TWI891529B - Glass substrate plating fixture - Google Patents
Glass substrate plating fixtureInfo
- Publication number
- TWI891529B TWI891529B TW113138289A TW113138289A TWI891529B TW I891529 B TWI891529 B TW I891529B TW 113138289 A TW113138289 A TW 113138289A TW 113138289 A TW113138289 A TW 113138289A TW I891529 B TWI891529 B TW I891529B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- contact portion
- metal
- fixture
- metal clamp
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Abstract
Description
一種電鍍夾具,尤指一種軟硬接觸部交錯排列且軟硬互相對應之玻璃基板電鍍夾具。 A plating jig, particularly a glass substrate plating jig with alternating soft and hard contact areas, with the soft and hard areas corresponding to each other.
按,電鍍係電子元件製造過程中廣泛應用的一種表面處理製程,其目的在於使待鍍件上披覆有例如銅、鎳、鉻等金屬,藉以達到防鏽、耐磨、導電及美觀等效果。夾具之習知結構型態,無論其採用圓桿型式或板片型式者,通常在製程上必須透過一些彎折手段來形成彈性部位,以達到適當的夾持彈力功能需求,然而此種型態隨著電鍍架體所需夾具配置數量越多,勢必相對提高夾具的製備成本,且利用彎折手段成型的夾持部位,不僅欠缺精準度也難存在產量難以提升的缺弊,且就夾持狀態的靈活變化性而言,亦有其不足之處。 Electroplating is a surface treatment process widely used in the manufacturing of electronic components. Its purpose is to coat the workpiece with metals such as copper, nickel, and chromium to achieve rust protection, wear resistance, electrical conductivity, and aesthetics. Conventional clamp structures, whether using round rods or plates, typically require some bending to create flexible features during the manufacturing process to achieve the required clamping force. However, as the number of clamps required for electroplating frames increases, this inevitably increases the cost of clamp production. Furthermore, the clamping features formed using bending not only lack precision and are difficult to increase production, but also have limitations in terms of flexibility in clamping configurations.
是以,如何解決上述現有技術之問題與缺失,即為相關業者所亟欲研發之課題所在。 Therefore, how to solve the problems and shortcomings of the above-mentioned existing technologies is a topic that relevant industries are eager to research and develop.
本發明主要提供一種玻璃基板電鍍夾具,尤適用於夾持一玻璃基板以進行電鍍,該玻璃基板電鍍夾具包括夾具基座、第一金屬夾持件與第二金屬夾持件。第一金屬夾持件,其連接至該夾具基座,該第一金屬夾持件為金屬材料製成,且該第一金屬夾持件之其中一側面為凹凸連續交錯排列的一第一凹凸狀平面,其中第偶數個位置之凸狀表面為內崁著具有彈性材質之一第一軟性接觸部,其中第奇數個位置之凸狀表面為一第一硬性接觸部。第二金屬夾持件,其連接至該夾具基座,該第二金屬夾持件為金屬材料製成,且該第二金屬夾持件之其中一側面為凹凸連續交錯排列的一第二凹凸狀平面,其中第奇數個位置之凸狀表面為內崁著具有彈性材質之一第二軟性接觸部,其中第偶數個位置之凸狀表面為一第二硬性接觸部。 The present invention primarily provides a glass substrate electroplating fixture, particularly suitable for clamping a glass substrate for electroplating. The fixture comprises a fixture base, a first metal clamp, and a second metal clamp. The first metal clamp is connected to the fixture base and is made of metal. One side of the first metal clamp comprises a first concave-convex surface with a continuous and alternating arrangement of concave and convex portions. The convex surfaces at even-numbered positions are embedded with a first soft contact portion made of a resilient material, while the convex surfaces at odd-numbered positions are a first hard contact portion. The second metal clamp is connected to the clamp base. The second metal clamp is made of metal, and one side of the second metal clamp has a second concave-convex surface with a continuous and alternating arrangement of concave and convex portions. The convex surfaces at odd-numbered positions are embedded with a second soft contact portion made of a resilient material, while the convex surfaces at even-numbered positions are second hard contact portions.
在本發明之一實施例中,透過該第一金屬夾持件與該第二金屬夾持件來夾持該玻璃基板,並且該第一軟性接觸部對應於該第二硬性接觸部。 In one embodiment of the present invention, the glass substrate is clamped by the first metal clamp and the second metal clamp, and the first soft contact portion corresponds to the second hard contact portion.
在本發明之一實施例中,透過該第一金屬夾持件與該第二金屬夾持件來夾持該玻璃基板,該第一硬性接觸部對應於該第二軟性接觸部。 In one embodiment of the present invention, the glass substrate is clamped by the first metal clamp and the second metal clamp, and the first hard contact portion corresponds to the second soft contact portion.
在本發明之一實施例中,當進行電鍍作業時,該第一金屬夾持件為通電狀態。 In one embodiment of the present invention, when the electroplating operation is performed, the first metal clamp is in an energized state.
在本發明之一實施例中,當進行電鍍作業時,該第二金屬夾持件為通電狀態。 In one embodiment of the present invention, when the electroplating operation is performed, the second metal clamp is in an energized state.
在本發明之一實施例中,該第一軟性接觸部內部具有至少一第一彈簧。 In one embodiment of the present invention, the first flexible contact portion has at least one first spring inside.
在本發明之一實施例中,該第二軟性接觸部內部具有至少一第二彈簧。 In one embodiment of the present invention, the second flexible contact portion has at least one second spring inside.
綜上所述,本發明所揭露之玻璃基板電鍍夾具能夠帶來以下功效:1.製作成本低;2.達到更均勻且適當的夾持彈力功能需求;以及3.更能適用於不同表面平整度的玻璃基板。 In summary, the glass substrate electroplating chuck disclosed in the present invention can bring the following benefits: 1. Low manufacturing cost; 2. Achieving more uniform and appropriate clamping spring force requirements; and 3. Greater adaptability to glass substrates with varying surface flatness.
底下藉由具體實施例詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。 The following detailed description is based on specific embodiments, which will make it easier to understand the purpose, technical content, features and effects achieved by the present invention.
100:玻璃基板電鍍夾具 100: Glass substrate electroplating fixture
110:夾具基座 110: Clamp base
120:第一金屬夾持件 120: First metal clamp
122:第一軟性接觸部 122: First soft contact area
124:第一硬性接觸部 124: First hard contact area
126:第一凹凸狀平面 126: First concave-convex plane
130:第二金屬夾持件 130: Second metal clamp
132:第二軟性接觸部 132: Second soft contact area
134:第二硬性接觸部 134: Second hard contact area
136:第二凹凸狀平面 136: Second concave-convex plane
GB:玻璃基板 GB: Glass substrate
第一圖係為本發明的玻璃基板電鍍夾具之示意圖。 The first figure is a schematic diagram of the glass substrate electroplating fixture of the present invention.
第二圖係為本發明的玻璃基板電鍍夾具之使用示意圖。 The second figure is a schematic diagram of the use of the glass substrate electroplating fixture of the present invention.
第三圖係為本發明的玻璃基板電鍍夾具之另一使用示意圖。 Figure 3 is another schematic diagram of the glass substrate electroplating fixture of the present invention in use.
發明人經過多年的研究及開發,據以改善現有產品的詬病,後續將詳細介紹本發明如何以一種玻璃基板電鍍夾具來達到最有效率的功能訴求。 After years of research and development, the inventors have addressed the shortcomings of existing products. This article will detail how this invention achieves the most efficient functional requirements using a glass substrate electroplating jig.
請參閱第一圖至第三圖,第一圖係為本發明的玻璃基板電鍍夾具之示意圖。第二圖係為本發明的玻璃基板電鍍夾具之使用示意圖。第三圖係為本發明的玻璃基板電鍍夾具之另一使用示意圖。本發明之玻璃基板電鍍夾具100,尤適用於夾持一玻璃基板GB以進行電鍍,其係一種軟硬接觸部交錯排列 且軟硬互相對應之玻璃基板電鍍夾具100。玻璃基板電鍍夾具100包括夾具基座110、第一金屬夾持件120與第二金屬夾持件130。第一金屬夾持件120連接至該夾具基座110,該第一金屬夾持件120為金屬材料製成,且該第一金屬夾持件120之其中一側面為凹凸連續交錯排列的一第一凹凸狀平面126,其中第偶數個位置(例如2、4、6)之凸狀表面為內崁著具有彈性材質之一第一軟性接觸部122,其中第奇數個位置(例如1、3、5)之凸狀表面為一第一硬性接觸部124。 Please refer to Figures 1 through 3. Figure 1 is a schematic diagram of the glass substrate electroplating jig of the present invention. Figure 2 is a schematic diagram of the glass substrate electroplating jig of the present invention in use. Figure 3 is another schematic diagram of the glass substrate electroplating jig of the present invention in use. The glass substrate electroplating jig 100 of the present invention is particularly suitable for clamping a glass substrate GB for electroplating. It features alternating soft and hard contact portions, with the soft and hard portions corresponding to each other. The glass substrate electroplating jig 100 includes a jig base 110, a first metal clamp 120, and a second metal clamp 130. The first metal clamp 120 is connected to the clamp base 110. The first metal clamp 120 is made of metal, and one side of the first metal clamp 120 is a first concave-convex surface 126 with a continuous and alternating arrangement of concave and convex portions. The convex surfaces at even-numbered positions (e.g., 2, 4, and 6) are embedded with a first soft contact portion 122 made of a resilient material, while the convex surfaces at odd-numbered positions (e.g., 1, 3, and 5) are first hard contact portions 124.
此外,第二金屬夾持件130連接至該夾具基座110,該第二金屬夾持件130為金屬材料製成,且該第二金屬夾持件130之其中一側面為凹凸連續交錯排列的一第二凹凸狀平面136,其中第奇數個位置(例如1、3、5)之凸狀表面為內崁著具有彈性材質之一第二軟性接觸部132,其中第偶數個位置(例如2、4、6)之凸狀表面為一第二硬性接觸部134。 Furthermore, a second metal clamp 130 is connected to the clamp base 110. The second metal clamp 130 is made of metal, and one side of the second metal clamp 130 comprises a second concave-convex surface 136 with a continuous and alternating arrangement of concave and convex portions. The convex surfaces at odd-numbered positions (e.g., 1, 3, and 5) are embedded with a second soft contact portion 132 made of a resilient material, while the convex surfaces at even-numbered positions (e.g., 2, 4, and 6) are second hard contact portions 134.
須注意的是,當在進行電鍍時,夾具基座110會透過該第一金屬夾持件120與該第二金屬夾持件130來夾持該玻璃基板GB,其中第一軟性接觸部122、第一硬性接觸部124、第二軟性接觸部132與第二硬性接觸部134都會接觸到該玻璃基板GB,並且該第一軟性接觸部122係對應於該第二硬性接觸部134,該第一硬性接觸部124係對應於該第二軟性接觸部132。舉例來說,第2、4、6號位置的第一軟性接觸部122對應於第2、4、6號位置的第二硬性接觸部134。第1、3、5號位置的第一硬性接觸部124對應於第1、3、5號位置的第二軟性接觸部132。再者,當在進行電鍍時,第一金屬夾持件為通電狀態且第二金屬夾持件為通電狀態。透過以上,玻璃基板電鍍夾具100透過第一軟性接觸部122與第二軟性接觸部132對玻璃基板GB的接觸可以更柔軟地且彈性地適應玻璃基板GB表面之平整度差異且不易碎。特別的是,由於第一軟性接觸部122與第一硬 性接觸部124之交錯排列,第二軟性接觸部132與第二硬性接觸部134之交錯排列,並且軟硬對應的接觸與夾持方式,更能夠彈性地適用於不同表面平整度之玻璃基板GB,以達到適當的夾持彈力功能需求。 It should be noted that during electroplating, the clamp base 110 clamps the glass substrate GB via the first metal clamp 120 and the second metal clamp 130. The first soft contact portion 122, the first hard contact portion 124, the second soft contact portion 132, and the second hard contact portion 134 all contact the glass substrate GB. Furthermore, the first soft contact portion 122 corresponds to the second hard contact portion 134, and the first hard contact portion 124 corresponds to the second soft contact portion 132. For example, the first soft contact portions 122 at positions 2, 4, and 6 correspond to the second hard contact portions 134 at positions 2, 4, and 6. The first hard contact portions 124 at positions 1, 3, and 5 correspond to the second soft contact portions 132 at positions 1, 3, and 5. Furthermore, during electroplating, the first metal clamp is energized and the second metal clamp is energized. As described above, the glass substrate electroplating fixture 100, through the first and second soft contact portions 122, 132, contacts the glass substrate GB more flexibly and resiliently, adapting to variations in surface flatness of the glass substrate GB and preventing breakage. In particular, the staggered arrangement of the first soft contact portion 122 and the first hard contact portion 124, and the staggered arrangement of the second soft contact portion 132 and the second hard contact portion 134, along with the corresponding soft and hard contact and clamping methods, allows for flexible adaptation to glass substrates GB with varying surface flatness, thereby achieving the appropriate clamping spring requirements.
此外,在另一實施例中,第一軟性接觸部內部具有至少一第一彈簧,並且第二軟性接觸部內部具有至少一第二彈簧。須注意的是,在此並不侷限於彈簧,任何彈性材料之物質在此都能作為彈簧之替代物。 Furthermore, in another embodiment, the first flexible contact portion has at least one first spring therein, and the second flexible contact portion has at least one second spring therein. It should be noted that this is not limited to springs; any elastic material can serve as a spring substitute.
綜上所述,本發明所揭露之玻璃基板電鍍夾具能夠帶來以下功效:1.製作成本低;2.達到更均勻且適當的夾持彈力功能需求;以及3.更能適用於不同表面平整度的玻璃基板。 In summary, the glass substrate electroplating chuck disclosed in the present invention can bring the following benefits: 1. Low manufacturing cost; 2. Achieving more uniform and appropriate clamping spring force requirements; and 3. Greater adaptability to glass substrates with varying surface flatness.
唯以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化或修飾,均應包括於本發明之申請專利範圍內。 The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any equivalent variations or modifications based on the features and spirit described in the patent application of the present invention should be included in the patent application of the present invention.
100:玻璃基板電鍍夾具 100: Glass substrate electroplating fixture
120:第一金屬夾持件 120: First metal clamp
122:第一軟性接觸部 122: First soft contact area
124:第一硬性接觸部 124: First hard contact area
126:第一凹凸狀平面 126: First concave-convex plane
130:第二金屬夾持件 130: Second metal clamp
132:第二軟性接觸部 132: Second soft contact area
134:第二硬性接觸部 134: Second hard contact area
136:第二凹凸狀平面 136: Second concave-convex plane
GB:玻璃基板 GB: Glass substrate
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113138289A TWI891529B (en) | 2024-10-08 | 2024-10-08 | Glass substrate plating fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113138289A TWI891529B (en) | 2024-10-08 | 2024-10-08 | Glass substrate plating fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI891529B true TWI891529B (en) | 2025-07-21 |
Family
ID=97228296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113138289A TWI891529B (en) | 2024-10-08 | 2024-10-08 | Glass substrate plating fixture |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI891529B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW508716B (en) * | 1999-05-25 | 2002-11-01 | Toto Ltd | Electrostatic chuck and treatment device |
| TWM393035U (en) * | 2010-06-08 | 2010-11-21 | C Sun Mfg Ltd | TFT tester table fixture for glass substrate Fixture for a TFT glass substrate tester |
| TW201317172A (en) * | 2011-09-27 | 2013-05-01 | Applied Materials Inc | Carrier for thin glass substrates and apparatus and method using the same |
| TWM665217U (en) * | 2024-10-08 | 2025-01-01 | 億鴻工業股份有限公司 | Glass substrate electroplating fixture |
-
2024
- 2024-10-08 TW TW113138289A patent/TWI891529B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW508716B (en) * | 1999-05-25 | 2002-11-01 | Toto Ltd | Electrostatic chuck and treatment device |
| TWM393035U (en) * | 2010-06-08 | 2010-11-21 | C Sun Mfg Ltd | TFT tester table fixture for glass substrate Fixture for a TFT glass substrate tester |
| TW201317172A (en) * | 2011-09-27 | 2013-05-01 | Applied Materials Inc | Carrier for thin glass substrates and apparatus and method using the same |
| TWM665217U (en) * | 2024-10-08 | 2025-01-01 | 億鴻工業股份有限公司 | Glass substrate electroplating fixture |
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