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GB202000401D0 - Substrate and method - Google Patents

Substrate and method

Info

Publication number
GB202000401D0
GB202000401D0 GBGB2000401.6A GB202000401A GB202000401D0 GB 202000401 D0 GB202000401 D0 GB 202000401D0 GB 202000401 A GB202000401 A GB 202000401A GB 202000401 D0 GB202000401 D0 GB 202000401D0
Authority
GB
United Kingdom
Prior art keywords
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2000401.6A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cantor Technologies Ltd
Original Assignee
Cantor Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cantor Technologies Ltd filed Critical Cantor Technologies Ltd
Priority to GBGB2000401.6A priority Critical patent/GB202000401D0/en
Publication of GB202000401D0 publication Critical patent/GB202000401D0/en
Priority to GB2210160.4A priority patent/GB2606109B/en
Priority to PCT/GB2020/053172 priority patent/WO2021140310A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GBGB2000401.6A 2020-01-10 2020-01-10 Substrate and method Ceased GB202000401D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB2000401.6A GB202000401D0 (en) 2020-01-10 2020-01-10 Substrate and method
GB2210160.4A GB2606109B (en) 2020-01-10 2020-12-11 Substrate comprising a through-hole via and manufacturing method
PCT/GB2020/053172 WO2021140310A1 (en) 2020-01-10 2020-12-11 Substrate comprising a through-hole via and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2000401.6A GB202000401D0 (en) 2020-01-10 2020-01-10 Substrate and method

Publications (1)

Publication Number Publication Date
GB202000401D0 true GB202000401D0 (en) 2020-02-26

Family

ID=69626426

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB2000401.6A Ceased GB202000401D0 (en) 2020-01-10 2020-01-10 Substrate and method
GB2210160.4A Active GB2606109B (en) 2020-01-10 2020-12-11 Substrate comprising a through-hole via and manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB2210160.4A Active GB2606109B (en) 2020-01-10 2020-12-11 Substrate comprising a through-hole via and manufacturing method

Country Status (2)

Country Link
GB (2) GB202000401D0 (en)
WO (1) WO2021140310A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12412811B2 (en) * 2022-08-23 2025-09-09 Micron Technology, Inc. Split via structure for semiconductor device packaging
CN121078647A (en) * 2025-11-07 2025-12-05 景旺电子科技(珠海)有限公司 PCB manufacturing methods and PCB

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63124595A (en) * 1986-11-14 1988-05-28 株式会社日立製作所 printed wiring board
WO2001099480A2 (en) * 2000-06-19 2001-12-27 3M Innovative Properties Company Printed circuit board having inductive vias
JP2002094204A (en) * 2000-09-19 2002-03-29 Matsushita Electric Ind Co Ltd High frequency module and manufacturing method thereof
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
TWI298993B (en) * 2004-06-17 2008-07-11 Advanced Semiconductor Eng A printed circuit board and its fabrication method
KR100725363B1 (en) * 2005-07-25 2007-06-07 삼성전자주식회사 Circuit boards and manufacturing method thereof
US20070089902A1 (en) * 2005-10-25 2007-04-26 Tourne Joseph A Circuit board having a multi-signal via
US20070151753A1 (en) * 2005-12-29 2007-07-05 Thor Soo F Printed circuit board having plated through hole with multiple connections and method of fabricating same
US7935895B2 (en) * 2006-09-26 2011-05-03 Cisco Technology, Inc. Structuring and circuitizing printed circuit board through-holes
US20090233461A1 (en) * 2008-03-17 2009-09-17 Tourne Joseph A A M Method of Manufacturing a Printed Circuit Board
TWI399138B (en) * 2010-08-24 2013-06-11 Hon Hai Prec Ind Co Ltd Printed circuit board
US9603255B2 (en) * 2015-02-20 2017-03-21 Nextgin Technology Bv Method for producing a printed circuit board
DE102015103724B4 (en) * 2015-03-13 2021-03-25 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with warp stabilization structure and method of manufacturing therefor
KR20180075171A (en) * 2016-12-26 2018-07-04 주식회사 엘지화학 Structure and method for diagonal via connected a layer spacing of PCB substrate

Also Published As

Publication number Publication date
WO2021140310A1 (en) 2021-07-15
GB202210160D0 (en) 2022-08-24
GB2606109A (en) 2022-10-26
GB2606109B (en) 2025-03-19

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)