TWI890046B - Stage device, transfer device and article manufacturing method - Google Patents

Abstract

The present invention provides a stage device, a transfer device, and an article manufacturing method. The stage device for holding a substrate includes: a coarse motion stage; a coarse motion actuator for driving the coarse motion stage along a specified plane; a fine motion stage for holding the substrate; a fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage; and an electromagnetic actuator for transmitting the thrust provided to the coarse motion stage by the coarse motion actuator to the fine motion stage in a non-contact manner. The electromagnetic actuator includes: a movable iron core fixed to the fine motion stage; a fixed iron core fixed to the coarse motion stage; and a coil wound on the fixed iron core. The shortest distance between the substrate held by the fine motion stage and the coil is greater than the shortest distance between the substrate and the fixed iron core.

Description

Carrier device, transfer device, and article manufacturing method

The present invention relates to a stage device, a transfer device and an article manufacturing method.

A transfer device for transferring a pattern from an original plate to a substrate may include: a coarse motion stage driven by a coarse motion actuator; and a fine motion stage disposed on the coarse motion stage and holding the substrate. A fine motion actuator may be disposed between the coarse motion stage and the fine motion stage for adjusting the position and orientation of the fine motion stage relative to the coarse motion stage. Furthermore, an electromagnetic actuator may be disposed between the coarse motion stage and the fine motion stage for contactlessly transmitting a thrust applied to the coarse motion stage by the coarse motion actuator to the fine motion stage. [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Application Publication No. 2005-109522 Patent Document 2: Japanese Patent Application Publication No. 8-130179

[Problem to be Solved by the Invention] When the fine motion stage is accelerated, a torque is applied to the stage. Activating the fine motion actuator to offset this torque increases heat generated by the actuator. This heat causes deformation of the fine motion stage, which in turn reduces overlay accuracy. The present invention aims to provide a technology that effectively reduces the torque acting on the fine motion stage. [Technical Solution] A first aspect of the present invention relates to a stage device for holding a substrate, comprising: a coarse motion stage; a coarse motion actuator for driving the coarse motion stage along a predetermined plane; a fine motion stage for holding the substrate; a fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage; and an electromagnetic actuator for contactlessly transmitting a thrust applied to the coarse motion stage by the coarse motion actuator to the fine motion stage. The electromagnetic actuator comprises: a movable iron core fixed to the fine motion stage; a fixed iron core fixed to the coarse motion stage; and a coil wound around the fixed iron core. The shortest distance between the coil and the substrate held by the fine motion stage is greater than the shortest distance between the substrate and the fixed iron core. The second aspect of the present invention relates to a transfer device for transferring a pattern from an original plate to a substrate, the transfer device comprising the stage device according to the first aspect. The third aspect of the present invention relates to a method for manufacturing an article, comprising: a transfer step of transferring the pattern from the original plate to a substrate using the transfer device according to the second aspect; and a step of obtaining an article from the substrate subjected to the transfer step. [Effects of the Invention] According to the present invention, a technique can be provided that is advantageous for reducing the torque acting on the fine motion stage.

Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention to which the patent application relates, and not all combinations of the features described in the embodiments are necessary components of the invention. Two or more of the multiple features described in the embodiments may be arbitrarily combined. In addition, the same or identical components are marked with the same figure markings, and repeated descriptions are omitted. In the following description, directions are described based on the XYZ coordinate system. The XY plane defined by the X-axis and the Y-axis is typically a horizontal plane, and the Z-axis is typically parallel to the vertical direction. The XY direction is a direction parallel to the XY plane. The X-axis direction is a direction parallel to the X-axis, the Y-axis direction is a direction parallel to the Y-axis, and the Z-axis direction is a direction parallel to the Z-axis. FIG1 exemplarily shows the structure of an exposure device of an embodiment. This exposure apparatus can be understood as an example of an alignment device that aligns a first object (e.g., a substrate) and a second object (e.g., a master) relative to each other, or a transfer device that transfers a pattern from a master (reduction mask) to a substrate (wafer). A stage plate 692 can be arranged above a floor 691 with a stand interposed therebetween, and a wafer stage device 500 can be arranged thereon. Furthermore, a barrel plate 696 can be arranged above the floor 691 with a stand interposed therebetween. The barrel plate 696 can support the projection optical system 687 and the reduction mask plate 694. A reduction mask stage device 695 can be arranged above the reduction mask plate 694. An illumination optical system 699 can be arranged above the reduction mask plate 694. The illumination optical system 699 can project the image of the magnification mask carried by the magnification mask stage of the magnification mask stage device 695 onto the wafer carried by the wafer stage of the wafer stage device 500, thereby transferring the pattern of the magnification mask onto the wafer. The exposure device can also be configured as a scanning exposure device. The wafer stage device 500 can be understood as a first positioning mechanism for positioning a substrate used as a first object, or as a stage device for holding a substrate. The magnification mask stage device 695 can be understood as a second positioning mechanism for positioning a magnification mask used as a second object. At least one of the first positioning mechanism and the second positioning mechanism may include an electromagnetic device or an electromagnetic actuator described below. The above-mentioned exposure device or transfer device can be used in an article manufacturing method for manufacturing articles such as semiconductor devices. The article manufacturing method may include: a transfer process of transferring the original pattern to a substrate by the above-mentioned exposure device or transfer device; and a process of obtaining an article by processing the substrate that has undergone the transfer process. The processing of the substrate may include, for example, etching, film formation, cutting, etc. The overall structure of the wafer stage device 500 is shown as an example in Figure 2. The XY slider 104 can be configured to slide freely in the XY direction on the stage base 105. On the XY slider 104, the force in the X-axis direction can be transmitted through the X slider 102, and the force in the Y-axis direction can be transmitted through the Y slider 103. The fine motion stage device 101 can be mounted on the XY slider 104. Coarse linear motors 106 can be provided on each side of the X slider 102 and the Y slider 103 to drive them in the X-axis direction and the Y-axis direction, respectively. FIG3 exemplarily shows a state in which the fine motion stage (fine motion top plate) 101-1 of the fine motion stage device 101 is moved upward for convenience in the wafer stage device 500. The fine motion stage 101-1 holds the wafer. The fine motion stage 101-1 can also be understood as a structure having a chuck for holding the wafer. The fine motion base 101-2 can be fixed on the XY slider 104. On the fine motion base 101-2, four fine motion ZLMs (first fine motion actuators) 101-6 can be provided for precise positioning of the Z tilt. Furthermore, two fine motion XLMs (second fine motion actuators) 101-4 can be installed on fine motion base 101-2 for precise positioning along the X-axis and around the Z-axis. Furthermore, two fine motion YLMs (third fine motion actuators) 101-5 can be installed on fine motion base 101-2 for precise positioning along the Y-axis and around the Z-axis. A fine motion electromagnet 101-3 can be installed in the center of fine motion base 101-2 to transmit the acceleration forces in the X-axis and Y-axis directions applied to XY slider 104 to fine motion base 101-2. Here, fine motion base 101-2 can be understood as a coarse motion stage. Alternatively, XY slider 104 and fine motion base 101-2 can also be understood as a coarse motion stage. Furthermore, the coarse linear motor 106 can be understood as a coarse motion actuator that drives the fine motion base 101-2, which serves as a coarse motion stage, along the XY plane, i.e., a predetermined plane. Furthermore, the fine motion ZLM 101-6, fine motion XLM 101-4, and Y fine motion YLM 101-5 can be understood as fine motion actuators for adjusting the position and posture of the fine motion stage 101-1 relative to the fine motion base 101-2, which serves as a coarse motion stage. Furthermore, the fine motion electromagnet 101-3 can be understood as an electromagnetic actuator for contactlessly transmitting the thrust applied by the coarse linear motor 106, which serves as a coarse motion actuator, to the fine motion base 101-2, which serves as a coarse motion stage, to the fine motion stage 101-1. Figure 4 shows the structure of the fine motion stage device 101, specifically the detailed structure of the fine motion YLM 101-5 and the fine motion ZLM 101-6. Figure 4 also shows a state where a portion of the magnetic yoke is removed. The fine motion YLM 101-5 can be composed of a linear motor. The fine motion YLM 101-5 can include a fine motion YLM coil base 101-52, a fine motion YLM coil 101-51, a fine motion YLM magnet 101-53, a fine motion YLM magnetic yoke 101-54, and a fine motion LM gasket 101-70. The fine motion YLM coil base 101-52 can be fixed on the fine motion base 101-2, and the fine motion YLM coil 101-51 can be fixed thereon. The fine-motion YLM coil 101-51 can be an oblong coil having a straight portion extending in the vertical direction. Four fine-motion YLM magnets 101-53 are arranged facing the straight portion with a gap therebetween. Two YLM yokes 101-54 can be arranged to allow magnetic flux to pass through these magnets in a manner that sandwiches these magnets. The magnetization direction of the magnets can be in the X-axis direction, magnets adjacent in the Y-axis direction can have opposite polarity, and magnets arranged in the X-axis direction can have the same polarity. The fine-motion LM gasket 101-70 can be used to resist the attractive force acting on the pair of magnets and the yoke to maintain their position. The magnets, yoke, and gasket can be fixed to the fine-motion base 101-2. By flowing current through the YLM coil 101-51, a force proportional to the current can be generated in the direction perpendicular to the straight line portion, that is, the Y-axis direction. Furthermore, by flowing current in opposite directions through the two fine-motion YLMs 101-5, a torque around the Z-axis can be generated. The fine-motion ZLM 101-6 can be composed of a linear motor. The fine-motion ZLM 101-6 can include a fine-motion ZLM coil base 101-62, a fine-motion ZLM coil 101-61, a fine-motion ZLM magnet 101-63, a fine-motion ZLM yoke 101-64, and a fine-motion LM gasket 101-70. The fine-motion ZLM coil base 101-62 can be fixed to the fine-motion base 101-2, and the fine-motion ZLM coil 101-61 can be fixed thereon. The fine-motion ZLM coil 101-61 can be an oblong coil with a straight portion extending horizontally. Four fine-motion ZLM magnets 101-63 are arranged facing the straight portion with a gap therebetween. Two ZLM yokes 101-64 can be arranged to sandwich these magnets, allowing magnetic flux to pass through. The magnets can be magnetized in the X-axis direction, with magnets adjacent in the Z-axis direction having opposite polarity, and magnets arranged in the X-axis direction having the same polarity. The fine-motion LM gasket 101-70 can be used to resist the attractive force acting on the pair of magnets and the yoke, thereby maintaining their position. The magnets, yoke, and gasket can be fixed to the fine-motion top plate 101. By flowing current through the ZLM coil 101-61, a force proportional to the current can be generated in the direction perpendicular to the straight line portion, that is, in the Z-axis direction. In addition, by combining the directions of the currents flowing through the four micro-switches ZLM101-6, a torque around the X-axis and a torque around the Y-axis can be generated. The micro-switches XLM101-4 have the same structure as the micro-switches YLM101-5, and have a configuration that rotates the micro-switches YLM101-5 90 degrees. As a result, a force in the X-axis direction and a torque around the Z-axis can be generated. In addition, four pin units 101-39 can also be provided, which can function as temporary placement when retrieving wafers from the micro-switches stage 101 and when placing wafers on the micro-switches stage 101-1. In order to temporarily place the wafer stably, the number of pin units 101-39 is preferably 3 or more, but the handover can be achieved if the minimum is 1. The pin unit 101-39 has a lifting mechanism for raising and lowering the pins for temporarily placing or loading the wafer. The pin unit 101-39 may have the following functions: driving the pins so that the upper ends of the pins protrude from the upper surface of the fine motion stage 101-1 in a first state; and driving the pins so that the upper ends of the pins retreat downward from the upper surface of the fine motion stage 101-1 in a second state. In the action of loading the wafer onto the fine motion stage 101-1, the pin unit 101-39 receives the wafer from the unillustrated transport mechanism in the first state, and then, in the process of transitioning to the second state, delivers the wafer on the pins to the fine motion stage 101-1. During the process of transferring the wafer placed on the fine motion stage 101-1 to the unillustrated transport mechanism, the pin unit 101-39 transitions the pins from the second state to the first state. During this process, the pins of the pin unit 101-39 receive the wafer placed on the fine motion stage 101-1 and transfer it to the unillustrated transport mechanism in the first state. The fine motion stage device 101 may also be configured without the pin unit 101-39. In this case, the fine motion stage 101-1 is moved to an upper position by the fine motion ZLM 101-6, allowing wafer transfer to and from the unillustrated transport mechanism. FIG. 5 exemplifies the coarse motion stage device, specifically the detailed configuration of the X slider 102, the Y slider 103, and the XY slider 104. The XY slider 104 may include a lower XY slider component 104-3, a middle XY slider component 104-2, and an upper XY slider component 104-1. The lower XY slider component 104-3 is supported on the stage base 105 for free sliding movement in the XY directions. The middle XY slider component 104-2 is positioned above it, and the upper XY slider component 104-1 is positioned above it. The X slider 102 may include an X-beam 102-1, two X-legs 102-2, and two X-yaw guides 102-3. The two X-yaw guides 102-3 may be fixed to two sides of the stage base 105. The two X-legs 102-2 may be connected by the X-beam 102-1. One X leg 102-2 faces the side of one X yaw guide 102-3 and the top surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely along the X-axis. The other X leg 102-2 faces the side of the other X yaw guide 102-3 and the top surface of the stage base 105 with a gap therebetween, and is supported to be able to slide freely along the X-axis. This allows the X-beam 102-1 and the two X legs 102-2 to be configured to slide freely along the X-axis. Furthermore, the sides of the X-beam 102-1 face the inner surface of the XY slider center component 104-2 with a slight gap between them, allowing for free sliding movement. This restricts the XY slider 104 to free sliding movement in the XY directions. The Y slider 103 may include a Y-beam 103-1, Y-legs 103-2, and a Y yaw guide 103-3. Two Y yaw guides 103-3 are fixed to two sides of the stage base 105, and the two Y-legs 103-2 may be connected by the Y-beam 103-1. One Y-leg 103-2 faces the side of one Y yaw guide 103-3 and the top surface of the stage base 105 with a gap between them, supporting it to slide freely along the Y-axis. The other Y-leg 103-2 faces the side of the other Y yaw guide 103-3 and the top surface of the stage base 105, with a gap between them, and is supported so that it can slide freely along the Y-axis. This allows the integrated structure of the Y-beam 103-1 and the two Y-legs 103-2 to slide freely along the X-axis. Furthermore, the sides of the Y-beam 103-1 face the inner surface of the XY slider upper component 104-1, with a small gap between them, so that they can slide freely, thus restricting the XY slider 104 to free movement in the XY directions. Figure 6 exemplifies the detailed structure of the coarse linear motor 106. The coarse linear motor 106 may include multiple linear motor coils 106-1, a coil support plate 106-2, a support column 106-3, a coil base 106-4, two linear motor magnets 106-5, a magnetic yoke 106-6, two spacers 106-7, and an arm 106-8. The multiple linear motor coils 106-1 may be a two-phase coil unit, with adjacent linear motor coils 106-1 having a 90-degree phase difference. The multiple linear motor coils 106-1 may be fixed to the coil support plate 106-2 and then to the coil base 106-4 via a support column 106-3. The coil base 106-4 may be fixed to the stage plate 692 or supported by the stage plate 692 so that it can slide freely in the direction of the coil arrangement. The coil base 106-4 is supported in a slidable configuration, absorbing the reaction of acceleration. The two linear motor magnets 106-5 can each be a four-pole magnetic unit, positioned to sandwich the linear motor coil 106-1 from above and below, with a gap between them. A yoke 106-6 can be placed on the back of each linear motor magnet 106-5. A spacer 106-7 can be used to resist attractive forces and maintain the gap between the two linear motor magnets 106-5. The structure consisting of the linear motor magnets 106-5, yoke 106-6, and spacer 106-7 can be secured to the X leg 102-2 or the Y leg 103-2 via an arm 106-8. This structure can provide thrust in the X- and Y-axis directions to an X-beam and two X-legs, or a Y-beam and two Y-legs. Furthermore, this configuration generates force continuously by flowing a sinusoidal current corresponding to the position of the two-phase coils facing the magnet. Figure 7 illustrates an exemplary arrangement of multiple irradiation areas on a wafer 700, or an irradiation area layout. Irradiation areas 701 with dimensions Sx and Sy in the X- and Y-axis directions, respectively, can be arranged on wafer 700. Multiple irradiation areas 701 can be used, for example, for scanning exposure along a step-and-scan track. During scan exposure, the fine motion stage 101-1 can be driven in the Y-axis direction in synchronization with the magnification reticle stage, scanning by a scan amount equal to 1/the projection magnification. Furthermore, when scan exposure is complete, the fine motion stage 101-1 can perform a U-turn in the Y-axis direction while stepping in the X-axis direction to perform scan exposure of the next exposure area. Electromagnets are used for acceleration of the fine motion stage 101-1, and a linear motor for position control, achieving both high-precision position control and low heat generation. During acceleration of the fine motion stage 101-1, a torque can be applied to the fine motion stage 101-1. If fine movement ZLM101-6 is actuated to offset this torque, heat generated by fine movement ZLM101-6 will increase. This heat will cause deformation of fine movement stage 101-1, which in turn will reduce overlay accuracy. To suppress heat generated by fine movement ZLM101-6, it is effective to reduce the torque acting on fine movement stage 101-1 when accelerating fine movement stage 101-1. To reduce the torque acting on fine movement stage 101-1 when accelerating fine movement stage 101-1, it is effective to reduce the distance between fine movement XLM101-4, fine movement YLM101-5, and fine movement ZLM101-6 and the center of gravity of fine movement stage 101-1. To this end, it is advantageous to reduce the height of the fine motion electromagnet 101-3 on the fine motion base 101-2. Figures 8, 9, and 10 exemplarily illustrate the configuration of the fine motion electromagnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the first embodiment. The fine motion electromagnet 101-3 of the first embodiment has a structure that is advantageous for reducing the torque acting on the fine motion stage 101-1 when the fine motion stage 101-1 is accelerated. The fine motion electromagnet 101-3 may include a fixed core (first member) SC, a support member 101-30 supporting the fixed core SC, a movable core (second member) MC, a support member 101-31 supporting the movable core MC, and a coil 101-36. Support member 101-30 secures the fixed core SC to the fine motion base 101-2, which serves as a coarse motion stage, and support member 101-31 secures the movable core MC to the fine motion stage 101-1. Coil 101-36 is wound around the fixed core SC. The center axis of coil 101-36 can be parallel to the XY plane (the plane in which the fine motion base 101-2, which serves as a coarse motion stage, moves). The fixed core SC has a first end face facing the movable core MC, and the distance between the wafer 700 held by the fine motion stage 101-1 and the center axis of coil 101-36 can be greater than the distance between the wafer 700 held by the fine motion stage 101-1 and the center of the first end face. In the examples of Figures 8, 9, and 10, four support members 101-30 are fixed to a fine-motion base 101-2, each of which is provided with a fixed core SC. A coil 101-36 is wound around each fixed core SC. The fixed core SC and the movable core MC face each other with a small gap between them. Here, the shortest distance Hcw between the wafer (substrate) 700 held by the fine-motion stage 101-1 and the coil 101-36 is greater than the shortest distance Hew between the wafer (substrate) 700 held by the fine-motion stage 101-1 and the fixed core SC. This configuration can be achieved, for example, by giving the fixed core SC a crank shape in a cross-section perpendicular to the XY plane and parallel to the center axis of the coil 101-36. By setting Hcw>Hew, the fixed iron core SC can be positioned vertically downward, compared to the configurations shown in Figures 4 and 35. This allows the height of the fine motion electromagnet 101-3 on the fine motion base 101-2 to be lowered. In the configurations shown in Figures 8, 9, and 10, when the fine motion stage 101-1 of mass m is accelerated at acceleration a, the torque M acting on the fine motion stage 101-1 is M=m·a·(hg+hu+he). On the other hand, in the configurations shown in Figures 4 and 35, when the fine motion stage 101-1 of mass m is accelerated at acceleration a, the torque M acting on the fine motion stage 101-1 is M=m·a·(hg+hu+he+hc). Therefore, the configurations shown in Figures 8, 9, and 10 reduce the moment M acting on fine movement stage 101-1 when fine movement stage 101-1 of mass m is accelerated at acceleration a by m·a·hc, compared to the configurations shown in Figures 4 and 35. Consequently, fine movement ZLM 101-6 is actuated to offset the moment, reducing heat generated by fine movement ZLM 101-6. This helps suppress deformation of fine movement stage 101-1 and, in turn, prevents a decrease in overlay accuracy. hg is the Z-axis distance between the center of gravity G of the structure consisting of the fine movement stage 101-1 and its components (such as the movable iron core MC and the supporting member 101-31) and the bottom surface of the fine movement stage 101-1 (the surface on the fine movement base 101-2 side). hu is the Z-axis distance between the bottom surface of the fine movement stage 101-1 and the top end of the fine movement electromagnet 101-3 (the end on the fine movement stage 101-1 side). he is the Z-axis distance between the top end of the fixed iron core SC and the point of application of the fine movement electromagnet 101-3. hc is the distance in the Z-axis direction between the upper end of coil 101-36 (the end on the fine movement stage 101-1 side) and the upper end of the fixed core SC. Figure 34 shows an example of the structure of the fixed core SC. In the example shown in Figure 34, the fixed core SC is composed of a stack of multiple electromagnetic steel plates, with the stacking direction oriented in the Z-axis direction. Each electromagnetic steel plate is coated with an insulating film. In Figure 34, the direction of the magnetic flux in the magnetic circuit is indicated by black arrows, flowing along a three-dimensional path. The magnetic flux flowing in the Z-axis direction is indicated by thick black arrows. Because the direction of the thick black arrows is parallel to the normal direction of the electromagnetic steel plate, the eddy currents generated by the current fluctuations flow along the surface of the electromagnetic steel plate, with no structure to suppress them. Consequently, large eddy currents are generated, as shown by the thick white arrows. This heats the fixed core SC, which is transferred to the fine motion stage 101-1, causing deformation of the fine motion stage 101-1 and reducing overlay accuracy. Furthermore, because the magnetic flux in the Z-axis direction, indicated by the thick black arrows, is parallel to the normal direction of the electromagnetic steel plate, it disadvantageously increases magnetic resistance, reduces the magnetic flux value, and reduces the attractive force. The following describes a modified example of the fine-motion electromagnet 101-3 of the first embodiment, which is incorporated into the exposure apparatus or wafer stage apparatus 500. FIG11 exemplarily illustrates the structure of the modified example of the fine-motion electromagnet 101-3 of the first embodiment. The fine-motion electromagnet 101-3 may include a fixed core (first member) SC, a support member 101-30 that supports the fixed core SC, a movable core (second member) MC, a support member 101-31 that supports the movable core MC, and a coil 101-36. The fixed core (first member) SC may include a first element 101-32, a second element 101-33, a third element 101-34, and a fourth element 101-35. While the movable core (second component) MC may include element 101-38, it may also include one or more other elements in addition to element 101-38. The fixed core (first component) SC may have a first end surface E1, and the movable core (second component) MC may have a second end surface E2 that faces the first end surface E1 across a gap. In this example, the first end surface E1 is provided on each of the second element 101-33, the third element 101-34, and the fourth element 101-35, and the second end surface E2 is provided on element 101-38. The fixed core (first component) SC may be formed from a laminate of multiple electromagnetic steel plates. Each of the multiple electromagnetic steel plates may be coated with an insulating film. From another perspective, the first element 101-32, second element 101-33, third element 101-34, and fourth element 101-35 that comprise the fixed core (first member) SC can each be formed from a laminate of multiple electromagnetic steel plates. The movable core (second member) MC can be formed from a laminate of multiple electromagnetic steel plates. From another perspective, at least one element that comprises the movable core (second member) MC, namely element 101-38, can be formed from a laminate of multiple electromagnetic steel plates. Each of these multiple electromagnetic steel plates can be coated with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap (the space between the first end surface E1 and the second end surface E2) can include at least one changing portion CP, where the stacking direction of the multiple electromagnetic steel sheets changes at a right angle. The changing portion CP can include a contact portion between a first portion (e.g., the first element 101-32) with a stacking direction in a first direction (e.g., the Z-axis) and a second portion (e.g., the third element 101-34) with a stacking direction in a second direction perpendicular to the first direction (e.g., the X-axis). The variable portion CP may include a portion where a first portion (e.g., first element 101-32) with a stacking direction in a first direction and a second portion (e.g., third element 101-34) with a stacking direction in a second direction orthogonal to the first direction face each other across a solid component. This solid component may be, for example, an insulating film covering each of a plurality of electromagnetic steel plates. In the modified example of Figure 11, the variable portion CP is provided in the fixed core (first component) SC. Furthermore, in the modified example of Figure 11, the variable portion CP includes a portion where the fixed core (first component) SC and the movable core (second component) MC face each other across a gap. The latter configuration can also be understood as follows: of the first and second parts constituting the variable portion CP, the first part is provided in the fixed iron core (first component) SC, and the second part is provided in the movable iron core (second component) MC. The variable portion CP may be provided in addition to the movable iron core (second component) MC, or may be provided only in the movable iron core (second component) MC. The fixed iron core (first component) SC and the movable iron core (second component) MC may each be composed of at least one laminated iron core. Alternatively, at least one of the fixed iron core (first component) SC and the movable iron core (second component) MC may be composed of a plurality of laminated iron cores. Such a plurality of laminated iron cores may be arranged close to each other and fixed by a fixed component. Alternatively, the laminated core can be formed by stacking electromagnetic steel plates of the same shape. The first element 101-32, the second element 101-33, the third element 101-34, and the fourth element 101-35 can be formed from the laminated core. The first element 101-32, the second element 101-33, the third element 101-34, and the fourth element 101-35 can be integrated using an adhesive or fastened using a clamping member. In this example, at least one variable portion CP is provided on the fixed core (first member) SC, and the coil 101-36 is wound around the fixed core (first member) SC. The coil 101-36 can be wound around a portion of the fixed core (first component) SC that is different from the portion where the variable portion CP is located. By flowing current through the coil 101-36, an attractive force is generated between the first end face E1 and the second end face E2. In the modified example of Figure 11, the first element 101-32 has an E-shaped shape, and the coil 101-36 is wound around the center tooth of the first element 101-32. The variable portion CP is configured so that the magnetic flux passing through the magnetic circuit formed by the fixed core (first component) SC, the movable core (second component) MC, and the gap does not flow through the multiple electromagnetic steel plates that constitute the fixed core (first component) SC and the movable core (second component) MC in the stacking direction. Alternatively, the converter CP, fixed iron core (first component) SC, and movable iron core (second component) MC can be configured so that the magnetic flux passing through the fixed iron core (first component) SC and movable iron core (second component) MC flows along the planes of the electromagnetic steel plates. Alternatively, the converter CP can be configured so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, movable iron core (second component) MC, and the gap is lower than that without the converter CP. Alternatively, the converter CP can be configured so that the eddy current generated in the magnetic circuit formed by the fixed iron core (first component) SC, movable iron core (second component) MC, and the gap is lower than that without the converter CP. Constructing the magnetic circuit using an iron core including the converter CP facilitates greater freedom in the shape of the magnetic circuit. Furthermore, by constructing the core, such as the fixed core (first component) SC and the movable core (second component) MC, from multiple elements, it is possible to easily manufacture cores with complex shapes, and it also facilitates the installation and replacement of coils. In particular, a configuration in which multiple elements are fastened by clamping members facilitates coil replacement. FIG12 exemplifies the configuration of another modified example of the micro-motion electromagnet 101-3 of the first embodiment. Matters not discussed here can be handled in accordance with the configuration of the modified example shown in FIG11. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a support member 101b-30 supporting the fixed core SC, a movable core (second component) MC, a support member (not shown) supporting the movable core MC, and a coil 101-36. The fixed core (first component) SC may include a first element 101b-32, a second element 101b-33, a third element 101b-34, and a fourth element 101b-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements in addition to element 101-38. As in the example of Figure 8 , the fixed core (first component) SC has a first end face, and the movable core (second component) MC may have a second end face that faces the first end face across a gap. In this example, the first end face is provided on each of the second element 101b-33, the third element 101b-34, and the fourth element 101b-35, while the second end face is provided on element 101-38. In the improved example of Figure 12 , the second element 101b-33, the third element 101b-34, and the fourth element 101b-35 have a crank shape in a cross-section perpendicular to the XY plane and parallel to the central axis of the coil 101-36, while the first element 101b-32 has a rectangular parallelepiped shape. Figures 13, 14, and 15 illustrate the configuration of a fine-motion electromagnet 101-3 incorporated into an exposure apparatus or wafer stage device 500 according to a second embodiment. Matters not discussed in the second embodiment may be handled in accordance with the first embodiment. The fine-motion electromagnet 101-3 of the second embodiment has a structure that helps reduce the torque acting on the fine-motion stage 101-1 when accelerating the fine-motion stage 101-1. The fine-motion electromagnet 101-3 may include a fixed core (first member) SC, a support member 101-30 supporting the fixed core SC, a movable core (second member) MC, a support member 101-31 supporting the movable core MC, and a coil 101-36. The supporting member 101-30 fixes the fixed core SC to the fine motion base 101-2 serving as a coarse motion stage, and the supporting member 101-31 fixes the movable core MC to the fine motion stage 101-1. The coil 101-36 is wound around the fixed core SC. The center axis of the coil 101-36 can be arranged at an angle inclined relative to the XY plane (the plane on which the fine motion base 101-2 serving as a coarse motion stage moves). Similarly, at least the portion of the fixed core SC around which the coil 101-36 is wound can include a portion extending in a direction inclined relative to the XY plane. The fixed core SC preferably includes a variable portion CP as in the improved example of the first embodiment. Figures 16, 17, and 18 illustrate the configuration of a fine-motion electromagnet 101-3 incorporated into an exposure apparatus or wafer stage device 500 according to a third embodiment. Matters not discussed in the third embodiment may be handled in accordance with the first embodiment. The fine-motion electromagnet 101-3 of the third embodiment has a structure that helps reduce the torque acting on the fine-motion stage 101-1 when accelerating the fine-motion stage 101-1. The fine-motion electromagnet 101-3 may include a fixed core (first member) SC, a support member 101-30 supporting the fixed core SC, a movable core (second member) MC, a support member 101-31 supporting the movable core MC, and a coil 101-36. Support member 101-30 secures the fixed core SC to the fine motion base 101-2, which serves as a coarse motion stage, and support member 101-31 secures the movable core MC to the fine motion stage 101-1. Coil 101-36 is wound around the fixed core SC. The center axis of coil 101-36 can be arranged at an angle perpendicular to the XY plane (the plane in which the fine motion base 101-2, which serves as a coarse motion stage, moves). In a cross-section perpendicular to the XY plane and parallel to the center axis of coil 101-36, the fixed core SC may include an L-shaped portion. The fine motion base 101-2 may also have an opening, and a portion of the fine motion electromagnet 101-3 may also be arranged in the opening. The following describes a modified example of the fine-motion electromagnet 101-3 assembled in the exposure device or wafer stage device 500 according to the third embodiment. Matters not discussed here can be handled in accordance with the modified example of the first embodiment. Figures 19 and 20 exemplify the configuration of the modified example of the fine-motion electromagnet 101-3 according to the third embodiment. Figure 20 also exemplifies the configuration of the fine-motion electromagnet 101-3 with the fine-motion base 101-2 removed. In this modified example, four openings 301-21 are provided in the fine-motion base 101-2, and a portion of each fine-motion electromagnet 101-3 can be positioned within the corresponding opening 301-21. Alternatively, a portion of each of the four fine-motion electromagnets 101-3 can be positioned below the fine-motion base 101-2. Each fine-motion electromagnet 101-3 can be supported by the fine-motion base 101-2 via a supporting member 301-30. This configuration helps reduce the height of the fine-motion electromagnet 101-3 above the fine-motion base 101-2 and minimizes the X and Y dimensions of the fine-motion electromagnet 101-3. The fine-motion electromagnet 101-3 can include a fixed core (first member) SC, a supporting member 301-30 supporting the fixed core SC, a movable core (second member) MC, a supporting member 101-31 supporting the movable core MC, and a coil 301-36. The fixed core (first component) SC may include a first element 301-32, a second element 301-33, a third element 301-34, and a fourth element 301-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements in addition to element 101-38. The fixed core (first component) SC may have a first end surface E1, and the movable core (second component) MC may have a second end surface E2 that faces the first end surface E1 across a gap. In this example, the first end surface E1 is provided on each of the second element 301-33, the third element 301-34, and the fourth element 301-35, and the second end surface E2 is provided on element 101-38. The fixed core (first component) SC can be formed from a layer of multiple electromagnetic steel plates. These multiple electromagnetic steel plates can each be coated with an insulating film. From another perspective, the first elements 301-32, second elements 301-33, third elements 301-34, and fourth elements 301-35 that constitute the fixed core (first component) SC can each be formed from a layer of multiple electromagnetic steel plates. The movable core (second component) MC can be formed from a layer of multiple electromagnetic steel plates. From another perspective, at least one element that constitutes the movable core (second component) MC, namely element 101-38, can be formed from a layer of multiple electromagnetic steel plates. The multiple electromagnetic steel plates may be each coated with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap (the space between the first end face E1 and the second end face E2) may include at least one changing portion CP in which the stack of the multiple electromagnetic steel plates has a perpendicularly changing stacking direction. The changing portion CP may include a contact portion between a first portion (e.g., first elements 301-32) with a stacking direction in a first direction (e.g., the Y-axis direction) and a second portion (e.g., third elements 301-34) with a stacking direction in a second direction perpendicular to the first direction (e.g., the X-axis direction). The variable portion CP may include a portion where a first portion (e.g., first elements 301-32) with a stacking direction oriented in a first direction and a second portion (e.g., third elements 301-34) with a stacking direction oriented in a second direction orthogonal to the first direction face each other across a solid component. This solid component may be, for example, an insulating film covering each of a plurality of electromagnetic steel plates. In the examples of Figures 19 and 20, the variable portion CP is provided within the fixed core (first component) SC. Furthermore, in the examples of Figures 19 and 20, the variable portion CP includes a portion where the fixed core (first component) SC and the movable core (second component) MC face each other across a gap. The latter structure can also be understood as the following structure: of the first and second parts constituting the variable portion CP, the first part is provided on the fixed iron core (first component) SC, and the second part is provided on the movable iron core (second component) MC. The variable portion CP can be provided in addition to the movable iron core (second component) MC, or it can be provided only on the movable iron core (second component) MC. In the examples of Figures 19 and 20, the second element 301-33, the third element 301-34, and the fourth element 301-3 have an L-shape, and the first element 301-32 has a rectangular parallelepiped shape. Figure 21 exemplifies the structure of another improved example of the micro-electromagnet 101-3 of the third embodiment. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a support member 201a-30 supporting the fixed core SC, a movable core (second component) MC, a support member 101-31 supporting the movable core MC, and a coil 201a-36. The fixed core (first component) SC may include a first element 201a-32, a second element 201a-33, a third element 201a-34, and a fourth element 201a-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements in addition to element 101-38. The fixed iron core (first component) SC may have a first end face E1, and the movable iron core (second component) MC may have a second end face E2 that faces the first end face E1 across a gap. In this example, the first end face E1 is provided on each of the second element 201a-33, the third element 201a-34, and the fourth element 201a-35, while the second end face E2 is provided on the element 101-38. In the modified example of Figure 21, the first element 201a-32 has an E-shaped shape, and the coil 201a-36 is wound around the central tooth of the first element 201a-32. Also in the modified example of Figure 21, the second element 201a-33, the third element 201a-34, and the fourth element 201a-35 have a rectangular parallelepiped shape. The following describes an assembly method or manufacturing method for the modified micro-electromagnet 101-3 of FIG. 21 , with reference to FIG. 27 to FIG. 31 . FIG. 27 shows the modified micro-electromagnet 101-3 of FIG. 21 in a disassembled state. The first element 201a-32 and the support member 201a-30 can be joined together using adhesive, clamping, or interlocking. Furthermore, the coil 201a-36 and the coil base 201a-42 can be joined together using adhesive, clamping, or interlocking. Furthermore, the second element 201b-33, the third element 201b-34, and the fourth element 201b-35 can be joined together via the end member gasket 201a-40 using adhesive, clamping, or interlocking. As shown in Figure 28 , the first element 201a-32 can be inserted into the opening 201a-21 of the fine-switch base 101-2, and the combination of the first element 201a-32 and the supporting member 201a-30 can be positioned on the fine-switch base 101-2. Furthermore, the supporting member 201a-30 can be secured to the fine-switch base 101-2. The securing of the supporting member 201a-30 to the fine-switch base 101-2 can be achieved, for example, by screwing, adhesive, clamping, or interlocking. Next, as shown in FIG29 , the combination of coil 201a-36 and coil base 201a-42 can be positioned on the fine-switch base 101-2, securing coil base 201a-42 to the fine-switch base 101-2. The securing of coil base 201a-42 to the fine-switch base 101-2 can be achieved, for example, by screwing, adhesive, clamping, or interlocking. Next, as shown in FIG30 , the end member base 201a-41 can be secured to the fine-switch base 101-2 by screwing, adhesive, clamping, or interlocking. Next, as shown in Figure 31, the second element 201b-33, the third element 201b-34, the fourth element 201b-35, and the combination of the second element 201b-33, the third element 201b-34, and the fourth element 201b-35 can be fixed to the end component base 201a-41. This can be achieved by fixing the end component gasket 201a-40 to the end component base 201a-41 using screws, adhesives, clamping, fitting, etc. The state shown in FIG28 can be returned to by following the reverse sequence described above. As shown in FIG29 , a new coil 201a-36 can be fixed to the fine-motion base 101-2, and then the coil 201a-36 can be replaced by following the sequence illustrated in FIG30 and FIG31 . When a fixed core SC is formed by combining multiple elements, there is a risk of particles being generated due to a slight relative offset between the two elements along the boundary surface (e.g., the boundary between the second element 201a-33 and the first element 201a-32). As a countermeasure, a device can be provided at the boundary surface to prevent particle coating, a recovery tray can be provided near the boundary surface, or a capture magnet can be provided near the boundary surface. In addition, when the end component gasket 201a-40 is fixed to the end component base 201a-41, a thin gasket can also be inserted between the two to maintain the first element 201a-32 and the second element 201a-33, the third element 201a-34, and the fourth element 201a-35 in a non-contact state. The following describes an exposure device and a fine-motion electromagnet 101-3 according to a fourth embodiment. Any matters not discussed in the fourth embodiment may be handled in accordance with the first to third embodiments. FIG. 22 exemplifies the structure of the fine-motion electromagnet 101-3 according to the fourth embodiment. The fine-motion electromagnet 101-3 may include a fixed core (first member) SC, a support member 301a-30 supporting the fixed core SC, a movable core (second member) MC, a support member 301a-31 supporting the movable core MC, and a coil 301a-36. The fixed core (first component) SC may include a first element 301a-32, a second element 301a-37, a third element 301a-33, a fourth element 301a-34, and a fifth element 301a-35. The movable core (second component) MC may include element 301a-38, but may also include one or more other elements in addition to element 301a-38. The fixed core (first component) SC may have a first end surface E1, and the movable core (second component) MC may have a second end surface E2 facing the first end surface E1 across a gap. In this example, the first end surface E1 is provided on each of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35, while the second end surface E2 is provided on element 301a-38. The fixed iron core (first component) SC can be formed from a stack of multiple electromagnetic steel plates. Each of these multiple electromagnetic steel plates can be coated with an insulating film. From another perspective, the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35, which constitute a portion of the fixed iron core (first component) SC, can be formed from a laminated iron core formed from multiple electromagnetic steel plates. Furthermore, the first element 301a-32 and the second element 301a-37, which constitute another portion of the fixed iron core (first component) SC, can be formed from a wound iron core formed by winding electromagnetic steel plates. Furthermore, when used as a component of the fixed iron core (first component) SC, the wound iron core has a structure composed of multiple stacked electromagnetic steel plates. The movable iron core (second component) MC can be composed of a laminated iron core composed of multiple stacked electromagnetic steel plates. From another perspective, at least one element 301a-38 constituting the movable iron core (second component) MC can be composed of a laminated body composed of multiple electromagnetic steel plates. Each of these multiple electromagnetic steel plates can be coated with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap (the space between the first end surface E1 and the second end surface E2) can include changing portions CP and CP', where the stacking direction of the multiple electromagnetic steel sheets changes at right angles. The changing portion CP can include a contact portion between a first portion (e.g., the fifth element 301a-38) with a stacking direction in a first direction (e.g., the Z-axis) and a second portion (e.g., the second element 301a-37) with a stacking direction in a second direction perpendicular to the first direction (e.g., the X-axis). The changing portion CP may include a portion where a first portion (e.g., the fifth element 301a-38) with a stacking direction in a first direction and a second portion (e.g., the second element 301a-37) with a stacking direction in a second direction orthogonal to the first direction face each other through a solid component. This solid component may be, for example, an insulating film covering each of a plurality of electromagnetic steel plates. The changing portion CP' includes a portion whose stacking direction gradually changes from the first direction (e.g., the X-axis) to a second direction orthogonal to the first direction (e.g., the Z-axis). The changing portion CP' including the portion with the gradually changing stacking direction may be a portion of the wound iron core. The fixed core (first component) SC includes a first portion P1 oriented in a first direction (e.g., the X-axis) and a second portion P2 oriented in a second direction (e.g., the Z-axis). The layer direction gradually changes between the first and second portions P1 and P2. The variable portion CP' is the portion between the first and second portions P1 and P2. In the example of Figure 22, the variable portions CP and CP' are provided in the fixed core (first component) SC. At least one of the variable portions CP and CP' may be provided in addition to the movable core (second component) MC, or may be provided solely in the movable core (second component) MC. Alternatively, one of the fixed iron core (first component) SC and the movable iron core (second component) MC may be formed of at least one laminated iron core, the other of the fixed iron core (first component) SC and the movable iron core (second component) MC may be formed of a wound iron core, and the variable portion may be formed of the wound iron core. The first element 301a-32, the second element 301a-37, the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 may be integrated using an adhesive or by being fastened together using a clamping member. In this example, the variable portions CP and CP' are provided on the fixed core (first component) SC, and the coil 301a-36 is wound around the fixed core (first component) SC. The coil 301a-36 can be wound around a portion of the fixed core (first component) SC that is different from the portion where the variable portions CP and CP' are located. By flowing current through the coil 301a-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of Figure 22, the first element 301a-32 and the second element 301a-37 have a U-shape, and the coil 301a-36 is wound around the portion where one tooth of the first element 301a-32 and one tooth of the second element 301a-37 are integrated. The variable parts CP and CP' can be configured so that the magnetic flux passing through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the air gap does not flow through the multiple electromagnetic steel plates that constitute the fixed iron core SC and the movable iron core MC in the layered direction. Alternatively, the variable parts CP and CP', the fixed iron core (first component) SC, and the movable iron core (second component) MC can be configured so that the magnetic flux passing through the fixed iron core SC and the movable iron core MC flows along the plane of each electromagnetic steel plate. Alternatively, the variable parts CP and CP' can be configured so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the air gap is lower than that in the absence of the variable parts CP and CP'. Alternatively, the variable portions CP and CP' can be designed to reduce the eddy current generated in the magnetic circuit formed by the fixed core (first component) SC, the movable core (second component) MC, and the air gap compared to a case without the variable portions CP and CP'. In the example of Figure 22 , the stacking direction (Z-axis direction) of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 having the first end face E1 is aligned with the stacking direction (Z-axis direction) of the element 301a-38 having the second end face E2. This helps reduce the magnetic resistance near the air gap and increase the magnetic flux. Alternatively, the stacking direction of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 can be set in the X-axis direction instead of the configuration shown in FIG22. This configuration helps reduce the magnetic resistance near the boundaries between the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 and the first element 301a-32 and the second element 301a-37, thereby increasing the magnetic flux. FIG23 illustrates a modified configuration of the micro-electromagnet 101-3 of the fourth embodiment. Matters not mentioned in the modified configuration can be handled in accordance with the configuration of the fourth embodiment shown in FIG22. The micro-motion electromagnet 101-3 may include a fixed core (first component) SC, a support component 301b-30 supporting the fixed core SC, a movable core (second component) MC, a support component 301b-31 supporting the movable core MC, and a coil 301b-36. The fixed core (first component) SC may include a first element 301b-32 and a second element 301b-33. The movable core (second component) MC may include a third element 301b-37 and a fourth element 301b-38. The fixed core (first component) SC may have a first end surface E1, and the movable core (second component) MC may have a second end surface E2 facing the first end surface E1 across a gap. In this example, the first end surface E1 is provided on each of the first element 301b-32 and the second element 301b-33, and the second end surface E2 is provided on each of the third element 301b-37 and the fourth element 301b-38. The fixed core (first component) SC can be formed from a laminate of multiple electromagnetic steel plates. Each of these multiple electromagnetic steel plates can be coated with an insulating film. From another perspective, the first element 301b-32 and the second element 301b-33, which constitute part of the fixed core (first component) SC, can also be formed from a laminate of multiple electromagnetic steel plates. Furthermore, when used as a component of the fixed iron core (first component) SC, the wound iron core also has a structure composed of multiple stacked electromagnetic steel plates. The movable iron core (second component) MC can be composed of a stack of multiple electromagnetic steel plates. From another perspective, the third element 301b-37 and the fourth element 301b-38 that constitute the movable iron core (second component) MC can be composed of a stack of multiple electromagnetic steel plates. These multiple electromagnetic steel plates can each be coated with an insulating film. The magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap (the space between the first end face E1 and the second end face E2) may include a changing portion CP' and CP" in which the layer direction of the layered body of multiple electromagnetic steel plates changes at right angles. In this example, the changing portion CP' is provided in the fixed iron core (first component) SC, and the changing portion CP" is provided in the movable iron core (second component) MC. The changing portion CP' includes a portion in which the layer direction slowly changes from a first direction (for example, the X-axis direction) to a second direction (for example, the Z-axis direction) orthogonal to the first direction. The changing portion CP' including the portion in which the layer direction slowly changes may be a portion of the winding iron core. The fixed core (first component) SC consists of a first portion P1 oriented in a first direction (e.g., the X-axis) and a second portion P2 oriented in a second direction (e.g., the Z-axis). The stacking direction gradually changes between the first and second portions P1 and P2. The variable portion CP' is the portion between the first and second portions P1 and P2. The movable core (second component) MC consists of a third portion P3 oriented in a first direction (e.g., the X-axis) and a fourth portion P4 oriented in a second direction (e.g., the Y-axis). The stacking direction gradually changes between the third and fourth portions P3 and P4. The variable portion CP" is the portion between the third portion P3 and the fourth portion P4. By allowing current to flow in the coil 301b-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of Figure 23, the first element 301b-32 and the second element 301b-33 have a U-shape, and the coil 301b-36 is wound around a portion where one tooth of the first element 301a-32 and one tooth of the second element 301a-37 are integrated. The variable portions CP' and CP" can be arranged so that the magnetic flux passing through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap does not flow through the multiple electromagnetic steel plates constituting the fixed iron core SC and the movable iron core MC in their layered direction. Alternatively, the variable parts CP', CP", the fixed iron core (first component) SC, and the movable iron core (second component) MC can be arranged so that the magnetic flux passing through the fixed iron core SC and the movable iron core MC flows along the surface direction of each electromagnetic steel plate. Alternatively, the variable parts CP', CP" can be arranged so that the magnetic resistance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where there are no variable parts CP', CP". Alternatively, the variable parts CP ’, CP” can be set so that the eddy current generated in the magnetic circuit composed of the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap is smaller than that in the case where there is no changing portion CP’, CP”. In the example of Figure 23, the layer direction (X-axis direction) of the first element 301b-32 and the second element 301b-33 at the first end face E1 and the layer direction (X-axis direction) of the third element 301b-37 and the fourth element 301b-38 at the second end face E2 are smaller than that of the first element 301b-32 and the second element 301b-33 at the first end face E1. The stacking direction (X-axis direction) is the same. This helps reduce the magnetic resistance near the gap and increase the magnetic flux. In addition, in the example of Figure 23, in the magnetic circuit composed of the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap, the stacking direction does not change abruptly, which helps reduce the magnetic resistance and increase the magnetic flux. Figure 24 shows an example of the structure of the supporting member 301b-31 that supports the movable iron core MC. Supporting member 301b-31 In order to support the movable iron core MC composed of the wound iron core, it may have a star wheel shape. Here, the wound iron core is explained with reference to FIG32. FIG32 (a) shows an example of the wound iron core. FIG32 (b) shows a wound iron core obtained by cutting the wound iron core shown in FIG32 (a) by wire cutting or the like. Such a wound iron core is also called a cut core. The wound iron core can be manufactured by winding a ring material around a core not shown in the figure. As shown in FIG33, the ring material can be cut by The coil is manufactured by the cutting machine shown in FIG33. The original coil is transported in the direction of the plate passing, and is cut into the desired width by a cutting machine including a circular knife installed on the way to obtain a ring material. The width is determined by the interval of the circular knife of the cutting machine. As shown in FIG32 (a), the winding iron core is a layered body of multiple electromagnetic steel plates, and one winding iron core has multiple layering directions. In other words, the winding iron core can be used as a component constituting the aforementioned changing part. The layering direction is relative to the electromagnetic steel plate. The direction perpendicular to the magnetic steel plate passes through the focus area of the wound iron core. The width direction is the direction determined by the cutting machine and is also the axial direction. The axial direction is the direction parallel to any part of the largest surface of each electromagnetic steel plate. In one aspect, the electromagnetic device of the present invention may have a plurality of iron core components composed of a laminated iron core or a wound iron core and a coil that generates a magnetic flux in the iron core component. Here, the lamination direction of a certain laminated iron core may be orthogonal to the width direction of a certain wound iron core, or a certain The stacking direction of a stacked iron core is orthogonal to that of another stacked iron core, or the width direction of a certain winding iron core is orthogonal to that of another winding iron core. The control system of the wafer carrier device 500 is described below. FIG25 exemplarily shows the structure of the control system of the wafer carrier device 500. The moving target providing unit 5101 provides a moving target. The position curve generator 5102 generates a time curve based on the moving target provided by the moving target providing unit 5101. The position curve generator 5102 generates a target position based on the generated position curve. The acceleration curve generator 5103 generates an acceleration curve representing the relationship between time and the acceleration of the fine motion stage 101-1 at that time based on the movement target provided by the movement target providing unit 5101. The acceleration curve generator 5103 generates a target acceleration based on the generated acceleration curve. Figure 26 shows an example of a position curve generated by the position curve generator 5102 and an acceleration curve generated by the acceleration curve generator 5103. The fine motion position sensor 5156 measures the position of the fine motion stage 101-1. The fine motion position control system 5121 generates a target position according to the position curve generated by the position curve generator 5102 and the current position provided by the fine motion position sensor 5156 through PID calculation and other methods. The current amplifier 5122 supplies a current corresponding to the operation amount generated by the fine motion position control system 5121 to the fine motion XLM101-4 and fine motion YLM101-5. As a result, the fine motion stage 101-1 is feedback controlled. The coarse motion position sensor 5135 measures the position of the fine motion base 101-2. The coarse motion position control system 5133 corresponds to the target position provided by the position curve generated by the position curve generator 5102 and the position curve generated by the position curve generator 5102. The deviation of the current position provided by the coarse position sensor 5135 generates an operating variable through PID calculation. The current amplifier 5131 supplies a current corresponding to the operating variable generated by the coarse position control system 5133 and the target acceleration provided by the acceleration curve generator 5103 to the coarse linear motor 106. As a result, the fine motion base 101-2 is subjected to feedback control and feedforward control. The target acceleration generated by the acceleration curve generator 5103 is also provided. The current is supplied to the electromagnet current control system 5515, which controls the fine motion electromagnet 101-3 according to the target acceleration. When the fine motion stage 101-1 (fine motion stage device 101) is accelerated, the fine motion electromagnet 101-3 mainly provides force to the fine motion stage 101-1. The fine motion XLM 101-4 and fine motion YLM 101-5 can be controlled to generate a small position difference between the target position and the measured current position. The thrust of the deviation is reduced. As a result, the heat generated by the fine motion XLM101-4 and the fine motion YLM101-5 will be reduced. The coarse motion position control system 5133 moves the position of the fine motion base 101-2 according to the position curve generated by the position curve generator 5102. The fine motion electromagnet 101-3 is advantageous in generating a large attraction with minimal heat. However, the distance between the first end face E1 and the second end face E2 of the fine motion electromagnet 101-3 must be maintained. That is, in order for the fine motion electromagnet 101-3 to continuously provide the desired force to the fine motion stage 101-1, it is necessary to move the stator (fixed iron core and coil) of the fine motion electromagnet 101-3 in accordance with the movement of the fine motion stage 101-1 to maintain the gap. In addition, the heat generated by the fine motion ZLM can be reduced by reducing the height of the fine motion electromagnet 101-3 on the fine motion base 101-2. According to the above structure, the fine motion stage 101-1 can be realized. The coarse position control system 5133 realizes the above-mentioned high-precision position control, heat reduction and overlap error reduction. The coarse position control system 5133 realizes the coarse position, that is, the position of the fine motion base 101-2 is measured by the coarse position sensor 5135 represented by the encoder. Based on the deviation from the target position, the coarse position control system 5133 drives the coarse linear motor 106. As a result, the position of the fine motion stage 101-1 (the mover of the fine motion electromagnet 101-3) is adjusted. The position of the fine motion stage 101-2 (the stator of the fine motion electromagnet 101-3) is controlled based on the output of the position curve generator 5102 to maintain the gap. The fine motion position sensor 5156 that measures the position of the fine motion stage 101-1 can also be replaced with a sensor that measures the relative position of the fine motion stage 101-1 and the fine motion base 101-2. The invention is not limited to the above-described embodiments; various modifications and variations are possible within the scope of the invention.

SC: Fixed core (first component) MC: Movable core (second component) 101-1: Micro-motion stage 101-2: Micro-motion base 101-36: Coil

[Figure 1] A diagram illustrating the configuration of an exposure apparatus according to one embodiment. [Figure 2] A diagram illustrating the configuration of a wafer stage apparatus according to one embodiment. [Figure 3] A diagram illustrating the configuration of a wafer stage apparatus according to one embodiment. [Figure 4] A diagram illustrating the configuration of a fine motion stage apparatus according to one embodiment. [Figure 5] A diagram illustrating the configuration of a coarse motion stage apparatus according to one embodiment. [Figure 6] A diagram illustrating the configuration of a coarse motion linear motor according to one embodiment. [Figure 7] A diagram illustrating an irradiation area layout. [Figure 8] A diagram illustrating the configuration of a fine motion electromagnet incorporated in an exposure apparatus or wafer stage apparatus according to the first embodiment. [Figure 9] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the first embodiment. [Figure 10] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the first embodiment. [Figure 11] A diagram illustrating the configuration of a modified example of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the first embodiment. [Figure 12] A diagram illustrating the configuration of another modified example of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the first embodiment. [Figure 13] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the second embodiment. [Figure 14] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the second embodiment. [Figure 15] A diagram illustrating the configuration of a fine-motion stage device incorporated in an exposure apparatus or wafer stage device according to the second embodiment. [Figure 16] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the third embodiment. [Figure 17] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in an exposure apparatus or wafer stage device according to the third embodiment. [Figure 18] A diagram illustrating the configuration of a fine-motion stage device incorporated in an exposure apparatus or wafer stage device according to the third embodiment. [Figure 19] A diagram illustrating the configuration of a modified example of the fine-motion electromagnet incorporated in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 20] A diagram illustrating the configuration of a modified example of the fine-motion electromagnet incorporated in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 21] A diagram illustrating the configuration of another modified example of the fine-motion electromagnet incorporated in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 22] A diagram illustrating the configuration of a fine-motion electromagnet incorporated in the exposure apparatus or wafer stage apparatus according to the fourth embodiment. [Figure 23] A diagram illustrating the configuration of a modified example of the fine-motion electromagnet incorporated in the exposure apparatus or wafer stage apparatus according to the fourth embodiment. [Figure 24] A diagram illustrating the configuration of a support member for the movable core in a modified example of the fine-motion electromagnet of the fourth embodiment. [Figure 25] A diagram illustrating the configuration of a control system for a wafer stage device in one embodiment. [Figure 26] A diagram illustrating position and acceleration curves. [Figure 27] A diagram illustrating an assembly method or manufacturing method for a modified example of the fine-motion electromagnet of the third embodiment. [Figure 28] A diagram illustrating an assembly method or manufacturing method for a modified example of the fine-motion electromagnet of the third embodiment. [Figure 29] A diagram illustrating an assembly method or manufacturing method for a modified example of the fine-motion electromagnet of the third embodiment. Figure 30 illustrates an assembly method or manufacturing method for a modified example of the fine motion electromagnet of the third embodiment. Figure 31 illustrates an assembly method or manufacturing method for a modified example of the fine motion electromagnet of the third embodiment. Figure 32 illustrates a winding iron core by way of example. Figure 33 illustrates an exemplary method for manufacturing a winding iron core by way of example. Figure 34 illustrates eddy currents generated in an iron core having a complex three-dimensional shape. Figure 35 illustrates an exemplary torque acting on the fine motion stage when the fine motion stage is accelerated.

101-2: Micro-switch base

101-30: Supporting components

101-31: Supporting components

101-36: Coil

101-39: Sales unit

SC: Fixed iron core (first component)

MC: Movable Core (Second Component)

Claims (26)

A stage device for holding a substrate is characterized by comprising: a coarse motion stage; a coarse motion actuator for driving the coarse motion stage along a predetermined plane; a fine motion stage for holding the substrate; a fine motion actuator for adjusting the position and posture of the fine motion stage relative to the coarse motion stage; and an electromagnetic actuator for contactlessly transmitting a thrust applied to the coarse motion stage by the coarse motion actuator to the fine motion stage. The electromagnetic actuator comprises: a movable iron core fixed to the fine motion stage; a fixed iron core fixed to the coarse motion stage; and a coil wound around the fixed iron core. The shortest distance between the coil and the substrate held by the fine motion stage is greater than the shortest distance between the substrate and the fixed iron core. The stage device according to claim 1, wherein the central axis of the coil is parallel to the plane. The stage device according to claim 2, wherein: the fixed iron core has a first end surface facing the movable iron core, and the distance between the substrate held by the fine motion stage and the center axis of the coil is greater than the distance between the substrate held by the fine motion stage and the center of the first end surface. The stage device according to claim 1, wherein: In a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a crank-shaped portion. The stage device according to claim 1, wherein the central axis of the coil is arranged at an angle inclined relative to the plane. The stage device according to claim 1, wherein: In a cross section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes an L-shaped portion. The stage device according to claim 6, wherein the central axis of the coil is arranged at an angle perpendicular to the plane. The stage device according to claim 7, wherein: the coarse motion stage has an opening, and a portion of the fixed iron core is disposed within the opening. The stage device according to claim 1, wherein the central axis of the coil is arranged at an angle perpendicular to the plane. The stage device according to any one of claims 1 to 9, wherein: the fixed iron core and the movable iron core form a magnetic circuit, the magnetic circuit including a laminate composed of a plurality of electromagnetic steel plates, the laminate including a changing portion in which the lamination direction of the plurality of electromagnetic steel plates changes at a right angle. The stage device according to claim 10, wherein the variable portion includes a contact portion having a first portion with the stacking direction being in a first direction and a second portion with the stacking direction being in a second direction orthogonal to the first direction. The stage device according to claim 10, wherein the variable portion includes a first portion having the stacking direction in a first direction and a second portion having the stacking direction in a second direction orthogonal to the first direction, the first portion and the second portion facing each other via a solid member. The stage device according to claim 10, wherein the variable portion is provided on at least one of the fixed iron core and the movable iron core. The stage device according to claim 10, wherein the variable portion includes a first portion having the stacking direction in a first direction and a second portion having the stacking direction in a second direction orthogonal to the first direction, the first portion and the second portion facing each other via a gap. The stage device according to claim 14, wherein: the first portion is provided on the fixed iron core, and the second portion is provided on the movable iron core. The stage device according to claim 10, wherein: the fixed iron core and the movable iron core are each formed of at least one laminated iron core. The stage device according to claim 10, wherein at least one of the fixed iron core and the movable iron core is formed of a plurality of laminated iron cores. The stage device according to claim 17, wherein the plurality of laminated iron cores are arranged close to each other and fixed by a fixing member. The stage device according to claim 10, wherein the changing portion includes a portion in which the stacking direction gradually changes from a first direction toward a second direction orthogonal to the first direction. The stage device according to claim 11, wherein the variable portion is formed of a wound iron core. The stage device according to claim 10, wherein: one of the fixed iron core and the movable iron core includes at least one laminated iron core; the other of the fixed iron core and the movable iron core includes a wound iron core; the variable portion is formed by the wound iron core. The stage device according to claim 10, wherein: the fixed iron core and the movable iron core are each formed of a winding iron core; the axial direction of the winding iron core forming the fixed iron core and the axial direction of the winding iron core forming the movable iron core are orthogonal to each other; and the winding iron core forming the fixed iron core and the winding iron core forming the movable iron core each constitute the variable portion. The stage device according to claim 10, wherein: the variable portion is provided on the fixed iron core, and the coil is wound around the fixed iron core. The stage device according to claim 23, wherein the coil is wound around a portion of the fixed core that is different from a portion where the changing portion is disposed. A transfer device for transferring a pattern from an original plate to a substrate is characterized by comprising the stage device described in claim 1. A method for manufacturing an article, comprising: a transfer step of transferring a pattern from an original plate to a substrate using the transfer device of claim 25; and a step of obtaining an article from the substrate subjected to the transfer step.