TWI890881B - Composition, film, filter, solid-state imaging element, image display device, and infrared sensor - Google Patents

Abstract

The present invention provides a composition capable of forming a film having excellent infrared shielding properties, a film, a filter, a solid-state imaging element, an image display device, and an infrared sensor. The composition contains an infrared absorber and a curable compound, wherein the infrared absorber includes a compound represented by formula (1), and the content of the compound represented by formula (1) in the total solid content of the composition is 3% by mass or more.

Description

Composition, film, filter, solid-state imaging element, image display device, and infrared sensor

The present invention relates to a composition containing an infrared absorber and a curable compound. Furthermore, the present invention relates to a film, a filter, a solid-state imaging device, an image display device, and an infrared sensor using the composition.

Video cameras, digital cameras, and mobile phones with camera functions use CCDs (charge-coupled devices) and CMOSs (complementary metal oxide semiconductors) as solid-state imaging devices for color imaging. These solid-state imaging devices utilize silicon photodiodes (SiPDs) in their light-receiving areas, which are sensitive to infrared light. Therefore, infrared cut filters are sometimes installed to correct for visibility. Infrared cut filters are manufactured using a composition containing an infrared absorber and a curable compound.

Alternatively, a step of manufacturing an infrared transmission filter using a composition containing an infrared absorber and a curable compound can be performed. By including an infrared absorber in the infrared transmission filter, the infrared region of the light (infrared light) transmitted by the infrared transmission filter can be shifted further toward longer wavelengths.

In this manner, a step of forming an infrared cut filter or an infrared transmission filter, etc., using a composition containing an infrared absorber and a curable compound can also be performed.

Non-patent document 1 states that the compound with the following structure exhibits a maximum absorption wavelength at 922 nm in dichloromethane, but lacks a clear absorption band in the visible region.

[Non-patent document 1] Hiroyuki Shimogawa, Yasujiro Murata, and Atsushi Wakamiya, “NIR-Absorbing Dye Based on BF2-Bridged Azafulvene Dimer as a Strong Electron-Accepting Unit”, “Organic Letters”, American Chemical Society, 2018, Vol. 20, No. 17, pp. 5135-5138

In recent years, there has been a demand for further improvements in the spectral properties of films obtained using compositions containing infrared absorbers and curable compounds. For example, there is a demand for superior shielding properties at longer wavelengths of infrared light.

Therefore, an object of the present invention is to provide a composition capable of forming a film with excellent infrared shielding properties. Furthermore, an object of the present invention is to provide a film, a filter, a solid-state imaging element, an image display device, and an infrared sensor using the composition.

The inventors conducted research on compositions containing infrared absorbers and curable compounds and discovered that using the composition described below can form a film with excellent infrared shielding properties, leading to the completion of the present invention. Consequently, the present invention provides the following.

<1> A composition comprising an infrared absorber and a curable compound, wherein the infrared absorber comprises a compound represented by formula (1), and the content of the compound represented by formula (1) in the total solid content of the composition is 3% by mass or more,

In formula (1), ^Ar1 and ^Ar2 each independently represent a nitrogen-containing heterocyclic ring that can be condensed to form a polycyclic ring, ^R1 and ^R2 each independently represent a substituent, n1 and n2 each independently represent an integer greater than 0, ^Y1 and ^Y2 each independently represent -O-, -S-, or -NR ^Y1 -, ^RY1 represents a hydrogen atom or a substituent, ^X1 and ^X2 each independently represent a hydrogen atom, -BR ^{X1 RX2} , or a metal atom that can be coordinated by a ligand, ^RX1 and ^RX2 each independently represent a hydrogen atom or a substituent, and ^RX1 and ^RX2 may be bonded to form a ring.

<2> The composition as described in <1>, wherein n1 and n2 in the above formula (1) each independently represent an integer greater than 1, and ^R1 and ^R2 in the above formula (1) each independently represent an aryl group or a heteroaryl group.

<3> The composition as described in <1> or <2>, wherein ^Y1 and ^Y2 in the above formula (1) are -O-.

<4> The composition according to any one of <1> to <3>, wherein ^X1 and ^X2 in the above formula (1) each independently represent ^-BRX1RX2 , ^RX1 and ^RX2 each independently represent a hydrogen atom or a substituent, ^{and RX1 and RX2} may be bonded to form a ring.

<5> The composition according to any one of <1> to <4>, wherein ^RX1 and ^RX2 independently represent a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an alkoxy group, or an aryloxy group, and ^RX1 and ^RX2 may be bonded to form a ring.

<6> The composition as described in any one of <1> to <5>, wherein the maximum absorption wavelength of the compound represented by the above formula (1) in dichloromethane exists in the wavelength range of 1000~1600nm.

<7> The composition as described in any one of <1> to <6>, wherein the infrared absorber contains a compound other than the compound represented by the above formula (1).

<8> The composition as described in any one of <1> to <7>, further comprising a coloring agent.

<9> The composition according to any one of <1> to <8>, wherein the curable compound contains a resin having an acid group.

<10> The composition according to any one of <1> to <9>, wherein the curable compound contains a polymerizable compound.

<11> The composition according to any one of <1> to <10>, wherein the curable compound contains a resin having a glass transition temperature of 150°C or higher.

<12> The composition described in any one of <1> to <11>, which is used in an infrared sensor.

<13> A film obtained using the composition described in any one of <1> to <12>.

<14> A filter comprising the film described in <13>.

<15> A solid-state imaging device comprising the film described in <13>.

<16> An image display device comprising the film described in <13>.

<17> An infrared sensor comprising the film described in <13>.

According to the present invention, a composition capable of forming a film with excellent infrared shielding properties, a film, a filter, a solid-state imaging element, an image display device, and an infrared sensor can be provided.

110: Solid-state imaging device

111: Infrared cutoff filter

112: Color filter

114: Infrared rays pass through the filter

115: Microscope

116: Planarization layer

Figure 1 is a schematic diagram showing one embodiment of an infrared sensor.

The following is a detailed description of the contents of this invention.

In this manual, "~" is used to mean that the numerical values listed before and after it are inclusive as lower and upper limits.

In this specification, the symbols for groups (atomic groups) that do not indicate substituted or unsubstituted include groups (atomic groups) without substituents as well as groups (atomic groups) with substituents. For example, "alkyl" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups).

In this specification, "exposure," unless otherwise specified, includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of mercury lamps, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, and actinic radiation such as electron beams, or radiation.

In this specification, "(meth)acrylate" refers to both or either acrylate and methacrylate, "(meth)acrylic acid" refers to both or either acrylic acid and methacrylic acid, and "(meth)acryl" refers to both or either acryl and methacryl.

In this specification, weight-average molecular weight and number-average molecular weight are defined as polystyrene-equivalent values measured by gel permeation chromatography (GPC).

In this specification, Me in the chemical formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.

In this manual, infrared refers to light (electromagnetic waves) with a wavelength of 700 to 2500 nm.

In this specification, the total solid content refers to the total mass of the components excluding the solvent from the total components of the composition.

In this manual, pigment refers to color materials that are not easily soluble in solvents.

In this specification, the term "step" includes not only independent steps but also steps that cannot be clearly distinguished from other steps as long as they achieve the intended effect of the process.

<Composition>

The composition of the present invention contains an infrared absorber and a curable compound. The composition is characterized in that the infrared absorber contains a compound represented by formula (1), and the content of the compound represented by formula (1) in the total solid content of the composition is 3% by mass or more.

The composition of the present invention can form a film with excellent infrared shielding properties. In particular, it can form a film with excellent infrared shielding properties of longer wavelengths, such as 1100 nm or more. Although the specific reason for this effect is unclear, it is speculated that the composition of the present invention contains 3% by mass or more of the compound represented by formula (1) in the total solid content of the composition. Therefore, when the composition is used to form a film, the combination of the compound represented by formula (1) is promoted in the film. It is speculated that by forming a complex of the compound represented by formula (1) in the film, the absorption peak of the compound represented by formula (1) is shifted to the longer wavelength side compared to the state of a single molecule. As a result, a film with excellent infrared shielding properties that can shield infrared rays of longer wavelengths can be formed.

The composition of the present invention can be used as a filter composition. Examples of such filters include infrared cut filters and infrared transmission filters. Furthermore, the composition of the present invention is preferably used in infrared sensors. More specifically, it is preferably used as the aforementioned filter composition in an infrared sensor having a filter.

The following describes the components used in the composition of the present invention.

<<Infrared absorber>>

The composition of the present invention contains an infrared absorber. The infrared absorber used in the composition of the present invention contains a compound represented by formula (1). Hereinafter, the compound represented by formula (1) is also referred to as a specific infrared absorbing compound.

In formula (1), ^Ar1 and ^Ar2 each independently represent a nitrogen-containing heterocyclic ring, ^R1 and ^R2 each independently represent a substituent, n1 and n2 each independently represent an integer greater than 0, ^Y1 and ^Y2 each independently represent -O-, -S-, or -NR ^Y1 -, ^RY1 represents a hydrogen atom or a substituent, ^X1 and ^X2 each independently represent a hydrogen atom, -BR ^{X1 RX2} , or a metal atom to which a ligand can coordinate, ^RX1 and ^RX2 each independently represent a hydrogen atom or a substituent, and ^RX1 and ^RX2 may be bonded to form a ring.

The nitrogen-containing heterocyclic ring represented by ^Ar1 and ^Ar2 in formula (1) may be a monocyclic ring or a condensed ring. The condensed ring preferably has a condensation number of 2 to 8, more preferably 2 to 4, and even more preferably 2 or 3. The nitrogen-containing heterocyclic ring represented by ^Ar1 and ^Ar2 is preferably a nitrogen-containing heteroaromatic ring.

Examples of the nitrogen-containing heterocyclic ring represented by Ar ¹ and Ar ² include pyrrole ring, imidazole ring, pyrazole ring, Azole, thiazole, triazole, tetrazole, pyridine, tathazole Ring, pyrimidine ring, pyridine Rings and condensed rings containing these rings. Examples of the condensed ring include indole ring, isoindole ring, benzimidazole ring, benzo Azoline ring, benzothiazole ring, benzotriazole ring, purine ring, quinoline ring, isoquinoline ring, quinazoline ring, quinoline ring The nitrogen-containing heterocyclic ring represented by Ar ¹ and Ar ² is preferably a pyrrole ring, an imidazole ring, or a condensed ring containing these rings, and more preferably a pyrrole ring, an imidazole ring, or a condensed ring containing these rings.

In formula (1), ^R1 and ^R2 each independently represent a substituent. Examples of the substituent include the groups listed below for the substituent T. An aryl group or a heteroaryl group is preferred, and a heteroaryl group is more preferred because it can shift the absorption wavelength to a longer wavelength.

The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12. The aryl group may have a substituent.

The heteroaryl group is preferably a monocyclic group or a condensed ring group having 2 to 8 rings, and more preferably a monocyclic group or a condensed ring group having 2 to 4 rings. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3. Examples of heteroatoms constituting the heteroaryl group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of carbon atoms constituting the heteroaryl group is preferably 3 to 20, more preferably 3 to 18, and even more preferably 3 to 12. The heteroaryl group is preferably a 5-membered or 6-membered ring heteroaryl group. Specific examples of the heteroaryl group include pyrrole ring group, furan ring group, thienyl ring group, imidazole ring group, pyrazolyl ring group, Azolyl, thiazolyl, triazolyl, tetrazolyl, pyridine, oxadiazole Cyclic group, pyrimidine cyclic group, pyridine cyclic groups and condensed rings containing such rings.

The above-mentioned aryl and heteroaryl groups may further have substituents. Examples of further substituents include -NR ¹⁰¹ R ¹⁰² , alkoxy groups, and aryloxy groups. -NR ¹⁰¹ R ¹⁰² is preferred because it can shift the absorption wavelength to a longer wavelength. R ¹⁰¹ and R ¹⁰² each independently represent a hydrogen atom or a substituent. R ¹⁰¹ and R ¹⁰² may bond to form a ring.

R ¹⁰¹ and R ¹⁰² are preferably each independently a substituent. Examples of the substituent represented by R ¹⁰¹ and R ¹⁰² include the groups exemplified in the substituent T described below, with alkyl, alkenyl, alkynyl, or aryl groups being preferred, and alkyl or aryl groups being more preferred.

The alkyl group represented by R ¹⁰¹ and R ¹⁰² preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and even more preferably 1 to 6 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include the groups listed below for the substituent T, with halogen atoms, aryl groups, and alkoxy groups being preferred. There may be multiple substituents.

The alkenyl group represented by R ¹⁰¹ and R ¹⁰² preferably has 1 to 20 carbon atoms, more preferably 1 to 15, and even more preferably 1 to 6. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include the groups listed below for the substituent T, preferably a halogen atom, an aryl group, or an alkoxy group. There may be multiple substituents.

The alkynyl group represented by R ¹⁰¹ and R ¹⁰² preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and even more preferably 1 to 6 carbon atoms. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include the groups listed below for the substituent T, with halogen atoms, aryl groups, and alkoxy groups being preferred. There may be multiple substituents.

The aryl group represented by R ¹⁰¹ and R ¹⁰² preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms. The aryl group may have a substituent. Examples thereof include the groups exemplified in the substituent T described below, with a halogen atom, an alkyl group, or an alkoxy group being preferred. There may be multiple substituents.

In formula (1), n1 and n2 each independently represent an integer greater than 0. Preferably, n1 and n2 each independently represent an integer greater than 1, more preferably an integer from 1 to 3, even more preferably 1 or 2, and particularly preferably 1.

In formula (1), ^Y1 and ^Y2 each independently represent -O-, -S- or -NR ^Y1 -, and ^RY1 represents a hydrogen atom or a substituent.

As the substituent represented by ^RY1 , there can be mentioned the groups exemplified in the substituent T described later, preferably an alkyl group, an aryl group, or a heteroaryl group, more preferably an alkyl group or an aryl group, and still more preferably an alkyl group. ^RY1 is preferably a hydrogen atom or an alkyl group, and more preferably a hydrogen atom.

In formula (1), ^Y1 and ^Y2 are each independently -O- or -S-, preferably -O-.

In formula (1) ^{, X1} and ^X2 each independently represent a hydrogen atom, ^-BRX1RX2 , or a metal atom capable of being coordinated by a ligand. ^RX1 and ^RX2 each independently represent a hydrogen atom or a substituent. ^RX1 and ^RX2 may bond to form a ring. Preferably, ^X1 and ^X2 each independently represent ^-BRX1RX2 or a metal atom capable of being coordinated by a ligand. From the perspective of being able to form a film having excellent heat resistance, ^-BRX1RX2 is more preferred. When ^X1 in formula ( ¹ ) represents ^-BRX1RX2 or ^a metal atom capable of being coordinated by a ligand, ^X1 may be coordinated to a nitrogen atom ^of the nitrogen-containing heterocyclic ring represented by ^Ar1 . Furthermore, when X ² in formula (1) is -BR ^X1 R ^X2 or a metal atom to which a ligand can coordinate, X ² can coordinate to the nitrogen atom of the nitrogen-containing heterocyclic ring represented by Ar ² .

represents a substituent represented by ^RX1 and ^RX2 . Examples of the substituent include the groups listed below for the substituent T, preferably a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an alkoxy group, or an aryloxy group. A halogen atom, an aryl group, or an alkoxy group is more preferred. From the perspective of easily forming a film with excellent heat resistance or light resistance, an aryl group or an alkoxy group is even more preferred.

Examples of the halogen atom include fluorine, chlorine, bromine, and iodine, with fluorine being preferred.

The number of carbon atoms in alkyl and alkoxy groups is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 6. Alkyl and alkoxy groups may be linear, branched, or cyclic. Alkyl and alkoxy groups may have substituents. Examples of substituents include those listed below for substituent T, with halogen atoms and acyl groups being preferred. There may be multiple substituents.

The number of carbon atoms in the alkenyl group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 6. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include the groups listed below for the substituent T, with halogen atoms, acyl groups, and alkoxy groups being preferred. There may be multiple substituents.

The number of carbon atoms in an alkynyl group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 6. Alkyl groups may be linear, branched, or cyclic. Alkyl groups may have substituents. Examples of substituents include those listed below for substituent T, with halogen atoms, acyl groups, and alkoxy groups being preferred. Multiple substituents may be present.

The number of carbon atoms in the aryl group and aryloxy group is preferably 6 to 20, more preferably 6 to 12. The aryl group and aryloxy group may have a substituent. Examples of the substituents include those listed below for the substituent T, with halogen atoms, acyl groups, and alkoxy groups being preferred. There may be multiple substituents.

The heteroaryl group is preferably a monocyclic ring or a condensed ring having 2 to 8 ring members, and more preferably a monocyclic ring or a condensed ring having 2 to 4 ring members. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3. Examples of heteroatoms constituting the heteroaryl group include nitrogen atoms, oxygen atoms, and sulfur atoms, with nitrogen atoms being preferred. The number of carbon atoms constituting the heteroaryl group is preferably 3 to 20, more preferably 3 to 18, and even more preferably 3 to 12. The heteroaryl group is preferably a 5-membered or 6-membered ring. The heteroaryl group may have a substituent. The groups listed below as examples of substituents T are preferred, with halogen atoms, acyl groups, or alkoxy groups being preferred. There may be multiple substituents.

^RX1 and ^RX2 may be bonded to form a ring. For example, the structures shown in (X-1) to (X-4) below can be cited. Hereinafter, Rx represents a substituent, ^Rx1 to ^Rx4 each independently represent a hydrogen atom or a substituent, x1 to x3 each independently represent an integer from 0 to 4, and * represents the bonding position with ^Y1 or ^Y2 in formula (1). As the substituent represented by Rx and ^Rx1 to ^Rx4 , the groups exemplified in the substituent T described below can be cited, preferably a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an alkoxy group, or an aryloxy group, and more preferably a halogen atom, an alkyl group, or an alkoxy group.

[Chemical formula 4]

Examples of the metal atoms represented by ^X1 and ^X2 include Mg, Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Mo, Ru, Rh, Pd, Ag, Pt, Au, and Er. Zn, Cu, or Co is preferred because of their suitable atomic radius, high complex stability, and improved resistance.

These metal atoms may be coordinated with a ligand (substituent). Examples of the ligand include a halogen atom, an alkyl group _, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, ^-ORX11 , -OC(=O) ^RX12 , -OP(=O) ^RX13RX14 , and -OS(=O) ^2RX15 . ^RX11 and ^RX12 independently represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heteroaryl group. ^RX13 to ^RX15 independently represent a hydroxyl group, an alkyl group, ^an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an alkoxy group, or an aryloxy group. ^RX13 and ^RX14 may bond to each other to form a ring. Preferred embodiments of the halogen atom, alkyl group, alkenyl group, alkynyl group, aryl group, heteroaryl group, alkoxy group, and aryloxy group are the same as those described above as the substituents represented by ^RX1 and ^RX2 .

Examples of the substituent T include the following groups: a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom), an alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), an aryl group (preferably an aryl group having 6 to 30 carbon atoms), a heteroaryl group (preferably a heteroaryl group having 1 to 30 carbon atoms), an amino group (preferably an amino group having 0 to 30 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 30 carbon atoms), an aryloxy group (preferably an aryloxy group having 6 to 30 carbon atoms), a heteroaryloxy group (preferably a heteroaryloxy group having 1 to 30 carbon atoms), an acyl group (preferably an acyl group having 2 to 30 carbon atoms), an alkoxycarbonyl group (preferably an alkyl group having 2 to 30 carbon atoms), and a hydroxycarbonyl group (preferably an alkyl group having 0 to 30 carbon atoms). preferably an alkoxycarbonyl group having 2 to 30 carbon atoms), an aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), a heteroaryloxycarbonyl group (preferably a heteroaryloxycarbonyl group having 2 to 30 carbon atoms), an acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), an amide group (preferably an amide group having 2 to 30 carbon atoms), an aminocarbonylamino group (preferably an aminocarbonylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms), an amide sulfonyl group (preferably an amide sulfonyl group having 0 to 30 carbon atoms), an amide sulfonylamino ... sulfonylamino group), carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms), alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms), arylthio group (preferably an arylthio group having 6 to 30 carbon atoms), heteroarylthio group (preferably a heteroarylthio group having 1 to 30 carbon atoms), alkylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms), ), alkylsulfonylamino (preferably an alkylsulfonylamino group having 1 to 30 carbon atoms), arylsulfonyl (preferably an arylsulfonyl group having 6 to 30 carbon atoms), arylsulfonylamino (preferably an arylsulfonylamino group having 6 to 30 carbon atoms), heteroarylsulfonyl (preferably a heteroarylsulfonyl group having 1 to 30 carbon atoms), heteroarylsulfonamide alkyl (preferably a heteroarylsulfonylamide group having 1 to 30 carbon atoms), alkylsulfinyl (preferably an alkylsulfinyl group having 1 to 30 carbon atoms), arylsulfinyl (preferably an arylsulfinyl group having 6 to 30 carbon atoms), heteroarylsulfinyl (preferably a heteroarylsulfinyl group having 1 to 30 carbon atoms), urea (preferably a 1-30 urea groups), hydroxyl groups, nitro groups, carboxyl groups, sulfonic acid groups, phosphoric acid groups, carboxylic acid amide groups, sulfonic acid amide groups, imide groups, phosphino groups, hydrazine groups, hydrazine groups, cyano groups, alkylsulfinic acid groups, arylsulfinic acid groups, arylazo groups, heteroarylazo groups, phosphinyl groups, phosphinyloxy groups, phosphinylamino groups, silyl groups, hydrazine groups, and imino groups. If these groups are further substitutable, they may further have substituents. Examples of further substituents include the groups described in the above-mentioned substituent group T.

The compound represented by formula (1) is preferably a compound represented by formula (1-1).

In formula (1-1), Ar ¹ and Ar ² each independently represent a nitrogen-containing heterocyclic ring, R ³ and R ⁴ each independently represent a substituent, n3 and n4 each independently represent an integer greater than 0, Ar ¹¹ and Ar ¹² each independently represent an aromatic hydrocarbon ring or a heteroaromatic ring, R ¹¹ and R ¹² each independently represent a substituent, n11 and n12 each independently represent an integer greater than 0, R ¹¹¹ to R ¹¹⁴ each independently represent a hydrogen atom or a substituent, R ¹¹¹ and R ¹¹² , and R ¹¹³ and R ¹¹⁴ may be bonded to form a ring, Y ¹ and Y ² each independently represent -O-, -S-, or -NR ^Y1 -, ^RY1 represents a hydrogen atom or a substituent, X ¹ and X ² independently represent a hydrogen atom, -BR ^X1 R ^X2 or a metal atom to which a ligand can coordinate, R ^X1 and R ^X2 independently represent a hydrogen atom or a substituent, and R ^X1 and R ^X2 may bond to form a ring.

Ar ¹ , Ar ² , Y ¹ , Y ² , X ¹ and X ² in formula (1-1) have the same meanings as Ar ¹ , Ar ² , Y ¹ , Y ² , X ¹ and X ² in formula (1), and the preferred ranges are also the same.

As the substituent represented by R ³ , R ⁴ , R ¹¹ and R ¹² in formula (1-1), the groups exemplified in the substituent T mentioned above can be mentioned.

In formula (1-1), n3 and n4 each independently represent an integer greater than 0, preferably 0 to 2, more preferably 0 or 1, and even more preferably 0.

In formula (1-1), n11 and n12 each independently represent an integer greater than 0, preferably 0 to 2, more preferably 0 or 1, and even more preferably 0.

Ar ¹¹ and Ar ¹² in formula (1-1) independently represent an aromatic hydrocarbon ring or a heteroaromatic ring, and a heteroaromatic ring is preferred. The aromatic hydrocarbon ring and the aromatic heterocyclic ring represented by Ar ¹¹ and Ar ¹² may be a monocyclic ring or a condensed ring. The condensation number of the condensed ring is preferably 2 to 8, more preferably 2 to 4, and even more preferably 2 or 3. Specific examples of the aromatic hydrocarbon ring include a benzene ring, a naphthalene ring, and the like. Specific examples of the heteroaromatic ring include a pyrrole ring, a furan ring, a thiophene ring, an imidazole ring, a pyrazole ring, Azole, thiazole, triazole, tetrazole, pyridine, tathazole Ring, pyrimidine ring, pyridine The ring and the condensed ring containing these rings are preferably a pyrrole ring, a furan ring or a thiophene ring.

In formula (1-1), R ¹¹¹ to R ¹¹⁴ each independently represent a hydrogen atom or a substituent, preferably a substituent. Examples of the substituent include the groups listed above for the substituent T, preferably an alkyl group, an alkenyl group, an alkynyl group, or an aryl group, and more preferably an alkyl group or an aryl group.

The alkyl group represented by R ¹¹¹ to R ¹¹⁴ preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and even more preferably 1 to 6 carbon atoms. Alkyl and alkoxy groups may be linear, branched, or cyclic. Alkyl and alkoxy groups may have substituents. Examples of substituents include those listed above for substituent T, with halogen atoms, aryl groups, and alkoxy groups being preferred. There may be multiple substituents.

The alkenyl group represented by R ¹¹¹ to R ¹¹⁴ preferably has 1 to 20 carbon atoms, more preferably 1 to 15, and even more preferably 1 to 6 carbon atoms. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include the groups listed above for the substituent T, preferably a halogen atom, an aryl group, or an alkoxy group. There may be multiple substituents.

The alkynyl group represented by R ¹¹¹ to R ¹¹⁴ preferably has 1 to 20 carbon atoms, more preferably 1 to 15, and even more preferably 1 to 6 carbon atoms. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have substituents. Examples of substituents include those listed above for the substituent T, with halogen atoms, aryl groups, and alkoxy groups being preferred. There may be multiple substituents.

The aryl group represented by R ¹¹¹ to R ¹¹⁴ preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms. The aryl group and aryloxy group may have substituents. Examples of the substituents T mentioned above include halogen atoms, alkyl groups, and alkoxy groups. There may be multiple substituents.

The heteroaryl group represented by R ¹¹¹ to R ¹¹⁴ is preferably a monocyclic heteroaryl group or a condensed heteroaryl group having 2 to 8 rings, and more preferably a monocyclic heteroaryl group or a condensed heteroaryl group having 2 to 4 rings. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3. Examples of heteroatoms constituting the heteroaryl group include nitrogen atoms, oxygen atoms, and sulfur atoms, with nitrogen atoms being preferred. The number of carbon atoms constituting the heteroaryl group is preferably 3 to 20, more preferably 3 to 18, and even more preferably 3 to 12. The heteroaryl group is preferably a 5-membered or 6-membered heteroaryl group. The heteroaryl group may have a substituent. The groups exemplified in the above substituent T are mentioned, and a halogen atom, an alkyl group, or an alkoxy group is preferred. There may be plural substituents.

The specific infrared absorbing compound preferably has a maximum absorption wavelength in dichloromethane within the range of 1000-1600 nm, more preferably within the range of 1100-1550 nm, and even more preferably within the range of 1200-1500 nm.

The absorption spectrum of a specific infrared-absorbing compound preferably has a steep slope at the long-wavelength end. In the absorption spectrum normalized by the absorbance at the maximum absorption wavelength, the difference between the wavelength of 0.5 absorbance on the long-wavelength side and the maximum absorption wavelength is preferably 200 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less.

The specific infrared absorbing compound preferably has a high molar extinction coefficient (ε). The molar extinction coefficient at the maximum absorption wavelength is preferably 20,000 or greater, more preferably 50,000 or greater, and even more preferably 100,000 or greater.

As specific examples of specific infrared absorbing compounds, compounds with the structures shown below can be cited. In the following structural formula, Ph represents a phenyl group.

[Chemical formula 7]

[Chemical formula 8]

[Chemical formula 9]

The infrared absorber used in the composition of the present invention may contain compounds other than the specific infrared absorbing compound described above (hereinafter also referred to as other infrared absorbing compounds).

The other infrared absorbing compound may have a maximum absorption wavelength on the longer wavelength side than the specific infrared absorbing compound. However, from the perspective of being able to form a film with excellent infrared shielding properties over a wide wavelength range and superior light resistance, it is preferable that the other infrared absorbing compound have a maximum absorption wavelength on the shorter wavelength side than the specific infrared absorbing compound.

The difference between the maximum absorption wavelength of the specific infrared absorbing compound and the maximum absorption wavelength of other infrared absorbing compounds is preferably 50 to 800 nm, more preferably 100 to 750 nm, and even more preferably 150 to 700 nm.

Furthermore, the maximum absorption wavelength of other infrared absorbing compounds is preferably within the wavelength range of 700-1500 nm, more preferably within the wavelength range of 750-1400 nm, and even more preferably within the wavelength range of 800-1300 nm.

Other infrared absorbing compounds can be dyes or pigments. Other infrared absorbing compounds include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, crotonium compounds, oxocyanine compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiol metal complexes, metal oxides, and metal borides. Pyrrolopyrrole compounds, squarylium compounds, phthalocyanine compounds, and oxocyanine compounds are preferred, and pyrrolopyrrole compounds are even more preferred, because they facilitate the formation of a specific infrared absorbing compound in the film during film formation and provide a film having excellent infrared shielding properties, heat resistance, and light resistance. Examples of pyrrolopyrrole compounds include the compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614, the compounds described in paragraphs 0037 to 0052 of JP-A-2011-068731, and the compounds described in paragraphs 0010 to 0033 of WO-2015/166873. Examples of the squarylium compound include the compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Publication No. 2011-208101, the compounds described in paragraphs 0060 to 0061 of Japanese Patent Application Publication No. 6065169, the compounds described in paragraph 0040 of International Publication No. 2016/181987, the compounds described in Japanese Patent Application Publication No. 2015-176046, and the compounds described in paragraph 0072 of International Publication No. 2016/190162. , the compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Publication No. 2016-074649, the compounds described in paragraph 0124 of Japanese Patent Application Publication No. 2017-067963, the compounds described in International Publication No. 2017/135359, the compounds described in Japanese Patent Application Publication No. 2017-114956, the compounds described in Japanese Patent Application No. 6197940, and the compounds described in International Publication No. 2016/120166. Examples of cyanine compounds include compounds described in paragraphs 0044-0045 of Japanese Patent Application Laid-Open No. 2009-108267, compounds described in paragraphs 0026-0030 of Japanese Patent Application Laid-Open No. 2002-194040, compounds described in Japanese Patent Application Laid-Open No. 2015-172004, compounds described in Japanese Patent Application Laid-Open No. 2015-172102, compounds described in Japanese Patent Application Laid-Open No. 2008-088426, compounds described in paragraph 0090 of International Publication No. 2016/190162, and compounds described in Japanese Patent Application Laid-Open No. 2017-031394. Examples of crotonium compounds include compounds described in Japanese Patent Application Laid-Open No. 2017-082029. Examples of the imine compound include the compounds described in JP-A-2008-528706, the compounds described in JP-A-2012-012399, the compounds described in JP-A-2007-092060, and the compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Phthalocyanine compounds include the compounds described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153, titanium phthalocyanine oxide described in Japanese Patent Application Laid-Open No. 2006-343631, compounds described in paragraphs 0013-0029 of Japanese Patent Application Laid-Open No. 2013-195480, vanadium phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 6081771, and compounds described in International Publication No. 2020/071470. Naphthalocyanine compounds include the compounds described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153. Dithioalkene metal complexes include the compounds described in Japanese Patent Application Laid-Open No. 5733804. Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, aluminum-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details about tungsten oxide, please refer to paragraph 0080 of Japanese Patent Application Publication No. 2016-006476, which is incorporated herein by reference. Examples of metal borides include titanium boride. Commercially available titanium boride includes LaB ₆ -F (manufactured by Japan New Metals Co., Ltd.). Furthermore, compounds described in International Publication No. 2017/119394 can also be used as metal borides. Examples of commercially available indium tin oxide include F-ITO (manufactured by DOWA HIGHTECH CO., LTD.).

Furthermore, as other infrared absorbing compounds, the squarylium cyanine compounds described in Japanese Patent Application Laid-Open No. 2017-197437, the squarylium cyanine compounds described in Japanese Patent Application Laid-Open No. 2017-025311, the squarylium cyanine compounds described in International Publication No. 2016/154782, the squarylium cyanine compounds described in Japanese Patent No. 5884953, the squarylium cyanine compounds described in Japanese Patent No. 6036689, the squarylium cyanine compounds described in Japanese Patent No. 5810604 The squarylium cyanine compounds described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the pyrrole ring-containing compounds described in paragraphs 0019 to 0075 of Japanese Patent Application Laid-Open No. 2018-054760, the pyrrole ring-containing compounds described in paragraphs 0078 to 0082 of Japanese Patent Application Laid-Open No. 2018-040955, and the pyrrole ring-containing compounds described in paragraphs 0043 to 0069 of Japanese Patent Application Laid-Open No. 2018-002773. Compounds containing a pyrrole ring, squarylium compounds having an aromatic ring at the amide α-position as described in paragraphs 0024 to 0086 of Japanese Patent Application Laid-Open No. 2018-041047, amide-linked squarylium compounds as described in Japanese Patent Application Laid-Open No. 2017-179131, compounds having a pyrrole bis-squarylium skeleton or a crotonium skeleton as described in Japanese Patent Application Laid-Open No. 2017-141215, dihydroxycarbazole bis-squarylium compounds as described in Japanese Patent Application Laid-Open No. 2017-082029 compounds, the asymmetric compounds described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 2017-068120, the pyrrole ring-containing compounds (carbazole type) described in Japanese Patent Application Laid-Open No. 2017-067963, the phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 6251530, the squarylium cyanine compounds described in Japanese Patent Application Laid-Open No. 2020-075959, and the copper complexes described in Korean Patent Application Laid-Open No. 10-2019-0135217.

The infrared absorber content in the composition of the present invention is preferably 3% by mass or more, and more preferably 3 to 70% by mass, based on the total solid content. The upper limit is preferably 65% by mass or less, and more preferably 60% by mass or less. The lower limit is preferably 4% by mass or more, and more preferably 5% by mass or more.

The content of the specific infrared-absorbing compound is 3% by mass or more, preferably 3% to 70% by mass or more, based on the total solids content of the composition. The upper limit is preferably 65% by mass or less, and more preferably 60% by mass or less. The lower limit is preferably 4% by mass or more, and more preferably 5% by mass or more. The composition of the present invention may contain only one specific infrared-absorbing compound or two or more. When containing two or more specific infrared-absorbing compounds, the total amount of the compounds is preferably within the above range.

When the composition of the present invention contains other infrared-absorbing compounds, the content of the other infrared-absorbing compounds is preferably 10 to 1000 parts by mass relative to 100 parts by mass of the specific infrared-absorbing compound. The upper limit is preferably 500 parts by mass or less, and more preferably 300 parts by mass or less. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The composition of the present invention may contain only one other infrared-absorbing compound or two or more. When containing two or more other infrared-absorbing compounds, the total amount of the other infrared-absorbing compounds is preferably within the above range.

<<Hardening Compound>>

The composition of the present invention contains a curable compound. Examples of the curable compound include polymerizable compounds and resins. The resin may be a non-polymerizable resin (a resin without a polymerizable group) or a polymerizable resin (a resin with a polymerizable group). Examples of polymerizable groups include groups containing ethylenically unsaturated bonds, cyclic ether groups, hydroxymethyl groups, and alkoxymethyl groups. Examples of groups containing ethylenically unsaturated bonds include vinyl groups, vinylphenyl groups, (meth)allyl groups, (meth)acryloyl groups, (meth)acryloyloxy groups, and (meth)acryloylamide groups. (Meth)allyl groups, (meth)acryloyl groups, and (meth)acryloyloxy groups are preferred, and (meth)acryloyloxy groups are even more preferred. Examples of the cyclic ether group include an epoxy group and an oxycyclobutyl group, with an epoxy group being preferred. The polymerizable compound preferably contains a polymerizable monomer.

As the curable compound, it is preferred to use one containing at least a resin. Furthermore, when the composition of the present invention is used as a photolithography composition, it is preferred to use a resin and a polymerizable monomer (monomer-type polymerizable compound) as the curable compound. It is even more preferred to use a resin and a polymerizable monomer having a group containing an ethylenically unsaturated bond (monomer-type polymerizable compound).

(Polymerizable compound)

Examples of polymerizable compounds include compounds having a group containing an ethylenically unsaturated bond, compounds having a cyclic ether group, compounds having a hydroxymethyl group, and compounds having an alkoxymethyl group. Compounds having a group containing an ethylenically unsaturated bond are preferably used as free radical polymerizable compounds. Compounds having a cyclic ether group are preferably used as cationic polymerizable compounds.

Examples of resin-type polymerizable compounds include resins containing repeating units having polymerizable groups.

The molecular weight of the monomer-type polymerizable compound (polymerizable monomer) is preferably less than 2000, more preferably 1500 or less. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or greater, more preferably 200 or greater. The weight average molecular weight (Mw) of the resin-type polymerizable compound is preferably 2000 to 2000000. The upper limit of the weight average molecular weight is preferably 1000000 or less, more preferably 500000 or less. The lower limit of the weight average molecular weight is preferably 3000 or greater, more preferably 5000 or greater.

The compound having a group containing an ethylenically unsaturated bond as the polymerizable monomer is preferably a 3- to 15-functional (meth)acrylate compound, and more preferably a 3- to 6-functional (meth)acrylate compound. Specific examples include compounds described in paragraphs 0095 to 0108 of Japanese Patent Application Laid-Open No. 2009-288705, paragraph 0227 of Japanese Patent Application Laid-Open No. 2013-029760, paragraphs 0254 to 0257 of Japanese Patent Application Laid-Open No. 2008-292970, paragraphs 0034 to 0038 of Japanese Patent Application Laid-Open No. 2013-253224, paragraph 0477 of Japanese Patent Application Laid-Open No. 2012-208494, Japanese Patent Application Laid-Open No. 2017-048367, Japanese Patent Application No. 6057891, Japanese Patent Application No. 6031807, and Japanese Patent Application Laid-Open No. 2017-194662, the contents of which are incorporated into this specification.

Examples of compounds having a group containing an ethylenically unsaturated bond include dipentatriol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol hexa(meth)acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.). Co., Ltd.) and compounds having a structure in which the (meth)acryloyl group of these compounds is bonded via ethylene glycol and/or propylene glycol residues (for example, SR454 and SR499 commercially available from SARTOMER Company, Inc.).

Also useful as compounds having a group containing an ethylenically unsaturated bond are diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available product, M-460; manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK ESTER A-TMMT manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (KAYARAD HDDA manufactured by Nippon Kayaku Co., Ltd.), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK OLIGO UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), and EP-1040 (manufactured by Nippon Kayaku Co., Ltd.). Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by TAISEI FINE CHEMICAL CO., LTD.), LIGHT ACRYLATE POB-A0, UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (all manufactured by KYOEISHA CHEMICAL CO., LTD.), etc.

Furthermore, as the compound having a group containing an ethylenic unsaturated bond, trifunctional (meth)acrylate compounds such as trihydroxymethylpropane tri(meth)acrylate, trihydroxymethylpropane propylene oxide-modified tri(meth)acrylate, trihydroxymethylpropane ethylene oxide-modified tri(meth)acrylate, triisocyanato ethylene oxide-modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate are also preferably used. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by Toagosei Co., Ltd.), NK Ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by Shin Nakamura Chemical Co., Ltd.), and KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

Furthermore, compounds having acid groups such as carboxyl groups, sulfonic acid groups, and phosphoric acid groups can also be used as compounds having groups containing ethylenically unsaturated bonds. Commercially available products of such compounds include ARONIX M-305, M-510, M-520, and ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.).

As compounds having a group containing an ethylenically unsaturated bond, compounds having a caprolactone structure can also be used. For information on compounds having a caprolactone structure, see paragraphs 0042 to 0045 of Japanese Patent Application Laid-Open No. 2013-253224, which is incorporated herein by reference. Examples of compounds having a caprolactone structure include DPCA-20, DPCA-30, DPCA-60, and DPCA-120, which are commercially available from Nippon Kayaku Co., Ltd. as part of the KAYARAD DPCA series.

As compounds having a group containing an ethylenically unsaturated bond, compounds having a group containing an ethylenically unsaturated bond and an alkoxy group can also be used. Compounds having a group containing an ethylenically unsaturated bond and a vinyloxy group and/or a propyloxy group are preferred, compounds having a group containing an ethylenically unsaturated bond and a vinyloxy group are more preferred, and tri- to hexafunctional (meth)acrylate compounds having 4 to 20 vinyloxy groups are even more preferred. Commercially available products include SR-494 (manufactured by Sartomer Company, Inc.), a tetrafunctional (meth)acrylate having 4 vinyloxy groups, and KAYARAD TPA-330 (manufactured by Nippon Kayaku Co., Ltd.), a trifunctional (meth)acrylate having 3 isobutyloxy groups.

As compounds having groups containing ethylenically unsaturated bonds, polymerizable compounds having a fluorene skeleton can also be used. Commercially available products include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

It is also preferable to use a compound containing a group containing an ethylenically unsaturated bond that is substantially free of environmentally regulated substances such as toluene. Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

Examples of compounds having a cyclic ether group include compounds having an epoxy group and compounds having an oxacyclobutyl group. Compounds having an epoxy group are preferred. Examples of compounds having an epoxy group include compounds having 1 to 100 epoxy groups per molecule. The upper limit of the number of epoxy groups can be, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups is preferably 2 or more. As compounds having an epoxy group, compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, paragraphs 0147 to 0156 of JP-A-2014-043556, paragraphs 0085 to 0092 of JP-A-2014-089408, and compounds described in JP-A-2017-179172 can also be used, and these contents are incorporated into this specification.

The compound containing a cyclic ether group may be a low molecular weight compound (e.g., a molecular weight less than 1000) or a high molecular weight compound (e.g., a polymer with a molecular weight of 1000 or greater, with a weight average molecular weight of 1000 or greater). The weight average molecular weight of the cyclic ether group is preferably 200-100,000, more preferably 500-50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

Compounds having a cyclic ether group include compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, compounds described in paragraphs 0147 to 0156 of JP-A-2014-043556, compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408, and compounds described in JP-A-2017-179172.

Examples of commercially available compounds having a cyclic ether group include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-850L, and EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, and EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, and EPPN-502 (all manufactured by ADEKA Corporation), and CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, and CELLOXIDE 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), CYCLOMER PACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), Aron Oxetane OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by TOAGOSEI CO., LTD.), ADEKA Glycyrol ED-505 (manufactured by ADEKA Corporation, epoxy-containing monomer), MARPROOF G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (manufactured by NOF Corporation, epoxy-containing polymers), OXT-101, OXT-121, OXT-212, OXT-221 (manufactured by TOAGOSEI CO., LTD., oxyheterocyclobutyl-containing monomers), OXE-10, OXE-30 (manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD., oxyheterocyclobutyl-containing monomers), etc.

Examples of compounds having a hydroxymethyl group (hereinafter also referred to as a hydroxymethyl compound) include compounds in which the hydroxymethyl group is bonded to a nitrogen atom or a carbon atom forming an aromatic ring.

Examples of compounds having an alkoxymethyl group (hereinafter also referred to as an alkoxymethyl compound) include compounds in which an alkoxymethyl group is bonded to a nitrogen atom or a carbon atom forming an aromatic ring. Preferred compounds in which an alkoxymethyl group or a hydroxymethyl group is bonded to a nitrogen atom include alkoxymethylated melamine, hydroxymethylated melamine, alkoxymethylated benzoguanamine, hydroxymethylated benzoguanamine, alkoxymethylated glycoluril, hydroxymethylated glycoluril, alkoxymethylated urea, and hydroxymethylated urea. Furthermore, compounds described in paragraphs 0134 to 0147 of Japanese Patent Application Publication No. 2004-295116 and paragraphs 0095 to 0126 of Japanese Patent Application Publication No. 2014-089408 can also be used.

(resin)

The composition of the present invention can utilize a resin as a curable compound. Preferably, the curable compound contains at least a resin. Resins are incorporated, for example, to disperse pigments, etc., in the composition or to serve as adhesives. Resins used primarily to disperse pigments, etc., in the composition are referred to as dispersants. However, these uses of resins are merely examples, and the resins can be used for purposes other than these. Furthermore, resins having polymerizable groups also constitute polymerizable compounds.

The weight average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

Examples of the resin include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamide resins, polyamideimide resins, polyolefin resins, cycloolefin resins, polyester resins, styrene resins, vinyl acetate resins, polyvinyl alcohol resins, polyvinyl acetal resins, polyurethane resins, and polyurea resins. These resins may be used alone or in combination of two or more. As the cyclic olefin resin, norbornene resin is preferred from the viewpoint of improving heat resistance. Commercially available norbornene resins include, for example, the Arton series (e.g., Arton F4520) manufactured by JSR Corporation. Furthermore, as the resin, the resin described in the embodiment of International Publication No. 2016/088645, the resin described in Japanese Patent Application Laid-Open No. 2017-057265, the resin described in Japanese Patent Application Laid-Open No. 2017-032685, the resin described in Japanese Patent Application Laid-Open No. 2017-075248, the resin described in Japanese Patent Application Laid-Open No. 2017-066240, the resin described in Japanese Patent Application Laid-Open No. 2017-16 The resins described in Japanese Patent Application Publication No. 7513, the resins described in Japanese Patent Application Publication No. 2017-173787, the resins described in paragraphs 0041 to 0060 of Japanese Patent Application Publication No. 2017-206689, the resins described in paragraphs 0022 to 0071 of Japanese Patent Application Publication No. 2018-010856, the blocked polyisocyanate resins described in Japanese Patent Application Publication No. 2016-222891, Resins described in Japanese Patent Application Laid-Open No. 2020-122052, Japanese Patent Application Laid-Open No. 2020-111656, Japanese Patent Application Laid-Open No. 2020-139021, and Japanese Patent Application Laid-Open No. 2017-138503 containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain can also be preferably used as the resin. Regarding resins having a fluorene skeleton, reference can be made to the description of U.S. Patent Application Publication No. 2017/0102610, the contents of which are incorporated herein.

It is also preferred to use a resin with a glass transition temperature of 150°C or higher. Using such a resin facilitates the formation of specific infrared-absorbing compounds within the film during film formation, resulting in a film with excellent infrared shielding properties, heat resistance, and light resistance. The resin's glass transition temperature is preferably 180°C or higher, and more preferably 200°C or higher. In this specification, the glass transition temperature (Tg) of a resin is expressed as the theoretical value expressed by the following formula for resins with known structures, and as a catalog value for resins with unknown structures.

1/Tg=(W1/Tg1)+(W2/Tg2)+......+(Wn/Tgn)

The above formula is calculated when the resin is composed of n monomer components: monomer 1, monomer 2, ..., monomer n. In the above formula, Tg represents the glass transition temperature of the resin (unit: K), Tg1 to Tgn represent the glass transition temperature of the homopolymer of each monomer (unit: K), and W1 to Wn represent the mass fraction of each monomer in the total monomer component.

Resins containing acidic groups are preferred. Examples of acidic groups include carboxyl groups, phosphoric acid groups, sulfonic acid groups, and phenolic hydroxyl groups. These acidic groups may be present in a single species or in two or more species. Resins containing acidic groups can also be used as dispersants. The acid value of the acidic resin is preferably 30 to 500 mgKOH/g. The lower limit is preferably 50 mgKOH/g or higher, and more preferably 70 mgKOH/g or higher. The upper limit is preferably 400 mgKOH/g or lower, more preferably 200 mgKOH/g or lower, even more preferably 150 mgKOH/g or lower, and most preferably 120 mgKOH/g or lower.

The resin is also preferably a resin containing repeating units derived from a compound represented by formula (ED1) and/or a compound represented by formula (ED2) (hereinafter, these compounds may also be referred to as "ether dimers").

In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a alkyl group having 1 to 25 carbon atoms which may have a substituent.

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. Specific examples of formula (ED2) can be found in Japanese Patent Application Laid-Open No. 2010-168539.

For specific examples of ether dimers, please refer to paragraph 0317 of Japanese Patent Application Laid-Open No. 2013-029760, which is incorporated into this specification.

As the resin, a resin having a polymerizable group is also preferably used. The polymerizable group is preferably a group containing an ethylenic unsaturated bond or a cyclic ether group, and a group containing an ethylenic unsaturated bond is even more preferred.

As the resin, a resin containing repeating units derived from a compound represented by formula (X) is also preferably used.

In the formula, ^R1 represents a hydrogen atom or a methyl group, ^R21 and ^R22 each independently represent an alkylene group, and n represents an integer from 0 to 15. The alkylene groups represented by ^R21 and ^R22 preferably have a carbon number of 1 to 10, more preferably 1 to 5, even more preferably 1 to 3, and particularly preferably 2 or 3. n represents an integer from 0 to 15, preferably 0 to 5, even more preferably 0 to 4, and even more preferably 0 to 3.

Examples of the compound represented by formula (X) include ethylene oxide- or propylene oxide-modified (meth)acrylates of p-cumylphenol. Commercially available products include ARONIX M-110 (manufactured by TOAGOSEI CO., LTD.).

The resin preferably includes a resin that serves as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and alkaline dispersants (alkaline resins). Here, an acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups exceeds the amount of alkaline groups. Acidic dispersants (acidic resins) preferably have an acid group amount of 70 mol% or greater, when the total amount of acid groups and alkaline groups is 100 mol%. The acid groups in the acidic dispersant (acidic resin) are preferably carboxyl groups. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH/g. Furthermore, an alkaline dispersant (alkaline resin) refers to a resin in which the amount of alkaline groups exceeds the amount of acidic groups. A resin having an alkaline group content exceeding 50 mol% (where the total amount of acidic groups and alkaline groups is 100 mol%) is preferred. The alkaline groups in the alkaline dispersant are preferably amino groups.

The resin used as the dispersant is preferably a grafted resin. For details on grafted resins, see paragraphs 0025 to 0094 of Japanese Patent Application Laid-Open No. 2012-255128, which is incorporated herein by reference.

The resin used as the dispersant is preferably a polyimine-based dispersant containing nitrogen atoms in at least one of the main chain and the side chains. Polyimine-based dispersants preferably have a main chain and side chains, and at least one of the main chain and side chains contains a basic nitrogen atom. The main chain contains a partial structure having a functional group with a pKa of 14 or less, and the side chains contain 40 to 10,000 atoms. The basic nitrogen atom is not particularly limited as long as it is basic. For information on polyimine-based dispersants, see paragraphs 0102 to 0166 of Japanese Patent Application Laid-Open No. 2012-255128, which is incorporated herein by reference.

Resins used as dispersants are preferably those having a structure in which multiple polymer chains are bonded at the core. Examples of such resins include dendrimers (including star polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of Japanese Patent Application Laid-Open No. 2013-043962.

The resin used as a dispersant is also preferably one containing repeating units having groups containing ethylenically unsaturated bonds in the side chains. The content of repeating units having groups containing ethylenically unsaturated bonds in the side chains is preferably at least 10 mol%, more preferably 10-80 mol%, and even more preferably 20-70 mol% of all repeating units in the resin.

Furthermore, as a dispersant, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, the resin described in Japanese Patent Publication No. 2018-087939, the polyethyleneimine with polyester side chains described in International Publication No. 2016/104803, and the polyethyleneimine described in International Publication No. 2019/125940 can also be used. The block copolymers described in JP-A-2020-066687, the block polymers having acrylamide structural units described in JP-A-2020-066688, the dispersants described in International Publication No. 2016/104803, and the resins described in JP-A-2019-095548 are also included.

Dispersants are also commercially available. Specific examples include the DISPERBYK series manufactured by BYK Japan KK, the SOLSPERSE series manufactured by Lubrizol Japan Limited, the Efka series manufactured by BASF, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc. Furthermore, the products described in paragraph 0129 of Japanese Patent Application Laid-Open No. 2012-137564 and paragraph 0235 of Japanese Patent Application Laid-Open No. 2017-194662 can also be used as dispersants.

The content of the curable compound is preferably 1 to 95 mass% of the total solids content of the composition. The lower limit is preferably 2 mass% or more, more preferably 5 mass% or more, even more preferably 7 mass% or more, and particularly preferably 10 mass% or more. The upper limit is preferably 94 mass% or less, more preferably 90 mass% or less, even more preferably 85 mass% or less, and particularly preferably 80 mass% or less.

When the composition of the present invention contains a polymerizable compound as a curable compound, the content of the polymerizable compound is preferably 1 to 85 mass% of the total solids content of the composition. The lower limit is preferably 2 mass% or greater, more preferably 3 mass% or greater, and even more preferably 5 mass% or greater. The upper limit is preferably 80 mass% or less, and even more preferably 70 mass% or less.

When the composition of the present invention contains a polymerizable monomer as a curable compound, the content of the polymerizable monomer is preferably 1 to 50 mass% of the total solid content of the composition. The lower limit is preferably 2 mass% or greater, more preferably 3 mass% or greater, and even more preferably 5 mass% or greater. The upper limit is preferably 30 mass% or less, and even more preferably 20 mass% or less.

When the composition of the present invention contains a compound having an ethylenically unsaturated bond-bearing group as a curable compound, the content of the compound having an ethylenically unsaturated bond-bearing group is preferably 1 to 70 mass% of the total solids content of the composition. The lower limit is preferably 2 mass% or greater, more preferably 3 mass% or greater, and even more preferably 5 mass% or greater. The upper limit is preferably 65 mass% or less, and even more preferably 60 mass% or less.

When the composition of the present invention contains a resin as a curable compound, the resin content is preferably 1 to 85 mass% of the total solids content of the composition. The lower limit is preferably 2 mass% or greater, more preferably 5 mass% or greater, even more preferably 7 mass% or greater, and particularly preferably 10 mass% or greater. The upper limit is preferably 80 mass% or less, more preferably 75 mass% or less, even more preferably 70 mass% or less, and particularly preferably 40 mass% or less.

When the composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant is preferably 0.1 to 40 mass% based on the total solids content of the composition. The upper limit is preferably 25 mass% or less, and more preferably 20 mass% or less. The lower limit is preferably 0.5 mass% or more, and more preferably 1 mass% or more. Furthermore, the content of the resin as a dispersant is preferably 1 to 100 mass parts per 100 mass parts of the specific infrared-absorbing compound. The upper limit is preferably 80 mass parts or less, and more preferably 75 mass parts or less. The lower limit is preferably 2.5 mass parts or more, and more preferably 5 mass parts or more.

The composition of the present invention may contain only one curable compound or two or more. When containing two or more curable compounds, the total amount thereof is preferably within the above range.

<<Pigment Derivatives>>

The composition of the present invention can further contain a pigment derivative. The pigment derivative can be used as a dispersing aid. Examples of pigment derivatives include compounds having a structure in which an acid group or a base group is bonded to the pigment skeleton.

Examples of the pigment skeleton constituting the pigment derivative include a squarylium pigment skeleton, a pyrrolopyrrole pigment skeleton, a diketopyrrolopyrrole pigment skeleton, a quinacridone pigment skeleton, an anthraquinone pigment skeleton, a dianthraquinone pigment skeleton, a benzisoindole pigment skeleton, and a thiophene pigment skeleton. Indigo pigment skeleton, azo pigment skeleton, quinoline yellow pigment skeleton, phthalocyanine pigment skeleton, naphthalocyanine pigment skeleton, di Pigment skeleton, perylene pigment skeleton, pyrene pigment skeleton, benzimidazolone pigment skeleton, benzothiazole pigment skeleton, benzimidazole pigment skeleton and benzo The azole pigment skeleton, the squarylium pigment skeleton, the pyrrolopyrrole pigment skeleton, the diketopyrrolopyrrole pigment skeleton, the phthalocyanine pigment skeleton, the quinacridone pigment skeleton and the benzimidazolone pigment skeleton are preferred, and the squarylium pigment skeleton and the pyrrolopyrrole pigment skeleton are more preferred.

Examples of acid groups include carboxyl, sulfonic, phosphoric, boric, carboxylic acid amide, sulfonic acid amide, imidic acid, and salts thereof. Examples of atoms or atomic groups constituting the salt include alkaline metal ions (Li ⁺ , Na ⁺ , K ⁺ , etc.), alkaline earth metal ions (Ca2 ⁺ , Mg2 ⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions. Preferred carboxylic acid amide groups are those represented by -NHCOR ^X1 . Preferred sulfonic acid amide groups are those represented by _-NHSO2R ^X2 . Preferred imidic acid groups are those represented ^by _{-SO₂NHSO₂RX₃} , _{-CONHSO₂RX₄} ^, _{-CONHCOR₂X₅} , or ^{-SO₂NHSO₂RX₃} , ^{with -SO₂NHSO₂RX₃ being more preferred. Each of R₁-R₆6} _{independently} ^represents _{an alkyl} group or an ^{aryl group} . The alkyl and aryl groups represented by ^R₁ - ^R₆6 may have a substituent. Preferred substituents are halogen atoms, with fluorine atoms being more preferred.

Examples of base groups include amino groups, pyridyl groups and their salts, ammonium salts, and phthalimide methyl groups. Examples of atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylic acid ions, sulfonic acid ions, and phenoxide ions.

Examples of pigment derivatives include compounds described in Japanese Patent Application Laid-Open No. 56-118462, compounds described in Japanese Patent Application Laid-Open No. 63-264674, compounds described in Japanese Patent Application Laid-Open No. 01-217077, compounds described in Japanese Patent Application Laid-Open No. 03-009961, compounds described in Japanese Patent Application Laid-Open No. 03-026767, compounds described in Japanese Patent Application Laid-Open No. 03-153780, compounds described in Japanese Patent Application Laid-Open No. 03-045662, compounds described in Japanese Patent Application Laid-Open No. 04- Compounds described in Japanese Patent Application No. 285669, compounds described in Japanese Patent Application No. 06-145546, compounds described in Japanese Patent Application No. 06-212088, compounds described in Japanese Patent Application No. 06-240158, compounds described in Japanese Patent Application No. 10-030063, compounds described in Japanese Patent Application No. 10-195326, compounds described in paragraphs 0086 to 0098 of International Publication No. 2011/024896, and International Publication No. 2012/102399. The compound described in paragraphs 0063 to 0094 of JP-A-2017/038252, the compound described in paragraph 0171 of JP-A-2015-151530, the compound described in paragraphs 0162 to 0183 of JP-A-2011-252065, the compound described in JP-A-2003-081972, the compound described in JP-A-5299151, the compound described in JP-A-2015-172732, the compound described in JP-A-2015-172732, the compound described in JP-A-2015-151530, the compound described in paragraphs 0162 to 0183 of JP-A-2011-252065, the compound described in JP-A-2003-081972, the compound described in JP-A-5299151, the compound described in JP-A-2015-172732, the compound described in JP-A-2015-151530, the compound described in JP-A-2015-151530 Compounds described in Japanese Patent Application Publication No. 2014-199308, compounds described in Japanese Patent Application Publication No. 2014-085562, compounds described in Japanese Patent Application Publication No. 2014-035351, compounds described in Japanese Patent Application Publication No. 2008-081565, compounds described in Japanese Patent Application Publication No. 2019-109512, compounds described in Japanese Patent Application Publication No. 2019-133154, and diketopyrrolopyrrole compounds having a thiol linking group described in International Publication No. 2020/002106.

The content of the pigment derivative is preferably 1 to 50 parts by mass per 100 parts by mass of the specific infrared-absorbing compound. The lower limit is preferably 3 parts by mass or greater, and more preferably 5 parts by mass or greater. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. A single pigment derivative may be used, or two or more may be used. When two or more pigment derivatives are used, the total amount is preferably within the above range.

<<Solvent>>

The composition of the present invention preferably contains a solvent. Examples of the solvent include water and organic solvents, with organic solvents being preferred. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For details, please refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated herein by reference. Furthermore, cyclic alkyl-substituted ester solvents and cyclic alkyl-substituted ketone solvents are also preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celulose acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propyl Glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cyclobutanesulfonate, anisole, 1,4-diethoxybutane, diethylene glycol monoethyl ether acetate, 1,3-diyl butane diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol, 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropyl alcohol, etc. However, for environmental reasons, it is sometimes desirable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents (for example, the amount can be set to 50 ppm (parts per million) or less, 10 ppm or less, or even 1 ppm or less relative to the total amount of the organic solvent).

In the present invention, it is preferred to use an organic solvent with a low metal content. For example, the metal content of the organic solvent is preferably 10 ppb (parts per billion) or less. Organic solvents with a ppt (parts per trillion) mass content may also be used as needed. Such organic solvents are provided, for example, by TOYO Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

Methods for removing impurities such as metals from organic solvents include distillation (molecular distillation or thin film distillation) or filtration using a filter. The pore size of the filter used in filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene, or nylon.

Organic solvents may contain isomers (compounds with the same number of atoms but different structures). Furthermore, isomers may consist of only one type or multiple types.

The peroxide content in the organic solvent is preferably 0.8 mmol/L or less, and even more preferably substantially free of peroxide.

The solvent content in the composition is preferably 10-97 mass%. The lower limit is preferably 30 mass% or greater, more preferably 40 mass% or greater, even more preferably 50 mass% or greater, even more preferably 60 mass% or greater, and particularly preferably 70 mass% or greater. The upper limit is preferably 96 mass% or less, and even more preferably 95 mass% or less. The composition may contain only one solvent or two or more. If two or more solvents are present, the total amount of the solvents is preferably within the above range.

<<Photopolymerization Initiator>>

When the composition of the present invention contains a polymerizable compound, it is preferred that the composition further contain a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, compounds that are photosensitized to light in the ultraviolet to visible range are preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

As the photopolymerization initiator, there can be cited halogenated hydrocarbon derivatives (for example, Skeleton compounds, with Compounds with a diazole skeleton, etc.), acylphosphine compounds, hexaarylbimidazoles, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc. From the perspective of exposure sensitivity, the photopolymerization initiator is trihalomethyl tris(2-hydroxy-3-oxadiazole). (trihalo methyl triazine) compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halogenated methyl Oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acylphosphine compounds are more preferred, and oxime compounds are even more preferred. In addition, as photopolymerization initiators, compounds described in paragraphs 0065 to 0111 of Japanese Patent Application Publication No. 2014-130173, compounds described in Japanese Patent Application No. 6301489, MATERIAL STAGE 37~60p, vol.19, No.3, 2019, the peroxide-based photopolymerization initiator described in International Publication No. 2018/221177, the photopolymerization initiator described in International Publication No. 2018/110179, the photopolymerization initiator described in Japanese Patent Application Publication No. 2019-043864, the photopolymerization initiator described in Japanese Patent Application Publication No. 2019-044030, the peroxide-based initiator described in Japanese Patent Application Publication No. 2019-167313, the photopolymerization initiator described in Japanese Patent Application Publication No. 2020-055992 The oxazolidinyl aminoacetophenone-based initiator and the oxime-based photopolymerization initiator described in Japanese Patent Application Laid-Open No. 2013-190459 are incorporated into this specification.

Examples of commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Examples of commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins B.V.), and Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (both manufactured by BASF), etc.

Examples of the oxime compound include the compounds described in Japanese Patent Application Laid-Open No. 2001-233842, the compounds described in Japanese Patent Application Laid-Open No. 2000-080068, the compounds described in Japanese Patent Application Laid-Open No. 2006-342166, the compounds described in J.C.S. Perkin II (1979, pp. 1653-1660), the compounds described in J.C.S. Perkin II (1979, pp. 156-162), the compounds described in Journal of Photopolymer Science and Technology, and the compounds described in Japanese Patent Application Laid-Open No. 2001-233842. The compound described in Technology (1995, pp. 202-232), the compound described in Japanese Patent Application Publication No. 2000-066385, the compound described in Japanese Patent Application Publication No. 2004-534797, the compound described in Japanese Patent Application Publication No. 2017-019766, the compound described in Japanese Patent Application No. 6065596, Compounds described in International Publication No. 2015/152153, compounds described in International Publication No. 2017/051680, compounds described in Japanese Patent Application Laid-Open No. 2017-198865, compounds described in paragraphs 0025-0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzyloxyiminobutane-2-one, 3-acetyloxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetyloxyiminopentane-3-one, 2-acetyloxyimino-1-phenylpropane-1-one, 2-benzyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonyloxy)iminobutane-2-one, and 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one. Commercially available products include Irgacure-OXE01, Irgacure-OXE02, Irgacure-OXE03, and Irgacure-OXE04 (all manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Tronly New Electronic Materials Co., Ltd.), and Adeka Optomer N-1919 (manufactured by Adeka Corporation, photopolymerization initiator 2 described in Japanese Patent Application Publication No. 2012-014052). Furthermore, it is also preferable to use a non-coloring compound or a highly transparent compound that is resistant to discoloration as the oxime compound. Commercially available products include Adeka ARKLS NCI-730, NCI-831, and NCI-930 (all manufactured by Adeka Corporation).

Oxime compounds having a fluorene ring can also be used as photopolymerization initiators. Specific examples of oxime compounds having a fluorene ring include compounds described in Japanese Patent Application Publication No. 2014-137466, compounds described in Japanese Patent Application No. 6636081, and compounds described in Korean Patent Application Publication No. 10-2016-0109444.

As a photopolymerization initiator, an oxime compound having a carbazole skeleton in which at least one benzene ring is replaced by a naphthalene ring can also be used. Specific examples of such oxime compounds include those described in International Publication No. 2013/083505.

Oxime compounds containing fluorine atoms can also be used as photopolymerization initiators. Specific examples of oxime compounds containing fluorine atoms include the compounds described in Japanese Unexamined Patent Application Publication No. 2010-262028, compounds 24, 36, 40, and 2014-500852, and compound (C-3) described in Japanese Unexamined Patent Application Publication No. 2013-164471.

As a photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable that the oxime compound having a nitro group is in the form of a dimer. Specific examples of oxime compounds having a nitro group include the compounds described in paragraphs 0031 to 0047 of Japanese Patent Application Publication No. 2013-114249, paragraphs 0008 to 0012 and paragraphs 0070 to 0079 of Japanese Patent Application Publication No. 2014-137466, the compounds described in paragraphs 0007 to 0025 of Japanese Patent Application No. 4223071, and ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

Oxime compounds with a benzofuran skeleton can also be used as photopolymerization initiators. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

Oxime compounds containing a hydroxyl substituent bonded to a carbazole backbone can also be used as photopolymerization initiators. Examples of such photopolymerization initiators include the compounds described in International Publication No. 2019/088055.

Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited thereto.

[Chemical formula 13]

[Chemical formula 14]

The oxime compound preferably has a maximum absorption wavelength in the wavelength range of 350-500 nm, and more preferably in the wavelength range of 360-480 nm. Furthermore, from the perspective of sensitivity, the oxime compound preferably has a high molar absorbance at a wavelength of 365 nm or 405 nm, preferably 1,000-300,000, more preferably 2,000-300,000, and particularly preferably 5,000-200,000. The molar absorbance of the compound can be measured using known methods. For example, it is preferably measured using a spectrophotometer (Varian Cary-5 spectrophotometer) using an ethyl acetate solvent at a concentration of 0.01 g/L.

Photopolymerization initiators with two or more functional groups can be used. These generate two or more free radicals per molecule, resulting in improved sensitivity. Furthermore, using asymmetric compounds reduces crystallinity and improves solubility in solvents, making precipitation more difficult over time and improving the stability of the composition over time. Specific examples of bifunctional or trifunctional or higher-functional photoradical polymerization initiators include dimers of oxime compounds described in JP-A-2010-527339, JP-A-2011-524436, International Publication No. 2015/004565, paragraphs 0407 to 0412 of JP-A-2016-532675, and paragraphs 0039 to 0055 of International Publication No. 2017/033680, and compound (E) described in JP-A-2013-522445. and compound (G), Cmpd 1 to 7 described in International Publication No. 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP-A-2017-523465, the photoinitiator described in paragraphs 0020 to 0033 of JP-A-2017-167399, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of JP-A-2017-151342, and the oxime ester photoinitiator described in JP-A-6469669.

The content of the photopolymerization initiator is preferably 0.1-40% by mass, more preferably 0.5-35% by mass, and even more preferably 1-30% by mass, based on the total solids content of the composition. The composition may contain only one type of photopolymerization initiator or two or more. When two or more types are present, the total amount of the initiators is preferably within the above range.

<<Hardener>>

When the composition of the present invention contains a compound having a cyclic ether group, it is preferably further comprised of a hardener. Examples of hardeners include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, polyvalent carboxylic acids, and thiol compounds. Specific examples of hardeners include succinic acid, trimellitic acid, pyromellitic acid, N,N-dimethyl-4-aminopyridine, and pentaerythritol tetrakis(3-butylpropionate). Hardeners may also include compounds described in paragraphs 0072-0078 of Japanese Patent Application Publication No. 2016-075720 or compounds described in Japanese Patent Application Publication No. 2017-036379.

The content of the hardener is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass, and even more preferably 0.1 to 6.0 parts by mass, relative to 100 parts by mass of the compound having a cyclic ether group.

<<Color coloring agent>>

The composition of the present invention may contain a colorant. In the present invention, a colorant refers to a colorant other than white colorants and black colorants. Preferably, the colorant has absorption within a wavelength range of 400 nm to less than 650 nm.

Examples of colorants include red, green, blue, yellow, violet, and orange. Colorants can be either pigments or dyes. Pigments and dyes can be used together. Furthermore, pigments can be either inorganic or organic. Furthermore, pigments can be made by substituting organic chromophores for a portion of an inorganic pigment or an organic-inorganic pigment. Substituting organic chromophores for inorganic or organic-inorganic pigments facilitates color design.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. If the average primary particle size of the pigment is within the above range, the dispersion stability of the pigment in the composition is good. Furthermore, in the present invention, the primary particle size of the pigment can be determined by observing the primary particles of the pigment with a transmission electron microscope and based on the obtained image photograph. Specifically, the projected area of the primary particles of the pigment is determined, and the corresponding equivalent circular diameter is calculated as the primary particle size of the pigment. In the present invention, the average primary particle size is the arithmetic average of the primary particle sizes of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles that are not aggregated.

The coloring agent preferably contains a pigment. The pigment content in the coloring agent is preferably 50% by mass or greater, more preferably 70% by mass or greater, even more preferably 80% by mass or greater, and particularly preferably 90% by mass or greater. Examples of the pigment include the following.

Colorimetric Index (CI) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126 6, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232 (methine series), 233 (quinoline series), 234 (aminoketone series), 235 (aminoketone series), 236 (aminoketone series), etc. (the above are yellow pigments), CI Pigment Orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (the above are orange pigments), CI Pigment Red Red)1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146 、149、150、155、166、168、169、170、171、172、175、176、177、178、179、184、185、187、188、190、200、202、206、207、208、209、210、216、220、224、226、242、246、254、255、264、269、270、272、279、291、294( Series, Organo Ultramarine (Organic Ultramarine), Bluish Red (Blue Red)), 295 (Monoazo Series), 296 (Diazo Series), 297 (Aminoketone) etc. (the above are red pigments), CI Pigment Green (Pigment Green) 7, 10, 36, 37, 58, 59, 62, 63, 64 (Phthalocyanine Series), 65 (Phthalocyanine Series), 66 (Phthalocyanine Series) etc. (the above are green pigments), CI Pigment Violet (Pigment Violet) 1, 19, 23, 27, 32, 37, 42, 60 (Triarylmethane Series), 61 ( series) etc. (the above are purple pigments), CI pigment blue (Pigment Blue) 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo series), 88 (methine series) etc. (the above are blue pigments).

Furthermore, as a green colorant, a zinc halogenide phthalocyanine pigment can be used, wherein the average number of halogen atoms per molecule is 10-14, the average number of bromine atoms is 8-12, and the average number of chlorine atoms is 2-5. A specific example is the compound described in International Publication No. 2015/118720. Green colorants that can also be used include compounds described in the specification of Chinese Patent Application No. 106909027, phthalocyanine compounds having a phosphate ester as a ligand described in International Publication No. 2012/102395, phthalocyanine compounds described in Japanese Patent Application Publication No. 2019-008014, phthalocyanine compounds described in Japanese Patent Application Publication No. 2018-180023, compounds described in Japanese Patent Application Publication No. 2019-038958, and core-shell pigments described in Japanese Patent Application Publication No. 2020-076995.

Furthermore, aluminum phthalocyanine compounds containing phosphorus atoms can also be used as blue colorants. Specific examples include the compounds described in paragraphs 0022 to 0030 of Japanese Patent Application Laid-Open No. 2012-247591 and paragraph 0047 of Japanese Patent Application Laid-Open No. 2011-157478.

Furthermore, as yellow coloring agents, compounds described in Japanese Patent Application Laid-Open No. 2017-201003, compounds described in Japanese Patent Application Laid-Open No. 2017-197719, compounds described in paragraphs 0011 to 0062 and 0137 to 0276 of Japanese Patent Application Laid-Open No. 2017-171912, compounds described in paragraphs 0010 to 0062 and 0138 to 0295 of Japanese Patent Application Laid-Open No. 2017-171913, and compounds described in paragraphs 0011 to 0062 and 0139 to 0190 of Japanese Patent Application Laid-Open No. 2017-171914 can also be used. The compound described in paragraphs 0010 to 0065 and 0142 to 0222 of Japanese Patent Application Laid-Open No. 2017-171915, the quinoline yellow compound described in paragraphs 0011 to 0034 of Japanese Patent Application Laid-Open No. 2013-054339, the quinoline yellow compound described in paragraphs 0013 to 0058 of Japanese Patent Application Laid-Open No. 2014-026228, the isoindoline compound described in Japanese Patent Application Laid-Open No. 2018-062644, the quinoline yellow compound described in Japanese Patent Application Laid-Open No. 2018-203798, the Quinoline yellow compounds described in Japanese Patent Publication No. 578, quinoline yellow compounds described in Japanese Patent Publication No. 6432076, quinoline yellow compounds described in Japanese Patent Publication No. 2018-155881, quinoline yellow compounds described in Japanese Patent Publication No. 2018-111757, quinoline yellow compounds described in Japanese Patent Publication No. 2018-040835, quinoline yellow compounds described in Japanese Patent Publication No. 2017-197640, quinoline yellow compounds described in Japanese Patent Publication No. 2016-145282, quinoline yellow compounds described in Japanese Patent Publication No. 2014-08556 Quinoline yellow compounds described in Japanese Patent Application Publication No. 5, quinoline yellow compounds described in Japanese Patent Application Publication No. 2014-021139, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-209614, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-209435, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-181015, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-061622, quinoline yellow compounds described in Japanese Patent Application Publication No. 2013-032486, quinoline yellow compounds described in Japanese Patent Application Publication No. 2012-22611 0, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-074987, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-081565, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-074986, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-074985, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-050420, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2008-031281, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 48-032765 , a quinoline yellow compound described in Japanese Patent Publication No. 2019-008014, a quinoline yellow compound described in Japanese Patent Publication No. 6607427, a methine dye described in Japanese Patent Publication No. 2019-073695, a methine dye described in Japanese Patent Publication No. 2019-073696, a methine dye described in Japanese Patent Publication No. 2019-073697, a methine dye described in Japanese Patent Publication No. 2019-073698, a methine dye described in Korean Patent Publication No. 10-2014-0034963 Compounds described in Japanese Patent Application Publication No. 2017-095706, compounds described in Taiwan Patent Application Publication No. 201920495, compounds described in Japanese Patent Application Publication No. 6607427, compounds described in Japanese Patent Application Publication No. 2020-033525, compounds described in Japanese Patent Application Publication No. 2020-033524, compounds described in Japanese Patent Application Publication No. 2020-033523, compounds described in Japanese Patent Application Publication No. 2020-033522, compounds described in Japanese Patent Application Publication No. 2020 Compounds described in International Publication No. 2020/045200, International Publication No. 2020/045199, International Publication No. 2020/045197, azo compounds described in Japanese Patent Application Laid-Open No. 2020-093994, perylene compounds described in Japanese Patent Application Laid-Open No. 2020-083982, perylene compounds described in International Publication No. 2020/105346, and quinoline yellow compounds described in Japanese Patent Application No. 2020-517791. From the perspective of improving color value, polymers of these compounds are also preferably used.

As red coloring agents, diketopyrrolopyrrole compounds having at least one bromine atom substituted in the structure described in Japanese Patent Application Laid-Open No. 2017-201384, diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838, diketopyrrolopyrrole compounds described in International Publication No. 2012/102399, diketopyrrolopyrrole compounds described in International Publication No. 2012/117965, naphthol azo compounds described in Japanese Patent Application Laid-Open No. 2012-229344, and the like can also be used. compounds, red pigments described in Japanese Patent No. 6516119, red pigments described in Japanese Patent No. 6525101, brominated diketopyrrolopyrrole compounds described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2020-090632, anthraquinone compounds described in Korean Patent Application No. 10-2019-0140741, anthraquinone compounds described in Korean Patent Application No. 10-2019-0140744, and perylene compounds described in Japanese Patent Application Laid-Open No. 2020-079396. Furthermore, as a red colorant, a compound having a structure in which an aromatic ring group, formed by introducing a group having an oxygen atom, a sulfur atom, or a nitrogen atom bonded to the aromatic ring, is bonded to a diketopyrrolopyrrole skeleton can also be used.

For information on the preferred diffraction angles of various pigments, see Japanese Patent Nos. 6561862, 6413872, 6281345, and JP-A-2020-026503, the contents of which are incorporated herein. Furthermore, it is also preferred to use a pyrrolopyrrole pigment having a crystallite size of 140 Å or less in the direction corresponding to the maximum peak in the X-ray diffraction pattern among the eight planes (±1±1±1) in the crystal lattice. Furthermore, it is also preferred to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028-0073 of JP-A-2020-097744.

Dyes can also be used as color dyes. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, aniline azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylene dyes, oxocyanine dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenanthridine dyes, and thiophene dyes. Series dyes, pyrrolopyrazole methine azo series dyes, Among the dyes, thiazole compounds described in Japanese Patent Application Laid-Open No. 2012-158649, azo compounds described in Japanese Patent Application Laid-Open No. 2011-184493, azo compounds described in Japanese Patent Application Laid-Open No. 2011-145540, triarylmethane dye polymers described in Korean Patent Application Laid-Open No. 10-2020-0028160, and thiazole compounds described in Japanese Patent Application Laid-Open No. 2020-117638 can also be preferably used. compound.

Phthalocyanine compounds described in International Publication No. 2020/174991 can be used as colorants.

When the composition of the present invention contains a colorant, the colorant content is preferably 1 to 50% by mass of the total solids content of the composition of the present invention. When the composition of the present invention contains two or more colorants, the total amount is preferably within the above range.

<<Color materials that transmit infrared rays and block visible light>>

The composition of the present invention can also contain a colorant that transmits infrared rays and blocks visible light (hereinafter also referred to as a visible light blocking colorant). Compositions containing a visible light blocking colorant can be preferably used as a composition for forming an infrared transmission filter.

The visible light-blocking colorant preferably absorbs light in the wavelength range from violet to red. Furthermore, the visible light-blocking colorant preferably blocks light in the wavelength range of 450 to 650 nm. Furthermore, the visible light-blocking colorant preferably transmits light in the wavelength range of 900 to 1500 nm. The visible light-blocking colorant preferably meets at least one of the following requirements (A) and (B).

(A): Contains two or more colorants, and the combination of two or more colorants forms black.

(B): Contains organic black colorant.

Examples of color colorants include those listed above. Examples of organic black colorants include bisbenzofuranone compounds, methine azo compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. Examples of bisbenzofuranone compounds include those described in JP-A-2010-534726, JP-A-2012-515233, and JP-A-2012-515234, and are available, for example, as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include the compounds described in paragraphs 0016-0020 of JP-A-2017-226821 and C.I. Pigment Black 31 and 32. Examples of methine azo compounds include those described in JP-A-01-170601 and JP-A-02-034664. For example, it can be obtained as "CHROMO FINE BLACK A1103" manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd.

When forming black by combining two or more color colorants, the following combinations of color colorants are exemplified, for example (1) to (8).

(1) Contains yellow colorant, blue colorant, purple colorant and red colorant.

(2) Contains yellow colorant, blue colorant and red colorant.

(3) Contains yellow colorant, purple colorant and red colorant.

(4) Contains yellow colorant and purple colorant.

(5) Contains green colorant, blue colorant, purple colorant and red colorant.

(6) Contains purple colorant and orange colorant.

(7) Contains green colorant, purple colorant and red colorant.

(8) Contains green colorant and red colorant.

When the composition of the present invention contains a colorant that blocks visible light, the content of the colorant is preferably 1 to 50% by mass of the total solids content of the composition. The lower limit is preferably 5% by mass or greater, more preferably 10% by mass or greater, even more preferably 20% by mass or greater, and particularly preferably 30% by mass or greater.

<<Surfactant>>

The composition of the present invention preferably contains a surfactant. Various surfactants can be used, including fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants. Silicone-based surfactants or fluorine-based surfactants are preferred. Examples of surfactants include those described in paragraphs 0238-0245 of International Publication No. 2015/166779 and Japanese Patent Application Laid-Open No. 2020-008634, the contents of which are incorporated herein.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of Japanese Patent Application Publication No. 2014-041318 (paragraphs 0060 to 0064 of the corresponding International Publication No. 2014/017669), the surfactants described in paragraphs 0117 to 0132 of Japanese Patent Application Publication No. 2011-132503, and the surfactants described in Japanese Patent Application Publication No. 2020-008634, all of which are incorporated into this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-47 5. F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-L M, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above is DIC CORPORATION), FLUORAD FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA SOLUTIONS Inc.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX-218 (all manufactured by NEOS), etc.

Alternatively, acrylic compounds can be preferably used as fluorine-based surfactants. These acrylic compounds have a molecular structure containing functional groups containing fluorine atoms, and when heat is applied, the fluorine-containing functional groups are partially cleaved, causing the fluorine atoms to volatilize. Examples of such fluorine-based surfactants include the MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Industry News (February 23, 2016)), for example, MEGAFACE DS-21.

Furthermore, a polymer of a fluorine-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound is also preferably used as a fluorinated surfactant. Examples of such fluorinated surfactants include those described in Japanese Patent Application Laid-Open No. 2016-216602, the contents of which are incorporated into this specification.

Block polymers can also be used as fluorine-based surfactants. Fluorine-containing polymers comprising repeating units derived from a (meth)acrylate compound containing fluorine atoms and repeating units derived from a (meth)acrylate compound containing two or more (preferably five or more) alkoxy groups (preferably vinyloxy or propoxy) can also be preferably used as fluorine-based surfactants. Fluorine-containing surfactants described in paragraphs 0016 to 0037 of Japanese Patent Application Laid-Open No. 2010-032698 and the following compounds are also exemplified as fluorine-based surfactants used in the present invention.

The weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000. In the above compound, the percentage representing the ratio of repeating units is molar %.

Furthermore, fluorinated polymers having ethylenically unsaturated bond-containing groups on their side chains can also be used as fluorinated surfactants. Specific examples include the compounds described in paragraphs 0050-0090 and 0289-0295 of JP-A-2010-164965, and MEGAFACE RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation. Furthermore, compounds described in paragraphs 0015-0158 of JP-A-2015-117327 can also be used as fluorinated surfactants.

Furthermore, from the perspective of environmental regulation, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for surfactants having a perfluoroalkyl group with 6 or more carbon atoms.

Furthermore, it is also preferred to use the fluorine-containing imide chlorine compound represented by formula (fi-1) as a surfactant.

In formula (fi-1), m represents 1 or 2, n represents an integer of 1 to 4, a represents 1 or 2, and Xa ⁺ represents a metal ion with a valence of a, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, a quaternary ammonium ion, or _NH4 ⁺ .

Examples of nonionic surfactants include glycerin, trihydroxymethylpropane, trihydroxymethylethane, and ethoxylates and propoxylates thereof (e.g., glycerin propoxylate, glycerin ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Lubrizol Japan Limited.), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D-6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (Nissin Chemical Co., Ltd.) etc.

Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzylammonium chloride, alkylpyridinium salts, and imidazolium salts. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, and stearylamide methylpyridinium chloride.

Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyl diphenyl ether disulfonate, sodium alkyl naphthalene sulfonate, sodium dialkyl sulfosuccinate, sodium stearate, potassium oleate, dioctyl sodium sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkyl sulfosuccinate, sodium oleate, and sodium tertiary octylphenoxyethoxypolyethoxyethyl sulfate.

Examples of silicone surfactants include DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (all manufactured by DuPont Toray Specialty Materials K.K.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (the above products are manufactured by BYK Chemie GmbH), etc.

Furthermore, among silicone-based surfactants, compounds with the following structures can also be used.

The surfactant content is preferably 0.001-1 mass %, more preferably 0.001-0.5 mass %, and even more preferably 0.001-0.2 mass % of the total solids content of the composition. The composition may contain only one surfactant or two or more. When two or more surfactants are present, the total amount is preferably within the above range.

<<Polymerization Inhibitor>>

The composition of the present invention may contain a polymerization inhibitor. Examples of such polymerization inhibitors include hydroquinone, p-methoxyphenol, di- and tertiary butyl-p-cresol, gallol, tertiary butyl-o-catechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tertiary butylphenol), 2,2'-methylenebis(4-methyl-6-tertiary butylphenol), and N-nitrosophenylhydroxylamine salts (ammonium salts, primary onium salts, etc.). p-methoxyphenol is preferred. The polymerization inhibitor content is preferably 0.0001 to 5% by mass based on the total solids content of the composition. The composition may contain only one polymerization inhibitor or two or more. In the case of more than two types, the total amount is preferably within the above range.

<<Silane Coupling Agent>>

The composition of the present invention may contain a silane coupling agent. In this specification, a silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Furthermore, a hydrolyzable group refers to a substituent that directly bonds to a silicon atom and is capable of forming a siloxane bond through at least one of a hydrolysis reaction and a condensation reaction. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, and acyloxy groups, with alkoxy groups being preferred. In other words, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than hydrolyzable groups include vinyl, styryl, (meth)acryl, octyl, epoxy, oxacyclobutane, amino, urea, sulfide, isocyanate, and phenyl groups, with (meth)acryl and epoxy groups being preferred. Silane coupling agents include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and in paragraphs 0056 to 0066 of JP-A-2009-242604, the contents of which are incorporated herein. The silane coupling agent content is preferably 0.01-15.0 mass% of the total solid content of the composition, and more preferably 0.05-10.0 mass%. The composition may contain only one silane coupling agent or two or more. When two or more silane coupling agents are included, the total amount is preferably within the above range.

<<UV Absorber>>

The composition of the present invention can contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazol compounds, and the like. Compounds, indole compounds, tri Compounds, etc. Specific examples of such compounds include those described in paragraphs 0038 to 0052 of JP-A-2009-217221, paragraphs 0052 to 0072 of JP-A-2012-208374, paragraphs 0317 to 0334 of JP-A-2013-068814, and paragraphs 0061 to 0080 of JP-A-2016-162946, the contents of which are incorporated herein. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by Daito Chemical Co., Ltd.), the Tinuvin series manufactured by BASF, and the Uvinul series. Examples of benzotriazole compounds include the MYUA series manufactured by MIYOSHI OIL & FAT CO., LTD. (Chemical Industry Daily, February 1, 2016). Furthermore, UV absorbers may include compounds described in paragraphs 0049-0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059-0076 of International Publication No. 2016/181987, and thioaryl-substituted benzotriazole-type UV absorbers described in International Publication No. 2020/137819. The UV absorber content is preferably 0.01-30% by mass, and more preferably 0.05-25% by mass, based on the total solids content of the composition. The composition may contain only one type of ultraviolet absorber or two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

<<Antioxidants>>

The composition of the present invention can contain an antioxidant. Examples of the antioxidant include phenolic compounds, phosphite compounds, and thioether compounds. As the phenolic compound, any phenolic compound known as a phenolic antioxidant can be used. Preferred phenolic compounds include hindered phenolic compounds. Compounds having a substituent at a position adjacent to a phenolic hydroxyl group (adjacent position) are preferred. As the substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Furthermore, the antioxidant is preferably a compound having a phenolic group and a phosphite group in the same molecule. Furthermore, the antioxidant can preferably be a phosphorus-based antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphinocycloheptadien-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetrakis-tetriblyldibenzo[d,f][1,3,2]dioxaphosphinocycloheptadien-2-yl)oxy]ethyl]amine, and bis(2,4-di-tetriblyl-6-methylphenyl)ethyl phosphite. Examples of commercially available antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, and ADK STAB AO-330 (all manufactured by ADEKA Corporation). Antioxidants that can also be used include compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017/006600, and compounds described in International Publication No. 2017/164024. The antioxidant content is preferably 0.01-20% by mass, and more preferably 0.3-15% by mass, based on the total solids content of the composition. The composition may contain only one antioxidant or two or more. If two or more antioxidants are present, the total amount is preferably within the above range.

<<Other Ingredients>>

The composition of the present invention may contain sensitizers, curing accelerators, fillers, thermosetting accelerators, plasticizers, and other additives (such as conductive particles, defoaming agents, flame retardants, leveling agents, exfoliation accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.) as needed. By appropriately incorporating these ingredients, the physical properties of the film can be adjusted. For information on these ingredients, see, for example, paragraphs 0183 and thereafter of Japanese Patent Application Publication No. 2012-003225 (paragraph 0237 of the corresponding U.S. Patent Application Publication No. 2013/0034812) and paragraphs 0101-0104 and 0107-0109 of Japanese Patent Application Publication No. 2008-250074, the contents of which are incorporated herein. Furthermore, the composition of the present invention may contain a potential antioxidant, if desired. Potential antioxidants include compounds in which the site responsible for antioxidant function is protected by a protecting group, and the protecting group is removed by heating at 100-250°C or heating at 80-200°C in the presence of an acid/base catalyst, allowing the compound to function as an antioxidant. Examples of potential antioxidants include compounds described in International Publication Nos. 2014/021023, 2017/030005, and JP-A-2017-008219. Commercially available potential antioxidants include ADEKA ARKLS GPA-5001 (manufactured by ADEKA CORPORATION).

<Storage Container>

The container for the composition of the present invention is not particularly limited, and any known container can be used. Furthermore, to prevent the incorporation of impurities into the raw materials or components, a multilayer bottle with an inner wall composed of six layers of six different resins, or a bottle with a seven-layer structure composed of six different resins, is also preferably used. Examples of such containers include those described in Japanese Patent Application Laid-Open No. 2015-123351. Furthermore, to prevent metal leaching from the inner wall of the container, improve the stability of the composition over time, or inhibit deterioration of the components, the inner wall of the container is preferably made of glass or stainless steel.

<Method for preparing the composition>

The composition of the present invention can be prepared by mixing the aforementioned components. All components can be dissolved or dispersed simultaneously in a solvent to prepare the composition. Alternatively, two or more solutions or dispersions containing appropriately blended components can be prepared in advance as needed and then mixed at the time of use (application).

Preparation of the composition may include a pigment dispersion process. Mechanical forces used in the pigment dispersion process include compression, extrusion, impact, shearing, and cavitation. Specific examples of these processes include bead mills, sand mills, roller mills, ball mills, paint shakers, microfluidizers, high-speed impellers, sand mills, flow jet mixers, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, when pulverizing the pigment in a sand mill (bead mill), it is preferred to use beads with a small diameter and an increased bead filling rate to improve pulverization efficiency. After the pulverization process, it is preferable to remove coarse particles by filtration, centrifugation, or the like. Furthermore, regarding the pigment dispersion process and disperser, preferably used are those described in "Complete Collection of Dispersion Technology, published by JOHOKIKO CO., LTD., July 15, 2005," "Comprehensive Data Collection of Dispersion Technology and Practical Industrial Applications Focusing on Suspension (Solid/Liquid Dispersion Systems)," published by the Business Development Center Publishing Department, October 10, 1978, and paragraph 0022 of Japanese Patent Application Publication No. 2015-157893. Furthermore, during the pigment dispersion process, the pigment can also be finely divided during the salt milling step. For information on the materials, equipment, and processing conditions used in the salt grinding process, please refer to, for example, Japanese Patent Application Publication No. 2015-194521 and Japanese Patent Application Publication No. 2012-046629.

When preparing a composition, it is preferably filtered using a filter for the purpose of removing foreign matter or reducing defects. Any filter that has been used for filtering purposes can be used without particular limitation. Examples include filters made of fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (e.g., nylon-6 and nylon-6,6), and polyolefin resins such as polyethylene and polypropylene (PP) (including high-density and ultra-high molecular weight polyolefin resins). Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The filter pore size is preferably 0.01-7.0μm, more preferably 0.01-3.0μm, and even more preferably 0.05-0.5μm. Filters within this range can more reliably remove fine foreign matter. For filter pore sizes, refer to the filter manufacturer's nominal values. Suitable filters include those provided by NIHON PALL Corporation (DFA4201NIEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (formerly Nippon Microfil Corporation), and KITZ MICROFILTER Corporation.

Furthermore, it is also preferable to use a fibrous filter material as the filter. Examples of fibrous filter materials include polypropylene fiber, nylon fiber, and glass fiber. Commercially available products include the SBP series (SBP008, etc.), TPR series (TPR002, TPR005, etc.), and SHPX series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, different filters (e.g., a first filter and a second filter) may be combined. In this case, filtration with each filter may be performed only once or twice or more. Furthermore, filters with different pore sizes within the above range may be combined. Furthermore, filtration with the first filter may be performed only on the dispersion, and after mixing the other components, filtration with the second filter may be performed.

<Membrane>

Next, the membrane of the present invention will be described. The membrane of the present invention is obtained from the composition of the present invention described above. The membrane of the present invention can be preferably used as an optical filter. The use of the optical filter is not particularly limited, and examples thereof include infrared cutoff filters and infrared transmission filters. Examples of infrared cut filters include those on the light-receiving side of a solid-state imaging device (e.g., those used for wafer-grade lenses), those on the back side (opposite to the light-receiving side) of a solid-state imaging device, and those for ambient light sensors (e.g., illumination sensors that adjust the color tone of a display by sensing the illuminance or color tone of the environment where an information terminal is located, or color correction sensors that adjust the color tone). In particular, infrared cut filters can be preferably used as infrared cut filters on the light-receiving side of a solid-state imaging device. As infrared transmission filters, there are filters that block visible light and selectively transmit infrared light above a specific wavelength.

The average transmittance of the film of the present invention in the wavelength range of 700-1500 nm is preferably less than 10%, and more preferably less than 5%.

The film of the present invention may have a pattern or be an unpatterned film (flat film). Furthermore, the film of the present invention may be used by being laminated onto a support or by being peeled off from the support. Examples of the support include semiconductor substrates such as silicon substrates and transparent substrates.

A charge-coupled device (CCD), complementary metal oxide semiconductor (CMOS), transparent conductive film, etc. can be formed on the semiconductor substrate serving as a support. Furthermore, a black matrix can be formed on the semiconductor substrate to isolate individual pixels. Furthermore, an underlayer can be formed on the surface of the semiconductor substrate. The surface contact angle of the underlayer is preferably 20-70° when measured with diiodomethane. Furthermore, 30-80° is preferably measured with water.

The transparent substrate used as a support is not particularly limited as long as it is made of a material that can at least transmit visible light. For example, substrates made of materials such as glass and resins can be cited. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene vinyl acetate copolymer, norbornene resins, polyacrylates, acrylic resins such as polymethyl methacrylate, polyurethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, and polyvinyl alcohol resins. Examples of glass include alkali-lime glass, borosilicate glass, alkali-free glass, quartz glass, and glass containing copper. Examples of copper-containing glass include copper-containing phosphate glass and copper-containing fluorsphate glass. Commercially available copper-containing glass can also be used. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC Techno Glass Co., Ltd.).

The thickness of the film of the present invention can be appropriately adjusted depending on the intended purpose. The film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, and more preferably 0.2 μm or more.

The film of the present invention can also be used in combination with a color filter containing a colorant. The color filter can be manufactured using a coloring composition containing a colorant. When the film of the present invention is used as an infrared cutoff filter and is combined with the color filter, it is preferably arranged with the color filter on the optical path of the film of the present invention. For example, the film of the present invention and the color filter are preferably laminated to form a laminate. In the laminate, the film of the present invention and the color filter may or may not be adjacent in the thickness direction. In the case where the film of the present invention and the color filter are not adjacent in the thickness direction, the film of the present invention may be formed on a support different from the support on which the color filter is formed, or other components constituting a solid-state imaging device (e.g., microlenses, planarization layers, etc.) may be interposed between the film of the present invention and the color filter.

The film of the present invention can be used in various devices, including solid-state imaging devices such as CCDs (charge-coupled devices), CMOSs (complementary metal oxide semiconductors), infrared sensors, and image display devices.

<Method for producing film>

The film of the present invention can be produced by applying the composition of the present invention.

Examples of the support include those mentioned above. As a method for applying the composition, any known method can be used. Examples include drop casting, slit coating, spraying, roll coating, spin coating, cast coating, slit spin coating, pre-wetting (e.g., the method described in Japanese Patent Application Laid-Open No. 2009-145395), various printing methods including inkjet printing (e.g., on-demand, piezoelectric, and thermal), nozzle printing, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing; transfer printing using a mold, etc.; and nanoimprinting. The applicable method for inkjet printing is not particularly limited. Examples include the method described in "Inkjet for Broad Application - Infinite Possibilities Emerging from Patents," published in February 2005 by Sumitbe Techon Research Co., Ltd. (particularly pages 115-133), and methods described in Japanese Patent Application Publication Nos. 2003-262716, 2003-185831, 2003-261827, 2012-126830, and 2006-169325.

The composition layer formed by applying the composition can be dried (pre-baked). When pre-baking is performed, the pre-baking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or 80°C or higher. The pre-baking time is preferably 10 to 3000 seconds, more preferably 40 to 2500 seconds, and even more preferably 80 to 220 seconds. Drying can be performed using a hot plate, oven, or other means.

The film manufacturing method may further include a patterning step. Examples of patterning methods include photolithography and dry etching, with photolithography being preferred. Furthermore, when the film of the present invention is used as a flat film, the patterning step may not be required. The patterning step is described in detail below.

(In the case of pattern formation using photolithography)

The method for forming a pattern by photolithography preferably includes the following steps: exposing a composition layer formed by coating the composition of the present invention in a pattern (exposure step); and developing and removing unexposed portions of the composition layer to form a pattern (development step). Optionally, a step of baking the developed pattern (post-baking step) may be included. Each step is described below.

In the exposure step, the component layer is exposed in a pattern. For example, a stepper or scanner can be used to expose the component layer through a mask with a predetermined mask pattern. This allows the exposed portion to be cured.

Examples of radiation (light) that can be used for exposure include g-rays and i-rays. Furthermore, light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (248 nm) and ArF rays (193 nm), with KrF rays (248 nm) being preferred. Furthermore, long-wavelength light sources of 300 nm or more can also be used.

Furthermore, exposure can be performed by continuous light irradiation or pulsed light irradiation (pulse exposure). Furthermore, pulsed exposure refers to an exposure method in which light irradiation and pauses are repeated in a short cycle (e.g., less than milliseconds).

The irradiation dose (exposure dose) is preferably 0.03-2.5 J/ ^cm² , and more preferably 0.05-1.0 J/ ^cm² . The oxygen concentration during exposure can be appropriately selected. In addition to exposure in air, exposure can be performed in a low-oxygen environment with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially no oxygen), or in a high-oxygen environment with an oxygen concentration exceeding 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, typically within a range of 1000 W/ ^m² to 100,000 W/ ^m² (e.g., 5000 W/ ^m² , 15,000 W/ ^m² , or 35,000 W/ ^m² ). The oxygen concentration and exposure illuminance can be appropriately combined, for example, with an oxygen concentration of 10% by volume and an illuminance of 10,000 W/ ^m² , or an oxygen concentration of 35% by volume and an illuminance of 20,000 W/ ^m² .

Next, development is performed to remove the unexposed portions of the exposed component layer, forming a pattern. This development can be performed using a developer. The unexposed portions of the component layer are dissolved by the developer, leaving only the photohardened portions on the support. The developer temperature is preferably between 20 and 30°C, for example. The development time is preferably between 20 and 180 seconds. Furthermore, to improve residue removal, the process of discarding the developer solution and reapplying it every 60 seconds can be repeated several times.

The developer may be an organic solvent or an alkaline developer, but an alkaline developer is preferably used. An alkaline aqueous solution (alkaline developer) obtained by diluting an alkaline agent with pure water is preferred. Examples of the alkaline agent include organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo[5.4.0]-7-undecene; and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. From an environmental and safety perspective, alkaline compounds with large molecular weight are preferred. The alkaline concentration in the alkaline aqueous solution is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. The developer may further contain a surfactant. Non-ionic surfactants are preferred. For ease of transportation and storage, the developer can be prepared as a concentrated solution and diluted to the desired concentration upon use. The dilution ratio is not particularly limited and can be set, for example, within a range of 1.5 to 100 times. Furthermore, rinsing with pure water after development is also preferred. Furthermore, rinsing is preferably performed by rotating the support on which the developed composition layer is formed while supplying rinsing liquid to the developed composition layer. Alternatively, rinsing is preferably performed by moving the nozzle that discharges the rinsing liquid from the center of the support toward the periphery. In this case, the nozzle can be moved while gradually decreasing its movement speed from the center of the support toward the periphery. Performing rinsing in this manner can suppress in-plane rinsing variations. A similar effect can be achieved by gradually decreasing the rotational speed of the support as the nozzle moves from the center toward the periphery.

After development, drying is preferably followed by additional exposure and heating (post-baking). Additional exposure and post-baking are post-development curing processes performed to fully cure the film. The heating temperature during post-baking is preferably 100-240°C, and more preferably 200-240°C. To achieve these conditions, the developed film can be post-baked continuously or intermittently using a heating mechanism such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater. When performing additional exposure, the exposure light preferably has a wavelength of 400nm or less. Furthermore, the additional exposure process can be performed using the method described in Korean Patent Publication No. 10-2017-0122130.

(Pattern formation by dry etching)

Patterning by dry etching can be performed by curing a composition layer formed by coating the above-mentioned composition on a support to form a cured layer, then forming a patterned photoresist layer on the cured layer. Dry etching is then performed on the cured layer using an etching gas, using the patterned photoresist layer as a mask. Pre-baking is preferably performed during the formation of the photoresist layer. For information on patterning by dry etching, please refer to paragraphs 0010-0067 of Japanese Patent Application Laid-Open No. 2013-064993, which is incorporated herein by reference.

<Filter>

The optical filter of the present invention comprises the aforementioned film of the present invention. Examples of optical filters include infrared cut filters and infrared transmission filters.

In addition to the aforementioned films of the present invention, the filter of the present invention may also include a copper-containing layer, a dielectric multilayer film, an ultraviolet absorption layer, and the like. Examples of ultraviolet absorption layers include those described in paragraphs 0040-0070 and 0119-0145 of International Publication No. 2015/099060. Examples of dielectric multilayer films include those described in paragraphs 0255-0259 of Japanese Patent Application Laid-Open No. 2014-041318. As the copper-containing layer, a glass substrate formed of copper-containing glass (copper-containing glass substrate) or a layer containing a copper complex (copper-containing complex layer) may also be used. Examples of copper-containing glass substrates include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercially available copper-containing glass products include NF-50 (manufactured by AGC Techno Glass Co., Ltd.), BG-60, BG-61 (all manufactured by Schott AG), and CD5000 (manufactured by HOYA GROUP).

<Solid-state imaging device>

The solid-state imaging device of the present invention includes the film of the present invention described above. The structure of the solid-state imaging device is not particularly limited as long as it includes the film of the present invention and functions as a solid-state imaging device. For example, the following structures can be cited.

The structure is as follows: a plurality of photodiodes constituting the light-receiving area of a solid-state imaging element and a transmission electrode formed of polysilicon or the like are provided on a support; a light-shielding film formed of tungsten or the like, with only the light-receiving portion of the photodiodes being opened, is provided on the photodiodes and the transmission electrode; a device protective film formed of silicon nitride or the like, formed to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiodes, is provided on the light-shielding film; and the film of the present invention is provided on the device protective film. Alternatively, a light-focusing mechanism (e.g., a microlens, etc., the same shall apply hereinafter) may be provided on the device protective film and on the lower side (the side closer to the support) of the film of the present invention, or a light-focusing mechanism may be provided on the film of the present invention. Alternatively, the color filter can have a structure in which a film forming each pixel is embedded within spaces partitioned by partitions, for example, in a grid pattern. In this case, the partitions preferably have a refractive index lower than that of the pixels. Examples of imaging devices having such structures include those described in Japanese Patent Application Publication Nos. 2012-227478 and 2014-179577.

<Image display device>

The image display device of the present invention includes the film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescent (EL) display devices. Definitions and details of image display devices are described in, for example, "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd. in 1990)" and "Display Devices (written by Junsho Ibuki, published by Sangyo Tosho Publishing Co., Ltd. in 1989)." Liquid crystal display devices are described in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd. in 1994)." There are no particular limitations on the liquid crystal display devices to which the present invention can be applied. For example, the present invention can be applied to liquid crystal display devices of various types described in the aforementioned "Next Generation Liquid Crystal Display Technology." The image display device can include a white organic EL element. A tandem structure is preferred for white organic EL elements. The tandem structure of organic EL elements is described in Japanese Patent Application Publication No. 2003-045676, supervised by Akiyoshi Mikami, "Frontiers in Organic EL Technology Development - High Brightness, High Precision, Long Life, and Techniques," Technical Information Institute Co., Ltd., pp. 326-328, 2008. The spectrum of white light emitted by organic EL devices preferably exhibits strong, maximum emission peaks in the blue region (430-485nm), green region (530-580nm), and yellow region (580-620nm). Furthermore, it is preferred that the spectrum also exhibits a strong emission peak in the red region (650-700nm).

<Infrared sensor>

The infrared sensor of the present invention includes the film of the present invention described above. The structure of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. An embodiment of the infrared sensor of the present invention is described below using drawings.

In Figure 1, reference numeral 110 denotes a solid-state imaging element. An infrared cut filter 111 and an infrared transmission filter 114 are disposed on the imaging area of solid-state imaging element 110. Furthermore, a color filter 112 is disposed above infrared cut filter 111. A microlens 115 is disposed on the incident light hν side of color filter 112 and infrared transmission filter 114. A planarization layer 116 is formed to cover microlens 115.

The infrared cutoff filter 111 can be formed using the composition of the present invention. The color filter 112 is formed with pixels that transmit and absorb light of specific wavelengths in the visible range. There are no particular limitations, and any known pixel-forming filter can be used. For example, a filter formed with red (R), green (G), and blue (B) pixels can be used. For example, see paragraphs 0214-0263 of Japanese Patent Application Laid-Open No. 2014-043556, which is incorporated herein. The infrared transmission filter 114 can have its characteristics selected according to the emission wavelength of the infrared LED used. The infrared transmission filter 114 can be formed using the composition of the present invention.

In the infrared sensor shown in Figure 1 , an infrared cut filter (another infrared cut filter) different from the infrared cut filter 111 can be further disposed on the planarization layer 116. Examples of other infrared cut filters include those having a copper-containing layer and/or a multilayer dielectric film. Details of these can be found in the examples mentioned above. Alternatively, a dual-band pass filter can be used as the other infrared cut filter.

[Example]

The present invention is further described below with reference to the following examples. The materials, amounts used, ratios, treatment contents, and treatment steps shown in the following examples may be modified as appropriate without departing from the spirit of the present invention. Furthermore, Ph in the structural formula represents a phenyl group.

<Measurement of weight average molecular weight and number average molecular weight>

The weight-average molecular weight of the resin was measured using an HPC-8220GPC (manufactured by TOSOH Corporation) as the measuring instrument, a TSKguardcolumn SuperHZ-L as the guard column, and columns directly connected to TSKgel SuperHZM-M, TSKgel SuperHZ4000, TSKgel SuperHZ3000, and TSKgel SuperHZ2000. The column temperature was set at 40°C, and 10 μL of a 0.1% by mass tetrahydrofuran solution of the sample was injected into the column. Tetrahydrofuran was passed as the eluent at a flow rate of 0.35 mL/min. The sample peak was detected using an RI (differential refractive index) detector, and calculations were performed using a calibration curve prepared using standard polystyrene.

<Preparation of Pigment Dispersion>

The materials listed in the table below were mixed in the amounts shown. Zirconia beads with a diameter of 0.3 mm were used to mix and disperse the mixture for 3 hours using a bead mill (a NANO-3000-10 high-pressure disperser with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) to prepare each pigment dispersion.

The details of the materials listed in the table are as follows.

(Paint)

P001~P004: Compounds with the following structures (infrared absorbers)

PR254: C.I. Pigment Red 254 (red pigment)

PB15:6: C.I. Pigment Blue 15:6 (blue pigment)

(Pigment derivatives)

B-1~B-3: Compounds with the following structures

[Chemical formula 20]

(Dispersant)

D-1: Resin with the following structure (values attached to the main chain are molar ratios, values attached to the side chains are the number of repeating units. Weight-average molecular weight 28,000)

D-2: Resin with the following structure (values attached to the main chain are molar ratios, values attached to the side chains are the number of repeating units. Weight average molecular weight 28,000)

[Chemical formula 22]

(Solvent)

S001: Propylene glycol monomethyl ether acetate

<Preparation of composition>

The materials other than the solvent listed in the table below were mixed in the proportions shown in the table below. The solvent listed in the table below was added to a solids concentration of 20% by mass. The mixture was then stirred and filtered through a nylon filter with a pore size of 0.45 μm (manufactured by NIHON PALL Corporation) to prepare a composition. The values in the "Amount of Blend" column in the table are expressed as parts by mass based on the solids content.

The details of the materials listed in the above table are as follows.

(Infrared absorber)

[Compound represented by formula (1)]

A001: Compound with the following structure (maximum absorption wavelength in dichloromethane is 920nm)

A002: Compound with the following structure (maximum absorption wavelength in dichloromethane is 900nm)

A003: Compound with the following structure (maximum absorption wavelength in dichloromethane is 910nm)

A004: Compound with the following structure (maximum absorption wavelength in dichloromethane is 980nm)

A005: Compound with the following structure (maximum absorption wavelength in dichloromethane is 990nm)

A006: Compound with the following structure (maximum absorption wavelength in dichloromethane is 970nm)

A007: Compound with the following structure (maximum absorption wavelength in dichloromethane is 1000nm)

A008: Compound with the following structure (maximum absorption wavelength in dichloromethane is 990nm)

A009: Compound with the following structure (maximum absorption wavelength in dichloromethane is 930nm)

A010: Compound with the following structure (maximum absorption wavelength in dichloromethane is 960nm)

A011: Compound with the following structure (maximum absorption wavelength in dichloromethane is 940nm)

A012: Compound with the following structure (maximum absorption wavelength in dichloromethane is 900nm)

A013: Compound with the following structure (maximum absorption wavelength in dichloromethane is 910nm)

A014: Compound with the following structure (maximum absorption wavelength in dichloromethane is 870nm)

A015: Compound with the following structure (maximum absorption wavelength in dichloromethane is 1080nm)

A016: Compound with the following structure (maximum absorption wavelength in dichloromethane is 1010nm)

A017: Compound with the following structure (maximum absorption wavelength in dichloromethane is 1030nm)

[Chemical formula 23]

[Chemical formula 26]

[Infrared absorbers other than the compound represented by formula (1)]

A101: Compounds with the following structures

(Pigment dispersion)

IR1~IR4, Red1, Blue1: The pigment dispersions IR1~IR4, Red1, Blue1 mentioned above.

(resin)

B001: Polymethyl methacrylate (weight-average molecular weight 24,000, dispersion 1.8, glass transition temperature 75°C)

B002: Resin with the following structure (resin with acid groups. Values noted on the main chain are the molar ratios of repeating units. Weight-average molecular weight 20,000, dispersity 1.9, glass transition temperature 100°C)

B003: Resin with the following structure (resin with acid groups. Values noted on the main chain are the molar ratios of repeating units. Weight-average molecular weight 15,000, dispersity 2.1, glass transition temperature 120°C)

B004: Resin with the following structure (polyimide resin, weight-average molecular weight 25,000, dispersion 2.2, glass transition temperature 310°C)

(Polymerizable compound)

M-1: ARONIX M-305 (manufactured by TOAGOSEI CO., LTD., a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. The pentaerythritol triacrylate content is 55% to 63% by mass.)

M-2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd., ethylene oxide-modified pentaerythritol tetraacrylate)

M-3: ARONIX M-510 (manufactured by TOAGOSEI CO., LTD., polyacid-modified acrylic acid oligomer)

(Photopolymerization initiator)

C-1: Irgacure OXE01 (manufactured by BASF, oxime ester-based initiator)

C-2: Irgacure OXE02 (manufactured by BASF, oxime ester-based initiator)

(Surfactant)

F-1: MEGAFACE RS-72-K (manufactured by DIC Corporation, fluorine-based surfactant)

F-2: Compound with the following structure (weight average molecular weight 14000, values representing the percentage of repeating units are in molar %)

F-3: KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd., polydimethylsiloxane modified with methanol at both ends, hydroxyl value 62 mgKOH/g)

(Polymerization inhibitor)

G-1: p-Methoxyphenol

(Other additives)

U-1: Uvinul 3050 (manufactured by BASF, UV absorber)

U-2: Tinuvin 477 (produced by BASF, hydroxyphenyl tris(III) UV absorber)

U-3: Tinuvin 326 (manufactured by BASF, UV absorber)

EP-1: Compound with the following structure (epoxy compound, weight-average molecular weight 4000)

EP-2: EHPE3150 (manufactured by Daicel Corporation, 1,2-epoxy-4-(2-epoxyethylene)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol)

(Solvent)

S001: Propylene glycol monomethyl ether acetate

S002: Propylene glycol monomethyl ether

<Evaluation of infrared shielding, light resistance, and heat resistance>

Each composition was spin-coated onto a glass substrate to a film thickness of 1.0 μm. Full-surface exposure was performed using an i-ray stepper (FPA-3000i5+, manufactured by Canon Inc.) at an exposure dose of 1000 mJ/ ^cm² . The film was then heated at 200°C for 2 minutes using a hot plate to form a film.

-Evaluation of infrared shielding properties-

The transmittance of the glass substrate on which the above film was formed was measured in the wavelength range of 400 to 1600 nm using an ultraviolet-visible near-infrared spectrophotometer (U-4100, manufactured by Hitachi High-Technologies Corporation). The average transmittance in the wavelength range of 1000 to 1200 nm was calculated, and the infrared shielding properties were evaluated according to the following criteria.

A: The average transmittance is less than 5%.

B: The average transmittance is greater than 5% and less than 10%.

C: The average transmittance is above 10%

-Evaluation of lightfastness-

The transmittance of the glass substrate on which the film was formed was measured in the wavelength range of 400 to 1600 nm using an ultraviolet-visible-near-infrared spectrophotometer (U-4100, manufactured by Hitachi High-Technologies Corporation). The glass substrate was then irradiated with a xenon lamp at 100,000 lux for 20 hours (equivalent to 2,000,000 lux/h). The transmittance of the film after xenon lamp irradiation was then measured. The change in transmittance (ΔT1) at each wavelength within the 1000 to 1500 nm wavelength range before and after xenon lamp irradiation was determined. Light resistance was evaluated using the following criteria based on the maximum ΔT1 value across the entire measured wavelength range. Smaller ΔT1 values indicate better light resistance.

Transmittance change (△T1) = |Transmittance of the membrane before xenon lamp irradiation - Transmittance of the membrane after xenon lamp irradiation|

A: △T1 less than 3%

B: △T1 is greater than 3% and less than 5%

C: △T1 is 5% or more

-Evaluation of Heat Resistance-

The transmittance of the glass substrate on which the film was formed was measured within the wavelength range of 400 to 1600 nm using a UV-Vis-Near-Infrared spectrophotometer (U-4100, manufactured by Hitachi High-Technologies Corporation). The glass substrate with the film was then heated at 200°C for 10 minutes using a hot plate. The change in transmittance (ΔT2) before and after heating at each wavelength within the 1000 to 1500 nm range was determined. Heat resistance was evaluated using the following criteria based on the maximum ΔT2 value across the entire wavelength range. Smaller ΔT2 values indicate better heat resistance.

Transmittance change (△T2) = |Transmittance of the membrane before heating - Transmittance of the membrane after heating|

A: △T2 less than 5%

B: △T2 is greater than 5% and less than 10%

C: △T2 is 10% or more

<Evaluation of Pattern Formation>

Each composition was spin-coated onto a glass substrate to a film thickness of 1.0 μm, then heated on a hot plate at 100°C for 2 minutes. Next, exposure was performed using an i-ray stepper (FPA-3000i5+, manufactured by Canon Inc.) through a 1 μm Bayer pattern mask at an exposure dose of 1000 mJ/ ^cm² . Next, spin immersion development was performed at 23°C for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH). After rinsing with a rotary shower and then washing with pure water, the surface was heated on a hot plate at 200°C for 5 minutes to form the pattern (pixels). The glass substrate with pixels formed thereon was observed under a microscope at 10,000x magnification, and pattern formation was evaluated according to the following evaluation criteria.

A: Able to form patterns

B: Unable to form a pattern

As shown in the above table, the composition of the embodiment can form a film with excellent infrared shielding properties.

without.

Claims (17)

A composition comprising an infrared absorber and a curable compound, wherein the infrared absorber comprises a compound represented by formula (1), and the content of the compound represented by formula (1) in the total solid content of the composition is 3% by mass to 70% by mass. [Chemical formula 1] In formula (1), ^Ar1 and ^Ar2 each independently represent a nitrogen-containing heterocyclic ring that can be condensed to form a polycyclic ring, ^R1 and ^R2 each independently represent a substituent, n1 and n2 each independently represent an integer greater than 0, ^Y1 and ^Y2 each independently represent -O-, -S- or -NR ^Y1 -, ^RY1 represents a hydrogen atom or a substituent, ^X1 and ^X2 each independently represent a hydrogen atom, -BR ^{X1 RX2} or a metal atom that can be coordinated by a ligand, ^RX1 and ^RX2 each independently represent a hydrogen atom or a substituent, and ^RX1 and R ^X2 can be bonded to form a ring, and the substituent is a halogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an alkynyl group having 2 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, a heteroaryl group having 1 to 30 carbon atoms, an amino group having 0 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryloxy group having 6 to 30 carbon atoms, a heteroaryloxy group having 1 to 30 carbon atoms, an acyl group having 2 to 30 carbon atoms, a an alkoxycarbonyl group having 7 to 30 carbon atoms, an aryloxycarbonyl group having 2 to 30 carbon atoms, a heteroaryloxycarbonyl group having 2 to 30 carbon atoms, an acyloxy group having 2 to 30 carbon atoms, an amide group having 2 to 30 carbon atoms, an aminocarbonylamino group having 2 to 30 carbon atoms, an alkoxycarbonylamino group having 2 to 30 carbon atoms, an aryloxycarbonylamino group having 7 to 30 carbon atoms, an aminosulfonyl group having 0 to 30 carbon atoms, an aminosulfonylamino group having 0 to 30 carbon atoms, an aminoformyl group having 1 to 30 carbon atoms, an alkylthio group having 1 to 30 carbon atoms, an arylthio group having 6 to 30 carbon atoms, a heteroarylthio group having 1 to 30 carbon atoms, an alkylsulfonyl group having 1 to 30 carbon atoms, an alkylsulfonamido group having 1 to 30 carbon atoms, an arylsulfonyl group having 6 to 30 carbon atoms, an arylsulfonamido group having 6 to 30 carbon atoms, a heteroarylsulfonyl group having 1 to 30 carbon atoms, a heteroarylsulfonamido group having 1 to 30 carbon atoms, an alkylsulfinyl group having 1 to 30 carbon atoms, a The present invention further comprises an arylsulfinyl group having 1 to 30 carbon atoms, a heteroarylsulfinyl group having 1 to 30 carbon atoms, a urea group having 1 to 30 carbon atoms, a hydroxyl group, a nitro group, a carboxyl group, a sulfonic acid group, a phosphoric acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imide group, a phosphino group, a hydroxyl group, a cyano group, an alkylsulfinyl group, an arylsulfinyl group, an arylazo group, a heteroarylazo group, a phosphinyl group, a phosphinyloxy group, a phosphinylamine group, a silyl group, a hydrazine group, or an imine group. The composition as claimed in claim 1, wherein n1 and n2 in the aforementioned formula (1) each independently represent an integer greater than 1, and ^R1 and ^R2 in the aforementioned formula (1) each independently represent an aryl group having 6 to 30 carbon atoms or a heteroaryl group having 1 to 30 carbon atoms. The composition as described in claim 1 or claim 2, wherein ^Y1 and ^Y2 in the aforementioned formula (1) are -O-. The composition as described in claim 1 or claim 2, wherein ^X1 and ^X2 in the aforementioned formula (1) each independently represent ^-BRX1RX2 , ^RX1 and ^RX2 each independently represent a hydrogen atom or the substituent, ^{and RX1} and ^RX2 may be bonded to form a ring. The composition as described in claim 1 or claim 2, wherein ^RX1 and ^RX2 independently represent a halogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an alkynyl group having 2 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, a heteroaryl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, or an aryloxy group having 6 to 30 carbon atoms, and ^RX1 and ^RX2 may be bonded to form a ring. The composition as described in claim 1 or claim 2, wherein the compound represented by the aforementioned formula (1) has a maximum absorption wavelength in dichloromethane within the wavelength range of 1000 to 1600 nm. The composition according to claim 1 or claim 2, wherein the infrared absorber contains a compound other than the compound represented by the aforementioned formula (1). The composition as described in claim 1 or claim 2, further comprising a coloring agent. The composition according to claim 1 or claim 2, wherein the curable compound contains a resin having an acid group. The composition as described in claim 1 or claim 2, wherein the curable compound contains a polymerizable compound. The composition according to claim 1 or claim 2, wherein the curable compound comprises a resin having a glass transition temperature of 150°C or higher. The composition as described in claim 1 or claim 2 is used in an infrared sensor. A film obtained using the composition of any one of claims 1 to 12. A filter comprising the film of claim 13. A solid-state imaging device comprising the film described in claim 13. An image display device comprising the film of claim 13. An infrared sensor comprising the film according to claim 13.