TWI730512B - Producing method of mask integrated frame and mask changing method of mask integrated frame - Google Patents

Abstract

The invention relates to a method for manufacturing a frame-integrated mask and a mask separation/replacement method for a frame-integrated mask. The present invention relates to a method for manufacturing a frame-integrated mask. The frame-integrated mask is integrally formed by a plurality of masks and a frame for supporting the mask. The method is characterized in that it includes: (a) The preparation template is bonded with A step of masking a mask supporting a template on which a plurality of mask patterns P are formed; (b) raising the temperature of a process area including a frame having a plurality of mask unit regions CR to a first temperature ET (C) the step of loading the template on the frame and corresponding the mask to the mask unit area CR of the frame; (d) the step of attaching the mask to the frame; (e) repeating steps (c) to Step (d) a step of attaching a mask to all mask cell regions CR of the frame; (f) a step of lowering the temperature of the process area including the frame to a second temperature LT.

Description

Method for manufacturing frame-integrated mask and method for mask separation/replacement of frame-integrated mask

Field of invention The invention relates to a method for manufacturing a frame-integrated mask and a mask separation/replacement method for a frame-integrated mask. More specifically, it relates to a mask that does not deform, can be stably supported and moved, can accurately align between the masks, and can prevent the frame from being separated from the frame to replace the mask. A modified frame-integrated mask manufacturing method and a frame-integrated mask mask separation/replacement method.

Background of the invention As a technology for forming pixels in the OLED (organic light emitting diode) manufacturing process, the FMM (Fine Metal Mask) method is mainly used, which tightens the thin film form of the metal mask (Shadow Mask). Stick to the substrate and deposit organics on the desired location.

In the existing OLED manufacturing process, after the mask is manufactured into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. One mask may have a plurality of cells corresponding to one display. In addition, in order to manufacture a large-area OLED, multiple masks can be fixed to the OLED pixel deposition frame, and during the process of fixing to the frame, each mask is stretched to make it flat. It is very difficult to adjust the stretching force to flatten the entire part of the mask. In particular, in order to make each unit flat while aligning a mask pattern with a size of only a few μm to several tens of μm, it is necessary to fine-tune the tensile force applied to each side of the mask and confirm the alignment status immediately. .

Nevertheless, in the process of fixing multiple masks to one frame, there is still a problem of poor alignment between the masks and between the mask units. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem of the mask sagging or twisting due to the load; due to wrinkles and burrs generated in the welding part during the welding process (Burr) and so on, causing the problem of inaccurate alignment of the mask unit.

In ultra-high-definition OLEDs, the existing QHD image quality is 500-600PPI (pixel per inch, pixels per inch), and the pixel size reaches about 30-50μm, while 4K UHD and 8K UHD have higher definitions~ Resolution of 860PPI, ~1600PPI, etc. In this way, considering the pixel size of the ultra-high-definition OLED, the alignment error between the units needs to be reduced to a few μm. Exceeding this error will lead to product failure, so the yield may be extremely low. Therefore, it is necessary to develop a technology that can prevent deformation such as sagging or twisting of the mask and make the alignment accurate, and a technology that fixes the mask to the frame, and the like.

In addition, when part of the mask is not accurately aligned and fixed or when a defect occurs in the mask, the mask needs to be separated. However, in the process of separating and replacing the soldered mask, there is a problem of disrupting the alignment of other masks.

Summary of the invention [technical problem] Therefore, the present invention was proposed in order to solve the various problems of the prior art as described above, and its object is to provide a mask that can be supported and moved stably without deformation, and can prevent the mask from sagging or twisting. A manufacturing method for a frame-integrated mask that is deformable and can be accurately aligned.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that can significantly reduce the manufacturing time and significantly improve the yield.

In addition, an object of the present invention is to provide a frame-integrated mask in which the mask and the frame form an integrated structure, which can prevent distortion of the frame and other deformations, and can separate and replace the mask to accurately align the mask. Mask separation/replacement method for frame-integrated masks. [Solution]

The object of the present invention can be achieved by the following method for manufacturing a frame-integrated mask, which is integrally formed by a plurality of masks and a frame for supporting the mask, and the method includes: (a) preparing a template A step of attaching a mask to a mask supporting template, the mask having a plurality of mask patterns formed thereon; (b) raising the temperature of a process area including a frame having a plurality of mask unit areas to a first temperature (C) the step of loading the template on the frame and corresponding the mask to the mask unit area of the frame; (d) the step of attaching the mask to the frame; (e) repeating steps (c) to steps (D) A step of attaching a mask to all mask unit areas of the frame; and (f) a step of lowering the temperature of the process area including the frame to a second temperature.

Step (a) may include: (a1) bonding a mask metal film to a template with a temporary bonding portion formed on one side; and (a2) manufacturing a mask by forming a mask pattern on the mask metal film, thereby A step of providing a mask support template with a mask adhered on the template, and a plurality of mask patterns formed on the mask.

Between step (a1) and step (a2), a step of reducing the thickness of the mask metal film bonded on the template may also be included.

The temporary bonding part may be an adhesive or an adhesive sheet that is separable by heating, or an adhesive or an adhesive sheet that is separable by irradiation with UV.

Step (a2) may include: (a2-1) a step of forming a patterned insulating portion on the mask metal film; (a2-2) forming a mask by etching the portion of the mask metal film exposed between the insulating portions The step of patterning; and (a2-3) the step of removing the insulating part.

In step (d), the laser irradiated on the upper part of the template can be irradiated to the welding part of the mask through the laser through hole.

The first temperature may be greater than or equal to the OLED pixel deposition process temperature, the second temperature may be at least lower than the first temperature, the first temperature may be any temperature from 25°C to 60°C, and the second temperature may be lower than the first temperature and At any temperature from 20°C to 30°C, the OLED pixel deposition process temperature can be any temperature from 25°C to 45°C.

In step (c), no stretching is applied to the mask, and the mask on the template can be mapped to the mask unit area only by controlling the position of the template.

In the step (f), if the temperature of the process area is lowered to the second temperature, the mask attached to the frame will be subjected to tension (tension) due to the shrinkage of the mask attached to the frame.

Between step (d) and step (e), it may further include a step of separating the mask from the template by heating the temporary bonding part, chemical treatment, applying ultrasonic waves, and applying ultraviolet rays.

In addition, the object of the present invention can be achieved by a mask separation/replacement method for a frame-integrated mask, which is integrally formed by a plurality of masks and a frame for supporting the mask, and the method includes: (A) The step of raising the temperature of the process area including the frame to the first temperature; (b) The step of separating the target mask from the frame; (c) The template is prepared, and the template is loaded on the frame to match the mask To the step of separating the target mask on the mask unit area, a plurality of mask patterns are formed on the mask; (d) the step of attaching the mask to the frame; (e) the process of including the frame The step of decreasing the temperature of the zone to the second temperature.

The first temperature may be greater than or equal to the OLED pixel deposition process temperature, the second temperature may be at least lower than the first temperature, the first temperature may be any temperature from 25°C to 60°C, and the second temperature may be lower than the first temperature and At any temperature from 20°C to 30°C, the OLED pixel deposition process temperature can be any temperature from 25°C to 45°C.

In step (c), no stretching is applied to the mask, and the mask on the template can be mapped to the mask unit area only by controlling the position of the template.

In step (a), if the temperature of the process area is raised to the first temperature, the tension applied to the mask attached to the frame can be released.

In the step (e), if the temperature of the process area is lowered to the second temperature, the mask attached to the frame will be subjected to tension due to shrinkage.

In step (b), the outer frame portion of at least one corner of the target mask to be separated/replaced is squeezed, and the mask can be separated from the frame by applying an external force to one corner of the mask. [Effects of the invention]

According to the present invention having the structure as described above, the mask can be stably supported and moved without deformation, and the mask can be prevented from being deformed such as sagging or twisting, and can be accurately aligned.

In addition, according to the present invention, the manufacturing time can be significantly reduced, and the yield can be significantly improved.

In addition, according to the present invention, the frame-integrated mask in which the mask and the frame form an integrated structure can prevent distortion of the frame, etc., and can separate and replace the mask to accurately align the mask.

Detailed ways The detailed description of the present invention described later will refer to the accompanying drawings, which illustrate specific embodiments capable of implementing the present invention as examples. These embodiments are explained in sufficient detail to enable those skilled in the art to implement the present invention. It should be understood that although the various embodiments of the present invention are different from each other, they are not necessarily mutually exclusive. For example, the specific shapes, structures, and characteristics described herein are related to one embodiment, and can be implemented in other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the position or arrangement of the individual constituent elements in each disclosed embodiment can be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description should not be regarded as having a restrictive meaning, and as long as it is appropriately described, the scope of the present invention is limited only by the scope of the attached patent application and all equivalent scopes thereof. Similar reference numerals in the figures represent the same or similar functions from many aspects. For convenience, the length, area, thickness and shape thereof may be exaggerated.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the present invention.

FIG. 1 is a schematic diagram showing a conventional mask 10 for OLED pixel deposition.

1, the existing mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is used as a strip mask, and both sides of the strip can be welded and fixed to the OLED pixel deposition frame and used. The mask 100 shown in (b) of FIG. 1 is a plate-type mask and can be used in a large-area pixel formation process.

The main body (body, or mask film 11) of the mask 10 is provided with a plurality of display units C. One cell C corresponds to one display of a smart phone or the like. A pixel pattern P is formed in the cell C so as to correspond to each pixel of the display. When the unit C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. As an example, the pixel pattern P is formed in the cell C so as to have a resolution of 70×140. That is, a large number of pixel patterns P form a set to constitute one cell C, and a plurality of cells C may be formed on the mask 10.

FIG. 2 is a schematic diagram showing a process of attaching the mask 10 to the frame 20 in the prior art. FIG. 3 is a schematic diagram illustrating the occurrence of alignment errors between units during the process of stretching the F1 to F2 mask 10 in the prior art. Hereinafter, the stripe mask 10 including 6 cells C (C1 to C6) shown in FIG. 1(a) will be described as an example.

Referring to FIG. 2(a), first, the strip mask 10 should be spread out flat. Stretching forces F1 to F2 are applied along the long axis direction of the strip mask 10, and with the stretching, the strip mask 10 is unfolded. In this state, the strip mask 10 is mounted on the frame 20 having a square shape. The cells C1 to C6 of the strip mask 10 will be located in the blank area part of the frame of the frame 20. The size of the frame 20 may be sufficient for the cells C1 to C6 of one strip mask 10 to be located in the blank area inside the frame, or it may be sufficient for the cells C1 to C6 of multiple strip masks 10 to be located in the blank area inside the frame.

2(b), fine-tune the tensile forces F1~F2 applied to each side of the strip mask 10, and after alignment at the same time, as a part of the side of the W strip mask 10 is welded, the strip mask 10 And the frame 20 are connected to each other. (C) of FIG. 2 shows a side cross-section of the strip mask 10 and the frame connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to each side of the strip mask 10 are fine-tuned, the problem of poor alignment between the mask units C1 to C3 is shown. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the strip mask 10 has a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of μm, it is prone to sag or twist due to a load. In addition, it is very difficult to adjust the stretching forces F1 to F2 so that all the units C1 to C6 become flat, and to check the alignment state of the units C1 to C6 in real time through a microscope.

Therefore, slight errors in the stretching forces F1 to F2 may cause errors in the degree of stretching or unfolding of each unit C1 to C3 of the strip mask 10, thereby resulting in the distance D1 to D1'' between the mask patterns P. D2~D2'' are different. Although it is very difficult to align perfectly so that the error is zero, in order to avoid the mask pattern P with a size of several μm to tens of μm from adversely affecting the pixel process of the ultra-high-definition OLED, it is preferable that the alignment error is not more than 3 μm. The alignment error between such adjacent cells is called pixel position accuracy (PPA).

In addition, about 6-20 strip masks 10 are connected to one frame 20, and the alignment between the strip masks 10 and the cells C-C6 of the strip mask 10 Accurate state is a very difficult task, and it can only increase the process time based on alignment, which becomes an important reason for reducing productivity.

On the other hand, after the strip mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the strip mask 10 will act on the frame 20 in reverse. That is, after the strip mask 10 stretched tightly by the stretching forces F1 to F2 is connected to the frame 20, tension can be applied to the frame 20. Normally, this tension is not large and does not have a large impact on the frame 20. However, if the size of the frame 20 is reduced and the strength becomes low, this tension may slightly deform the frame 20. In this way, a problem of destroying the alignment state between the plurality of cells C to C6 may occur.

In view of this, the present invention proposes a frame 200 and a frame-integrated mask capable of forming the mask 100 and the frame 200 into an integrated structure. The mask 100 integrated with the frame 200 can prevent deformation such as sagging or twisting, and is accurately aligned with the frame 200. When the mask 100 is connected to the frame 200, no stretching force is applied to the mask 100, so after the mask 100 is connected to the frame 200, no tension that causes deformation is applied to the mask 200. Also, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly shortened, and the yield can be significantly improved.

4 is a front view (FIG. 4(a)) and a side cross-sectional view (FIG. 4(b)) of a frame-integrated mask according to an embodiment of the present invention, and FIG. 5 is a view showing an aspect of the present invention A front view (FIG. 5( a)) and a side cross-sectional view (FIG. 5 b) of the frame related to the embodiment.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a form in which a plurality of masks 100 are attached to the frame 200, respectively. Hereinafter, for the convenience of description, a rectangular mask 100 is used as an example for description. However, before the mask 100 is attached to the frame 200, it may be in the shape of a stripe mask with protrusions for clamping on both sides, and attached to After the frame 200, the protrusions can be removed.

A plurality of mask patterns P are formed on each mask 100, and one cell C may be formed on one mask 100. One mask unit C can correspond to one display of a smart phone or the like.

The mask 100 may be an invar material with a thermal expansion coefficient of about 1.0×10-6/°C, and a super invar material with an expansion coefficient of about 1.0×10-7/°C. The mask 100 of this material has a very low coefficient of thermal expansion, so there is little concern about the pattern of the mask being deformed due to thermal energy, and it can be used as FMM (Fine Metal Mask) and shadow mask (Shadow Mask) in high-resolution OLED manufacturing. use. In addition, considering the recently developed technology for performing the pixel deposition process within a range where the temperature change value is not large, the mask 100 may also be made of nickel (Ni), nickel-cobalt (Ni-Co) whose thermal expansion coefficient is slightly larger than this. ) And other materials. The mask 100 may use a metal sheet generated by a rolling process or electroforming. The detailed description will be given below with reference to FIGS. 9 and 10.

The frame 200 may be formed in a form in which a plurality of masks 100 are attached. Including the outermost periphery, the frame 200 may include a plurality of edges and corners formed along a first direction (for example, a lateral direction) and a second direction (for example, a vertical direction). Such multiple edges and corners may divide the area for attaching the mask 100 on the frame 200.

The frame 200 may include an edge frame part 210 roughly in a square shape and a box shape. The inside of the edge frame part 210 may be a hollow shape. That is, the edge frame part 210 may include the hollow region R. The frame 200 may be formed of metal materials such as Invar, Super Invar, aluminum, and titanium. Considering thermal deformation, it is preferably made of Invar, Super Invar, nickel, and nickel-cobalt having the same thermal expansion coefficient as the mask. These materials can be applied to all the edge frame parts 210 and the mask unit sheet part 220 that are the constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the edge frame part 210. The mask unit sheet part 220 may be formed by calendering like the mask 100, or may also be formed by using another film forming process such as electroforming. In addition, the mask unit sheet portion 220 may be connected to the edge frame portion 210 after forming a plurality of mask unit regions CR on a planar sheet by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may connect a planar sheet to the edge frame portion 210, and then form a plurality of mask unit regions CR by laser scribing, etching, or the like. In this specification, the case where a plurality of mask cell regions CR are first formed in the mask cell sheet section 220 and then connected to the edge frame section 210 will be mainly described.

The mask unit sheet part 220 may include an edge sheet part 221 and at least one of a first grid sheet part 223 and a second grid sheet part 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to the respective portions divided on the same sheet, and they are integrated with each other.

The edge sheet part 221 may be substantially connected to the edge frame part 210. Therefore, the edge sheet part 221 may have a substantially square shape or a box shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may be formed to extend along the first direction (lateral direction). The first grid sheet portion 223 is formed in a linear form, and both ends of the first grid sheet portion 223 may be connected to the edge sheet portion 221. When the mask unit sheet part 220 includes a plurality of first grid sheet parts 223, each of the first grid sheet parts 223 preferably has the same pitch.

In addition, further, the second grid sheet portion 225 may be formed to extend along the second direction (vertical direction), and the second grid sheet portion 225 may be formed in a linear form, and both ends of the second grid sheet portion 225 may be connected to the edge sheet portion 221 . The first grid sheet part 223 and the second grid sheet part 225 may perpendicularly cross each other. When the mask unit sheet part 220 includes a plurality of second grid sheet parts 225, each of the second grid sheet parts 225 preferably has the same pitch.

On the other hand, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask unit C.

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a film, the shape of the cross section perpendicular to the length direction may be a rectangle, a quadrangular shape such as a trapezoid, a triangular shape, etc., Part of the sides and corners can be rounded. The cross-sectional shape can be adjusted during laser scribing, etching, etc.

The thickness of the edge frame part 210 may be greater than the thickness of the mask unit sheet part 220. Since the edge frame part 210 is responsible for the overall rigidity of the frame 200, it can be formed with a thickness of several mm to several tens of cm.

Regarding the mask unit sheet portion 220, the process of manufacturing a thick sheet is actually difficult. If the thickness is too thick, the organic source 600 (refer to FIG. 22) may block the path through the mask 100 during the OLED pixel deposition process. On the contrary, if it is too thin, it may be difficult to ensure sufficient rigidity to support the mask 100. Thus, the mask unit sheet portion 220 is preferably thinner than the thickness of the edge frame portion 210, but thicker than the mask 100. The thickness of the mask unit sheet part 220 may be about 0.1 mm to 1 mm. In addition, the width of the first grid sheet portion 223 and the second grid sheet portion 225 may be about 1 to 5 mm.

In the planar sheet, in addition to the area occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11~CR56) may be provided . From another perspective, the mask unit area CR may refer to the hollow area R of the edge frame portion 210, except for the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225. Blank area outside of the occupied area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can actually be used as a channel for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display of a smartphone or the like. A mask pattern P for constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 has multiple cells C and each cell C can correspond to each cell area CR of the frame 200. However, in order to accurately align the mask 100, a large area mask 100 needs to be avoided, and one cell C is preferred. The small area mask 100. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, in order to accurately align, it can be considered that the mask 100 having 2-3 cells C corresponds to one cell region CR of the mask 200.

The mask 200 includes a plurality of mask cell regions CR, and each mask 100 can be attached so that each mask cell C corresponds to each mask cell region CR. Each mask 100 may include a mask unit C in which a plurality of mask patterns P are formed, and a dummy portion around the mask unit C (equivalent to a portion of the mask film 110 other than the unit C). The dummy part may include only the mask film 110, or may include the mask film 110 formed with a predetermined dummy pattern in a similar form to the mask pattern P. The mask unit C corresponds to the mask unit region CR of the frame 200, and a part or all of the dummy part may be attached to the frame 200 (mask unit sheet part 220). Thus, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by attaching the mask unit sheet portion 220 to the edge frame portion 210, but can be used in the hollow area R portion of the edge frame portion 210 to be directly formed with the edge frame The part 210 becomes a frame of an integrated grid frame (equivalent to the grid sheet parts 223 and 225). The frame of this form also includes at least one mask unit region CR, and the mask 100 can be made to correspond to the mask unit region CR to manufacture a frame-integrated mask.

Hereinafter, the manufacturing process of the frame-integrated mask will be described.

First, the frame 200 described in FIG. 4 and FIG. 5 may be provided. FIG. 6 is a schematic diagram showing the manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, an edge frame part 210 is provided. The edge frame part 210 may be a box shape including a hollow area R.

Next, referring to FIG. 6( b ), the mask unit sheet portion 220 is manufactured. The mask unit sheet portion 220 uses rolling, electroforming, or other film forming processes to manufacture a planar sheet, and then removes the mask unit region CR by laser scribing, etching, or the like, so that it can be manufactured. In this specification, a 6×5 mask cell region CR (CR11~CR56) is formed as an example for description. There may be five first grid sheet parts 223 and four second grid sheet parts 225.

Then, the mask unit sheet part 220 may correspond to the edge frame part 210. In the corresponding process, the edge sheet part 221 and the edge frame part 210 may be stretched on all sides of the F1~F4 mask unit sheet part 220 to make the mask unit sheet part 220 stretched flat. correspond. It is also possible to sandwich and stretch the mask unit sheet portion 220 at a plurality of points (as an example of FIG. 6(b), 1 to 3 points) on one side. On the other hand, the F1 and F2 mask unit sheet parts 220 may be stretched along the direction of a part of the sides instead of all sides.

Then, when the mask unit sheet part 220 is made to correspond to the edge frame part 210, the edge sheet part 221 of the mask unit sheet part 220 can be attached by welding W method. Preferably, all sides of W are welded so that the mask unit sheet part 220 is firmly attached to the edge frame part 210, but it is not limited thereto. The welding W should be carried out as close as possible to the corners of the frame portion 210 to minimize the warped space between the edge frame portion 210 and the mask unit sheet portion 220 and improve the adhesion. The welding W part can be generated in a line or spot shape, has the same material as the mask unit sheet part 220, and can be integrated with the edge frame part 210 and the mask unit sheet part 220 medium.

Fig. 7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first manufactures the mask cell sheet portion 220 with the mask cell region CR, and then attaches it to the edge frame portion 210, while the embodiment of FIG. 7 attaches a flat sheet to the edge frame portion 210, A portion of the mask cell region CR is formed.

First, the edge frame part 210 including the hollow region R is provided in the same manner as in (a) of FIG. 6.

Then, referring to FIG. 7( a ), a planar sheet (a planar mask unit sheet portion 220 ′) can be made to correspond to the edge frame portion 210. The mask cell sheet portion 220' is in a planar state in which the mask cell region CR has not yet been formed. In the corresponding process, all sides of the F1 to F4 mask unit sheet portion 220 ′ may be stretched to make the mask unit sheet portion 220 ′ flat and stretched to make it correspond to the edge frame portion 210. It is also possible to sandwich the unit sheet portion 220' at a plurality of points (as an example of FIG. 7(a), 1 to 3 points) and stretch the unit sheet portion 220' on one side. On the other hand, the F1 and F2 mask unit sheet portions 220' may be stretched along a part of the side portions instead of all the side portions.

Then, when the mask unit sheet portion 220' corresponds to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' can be attached by welding W. Preferably, all sides of W are welded so that the mask unit sheet part 220' is firmly attached to the edge frame part 220, but it is not limited thereto. The welding W should be carried out as close as possible to the corners of the edge frame portion 210, so as to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220', and improve the adhesion. The welding W part can be generated in the shape of a line or a spot, which has the same material as the mask unit sheet part 220', and can be integrated into the edge frame part 210 and the mask unit sheet part 220'. Medium.

Then, referring to FIG. 7( b ), the mask cell region CR is formed on the planar sheet (the planar mask cell sheet portion 220 ′). By laser scribing, etching, etc., the sheet material in the portion of the mask cell region CR is removed, so that the mask cell region CR can be formed. In this specification, a 6×5 mask cell region CR (CR11~CR56) is formed as an example for description. When the mask cell region CR is formed, the mask cell sheet portion 220 may be formed, wherein the portion welded W to the edge frame portion 210 becomes the edge sheet portion 221, and includes five first grid sheet portions 223 and 4 second grid sheet parts 225.

FIG. 8 is a schematic diagram showing a mask used to form an existing high-resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern gradually becomes smaller, and the thickness of the mask metal film used therefor must also become thinner. As shown in FIG. 8(a), if a high-resolution OLED pixel 6 is to be realized, the pixel interval and pixel size, etc. (PD->PD') need to be reduced in the mask 10'. In addition, in order to prevent the OLED pixels 6 from being deposited unevenly due to the shadow effect, it is necessary to form the pattern of the mask 10 ′ at an angle 14. However, in the process of forming the pattern 14 obliquely in a thicker mask 10' having a thickness T1 of about 30-50 μm, it is difficult to form a pattern 13 matching it due to the fine pixel interval PD' and pixel size. Therefore, it becomes a factor that causes the yield to decrease in the processing technology. In other words, in order to have a fine pixel interval PD' and to form the pattern 14 obliquely, it is necessary to use a thinner mask 10'.

In particular, in order to achieve high resolution of the UHD level, as shown in FIG. 8(b), only a thin mask 10' with a thickness T2 of 20 μm or less can be used for fine patterning. In addition, in order to achieve ultra-high resolution above UHD, a thin mask 10' with a thickness T2 of 10 μm can be considered.

FIG. 9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask unit C formed with a plurality of mask patterns P and a dummy part DM around the mask unit C. As described above, the mask 100 can be manufactured using a metal sheet produced by electroforming or the like by a calendering process, and a cell C can be formed in the mask 100. The dummy portion DM corresponds to the mask film 110 [mask metal film 110] except for the cell C, and may include only the mask film 110, or include a predetermined dummy portion pattern formed with a form similar to the mask pattern P Mask film 110. The dummy part DM corresponds to the edge of the mask 100 and a part or all of the dummy part DM may be attached to the frame 200 [mask unit sheet part 220].

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 has a plurality of mask cell regions CR (CR11~CR56), it may also have a plurality of masks 100 corresponding to the mask cells C (C11~C56) of each mask cell region CR (CR11~CR56) .

Since one side 101 of the mask 100 is in contact with and attached to the side of the frame 200, it is preferably a flat surface. The planarization process described below can be used to make one surface 101 planar and mirror-finished at the same time. The other side 102 of the mask 100 may face one side of the template 50 described below.

In the following, the mask metal film 110' will be manufactured and supported on the template 50 to manufacture the mask 100. The frame is manufactured by mounting the template 50 supporting the mask 100 on the frame 200 and attaching the mask 100 to the frame 200. A series of processes of the integrated mask will be described.

FIG. 10 is a schematic diagram showing a process of manufacturing a mask metal film by rolling according to an embodiment of the present invention. FIG. 11 is a schematic diagram showing a process of manufacturing a mask metal film by electroforming according to another embodiment of the present invention.

First, the mask metal film 110 may be prepared. As an example, the mask metal film 110 can be prepared by calendering.

Referring to (a) of FIG. 10, the metal sheet manufactured by the rolling process may have a thickness of tens to hundreds of μm based on the manufacturing process. As described above in Figure 8, in order to obtain UHD-level high resolution, only a thin mask metal film 110 with a thickness of 20 μm or less can be used for fine patterning. In order to obtain ultra-high resolution above UHD, it is necessary to use A thin mask metal film 110 with a thickness of 10 μm. However, the mask metal film 110 ′ generated by a rolling process has a thickness of about 25 to 500 μm, so it is necessary to reduce the thickness.

Therefore, a process of planarizing PS on one side of the mask metal film 110' can be further performed. Among them, the planarization PS means that one surface (upper surface) of the mask metal film 110' is mirror-finished, and at the same time, the upper portion of the mask metal film 110' is partially removed to make the thickness thinner. The planarization PS can be performed by the CMP (Chemical Mechanical Polishing) method, and it can be used without limitation as long as it is a well-known CMP method. In addition, the thickness of the mask metal film 110' can be thinned by using a chemical wet etching or dry etching method. In addition to this, a planarization process that thins the thickness of the mask metal film 110' can be used without limitation.

In the process of performing the planarization PS, as an example, during the CMP process, the surface roughness Ra of the upper surface of the mask metal film 110' can be controlled. Preferably, mirroring for further reducing the surface roughness can be performed. Or, as another example, after the PS is planarized through a chemical wet etching or dry etching process, an additional polishing process such as a CMP process may be additionally performed to reduce the surface roughness Ra.

In this way, the mask metal film 110' can be made into a thinner thickness of about 50 μm or less. Therefore, the thickness of the mask metal film 110 is preferably formed at a thickness of about 2 μm to 50 μm, and more preferably, the thickness may be formed at a thickness of about 5 μm to 20 μm. However, it is not necessarily limited to this.

10(b), like FIG. 10(a), the mask metal film 110 can be manufactured by reducing the thickness of the mask metal film 110' manufactured by the calendering process. However, the mask metal film 110' is bonded to the template 50 described below with the temporary bonding part 55 interposed therebetween, and the planarization PS process is performed in this state, thereby reducing the thickness.

As another example, the mask metal film 110 may be prepared by electroforming.

Referring to (a) of FIG. 11, a conductive substrate 21 is prepared. In order to be able to perform electroforming, the base material 21 of the motherboard may be a conductive material. The motherboard can be used as a cathode electrode in electroforming.

As a conductive material, for metals, metal oxides may be formed on the surface, and impurities may be mixed in the metal manufacturing process. For polysilicon substrates, there may be inclusions or grain boundaries (Grain Boundary). For conductive polymer substrates , There may be a high possibility of impurities, and may be weak in strength and acid resistance. Elements such as metal oxides, impurities, inclusions, and grain boundaries that hinder the uniform formation of electromagnetic fields on the surface of the mother board (or cathode) are called "defects". Due to defects, a uniform electromagnetic field cannot be introduced into the cathode of the above-mentioned materials, so that a part of the plating film 110 [or the mask metal film 110] may be formed unevenly.

In the process of realizing ultra-high image quality pixels above the UHD level, the unevenness of the coating film and the coating pattern [mask pattern P] will adversely affect the formation of the pixel. For example, the current QHD image quality is 500~600PPI (pixel per inch), and the pixel size is about 30~50μm, while 4K UHD and 8K UHD have higher resolutions of ~860PPI, ~1600PPI. In addition, the micro-display directly applied to the VR machine or the micro-display inserted into the VR machine aims at ultra-high image quality above about 2000PPI, and the pixel size is about 5-10μm. The pattern width of the FMM and shadow mask used here can be several μm to several tens of μm, preferably less than 30 μm. Therefore, even defects of several μm occupy a large proportion in the pattern size of the mask. Moreover, in order to remove the defects in the cathode of the above-mentioned materials, an additional process for removing metal oxides, impurities, etc. may be performed, and other defects such as etching of the cathode material may also be caused in this process.

Therefore, the present invention can use a mother board (or cathode) of a single crystal material. In particular, it is preferably a single crystal silicon material. In order to have conductivity, a high-concentration doping of ^{10 19} /cm ³ or more can be performed in the mother board of monocrystalline silicon material. The doping can be performed on the entire motherboard or only on the surface of the motherboard.

In addition, as single crystal materials, metals such as Ti, Cu, Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene can be used, including Single crystal ceramics for superconductors such as CH3NH3PbCl3, CH3NH3PbBr3, CH3NH3PbI3, SrTiO3, etc., perovskite structures, and single crystal superalloys for aircraft parts. Metals and carbon-based materials are basically conductive materials. For semiconductor materials, doping at a high concentration of ^{10 19} /cm ³ or more can be performed in order to have conductivity. For other materials, conductivity can be formed by doping or forming oxygen vacancy. The doping can be performed on the entire motherboard or only on the surface of the motherboard.

For the single crystal material, since it does not have defects, it has the advantage of uniformly forming an electromagnetic field on the entire surface during electroforming, so that the plating film 110 can be uniformly formed. The frame-integrated masks 100 and 200 manufactured by uniform coating can further improve the image quality level of the OLED pixels. In addition, since there is no need to perform additional processes for removing and resolving defects, it has the advantages of reducing process costs and improving production efficiency.

11(a) again, then, by using the conductive substrate 21 as a mother board [cathode (Cathode Body)], and arranging the anodes (not shown) at intervals, electroforming is used on the conductive substrate. A plating film 110 [or a mask metal film 110] may be formed on the material 21. The plating film 110 may be formed on the exposed upper surface and side surface of the conductive substrate 21 facing the anode and capable of an electromagnetic field. In addition to the side surface of the conductive substrate 21, a plating film 110 may be formed on a part of the lower surface of the conductive substrate 21.

Then, the edge portion of the plating film 110 is cut by D using a laser, or the exposed portion of the plating film 110 is etched and D is removed after only forming a photoresist layer on the upper portion of the plating film 110. As a result, as shown in (b) of FIG. 11, the plating film 110 can be separated from the conductive base 21.

In addition, before separating the plating film 110 from the conductive substrate 21, heat treatment H may be performed. The present invention is characterized in that in order to reduce the thermal expansion coefficient of the mask 100 and to prevent deformation of the mask 100 and the mask pattern P due to heat, the plating film 110 is separated from the conductive substrate 21 [or the mother board or the cathode] Perform heat treatment H before. The heat treatment can be performed at a temperature of 300°C to 800°C.

Generally, the thermal expansion coefficient of Invar alloy sheet produced by electroforming is higher than that of Invar alloy sheet produced by rolling. Therefore, the thermal expansion coefficient of the Invar alloy sheet can be reduced by heat-treating the Invar alloy sheet, but the Invar alloy sheet may be peeled, deformed, etc. during the heat treatment process. This is caused by the heat treatment of only the Invar alloy sheet, or the heat treatment of only the Invar alloy sheet temporarily bonded to the upper surface of the conductive base 21. However, in the present invention, the plating film 110 is formed not only on the upper part of the conductive substrate 21 but also on parts of the side and lower surface, so even if the heat treatment H is performed, peeling, deformation, etc. will not occur. In other words, since the conductive substrate 21 and the plating film 110 are heat-treated in a tightly bonded state, there is an advantage that peeling, deformation, etc. due to the heat-treatment can be prevented, and the heat-treatment can be performed stably.

The thickness of the mask metal film 110 generated by the electroforming process may be thinner than that of the mask metal film 110 generated by the calendering process. Therefore, although the patterning PS process for reducing the thickness can also be omitted, the composition, crystal structure/fine structure of the surface layer of the gold-plated mask metal film 110 may have different etching characteristics, so it is necessary to perform patterning PS to control the surface characteristics and thickness.

FIGS. 12 to 13 are schematic diagrams illustrating a process of bonding a mask metal film 110 on a template 50 to form a mask 100 and then manufacturing a mask support template according to an embodiment of the present invention.

Referring to FIG. 12(a), a template 50 (template) may be provided. The template 50 is a medium on which the mask 100 is attached to one surface and the mask 100 is moved while supporting the mask 100. One surface of the template 50 is preferably a flat surface to support and carry the flat mask 100. The central part 50a may correspond to the mask unit C of the mask metal film 110, and the edge part 50b may correspond to the dummy part DM of the mask metal film 110. In order to be able to support the mask metal film 110 as a whole, the area of the template 50 is larger than that of the mask metal film 110, and may have a flat shape.

The template 50 is preferably a transparent material to facilitate vision observation and the like during the process of aligning and attaching the mask 100 and the frame 200. In addition, when transparent materials are used, lasers can also pass through. As transparent materials, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al2O3), borosilicate glass, and zirconia can be used. As an example, the template 50 may use BOROFLOAT® 33 material that has excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. In addition, the thermal expansion coefficient of BOROFLOAT® 33 is about 3.3, and the thermal expansion coefficient is very small from the Invar mask metal film 110, which has the advantage of easy control of the mask metal film 110.

In addition, in order to prevent an air gap from occurring between the boundary with the mask metal film 110 [or the mask 100], the contact surface of the template 50 and the mask metal film 110 may be a mirror surface. Taking this into consideration, the surface roughness Ra of one side of the template 50 may be 100 nm or less. In order to realize the template 50 with a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. The surface roughness Ra of a wafer is about 10 nm. There are many products on the market, and the surface treatment process is widely known, so it can be used as a template 50. Since the surface roughness Ra of the template 50 is on the order of nm, it can be at a level with no air gap or almost no air gap, so that the bead WB is easily generated based on laser welding, and the alignment error of the mask pattern P is not affected.

In order for the laser L irradiated from the upper portion of the template 50 to reach the welding portion WP (area where welding is performed) of the mask 100, a laser through hole 51 may be formed in the template 50. The laser through-holes 51 can be formed on the template 50 in a manner corresponding to the positions and the number of the welding parts WP. Since a plurality of welding parts WP are arranged at a predetermined interval on the edge of the mask 100 or the dummy part DM portion, the laser through-hole 51 is also formed in plural at a predetermined interval corresponding thereto. As an example, since a plurality of welding portions WP are arranged at predetermined intervals on both sides (left/right) of the dummy portion DM of the mask 100, the laser through holes 51 may also be on both sides (left/right) of the template 50 A plurality of them may be formed at predetermined intervals.

The laser through-hole 51 does not necessarily correspond to the position and number of the welding part WP. For example, only a part of the laser through hole 51 may be irradiated with the laser L and welded. In addition, a part of the laser through hole 51 that does not correspond to the welding portion WP may be used instead of the alignment mark when aligning the mask 100 and the template 50. Assuming that the material of the template 50 is transparent to the light of the laser L, the laser through hole 51 may not be formed.

A temporary bonding part 55 may be formed on one side of the template 50. Before the mask 100 is attached to the frame 200, the temporary adhesive part 55 can temporarily attach the mask 100 [or the mask metal film 110] to one side of the template 50 and support it on the template 50.

The temporary adhesive part 55 may use an adhesive or an adhesive sheet (thermal release type) that is separable by heating, or an adhesive or an adhesive sheet (UV release type) that is separable by irradiation with UV.

As an example, liquid wax (liquid wax) can be used for the temporary bonding part 55. The liquid wax can be the same wax used in the polishing step of a semiconductor wafer or the like, and its type is not particularly limited. As a resin component mainly used to control adhesion and impact resistance related to maintaining power, liquid wax may include substances and solvents such as acrylic acid, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive part 55 may use SKYLIQUID ABR-4016 including Acrylonitrile butadiene rubber (ABR) as a resin component and n-propanol as a solvent component. A spin coating method is used to form liquid wax on the temporary bonding part 55.

Temporary adhesive part 55, which is a liquid wax, decreases in viscosity at a temperature higher than 85°C to 100°C, and increases in viscosity at a temperature lower than 85°C, and a part of it can be solidified as a solid, so that the mask metal film 110' Fixed and bonded with template 50.

Then, referring to FIG. 12( b ), the mask metal film 110 ′ may be bonded on the template 50. The liquid wax is heated to 85° C. or higher, and after the mask metal film 110' is in contact with the template 50, the mask metal film 110' and the template 50 are passed between the rollers to perform bonding.

According to an embodiment, after baking on the template 50 at 120° C. for 60 seconds, and vaporizing the solvent of the temporary bonding portion 55, the mask metal film lamination process can be performed immediately. The lamination is performed by loading the mask metal film 110 ′ on the template 50 with the temporary adhesive part 55 formed on one surface and passing it between the upper roll of about 100° C. and the lower roll of about 0° C. As a result, the mask metal film 110 ′ can be in contact with the template 50 with a temporary adhesive part 55 interposed therebetween.

FIG. 14 is an enlarged schematic cross-sectional view showing the temporary bonding part 55 according to an embodiment of the present invention. As another example, a thermal release tape (thermal release tape) may be used for the temporary adhesive part 55. A core film 56 (core film) such as a PET film is arranged in the middle of the thermal release tape, and thermal release adhesive layers 57a, 57b (thermal release adhesive) are arranged on both sides of the core film 56. The outer contours of the adhesive layers 57a, 57b can be It is a form in which release films/release films 58a and 58b are arranged. Among them, the mutual peeling temperature of the adhesive layers 57a, 57b arranged on both sides of the core film 56 may be different from each other.

According to one embodiment, with the release film/release film 58a, 58b removed, the lower surface of the thermal peeling tape [the second adhesive layer 57b] is adhered to the template 50, and the upper surface of the thermal peeling tape [the first adhesive layer] 57a] can be bonded to the mask metal film 110'. Since the first adhesive layer 57a and the second adhesive layer 57b have mutually different peeling temperatures, when the template 50 is separated from the mask 100 in FIG. 17 described later, by applying heat to peel off the first adhesive layer 57a, the mask 100 can be separated from the template 50 and the temporary bonding part 55.

Next, referring to FIG. 12(b) again, one side of the PS mask metal film 110' can be planarized. As described above in FIG. 10, the mask metal film 110' manufactured by the calendering process can be reduced in thickness (110'->110) through the planarization PS process. In addition, in order to control the surface characteristics and thickness, the mask metal film 110 manufactured by the electroforming process may also be subjected to a planarization PS process.

Thus, as shown in (c) of FIG. 12, as the thickness of the mask metal film 110 ′ decreases (110 ′->110), the thickness of the mask metal film 110 may be about 5 μm to 20 μm.

Then, referring to (d) of FIG. 13, the patterned insulating portion 25 may be formed on the mask metal film 110. The insulating part 25 may be formed of a photoresist material by a printing method or the like.

Next, the mask metal film 110 may be etched. Methods such as dry etching, wet etching, etc. can be used without limitation. As a result of the etching, the portion of the mask metal film 110 exposed from the blank space 26 between the insulating portions 25 can be etched. The etched portion of the mask metal film 110 constitutes the mask pattern P, so that the mask 100 in which a plurality of mask patterns P are formed can be manufactured.

Then, referring to FIG. 13( e ), the manufacturing of the template 50 for supporting the mask 100 can be completed by removing the insulating portion 25.

Since the frame 200 has a plurality of mask cell regions CR (CR11~CR56), it may also have a plurality of masks 100 having a mask corresponding to each mask cell region CR (CR11~CR56) Unit C (C11~C56). In addition, there may be a plurality of templates 50 for supporting each of the plurality of masks 100 respectively.

FIG. 15 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.

15, the template 50 may be transferred based on the vacuum chuck 90. The vacuum chuck 90 can be used to suck and transfer the opposite side of the surface of the template 50 to which the mask 100 is bonded. The vacuum chuck 90 can be connected to a moving means (not shown) that moves to the x, y, z, and θ axes. In addition, the vacuum chuck 90 may be connected to a flipping means (not shown) for flipping by sucking the template 50. As shown in (b) of FIG. 16, during the process of transferring the template 50 to the frame 200 after the vacuum chuck 90 sucks and turns over the template 50, the bonding state and the alignment state of the mask 100 are also not affected.

16 is a schematic diagram showing a state in which a template is mounted on a frame after the temperature of a process area is increased, and the mask is corresponding to a unit area of the frame according to an embodiment of the present invention. The method of corresponding/attaching one mask 100 to the cell region CR is illustrated in FIG. 16, and the process of simultaneously corresponding to multiple masks 100 to all the cell regions CR and attaching the mask 100 to the frame 200 can also be performed. . In this case, there may be a plurality of templates 50 for supporting a plurality of masks 100 respectively.

Then, referring to FIG. 16, after the temperature of the process area is increased by ET, the mask 100 can be mapped to one mask cell area CR of the frame 200. The present invention is characterized in that in the process of mapping the mask 100 to the mask unit area CR of the frame 200, no stretching force is applied to the mask 100.

Since the mask unit sheet portion 220 of the frame 200 has a very thin thickness, if the mask 100 is attached to the mask unit sheet portion 220 in a state where a stretching force is applied, the remaining stretch on the mask 100 Force may act on the mask unit sheet portion 220 and the mask unit area CR and deform them. Therefore, the mask 100 should be attached to the mask unit sheet portion 220 in a state where no tensile force is applied to the mask 100. Therefore, it is possible to prevent the tensile force applied to the mask 100 from acting on the frame 200 in the form of tension to deform the frame 200 [or the mask unit sheet portion 220].

However, the mask 100 is attached to the frame 200 [or the mask unit sheet portion 220] without applying tensile force to manufacture a frame-integrated mask, and the frame-integrated mask can be used in a pixel deposition process. A problem occurred. When the pixel deposition process is performed at a temperature of about 25 to 45° C., the mask 100 expands by a predetermined length. Even for the mask 100 made of Invar alloy material, its length will vary by about 1 to 3 ppm based on a temperature rise of about 10° C. for forming the atmosphere of the pixel deposition process. For example, when the total length of the mask 100 is 500 mm, its length can be increased by about 5-15 μm. As a result, the mask 100 sags due to its own weight, or the mask 100 is stretched while being fixed to the frame 200 and deformed such as twisting, and at the same time, there is a problem that the alignment error between the patterns P becomes large.

Therefore, the present invention is characterized in that the mask 100 is attached to the mask unit region CR of the frame 200 in a state where no tensile force is applied to the mask 100 at an extraordinary temperature higher than normal temperature. In this specification, it is stated that after the temperature of the process area is increased to the first temperature ET, the mask 100 is corresponding to the frame 200 and attached.

The "process area" may refer to a space for placing constituent elements such as the mask 100 and the frame 200, and for performing an attaching process of the mask 100 and the like. The process area can also be a space in a sealed chamber or an open space. Moreover, the “first temperature” may refer to a temperature equal to or higher than the temperature of the pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the temperature of the pixel deposition process is about 25°C to 45°C, the first temperature may be about 25°C to 60°C. The temperature increase in the process area can be performed by providing a heating means in the chamber, or a method of providing a heating means around the process area, or the like.

16 again, after the temperature of the process area including the frame 200 is increased to the first temperature ET, the mask 100 may be mapped to the mask cell area CR. Alternatively, after the mask 100 is mapped to the mask cell area CR, the temperature of the process area including the frame 200 may be increased to the first temperature ET.

By loading the template 50 on the frame 200 [or the mask unit sheet part 220], the mask 100 can be mapped to the mask unit area CR. While controlling the position of the template 50/vacuum chuck 90, it is possible to observe through a microscope whether the mask 100 corresponds to the mask unit area CR. Since the template 50 presses the mask 100, the mask 100 can be closely attached to the frame 200. Since the mask 100 can be mapped to the mask unit region CR by controlling the position of the template 50, any stretching force may not be directly applied to the mask 100.

In addition, the lower support body 70 may be further arranged at the lower portion of the frame 200. The lower support body 70 has a size that can enter the hollow area R of the frame edge portion 210 and may be a flat plate. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask unit sheet portion 220 may be formed on the upper surface of the lower support body 70. In this case, since the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are inserted in the supporting groove, the mask unit sheet portion 220 is more firmly fixed.

The lower support 70 may press the opposite surface of the mask unit region CR that the mask 100 contacts. That is, the lower support body 70 supports the mask unit sheet portion 220 in the upward direction, thereby preventing the mask unit sheet portion 220 from sagging in the downward direction during the process of attaching the mask 100. At the same time, since the lower support 70 and the template 50 press the edges of the mask 100 and the frame 200 [or the mask unit sheet portion 220] in opposite directions, the alignment state of the mask 100 can be maintained without Was disrupted.

In this way, only by attaching the mask 100 to the template 50 and loading the template 50 on the frame 200, the process of mapping the mask 100 to the mask unit area CR of the frame 200 can be ended, and the process can be corrected. The mask 100 does not apply any tensile force.

Next, the laser L may be irradiated to the mask 100 and the mask 100 may be attached to the frame 200 based on laser welding. A welding bead WB is generated on the welding part WP part of the mask welded by the laser, and the welding bead WB may have the same material as the mask 100/frame 200 and be integrally connected with them.

FIG. 17 is a schematic diagram showing a process of separating the mask 100 from the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 17, after the mask 100 is attached to the frame 200, the mask 100 and the template 50 may be separated (debonding). The separation of the mask 100 and the template 50 can be performed by heating EP, chemical treatment CM, applying ultrasonic waves US, and applying ultraviolet UV to the temporary bonding part 55 by at least any one of them. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. As an example, if heat EP at a temperature higher than 85° C. to 100° C. is applied, the viscosity of the temporary bonding portion 55 decreases, and the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 can be separated. As another example, the mask 100 and the template 50 can be separated by immersing the temporary bonding part 55 in a chemical substance such as IPA, acetone, ethanol, etc. to dissolve or remove the temporary bonding part 55. As another example, the adhesive force between the mask 100 and the template 50 can be weakened by applying ultrasonic waves US or applying ultraviolet rays, so that the mask 100 and the template 50 can be separated.

Furthermore, the temporary bonding part 55 as a medium for bonding the mask 100 and the template 50 is a TBDB bonding material (temporary bonding & debonding adhesive), so that various debonding methods can be used.

As an example, a solvent separation (Solvent Debonding) method based on chemical treatment of CM can be used. The temporary bonding part 55 can be dissolved and separated based on the penetration of a solvent. At this time, the pattern P is already formed on the mask 100, so the solvent can penetrate through the mask pattern P and the boundary between the mask 100 and the template 50. Solvent separation can be carried out at room temperature. Since no additional complicated separation equipment is required, it has the advantage of being relatively inexpensive compared to other separation methods.

As another example, a heat separation (Heat Debonding) method based on heating EP can be used. By using high-temperature heat to induce the decomposition of the temporary adhesive part 55, if the adhesive force between the mask 100 and the template 50 is weakened, the separation can be carried out in the up and down direction or the left and right direction.

As another example, a Peelable Adhesive Debonding (Peelable Adhesive Debonding) method based on heating EP, applying ultraviolet UV, or the like can be used. When the temporary bonding part 55 is a thermal peeling tape, the peeling adhesive separation method can be used for separation. This method does not require high-temperature heat treatment such as the thermal separation method and does not require additional expensive heat treatment equipment, which has the advantage of relatively simple process.

As another example, a room temperature separation (Room Temperature Debonding) method based on chemical treatment of CM, application of ultrasonic waves US, application of ultraviolet rays UV, and the like can be used. If the non-sticky process is performed on a part (central part) of the mask 100 or the template 50, the temporary adhesive part 55 is used to adhere only to the edge part. In addition, during separation, the solvent penetrates to the edge portion to dissolve the temporary adhesive portion 55 to achieve separation. This method has the advantages of no direct loss of the remaining parts except the edge regions of the mask 100 and the template 50 during the bonding and separation process or the defects caused by the residue of the bonding material during the separation. In addition, unlike the thermal separation method, since high-temperature heat treatment is not required during separation, it has the advantage of relatively reducing process costs.

FIG. 18 is a schematic diagram showing a state in which the mask 100 is corresponding to the cell region CR of the adjacent frame 200 according to an embodiment of the present invention.

Referring to FIG. 18, the mask 100 may be corresponding to the mask cell region CR121 adjacent to the mask cell region CR111 to which the mask 100 is attached. The temperature of the process area can maintain the state of rising to the first temperature ET in FIG. 16. As a result, the mask 100 can maintain the volume at the first temperature in a state where no stretching force is applied.

The mask 100 can be mapped to the mask unit area CR121 by loading the template 50 on the frame 200 [or the mask unit sheet part 220]. The method of mapping the mask 100 to the mask unit region CR121 by controlling the position of the template 50 is the same as the process in FIG. 16. In addition, the mask 100 may first correspond to the mask cell region CR other than the mask cell region CR121 adjacent to the mask cell region CR111.

Next, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 and based on laser welding. Solder beads WB are formed on the welding part of the laser-welded mask, and the solder beads WB may have the same material as the mask 100/frame 200 and be integrally connected with them.

FIG. 19 is a schematic diagram illustrating a process of separating the mask 100 from the template 50 after attaching the mask 100 to the cell region CR of the adjacent frame 200 according to an embodiment of the present invention.

Referring to FIG. 19, after the mask 100 is attached to the frame 200, the mask 100 and the template 50 may be separated (debonding). The separation of the mask 100 and the template 50 can be performed by at least any one of heating EP, chemical treatment CM, applying ultrasonic waves US, and applying ultraviolet UV to the temporary bonding part 55. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. This is the same as the content described in FIG. 17.

FIG. 20 is a schematic diagram showing a state in which a mask is attached to a frame according to an embodiment of the present invention.

Then, referring to FIG. 20, a process of mapping and attaching the mask 100 to the remaining mask unit region CR may be performed. All the masks 100 may be attached on the mask unit area CR of the frame 200.

The existing mask 10 of FIG. 1 includes 6 cells C1 to C6, and therefore has a relatively long length, while the mask 100 of the present invention includes one cell C, and therefore has a relatively short length, and therefore PPA (pixel position accuracy) is distorted. The degree will become smaller. Assuming that the length of the mask 10 including a plurality of cells C1 to C6... is 1m, and a PPA error of 10μm occurs in the total length of 1m, the mask 100 of the present invention can be reduced with the relative length (equivalent to cell C The number is reduced) and the above error range becomes 1/n. For example, the mask 100 of the present invention has a length of 100 mm, which has a length reduced from 1 m of the existing mask 10 to 1/10. Therefore, a PPA error of 1 μm occurs in a total length of 100 mm, which significantly reduces the alignment error.

On the other hand, the mask 100 includes a plurality of cells C, and even if each cell C corresponds to each cell area CR of the frame 200, the alignment error is still minimized, the mask 100 can also be more than the frame 200. Each mask cell area CR corresponds to each other. Alternatively, the mask 100 having a plurality of cells C may also correspond to one mask cell region CR. In this case, in consideration of the process time and productivity based on alignment, the mask 100 is preferably provided with as few cells C as possible.

In the present invention, it is only necessary to match one cell C of the mask 100 and confirm the alignment state. Therefore, compared with the existing method that matches multiple cells C (C1 to C6) at the same time and needs to confirm all the alignment states, The manufacturing time can be significantly reduced.

That is, the manufacturing method of the frame-integrated mask of the present invention is compared with the conventional method of matching 6 cells C1 to C6 at the same time and confirming the alignment state of the 6 cells C1 to C6 at the same time. Each of the cells C11~C16 corresponds to a cell area CR11~CR16, and the time can be significantly shortened through the 6 processes of confirming the alignment status of each.

In addition, in the manufacturing method of the frame-integrated mask of the present invention, the product yield during 30 times of alignment and alignment of 30 masks 100 with 30 cell regions CR (CR11 to CR56) can be It is significantly higher than the yield of the existing product in five processes in which five masks 10 each including six cells C1 to C6 (see FIG. 2(a)) correspond to and align with the frame 20. Because the existing method of aligning the 6 cells C1 to C6 in the area corresponding to the 6 cells C at a time is an obviously tedious and difficult operation, and the product yield is low.

FIG. 21 is a schematic diagram illustrating a process of lowering the temperature of the process area LT after attaching the mask 100 to the cell area CR of the frame 200 according to an embodiment of the present invention.

Then, referring to FIG. 21, the temperature of the process area is lowered to the second temperature LT. The "second temperature" may refer to a temperature lower than the first temperature. Considering that the first temperature is about 25°C to 60°C, the second temperature is assumed to be lower than the first temperature, and may be about 20°C to 30°C. Preferably, the second temperature may be normal temperature. The temperature drop of the process area can be performed by a method of providing a cooling means in the chamber or a cooling means around the process area, a method of natural cooling at room temperature, and the like.

If the temperature of the process area drops to the second temperature LT, the mask 100 may be thermally shrunk by a predetermined length. The mask 100 may be thermally shrunk isotropically along all side directions. However, since the mask 100 is fixedly connected to the frame 200 [or the mask unit sheet portion 220] by welding W, the thermal shrinkage of the mask 100 itself applies tension TS to the surrounding mask unit sheet portion 220. Based on the tension TS applied by the mask 100 itself, the mask 100 may be more tightly attached to the frame 200.

In addition, after each mask 100 is completely attached to the corresponding mask unit area CR, the temperature of the process area will drop to the second temperature LT, so that all the masks 100 are thermally contracted at the same time, thus causing deformation of the frame 200 Or there is a problem that the alignment error of the pattern P becomes large. To further illustrate, even if the tension TS is applied to the mask unit sheet portion 220, since the plurality of masks 100 apply tensions TS contracting in opposite directions, the tensions TS cancel each other out, so no occurrence of the mask unit sheet portion 220 Deformed. For example, in the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area, the mask 100 attached to the CR11 cell area acts on the right side. The tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell area can cancel each other out. Therefore, by minimizing the deformation of the frame 200 [or the mask unit sheet portion 220] due to the tension TS, there is an advantage that the alignment error of the mask 100 [or the mask pattern P] can be minimized.

FIG. 22 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

22, the OLED pixel deposition apparatus 1000 includes a magnetic plate 300 containing a magnet 310 and arranged with cooling water pipes 350; and a deposition source supply part 500 that supplies organic material 600 from a lower portion of the magnetic plate 300.

A target substrate 900 such as glass for depositing the organic matter source 600 may be inserted between the magnetic plate 300 and the deposition source deposition part 500. The target substrate 900 may be provided with a frame-integrated mask 100, 200 (or FMM) for depositing the organic matter source 600 according to different pixels in a close or very close manner. The magnet 310 can generate a magnetic field and tightly adhere to the target substrate 900 through the magnetic field.

The deposition source supply part 500 can reciprocate left and right paths and supply the organic material source 600. The organic material source 600 supplied by the deposition source supply part 500 can be attached to one side of the target substrate 900 through the pattern P formed on the frame-integrated mask 100, 200. The organic material source 600 deposited after passing through the pattern P of the frame-integrated mask 100 and 200 can be used as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 due to the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed obliquely S (or formed in a tapered S). The organic material source 600 passing through the pattern in the diagonal direction along the inclined surface can also contribute to the formation of the pixel 700, and therefore, the pixel 700 can be deposited with a uniform thickness as a whole.

At a first temperature higher than the temperature of the pixel deposition process, the mask 100 is attached and fixed on the frame 200, so even if it is raised to the temperature used for the pixel deposition process, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto can be maintained to be no more than 3 μm.

FIG. 23 is a schematic diagram showing a problem when the mask is separated from the frame-integrated mask.

In addition, when defects such as impurities are included in the mask 100 attached to the frame 200 or the mask pattern P is damaged, it is necessary to replace the mask 100. Or, when the mask 100 is attached to the frame 200 but a part of the mask pattern P is incorrectly aligned, it is also necessary to replace the mask 100 to make the alignment accurate.

Referring to FIG. 23, the existing method is a method in which physical force is applied to the mask 100 welded on the frame 200 and the mask 100 is separated from the frame 200. For example, when a defect occurs in the mask 100 attached to the cell region CR11, the mask 100 needs to be removed, but when the mask 100 is separated from the frame 200, due to the remaining cell regions CR12, CR13 except for the cell region CR11 , CR21, ... by the tension TS of the mask 100 attached, the frame 200 may be slightly deformed. This deformation may cause alignment errors of the mask pattern P and the mask unit C to occur sequentially along the PL line (refer to the enlarged part of FIG. 23). That is, as any one of the masks 100 [the mask 100 of the cell area CR111] is separated from the frame 200, the forces that cancel each other by applying the tension TS in the opposite directions from the plurality of masks 100 will act on the frame 200 again, thereby An alignment error has occurred.

Therefore, the present invention is characterized in that after readjusting to the state where such tension TS does not act on the frame 200, the target mask 100 that has a defect and needs to be separated/replaced is separated/replaced.

24 to 26 are schematic diagrams showing a process of separating and replacing the mask 100 from the frame-integrated mask according to an embodiment of the present invention. As an example, it is assumed that the description will be made by taking the separation/replacement of the target mask 100 including the mask unit C11 from the frame 200 as an example. In addition, it is assumed that the left and right corners of the mask 100 are welded and attached to the frame 200 [mask unit sheet portion 220] as an example, but the same applies to a mask with all four sides welded. 100.

Referring to FIG. 24, first, the temperature of the process area can be increased to the first temperature ET. The first temperature may refer to a temperature equal to or higher than the temperature of the pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature may be about 25 to 45°C, the first temperature may be about 25 to 60°C. This is the same as the case of rising to the first temperature ET in FIG. 16.

If the temperature of the process area rises to the first temperature ET, the thermally contracted mask 100 simultaneously generates a predetermined thermal expansion. The degree of thermal expansion corresponds to the degree of release of the tension TS. In other words, if the temperature of the process area rises to the first temperature ET, the tension TS applied to the mask 100 attached to the frame 200 will be released. As a result, the mask 100 and the frame 200 can be changed to a stree free state.

Then, referring to FIG. 25, the target mask 100 may be separated from the frame 200. The mask can be separated from the frame 200 by applying a physical force to the target mask 100. However, in order to prevent deformation caused by the force acting on the frame 200, it is necessary to squeeze the remaining side when one side is peeled off.

After peeling off one side corner (right corner) of the mask 100 including the mask unit C11 from the frame 200, the other side corner (left corner) can be peeled off from the frame 200. Specifically, one side corner of the mask 100 may be attached to the first grid sheet portion 223 as the right corner of the mask unit region CR111. Therefore, when the mask 100 is peeled off by applying an external force to the corners of one side of the mask, the adhesion of the mask 100 and the frame 200 [the first grid sheet portion 223] causes the first grid sheet portion 223 to become uncomfortable. Part of the problem is deformed. Therefore, it is necessary to remove the mask 100 after tightly fixing the frame 200 [the first grid sheet portion 223].

In order to firmly fix the frame 200 against external forces, the outer part of one side corner (right side corner) of the mask 100 that can directly act on the external force is squeezed. That is, the part of the frame 200 [the first grid sheet portion 223] located outside the corner of the attached mask 100 can be pressed. The pressing is preferably performed on both the upper surface and the lower surface of the portion of the frame 200 [first grid sheet portion 223] that is closer to the outside than one side corner. The upper surface can be squeezed using a pressure bar (not shown), and the lower surface can be squeezed using the lower support 70 [refer to FIG. 16] for supporting the frame 200. When the other side corner (left corner) is peeled off from the frame 200, the outer part of the other side corner (left corner) can also be squeezed.

Then, referring to FIG. 26, the new mask 100 to be replaced may be mapped to the mask unit area CR111. The mask 100 can be mapped to the mask unit area CR111 by loading the template 50 on the frame 200 [or the mask unit sheet part 220]. Next, the laser L is irradiated to the mask 100 and the mask 100 is attached to the frame 200 based on laser welding. This is the same process as in Figure 16.

Then, the temperature of the process zone can be lowered to the second temperature LT. Considering that the first temperature is about 25°C to 60°C, and the second temperature is lower than the first temperature, it may be about 20°C to 30°C. Preferably, the second temperature may be normal temperature. This is the same as the case where the temperature drops to the second temperature LT in FIG. 21.

If the temperature of the process area drops to the second temperature LT, the mask 100 may be thermally shrunk by a predetermined length. The mask 100 may be thermally shrunk in the lateral direction. At the same time, since the plurality of masks 100 apply tension TS in opposite directions to each other, the forces cancel each other out. Therefore, the mask unit sheet portion 220 does not deform.

As described above, when the defective mask 100 is separated/replaced, since the separation/replacement is performed in a stress-free state by raising the temperature of the process area to the first temperature, the deformation of the frame 200 can be prevented, and the deformation of the frame 200 can be prevented. The occurrence of alignment errors of the mask pattern P and the mask unit C has the advantage of stably separating/replacement of the mask 100.

As described above, the present invention exemplifies preferred embodiments for illustration and description, but is not limited to the above-mentioned embodiments, and those skilled in the art can make various modifications and changes within the scope not departing from the spirit of the present invention. Such deformations and changes fall within the scope of the present invention and the attached patent application.

6: OLED pixels 10, 10': mask 11: Mask film 13: pattern 20: Frame 26: Blank space 50...template 50a: Center 50b: Edge 51: Laser through hole 55: Temporary bonding part 56: core membrane 57a: The first adhesive layer 57b: second adhesive layer 58a, 58b: release film/release film 70: Lower support 90: vacuum suction cup 100: mask 101: One side of the mask 102: The other side of the mask 110, 110': mask film, mask metal film 200: frame 210: edge frame 220: Mask unit sheet section 221: Edge sheet section 223: The first grid sheet part 225: The second grid sheet part 300: magnetic plate 310: Magnet 500: Deposition Source Supply Department 600: Organic Source 700: pixels 900: target substrate 1000: OLED pixel deposition device C: C (C1~C6, C11~C56): unit, mask unit CM: Chemical treatment CR (CR11~CR56): Mask unit area D1~D1", D2~D2": distance DM: dummy part, mask dummy part ET: Raise the temperature of the process area to the first temperature EP: heating F1~F2: Stretching force L: Laser LT: Decrease the temperature of the process area to the second temperature P: Mask pattern PD': pixel interval PS: Flattening R: The hollow area of the edge frame Ra: surface roughness T1, T2: thickness US: Ultrasound UV: Ultraviolet W: welding WB: Solder bead WP: Welding Department

FIG. 1 is a schematic diagram showing a conventional mask for OLED pixel deposition. Fig. 2 is a schematic diagram showing a conventional process of attaching a mask to a frame. FIG. 3 is a schematic diagram showing that an alignment error between units occurs in the process of stretching a mask in the prior art. 4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention. Fig. 5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention. Fig. 6 is a schematic diagram showing a frame manufacturing process related to an embodiment of the present invention. Fig. 7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. FIG. 8 is a schematic diagram showing a conventional mask used to form a high-resolution OLED. Fig. 9 is a schematic diagram showing a mask according to an embodiment of the present invention. FIG. 10 is a schematic diagram showing a process of manufacturing a mask metal film by rolling according to an embodiment of the present invention. FIG. 11 is a schematic diagram showing a process of manufacturing a mask metal film by electroforming according to another embodiment of the present invention. FIGS. 12 to 13 are schematic diagrams illustrating a process of manufacturing a mask support template by bonding a mask metal film on the template and forming a mask according to an embodiment of the present invention. Fig. 14 is an enlarged schematic cross-sectional view showing a temporary bonding portion according to an embodiment of the present invention. FIG. 15 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention. 16 is a schematic diagram showing a state in which the template is loaded on the frame after the temperature of the process area is increased and the mask is mapped to the unit area of the frame according to an embodiment of the present invention. FIG. 17 is a schematic diagram showing a process of separating the mask from the template after attaching the mask to the frame according to an embodiment of the present invention. FIG. 18 is a schematic diagram showing a state in which a mask is associated with a unit area of an adjacent frame according to an embodiment of the present invention. 19 is a schematic diagram showing a process of separating the mask from the template after attaching the mask to the unit area of the adjacent frame according to an embodiment of the present invention. FIG. 20 is a schematic diagram showing a state in which a mask is attached to a frame according to an embodiment of the present invention. FIG. 21 is a schematic diagram showing a process of lowering the temperature of a process area after attaching a mask to a cell area of a frame according to an embodiment of the present invention. FIG. 22 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention. FIG. 23 is a schematic diagram showing a problem when the mask is separated from the frame-integrated mask. 24 to 26 are schematic diagrams showing a process of separating and replacing the mask from the frame-integrated mask according to an embodiment of the present invention.

50: template

51: Laser through hole

70: Lower support

90: vacuum suction cup

100: mask

200: frame

210: edge frame

221: Edge sheet section

223: The first grid sheet part

225: The second grid sheet part

C (C11, C12, C13): unit, mask unit

CM: Chemical treatment

CR (CR13, CR21, CR22, CR23): mask unit area

ET: Raise the temperature of the process area to the first temperature

EP: heating

US: Ultrasound

UV: Ultraviolet

W: welding

WB: Solder bead

Claims (14)

A method for manufacturing a frame-integrated mask. The frame-integrated mask is integrally formed by a plurality of masks and a frame for supporting the mask. The method is characterized in that the method includes: (a) preparing a template with a mask adhered to it The step of supporting a template with a plurality of mask patterns formed on the mask; (b) a step of raising the temperature of a process area including a frame with a plurality of mask unit areas to a first temperature; (c) ) The step of loading the template on the frame and corresponding the mask to the mask unit area of the frame; (d) the step of attaching the mask to the frame; (e) repeating steps (c) to (d) to mask The step of attaching the mold to all mask unit areas of the frame; and (f) the step of lowering the temperature of the process area including the frame to the second temperature; wherein, in step (c), no stretching is applied to the mask, and Only by controlling the position of the template, the mask on the template is mapped to the mask unit area. The method for manufacturing a frame-integrated mask according to claim 1, wherein the step (a) includes: (a1) bonding a mask metal film to a template with a temporary bonding portion formed on one side; and ( a2) A mask is manufactured by forming a mask pattern on a mask metal film, thereby providing a step of a mask support template with a mask adhered to the template, and a plurality of mask patterns are formed on the mask. The method for manufacturing a frame-integrated mask according to claim 2, characterized in that, between step (a1) and step (a2), the method further includes a step of reducing the thickness of the mask metal film adhered to the template. The method for manufacturing a frame-integrated mask according to claim 2, wherein the temporary bonding part is an adhesive or an adhesive sheet that is separable by heating, and an adhesive or an adhesive sheet that is separable by UV irradiation. The method for manufacturing a frame-integrated mask according to claim 2, wherein the step (a2) includes: (a2-1) a step of forming a patterned insulating portion on the mask metal film; (a2- 2) A step of forming a mask pattern by etching the portion of the mask metal film exposed between the insulating portions; and (a2-3) a step of removing the insulating portion. The method of manufacturing a frame-integrated mask according to claim 1, wherein in step (d), the laser irradiated on the upper part of the template is irradiated to the welding part of the mask through the laser through hole. The method for manufacturing a frame-integrated mask according to claim 1, wherein the first temperature is greater than or equal to the OLED pixel deposition process temperature, the second temperature is at least lower than the first temperature, and the first temperature is 25° C. to 60° C. The second temperature is lower than the first temperature and is any temperature from 20°C to 30°C, and the OLED pixel deposition process temperature is any temperature from 25°C to 45°C. Fabrication of the frame-integrated mask as described in claim 1 The manufacturing method is characterized in that, in step (f), if the temperature of the process area is lowered to the second temperature, the mask attached to the frame is contracted and subjected to tension. The method for manufacturing a frame-integrated mask according to claim 1, characterized in that, between step (d) and step (e), the method further includes heating, chemically treating, applying ultrasonic waves, and applying the temporary bonding portion between step (d) and step (e). At least any one of ultraviolet rays is used to separate the mask from the template. A mask separation/replacement method for a frame-integrated mask. The frame-integrated mask is integrally formed by a plurality of masks and a frame for supporting the mask. The method is characterized in that the method includes: (a) including a frame The step of raising the temperature of the process area to the first temperature; (b) the step of separating the target mask from the frame; (c) preparing the mask support template with the mask adhered to the template, and loading the template on the frame, thereby The step of mapping the mask to the area of the mask unit after the target mask is separated, and a plurality of mask patterns are formed on the mask; (d) the step of attaching the mask to the frame; (e) Including the step of lowering the temperature of the process area of the frame to the second temperature; wherein, in step (c), no stretching is applied to the mask, and only the position of the template is controlled to correspond to the mask on the template to the mask unit area . The mask separation/replacement method for a frame-integrated mask according to claim 10, wherein the first temperature is greater than or equal to The OLED pixel deposition process temperature, the second temperature is at least lower than the first temperature, the first temperature is any temperature from 25°C to 60°C, and the second temperature is lower than the first temperature and is any temperature from 20°C to 30°C, The OLED pixel deposition process temperature is any temperature from 25°C to 45°C. The mask separation/replacement method of the frame-integrated mask according to claim 10, wherein, in step (a), if the temperature of the process area is raised to the first temperature, the mask attached to the frame is The tension applied to the mold is released. The mask separation/replacement method for a frame-integrated mask according to claim 10, characterized in that, in step (e), if the temperature of the process area is lowered to the second temperature, the The mask shrinks and bears tension. The mask separation/replacement method for a frame-integrated mask according to claim 10, characterized in that, in step (b), the outer frame of at least one corner of the target mask to be separated/replaced is pressed Part and separate the mask from the frame by applying an external force to one edge of the mask.

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