TWI592665B - Probe device of vertical probe card - Google Patents

Description

Vertical probe card probe device

This invention relates to a probe device, and more particularly to a probe device for a vertical probe card.

In recent years, as electronic products have advanced toward precision and multi-functionality, the wafer structure of integrated circuits applied in electronic products has also become complicated. In the manufacture of wafers, batch mass production is usually used. Therefore, in order to ensure the electrical quality of the wafer, wafer level measurement is performed before the wafer is packaged. In the current wafer processing, a probe card is generally used to test the wafer. And according to the type of the probe, it can be divided into a cantilever probe card and a vertical probe card. In use, the test signal is transmitted to the chip or received by electrically connecting the probe of the probe card to the contact pad of the wafer and then connecting the electrical signal to the tester via the circuit board of the probe card. The output signal from the wafer is used to measure the electrical characteristics of the wafer, and the user can further reject the defective wafer according to the measurement result for subsequent packaging processing.

Referring to Figure 1, a schematic diagram of a conventional vertical probe card 100 is shown. The vertical probe card 100 includes a circuit board 110 and a probe device. The probe device comprises a guide plate assembly 120 and a plurality of probes 130, wherein one end of each probe 130 contacts a pad 51' on one of the circuit boards 110 (for example, a metal pad, a metal bump, a solder ball... Etc) electrical connection and The other end of the probe 130 is electrically connected to the corresponding contact pad 51 of a device under test 50 through the guide plate assembly 120. More specifically, the guide assembly 120 includes an upper die 121 and a lower die 123, wherein the upper guide 121 is formed with a plurality of vertically extending upper openings 122, and The lower guide plate 123 is formed with a plurality of vertically extending lower openings 124. The upper openings 122 are disposed corresponding to the lower openings 124 such that each of the probes 130 can vertically pass through one of the corresponding upper openings 122 and one of the lower openings 124. In addition, the guide assembly 120 further includes a plurality of spacer members 129. The upper guide plate 121 and the lower guide plate 123 are fixed by the spacer members 129, and the upper guide plate 123 and the lower guide plate 123 are kept at a distance. A longitudinal distance further forms a needle space within the guide assembly 120. Therefore, when the vertical probe card 100 electrically contacts the contact pad 51 toward the test component 50, the probes 130 absorb the reverse stress during the test by their own elastic deformation. That is to say, the needle space of the guide plate assembly 120 serves as an elastic deformation space of the probes 130.

However, when the probes 130 are elastically deformed in the space of the guide plate assembly 120, the adjacent two probes are likely to be short-circuited by the electrical contact. Therefore, in the conventional vertical probe card 100, the probes 130 must be subjected to an insulating coating process or the probes 130 are processed to have a special configuration, thereby improving the difficulty of the process and increasing the production. cost.

In view of the above, it is desirable to provide an improved vertical probe card to solve the problems of the prior art.

In order to solve the above technical problems, an object of the present invention is to provide a probe device for a vertical probe card, which is designed to have two or more guide plates, and Appropriate openings are provided in the guide plates of the layer, so that when the probes are elastically deformed by pressing, the probes are guided to form at least one elastic bending direction, thereby preventing the adjacent two probes from being electrically connected to each other. Sexual contact, and omission in the prior art, special pretreatment must be performed on the probe (for example, performing an insulating coating process or forming a special configuration via secondary processing), thereby effectively simplifying the process to reduce the production cost.

In order to achieve the above object, the present invention provides a probe device for a vertical probe card, comprising: a guide plate assembly comprising: an upper guide plate having at least one vertically extending upper opening; and a lower guide plate having at least one a vertically penetrating lower opening, wherein the at least one lower opening is disposed corresponding to the at least one upper opening; and at least one intermediate guiding plate disposed between the upper guiding plate and the lower guiding plate, having at least one vertical through An intermediate opening, wherein the at least one intermediate opening is respectively disposed corresponding to the at least one upper opening and the at least one lower opening; and at least one probe is inserted in the guiding plate and passes through the at least one upper opening The at least one intermediate opening and the at least one lower opening electrically contact one of the components to be tested to contact the pad.

In a preferred embodiment of the present invention, the aperture of the at least one intermediate opening is larger than the aperture of the at least one upper opening and the at least one lower opening.

In a preferred embodiment of the invention, only one of the at least one upper opening, the at least one lower opening, and the at least one intermediate opening are allowed to be disposed in a single probe.

In a preferred embodiment of the present invention, the guide plate assembly further includes a plurality of spacer elements disposed between the upper guide plate and the at least one intermediate guide plate and the at least one intermediate guide plate and the lower guide plate Between the upper guide plate and the at least one intermediate guide plate and the at least one intermediate guide plate and the lower guide plate, and respectively respectively, the upper guide plate, the at least one intermediate guide plate and the lower guide plate The longitudinal distance between the two is maintained to form a needle space inside the guide plate assembly.

In a preferred embodiment of the invention, the outline of the cross section of the at least one probe comprises a circle or a polygon.

In one preferred embodiment of the invention, the polygon comprises a triangle, a quadrangle or a hexagon.

In a preferred embodiment of the present invention, the centerline position of the at least one intermediate opening is a lateral distance from the centerline position of the at least one upper opening and the at least one lower opening.

In a preferred embodiment of the present invention, the centerline position of the at least one intermediate opening is offset from the sideline of the at least one upper opening and the at least one lower opening by a lateral distance, such that When at least one probe electrically contacts the contact pad, the at least one probe is pressed to form at least one curved region inside the combination of the guide plates.

In a preferred embodiment of the present invention, the guide assembly includes a first intermediate guide and a second intermediate guide, the first intermediate guide being located at the upper guide and the second intermediate guide And the second intermediate guide is located between the first intermediate guide and the lower guide, and the first intermediate guide has at least one vertically intersecting first intermediate opening, and the second intermediate The guide plate has at least one second intermediate opening vertically penetrating; wherein the at least one probe penetrates through the at least one upper opening, the at least one first intermediate opening, the at least one second intermediate opening, and the at least A hole is opened to electrically contact the contact pad of the device under test.

In a preferred embodiment of the present invention, the centerline position of the at least one first intermediate opening is at a lateral distance from the centerline position of the at least one second intermediate opening.

In a preferred embodiment of the present invention, the at least one first intermediate opening The centerline position is offset from the centerline position of the at least one upper aperture and the at least one lower aperture by a lateral distance, and the centerline position of the at least one second intermediate aperture is opposite to the at least one upper aperture And a position of the center line of the at least one opening is offset from the other side by a lateral distance, such that when the at least one probe electrically contacts the contact pad, the at least one probe is pressed and combined in the guide A plurality of curved regions are formed inside.

In a preferred embodiment of the present invention, the centerline position of the at least one first intermediate opening and the centerline position of the at least one second intermediate opening are opposite to the at least one upper opening and the at least one opening. The centerline position of the aperture is offset from the side by a lateral distance such that when the at least one probe is in electrical contact with the contact pad, the at least one probe is pressed to form at least one curved region within the combination of the guide.

100, 200, 300, 400‧‧‧ vertical probe cards

110, 210, 310, 410‧‧‧ boards

120, 220, 320, 420‧‧ ‧ guide plate combination

121, 221, 321, 421‧‧‧ upper guide

Open holes in 122, 222, 322, 422‧‧

123, 223, 323, 423‧‧‧ lower guide

Opening holes under 124, 224, 324, 424‧‧

225‧‧‧Intermediate guide

226‧‧‧Intermediate opening

129, 229, 329, 429‧‧‧ spacer elements

130, 230, 330, 430‧‧ probes

325, 425‧‧‧ first intermediate guide

326, 426‧‧‧ first intermediate opening

327, 427‧‧‧ second intermediate guide

328, 428‧‧‧ second intermediate opening

50‧‧‧Device under test

51, 51'‧‧‧ contact pads

R1‧‧‧ aperture of the upper opening

R2‧‧‧ aperture of the opening

R3‧‧‧ aperture in the middle opening

Cut line of A-A’‧‧‧Fig. 2

D1, d2, d3, d4, d5, d6, d7, d8‧‧‧ longitudinal distance

S‧‧‧Bending area

C1, C3‧‧‧ centerline of upper and lower openings

C2, C6‧‧‧ center line of the middle opening

C4, C7‧‧‧ center line of the first intermediate opening

C5, C8‧‧‧ centerline of the second intermediate opening

L1, L2, L3, L4, L5‧‧‧ lateral distance

X‧‧‧ direction

1 is a schematic view showing a conventional vertical probe card; FIG. 2 is a schematic view showing the structure of a vertical probe card according to a first preferred embodiment of the present invention; and FIG. 3 is a vertical view of FIG. Schematic diagram of the probe when the probe is placed; FIG. 4A to FIG. 4D respectively show a schematic cross-sectional view of the probe of FIG. 2 along the line A-A'; FIG. 5 shows a schematic diagram according to the present invention. A schematic structural view of a vertical probe card of a second preferred embodiment; and FIG. 6 is a schematic view showing the structure of a vertical probe card according to a third preferred embodiment of the present invention.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Please refer to FIG. 2, which shows a schematic structural view of a vertical probe card 200 according to a first preferred embodiment of the present invention. The vertical probe card 200 includes a circuit board 210 and a probe device. The probe device comprises a guide plate assembly 220 and a plurality of probes 230, wherein one end of each probe 230 contacts a pad 51' on one of the circuit boards 210 (for example, a metal pad, a metal bump, a solder ball... The other end of the probe 230 passes through the guide plate assembly 220 to electrically contact the corresponding contact pads 51 of a device under test 50 other than the vertical probe card 200. In use, the probes 230 of the vertical probe card 200 are electrically contacted with corresponding contact pads 51 of the device under test 50 (eg, a wafer) (eg, metal pads, metal bumps, solder balls). And the probes 230 are electrically connected to the contact pads 51 vertically, and then the electrical signals are connected to the tester via the circuit board 210 of the vertical probe card 200, so that the test machine transmits Test the signal to the device under test 50 or receive the output signal from the device under test 50, thereby measuring the electrical characteristics of the device under test 50, and the user can further test the defective device according to the result of the measurement. Eliminated for subsequent processing.

As shown in FIG. 2, the guide plate assembly 220 includes an upper die 221, a middle die 225 and a lower die 223, wherein the upper guide 221 is formed with A plurality of vertically extending upper openings 222 are formed. The intermediate guide 225 is formed with a plurality of vertically extending intermediate openings 226, and the lower guide plate 223 is formed with a plurality of vertically extending lower openings 224. The upper opening 222, the intermediate opening 226, and the lower opening 224 are all corresponding So that each of the probes 230 passes through the corresponding one of the upper openings 222, one of the intermediate openings 226 and one of the lower openings 224, thereby electrically contacting a device under test 50. Corresponding contact pads 51. As shown in FIG. 2, the position of the center line C1 of the upper opening 222 and the lower opening 224 is offset from the center line position C2 of the intermediate opening 226 by a lateral distance L1, and the intermediate opening is The side wall of the 226 abuts the probe 230 such that the probe 230 is pushed by the side wall of the intermediate opening 226 to form at least one curved region S inside the guide plate assembly 220. It should be noted that only a single probe is allowed to be disposed within each of the upper apertures 222, each of the lower apertures 224, and each of the intermediate apertures 226. That is to say, more than one probe does not exist simultaneously in each opening, thereby avoiding electrical contact between the probes.

As shown in FIG. 2, the guide assembly 220 further includes a plurality of spacer elements 229. The upper guide plate 221 and the intermediate guide plate 225 are fixed by the spacer members 229, and the intermediate guide plate 225 and the lower guide plate 223 are fixed, and the upper guide plate 221 and the intermediate guide plate 225 are kept at a distance from each other. The longitudinal distance d1 and the intermediate guide 225 are also maintained at a longitudinal distance d2 from the lower guide 223, thereby forming a needle space inside the guide assembly 220.

Please refer to FIG. 3, which shows a schematic structural view of the vertical probe card 200 of FIG. 2 when the probe 230 is disposed. When the probe 230 is disposed, the intermediate guide 225 is moved in the X direction such that the same side of the upper opening 222, the intermediate opening 226, and the lower opening 224 are aligned with each other. Thus, each of the probes 230 can smoothly pass vertically through one of the corresponding upper apertures 222, one of the intermediate apertures 226, and one of the lower apertures 224. Similarly, when the probes 230 are arranged, the intermediate guide 225 is moved in the opposite direction (ie, the direction opposite to the X direction) so that the probe 230 is pushed by the side wall of the intermediate opening 226. The bending region S is formed in the interior of the guide plate assembly 220 by extrusion.

During the equivalent measurement, the probes 230 of the vertical probe card 200 are first electrically contacted to the contact pads 51, and then the vertical probe card 200 is electrically electrically contacted to the contact pads perpendicularly to the test component 50. 51. After being pressed, the probes 230 absorb the reverse stress under pressure by their own elastic deformation. That is to say, the needle space of the guide plate assembly 220 serves as an elastic deformation space of the probes 230. As shown in FIG. 2 and FIG. 3 , the aperture R3 of the intermediate opening 226 of the intermediate guiding plate 225 is larger than the aperture R1 of the upper opening 222 of the upper guiding plate 221 and larger than the lower guiding plate 223 . The aperture R2 of the lower opening 224. Therefore, after the probes 230 are pressed, the upper and lower ends of the probes 230 are respectively restricted by the upper apertures 222 and the lower apertures 224 having smaller apertures without a large deformation offset. And the central curved region S of the probes 230 further produces a greater curvature along the direction of the opening of the intermediate openings 226, thereby causing the probes 230 to be internally contracted toward the guide plate assembly 220. Both are regularly curved in a desired direction, thereby preventing the two adjacent probes 230 from electrically contacting each other to cause the vertical probe card 200 to be short-circuited. It should be noted that in the curved region S of the probes 230, the probes 230 may exhibit an arcuate curvature or an angular bend with a bend or bend angle between 0 and 180 degrees. .

Referring to Figs. 4A to 4D, there are shown schematic cross-sectional views of the probe 230 of Fig. 2 along the line A-A'. Since the intermediate guide 225 is further disposed in the guide assembly 220 of the vertical probe card 200 of the present invention, all of the probes 230 inserted in the guide assembly 220 can be effectively separated. Therefore, in the vertical probe card 200 of the present invention, the probes 230 do not need to be subjected to the step of insulating coating, and do not need to be formed into a special configuration by secondary processing, so that the production steps can be effectively simplified and reduce manufacturing cost. That is, as shown in FIGS. 4A to 4D, in the present invention, the probes 230 can be formed into the most basic geometric configuration by the method with the least difficulty in processing. For example, the outline of the cross section of the probes 230 can be a circle. Shape (as shown in Figure 4A) or various A polygon (such as a triangle shown in Fig. 4B, a quadrangle as shown in Fig. 4B, and a hexagon as shown in Fig. 4B). Similarly, in other preferred embodiments of the present invention, the probe of the vertical probe card can also adopt the lowest processing method as described above to form the most basic geometric configuration, thereby reducing the production cost.

Referring to Figure 5, there is shown a schematic diagram of the operation of a vertical probe card 300 in accordance with a second preferred embodiment of the present invention. The vertical probe card 300 includes a circuit board 310 and a probe device. The probe device comprises a guide plate assembly 320 and a plurality of probes 330, wherein one end of each probe 330 contacts a pad 51' on one of the circuit boards 310 (for example, a metal pad, a metal bump, a solder ball... The other end of the probe 330 is electrically connected, and the other end of the probe 330 is electrically connected to the corresponding contact pad 51 of a device to be tested 50 other than the vertical probe card 300. . In use, the probes 330 of the vertical probe card 300 are electrically contacted with corresponding contact pads 51 of the device under test 50 (eg, a wafer) (eg, metal pads, metal bumps, solder balls). And the probes 330 are electrically connected to the contact pads 51 vertically, and then the electrical signals are connected to the testing machine via the circuit board 310 of the vertical probe card 300, so that the testing machine transmits the test signals to The device under test 50 receives the output signal from the device under test 50, thereby measuring the electrical characteristics of the device under test 50, and the user can further remove the bad device to be tested according to the measurement result. Perform subsequent processing.

As shown in FIG. 5, the guide plate assembly 320 includes an upper guide plate 321, a first intermediate guide plate 325, a second intermediate guide plate 327, and a lower guide plate 323. The upper guide plate 321 is formed with a plurality of upper guide plates 321 a vertically extending upper opening 322, the first intermediate guiding plate 325 is formed with a plurality of vertically intersecting first intermediate openings 326, and the second intermediate guiding plate 327 is formed with a plurality of vertically intersecting second intermediate openings 328. And the lower guide plate 323 is formed with a plurality of vertically extending lower openings 324. On the above The opening 322, the first intermediate opening 326, the second intermediate opening 328, and the lower opening 324 are all correspondingly disposed such that each of the probes 330 can pass through one of the corresponding ones. The upper opening 322, one of the first intermediate opening 326, one of the second intermediate opening 328 and one of the lower opening 324, thereby electrically contacting a corresponding contact of the device under test 50 Pad 51. It should be noted that only one single probe 330 is allowed to be disposed in each of the upper opening 322, each of the lower opening 324, each of the first intermediate opening 326, and each of the second intermediate opening 328. . That is to say, more than one probe 330 does not exist simultaneously in each opening, thereby avoiding electrical contact between the probes 330.

As shown in FIG. 5, the position of the center line C4 of each of the first intermediate openings 326 is offset from the center line C3 of the upper opening 322 and the lower opening 324 by a lateral distance L2. And the center line C5 of each of the second intermediate openings 328 is opposite to the position of the center line C3 of the upper opening 322 and the lower opening 324, and is offset to the left side by a lateral distance L3, and each of the first The position of the center line C4 of the intermediate opening 326 and the position of the center line C5 of each of the second intermediate openings 328 are also separated by a lateral distance (ie, the distance L2 and the distance L3), so that the probe 330 The pushing of the side walls of the first intermediate opening 326 and the second intermediate opening 328 further forms a plurality of curved regions S inside the guide plate assembly 320. For example, a plurality of curved regions S resembling a "Z" shape are presented. That is to say, by setting the corresponding openings between the corresponding openings, the probe 330 can avoid the electrical contact between the two adjacent probes 330 while having a large telescopic stroke. It should be noted that in the curved region S of the probes 330, the probes 330 may exhibit an arcuate curvature or an angular bend with a bend or bend angle between 0 and 180 degrees. .

As shown in FIG. 5, the guide assembly 320 also includes a plurality of spacer elements 329. The upper guide plate 321 and the first intermediate guide 325 are fixed by the spacer elements 329, the first intermediate guide 325 and the second intermediate guide 327 are fixed, and the second intermediate guide 327 is fixed and the lower a guiding plate 323, and maintaining the upper guiding plate 321 and the first intermediate guiding plate 325 at a longitudinal distance d3, and maintaining the first intermediate guiding plate 325 and the second intermediate guiding plate 327 at a longitudinal distance d4 And maintaining the second intermediate guide 327 and the lower guide 323 at a longitudinal distance d5, thereby forming a needle space inside the guide assembly 320.

During the equivalent measurement, the probes 330 of the vertical probe card 300 are first electrically contacted to the contact pads 51, and then the vertical probe card 300 is vertically electrically contacted with the contact pads toward the test component 50. 51. After being pressed, the probes 330 absorb the reverse stress under pressure by their own elastic deformation. That is, the needle space of the guide assembly 320 serves as an elastic deformation space for the probes 330. It should be noted that the first intermediate opening 326 and the second intermediate opening 327 of the first intermediate guiding plate 325 and the second intermediate guiding plate 327 have larger apertures than the upper guiding plate 321 . The aperture of the upper opening 322 and the aperture of the lower opening 324 of the lower guiding plate 323, so when the probes 330 electrically contact the contact pad 51 and the probes 330 are pressed, the probes The upper and lower ends of the needle 330 are respectively restricted by the upper opening 322 and the lower opening 324 having a smaller aperture without causing a large deformation offset, and the curved region S of the probe 330 is along The first intermediate opening 326 and the second intermediate opening 328 are bent in the direction in which the openings extend, so that the probes 330 which are internally contracted toward the guide assembly 320 are regularly curved in a desired direction. In addition, the two adjacent probes 330 are prevented from electrically contacting each other to cause the vertical probe card 300 to be short-circuited.

Referring to Figure 6, there is shown a schematic diagram of the operation of a vertical probe card 400 in accordance with a third preferred embodiment of the present invention. The vertical probe card 400 includes a circuit Plate 410 and a probe device. The probe device comprises a guide plate assembly 420 and a plurality of probes 430, wherein one end of each probe 430 contacts a pad 51' on one of the circuit boards 410 (for example, a metal pad, a metal bump, a solder ball... The other end of the probe 430 is electrically connected, and the other end of the probe 430 is electrically connected to the corresponding contact pad 51 of a device under test 50 other than the vertical probe card 400. . In use, the probes 430 of the vertical probe card 400 are electrically contacted with corresponding contact pads 51 of the device under test 50 (eg, a wafer) (eg, metal pads, metal bumps, solder balls). And the probes 430 are electrically connected to the contact pads 51 vertically, and then the electrical signals are connected to the testing machine via the circuit board 410 of the vertical probe card 400, so that the testing machine transmits the test signals to The device under test 50 receives the output signal from the device under test 50, thereby measuring the electrical characteristics of the device under test 50, and the user can further remove the bad device to be tested according to the measurement result. Perform subsequent processing.

As shown in FIG. 6, the guide plate assembly 420 includes an upper guide plate 421, a first intermediate guide plate 425, a second intermediate guide plate 427, and a lower guide plate 423. The upper guide plate 421 is formed with a plurality of upper guide plates 421. a vertically extending upper opening 422, the first intermediate guiding plate 425 is formed with a plurality of vertically intersecting first intermediate openings 426, and the second intermediate guiding plate 427 is formed with a plurality of vertically intersecting second intermediate openings 428. And the lower guide plate 423 is formed with a plurality of vertically extending lower openings 424. The upper opening 422, the first intermediate opening 426, the second intermediate opening 428, and the lower opening 424 are correspondingly disposed such that each of the probes 430 can pass through the corresponding one. One of the upper openings 422, one of the first intermediate openings 426, one of the second intermediate openings 428 and one of the lower openings 424, thereby electrically contacting a phase of the device under test 50 Corresponding contact pads 51. It should be noted that only one single probe 430 is allowed to be disposed in each of the upper opening 422, each of the lower opening 424, each of the first intermediate opening 426, and each of the second intermediate opening 428. . That is, at every More than one probe 430 does not exist simultaneously in an opening, thereby avoiding electrical contact between the probes 430.

As shown in FIG. 6, the center line C7 of each of the first intermediate openings 426 is offset from the corresponding center line C42 and the center line C6 of the lower opening 424 by a short distance to the right side. L4, and the center line C8 of each of the second intermediate openings 428 are oppositely positioned. The positions of the center line C6 of the upper opening 422 and the lower opening 424 are offset to the right side by a longer distance L5, and each A lateral distance between the center line C7 of the first intermediate opening 426 and the center line C8 of each of the second intermediate openings 428 is also a lateral distance (ie, the difference between the distance L5 and the distance L4). The value of the probe 430 is caused by the pushing of the first intermediate opening 426 and the side wall of the second intermediate opening 428 to form a curved region S inside the guide plate assembly 420. For example, a curved region S resembling a "ㄑ" shape is presented. That is to say, by setting the corresponding openings between the corresponding openings, the probe 430 can avoid the electrical contact between the two adjacent probes 430 while having a large telescopic stroke. It should be noted that in the curved region S of the probes 430, the probes 430 may exhibit an arcuate curvature or an angular bend with a bend or bend angle between 0 and 180 degrees. .

As shown in FIG. 6, the guide assembly 420 also includes a plurality of spacer elements 429. Fixing the upper guiding plate 421 and the first intermediate guiding plate 425, fixing the first intermediate guiding plate 425 and the second intermediate guiding plate 427, and fixing the second intermediate guiding plate 427 and the lower portion by the spacer members 429 a guiding plate 423, and maintaining the upper guiding plate 421 and the first intermediate guiding plate 425 at a longitudinal distance d6, and maintaining the first intermediate guiding plate 425 and the second intermediate guiding plate 427 at a longitudinal distance d7 And maintaining the second intermediate guiding plate 427 and the lower guiding plate 423 at a longitudinal distance d8, thereby forming a needle space inside the guiding plate assembly 420.

During the equivalent measurement, the probes 430 of the vertical probe card 400 are first electrically contacted to the contact pads 51, and then the vertical probe card 400 is electrically contacted perpendicularly to the test elements 50. 51. After the probes 430 are pressed, they will absorb the reverse stress under pressure by their own elastic deformation. That is to say, the needle space of the guide plate assembly 420 serves as an elastic deformation space of the probes 430. It should be noted that the first intermediate opening 426 and the second intermediate opening 428 of the first intermediate guiding plate 425 and the second intermediate guiding plate 427 have larger apertures than the upper guiding plate 421. The aperture of the upper opening 422 and the aperture of the lower opening 424 of the lower guiding plate 423, so when the probes 430 electrically contact the contact pads 51 and the probes 430 are pressed, the probes The upper and lower ends of the needle 430 are respectively restricted by the upper opening 422 having a smaller aperture and the lower opening 424 without a large deformation offset, and the curved region S of the probe 430 is along The first intermediate opening 426 and the second intermediate opening 428 are bent in the direction in which the opening extends, so that the probes 430 which are internally contracted toward the guide assembly 420 are regularly curved in a desired direction. In addition, the two adjacent probes 430 are prevented from electrically contacting each other to cause the vertical probe card 400 to be short-circuited.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

200‧‧‧Vertical probe card

210‧‧‧ boards

220‧‧‧ Guide plate combination

221‧‧‧Upper guide

Opening 222‧‧‧

223‧‧‧ lower guide

224‧‧‧ opening

225‧‧‧Intermediate guide

226‧‧‧Intermediate opening

229‧‧‧ spacer elements

230‧‧‧ probe

50‧‧‧Device under test

51, 51'‧‧‧ contact pads

L1‧‧‧ lateral distance

Cut line of A-A’‧‧‧Fig. 2

D1, d2‧‧‧ longitudinal distance

C1‧‧‧ centerline of upper and lower openings

C2‧‧‧ centerline of the middle opening

S‧‧‧Bending area

Claims (10)

A probe device for a vertical probe card, comprising: a guide plate assembly comprising: an upper guide plate having at least one vertically extending upper opening; and a lower guide plate having at least one vertically extending lower opening, and The at least one lower opening is disposed corresponding to the at least one upper opening; and the at least one intermediate guiding plate is located between the upper guiding plate and the lower guiding plate, and has at least one vertically penetrating intermediate opening; and at least one probe a needle is inserted into the guide plate assembly, and through the at least one upper opening, the at least one intermediate opening, and the at least one lower opening, thereby electrically contacting one of the contact elements to be tested, wherein the at least one The centerline position of the intermediate opening is at a lateral distance from the centerline position of the at least one upper opening and the at least one lower opening, wherein the at least one intermediate opening has a larger aperture than the at least one upper opening and the at least one opening The pore size of the hole. The probe device of the vertical probe card of claim 1, wherein a center line position of the at least one intermediate opening is opposite to a center line position of the at least one upper opening and the at least one lower opening Offseting the lateral distance, and the sidewall of the at least one intermediate opening abuts the at least one probe such that the at least one probe is pushed by the sidewall of the at least one intermediate opening and then combined in the guide plate The interior forms at least one curved region. The probe device of the vertical probe card of claim 1, wherein the at least one upper opening, the at least one lower opening, and the at least one intermediate opening are only allowed to be arranged in a single probe. The probe device of the vertical probe card according to claim 1, wherein the guide plate group The assembly further includes a plurality of spacer elements disposed between the upper guide plate and the at least one intermediate guide plate and between the at least one intermediate guide plate and the lower guide plate for fixing the upper guide plate and the at least one intermediate portion The guide plate and the at least one intermediate guide plate and the lower guide plate respectively maintain a longitudinal distance between the upper guide plate, the at least one intermediate guide plate and the lower guide plate, respectively, and further combine the guide plates The interior of the body forms a cloth needle space. The probe device of the vertical probe card of claim 1, wherein the outer section of the cross section of the at least one probe comprises a circle or a polygon. The probe device of the vertical probe card of claim 5, wherein the polygon comprises a triangle, a quadrangle or a hexagon. The probe device of the vertical probe card of claim 1, wherein the guide assembly comprises a first intermediate guide and a second intermediate guide, wherein the first intermediate guide is located thereon Between the guide plate and the second intermediate guide, and the second intermediate guide is located between the first intermediate guide and the lower guide, and the first intermediate guide has at least one vertical through The intermediate opening, and the second intermediate guide has at least one second intermediate opening vertically penetrating; wherein the at least one probe extends through the at least one upper opening, the at least one first intermediate opening, the at least one a second intermediate opening, and the at least one lower opening electrically contacting the contact pad of the device under test. The probe device of the vertical probe card of claim 7, wherein a center line position of the at least one first intermediate opening and a center line position of the at least one second intermediate opening are between A lateral distance apart. The probe device of the vertical probe card of claim 7, wherein a center line position of the at least one first intermediate opening is opposite to a center line position of the at least one upper opening and the at least one lower opening Offward a lateral distance, and a centerline of the at least one second intermediate opening The position of the centerline relative to the at least one upper opening and the at least one lower opening is offset from the other side by a lateral distance, and the sidewalls of the at least one first intermediate opening and the at least one second intermediate opening Abutting the at least one probe such that the at least one probe is pushed by the sidewall of the at least one first intermediate opening and the at least one second intermediate opening to form a plurality of interiors of the guide plate assembly A curved area. The probe device of the vertical probe card of claim 7, wherein a center line position of the at least one first intermediate opening and a center line position of the at least one second intermediate opening are opposite to the at least An upper opening and a centerline position of the at least one lower opening are offset from the side by a lateral distance, and sidewalls of the at least one first intermediate opening and the at least one second intermediate opening are offset from the at least one probe The at least one probe is urged by the at least one first intermediate opening and the sidewall of the at least one second intermediate opening to form at least one curved region inside the combination of the guide plates.