TWI890991B - Pressing mechanism, testing device, and processing machine - Google Patents

Abstract

The pressing mechanism includes a rack member, a support seat, a pipeline unit, and a pressing member. The support seat has a first cavity. The first face of the support seat is formed with an opening communicating the first cavity. The pipeline unit has a first inlet pipe and a first outlet pipe communicating the first cavity so as to inject a first fluid into the first cavity or to draining the first fluid from the first cavity. The pressing member is disposed on the first face of the support seat to close the opening. The pressing member also contacts the first fluid. The pressure from the first fluid is exerted onto the pressing member so that the pressing member is able to bend to fit the arc surface of the electronic component. Thus, the electronic component can be pressed evenly for testing.

Description

Crimping mechanism, testing equipment and operating machine

The present invention provides a press-fit mechanism in which a joint member deforms under pressure to fully fit the curved surface of an electronic component, thereby evenly pressurizing the electronic component and improving test quality.

Today, after electronic components are manufactured, they must be tested using a test device to eliminate defective products. Referring to Figure 1, the test device comprises an electrically connected circuit board 11 and a test socket 12 for holding and testing electronic components 13. To ensure effective contact between the contacts of electronic component 13 and the probes of test socket 12, a press-fit fixture 141 is positioned above test socket 12. The press-fit fixture 141 has a flat surface 142 that presses against the top surface 131 of electronic component 13 with a predetermined pressure to perform the test.

However, the top surfaces 131 of some electronic components 13 are non-planar, such as concave or convex arcs. When the crimper 14 uses the lower pressing jig 141 to press a component 13 with a concave top surface 131, the flat pressing surface 142 of the lower pressing jig 141 cannot conform to the concave top surface 131 of the electronic component 13. As a result, the lower pressing jig 141 cannot evenly press the electronic component 13 with the preset pressure. As a result, the pressure on the electronic component 13 is uneven, causing some contacts on the electronic component 13 to not reliably contact the probes on the test socket 13, thereby affecting test accuracy and quality. Furthermore, if the crimper 14 must transfer the temperature of the temperature control unit (not shown) to the electronic component 13, the crimping surface 142 of the pressing fixture 141 will not be able to conform to the concave top surface 131 of the electronic component 13, which will also affect the temperature transfer and, in turn, the test quality of the electronic component 13.

A first object of the present invention is to provide a press-fit mechanism comprising a mounting fixture, a socket, a piping unit, and a connector. The socket is mounted on the mounting fixture and defines a first chamber. The socket has an opening on a first surface along the axis of the press-fitting direction that communicates with the first chamber. The piping unit is mounted on the socket and defines a first input line and a first output line that communicate with the first chamber, for supplying and discharging a first fluid into and out of the first chamber. The connector is mounted on the first surface of the socket to seal the opening of the first chamber and contact the first fluid. The connector withstands the pressure of the first fluid in the first chamber and is able to bend and deform to fully conform to the curved surface of the electronic component. This allows the electronic component to be evenly pressed with a predetermined downward pressure, ensuring uniform pressure on the electronic component during testing, thereby improving test quality.

A second object of the present invention is to provide a press-fitting mechanism, wherein the support further includes at least one temperature control unit, which can be displaced in at least one direction in the first chamber to approach or move away from the joint piece to adjust the temperature of the joint piece to a preset press-fitting temperature, thereby improving the performance.

A third object of the present invention is to provide a testing device comprising a testing mechanism and the present invention's crimping mechanism, wherein the testing mechanism is provided with at least one tester for testing electronic components; the present invention's crimping mechanism comprises a mounting fixture, a holder, a piping unit, and a connector for crimping the electronic components of the tester.

A fourth object of the present invention is to provide an operating machine comprising a machine, a feeding device, a receiving device, a testing device, a conveying device, and a central control device. The feeding device is disposed on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is disposed on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device is disposed on the machine and is provided with a testing mechanism and the crimping mechanism of the present invention for testing and crimping electronic components; the conveying device is disposed on the machine and is provided with at least one conveyor for conveying electronic components; and the central control device controls and integrates the operations of each device to perform automated operations.

To help you better understand this invention, we will provide you with a better understanding of this invention by providing a preferred embodiment with accompanying drawings.

Please refer to Figure 2. The compression joint mechanism of the present invention includes a mounting device, a socket, a pipe unit and a joint.

The mounting device can be fixed or movable. For example, the mounting device can be a fixed rack, and the tester (not shown) can be displaced toward the mounting device along the compression axis. For example, the mounting device can be a movable arm that can be displaced in at least one direction and displaced along the compression axis toward the tester. In this embodiment, the mounting device is a movable arm 21, and a first actuator (not shown) drives the movable arm 21 to displace in the Z direction along the compression axis L.

The support is assembled to the mounting fixture and defines at least one first cavity. An opening is formed on the first surface of the support along the press-fit axis L, communicating with the first cavity. Depending on operational requirements, the support may include at least one first component, a first component and a second component, or even more components. In this embodiment, the support includes a first component 22, within which a first cavity 221 is defined. The bottom surface of the first component 22 serves as a first surface 222, and an opening 223 is formed along the press-fit axis L, communicating with the first cavity 221, from the first surface 222.

The piping unit is assembled to the base and is provided with a first input line and a first output line communicating with the first chamber 221 for supplying and discharging a first fluid into and out of the first chamber 221. Furthermore, the first fluid can be a gas or a liquid. Depending on the operating requirements, the first fluid can be a room-temperature fluid or a fluid with a preset temperature (e.g., a cryogenic liquid). In this embodiment, the piping unit is provided with a first input line 231 communicating with the first chamber 221 on one side of the first component 22 for supplying the first fluid at a preset low temperature into the first chamber 221. The piping unit is provided with a first output line 232 communicating with the first chamber 221 on the other side of the first component 22 for discharging the first fluid from the first chamber 221.

The connector 24 is mounted on the first surface 222 of the base to seal the opening 223 of the first chamber 221 and contact the first fluid. The connector 24 withstands the pressure of the first fluid in the first chamber 221, allowing it to bend and deform to conform to the curved surface of the electronic component, thereby evenly pressing down on the electronic component. Furthermore, the connector 24 is made of a deformable material, such as a thin metal or silicone. Depending on the application requirements, the connector 24 may also have thermal conductivity to transfer heat to the electronic component.

In this embodiment, the connector 24 is assembled to the first surface 222 of the first component 22 of the support, thereby sealing the opening 223 of the first chamber 221. The pressure-bearing surface 241 contacts the first fluid in the first chamber 221, thereby being able to withstand the pressure and temperature conduction of the first fluid. The pressing surface 242 of the connector 24 is provided for pressing and fitting the curved surface (e.g., the top surface) of the electronic component (not shown), allowing the electronic component to perform testing operations in a simulated future application temperature environment.

According to operational requirements, the first input pipeline 231 of the pipeline unit can be connected to a hydraulic control valve to adjust the flow rate of the first fluid and control the pressure of the first fluid in the first chamber 221.

According to the working requirements, the holder can also separate the first chamber 221 of the first component 22 into a second chamber (not shown) with a partition (not shown in the figure). The first chamber 221 is used for the first input pipe 231 of the pipeline unit to input a first fluid at room temperature, and the first fluid is used for the connector 24 to bend and deform to fit the curved surface of the electronic component; the pipeline unit is provided with a second input pipe (not shown in the figure) and a second output pipe (not shown in the figure) connected to the second chamber for inputting/outputting the second fluid. The temperature of the second fluid can be the same as or different from the temperature of the first fluid. For example, the second fluid has a preset test temperature for temperature-controlling the electronic component through the first fluid, the partition and the connector 24. The pressure of the first fluid in the first chamber 221 may be different from the pressure of the second fluid in the second chamber. The pipeline unit may independently adjust the pressure of the first fluid in the first chamber 221 to increase the service life of the joint 24.

According to the working requirements, the support is provided with a first component 22 and a second component (not shown in the figure). The first component 22 has a first chamber 221, and the second component has a second chamber. The piping unit is provided with a first input pipe 231 and a first output pipe 232 connected to the first chamber 221 for inputting/outputting a first fluid in the first chamber 221. The piping unit is also provided with a second input pipe (not shown in the figure) and a second output pipe (not shown in the figure) connected to the second chamber for inputting/outputting a second fluid in the second chamber.

As mentioned above, the support is provided with at least one temperature control unit between the first component 22 and the second component to assist in regulating the temperature of the joint 24 .

Referring to Figures 3 and 4 , the present test device 20 includes a test mechanism and a crimping mechanism. The test mechanism is equipped with at least one tester for testing electronic components. In this embodiment, the tester includes an electrically connected circuit board 251 and a test socket 252. The test socket 252 has multiple probes for electrically connecting the circuit board 251 and the electronic component 31 to perform testing operations. The crimping mechanism is positioned above the test mechanism to crimp the electronic components of the tester.

A conveyor (not shown) moves the electronic component 31 into the test seat 252 of the test mechanism. The top surface 311 of the electronic component 31 is concave and faces the joint 24 of the press-fit mechanism. The first input line 231 of the press-fit mechanism inputs an appropriate amount of first fluid with a preset temperature into the first chamber 221 of the first component 22, so that the first chamber 221 has an appropriate pressure. The first fluid contacts the pressure-bearing surface 241 of the joint 24, causing the joint 24 to be pushed by the first fluid in the first chamber 221 and deform into an appropriate curved convex shape.

The pressing mechanism uses a first driver (not shown) to drive the moving arm 21 to move downward in the Z direction along the pressing axis L. The moving arm 21 drives the first component 22 and the joint member 24 to move downward synchronously, so that the pressing surface 242 of the joint member 24 contacts the concave arc-shaped top surface 311 of the electronic component 31. Since the joint member 24 can be elastically bent and deformed, and the first cavity 221 has appropriate pressure, the joint member 24 can first contact the top surface 311 of the electronic component 31 smoothly and then bend and deform along with the concave arc shape of the top surface 311. After the joint member 24 contacts the electronic component 31, the first input pipeline 2 can be added. The first fluid flow rate 31 is input into the first chamber 221, causing the pressure of the first chamber 221 to reach a preset contact pressure. This causes the first fluid in the first chamber 221 to further push against the contact surface 242 of the connector 24, causing it to bend and deform to fully fit the concave arc-shaped top surface 311 of the electronic component 31. Combined with the downward pressure of the moving arm 21, the connector 24 evenly presses the top surface 311 of the electronic component 31 with the preset downward pressure, causing the electronic component 31 to be evenly pressurized. This ensures that the contacts of the electronic component 31 and the probe of the test socket 252 make effective contact, thereby improving the test quality of the electronic component 31.

However, depending on operational requirements, the flow rate of the first fluid input into the first chamber 221 through the first input line 231 can also directly cause the pressure of the first chamber 221 to reach a preset pressing pressure. The first fluid in the first chamber 221 will also push the pressing surface 242 of the connector 24 to bend and deform to fully fit the concave arc-shaped top surface 311 of the electronic component 31, without being limited to this embodiment.

Please refer to FIG5. The present invention's press-fit mechanism is applied to another type of electronic component 32. The top surface 321 of the other type of electronic component 32 is convex. The moving arm 21 of the press-fit mechanism drives the first component 22 and the joint 24 to move downward in the Z direction along the press-fit axis L, so that the press-fit surface 242 of the joint 24 contacts the convex top surface 321 of the electronic component 32, and the first chamber 2 The first fluid of the connector 21 pushes against the pressing surface 242 of the connector 24, causing it to bend and deform to fully fit the convex arc-shaped top surface 321 of the electronic component 32. This allows the connector 24 to evenly press the top surface 321 of the electronic component 32 with a preset downward pressure. The electronic component 32 is evenly pressurized to ensure that the contacts of the electronic component 32 and the probe of the test socket 252 are effectively in contact, thereby improving the test quality of the electronic component.

Please refer to Figure 6. Another embodiment of the crimping mechanism of the present invention further includes at least one temperature control unit provided in the first chamber 221 of the support. Furthermore, the temperature control unit is a heating element or a cooling chip. According to the working requirements, the temperature control unit is a fixed configuration or a movable configuration. In this embodiment, a temperature control unit for a heating element 26 is provided in the first chamber 221 supported on the first component 22, and a second driver 27 is provided to drive the heating element 26 to move in at least one direction to approach or move away from the joint 24, so as to adjust the distance between the heating element 26 and the joint 24, so as to adjust the temperature of the joint 24 to the preset crimping temperature; for example, if the temperature conducted by the joint 24 does not reach the preset test temperature, the heating element 26 can be started to adjust the joint. The temperature conducted by the joint 24; more preferably, the second driver 27 is used to drive the heating element 26 to move in the Z direction and approach the joint 24 to shorten the temperature conduction distance between the heating element 26 and the joint 24, so that the heating element 26 can facilitate the regulation of the temperature conducted by the joint 24, so that the joint 24 conducts the preset test temperature to the electronic component 31, thereby ensuring that the electronic component 31 performs the test operation in the simulated future application temperature environment, thereby improving the use efficiency.

Please refer to Figures 2 to 4. The operating machine of the present invention includes a machine 40, a feeding device 50, a receiving device 60, a testing device 20 with a crimping mechanism of the present invention, a conveying device 70, and a central control device (not shown). The feeding device 50 is mounted on the machine 40 and is provided with at least one feeder 51 to accommodate at least one electronic component 31 to be tested; the receiving device 60 is mounted on the machine 40 and is provided with at least one receiver 61 to accommodate at least one electronic component 31 that has been tested; the testing device 20 is arranged on the machine 40 and is provided with a testing mechanism and the crimping mechanism of the present invention. The testing mechanism is provided with at least one tester for testing the electronic component 31. In this embodiment, the tester is provided with an electrically connected The circuit board 251 and the test seat 252, the test seat 252 has a probe for holding and testing the electronic component 31; the crimping mechanism of the present invention is arranged above the test mechanism and includes a mounting tool, a seat, a pipe unit and a joint 24 for crimping the electronic components of the tester; the conveying device 70 is assembled on the machine 40 and is provided with at least one conveyor for conveying the electronic components. In this embodiment, the conveying device 70 is provided with a first conveyor 71 for feeding the feeding device 50. The feeder 51 takes out the electronic component 31 to be tested and transfers it to the second conveyor 72. The conveying device 70 takes out the electronic component 31 to be tested from the second conveyor 72 with the third conveyor 73 and moves the electronic component 31 to be tested into the test seat 252 of the test mechanism. The pressing mechanism uses the moving arm 21 to drive the first component 22 and the joint 24 to move downward in the Z direction. The joint 24 presses the top surface 311 of the electronic component 31 and bends and deforms to fully fit it, so that the electronic component 31 is pressed. 1 is uniformly pressed to perform the test operation. The third conveyor 73 transfers the tested electronic component 31 to the second conveyor 72. The first conveyor 71 removes the tested electronic component 31 from the second conveyor 72 and, based on the test results, transports the tested electronic component 31 to the receiver 61 of the receiving device 60 for classification and storage. The central control device (not shown) is used to control and integrate the operations of various devices to perform automated operations and achieve practical benefits of improving operating efficiency.

[Knowledge] 11: Circuit board 12: Test socket 13: Electronic component 131: Top surface 14: Press fitter 141: Pressing fixture 142: Pressing surface [Invention] 20: Test device 21: Moving arm 22: First component 221: First chamber 222: First surface 223: Opening 231: First input line 232: First output line 24: Connector 241: Pressure-bearing surface 242: Pressing surface 251: Circuit board 252: Test socket 26: Heating element 27: Second actuator L: Pressing axis 31: Electronic component 311: Top surface 32: Electronic components 321: Top surface 40: Machine 50: Feeder 51: Feeder 60: Receiver 61: Receiver 70: Conveyor 71: First conveyor 72: Second conveyor 73: Third conveyor

Figure 1: Schematic diagram of a conventional test device used to press-test electronic components. Figure 2: Schematic diagram of the crimping mechanism of the present invention. Figure 3: Schematic diagram of the crimping mechanism of the present invention used in a test device. Figure 4: Schematic diagram of the crimping mechanism of the present invention used to press-test electronic components. Figure 5: Schematic diagram of the crimping mechanism of the present invention used to press-test another type of electronic component. Figure 6: Schematic diagram of the crimping mechanism of the present invention used to attach a temperature control unit. Figure 7: Schematic diagram of the test device of the present invention used in a workpiece.

21: Moving Arm

22: First component

221: First Chamber

222: First Side

223: Opening

231: First input pipeline

232: First output pipeline

24: Joints

241: Pressure-bearing surface

242: Pressed joint surface

L: Press-fit axial direction

Claims (10)

A press-fit mechanism comprises: a mounting fixture; a socket, mounted on the mounting fixture and provided with at least one first chamber; an opening on a first surface of the socket, extending along the press-fit axis and located at the bottom thereof, communicating with the first chamber; a piping unit, mounted on the socket, and provided with a first input pipe and a first output pipe communicating with the first chamber, for supplying and discharging a first fluid to and from the first chamber; a coupling member, mounted on the first surface of the socket to seal the opening of the first chamber and located at the bottom thereof, with a pressure-bearing surface of the coupling member contacting the first fluid. The coupling member is capable of bending and deforming under pressure from the first fluid, and its press-fit surface is adapted to contact the curved surface of an electronic component, thereby evenly pressing the electronic component downward. In the press-fit mechanism of claim 1, the seat is provided with at least one first component, the first component having the first chamber with the opening, the first input pipe and the first output pipe of the pipe unit communicating with the first chamber of the first component, and the coupling member being mounted on the first surface of the first component. As described in claim 2, the first component of the compression mechanism separates the first chamber into a second chamber by a partition, and the pipeline unit is provided with a second input pipeline and a second output pipeline connected to the second chamber to provide input/output of a second fluid in the second chamber. The press-fit mechanism of claim 2, wherein the seat comprises the first component and a second component, wherein the second component is provided with a second chamber, and the pipe unit is provided with a second input pipe and a second output pipe communicating with the second chamber for supplying/discharging a second fluid to/from the second chamber. In the compression joint mechanism as described in claim 4, the seat is provided with at least one temperature control unit between the first component and the second component. In the compression mechanism of any one of claims 3 to 5, the first fluid pressure in the first chamber is different from the second fluid pressure in the second chamber. The compression joint mechanism as described in any one of claims 1 to 4, wherein the first chamber of the support is provided with at least one temperature control unit. In the press-fit mechanism as described in claim 7, the seat is provided with a second actuator, and the second actuator is used to drive the temperature control unit to move in at least one direction. A testing device comprising: A testing mechanism equipped with at least one tester for testing electronic components; At least one crimping mechanism as described in claim 1 for crimping the electronic component of the tester. A processing machine comprises: a machine; a feeding device, disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be tested; a receiving device, disposed on the machine and equipped with at least one receiver for accommodating at least one tested electronic component; a conveying device, disposed on the machine and equipped with at least one conveyor for conveying electronic components; at least one testing device as described in claim 9, disposed on the machine for testing and crimping electronic components; a central control device, configured to control and integrate the operations of various devices to perform automated operations.