TWI808793B - Exhaust jig device and method for suppressing warpage of carrier board by using gas pressurization - Google Patents

Abstract

An exhaust fixture device and method for suppressing warping of a carrier plate by using gas pressurization, comprising: The exhaust fixture containing the carrier is placed in the gas pressurized chamber. The upper contact surface of the plurality of holes of the exhaust fixture is used for placing the first surface of the carrier, and the exhaust fixture is vacuum exhausted to fix the carrier. The exhaust fixture is composed of a detachable upper contact part and a lower base. Predetermined pressure for thermal processing, the first surface of the carrier board can be simulated or measured to obtain a geometric curved surface, and the upper contact surface is processed into an inverse geometric curved surface, which can offset the thermal stress and make the carrier board shape tend to be flat.

Description

Exhaust jig device and method for suppressing warpage of carrier board by using gas pressurization

The present invention provides a technical field of exhaust fixtures, especially to provide an exhaust fixture device and method that uses gas pressure to suppress the warping of the carrier board. The upper contact surface of the exhaust fixture is processed into a reverse curvature surface or an anti-wave surface that is simulated or actually measured on the carrier board to offset the thermal stress of the carrier board and tend to be flat.

According to this, the warpage of the package is caused by the different thermal expansion coefficients of the materials in the package. In order to solve this warping problem, the prior invention patent application No. 100146868 "Substrate Fixing Method Using Gas Inflation to Suppress Warpage of the Substrate" provides a solution. Referring to Fig. 1 and Fig. 2, the above-mentioned prior patent of the prior art invention includes: a carrier board 1 having upper and lower surfaces 1b, 1c, and the upper and lower surfaces 1b, 1c are opposite to each other. A degassable jig 3 , the degassable jig 3 has a hole surface 3 a including a plurality of holes 5 . One of the upper and lower surfaces 1b, 1c of the carrier board 1 faces the hole surface 3a and is placed on the hole surface 3a. The exhaustable jig 3 is vacuum exhausted to fix the carrier plate 1 on the exhaustable jig 3 . The carrier board 1 is fixed on the hole surface 3 a by means of a pressing plate which avoids the effective area on the carrier board 1 . The degassable jig 3 containing the carrier 1 is placed in a gas-filled chamber 20 . The gas pressurized chamber 20 is pressurized to form a pressure difference between the first surface and the second surface of the carrier plate 1 to generate a pressure 22 to press the carrier plate 1 on the degassable jig 3, wherein the gas pressurized chamber 20 is pressurized to a predetermined pressure greater than standard atmospheric pressure. The predetermined pressure ranges between 1 atm (kg/cm2) and about 30 atm (kg/cm2). After the pressure in the gas-filled chamber 20 reaches a predetermined pressure, the exhaust of the degassable jig 3 can be closed, and the carrier 1 can be pressed on the degassable jig 3 through the formed high pressure difference. At least one heat-resistant sealing layer 11 can be disposed between the first surface of the carrier board 1 and the hole surface 3 a of the degassable jig 3 , wherein the heat-resistant sealing layer 11 does not cover the hole 5 of the hole surface 3 a. The heat-resistant sealing layer 11 can withstand, for example, a processing temperature of not less than 40°C and not more than 300°C. The carrier board 1 with the warped portion 1 a is placed on the degassable jig 3 . The upper surface 1b or the lower surface 1c of the carrier board 1 can be the first surface or the second surface. The degassable jig 3 can have a hole surface 3 a and a gas channel 7 to generate a gas flow path 21 . The hole surface 3 a may contain a plurality of holes 5 . The gas channel 7 is coupled to an exhaust device 9, and the exhaust device 9 can be a general exhaust pump or a vacuum pump or an exhaust channel switch. The downward force 22 generated by the air pressure difference from the gas pressure chamber 20 to the airflow path 21 at the hole surface 3A and the hole 5 can press the carrier board 1 tightly on the degassable fixture 3, so as to resist the warping phenomenon caused by the uneven thermal expansion of the carrier board 1 at high temperature. Although the above-mentioned conventional invention keeps the carrier plate 1 flat under pressure, there is still thermal stress in the carrier plate 1 that has not been completely eliminated, so the thermal stress will still deform the carrier plate 1 after the pressure disappears.

Therefore, in view of the problems existing in the above-mentioned conventional structures, how to develop a more ideal and practical innovative structure is what consumers are eagerly looking forward to, and it is also the goal and direction that related businesses must work hard to develop breakthroughs.

In view of this, the inventor has been engaged in the manufacture, development and design of related products for many years. After careful design and careful evaluation for the above-mentioned goals, he finally obtained a practical invention.

The main purpose of the present invention is to provide an exhaust fixture device and method that uses gas pressurization to suppress warping of the carrier board. The upper contact surface of the exhaust fixture is processed into a curved surface or an anti-wave surface that is simulated or actually measured on the carrier board to offset the thermal stress of the carrier board and tend to be flat.

In order to achieve the above-mentioned purpose, the present invention provides a kind of exhaust fixture device and method that utilizes gas pressurization to suppress the warping of the carrier plate, which includes: a carrier plate with an upper and a lower surface, the upper and lower surfaces are opposite to each other; prepare an exhaust fixture, the exhaust fixture has an upper contact surface containing a plurality of holes; one of the upper and lower surfaces of the carrier plate faces the upper contact surface, and is placed and fixed on the surface of the hole, which can be defined as the first surface, and the corresponding surface is defined as the second surface; pressure and exhaust the exhaust fixture located in the gas pressurized chamber to form a pressure difference between the first surface and the second surface of the carrier plate, so as to press the carrier plate on the exhaust fixture, wherein the chamber is pressurized to a predetermined pressure greater than the standard atmospheric pressure; it is characterized in that: the exhaust fixture is composed of an upper contact part and a lower base part, wherein the surface of the upper contact part is the upper contact surface, and a fitting part of a fitting structure is provided on the periphery of the upper contact part, and the lower seat part corresponds to the fitting. A fitting groove of the fitting structure is provided in the fitting groove, and an O-ring is first assembled in the fitting groove, and then the fitting part is combined. The upper contact part is a detachable design. The first surface of the carrier board can be simulated or measured to be flat or concave, convex, or wavy. The upper contact surface can be processed into a corresponding flat or convex, concave, or anti-wavy surface.

Regarding the techniques, means and effects used in the present invention, a preferred embodiment will be described in detail in conjunction with the drawings. It is believed that the above-mentioned purpose, structure and characteristics of the present invention should be able to gain a deep and specific understanding therefrom.

The present invention provides a designer of an exhaust fixture device and method for suppressing warping of a carrier plate by using gas pressurization.

In order to enable your review committee members to have a further understanding and understanding of the purpose, characteristics and effects of the present invention, the implementation methods and drawings are described in detail as follows:

Referring to Figures 3 to 4, the present invention provides an exhaust fixture device that uses gas pressure to suppress warping of the carrier board, which includes:

A carrier plate 1 having upper and lower faces 1b, 1c, the upper and lower faces 1b, 1c are opposite to each other; an exhaust tool 30, the exhaust tool 30 has an upper contact surface 41 comprising a plurality of holes 5; one of the upper and lower faces 1b, 1c of the carrier plate 1 faces the upper contact face 41, and is placed and fixed on the upper contact face 41, wherein the upper face 1b or the lower face 1c of the carrier 1 facing the upper contact face 41 is defined as a first face, and the other side relative to the first side is defined as a second side; a gas pressurized chamber 20 is gas-charged, and the exhaust fixture 30 located in the gas pressurized chamber 20 is exhausted to form a pressure difference between the first surface and the second surface of the carrier plate 1, so that the carrier plate 1 is pressed on the exhaust fixture 30, wherein the gas pressurized chamber 20 is pressurized to a predetermined pressure greater than standard atmospheric pressure; it is characterized in that:

The exhaust fixture 30 may be composed of an upper contact portion 40 and a lower base portion 50, wherein the surface of the upper contact portion 40 is the upper contact surface 41, and the upper contact portion 40 is of a detachable design. A surface data can be obtained by simulating or actually measuring the first surface of the carrier plate 1 after previous thermal processing. The surface data can be processed on the upper contact surface 41 according to the corresponding data of flat to flat, concave to convex, and convex to concave, so that the thermal stress of the carrier 1 can be offset during subsequent thermal processing. The carrier plate 1 after thermal processing tends to be flat.

Said exhaust fixture device using gas pressurization to suppress warping of the carrier plate, wherein a fitting portion 42 of a fitting structure is provided downwards around the upper contact portion 40 , and a fitting groove 51 of the fitting structure is provided on the lower base portion 50 corresponding to the fitting portion 42 , the fitting portion 42 is fitted and tightly fitted to the fitting groove 51 , and an O-ring 60 is formed between the fitting portion 42 and the fitting groove 51 .

Referring to FIG. 5, the exhaust fixture device using gas pressurization to suppress the warpage of the carrier plate, wherein the first surface of the carrier plate 1 is a concave surface, and the upper contact surface 41 of the upper contact portion 40 is a convex surface.

Referring to FIG. 6, the exhaust fixture device using gas pressurization to suppress the warpage of the carrier board, wherein the first surface of the carrier board 1 is a convex curved surface, and the upper contact surface 41 of the upper contact portion 40 is a concave curved surface.

Referring to FIG. 7, the exhaust fixture device using gas pressurization to suppress the warping of the carrier plate, wherein the first surface of the carrier plate 1 is a wavy surface, and the upper contact surface 41 of the upper contact portion 40 is an anti-wavy surface.

Referring to FIG. 8, the exhaust fixture device using gas pressurization to suppress the warpage of the carrier plate, wherein the first surface of the carrier plate 1 is an irregular curved surface, and the upper contact surface 41 of the upper contact portion 40 is an anti-irregular curved surface.

In the exhaust jig device using gas pressurization to suppress warping of the carrier board, at least one heat-resistant sealing layer 11 is provided between the first surface of the carrier board 1 and the upper contact surface 41 of the exhaust jig 30, wherein the heat-resistant sealing layer 11 may partially cover or not cover the hole 5.

In the exhaust fixture device using gas pressurization to suppress the warpage of the carrier, the heat-resistant sealing layer 11 can withstand the processing temperature above 40°C and below 1200°C.

The exhaust fixture device using gas pressurization to suppress the warpage of the carrier board, wherein the carrier board 1 can be at least one of a printed circuit board, a substrate, a lead frame, a wafer, a silicon interposer, a package, and a flat plate with circuit wiring.

As shown in Figure 9, a method of using gas pressurization to suppress warping of the carrier board includes:

Step 1A: After a carrier is deformed by thermal processing, the surface data (71) of the deformed first surface of the carrier is actually measured (71); or

Step 1B: Calculate the deformed surface data (72) of the first surface of a support plate after simulating thermal processing deformation;

Step 2: Prepare an exhaust fixture (73) with a detachable upper contact part;

Step 3: The processing machine obtains an upper contact surface of the upper contact portion, and according to the surface data, can process relevant data corresponding to flat to flat, concave to convex, and convex to concave on the upper contact surface (74);

Step 4: placing the exhaust fixture containing the carrier plate in a gas-filled chamber, and placing the first surface of the carrier plate facing the upper contact surface with a plurality of holes (75);

Step 5: pressurize the gas pressurization chamber, and exhaust the exhaust fixture to form a pressure difference between the first surface of the carrier plate and the second surface of the carrier plate, so as to press the carrier plate on the exhaust fixture, and pressurize the gas pressurization chamber to a predetermined pressure greater than standard atmospheric pressure (76);

Step 6: After the thermal processing of the carrier board, the thermal stress of the carrier board can be offset to make the carrier board tend to be flat (77). Wherein, the upper surface or the lower surface of the carrier facing the upper contact surface is defined as a first surface, and the other surface opposite to the first surface is defined as a second surface.

It can be seen from the above that the exhaust fixture device and method of the present invention that uses gas pressure to suppress the warping of the carrier plate is indeed the first in the industry and meets the novelty requirements of the invention patent, and its comprehensive innovative design meets the progressive requirements of the invention patent, and the contact surface of the exhaust fixture can be processed into the reverse curvature or anti-wave surface of the carrier board simulation or actual measurement of the curvature surface or the wave surface, so as to offset the thermal stress of the carrier board and tend to be flat, which is in line with better industrial applicability.

The above is a specific description of the technical features of the present invention for the preferred embodiments of the present invention; however, those who are familiar with this technology should be able to make changes and modifications to the present invention without departing from the spirit and principles of the present invention, and such changes and modifications should be covered in the scope defined by the scope of the following patent application.

To sum up, the present invention provides an exhaust fixture device and method that utilizes gas pressurization to suppress the warping of the carrier board. It has indeed achieved all the objectives of the present invention. In addition, the spatial configuration of its combined structure has not been seen in similar products, nor has it been disclosed before the application.

[knowledge] 1: carrier board 1a: Warped part 1b: above 1c: Below 3: Exhaust fixture 3a: hole surface 5: hole 7: Gas channel 9: Exhaust device 11: heat-resistant sealing layer 20: Gas-filled chamber 21: Airflow path 22: Downforce force 〔this invention〕 30: exhaust fixture 40: upper contact part 41: Upper contact surface 42: Fitting part 50: Lower base part 51: Fitting groove 60: O-ring 71: After a carrier board is deformed by thermal processing, the surface data of the first surface of the carrier board after deformation is actually measured 72: Calculate the surface data of the deformation of the first surface of the support plate after simulating thermal deformation of the support plate 73: Prepare an exhaust fixture with a detachable upper contact part 74: The processing machine obtains an upper contact surface of the upper contact part, and according to the surface data, the relevant data corresponding to flat to flat, concave to convex, and convex to concave can be processed on the upper contact surface 75: Place the exhaust fixture containing the carrier plate in a gas-filled chamber, and place the first surface of the carrier plate facing the upper contact surface with a plurality of holes 76: pressurize the gas pressurized chamber, and exhaust the exhaust fixture to form a pressure difference between the first surface of the carrier plate and the second surface of the carrier plate, so as to press the carrier plate on the exhaust fixture, and pressurize the gas pressurized chamber to a predetermined pressure greater than standard atmospheric pressure 77: After thermal processing of the carrier board, the thermal stress of the carrier board can be offset, so that the carrier board tends to be flat

[Picture 1] is a schematic cross-sectional view of the principle of the previous case. [Fig. 2] is a schematic cross-sectional view of at least one heat-resistant sealing layer arranged between the first surface of the carrier board and the hole surface of the jig in the prior art. [Fig. 3] is a schematic exploded sectional view of a preferred embodiment of the present invention. [Fig. 4] is a schematic cross-sectional schematic diagram of a preferred embodiment of the present invention. [Fig. 5] is a schematic diagram of an embodiment of a part of the first surface of the carrier board and a part of the contact surface of the exhaust fixture according to the present invention. [Fig. 6] is a schematic diagram of another embodiment of a part of the first surface of the carrier plate of the present invention and a part of the contact surface of the exhaust fixture. [Fig. 7] is a schematic diagram of yet another embodiment of a part of the first surface of the carrier plate of the present invention and a part of the contact surface of the exhaust fixture. [Fig. 8] is a schematic diagram of yet another embodiment of a part of the first surface of the carrier plate of the present invention and a part of the contact surface of the exhaust fixture. [Fig. 9] is a block diagram of the method flow of one embodiment of the present invention.

1: carrier board

1b: above

1c: below

5: hole

30: exhaust fixture

40: upper contact part

41: Upper contact surface

42: Fitting part

50: Lower base part

51: Fitting groove

60: O-ring

Claims (10)

A degassing jig device that uses gas pressure to suppress the warping of the carrier board, including: A support plate with an upper and a lower surface, the upper and lower surfaces are opposite to each other; an exhaust fixture, the exhaust fixture has an upper contact surface including a plurality of holes; one of the upper and lower surfaces of the carrier plate faces the upper contact surface, and is placed and fixed on the upper contact surface, wherein the upper or lower surface of the carrier plate facing the upper contact surface is defined as a first surface, and the other surface opposite to the first surface is defined as a second surface; a gas pressure chamber is used to pressurize the gas, and to charge the gas located on the upper contact surface. The exhaust fixture in the pressure chamber is exhausted to form a pressure difference between the first surface and the second surface of the carrier plate, so as to press the carrier plate on the exhaust fixture, wherein the gas pressurization chamber is pressurized to a predetermined pressure greater than standard atmospheric pressure; it is characterized in that: The exhaust fixture may be composed of an upper contact part and a lower base part, wherein the surface of the upper contact part is the upper contact surface, and the upper contact part is designed to be detachable. A surface data can be obtained by simulating or actually measuring the first surface of the carrier board after previous thermal processing. The surface data can be processed on the upper contact surface according to the corresponding data of flat to flat, concave to convex, and convex to concave, so that the thermal stress of the carrier can be offset during subsequent thermal processing, so that the carrier after thermal processing tends to be flat. As described in Claim 1, the exhaust fixture device using gas pressurization to suppress the warping of the carrier plate, wherein a fitting part of a fitting structure is provided on the periphery of the upper contact part, and a fitting groove of the fitting structure is provided on the lower base part corresponding to the fitting part. According to claim 1, the exhaust fixture device using gas pressurization to suppress the warping of the carrier board, wherein the first surface of the carrier board is a concave curved surface, and the upper contact surface of the upper contact portion is a convex curved surface. According to claim 1, the exhaust fixture device using gas pressurization to suppress the warping of the carrier board, wherein the first surface of the carrier board is a convex curved surface, and the upper contact surface of the upper contact portion is a concave curved surface. According to claim 1, the exhaust fixture device using gas pressurization to suppress the warping of the carrier board, wherein the first surface of the carrier board is a wavy curved surface, and the upper contact surface of the upper contact portion is an anti-wavy curved surface. According to claim 1, the exhaust fixture device using gas pressurization to suppress the warping of the carrier board, wherein the first surface of the carrier board is an irregular curved surface, and the upper contact surface of the upper contact portion is an anti-irregular curved surface. According to claim 1, the exhaust fixture device using gas pressurization to suppress warping of the carrier board, wherein at least one heat-resistant sealing layer is provided between the first surface of the carrier board and the upper contact surface of the exhaust fixture, wherein the heat-resistant sealing layer may partially cover or not cover the hole. According to claim 7, the exhaust fixture device using gas pressurization to suppress the warpage of the carrier board, wherein the heat-resistant sealing layer can withstand the processing temperature above 40°C and below 1200°C. As described in claim 1, the exhaust fixture device using gas pressurization to suppress the warpage of the carrier board, wherein the carrier board can be at least one of a printed circuit board, a substrate, a conductive support, a wafer, a silicon interposer, a package, and a flat panel with circuit wiring. A method for suppressing warping of a carrier plate by using gas pressure, comprising the following steps: after a carrier plate is deformed by thermal processing, the surface data of the deformed first surface of the carrier plate is actually measured, or after a carrier plate is deformed by simulated thermal processing, the surface data of the deformed first surface of the carrier plate is calculated; an exhaust fixture with a detachable upper contact part is prepared; a processing machine obtains an upper contact surface of the upper contact part, and according to the surface data, the corresponding data corresponding to flatness, concavity, convexity, and convexity is processed on the upper contact place the exhaust fixture containing the carrier plate in a gas pressurized chamber, the first surface of the carrier plate faces the upper contact surface with a plurality of holes; pressurize the gas pressurized chamber, and exhaust the exhaust fixture to form a pressure difference between the first surface of the carrier plate and the second surface of the carrier plate, so as to press the carrier plate on the exhaust fixture, pressurize the gas pressurized chamber to a predetermined pressure greater than standard atmospheric pressure; The stress makes the carrier plate tend to be flat.

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