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TWI800060B - Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel - Google Patents

Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel Download PDF

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Publication number
TWI800060B
TWI800060B TW110140161A TW110140161A TWI800060B TW I800060 B TWI800060 B TW I800060B TW 110140161 A TW110140161 A TW 110140161A TW 110140161 A TW110140161 A TW 110140161A TW I800060 B TWI800060 B TW I800060B
Authority
TW
Taiwan
Prior art keywords
electronic component
transferring electronic
manufacturing
light
emitting diode
Prior art date
Application number
TW110140161A
Other languages
Chinese (zh)
Other versions
TW202306218A (en
Inventor
莊國彬
黃聖哲
黃書賢
Original Assignee
斯託克精密科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯託克精密科技股份有限公司 filed Critical 斯託克精密科技股份有限公司
Priority to US17/744,753 priority Critical patent/US12394642B2/en
Priority to CN202210557071.6A priority patent/CN115692243A/en
Publication of TW202306218A publication Critical patent/TW202306218A/en
Application granted granted Critical
Publication of TWI800060B publication Critical patent/TWI800060B/en

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TW110140161A 2021-07-30 2021-10-28 Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel TWI800060B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/744,753 US12394642B2 (en) 2021-07-30 2022-05-16 Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
CN202210557071.6A CN115692243A (en) 2021-07-30 2022-05-19 Electronic component transfer apparatus, electronic component transfer method, and method for manufacturing light emitting diode panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163227340P 2021-07-30 2021-07-30
US63/227,340 2021-07-30

Publications (2)

Publication Number Publication Date
TW202306218A TW202306218A (en) 2023-02-01
TWI800060B true TWI800060B (en) 2023-04-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140161A TWI800060B (en) 2021-07-30 2021-10-28 Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel

Country Status (1)

Country Link
TW (1) TWI800060B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102044404A (en) * 2009-10-12 2011-05-04 桑迪士克股份有限公司 System for separating cut semiconductor bare chip from bare chip adhesive tape
TW202022929A (en) * 2018-12-07 2020-06-16 台灣愛司帝科技股份有限公司 Method for transferring chip and chip transferring apparatus
CN112055890A (en) * 2018-04-30 2020-12-08 科锐公司 Apparatus and method for electronic die mass transfer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102044404A (en) * 2009-10-12 2011-05-04 桑迪士克股份有限公司 System for separating cut semiconductor bare chip from bare chip adhesive tape
CN112055890A (en) * 2018-04-30 2020-12-08 科锐公司 Apparatus and method for electronic die mass transfer
TW202022929A (en) * 2018-12-07 2020-06-16 台灣愛司帝科技股份有限公司 Method for transferring chip and chip transferring apparatus

Also Published As

Publication number Publication date
TW202306218A (en) 2023-02-01

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