TWI806091B - Needle for vertical probe card with improved alignment efficiency - Google Patents
Needle for vertical probe card with improved alignment efficiency Download PDFInfo
- Publication number
- TWI806091B TWI806091B TW110125424A TW110125424A TWI806091B TW I806091 B TWI806091 B TW I806091B TW 110125424 A TW110125424 A TW 110125424A TW 110125424 A TW110125424 A TW 110125424A TW I806091 B TWI806091 B TW I806091B
- Authority
- TW
- Taiwan
- Prior art keywords
- cross
- probe card
- section
- guide plate
- needle
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 54
- 238000001514 detection method Methods 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Images
Landscapes
- Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
Abstract
本發明涉及一種對準效率提升的垂直式探針卡用針頭。 所述對準效率提升的垂直式探針卡用針頭,如果在截面中央形成有水平的虛擬線,則截面上部的截面積與截面下部的截面積大小互不相同,由此針對在與檢測物件接觸的過程中產生扭力的阻力在一定方向產生,從而不需要額外的步驟,也能夠將尖部準確地對齊到預先設定的導板內部一側。 The invention relates to a needle head for a vertical probe card with improved alignment efficiency. In the vertical probe card needle head with improved alignment efficiency, if a horizontal virtual line is formed in the center of the section, the cross-sectional area of the upper part of the cross-section is different from the cross-sectional area of the lower part of the cross-section. The torsion-generating resistance during contact is oriented in such a way that no extra steps are required to accurately align the tip to the pre-set inside side of the guide.
Description
本發明涉及一種對準效率提升的垂直式探針卡用針頭,更具體地,涉及一種對準效率提升的垂直式探針卡用針頭其能夠形成細間距,在檢測過程中使多個針頭部的尖部與預先設定的位置對準,從而可以大幅提高探針卡的檢測可靠性。The present invention relates to a needle head for a vertical probe card with improved alignment efficiency, and more particularly, to a needle head for a vertical probe card with improved alignment efficiency, which can form a fine pitch and make multiple needle heads The tip of the probe card is aligned with the preset position, which can greatly improve the detection reliability of the probe card.
一般來說,半導體製造工藝通過以下幾道步驟完成,包括:在晶圓(wafer)上形成圖案(pattern)的製造(fabrication)步驟;對構成晶圓的各個晶片(chip)的電特性進行檢測的電氣晶粒分選(Electrical Die Sorting,EDS)步驟;將形成有圖案的晶圓組裝到各個晶片上的裝配(assembly)步驟。Generally speaking, the semiconductor manufacturing process is completed through the following steps, including: the fabrication step of forming a pattern on the wafer; testing the electrical characteristics of each chip (chip) that constitutes the wafer The electrical grain sorting (Electrical Die Sorting, EDS) step; the assembly (assembly) step of assembling the patterned wafer onto each wafer.
在這裡,EDS步驟是為了辨別構成晶圓的晶片中存在的不良晶片,主要使用一種叫作「探針卡(probe card)」的檢測裝置,其向構成晶圓的晶片載入電信號,通過從載入的電信號中檢查出的信號判斷不良。Here, the EDS step is to identify defective chips in the chips that make up the wafer. It mainly uses a detection device called a "probe card (probe card)", which loads electrical signals to the chips that make up the wafer. Poor judgment of the signal detected from the loaded electrical signal.
這種探針卡構成有與構成晶圓的各個晶片的圖案接觸從而載入電信號的多個針頭(needle)。通常情況下,使探針卡的針頭與晶圓各個設備的電極板接觸,通過所述針頭供應特定的電流,並對這時輸出的電特性進行測定。Such a probe card includes a plurality of needles that contact patterns of individual wafers constituting a wafer to load electrical signals. Normally, the needles of the probe card are brought into contact with the electrode plates of each device on the wafer, a specific current is supplied through the needles, and the electrical characteristics of the output at this time are measured.
另外,最近的半導體設備呈出現這樣一種趨勢,就是將設計規則進一步細化,在實現高度集成化的同時,實現超小型化。因此,為了與變得越來越微小的半導體設備的圖案進行連接,探針卡的針頭也需要按照與之匹配的合適尺寸實現微型化,同時針頭與針頭之間也需要保持更細的間隔,按照細間距(fine pitch)的形式配置。In addition, there has been a trend in recent semiconductor devices to further refine the design rules and achieve ultra-miniaturization while achieving high integration. Therefore, in order to connect with the patterns of semiconductor devices that are becoming smaller and smaller, the needles of the probe card also need to be miniaturized according to the appropriate size that matches them, and the spacing between the needles also needs to be finer. It is configured in the form of fine pitch.
因此,為了確保探測針(probe needle)與探測針之間的間隔能夠更加緊密地配置,開發出了一種接近「1」字形狀的垂直式探針,列舉一個實例,在韓國註冊專利第1859388號(以下簡稱「現有探針卡」)中,公開了採用這種探測針的垂直式探針卡。Therefore, in order to ensure that the distance between the probe needle and the probe needle can be arranged more closely, a vertical probe close to the shape of "1" has been developed. An example is registered in Korean Patent No. 1859388 (hereinafter referred to as "conventional probe card") discloses a vertical type probe card using such probe needles.
圖1(a)及(b)是現有探針卡的截面圖。1( a ) and ( b ) are cross-sectional views of conventional probe cards.
如圖1(a)及(b)所示,現有探針卡100由以下部件構成:第1導板110,在一側設置有第1插孔111;第2導板120,其位於第1導板110的下部,與第1導板110隔開設置,在一側設置有第2插孔121;以及針頭部130,其插入第1插孔111與第2插孔121內。As shown in Figure 1 (a) and (b), the existing probe card 100 is made up of the following parts: the
在這裡,針頭部130可以分為上端部即頭部H、下端部即尖部T、中心區即主體部B,頭部H與尖部T分別插入第1導板110的第1插孔111及第2導板120的第2插孔121內且由第1導板110及第2導板120的內部一側支撐,從而主體部B呈朝一個方向彎曲的形態折彎。Here, the
對於這種現有探針卡100來說,當尖部T與檢測物件接觸時,在向針頭部130上方傳遞的接觸壓力作用下,主體部B會朝著彎折的方向彎曲並朝下方向尖部T提供彈力,從而能夠確保針頭部130穩定地與檢測物件接觸。For this kind of conventional probe card 100, when the tip T comes into contact with the detection object, under the action of the contact pressure transmitted to the upper part of the
在這種情況下,當多個針頭部130與檢測物件接觸時,主體部B就會朝著一定方向壓彎,從而使尖部T按照一定距離進行擦刷(scrub),並由第2導板120的內側支撐進行對準。因此,現有探針卡100多個針頭部130的尖部T分別在不同的位置進行對準,由此就會導致探針卡100的可靠性下降的問題。In this case, when the plurality of
特別是,為了形成細間距,在將主體部B的曲率設置得小的情況下,即為了形成細間距而將針頭部130越是按照接近於垂直的方式配置,則針頭部130的彎曲方向越是不固定,由此就會導致更難將針頭部130的尖部T對準的問題。In particular, in order to form a fine pitch, when the curvature of the main body B is set to be small, that is, the closer the
(發明所欲解決之問題)(Problem to be solved by the invention)
本發明就是為解決了上述問題而研發的,本發明的目的在於,提供一種對準效率提升的垂直式探針卡用針頭,其按照垂直方式配置在導板上以形成細間距,即使不增加製造步驟,也能夠將多個針頭部的尖部對齊至預先設定的位置,從而能夠大幅提高探針卡的檢測可靠性。 (解決問題之技術手段) The present invention was developed to solve the above problems. The purpose of the present invention is to provide a vertical probe card needle with improved alignment efficiency, which is vertically arranged on the guide plate to form a fine pitch, even without increasing the In the manufacturing process, the tips of the plurality of needle parts can also be aligned to preset positions, thereby greatly improving the detection reliability of the probe card. (technical means to solve the problem)
為了實現上述目的,根據本發明的一個層面,提供一種對準效率提升的垂直式探針卡用針頭,針對與檢測對象接觸將從所述檢測物件傳輸的電信號向外部測試設備傳輸的、對準效率提升的垂直式探針卡用針頭來說,其插入至分別設置在探針卡的上部導板與下部導板上的插孔內,上端部與下端部分別由設置有所述插孔的所述上部導板的內側和所述下部導板的內側提供支撐,如果在截面中央形成有水平的虛擬線,則以所述虛擬線為基準截面上部的截面積與截面下部的截面積大小互不相同。In order to achieve the above object, according to one aspect of the present invention, a vertical probe card needle with improved alignment efficiency is provided, for contacting with the detection object and transmitting the electrical signal transmitted from the detection object to the external testing equipment. For the vertical probe card with improved efficiency, the needle is inserted into the sockets respectively provided on the upper guide plate and the lower guide plate of the probe card, and the upper end and the lower end are respectively provided with the sockets. The inner side of the upper guide plate and the inner side of the lower guide plate provide support. If a horizontal imaginary line is formed in the center of the cross section, the cross-sectional area of the upper part of the cross-section and the cross-sectional area of the lower part of the cross-section are based on the virtual line. different from each other.
另外,較佳地,截面形成為梯形。In addition, preferably, the cross section is formed into a trapezoid.
另外,可以形成從截面一側朝外側方向突出的突起。In addition, a protrusion protruding outward from one side of the cross section may be formed.
同時,較佳地,上端部與下端部中任意一個端部朝外側方向彎曲形成。Meanwhile, preferably, any one of the upper end portion and the lower end portion is bent outward.
另外,在中心區沿長度方向至少設置有一個分離穴以構成多個梁,如果所述各個梁在截面中央形成有水平的虛擬線,則以所述虛擬線為基準,截面上部的截面積與截面下部的截面積大小互不相同。 (對照先前技術之功效) In addition, at least one separation hole is provided along the length direction in the central area to form a plurality of beams. If a horizontal imaginary line is formed in the center of the cross-section of each beam, the cross-sectional area of the upper part of the cross-section is equal to The size of the cross-sectional area of the lower part of the cross-section is different from each other. (compared to the effect of previous technology)
如上所述,根據本發明,如果在截面中央形成有水平的虛擬線,則截面上部的截面積與截面下部的截面積形成為大小互不相同,從而使阻力朝一定方向產生,該阻力為在與檢測物件接觸的過程中針對產生的扭力的阻力,從而不需要額外的步驟,也能夠將尖部準確地對準到預先設定的導板的內部一側。As described above, according to the present invention, if a horizontal imaginary line is formed in the center of the cross section, the cross-sectional area of the upper part of the cross-section and the cross-sectional area of the lower part of the cross-section are formed to be different in size, so that resistance is generated in a certain direction. Resistance against torsion forces generated during contact with the test object enables accurate alignment of the tip to the inside side of the pre-set guide plate without the need for additional steps.
下面,將參照附圖對本發明的一個較佳實施例進行詳細說明。Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
圖2是根據本發明一實施例的垂直式探針卡的截面圖,圖3是根據本發明一實施例對準效率提升的垂直式探針卡用針頭的立體圖,圖4顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭立體圖截面的示意圖,圖5(a)至(e)顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭截面另一形態的示意圖。2 is a cross-sectional view of a vertical probe card according to an embodiment of the present invention. FIG. 3 is a perspective view of a needle head for a vertical probe card with improved alignment efficiency according to an embodiment of the present invention. FIG. 4 shows a vertical probe card according to an embodiment of the present invention. Embodiments Schematic diagrams of cross-sections of vertical probe card needles with improved alignment efficiency. FIGS. Schematic diagram of the shape.
首先,來看一下採用根據本發明一實施例的對準效率提升的垂直式探針卡用針頭的探針卡1,如圖2所示,包括:第1導板10、第2導板20、以及針頭30。First of all, let’s take a look at the probe card 1 that adopts the needle head of the vertical probe card with improved alignment efficiency according to an embodiment of the present invention, as shown in FIG. 2 , including: a
第1導板10呈具有一定厚度的板狀,在一側按照預先規定的間隔設置有多個第1插孔11,將要後述的針頭30插入第1插孔11內,針頭30的頭部H由內部一側提供支撐。The
第2導板20與第1導板10一樣呈具有一定厚度的板狀,在一側按照預先規定的間隔設置有多個第2插孔21,其與第1導板10隔開配置在第1導板10的下部。Like the
另外,尖部T插入第2插孔21內,尖部T的外面一側由內側提供支撐。由此,對沿特定方向擦刷的尖部T進行支撐,由此,第2導板20發揮將尖部T對準到預先設定的位置上的作用。In addition, the tip T is inserted into the
為了保持第1導板10與第2導板20之間的間隔,根據本發明一實施例的垂直式探針卡1包含插入第1導板10與第2導板20之間的夾具板J(jig plate)。In order to keep the distance between the
如圖3所示,針頭30大致呈沿垂直方向配置的條狀,可以區分為上端部即頭部H、下端部即尖部T、中心區即主體部B。As shown in FIG. 3 , the
另外,如上所述,針頭30的頭部H插入第1插孔11內,由第1導板10的內面一側提供支撐。尖部T插入第2插孔21內,由第2導板20的內面一側提供支撐。In addition, as described above, the head H of the
所述針頭30的作用在於,其尖部T與準備好的檢測物件進行彈性接觸,通電特定電流的同時,將此時輸出的電信號通過與上部連接的空間轉換器K向外部的測試設備傳輸。The function of the
在這裡,如圖4所示,如果根據本實施例的針頭30在截面中央形成有水平的虛擬線G,則以虛擬線G為基準,截面上部的截面積S與截面下部的截面積R大小互不相同。Here, as shown in FIG. 4, if the
這是為了當多個針頭30與檢測物件接觸時,使各個尖部T對準到第2導板20內部中預先設定的位置上,與此相關的操作將在後述操作說明中進行更加詳細的說明。This is for aligning each tip T to a preset position inside the
另外,在本實施例中,雖然介紹針頭30的截面呈梯形,但是本發明的針頭30截面形狀並非必須限定於此。如圖5(a)至(e)所示,在四邊形中,只要是上部的截面兩側棱角構成彎曲的形狀或者從截面上下部棱角中的任意一個棱角一側開始朝外側方向突出形成帶有突起的形狀等截面上下部大小互不相同的形狀,採用任意一種形狀均可以。In addition, in this embodiment, although it is introduced that the section of the
圖6顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭與檢測對象接觸瞬間的示意圖,圖7是顯示在向根據本發明一實施例對準效率提升的垂直式探針卡用針頭施加扭力的情況下其截面扭曲狀態的示意圖,圖8是顯示根據本發明一實施例尖部由第2導板內側支撐狀態的示意圖。Fig. 6 shows a schematic diagram of the moment when the needle of the vertical probe card with improved alignment efficiency is in contact with the detection object according to an embodiment of the present invention, and Fig. 7 shows the vertical probe with improved alignment efficiency according to an embodiment of the present invention A schematic diagram of the cross-sectional twisted state of the card needle under the condition of applying torsion force. FIG. 8 is a schematic diagram showing the state that the tip is supported by the inner side of the second guide plate according to an embodiment of the present invention.
下面,將參照圖6至圖8對根據具有上述構成的本發明一實施例對準效率提升的垂直式探針卡用針頭的操作進行說明。Next, an operation of aligning efficiency-improved vertical probe card needles according to an embodiment of the present invention having the above-mentioned configuration will be described with reference to FIGS. 6 to 8 .
首先,檢測物件朝上方移動,當尖部T與檢測對象接觸之後,在其接觸壓力的作用下,主體部B朝一個方向彎曲,隨後就會根據針頭30的截面形狀而產生扭力。First, the detection object moves upward, and when the tip T contacts the detection object, under the action of the contact pressure, the main body B bends in one direction, and then a torsion force is generated according to the cross-sectional shape of the
在這種情況下,根據本實施例的針頭30截面上下部的截面積大小互不相同。因此,在截面上下部中會分別針對扭力以不同的力量進行抵抗,從而就會朝阻力較小的一側扭曲。In this case, the cross-sectional areas of the upper and lower parts of the cross-section of the
另外,尖部T按照一定的間隔朝扭曲的方向移動,並由第2導板20的內側提供支撐,當沿著第2導板20的內側移動之後,就由與第2插孔21的頂點附近對應的第2導板20內側提供支撐而進行對齊。In addition, the tip T moves in a twisted direction at a certain interval and is supported by the inner side of the
在這種情況下,根據本實施例的針頭30可以通過對截面上下部大小進行相對調節而控制扭曲方向,隨著對扭曲方向進行控制,就可以決定由第2導板20內側提供支撐的位置,從而就能夠將多個針頭30的尖部T準確地對齊到一定位置上。In this case, the
由此,當多個尖部T對齊到正確的位置上之後,各個尖部T就能夠準確地與各個檢測物件的接觸區域中預先設定的位置接觸,從而能夠提高檢測品質,並由此可以大幅提高檢查的可靠性。Thus, when the plurality of tip Ts are aligned to the correct position, each tip T can accurately contact the preset position in the contact area of each detection object, thereby improving the detection quality, and thereby greatly improving the detection quality. Improve inspection reliability.
圖9是根據本發明另一實施例對準效率提升的垂直式探針卡用針頭的立體圖,圖10(a)及(b)顯示向根據本發明另一實施例的各個梁施加扭力狀態的示意圖。Fig. 9 is a perspective view of a needle head for a vertical probe card with improved alignment efficiency according to another embodiment of the present invention, and Fig. 10 (a) and (b) show the state of applying torsion to each beam according to another embodiment of the present invention schematic diagram.
圖9及圖10(a)及(b)所述實施例的基本構成與圖2至圖8所述實施例相同,但是圖9及圖10(a)及(b)所述實施例的基本構成形成為能夠更加穩定地對針頭30進行對準的結構。The basic structure of the embodiment described in Fig. 9 and Fig. 10 (a) and (b) is the same as the embodiment described in Fig. 2 to Fig. 8, but the basic structure of the embodiment described in Fig. 9 and Fig. 10 (a) and (b) The configuration is such that the
如圖9所示,本實施例與前述實施例不同,其在針頭30的主體部B內側沿長度方向至少形成有一個分離穴31,針頭30內側形成為多個梁32形狀。如圖9所示,當各個梁32在截面中央形成水平的虛擬線時,其上下部截面以分別不同的大小形成。As shown in FIG. 9 , this embodiment is different from the previous embodiments in that at least one
由此,在本實施例中,當針頭30的尖部T與檢測物件接觸時產生的扭力就會向各個梁32傳遞,在各個梁32的截面上下部中針對扭力產生的阻力互不相同。因此,如圖10(a)及(b)所示,就會朝阻力較小的方向扭曲。Therefore, in this embodiment, the torsional force generated when the tip T of the
在這裡,如果多個梁32中任意一個梁32因受到外部因素影響而過度扭曲時,就會從其它梁32中對此進行補償,防止產生錯開,從而能夠使尖部T準確地向第2導板20內側中設定的位置移動並進行對齊。Here, if any
另外,在本實施例中,為了有助於對說明進行理解,將多個梁32的截面全都按照相同的形態進行介紹。但是,根據環境的變化,多個梁32的截面也可以分別形成為互不相同的形態。In addition, in this embodiment, in order to facilitate understanding of the description, all the cross sections of the plurality of
除此之外的結構與前述的基本實施例相同,因此這裡就省略其餘的說明。The structure other than that is the same as that of the aforementioned basic embodiment, so the rest of the description will be omitted here.
雖然與所述提到的較佳實施例相關聯地對本發明進行了說明,但是在不偏離本發明要點與範圍的前提下,可以實施多種修改或者變形。因此,所附的申請專利範圍包含屬於本發明要點的所述修改或者變形。Although the present invention has been described in association with the above-mentioned preferred embodiments, various modifications or variations can be implemented without departing from the gist and scope of the present invention. Accordingly, the appended patent claims include such modifications or variations as fall within the gist of the present invention.
1:探針卡 10:第1導板 11:第1插孔 20:第2導板 21:第2插孔 30:針頭 31:分離穴 32:梁 100:探針卡 110:第1導板 111:第1插孔 120:第2導板 121:第2插孔 130:針頭部 B:主體部 G:虛擬線 H:頭部 J:夾具板 K:空間轉換器 R:截面積 S:截面積 T:尖部 1: Probe card 10: The first guide plate 11: 1st jack 20: The second guide plate 21: 2nd jack 30: Needle 31: Separation hole 32: Beam 100: probe card 110: The first guide plate 111: 1st jack 120: The second guide plate 121: 2nd jack 130: needle head B: Main body G: virtual line H: head J: Fixture plate K: Space Transformer R: cross-sectional area S: cross-sectional area T: tip
圖1(a)及(b)是現有探針卡的截面圖; 圖2是根據本發明一實施例的垂直式探針卡的截面圖; 圖3是根據本發明一實施例對準效率提升的垂直式探針卡用針頭的立體圖; 圖4顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭立體圖截面的示意圖; 圖5(a)至(e)顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭截面另一形態的示意圖; 圖6顯示根據本發明一實施例對準效率提升的垂直式探針卡用針頭與檢測對象接觸瞬間的示意圖; 圖7顯示在向根據本發明一實施例對準效率提升的垂直式探針卡用針頭施加扭力的情況下其截面扭曲狀態的示意圖; 圖8顯示根據本發明一實施例的尖部由第2導板內側支撐狀態的示意圖; 圖9是根據本發明另一實施例對準效率提升的垂直式探針卡用針頭的立體圖; 圖10(a)及(b)顯示向根據本發明另一實施例的多個梁(multi beam)施加扭力狀態的示意圖。 Fig. 1 (a) and (b) are the sectional views of existing probe card; 2 is a cross-sectional view of a vertical probe card according to an embodiment of the present invention; 3 is a perspective view of a needle head for a vertical probe card with improved alignment efficiency according to an embodiment of the present invention; 4 shows a schematic cross-sectional view of a perspective view of a needle head for a vertical probe card with improved alignment efficiency according to an embodiment of the present invention; 5( a ) to ( e ) are schematic diagrams showing another form of cross-section of the vertical probe card needle with improved alignment efficiency according to an embodiment of the present invention; 6 shows a schematic diagram of the moment when the needle of the vertical probe card with improved alignment efficiency is in contact with the detection object according to an embodiment of the present invention; 7 is a schematic diagram showing a cross-sectional twisted state of a vertical probe card needle with improved alignment efficiency according to an embodiment of the present invention when torque is applied; Fig. 8 shows a schematic diagram of a state where the tip is supported by the inner side of the second guide plate according to an embodiment of the present invention; 9 is a perspective view of a needle head for a vertical probe card with improved alignment efficiency according to another embodiment of the present invention; 10( a ) and ( b ) are schematic diagrams showing a state of applying torsion to a plurality of beams (multi beam) according to another embodiment of the present invention.
30:針頭 30: Needle
G:虛擬線 G: virtual line
R:截面積 R: cross-sectional area
S:截面積 S: cross-sectional area
Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210049945A KR102260983B1 (en) | 2021-04-16 | 2021-04-16 | Needle for vertical probe card with improved alignment efficiency |
| KR10-2021-0049945 | 2021-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202242423A TW202242423A (en) | 2022-11-01 |
| TWI806091B true TWI806091B (en) | 2023-06-21 |
Family
ID=76391460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110125424A TWI806091B (en) | 2021-04-16 | 2021-07-12 | Needle for vertical probe card with improved alignment efficiency |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102260983B1 (en) |
| TW (1) | TWI806091B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102534749B1 (en) * | 2022-10-17 | 2023-05-30 | 주식회사 윌인스트루먼트 | Probe Head for a Probe Card, Its Manufacturing Method and Its Manufacturing Device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087906A1 (en) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | Electrical contact |
| CN107430150A (en) * | 2015-03-13 | 2017-12-01 | 泰克诺探头公司 | Test head with vertical probe especially for high-frequency applications |
| CN107430151A (en) * | 2015-03-31 | 2017-12-01 | 泰克诺探头公司 | Especially suitable for frequency applications vertical contact probe and include its measuring head |
| KR101859388B1 (en) * | 2016-09-19 | 2018-06-28 | 피엠피(주) | Vertical Probe Card |
| TWI709752B (en) * | 2019-10-14 | 2020-11-11 | 中華精測科技股份有限公司 | Staggered-mode probe card |
| TWM603961U (en) * | 2020-05-26 | 2020-11-11 | 旺矽科技股份有限公司 | Linear probe with asymmetrical needle tail |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750321A (en) * | 1993-08-04 | 1995-02-21 | Yokowo Co Ltd | Probe card |
| TW201537181A (en) * | 2014-03-25 | 2015-10-01 | Mpi Corp | Vertical probe device and supporter used in the same |
| KR101662937B1 (en) * | 2015-01-25 | 2016-10-14 | 김일 | Test Contact Device with Space Transform Function |
| JP6654061B2 (en) * | 2016-02-23 | 2020-02-26 | 日本電子材料株式会社 | Probe guide, probe card and method of manufacturing probe guide |
| KR101869044B1 (en) * | 2016-11-10 | 2018-07-19 | 윌테크놀러지(주) | Needle unit for vertical probe card with reduced scrub phenomenon and vertical probe using thereof |
| KR101913355B1 (en) * | 2017-09-19 | 2018-12-28 | 윌테크놀러지(주) | Needle unit for vertical probe card with |
| KR102164373B1 (en) * | 2019-04-05 | 2020-10-12 | 윌테크놀러지(주) | Needle for vertical probe card with scrub control and bending direction control and vertical probe card using thereof |
| KR102145719B1 (en) * | 2019-04-12 | 2020-08-19 | 윌테크놀러지(주) | Needle unit for vertical probe card having control function for bending direction |
| KR102164341B1 (en) * | 2019-07-01 | 2020-10-12 | 윌테크놀러지(주) | Vertical probe card with detachable support bump unit |
| KR102164358B1 (en) * | 2019-07-01 | 2020-10-12 | 윌테크놀러지(주) | Probe card having adjustable length of needle unit tip |
-
2021
- 2021-04-16 KR KR1020210049945A patent/KR102260983B1/en active Active
- 2021-07-12 TW TW110125424A patent/TWI806091B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087906A1 (en) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | Electrical contact |
| CN107430150A (en) * | 2015-03-13 | 2017-12-01 | 泰克诺探头公司 | Test head with vertical probe especially for high-frequency applications |
| CN107430151A (en) * | 2015-03-31 | 2017-12-01 | 泰克诺探头公司 | Especially suitable for frequency applications vertical contact probe and include its measuring head |
| KR101859388B1 (en) * | 2016-09-19 | 2018-06-28 | 피엠피(주) | Vertical Probe Card |
| TWI709752B (en) * | 2019-10-14 | 2020-11-11 | 中華精測科技股份有限公司 | Staggered-mode probe card |
| TWM603961U (en) * | 2020-05-26 | 2020-11-11 | 旺矽科技股份有限公司 | Linear probe with asymmetrical needle tail |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102260983B1 (en) | 2021-06-04 |
| TW202242423A (en) | 2022-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI820478B (en) | Multi needle of vertical probe card with scrub control | |
| KR102164373B1 (en) | Needle for vertical probe card with scrub control and bending direction control and vertical probe card using thereof | |
| US7671610B2 (en) | Vertical guided probe array providing sideways scrub motion | |
| US8723546B2 (en) | Vertical guided layered probe | |
| EP3268751B1 (en) | Testing head with vertical probes, particularly for high frequency applications | |
| KR101869044B1 (en) | Needle unit for vertical probe card with reduced scrub phenomenon and vertical probe using thereof | |
| US7014499B2 (en) | Probe card for testing semiconductor device | |
| US7619430B2 (en) | Electrical testing probe assembly having nonparallel facing surfaces and slots formed thereon for receiving probes | |
| US7301354B2 (en) | Contact probe for a testing head having vertical probes for semiconductor integrated devices | |
| TWM529167U (en) | Probe device of vertical probe card | |
| US20070089551A1 (en) | Cantilever probe structure for a probe card assembly | |
| US20080186037A1 (en) | Probe card and structure for fixing needle thereof | |
| KR102145719B1 (en) | Needle unit for vertical probe card having control function for bending direction | |
| KR102283282B1 (en) | Vertical probe card with improved alignment efficiency | |
| TWI806091B (en) | Needle for vertical probe card with improved alignment efficiency | |
| KR102121754B1 (en) | Device for test socket pin having single coil spring divided into upper and lower regions | |
| US20080265920A1 (en) | Probe card | |
| KR102538834B1 (en) | Probe pin | |
| TWI592665B (en) | Probe device of vertical probe card | |
| KR102597311B1 (en) | Probe card with fine pitch implemention | |
| US20080186042A1 (en) | Probe card | |
| KR102888162B1 (en) | Probe card with scrub control | |
| KR20090073747A (en) | Probe Units and Probe Cards | |
| TWI902233B (en) | Semiconductor package test devices with ultra-short length buckling mems probes | |
| US20240402218A1 (en) | Probe system for testing device under test integrated in semiconductor wafer, and probe card, probe head and guide plate structure thereof |