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TWI800668B - Wafer Manufacturing Method - Google Patents

Wafer Manufacturing Method Download PDF

Info

Publication number
TWI800668B
TWI800668B TW108126555A TW108126555A TWI800668B TW I800668 B TWI800668 B TW I800668B TW 108126555 A TW108126555 A TW 108126555A TW 108126555 A TW108126555 A TW 108126555A TW I800668 B TWI800668 B TW I800668B
Authority
TW
Taiwan
Prior art keywords
wafer manufacturing
wafer
manufacturing
Prior art date
Application number
TW108126555A
Other languages
Chinese (zh)
Other versions
TW202008452A (en
Inventor
源田悟史
小川雄輝
小田中健太郎
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202008452A publication Critical patent/TW202008452A/en
Application granted granted Critical
Publication of TWI800668B publication Critical patent/TWI800668B/en

Links

Classifications

    • H10P52/00—
    • H10P54/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10P72/0428—
    • H10P72/0431—
    • H10P72/0602—
    • H10P72/0604—
    • H10W10/00—
    • H10W10/01—
    • H10W74/01—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW108126555A 2018-07-31 2019-07-26 Wafer Manufacturing Method TWI800668B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-143126 2018-07-31
JP2018143126A JP7072993B2 (en) 2018-07-31 2018-07-31 Chip manufacturing method

Publications (2)

Publication Number Publication Date
TW202008452A TW202008452A (en) 2020-02-16
TWI800668B true TWI800668B (en) 2023-05-01

Family

ID=69383822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126555A TWI800668B (en) 2018-07-31 2019-07-26 Wafer Manufacturing Method

Country Status (5)

Country Link
JP (1) JP7072993B2 (en)
KR (1) KR102699722B1 (en)
CN (1) CN110783185B (en)
SG (1) SG10201906679RA (en)
TW (1) TWI800668B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7273756B2 (en) * 2020-03-18 2023-05-15 株式会社東芝 Semiconductor device and its manufacturing method
JP7450426B2 (en) * 2020-03-24 2024-03-15 株式会社ディスコ Processing method of workpiece
KR102405460B1 (en) 2020-06-26 2022-06-07 매그나칩 반도체 유한회사 Semiconductor Die Forming and Packaging Method Using Ultrashort pulse Laser Micromachining
KR20220167106A (en) 2021-06-11 2022-12-20 삼성전자주식회사 Semiconductor chip, and semiconductor package
CN113649709A (en) * 2021-08-16 2021-11-16 湖北三维半导体集成创新中心有限责任公司 Wafer cutting method
KR20230028186A (en) * 2021-08-19 2023-02-28 허페이 시트로닉스 컴퍼니 리미티드 Method for manufacturing semiconductor chips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201517150A (en) * 2013-10-03 2015-05-01 迪思科股份有限公司 Wafer processing method
US20170140989A1 (en) * 2015-11-16 2017-05-18 Disco Corporation Wafer dividing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3583279B2 (en) * 1998-01-13 2004-11-04 三菱電機株式会社 Drilling method
JP4694845B2 (en) 2005-01-05 2011-06-08 株式会社ディスコ Wafer division method
JP2011035302A (en) * 2009-08-05 2011-02-17 Renesas Electronics Corp Method of manufacturing semiconductor device
US8383984B2 (en) * 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
JP2014093445A (en) * 2012-11-05 2014-05-19 Disco Abrasive Syst Ltd Processing method of optical device wafer
US9919380B2 (en) * 2013-02-23 2018-03-20 Coherent, Inc. Shaping of brittle materials with controlled surface and bulk properties
JP2015020195A (en) * 2013-07-19 2015-02-02 アイシン精機株式会社 Laser processing apparatus, laser processing method, and laser oscillation apparatus
JP2015138857A (en) * 2014-01-22 2015-07-30 株式会社ディスコ Wafer processing method
JP2016162809A (en) * 2015-02-27 2016-09-05 株式会社ディスコ Wafer processing method
CN104716066B (en) * 2015-03-20 2018-03-30 上海华力微电子有限公司 One kind detects the defects of figure bottom photoetching glue residua detection method
CN106229309B (en) * 2016-07-20 2019-05-07 日月光半导体(上海)有限公司 Package substrate and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201517150A (en) * 2013-10-03 2015-05-01 迪思科股份有限公司 Wafer processing method
US20170140989A1 (en) * 2015-11-16 2017-05-18 Disco Corporation Wafer dividing method
JP2017092363A (en) * 2015-11-16 2017-05-25 株式会社ディスコ Dividing method for wafer

Also Published As

Publication number Publication date
CN110783185A (en) 2020-02-11
JP7072993B2 (en) 2022-05-23
JP2020021786A (en) 2020-02-06
KR102699722B1 (en) 2024-08-27
SG10201906679RA (en) 2020-02-27
TW202008452A (en) 2020-02-16
KR20200014195A (en) 2020-02-10
CN110783185B (en) 2023-10-10

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