TWI913192B - Platform device, transfer device and article manufacturing method - Google Patents

Abstract

This invention provides a stage device, a transfer device, and a method for manufacturing an article. The stage device for holding a substrate includes: a coarse stage; a coarse actuator that drives the coarse stage along a predetermined plane; a micro stage for holding the substrate; a micro actuator for adjusting the position and orientation of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting the thrust provided by the coarse actuator to the coarse stage to the micro stage in a non-contact manner. The electromagnetic actuator includes: a movable iron core fixed to the micro stage; a fixed iron core fixed to the coarse stage; and a coil wound around the fixed iron core. The shortest distance between the substrate held by the micro stage and the coil is greater than the shortest distance between the substrate and the fixed iron core.

Description

Platform device, transfer device and article manufacturing method

This invention relates to a platform device, a transfer device, and a method for manufacturing articles.

A transfer apparatus for transferring an original graphic to a substrate may include: a coarse stage driven by a coarse actuator; and a micro stage disposed on the coarse stage and holding the substrate. Between the coarse stage and the micro stage, a micro actuator may be disposed for adjusting the position and orientation of the micro stage relative to the coarse stage. Additionally, between the coarse stage and the micro stage, an electromagnetic actuator may also be disposed for transmitting the thrust provided by the coarse actuator to the coarse stage to the micro stage in a non-contact manner. [Prior Art Documents][Patent Documents]

Patent Document 1: Japanese Patent Application Publication No. 2005-109522; Patent Document 2: Japanese Patent Application Publication No. Hei 8-130179

[Problem to be Solved by the Invention] When the micro stage is accelerated, a torque is applied to the micro stage. If the micro actuator is activated to counteract this torque, the heat generated by the micro actuator will increase. This heat will cause deformation of the micro stage, which will lead to a decrease in overlap accuracy.

The purpose of this invention is to provide a technique that helps reduce the torque acting on the micro-motion stage. [Technical means to solve the problem]

The first aspect of the present invention relates to a stage device for holding a substrate, the stage device comprising: a coarse stage; a coarse actuator for driving the coarse stage along a predetermined plane; a micro stage for holding the substrate; a micro actuator for adjusting the position and orientation of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting, in a non-contact manner, the thrust provided by the coarse actuator to the coarse stage to the micro stage, the electromagnetic actuator comprising: a movable iron core fixed to the micro stage; a fixed iron core fixed to the coarse stage; and a coil wound on the fixed iron core, wherein the shortest distance between the substrate held by the micro stage and the coil is greater than the shortest distance between the substrate and the fixed iron core.

The second aspect of the present invention relates to a transfer apparatus for transferring an original graphic onto a substrate, the transfer apparatus having the stage device described in the first aspect.

A third aspect of this invention relates to a method for manufacturing an article, comprising: a transfer step of transferring an original image onto a substrate using a transfer apparatus as described in the second aspect; and a step of obtaining an article from the substrate having undergone the transfer step. [Effects of the Invention]

According to the present invention, a technique is provided that is advantageous in reducing the torque acting on the micro-motion stage.

The embodiments are described in detail below with reference to the accompanying drawings. Furthermore, the embodiments described below do not limit the invention covered by the patent application, and not all combinations of features described in the embodiments are essential components of the invention. Two or more features described in the embodiments can be combined arbitrarily. Additionally, duplicate descriptions are omitted where the same or identical components are labeled with the same reference numerals.

In the following explanation, directions are defined using the XYZ coordinate system. The XY plane, defined by the X and Y axes, is typically horizontal, and the Z axis is typically parallel to the vertical direction. The XY direction is the direction parallel to the XY plane. The X-axis direction is parallel to the X-axis, the Y-axis direction is parallel to the Y-axis, and the Z-axis direction is parallel to the Z-axis.

Figure 1 illustrates, illustratively, the configuration of an exposure apparatus according to one embodiment. This exposure apparatus can be understood as an alignment device for aligning a first object (e.g., a substrate) and a second object (e.g., a master image) relative to each other, or as a transfer device for transferring the pattern of the master image (reduction mask) to the substrate (wafer). A stage plate 692 can be disposed on a base 691, with a wafer stage assembly 500 disposed thereon. Additionally, a lens plate 696 can be disposed on the base 691, with a base 698. The lens plate 696 can support the projection optics system 687 and the reduction mask plate 694. A reduction mask stage assembly 695 can be disposed on the reduction mask plate 694. An illumination optics system 699 can be disposed above the reduction mask plate 694. The illumination optics unit 699 can project the image of the magnifying mask mounted on the magnifying mask stage of the magnifying mask stage assembly 695 onto the wafer mounted on the wafer stage of the wafer stage assembly 500, thereby transferring the pattern of the magnifying mask onto the wafer. This exposure apparatus can also be configured as a scanning exposure apparatus.

The wafer stage device 500 can be understood as a first positioning mechanism for positioning a substrate used as a first object, or as a stage device for holding the substrate. The zoom mask stage device 695 can be understood as a second positioning mechanism for positioning a zoom mask used as a second object. At least one of the first positioning mechanism and the second positioning mechanism may include an electromagnetic device or an electromagnetic actuator as described below.

The aforementioned exposure apparatus or transfer apparatus can be used in article manufacturing methods for manufacturing articles such as semiconductor devices. The article manufacturing method may include: a transfer process in which an original pattern is transferred to a substrate using the aforementioned exposure apparatus or transfer apparatus; and a process in which an article is obtained by processing the substrate after the transfer process. Substrate processing may include, for example, etching, film deposition, and dicing.

Figure 2 illustrates the overall configuration of the wafer stage assembly 500. The XY slider 104 is slidably mounted on the stage base 105 in the XY directions. Force in the X-axis direction is transmitted via the X slider 102, and force in the Y-axis direction is transmitted via the Y slider 103. A micro-motion stage assembly 101 can be mounted on the XY slider 104. Coarse linear motors 106, driving the X and Y sliders respectively, can be provided on both sides of the X slider 102 and Y slider 103.

Figure 3 illustrates, for convenience, the micro-motion stage (micro-motion top plate) 101-1 of the micro-motion stage device 101 in the wafer stage apparatus 500 after being moved upward. The micro-motion stage 101-1 holds the wafer. The micro-motion stage 101-1 can also be understood as a structure having a chuck for holding the wafer. The micro-motion base 101-2 can be fixed on the XY slider 104. On the micro-motion base 101-2, four micro-motion ZLMs (first micro-motion actuators) 101-6 for precise positioning in the Z-axis tilt can be provided. In addition, on the micro-motion base 101-2, two micro-motion XLMs (second micro-motion actuators) 101-4 for precise positioning in the X-axis and around the Z-axis can be provided. Additionally, two micro-motion actuators (YLMs) 101-5, precisely positioned around the Z-axis and Y-axis, can be installed on the micro-motion base 101-2. At the center of the micro-motion base 101-2, a micro-motion magnet 101-3 can be installed to transmit the acceleration force provided to the XY slider 104 in the X-axis and Y-axis directions to the micro-motion base 101-2.

Here, the micro-motion base 101-2 can be understood as a coarse motion stage. Alternatively, the XY slider 104 and the micro-motion base 101-2 can also be understood as a coarse motion stage. Furthermore, the coarse linear motor 106 can be understood as a coarse actuator that drives the micro-motion base 101-2, which serves as the coarse motion stage, along the XY plane, i.e., the defined plane. Additionally, the micro-motion ZLM101-6, micro-motion XLM101-4, and Y-micro-motion YLM101-5 can be understood as micro-motion actuators used to adjust the position and orientation of the micro-motion stage 101-1 relative to the micro-motion base 101-2, which serves as the coarse motion stage. In addition, the micro-motion electromagnetic 101-3 can be understood as an electromagnetic actuator for transmitting the thrust provided by the coarse linear motor 106, which serves as a coarse actuator, to the micro-motion base 101-2, which serves as a coarse stage, to the micro-motion stage 101-1 in a non-contact manner.

Figure 4 shows the configuration of the micro-motion stage device 101, especially detailed examples of the configuration of the micro-motion YLM101-5 and micro-motion ZLM101-6. Figure 4 also shows a configuration with a portion of the magnetic axle removed. The micro-motion YLM101-5 can be constructed using a linear motor. The micro-motion YLM101-5 may include a micro-motion YLM coil base 101-52, a micro-motion YLM coil 101-51, a micro-motion YLM magnet 101-53, a micro-motion YLM magnetic axle 101-54, and a micro-motion LM pad 101-70. The micro-motion YLM coil base 101-52 can be fixed on the micro-motion base 101-2, and the micro-motion YLM coil 101-51 can be fixed on it. The micro-motion YLM coil 101-51 can be an elongated coil with a straight section extending in the vertical direction, and four micro-motion YLM magnets 101-53 are arranged with gaps between them, facing the straight section. Two YLM yokes 101-54 for passing magnetic flux can be arranged to clamp these magnets. The magnetization direction of the magnets can be the X-axis direction, adjacent magnets in the Y-axis direction can have opposite polarities, and magnets arranged in the X-axis direction can have the same polarity. The micro-motion LM pad 101-70 can be used to resist the attractive force acting on a pair of magnets and yokes to maintain their position. The magnets, yokes, and pads can be fixed to the micro-motion base 101-2. By allowing current to flow through the YLM coil 101-51, a force proportional to the current can be generated in the Y-axis direction, which is orthogonal to the straight section. In addition, a torque around the Z-axis can be generated by allowing currents in opposite directions to flow through the two micro-motion YLM101-5.

The micro-switch ZLM101-6 can be constructed using a linear motor. The micro-switch ZLM101-6 may include a micro-switch ZLM coil base 101-62, a micro-switch ZLM coil 101-61, micro-switch ZLM magnets 101-63, micro-switch ZLM axles 101-64, and a micro-switch ZLM pad 101-70. The micro-switch ZLM coil base 101-62 can be fixed on the micro-switch base 101-2, and the micro-switch ZLM coil 101-61 can be fixed on it. The micro-switch ZLM coil 101-61 can be an elongated coil having a straight section extending horizontally, with four micro-switch ZLM magnets 101-63 arranged with gaps between them facing the straight section. Two ZLM axles 101-64 for passing magnetic flux can be arranged to clamp these magnets. The magnetization direction of the magnets can be the X-axis direction, adjacent magnets in the Z-axis direction can have opposite polarities, and magnets arranged in the X-axis direction can have the same polarity. The micro-motion LM pads 101-70 can be used to resist the attractive forces acting on a pair of magnets and their yokes, thus maintaining their positions. The magnets, yokes, and pads can be fixed to the micro-motion top plate 101. By allowing current to flow in the ZLM coils 101-61, a force proportional to the current can be generated in the Z-axis direction, which is orthogonal to the straight section. Furthermore, by combining the directions of the currents flowing in the four micro-motion ZLMs 101-6, torques around the X-axis and around the Y-axis can be generated.

The XLM101-4 microswitch has the same structure as the YLM101-5 microswitch, but with a configuration that allows the YLM101-5 microswitch to rotate by 90 degrees. This generates a force in the X-axis direction and a torque about the Z-axis.

Alternatively, four pin units 101-39 can be provided, which can serve as temporary placement points when recovering wafers from the micro-motion stage 101 and when placing wafers on the micro-motion stage 101-1. For stable temporary wafer placement, the number of pin units 101-39 is preferably three or more, but a minimum of one is also acceptable. Each pin unit 101-39 has a lifting mechanism for raising and lowering the pin used for temporary or wafer placement. Each pin unit 101-39 can have the following functions: a first state where the upper end of the pin protrudes from the upper surface of the micro-motion stage 101-1; and a second state where the upper end of the pin retracts downwards from the upper surface of the micro-motion stage 101-1. In the operation of placing a wafer onto the micro-motion stage 101-1, the pin unit 101-39 receives the wafer from a transfer mechanism (not shown) in a first state, and then, during the transition to a second state, delivers the wafer on the pin to the micro-motion stage 101-1. In the operation of delivering the wafer placed on the micro-motion stage 101-1 to the transfer mechanism (not shown), the pin unit 101-39 causes the pin to transition from the second state to the first state. During this process, the pin unit 101-39 receives the wafer placed on the micro-motion stage 101-1 by the pin and delivers it to the transfer mechanism (not shown) in the first state.

The micro-motion stage device 101 may also be without the pin unit 101-39. In this case, the micro-motion stage 101-1 can be driven to the upper position by the micro-motion ZLM101-6, allowing for wafer transfer with a conveyor mechanism not shown.

Figure 5 illustrates the coarse motion stage device, particularly the detailed configuration of the X slider 102, Y slider 103, and XY slider 104. The XY slider 104 may include a lower XY slider component 104-3, a middle XY slider component 104-2, and an upper XY slider component 104-1. The lower XY slider component 104-3 is slidably supported on the stage base 105 along the XY direction, the middle XY slider component 104-2 is disposed thereon, and the upper XY slider component 104-1 is disposed thereon.

The X-slider 102 may include an X-beam 102-1, two X-feet 102-2, and two X-yaw guides 102-3. The two X-yaw guides 102-3 may be fixed to two sides of the platform base 105. The two X-feet 102-2 may be connected by the X-beam 102-1. One X-feet 102-2 is supported with a gap between its side and the upper surface of the platform base 105 and the side of one X-yaw guide 102-3. The other X-feet 102-2 is supported with a gap between its side and the upper surface of the platform base 105 and the side of the other X-yaw guide 102-3. Thus, the integral assembly of X-beam 102-1 and two X-feet 102-2 can be configured to slide freely along the X-axis. Furthermore, the two sides of X-beam 102-1 are aligned with the inner surfaces of component 104-2 in the XY slider, separated by a small gap and allowing for free sliding, thus restricting the XY slider 104 to slide freely in the XY direction.

The Y-slider 103 may include a Y-beam 103-1, Y-feet 103-2, and Y-yaw guide 103-3. Two Y-yaw guides 103-3 are fixed to two sides of the platform base 105, and the two Y-feet 103-2 can be connected by the Y-beam 103-1. One Y-feet 103-2 is supported relative to the side of one Y-yaw guide 103-3 and the upper surface of the platform base 105 through a gap, allowing it to slide freely along the Y-axis. The other Y-feet 103-2 is supported relative to the side of the other Y-yaw guide 103-3 and the upper surface of the platform base 105 through a gap, allowing it to slide freely along the Y-axis. Thus, the integral assembly of Y-beam 103-1 and two Y-feet 103-2 can be configured to slide freely along the X-axis. Furthermore, the two side surfaces of Y-beam 103-1 are aligned with the inner surface of component 104-1 on the XY slider with a small gap and can slide freely, thus restricting the XY slider 104 to slide freely in the XY direction.

Figure 6 illustrates the detailed structure of the coarse linear motor 106. The coarse linear motor 106 may include multiple linear motor coils 106-1, coil support plates 106-2, support columns 106-3, coil bases 106-4, two linear motor magnets 106-5, magnetic yokes 106-6, two washers 106-7, and arms 106-8.

Multiple linear motor coils 106-1 can be two-phase coil units with adjacent linear motor coils 106-1 having a phase difference of 90 degrees from each other. Multiple linear motor coils 106-1 can be fixed to coil support plate 106-2 and fixed to coil base 106-4 via support column 106-3. Coil base 106-4 can be fixed to platform plate 692 or supported so as to slide freely in the coil arrangement direction via platform plate 692. In the configuration where coil base 106-4 is supported so as to absorb the reaction force of acceleration. Two linear motor magnets 106-5 can each be 4-pole magnet units, which can be configured to clamp the linear motor coils 106-1 from above and below with a gap.

A magnetic axle 106-6 can be disposed on the back side of each linear motor magnet 106-5. A pad 106-7 can be used to resist attractive forces and maintain the gap between the two linear motor magnets 106-5. The structure consisting of the linear motor magnets 106-5, magnetic axles 106-6, and pads 106-7 can be fixed to the X-leg 102-2 or the Y-leg 103-2 via the arm 106-8. This structure can provide thrust in the X-axis and Y-axis directions to the integral part of the X-beam and the two X-legs or the integral part of the Y-beam and the two Y-legs. In addition, in this configuration, a force can be continuously generated by flowing a sinusoidal current corresponding to the position of the coil facing the magnet in one of the two phase coils.

Figure 7 illustrates the arrangement of multiple illumination areas on wafer 700, i.e., the illumination area layout. Illumination areas 701 with dimensions Sx and Sy in the X-axis and Y-axis directions, respectively, can be configured on wafer 700. Multiple illumination areas 701 are scanned and exposed, for example, along a stepping/scanning trajectory. During scanned exposure, the micro-motion stage 101-1 can be synchronously driven in the Y-axis direction with the magnification mask stage, performing a scan drive of 1/projection magnification of the magnification mask stage's scan amount. In addition, if the scanned exposure is completed, the micro-motion stage 101-1 can perform a U-shaped turn in the Y-axis direction while stepping in the X-axis direction to scan and expose the next illumination area. The micro-motion stage 101-1 uses an electromagnetic motor for acceleration and a linear motor for position control, thereby achieving both high-precision position control and low heat generation.

When the micro-motion stage 101-1 is accelerated, a torque can be applied relative to the micro-motion stage 101-1. If the micro-motion ZLM101-6 is activated to counteract this torque, the heat generated from the micro-motion ZLM101-6 will increase. This heat will cause deformation of the micro-motion stage 101-1, which will lead to a decrease in overlap accuracy.

To suppress heat generation from the micro-switch ZLM101-6, reducing the torque acting on the micro-switch stage 101-1 when accelerating it is effective. To further reduce the torque acting on the micro-switch stage 101-1 when accelerating it, reducing the distance between the centers of gravity of the micro-switch XLM101-4, micro-switch YLM101-5, micro-switch ZLM101-6 and the micro-switch stage 101-1 is also effective. Therefore, reducing the height of the micro-switch magnet 101-3 on the micro-switch base 101-2 is advantageous.

Figures 8, 9, and 10 illustratively illustrate the configuration of the micro-magnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the first embodiment. The micro-magnet 101-3 of the first embodiment has a structure that is advantageous in reducing the torque acting on the micro-stage 101-1 when accelerating the micro-stage 101-1. The micro-magnet 101-3 may include a fixed iron core (first component) SC, a support component 101-30 supporting the fixed iron core SC, a movable iron core (second component) MC, a support component 101-31 supporting the movable iron core MC, and a coil 101-36. Support member 101-30 fixes the fixed iron core SC to the micro-motion base 101-2, which serves as a coarse motion stage, and support member 101-31 fixes the movable iron core MC to the micro-motion stage 101-1. Coil 101-36 is wound around the fixed iron core SC. The central axis of coil 101-36 can be parallel to the XY plane (the plane in which the micro-motion base 101-2, serving as the coarse motion stage, moves). The fixed iron core SC has a first end face facing the movable iron core MC. The distance between the wafer 700 held by the micro-motion stage 101-1 and the central axis of coil 101-36 can be greater than the distance between the wafer 700 held by the micro-motion stage 101-1 and the center of the first end face.

In the examples shown in Figures 8, 9, and 10, four support members 101-30 can be fixed on the micro-motion base 101-2, with fixed iron cores SC respectively disposed on them, and coils 101-36 wound around each fixed iron core SC. The fixed iron cores SC and the movable iron cores MC are grounded with a small gap between them. Here, the shortest distance Hcw between the wafer (substrate) 700 held by the micro-motion stage 101-1 and the coil 101-36 is greater than the shortest distance Hew between the wafer (substrate) 700 held by the micro-motion stage 101-1 and the fixed iron core SC. This configuration can be achieved, for example, by giving the fixed iron core SC a crank shape in a cross-section perpendicular to the XY plane and parallel to the central axis of the coil 101-36. By setting Hcw > Hew, compared to the configuration in Figures 4 and 35, the fixed iron core SC can be configured to descend vertically downwards. This reduces the height of the micro-motion magnet 101-3 on the micro-motion base 101-2.

In the configurations shown in Figures 8, 9, and 10, the torque M acting on the micro-motion stage 101-1 when the mass m is accelerated by acceleration a is M = m・a・(hg + hu + he). On the other hand, in the configurations shown in Figures 4 and 35, the torque M acting on the micro-motion stage 101-1 when the mass m is accelerated by acceleration a is M = m・a・(hg + hu + he + hc). Therefore, compared to the configurations shown in Figures 4 and 35, the torque M acting on the micro-motion stage 101-1 when the mass m is accelerated by acceleration a is reduced by m・a・hc in the configurations shown in Figures 8, 9, and 10. Therefore, the micro-motion ZLM101-6 is activated to counteract the torque, thereby reducing the heat generated by the micro-motion ZLM101-6. This helps to suppress the deformation of the micro-motion stage 101-1, and thus suppress the reduction in overlap accuracy. hg is the Z-axis distance between the center of gravity G of the structure consisting of the micro-motion stage 101-1 and the components that move with the micro-motion stage 101-1 (the surface on the side of the micro-motion base 101-2) and the lower surface of the micro-motion stage 101-1. hu is the Z-axis distance between the lower surface of the micro-motion stage 101-1 and the upper end of the micro-motion magnet 101-3 (the end on the side of the micro-motion stage 101-1). he is the Z-axis distance between the upper end of the fixed iron core SC and the point of action of the micro-motion electromagnet 101-3. hc is the Z-axis distance between the upper end of the coil 101-36 (the end on the side of the micro-motion stage 101-1) and the upper end of the fixed iron core SC.

Figure 34 shows an example of the structure of a fixed iron core SC. In the example of Figure 34, the fixed iron core SC is composed of a laminate of multiple electromagnetic steel plates, with the lamination direction along the Z-axis. Each electromagnetic steel plate is covered by an insulating film. In Figure 34, the direction of the magnetic flux in the magnetic circuit is indicated by black arrows, and the magnetic flux flows through a three-dimensional path. The magnetic flux flowing in the Z-axis direction is indicated by thick black arrows. Since the direction of the thick black arrows is parallel to the normal direction of the electromagnetic steel plates, the eddy current generated by the change in current flows along the surface of the electromagnetic steel plates without any suppression. Therefore, as indicated by the thick white arrows, a large eddy current is generated. As a result, the fixed iron core SC heats up, and this heat is transferred to the micro-motion stage 101-1, causing the stage 101-1 to deform, which in turn reduces the overlap accuracy. In addition, the magnetic flux in the Z-axis direction, indicated by the thick black arrow, has a direction parallel to the normal direction of the electromagnetic plate, which leads to disadvantages such as high magnetic reluctance, reduced magnetic flux value, and reduced attractive force.

The following describes an improved example of the micro-magnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the first embodiment.

Figure 11 illustratively illustrates the configuration of an improved example of the micro-switch magnet 101-3 of the first embodiment. The micro-switch magnet 101-3 may include a fixed core (first component) SC, a support component 101-30 supporting the fixed core SC, a movable core (second component) MC, a support component 101-31 supporting the movable core MC, and a coil 101-36. The fixed core (first component) SC may include first element 101-32, second element 101-33, third element 101-34, and fourth element 101-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements besides element 101-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 that is groundly opposite the first end face E1 with a gap. In this example, the first end face E1 is provided in each of the second element 101-33, the third element 101-34, and the fourth element 101-35, and the second end face E2 is provided in element 101-38.

The fixed core (first component) SC may be composed of a laminate of multiple electromagnetic plates. Each of the multiple electromagnetic plates may be covered by an insulating film. Alternatively, elements 101-32, 101-33, 101-34, and 101-35 constituting the fixed core (first component) SC may each be composed of a laminate of multiple electromagnetic plates. The movable core (second component) MC may be composed of a laminate of multiple electromagnetic plates. Alternatively, at least one element constituting the movable core (second component) MC, namely element 101-38, may be composed of a laminate of multiple electromagnetic plates. Each of the multiple electromagnetic plates can be covered by an insulating film.

The magnetic circuit consisting of a fixed iron core (first component) SC, a movable iron core (second component) MC, and a gap (the space between the first end face E1 and the second end face E2) may include at least one variation portion CP in which the lamination direction of the laminate of multiple electromagnetic plates changes at right angles. The variation portion CP may include a contact portion of a first part (e.g., first element 101-32) in which the lamination direction is a first direction (e.g., the Z-axis direction) and a second part (e.g., third element 101-34) in which the lamination direction is orthogonal to the first direction (e.g., the X-axis direction). The variation CP may include a first portion (e.g., first element 101-32) with its lamination direction in a first direction and a second portion (e.g., third element 101-34) with its lamination direction in a second direction orthogonal to the first direction, which are opposite to the solid component ground. The solid component may, for example, be an insulating film that covers a plurality of electromagnetic plates.

In the improved example of Figure 11, the variable part CP is provided on the fixed core (first component) SC. Alternatively, in the improved example of Figure 11, the variable part CP includes a portion in which the fixed core (first component) SC and the movable core (second component) MC face each other with a gap between them. The latter configuration can also be understood as follows: the first part of the first and second parts constituting the variable part CP is provided on the fixed core (first component) SC, and the second part is provided on the movable core (second component) MC. The variable part CP can be additionally provided relative to the movable core (second component) MC, or it can be provided only on the movable core (second component) MC.

The fixed core (first component) SC and the movable core (second component) MC can each be composed of at least one laminated core. Alternatively, at least one of the fixed core (first component) SC and the movable core (second component) MC can be composed of multiple laminated cores. Such multiple laminated cores can be arranged close to each other and fixed by the fixing component. In addition, the laminated cores can be constructed by laminating electromagnetic steel plates of the same shape.

Elements 101-32, 101-33, 101-34, and 101-35 may be composed of a laminated iron core. Elements 101-32, 101-33, 101-34, and 101-35 may be integrated using adhesive materials or clamping components. In this example, at least one variable portion CP is provided on the fixed iron core (first component) SC, and the coil 101-36 is wound around the fixed iron core (first component) SC. The coil 101-36 may be wound around a portion of the fixed iron core (first component) SC that is different from the portion where the variable portion CP is located. By allowing current to flow in coils 101-36, an attractive force is generated between the first end face E1 and the second end face E2. In the improved example of Figure 11, the first element 101-32 has an E-shaped form, and coils 101-36 are wound around the central tooth of the first element 101-32.

The variable section CP is configured such that the magnetic flux through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap does not flow in their layering direction through the multiple electromagnetic plates constituting the fixed iron core (first component) SC and the movable iron core (second component) MC. Alternatively, the variable section CP, the fixed iron core (first component) SC, and the movable iron core (second component) MC can be configured such that the magnetic flux through the fixed iron core (first component) SC and the movable iron core (second component) MC flows along the surface direction of each electromagnetic plate. Alternatively, the variable section CP can be configured such that the magnetic reluctance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than in the case without the variable section CP. Alternatively, the variable part CP can be configured such that the eddy current generated in the magnetic circuit consisting of the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than that without the variable part CP.

The magnetic circuit, constructed from an iron core including the variable section CP, allows for greater freedom in the shape of the magnetic circuit. Furthermore, by constructing an iron core from multiple elements, such as a fixed iron core (first component) SC and a movable iron core (second component) MC, the manufacture of iron cores with complex shapes becomes easier, and the installation and replacement of the coil also become simpler. In particular, the construction of multiple elements secured by clamping components facilitates coil replacement.

Figure 12 illustrates an embodiment of a further improved configuration of the micro-switch magnet 101-3 of the first embodiment. Matters not mentioned here may be configured according to the improved configuration shown in Figure 11. The micro-switch magnet 101-3 may include a fixed core (first component) SC, a support component 101b-30 supporting the fixed core SC, a movable core (second component) MC, a support component (not shown) supporting the movable core MC, and a coil 101-36. The fixed core (first component) SC may include a first element 101b-32, a second element 101b-33, a third element 101b-34, and a fourth element 101b-35. The movable core (second component) MC may include elements 101-38, but may also include one or more other elements besides elements 101-38. Similar to the example in Figure 8, the fixed core (first component) SC has a first end face, and the movable core (second component) MC may have a second end face facing the first end face across a gap. In this example, the first end face is located at each of the second elements 101b-33, the third elements 101b-34, and the fourth element 101b-35, and the second end face is located at element 101-38. In the improved example of Figure 12, the second element 101b-33, the third element 101b-34 and the fourth element 101b-35 have a crank shape in a cross section that is perpendicular to the XY plane and parallel to the central axis of the coil 101-36, and the first element 101b-32 has a cuboid shape.

Figures 13, 14, and 15 illustrate, illustratively, the configuration of the micro-magnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the second embodiment. Matters not mentioned in the second embodiment can be handled according to the first embodiment. The micro-magnet 101-3 of the second embodiment has a structure that is advantageous in reducing the torque acting on the micro-stage 101-1 when accelerating it. The micro-magnet 101-3 may include a fixed core (first component) SC, a support component 101-30 supporting the fixed core SC, a movable core (second component) MC, a support component 101-31 supporting the movable core MC, and a coil 101-36. Support member 101-30 fixes the fixed iron core SC to the micro-motion base 101-2, which serves as a coarse motion stage, and support member 101-31 fixes the movable iron core MC to the micro-motion stage 101-1. A coil 101-36 is wound around the fixed iron core SC. The central axis of the coil 101-36 can be configured at an angle inclined relative to the XY plane (the plane in which the micro-motion base 101-2, serving as the coarse motion stage, moves). Similarly, at least the portion of the fixed iron core SC around the coil 101-36 may include a portion extending in an inclined direction relative to the XY plane. Preferably, the fixed iron core SC includes a variation CP, as in the improved example of the first embodiment.

Figures 16, 17, and 18 illustratively illustrate the configuration of the micro-magnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the third embodiment. Matters not mentioned in the third embodiment can be handled according to the first embodiment. The micro-magnet 101-3 of the third embodiment has a structure that is advantageous in reducing the torque acting on the micro-stage 101-1 when accelerating it. The micro-magnet 101-3 may include a fixed core (first component) SC, a support component 101-30 supporting the fixed core SC, a movable core (second component) MC, a support component 101-31 supporting the movable core MC, and a coil 101-36. Support member 101-30 secures the fixed iron core SC to the micro-motion base 101-2, which serves as a coarse motion stage, while support member 101-31 secures the movable iron core MC to the micro-motion stage 101-1. A coil 101-36 is wound around the fixed iron core SC. The central axis of the coil 101-36 can be configured at an angle perpendicular to the XY plane (the plane in which the micro-motion base 101-2, serving as the coarse motion stage, moves). In a cross-section perpendicular to the XY plane and parallel to the central axis of the coil 101-36, the fixed iron core SC may include an L-shaped portion. The micro-motion base 101-2 may also have an opening, in which a portion of the micro-motion magnet 101-3 may be disposed.

The following describes an improved example of the micro-motion magnet 101-3 assembled in the exposure apparatus or wafer stage apparatus 500 according to the third embodiment. Matters not mentioned here can be referred to in the improved example of the first embodiment. Figures 19 and 20 illustrate the configuration of the improved example of the micro-motion magnet 101-3 according to the third embodiment. In addition, Figure 20 illustrates the configuration of the micro-motion magnet 101-3 with the micro-motion base 101-2 removed.

In this improved example, the micro-motion base 101-2 is provided with four openings 301-21, and a portion of each micro-motion magnet 101-3 can be disposed in the corresponding opening 301-21. A portion of each of the four micro-motion magnets 101-3 can also be disposed below the micro-motion base 101-2. Each micro-motion magnet 101-3 can be supported by the micro-motion base 101-2 via a support member 301-30. This configuration is advantageous in reducing the height of the micro-motion magnets 101-3 above the micro-motion base 101-2 and in reducing the dimensions of the micro-motion magnets 101-3 in the XY directions.

The micro-moving magnet 101-3 may include a fixed core (first component) SC, support components 301-30 supporting the fixed core SC, a movable core (second component) MC, support components 101-31 supporting the movable core MC, and a coil 301-36. The fixed core (first component) SC may include first element 301-32, second element 301-33, third element 301-34, and fourth element 301-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements besides element 101-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 that is groundly opposite the first end face E1 with a gap. In this example, the first end face E1 is provided in each of the second elements 301-33, the third elements 301-34, and the fourth elements 301-35, and the second end face E2 is provided in elements 101-38.

The fixed core (first component) SC may be composed of a laminate of multiple electromagnetic plates. Each of the multiple electromagnetic plates may be covered by an insulating film. Alternatively, elements 301-32, 301-33, 301-34, and 301-35 constituting the fixed core (first component) SC may each be composed of a laminate of multiple electromagnetic plates. The movable core (second component) MC may be composed of a laminate of multiple electromagnetic plates. Alternatively, at least one element constituting the movable core (second component) MC, namely element 101-38, may be composed of a laminate of multiple electromagnetic plates. Each of the multiple electromagnetic plates can be covered by an insulating film.

The magnetic circuit consisting of a fixed iron core (first component) SC, a movable iron core (second component) MC, and a gap (the space between the first end face E1 and the second end face E2) may include at least one variation portion CP in which the lamination direction of the laminate of multiple electromagnetic plates changes at a right angle. The variation portion CP may include a contact portion of a first part (e.g., first element 301-32) in which the lamination direction is a first direction (e.g., the Y-axis direction) and a second part (e.g., third element 301-34) in which the lamination direction is orthogonal to the first direction (e.g., the X-axis direction). The variation CP may include a first portion (e.g., first element 301-32) with its lamination direction in a first direction and a second portion (e.g., third element 301-34) with its lamination direction in a second direction orthogonal to the first direction, which are opposite to the solid component ground. The solid component may, for example, be an insulating film that covers multiple electromagnetic plates respectively.

In the examples of Figures 19 and 20, the variable part CP is provided on the fixed core (first component) SC. Alternatively, in the examples of Figures 19 and 20, the variable part CP includes a portion that allows the fixed core (first component) SC and the movable core (second component) MC to face each other with a gap between them. The latter configuration can also be understood as follows: the first part of the first portion and the second part constituting the variable part CP are provided on the fixed core (first component) SC, and the second part is provided on the movable core (second component) MC. The variable part CP can be additionally provided relative to the movable core (second component) MC, or it can be provided only on the movable core (second component) MC. In the examples of Figures 19 and 20, the second element 301-33, the third element 301-34, and the fourth element 301-3 have an L-shaped form, and the first element 301-32 has a cuboid shape.

Figure 21 illustratively illustrates the configuration of another improved example of the micro-switch magnet 101-3 of the third embodiment. The micro-switch magnet 101-3 may include a fixed core (first component) SC, support components 201a-30 supporting the fixed core SC, a movable core (second component) MC, support components 101-31 supporting the movable core MC, and a coil 201a-36. The fixed core (first component) SC may include first element 201a-32, second element 201a-33, third element 201a-34, and fourth element 201a-35. The movable core (second component) MC may include element 101-38, but may also include one or more other elements besides element 101-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 facing the first end face E1 with a gap between them. In this example, the first end face E1 is provided in each of the second element 201a-33, the third element 201a-34, and the fourth element 201a-35, and the second end face E2 is provided in element 101-38. In the improved example of FIG. 21, the first element 201a-32 has an E-shaped shape, and the coil 201a-36 is wound around the central tooth of the first element 201a-32. In addition, in the improved example of FIG. 21, the second element 201a-33, the third element 201a-34, and the fourth element 201a-35 have a cuboid shape.

Hereinafter, the assembly method or manufacturing method of the improved micro-magnet 101-3 of FIG21 will be described with reference to FIGS. 27 to 31. FIG27 shows the disassembled state of the improved micro-magnet 101-3 of FIG21. The first element 201a-32 and the support component 201a-30 can be bonded by adhesive, clamping, fitting, etc. In addition, the coil 201a-36 and the coil base 201a-42 can be bonded by adhesive material, etc. In addition, the second element 201b-33, the third element 201b-34, and the fourth element 201b-35 can be bonded through the end component gasket 201a-40 by adhesive material, clamping, fitting, etc.

As illustrated in Figure 28, the first element 201a-32 can be inserted into the opening 201a-21 of the micro-motion base 101-2, positioning the assembly of the first element 201a-32 and the support member 201a-30 on the micro-motion base 101-2. Furthermore, the support member 201a-30 can be fixed to the micro-motion base 101-2. The fixing of the support member 201a-30 relative to the micro-motion base 101-2 can be achieved, for example, by screw fastening, adhesive, clamping, or fitting.

Next, as illustrated in Figure 29, the assembly of coil 201a-36 and coil base 201a-42 can be positioned on micro-motion base 101-2, and coil base 201a-42 can be fixed to micro-motion base 101-2. The fixing of coil base 201a-42 relative to micro-motion base 101-2 can be achieved, for example, by screw fastening, adhesive, clamping, or fitting.

Next, as illustrated in Figure 30, the end component base 201a-41 can be fixed to the micro-motion base 101-2 by means of screw fastening, adhesive, clamping, fitting, etc.

Next, as illustrated in Figure 31, the combination of the second element 201b-33, the third element 201b-34, the fourth element 201b-35, and the fourth element 201b-35 can be fixed to the end component base 201a-41. This can be achieved by fixing the end component gasket 201a-40 to the end component base 201a-41 using screws, adhesives, clamps, fittings, etc.

The state shown in Figure 28 can be returned by the reverse order described above, as illustrated in Figure 29. The new coil 201a-36 is fixed to the micro-motion base 101-2, and then the coil 201a-36 is replaced by the order illustrated in Figures 30 and 31.

In cases where a fixed iron core SC is formed by combining multiple elements, there is a risk of particles being generated at the boundary between two elements (e.g., the boundary between the second element 201a-33 and the first element 201a-32) along the interface. As a countermeasure, a coating to prevent particles can be applied to the interface, or a collection tray or a trapping magnet can be installed near the interface. Additionally, when the end component pad 201a-40 is fixed to the end component base 201a-41, a thin pad can be inserted between them to maintain the first element 201a-32 and the second, third, third, and fourth elements 201a-35 in a non-contact state.

The exposure apparatus and the micro-moving magnet 101-3 of the fourth embodiment will be described below. Matters not mentioned in the fourth embodiment can be referred to in the first to third embodiments. The configuration of the micro-moving magnet 101-3 of the fourth embodiment is illustrated in Figure 22. The micro-moving magnet 101-3 may include a fixed iron core (first component) SC, support components 301a-30 supporting the fixed iron core SC, a movable iron core (second component) MC, support components 301a-31 supporting the movable iron core MC, and a coil 301a-36. The fixed core (first component) SC may include elements 301a-32, 301a-37, 301a-33, 301a-34, and 301a-35. The movable core (second component) MC may include elements 301a-38, but may also include one or more other elements besides 301a-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 facing the first end face E1 across a gap. In this example, the first end face E1 is located in each of elements 301a-33, 301a-34, and 301a-35, and the second end face E2 is located in element 301a-38.

The fixed core (first component) SC may be composed of a laminate of multiple electromagnetic steel plates. Each of the multiple electromagnetic steel plates may be covered with an insulating film. Alternatively, elements 301a-33, 301a-34, and 301a-35, constituting part of the fixed core (first component) SC, may be composed of a laminated core consisting of multiple electromagnetic steel plates. Furthermore, elements 301a-32 and 301a-37, constituting another part of the fixed core (first component) SC, may be composed of a wound core that can be formed by winding electromagnetic steel plates. Furthermore, when used as a component constituting the fixed core (first component) SC, the wound core has a structure consisting of multiple laminated electromagnetic plates. The movable core (second component) MC may be composed of a laminated core consisting of multiple laminated electromagnetic plates. From another perspective, at least one element constituting the movable core (second component) MC, namely elements 301a-38, may be composed of a laminate of multiple electromagnetic plates. Each of these multiple electromagnetic plates may be covered by an insulating film.

The magnetic circuit consisting of a fixed iron core (first component) SC, a movable iron core (second component) MC, and a gap (the space between the first end face E1 and the second end face E2) may include variation portions CP and CP' of the laminate of multiple electromagnetic plates whose lamination directions change at right angles. The variation portion CP may include a contact portion of a first part (e.g., element 5 301a-38) whose lamination direction is a first direction (e.g., the Z-axis direction) and a second part (e.g., element 2 301a-37) whose lamination direction is orthogonal to the first direction (e.g., the X-axis direction). The variation section CP may include a portion in which a first part (e.g., element 5 301a-38) has a lamination direction in a first direction and a second part (e.g., element 2 301a-37) in which a second part has a lamination direction orthogonal to the first direction, facing each other across a solid component. The solid component may, for example, be an insulating film covering multiple electromagnetic plates. The variation section CP' includes a portion in which the lamination direction gradually changes from the first direction (e.g., the X-axis direction) to a second direction orthogonal to the first direction (e.g., the Z-axis direction). The variation section CP' including the portion with the gradually changing lamination direction may be part of a wound iron core. The fixed core (first component) SC includes a first portion P1 with a lamination direction in a first direction (e.g., the X-axis direction) and a second portion P2 with a lamination direction in a second direction (e.g., the Z-axis direction), the lamination direction changing slowly between the first portion P1 and the second portion P2. The changing portion CP' is the portion between the first portion P1 and the second portion P2.

In the example of Figure 22, the variable parts CP and CP' are provided on the fixed core (first component) SC. At least one of the variable parts CP and CP' can be additionally provided relative to the movable core (second component) MC, or it can be provided only on the movable core (second component) MC. Alternatively, one of the fixed core (first component) SC and the movable core (second component) MC can be composed of at least one laminated core, and the other of the fixed core (first component) SC and the movable core (second component) MC can be composed of a wound core, with the variable part being composed of a wound core.

Elements 301a-32, 301a-37, 301a-33, 301a-34, and 301a-35 can be integrated using adhesive materials or by clamping components. In this example, the variants CP and CP' are located on the fixed core (first component) SC, and the coil 301a-36 is wound around the fixed core (first component) SC. The coil 301a-36 can be wound around a portion of the fixed core (first component) SC that differs from the portion where the variants CP and CP' are located. By allowing current to flow through the coil 301a-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of Figure 22, the first element 301a-32 and the second element 301a-37 have a U-shaped shape, and the coil 301a-36 is wrapped around one tooth of the first element 301a-32 and one tooth of the second element 301a-37 in the integrated portion.

The variable parts CP and CP' can be configured such that the magnetic flux through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap does not flow in their layering direction through the multiple electromagnetic plates constituting the fixed iron core SC and the movable iron core MC. Alternatively, the variable parts CP and CP', the fixed iron core (first component) SC, and the movable iron core (second component) MC can be configured such that the magnetic flux through the fixed iron core SC and the movable iron core MC flows along the surface direction of each electromagnetic plate. Alternatively, the variable parts CP and CP' can be configured such that the magnetic reluctance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than in the case where there are no variable parts CP and CP'. Alternatively, the variations CP and CP' can be configured such that the eddy current generated in the magnetic circuit consisting of the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than that without variations CP and CP'.

In the example of Figure 22, the stacking direction (Z-axis direction) of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 with the first end face E1 is the same as the stacking direction (Z-axis direction) of the element 301a-38 with the second end face E2. This helps to reduce the magnetic resistance near the gap and increase the magnetic flux.

Alternatively, in the alternative configuration of Figure 22, the layering direction of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 can be set to the X-axis direction. This configuration helps to reduce the magnetic resistance near the boundaries of the third element 301a-33, the fourth element 301a-34, and the fifth element 301a-35 with the first element 301a-32 and the second element 301a-37, thereby increasing the magnetic flux.

Figure 23 illustrates an illustrative variation of the micro-moving magnet 101-3 according to the fourth embodiment. Matters not mentioned in this variation can be handled according to the configuration of the fourth embodiment shown in Figure 22. The micro-moving magnet 101-3 may include a fixed core (first component) SC, support components 301b-30 supporting the fixed core SC, a movable core (second component) MC, support components 301b-31 supporting the movable core MC, and a coil 301b-36. The fixed core (first component) SC may include first elements 301b-32 and second elements 301b-33. The movable core (second component) MC may include third elements 301b-37 and fourth elements 301b-38. The fixed core (first component) SC may have a first end face E1, and the movable core (second component) MC may have a second end face E2 that is groundly opposite the first end face E1 with a gap. In this example, the first end face E1 is provided in each of the first elements 301b-32 and the second elements 301b-33, and the second end face E2 is provided in each of the third elements 301b-37 and the fourth elements 301b-38.

The fixed core (first component) SC can be composed of a laminate of multiple electromagnetic plates. Each of these electromagnetic plates can be covered with an insulating film. Alternatively, first elements 301b-32 and second elements 301b-33, constituting part of the fixed core (first component) SC, can also be composed of a laminate of multiple electromagnetic plates. Furthermore, when used as a component constituting the fixed core (first component) SC, the wound core also has a structure consisting of laminated electromagnetic plates. The movable core (second component) MC can be composed of a laminate of multiple electromagnetic plates. From another perspective, the third element 301b-37 and the fourth element 301b-38 constituting the movable core (second component) MC may be composed of a laminate of multiple electromagnetic plates. Each of the multiple electromagnetic plates may be covered by an insulating film.

A magnetic circuit consisting of a fixed iron core (first component) SC, a movable iron core (second component) MC, and a gap (the space between the first end face E1 and the second end face E2) may include variation portions CP' and CP'” of a multilayer of electromagnetic plates whose lamination directions change at right angles. In this example, variation portion CP' is located in the fixed iron core (first component) SC, and variation portion CP” is located in the movable iron core (second component) MC.

The variable portion CP' includes a section whose lamination direction gradually changes from a first direction (e.g., the X-axis direction) to a second direction orthogonal to the first direction (e.g., the Z-axis direction). The variable portion CP', including the section with the gradually changing lamination direction, can be part of the wound core. The fixed core (first component) SC includes a first portion P1 with a lamination direction in the first direction (e.g., the X-axis direction) and a second portion P2 with a lamination direction in the second direction (e.g., the Z-axis direction), the lamination direction gradually changing between the first portion P1 and the second portion P2. The variable portion CP' is the portion between the first portion P1 and the second portion P2.

The movable iron core (second component) MC includes a third part P3 with a first direction (e.g., the X-axis direction) and a fourth part P4 with a second direction (e.g., the Y-axis direction), the lamination direction changing slowly between the third part P3 and the fourth part P4. The changing part "CP" is the portion between the third part P3 and the fourth part P4.

By allowing current to flow in coils 301b-36, an attractive force is generated between the first end face E1 and the second end face E2. In the example of Figure 23, the first element 301b-32 and the second element 301b-33 have a U-shaped form, and coil 301b-36 is wound around one tooth of the first element 301a-32 and one tooth of the second element 301a-37, which are integrated into the portion.

The variable parts CP' and CP'" can be configured such that the magnetic flux through the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap does not flow in their layering direction through the multiple electromagnetic plates constituting the fixed iron core SC and the movable iron core MC. Alternatively, the variable parts CP' and CP'", the fixed iron core (first component) SC, and the movable iron core (second component) MC can be configured such that the magnetic flux through the fixed iron core SC and the movable iron core MC flows along the surface direction of each electromagnetic plate. Alternatively, the variable parts CP' and CP'" can be configured such that the magnetic reluctance of the magnetic circuit formed by the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than in the case where there are no variable parts CP' and CP'". Alternatively, the variations CP' and CP" can be configured such that the eddy current generated in the magnetic circuit consisting of the fixed iron core (first component) SC, the movable iron core (second component) MC, and the gap is smaller than that without variations CP' and CP"

In the example of Figure 23, the lamination direction (X-axis direction) of the first element 301b-32 and the second element 301b-33 at the first end face E1 is the same as the lamination direction (X-axis direction) of the third element 301b-37 and the fourth element 301b-38 at the second end face E2. This helps to reduce the magnetic reluctance near the gap and increase the magnetic flux. In addition, in the example of Figure 23, in the magnetic circuit composed of the fixed iron core (first component) SC, the movable iron core (second component) MC and the gap, the lamination direction does not change drastically, which is beneficial to reduce the magnetic reluctance and increase the magnetic flux.

Figure 24 illustrates the structure of the support components 301b-31 that support the movable iron core MC. The support components 301b-31 may have a star-shaped wheel in order to support the movable iron core MC, which may be composed of a wound iron core.

Here, the wound core will be explained with reference to FIG. 32. FIG. 32(a) illustrates the wound core. FIG. 32(b) shows a wound core obtained by cutting the wound core illustrated in FIG. 32(a) using wire cutting or the like; such a wound core is also called a cut core. The wound core can be manufactured by winding a ring around a core not shown. As illustrated in FIG. 33, the ring can be manufactured using the cutting machine illustrated in FIG. 33. The original coil is conveyed in the direction of board passage, and cut to the desired width by a cutting machine including a circular blade located along the way, to obtain the ring. The width is determined by the spacing of the circular blades on the cutting machine.

As illustrated in Figure 32(a), a wound core is a laminate of multiple magnetron plates, and one wound core has multiple lamination directions. In other words, the wound core can be used as a component constituting the aforementioned variation. The lamination direction is the direction that runs through the prominent portion of the wound core in a direction perpendicular to the magnetron plates. The width direction is the direction determined by the cutting machine, and is also the axial direction. The axial direction is the direction parallel to any part of the largest surface of each magnetron plate.

In one aspect, the electromagnetic device of the present invention may have multiple core components consisting of laminated or wound cores and coils that generate magnetic flux in the core components. Here, the lamination direction of one laminated core may be orthogonal to the width direction of one wound core, or the lamination direction of one laminated core may be orthogonal to the lamination direction of another laminated core, or the width direction of one wound core may be orthogonal to the width direction of another wound core.

The control system of the wafer stage assembly 500 will now be described. Figure 25 illustrates the configuration of the control system of the wafer stage assembly 500. A motion target providing unit 5101 provides a motion target. A position curve generator 5102 generates a position curve representing the relationship between time and the position of the micro-motion stage 101-1 at that time, based on the motion target provided by the motion target providing unit 5101. Furthermore, the position curve generator 5102 generates a target position based on the generated position curve. An acceleration curve generator 5103 generates an acceleration curve representing the relationship between time and the acceleration of the micro-motion stage 101-1 at that time, based on the motion target provided by the motion target providing unit 5101. Furthermore, the acceleration curve generator 5103 generates a target acceleration based on the generated acceleration curve. Figure 26 illustrates the position curve generated by the position curve generator 5102 and the acceleration curve generated by the acceleration curve generator 5103.

The micro-position sensor 5156 measures the position of the micro-stage 101-1. The micro-position control system 5121 generates an operational quantity through PID calculations, etc., based on the deviation between the target position provided by the position curve generated by the position curve generator 5102 and the current position provided by the micro-position sensor 5156. The current amplifier 5122 supplies a current corresponding to the operational quantity generated by the micro-position control system 5121 to the micro-motion XLM101-4 and micro-motion YLM101-5. Thus, the micro-stage 101-1 receives feedback control.

The coarse position sensor 5135 measures the position of the micro-motion base 101-2. The coarse position control system 5133 generates an operating quantity through PID calculations, etc., corresponding to the deviation between the target position provided by the position curve generated by the position curve generator 5102 and the current position provided by the coarse position sensor 5135. The current amplifier 5131 supplies the current corresponding to the operating quantity generated by the coarse position control system 5133 and the target acceleration provided by the acceleration curve generator 5103 to the coarse linear motor 106. Thus, the micro-motion base 101-2 is subject to both feedback control and feedforward control.

The target acceleration generated by the acceleration curve generator 5103 is also supplied to the electromagnet current control system 5515, which controls the micro-motion electromagnet 101-3 based on the target acceleration. During the acceleration of the micro-motion stage 101-1 (micro-motion stage device 101), the force is mainly provided to the micro-motion stage 101-1 by the micro-motion electromagnet 101-3. The micro-motion XLM101-4 and micro-motion YLM101-5 can be controlled to generate thrust to reduce the small positional deviation between the target position and the measured current position. As a result, the heat generated by the micro-motion XLM101-4 and micro-motion YLM101-5 will be reduced.

The coarse position control system 5133 moves the position of the micro-motion base 101-2 according to the position curve generated by the position curve generator 5102. The micro-motion magnet 101-3 is advantageous for generating a large attractive force with minimal heat generation. However, it is necessary to maintain the gap between the first end face E1 and the second end face E2 of the micro-motion magnet 101-3. That is, in order for the micro-motion magnet 101-3 to continuously provide the desired force to the micro-motion stage 101-1, the stator (fixed core and coil) of the micro-motion magnet 101-3 needs to move in accordance with the movement of the micro-motion stage 101-1 to maintain the gap. Furthermore, the heat generated by the micro-motion ZLM can be reduced by decreasing the height of the micro-motion magnet 101-3 on the micro-motion base 101-2. Based on the above configuration, high-precision position control of the micro-motion stage 101-1, reduced heat generation, and reduced overlap error can be achieved.

The coarse position control system 5133 achieves the above. The coarse position, that is, the position of the micro-motion base 101-2, is measured by the coarse position sensor 5135 represented by the encoder. Based on its deviation from the target position, the coarse position control system 5133 drives the coarse linear motor 106. As a result, the positions of the micro-motion stage 101-1 (the mover of the micro-motion magnet 101-3) and the micro-motion base 101-2 (the stator of the micro-motion magnet 101-3) are controlled based on the output of the position curve generator 5102 to maintain the clearance. The micro-motion position sensor 5156 that measures the position of the micro-motion stage 101-1 can also be replaced by a sensor that measures the relative position of the micro-motion stage 101-1 and the micro-motion base 101-2.

The invention is not limited to the above-mentioned implementation methods; various modifications and alterations can be made within the scope of the invention's concept.

SC: Fixed iron core (first component) MC: Movable iron core (second component) 101-1: Micro-motion platform 101-2: Micro-motion base 101-36: Coil

[Figure 1] A diagram illustrating the configuration of an exposure apparatus according to one embodiment. [Figure 2] A diagram illustrating the configuration of a wafer stage apparatus according to one embodiment. [Figure 3] A diagram illustrating the configuration of a wafer stage apparatus according to one embodiment. [Figure 4] A diagram illustrating the configuration of a micro-motion stage apparatus according to one embodiment. [Figure 5] A diagram illustrating the configuration of a coarse-motion stage apparatus according to one embodiment. [Figure 6] A diagram illustrating the configuration of a coarse-motion linear motor according to one embodiment. [Figure 7] A diagram illustrating the layout of the irradiation area. [Figure 8] A diagram illustrating the configuration of a micro-motion magnet assembled in an exposure apparatus or wafer stage apparatus according to a first embodiment. [Figure 9] An illustrative diagram showing the configuration of a micro-magnet assembled in an exposure apparatus or wafer stage apparatus according to the first embodiment. [Figure 10] An illustrative diagram showing the configuration of a micro-stage apparatus assembled in an exposure apparatus or wafer stage apparatus according to the first embodiment. [Figure 11] An illustrative diagram showing the configuration of an improved example of a micro-magnet assembled in an exposure apparatus or wafer stage apparatus according to the first embodiment. [Figure 12] An illustrative diagram showing the configuration of another improved example of a micro-magnet assembled in an exposure apparatus or wafer stage apparatus according to the first embodiment. [Figure 13] An illustrative diagram showing the configuration of a micro-magnet assembled in an exposure apparatus or wafer stage apparatus according to the second embodiment. [Figure 14] An illustrative diagram showing the configuration of the micro-moving magnet assembled in the exposure apparatus or wafer stage apparatus according to the second embodiment. [Figure 15] An illustrative diagram showing the configuration of the micro-moving stage apparatus assembled in the exposure apparatus or wafer stage apparatus according to the second embodiment. [Figure 16] An illustrative diagram showing the configuration of the micro-moving magnet assembled in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 17] An illustrative diagram showing the configuration of the micro-moving magnet assembled in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 18] An illustrative diagram showing the configuration of the micro-moving stage apparatus assembled in the exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 19] A diagram illustrating an improved example of the micro-magnet assembly in an exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 20] A diagram illustrating an improved example of the micro-magnet assembly in an exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 21] A diagram illustrating another improved example of the micro-magnet assembly in an exposure apparatus or wafer stage apparatus according to the third embodiment. [Figure 22] A diagram illustrating the configuration of the micro-magnet assembly in an exposure apparatus or wafer stage apparatus according to the fourth embodiment. [Figure 23] A diagram illustrating a modified example of the micro-magnet assembly in an exposure apparatus or wafer stage apparatus according to the fourth embodiment. [Figure 24] A diagram illustrating the configuration of the support structure for the movable core in a modified example of the micro-magnet of the fourth embodiment. [Figure 25] A diagram illustrating the configuration of the control system of a wafer stage apparatus in one embodiment. [Figure 26] A diagram illustrating the position curve and acceleration curve. [Figure 27] A diagram illustrating the assembly or manufacturing method of an improved example of the micro-magnet of the third embodiment. [Figure 28] A diagram illustrating the assembly or manufacturing method of an improved example of the micro-magnet of the third embodiment. [Figure 29] A diagram illustrating the assembly or manufacturing method of an improved example of the micro-magnet of the third embodiment. [Figure 30] A diagram illustrating the assembly or manufacturing method of an improved example of the micro-magnet of the third embodiment. [Figure 31] A diagram illustrating the assembly or manufacturing method of the improved micro-motion magnet of the third embodiment. [Figure 32] A diagram illustrating the wound iron core. [Figure 33] A diagram illustrating the manufacturing method of the wound iron core. [Figure 34] A diagram illustrating the eddy current generated in an iron core having a complex three-dimensional shape. [Figure 35] A diagram illustrating the torque acting on the micro-motion stage when the micro-motion stage is accelerated.

101-2: Micro-motion base; 101-30: Support component; 101-31: Support component; 101-36: Coil; 101-39: Pin unit; SC: Fixed iron core (first component); MC: Movable iron core (second component).

Claims (17)

A stage device for holding a substrate, characterized in that it includes: a coarse stage; a coarse actuator for driving the coarse stage along a predetermined plane; a micro stage for holding the substrate; a micro actuator for adjusting the position and orientation of the micro stage relative to the coarse stage; and an electromagnetic actuator for transmitting, in a non-contact manner, a thrust provided from the coarse actuator to the coarse stage to the micro stage, the electromagnetic actuator including: a movable iron core fixed to the micro stage; a fixed iron core fixed to the coarse stage; and a coil wound on the fixed iron core, the center of the faces of the movable iron core and the fixed iron core being located closer to the substrate than the central axis of the coil. The stage device as described in claim 1, wherein the central axis of the coil is parallel to the plane. The platform device as described in claim 1, wherein, in a cross-section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes a portion having a crank shape. The stage device as described in claim 1, wherein the central axis of the coil is configured at an angle inclined relative to the plane. The platform device as described in claim 1, wherein, in a cross-section perpendicular to the plane and parallel to the central axis of the coil, the fixed core includes an L-shaped portion. The platform device as described in any one of claims 1 to 5, wherein the fixed iron core and the movable iron core constitute a magnetic circuit, the magnetic circuit including a laminate composed of a plurality of electromagnetic plates, the laminate including a variation portion in which the lamination direction of the plurality of electromagnetic plates changes at a right angle. The stage device as described in claim 6, wherein the modified part includes a contact portion having a first part having a first direction as the lamination direction and a second part having a second direction having a lamination direction orthogonal to the first direction. The stage device as described in claim 6, wherein the modified portion includes a first portion whose lamination direction is a first direction and a second portion whose lamination direction is a second direction orthogonal to the first direction, which faces the solid component across the solid component. The platform device as described in claim 6, wherein the aforementioned variation part is provided in at least one of the fixed iron core and the movable iron core. The stage device as described in claim 6, wherein the modified portion includes a first portion whose layering direction is a first direction and a second portion whose layering direction is a second direction orthogonal to the first direction, which are separated by a gap and face each other. The platform device as described in claim 10, wherein the first part is disposed on the fixed iron core and the second part is disposed on the movable iron core. The platform device as described in claim 6, wherein the fixed iron core and the movable iron core are each composed of at least one laminated iron core. The platform device as described in claim 7, wherein the aforementioned variation part is composed of a wound iron core. The platform device as described in claim 6, wherein one of the fixed core and the movable core includes at least one laminated core, and the other of the fixed core and the movable core includes a wound core, and the variation part is composed of the wound core. The platform device as described in claim 6, wherein the fixed iron core and the movable iron core are each composed of a wound iron core, the axis of the wound iron core constituting the fixed iron core is orthogonal to the axis of the wound iron core constituting the movable iron core, and the aforementioned variation part is constituted by the wound iron core constituting the fixed iron core and the wound iron core constituting the movable iron core. A transfer apparatus for transferring an original image onto a substrate, the transfer apparatus being characterized in that it has the stage device described in claim 1. A method for manufacturing an article, characterized in that it includes: a transfer step of transferring an original image to a substrate using a transfer apparatus as described in claim 16; and a step of obtaining an article from the substrate having undergone the transfer step.