TWI895795B - connector - Google Patents

Abstract

This document describes various aspects of a connector with a contact support structure. An example connector includes: a base; a wafer assembly including a terminal block and a wafer molded insert; and a wafer assembly support strip. The terminal block includes a plurality of terminal conductors. The wafer assembly support strip includes a terminal seating surface, a reference surface, and a molded interlock. A terminal conductor of the plurality of terminal conductors is electrically connected to the terminal seating surface, and the wafer molded insert is molded and extends into the molded interlock to secure the terminal block relative to the reference surface. The terminal block is thereby secured to the wafer assembly support strip and the wafer molded insert. The wafer assembly support strip provides additional strength, a higher elastic modulus, and thermal stability compared to other designs.

Description

connector

The present invention relates to a connector, and in particular to a connector with a contact support structure.

A range of input/output (I/O) connectors are designed for power, data, and power and data interconnect systems, including board-to-board, wire-to-wire, and wire-to-board systems. Various designs exist for each type of system, depending on the requirements of the power and data communication environment in which the connector is used. As an example, a wire-to-board system includes a free-end connector attached to a wire and a fixed-end connector attached to a board.

As an example, designing interconnect connectors for high-data-rate applications where physical space is constrained can be challenging due to many competing considerations. High-data-rate interconnect systems often rely on differentially coupled signal pairs, in which two conductors are arranged as a pair to transmit a differential signal. The transmitted signal is characterized by the measured electrical difference between the conductor pairs. Differential signaling can help avoid spurious signals and crosstalk and prevent unintended signaling modes between adjacent signal pairs. In connector interfaces, ground terminals can be used to create a return path for electrical grounding, provide shielding between differential pairs, and for other purposes.

Connectors used in high-data-rate applications are typically designed to meet a range of mechanical and electrical requirements. For example, high-data-rate connectors are often used in backplane applications that require very high conductor density and data rates. To achieve the necessary mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. The wafer assembly may include an insulating web that supports the terminal conductors within the wafer assembly. Using wafer assemblies facilitates the use of many different assembly processes to manufacture connectors capable of achieving high data rates. However, designing wafers with the conductor density and small pinout required for high-data-rate applications in new systems, while also maintaining the electrical characteristics desired for transmitting data with integrity, can be challenging.

Various aspects of a connector with a contact support structure are described. An example connector includes: a base; a wafer assembly including a terminal block and a wafer molded insert; and a wafer assembly support strip. The terminal block includes a plurality of terminal conductors. The wafer assembly support strip includes a terminal seating surface, a reference surface, and a molded interlocking feature. A terminal conductor from the plurality of terminal conductors is electrically connected to the terminal seating surface, and the wafer molded insert is molded into and extends into the molded interlocking feature to secure the terminal block relative to the reference surface. Thus, the terminal block is secured to the wafer assembly support strip and the wafer molded insert. The wafer assembly support strip provides additional strength, a higher elastic modulus, and thermal stability compared to other designs.

In other aspects of various embodiments, the wafer assembly support bar is embodied or formed from metal, and the wafer molded insert is embodied or formed from plastic. The wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first arm and the second arm. The first arm and the second arm define two sides of a front port opening of the connector. The extension bar of the wafer assembly support bar includes the molded interlocking feature, and at least one of the first arm and the second arm includes the reference surface.

In other aspects, the plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors, the wafer assembly support strip includes a plurality of terminal mounting surfaces, and each of the plurality of ground conductors is electrically connected to a respective one of the plurality of terminal mounting surfaces. The wafer assembly support strip further includes a terminal recess located between a pair of the plurality of terminal mounting surfaces. A pair of the plurality of signal conductors extends through the terminal recess of the wafer assembly support strip and is surrounded by the wafer molded insert.

In other aspects of various embodiments, the connector includes a ground path assembly. The ground path assembly includes a ground via block, and the ground via block includes a plurality of vias. A pair of signal conductors among the plurality of terminal conductors extends along one of the plurality of vias. In one example, the ground via block includes a metal coating on a plastic body. In other aspects, the ground via block includes a plurality of ground ribs for surface mounting at a terminal foot of the connector. The via extends between a pair of ground ribs among the plurality of ground ribs at the terminal foot of the connector. In another aspect, the ground via block includes a ground bar extending between and electrically connected to the plurality of ground ribs of the ground via block. In one example, the plurality of ground ribs are integrally formed with the ground via block ribs.

In another example, the ground via block includes a metal coating on a plastic body, and the plurality of ground ribs are separate from the ground via block and formed of metal. In other aspects, the ground path assembly further includes a ground platform frame, and a major surface of the ground platform frame extends in a plane that extends parallel to a major surface of the plurality of ground ribs at a terminal foot of the connector.

Another example connector includes: a wafer assembly including a terminal block and a wafer molded insert; and a wafer assembly support bar. The wafer assembly support bar includes a molded interlocking feature, and the wafer molded insert is molded into and extends into the molded interlocking feature of the wafer assembly support bar. In one example, the wafer assembly support bar includes a terminal mounting surface, and a ground conductor of the terminal block is electrically connected to the terminal mounting surface of the wafer assembly support bar. In one example, the wafer assembly support bar includes metal, the wafer molded insert includes plastic, the wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first arm and the second arm, and the first arm and the second arm define two sides of a front port opening of the connector.

In another example, the connector further includes a ground path assembly. The ground path assembly includes a ground channel block, the ground channel block including a channel along which a pair of signal conductors of the terminal block extend. In one example, the ground channel block includes a plurality of grounding ribs for surface mounting at a terminal leg of the connector, and the channel extends between a pair of the plurality of grounding ribs at the terminal leg of the connector. The ground channel block includes a grounding strip extending between and electrically connected to the plurality of grounding ribs of the ground channel block.

10: Connector

12: Front port opening

13: Terminal pin

20: Connector

100: Base

110: Front port

120: Bottom mounting surface

122: Mounting column

124: Mounting column

200: Thin-film assembly

210: Terminal block

211: Terminal conductor (also known as grounding conductor)

214: Terminal conductor (also known as grounding conductor)

212: Terminal conductor (also known as signal conductor)

213: Terminal conductor (also known as signal conductor)

212B: Bend

212L: Head contact area

212T: Tail contact

216: First or right group

217: Central Group

218: Second or left group

218T: Tail contact

219T: Tail contact

220: Support bar

220A: First Arm

220B: Second Arm

220C: Extension bar

221A-222F: Interlocking Features

222A-222F: Interlocking openings

223A-223C: Terminal mounting surface

224A: Terminal recess

224B: Terminal recess

226: Baseline

230: Flexible shielding element

231: Flexible shielding element

240: Thin-film molded insert

241: Interlocking plug

243: Thin-film interface plug

244: Thin-film interface plug

250: Thin-film molded insert

250E: Thin-film molded insert

251E: Relocation Channel

300: Thin-film assembly

310: Terminal block

311: Terminal conductor (also known as grounding conductor)

314: Terminal conductor (also known as grounding conductor)

312: Terminal conductor (also known as signal conductor)

313: Terminal conductor (also known as signal conductor)

312B: Bend

312L: Head contact area

312T: Tail contact

316: First or right group

317: Central Group

318: Second or left group

318T: Tail contact

319T: Tail contact

320: Support bar

322D: Interlocking openings

326: Baseline

327: Baseline

328A: Gradual opening

328B: Gradual opening

329A: Inner surface

329B: External surface

330: Installation interface

340: Thin-film molded insert

343: Thin-film interface plug

344: Thin-film interface plug

350: Thin-film molded insert

400A: Upper ground channel block

400B: Upper ground channel block

401C-404C: Passageway

401D-404D: Channel

410A: Grounding frame

410B: Grounding frame

411A-413A: Ground contact platform

411B-413B: Ground contact platform

414A: Curved sheet

416: Interface opening

417: Interface opening

450A: Lower ground channel block

450B: Lower ground channel block

450E: Lower ground channel block

451C: Channel

451D: Channel

452C: Channel

452D: Channel

451A: Grounding Rib

452A: Grounding Rib

451B: Grounding Rib

452B: Grounding Rib

451F-455F: Grounding Rib

456A: Grounding bar

456B: Grounding bar

460A: Grounding frame

460B: Grounding frame

461A: Connecting plate

500A: Upper ground channel block

500B: Upper ground channel block

501C: Channel

502C: Channel

501D: Channel

502D: Channel

510A: Grounding frame

510B: Grounding frame

511A: Ground contact platform

511B: Ground contact platform

512A: Ground contact platform

512B: Ground contact platform

514B: Grounding pin

550A: Lower ground channel block

550B: Lower ground channel block

551A: Grounding Rib

551B: Grounding Rib

552A: Grounding Rib

552B: Grounding Rib

551C: Channel

551D: Channel

552C: Channel

552D: Channel

551F: Grounding Rib

556A: Grounding bar

556B: Grounding bar

560A: Grounding frame

560B: Grounding frame

561A: Needle Eye

600: Interlocking feature

601: Interlocking feature

610: Offset

612: Offset

620: Installation opening

622: Installation opening

630: Bottom edge length

631: Bottom edge length

640: Grounding platform frame

641: Buckling recess

642: Buckling recess

643: Buckling recess

644: Buckling recess

646: Channel

647: Channel

648: Previous relationship

649: Connecting bar

650: bottom edge length

651: Bottom edge length

660: bottom edge length

661: Buckling recess

670: Ribs

671: Connecting teeth

672: Connecting Channel

680: Rib body

690: Opening

691: Opening

692: Opening

693: Opening

695: Interlocking Area

B:Axis

W: Width

Many aspects of the present invention may be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, with emphasis placed on clearly illustrating the principles of the present invention. In addition, in the drawings, similar figure labels throughout the several views indicate corresponding elements: Figure 1 shows a perspective view of an example connector according to various embodiments of the present invention; Figure 2 shows a front perspective view of the connector shown in Figure 1 according to various embodiments of the present invention, wherein the base is omitted; Figure 3 shows a rear perspective view of the connector shown in Figure 1 according to various embodiments of the present invention, wherein the base is omitted; Figure 4 shows two support bars of the connector shown in Figure 1 according to various embodiments of the present invention; Figure 5 shows an A-A cross-sectional view of a support bar shown in Figure 4; Figure 6 shows two support bars and a support bar at one side of the connector shown in Figure 1 according to various embodiments of the present invention. FIG7 shows a detailed view of two terminal blocks; FIG8 shows a detailed view of a terminal block and a thin-film molded insert of the connector shown in FIG1 according to various embodiments of the present invention; FIG8 shows another detailed view of the terminal block shown in FIG7, wherein the thin-film molded insert is omitted; FIG9 shows a top perspective view of a terminal block and a thin-film molded insert in the connector shown in FIG1 according to various embodiments of the present invention; FIG10 shows a bottom perspective view of a terminal block and a thin-film molded insert in the connector shown in FIG1 according to various embodiments of the present invention; FIG11 shows a terminal block and a thin-film molded insert in the connector shown in FIG1 according to various embodiments of the present invention. FIG12 is a top perspective view of a terminal block and a sheet molded insert in the connector shown in FIG1 according to various embodiments of the present invention; FIG13 is a front perspective view of a ground channel block in the connector shown in FIG1 according to various embodiments of the present invention; FIG14 is a rear perspective view of a ground channel block in the connector shown in FIG1 according to various embodiments of the present invention; FIG15 is a front perspective view of a ground frame in the connector shown in FIG1 according to various embodiments of the present invention; FIG16 is a rear perspective view of a ground frame in the connector shown in FIG1 according to various embodiments of the present invention; FIG17 is a diagram of a ground frame in the connector shown in FIG1 according to various embodiments of the present invention. FIG18 shows a perspective rear view of a grounding frame in the connector shown in FIG1 according to various embodiments of the present invention; FIG18 shows a perspective view of a terminal leg of the connector shown in FIG1 according to various embodiments of the present invention; FIG19 shows a side view of a grounding rib of the connector shown in FIG1 according to various embodiments of the present invention; FIG20 shows a side view of another type of grounding rib according to various embodiments of the present invention; FIG21 shows a connector with a grounding rib and a grounding platform frame according to various embodiments of the present invention; FIG22 shows a side view of a metal rib insert according to various embodiments of the present invention; and FIG23 shows a top view of a grounding platform frame according to various embodiments of the present invention.

Connectors used in high-data-rate applications are typically designed to meet a range of mechanical and electrical requirements. For example, high-data-rate connectors are often used in backplane applications that require very high conductor density and data rates. To achieve the necessary mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. The wafer assembly may include an insulating web that supports the terminal conductors within the wafer assembly. Using wafer assemblies facilitates the use of a variety of assembly processes to manufacture connectors capable of achieving high data rates. However, designing wafers and connectors that possess the conductor density and small pinouts required for high-data-rate applications in new systems, while also maintaining the electrical characteristics desired for the transmission of high-quality data, can be challenging.

In the sections summarized above, various aspects and embodiments of connectors with contact support structures and other features are described herein. An example connector includes: a base; a wafer assembly comprising a terminal block and a wafer molded insert; and a wafer assembly support strip. The terminal block includes a plurality of terminal conductors. The wafer assembly support strip includes a terminal seating surface, a reference surface, and a molded interlocking feature. A terminal conductor from the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the wafer molded insert is molded into and extends into the molded interlocking feature to secure the terminal block relative to the reference surface. Thus, the terminal block is secured to the wafer assembly support strip and the wafer molded insert. The thin-film assembly support strips provide additional strength, a higher elastic modulus, and thermal stability compared to other designs.

Turning to the drawings, FIG1 shows a perspective view of an example connector 10 according to various embodiments of the present invention. Connector 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratios, and other characteristics of connector 10 can vary from that shown. For example, connector 10 can accommodate more or fewer rows of terminals (e.g., connector 10 can be wider or narrower), and other variations are within the scope of the examples described herein. For higher data rate interconnects, multiple connectors similar to connector 10 can be stacked or arranged side by side. Additionally, in some cases, one or more of the parts or components of connector 10 as shown and described herein can be omitted. Connector 10 can also include other parts or components not shown.

Connector 10 includes a front port opening 12 and a terminal leg 13. Connector 10 is designed to establish and maintain electrical connection with contacts on the free end interface of a cable assembly. For example, a printed circuit board (PCB)-style interface of an Octal Small Form Factor Pluggable (OSFP), Quad Small Form Factor Pluggable (QSFP), or similar cable assembly can be plugged into front port opening 12 of connector 10.

Connector 10 includes a row of terminal conductors extending from a front port opening 12 to terminal legs 13 for communicating data signals on the conductors. Connector 10 is designed to provide shielding and maintain signal integrity for the differential signals on the terminal conductors as the terminal conductors extend from the front port opening 12 to the terminal legs 13. Connector 10 can be designed for use with an OSFP, QSFP, or related interconnect system, but the concepts described herein are not limited to use with any particular type or style of interconnect system. Additionally, the terminal legs 13 of connector 10 can be designed as surface mount technology (SMT) legs for connection to the surface of a larger substrate or assembly. However, in some cases, connector 10 can also be designed with through-hole leads or other header styles on the terminal legs 13.

As shown in Figure 1, connector 10 includes a base 100, two support bars 220, 320, and two terminal blocks 210, 310 positioned within a front port opening 12. In one example, base 100 can be formed from plastic or other insulating materials, but in some cases, base 100 can also be formed from metal or a combination of insulating and conductive materials. Base 100 includes a front port 110, a bottom mounting surface 120, and a plurality of mounting posts 122, 124. In one example, connector 10 is adapted to receive an OSFP, QSFP, or related PCB-style terminal from a cable system. The PCB-style terminal of the cable system can be assembled into opening 12 of connector 10. When inserted, the terminal blocks 210, 310 in the base 100, including the terminal conductors 211, 311, etc., will sit on and make electrical contact with the contacts on the top and bottom surfaces of the PCB pattern end.

The alignment and positioning of the terminal conductors 211, 311 within the connector 10 are particularly important. The mechanical compliance and robustness of each terminal conductor 211, 311 in the terminal blocks 210, 310 within the base 100 should be consistent across the terminal blocks 210, 310. Designing a connector with a terminal block that does not change in mechanical robustness, does not bend or buckle at the center (or other locations), or does not exhibit other mechanical or electrical variations can be difficult, especially when the terminal blocks are wide. In addition, when the connector 10 is mounted to the surface of a larger substrate or assembly, it often relies on heat, and the application of heat can cause the inner laminate molded support within the connector 10 to relax, which sometimes changes the mechanical or electrical properties of the terminal conductors 211, 311.

In the sections summarized above, connector 10 includes two support bars 220, 320. The support bars 220, 320 are formed from a material that is relatively rigid even when heated and has a high elastic modulus. In various other examples described herein, the support bars 220, 320 can be formed from a rigid and thermally stable metal or metal alloy such as aluminum, copper, or another metal. The laminate assembly within connector 10 can be molded into the molded interlocking features of the support bars 220, 320, and the terminal conductors 211, 311 can be mechanically and electrically secured (e.g., soldered or welded) to the terminal mounting surfaces on the support bars 220, 320. Thus, the wafer assembly can be mechanically and electrically integrated with the support bars 220, 320, providing additional strength and dimensional accuracy to the terminal blocks 210, 310 within the wafer assembly. The support bars 220, 320 thus provide a common electrical path between the ground terminals within the terminal blocks 210, 310.

Furthermore, as shown in FIG1 , the ends of the two support bars 220 , 320 define the sides of the front port opening 12 in the connector 10 . In this arrangement, the surfaces at the ends of the two support bars 220 , 320 provide datum surfaces, and the position of the terminal conductors 211 , 311 relative to the datum surfaces can be manufactured with greater precision. This position is maintained even under mechanical stress and thermal cycling. The PCB-style end of the cable system can be assembled into the front port opening 12 of the connector 10 and, based on contact with the datum surfaces of the two support bars 220 , 320 , finds proper alignment of the terminal strip with the conductors in the base 100 . These and other features of the base 100 will be described in additional detail later.

Figure 2 illustrates a front perspective view of the connector 10 shown in Figure 1 , with the base 100 omitted from this view. Figure 3 illustrates a rear perspective view of the connector 10 . Within the base 100 , the connector 10 includes a first or upper wafer assembly 200 (collectively, "wafer assembly 200"), a second or lower wafer assembly 300 (collectively, "wafer assembly 300"), two support bars 220 and 320, and a plurality of ground path assemblies. These components of the connector 10 are first described with reference to Figures 2 and 3 , and detailed views of these components are subsequently described with reference to Figures 4 through 19 .

Wafer assembly 200 includes a terminal block 210, two flexible shields 230, 231, and two wafer molded inserts 240, 250, among other possible components. Together with support bar 220, wafer assembly 200 supports, spaces, and aligns terminal conductors 211 within terminal block 210. Connector 10 also includes a ground path assembly for wafer assembly 200. The ground path assembly for wafer assembly 200 includes upper ground via blocks 400A, 400B and lower ground via blocks 450A, 450B. Upper ground via blocks 400A, 400B and lower ground via blocks 450A, 450B are also shown separately in Figures 13 and 14. The ground path assembly further includes ground frames 410A and 410B for the upper ground channel blocks 400A and 400B, respectively, and ground frames 460A and 460B for the lower ground channel blocks 450A and 450B, respectively. The ground frames 410A, 410B, 460A, and 460B are also shown separately in Figures 15 to 17.

The terminal block 210 includes signal conductors, power conductors, and ground conductors. The signal conductors and power conductors in the terminal block 210 each include a head contact at one distal end (i.e., located at the front port opening 12 of the connector 10, as shown in FIG1 ), a tail contact at the other distal end (i.e., located at the terminal foot 13), and a conductor bend between the head contact and the tail contact. The signal conductors and power conductors in the terminal block 210 are electrically isolated from each other within the connector 10. The signal conductors and power conductors extend from the head contact at the front port opening 12 to the tail contact at the terminal foot 13 of the connector 10. The tail contacts of the signal conductors and the power conductors can be formed as SMT tail contacts as in the example shown or as through-hole type or other types of contacts.

Each ground conductor in terminal block 210 includes a head contact at one distal end and a tail contact at the other distal end. The ground conductor extends from the head contact within front port opening 12 to a contact point on a ground path assembly for wafer assembly 200, as will be described later. The ground path assembly includes a plurality of grounding ribs or fins for surface mounting to a substrate at terminal foot 13. Additional views of terminal block 210 are provided in Figures 9 and 10.

The terminal block 210 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed). In some cases, the sheet of metal can be coated with one or more coating metals. The two sheet molded inserts 240, 250 can be formed from a plastic such as liquid crystal polymer (LCP) or other insulating material and are molded around the terminal conductors 211 in the terminal block 210. The two sheet molded inserts 240, 250 are spaced apart along the length of the terminal conductors 211 in the terminal block 210, and a bend is formed in the terminal block 210 between the two sheet molded inserts 240, 250.

The two flexible shields 230, 231 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed) and, in some cases, coated. The two flexible shields 230, 231 are secured to a top surface of a ground conductor in the terminal block 210 by mechanical interference within an opening through which the ground conductor passes. The two flexible shields 230, 231 span (but do not contact) the signal conductors in the terminal block 210 to provide shielding for the signal conductors. The two flexible shields 230, 231 provide additional support for the ground conductors in the terminal block 210 and shield the signal conductors in the terminal block 210 to maintain an electrical ground connection and preserve data signal integrity. Although not visible in FIG. 2, the terminal block 310 also includes two flexible shields 230, 231.

In one example, the upper ground via blocks 400A, 400B and the lower ground via blocks 450A, 450B can be formed from an insulating block or insulator coated with one or more plated metals. For example, the upper ground via blocks 400A, 400B and the lower ground via blocks 450A, 450B can be formed from LCP, polyethylene (PE), polytetrafluoroethylene (PTFE), conductive PE or PTFE, fluoropolymers, or other plastic or insulating materials. The upper ground via blocks 400A, 400B and the lower ground via blocks 450A, 450B can be plated with tin, gold, or another plated metal or metals. In other cases, the upper ground via blocks 400A and 400B can be formed from metal or other conductive materials with or without plating. The signal conductors of the terminal block 210 extend within the channels formed in the upper ground via blocks 400A and 400B and the lower ground via blocks 450A and 450B, which helps prevent signal crosstalk and interference between the signal conductors of the terminal block 210. The lower ground via blocks 450A and 450B include multiple ground ribs, including ground ribs 451A and 452A in the lower ground via block 450A and ground ribs 451B and 452B in the lower ground via block 450B, as shown in FIG. 3 .

Referring to FIG. 3 , the lower ground via block 450A includes a grounding bar 456A, while the lower ground via block 450B includes a grounding bar 456B. Both grounding bars 456A and 456B can be formed from a metal or metal alloy, such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases, can be plated with one or more metal platings. The grounding bar 456A extends between and electrically connects the grounding ribs 451A and 452A of the lower ground via block 450A to provide ground communication and maintain a common voltage potential between the grounding ribs 451A and 452A. Similarly, grounding strip 456B extends between and electrically connects the grounding ribs 451B, 452B of lower ground via block 450B to provide grounding connectivity and maintain a common potential between the grounding ribs 451B, 452B. Additional aspects of the ground path assembly for wafer assembly 300 will be described later.

Two sheet-molded inserts 240 and 250 are molded or otherwise formed around the terminal block 210. Before the two sheet-molded inserts 240 and 250 are formed, one or more of the ground conductors in the terminal block 210 can be mechanically and electrically secured (e.g., soldered, welded, bonded, etc.) to the terminal-receiving surface of the support bar 220. The terminal block 210 and support bar 220 can then be inserted into a mold fixture, and LCP or another insulating material can be injected into the mold. The insulating material forms the two sheet-molded inserts 240 and 250 around the terminal block 210 and also flows into the molded interlocking features of the support bar 220. The sheet-molded insert 240 is thereby anchored and secured to the support bar 220.

For example, Figures 2 and 3 illustrate how the insulating material of a laminated molded insert 240 extends into an interlocking opening 222A in a support strip 220 to form an interlocking plug 241. The support strip 220 includes a plurality of interlocking openings 222A, and the laminated molded insert 240 extends through each interlocking opening 222A to form a plurality of interlocking plugs 241. In this manner, the terminal block 210 is secured to the support strip 220 and the laminated molded insert 240. Compared to other designs, the support strip 220 provides additional strength, a higher elastic modulus, and better thermal stability. The support strip 220 also offers additional benefits described herein. Other aspects of the arrangement of the terminal block 210, support strip 220, and laminated molded insert 240 will be described below.

The wafer assembly 300 includes, among other possible components, a terminal block 310, two flexible shields (not seen in Figures 2 and 3), and two wafer molded inserts 340, 350. Together with the support bar 320, the wafer assembly 300 supports, spaces, and aligns the terminal conductors 311 in the terminal block 310. The connector 10 also includes a ground path assembly for the wafer assembly 300. The ground path assembly for the wafer assembly 300 includes upper ground channel blocks 500A, 500B and lower ground channel blocks 550A, 550B. The upper ground channel blocks 500A, 500B and the lower ground channel blocks 550A, 550B are also shown separately in Figures 13 and 14. The ground path assembly further includes ground frames 510A and 510B for the upper ground channel blocks 500A and 500B, respectively, and ground frames 560A and 560B for the lower ground channel blocks 550A and 550B, respectively. The ground frames 510A, 510B, 560A, and 560B are also shown separately in Figures 15 to 17.

Terminal block 310 includes signal conductors, power conductors, and a ground conductor. Each signal conductor and power conductor in terminal block 310 includes a head contact at one distal end (i.e., located at the front port opening 12 of connector 10, as shown in Figure 1), a tail contact at the other distal end (i.e., located at the terminal foot 13), and a conductor bend between the head and tail contacts. The signal conductors and power conductors in terminal block 310 are electrically isolated from each other within connector 10. The signal conductors and power conductors extend from the head contact at the front port opening 12 to the tail contact at the terminal foot 13 of connector 10. As an example, the signal conductor 312 extends from a head contact 312L at the front port opening 12 to a tail contact 312T at the terminal foot 13. The tail contacts of the signal conductor and the power conductor can be formed as SMT tail contacts as in the example shown, or as through-hole or other types of contacts.

The ground conductors in terminal block 310 each include a head contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the head contact within front port opening 12 to a contact point on a ground path assembly for wafer assembly 300, as will be described later. The ground path assembly includes a plurality of grounding ribs or fins for surface mounting to a board at terminal foot 13. Additional views of terminal block 210 are provided in Figures 9 and 10.

The terminal block 310 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed). In some cases, the sheet of metal can be coated with one or more coatings. Two sheet mold inserts 340, 350 can be formed from a plastic, such as LCP or other insulating material, and are molded around the terminal conductors 311 in the terminal block 310. The two sheet mold inserts 340, 350 are spaced apart along the length of the terminal conductors 311 in the terminal block 310, and a bend is formed in the terminal block 310 between the sheet mold inserts 340, 350.

In one example, the upper ground via blocks 500A, 500B and the lower ground via blocks 550A, 550B can be formed from a plastic block coated with one or more metal-plated materials. However, these upper ground via blocks 500A, 500B and the lower ground via blocks 550A, 550B can also be formed from metal or other conductive materials. By way of example, the upper ground via blocks 500A, 500B and the lower ground via blocks 550A, 550B can be formed from LCP, PE, PTFE, conductive PE or PTFE, fluoropolymers, or other plastic or insulating materials. The signal conductors of terminal block 310 extend within channels formed in upper ground via blocks 500A, 500B and lower ground via blocks 550A, 550B. This helps prevent signal crosstalk and interference between the signal conductors of terminal block 310. Both lower ground via blocks 550A, 550B include grounding ribs. For example, lower ground via block 550A includes grounding ribs 551A, 552A, and so on, while lower ground via block 550B includes grounding ribs 551B, 552B, and so on, as shown in Figure 2.

2 , the lower ground via block 550A includes a grounding bar 556A, while the lower ground via block 550B includes a grounding bar 556B. Both grounding bars 556A and 556B can be formed from a metal or metal alloy, such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases, can be plated with one or more metal platings. The grounding bar 556A extends between and electrically connects the grounding ribs 551A and 552A of the lower ground via block 550A to provide ground connectivity and maintain a common electrical potential between the grounding ribs 551A and 552A. Similarly, grounding strip 556B extends between and electrically connects the grounding ribs 551B, 552B of lower ground via block 550B to provide ground connectivity and maintain a common potential between the grounding ribs 551B, 552B. [The grounding path for wafer assembly 300 is omitted as it is omitted.] Additional aspects of the assembly will be described later.

Two laminated molded inserts 340, 350 are molded or otherwise formed around the terminal block 310. Before the two laminated molded inserts 340, 350 are formed, one or more of the ground conductors in the terminal block 310 can be electrically and mechanically fastened (e.g., soldered, welded, bonded, etc.) to the seating surface of the terminal support strip 320. When the laminated molded inserts 340 are molded, the insulating material of the laminated molded inserts 340 flows into the molded interlocking features of the support strip 320 to anchor and secure the laminated molded inserts 340 to the support strip 320. This is similar to how the laminated molded inserts 240 are anchored to the support strip 220. In this manner, terminal block 310 is secured to support bar 320 and sheet-molded insert 340. Support bar 320 provides additional strength, a higher elastic modulus, and thermal stability compared to other designs. Support bar 320 also provides additional benefits described herein. Further aspects of the arrangement of terminal block 310, support bar 320, and sheet-molded insert 340 will be described later.

FIG4 shows the two support bars 220, 320 separated from each other, with all other components of the connector 10 omitted from this view. The two support bars 220, 320 are shown in FIG4 as a representative example. The size, shape, and pattern of the two support bars 220, 320 can vary from that shown. For example, the number and location of interlocking features, terminal mounting surfaces, and other features of the two support bars 220, 320 can vary from that shown. The two support bars 220, 320 can be formed from metals such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys that are relatively rigid even when heated and have a high elastic modulus. The two support bars 220, 320 are preferably formed from a material having a higher stiffness and elastic modulus than the sheet-molded inserts 240, 250, 340, 350. The two support bars 220, 320 can be molded, machined, or formed using other suitable manufacturing techniques. In some cases, the two support bars 220, 320 can also be plated with one or more metals.

In the example shown in FIG. 4 , the two support bars 220 , 320 are formed to have the same shape and size, with support bar 320 rotated 180° relative to support bar 220 along axis “B.” Thus, the two support bars 220 , 320 are identical and can serve as a source of multiple identical parts or components, reducing cost, complexity, and tooling requirements. However, in other cases, the two support bars 220 , 320 can differ from one another in size, shape, both size and shape, or other aspects. The support bar 220 includes a first or right arm 220A, a second or left arm 220B, and an extension bar 220C. The extension bar 220C extends between the first and second arms 220A, 220B. First arm 220A and second arm 220B include interlocking features 221A and 221B, respectively, that complement each other in shape. In the illustrated arrangement, the interlocking features of support strip 220 correspond to and abut the interlocking features of support strip 320, thereby positioning the two support strips 220 and 320 together within connector 10. The first and second arms 220A and 220B of support strip 220 and the two arms of support strip 320 define the sides of the front port opening 12 of connector 10.

Support bar 220 includes a plurality of molded interlocking features, such as interlocking openings 222A-222F. Support bar 220 also includes a plurality of terminal receiving surfaces, such as terminal receiving surfaces 223A-223C. Support bar 220 also includes recesses between the terminal receiving surfaces. In FIG. 4 , terminal recesses 224A and 224B are shown between terminal receiving surfaces 223A-223C. As shown in FIG. 4 , support bar 320 also includes interlocking openings 222A-222F, terminal receiving surfaces 223A-223C, and terminal recesses 224A and 224B.

The ground conductors in the terminal block 210 can be mechanically and electrically fastened (e.g., soldered, welded, bonded, etc.) to the terminal mounting surfaces 223A-223C. In that manner, the terminal block 210 can be fastened to the support bar 220 before the two sheet molded inserts 240, 250 are formed. The terminal block 210 and support bar 220 can then be inserted into a mold fixture, and LCP or another insulating material can be injected into the mold. As the two sheet molded inserts 240, 250 are molded around the terminal block 210, the insulating material of the sheet molded insert 240 also flows into the interlocking openings 222A-222F of the support bar 220 to anchor and fasten the sheet molded insert 240 to the support bar 220. Compared to other designs where only a plastic molded part is used to support a row of terminal conductors, the support strip 220 provides additional strength, a higher elastic modulus, and thermal stability.

In a similar manner, the ground conductors in terminal block 310 can be mechanically and electrically secured to the terminal-receiving surface of support strip 320. In this manner, terminal block 310 can be secured to support strip 320 before the two laminated molded inserts 340 and 350 are formed. When the two laminated molded inserts 340 and 350 are formed, the insulating material of laminated molded insert 340 flows into interlocking openings, such as interlocking openings 322D, in support strip 320, anchoring and securing laminated molded insert 340 to support strip 320.

The two support strips 220 and 320 also include a plurality of reference surfaces. According to aspects of various embodiments, the positions and surfaces of the terminal conductors 211 and 311 in the terminal blocks 210 and 310 are precisely defined by these reference surfaces. For example, support strip 220 includes a reference surface 226, while support strip 320 includes reference surfaces 326 and 327. Reference surfaces 226, 326, and 327 provide surface interfaces (or mechanical interfaces or interferences) through which contacts on a PCB-style connector can be aligned with the terminal conductors 211 and 311 in the terminal blocks 210 and 310, as will be explained later with reference to FIG. 6.

FIG5 shows a cross-sectional view taken along line A-A through interlocking aperture 322D of support strip 320 shown in FIG4 . Interlocking aperture 322D is cylindrical and gradient in shape, but can be formed in other shapes, and extends from an inner surface 329A of support strip 320 to an outer surface 329B of support strip 320. Interlocking aperture 322D includes a first, narrow gradient aperture 328A extending from inner surface 329A to a position within support strip 320, and a second, wider gradient aperture 328B extending from within support strip 320 to outer surface 329B. Thus, interlocking aperture 322D includes a step or ledge between gradient aperture 328A and gradient aperture 328B. In one example, each of the other interlocking openings in the two support strips 220, 320 has a similar shape, but the two support strips 220, 320 can include different types and styles of molded interlocking parts.

As the laminated molded insert 340 is molded around the terminal block 310, the insulating material of the laminated molded insert 340 flows into the interlocking openings 322D and the like in the support strip 320. The laminated molded insert 340 forms a large cap or interlocking plug within the tapered opening 328B, with mechanical interference between the interlocking plug and the step or ledge in the interlocking opening 322D. After the laminated molded insert 340 is formed, it is thus secured to the support strip 320. In a similar manner, the sheet molded insert 240 and the support strip 220 are also secured together based on the flow of an insulating material extending from the sheet molded insert 240 into the interlocking openings 222A-222F of the support strip 220.

FIG6 shows a detailed view of two support bars 220, 320 and two terminal blocks 210, 310 on one side of connector 10. In FIG6, base 100 and two flexible shields 230, 231 are omitted from this view. The two support bars 220, 320 include reference surfaces that allow the position and surface of the terminal conductors 211, 311 in the two terminal blocks 210, 310 to be set or determined with greater accuracy than in other designs. For example, support bar 220 includes a reference surface 226, while support bar 320 includes reference surfaces 326, 327. When a PCB-style end of a cable system is inserted into the front port opening 12 of connector 10, the top surface of the PCB can be guided by reference surface 226, the bottom surface of the PCB can be guided by reference surface 326, and the side surface of the PCB can be guided by reference surface 327. Thus, reference surfaces 226, 326, 327 provide surface interfaces (or mechanical interferences) through which the PCB and its contacts can be aligned with the terminal conductors 211, 311 in the two terminal blocks 210, 310. The two support bars 220, 320 include reference surfaces on the right and left sides of the front port opening 12 in the front port 110 of the base 100. Additionally, the two support bars 220 , 320 provide a type of ground shield surrounding the two terminal blocks 210 , 310 in the front port 110 of the base 100 , as the two support bars 220 , 320 are electrically connected to the ground conductors in the two terminal blocks 210 , 310 .

See Figure 6 for the terminal conductors 211-214 of the terminal block 210. The two terminal conductors 211 and 214 are ground conductors (also referred to as "the two ground conductors 211 and 214"), while the two terminal conductors 212 and 213 are a pair of signal conductors for a differential signal (also referred to as "the two signal conductors 212 and 213"). The two signal conductors 212 and 213 are arranged between the two ground conductors 211 and 214 in the terminal block 210, and other pairs of signal conductors are also arranged between the two ground conductors 211 and 214 in the terminal block 210.

Figure 6 illustrates how the top surfaces of the two ground conductors 211 and 214 contact the two terminal mounting surfaces 223A and 223B of the support strip 220. Prior to forming the sheet-molded insert 240, the two ground conductors 211 and 214 can be soldered, welded, or otherwise bonded to the two terminal mounting surfaces 223A and 223B. Meanwhile, the two signal conductors 212 and 213 pass beneath the terminal recesses 224A of the support strip 220 without contacting the support strip 220. The signal conductors 212 and 213 in the other terminal blocks 210 also pass beneath the terminal recesses 224A in the support strip 220.

When the sheet-molded insert 240 is formed, insulating material flows into the terminal recess 224A of the support strip 220, surrounding the signal conductors 212, 213 along their length. Insulating material also flows into the interlocking opening 222A to form the interlocking plug 241. Thus, the sheet-molded insert 240 not only electrically isolates the signal conductors 212, 213 from the support strip 220 but also secures them to the support strip 220. Due to the structural design and assembly of the connector 10, a high degree of accuracy is achieved between the datum surfaces 226, 326, 327 of the support strip 220 and the terminal conductors 211-214 in the terminal block 210. In a similar manner, the wafer assemblies 200, 300 are secured together with two support bars 220, 320, respectively, and the support bars 220, 320 provide a number of advantages, including additional strength and dimensional accuracy for the two terminal blocks 210, 310 and the two wafer assemblies 200, 300.

FIG7 shows a detailed view of the terminal block 210 and the sheet molded insert 240 of the connector 10 shown in FIG1 . In FIG7 , the base 100 , the support bar 220 , and the upper ground channel block 400A are omitted from this view. FIG8 shows another detailed view of the terminal block 210 shown in FIG7 , wherein the sheet molded insert 240 is also omitted from this view. FIG7 shows how a pair of signal conductors, such as the two signal conductors 212 , 213 , pass through the sheet molded insert 240 (i.e., the sheet molded insert 240 is formed around the two signal conductors 212 , 213 ). However, the top surfaces of the ground conductors, such as the two ground conductors 211 , 214 , are not wrapped or surrounded by the sheet molded insert 240 . Instead, the top surfaces of the two ground conductors 211 and 214 can be soldered, welded, or otherwise bonded to the two terminal mounting surfaces 223A and 223B of the support bar 220 (see FIG. 6 ). In that manner, the two ground conductors 211 and 214 are electrically connected to the support bar 220.

Referring to Figure 8 , the ground frame 410A includes ground contact platforms 411A-413A, etc. Ground contact platforms 411A-413A are curved or otherwise formed to extend upward from a main surface of the ground frame 410A. When the connector 10 is assembled, the top surfaces of the ground contact platforms 411A-413A contact the bottom surfaces of the ground conductors 211 and 214 in the terminal block 210. For example, the top surfaces of the ground contact platforms 411A and 412A contact the bottom surfaces of the ground conductors 211 and 214. In this manner, the two ground conductors 211 and 214 are electrically connected to the ground frame 410A, and the ground frame 410A is assembled or integrated with the upper ground via block 400A. Both are components of the ground path assembly for the wafer assembly 200. The ground frame 410A, the upper ground via block 400A, and other ground frames and ground via blocks in the connector 10 will be described in more detail later with reference to Figures 13 to 16.

Ground frame 410A also includes interface openings on the sides of ground contact platforms 411A-413A. For example, ground frame 410A includes two interface openings 416 and 417 on either side of ground contact platform 411A. When connector 10 is assembled, the interface plugs on wafer mold insert 240 can be positioned within interface openings 416 and 417 of ground frame 410A. Ground frames 410B, 510A, and 510B also include interface openings, and wafer mold insert 340 of wafer assembly 300 also includes interface plugs. An example of an interface plug on wafer mold insert 240 will be described later with reference to FIG. 10 . An example of an interface plug on wafer mold insert 340 will be described later with reference to FIG. 11 .

Figure 9 shows a top perspective view of the terminal block 210 and two laminated molded inserts 240 and 250, while Figure 10 shows a bottom perspective view of the terminal block 210 and two laminated molded inserts 240 and 250. Laminated molded insert 240 extends across the width "W" of the terminal block 210, as shown in Figure 9. Similarly, laminated molded insert 250 extends across the width "W" of the terminal block 210, as shown in Figure 10. The terminal block 210 and two laminated molded inserts 240 and 250 are components or elements of the first or upper laminated assembly 200 of the connector 10.

The terminal block 210 includes a first or right group 216 of terminal conductors, a central group 217 of terminal conductors, and a second or left group 218 of terminal conductors. The first or right group 216 and the second or left group 218 include ground conductors and signal conductors. The first or right group 216 includes a ground conductor 211, two signal conductors 212 and 213 forming a differential pair of signal conductors, and a ground conductor 214. Overall, the first or right group 216 includes eight signal conductors and five ground conductors, wherein each pair of signal conductors is located between two ground conductors. The terminal conductors of the central group 217 include power conductors and, in some cases, can include ground conductors or signal conductors. The second or left group 218 is similar to the first or right group 216 but is located on the other side of the central group 217. FIG11 shows a terminal block 310 that is similar to terminal block 210. In one example, the spacing between the header contacts of the terminal conductors is the same in both terminal blocks 210 and 310. However, the terminal conductors in terminal block 210 may be offset from the terminal conductors in terminal block 310, such that the header contacts are staggered between the two terminal blocks 210 and 310. In other cases, the terminal conductors in the two terminal blocks 210 and 310 may have the same spacing and be aligned relative to each other (i.e., not staggered). In still other cases, the terminal conductors in the two terminal blocks 210 and 310 may have different header contact spacings compared to each other.

Figure 10 illustrates how the signal and power conductors in terminal block 210 extend from header contacts within front port opening 12 (see Figure 1) to tail contacts at terminal foot 13 of connector 10. As an example, signal conductor 212 extends from a header contact 212L to a tail contact 212T at connector 10. Signal conductor 212 includes a bend 212B between sheet mold insert 240 and sheet mold insert 250, as do the other signal and power conductors in terminal block 210. The tail contacts of the signal and power conductors in terminal block 210 can be formed as SMT tail contacts, as shown in Figure 10, or as through-hole or other types of contacts. The ground conductors in the terminal block 210 do not extend directly to the terminal legs 13. Instead, the ground conductors extend from header contacts within the front port opening 12 to contact points on a ground path assembly for the wafer assembly 200. The ground path assembly includes ground ribs for surface mounting to a substrate, as will be described later.

FIG10 also illustrates the wafer interface plugs 243, 244, etc., of the wafer molded insert 240. When the connector 10 is assembled, the wafer interface plugs 243, 244 on the wafer molded insert 240 can be positioned within the interface openings of the ground frame 410A. For example, the wafer interface plugs 243, 244 shown in FIG10 can be positioned within the interface openings 416, 417 of the ground frame 410A shown in FIG8 , which is part of the ground path assembly of the connector 10. The wafer interface plugs 243, 244 of the wafer molded insert 240 can be used to secure the wafer assembly 200 to the ground path assembly for the wafer assembly 200. In a similar manner, the wafer assembly 300 can be secured to a ground path assembly for the wafer assembly 300 by means of a wafer interface plug of the wafer molded insert 350, as will be described later.

Figure 11 shows a top perspective view of the terminal block 310 and two laminated molded inserts 340 and 350, while Figure 12 shows a bottom perspective view of the terminal block 310 and two laminated molded inserts 340 and 350. The laminated molded insert 340 extends across the width "W" of the terminal block 310, as shown in Figure 11. Similarly, the laminated molded insert 350 extends across the width "W" of the terminal block 310, as shown in Figure 12. The terminal block 310 and the two laminated molded inserts 340 and 350 are components or parts of the second or lower laminated assembly 300 in the connector 10.

Terminal block 310 includes a first or right group 316 of terminal conductors, a center group 317 of terminal conductors, and a second or left group 318 of terminal conductors. Both first or right group 316 and second or left group 318 include ground conductors and signal conductors. For example, first or right group 316 includes a ground conductor 311, two signal conductors 312 and 313 forming a differential pair of signal conductors, and a ground conductor 314. Overall, first or right group 316 includes eight signal conductors and five ground conductors, with each pair of signal conductors positioned between two ground conductors. The center group 317 includes power conductors and, in some cases, ground or signal conductors. Second or left group 318 is similar to first or right group 316 but is located on the other side of center group 317.

FIG11 also illustrates the wafer interface plugs 343, 344, etc. of the wafer molded insert 340. When the connector 10 is assembled, the wafer interface plugs 343, 344 on the wafer molded insert 340 can be positioned within the interface openings of the ground frame 410A. The wafer interface plugs 343, 344 of the wafer molded insert 340 can be used to secure the wafer assembly 300 to the ground path assembly for the wafer assembly 300.

FIG12 illustrates how the signal and power conductors in the terminal block 310 extend from a head contact within the front port opening 12 (see FIG1 ) to a tail contact at the terminal foot 13 of the connector 10. As an example, a signal conductor 312 extends from a head contact 312L end to a tail contact 312T end of the connector 10. The signal conductor 312 includes a bend 312B between the sheet molded insert 340 and the sheet molded insert 350, as do the other signal and power conductors in the terminal block 310. The tail contacts of the signal and power conductors in the terminal block 310 can be formed as SMT tail contacts as shown in FIG12 or as through-hole or other types of contacts. The ground conductors in the terminal block 310 do not extend directly to the mounting interface 330. Instead, the ground conductors extend from header contacts within the front port opening 12 (see FIG. 1 ) to contact points on the ground path assembly for the wafer assembly 300.

FIG13 shows a front perspective view of the upper ground via blocks 400A, 400B, the lower ground via blocks 450A, 450B, the upper ground via blocks 500A, 500B, and the lower ground via blocks 550A, 550B of the connector 10 shown in FIG1 , while FIG14 shows a rear perspective view of these upper and lower ground via blocks. The upper ground via blocks 400A, 400B and the lower ground via blocks 450A, 450B form parts or components of the ground path assembly for the wafer assembly 200, while the upper ground via blocks 500A, 500B and the lower ground via blocks 550A, 550B form parts or components of the ground path assembly for the wafer assembly 300. In the illustrated example, the upper ground via blocks 400A, 400B, the lower ground via blocks 450A, 450B, the upper ground via blocks 500A, 500B, and the lower ground via blocks 550A, 550B are separate (i.e., not integrally formed) blocks. However, in some cases, one or more of these upper and lower ground via blocks can be combined or integrally formed together. For example, in some cases, the upper and lower ground via blocks 400A, 450A can be formed as a single block, while other blocks can be combined. As described above, the upper ground via blocks 400A, 400B, the lower ground via blocks 450A, 450B, the upper ground via blocks 500A, 500B, and the lower ground via blocks 550A, 550B can be formed of LCP, PE, PTFE, conductive PE or PTFE, fluoropolymers, or other plastic or insulating materials.

As shown in Figures 13 and 14 , upper ground channel block 400A includes channels 401C-404C, while upper ground channel block 400B includes channels 401D-404D. When connector 10 is assembled, paired signal conductors in terminal block 210 extend within channels 401C-404C and 401D-404D in upper ground channel blocks 400A and 400B, as also shown in Figure 3 . Channels 401C-404C and 401D-404D help electrically isolate the paired signal conductors in terminal block 210 from each other, thereby reducing crosstalk and interference between the paired signal conductors in terminal block 210.

Similarly, upper ground channel blocks 500A and 500B include channels 501C, 502C, 501D, 502D, and other channels. Pairs of signal conductors in terminal block 310 extend within channels 501C and 502C in upper ground channel block 500A, within channels 501D and 502D in upper ground channel block 500B, and so on. Pairs of signal conductors in terminal block 310 also extend within channels 551C and 552C in lower ground channel block 550A, within channels 551D and 552D in lower ground channel block 550B, and so on. These channels in the upper ground channel blocks 500A, 500B and the lower ground channel blocks 550A, 550B help electrically isolate the paired signal conductors in the terminal block 310 from each other, thereby reducing crosstalk and interference between the paired signal conductors in the terminal block 310. The signal conductors in the terminal block 310 extend from the header contacts within the front port opening 12 (see FIG. 1 ), through the channels 501C, 502C, 501D, 502D in the upper ground channel blocks 500A, 500B, through the channels 551C, 552C, 551D, 552D in the lower ground channel blocks 550A, 550B, to the tail contacts at the terminal feet 13 of the connector 10.

14 , lower ground via block 450A includes channels 451C, 452C, and so on, and lower ground via block 450B includes channels 451D, 452D, and so on. Pairs of signal conductors in terminal block 210 extend within channels 451C and 452C of lower ground via block 450A, as well as within channels 451D, 452D, and so on, of lower ground via block 450B. These channels 451C, 452C, 451D, and 452D in lower ground via blocks 450A and 450B help electrically isolate the paired signal conductors in terminal block 210 from one another, thereby reducing crosstalk and interference between the paired signal conductors in terminal block 210. Signal conductors in terminal block 210 extend from header contacts within front port opening 12 (see FIG. 1 ), through channels in upper ground channel blocks 400A and 400B (see FIG. 3 ), through channels in lower ground channel blocks 450A and 450B, and to tail contacts at terminal foot 13 of connector 10. These channels in upper ground channel blocks 400A and 400B, lower ground channel blocks 450A and 450B, upper ground channel blocks 500A and 500B, and lower ground channel blocks 550A and 550B can also include shifts, bends, or other features that track shifts or bends in the signal conductors extending within these channels. As examples, Figures 13 and 14 show offsets 610, 612, and other variations in the direction of the channels are within the scope of the present embodiments.

A subset of the ground channel blocks shown in Figures 13 and 14 also includes ground ribs at the terminal foot 13 of the connector 10. In the examples shown in Figures 13 and 14, the ground ribs are formed integrally with the lower ground channel blocks 450A, 450B, 550A, 550B. In various other examples, ground channel blocks including separate ground ribs formed of metal, such as those shown in Figures 21 to 23, can be relied upon. As shown in Figure 13, the lower ground channel block 550A includes ground ribs 551A, 552A, while the lower ground channel block 550B includes ground ribs 551B, 552B, and so on. Channel 551C extends between the two grounding ribs 551A and 552A of the lower ground via block 550A, while the other channels of the lower ground via block 550A extend between the pair of grounding ribs 551A and 552A of the lower ground via block 550A. Channel 551D extends between the two grounding ribs 551B and 552B, while the other channels of the lower ground via block 550B also extend between the pair of grounding ribs 551B and 552B of the lower ground via block 550B.

As shown in Figure 14 , lower ground via block 450A includes grounding ribs 451A and 452A, while lower ground via block 450B includes grounding ribs 451B and 452B, and so on. These grounding ribs can be coated with tin, gold, or another metal coating suitable for surface mounting and can be surface mounted to traces on a PCB along with the SMT tail contacts of the signal and power terminal conductors. These grounding ribs provide shielding between the SMT tail contacts, even at the mounting surface of the terminal pins 13 of the connector 10. The grounding ribs in lower ground via blocks 450A, 450B, 550A, and 550B will also be described later with reference to Figures 18 and 19 .

Referring to FIG. 13 , the lower ground channel block 550A further includes a grounding strip 556A, while the lower ground channel block 550B includes a grounding strip 556B. Grounding strip 556A extends between and electrically connects the grounding ribs 551A and 552A of the lower ground channel block 550A, providing grounding connectivity and maintaining a common potential between the grounding ribs 551A and 552A. Similarly, grounding strip 556B extends between and electrically connects the grounding ribs 551B and 552B of the lower ground channel block 550B, providing grounding connectivity and maintaining a common potential between the grounding ribs 551B and 552B.

Referring to FIG. 14 , the lower ground channel block 450A further includes a grounding strip 456A, while the lower ground channel block 450B includes a grounding strip 456B. Grounding strip 456A extends between and electrically connects the grounding ribs 451A and 452A of the lower ground channel block 450A, providing grounding connectivity and maintaining a common potential between the grounding ribs 451A and 452A. Similarly, grounding strip 456B extends between and electrically connects the grounding ribs 451B and 452B of the lower ground channel block 450B, providing grounding connectivity and maintaining a common potential between the grounding ribs 451B and 452B.

The grounding bars 456A, 456B, 556A, 556B can be formed from a metal or metal alloy such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases can be plated with one or more plated metals. In one example, the lower ground via blocks 450A, 450B can be molded around the grounding bars 456A, 456B, or the grounding bars 456A, 456B can be inserted into slots at the ends of the grounding ribs and secured using an interference fit, welding, adhesive bonding, or other means. Similarly, in one example, the lower ground via blocks 550A, 550B can be molded around the ground bars 556A, 556B, or the ground bars 556A, 556B can be inserted into slots at the ends of the ground ribs and secured using an interference fit, welding, adhesive bonding, or other means.

The upper ground channel blocks 400A, 400B, the lower ground channel blocks 450A, 450B, the upper ground channel blocks 500A, 500B, and the lower ground channel blocks 550A, 550B can also include a number of corresponding or abutting interlocking features, such as the interlocking feature 600 shown in FIG. 13 and the interlocking feature 601 shown in FIG. 14 . The interlocking features 600 can be used to position, align, and secure the paired upper ground channel blocks 400A, 400B, the lower ground channel blocks 450A, 450B, the upper ground channel blocks 500A, 500B, and the lower ground channel blocks 550A, 550B relative to each other.

FIG15 shows a front perspective view of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B in the connector 10 shown in FIG1 , while FIG16 shows a rear perspective view of these ground frames. Ground frames 410A, 410B, 460A, and 460B form parts or components of the ground path assembly for wafer assembly 200 , while ground frames 510A, 510B, 560A, and 560B form parts or components of the ground path assembly for wafer assembly 300 . In the illustrated example, the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B are separate (i.e., not integrally formed). However, in some cases, one or more of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be combined and integrated together. For example, in some cases, the ground frames 410A and 460A can be formed as a single ground frame, while the other ground frames can be combined.

The ground frame 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B can be stamped, sheared, or otherwise formed from a flat sheet of metal. In some cases, the sheet of metal can be coated with one or more coating metals. When the connector 10 is assembled, the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B can be positioned (e.g., adjacent to, between, against, etc.) and secured together with the sheet mold inserts 240, 250, 340, 350 and the upper ground via blocks 400A, 400B, the lower ground via blocks 450A, 450B, the upper ground via blocks 500A, 500B, and the lower ground via blocks 550A, 550B. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B includes two major side surfaces that are the two largest surfaces of the ground frame. As an example, the main side surfaces of the ground frames 410A and 410B are indicated by hatching in Figures 15 and 16.

The ground frame 410A includes ground contact platforms 411A-413A, among others. These platforms are curved or otherwise formed to extend upward from a major side surface of the ground frame 410A. When the connector 10 is assembled, the top surfaces of the ground contact platforms 411A-413A contact the bottom surfaces of the ground conductors in the terminal block 210. For example, the top surfaces of the ground contact platforms 411A and 412A contact the bottom surfaces of the ground conductors 211 and 214, as also shown in FIG8 . In this manner, the ground conductors 211 and 214 are electrically connected to the ground frame 410A, and the ground frame 410A is assembled or integrated with the upper ground via block 400A as a component of the ground path assembly for the wafer assembly 200.

Similarly, the ground frame 410B includes ground contact platforms 411B-413B, etc. The ground contact platforms 411B-413B are curved or otherwise formed to extend upward from a major side surface of the ground frame 410B. When the connector 10 is assembled, the top surfaces of the ground contact platforms 411B-413B contact the bottom surfaces of the ground conductors in the terminal block 210. In this manner, the ground conductors in the terminal block 210 are connected to the ground frame 410B, and the ground frame 410B is assembled or integrated with the upper ground via block 400B as a ground path assembly for the wafer assembly 200. As shown in FIG17 , the grounding frames 510A and 510B further include grounding contact platforms 511A, 512A, 511B, and 512B that contact the grounding terminals in the terminal block 310.

As shown in FIG16 , ground frame 410A includes a plurality of curved tabs, including curved tab 414A. When connector 10 is assembled, curved tab 414A mechanically and electrically connects to connecting tabs of ground frame 460A using an interference fit. As an example shown in FIG16 , curved tab 414A mechanically and electrically connects to connecting tab 461A of ground frame 460A. Ground frame 510A is also mechanically and electrically connected to ground frame 560A, and ground frame 510B is also mechanically and electrically connected to ground frame 560B. As shown in FIG17 , ground frame 560B includes a plurality of eyelets, such as eyelets 561A, while ground frame 510B includes a plurality of ground pins, such as ground pins 514B. Ground pins 514B are inserted through eyelets 561A to mechanically and electrically connect the two ground frames 510B and 560B. In a similar manner, the two ground frames 510A and 510B are connected together. While FIG15 through FIG17 illustrate example ground frames and methods for connecting the ground frames to each other, other sizes, shapes, and styles of frames are possible. Ground frames can also be electrically connected to each other in other ways, utilizing mechanical interfaces and mounting arrangements.

The ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B, the sheet molded inserts 240, 250, 340, 350, and the upper ground vias 400A, 400B, the lower ground vias 450A, 450B, the upper ground vias 500A, 500B, and the lower ground vias 550A, 550B can be fastened together in various ways. Referring to FIG. 16 for an example, the ground frame 460B includes a mounting opening 620 at one end, while the ground frame 560B includes a mounting opening 622 at one end. For example, mounting posts or pins of the sheet molded inserts 250, 350 can be molded or inserted through the mounting openings 620, 622 to help secure the ground frame 460B, 560B to the sheet molded inserts 250, 350. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B includes one or more mounting openings, but other features can be used to position the ground frame within the connector 10. In some cases, the mounting openings can be omitted.

FIG18 illustrates a perspective view of the terminal leg 13 of the connector 10 shown in FIG1 . As shown, the lower ground channel blocks 450A, 450B, 550A, and 550B include grounding ribs. For example, the lower ground channel blocks 450A and 450B include grounding ribs 451A and 452A in the lower ground channel block 450A and grounding ribs 451B and 451B in the lower ground channel block 450B. The lower ground channel block 550A includes grounding ribs 551A and 552A, and the lower ground channel block 550B includes grounding ribs 551B and 552B, respectively. The ground ribs of the lower ground via blocks 450A, 450B, 550A, 550B can be plated with tin, gold, or another metal plating suitable for surface mounting using tin, cadmium, zinc, indium, or other types of solder.

Due to their large surface area, the ground ribs help electrically isolate the tail contacts, or ends, of the terminal conductors in the terminal blocks 210 and 310 that lead down to the PCB or other component to which the connector 10 is mounted at the terminal foot 13. For example, tail contacts 318T and 319T are located between ground ribs 551B and 552B, and ground ribs 551B and 552B help maintain electrical isolation between the signals on tail contacts 318T and 319T. Similarly, tail contacts 218T and 219T are located between ground ribs 451B and 452B, and ground ribs 451B and 452B help maintain electrical isolation between the signals on tail contacts 218T and 219T.

In some cases, the side profile of the grounding rib can be formed to track or coincide with the side profile of the tail contacts in terminal blocks 210 and 310. For example, as shown in Figure 19, the side profiles of grounding ribs 451B and 551B track the side profiles of tail contacts 219T and 319T along bottom edge lengths 630 and 631 of grounding rib 451B and 551B, respectively. Thus, when the terminal legs 13 of connector 10 are placed on the top surface of a PCB or other component for surface mounting, the bottom edge lengths 630 and 631 of grounding ribs 451B and 551B and the tail contacts 219T and 319T of terminal blocks 210 and 310 contact the PCB.

The grounding rib of connector 10 can include other features that facilitate surface mounting. For example, FIG. 20 shows a side view of grounding ribs 451F, 551F, providing an alternative example of a grounding rib. Grounding rib 451F includes flexures 641, 642, while grounding rib 551F includes flexures 643, 644. Flexures 641, 642 of grounding rib 451F are located at opposite ends of a bottom edge length 650 of grounding rib 451F, while flexures 643, 644 of grounding rib 551F are located at opposite ends of a bottom edge length 651 of grounding rib 551F. For example, flexures 641-644 provide an area for solder or other electrical connections to flow around and secure the bottom edge lengths 650, 651 of grounding ribs 451F, 551F.

FIG21 illustrates a partial view of another connector 20. Connector 20 is similar to connector 10 but includes metal ground ribs and a ground platform. In connector 20, each ground via block includes a ground rib and a platform frame. In FIG21 , lower ground via block 450E is similar to lower ground via block 450B in connector 10 described above. However, lower ground via block 450E includes ground ribs 451F-455F formed from metal rib inserts. Ground ribs 451F-455F can be formed (e.g., stamped, sheared, or otherwise formed) from a metal or metal alloy such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases can be coated with one or more coating metals. A side view of ground rib 455F is shown in FIG22 .

Grounding ribs 451F-455F are not integrally formed with lower ground via block 450E, as grounding ribs 451B and 452B are. Instead, grounding ribs 451F-455F are assembled around the laminated molded insert 250E and lower ground via block 450E. The laminated molded insert 250E includes a plurality of receiving channels, such as receiving channel 251E. Grounding rib 455F includes a rib 670 (see FIG. 22 ) that fits into a lower lip in receiving channel 251E to create an interference fit between the grounding rib 455F and the laminated molded insert 250E. The lower grounding channel block 450E also includes a channel or slot, into which a rib 680 (see FIG. 22 ) of the grounding rib 455F slides to help secure the grounding rib 455F in place. In a similar manner, the other grounding ribs 451F-454F are also secured to the sheet mold insert 250E and the lower grounding channel block 450E.

The example shown in FIG21 also includes a ground platform frame 640. At least one major surface of the ground platform frame 640 extends in a plane parallel to the major surfaces of the ground ribs 451F-455F. For reference, a major surface of the ground platform frame 640 is indicated by shading in FIG21, while a major surface of the ground rib 455F is indicated by shading in FIG22. The ground platform frame 640 includes a plurality of openings 690-693 (see FIG23) and a contact bar 649 (see FIG23) that spans the ground ribs 451F-455F and extends over the tail contacts of the signal conductors, as shown in FIG21. The ground platform frame 640 can be formed from a metal or metal alloy such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases can be plated with one or more plating metals.

FIG22 shows a side view of the ground rib 455F, while FIG23 shows a top view of the ground platform frame 640. The ground rib 455F includes a bottom edge length 660 for surface mounting. The bottom edge length 660 of the ground rib 455F can have other side profile shapes or patterns than shown, including angled edges. For example, the bottom edge length 660 can include a curved recess 661 that provides an area for solder to flow. In some cases, the bottom edge length 660 of the ground rib 455F can also have additional recesses similar to the example shown in FIG20.

Grounding rib 455F also includes a rib body 680. Rib body 680 can be inserted into a channel or slot in lower ground channel block 450E (see FIG. 21 ), with the abutting edge of rib body 680 contacting a rear surface in the channel or slot. Rib body 680 also extends into a channel 646 in ground platform frame 640 , as shown in FIG. 23 . The rib bodies of other grounding ribs can extend into other channels in ground platform frame 640 . For example, a rib body of grounding rib 454F can extend into channel 647 in ground platform frame 640 , and so on.

Ground rib 455F also includes a rib 670 that fits into the lower edge of the receiving channel 251E of the sheet mold insert 250E (see FIG. 21 ), creating an interference fit between the ground rib 455F and the sheet mold insert 250E. Furthermore, ground rib 455F includes a communicating channel 672. Referring to FIG. 22 and FIG. 23 , when the connector is assembled, an interlocking area 695 of the ground platform frame 640 inserts into the communicating channel 672 of the ground rib 455F. Similar interlocking areas of the ground platform frame 640 can be inserted into the communicating channels of the ground ribs 451F-454F. A communicating tooth 671 of the ground rib 455F rests against the leading edge 648 of the interlocking region 695 to electrically and mechanically secure the ground rib 455F to the ground platform frame 640. When the connector 20 is assembled, the signal conductors can extend downward through the openings 690-693 in the ground platform frame 640, with the communicating bar 649 extending across the ground ribs 451F-455F and over the tail contacts of the signal conductors, as shown in FIG21.

Terms such as "top," "bottom," "side," "front," "back," "right," and "left" are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to identify certain features in relation to one another, as the configuration of the structures described herein can vary. The terms "include," "comprising," "having," and the like are synonymous and are used in an open-ended manner and do not exclude additional elements, features, behaviors, operations, and the like. Furthermore, the term "or" is used in its inclusive sense, not its exclusive sense; thus, for example, when used to link a list of elements, the term "or" means one, some, or all of the elements in the list.

Unless otherwise specified, grouping language such as "at least one of X, Y, and Z" or "at least one of X, Z, or Y" is generally used to identify one, a combination of any two, or all three (or more if a larger group is identified), such as X and only X, Y and only Y, and Z and only Z, X and Y, the combination of X and Z, and the combination of Y and Z, and all of X, Y, and Z. Unless otherwise specified, such grouping language is generally not intended to identify or require the inclusion of at least one of X, at least one of Y, and at least one of Z. The terms "approximately" and "substantially," unless otherwise defined herein as relating to a specific range, percentage, or related measure of deviation, account for at least some manufacturing tolerances between the theoretical design and the manufactured product or component, such as those specified in the American Society of Mechanical Engineers (ASME®) Y14.5 and related International Standards Organization (ISO®) standards for geometric dimensioning and tolerancing. As one of ordinary skill in the art will understand, such manufacturing tolerances are also accounted for in connection with the use of theoretical terms, such as the geometric terms "perpendicular," "orthogonal," "vertex," "collinear," "coplanar," and others, even when the terms "approximately," "substantially," or related terms are not explicitly specified.

The above-described embodiments of the present invention are merely examples of implementations to provide a clear understanding of the principles of the present invention. Many variations and modifications may be made to the above-described embodiments without departing substantially from the spirit and principles of the present invention. In addition, components and features described with respect to one embodiment may be included in another embodiment. All such modifications and variations are intended to be included herein within the scope of the present invention.

10: Connector 12: Front port opening 13: Terminal foot 100: Base 110: Front port 120: Bottom mounting surface 122: Mounting post 124: Mounting post 210: Terminal block 211: Terminal conductor (also known as ground conductor) 220: Support bar 310: Terminal block 311: Terminal conductor (also known as ground conductor) 320: Support bar

Claims (20)

A connector comprises: a base; a wafer assembly comprising a terminal block and a wafer molded insert, the terminal block including a plurality of terminal conductors; a wafer assembly support strip comprising a terminal seating surface, a reference surface, and a molded interlocking feature; wherein: a terminal conductor of the plurality of terminal conductors is electrically connected to the terminal seating surface of the wafer assembly support strip; and the wafer molded insert extends into the molded interlocking feature of the wafer assembly support strip to secure the terminal block relative to the reference surface. The connector of claim 1, wherein: the wafer assembly support bar comprises metal; and the wafer molded insert comprises plastic. The connector of claim 1, wherein: the wafer assembly support strip comprises a first arm, a second arm, and an extension strip extending between the first arm and the second arm; and the first arm and the second arm define two sides of a front port opening of the connector. The connector of claim 3, wherein: the extension strip of the wafer assembly support strip includes the molded interlocking feature; and at least one of the first arm and the second arm includes the reference surface. The connector of claim 1, wherein: the plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors; the wafer assembly support strip includes a plurality of terminal mounting surfaces; and each of the plurality of ground conductors is electrically connected to a respective terminal mounting surface of the plurality of terminal mounting surfaces. The connector according to claim 5, wherein: the wafer assembly support strip further includes a terminal recess located between a pair of terminal mounting surfaces among the plurality of terminal mounting surfaces. The connector of claim 6, wherein a pair of the plurality of signal conductors extends through the terminal recess of the wafer assembly support strip and is surrounded by the wafer molded insert. The connector of claim 1 further comprises a ground path assembly, wherein: the ground path assembly comprises a ground channel block; the ground channel block comprises a plurality of channels; and a pair of signal conductors in the plurality of terminal conductors extends along one of the plurality of channels. The connector of claim 8, wherein the ground via block comprises a metal coating on a plastic body. The connector of claim 8, wherein: the ground channel block includes a plurality of ground ribs for surface mounting at a terminal leg of the connector; and the channel extends between a pair of ground ribs among the plurality of ground ribs at the terminal leg of the connector. The connector of claim 10, wherein the ground channel block includes a grounding strip extending between and electrically connected to the plurality of grounding ribs of the ground channel block. The connector of claim 10, wherein the plurality of ground ribs are integrally formed with the ground via block. The connector of claim 10, wherein: the ground via block comprises a metal coating on a plastic body; and the plurality of ground ribs are separate from the ground via block and formed of metal. The connector of claim 13, wherein: the ground path assembly further comprises a ground platform frame; and a major surface of the ground platform frame extends in a plane extending parallel to major surfaces of the plurality of ground ribs at a terminal foot of the connector. A connector comprises: a wafer assembly including a terminal block and a wafer molded insert; and a wafer assembly support strip including a molded interlocking feature, wherein the wafer molded insert extends into the molded interlocking feature of the wafer assembly support strip. The connector of claim 15, wherein: the wafer assembly support strip further includes a terminal mounting surface; and a ground conductor of the terminal block is electrically connected to the terminal mounting surface of the wafer assembly support strip. The connector of claim 15, wherein: the wafer assembly support bar comprises metal; the wafer molded insert comprises plastic; the wafer assembly support bar comprises a first arm, a second arm, and an extension bar extending between the first arm and the second arm; and the first arm and the second arm define two sides of a front port opening of the connector. The connector of claim 15 further comprises a ground path assembly, wherein: the ground path assembly comprises a ground channel block; the ground channel block comprises a channel; and the pair of signal conductors of the terminal block extend along the channel. The connector of claim 18, wherein: the ground channel block includes a plurality of ground ribs for surface mounting at a terminal leg of the connector; and the channel extends between a pair of ground ribs among the plurality of ground ribs at the terminal leg of the connector. The connector of claim 19, wherein the ground channel block includes a grounding strip extending between and electrically connected to the plurality of grounding ribs of the ground channel block.