TW201604329A - Plating carrier assembly - Google Patents
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- TW201604329A TW201604329A TW103124457A TW103124457A TW201604329A TW 201604329 A TW201604329 A TW 201604329A TW 103124457 A TW103124457 A TW 103124457A TW 103124457 A TW103124457 A TW 103124457A TW 201604329 A TW201604329 A TW 201604329A
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- 238000007747 plating Methods 0.000 title abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000009713 electroplating Methods 0.000 claims abstract description 45
- 230000007774 longterm Effects 0.000 abstract description 5
- 230000000087 stabilizing effect Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 101100493710 Caenorhabditis elegans bath-40 gene Proteins 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本發明係關於一種電鍍載具總成，尤指一種應用於電路板之電鍍製程之電鍍設備的電鍍載具總成。The present invention relates to a plating carrier assembly, and more particularly to a plating carrier assembly for an electroplating apparatus for an electroplating process of a circuit board.
電鍍係電子元件製造過程中廣泛應用的一種表面處理製程，其目的在於使待鍍件上披覆有例如銅、鎳、鉻等金屬，藉以達到防鏽、耐磨、導電及美觀等效果。A surface treatment process widely used in the manufacturing process of electroplating electronic components, the purpose of which is to make the metal to be plated with metal such as copper, nickel, chromium, etc., thereby achieving effects such as rust prevention, wear resistance, electrical conductivity and aesthetics.
請參考第1圖，習知用於電路板製程的電鍍設備係具有夾具總成1、與電源供應器(圖未示)電連接之導電極板2及盛裝電鍍液的電鍍槽3，電路板6(待鍍件)係由夾具總成1夾持，夾具總成1係被驅動以移載電路板6至電鍍槽3，並將電路板6浸入電鍍槽3中進行電鍍。習知技術中，夾具總成1頂端係具有導電載台4，導電極板2藉由導線與電源供應器連接，並導電極板2底部設置有導電塊5，夾具總成之導電載台4與導電塊5接觸，以使電源供應器輸出之電流可經由導電極板2、導電塊5及導電載台4傳導至夾具總成1夾持之電路板上。在電鍍過程中，電路板6係作為電鍍之陰極，電鍍液中的金屬離子獲得電子而析出沉積在電路板6表面，因此，導電極板2、夾具總成1及電路板6間的電性導通係影響電鍍品質的重要因素。Referring to FIG. 1 , a plating apparatus for a circuit board process has a fixture assembly 1 , a conductive electrode plate 2 electrically connected to a power supply (not shown), and a plating tank 3 for holding a plating solution, and a circuit board. 6 (to be plated) is held by the jig assembly 1, and the jig assembly 1 is driven to transfer the circuit board 6 to the plating tank 3, and the circuit board 6 is immersed in the plating tank 3 for electroplating. In the prior art, the top end of the clamp assembly 1 has a conductive stage 4, the conductive electrode plate 2 is connected to the power supply by wires, and the conductive block 5 is disposed at the bottom of the conductive electrode plate 2, and the conductive stage 4 of the clamp assembly The contact with the conductive block 5 is such that the current output from the power supply can be conducted to the circuit board clamped by the clamp assembly 1 via the conductive plate 2, the conductive block 5 and the conductive stage 4. In the electroplating process, the circuit board 6 serves as a cathode for electroplating, and metal ions in the electroplating solution acquire electrons and are deposited on the surface of the circuit board 6, and therefore, electrical properties between the electrode plate 2, the jig assembly 1, and the circuit board 6. The conduction system affects the important factors of plating quality.
然而，習知技術中，為使夾具總成1上的導電載台4與導電塊5在製程中可緊密接觸，故各組件之結構係需精密配合，導致設備成本高昂；此外，夾具總成1上的導電載台4與導電塊5因長時間接觸及摩擦，將使導電載台4與導電塊5被磨耗，造成導電載台4與導電塊5之間形成間隙，導致無法導通電流。However, in the prior art, in order to make the conductive stage 4 and the conductive block 5 on the clamp assembly 1 in close contact with each other in the manufacturing process, the structure of each component needs to be closely matched, resulting in high equipment cost; Due to the long-term contact and friction between the conductive stage 4 and the conductive block 5 on the first stage, the conductive stage 4 and the conductive block 5 are abraded, causing a gap between the conductive stage 4 and the conductive block 5, resulting in failure to conduct current.
本發明之一目的在於提供一種電鍍載具總成，其結構簡單且容易加工及組裝，無須高精度對位即可確保良好穩定的導電效能，並可降低設備成本。An object of the present invention is to provide an electroplating carrier assembly which is simple in structure and easy to process and assemble. It can ensure good and stable electrical conductivity without high precision alignment and can reduce equipment cost.
為達上述目的及其他目的，本發明提供一種電鍍載具總成，用於設置在電鍍設備內的支承架上，該支承架具有平行且間隔設置的二導軌，該電鍍載具總成包含複數個導電夾具及二導電極板，該等導電夾具用於可移動地設置在該二導軌上，各該導電夾具係包含一導電基板、二滑輪、二彈性導電片、二導電塊及一夾持件，該導電基板具有相對之第一面與第二面；該二滑輪分別設置於該導電基板之第一面與第二面上，並可滾動地設置於對應之導軌上；該二彈性導電片分別設置於該導電基板之第一面與第二面上，各該彈性導電片具有一結合部與一抵頂部，該結合部係與該導電基板結合；該二導電塊係分別設置於各該彈性導電片之抵頂部上；該夾持件係連接該導電基板，以供夾持一待鍍件；該二導電極板係固定於該支承架上並分別對應於每一導電夾具第一面與第二面上之二導電塊的位置，各該導電塊係可移動地抵接對應之導電極板。To achieve the above and other objects, the present invention provides an electroplating carrier assembly for mounting on a support frame in an electroplating apparatus having parallel and spaced apart two rails, the electroplating carrier assembly comprising a plurality of a conductive fixture and a two-electrode plate, the conductive fixtures are movably disposed on the two rails, each of the conductive fixtures comprises a conductive substrate, two pulleys, two elastic conductive sheets, two conductive blocks and a clamping The conductive substrate has opposite first and second faces; the two pulleys are respectively disposed on the first surface and the second surface of the conductive substrate, and are rollably disposed on the corresponding rails; the two elastic conductive The elastic conductive sheets have a joint portion and a top portion, and the joint portion is coupled to the conductive substrate; the two conductive blocks are respectively disposed on the first surface and the second surface of the conductive substrate. The elastic conductive sheet is abutted on the top; the clamping member is connected to the conductive substrate for holding a plate to be plated; the two conductive plates are fixed on the support frame and respectively correspond to each of the conductive clamps surface Position two conductive surfaces of a second block, each of the conductive block based movably abut corresponding to the conductive plate.
上述之電鍍載具總成，其中進一步包含二收集盤，係分別設置於該支承架上且對應於相抵接之導電塊與導電極板的下方。The above-mentioned electroplating carrier assembly further includes two collecting trays respectively disposed on the supporting frame and corresponding to the underlying conductive blocks and the conductive plates.
上述之電鍍載具總成，其中進一步包含一傳動鏈條，該傳動鏈條係連接該等導電夾具。The above-described electroplating carrier assembly further includes a drive chain that connects the conductive clamps.
上述之電鍍載具總成，其中各該導電夾具進一步包含二抵頂彈簧，該二抵頂彈簧係分別設置於該導電基板之第一面與第二面上，每一抵頂彈簧之二端係分別連接該導電基板與該彈性導電片之抵頂部。In the above-mentioned electroplating carrier assembly, each of the conductive jigs further includes two abutting springs respectively disposed on the first surface and the second surface of the conductive substrate, and the two ends of each of the abutting springs The conductive substrate and the elastic conductive sheet are respectively connected to the top.
上述之電鍍載具總成，其中各彈性導電片係由該結合部朝遠離該導電基板的方向彎折並延伸連接該抵頂部。In the above-mentioned electroplating carrier assembly, each of the elastic conductive sheets is bent from the bonding portion in a direction away from the conductive substrate and extends to connect the abutting top.
上述之電鍍載具總成，其中該二滑輪之軸心係相隔一間距。The above-mentioned electroplating carrier assembly, wherein the axes of the two pulleys are separated by a distance.
上述之電鍍載具總成，其中該夾持件係具有複數個夾爪，該等夾爪係等距配置。The above-described electroplating carrier assembly, wherein the clamping member has a plurality of jaws, the jaws being equidistantly disposed.
因此，上述之電鍍載具總成係以各該彈性導電片連接對應之導電塊及導電基板，使各該導電塊抵接於對應之導電極板，而於各該導電夾具移動時，各該導電塊可穩定緊密地抵接對應之導電極板，進而使導電極板與導電夾具之間的電流流率穩定，並提高電鍍之品質，此外，上述之電鍍載具總成利用彈性導電片使導電塊抵接於導電極板的技術手段，係無須高精度對位即可確保良好穩定的導電效能，結構簡單且容易加工及組裝，故可降低成本；並且，若各該導電塊與各該導電極板因長久使用而導致磨耗，由於彈性導電片之彈力係使該導電塊緊密抵接導電極板，故上述之電鍍載具總成可避免因各該導電塊與各該導電極板一磨耗就產生間隙而無法導通的情形，而減少維修更新導電塊及導電極板的次數與週期。Therefore, in the above-mentioned electroplating carrier assembly, each of the elastic conductive sheets is connected to the corresponding conductive block and the conductive substrate, so that each of the conductive blocks abuts against the corresponding conductive electrode plate, and when each of the conductive clamps moves, each of the conductive clips The conductive block can stably and closely abut the corresponding conductive electrode plate, thereby stabilizing the current flow rate between the conductive electrode plate and the conductive clamp, and improving the quality of the plating. In addition, the above-mentioned plating carrier assembly utilizes an elastic conductive sheet to make The technical means of the conductive block abutting on the conductive electrode plate can ensure good and stable electrical conductivity without high-precision alignment, the structure is simple and easy to process and assemble, so the cost can be reduced; and, if each of the conductive blocks and each of the conductive blocks The conductive electrode plate is worn out due to long-term use. Since the elastic force of the elastic conductive sheet is such that the conductive block closely abuts against the conductive electrode plate, the above-mentioned plating carrier assembly can avoid each of the conductive blocks and each of the conductive plates. The wear causes a gap and cannot be turned on, and the number and period of repairing and updating the conductive block and the electrode plate are reduced.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.
請參考第2圖，本發明實施例之電鍍載具總成10，係用於設置在電鍍設備內的支承架20上，該支承架20具有平行且間隔設置的二導軌21及連接電源供應器的導線22，該電鍍載具總成10係夾持一待鍍件30(例如電路板)並將該待鍍件移載至一電鍍槽40進行電鍍製程，該電鍍槽40係用於盛裝電鍍液且設置有與電源供應器連接之極板。Referring to FIG. 2, the electroplating carrier assembly 10 of the embodiment of the present invention is used for mounting on a support frame 20 in an electroplating apparatus. The support frame 20 has two parallel guide rails 21 and a power supply connected thereto. a plating wire 40 for holding a plated member 30 (for example, a circuit board) and transferring the member to be plated to a plating bath 40 for performing an electroplating process, the plating bath 40 being used for plating The liquid is provided with a plate connected to the power supply.
本發明實施例之電鍍載具總成10包含複數個導電夾具100及二導電極板200，該電鍍載具總成10係組裝於該支承架20上。The electroplating carrier assembly 10 of the embodiment of the present invention includes a plurality of conductive jigs 100 and two conductive plates 200, and the electroplating carrier assembly 10 is assembled on the support frame 20.
該等導電夾具100用於可移動地設置在該二導軌21上，如第3圖及第4圖，各該導電夾具100係包含一導電基板110、二滑輪120、二彈性導電片130、二導電塊140及一夾持件150，該導電基板110具有相對之第一面111與第二面112，該二滑輪120係分別設置於該導電基板110之第一面111與第二面112上，並可滾動地設置於對應之導軌21上；該二彈性導電片130分別設置於該導電基板110之第一面111與第二面112上，配合如第5圖所示，各該彈性導電片130具有一結合部131與一抵頂部132，該結合部131係與該導電基板110結合；該二導電塊140係分別設置於各該彈性導電片130之抵頂部132上；該夾持件150係連接該導電基板110，以供夾持該待鍍件30。The conductive fixtures 100 are movably disposed on the two rails 21, as shown in FIG. 3 and FIG. 4, each of the conductive fixtures 100 includes a conductive substrate 110, two pulleys 120, two elastic conductive sheets 130, and two. a conductive block 140 and a clamping member 150. The conductive substrate 110 has a first surface 111 and a second surface 112. The two pulleys 120 are respectively disposed on the first surface 111 and the second surface 112 of the conductive substrate 110. And the two elastic conductive sheets 130 are respectively disposed on the first surface 111 and the second surface 112 of the conductive substrate 110, and the elastic conductive materials are respectively arranged as shown in FIG. The sheet 130 has a joint portion 131 and a top portion 132. The joint portion 131 is coupled to the conductive substrate 110. The two conductive blocks 140 are respectively disposed on the top portion 132 of each of the elastic conductive sheets 130. The 150 series is connected to the conductive substrate 110 for clamping the member to be plated 30.
該二導電極板200係固定於該支承架20上並分別對應於每一導電夾具100之二導電塊140的位置，各該導電塊140係可移動地抵接對應之導電極板200，即在該導電基板100之第一面111上的導電塊140係可移動地抵接面對該導電基板110之第一面111之導電極板200，在該導電基板100之第二面112上的導電塊140係可移動地抵接面對該導電基板110之第二面112之導電極板200，如第2圖所示，該二導電極板200與該等導線22連接，以使電源供應器至對應之導線22、導電極板200、導電塊140、彈性導電片130及導電基板110係電性連接。The two conductive plates 200 are fixed on the support frame 20 and respectively correspond to the positions of the two conductive blocks 140 of each conductive jig 100. Each of the conductive blocks 140 movably abuts the corresponding conductive electrode plate 200, that is, The conductive block 140 on the first surface 111 of the conductive substrate 100 is movably abutting against the conductive electrode plate 200 facing the first surface 111 of the conductive substrate 110 on the second surface 112 of the conductive substrate 100. The conductive block 140 is movably abutting against the conductive electrode plate 200 facing the second surface 112 of the conductive substrate 110. As shown in FIG. 2, the two conductive electrode plates 200 are connected to the wires 22 for power supply. The wires are electrically connected to the corresponding wires 22, the electrode plates 200, the conductive blocks 140, the elastic conductive sheets 130, and the conductive substrate 110.
於本實施例中，該電鍍載具總成10可包含二收集盤300，係分別設置於該支承架20上且對應於相抵接之導電塊140與導電極板200的下方， 該二收集盤300用於收集相抵接之導電塊140與導電極板200因摩擦產生的碎屑，以避免碎屑掉落至其他組件上及電鍍槽40中，進而減少污染。In this embodiment, the plating carrier assembly 10 can include two collecting trays 300 respectively disposed on the supporting frame 20 and corresponding to the underlying conductive blocks 140 and the lower side of the conductive plate 200. 300 is used to collect debris generated by the friction between the conductive block 140 and the conductive electrode plate 200 to prevent debris from falling onto other components and the plating tank 40, thereby reducing pollution.
據此，本創作實施例之電鍍載具總成10中，係以各該彈性導電片130連接對應之導電塊140及導電基板110，各該彈性導電片130係具有彈力並使各該導電塊140抵接於對應之導電極板200，而使各該導電夾具100移動時，各該導電塊140係可穩定緊密地抵接對應之導電極板200，進而使導電極板200與導電夾具100之間的電流流率穩定，並提高電鍍之品質；並且，若各該導電塊140與各該導電極板200因長久使用而導致磨耗，由於彈性導電片130之彈力係使該導電塊140緊密抵接導電極板200，故可避免因各該導電塊140與各該導電極板200一磨耗就產生間隙而無法導通的情形，可使減少維修更新導電塊140及導電極板200的次數與週期。Accordingly, in the electroplating carrier assembly 10 of the present embodiment, each of the elastic conductive sheets 130 is connected to the corresponding conductive block 140 and the conductive substrate 110, and each of the elastic conductive sheets 130 has an elastic force and each of the conductive blocks When the conductive jigs 100 are moved, each of the conductive blocks 140 can stably and closely abut the corresponding conductive electrode plates 200, thereby causing the conductive plates 200 and the conductive jigs 100. The current flow rate between the two is stable, and the quality of the plating is improved. Moreover, if each of the conductive blocks 140 and each of the conductive plates 200 is worn due to long-term use, the elastic force of the elastic conductive sheet 130 causes the conductive block 140 to be tight. The conductive electrode plate 200 is abutted against the conductive electrode plate 200, so that the gap between the conductive block 140 and each of the conductive electrode plates 200 can be prevented from being turned on, and the number of times of repairing and updating the conductive block 140 and the conductive electrode plate 200 can be reduced. cycle.
此外，如第4圖所示，本實施例之各該導電夾具100，該二滑輪120之軸心係相隔一間距，即該二滑輪120之軸心並不重合，該二滑輪120被該支承架20之二導軌21所支撐，以避免各該導電夾具100因待鍍件30的重量及移動時受力而被轉動。In addition, as shown in FIG. 4, in each of the conductive jigs 100 of the embodiment, the axes of the two pulleys 120 are spaced apart from each other, that is, the axes of the two pulleys 120 do not coincide, and the two pulleys 120 are supported by the support. The two guide rails 21 of the frame 20 are supported to prevent each of the conductive jigs 100 from being rotated due to the weight of the member to be plated 30 and the force applied during the movement.
如第5圖所示，各該彈性導電片130係由該結合部131朝遠離該導電基板110的方向彎折成鈍角並延伸連接該抵頂部132，該結合部131係固定至該導電基板110，該抵頂部132係呈懸空而與該導電基板110間有一距離，各該導電夾具100組裝於該二導電極板200之間時，各該彈性導電片130之抵頂部132被以朝向該導電基板110之方向壓，該彈性導電片130之彈力係使在該抵頂部132上的導電塊140抵頂並接觸對應之導電極板200，因此，在該導電基板100之第一面111上的導電塊140係可穩定緊密地抵接面對該導電基板110之第一面111之導電極板200，在該導電基板100之第二面112上的導電塊140係可穩定緊密地抵接面對該導電基板110之第二面112之導電極板200。As shown in FIG. 5 , each of the elastic conductive sheets 130 is bent at an obtuse angle away from the conductive substrate 110 and extends to the abutting portion 132 . The bonding portion 131 is fixed to the conductive substrate 110 . The top portion 132 is suspended and has a distance from the conductive substrate 110. When the conductive jig 100 is assembled between the two conductive plates 200, the top portion 132 of each of the elastic conductive sheets 130 is directed toward the conductive portion. In the direction of the substrate 110, the elastic force of the elastic conductive sheet 130 causes the conductive block 140 on the abutting top 132 to abut against the corresponding conductive electrode plate 200, and thus on the first surface 111 of the conductive substrate 100. The conductive block 140 can stably and closely abut the conductive electrode plate 200 facing the first surface 111 of the conductive substrate 110. The conductive block 140 on the second surface 112 of the conductive substrate 100 can stably and closely abut the surface. The conductive electrode plate 200 of the second surface 112 of the conductive substrate 110.
如第6圖所示，本實施例中，電鍍設備之入口或每一製程之前端，該二導電極板200之間的距離係隨著各該導電夾具100之移動方向逐漸減小，進入製程中(即對應電解槽的位置)，該二導電極板200係彼此平行。每一導電夾具100移動過程中，各該導電塊140係藉由彈性導電片130穩定抵接於對應之導電極板200。As shown in FIG. 6, in the embodiment, the distance between the two conductive plates 200 at the entrance of the electroplating apparatus or the front end of each process is gradually decreased as the moving direction of each of the conductive jigs 100 moves into the process. In the middle (ie, corresponding to the position of the electrolytic cell), the two conductive plates 200 are parallel to each other. Each of the conductive blocks 140 is stably abutted against the corresponding conductive electrode plate 200 by the elastic conductive sheet 130 during the movement of each of the conductive clips 100.
請參照第7圖至第9圖，本實施例之導電夾具100可進一步包含二抵頂彈簧133，該二抵頂彈簧133係分別設置於該導電基板110之第一面111與第二面112上，每一抵頂彈簧133之二端係分別連接該導電基板110與該彈性導電片130之抵頂部132。據此，如第10圖所示，該二導電極板200間的距離係配置成，各該抵頂彈簧133為壓縮之狀態，即各該導電基板110至各該導電極板200間的距離係小於各該抵頂彈簧133的原長，使各該抵頂彈簧133欲恢復原長而對各該抵頂部132及各該導電塊140施加朝向各該導電塊140所對應之導電極板200方向的力，可使該抵頂部132上的導電塊140抵頂並緊密接觸對應之導電極板200，每一導電夾具100移動過程中，各該導電塊140係藉由各該彈性導電片130及各該抵頂彈簧133而穩定抵接於對應之導電極板200。此外，該二抵頂彈簧132的配置，可讓該二彈性導電片130在長時間使用後發生可能彈性疲乏的問題被減少或避免，進而延長各導電夾具100的使用壽命。Referring to FIG. 7 to FIG. 9 , the conductive jig 100 of the present embodiment may further include two abutting springs 133 respectively disposed on the first surface 111 and the second surface 112 of the conductive substrate 110 . The two ends of each of the abutting springs 133 are respectively connected to the conductive substrate 110 and the abutting portion 132 of the elastic conductive sheet 130. Accordingly, as shown in FIG. 10, the distance between the two conductive plates 200 is such that each of the abutting springs 133 is in a compressed state, that is, the distance between each of the conductive substrates 110 to the respective conductive plates 200. The length of each of the abutting springs 133 is smaller than the original length of each of the abutting springs 133, so that each of the abutting springs 133 is restored to the original length, and the conductive plates 140 corresponding to the conductive blocks 140 are applied to the respective abutting portions 132 and the respective conductive blocks 140. The direction of the force can cause the conductive block 140 on the top portion 132 to abut and closely contact the corresponding conductive electrode plate 200. During the movement of each conductive jig 100, each of the conductive blocks 140 is supported by each of the elastic conductive sheets 130. And each of the abutting springs 133 is stably abutted against the corresponding conductive electrode plate 200. In addition, the configuration of the two abutting springs 132 can reduce or avoid the problem that the elastic conductive sheets 130 may be elastically fatigued after prolonged use, thereby prolonging the service life of each of the conductive jigs 100.
如第11圖所示，本實施例中，該電鍍載具總成10可包含一傳動鏈條400，該傳動鏈條400係連接該等導電夾具100，該傳動鏈條400固定於每一導電夾具100之導電基板110的第二面112上；如第12圖所示，該傳動鏈條400係與一傳動齒輪500囓合，以藉由驅動該傳動齒輪500轉動而帶動該傳動鏈條400，進而使該等導電夾具100移動，進而移載被該等導電夾具100夾持之待鍍件30。As shown in FIG. 11 , in the embodiment, the plating carrier assembly 10 can include a transmission chain 400 , and the transmission chain 400 is connected to the conductive clamps 100 , and the transmission chain 400 is fixed to each of the conductive clamps 100 . The second surface 112 of the conductive substrate 110; as shown in FIG. 12, the transmission chain 400 is meshed with a transmission gear 500 to drive the transmission chain 400 by driving the transmission gear 500 to rotate the conductive chain 400. The jig 100 moves to transfer the member 30 to be plated held by the conductive jigs 100.
此外，本實施例中，各該導電夾具100中，該夾持件150係具有複數個夾爪151，該等夾爪151係等距配置，每一待鍍件30所需之導電夾具100的數量及夾爪151之數量係依據所夾持之待鍍件30的寬度來決定。In addition, in this embodiment, in the conductive jig 100, the clamping member 150 has a plurality of clamping jaws 151, and the clamping jaws 151 are equidistantly disposed, and the conductive clamps 100 required for each of the components to be plated 30 are The number and the number of jaws 151 are determined by the width of the member to be plated 30 to be clamped.
綜上所述，本創作實施例之電鍍載具總成10，係以各該彈性導電片130連接對應之導電塊140及導電基板110，使各該導電塊140抵接於對應之導電極板200，而於各該導電夾具100移動時，各該導電塊140可穩定緊密地抵接對應之導電極板200，進而使導電極板200與導電夾具100之間的電流流率穩定，並提高電鍍之品質，此外，本實施例之電鍍載具總成10利用彈性導電片130使導電塊140抵接於導電極板200的技術手段，無須高精度對位即可確保良好穩定的導電效能，結構係簡單且容易加工及組裝，故可降低成本；並且，若各該導電塊140與各該導電極板200因長久使用而導致磨耗，由於彈性導電片130之彈力係使該導電塊140緊密抵接導電極板200，故本實施例之電鍍載具總成10可避免因各該導電塊140與各該導電極板200一磨耗就產生間隙而無法導通的情形，可使減少維修更新導電塊140及導電極板200的次數與週期。In summary, the electroplating carrier assembly 10 of the present embodiment is connected to the corresponding conductive block 140 and the conductive substrate 110 by the elastic conductive sheets 130, so that the conductive blocks 140 abut against the corresponding conductive plates. 200, when each of the conductive jigs 100 moves, each of the conductive blocks 140 can stably and closely abut the corresponding conductive plate 200, thereby stabilizing the current flow rate between the conductive plates 200 and the conductive jig 100, and improving The quality of the electroplating, in addition, the electroplating carrier assembly 10 of the present embodiment utilizes the elastic conductive sheet 130 to abut the conductive block 140 against the conductive electrode plate 200, and ensures good and stable electrical conductivity without high-precision alignment. The structure is simple and easy to process and assemble, so that the cost can be reduced. Moreover, if each of the conductive blocks 140 and each of the conductive plates 200 is worn due to long-term use, the elastic force of the elastic conductive sheet 130 causes the conductive block 140 to be tight. The electroplating carrier assembly 10 of the present embodiment can avoid the situation that the conductive block 140 and each of the conductive electrode plates 200 are worn out and can not be turned on, thereby reducing the maintenance and renewal of the conductive. Block 1 40 and the number and period of the electrode plates 200.
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
10‧‧‧電鍍載具總成
20‧‧‧支承架
21‧‧‧導軌
22‧‧‧導線
30‧‧‧待鍍件
40‧‧‧電鍍槽
100‧‧‧導電夾具
110‧‧‧導電基板
111‧‧‧第一面
112‧‧‧第二面
120‧‧‧滑輪
130‧‧‧彈性導電片
131‧‧‧結合部
132‧‧‧抵頂部
133‧‧‧抵頂彈簧
140‧‧‧導電塊
150‧‧‧夾持件
151‧‧‧夾爪
200‧‧‧導電極板
300‧‧‧收集盤
400‧‧‧傳動鏈條
500‧‧‧傳動齒輪10‧‧‧Electroplating vehicle assembly
20‧‧‧Support frame
21‧‧‧ rails
22‧‧‧Wire
30‧‧‧To be plated
40‧‧‧ plating bath
100‧‧‧Conductive fixture
110‧‧‧Electrical substrate
111‧‧‧ first side
112‧‧‧ second side
120‧‧‧ pulley
130‧‧‧elastic conductive sheet
131‧‧‧Combination Department
132‧‧‧ arrive at the top
133‧‧‧Abutting spring
140‧‧‧Electrical block
150‧‧‧Clamping parts
151‧‧‧claw
200‧‧‧electrode plate
300‧‧‧Collection tray
400‧‧‧Drive chain
500‧‧‧Transmission gear
第1圖係為習知電鍍設備的結構示意圖。 第2圖係為本發明實施例之電鍍載具總成的結構示意圖。 第3圖係為本發明實施例中導電夾具的結構示意圖。 第4圖係為本發明實施例中導電夾具的結構側視示意圖。 第5圖係為第4圖中由A-A’觀看之視角的示意圖。 第6圖係顯示本發明實施例中導電夾具之導電塊移動於二導電極板上的示意圖。 第7圖係為本發明實施例之電鍍載具總成中，導電夾具進一步包含抵頂彈簧的示意圖。 第8圖係為本發明實施例中導電夾具包含抵頂彈簧的結構示意圖。 第9圖係為本發明實施例中導電夾具包含抵頂彈簧之俯視圖。 第10圖係顯示第8圖之導電夾具之導電塊移動於二導電極板上的示意圖。 第11圖係為本發明實施例中複數個電鍍載具總成夾持電路板的示意圖。 第12圖係為本發明實施例中傳動齒輪結合複數個導電夾具的示意圖。Figure 1 is a schematic view of the structure of a conventional electroplating apparatus. 2 is a schematic structural view of an electroplating carrier assembly according to an embodiment of the present invention. Figure 3 is a schematic view showing the structure of a conductive jig in the embodiment of the present invention. Figure 4 is a side elevational view showing the structure of the conductive jig in the embodiment of the present invention. Fig. 5 is a schematic view of the angle of view viewed from A-A' in Fig. 4. Figure 6 is a schematic view showing that the conductive block of the conductive jig is moved on the two-electrode plate in the embodiment of the present invention. Figure 7 is a schematic view of the electroplating fixture assembly of the embodiment of the present invention, further comprising an abutting spring. Figure 8 is a schematic view showing the structure of the conductive jig including the abutting spring in the embodiment of the present invention. Figure 9 is a plan view of the conductive jig including the abutting spring in the embodiment of the present invention. Figure 10 is a schematic view showing that the conductive block of the conductive jig of Figure 8 is moved on the two-electrode plate. Figure 11 is a schematic view showing a plurality of electroplating carrier assemblies holding circuit boards in the embodiment of the present invention. Figure 12 is a schematic view showing the transmission gear combined with a plurality of conductive clamps in the embodiment of the present invention.
10‧‧‧電鍍載具總成 10‧‧‧Electroplating vehicle assembly
20‧‧‧支承架 20‧‧‧Support frame
21‧‧‧導軌 21‧‧‧ rails
22‧‧‧導線 22‧‧‧Wire
30‧‧‧待鍍件 30‧‧‧To be plated
40‧‧‧電鍍槽 40‧‧‧ plating bath
100‧‧‧導電夾具 100‧‧‧Conductive fixture
110‧‧‧導電基板 110‧‧‧Electrical substrate
111‧‧‧第一面 111‧‧‧ first side
112‧‧‧第二面 112‧‧‧ second side
120‧‧‧滑輪 120‧‧‧ pulley
130‧‧‧彈性導電片 130‧‧‧elastic conductive sheet
140‧‧‧導電塊 140‧‧‧Electrical block
150‧‧‧夾持件 150‧‧‧Clamping parts
200‧‧‧導電極板 200‧‧‧electrode plate
300‧‧‧收集盤 300‧‧‧Collection tray
400‧‧‧傳動鏈條 400‧‧‧Drive chain
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103124457A TWI537431B (en) | 2014-07-16 | 2014-07-16 | Electroplating vehicle assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103124457A TWI537431B (en) | 2014-07-16 | 2014-07-16 | Electroplating vehicle assembly |
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| Publication Number | Publication Date |
|---|---|
| TW201604329A true TW201604329A (en) | 2016-02-01 |
| TWI537431B TWI537431B (en) | 2016-06-11 |
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Cited By (1)
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| CN113882004A (en) * | 2021-10-28 | 2022-01-04 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113882004A (en) * | 2021-10-28 | 2022-01-04 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
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