TWI809045B - resin composition for sealing - Google Patents

Abstract

The present invention is to provide a resin composition for sealing that is excellent in moisture barrier properties and can suppress deterioration of elements such as EL elements due to moisture penetrating into the resin composition without performing a drying step before the sealing step. The present invention is a resin composition for sealing, which contains hydrotalcite and calcium oxide.

Description

resin composition for sealing

The present invention relates to a resin composition for sealing, and particularly relates to a resin composition for sealing suitable for sealing light-emitting elements such as organic EL (Electroluminescence) elements or light-receiving elements such as solar cells.

The organic EL element is a light-emitting element that uses an organic substance as a light-emitting material, and has attracted attention in recent years because it can obtain low-voltage and high-brightness light emission. However, organic EL elements are extremely weak to moisture, and the light-emitting material (light-emitting layer) will deteriorate due to water, resulting in reduced brightness, or failure to emit light, or the interface between the electrode and the light-emitting layer will be peeled off due to the influence of water, or metal oxidation will cause high resistance. The problem. Therefore, in order to shield the inside of the element from moisture in the outside air, for example, the organic EL element is sealed by forming a sealing layer with a resin composition so as to cover the entire surface of the light emitting layer formed on the substrate. In addition, in order to prevent the intrusion of moisture from the edge of the sealing layer of the organic EL device, there are cases where the sealing layer is provided on the edge using a resin composition for sealing called a dam material. In addition, there is also known a dam-fill sealing in which the overall sealing of the light emitting layer by a liquid sealing material (fill material) and the edge sealing by a dam material are combined. High moisture barrier properties (also referred to as barrier properties and moisture permeability resistance) are required for the sealing layer of such an organic EL element.

Patent Document 1 proposes a resin composition for sealing that uses hydrotalcite as a moisture absorbing agent and is excellent in moisture barrier properties. However, in resin compositions containing hydrotalcite, water reversibly infiltrates into the resin composition during the manufacturing process or distribution process, causing deterioration of organic EL devices and the like. As a method for removing moisture penetrating into this resin composition, Patent Document 2 discloses a method of drying a sealing sheet in a short time by using near-infrared rays and heating together. However, in this method, there is a problem that an increase in the number of steps in the manufacturing process and introduction of drying equipment are required. [Prior Art Literature] [Patent Document]

[Patent Document 1] WO2015/068787A [Patent Document 2] WO2016/152756A

The present invention was accomplished in view of the above-mentioned matters, and the problem to be solved is to provide a product that has excellent moisture barrier properties and can suppress EL caused by moisture penetrating into the resin composition even without performing a drying step before the sealing step. Resin composition for encapsulation of deterioration of elements such as components.

As a result of diligent research by the present inventors to solve the above-mentioned problems, they found that the above-mentioned problems can be solved by mixing calcium oxide into a sealing resin composition containing hydrotalcite, and finally completed the present invention. That is, the present invention has the following features.

[1] A sealing resin composition containing hydrotalcite and calcium oxide.

[2] The resin composition for sealing according to the above [1], wherein the ratio of calcium oxide to the hydrotalcite is 0.1 to 1 in mass ratio.

[3] The resin composition for sealing according to [1] or [2] above, wherein the hydrotalcite content is 10% by mass to 70% by mass relative to 100% by mass of the non-volatile content of the resin composition.

[4] The resin composition for sealing according to any one of [1] to [3] above, which further contains at least one resin selected from acrylic resins and epoxy resins.

[5] The resin composition for sealing according to any one of [1] to [3] above, which further contains at least one kind of acrylic resin.

[6] The resin composition for sealing according to [4] or [5] above, wherein the acrylic resin is a compound having three or more ethylenically unsaturated groups in one molecule.

[7] The resin composition for sealing according to any one of [4] to [6] above, wherein the acrylic resin has two or more ethylenically unsaturated groups and an alicyclic structure in one molecule. compound.

[8] The sealing resin composition according to [6] or [7], wherein the ethylenically unsaturated group is a (meth)acryl group.

[9] The sealing resin composition as described in [7] or [8] above, which is Among them, the amount of the compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule is 5 to 75 mass % with respect to the entire resin composition.

[10] The resin composition for sealing according to any one of [1] to [9] above, wherein the hydrotalcite is semi-fired hydrotalcite.

[11] The resin composition for sealing according to any one of [1] to [10], which further contains a radical polymerization initiator.

[12] The sealing resin composition according to [11] above, wherein the radical polymerization initiator is a photoradical polymerization initiator and/or a thermal radical polymerization initiator.

[13] The resin composition for sealing according to [11] or [12] above, wherein the amount of the radical polymerization initiator is 0.5 to 10 parts by mass relative to 100 parts by mass of the compound having an ethylenically unsaturated group. parts by mass.

[14] The resin composition for sealing according to any one of [1] to [13] above, further comprising a silane coupling agent.

[15] The resin composition for sealing according to any one of [1] to [14] above, which is liquid.

[16] The resin composition for sealing according to any one of [1] to [15] above, which is used for sealing organic EL elements.

[17] An organic EL device in which an organic EL element is sealed with a cured product of the sealing resin composition as described in any one of [1] to [16].

According to the present invention, it is possible to provide a A resin composition for sealing capable of suppressing deterioration of elements such as EL elements due to moisture penetrating into the resin composition without performing a drying treatment step before the sealing step.

<Resin composition for sealing>

The sealing resin composition of the present invention contains hydrotalcite and calcium oxide. The resin composition for sealing of the present invention can be produced by mixing resin, hydrotalcite, calcium oxide, and other components as necessary using kneading rolls, a rotary mixer, or the like.

The resin composition for sealing of the present invention is used, for example, in electronic parts such as semiconductors, solar cells, high-brightness LEDs, LCDs, EL elements, etc., preferably for sealing optical semiconductors such as organic EL elements, solar cells, and the like. The sealing resin composition of the present invention is particularly suitable for sealing organic EL elements. Specifically, the upper part of the light-emitting part of the organic EL element is suitable as a filling material, and/or the surrounding (side part) is suitable as a dam material. In order to protect the light-emitting part of the organic EL element from the outside, the sealing material of the present invention can be used. Resin composition.

The sealing resin composition of the present invention is preferably a liquid sealing resin composition. The term "liquid resin composition for sealing" herein refers to a resin composition for sealing that has fluidity at normal temperature (25° C.) and normal pressure (1 atmosphere). For example, if the sealing resin composition containing the inorganic filler also has fluidity at normal temperature and normal pressure, it is equivalent to the A liquid sealing resin composition. Compared with film-like sealing materials, liquid sealing materials (resin compositions for sealing) generally have better embedding properties on the surface of light-emitting elements with circuits, suppression of voids when the sealing surface has a large area, and the film of the sealing layer Ease of thickness adjustment, and high alignment accuracy achieved by aligning positions by forming a dam before sealing are often advantageous.

It is desirable that the resin composition for sealing of the present invention does not contain volatile components such as solvents. Furthermore, when the resin composition for sealing of the present invention contains volatile matter such as a solvent, the volatile matter such as the solvent is not included in the content basis of each component. That is, when the sealing resin composition of the present invention contains a volatile component, the content standard of each component is "relative to the entire resin composition" and means "relative to the entire non-volatile components of the resin composition".

<hydrotalcite>

The sealing resin composition of the present invention contains hydrotalcite. Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite, and may be any one of these, and may be only one type, or may be two or more types.

Unfired hydrotalcite is, for example, a metal hydroxide having a layered crystal structure represented by natural hydrotalcite (Mg ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O), for example, consisting of a layer as a basic skeleton [Mg _1-X Al _X (OH) ₂ ] ^X+ and the middle layer [(CO ₃ ) _X/2 . mH ₂ O] ^X- constituted. The concept of hydrotalcite compounds such as synthetic hydrotalcite and the like is included in the unfired hydrotalcite of the present invention. Examples of the hydrotalcite-like compound include those represented by the following formula (I) and the following formula (II).

(In the formula, M ²⁺ represents divalent metal ions such as Mg ₂₊ , Zn ²⁺ , M ³⁺ represents trivalent metal ions such as Al ³⁺ , Fe ^{3+ ,} etc., ^An- represents CO ₃ ^2- , Cl ^- , NO ₃ ^- and other n-valent anions, 0<x<1, 0≦m<1, n is a positive number) In formula (I), M ²⁺ is preferably Mg ²⁺ , and M ³⁺ is more preferable is Al ³⁺ , and ^An- is preferably CO ₃ ^2- .

(In the formula, M ²⁺ represents divalent metal ions such as Mg ²⁺ , Zn ^{2+ ,} etc., ^An- represents n-valent anions such as CO ₃ ^2- , Cl ^- , NO ^3-, etc., and x is a positive number of 2 or more , z is a positive number less than 2, m is a positive number, n is a positive number) In formula (II), M ²⁺ is preferably Mg ²⁺ , and ^An- is preferably CO ₃ ^2- .

Semi-fired hydrotalcite refers to a metal hydroxide having a layered crystal structure in which the amount of interlayer water is reduced or disappeared by firing unfired hydrotalcite. The so-called "interlayer water" refers to "H ₂ O" described in the above-mentioned composition formulas of unfired natural hydrotalcite and hydrotalcite-like compounds, if described using the composition formula.

In addition, fired hydrotalcite refers to a metal oxide having an amorphous structure obtained by firing unfired hydrotalcite or semi-fired hydrotalcite, in which not only interlayer water but also hydroxyl groups disappear through condensation and dehydration.

Unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by saturated water absorption. The saturated water absorption of the semi-fired hydrotalcite is not less than 1% by mass and not more than 20% by mass. In addition, the saturated water absorption of the unfired hydrotalcite is less than 1% by mass, and the saturated water absorption of the fired hydrotalcite is 20% by mass or more.

The so-called "saturated water absorption" in the present invention refers to weighing 1.5g of unfired hydrotalcite, semi-fired hydrotalcite or fired hydrotalcite on a balance, measuring the initial mass, and setting it under atmospheric pressure at 60°C , 90% RH (relative humidity) small-scale environmental tester (SH-222 manufactured by Espec Co., Ltd.) when standing for 200 hours, the mass increase rate relative to the initial mass can be obtained by the following formula (i). Saturated water absorption (mass%) =100×(mass after moisture absorption-initial mass)/initial mass (i)

The saturated water absorption of the semi-fired hydrotalcite is preferably from 3% by mass to 20% by mass, more preferably from 5% by mass to 20% by mass.

Moreover, unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite can be distinguished by the thermogravimetric reduction rate measured by thermogravimetric analysis. The thermal weight loss rate of the semi-fired hydrotalcite at 280°C is less than 15% by mass, and the thermal weight loss rate at 380°C is 12% by mass or more. In addition, the thermal weight loss rate of the unfired hydrotalcite at 280° C. is 15% by mass or more, and the thermal weight loss rate of the fired hydrotalcite at 380° C. is less than 12% by mass.

Thermogravimetric analysis was performed using TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Co., Ltd. Weighed 5 mg of hydrotalcite on an aluminum sample pan and opened it without covering it. Under the environment with a nitrogen flow rate of 200 mL/min, from 30 ° C to 550 ° C °C was carried out under the condition of a temperature increase rate of 10 °C/min. The thermal weight loss rate can be calculated|required with following formula (ii). Thermal weight reduction rate (mass%) =100×(mass before heating - mass when reaching the specified temperature)/mass before heating (ii)

Furthermore, unfired hydrotalcite, half-fired hydrotalcite, and fired hydrotalcite can be distinguished by peak values and relative intensity ratios measured by powder X-ray diffraction. Semi-fired hydrotalcite shows that by powder X-ray diffraction, it has a peak that splits into two near 2θ of 8 to 18°, or has a peak with a shoulder due to the synthesis of two peaks, and the peak on the low-angle side The relative intensity ratio of the diffraction intensity of the peak or shoulder (= low-angle side diffraction intensity) to the diffraction intensity of the peak or shoulder (= high-angle side diffraction intensity) that appears on the high-angle side (low-angle side Diffraction intensity/high-angle side diffraction intensity) is 0.001 to 1,000. In addition, unfired hydrotalcite has only one peak near 8-18°, or the relative intensity ratio of the diffraction intensity of the peak or shoulder on the low-angle side to the peak or shoulder on the high-angle side becomes the aforementioned out of range. Burned hydrotalcite does not have a characteristic peak in the region of 8°～18°, but has a characteristic peak at 43°. The powder X-ray diffraction measurement system uses a powder X-ray diffraction device (manufactured by PANalytical, Empyrean) to the cathode CuKα (1.5405Å), voltage: 45V, current: 40mA, sampling width: 0.0260˚, scanning speed: 0.0657 ˚/s, measuring diffraction angle range (2θ): 5.0131～79.9711˚. The peak search is using the peak search function of the software attached to the diffraction device, which can be used "minimum significance: 0.50, minimum peak chip (Minimum peak chip): 0.01˚, maximum peak chip (Maximum peak chip): 1.00˚, peak bottom width : 2.00˚, method: the minimum value of the second order differential".

The BET specific surface area of the hydrotalcite is preferably from 1 to 250 m ² /g, more preferably from 5 to 200 m ² /g. The BET specific surface area of hydrotalcite can be calculated using the BET multipoint method by adsorbing nitrogen gas on the surface of the sample using a specific surface area measuring device (Macsorb HM Model 1210 MOUNTECH Co., Ltd.) according to the BET method.

The average particle size of the hydrotalcite is preferably from 1 to 1,000 nm, more preferably from 10 to 800 nm. The average particle diameter of hydrotalcite is the median diameter of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z 8825).

As the hydrotalcite, one surface-treated with a surface-treating agent can be used. As a surface treatment agent used for surface treatment, for example, higher fatty acids, alkylsilanes, silane coupling agents, etc. can be used, and among them, higher fatty acids and alkylsilanes are suitable. One type or two or more types of surface treatment agents can be used.

Examples of higher fatty acids include higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, and palmitic acid, among which stearic acid is preferred. These can be used 1 type or 2 or more types.

Examples of alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, and Silane, dimethyldimethoxysilane, octyltriethoxysilane, n-octadecyldimethyl(3-(trimethoxysilyl)propyl)ammonium chloride, etc. These can be used 1 type or 2 or more types.

As the silane coupling agent, for example, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl triethoxysilane, 3-glycidoxypropyl (dimethyl Epoxy silane coupling agents such as oxy)methylsilane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyl Mercapto-based silane coupling agents such as triethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyl Trimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethyl Amino-based silane coupling agents such as silanes; ureido-based silane coupling agents such as 3-ureidopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethoxysilane Vinyl silane coupling agents such as p-styryl trimethoxysilane, etc.; 3-acryloxypropyl trimethoxysilane and 3-acryloxypropyl trimethoxysilane - Acrylate-based silane coupling agents such as methacryloxypropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltrimethoxysilane; Sulfide-based silane coupling agents such as disulfide, bis(triethoxysilylpropyl)tetrasulfide, etc.; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazole silane, triazine silane, etc. These can be used 1 type or 2 or more types.

The surface treatment of hydrotalcite can be carried out, for example, by stirring and dispersing untreated hydrotalcite with a mixer at room temperature, adding a spray surface treatment agent, and stirring for 5 to 60 minutes. As the mixer, known mixers can be used, for example, mixers such as V mixer, ribbon mixer, and bubble cone mixer, mixers such as Henschel mixer and concrete mixer, ball mill, and winch mill. In addition, it can also be pulverized by a ball mill or the like For surface treatment, add the aforementioned higher fatty acids, alkyl silanes or silane coupling agents. The amount of the surface treatment agent used varies depending on the type of hydrotalcite or the type of surface treatment agent, but is preferably 1 to 10 parts by mass relative to 100 parts by mass of untreated hydrotalcite. In the present invention, surface-treated hydrotalcite is also included in the "hydrotalcite" of the present invention.

The content of hydrotalcite in the resin composition for sealing of the present invention is not particularly limited if the effect of the present invention can be exhibited, but it is preferably 10 to 70% with respect to 100% by mass of the non-volatile components of the resin composition. % by mass, more preferably 15 to 60% by mass, more preferably 30 to 50% by mass. Since hydrotalcite has excellent hygroscopic performance, if its content is increased, the moisture barrier property of the obtained cured product will be improved. However, if the content exceeds 70% by mass, the viscosity of the resin composition will increase, the wettability will decrease, the adhesion between the substrate, etc. to be sealed, and the resin composition will decrease, and the strength of the cured product will decrease and become brittle. tendency of the problem. In addition, due to the interlayer water of hydrotalcite, due to the increase of the moisture content in the sealing layer (that is, the hardened material), for example, in the manufacture of organic EL devices, the moisture in the sealing layer will cause damage to the light-emitting material (light-emitting layer) or electrode layer. The adverse effects of the disease are manifested, and there is suspense that the occurrence of black spots in the initial stage will increase.

Specific examples of semi-fired hydrotalcite include "DHT-4C" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400 nm), "DHT-4A-2" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400nm), etc. In addition, examples of fired hydrotalcite include "KW-2200" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), and examples of unfired hydrotalcite include "DHT-4A" (Kyowa Chemical Industry Co., Ltd. Made by the company, average particle diameter: 400 nm), etc.

＜Calcium Oxide＞ The sealing resin composition of the present invention contains calcium oxide. The ratio of calcium oxide to hydrotalcite in the sealing resin composition of the present invention is not particularly limited if the effect of the present invention is exerted, but is preferably 0.1 to 1 by mass, more preferably by mass The ratio is 0.1-0.75, more preferably 0.15-0.55 by mass ratio. When the mass ratio is lower than 0.1, it tends to be difficult to exert the effect of the present invention, and when the mass ratio is higher than 1, problems such as an increase in the moisture content of the resin composition and a decrease in moisture barrier properties tend to occur.

The particle form of calcium oxide is not particularly limited, and for example, approximately spherical, cuboid, plate, linear form of fiber, and branched form can be used.

The average particle size of calcium oxide is preferably from 0.1 to 20 μm, more preferably from 0.1 to 15 μm. The average particle diameter of calcium oxide is the median diameter of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z 8825).

<Resin constituting the resin composition> The resin constituting the sealing resin composition of the present invention is not particularly limited as long as it is used in the sealing resin composition in this field, and although one or more kinds can be used, it is preferably selected from acrylic acid At least one kind of resin among resin and epoxy resin, more preferably at least one kind of acrylic resin.

When the resin is an acrylic resin, the sealing resin composition of the present invention, for example, contains the following compounds having two or more ethylenically unsaturated groups in one molecule (having two or more (meth)acryl groups in one molecule radical (meth)acrylate) and radical polymerization initiators.

<Compounds having two or more ethylenically unsaturated groups in one molecule> Compounds having two or more ethylenically unsaturated groups in one molecule (hereinafter, sometimes referred to simply as "polyfunctional ethylenically unsaturated compounds") may be used alone or in combination of two or more. The polyfunctional ethylenically unsaturated compound may contain other functional groups such as epoxy groups within the range in which the effects of the present invention are exhibited. Furthermore, polyfunctional ethylenically unsaturated compounds containing epoxy groups are not epoxy resins in the present invention, but are classified as polyfunctional ethylenically unsaturated compounds.

The polyfunctional ethylenically unsaturated compound is preferably liquid because the sealing resin composition of the present invention is liquid. The term "liquid" here refers to the state of the polyfunctional ethylenically unsaturated compound at normal temperature (25° C.) and normal pressure (1 atmosphere). When the polyfunctional ethylenically unsaturated compound is a mixture of two or more compounds, it is preferable that the mixture is liquid. For example, when using a solid polyfunctional ethylenic unsaturated compound and a liquid polyfunctional ethylenic compound, it is preferable that the mixture of these compounds is liquid.

The polyfunctional ethylenically unsaturated compound is preferably a compound having three or more ethylenically unsaturated groups contained in one molecule, more preferably A compound having 4 or more ethylenically unsaturated groups in 1 molecule, more preferably 5 or more ethylenically unsaturated groups in 1 molecule, particularly preferably 6 or more ethylenically unsaturated groups in 1 molecule base compound. In the polyfunctional ethylenically unsaturated compound, the upper limit of the number of ethylenically unsaturated groups contained in one molecule is not particularly limited, but the number is preferably 15 or less, more preferably 12 or less, still more preferably 10 or less.

The polyfunctional ethylenically unsaturated compound is preferably a compound having two or more ethylenically unsaturated groups and an alicyclic structure contained in 1 molecule, more preferably contained in 1 molecule, from the viewpoint of improving moisture barrier properties. A compound with two ethylenically unsaturated groups and an alicyclic structure. As an alicyclic structure, the structure which has an alicyclic hydrocarbon ring with 5-12 carbon atoms is mentioned, for example. Examples of alicyclic hydrocarbon rings include tricyclo[5.2.1.0 ^2,6 ]decane rings, camphane rings, isobornane rings, cyclohexane rings, bicyclooctane rings, norbornane rings, Decane ring, adamantane ring, cyclopentane ring, etc. There may be heteroatoms in the alicyclic configuration. In addition, substituents such as an alkyl group, an alkoxy group, and an alkylene group may be bonded to the alicyclic structure.

When using a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule (especially a compound having two ethylenically unsaturated groups and an alicyclic structure in one molecule), the content relative to The entire resin composition is preferably at least 5% by mass, more preferably at least 10% by mass, still more preferably at least 15% by mass, preferably at most 75% by mass, more preferably at most 70% by mass, and still more preferably at least 70% by mass. 65% by mass or less.

<Compounds having 3 or more ethylenically unsaturated groups in one molecule> When used in a compound having three or more ethylenically unsaturated groups in one molecule, the content thereof is preferably at least 2% by mass, more preferably 3 mass % or more, more preferably 4 mass % or less, preferably 70 mass % or less, more preferably 65 mass % or less, still more preferably 60 mass % or less.

The ethylenically unsaturated group is preferably a (meth)acryl group. That is, as a compound which has an ethylenically unsaturated group, (meth)acrylate which has a (meth)acryl group is preferable. In this specification, the so-called "(meth)acryl" means "acryl and/or methacryl", and the so-called "(meth)acrylate" means "acrylate and/or or methacrylate". Furthermore, (meth)acrylates having two or more (meth)acryl groups in one molecule may be abbreviated as "polyfunctional (meth)acrylates" below. Also, a (meth)acrylate having two (meth)acryloyl groups in one molecule may be simply referred to as "bifunctional (meth)acrylate".

As the polyfunctional (meth)acrylate, an oligomer can be used. Examples of oligomers include polyester oligomers synthesized by the reaction of polyester polyol and acrylic acid, urethane oligomers having urethane bonds, glycidyl ether and Epoxy oligomers synthesized by the reaction of acrylates with acrylic acid or carboxyl groups, etc.

Examples of bifunctional (meth)acrylates include "DPGDA" (dipropylene glycol diacrylate), "HDDA" (1,6-hexanediol diacrylate), and "TPGDA" (tripropylene glycol diacrylate) manufactured by Daicel Orneex. Propylene glycol diacrylate), "EBECRYL145" (PO-modified neopentyl glycol diacrylate), "EBECRYL150" (modified bisphenol A diacrylate), "IRR214-K" (tricyclodecane dimethanol diacrylate ester), "EBECRYL11" (PEG600 diacrylate), "HPNDA" (neopentyl glycol hydroxypivalate diacrylate), "LIGHT ESTER EG" (ethylene glycol dimethacrylate ester), "LIGHT ESTER NP-A" (neopentyl glycol dimethacrylate), "LIGHT ESTER 2EG" (diethylene glycol dimethacrylate), "LIGHT ESTER 1.6HX" (1,6- hexanediol dimethacrylate), "LIGHT ESTER 1.9ND" (1,9-nonanediol dimethacrylate), "LIGHT ESTER G-101P" (glycerin dimethacrylate), " LIGHT ESTER BP-2EMK" (EO adduct dimethacrylate of bisphenol A), "LIGHT ACRYLATE NP-A" (neopentyl glycol diacrylate), "LIGHT ACRYLATE 1.9ND-A" (1, 9-nonanediol diacrylate), "LIGHT ACRYLATE BP-4EAL" (EO adduct diacrylate of bisphenol A), "LIGHT ACRYLATE BP-4PA" (PO adduct diacrylate of bisphenol A ester), Shin-Nakamura Chemical Co., Ltd. "NK ESTER 701A" (2-hydroxy-3-methacrylpropyl acrylate), "NK ESTER A-200" (polyethylene glycol #200 diacrylate) , "NK ESTER APG-400" (polypropylene glycol #400 diacrylate), "NK ESTER A-PTMG-65" (polytetramethylene glycol #650 diacrylate), "NK ESTER A-1206PE" ( Polyethylene polypropylene glycol diacrylate), "NK ESTER ESTERA-BPEF" (9,9-bis[4-(2-hydroxyethoxy)phenyl] fennel diacrylate), "NK ESTER ESTERA-BPE30" ( Ethoxylated bisphenol A diacrylate), "NK ESTER A-BPP-3" (propoxylated bisphenol A diacrylate), "NK ESTER BG" (1,3-butanediol dimethyl acrylate), "NK ESTER 701" (2-hydroxy-1,3-dimethacryloxypropane), "NK ESTER 3PG" (tripropylene glycol dimethacrylate), "NK ESTER ESTER 1206PE "(polyethylene polypropylene glycol dimethacrylate), "NK ESTER DCP" (tricyclodecane dimethanol dimethacrylate), Nippon Kayaku "KAYARAD FM-400", "KAYARAD HX-220" , "KAYARAD HX-620" (neopentyl modified diacrylate), "KAYARAD R-604" (dioxanediol diacrylate), "KAYARAD UX-3204" (having two propylene in one molecule Acyl oligomer), Osaka Organic Chemical Industry Co., Ltd. "BISCOAT #195" (1,4-butanediol diacrylate), "BISCOAT #540" (bisphenol A diglycidyl ether acrylic acid plus product), "CD406" (cyclohexanedimethanol diacrylate) manufactured by Arkema Corporation, "SR562" (alkoxylated hexanediol diacrylate), "EBECRYL600" manufactured by Daicel Orneex Corporation (in 1 Bisphenol A type epoxy acrylate having two acryl groups in the molecule), "EBECRYL210" (aromatic urethane oligomer having two acryl groups in one molecule), "EBECRYL230" ( Aliphatic urethane oligomer having two acryl groups in one molecule), "EBECRYL436" (ester oligomer having two acryl groups in one molecule), " CN959" (urethane oligomer having two acryl groups in one molecule), "Art Resin UN-9000PEP" (urethane oligomer having two acryl groups in one molecule) manufactured by Negami Kogyo Co., Ltd. ester oligomer), "Art Resin UN-333" (oligomer having two acryl groups in one molecule), etc.

As a (meth)acrylic ester which has 3 or more (meth)acryloyl groups in 1 molecule, "LIGHT ESTER TMP" (trimethylolpropane trimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd. is mentioned, for example. , LIGHT ACRYLATE PE-3A” (pentaerythritol triacrylate), “LIGHT ACRYLATE PE-4A” (pentaerythritol tetraacrylate), “LIGHT ACRYLATE DGE-4A” (EO adduct modified diglycerol tetraacrylate), Daicel "PETIA" (pentaerythritol (tri/tetra) acrylate), TMPTA (trimethylolpropane triacrylate), TMPEOTA (trimethylolpropane ethoxy triacrylate), "EBECRYL135" (trimethylolpropane ethoxylate) manufactured by Orneex Corporation methyl propane propoxy triacrylate), "PETA" (pentaerythritol (tri/tetra) acrylate), "DPHA" (dipentaerythritol hexaacrylate), Shin-Nakamura Chemical Co., Ltd. "NK ESTER A-TMPT" ( trimethylolpropane triacrylate), "NK ESTER A-TMPT-3PO" (propoxylated trimethylolpropane triacrylate), "NK ESTER A-GLY-6E" (ethoxylated triglyceride Acrylate), "NK ESTER A-GLY-6P" (propoxylated glyceryl triacrylate), "NK ESTER A-9300" (ginseng-(2-acryloxyethyl)isocyanurate) , "NK ESTER A-9200" (bis/ginseng-(2-acryloxyethyl) isocyanurate), "NK ESTER A-9300-1CL" (caprolactone modified ginseng-(2- Acryloxyethyl) isocyanurate), "NK ESTER ATM-4EL" (ethoxylated pentaerythritol (tri/tetra) acrylate), "KAYARAD DPCA-20" (6-functional Acrylate), "KAYARAD DPCA-60" (6-functional acrylate), "T-1420(T)" (4-functional acrylate), "DPEA-12" (6-functional acrylate), "KAYARAD DPHA-40H" (Oligomer having 10 acryl groups in one molecule), "BISCOAT #802" (pentaerythritol acrylate), "BISCOAT #1000" (dendrimer acrylate) manufactured by Osaka Organic Chemical Industry Co., Ltd., "CN989NS" (aliphatic urethane oligomer having 3 acryl groups in one molecule), "CN9039" (aliphatic amine having 6 acryl groups in 1 molecule) manufactured by Arkema urethane oligomer), "UN-3320HA", "UN-3320HC", "UN-906S" (aliphatic urethane oligomer having 6 acryl groups in one molecule) manufactured by Negami Kogyo Co., Ltd. polymer), "DICLITE UE-8740" (phenol novolac type epoxy acrylate having three acryl groups in one molecule) manufactured by DIC Corporation, and the like. Furthermore, the so-called "pentaerythritol (tri/tetra) acrylate" refers to a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. The other "(three/four)" etc. have the same meaning.

As a polyfunctional (meth)acrylate having an alicyclic structure, for example ^, "IRR214-K" (tricyclodecane di methanol diacrylate), 1,3-adamantanediol diacrylate manufactured by Mitsubishi Gas Chemical Co., Ltd., and the like.

The content of the polyfunctional ethylenically unsaturated compound is preferably from 20 to 78% by mass, more preferably from 25 to 75% by mass, and still more preferably from 30 to 70% by mass, based on the entire resin composition.

<Compounds having one ethylenically unsaturated group in one molecule> A compound having one ethylenically unsaturated group in one molecule (hereinafter, may be simply referred to as "monofunctional ethylenically unsaturated compound") may be contained. The "monofunctional ethylenically unsaturated compound" may be included in the sealing resin composition of the present invention as a diluent as described later. The monofunctional ethylenically unsaturated compound may contain other functional groups such as epoxy groups within the range in which the effects of the present invention are exhibited. As such a compound, the compound which has 1 or more epoxy groups and 1 ethylenically unsaturated group in 1 molecule is mentioned, for example. Furthermore, monofunctional ethylenically unsaturated compounds containing epoxy groups are classified as monofunctional ethylenically unsaturated compounds instead of epoxy resins in the present invention.

Examples of commercially available compounds having an epoxy group and one ethylenically unsaturated group in one molecule include "CYCLOMER M100" (3,4-epoxycyclohexylmethyl methacrylate) manufactured by Daicel Orneex Co., Ltd. ), "UVACURE1561" (mixture of epoxy group and compound having one acryl group in one molecule (content: 78-82% by mass) and bisphenol A epoxy resin (content: 18-22% by mass) ), "4HBAGE" (4-hydroxybutyl acrylate glycidyl ether) manufactured by Nippon Chemical Corporation, etc.

When the sealing resin composition of the present invention contains a monofunctional ethylenically unsaturated compound, its content is preferably at least 0.5% by mass, more preferably at least 1% by mass, and still more preferably 1.5% by mass, based on the entire resin composition. Above, preferably at most 55% by mass, more preferably at most 50% by mass, still more preferably at most 40% by mass.

＜Compounds with ethylenically unsaturated groups＞ The above-mentioned "polyfunctional ethylenically unsaturated compound" and "monofunctional ethylenically unsaturated compound" are collectively described as "a compound having an ethylenically unsaturated group". The content of the compound having such an ethylenically unsaturated group is preferably from 30 to 80% by mass, more preferably from 35 to 80% by mass, and still more preferably from 40 to 80% by mass, based on the entire resin composition.

＜Radical polymerization initiator＞ Only 1 type may be sufficient as a radical polymerization initiator, and 2 or more types may be sufficient as it. The radical polymerization initiator may be a photoradical polymerization initiator or a thermal radical polymerization initiator. That is, the radical polymerization initiator is a photoradical polymerization initiator and/or a thermal radical polymerization initiator. The radical polymerization initiator is preferably a photoradical polymerization initiator or a thermal radical polymerization initiator. Both a photoradical polymerization initiator and a thermal radical polymerization initiator may be only 1 type, and may be 2 or more types.

Examples of photoradical polymerization initiators include acetophenone, diethoxyacetophenone, 2-[4-(methylthio)methyl-1-phenyl]-2-morpholinoacetone, Benzoin, benzoin ethyl ether, benzyl methyl ketal, benzophenone, 2-ethyl anthraquinone, thioxanthone, diethyl thioxanthone, 2,4,6-trimethylbenzoyl Diphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylethoxyphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2 -Hydroxy-2-methyl-1-phenylpropan-1-one, 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, 1-hydroxycyclohexylphenylketone , 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropane- 1-keto, 2-methyl-2-morpholinyl (4-thiomethylphenyl) propane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholine phenyl)-butanone, N,N'-octamethylenebisacridine, acrylbenzophenone, 2-(benzoyloxyimino)-1-[4'-(benzene Thio)phenyl]-1-octanone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2 -Methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propan-1-one, 2-hydroxyl-1- {4-[4-(2-Hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one, methyl phenylglyoxylic acid (Glyoxylic Acid) ester , 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morph Linylphenyl)-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butanone, bis(2, 4,6-Trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(η ⁵ -2,4-cyclopentadiene -1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium, 1-[4-(phenylthio)phenyl]-1,2-octane Alkanedione 2-(O-benzoyl oxime), 1-[6-(2-methylbenzoyl)-9-ethyl-9H-carbazol-3-yl]ethanone O-acetyl Oxime etc.

Examples of commercially available photoradical polymerization initiators include "Omnirad 651", "Omnirad 184", "Omnirad 1173", "Omnirad 500", "Omnirad 2959", "Omnirad 127" manufactured by IGM Resins, Inc. "Omnirad 754", "Omnirad 907", "Omnirad 369", "Omnirad 379", "Omnirad 819", "Omnirad TPO", "Omnirad 784", "Irgacure OXE-01", "Irgacure OXE-02" made by BASF Corporation , "Irgacure 1173" and so on.

As a thermal radical polymerization initiator, an azo compound, an organic peroxide, etc. are mentioned, for example. Examples of the azo compound include 2,2'-azobis(isobutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis (2-Methylbutyronitrile), 4,4'-Azobis(4-cyanovaleric acid), 2,2'-Azobis(2-methyl)dihydrochloride, 1,1'- Azobis(1-acetyloxy-1-phenylethane, 1,1'-azobis(cyclohexane-1-carbonitrile), dimethyl 2,2'-azobis(iso butyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2-methylpropionitrile), 2, 2'-Azobis(2-methylbutyronitrile), 1-[(1-cyano-1-methylethyl)azo]formamide, 2-phenylazo-4-methoxy -2,4-Dimethylvaleronitrile, Dimethyl 2,2'-Azobis(2-methylpropionate), 2,2'-Azobis(N-Butyl-2-methyl Acrylamide, etc.

Examples of organic peroxides include benzoyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, di-tert-butyl peroxide, methyl ethyl ketone peroxide, 1,1-bis(t-hexylperoxy)cyclohexane, 2,2-bis(t-butylperoxy)butane, n-butyl 4,4-bis(t-butylperoxy base) pivalate (Pivalate), 2,2-bis(4,4-bis(t-butylperoxy)cyclohexyl)propane, p-menthane hydroperoxide, diisopropoxybenzene peroxide oxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, bis(2-t-butylperoxyisopropyl) Benzene, cumene diperoxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butyl cumene peroxide, di-t-hexylperoxy oxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane-3, diisobutyryl peroxide, bis(3,5,5-t-methylhexyl Acyl) peroxide, dilauroyl peroxide, disuccinic acid peroxide, bis(3-methylbenzoyl) peroxide, dibenzoyl peroxide, di-n- Propyl peroxycarbonate, di-isopropyl peroxydicarbonate, bis(4-t-butylcyclohexyl) peroxycarbonate, bis(2-ethylhexyl) peroxycarbonate , Di-sec-butylperoxycarbonate, cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, t-hexylperoxyneodecanoate oxyneodecanoate, t-butylperoxyneodecanoate, t-hexylperoxypivalate, t-butylperoxypivalate, 1,1,3,3- Tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(t-ethylhexylperoxy)hexane, t-hexylperoxy 2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5 ,5-Trimethylhexanoate, t-Butylperoxylaurate, t-Butylperoxyisopropyl monocarbonate, t-Butylperoxy-2-ethylhexyl monocarbonate ester, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, t-butylperoxyacetate, t -Butylperoxy-3-methylbenzoate and t-butylperoxybenzoate mixture, t-butylperoxybenzoate, t-butylperoxyalkene Propyl monocarbonate, 3,3',4,4'-tetrakis(t-butylperoxycarbonyl)benzophenone, etc.

Examples of commercially available thermal radical polymerization initiators include "AIBN" (2,2'-azobis(isobutyronitrile)) manufactured by Wako Pure Chemical Industries, Ltd., "V-40" (1,1 '-Azobis(cyclohexane-1-carbonitrile), "VAm-110" (2,2'-azobis(N-butyl-2-methylpropionamide), "V-601" (Dimethyl 2,2'-azobis(isobutyrate)), "OTAZO-15" (1,1'-azobis(1-acetyloxy-1-phenyl ethane), "MAIB" (dimethyl 2,2'-azobisisobutyrate), etc.

The content of the radical polymerization initiator is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and still more preferably 0.5 to 6 parts by mass relative to 100 parts by mass of the "compound having an ethylenically unsaturated group". share. Here, the "compound having an ethylenically unsaturated group" includes a "polyfunctional ethylenically unsaturated compound" and a "monofunctional ethylenically unsaturated compound" as described above.

When using a photoradical polymerization initiator, its content is preferably 0.5-10 parts by mass, more preferably 0.5-8 parts by mass, and still more preferably 0.5 to 6 parts by mass.

When a thermal radical polymerization initiator is used, its content is preferably 0.5-10 parts by mass, more preferably 0.5-8 parts by mass, and still more preferably 0.5 to 6 parts by mass.

＜Epoxy resin＞ The epoxy resin may be only 1 type, and may be 2 or more types. Sometimes the epoxy resin with one epoxy group in one molecule is referred to as "monofunctional epoxy resin" and the epoxy resin with two epoxy groups in one molecule is referred to as "bifunctional epoxy resin". ". Sometimes it is also abbreviated as an epoxy resin having three or more epoxy groups in one molecule.

As mentioned above, compounds having one or more epoxy groups and two or more ethylenically unsaturated groups in one molecule can be used as polyfunctional ethylenically unsaturated compounds in the present invention, so they are classified into the above-mentioned ones in the present invention. Multifunctional ethylenically unsaturated compounds. Moreover, as mentioned above, the compound which has one or more epoxy groups and one ethylenically unsaturated group in 1 molecule is classified as a monofunctional ethylenically unsaturated compound in this invention.

Examples of epoxy resins include hydrogenated epoxy resins (hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, etc.), fluorine-containing epoxy resins, chain aliphatic type epoxy resins, cyclo Aliphatic epoxy resin, bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type Epoxy resins, phosphorus-containing epoxy resins, bisphenol S-type epoxy resins, aromatic glycidylamine-type epoxy resins (such as tetraglycidyldiaminodiphenylmethane, triglycidyl -p-aminophenol, Diglycidyl toluidine, Diglycidyl aniline, etc.), alicyclic epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin , bisphenol A novolak type epoxy resin, epoxy resin with butadiene structure, bisphenol diglycidyl ether compound, naphthalene diol diglycidyl ether compound, phenolic diepoxy Propyl ether compounds and diglycidyl ether compounds of alcohols, and alkyl substituted products of these epoxy resins, etc.

The epoxy equivalent of the epoxy resin is preferably from 50 to 1,000, more preferably from 50 to 750, still more preferably from 100 to 750, particularly preferably from 100 to 500, from the viewpoint of reactivity and the like. Also, the "epoxy equivalent" is the number of grams (g/eq) of resin containing 1 gram equivalent of epoxy groups, and it is measured in accordance with the method prescribed in JIS K 7236.

The epoxy resin is preferably at least one selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, chain aliphatic epoxy resins, and cycloaliphatic epoxy resins, more preferably selected from hydrogenated cyclic epoxy resins. One or more kinds of epoxy resins, fluorine-containing epoxy resins, and cycloaliphatic epoxy resins, more preferably one or more kinds selected from hydrogenated epoxy resins and cycloaliphatic epoxy resins. Here, the term "hydrogenated epoxy resin" refers to an epoxy resin obtained by hydrogenating an epoxy resin containing an aromatic ring. The hydrogenation rate of the hydrogenated epoxy resin is preferably at least 50%, more preferably at least 70%. The so-called "chain aliphatic epoxy resin" refers to epoxy resins with linear or branched alkyl chains or alkyl ether chains, and the so-called "cyclic aliphatic epoxy resin" refers to It means an epoxy resin having a cycloaliphatic skeleton such as a cycloalkane skeleton in the molecule.

Examples of hydrogenated bisphenol A epoxy resins include liquid hydrogenated bisphenol A epoxy resins (for example, "YX8000" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), "DENACOL EX-252" (Nagase ChemteX Co., Ltd., epoxy equivalent: about 213)), solid hydrogenated bisphenol A epoxy resin (for example, "YX8040" (Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)).

As the fluorine-containing epoxy resin, for example, the fluorine-containing epoxy resin described in WO2011/089947 can be used.

Examples of chain aliphatic epoxy resins include polyglycerol polyglycidyl ether (for example, "DENACOL EX-512", "DENACOL EX-521", manufactured by Nagase ChemteX), pentaerythritol polyglycidyl ether (such as "DENACOL EX-411", manufactured by Nagase ChemteX), diglycerin polyglycidyl ether (such as "DENACOL EX-421", manufactured by Nagase ChemteX), glycerin polyglycidyl ether (such as "DENACOL EX-421", -313", "DENACOL EX-314", manufactured by Nagase ChemteX Corporation), trimethylolpropane polyglycidyl ether (such as "DENACOL EX-321", manufactured by Nagase ChemteX Corporation), neopentyl glycol diepoxy Propyl ether (for example, "DENACOL EX-211", manufactured by Nagase ChemteX), 1,6-hexanediol diglycidyl ether (for example, "DENACOL EX-212", manufactured by Nagase ChemteX), ethylene glycol Diglycidyl ether (such as "DENACOL EX-810", "DENACOL EX-811", manufactured by Nagase ChemteX Co., Ltd.), diethylene glycol diglycidyl ether (such as "DENACOL EX-850", "DENACOL EX-850" -851", manufactured by Nagase ChemteX Co., Ltd.), polyethylene glycol diglycidyl ether (such as "DENACOL EX-821", "DENACOL EX-830", "DENACOL EX-832", "DENACOL EX-841", "DENACOL EX-861", manufactured by Nagase ChemteX Co., Ltd.), propylene glycol diglycidyl ether (such as "DENACOL EX-911", manufactured by Nagase ChemteX Co., Ltd.), polypropylene glycol diglycidyl ether (such as "DENACOL EX-941 ", "DENACOL EX-920", "DENACOL EX-931", manufactured by Nagase ChemteX Corporation), etc.

As a cycloaliphatic type epoxy resin, "EHPE-3150" by Daicel Chemical Industry Co., Ltd. etc. are mentioned, for example.

When an epoxy resin is used, its content is preferably from 5 to 40% by mass, more preferably from 5 to 35% by mass, and still more preferably from 5 to 30% by mass, based on the entire resin composition.

＜Other ingredients＞ The resin composition for sealing of the present invention may contain other components different from the above-mentioned components within the range that does not impair the effect thereof.

Thinner The sealing resin composition of the present invention may contain a diluent to achieve an appropriate viscosity as a liquid sealing resin composition. The viscosity of the diluent measured with an E-type viscometer at a temperature of 25°C is preferably 0.1-5000mPa･s, more preferably 0.1-2500mPa･s, and even more preferably 0.1-1000mPa･s.

The diluent is preferably a reactive diluent. The reactive diluent is preferably a compound having one ethylenically unsaturated group in one molecule (hereinafter, may be simply referred to as "monofunctional ethylenically unsaturated compound").

Also, in the present invention, compounds classified as "polyfunctional ethylenically unsaturated compounds" having two ethylenically unsaturated groups in one molecule (hereinafter, sometimes simply referred to as "bifunctional ethylenically unsaturated compounds") , If it is within the above viscosity range, it may also be used as a reactive diluent. When blending a difunctional ethylenically unsaturated compound used as a reactive diluent, the blending amount may be reduced when no diluent is blended or blended. Examples of bifunctional ethylenically unsaturated compounds that can also be used as diluents include "DPGDA" (dipropylene glycol diacrylate), "HDDA" (1,6-hexanediol diacrylate), and "TPGDA" (tripropylene glycol diacrylate), "EBECRYL145" (PO-modified neopentyl glycol diacrylate), "HPNDA" (neopentyl glycol hydroxypivalate diacrylate), "LIGHT" manufactured by Kyoeisha Chemical Co., Ltd. ESTER NP” (neopentyl glycol dimethacrylate), “LIGHT ESTER EG” (ethylene glycol dimethacrylate), “LIGHT ESTER 2EG” (diethylene glycol dimethacrylate), “LIGHT ESTER 1.6HX” (1,6-hexanediol dimethacrylate), “LIGHT ESTER 1.9ND” (1,9-nonanediol dimethacrylate), “LIGHT ACRYLATE NP-A” ( neopentyl glycol diacrylate), "LIGHT ACRYLATE 1.9ND-A" (1,9-nonanediol diacrylate), "NK ESTER 701A" (2-hydroxy-3-methyl Acryl Propyl Acrylate), "NK ESTER A-200" (Polyethylene Glycol #200 Diacrylate), "NK ESTER APG-400" (Polypropylene Glycol #400 Diacrylate), "NK ESTER BG "(1,3-butanediol dimethacrylate), "NK ESTER 701" (2-hydroxy-1,3-dimethylacryloxypropane), "NK ESTER 3PG" (tripropylene glycol dimethacrylate methacrylate), Osaka Organic Chemical Industry Co., Ltd. "BISCOAT #195" (1,4-butanediol diacrylate), Arkema Corporation "SR562" (alkoxylated hexanediol diacrylate esters), etc. As the ethylenically unsaturated group, it is preferably a (meth)acryl group, and the reactive diluent is more preferably a (meth)acrylic ester having one (meth)acryl group in 1 molecule (hereinafter , sometimes referred to simply as "monofunctional (meth)acrylate").

Monofunctional (meth)acrylates used as diluents include, for example, Daicel Orneex Co., Ltd., "ODA-N" (octyl/decyl acrylate, that is, a monofunctional acrylate having a long-chain alkyl group), "EBECRYL 110", "EBECRYL 1114" (ethoxylated phenyl acrylate), "LIGHT ESTER E" (ethyl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "LIGHT ESTER NB" (n-butyl methyl Acrylate), "LIGHT ESTER IB" (isobutyl methacrylate), "LIGHT ESTER TB" (t-butyl methacrylate), "LIGHT ESTER EH" (2-ethylhexyl methacrylate), "LIGHT ESTER ID" (isodecyl methacrylate), "LIGHT ESTER L" (n-lauryl methacrylate), "LIGHT ESTER S" (n-stearyl methacrylate), "LIGHT ESTER CH "(cyclohexyl methacrylate), "LIGHT ESTER THF (1000)" (tetrahydrofurfuryl methacrylate), "LIGHT ESTER BZ" (benzyl methacrylate), "LIGHT ESTER PO" (benzyl phenoxyethyl methacrylate), "LIGHT ESTER IB-X" (isocamyl methacrylate), "LIGHT ESTER HO-250" (2-hydroxyethyl methacrylate), "LIGHT ESTER HOA" (2-hydroxyethyl acrylate), "LIGHT ESTER G" (glycidyl methacrylate), "LIGHT ACRYLATE IAA" (isoamyl acrylate, that is, single functional acrylate), "LIGHT ACRYLATE S-A" (stearyl acrylate), "LIGHT ACRYLATE EC-A" (ethoxy-diethylene glycol acrylate), "LIGHT ACRYLATE EHDG-AT" (2-ethyl Hexyl-diethylene glycol acrylate), "LIGHT ACRYLATE DPM-A" (methoxydipropylene glycol acrylate), "LIGHT ACRYLATE IB-XA" (isocamphoryl methacrylate, which has an alicyclic group monofunctional methacrylate), "LIGHT ACRYLATE PO-A" (phenoxy ethyl acrylate, monofunctional acrylate with an aromatic ring), "LIGHT ACRYLATE P2H-A" (phenoxydiethylene alcohol acrylate), "LIGHT ACRYLATE P-200A" (phenoxy-polyethylene glycol acrylate), "LIGHT ACRYLATE POB-A" (m-phenoxybenzyl acrylate), "LIGHT ACRYLATE TFH-A "(tetrahydrofurfuryl acrylate), "LIGHT ESTER HOP-A(N)"(2-hydroxypropyl acrylate), "HOA-MS(N)"(2-acryloxyethyl-succinic acid ), "Epoxy Ester M-600A" (2-hydroxy-3-phenoxypropyl acrylate), "IDAA" (isodecyl acrylate) manufactured by Osaka Organic Chemical Industry Co., Ltd., "BISCOAT #155" (cyclo Hexyl acrylate), "BISCOAT #160" (benzyl acrylate), "BISCOAT #150" (tetrahydrofurfuryl acrylate), "BISCOAT #190" (ethyl carbitol acrylate), "OXE-10 "(3-Ethyl-3-epoxypropylene methacrylate, that is, an acrylate with a propylene oxide ring), "MEDOL-10" (2-methyl-2-ethyl-1,3- Dioxolane (Dioxolane)-4-yl) methacrylate, that is, acrylate having a dioxolane (Dioxolane) ring), Toagosei Co., Ltd. "ARONIX M-101A" (phenol EO modified acrylate ), Shin-Nakamura Chemical Industry Co., Ltd. "NK ESTER A-LEN-10" (ethoxylated o-phenylphenol acrylate), "NK ESTER EH-4E" (ethoxylated ethylhexyl polyethylene glycol methacrylate), Hitachi Chemical Co., Ltd. "FA-511AS" (dicyclopentenyl acrylate), "FA-512AS" (dicyclopentenyloxyethyl acrylate), "FA-513AS" ( Dicyclopentyl acrylate), "SR217NS" (4-Tert-butylcyclohexanol acrylate), "SR420NS" (3,3,5-trimethylcyclohexanol acrylate) manufactured by Arkema Corporation, "SR531" (cyclic trimethylolpropane formal acrylate), "CD421" (3,3,5-trimethylcyclohexanol methacrylate), "CD535" (dicyclopentadienylmethacrylate acrylate), "VEEA" (2-(2-vinyloxyethoxy)ethyl acrylate), "VEEM" (2-(2-vinyloxyethoxy)methacrylate) manufactured by Nippon Shokubai Co., Ltd. ethyl ester), etc. Also, the so-called "octyl/decyl acrylate" refers to a mixture of octyl acrylate and decyl acrylate.

The monofunctional (meth)acrylate used as a diluent is particularly preferably a monofunctional methacrylate having an alicyclic structure. The alicyclic structure is synonymous with the foregoing. Examples of commercially available monofunctional (meth)acrylates having an alicyclic structure include "LIGHT ESTER IB-X" (isocamphoryl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd. having a camphane ring structure. , "LIGHT ACRYLATE IB-XA" (isocamyl methacrylate), "LIGHT ESTER CH" (cyclohexyl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd. having a cyclohexyl structure, "LIGHT ESTER CH" manufactured by Osaka Organic Chemical Industry Co., Ltd. BISCOAT #155" (cyclohexyl acrylate), "SR217NS" (4-Tert-butylcyclohexyl acrylate) made by Arkema, "SR420NS" (3,3,5-trimethylcyclohexyl acrylate) ester), "CD421" (3,3,5-trimethylcyclohexanol methacrylate), "CD535" (dicyclopentadienyl methacrylate), Hitachi Chemical Co., Ltd. "FA-511AS" (dicyclopentenyl acrylate), "FA-512AS" (dicyclopentenyloxyethyl acrylate), "FA-513AS" (dicyclopentyl acrylate), Arco "CD535" (dicyclopentadienyl methacrylate) manufactured by Mara Corporation, "VEEA" (2-(2-vinyloxyethoxy)ethyl acrylate) manufactured by Nippon Shokubai Co., Ltd., "VEEM" (methyl 2-(2-vinyloxyethoxy)ethyl acrylate), etc.

When a diluent is used, its content (including the content of "difunctional ethylenically unsaturated compound" used as a diluent) is preferably 2% by mass or more, more preferably 5% by mass, based on the entire resin composition % or more, more preferably at least 10 mass %, more preferably at most 60 mass %, more preferably at most 55 mass %, even more preferably at most 50 mass %.

Photocationic polymerization initiator The sealing resin composition of the present invention may contain a photocationic polymerization initiator. Only 1 type may be sufficient as a photocationic polymerization initiator, and 2 or more types may be sufficient as it.

As photocationic polymerization initiators, for example, aromatic percited salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts, (2,4-cyclopentadien-1-yl) ((1-methylethyl)benzene)-Fe salt, etc.

Examples of aromatic cobaltium salts include bis(4-(diphenylsulfonio)phenyl)sulfide bishexafluorophosphate, bis(4-(diphenylsulfonio)benzene base) sulfide bis-hexafluoroantimonate, bis(4-(diphenyldihydrogenthio)phenyl)sulfide bistetrafluoroborate, bis(4-(diphenyldihydrothio)benzene base) sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4-(phenylsulfanyl) phenyl percited hexafluorophosphate, diphenyl-4-(phenylthio) phenyl percited hexafluoro Antimonate, diphenyl-4-(phenylsulfanyl)phenylsulfurium tetrafluoroborate, diphenyl-4-(phenylthio)phenylsulfurium(pentafluorophenyl)borate, tri Phenyl percite hexafluorophosphate, triphenyl percite hexafluoroantimonate, triphenyl percite tetrafluoroborate, triphenyl peroxide (pentafluorophenyl) borate, bis(4-(bis( 4-(2-hydroxyethoxy))phenyldihydrothio)phenyl)sulfide bis-hexafluorophosphate, bis(4-(bis(4-(2-hydroxyethoxy))phenyl di Sulfuryl)phenyl)sulfide bishexafluoroantimonate, bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrothio)phenyl)sulfide bistetrafluoroboron ester, bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydromercapto)phenyl)sulfide tetrakis(pentafluorophenyl)borate, etc.

Examples of aromatic iodonium salts include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium Fluorophenyl) borate, bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonate, bis(dodecylphenyl) Ionium tetrafluoroborate, bis(dodecylphenyl)iodonium tetra(pentafluorophenyl)borate, 4-methylphenyl-4-(1-methylethyl)phenyliodide Onium hexafluorophosphate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluoroantimonate, 4-methylphenyl-4-(1-methylethyl) Phenyliodonium tetrafluoroborate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetra(pentafluorophenyl)borate, and the like.

Examples of aromatic diazonium salts include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium (pentafluorophenyl) Borates, etc.

Examples of aromatic ammonium salts include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2-cyano 1-pyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetra(pentafluorophenyl) borate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluorophosphate , 1-(naphthylmethyl)-2-cyanopyridinium hexafluoroantimonate, 1-(naphthylmethyl)-2-cyanopyridinium tetrafluoroborate, 1-(naphthylmethyl )-2-cyanopyridinium tetrakis (pentafluorophenyl) borate and the like.

As (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salt, for example, (2,4-cyclopentadien-1-yl)((1 -Methylethyl)benzene)-Fe(II) hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II)hexafluoro Antimonate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) tetrafluoroborate, (2,4-cyclopentadiene- 1-yl)((1-methylethyl)benzene)-Fe(II) tetrakis(pentafluorophenyl)boronate, etc.

Examples of commercially available photocationic polymerization initiators include "SP-150", "SP-170", "SP-082", "SP-103" manufactured by ADEKA Corporation, "CPI-103" manufactured by San-Apro Corporation, 100P", "CPI-101A", "CPI-200K", "Omnirad 270", "Omnirad 290" manufactured by IGM resins, etc.

When a photocationic polymerization initiator is used, its content is preferably 0.5 parts by mass relative to 100 parts by mass of the total of compounds having epoxy groups (for example, the total of (meth)acrylates and epoxy resins having epoxy groups). -10 parts by mass, more preferably 1.0-8 parts by mass, still more preferably 2.0-6 parts by mass.

Silane coupling agent The sealing resin composition of the present invention may contain a silane coupling agent. Only 1 type may be sufficient as a silane coupling agent, and 2 or more types may be sufficient as it.

As the silane coupling agent, for example, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl triethoxysilane, 3-glycidoxypropyl (dimethyl Epoxy silane coupling agents such as oxy)methylsilane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyl Mercapto-based silane coupling agents such as triethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyl Trimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethyl Amino-based silane coupling agents such as silanes; ureido-based silane coupling agents such as 3-ureidopropyltriethoxysilane; vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethoxysilane Vinyl silane coupling agents such as p-styryl trimethoxysilane, etc.; 3-acryloxypropyl trimethoxysilane and 3-acryloxypropyl trimethoxysilane - Acrylate-based silane coupling agents such as methacryloxypropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltrimethoxysilane; bis(triethoxysilylpropane) Sulfide-based silane coupling agents such as disulfide, bis(triethoxysilylpropyl)tetrasulfide, etc.; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazole silane, triazine silane, etc. Among them, an acrylate-based silane coupling agent is preferable.

Examples of commercially available silane coupling agents include "KBM-502", "KBM-503", "KBE-502", "KBE-503", "KBM-5103", and "KBM-5103" manufactured by Shin-Etsu Chemical Co., Ltd. 5803" and so on.

When using a silane coupling agent, its content is preferably 0.10-5.00 mass % with respect to the whole resin composition, More preferably, it is 0.25-3.00 mass %, More preferably, it is 0.30-2.00 mass %.

Polymerization inhibitor The sealing resin composition of the present invention may contain a polymerization inhibitor. Only 1 type may be sufficient as a polymerization inhibitor, and 2 or more types may be sufficient as it.

Examples of polymerization inhibitors include t-butylhydroquinone, p-benzoquinone, hydroquinone, p-methoxyphenol, N,N-diethylhydroxylamine, N-nitroso-N-phenyl Hydroxylamine ammonium salt, etc. Examples of commercially available polymerization inhibitors include "Q-1301", "TBHQ", "PBQ2", "DEHA", "MEHQ" manufactured by Wako Pure Chemical Industries, Ltd., and "QS-10" manufactured by Kawasaki Chemical Industries, Ltd. wait.

When using a polymerization inhibitor, its content is preferably 10-200 ppm, more preferably 50-100 ppm with respect to 100 parts by mass of the "compound having an ethylenically unsaturated group". Also, the aforementioned "ppm" is the quality standard. Here, the "compound having an ethylenically unsaturated group" includes a "polyfunctional ethylenically unsaturated compound" and a "monofunctional ethylenically unsaturated compound" as described above.

＜Organic EL device＞ The organic EL device in which the organic EL element is sealed with the cured product of the resin composition for sealing of the present invention can be obtained by, for example, coating the resin composition for sealing of the present invention on the organic EL element on the substrate, and then making the resin The composition hardens to manufacture.

When the sealing resin composition of the present invention contains a photoradical polymerization initiator, curing can be performed by irradiating the resin composition with ultraviolet rays. As a device for irradiating ultraviolet rays, for example, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, high-power metal halide lamps, low-pressure mercury lamps, LED light sources, and the like can be cited. The temperature of the resin composition during ultraviolet irradiation is preferably from 20 to 120°C, more preferably from 25 to 110°C. The cumulative irradiation dose of ultraviolet rays is preferably from 500 to 4000 mJ/cm ² , more preferably from 1000 to 3500 mJ/cm ² .

When the sealing resin composition of the present invention contains a thermal radical polymerization initiator, hardening can be performed by heating the resin composition using a dryer or the like. The heating temperature is preferably 80-120°C, more preferably 100-110°C, and the heating time is preferably 15-120 minutes, more preferably 30-90 minutes. This heating can be carried out under the atmospheric environment, and can also be carried out under the inert gas (such as nitrogen gas) environment. [Example]

Hereinafter, although the examples are listed to describe the present invention in more detail, the present invention is not limited by the following examples. Of course, it can be appropriately modified and implemented within the scope of the above-mentioned and following purposes, and these are also included in the present invention. range of technologies. Also, the "parts" of the amounts described below mean "parts by mass" unless otherwise mentioned.

<Example 1> 90 parts of bifunctional alicyclic acrylate ("IRR214-K" manufactured by Daicel Orneex), 30 parts of hexafunctional acrylate ("DPCA-60" manufactured by Nippon Kayaku Co., Ltd.), and 2 30 parts of functional aliphatic acrylate ("1.9ND-A" manufactured by Kyoeisha Chemical Co., Ltd.), 0.05 parts of a polymerization inhibitor ("Q-1301" manufactured by Wako Pure Chemical Industries, Ltd.), and commercially available hydrotalcite A (semi Calcined hydrotalcite, BET specific surface area: 13m ² /g, average particle size: 400nm)) 90 parts, and commercially available calcium oxide (manufactured by Kitamura Co., Ltd.) 30 parts, uniformly dispersed with a high-speed rotary mixer. Then, 11 parts of a polymerization initiator ("Irgacure 1173" manufactured by BASF Corporation) was added and dispersed again to obtain a resin composition.

<Example 2> Using semi-fired hydrotalcite A and commercially available hydrotalcite D (unfired hydrotalcite, average particle size: 400nm), stir and mix the ingredients listed in Table 1 at a specified blending ratio to obtain a resin composition things.

<Example 3> Using semi-fired hydrotalcite A and commercially available hydrotalcite C (fired hydrotalcite, average particle size: 400nm), the components listed in Table 1 were stirred and mixed at a specified blending ratio to obtain a resin composition .

<Examples 4-6, Comparative Examples 1-4> In the same manner as in Example 1, each component described in Table 1 was stirred and mixed at a predetermined blending ratio, and the resin compositions of Examples 4-6 and Comparative Examples 1-4 were obtained.

＜Water absorption rate of hydrotalcite＞ 1.5 g of each hydrotalcite was weighed on a scale, and the initial mass was measured. Let stand for 200 hours in a small environmental tester (SH-222 manufactured by Espec Co., Ltd.) set at atmospheric pressure, 60°C, and 90%RH (relative humidity), measure the mass after moisture absorption, and calculate the saturation using the above formula (i) water absorption. The results are shown in Table 1.

＜Thermal weight reduction rate of hydrotalcite＞ The thermogravimetric analysis of each hydrotalcite was performed using TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Co., Ltd. 10 mg of hydrotalcite was weighed on a sample pan made of AL, and the temperature was raised from 30°C to 550°C at 10°C/min in an environment with a nitrogen flow rate of 200 mL/min in an uncovered and open state. Using the above formula (ii), the thermogravimetric reduction rates at 280°C and 380°C were obtained. The results are shown in Table 1.

＜Powder X-ray diffraction＞ Powder X-ray diffraction was measured by powder X-ray diffraction device (manufactured by PANalytical, Empyrean), with cathode CuKα (1.5405Å), voltage: 45V, current: 40mA, sampling width: 0.0260˚, scanning speed: 0.0657˚/s, measuring diffraction angle range (2θ): 5.0131～79.9711˚. The peak search uses the peak search function of the software attached to the diffraction device, with "minimum significance: 0.50, minimum peak chip: 0.01˚, maximum peak chip (Maximum peak chip): 1.00˚, peak bottom width: 2.00˚, method : The minimum value of the second differential” is carried out. Detect two split peaks that appear within the range of 2θ of 8 to 18˚, or use the synthesis of two peaks to have a peak with a shoulder, and measure the peak that appears on the low-angle side or the diffraction intensity of the shoulder (= low-angle side diffraction intensity), and the diffraction intensity of the peak or shoulder appearing on the high-angle side (= high-angle side diffraction intensity), calculate the relative intensity ratio (= low-angle side diffraction intensity/high-angle side diffraction strength). The results are shown in Table 1.

According to the results of saturated water absorption, thermal weight reduction rate and powder X-ray diffraction, hydrotalcite A is "semi-fired hydrotalcite", hydrotalcite C is "fired hydrotalcite", and hydrotalcite D is "unfired hydrotalcite". talc".

＜Moisture content＞ After the resin compositions prepared in Examples and Comparative Examples were stored in an oven at 80°C for one week, the moisture contained in the resin compositions was measured using a Karl Fischer moisture meter (manufactured by Mitsubishi Chemical Analytech, CA-200). . The moisture content detected when heated in a furnace at 130°C was evaluated using the following criteria. The results are shown in Table 2. Good (○): Less than 1000ppm Acceptable (△): More than 1000ppm but less than 1500ppm Bad (×): 1500ppm or more

＜Ca deterioration assessment＞ After forming a Ca 200nm film on the glass substrate, the prepared resin composition is coated on the Ca for hardening treatment. The presence or absence of deterioration of the Ca film surface after heating at 100° C. for 30 minutes was confirmed, and evaluated by the following criteria. The results are shown in Table 2. Good (○): No deterioration of Ca film surface Poor (×): Significant deterioration of Ca film surface

From the results in Table 2, it can be confirmed that the compositions of Examples 1 to 6 are all low in water content and good in Ca deterioration evaluation, that is, they can suppress the initial deterioration of organic EL during sealing, and can form a composition that can prevent the deterioration of the device over a long period of time. Sealing layer.

<Device sealing test> First, an organic EL element (thickness of organic film: 110nm, thickness of cathode: 10nm) was formed on an indium tin oxide (ITO)-attached glass substrate (manufactured by GEOMATEC) so that the light emitting area became ^4mm2 . Next, a nitride film (thickness: 500 nm) was formed on the organic EL element using a chemical vapor phase growth method (CVD method). Next, after applying the composition prepared in Example 1 so as to surround the organic EL element with a nitride film, a non-alkali glass plate is stacked thereon to prepare a laminate (alkali-free glass plate/composition layer/organic EL element with nitride film/glass substrate with ITO). The composition was cured by heating the laminate at 100° C. for 30 minutes to manufacture a laminate sealing the organic EL element (thickness of the cured product: 10 μm). [Industrial availability]

The resin composition for encapsulation of the present invention is excellent in moisture barrier properties and degradation suppression of elements such as organic EL elements, so it can be suitably used for sealing light-emitting elements such as organic EL elements or light-receiving elements such as solar cells.

This case is based on the Japanese application No. 2018-033850, and all of its contents are included in the specification of this case.

Claims (14)

A resin composition for sealing, which contains at least one kind of acrylic resin, hydrotalcite, calcium oxide and radical polymerization initiator; the mass ratio of calcium oxide to hydrotalcite is 0.1~1, and the acrylic resin is contained in 1 Compounds with two or more ethylenically unsaturated groups in the molecule, the average particle size of hydrotalcite is 1-1,000nm, and the average particle size of calcium oxide is 0.1-20μm. The sealing resin composition according to claim 1, wherein the content of the hydrotalcite is 10% by mass to 70% by mass relative to 100% by mass of the non-volatile components of the resin composition. The sealing resin composition according to claim 1, which further contains at least one kind of epoxy resin. The sealing resin composition according to claim 1, wherein the acrylic resin is a compound having three or more ethylenically unsaturated groups in one molecule. The sealing resin composition according to claim 1, wherein the acrylic resin is a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule. The resin composition for sealing as claimed in claim 1, wherein the ethylenically unsaturated The base is a (meth)acryl group. The sealing resin composition according to claim 5, wherein the amount of the compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule is 5 to 75% by mass relative to the entire resin composition. The resin composition for sealing according to Claim 1, wherein the hydrotalcite is semi-fired hydrotalcite. The sealing resin composition according to claim 1, wherein the radical polymerization initiator is a photo radical polymerization initiator and/or a thermal radical polymerization initiator. The sealing resin composition according to claim 1, wherein the amount of the radical polymerization initiator is 0.5 to 10 parts by mass relative to 100 parts by mass of the compound having an ethylenically unsaturated group. The sealing resin composition according to claim 1, further comprising a silane coupling agent. The resin composition for sealing as claimed in claim 1 is liquid. The sealing resin composition according to claim 1 is used for sealing organic EL elements. An organic EL device, which seals an organic EL element with a cured product of the resin composition for sealing according to any one of claims 1 to 13.