0 μm.

The thermal expansion coefficient of the mask may be at least greater than 1, and the thermal expansion coefficient of the template may be less than 1 (greater than 0).

A mask for OLED pixel formation supported by a mask supporting template can be manufactured by the following steps: (a) preparing a template with a temporary adhesive portion formed on one side; (b) raising the process temperature to a point where the adhesive strength of the temporary adhesive portion becomes 0 to a temperature of 5kgf/ ^cm2 and contact the mask metal film to the template; (c) lower the process temperature to a temperature such that the bonding strength of the temporary bonding part is at least greater than 5kgf/ ^cm2 and bond the mask metal film to the template ; (d) Lower the process temperature to normal temperature; (e) Manufacture the mask by forming a mask pattern on the mask metal film.

Step (d) may include the following steps: (d1) lowering the process temperature to lower than normal temperature; (d2) lowering the process temperature to normal temperature.

In step (b), the process temperature can be raised to 110°C to 200°C, and in step (c), the process temperature can be lowered to lower than the process temperature of step (b) and higher than normal temperature.

In step (b), the mask metal film extends further to the side than the template when there is no adhesive force between it and the template. In step (c), the mask metal film adheres to the template in an extended state.

As the process temperature in step (b) increases, the mask metal film can be bonded and fixed to the template in a state of greater extension.

In addition, the object of the present invention can be achieved by a mask for forming OLED pixels, which is supported by a mask supporting template and attached to the frame, wherein the mask includes a mask formed with a plurality of mask patterns The mask unit and the dummy part around the mask unit, the mask has a pair of long sides and a pair of short sides, on any straight line parallel to the long side or short side of the mask, from the mask pattern arranged at one end to The distance of the mask pattern arranged at the other end is 0.1 μm to 20.0 μm larger than the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end in the mask manufactured by the steps of Specifically: (1) Prepare a template with a temporary adhesive portion formed on one side; (2) Raise the process temperature to a temperature where the temporary adhesive portion at least adheres to the mask metal film and the template, and bond the mask metal film to the template; ( 3) Lower the process temperature to normal temperature; (4) Manufacture the mask by forming a mask pattern on the mask metal film.

The mask includes a mask unit formed with a plurality of mask patterns and a dummy portion around the mask unit. The mask has a pair of long sides and a pair of short sides. When the mask is equally divided into three areas along the long side. , extend any straight line in the direction perpendicular to the long side in each area, set the average distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end to be A, and set the mask along the When the short side direction is divided into three equal regions, any straight line in each area is extended in a direction perpendicular to the short side, and the distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end is The average value is set to B. For the following steps: (1) Prepare a template with a temporary adhesive portion formed on one side; (2) Raise the process temperature to a temperature where the temporary adhesive portion at least adheres to the mask metal film and the template and place the mask The metal film is bonded to the template; (3) the process temperature is lowered to normal temperature; (4) the mask is manufactured by forming a mask pattern on the mask metal film; in the case of the manufactured mask, the mask is placed along the long side direction, etc. When divided into three areas, any straight line is extended in the direction perpendicular to the long side in each area, and the average distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end is set to C. When the mask is divided into three equal areas along the short side, extend any straight line in each area in a direction perpendicular to the short side, and extend any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end. The average distance of the mask pattern is set to D. At this time, the values of A-C and B-D can be positive numbers respectively.

In addition, the above object of the present invention is achieved by a mask supporting template, which is used to support the OLED pixel forming mask and correspond the mask to the frame. The mask supporting template includes: a template; a temporary adhesive portion, formed on the template; and a mask, which is bonded to the template by sandwiching a temporary adhesive portion and formed with a plurality of mask patterns, and the mask includes a mask unit formed with a plurality of mask patterns and a mask unit around the mask unit. Dummy part, the mask has a pair of long sides and a pair of short sides, on any straight line parallel to the long side or short side of the mask, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end Compared with a mask using predetermined design values, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is 0.1 μm to 20.0 μm larger.

In addition, the object of the present invention can be achieved by a mask support template, which is used to support the OLED pixels formed with a mask and correspond the mask to the frame. The mask support template includes: a template; a temporary an adhesive portion formed on the template; and a mask, which is bonded to the template by interposing a temporary adhesive portion and formed with a plurality of mask patterns, and the mask includes a mask unit formed with a plurality of mask patterns and a mask The dummy part around the mold unit. The mask has a pair of long sides and a pair of short sides. On any straight line parallel to the long or short sides of the mask, from the mask pattern arranged at one end to the mask arranged at the other end. The distance of the mold pattern is 0.1 μm to 20.0 μm larger than the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end in the mask manufactured by the following steps, specifically: (1) Prepare a template with a temporary adhesive portion formed on one side; (2) Raise the process temperature to a temperature where the temporary adhesive portion at least adheres to the mask metal film and the template and bond the mask metal film to the template; (3) Lower the process temperature to normal temperature; (4) The mask is manufactured by forming a mask pattern on the mask metal film.

In addition, the above object of the present invention is achieved by a method for manufacturing a frame-integrated mask, which is integrally formed by at least one mask and a frame for supporting the mask, wherein the method may include the following steps: (a) loading the mask support template described in claim 12 or 13 onto a frame having at least one mask unit area, and corresponding the mask to the mask unit area of the frame; and (b) attaching the mask onto the frame. [beneficial effect]

According to the present invention having the above-mentioned structure, the mask can be supported and moved stably without deformation, and the mask can be prevented from deformation such as sagging or twisting and can be accurately aligned.

In addition, according to the present invention, the manufacturing time can be significantly shortened and the productivity can be significantly improved.

Detailed implementation

The present invention will be described in detail below with reference to the accompanying drawings, which illustrate examples of specific embodiments in which the invention can be implemented. These embodiments are described in detail to fully enable those skilled in the art to practice the invention. The various embodiments of the invention are to be understood as being different from each other but not mutually exclusive. For example, the specific shapes, structures, and characteristics described herein may be used to implement one embodiment into other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the position or arrangement of individual components in each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to limit the present invention. As long as it can be properly explained, the scope of the present invention is limited only by the appended patent scope and all scopes equivalent thereto. Similar reference numerals in the drawings refer to the same or similar functions in various aspects. For convenience, the length, area, thickness, etc. and their shapes may also be exaggerated.

In order to enable those skilled in the art to easily implement the present invention, preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Figure 1 is a schematic diagram of the existing process of attaching a mask to a frame.

The existing mask 10 is a stick-type or a plate-type. The stick-type mask 10 in Figure 1 can be used by welding and fixing both sides of the strip to the OLED pixel evaporation frame. The body (or mask film 11) of the mask 10 has a plurality of display units C. One unit C corresponds to one display of a smartphone or the like. A pixel pattern P is formed in the cell C so as to correspond to each pixel of the display.

Referring to FIG. 1( a ), tensile force F1 - F2 is applied along the long axis direction of the strip mask 10 , and the strip mask 10 is loaded on the square frame 20 in an unfolded state. The cells C1 - C6 of the strip mask 10 will be located in the blank area inside the frame 20 .

Referring to (b) of FIG. 1 , alignment is performed while finely adjusting the tensile force F1 - F2 applied to each side of the strip mask 10 , and then a part of the side surface of the strip mask 10 is welded to make the strip mask 10 and frame 20 are connected to each other. (c) of FIG. 1 shows a side section of the strip mask 10 and the frame connected to each other.

Despite fine-tuning the tensile forces F1 - F2 applied to each side of the strip mask 10 , the problem of poor alignment of the mask units C1 - C3 with each other still occurs. For example, the distances between the patterns P of the cells C1 to C6 are different from each other or the patterns P are skewed. Since the stripe mask 10 has a large area including a plurality of cells C1 to C6 and has a very thin thickness of several tens of μm, it is prone to sagging or distortion due to load. In addition, it is a very difficult task to instantly confirm the alignment status between the units C1 to C6 through a microscope while adjusting the tensile force F1 to F2 so that all units C1 to C6 are flattened. However, in order to avoid the negative impact of the mask pattern P with a size of several μm to tens of μm on the pixel process of ultra-high-definition OLED, the alignment error is preferably no more than 3 μm. The alignment error between such adjacent units is called pixel position accuracy (PPA).

Furthermore, each strip mask 10 is connected to a frame 20 respectively, and at the same time, the alignment state between the multiple strip masks 10 and between the multiple units C-C6 of the strip mask 10 is accurately It is a very difficult operation and will only increase the process time based on alignment, thus becoming an important reason for reducing production efficiency.

In addition, after the strip mask 10 is connected and fixed to the frame 20 , the tensile force F1 - F2 applied to the strip mask 10 will act in reverse on the frame 20 . This tension may cause slight deformation of the frame 20, and may cause distortion of the alignment between the plurality of units C-C6.

In view of this, the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 and the frame 200 to form an integrated structure. The mask 100 integrated with the frame 200 can not only prevent deformation such as sagging or twisting, but also can be accurately aligned with the frame 200 .

FIG. 2 is a front view [FIG. 2(a)] and a side cross-sectional view [FIG. 2(b)] of a frame-integrated mask according to an embodiment of the present invention.

Although this specification describes the configuration of the frame-integrated mask, the structure and manufacturing process of the frame-integrated mask can be understood to include the entire contents of Korean Invention Patent Application No. 2018-0016186.

Referring to FIG. 2 , the frame-integrated mask may include multiple masks 100 and a frame 200 . In other words, the plurality of masks 100 are respectively attached to the frame 200 . In the following, for convenience of explanation, the quadrangular mask 100 will be described as an example. However, before the mask 100 is attached to the frame 200, it may be in the shape of a strip mask with protrusions for clamping on both sides, and the mask 100 may be attached to the frame. 200 can be used to remove the protrusions.

A plurality of mask patterns P are formed on each mask 100, and one cell C can be formed on one mask 100. One mask unit C can correspond to one display of a smartphone or the like.

The mask 100 may also be made of invar, super invar, nickel (Ni), nickel-cobalt (Ni-Co), or other materials. The mask 100 may use a metal sheet produced by a rolling process or electroforming.

The frame 200 may be formed in a form in which a plurality of masks 100 are attached. Considering thermal deformation, the frame 200 is preferably formed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc. that have the same thermal expansion coefficient as the mask. The frame 200 may include a substantially quadrangular or square frame-shaped edge frame portion 210 . The inside of the edge frame part 210 may be hollow.

In addition, the frame 200 is provided with a plurality of mask unit areas CR, and may include a mask unit sheet portion 220 connected to the edge frame portion 210 . The mask unit sheet part 220 may be composed of an edge sheet part 221 and a first grid sheet part 223 and a second grid sheet part 225 . The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are portions divided on the same sheet, and they are integrated with each other.

The thickness of the edge frame part 210 may be greater than the thickness of the mask unit sheet part 220, and may be formed with a thickness of several mm to several tens of centimeters. Although the thickness of the mask unit sheet portion 220 is thinner than that of the edge frame portion 210 , it is thicker than the mask 100 , and may be approximately 0.1 mm to 1 mm thick. The widths of the first grid sheet part 223 and the second grid sheet part 225 may be about 1-5 mm.

In the planar sheet, in addition to the areas occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit areas CR (CR11-CR56) may be provided.

The mask 200 includes a plurality of mask unit areas CR, and each mask 100 can be attached so that each mask unit C corresponds to each mask unit area CR. The mask unit C corresponds to the mask unit region CR of the frame 200, and part or all of the dummy portion may be attached to the frame 200 (mask unit sheet portion 220). Therefore, the mask 100 and the frame 200 may form an integrated structure.

Figure 3 is a schematic diagram of a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask unit C in which a plurality of mask patterns P are formed and a dummy portion DM around the mask unit C. The mask 100 can be manufactured using a metal sheet produced by a rolling process, electroforming, etc., and one unit C can be formed in the mask 100 . The dummy portion DM corresponds to a portion of the mask film 110 (mask metal film 110) other than the cell C, and may include only the mask film 110, or may include a predetermined dummy portion pattern formed with a shape similar to the mask pattern P Mask film 110. The dummy part DM corresponds to the edge of the mask 100 and part or all of the dummy part DM may be attached to the frame 200 (mask unit sheet part 220).

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 is provided with a plurality of mask unit areas CR (CR11-CR56), it may also be provided with a plurality of masks 100 having mask units corresponding to each mask unit area CR (CR11-CR56). C(C11-C56).

Referring to (a) of Figure 4, a template 50 (template) may be provided. The template 50 is a medium to which the mask 100 is attached on one side and moves the mask 100 while supporting the mask 100 . One side of the template 50 is preferably a flat surface to support and transport the flat mask 100 . The central part 50a may correspond to the mask unit C of the mask metal film 110, and the edge part 50b may correspond to the dummy part DM of the mask metal film 110. In order to support the mask metal film 110 as a whole, the template 50 has a flat shape with an area larger than the mask metal film 110 .

In order that the laser L irradiated from the upper part of the template 50 can reach the welding part WP (area where welding is performed) of the mask 100 , a laser passage hole 51 may be formed in the template 50 . The laser passage holes 51 can be formed on the template 50 in a manner corresponding to the position and number of the welding portions WP. Since the plurality of welding portions WP are arranged at predetermined intervals on the edge of the mask 100 or the dummy portion DM portion, a plurality of laser passage holes 51 may be formed at predetermined intervals accordingly. As an example, since a plurality of welding portions WP are arranged at predetermined intervals on both sides (left/right side) of the dummy portion DM portion of the mask 100 , the laser passage hole 51 may also be provided on both sides (left/right side) of the template 50 ) are formed into multiple at predetermined intervals.

The position and number of the laser passage holes 51 do not necessarily correspond to the position and number of the welding portions WP. For example, only part of the laser passage hole 51 may be irradiated with the laser L to perform welding. In addition, the portion of the laser passage hole 51 that does not correspond to the welding portion WP can also be used as an alignment mark when aligning the mask 100 and the template 50 . If the material of the template 50 is transparent to the laser L, the laser passage hole 51 does not need to be formed.

A temporary bonding portion 55 can be formed on one side of the template 50 . Before the mask 100 is attached to the frame 200 , the temporary adhesive portion 55 allows the mask 100 (or the mask metal film 110 ) to be temporarily attached to one side of the template 50 and supported on the template 50 .

The temporary adhesive portion 55 may use an adhesive detachable by heating or an adhesive detachable by UV irradiation.

As an example, the temporary adhesive portion 55 may use liquid wax. The liquid wax can use the same wax used in the polishing step of a semiconductor wafer, etc., and its type is not particularly limited. As a resin component mainly used to control adhesion, impact resistance, etc. related to maintaining force, liquid wax can include substances and solvents such as acrylic acid, vinyl acetate, nylon and various polymers. As an example, SKYLIQUIDABR-4016 including Acrylonitrile butadiene rubber (ABR) as a resin component and n-propanol as a solvent component can be used for the temporary adhesive portion 55 . A spin coating method is used to form liquid wax on the temporary bonding portion 55 .

The viscosity of the temporary adhesive portion 55 as liquid wax decreases at temperatures above 85°C to 100°C, and increases at temperatures below 85°C, and a part of it is solidified, so that the mask metal film 110 can be Fixed and glued to the template 50.

Next, referring to (b) of FIG. 4 , the mask metal film 110 can be bonded to the template 50 . The liquid wax can be heated to above 85° C., and the mask metal film 110 is brought into contact with the template 50 , and then the mask metal film 110 and the template 50 are passed between rollers for bonding.

According to one embodiment, the template 50 is baked at approximately 120° C. for 60 seconds to vaporize the solvent in the temporary bonding portion 55 , and the mask metal film lamination process can be performed immediately thereafter. Lamination is performed by loading the mask metal film 110 on the template 50 having the temporary adhesive portion 55 formed on one side and passing it between an upper roll at about 100°C and a lower roll at about 0°C. As a result, the mask metal film 110 can be in contact with the template 50 with the temporary adhesive portion 55 interposed therebetween.

After the mask metal film 110 is bonded to the template 50 , one side of the mask metal film 110 may also be planarized. The thickness of the mask metal film 110 produced by the rolling process can be reduced through the planarization process. In addition, the mask metal film 110 produced through the electroforming process can also be subjected to a planarization process to control its surface characteristics and thickness. In addition, before bonding the mask metal film 110 to the template 50 , a planarization process can also be performed on the mask metal film 110 . The thickness of the mask metal film 110 may be approximately 5 μm to 20 μm.

In addition, when forming the mask metal film by etching the mask metal film 110, the etching liquid should be prevented from entering the interface between the mask metal film 110 and the temporary bonding portion 55 to damage the temporary bonding portion 55/template 50, thereby causing the mask pattern P etching error. Therefore, in a state where the first insulating portion 23 is formed on one side of the mask metal film 110 , the mask metal film 110 is bonded to the upper surface of the template 50 . That is, the surface of the mask metal film 110 on which the first insulating portion 23 is formed may face the upper surface of the template 50 . The mask metal film 110 and the template 50 can be bonded to each other by sandwiching the first insulating portion 23 and the temporary bonding portion 55 .

The first insulating portion 23 can be formed on the mask metal film 110 by a printing method or the like using a photoresist material that is not etched by the etching liquid. In addition, in order to maintain a circular shape after multiple wet etching processes, the first insulating portion 23 may include at least any one of a curable negative photoresist and a negative photoresist containing epoxy resin. As an example, it is preferable to use epoxy resin-based SU-8 photoresist or black matrix photoresist (black matrix) to achieve baking in the temporary bonding part 55 and the second insulating part 25 (refer to FIG. 5 (c)) etc. are solidified together during the process.

Due to the material characteristics of the first insulating portion 23, even if multiple subsequent etching processes are performed after the second insulating portion 25 is formed (see FIG. 5(c)), it will not be dissolved by the etching liquid. If the first insulating portion 23 does not exist, the etching liquid can enter between the damaged temporary adhesive portion 55 and the interface of the mask metal film 110, which will further etch the lower part of the first mask pattern P, thereby causing pattern size formation. Problems with excessively large or locally irregular defects. As the present invention further interposes the first insulating portion 23 , in the process of forming the mask pattern P using multiple processes, even if the mask metal film 110 is penetrated, the pattern width will not further expand, so that the insulating portion 25 can be maintained. pattern width.

Although the first insulating portion 23 and the temporary bonding portion 55 are illustrated as being formed on the upper surface of the template 50 , they may be formed on the lower surface of the mask metal film 110 instead. In addition, a first insulating part 23 and a temporary bonding part 55 may be formed on the template 50 and the mask metal film 110 respectively.

Then, referring to (c) of FIG. 5 , the patterned insulating portion 25 (second insulating portion 25 ) may be formed on the mask metal film 110 . The insulating portion 25 can be formed of photoresist using a printing method or the like.

Next, the mask metal film 110 may be etched. Methods such as dry etching and wet etching can be used without limitation. As a result of etching, the portion of the mask metal film 110 exposed by the blank space 26 between the insulating portions 25 can be etched away. The etched portion of the mask metal film 110 forms the mask pattern P, so that the mask 100 in which a plurality of mask patterns P is formed can be manufactured.

Then, referring to (d) of FIG. 5 , the manufacturing of the template 50 supporting the mask 100 can be completed by removing the insulating portion 25 (second insulating portion).

In addition, although (d) of FIG. 5 illustrates the process of forming the mask pattern P after bonding the mask metal film 110 to the template 50, the process is not limited to this and can be formed by (a) and (b) of FIG. 4 The mask 100 with the mask pattern P (refer to FIG. 3 ) is bonded to the template 50 , thereby completing the manufacturing of the template 50 for supporting the mask 100 .

Since the frame 200 has a plurality of mask unit areas CR (CR11-CR56), it may also have a plurality of masks 100 having mask units corresponding to each mask unit area CR (CR11-CR56). C(C11-C56). Furthermore, there may be a plurality of templates 50 for respectively supporting each of the plurality of masks 100 .

FIG. 6 is a schematic diagram illustrating problems that exist when the thermal expansion coefficient of the template is higher than that of the mask according to the comparative example.

Referring to (a) of FIG. 6 , the process temperature of the space where the bonding process of the mask metal film 110 (or the mask 100 ) and the template 50 ′ is performed is raised to a temperature T1 higher than normal temperature. The process temperature T1 may be 85°C to 100°C, which reduces the viscosity of the temporary bonding portion 55 . Next, the solvent in the temporary bonding portion 55 is vaporized by baking, and the mask metal film 110 is bonded to the template 50'. Then, the process temperature can be lowered to a temperature T2 that increases the viscosity of the temporary bonding portion 55 and allows a part of it to solidify.

In the past, glass, borosilicate glass, etc. were used as the material of the template 50'. Among them, BOROFLOAT®33, which is ^a borosilicate glass, has a thermal expansion coefficient of about ^3.3 The difference in thermal expansion coefficient of the film 110 is small, and the mask metal film 110 is easy to control, so it is often used.

The thermal expansion coefficient of the template 50' is higher than that of the mask metal film 110. When the temperature T2 is lowered as shown in FIG. 'The degree of relative shrinkage L1 (L1>L2) is large. At the same time, the template 50' and the mask metal film 110 are firmly adhered and fixed with the temporary adhesive portion 55 interposed therebetween, and the mask metal film 110 is exerted a shrinkage force CT that is greater than the original shrinkage degree L2. . The force CT to shrink more is generated because the template 50' shrinks to a greater extent L1 than the mask metal film 110 shrinks to a level L2. Therefore, the mask metal film 110 is adhered to the template 50' in a state where the compressive force CT in the side direction (inside of the mask metal film 110) is applied.

If the thermal expansion coefficient of the template 50' is higher than that of the mask 100 (or the mask metal film 110), the following problems may occur.

Referring to (b) of FIG. 6 , the template 50 ′ of (a) of FIG. 6 is loaded onto the frame 200 (or the edge sheet part 221 , the first grid sheet part 223 and the second grid sheet part 225 ). Thereby corresponding to the mask 100, and welding beads WB are formed by welding, so that the mask 100 can be attached to the frame 200.

Additionally, the template 50' can be detached from the mask 100. However, when the template 50' is separated from the mask 100, the compressive force CT applied to the mask 100 is released, thereby causing the alignment state of the mask 100 to be disrupted. In other words, there is a problem that the mask 100 cannot be attached to the frame 200 with both sides of the mask 100 being pulled tightly toward the outside, but is attached to the frame 200 in a wrinkled or sagging state. This will cause product defects based on alignment errors of the mask 100, PPA errors between cells C, etc.

Therefore, the template 50 of the present invention has a thermal expansion coefficient lower than that of the mask 100 (or the mask metal film 110).

7 is a schematic diagram of the interface state between the mask and the template and the state of the mask attached to the frame when the thermal expansion coefficient of the template is lower than that of the mask according to an embodiment of the present invention.

Referring to FIG. 7(a) , as shown in FIG. 6(a) , the process temperature of the space where the process is performed is raised to a temperature T1 higher than the normal temperature, and the mask metal film 110 (or the mask on which the pattern P is formed is 100) Glued to template 50. Then, the process temperature can be lowered to a temperature T2 that increases the viscosity of the temporary bonding portion 55 and allows a part of it to solidify.

The mask metal 110 (or the mask 100) is made of Invar alloy, super Invar alloy, nickel, nickel-cobalt and other materials with a thermal expansion coefficient at least greater than 1. On the contrary, the thermal expansion coefficient of the template 50 may be less than 1 (greater than 0). Preferably, the template 50 may be made of quartz material with a thermal expansion coefficient of 0.55, but is not limited thereto.

Since the thermal expansion coefficient of the template 50 is lower than that of the mask metal film 110 , when the temperature T2 is lowered as shown in FIG. 7( a ), the template 50 hardly shrinks or shrinks to a relatively smaller extent than the mask metal film 110 . Although the degree of shrinkage of the mask metal film 110 [the degree of shrinkage L2 in FIG. 7(a) ] is relatively large, it cannot shrink because it is firmly adhered and fixed to the template 50 with the temporary adhesive portion 55 interposed therebetween. And is exerted an internal force IT to shrink. In other words, the mask metal film 110 is exerted a tensile force IT in the side direction and is adhered to the template 50 in a tight state.

Referring to FIG. 7( b ), the template 50 is loaded onto the frame 200 (or the edge sheet part 221 , the first grid sheet part 223 and the second grid sheet part 225 ) in the state of FIG. 6( a ). Thereby corresponding to the mask 100, and welding beads WB are formed by welding, so that the mask 100 can be bonded to the frame 200.

Additionally, the template 50 can be separated from the mask 100 . However, when the template 50' is separated from the mask 100, the tensile force IT applied to the mask 100 is released and converted into a tension TS that tightens both sides of the mask 100. In other words, this state is a state in which the mask 100 is pulled to a length longer than the original length at the lowered temperature T2 and then bonded to the template 50. Since the mask 100 is welded and bonded to the frame 200 as it is in this state, Therefore, the pulled state (the state in which it exerts tension TS on the surrounding mask unit sheet portion 220) can be maintained. The mask 100 is attached to the frame 200 in a taut and pulled state, so that wrinkles, deformation, etc. do not occur. Therefore, there is an effect of reducing the alignment error of the mask 100 and the PPA error between the cells C.

FIG. 8 is a schematic diagram of the extended state of the mask metal film 110 and the template 50 in response to process temperature changes according to an embodiment of the present invention.

In addition, as shown in FIG. 7 , although the thermal expansion coefficient of the template 50 is set to be lower than that of the mask metal film 110 , an internal force IT (or a tensile force IT) can be applied to the mask metal film 110 (or the mask 100 ). ), however, the temperature raised in order to bond the mask metal film 110 to the template 50 is 85-100°C. Within this range, the difference in thermal expansion between the template 50 and the mask metal film 110 is not large, and during temporary bonding Since the adhesive strength of the portion 55 is sufficiently high, there is a limitation that the tensile force IT contained in the mask metal film 110 is not large.

Therefore, a feature of the present invention is that, as shown in FIG. 8 , compared with the embodiment of FIG. 7 , the process temperature is further controlled to further stretch the mask metal film 110 or further increase the tensile force IT. In FIG. 8(a) , in order to compare the expansion and contraction degrees of the mask metal film 110 and the template 50 , their initial lengths are the same, but the initial length of the template 50 may be greater than or equal to the mask metal film 110 .

Referring to (a) of FIG. 8 , the template 50 and the mask metal film 110 (or the mask 100 in which the mask pattern P is formed) are prepared at a room temperature (RT) of about 25° C. The first insulating part 23 and the temporary bonding part 50 may be formed on one side of the template 50 or/and the mask metal film 110 .

Next, referring to (b) of FIG. 8 , the process temperature can be increased to a first process temperature TS1 at which the push-pull strength of the temporary bonding portion 55 becomes 0 to 5 kgf/cm ² . The first process temperature TS1 may be approximately 110-200°C. When the temporary bonding portion 55 is 0 to 5 kgf/cm ² at the first process temperature TS1 , the temporary bonding portion 55 is equivalent to a state in which the temporary bonding portion 55 has no adhesive force capable of bonding the mask metal film 110 and the template 50 . That is, it is difficult to adhere the mask metal film 110 and the template 50 when the temporary adhesive portion 55 has no adhesiveness. This state can be understood to mean that the mask metal film 110 and the template 50 can be separated very easily even if no load or external force is applied. status. Therefore, even if the temporary bonding portion 55 (and the first insulating portion 23 ) is interposed, the mask metal film 110 and the template 50 are only in contact without adhesion. The mask metal film 110 is not hindered by the temporary adhesive portion 55 and extends linearly as the temperature rises. In addition, the thermal expansion coefficient of the mask metal film 110 is smaller than that of the template 50 , so the extension degree L1 of the mask metal film 110 may be greater than the extension degree L2 of the template 50 at the first process temperature TS1 .

Next, referring to FIG. 8(c) , the process temperature can be lowered to the second process temperature TS2 while the mask metal film 110 is in contact with the template 50. At the second process temperature TS2, the adhesion strength of the temporary adhesive portion 55 is At least greater than 5kgf/cm ² . The second process temperature TS2 may be less than 85-100°C and greater than normal temperature. As the temporary adhesive portion 55 exhibits adhesive force at the second process temperature TS2, the mask metal film 110 and the template 50 may be adhered. As the temperature decreases, the template 50 may shrink (L2->L3), and the mask metal film 110 will shrink accordingly.

However, when the process temperature drops (TS1->TS2) from step (b) to step (c) in FIG. 8 , the temporary bonding portion 55 is first cooled and solidified, and the mask metal film 110 is lower in temperature than the temporary bonding portion 55 The speed can be delayed. Therefore, compared with the situation in FIG. 7 , the mask metal film 110 can be bonded to the template 50 in a further extended state. In other words, compared to the situation where the mask metal film 110 and the template 50 are bonded immediately after rising to the second process temperature TS2 at room temperature RT as shown in FIG. 7 , between the room temperature T and the second process temperature TS2 as shown in FIG. 8 , by further adding the step of raising the temperature to the first process temperature TS1, the mask metal film 110 can be bonded to the template 50 in a further extended state. When the mask metal film 110 and the template 50 are bonded after immediately rising to the second process temperature TS2 from room temperature RT, the mask metal film 110 will be blocked by the temporary bonding portion 55 due to the considerable adhesive force present in the temporary bonding portion 55 , and even if the temperature rises, linear extension will not occur. Further extension of the mask metal film 110 corresponds to a further increase in the tensile force IT contained in the mask metal film 110 (or the mask 100) supported by the template 50, which means that the mask 100 will correspond to/ Mask 100 can remain in a more taut state after being attached to frame 200.

Next, referring to (e) of FIG. 8 , the process temperature can be lowered to normal temperature RT. As the temperature decreases, the template 50 shrinks (around L3), and the mask metal film 110 shrinks accordingly. The template 50 can be restored to the length in the initial room temperature RT state in FIG. 8(a) , and the mask metal film 110 can be bonded and fixed to the template 50 in a state extending L5 further than the initial room temperature RT. The extent of the extension L5 and the tensile force IT contained in the mask metal film 110 are greater than those described in FIG. 7 .

In addition, between step (c) and step (e) of FIG. 8 , a process of lowering the process temperature to a process temperature TS3 lower than the normal temperature RT may be further performed. Then, the temperature can be raised again to room temperature RT. As the temperature decreases to the process temperature TS3, the template 50 will shrink L4 more than the normal temperature state, and the mask metal film 110 will shrink accordingly. The process temperature TS3 may be approximately 5-15°C. In addition, the maintenance time of the process temperature TS3 may be at least greater than or equal to the maintenance time of the process temperatures TS1 and TS2 of (b) and (c) of FIG. 8 . For example, assuming that the maintenance time of TS1 is 10 minutes and the maintenance time of TS2 is 5 minutes, the maintenance time of TS3 can be more than 10 minutes. Through the above-mentioned rapid cooling instead of slow cooling, the viscosity of the temporary bonding portion 55 increases, thereby further increasing the bonding strength. As the bonding strength of the temporary bonding portion 55 is maximized, the mask metal film 110 and the template 50 can be further firmly bonded. The length of the mask metal film 110 further extended in step (b) of FIG. 8 remains unchanged after the temperature drops. Can be maintained.

In addition, the process temperature of the process area where the mask 100 and the template 50 are arranged can be controlled by heating/cooling means. In addition, the process temperature can also be controlled by applying specific energy of plasma, UV, laser, etc. to the mask 100 and the template 50 .

FIG. 9 is a comparison data of the initial design size and the size after the process of the mask according to an experimental example of the present invention. (a) and (c) of Figure 9 respectively show the initial state of the two samples, and (b) and (d) show the state after the process of Figure 8 is performed. Three points were respectively set at the upper, middle, and lower parts of the mask metal film 110 (or the mask 100), and the sizes were compared. The parts indicated by dotted lines in (a)-(d) correspond to the area (mask unit C) where the mask pattern P is arranged with predetermined design values, and the parts indicated by solid lines are actual measured values.

Comparing (a) and (b) and (c) and (d), it can be seen that after the process of Figure 8 is performed, the distance between the dotted lines becomes larger than that of the solid lines. This means that the mask metal film 110 extends compared to the same point. Comparing (a) and (b), it can be seen that it extends further toward the X-axis (short side) direction by about 1.6 μm, and further extends toward the Y-axis (long side) direction by about 4.3 μm. The axial direction further extends by about 0.9 μm, and the Y-axis direction further extends by about 3.3 μm.

FIG. 10 is a schematic diagram of a method for measuring the total pitch of a mask before and after a process according to an experimental example of the present invention.

The processes of Figures 7 and 8 were carried out under the conditions of Table 1 below. Table 1 Experimental example condition Experimental example 1 60℃(10 minutes)->RT(direct cooling) Experimental example 2 80℃(10 minutes)->RT(direct refrigeration) Experimental example 3 100℃(10 minutes)->RT(direct refrigeration) Experimental example 4 120℃(10 minutes)->RT(direct refrigeration) Experimental example 5 120℃(10 minutes)->50℃(5 minutes)->11℃(10 minutes)->RT Experimental example 6 130℃(10 minutes)->50℃(5 minutes)->11℃(10 minutes)->RT Experimental example 7 150℃(10 minutes)->11℃(10 minutes)->RT Experimental example 8 150℃(10 minutes)->50℃(5 minutes)->11℃(10 minutes)->RT

Experimental examples 1 to 3 correspond to the process of FIG. 7 , and experimental examples 5, 6, and 8 correspond to the process of FIG. 8 . In Experimental Example 4, only the initial rising temperature TS2 corresponds to the process of FIG. 8 , and Experimental Example 7 corresponds to the process of omitting the step of lowering to TS2 and directly cooling to TS3 in the process of FIG. 8 .

FIG. 10 shows a method of measuring the extended state of the mask 100 after performing the process. The portion of the mask 100 that is actually attached to the frame 200 (mask unit sheet portion 220) and functions as the mask unit C is the portion where the mask pattern P is formed. Therefore, a mask pattern other than the dummy portion DM can be used. The position of P is the state of reference measurement extension. The distance between the mask patterns P located at the ends of the mask unit C is called the total pitch (TP).

Referring to FIG. 10 , when the mask 100 has a pair of long sides (X-axis sides) and a pair of short sides (Y-axis sides), if the mask 100 is equally divided into three areas along the short side direction, then in each area In the area, any straight lines S1, S2 and S3 are extended in the direction perpendicular to the short side, and the distance from the mask pattern P arranged at one end to the mask pattern P arranged at the other end in any straight line S1, S2 and S3 can be calculated. The average of the distances (X-axis TP). In addition, if it is equally divided into three areas along the long side direction, then any straight lines S4, S5 and S6 are extended in the direction perpendicular to the long side direction in each area, and the distance between any straight lines S4, S5 and S6 can be calculated. The average value of the distance from the mask pattern P arranged at one end to the mask pattern P arranged at the other end (Y-axis TP).

The following table shows the X-axis (long axis) TP and Y-axis (short axis) TP of Experimental Example 1-8. The average value for each axis can be calculated by measuring the TP of three areas. ΔTP is obtained by subtracting the TP value measured after performing the process of FIG. 7 from the TP value measured after performing the process of FIG. 8 . In addition, ΔTP is obtained by subtracting the predetermined design value described in FIG. 9 (refer to the dotted line in FIG. 9 ) from the TP value measured after performing the process of FIG. 8 . Experimental Examples 1-7 performed TP measurements on three samples, and Experimental Example 8 performed TP measurements on two samples 2. The bonding strength of the temporary bonding portion 55 in each experimental example is approximately 40kgf/cm ² (-4MPa). The unit of values in the table is μm. Table 2 Experimental example X-axis △TP Y axis △TP X-axis △TP average/Y-axis △TP average Experimental example 1 -0.9/-0.6/+0.2 -0.2/-0.1/+0.8 -0.4/+0.2 Experimental example 2 -0.6/-0.7/-0.2 +0.1/-0.3/+0.1 -0.5/-0.0 Experimental example 3 -0.1/-0.3/-0.6 0.0/0.0/+0.2 -0.6/+0.1 Experimental example 4 +0.6/+1.0/+0.6 0.0/+0.3/-0.2 +0.7/+0.0 Experimental example 5 +1.1/+0.9/-0.4 +0.6/+0.6/+0.3 +0.5/+0.5 Experimental example 6 +2.6/+5.5/+3.8 +1.7/+2.7/+2.0 +4.0/+2.1 Experimental example 7 +2.0/+2.3/+2.0 +1.7/+2.1/+1.2 +2.1/+1.7 Experimental example 8 +6.8/+5.2 +2.9/+2.3 +6.0/+2.6

Referring to Table 2, it can be seen that the average value of ΔTP in Experimental Examples 1 to 3 is a negative number rather than a positive number. In Experimental Examples 5, 6 and 8 corresponding to the process in Figure 8, the average value of ΔTP is a positive number. In particular, it was confirmed that as Experimental Examples 5, 6, and 8 were executed, that is, as the initial rising temperature TP2 increased, the absolute value of ΔTP became larger.

In particular, ΔTP is preferably about 0.1 μm to 20.0 μm based on the long axis, and preferably about 0.1 μm to 15.0 μm based on the short axis. If it is less than the above reference, it will be difficult for the mask 100 to maintain a sufficiently tight state on the frame 200. If it is greater than the above reference, the tension exerted by the mask 100 on the frame 200 will increase, causing an alignment error in the mask pattern P. The possibility increases, which may cause local wrinkles of the mask 100 .

FIG. 11 is a graph showing the measurement results of the total mask spacing before and after each process according to an experimental example of the present invention. T1-T5 serve as the initial rising temperature TP2, corresponding to 120℃-150℃ respectively.

Referring to FIG. 11 , it can be seen that in the process of FIG. 8 , ΔTP becomes larger as the initial rising temperature TP2 increases. This tendency is the same as Experimental Examples 5, 6 and 8 in Fig. 10 . That is, it was confirmed that as the initial rising temperature TP2 increases, the mask metal film 110 adheres and is fixed to the template 50 in a state in which the degree of extension increases.

FIG. 12 is a schematic diagram of a process of measuring tension by placing the weight MS on the mask 100 after attaching the mask 100 to the frame 200 according to an experimental example of the present invention.

With the mask 100 attached to the frame 200 (mask unit sheet parts 220: 223, 225), a weight MS of 50 g is placed on the center of the mask 100 and the mask unit sheet part (220: 223, 225) The amount of sagging relative to the mask 100. In the table below, Experimental Examples 9 and 10 are states where the process of Figure 8 is not executed, and Experimental Examples 11 and 12 are states where the process of Figure 8 is executed. In the initial state, the height of the mask unit sheet portion 220 is 0, which is a reference value. Δ(OM) indicates the amount of sagging of the mask unit sheet portion 220 (μm) when the weight MS is placed on the mask 100 ). table 3 Experimental example 9 Experimental example 10 Experimental example 11 Experimental example 12 Start 35 48 26 36 Weight(50g) -716 -702 -671 -683 △(OM) -222 -232 -230 -235 △(Start-after the weight is increased) -751 -750 -697 -719 end 35 48 26 39 △(OM)(start-end) 0 0 0 3

Referring to Table 3, it can be seen that the masks 100 of Experimental Examples 11 and 12 have a large tensile force and are tightly attached to the mask unit sheet portion 220 from the initial stage, so the height is low. It was confirmed that the deformation amount Δ(OM) of the mask unit sheet portion 220 remained almost constant. In addition, when the weight MS is placed on the mask 100, the average value is -750 in Experimental Examples 9 and 10. On the contrary, the average value is -708 in Experimental Examples 11 and 12, and the amount of sagging is reduced by 42 μm. This means that the mask 100 is attached to the frame 200 with a large tensile force IT or tension TS (see FIG. 15 ).

FIG. 13 is a schematic diagram of a state in which the template 50 is loaded onto the frame 200 and the mask 100 is mapped to the unit area CR of the frame 200 according to an embodiment of the present invention. FIG. 13 illustrates a method of mapping/attaching one mask 100 to the unit area CR, but it is also possible to map multiple masks 100 to all unit areas CR at the same time and attach the masks 100 to the frame 200 . Process. At this time, there may be a plurality of templates 50 for supporting each of the plurality of masks 100 respectively.

The template 50 can be transferred by a vacuum suction cup 90 . The surface opposite to the surface of the template 50 to which the mask 100 is adhered can be sucked and transferred using the vacuum suction cup 90 . The vacuum suction cup 90 absorbs and flips the template 50 and then transfers the template 50 to the frame 200 without affecting the bonding state and alignment of the mask 100 .

Next, referring to FIG. 13 , the mask 100 can be mapped to a mask unit region CR of the frame 200 . The mask 100 can be made to correspond to the mask unit region CR by loading the template 50 to the frame 200 (or the mask unit sheet portion 220). While controlling the position of the template 50/vacuum suction cup 90, it can be observed through a microscope whether the mask 100 corresponds to the mask unit area CR. Since the template 50 presses the mask 100, the mask 100 can be in close contact with the frame 200.

In addition, a lower support body 70 may be further arranged at the lower part of the frame 200 . The lower support 70 may press the opposite surface of the mask unit region CR in contact with the mask 100 . At the same time, since the lower support 70 and the template 50 press the edge of the mask 100 and the frame 200 (or the mask unit sheet portion 220 ) in opposite directions, the alignment state of the mask 100 can be maintained and no Be disrupted.

Next, the mask 100 is irradiated with laser L and attached to the frame 200 based on laser welding. Welding beads WB are generated on the welding portion WP of the mask by laser welding. The welding beads WB may have the same material as the mask 100/frame 200 and be integrally connected with them.

14 is a schematic diagram of a process of separating the mask from the template after attaching the mask to the frame according to an embodiment of the present invention.

Referring to FIG. 14 , after the mask 100 is attached to the frame 200 , the mask 100 may be debonded from the template 50 . The separation of the mask 100 and the template 50 can be performed by at least any one of heating ET, chemical treatment CM, application of ultrasonic waves US, and application of ultraviolet UV to the temporarily bonded portion 55 . Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. As an example, if thermal ET at a temperature higher than 85° C. to 100° C. is applied, the viscosity of the temporary adhesive portion 55 is reduced, and the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 can be separated. As another example, the mask 100 and the template 50 can be separated from the template 50 by immersing the temporary adhesive portion 55 in CM in chemical substances such as IPA, acetone, ethanol, etc. to dissolve, remove, or the like. As another example, the adhesive force between the mask 100 and the template 50 is weakened by applying ultrasonic waves US or ultraviolet UV, so that the mask 100 and the template 50 can be separated.

If the template 50 is separated from the mask 100 , the tensile force IT applied to the mask 100 is released and converted into a tension TS that tightens both sides of the mask 100 . Thereby, the mask 100 can be attached in a tight state by applying the tension TS to the frame 200 (mask unit sheet portion 220).

FIG. 15 is a schematic diagram of a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention. A state in which all masks 100 are attached to the unit area CR of the frame 200 is illustrated in FIG. 15 . Although the masks 100 can be attached one by one and then the template 50 is detached, it is also possible to attach all the masks 100 and then detach all the templates 50 .

The existing mask 10 of FIG. 1 includes 6 units C1-C6 and therefore has a longer length, while the mask 100 of the present invention includes one unit C and therefore has a shorter length, so the PPA (pixel position accuracy) is distorted. will become smaller. Moreover, the present invention only needs to correspond to one unit C of the mask 100 and confirm the alignment status. Therefore, compared with the existing method that simultaneously corresponds to multiple units C (C1-C6) and needs to confirm all the alignment statuses, the present invention is more efficient. Inventions can significantly reduce manufacturing time.

If each mask 100 is attached to the corresponding mask unit region CR and then the template 50 and the mask 100 are separated, the plurality of masks 100 will exert tension TS that shrinks in opposite directions, and the tensions will cancel each other out. , therefore the mask unit sheet portion 220 will not be deformed. For example, on the first grid sheet portion 223 between the mask 100 attached to the CR11 unit area and the mask 100 attached to the CR12 unit area, the mask 100 attached to the CR11 unit area acts in the right direction. The tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 unit area can cancel each other out. Therefore, the deformation of the frame 200 (or the mask unit sheet portion 220 ) due to the tension TS is minimized, thereby minimizing the alignment error of the mask 100 (or the mask pattern P).

As mentioned above, the present invention has been illustrated and described by enumerating preferred embodiments. However, the present invention is not limited to the above-described embodiments. Those skilled in the art can make various modifications and changes within the scope that does not depart from the spirit of the present invention. Such deformations and changes all fall within the scope of the present invention and the appended patent applications.

23:First insulation department 25:Second Insulation Department 50: template 51: Laser pass hole 55: Temporary bonding part 100:mask 110: Mask film, mask metal film 200:Frame 210: Edge frame part 220:Mask unit sheet section 221: Edge sheet part 223: The first grid sheet department 225: Second grid sheet part C: unit, mask unit CR: mask unit area DM: Dummy Department, Mask Dummy Department L:Laser P:Mask pattern RT: normal temperature S1-S6: straight line TS1, TS2, TS3: first, second and third process temperatures WB:weld beads

Figure 1 is a schematic diagram of the existing process of attaching a mask to a frame. 2 is a front view and a side cross-sectional view of a frame-integrated mask according to an embodiment of the present invention. Figure 3 is a schematic diagram of a mask according to an embodiment of the present invention. 4 to 5 are schematic diagrams of a process of forming a mask by bonding a mask metal film on the template to manufacture a mask supporting template according to an embodiment of the present invention. FIG. 6 is a schematic diagram illustrating problems that exist when the thermal expansion coefficient of the template is higher than that of the mask according to the comparative example. 7 is a schematic diagram of the interface state between the mask and the template and the state of the mask attached to the frame when the thermal expansion coefficient of the template is lower than that of the mask according to an embodiment of the present invention. FIG. 8 is a schematic diagram of the extended state of the mask metal film and the template in response to process temperature changes according to an embodiment of the present invention. FIG. 9 is a comparison data of the initial design size and the size after the process of the mask according to an experimental example of the present invention. FIG. 10 is a schematic diagram of a method for measuring the total pitch of a mask before and after a process according to an experimental example of the present invention. FIG. 11 is a graph showing the measurement results of the total mask spacing before and after each process temperature according to an experimental example of the present invention. 12 is a schematic diagram of a process of measuring tension by placing a weight on the mask after attaching the mask to the frame according to an experimental example of the present invention. FIG. 13 is a schematic diagram of a state in which a template is loaded onto a frame and the mask is mapped to a unit area of the frame according to an embodiment of the present invention. 14 is a schematic diagram of a process of separating the mask and the template after attaching the mask to the frame according to an embodiment of the present invention. FIG. 15 is a schematic diagram of a state in which a mask is attached to a unit area of a frame according to an embodiment of the present invention.

100:mask

P:Mask pattern

S1-S6: straight line

Claims (8)

A mask for OLED pixel formation, which is supported by a template and attached to a frame. The template supports a mask, wherein the mask includes a mask unit formed with a plurality of mask patterns and dummy holes around the mask unit. The mask has a pair of long sides and a pair of short sides. Make the mask according to (I) or (II) below. (I): (a) Prepare a template with a temporary bonding part formed on one side; (b) Apply the process The temperature rises to a temperature where the push-pull strength of the temporary bonding part becomes at least 0 to 5 kgf/cm ² and the mask metal film contacts the template; (c) The process temperature is lowered to a temperature where the push-pull strength of the temporary bonding part becomes at least 0 to 5 kgf/cm 2 The bonding strength is at least greater than 5kgf/cm ² at a temperature and the mask metal film is bonded to the template; (d) the process temperature is lowered to normal temperature; (e) the mask is manufactured by forming a mask pattern on the mask metal film; (II): (a) Prepare a mask with a mask pattern formed on it; (b) Prepare a template with a temporary adhesive portion formed on one side; (c) Increase the process temperature until the adhesive strength of the temporary adhesive portion becomes at least 0 to 5kgf / ^cm2 and contact the mask to the template; (d) Lower the process temperature to a temperature such that the bonding strength of the temporary bonding part is at least greater than 5kgf/ ^cm2 and bond the mask to the template; (e) The process temperature is lowered to normal temperature; the mask using the predetermined design value is a mask manufactured through the following steps: (1) prepare a template with a temporary adhesive portion formed on one side; (2) increase the process temperature to a point where the temporary adhesive portion at least adheres to the mask The temperature of the mold metal film and the template is 85°C to 100°C and the mask metal film is bonded to the template; (3) the process temperature is lowered to normal temperature; (4) the mask is manufactured by forming a mask pattern on the mask metal film ; On any straight line parallel to the long side or short side of the mask, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is compared with the distance from the mask pattern arranged at the predetermined design value to The distance from the mask pattern at one end to the mask pattern arranged at the other end is 0.1 μm to 20.0 μm larger. The thermal expansion coefficient of the mask is at least greater than 1X10 ^-6 /℃, and the thermal expansion coefficient of the template is less than 1X10 ^-6 /℃ (more than 0) , wherein the process temperature is raised to 110°C to 200°C in step (b), and the process temperature is lowered to lower than the process temperature of step (b) and higher than normal temperature in step (c). The OLED pixel forming mask according to claim 1, wherein when the mask is divided into three equal regions along the long side, any straight line is extended in each region in a direction perpendicular to the long side, and the arbitrary straight line is extended in a direction perpendicular to the long side. The average distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is set to A. When the mask is equally divided into three areas along the short side direction, any straight line is directed vertically in each area. Extending in the direction of the short side, the average distance on any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end is set to B. For the case of using a mask with a predetermined design value, the mask When dividing the area into three equal areas along the long side, extend any straight line in each area in a direction perpendicular to the long side, and extend any straight line from the mask pattern arranged at one end to the mask pattern arranged at the other end. The average distance is set to C. When the mask is equally divided into three areas along the short side, any straight line is extended in the direction perpendicular to the short side in each area, and any straight line is drawn from the mask pattern arranged at one end. The average distance to the mask pattern arranged at the other end is set to D, and at this time, the values of A-C and B-D are positive numbers respectively. The OLED pixel formation mask according to claim 2, wherein the values of A-C are 0.1 μm to 20.0 μm, and the values of B-D are 0.1 μm to 15.0 μm. The mask for forming OLED pixels according to claim 1, wherein step (d) includes the following steps: (d1) lowering the process temperature to lower than normal temperature; (d2) raising the process temperature to normal temperature. The mask for forming OLED pixels as described in claim 1, wherein in step (b), the mask metal film extends further to the side than the template in a state where there is no adhesive force between it and the template, and step (c) The mid-mask metal film is bonded to the template in an extended state. The mask for OLED pixel formation as described in claim 5, wherein in step (b) As the process temperature increases, the mask metal film is bonded and fixed to the template in a state of greater extension. A template that supports a mask, the template is used to support a mask for forming OLED pixels and correspond the mask to a frame, including: a template; a temporary adhesive portion formed on the template; and a mask that passes through a clamp Assume that the temporary adhesive portion is bonded to the template and is formed with multiple mask patterns. The mask includes a mask unit formed with multiple mask patterns and a dummy portion around the mask unit. The mask has a pair of long sides and a pair of On the short side, make a mask according to (I) or (II) below, (I): (a) prepare a template with a temporary bonding portion formed on one side; (b) increase the process temperature to a level that increases the bonding strength of the temporary bonding portion ( push-pull strength) to a temperature of at least 0 to 5kgf/ ^cm2 and contact the mask metal film to the template; (c) lower the process temperature to a temperature where the bonding strength of the temporary bonding part is at least greater than 5kgf/ ^cm2 and Bond the mask metal film to the template; (d) Lower the process temperature to normal temperature; (e) Make the mask by forming a mask pattern on the mask metal film; (II): (a) Prepare to form a mask (b) prepare a template with a temporary bonding portion formed on one side; (c) raise the process temperature to a temperature such that the bonding strength of the temporary bonding portion becomes at least 0 to 5kgf/ ^cm2 and contact the mask on the template; (d) lower the process temperature to a temperature where the bonding strength of the temporary bonding part is at least greater than 5kgf/ ^cm2 and bond the mask to the template; (e) lower the process temperature to normal temperature; use the predetermined design value The mask is a mask manufactured by the following steps: (1) preparing a template with a temporary adhesive portion formed on one side; (2) raising the process temperature to 85°C to 100°C where the temporary adhesive portion can at least adhere to the mask metal film and the template And bond the mask metal film to the template; (3) Reduce the process temperature to normal temperature; (4) Make the mask by forming a mask pattern on the mask metal film; Place a mask parallel to the long or short side of the mask On any straight line along the edge, the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end is compared with the distance from the mask pattern arranged at one end to the mask pattern arranged at the other end in the mask using the predetermined design value. The distance between the mask patterns is 0.1 μm to 20.0 μm, the thermal expansion coefficient of the mask is at least greater than 1X10 ^-6 /℃, and the thermal expansion coefficient of the template is less than 1X10 ^-6 /℃ (more than 0), where the process is The temperature rises to 110°C to 200°C, and in step (c), the process temperature is lowered to lower than the process temperature of step (b) and higher than normal temperature. A method for manufacturing a frame-integrated mask, the frame-integrated mask is integrally formed by at least one mask and a frame for supporting the mask, wherein the method includes the following steps: (a) combining the method described in claim 7 Loading the template supporting the mask onto a frame having at least one mask unit area and corresponding the mask to the mask unit area of the frame; and (b) attaching the mask to the frame.