TWI894711B - Substrate processing device, and method for rearranging support pins - Google Patents

Abstract

In the substrate processing apparatus, substrate processing system, and support pin replacement method for the same, multiple support pins are detachably mounted on the top surface of a first plate. The first plate is detachably coupled to a second plate within a chamber using magnetic force. The support pin replacement is accomplished by lifting the first plate upward to release the coupling with the second plate. The first plate is then removed from the chamber, and the configuration of the support pins mounted on the first plate is changed outside the chamber. The first plate is then returned to the chamber and coupled to the second plate. This allows for excellent workability and replacement of the support pins.

Description

Substrate processing device and support pin configuration replacement method

The present invention relates to a substrate processing apparatus and system in which a plurality of support pins are arranged within a chamber with a depressurized interior space. The support pins are used to support substrates while performing predetermined processing, as well as methods for replacing the support pins. Substrates processed include, for example, semiconductor substrates, photomask substrates, liquid crystal display substrates, organic EL display substrates, plasma display substrates, field emission display (FED) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical substrates.

One example of a treatment performed on a substrate involves placing the substrate in a chamber and reducing the pressure within the chamber. For example, a known reduced-pressure drying process involves placing the substrate in a reduced-pressure environment to volatilize the liquid components in the coating, thereby drying the coating formed on the substrate surface. For example, Japanese Patent Publication No. 2022-086766 (Patent Document 1) describes a reduced-pressure drying apparatus that supports a glass substrate with a coating formed on its surface in a horizontal position within a chamber and dries the coating by reducing the pressure within the chamber.

In this device, the stage supporting the substrate within the chamber consists of multiple support plates arranged horizontally. Multiple support pins are vertically mounted on the top surface of each support plate. This supports the substrate in a horizontal position, positioned upward from the support plates. When the chamber is depressurized, exhaust gas flows through the bottom surface of the substrate or the gaps between the support plates, promoting uniform drying of the coated film.

In this type of device, support pins support the substrate by contacting a tiny area on the bottom surface. Consequently, differences in processing quality inevitably occur between the areas of the substrate where the support pins abut and those elsewhere. In the prior art, by contacting the support pins with the edges of the substrate, areas not used for circuitry, this uneven processing can be prevented from affecting the performance of the final device.

In other words, support pins must be positioned so that they contact areas not used for components. Therefore, the support pin configuration will naturally vary depending on the specifications of the substrates being processed, and the support pin configuration will need to be replaced in the equipment that receives them. Especially as substrates become larger, the number of support pins required to support them increases, significantly increasing the workload.

However, Patent Document 1 does not mention a method for replacing the support pins or a structural design that would improve their operability. Therefore, it is desirable to establish a technology that can efficiently and effectively replace the support pins.

The present invention was developed in response to the aforementioned challenges. Its purpose is to provide a technology that enables the placement and replacement of support pins with excellent workability in a substrate processing apparatus that supports a substrate within a chamber using multiple support pins.

One aspect of the present invention is a substrate processing apparatus comprising: a chamber having a depressurized interior space capable of accommodating a substrate; a first plate disposed within the interior space, having a plurality of support pins detachably mounted on its upper surface for supporting the substrate; a second plate abutting against the lower surface of the first plate within the interior space to support the first plate; and a coupling portion detachably coupling the first and second plates via magnetic force.

In this invention, the first and second plates are magnetically bonded, and thus can be released by pulling them apart with a force exceeding the bonding force. For example, the first plate can be lifted and pulled away from the second plate, without the need for clamps or tools.

Furthermore, under reduced pressure, the first and second plates adhere closely to each other, forming a virtually unified structure. Therefore, they do not necessarily need to be mechanically firmly joined. Furthermore, since high mechanical strength is not required of the first plate, the first plate can be constructed relatively lightweight.

This makes it easy to transport the first plate, separated from the second plate, outside the chamber. It also makes it easy to replace the support pins on the first plate that has been moved out of the chamber. The replacement is then completed by returning the first plate, with the support pins replaced, to the chamber and returning it to its bonded position with the second plate. Thus, the present invention enables the replacement of support pins with excellent workability and efficiency.

In addition, one aspect of the present invention is a substrate processing system comprising: a substrate processing unit having the same structure as the substrate processing apparatus; a depressurization unit connected to the chamber to depressurize the internal space; and a transport unit disposed to the side of the chamber to at least one of transport the substrate into and out of the chamber. In the system, a plurality of combined bodies, each comprising a first plate and a second plate, are arranged horizontally within the internal space, spaced apart from each other. The transport unit is disposed relative to the chamber in a direction perpendicular to the arrangement of the combined bodies. Within the internal space, the substrate, having a coating film formed on its upper surface, is supported by a plurality of support pins. The depressurization unit depressurizes the internal space, thereby drying the coating film.

In this invention, the substrate processing unit has the same structure as the aforementioned substrate processing apparatus, making it easy to pull the first plate, equipped with support pins, out of the chamber. Furthermore, the transport unit is positioned relative to the chamber in a direction perpendicular to the arrangement of the first and second plate assemblies. Therefore, after removing the first plate from each assembly and replacing it, reinstallation can be performed by accessing the chamber from the side opposite to the transport unit, across the chamber.

Therefore, when performing layout changes, workers and their jigs and tools do not need to enter the space where the conveyor unit operates. This keeps the area around the conveyor unit, which serves as the substrate transport path, clean.

One aspect of the present invention is a method for replacing the arrangement of support pins in a chamber having an internal space capable of accommodating a substrate and having a plurality of support pins disposed therein for supporting the substrate. The plurality of support pins are pre-removably attached to the upper surface of a first plate, and the first plate is removably coupled to a second plate disposed within the internal space by magnetic force. The replacement method includes: lifting the first plate upward to release the coupling with the second plate; removing the first plate from the chamber; changing the arrangement of the support pins attached to the first plate outside the chamber; and returning the first plate to the chamber and coupling it to the second plate.

With this configuration, the support pins can be replaced efficiently and with excellent workability for the same reasons as described above. Specifically, the first plate is magnetically coupled to the second plate, allowing for easy release by lifting the first plate upward. Furthermore, the first plate is lightweight, making it easy to transport outside the chamber. Since the support pins can be replaced outside the chamber, workability is improved. Furthermore, returning the first plate to the chamber after replacement is also easy.

As described above, according to the present invention, the first plate, to which the support pins are attached, is magnetically coupled to the upper surface of the second plate. Therefore, the coupling with the second plate can be easily released by lifting the first plate upward. Furthermore, since high mechanical strength is not required of the first plate, the first plate can be constructed lightweight. Consequently, the support pins can be replaced efficiently and with excellent workability.

1: Coating device

2: Decompression drying equipment (substrate processing equipment, substrate processing unit)

3: Export storage device

4:Conveying device (conveying part)

10, 10A, 10B: Chambers

11: Bottom plate (base)

11A: Bottom plate

12, 12A: Hood

13: Sealing component

15: Chamber lift

16a, 16b, 16c, 16d: Exhaust vents

16f: Air supply port

20: Carrier

21: Support plate (combination)

21a, 21b, 21c, 21e, 21f: Support plates

22: Upper board (first board)

22a, 22b, 22c, 22d, 22e, 22f: upper plate

23: Lower board (second board)

23a: Lower plate ((+X) side end, (+X) side end)

23b: Lower plate ((-X) side end, (-X) side end)

23c, 23e, 23f: Lower plate

24: Support pin

25: Carrier lift (lifting mechanism)

26: Supporting components

27: Lifting components

30: Pressure reducing mechanism (pressure reducing unit)

31: Exhaust pipe

31a, 31b, 31c, 31d: Separate piping

31e: Main piping

32: Vacuum pump

41:Manipulator

60: Air supply mechanism

61: Air supply piping

80: Control Department

100: Substrate processing system

101, 102, 103: Block

221: concave part

231: Magnet (junction, permanent magnet)

232, 233: Incision

A: Location

Da: second distance (distance)

Db: First distance (distance)

H: Hands

S:Substrate

S101, S102, S103, S104, S105, S106: Steps

SP: Interior space

TS:Transportation space

Va, Vb, Vc, Vd: Valve

Vf: Air supply valve

X, Y, Z: Direction

FIG1 is a plan view showing an example of the structure of a substrate processing system according to one embodiment of the present invention.

Figure 2(a) is a longitudinal cross-sectional view of a reduced pressure drying apparatus as one embodiment of a substrate processing apparatus.

Figure 2(b) is a longitudinal sectional view showing a reduced pressure drying apparatus as one embodiment of a substrate processing apparatus.

Figure 3(a) shows the detailed structure of the carrier.

Figure 3(b) shows the detailed structure of the carrier.

Figure 4 (a) schematically shows the process of removing the upper plate from the support plate.

Figure 4(b) schematically illustrates the process of removing the upper plate from the support plate.

Figure 4(c) schematically illustrates the process of removing the upper plate from the support plate.

Figure 4(d) schematically shows the process of removing the upper plate from the support plate.

Figure 5(a) shows an example of a shape for facilitating removal of a plate.

Figure 5(b) shows an example of a shape for facilitating removal of the plate.

Figure 5(c) shows an example of a shape for facilitating removal of the plate.

Figure 6(a) shows an example of a shape for suppressing deflection of the upper plate.

Figure 6(b) shows an example of a shape for suppressing deflection of the upper plate.

Figure 6(c) shows an example of a shape for suppressing deflection of the upper plate.

Figure 7 is a flow chart showing the process of replacing the support pin configuration.

Figure 8(a) shows another example of the chamber structure.

Figure 8(b) shows another example of the chamber structure.

Figure 1 is a plan view illustrating an exemplary structure of a substrate processing system according to one embodiment of the present invention. The substrate processing system 100 is used to apply a coating liquid to the surface of a substrate, solidify the resulting coating layer through a reduced-pressure drying process, and then output the coating layer. For example, the substrate processing system 100 can be used in the manufacturing process of display panels such as organic electroluminescence (EL) displays to form functional layers such as hole injection layers, hole transport layers, or light-emitting layers on the substrate surface.

The substrate processing system 100 includes a coating apparatus 1 that forms a coating layer on the surface of a substrate; a decompression drying apparatus 2 that dries and solidifies the coating layer through a decompression drying process; an outlet stocker 3 that temporarily stores processed substrates; and a conveyor 4 that transports substrates between these apparatuses. The conveyor 4 includes a robot 41 that supports the substrates from below. As indicated by the dashed lines in Figure 1, the robot 41 moves in and out of the coating apparatus 1, decompression drying apparatus 2, and outlet stocker 3 as needed, thereby transferring substrates. The structure of this conveyor 4 is well known, so a detailed description is omitted.

For example, a rectangular glass substrate can be used as the substrate to be processed. Furthermore, in the manufacturing process of an organic EL display, for example, a coating liquid containing an organic material and a solvent to form a hole injection layer, a hole transport layer, or a light-emitting layer can be used. Furthermore, the substrate processing system 100 can also be used to form an anti-etching film on a substrate surface.

The types of substrate and coating layer are not limited to these and are arbitrary. The coating layer can be formed uniformly on the surface of the substrate, or a partially formed coating layer can have a predetermined pattern. When forming a uniform coating layer on the substrate, coating apparatus 1 can employ, for example, a spray coating apparatus or a slit nozzle coating apparatus. When forming a patterned coating layer, coating apparatus 1 can employ, for example, an inkjet printer. These coating apparatuses can employ known structures, and therefore detailed descriptions are omitted here.

To uniformly represent directions in the following description, an XYZ orthogonal coordinate system is established as shown in Figure 1. Here, the XY plane is a horizontal plane, and the Z direction is the vertical direction. More specifically, the (+Z) direction is the vertically upward direction. In a top view, the substrate processing system 100 is configured with the conveyor apparatus 4 at its center, and other devices are arranged around it. Specifically, the coating apparatus 1 is positioned adjacent to the (-Y) side of the conveyor apparatus 4, and the pressure reduction drying apparatus 2 is positioned adjacent to the (+X) side of the conveyor apparatus 4. Furthermore, the outlet stocker 3 is positioned adjacent to the (+Y) side of the conveyor apparatus 4.

Figures 2(a) and 2(b) are longitudinal cross-sectional views showing the structure of a reduced-pressure drying apparatus, one embodiment of the substrate processing apparatus of the present invention. The reduced-pressure drying apparatus 2 receives a rectangular substrate S, which has been pre-coated by a coating apparatus 1 and transported by a transport apparatus 4, and performs a reduced-pressure drying process on the substrate S. As shown in Figure 2(a), the reduced-pressure drying apparatus 2 includes a chamber 10, a stage 20, a decompression mechanism 30, and a control unit 80.

The chamber 10 is a pressure-resistant container with an internal space for accommodating substrates S. It is fixed to an apparatus frame (not shown). It has a flat, rectangular shape. It has a generally square bottom plate 11 and a box-shaped cover 12 with an open bottom surface. The cover 12 is coupled to a chamber elevator 15. The chamber elevator 15 operates in response to control commands from the control unit 80, raising and lowering the cover 12 between a blocked position (shown in Figure 2(a)) and a retracted position (shown in Figure 2(b)).

When the cover 12 is in the blocked position, it covers and blocks the space above the bottom plate 11, thereby forming the internal space SP of the chamber 10. A sealing member 13 is provided between the bottom plate 11 and the cover 12, thereby maintaining the internal space SP in an airtight state. In the retracted position, the cover 12 is significantly raised upward relative to the bottom plate 11, enabling operators to perform maintenance work inside the chamber.

Furthermore, when the transport unit 4 enters the chamber 10 to load or unload substrates S, the chamber elevator 15 also moves the hood 12 upward. In this case, a gap sufficient for the robot 41 of the transport unit 4 and the substrates S to pass through is sufficient, eliminating the need for the hood 12 to retreat significantly upward as shown in Figure 2(b). Furthermore, the lifting of the hood 12 for loading and unloading substrates S and for maintenance operations can be achieved using separate mechanisms.

The stage 20 is a support member for the substrate S within the chamber 10. The stage 20 includes multiple (four sets in this example) support plates 21. The multiple support plates 21 are arranged horizontally at intervals. Each support plate 21 includes an upper plate 22 and a lower plate 23, each having approximately the same planar dimensions. The upper plate 22 is a flat plate formed of a soft magnetic material, such as an iron plate. The lower plate 23 has a flat top surface and supports the upper plate 22 by contacting the lower surface of the upper plate 22.

Multiple support pins 24 are vertically mounted on the upper surface of the upper plate 22. These pins are removably attached to the upper plate 22. A substrate S is placed on top of the upper plates 22. The upper ends of the support pins 24 contact the lower surface of the substrate S, supporting the substrate S in a horizontal position. The support pins 24 are, for example, magnetic pins with permanent magnets mounted on their lower surfaces. Therefore, the support pins 24 are fixed to the upper surface of the upper plate 22 by magnetic force. Furthermore, the support pins 24 can be removed from the upper plate 22 by lifting them to overcome the magnetic attraction.

The multiple support plates 21 of the stage 20 are connected to the stage lift unit 25. Specifically, a downward-extending support member 26 is bonded to the lower surface of the lower plate 23 of each support plate 21. The lower end of the support member 26 is bonded to a lift member 27 supported by the stage lift unit 25 below the chamber 10 so that it can be raised and lowered. When the stage lift unit 25 is activated in response to control commands from the control unit 80, the lift member 27 rises and falls, and accordingly, each support plate 21 moves integrally in the Z direction.

The conveyor device 4 and the stage lift 25 work together to transfer substrates S between the robot 41 of the conveyor device 4 and the stage 20. Transferring the substrate S from the robot 41 to the stage 20 occurs as follows. With the stage 20 lowered, the robot 41, supporting the substrate S, enters the internal space SP. At this point, the robot 41 passes through the gaps between the support plates 21, preventing interference between the robot 41 and the support plates 21. As the stage 20 rises, the support pins 24 on the upper plate 22 come into contact with the bottom surface of the substrate S, transferring the substrate S from the robot 41 to the stage 20.

Meanwhile, the transfer of the substrate S from the stage 20 to the robot 41 is performed as follows. While the stage 20, which supports the substrate S, is raised, the robot 41 enters through the gap between the support plates 21. As the stage 20 descends, the substrate S's support body moves from the support pins 24 to the robot 41, thereby transferring the substrate S from the stage 20 to the robot 41.

A pressure relief mechanism 30 is connected to the chamber 10. This mechanism reduces the pressure within the chamber 10 by drawing gas from its interior. As shown in Figure 2(a), four exhaust ports 16a through 16d are provided on the bottom plate 11 of the chamber 10. These ports are located below the substrate S supported by the stage 20. The pressure relief mechanism 30 includes exhaust piping 31 connected to the ports 16a through 16d, four valves Va through Vd corresponding to each port, and a vacuum pump 32.

The exhaust piping 31 consists of four individual pipes 31a through 31d and one main pipe 31e. One end of each of the four individual pipes 31a through 31d is connected to the four exhaust ports 16a through 16d, respectively. The other ends of the four individual pipes 31a merge into a single pipe and are connected to one end of the main pipe 31e. The other end of the main pipe 31e is connected to the vacuum pump 32. Four valves Va through Vd are installed on the paths of the four individual pipes 31a through 31d.

When the vacuum pump 32 operates with the chamber 10 sealed and at least some of the four valves Va through Vd open, the gas within the chamber 10 passes through the exhaust pipe 31 and the vacuum pump 32 and is exhausted to the external exhaust line. This reduces the pressure within the chamber 10.

The four valves Va through Vd are used to individually regulate the exhaust volume from the four exhaust ports 16a through 16d. In this embodiment, valves Va through Vd are on-off valves that switch between open and closed states based on control commands from the control unit 80. Alternatively, they can be opening-controlled valves whose opening degree can be adjusted based on control commands from the control unit 80.

In the reduced-pressure drying apparatus 2, the four exhaust ports 16a to 16d are located below the substrate S supported by the stage 20. This allows for a more uniform flow of gas on the upper surface of the substrate S. Consequently, uneven drying of the coating layer formed on the upper surface of the substrate S can be suppressed.

An air supply mechanism 60 is also connected to the chamber 10. This mechanism is used to return the air inside the chamber 10 to atmospheric pressure at the end of the decompression drying process. As shown in Figure 2(a), an air supply port 16f is provided on the bottom plate 11 of the chamber 10. The air supply mechanism 60 includes an air supply pipe 61 connected to the air supply port 16f at one end and an air supply valve Vf. The other end of the air supply pipe 61 is connected to an external air source. The air supply valve Vf is located along the path of the air supply pipe 61.

When the air supply valve Vf is opened in response to a control command from the control unit 80, gas is supplied from the air supply source through the air supply pipe 61 and the air supply port 16f into the interior of the chamber 10. This increases the air pressure within the chamber 10. The gas supplied from the air supply source can be an inert gas such as nitrogen, or clean, dry air.

The control unit 80 is used to control the operation of various components of the pressure-reducing drying apparatus 2. The control unit 80 comprises a computer having a processor such as a central processing unit (CPU), memory such as random access memory (RAM), and storage such as a hard drive. The control unit 80 executes a control program pre-stored in the memory to control the operation of various components within the pressure-reducing drying apparatus 2, thereby performing the pressure-reducing drying process.

While the main structure of the reduced-pressure drying apparatus 2 has been described here, in addition to the above, a rectifying plate may be provided to control the airflow within the chamber 10 and more effectively suppress uneven drying, as described in Patent Document 1. Furthermore, a heater may be provided within the chamber 10 to heat the substrate S and promote solvent volatilization. The reduced-pressure drying process performed by the reduced-pressure drying apparatus 2 can be essentially the same as that described in Patent Document 1. Therefore, a detailed description of the reduced-pressure drying process will be omitted.

Figures 3(a) and 3(b) illustrate the detailed structure of the stage. As shown in Figure 3(a), as described above, the stage 20 includes a plurality of support plates 21 arranged in the Y direction at predetermined intervals. Each support plate 21 includes an upper plate 22 and a lower plate 23 of substantially equal planar dimensions. These plates are rectangular in plan view, more specifically, with their longitudinal sides in the X direction.

Multiple detachable support pins 24 are distributed across the top surface of the upper plate 22. These support pins 24 have magnets on their bottom surfaces, allowing them to be detachably secured to the metal upper plate 22 through magnetic force. Therefore, by overcoming the magnetic force and lifting the support pins 24, they can be pulled away from the upper plate 22. Furthermore, the support pins 24 can be installed at any location on the upper surface of the upper plate 22.

When processing the substrate S while supporting it with the support pins 24 partially in contact with the lower surface, the load may be concentrated on the area of the substrate S that contacts the support pins 24, resulting in uneven processing. The support pins 24 must be positioned to avoid this problem. For example, when a single substrate S is divided into multiple component areas, so-called multi-chamfering, the support pins 24 can be positioned so that they contact the blank areas between the component areas.

On the other hand, the shape and size of the substrate S, as well as the placement of the component areas therein, vary depending on the specifications. To accommodate this, the placement of the support pins 24 also needs to be modified. In the above embodiment, the support pins 24, which function as magnetic pins, are mounted on the upper plate 22, which is a flat iron plate. This allows for easy replacement of the support pins 24.

Furthermore, to perform this relocation operation more efficiently and with excellent workability, the embodiment described above is configured to enable the operation to be performed outside the chamber 10. Specifically, as shown below, the upper plate 22 and lower plate 23 are detachably coupled and easily removable, allowing the upper plate 22 to be transported outside the chamber 10 for relocation.

As shown in Figure 3(a), the lower plate 23 is formed relatively thick to provide sufficient mechanical strength to support the upper plate 22. Meanwhile, the upper plate 22 is thinner and lighter than the lower plate 23. For example, an iron plate approximately 2 mm thick can be used as the upper plate 22.

As shown in Figure 3(b), the upper plate 22 and the lower plate 23 are detachably connected to each other via magnets (permanent magnets) 231. Specifically, multiple magnets 231 protrude from the upper surface of the lower plate 23. Furthermore, recesses 221 slightly larger than the outer shape of the magnets 231 are formed on the lower surface of the upper plate 22 at positions corresponding to the locations where the magnets 231 are located. As indicated by the dotted arrows, when the upper and lower plates 22 and 23 overlap, the magnets 231 protruding from the upper surface of the lower plate 23 fit into the recesses 221 on the lower surface of the upper plate 22, magnetically attracting the upper plate 22. In other words, the magnets 231 magnetically connect the upper and lower plates 22 and 23, while also functioning as a horizontal positioning mechanism.

The attractive force generated by magnet 231 is designed to release the upper plate 22 from its connection with the lower plate 23 with relatively small force, such as human effort, when an external force acts to lift it upward. Therefore, the upper plate 22 and lower plate 23 cannot be considered firmly bonded. However, when the internal space SP of chamber 10 is depressurized, the gas between the upper plate 22 and lower plate 23 is expelled, and the plates are in close contact, so they can be considered to be effectively integrated in a depressurized environment.

The number of magnets 231 is also arbitrary, but as long as the upper plate 22 can be properly positioned relative to the lower plate 23, a small number is preferred. This also reduces the external force required to lift the upper plate 22.

Furthermore, as shown in Figure 3(b), on the upper surface of the lower plate 23, the distance Da between the (+X)-side end 23a and the closest magnet 231 is significantly smaller than the distance Db between the (-X)-side end 23b and the closest magnet 231. In other words, the blank area near the (-X)-side end 23b of the lower plate 23, where magnets 231 are not located, is significantly larger than the blank area near the (+X)-side end 23a. Distance Db can be appropriately determined within a range of approximately half the X-direction length of the lower plate 23. The reasons for this arrangement are explained below.

Figures 4(a) through 4(d) schematically illustrate the process of removing the upper plate from the support plate. As shown in Figures 4(a) and 4(b), the support plate 21 of this embodiment can be separated from the lower plate 23 by inserting a hand H or a suitable clamp or tool between the upper plate 22 and the lower plate 23 at the (+X) side. However, the thickness of the upper plate 22 is small relative to its planar dimensions, so the lifted upper plate 22 may bend downward, as shown in Figure 4(c).

Consider the case where a magnet is placed near the (-X)-side end of support plate 21, for example, at position A indicated by the arrow in Figure 4(c). In this case, due to the deflection of upper plate 22 and the attractive force of the magnet, it may be difficult to separate upper plate 22 and lower plate 23 simply by lifting the (+X)-side end. Furthermore, even if this were possible, the (+X)-side end of upper plate 22 would need to be lifted considerably.

In this embodiment, magnets 231 are concentrated on one side of the lower plate 23 near the (+X)-side end 23a, leaving a larger area near the (-X)-side end 23b without magnets. This allows the upper plate 22 and lower plate 23 to be separated more reliably and with less lifting effort. The upper plate 22, thus released from the lower plate 23, is lightweight and can be moved in the (+X) direction and pulled out of the chamber 10, as shown in Figure 4(d). The procedure for joining the upper plate 22 and lower plate 23 is the reverse of the above.

Furthermore, loading and unloading the upper plate 22 is performed from the (+X) side of the chamber 10 for the following reason. As shown in Figure 1, the reduced-pressure drying apparatus 2 is located on the (+X) side relative to the transport apparatus 4 that carries the substrates S. Therefore, the space adjacent to the (-X) side of the reduced-pressure drying apparatus 2 serves as the transport space TS for transporting the substrates S, and this space must be maintained at a high level of cleanliness.

Therefore, to prevent dust and other particles generated during loading and unloading from entering the transport space, it is best to perform these operations as far away from the transport space TS as possible. In the embodiment described above, loading and unloading the upper plate 22 is performed by approaching the chamber 10 from the opposite side of the transport space TS, across the decompression dryer 2, i.e., the (+X) side of the decompression dryer 2. This prevents dust and other particles from being dispersed into the transport space TS.

If the support plate 21 is constructed from a single component, or the upper plate 22 and lower plate 23 are bolted together, requiring the entire support plate 21 to be removed, or if the upper plate 22 is of high quality, removal may not be possible simply by accessing it from the (+X) side. In such cases, workers would need to enter the transport space TS, for example, and support and remove the support plate 21 or upper plate 22 from both sides in the X direction, potentially contaminating the transport space TS.

In this embodiment, the support plate 21 is constructed as separate components: a lower plate 23, which ensures mechanical strength, and an upper plate 22, which attracts the support pins 24, which function as magnetic pins. This allows the upper plate 22 to be lightweight. Furthermore, the upper and lower plates 22, 23 are connected solely by magnetic force, and releasing this connection does not require significant force or time-consuming work.

Based on these circumstances, the top plate 22 can be attached and detached, and the support pins 24 can be replaced and repositioned, simply by working from the (+X) side of the chamber 10, reliably preventing contamination of the transfer space TS.

Next, the more practical structure of each of the multiple support plates 21 will be described. Specifically, in Figure 3(a), for the purpose of illustrating the principle, the upper plate 22 and lower plate 23 are shown as flat plates with identical planar dimensions. However, a more suitable structure for actually replacing the support pins 24 can be modified as follows. The following structure, with reference to Figures 5(a) through 5(c), will describe a structure for improving operability when separating the upper and lower plates 22 and 23. Furthermore, with reference to Figures 6(a) through 6(c), a structure for reducing deflection of the upper plate 22 will be described.

Figures 5(a) through 5(c) illustrate examples of shapes designed to facilitate panel removal. In the principle described so far, the upper panel 22 and lower panel 23 have the same planar dimensions and are joined together in an overlapping manner. In this case, with the upper and lower panels 22 and 23 in close contact, there are no grips to pull them apart, making it difficult to lift the upper panel 22.

In the example support plate 21a shown in Figure 5(a), a notch 232 is formed on the upper portion of the (+X)-side end surface of the lower plate 23a, partially recessing the surface toward the (-X) side. When the upper plate 22a and lower plate 23a are superimposed, a small gap is formed below the (+X)-side end of the upper plate 22a, as shown in the right figure. By inserting a hand, a clamp, or a tool into this gap, the upper plate 22a can be easily lifted upward from the lower plate 23a.

In the support plate 21b shown in Figure 5(b), the shape of the cutout 233 formed on the (+X)-side end surface of the lower plate 23b differs from the previous example, but its function is the same. Specifically, a portion of the lower surface of the upper plate 22b is exposed above the cutout 233, allowing a hand, a clamp, or a tool to be inserted into this portion, allowing the upper plate 22b to be easily lifted upward from the lower plate 23b.

Furthermore, in the support plate 21c shown in Figure 5(c), the (+X) side end of the upper plate 22c slightly protrudes from the lower plate 23c. This structure makes it easy to lift the lower plate 23c by placing your hands, clamps, or tools on the lower surface of the protruding upper plate 22c.

In this way, in a structure where the upper and lower plates differ in shape or size when viewed from above, it is preferable to minimize the difference in shape between them in order to suppress airflow disturbance during the reduced pressure drying process.

Furthermore, for example, by temporarily attaching a handle equipped with a magnet having a sufficiently strong attraction force compared to that of magnet 231 to the upper plate 22, or by pre-installing a handle shorter in height than support pin 24 near the (+X) side end of the upper plate 22, workability when removing the upper plate 22 can be improved.

Figures 6(a) through 6(c) illustrate examples of shapes used to suppress upper plate deflection. To make the upper plate 22 lightweight and improve ease of assembly and disassembly, it is effective to make the upper plate 22 a thin, flat plate. However, such a structure can easily cause deflection when one end is lifted. For example, as shown in Figure 6(a), by employing a shape in which both Y-side ends of the upper plate 22d are bent downward, a so-called channel shape, this can enhance resistance to deflection in the X direction and suppress deflection.

By implementing measures to suppress upper plate deflection, the placement of the magnets on the lower plate becomes more flexible. Specifically, if deflection is not a problem when the (+) side of the upper plate is lifted, the placement of the magnets, as shown in Figure 3(b), with a bias toward the (+X) side, is not necessarily necessary.

As a specific structure in this case, to suppress airflow turbulence, for example, a structure in which the upper portion of lower plate 23e is modified to correspond to the bend of upper plate 22e, as in support plate 21e shown in Figure 6(b) , or a structure in which the bent portion of upper plate 22f completely covers the side of lower plate 23f, as in support plate 21f shown in Figure 6(c) , can be adopted. This allows the structure, viewed as a single support plate integrating the upper and lower plates, to be formed as a flat plate or a rectangular parallelepiped, similar to the aforementioned principle.

Figure 7 is a flowchart illustrating the process of replacing the support pin configuration. This operation is performed, for example, when the specifications of the substrates S processed by the substrate processing system 100 change. Alternatively, it can be performed simultaneously with other maintenance operations within the chamber 10. The operation can also be performed entirely manually by the operator (or using appropriate jigs and tools), or it can be partially combined with the operation of the decompression drying apparatus 2. First, the hood 12 of the chamber 10 retracts to a significantly upward retracted position (the position shown in Figure 2(b)) (step S101). This movement can be performed by operating the chamber lift 15, or by lifting the hood 12 using an external lift. This opens the chamber 10 widely vertically.

Next, the operator lifts the (+X)-side end of the upper plate 22 from the (+X) side of the thus-opened chamber 10, thereby releasing the magnetic connection between the upper plate 22 and the lower plate 23 (step S102). The upper plate 22, now separated from the lower plate 23, is pulled out in the (+X) direction and carried outside the chamber 10 (step S103). The upper plate 22 thus pulled out to the outside space is then repositioned by changing the position of the support pins 24 (step S104).

Each support pin 24 is magnetically attached to the upper plate 22 and can be removed from the upper plate 22 by lifting it upward. The support pin 24 can then be reinstalled as needed, completing the configuration change. Unnecessary support pins 24 can also be removed and new ones added.

To improve the efficiency of this operation, a ruler or grid, for example, may be provided on the upper surface of the upper plate 22 as a reference for positioning. Furthermore, a jig (e.g., a template) may be provided to facilitate positioning of the support pins 24, depending on the specifications of the substrate S.

When the configuration change is complete, the upper plate 22 is returned to the chamber 10 (step S105). Specifically, the operator loads the upper plate 22 from the (+X) side of the chamber 10 and places it on the corresponding lower plate 23. The magnets 231 on the upper surface of the lower plate 23 engage with the recesses 221 on the lower surface of the upper plate 22, magnetically coupling the upper and lower plates 22 and 23. The cover 12 is then lowered to a blocking position (shown in Figure 2(a)) that blocks the internal space SP (step S106), completing the operation.

If multiple support plates 21 need to be replaced, for example, after performing the aforementioned operation on one set of support plates 21, the same operation can be performed on another set of support plates 21. Alternatively, multiple support plates 21 can be removed at once and the operation performed simultaneously.

As described above, in the embodiment described above, the stage 20 supporting the substrate S within the chamber 10 is configured to support the substrate S from its lower surface via a plurality of support pins 24 on the upper surface of a support plate 21. The upper plate 22 and lower plate 23 of the support plate 21 are separable and are connected with relatively little force via magnets 231. Therefore, the upper plate 22 can be easily released from the lower plate 23 by lifting it upward.

Furthermore, since high mechanical strength is not required for the upper plate 22, it can be constructed to be thin and lightweight. This also facilitates transporting the upper plate 22, which is separated from the lower plate 23, outside the chamber 10. This makes it easy to transport the upper plate 22, with the support pins 24 attached, outside the chamber 10. Therefore, in this embodiment, the support pins 24 can be replaced efficiently and with excellent workability.

Furthermore, the support pins 24 can be replaced from the side opposite to the transport space TS used to transport the substrates S. This eliminates the need for workers to enter the transport space TS, preventing contamination of the transport space TS.

Alternatively, if the support pins 24 are magnetic pins with magnets attached to their bottom surfaces, and the upper plate 22 is constructed from a soft magnetic material such as an iron plate, the support pins 24 can be easily removed and mounted at any position on the upper surface of the upper plate 22. This allows for flexible response to various substrate processing requirements, enabling the construction of a stage 20 capable of realizing a support configuration tailored to the substrate's specifications.

The chamber 10 of the above embodiment is structured so that substrates S can be loaded and unloaded by separating the cover portion 12 and the bottom plate portion 11 vertically. However, other chambers of this type allow for loading and unloading of substrates S via side baffles. In this configuration, the support plate 21 can also be configured similarly to the above configuration.

Figures 8(a) and 8(b) are diagrams showing other examples of the structure of the chamber. In addition, since the structures of each part other than the chamber structure are the same as those of the reduced pressure drying device 2 of the above-mentioned embodiment, they are sometimes omitted in the figure or the same symbols are assigned and the description is omitted. The chamber 10A shown in Figure 8(a) includes a flat bottom plate portion 11A and a cover portion 12A covering the upper portion thereof, as in the above-mentioned embodiment. A baffle 101 is provided on the (-X) side of the cover portion 12A, which is opened/closed according to the control command from the control unit 80. In this structure, the substrate S to be processed is taken out/put in by the conveying device 4 via the baffle 101. On the other hand, when performing maintenance work inside the chamber 10, including replacing the support pins 24, the cover 12A is raised to open the chamber.

Furthermore, chamber 10B shown in Figure 8(b) has a freely openable and closable baffle 102 on its (-X) side for loading and unloading substrates S. On the other hand, a freely openable and closable baffle 103 is provided on the (+X) side for maintenance work. When baffle 103 is open, the (+X) side of chamber 10B is widely opened, for example, allowing the entire side to be open. Baffle 103 can also be opened and closed manually. In this structure, rather than creating a workspace by separating the chamber into upper and lower parts, the chamber interior is accessible by widely opening the chamber side.

Even with these chamber structures, the structure of the support plate 21 installed inside can be similar to that of the aforementioned embodiment. Even in this case, the upper plate 22 can be attached and detached by accessing the chamber from the (+X) side. This allows the upper plate 22 to be pulled out of the chamber, allowing the support pins 24 to be replaced with excellent workability and efficiency.

As described above, the reduced-pressure drying apparatus 2 of the embodiment described above functions as the "substrate processing apparatus" and "substrate processing unit" of the present invention. Furthermore, the transport apparatus 4 functions as the "transport unit" of the present invention. Furthermore, the bottom plate 11 and cover 12 constituting the chamber 10 function as the "base" and "cover," respectively, of the present invention. Furthermore, the support plate 21 serves as the "joint body" of the present invention, while the upper plate 22 and lower plate 23 function as the "first plate" and "second plate," respectively. Furthermore, the support pins 24 function as the "support pins" of the present invention.

The stage lift 25 functions as the "lifting mechanism" of the present invention, while the pressure reducing mechanism 30 functions as the "pressure reducing unit" of the present invention. Furthermore, the substrate processing system 100 corresponds to the "substrate processing system" of the present invention. The recess 221 corresponds to the "recess" of the present invention, and the magnet 231 functions as the "coupling unit" of the present invention. The cutouts 232 and 233 also correspond to the "cutout" of the present invention.

Furthermore, the distance Da and the distance Db correspond to the "second distance" and the "first distance" of the present invention, respectively; the substrate S corresponds to the "substrate" of the present invention; and the internal space SP corresponds to the "internal space" of the present invention.

The present invention is not limited to the above-described embodiment and can be modified in various ways without departing from the spirit of the present invention. For example, in the above-described embodiment, the upper plate 22 is formed as a thin plate made of iron, which is a soft magnetic material, and the support pins 24 are formed as magnetic pins, with the support pins 24 and the upper plate 22 being coupled together by magnetic force. However, the mechanism for coupling the support pins to the upper plate is not limited to this; for example, bolts or the like may be used for fastening.

This eliminates the need for the upper plate to be magnetic, allowing for greater freedom in material selection. For example, aluminum, which is lighter than iron, can be used. In this case, if the upper plate is not magnetic, to achieve magnetic coupling with the lower plate, it is ideal to place a magnetic material on the lower surface of the upper plate at a location corresponding to the magnet (e.g., the inner surface of recess 221). For example, a separate magnetic component can be attached to the lower surface of the upper plate.

Furthermore, for example, in the above embodiment, magnet 231 is positioned so as to protrude from the upper surface of lower plate 23, thereby also functioning as a means of determining the horizontal position of upper plate 22. However, the magnet may also be embedded in the lower plate, with the lower plate's upper surface being flat. In this case, separate positioning pins or the like are required to determine the horizontal position of the upper plate. However, with the configuration shown in Figures 6(a) to 6(c), positional deviation in the Y direction is naturally limited. Therefore, it is sufficient to implement a solution solely to suppress positional deviation in the X direction.

For example, in the above embodiment, the upper plate 22 and lower plate 23 are joined by magnets mounted on the lower plate 23. However, a configuration in which magnets are mounted on the upper plate is also possible. Furthermore, the magnetic force is not limited to that generated by permanent magnets; for example, electromagnets can also be used. In this case, the upper plate can be easily removed from the lower plate by stopping the power supply as needed.

For example, while the above embodiments apply the present invention to a reduced-pressure drying apparatus, the present invention is not limited to such apparatuses. The present invention can be applied to various substrate processing apparatuses having a chamber that accommodates substrates and reduces pressure.

As described above using specific embodiments, in the substrate processing apparatus of the present invention, for example, multiple combined bodies formed by combining a first plate and a second plate can be arranged horizontally within the internal space, spaced apart from each other. In a structure that uses support pins to support the substrate, the shape and size of the combined body do not necessarily need to match those of the substrate, providing a greater degree of flexibility. A structure that utilizes multiple combined bodies to support the substrate can reduce the size of the first plate in each combined body, resulting in a lighter weight and improved workability during loading and unloading.

Alternatively, for example, the coupling portion may include a plurality of magnets discretely projecting from the upper surface of the second plate. Recesses for receiving the magnets may be provided on the lower surface of the first plate at positions corresponding to the positions of the magnets, with at least a portion of the inner surface of the recess formed from a soft magnetic material. With this structure, the magnets engage the recesses, facilitating positioning of the first and second plates.

In this case, the first plate may be rectangular in plan view, and a first distance between one end of the second plate's main surface and a magnet located closest to the one end is greater than a second distance between the other end on the opposite side from the one end and the magnet located closest to the other end. This structure solves the problem of the magnet located at one end being unable to release its engagement due to the first plate's deflection when the first plate is lifted from the other end.

Alternatively, for example, the top surface of the first plate may be formed flat from a soft magnetic material, and the support pin may be attached to the top surface of the first plate via a magnet. In this manner, by magnetically securing the support pin to the magnetic first plate, the support pin can be attached to any position on the first plate and easily removed.

For example, if the first and second plates have the same shape and size when viewed from above, it is preferable to provide a notch portion partially recessed relative to the lower surface of the first plate in a portion of the periphery of the upper surface of the second plate. Here, "having the same shape and size" includes the case where the first and second plates have substantially the same shape and size when viewed from above. This structure allows the first plate to be easily lifted using the notch portion as a grip.

Alternatively, for example, a lifting mechanism could be provided to raise and lower the second plate within the internal space. In the present invention, the first plate can be easily removed from the second plate and carried out of the chamber. Therefore, even with a structure that incorporates the lifting mechanism into the second plate, the replacement of the support pins would not be hindered.

Alternatively, for example, a chamber may have a base portion forming the chamber bottom and a cover portion covering the base portion to define the interior space, with the base portion and the cover portion being spaced apart in the upper and lower directions. With this structure, by separating the base portion and the cover portion, structures within the chamber can be exposed. Consequently, the work of separating the first and second plates and removing them can be performed with excellent workability.

The substrate processing apparatus of the present invention may also include a decompression unit connected to the chamber to depressurize the internal space. A substrate having a coating film formed on its upper surface is supported within the internal space by a plurality of support pins. The decompression unit depressurizes the internal space to dry the coating film. This process is known as decompression drying. In this process, the contact position of the support pins with the substrate is known to affect processing quality. The present invention enables efficient replacement of the support pins with excellent workability and is particularly suitable for decompression drying apparatuses.

Furthermore, in the support pin placement and replacement method of the present invention, a transport unit for at least one of loading and unloading substrates into and out of the chamber may be disposed on the side of the chamber. In this case, the first plate is ideally loaded into and unloaded from the side of the chamber opposite the transport unit. This configuration allows the first plate to be loaded into and unloaded without passing through the path of the substrates transported by the transport unit, thus preventing contamination of substrates and the like by dust generated during operation.

[Industrial Availability]

The present invention is applicable to any substrate processing apparatus that processes substrates by depressurizing a chamber containing substrates, but is particularly suitable for apparatus that performs depressurization drying processes.

20: Carrier 21: Support plate (joint) 22: Upper plate (first plate) 23: Lower plate (second plate) 23a: Lower plate ((+X) side end, (+X) side end) 23b: Lower plate ((-X) side end, (-X) side end) 24: Support pin 221: Recess 231: Magnet (joint, permanent magnet) Da: Second distance (distance) Db: First distance (distance) X, Y, Z: Directions

Claims (11)

A substrate processing device includes: a chamber having an internal space capable of accommodating a substrate, the internal space being depressurized; a first plate disposed in the internal space, a plurality of support pins for supporting the substrate being detachably mounted on the upper surface; a second plate abutting the lower surface of the first plate in the internal space to support the first plate; and a coupling portion detachably coupling the first plate to the second plate by magnetic force from a plurality of discretely disposed magnets, the plurality of magnets being discretely protruding from the upper surface of the second plate, recesses for engaging the magnets being provided in the lower surface of the first plate at positions corresponding to the positions of the magnets, at least a portion of the inner surface of the recess being formed of a soft magnetic material. A substrate processing device includes: a chamber having an internal space capable of accommodating a substrate, the internal space being depressurized; a first plate disposed in the internal space, a plurality of support pins for supporting the substrate being detachably mounted on the upper surface; a second plate abutting the lower surface of the first plate in the internal space to support the first plate; and a coupling portion detachably coupling the first plate to the second plate by magnetic force from a plurality of discretely disposed magnets, the plurality of magnets being discretely protruding from the lower surface of the first plate, recesses for engaging the magnets being provided on the upper surface of the second plate at positions corresponding to the positions of the magnets, at least a portion of the inner surface of the recess being formed from a soft magnetic material. In the substrate processing apparatus according to claim 1 or claim 2, a plurality of combined bodies formed by combining the first plate and the second plate are arranged horizontally in the internal space and are spaced apart from each other. The substrate processing apparatus according to claim 1 or claim 2, wherein the upper surface of the first plate is formed flatly by a soft magnetic material, and the support pin is attached to the upper surface of the first plate via a magnet. A substrate processing device as described in claim 1 or claim 2, wherein, in a plan view, the first plate and the second plate have the same shape and size, and a cutout portion partially retreated relative to the lower surface of the first plate is provided on a portion of the peripheral portion of the upper surface of the second plate. The substrate processing apparatus according to claim 1 or claim 2 includes a lifting mechanism for lifting and lowering the second plate within the internal space. The substrate processing apparatus according to claim 1 or claim 2, wherein the chamber has a base portion constituting the bottom of the chamber and a cover portion covering an upper portion of the base portion to form the internal space, and the base portion and the cover portion are spaced apart in a vertical direction. The substrate processing device as described in claim 1 or claim 2 further includes a depressurizing unit connected to the chamber to depressurize the internal space, wherein the substrate having a coating film formed on the upper surface is supported by a plurality of the supporting pins in the internal space, and the depressurizing unit depressurizes the internal space, thereby drying the coating film. A method for replacing the configuration of a support pin is provided in a chamber in which a plurality of support pins for supporting the substrate are provided in an internal space capable of accommodating a substrate, wherein the plurality of support pins are detachably mounted on the upper surface of a first plate, and the first plate is detachably coupled to a second plate provided in the internal space by the magnetic force of a plurality of magnets provided discretely, and the method for replacing the configuration of the support pin comprises: lifting the first plate upwards and coupling the first plate to the second plate; The process of releasing the coupling; the process of moving the first plate out of the chamber; the process of changing the configuration of the support pin installed on the first plate outside the chamber; and the process of returning the first plate to the chamber and coupling it with the second plate; the plurality of magnets are discretely protruding from the upper surface of the second plate, and recesses for the magnets to be embedded are provided at positions on the lower surface of the first plate corresponding to the positions of the magnets, and at least a portion of the inner surface of the recess is formed by a soft magnetic material. A method for replacing the configuration of a support pin is provided in a chamber in which a plurality of support pins for supporting the substrate are provided in an internal space capable of accommodating a substrate, wherein the plurality of support pins are detachably mounted on the upper surface of a first plate, and the first plate is detachably coupled to a second plate provided in the internal space by the magnetic force of a plurality of magnets provided discretely, and the method for replacing the configuration of the support pin comprises: lifting the first plate upwards and coupling the first plate to the second plate; The process of releasing the coupling; the process of moving the first plate out of the chamber; the process of changing the configuration of the support pin installed on the first plate outside the chamber; and the process of returning the first plate to the chamber and coupling it with the second plate; the multiple magnets are discretely protruding from the lower surface of the first plate, and recesses for the magnets to be embedded are provided at positions on the upper surface of the second plate corresponding to the positions of the magnets, and at least a portion of the inner surface of the recess is formed by a soft magnetic material. A method for replacing the configuration of support pins as described in claim 9 or claim 10, wherein a conveying unit for performing at least one of moving the substrate into the chamber and moving the substrate out of the chamber is arranged on the side of the chamber, and the first plate is moved into and out of the chamber from a side opposite to the chamber and opposite to the conveying unit.