TWI895695B - Circuit board and its manufacturing method, display module - Google Patents

Abstract

A circuit board comprises a core board and a first side board. The core board has multiple first connection pads arranged at intervals, defining a first center-to-center distance between adjacent first connection pads. The first side board covers the multiple first connection pads, and has multiple first openings formed therethrough. Each first opening includes a first end and a second end communicating with the first end. Each first connection pad is exposed at a first end, defining a second center-to-center distance between adjacent second ends, wherein the first center-to-center distance is greater than the second center-to-center distance. Multiple first conductors are disposed in the first openings, and one end of each first conductor is electrically connected to the corresponding first connection pad. The other end of each first conductor protrudes from the first opening away from the corresponding first connection pad to form a first connecting portion.

Description

Circuit board, manufacturing method thereof, and display module

This application relates to the field of display technology, and in particular to a circuit board, a manufacturing method thereof, and a display module.

A display module primarily consists of a circuit board (PCB), a display panel, and a driver chip mounted on the PCB. As display module miniaturization continues, the overall width of the display panel's or driver chip's fingers has gradually decreased. However, due to short-circuit avoidance, the corresponding PCB fingers cannot be made smaller. As a result, the display panel or driver chip's fingers do not align with those of the PCB. Consequently, conventional press-fit connections between the display panel and PCB, or between the driver chip and PCB, cannot be achieved using conductive adhesive.

In view of this, it is necessary to provide a circuit board to achieve electrical connection between the display panel or driver chip that does not correspond to the finger.

In addition, it is necessary to provide a circuit board manufacturing method.

In addition, it is necessary to provide a display module.

A method for manufacturing a circuit board comprises the following steps: providing a core board comprising a plurality of first connection pads spaced apart, defining a first center-to-center distance between adjacent first connection pads; disposing a first side panel on one side of the core board, the first side panel covering the plurality of first connection pads; providing a plurality of first openings through the first side panel, each first opening having a first end and a second end connected to the first end, each first connection pad exposed at one of the first ends, defining a second center-to-center distance between adjacent second ends, the first center-to-center distance being greater than the second center-to-center distance; and disposing a first conductor in the first opening, one end of the first conductor electrically connected to the first connection pad, and an end of the first conductor facing away from the first connection pad extending out of the first opening to form a first connection portion, thereby obtaining the circuit board.

Furthermore, the step of "disposing a first side panel on one side of the core panel" includes: disposing a first adhesive layer on one side of the core panel, wherein the first adhesive layer covers the plurality of first connection pads; and disposing a first circuit substrate on the first adhesive layer, wherein the first circuit substrate and the first adhesive layer form the first side panel.

Furthermore, the core plate further includes a plurality of second connecting pads arranged at intervals, and before the step of "arranging a plurality of first openings through the first side plate", the step further includes: arranging a second side plate on the other side of the core plate, the second side plate covering a plurality of the second connecting pads, defining a third center distance between two adjacent second connecting pads; after the step of "arranging a plurality of first openings through the first side plate", the step further includes: arranging a second opening through the second side plate, each of the second openings The second opening has a third end and a fourth end connected to the third end. Each second connection pad is exposed at one of the third ends. A fourth center-to-center distance is defined between two adjacent fourth ends, and the third center-to-center distance is greater than the fourth center-to-center distance. A second conductor is disposed in the second opening. One end of the second conductor is electrically connected to the second connection pad, and an end of the second conductor facing away from the second connection pad extends out of the second opening to form a second connection portion.

Furthermore, the step of "arranging the second side panel on the other side of the core panel" includes: disposing a second adhesive layer on the other side of the core panel, the second adhesive layer having through holes formed therethrough, the through holes being arranged corresponding to the plurality of first connection pads; disposing a second circuit substrate on the second adhesive layer, and removing a portion of the second circuit substrate corresponding to the through holes, so that the other portion of the second circuit substrate and the second adhesive layer form the second side panel.

Furthermore, the method further includes the following steps: Providing a first covering film on a side of the first side panel facing away from the core panel, the first covering film having a first window formed therethrough, with the second end exposed at the first window; and providing a second covering film on a side of the second side panel facing away from the core panel, the second covering film having a second window and a third window formed therethrough, a plurality of the first connecting pads being provided corresponding to the second window, with the fourth end exposed at the third window.

A circuit board comprises: a core board, one side of the core board including a plurality of first connection pads spaced apart, defining a first center distance between two adjacent first connection pads; and a first side board covering the plurality of first connection pads. The first side board has a plurality of first openings formed therethrough, each of the first openings having a first end and a second end connected to the first end. Each first connection pad is exposed at one of the first ends, defining a second center distance between two adjacent second ends, wherein the first center distance is greater than the second center distance.

A plurality of first conductors are provided, one end of each first conductor being disposed within the first opening and connected to the first connection pad, and the other end of each first conductor protruding from the second end. Furthermore, the other side of the core board further includes a plurality of spaced second connection pads. The circuit board further includes a second side plate disposed on the plurality of second connection pads. The second side plate has a second opening extending therethrough. Each second opening has a third end and a fourth end connected to the third end, defining a third center-to-center distance between two adjacent second connection pads. Each second connection pad is exposed beyond one of the third ends, defining a fourth center-to-center distance between two adjacent fourth ends. The third center-to-center distance is greater than the fourth center-to-center distance.

Multiple second conductors, one end of each second conductor is disposed in the second opening and connected to the second connection pad, and the other end of each second conductor protrudes from the fourth end; further, the first side plate is electrically connected to the core plate, and the second side plate is electrically connected to the core plate.

A display module includes a circuit board, the circuit board including a core board and a first side board disposed on one side of the core board. The side of the core board includes a plurality of first connection pads spaced apart, defining a first center distance between two adjacent first connection pads. The first side board covers the plurality of first connection pads. The first side board has a plurality of first openings formed therethrough, each of the first openings having a first end and a second end connected to the first end. Each of the first connection pads is exposed at one of the first ends, defining a first center distance between two adjacent first connection pads. The second ends of the first and second side panels have a second center-to-center distance therebetween, and the first center-to-center distance is greater than the second center-to-center distance; a display panel disposed on the first side panel, the display panel including a plurality of connection terminals disposed corresponding to the second ends; a plurality of first conductors, one end of each first conductor disposed in the first opening and connected to the first connection pad, and the other end of each first conductor connected to the connection terminal; a display driver chip connected to the core board, the driver chip being used to drive the display panel.

Furthermore, the other side of the core board further includes a plurality of spaced second connection pads. The circuit board further includes a second sideboard disposed on the plurality of second connection pads. The second sideboard has a second opening formed therethrough. Each second opening has a third end and a fourth end connected to the third end. A third center-to-center distance is defined between two adjacent second connection pads. Each second connection pad is exposed at one of the third ends. A fourth center-to-center distance is defined between two adjacent fourth ends. The third center-to-center distance is greater than the fourth center-to-center distance. The display driver chip is disposed on the second sideboard. The display module further includes a plurality of second conductors. One end of each second conductor is disposed in the second opening and connected to the second connection pad, and the other end of each second conductor is connected to the display driver chip.

The circuit board manufacturing method provided in this application facilitates corresponding connection of the first connection pads to the display panel by obliquely disposing the first conductor on the first side panel and making the spacing between the first connection portions of the first conductor closer than the first connection pads.

100: Circuit board

101: District 1

102: District 2

10: Double-sided copper-clad substrate

11: First insulating layer

12: First copper foil layer

121: First inner circuit layer

122: First connection pad

13: Second copper foil layer

131: Second inner wiring layer

132: Second connection pad

14: Core board

20: First side panel

201: First adhesive layer

202: Second adhesive layer

203: Through hole

21: Second side panel

22: First circuit substrate

221: Second insulation layer

222: First outer circuit layer

23: Second circuit substrate

231: The third insulating layer

232: Second outer circuit layer

24: First opening

241: First conductive body

25: Second opening

251: Second conductive body

30: First opening

301: First End

302: Second End

31: Second opening

311: The Third End

312: The Fourth End

40: First covering film

401: First window

402: First adhesive layer

403: First covering layer

41: Second covering film

411: Second Window

412: Third Window

413: Second covering layer

414: Second adhesive layer

50: First conductive intermediate

51: First connection part

52: Second conductive intermediate

53: Second connection part

60: Display Panel

61: First connection end

70: Display driver chip

71: Second connection port

80: First package

81: Second package

200: Display module

A: Thickness direction

S1: First center distance

S2: Second center distance

S3: Third center distance

S4: Fourth center distance

Figure 1 is a schematic cross-sectional view of a double-sided copper-clad substrate provided in one embodiment of this application.

Figure 2 is a schematic cross-sectional view of etching the double-sided copper-clad substrate shown in Figure 1 to form a core substrate.

Figure 3 is a schematic cross-sectional view of the core plate shown in Figure 2 after a first side plate is installed on one side.

Figure 4 is a schematic cross-sectional view of the first side panel shown in Figure 3 after the first opening is provided therethrough.

Figure 5 is a schematic cross-sectional view of the first side panel shown in Figure 4 after the first covering film is provided.

Figure 6 is a schematic cross-sectional view of a first conductor disposed within the first opening shown in Figure 5.

Figure 7 is a schematic cross-sectional view of a display module provided in accordance with an embodiment of this application.

The following will describe the technical solutions in the embodiments of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them.

It should be noted that when an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be a central element at the same time.

Referring to Figures 1 to 5, this application provides a method for manufacturing a circuit board 100, comprising the following steps:

S1: Referring to Figure 1 , a double-sided copper-clad substrate 10 is provided. The double-sided copper-clad substrate 10 includes a first insulating layer 11, a first copper foil layer 12, and a second copper foil layer 13. The first copper foil layer 12 and the second copper foil layer 13 are disposed on opposite sides of the first insulating layer 11. Specifically, the double-sided copper-clad substrate 10 has a thickness direction A. Perpendicular to the thickness direction A, the double-sided copper-clad substrate 10 is divided into a first region 101 and a second region 102 excluding the first region 101.

In this embodiment, the material of the first insulating layer 11 is polyimide (PI). It is understood that in other embodiments of the present application, the material of the first insulating layer 11 may also be a thermally conductive insulating material such as thermoplastic polyimide (TPI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), or polyvinyl chloride polymer (PVC).

S2: Referring to FIG. 2 , the first copper foil layer 12 is etched to form a first inner wiring layer 121. The first inner wiring layer 121 has a plurality of first connection pads 122 spaced apart within the first region 101. The first connection pads 122 can be used to connect to other components (e.g., a finger of the display panel 60). Furthermore, the second copper foil layer 13 is etched to form a second inner wiring layer 131. The second inner wiring layer 131 has a plurality of second connection pads 132 spaced apart within the second region 102. The second connection pads 132 can be used to connect to other components (e.g., a finger of the display driver chip 70), thereby obtaining a core board 14. Multiple first connecting pads 122 are arranged side by side in the first area 101, and multiple second connecting pads 132 are arranged side by side in the second area 102. A first center distance S1 is defined between two adjacent first connecting pads 122, and a third center distance S3 is defined between two adjacent second connecting pads 132. The first center distance S1 is the distance between the centers of the two adjacent first connecting pads 122, and the third center distance S3 is the distance between the centers of the two adjacent second connecting pads 132.

S3: Referring to Figures 3 and 4, a first side plate 20 is disposed on the first inner circuit layer 121, and the first side plate 20 covers the plurality of first connection pads 122. A second side plate 21 is disposed on the second inner circuit layer 131, and the second side plate 21 covers the plurality of second connection pads 132.

In this embodiment, please refer to Figure 3, step S3 specifically includes:

S31: Disposing a first adhesive layer 201 on the first inner circuit layer 121, wherein the first adhesive layer 201 covers the plurality of first connection pads 122; and disposing a second adhesive layer 202 on the second inner circuit layer 131, wherein the second adhesive layer 202 is provided with through holes 203 extending therethrough, wherein the through holes 203 are provided corresponding to the first areas 101.

S32: Disposing a first circuit substrate 22 on the first adhesive layer 201. The first circuit substrate 22 includes a second insulating layer 221 and a first outer circuit layer 222. The second insulating layer 221 is disposed between the first outer circuit layer 222 and the first adhesive layer 201. The first circuit substrate 22 and the first adhesive layer 201 form the first side panel 20. Furthermore, disposing a second circuit substrate 23 on the second adhesive layer 202. The second circuit substrate 23 includes a third insulating layer 231 and a second outer circuit layer 232. The third insulating layer 231 is disposed between the second outer circuit layer 232 and the second adhesive layer 202.

S33: Penetrate the first circuit substrate 22 and the first adhesive layer 201 to form a first opening 24, with a portion of the first inner circuit layer 121 exposed through the first opening 24, and the first opening 24 is staggered with the first area 101; and penetrate the second circuit substrate 23 and the second adhesive layer 202 to form a second opening 25, with a portion of the second inner circuit layer 131 exposed through the second opening 25, and the second opening 25 is staggered with the first area 101.

S34: Electroplating is performed within the first opening 24 to form a first conductive member 241, electrically connecting the first inner wiring layer 121 and the first outer wiring layer 222. Electroplating is also performed within the second opening 25 to form a second conductive member 251, electrically connecting the second inner wiring layer 131 and the second outer wiring layer 232. This achieves electrical connectivity between the first and second circuit substrates 22, 23, and the core substrate 14. It is understood that in other embodiments of the present application, the first and/or second conductive members 241, 251 may be formed by electroless copper deposition.

S4: Referring to FIG. 4 , a plurality of first openings 30 are formed through the portion of the first side panel 20 corresponding to the first region 101. Each first opening 30 includes a first end 301 and a second end 302 connected to the first end 301. Each first connection pad 122 is exposed at one of the first ends 301. Furthermore, a portion of the second circuit substrate 23 corresponding to the first region 101 is removed (i.e., the portion of the second circuit substrate 23 corresponding to the through-hole 203 is removed). Another portion of the second circuit substrate 23 and the second adhesive layer 202 are formed to form the second side panel 21. Furthermore, a plurality of second openings 31 are formed through the portion of the second side panel 21 corresponding to the second region 102. Each second opening 31 includes a third end 311 and a fourth end 312 connected to the third end 311. Each second connection pad 132 is exposed at one of the third ends 311. A second center distance S2 is defined between two adjacent second ends 302, and a fourth center distance S4 is defined between two adjacent fourth ends 312. The second center distance S2 is the distance between the centers of the two adjacent second ends 302, and the fourth center distance S4 is the distance between the centers of the two adjacent fourth ends 312. The first center distance S1 is greater than the second center distance S2, and the third center distance S3 is greater than the fourth center distance S4.

That is, along the thickness direction A, at least a portion of the first openings 30 or at least a portion of the second openings 31 are arranged at an angle. This facilitates the corresponding connection between a plurality of first connection pads 122 with larger spacing and a plurality of connection terminals with smaller spacing (e.g., the fingers of the display panel 60), and facilitates the corresponding connection between a plurality of second connection pads 132 with larger spacing and a plurality of connection terminals with smaller spacing (e.g., the fingers of the display driver chip 70).

In this embodiment, the operations of removing a portion of the second circuit substrate 23, drilling the first opening 30, and drilling the second opening 31 are all performed by laser drilling. It is understood that in other embodiments of this application, these operations may also be performed by mechanical drilling.

S5: Referring to Figure 5 , a first cover film 40 is disposed on the side of the first side panel 20 facing away from the core panel 14 (i.e., the first outer circuit layer 222). A first window 401 is formed through the first cover film 40, with the second end 302 exposed through the first window 401. A second cover film 41 is disposed on the side of the second side panel 21 facing away from the core panel 14 (i.e., the second outer circuit layer 232). A second cover film 41 is formed through the second cover film 41, with a second window 411 and a third window 412 formed through the second cover film 41. The second window 411 is disposed corresponding to the first region 101, and the plurality of fourth ends 312 are exposed through the third window 412, thereby obtaining the circuit board 100. Part of the first covering film 40 extends toward the first window 401, thereby covering a portion of the first side panel 20. This portion of the first side panel 20 is not used to accommodate other components (e.g., the display panel 60). The first covering film 40 includes a first adhesive layer 402 and a first covering layer 403. The first adhesive layer 402 is disposed between the first covering layer 403 and the first external circuit layer 222. Part of the second covering film 41 extends toward the second window 411, thereby covering a portion of the core board 14 within the first area 101, thereby facilitating protection of the side surface of the second side panel 21. The second cover film 41 includes a second cover layer 413 and a second adhesive layer 414. The second adhesive layer 414 is disposed between the second cover layer 413 and the second external circuit layer 232.

S6: Referring to Figures 6 and 7, conductive paste is applied to the first opening 30 and baked to solidify the paste, forming a first conductor 54. The first conductor 54 is electrically connected to the first connection pad 122, and one end of the first conductor 54 facing away from the first connection pad 122 extends out of the first opening 30 to form a first connection portion 51. Similarly, conductive paste is applied to the second opening 31 and baked to solidify the paste, forming a second conductor 55. The second conductor 55 is electrically connected to the second connection pad 132, and the second conductor 55 extends out of the second opening 31 to form a second connection portion 53.

Compared to conventional techniques, the circuit board 100 manufacturing method provided in this application has the following advantages:

(1) By slanting the first conductor 54 on the first side panel 20 and spacing the first connection portions 51 of the first conductor 54 closer together than the first connection pads 122, it is easier to connect the first connection pads 122 to the display panel 60, making it more suitable for smaller display panels 60.

(2) By slanting the second conductor 55 on the second side panel 21 and spacing the second connection portions 53 of the second conductor 55 closer together than the second connection pads 132, it is easier to connect the second connection pads 132 to the display driver chip 70, making it more suitable for smaller display driver chips 70.

(3) By providing a through hole 203 on the second side panel 21, the first region 101 of the core board 14 is exposed, thereby facilitating bending of the exposed first region 101, thereby expanding the application areas of the circuit board 100 or a display device using the circuit board 100, such as the field of curved displays.

Referring to Figure 6 , one embodiment of the present application further provides a circuit board 100 comprising a core board 14 and a first sideboard 20 disposed on one side of the core board 14. One side of the core board 14 includes a plurality of spaced-apart first connection pads 122, defining a first center-to-center distance S1 between adjacent first connection pads 122. The first sideboard 20 covers the plurality of first connection pads 122. A plurality of first openings 30 are formed through the first sideboard 20. Each first opening 30 has a first end 301 and a second end 302 connected to the first end 301. Each first connection pad 122 is exposed at one of the first ends 301, defining a second center-to-center distance S2 between adjacent second ends 302. The first center-to-center distance S1 is greater than the second center-to-center distance S2. A plurality of first conductors 54 are disposed in the first opening 30 and electrically connected to the first connection pad 122. One end of the first conductor 54 facing away from the first connection pad 122 extends out of the first opening 30 to form a first connection portion 51.

Please continue to refer to Figure 6. In this embodiment, the other side of the core board 14 further includes a plurality of second connection pads 132 arranged at intervals. The circuit board 100 further includes a second side panel 21 arranged on the plurality of second connection pads 132. The second side panel 21 is penetrated by a second opening 31. Each of the second openings 31 has a third end 311 and a fourth end 312 connected to the third end 311, defining a third center distance S3 between two adjacent second connection pads 132. Each of the second connection pads 132 is exposed at one of the third ends 311, defining a fourth center distance S4 between two adjacent fourth ends 312. The third center distance S3 is greater than the fourth center distance S4. A plurality of second conductors 55 are disposed in the second opening 31 and electrically connected to the second connection pad 132. One end of the second conductor 55 facing away from the second connection pad 132 extends out of the second opening 31 to form a second connection portion 53.

Please refer to Figure 7. This application also provides a method for manufacturing a display module, including the following steps:

S7: Referring to Figure 7 , a display panel 60 is disposed within the first opening 401 . The display panel 60 includes a plurality of first connection terminals 61 . Each first connection terminal 61 is connected to a corresponding first connection portion 51 , thereby achieving electrical conduction between the display panel 60 and the first connection pad 122 . Similarly, a display driver chip 70 is disposed within the third opening 412 . The display driver chip 70 includes a plurality of second connection terminals 71 . Each second connection terminal 71 is connected to a corresponding second connection portion 53 , thereby achieving electrical conduction between the driver chip and the second connection pad 132 .

S8: Continuing with Figure 7, a first package 80 is disposed in the gap between the display panel 60 and the first side panel 20. The first package 80 can be used to stabilize the connection between the display panel 60 and the first side panel 20. A second package 81 is disposed in the gap between the display driver chip 70 and the second side panel 21. The second package 81 can be used to stabilize the connection between the display driver chip 70 and the second side panel 21, thereby obtaining the display module 200.

6 and 7 , an embodiment of the present application further provides a display module 200 , which includes a circuit board 100 , a display panel 60 , a plurality of first conductors 54 , and a display driver chip 70 . The circuit board 100 includes a core board 14 and a first side board 20 arranged on one side of the core board 14. One side of the core board 14 includes a plurality of first connection pads 122 arranged at intervals, defining a first center distance S1 between two adjacent first connection pads 122. The first side board 20 covers the plurality of first connection pads 122. The first side board 20 is penetrated by a plurality of first openings 30. Each of the first openings 30 has a first end 301 and a second end 302 connected to the first end 301. Each of the first connection pads 122 is exposed at one of the first ends 301, defining a second center distance S2 between two adjacent second ends 302. The first center distance S1 is greater than the second center distance S2. The display panel 60 is mounted on the first side panel 20 and includes a plurality of first connection terminals 61 corresponding to the second terminals 302. One end of the first conductor 54 is positioned within the first opening 30 and connected to the first connection pad 122. The other end of the first conductor 54 extends out of the first opening 30 and connects to the first connection terminal 61. The display driver chip 70 is connected to the core board 14 and is used to drive the display panel 60.

6 and 7 , in this embodiment, the other side of the core board 14 further includes a plurality of second connection pads 132 disposed at intervals. The circuit board 100 further includes a second side board 21 disposed on the plurality of second connection pads 132 . The second side panel 21 is provided with second openings 31 extending through it. Each second opening 31 has a third end 311 and a fourth end 312 connected to the third end 311. A third center-to-center distance S3 is defined between two adjacent second connection pads 132. Each second connection pad 132 is exposed at one of the third ends 311. A fourth center-to-center distance S4 is defined between two adjacent fourth ends 312. The third center-to-center distance S3 is greater than the fourth center-to-center distance S4. The display driver chip 70 is disposed on the second side panel 21. The display module further includes a plurality of second conductors 55. One end of each second conductor 55 is disposed within the second opening 31 and connected to the second connection pad 132. The other end of each second conductor 55 extends out of the second opening 31 and is connected to the display driver chip 70.

Those skilled in the art should recognize that the above embodiments are intended only to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

100: Circuit board 101: First area 411: Second window 122: First connection pad S1: First center distance 30: First opening 301: First end 302: Second end S2: Second center distance 401: First window 241: First conductive element 102: Second area S3: Third center distance 132: Second connection pad 40: First cover film 402: First adhesive layer 403: First cover layer 222: First external circuit layer 20: First side panel 14: Core board 21: Second side panel 232: Second external circuit layer 41: Second cover film 413: Second cover layer 414: Second adhesive layer 31: Second opening S4: Fourth center distance 312: Fourth end 311: Third end 251: Second conductive element

Claims (10)

A method for manufacturing a circuit board comprises the following steps: Providing a core board, the core board including a plurality of first connection pads spaced apart, defining a first center-to-center distance between adjacent first connection pads; Disposing a first side panel on one side of the core board, the first side panel covering the plurality of first connection pads; Disposing a plurality of first openings through the first side panel, each first opening having a first end and a second end connected to the first end, each first connection pad exposed at one of the first ends, defining a second center-to-center distance between adjacent second ends, the first center-to-center distance being greater than the second center-to-center distance; Disposing a first conductor in the first opening, one end of the first conductor electrically connected to the first connection pad, and an end of the first conductor facing away from the first connection pad extending out of the first opening to form a first connection portion, thereby obtaining the circuit board. The manufacturing method of claim 1, wherein the step of "disposing a first side panel on one side of the core panel" includes: disposing a first adhesive layer on one side of the core panel, the first adhesive layer covering the plurality of first connection pads; and disposing a first circuit substrate on the first adhesive layer, the first circuit substrate and the first adhesive layer forming the first side panel. The manufacturing method of claim 1, wherein the core plate further includes a plurality of spaced-apart second connecting pads, and before the step of "providing a plurality of first openings through the first side plate," the method further includes: Providing a second side plate on the other side of the core plate, the second side plate covering the plurality of second connecting pads, and defining a third center-to-center distance between adjacent second connecting pads; After the step of "forming a plurality of first openings through the first side panel," the method further includes: forming second openings through the second side panel, each second opening having a third end and a fourth end connected to the third end, each second connection pad being exposed at one of the third ends, defining a fourth center-to-center distance between two adjacent fourth ends, the third center-to-center distance being greater than the fourth center-to-center distance, and providing a second conductor in the second opening, one end of the second conductor being electrically connected to the second connection pad, and an end of the second conductor facing away from the second connection pad extending out of the second opening to form a second connection portion. The manufacturing method of claim 3, wherein the step of "disposing the second side panel on the other side of the core panel" includes: disposing a second adhesive layer on the other side of the core panel, the second adhesive layer having through-holes formed therethrough, the through-holes being provided corresponding to the plurality of first connection pads; disposing a second circuit substrate on the second adhesive layer; and removing the portion of the second circuit substrate corresponding to the through-holes, thereby forming the second side panel with the remaining portion of the second circuit substrate and the second adhesive layer. The manufacturing method of claim 3 further comprises the steps of: disposing a first covering film on a side of the first side panel facing away from the core panel, the first covering film having a first window formed therethrough, the second end being exposed at the first window; and disposing a second covering film on a side of the second side panel facing away from the core panel, the second covering film having a second window and a third window formed therethrough, a plurality of the first connecting pads being provided corresponding to the second window, the fourth end being exposed at the third window. A circuit board comprises: a core board, one side of the core board including a plurality of first connection pads spaced apart, defining a first center-to-center distance between adjacent first connection pads; a first side board covering the plurality of first connection pads, the first side board having a plurality of first openings extending through the first side board, each first opening having a first end and a second end connected to the first end, each first connection pad exposed at one of the first ends, defining a second center-to-center distance between adjacent second ends, the first center-to-center distance being greater than the second center-to-center distance; a plurality of first conductors disposed in the first openings, one end of the first conductors electrically connected to the first connection pads, and an end of the first conductor facing away from the first connection pads extending out of the first openings to form a first connection portion. The circuit board of claim 6, wherein the other side of the core board further includes a plurality of spaced-apart second connection pads, and the circuit board further includes a second side plate disposed on the plurality of second connection pads, the second side plate having a second opening extending therethrough, each second opening having a third end and a fourth end connected to the third end, defining a third center-to-center distance between two adjacent second connection pads, each second connection pad being exposed at one of the third ends, defining a fourth center-to-center distance between two adjacent fourth ends, the third center-to-center distance being greater than the fourth center-to-center distance; A plurality of second conductors are disposed in the second openings, the second conductors being electrically connected to the second connection pads, and an end of the second conductor facing away from the second connection pad extending out of the second opening to form a second connection portion. A circuit board as described in claim 7, wherein the first side board is electrically connected to the core board, and the second side board is electrically connected to the core board. A display module comprises: a circuit board comprising a core board and a first side panel disposed on one side of the core board, the side of the core board comprising a plurality of spaced-apart first connection pads defining a first center-to-center distance between adjacent pairs of the first connection pads, the first side panel covering the plurality of first connection pads, the first side panel having a plurality of first openings extending through the first side panel, each of the first openings having a first end and a second end connected to the first end, each of the first connection pads being exposed at one of the first ends, defining a second center-to-center distance between adjacent pairs of the second ends, the first center-to-center distance being greater than the second center-to-center distance; a display panel disposed on the first side panel, the display panel comprising a plurality of connection terminals disposed corresponding to the second ends; A plurality of first conductors, one end of each first conductor being disposed within the first opening and connected to the first connection pad, and the other end of each first conductor extending out of the first opening and connected to the connection end; A display driver chip, connected to the core board and configured to drive the display panel. A display module as described in claim 9, wherein the other side of the core board further includes a plurality of second connection pads arranged at intervals, the circuit board further includes a second side panel arranged on the plurality of second connection pads, the second side panel is penetrated by a second opening, each of the second openings has a third end and a fourth end connected to the third end, defining a third center distance between two adjacent second connection pads, each second connection pad is exposed at one of the third ends, defining a fourth center distance between two adjacent fourth ends, the third center distance being greater than the fourth center distance, the display driver chip is arranged on the second side panel, and the display module further includes a plurality of second conductors, one end of the second conductor is arranged in the second opening and connected to the second connection pad, and the other end of the second conductor extends out of the second opening and connected to the display driver chip.