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TWI889165B - Substrate holder and coating device - Google Patents

Substrate holder and coating device Download PDF

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Publication number
TWI889165B
TWI889165B TW113102680A TW113102680A TWI889165B TW I889165 B TWI889165 B TW I889165B TW 113102680 A TW113102680 A TW 113102680A TW 113102680 A TW113102680 A TW 113102680A TW I889165 B TWI889165 B TW I889165B
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bus bar
central opening
substrate
substrate holder
regulating
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TW113102680A
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Chinese (zh)
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TW202530486A (en
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平尾智則
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日商荏原製作所股份有限公司
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Abstract

本案提供一種基板固持器,實現可對應饋電位置不同的各種種類的基板。所提供之基板固持器210係包含:底板;及面板230,其係用以連同底板一起夾著基板進行保持。面板230係具有中央開口234a及包圍中央開口234a的框構件234。基板固持器210係包含:可對框構件234移動地被安裝在框構件234的第1匯流條242、及被安裝在第1匯流條242的饋電接點243。The present invention provides a substrate holder that can correspond to various types of substrates with different feeding positions. The provided substrate holder 210 includes: a base plate; and a panel 230, which is used to clamp the substrate together with the base plate for holding. The panel 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The substrate holder 210 includes: a first bus bar 242 that can be movably mounted on the frame member 234, and a feeding contact 243 mounted on the first bus bar 242.

Description

基板固持器及鍍覆裝置Substrate holder and coating device

本案係關於基板固持器及鍍覆裝置。 This case is about substrate holder and coating device.

在專利文獻1中揭示浸漬式的鍍覆裝置,作為電解鍍覆裝置之一例。該鍍覆裝置係使將被鍍覆面朝向側方的基板(例如半導體晶圓)保持在基板固持器而浸漬在鍍覆液,且在基板(陰極)與陽極之間施加電壓,藉此使基板的表面析出導電膜。 Patent document 1 discloses an immersion plating device as an example of an electrolytic plating device. The plating device holds a substrate (e.g., a semiconductor wafer) with the surface to be plated facing the side in a substrate holder and immerses it in a plating liquid, and applies a voltage between the substrate (cathode) and the anode, thereby depositing a conductive film on the surface of the substrate.

基板固持器一般構成為藉由底板與面板夾著基板進行保持,且使基板的被鍍覆面由形成在面板的中央開口露出。此外,基板固持器係構成為具備設在面板的接觸構件,且藉由使接觸構件接觸基板而饋電至基板。 The substrate holder is generally configured to hold the substrate by clamping it between a bottom plate and a panel, and to expose the coated surface of the substrate from a central opening formed in the panel. In addition, the substrate holder is configured to have a contact member disposed on the panel, and to feed electricity to the substrate by making the contact member contact the substrate.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特許第6335763號公報 [Patent Document 1] Japanese Patent No. 6335763

專利文獻1所揭示的鍍覆裝置的基板固持器並未考慮對應饋電位置不同的各種種類的基板的情形。 The substrate holder of the coating device disclosed in Patent Document 1 does not take into account the situation of various types of substrates with different corresponding feeding positions.

亦即,成為鍍覆處理對象的基板有各種種類,饋電位置的規格亦依基板而異。此時,必須按饋電位置不同的每個基板製作專用的基板固持器,基板固持器的數量增加,因此鍍覆裝置的構成變得複雜。 That is, there are various types of substrates that are the target of the plating process, and the specifications of the feeding position also vary depending on the substrate. At this time, a dedicated substrate holder must be made for each substrate with a different feeding position, and the number of substrate holders increases, so the structure of the plating device becomes complicated.

因此,本案之目的之一在實現可對應饋電位置不同的各種種類的基板的基板固持器。 Therefore, one of the purposes of this case is to realize a substrate holder that can correspond to various types of substrates with different feeding positions.

藉由一實施形態,揭示一種基板固持器,其係包含:底板;面板,其係用以連同前述底板一起夾著基板進行保持的面板(faceplate),具有中央開口及包圍前述中央開口的框構件;及接觸構件,其係具有:可對前述框構件移動地被安裝在前述框構件的第1匯流條、及被安裝在前述第1匯流條的饋電接點。 According to one embodiment, a substrate holder is disclosed, which includes: a bottom plate; a faceplate, which is a faceplate used to clamp the substrate together with the bottom plate for holding, and has a central opening and a frame member surrounding the central opening; and a contact member, which has: a first bus bar movably mounted on the frame member, and a feeding contact mounted on the first bus bar.

100:裝載埠 100: Loading port

110:搬送機器人 110:Transport robot

120:裝載載台 120: Loading platform

130:卸載載台 130: Unloading platform

140:裝載機 140: Loader

200:固定模組 200: Fixed module

210:基板固持器 210:Substrate holder

220:底板 220: Base plate

220a:第1鎖定開口 220a: 1st locking opening

222:固持器板件 222: Retainer plate

224:固持器鉤扣 224: Retainer hook

224a:軸 224a: Axis

230:面板 230: Panel

230a:第2鎖定開口 230a: Second locking opening

234:框構件 234: Frame components

234a:中央開口 234a: Central opening

236:夾持器板件 236: Clamp plate

238:夾持器鉤扣 238: Clip hook

240:接觸構件 240: Contact components

241:第2規制構件 241: Second regulatory component

241a:近位規制構件 241a: Proximal regulatory components

241b:遠位規制構件 241b: Remote regulatory components

242:第1匯流條 242: Busbar 1

242a:把持孔 242a:Holding hole

242b:突條部 242b: protrusion

243:饋電接點 243: Feedback contact

244:第2匯流條 244: Busbar No. 2

245:導引構件 245: Guiding component

246:長孔 246: Long hole

247:第1規制構件 247: The first regulatory component

247a:近位端 247a: near end

247b:遠位端 247b: Distal end

248:壓縮線圈彈簧 248: Compression coil spring

249:盤形彈簧 249: Disc spring

250:內側密封構件 250: Inner sealing component

260:外側密封構件 260: External sealing component

270:鎖定機構 270: Locking mechanism

280:位置調整治具 280: Position adjustment fixture

281:治具本體 281: Fixture body

282:第1爪構件 282: 1st claw component

283:第2爪構件 283: Second claw component

284:治具遠位按壓構件 284: Jig remotely presses components

285:治具近位按壓構件 285: The fixture presses the component in a near position

290:位置調整機構 290: Position adjustment mechanism

292:臂 292: Arm

293:近位按壓構件 293: Near-position pressing member

294:遠位按壓構件 294: Remote pressing component

295:把持部 295:Handling part

296:第2驅動構件 296: Second drive component

298:第1驅動構件 298: First drive component

300:倉儲模組 300: Storage module

310:交換模組 310: Exchange module

320:固持器洗淨模組 320: Holder cleaning module

400:預濕模組 400: Pre-wetting module

500:預浸模組 500: Prepreg module

510:預浸洗淨模組 510: Pre-soaking and cleaning module

600:鍍覆模組 600: Coating module

700:鍍覆洗淨模組 700: Coating and cleaning module

710:鼓風模組 710: Blower module

720:暫置模組 720: Temporary module

800:洗淨模組 800: Washing module

900:搬送裝置 900: Transport device

950:控制模組 950: Control module

1000:鍍覆裝置 1000: Coating device

WF:基板 WF: substrate

[圖1]係顯示一實施形態之鍍覆裝置的全體構成的剖面圖。 [Figure 1] is a cross-sectional view showing the overall structure of a coating device in an implementation form.

[圖2]係一實施形態之基板固持器的概略斜視圖。 [Figure 2] is a schematic oblique view of a substrate holder in an implementation form.

[圖3]係一實施形態之基板固持器的鎖定機構的概略剖面圖。 [Figure 3] is a schematic cross-sectional view of a locking mechanism of a substrate holder in one embodiment.

[圖4]係一實施形態之接觸構件的概略斜視圖。 [Figure 4] is a schematic oblique view of a contact member of an implementation form.

[圖5]係一實施形態之接觸構件的放大斜視圖。 [Figure 5] is an enlarged oblique view of a contact member of an implementation form.

[圖6]係一實施形態之接觸構件的放大斜視圖。 [Figure 6] is an enlarged oblique view of a contact member of an implementation form.

[圖7]係一實施形態之接觸構件的放大斜視圖。 [Figure 7] is an enlarged oblique view of a contact member of an implementation form.

[圖8]係一實施形態之接觸構件的放大斜視圖。 [Figure 8] is an enlarged oblique view of a contact member of an implementation form.

[圖9]係一實施形態之接觸構件的放大斜視圖。 [Figure 9] is an enlarged oblique view of a contact member of an implementation form.

[圖10]係一實施形態之接觸構件的放大斜視圖。 [Figure 10] is an enlarged oblique view of a contact member of an implementation form.

[圖11]係一實施形態之位置調整機構的概略斜視圖。 [Figure 11] is a schematic oblique view of a position adjustment mechanism in an implementation form.

[圖12]係一實施形態之位置調整機構的概略斜視圖。 [Figure 12] is a schematic oblique view of a position adjustment mechanism in an implementation form.

[圖13]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 13] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖14]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 14] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖15]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 15] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖16]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 16] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖17]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 17] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖18]係一實施形態之接觸構件及位置調整機構的放大斜視圖。 [Figure 18] is an enlarged oblique view of a contact member and a position adjustment mechanism of an implementation form.

[圖19]係一實施形態之接觸構件的放大斜視圖。 [Figure 19] is an enlarged oblique view of a contact member of an implementation form.

[圖20]係一實施形態之接觸構件及位置調整治具的概略斜視圖。 [Figure 20] is a schematic oblique view of a contact member and a position adjustment fixture of an implementation form.

[圖21]係一實施形態之接觸構件及位置調整治具的概略斜視圖。 [Figure 21] is a schematic oblique view of a contact member and a position adjustment fixture of an implementation form.

[圖22]係一實施形態之接觸構件及位置調整治具的概略斜視圖。 [Figure 22] is a schematic oblique view of a contact member and a position adjustment fixture of an implementation form.

[圖23]係一實施形態之接觸構件及位置調整治具的概略斜視圖。 [Figure 23] is a schematic oblique view of a contact member and a position adjustment fixture of an implementation form.

[圖24]係一實施形態之基板裝設方法的流程圖。 [Figure 24] is a flow chart of a substrate installation method in one embodiment.

以下參照圖面,說明本發明之實施形態。在以下說明的圖面中,對相同或相當的構成元件係標註相同符號且省略重複說明。 The following is a description of the implementation of the present invention with reference to the drawings. In the drawings described below, the same or equivalent components are marked with the same symbols and repeated descriptions are omitted.

<鍍覆裝置的全體構成> <Overall structure of the coating device>

圖1係顯示本實施形態之鍍覆裝置的全體構成的平面圖。鍍覆裝置1000係具備:裝載埠100、搬送機器人110、裝載載台120、卸載載台130、裝載機140、固定模組200、倉儲模組300、交換模組310、固持器洗淨模組320、預濕 模組400、預浸模組500、預浸洗淨模組510、鍍覆模組600、鍍覆洗淨模組700、鼓風模組710、暫置模組720、洗淨模組800、搬送裝置900、及控制模組950。 FIG1 is a plan view showing the overall structure of the coating device of this embodiment. The coating device 1000 is equipped with: a loading port 100, a transfer robot 110, a loading platform 120, an unloading platform 130, a loader 140, a fixed module 200, a storage module 300, an exchange module 310, a holder cleaning module 320, a pre-wetting module 400, a pre-preg module 500, a pre-preg cleaning module 510, a coating module 600, a coating cleaning module 700, a blast module 710, a temporary module 720, a cleaning module 800, a transfer device 900, and a control module 950.

裝載埠100係用以將被收納在未圖示的FOUP等匣盒的基板WF搬入至鍍覆裝置1000、或將基板WF從鍍覆裝置1000搬出至匣盒的模組。在本實施形態中,朝水平方向排列配置有4台裝載埠100,惟裝載埠100的數量及配置為任意。搬送機器人110係用以水平搬送基板WF的機器人,構成為在裝載埠100與裝載載台120之間收授基板WF。 The loading port 100 is a module for carrying substrates WF stored in a cassette such as a FOUP (not shown) into the coating device 1000, or carrying substrates WF out of the coating device 1000 to the cassette. In this embodiment, four loading ports 100 are arranged horizontally, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for horizontally transporting substrates WF, and is configured to receive and deliver substrates WF between the loading port 100 and the loading platform 120.

裝載載台120係用以在搬送機器人110與裝載機140之間收授鍍覆處理前的基板WF的載台。卸載載台130係用以在搬送機器人110與裝載機140之間收授鍍覆處理後的基板WF的載台。裝載機140係用以水平搬送基板WF的機器人,構成為在裝載載台120、卸載載台130、固定模組200、及洗淨模組800之間收授基板WF。 The loading platform 120 is a platform for receiving and transferring substrates WF before coating between the transport robot 110 and the loader 140. The unloading platform 130 is a platform for receiving and transferring substrates WF after coating between the transport robot 110 and the loader 140. The loader 140 is a robot for horizontally transferring substrates WF, and is configured to receive and transfer substrates WF between the loading platform 120, the unloading platform 130, the fixed module 200, and the cleaning module 800.

固定模組200係用以在基板固持器210安裝基板WF、或從基板固持器210卸下基板WF的模組。倉儲模組300係用以垂直保管基板固持器210的模組。交換模組310係用以暫時保管必須進行交換或維護的基板固持器210的模組,形成為可取出放入基板固持器210的構造。由交換模組310被取出的基板固持器210係在鍍覆裝置1000內予以維護、或取出至鍍覆裝置1000之外予以維護,可將維護後的基板固持器210或新的基板固持器210放入至交換模組310。固持器洗淨模組320係用以洗淨基板固持器210的模組。 The fixed module 200 is a module for mounting a substrate WF on a substrate holder 210 or removing a substrate WF from the substrate holder 210. The storage module 300 is a module for vertically storing a substrate holder 210. The exchange module 310 is a module for temporarily storing a substrate holder 210 that must be exchanged or maintained, and is formed into a structure that can take out and put in the substrate holder 210. The substrate holder 210 taken out by the exchange module 310 is maintained in the coating device 1000 or taken out to the outside of the coating device 1000 for maintenance, and the maintained substrate holder 210 or a new substrate holder 210 can be put into the exchange module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

預濕模組400係用以利用純水或脫氣水等處理液弄濕鍍覆處理前的基板WF的被鍍覆面,藉此將形成在基板表面的圖案內部的空氣置換為處理液 的模組。預濕模組400係構成為藉由在鍍覆時將圖案內部的處理液置換為鍍覆液來施行容易對圖案內部供給鍍覆液的預濕處理。 The pre-wetting module 400 is a module for wetting the coated surface of the substrate WF before the coating process with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the substrate surface with the treatment liquid. The pre-wetting module 400 is configured to perform a pre-wetting process that facilitates the supply of the coating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the coating liquid during coating.

預浸模組500係構成為施行將在形成在例如鍍覆處理前的基板WF的被鍍覆面的種層表面等所存在的電阻大的氧化膜,以硫酸或鹽酸等處理液蝕刻去除而將鍍覆基底表面洗淨或活性化的預浸處理。預浸洗淨模組510係用以洗淨經施行預浸處理的基板WF的模組。 The pre-dip module 500 is configured to perform a pre-dip treatment for cleaning or activating the surface of the plated substrate by etching away the oxide film with high resistance existing on the surface of the seed layer formed on the plated surface of the substrate WF before the plating treatment, for example, with a treatment liquid such as sulfuric acid or hydrochloric acid. The pre-dip cleaning module 510 is a module for cleaning the substrate WF that has been subjected to the pre-dip treatment.

鍍覆模組600係用以對基板WF施行鍍覆處理的模組。鍍覆洗淨模組700係用以為了去除殘留在鍍覆處理後的基板WF的鍍覆液等而洗淨基板WF的模組。在本實施形態中,水平排列設有3台鍍覆模組600及鍍覆洗淨模組700,惟鍍覆模組600及鍍覆洗淨模組700的數量及配置為任意。鼓風模組710係用以使洗淨處理後的基板WF乾燥的模組。暫置模組720係用以為了在複數搬送裝置900之間收授安裝有基板WF的基板固持器210而進行暫置的模組。在本實施例中,暫置模組720的基板固持器210的收納台數為1台,惟其數量為任意。 The coating module 600 is a module for performing a coating process on the substrate WF. The coating cleaning module 700 is a module for cleaning the substrate WF in order to remove the coating liquid and the like remaining on the substrate WF after the coating process. In this embodiment, three coating modules 600 and three coating cleaning modules 700 are arranged horizontally, but the number and arrangement of the coating modules 600 and the coating cleaning modules 700 are arbitrary. The blowing module 710 is a module for drying the substrate WF after the cleaning process. The temporary module 720 is a module for temporarily storing the substrate holder 210 mounted with the substrate WF between a plurality of conveying devices 900. In this embodiment, the number of substrate holders 210 that can be stored in the temporary module 720 is 1, but the number is arbitrary.

洗淨模組800係用以為了去除殘留在由基板固持器210卸下的鍍覆處理後的基板WF的鍍覆液等而對基板WF施行洗淨處理及乾燥處理的模組。在本實施形態中,夾著裝載載台120及卸載載台130水平排列配置有2台洗淨模組800,惟洗淨模組800的數量及配置為任意。搬送裝置900係用以在鍍覆裝置1000內的複數模組間垂直搬送基板固持器210的裝置。在本實施形態中排列配置有3台搬送裝置900,惟搬送裝置900的數量及配置為任意。 The cleaning module 800 is a module for cleaning and drying the substrate WF in order to remove the coating liquid etc. remaining on the substrate WF after the coating process removed from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally with the loading stage 120 and the unloading stage 130 sandwiched therebetween, but the number and arrangement of the cleaning modules 800 are arbitrary. The conveying device 900 is a device for vertically conveying the substrate holder 210 between the plurality of modules in the coating device 1000. In this embodiment, three conveying devices 900 are arranged in an arranged manner, but the number and arrangement of the conveying devices 900 are arbitrary.

控制模組950係構成為控制鍍覆裝置1000的複數模組,可由具備例如與操作員之間的輸出入介面的一般電腦或專用電腦所構成。 The control module 950 is composed of a plurality of modules for controlling the coating device 1000, and can be composed of a general computer or a dedicated computer having an input/output interface with an operator, for example.

說明藉由鍍覆裝置1000所為之一連串鍍覆處理之一例。首先,被收納在匣盒的基板WF被搬入至裝載埠100。接著,搬送機器人110係從裝載埠100的匣盒取出基板WF,且將基板WF放置在裝載載台120。裝載機140係從裝載載台120收取基板WF,且搬送至固定模組200。 An example of a continuous coating process performed by the coating device 1000 is described. First, the substrate WF stored in the cassette is moved to the loading port 100. Then, the transfer robot 110 takes out the substrate WF from the cassette of the loading port 100 and places the substrate WF on the loading platform 120. The loader 140 takes the substrate WF from the loading platform 120 and transfers it to the fixed module 200.

固定模組200係在基板固持器210安裝基板WF。搬送裝置900係將安裝有基板WF的基板固持器210搬送至預濕模組400。預濕模組400係對基板WF施行預濕處理。搬送裝置900係將安裝有已被施行預濕處理的基板WF的基板固持器210搬送至預浸模組500。預浸模組500係對基板WF施行預浸處理。搬送裝置900係將安裝有已被施行預浸處理的基板WF的基板固持器210搬送至預浸洗淨模組510。預浸洗淨模組510係洗淨基板WF。搬送裝置900係將安裝有已被施行洗淨處理的基板WF的基板固持器210搬送至鍍覆模組600。鍍覆模組600係對基板WF施行鍍覆處理。 The fixed module 200 mounts the substrate WF on the substrate holder 210. The conveying device 900 conveys the substrate holder 210 on which the substrate WF is mounted to the pre-wetting module 400. The pre-wetting module 400 performs a pre-wetting treatment on the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF that has been pre-wetted is mounted to the pre-preg module 500. The pre-preg module 500 performs a pre-preg treatment on the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF that has been pre-preg is mounted to the pre-preg cleaning module 510. The pre-preg cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 on which the substrate WF that has been subjected to a cleaning process is mounted to the coating module 600. The coating module 600 performs a coating process on the substrate WF.

搬送裝置900係將安裝有已被施行鍍覆處理的基板WF的基板固持器210搬送至鍍覆洗淨模組700。鍍覆洗淨模組700係對基板WF及基板固持器210施行洗淨處理。搬送裝置900係將安裝有已被施行洗淨處理的基板WF的基板固持器210搬送至鼓風模組710。鼓風模組710係對基板WF施行乾燥處理。搬送裝置900係將安裝有已被施行乾燥處理的基板WF的基板固持器210搬送至暫置模組720,別的搬送裝置900將該基板固持器210由暫置模組720搬送至固定模組200。固定模組200係從基板固持器210卸下基板WF。 The transport device 900 transports the substrate holder 210 on which the substrate WF that has been subjected to the coating process is mounted to the coating cleaning module 700. The coating cleaning module 700 performs a cleaning process on the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210 on which the substrate WF that has been subjected to the cleaning process is mounted to the blower module 710. The blower module 710 performs a drying process on the substrate WF. The transport device 900 transports the substrate holder 210 on which the substrate WF that has been subjected to the drying process is mounted to the temporary module 720, and another transport device 900 transports the substrate holder 210 from the temporary module 720 to the fixed module 200. The fixed module 200 removes the substrate WF from the substrate holder 210.

裝載機140係將從基板固持器210被卸下的鍍覆處理後的基板WF搬送至洗淨模組800。洗淨模組800係對基板WF施行洗淨處理及乾燥處理。裝載機140係將經施行洗淨處理及乾燥處理的基板WF放置在卸載載台130。搬送機器 人110係從卸載載台130收取基板WF,且搬送至裝載埠100的匣盒。最後從裝載埠100搬出收納有基板WF的匣盒。 The loader 140 transfers the coated substrate WF removed from the substrate holder 210 to the cleaning module 800. The cleaning module 800 performs cleaning and drying on the substrate WF. The loader 140 places the substrate WF that has been cleaned and dried on the unloading platform 130. The transfer robot 110 receives the substrate WF from the unloading platform 130 and transfers it to the cassette of the loading port 100. Finally, the cassette containing the substrate WF is removed from the loading port 100.

在固定模組200已被卸下基板WF的基板固持器210係被安裝接下來的基板WF、或藉由搬送裝置900被送回至倉儲模組300。未保持基板WF的基板固持器210係視需要而在固持器洗淨模組320予以洗淨。 The substrate holder 210 from which the substrate WF has been removed in the fixed module 200 is installed with the next substrate WF or is sent back to the storage module 300 by the transfer device 900. The substrate holder 210 that does not hold the substrate WF is cleaned in the holder cleaning module 320 as needed.

圖2係一實施形態之基板固持器的概略斜視圖。如圖2所示,基板固持器210係包含:底板220、及用以連同底板220一起夾著基板進行保持的面板230。面板230係具有:中央開口234a及包圍中央開口234a的框構件234。中央開口234a係形成為矩形。其中,在本實施形態中係示出中央開口234a形成為矩形之例,惟非限定於此,中央開口234a亦可為例如圓形。 FIG2 is a schematic oblique view of a substrate holder of an embodiment. As shown in FIG2, the substrate holder 210 includes: a bottom plate 220, and a panel 230 for holding the substrate together with the bottom plate 220. The panel 230 has: a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. In this embodiment, an example in which the central opening 234a is formed in a rectangular shape is shown, but it is not limited to this. The central opening 234a can also be, for example, circular.

此外,在本實施形態中係示出在底板220亦形成有中央開口之例,惟此係用以在基板的兩面進行鍍覆處理者。因此,若僅在基板的單面進行鍍覆處理,亦可在底板220未形成有中央開口。此外,以下為方便說明,係有使用面板230被配置在下方、底板220被配置在上方的圖面來進行說明的情形,惟當在固定模組200處理基板固持器210時,底板220被配置在下方,且面板230被配置在上方。 In addition, in this embodiment, an example is shown in which a central opening is formed on the bottom plate 220, but this is for performing plating treatment on both sides of the substrate. Therefore, if plating treatment is performed on only one side of the substrate, the bottom plate 220 may not have a central opening. In addition, for the convenience of explanation, the following is a diagram in which the panel 230 is arranged at the bottom and the bottom plate 220 is arranged at the top. However, when the substrate holder 210 is processed in the fixed module 200, the bottom plate 220 is arranged at the bottom and the panel 230 is arranged at the top.

基板固持器210係包含:以包圍中央開口234a的方式設在框構件234的內側密封構件250;及與內側密封構件250隔著間隔而以包圍內側密封構件250的外側的方式設在框構件234的外側密封構件260。此外,基板固持器210係包含夾著矩形的中央開口234a而一對設在框構件234的接觸構件240。接觸構件240係設在內側密封構件250與外側密封構件260之間。藉此,基板固持器210已被浸漬在鍍覆液時,接觸構件240及基板的端部密封鍍覆液。其中,在本實施形態中 係示出接觸構件240夾著矩形的中央開口234a以一對安裝在框構件234之例,惟非限定於此。接觸構件240亦可以包圍矩形的中央開口234a的方式安裝在框構件234的4邊。 The substrate holder 210 includes an inner sealing member 250 provided on the frame member 234 so as to surround the central opening 234a, and an outer sealing member 260 provided on the frame member 234 so as to surround the outer side of the inner sealing member 250 with a gap therebetween. In addition, the substrate holder 210 includes a pair of contact members 240 provided on the frame member 234 with the rectangular central opening 234a interposed therebetween. The contact member 240 is provided between the inner sealing member 250 and the outer sealing member 260. Thus, when the substrate holder 210 is immersed in the coating liquid, the contact member 240 and the end of the substrate are sealed with the coating liquid. In this embodiment, the contact member 240 is mounted on the frame member 234 in a pair with the rectangular central opening 234a, but the present invention is not limited thereto. The contact member 240 can also be mounted on the four sides of the frame member 234 in a manner of surrounding the rectangular central opening 234a.

如圖2所示,基板固持器210係具有用以使底板220與面板230鎖定或使鎖定解除的複數鎖定機構270。複數鎖定機構270係沿著底板220與面板230的外周而設。 As shown in FIG. 2 , the substrate holder 210 has a plurality of locking mechanisms 270 for locking or releasing the bottom plate 220 and the panel 230. The plurality of locking mechanisms 270 are provided along the periphery of the bottom plate 220 and the panel 230.

圖3係一實施形態之基板固持器的鎖定機構270的概略剖面圖。如圖3所示,底板220係具有形成在比外側密封構件260更為外側的第1鎖定開口220a。另一方面,面板230係具有形成在比外側密封構件260更為外側之對應第1鎖定開口220a的位置的第2鎖定開口230a。鎖定機構270係包含:設在第1鎖定開口220a的固持器板件222;及透過第1鎖定開口220a朝面板230側突出的固持器鉤扣224。另一方面,鎖定機構270係包含:設在第2鎖定開口230a的夾持器板件236;及透過第2鎖定開口230a朝底板220的方向突出的夾持器鉤扣238。 FIG3 is a schematic cross-sectional view of a locking mechanism 270 of a substrate holder in an embodiment. As shown in FIG3 , the bottom plate 220 has a first locking opening 220a formed on the outer side of the outer sealing member 260. On the other hand, the panel 230 has a second locking opening 230a formed on the outer side of the outer sealing member 260 at a position corresponding to the first locking opening 220a. The locking mechanism 270 includes: a holder plate 222 provided at the first locking opening 220a; and a holder hook 224 protruding toward the panel 230 side through the first locking opening 220a. On the other hand, the locking mechanism 270 includes: a clamp plate 236 provided at the second locking opening 230a; and a clamp hook 238 protruding toward the bottom plate 220 through the second locking opening 230a.

固持器鉤扣224係構成為可以軸224a為中心作旋轉。鎖定機構270係構成為當固持器鉤扣224位於以實線所示位置時,固持器鉤扣224卡合在夾持器鉤扣238,藉此鎖定底板220與面板230。另一方面,鎖定機構270係構成為當固持器鉤扣224旋轉而位於以虛線所示位置時,固持器鉤扣224與夾持器鉤扣238的卡合被解除,且底板220與面板230的鎖定被解除。其中,在圖2中係示出鎖定機構270沿著底板220與面板230的外周設置複數個之例,惟非限定於此。此外,在圖4之後的說明中,為方便說明,省略鎖定機構270的圖示。 The holder hook 224 is configured to be rotatable around the axis 224a. The locking mechanism 270 is configured such that when the holder hook 224 is located at the position indicated by the solid line, the holder hook 224 is engaged with the clip hook 238, thereby locking the bottom plate 220 and the panel 230. On the other hand, when the holder hook 224 is rotated and located at the position indicated by the dotted line, the engagement between the holder hook 224 and the clip hook 238 is released, and the locking of the bottom plate 220 and the panel 230 is released. In particular, FIG. 2 shows an example in which a plurality of locking mechanisms 270 are provided along the periphery of the bottom plate 220 and the panel 230, but the present invention is not limited thereto. In addition, in the description after FIG. 4, the illustration of the locking mechanism 270 is omitted for the convenience of explanation.

圖4至圖7係一實施形態之接觸構件的概略斜視圖。圖4係示出接觸構件240的全體,圖5至圖7係放大示出接觸構件240的一部分。其中,接觸構件 240係夾著中央開口234a以一對設在框構件234,惟二者均具有相同的構成,因此僅說明其中一方。 Figures 4 to 7 are schematic oblique views of a contact member of an embodiment. Figure 4 shows the entire contact member 240, and Figures 5 to 7 show a portion of the contact member 240 in an enlarged manner. The contact member 240 is provided in a pair on the frame member 234 with the central opening 234a sandwiched between them, but both have the same structure, so only one of them is described.

如圖4至圖7所示,接觸構件240係具有:沿著框構件234延伸,且可對框構件234移動地被安裝在框構件234的第1匯流條242、及被安裝在第1匯流條242的饋電接點243。更具體而言,接觸構件240係包含有沿著框構件234延伸且被固定在框構件234的第2匯流條244。第1匯流條242係可對第2匯流條244移動地積層在第2匯流條244予以安裝。 As shown in FIGS. 4 to 7 , the contact member 240 includes: a first bus bar 242 extending along the frame member 234 and movably mounted on the frame member 234, and a feeding contact 243 mounted on the first bus bar 242. More specifically, the contact member 240 includes a second bus bar 244 extending along the frame member 234 and fixed to the frame member 234. The first bus bar 242 is movably laminated on the second bus bar 244 and mounted on the second bus bar 244.

饋電接點243的基端係被固定在第1匯流條242,饋電接點243的前端係朝中央開口234a的方向突出。第2匯流條244係連接於未圖示的電源。由電源透過第2匯流條244及第1匯流條242對饋電接點243予以饋電。饋電接點243係構成為藉由饋電接點243的前端接觸基板而饋電至基板。 The base end of the feeding contact 243 is fixed to the first bus bar 242, and the front end of the feeding contact 243 protrudes toward the central opening 234a. The second bus bar 244 is connected to a power source not shown. The power source feeds the feeding contact 243 through the second bus bar 244 and the first bus bar 242. The feeding contact 243 is configured to feed the substrate by contacting the front end of the feeding contact 243 with the substrate.

第1匯流條242係可朝對中央開口234a接近及遠離的第1方向移動地被安裝在第2匯流條244。第2匯流條244係具有配置在第1匯流條242的延伸方向的兩端的導引構件245。導引構件245係用以將第1匯流條242的移動方向規制在第1方向的構件。 The first bus bar 242 is mounted on the second bus bar 244 so as to be movable in the first direction approaching and moving away from the central opening 234a. The second bus bar 244 has guide members 245 disposed at both ends of the extension direction of the first bus bar 242. The guide member 245 is a member for regulating the movement direction of the first bus bar 242 in the first direction.

如圖5所示,第1匯流條242係具有形成在第1匯流條242的延伸方向的兩端的把持孔242a。把持孔242a係當使用後述之位置調整機構及/或治具來使第1匯流條242移動時,用以把持第1匯流條242的切口。 As shown in FIG. 5 , the first bus bar 242 has holding holes 242a formed at both ends of the extending direction of the first bus bar 242. The holding holes 242a are cutouts for holding the first bus bar 242 when the position adjustment mechanism and/or jig described later is used to move the first bus bar 242.

如圖6及圖7所示,第1匯流條242係具有相較於第1匯流條242的延伸方向朝第1方向較長的長孔246。長孔246係沿著第1匯流條242的延伸方向設置複數個。另一方面,第2匯流條244係具有配置在對應長孔246的位置的第1規制構件247。第1規制構件247係用以規制第1匯流條242的第1方向的移動的構件。 As shown in FIG. 6 and FIG. 7 , the first bus bar 242 has a long hole 246 that is longer in the first direction than the extension direction of the first bus bar 242. A plurality of long holes 246 are provided along the extension direction of the first bus bar 242. On the other hand, the second bus bar 244 has a first regulating member 247 disposed at a position corresponding to the long hole 246. The first regulating member 247 is a member for regulating the movement of the first bus bar 242 in the first direction.

具體而言,第1規制構件247係具有當第1匯流條242朝遠離中央開口234a的方向移動時與長孔246的邊緣接觸的近位端247a。此外,第1規制構件247係具有當第1匯流條242朝接近中央開口234a的方向移動時與長孔246的邊緣接觸的遠位端247b。在本實施形態中,第1規制構件247係被固定在第2匯流條244之與第1匯流條242的對向面的螺栓,最接近螺栓的軸部的中央開口234a的部位成為近位端247a,最遠離螺栓的軸部的中央開口234a的部位成為遠位端247b。 Specifically, the first regulating member 247 has a proximal end 247a that contacts the edge of the long hole 246 when the first bus bar 242 moves in a direction away from the central opening 234a. In addition, the first regulating member 247 has a distal end 247b that contacts the edge of the long hole 246 when the first bus bar 242 moves in a direction close to the central opening 234a. In this embodiment, the first regulating member 247 is a bolt fixed to the surface of the second bus bar 244 facing the first bus bar 242, and the portion closest to the central opening 234a of the shaft of the bolt becomes the proximal end 247a, and the portion farthest from the central opening 234a of the shaft of the bolt becomes the distal end 247b.

第2匯流條244係具有用以將第1匯流條242推壓至第2匯流條244的壓縮線圈彈簧248。壓縮線圈彈簧248係配置在第1規制構件247亦即螺栓的頭部與第1匯流條242之間。第1規制構件247係對第2匯流條244予以固定,因此壓縮線圈彈簧248係將第1匯流條242朝第2匯流條244彈壓。 The second bus bar 244 has a compression coil spring 248 for pressing the first bus bar 242 toward the second bus bar 244. The compression coil spring 248 is disposed between the first regulating member 247, i.e., the head of the bolt, and the first bus bar 242. The first regulating member 247 fixes the second bus bar 244, so the compression coil spring 248 presses the first bus bar 242 toward the second bus bar 244.

如圖7所示,第1匯流條242係在與第2匯流條244的對向面具有形成為沿著第1方向延伸的突條部242b。藉由壓縮線圈彈簧248將第1匯流條242朝第2匯流條244推壓,藉此突條部242b與第2匯流條244相接觸。藉此,確保第1匯流條242與第2匯流條244的電性導通。此外,第1規制構件247及壓縮線圈彈簧248為導電性的構件,因此透過第1規制構件247及壓縮線圈彈簧248來確保第1匯流條242與第2匯流條244的電性導通。其中,突條部242b係沿著第1方向延伸,因此突條部242b並無法妨礙第1匯流條242沿著第1方向移動。 As shown in FIG. 7 , the first bus bar 242 has a protrusion 242b formed to extend in the first direction on the surface facing the second bus bar 244. The first bus bar 242 is pressed toward the second bus bar 244 by the compression coil spring 248, so that the protrusion 242b contacts the second bus bar 244. Thus, the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured. In addition, the first regulating member 247 and the compression coil spring 248 are conductive members, so the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured through the first regulating member 247 and the compression coil spring 248. The protrusion 242b extends along the first direction, so the protrusion 242b cannot hinder the first bus bar 242 from moving along the first direction.

在上述說明中係示出使用壓縮線圈彈簧248,將第1匯流條242朝第2匯流條244推壓,藉此確保第1匯流條242與第2匯流條244的電性導通之例,惟非限定於此。圖8至圖10係一實施形態之接觸構件的放大斜視圖。 In the above description, an example is shown in which the compression coil spring 248 is used to push the first bus bar 242 toward the second bus bar 244 to ensure electrical conduction between the first bus bar 242 and the second bus bar 244, but it is not limited to this. Figures 8 to 10 are enlarged oblique views of a contact member of an embodiment.

如圖8至圖10所示,第2匯流條244亦可包含在配置有第1規制構件247的區域被配置在第1匯流條242與第2匯流條244之間的盤形彈簧249,來取代 壓縮線圈彈簧248。盤形彈簧249係將第1匯流條242朝遠離第2匯流條244的方向彈壓。藉此,盤形彈簧249係將第1匯流條242推壓至第1規制構件247亦即螺栓的頭部。 As shown in FIGS. 8 to 10 , the second bus bar 244 may also include a disc spring 249 disposed between the first bus bar 242 and the second bus bar 244 in the area where the first regulating member 247 is disposed, to replace the compression coil spring 248. The disc spring 249 compresses the first bus bar 242 in a direction away from the second bus bar 244. Thus, the disc spring 249 pushes the first bus bar 242 to the first regulating member 247, i.e., the head of the bolt.

盤形彈簧249係導電性的構件,透過盤形彈簧249來確保第1匯流條242與第2匯流條244的電性導通。此外,第1規制構件247亦為導電性的構件,透過第1規制構件247來確保第1匯流條242與第2匯流條244的電性導通。其中,盤形彈簧249之與第1匯流條242的接觸面係朝第1方向延伸,因此盤形彈簧249並不妨礙第1匯流條242沿著第1方向移動。 The disc spring 249 is a conductive component, and the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured by the disc spring 249. In addition, the first regulating component 247 is also a conductive component, and the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured by the first regulating component 247. Among them, the contact surface of the disc spring 249 with the first bus bar 242 extends in the first direction, so the disc spring 249 does not hinder the first bus bar 242 from moving along the first direction.

圖11及圖12係一實施形態之位置調整機構的概略斜視圖。鍍覆裝置1000係包含構成為調整第1匯流條242對面板230的位置的位置調整機構290。位置調整機構290係配置在固定模組200。位置調整機構290係包含:用以把持第1匯流條242的臂292、用以使臂292朝第1方向移動的第1驅動構件298、及用以使臂292朝第1匯流條242的延伸方向及與第1方向呈正交的第2方向(鉛直方向)移動的第2驅動構件296。第1驅動構件298及第2驅動構件296係可藉由例如馬達、汽缸等周知的機構來實現。圖11係示出臂292未把持第1匯流條242的狀態,圖12係示出臂292把持第1匯流條242的狀態。 FIG. 11 and FIG. 12 are schematic perspective views of a position adjustment mechanism of an embodiment. The coating device 1000 includes a position adjustment mechanism 290 configured to adjust the position of the first bus bar 242 relative to the panel 230. The position adjustment mechanism 290 is disposed on the fixed module 200. The position adjustment mechanism 290 includes: an arm 292 for holding the first bus bar 242, a first driving member 298 for moving the arm 292 in a first direction, and a second driving member 296 for moving the arm 292 in an extending direction of the first bus bar 242 and in a second direction (vertical direction) orthogonal to the first direction. The first driving member 298 and the second driving member 296 can be implemented by a well-known mechanism such as a motor or a cylinder. FIG. 11 shows a state where the arm 292 does not hold the first bus bar 242, and FIG. 12 shows a state where the arm 292 holds the first bus bar 242.

圖13至圖18係一實施形態之接觸構件及位置調整機構的放大斜視圖。圖19係一實施形態之接觸構件的放大斜視圖。如圖13所示,第2匯流條244係具有第2規制構件241。第2規制構件241係用以規制第1匯流條242的第1方向的移動的構件。 Figures 13 to 18 are enlarged oblique views of a contact member and a position adjustment mechanism of an implementation form. Figure 19 is an enlarged oblique view of a contact member of an implementation form. As shown in Figure 13, the second bus bar 244 has a second regulating member 241. The second regulating member 241 is a member for regulating the movement of the first bus bar 242 in the first direction.

具體而言,第2規制構件241係具有在第1規制構件247的近位端247a與長孔246的邊緣接觸的狀態(圖17)下,規制第1匯流條242接近中央開口 234a的方向的移動的近位規制構件241a。此外,第2規制構件241係具有在第1規制構件247的遠位端247b與長孔246的邊緣接觸的狀態(圖15)之時,規制第1匯流條242遠離中央開口234a的方向的移動的遠位規制構件241b。 Specifically, the second regulating member 241 has a proximal regulating member 241a that regulates the movement of the first bus bar 242 in a direction close to the central opening 234a when the proximal end 247a of the first regulating member 247 is in contact with the edge of the long hole 246 (Figure 17). In addition, the second regulating member 241 has a distal regulating member 241b that regulates the movement of the first bus bar 242 in a direction away from the central opening 234a when the distal end 247b of the first regulating member 247 is in contact with the edge of the long hole 246 (Figure 15).

近位規制構件241a及遠位規制構件241b係藉由板狀彈簧所構成。近位規制構件241a及遠位規制構件241b係在未施加外力的平常時,存在於第1匯流條242的第1方向的移動路徑,與第1匯流條242接觸來規制移動。另一方面,近位規制構件241a及遠位規制構件241b係構成為若施加外力而朝第2匯流條244的方向被按壓時,不在第1匯流條242的第1方向的移動路徑,而解除第1匯流條242的移動的規制。 The proximal regulating member 241a and the distal regulating member 241b are formed by a plate spring. The proximal regulating member 241a and the distal regulating member 241b are located in the moving path of the first direction of the first bus bar 242 when no external force is applied, and contact the first bus bar 242 to regulate the movement. On the other hand, the proximal regulating member 241a and the distal regulating member 241b are configured so that if an external force is applied and they are pressed toward the second bus bar 244, they are not located in the moving path of the first direction of the first bus bar 242, and the movement of the first bus bar 242 is released.

臂292係包含用以按壓近位規制構件241a來解除第1匯流條242的移動的規制的近位按壓構件293。此外,臂292係包含用以按壓遠位規制構件241b來解除第1匯流條242的移動的規制的遠位按壓構件294。此外,臂292係包含嵌合在第1匯流條242的把持孔242a的把持部295。 The arm 292 includes a proximal pressing member 293 for releasing the movement regulation of the first bus bar 242 by pressing the proximal regulating member 241a. In addition, the arm 292 includes a distal pressing member 294 for releasing the movement regulation of the first bus bar 242 by pressing the distal regulating member 241b. In addition, the arm 292 includes a gripping portion 295 that is fitted into the gripping hole 242a of the first bus bar 242.

圖15係示出第1匯流條242移動至最接近中央開口234a的位置的狀態。在該狀態下,第1匯流條242的長孔246的邊緣接觸第1規制構件247的遠位端247b,因此第1匯流條242係規制接近中央開口234a的方向的移動。另一方面,在該狀態下,對第2規制構件241的遠位規制構件241b並未施加外力,遠位規制構件241b存在於第1匯流條242的第1方向的移動路徑,因此第1匯流條242係規制遠離中央開口234a的方向的移動。結果,第1匯流條242係被固定在最接近中央開口234a的位置。 FIG. 15 shows a state where the first bus bar 242 moves to the position closest to the central opening 234a. In this state, the edge of the long hole 246 of the first bus bar 242 contacts the distal end 247b of the first regulating member 247, so the first bus bar 242 regulates movement in the direction close to the central opening 234a. On the other hand, in this state, no external force is applied to the distal regulating member 241b of the second regulating member 241, and the distal regulating member 241b exists in the movement path of the first direction of the first bus bar 242, so the first bus bar 242 regulates movement in the direction away from the central opening 234a. As a result, the first bus bar 242 is fixed at the position closest to the central opening 234a.

圖16係示出臂292把持第1匯流條242的狀態。在該狀態下,臂292的遠位按壓構件294按壓遠位規制構件241b,藉此解除第1匯流條242遠離中央開 口234a的方向的移動的規制。此外,臂292的把持部295嵌合在第1匯流條242的把持孔242a。藉此,位置調整機構290的第1驅動構件298係可使第1匯流條242朝遠離中央開口234a的方向移動。 FIG. 16 shows a state where the arm 292 holds the first bus bar 242. In this state, the remote pressing member 294 of the arm 292 presses the remote regulating member 241b, thereby releasing the regulation of the movement of the first bus bar 242 away from the central opening 234a. In addition, the holding portion 295 of the arm 292 is engaged with the holding hole 242a of the first bus bar 242. Thus, the first driving member 298 of the position adjustment mechanism 290 can move the first bus bar 242 in a direction away from the central opening 234a.

圖17係示出第1匯流條242移動至最遠離中央開口234a的位置的狀態。在該狀態下,第1匯流條242的長孔246的邊緣接觸第1規制構件247的近位端247a,因此第1匯流條242係規制遠離中央開口234a的方向的移動。另一方面,在該狀態下,對第2規制構件241的近位規制構件241a並未施加外力,近位規制構件241a存在於第1匯流條242的第1方向的移動路徑,因此第1匯流條242係被規制接近中央開口234a的方向的移動。結果,第1匯流條242係被固定在離中心開口234a最遠的位置。 FIG. 17 shows a state where the first bus bar 242 moves to the position farthest from the central opening 234a. In this state, the edge of the long hole 246 of the first bus bar 242 contacts the proximal end 247a of the first regulating member 247, so the first bus bar 242 is regulated to move in a direction away from the central opening 234a. On the other hand, in this state, no external force is applied to the proximal regulating member 241a of the second regulating member 241, and the proximal regulating member 241a exists in the movement path of the first bus bar 242 in the first direction, so the first bus bar 242 is regulated to move in a direction close to the central opening 234a. As a result, the first bus bar 242 is fixed at the position farthest from the center opening 234a.

如以上所示,藉由本實施形態,可使第1匯流條242及饋電接點243,對第2匯流條244(框構件234)移動而固定在複數位置,因此可實現可對應饋電位置不同的各種種類的基板的基板固持器210。 As shown above, through this embodiment, the first bus bar 242 and the feeding contact 243 can be moved to the second bus bar 244 (frame member 234) and fixed at multiple positions, so that a substrate holder 210 that can correspond to various types of substrates with different feeding positions can be realized.

在上述說明中係示出使用位置調整機構290來使第1匯流條242移動之例,惟非限定於此。圖20至圖23係一實施形態之接觸構件及位置調整治具的概略斜視圖。 The above description shows an example of using the position adjustment mechanism 290 to move the first bus bar 242, but it is not limited to this. Figures 20 to 23 are schematic oblique views of a contact member and a position adjustment tool in an implementation form.

位置調整治具280係包含:沿著第1匯流條242延伸的治具本體281、設在治具本體281的延伸方向的端部的治具近位按壓構件285、及設在治具本體281的延伸方向的端部的治具遠位按壓構件284。治具近位按壓構件285係具有與上述近位按壓構件293相同的功能。亦即,治具近位按壓構件285係用以按壓近位規制構件241a來解除第1匯流條242的移動的規制的構件。此外,治具遠位按 壓構件284係具有與上述遠位按壓構件294相同的功能。亦即,治具遠位按壓構件284係用以按壓遠位規制構件241b來解除第1匯流條242的移動的規制的構件。 The position adjustment jig 280 includes a jig body 281 extending along the first bus bar 242, a jig proximal pressing member 285 provided at an end of the jig body 281 in the extending direction, and a jig distal pressing member 284 provided at an end of the jig body 281 in the extending direction. The jig proximal pressing member 285 has the same function as the proximal pressing member 293. That is, the jig proximal pressing member 285 is a member for pressing the proximal regulating member 241a to release the regulation of the movement of the first bus bar 242. In addition, the jig distal pressing member 284 has the same function as the distal pressing member 294. That is, the jig remote pressing member 284 is a member used to release the movement regulation of the first bus bar 242 by pressing the remote regulating member 241b.

如圖20及圖21所示,位置調整治具280係包含被配置在治具本體281的反中央開口234a側的第1爪構件282。此外,如圖22所示,位置調整治具280係包含被配置在治具本體281的中央開口234a側的第2爪構件283。 As shown in FIG. 20 and FIG. 21 , the position adjustment tool 280 includes a first claw member 282 disposed on the side opposite to the central opening 234a of the tool body 281. In addition, as shown in FIG. 22 , the position adjustment tool 280 includes a second claw member 283 disposed on the side of the central opening 234a of the tool body 281.

圖20係示出將第1爪構件282嵌入至第1匯流條242與第2匯流條244之間的間隙之前的狀態。圖21係示出將第1爪構件282嵌入至第1匯流條242與第2匯流條244之間的間隙的狀態。圖22係示出將第2爪構件283嵌入至第1匯流條242與第2匯流條244之間的間隙的狀態。 FIG. 20 shows a state before the first claw member 282 is embedded in the gap between the first bus bar 242 and the second bus bar 244. FIG. 21 shows a state after the first claw member 282 is embedded in the gap between the first bus bar 242 and the second bus bar 244. FIG. 22 shows a state after the second claw member 283 is embedded in the gap between the first bus bar 242 and the second bus bar 244.

如圖23所示,第1爪構件282及第2爪構件283係構成為當被嵌入至第1匯流條242與第2匯流條244之間的間隙時,使第1匯流條242稍微從第2匯流條244上浮。亦即,本實施形態之位置調整治具280係假想藉由上述壓縮線圈彈簧248將第1匯流條242朝第2匯流條244彈壓的情形。如圖23所示,藉由第1爪構件282及第2爪構件283使第1匯流條242稍微從第2匯流條244上浮,藉此使第1匯流條242對第2匯流條244的移動較為平順。其中,亦可未設置第1爪構件282及第2爪構件283。尤其,若採用盤形彈簧249來取代壓縮線圈彈簧248時,亦可未設置第1爪構件282及第2爪構件283。 As shown in FIG23, the first claw member 282 and the second claw member 283 are configured to slightly float the first bus bar 242 from the second bus bar 244 when they are inserted into the gap between the first bus bar 242 and the second bus bar 244. That is, the position adjustment tool 280 of the present embodiment is assumed to be a situation where the first bus bar 242 is pressed toward the second bus bar 244 by the compression coil spring 248. As shown in FIG23, the first bus bar 242 is slightly floated from the second bus bar 244 by the first claw member 282 and the second claw member 283, thereby making the movement of the first bus bar 242 to the second bus bar 244 smoother. The first claw member 282 and the second claw member 283 may not be provided. In particular, if the disc spring 249 is used to replace the compression coil spring 248, the first claw member 282 and the second claw member 283 may not be provided.

接著,說明基板裝設方法。圖24係一實施形態之基板裝設方法的流程圖。基板裝設方法係首先將基板固持器210儲放在固定模組200(步驟S101)。此時,基板固持器210係以底板220成為下、面板230成為上的方式配置在固定模組200。 Next, the substrate installation method is described. FIG. 24 is a flow chart of a substrate installation method in an implementation form. The substrate installation method first stores the substrate holder 210 in the fixed module 200 (step S101). At this time, the substrate holder 210 is arranged in the fixed module 200 in such a way that the bottom plate 220 is at the bottom and the panel 230 is at the top.

接著,基板裝設方法係使用鎖定機構270來解除基板固持器210的鎖定(步驟S102)。接著,基板裝設方法係將面板230朝上方舉起(步驟S103)。接著,基板裝設方法係將位置調整機構290的臂292插入在底板220與面板230之間(步驟S104)。 Next, the substrate installation method uses the locking mechanism 270 to unlock the substrate holder 210 (step S102). Next, the substrate installation method lifts the panel 230 upward (step S103). Next, the substrate installation method inserts the arm 292 of the position adjustment mechanism 290 between the bottom plate 220 and the panel 230 (step S104).

接著,基板裝設方法係使用臂292來把持第1匯流條242,而使第1匯流條242移動(步驟S105)。例如,步驟S105係按照基板WF的饋電位置的規格,使第1匯流條242移動至最接近中央開口234a的位置、或最遠離中央開口234a的位置。接著,基板裝設方法係使臂292從底板220與面板230之間退避(步驟S106)。 Next, the substrate installation method is to use the arm 292 to hold the first bus bar 242 and move the first bus bar 242 (step S105). For example, step S105 is to move the first bus bar 242 to the position closest to the central opening 234a or the position farthest from the central opening 234a according to the specification of the feeding position of the substrate WF. Next, the substrate installation method is to make the arm 292 retreat from between the bottom plate 220 and the panel 230 (step S106).

接著,基板裝設方法係將基板WF設置在底板220的上表面(步驟S107)。接著,基板裝設方法係使面板230下降,而以底板220與面板230夾持基板WF(步驟S108)。 Next, the substrate installation method is to place the substrate WF on the upper surface of the bottom plate 220 (step S107). Next, the substrate installation method is to lower the panel 230 and clamp the substrate WF with the bottom plate 220 and the panel 230 (step S108).

接著,基板裝設方法係使用鎖定機構270來鎖定基板固持器210(步驟S109)。藉此,基板WF係被夾持在基板固持器210。接著,基板裝設方法係從固定模組200搬出基板固持器210(步驟S110)。 Next, the substrate installation method uses the locking mechanism 270 to lock the substrate holder 210 (step S109). Thereby, the substrate WF is clamped in the substrate holder 210. Next, the substrate installation method removes the substrate holder 210 from the fixed module 200 (step S110).

藉由本實施形態之基板裝設方法,可使第1匯流條242及饋電接點243,對第2匯流條244(框構件234)移動而固定在複數位置,因此可對應饋電位置不同的各種種類的基板。 By using the substrate installation method of this embodiment, the first bus bar 242 and the feeding contact 243 can be moved to the second bus bar 244 (frame member 234) and fixed at multiple positions, so it can correspond to various types of substrates with different feeding positions.

以上說明了若干本發明之實施形態,惟上述發明的實施形態係用以易於理解本發明者,並非為限定本發明者。本發明可在未脫離其要旨的情形下變更、改良,並且在本發明係包含其等效物,自不待言。此外,可在可解決上述課題的至少一部分的範圍、或達成效果的至少一部分的範圍中,進行申請專利範圍及說明書所記載的各構成元件的任意組合、或省略。 The above describes some implementation forms of the present invention, but the implementation forms of the present invention are used to facilitate the understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from its gist, and it goes without saying that the present invention includes its equivalents. In addition, any combination or omission of the components described in the scope of the patent application and the specification can be carried out within the scope of solving at least part of the above-mentioned problems or achieving at least part of the effects.

以一實施形態而言,本案係揭示一種基板固持器,其係包含:底板;面板,其係用以連同前述底板一起夾著基板進行保持的面板,具有中央開口及包圍前述中央開口的框構件;及接觸構件,其係具有:可對前述框構件移動地被安裝在前述框構件的第1匯流條、及被安裝在前述第1匯流條的饋電接點。 In one embodiment, the present invention discloses a substrate holder, which includes: a bottom plate; a panel, which is used to hold the substrate together with the bottom plate, and has a central opening and a frame member surrounding the central opening; and a contact member, which has: a first bus bar movably mounted on the frame member, and a feeding contact mounted on the first bus bar.

此外,以一實施形態而言,本案係揭示一種基板固持器,其中,前述中央開口係形成為矩形,前述接觸構件係夾著矩形的前述中央開口而以一對被安裝在前述框構件、或以包圍矩形的前述中央開口的方式被安裝在前述框構件的4邊。 In addition, in one embodiment, the present case discloses a substrate holder, wherein the central opening is formed into a rectangle, and the contact member is mounted on the frame member in a pair with the rectangular central opening sandwiched therebetween, or is mounted on the four sides of the frame member in a manner of surrounding the rectangular central opening.

此外,以一實施形態而言,本案係揭示一種基板固持器,其中,前述接觸構件係另外包含:被固定在前述框構件的第2匯流條,前述第1匯流條係可對前述第2匯流條移動地被安裝在前述第2匯流條。 In addition, in one embodiment, the present invention discloses a substrate holder, wherein the contact member further comprises: a second bus bar fixed to the frame member, and the first bus bar is mounted on the second bus bar so as to be movable relative to the second bus bar.

此外,以一實施形態而言,本案係揭示一種基板固持器,其中,前述第1匯流條係構成為可朝對前述中央開口接近及遠離的第1方向移動,前述第2匯流條係具有:導引構件,該導引構件係配置在前述第1匯流條的延伸方向的兩端的導引構件,且用以將前述第1匯流條的移動方向規制為前述第1方向。 In addition, in one embodiment, the present invention discloses a substrate holder, wherein the first bus bar is configured to be movable in a first direction approaching and moving away from the central opening, and the second bus bar has a guide member disposed at both ends of the extension direction of the first bus bar and used to control the movement direction of the first bus bar to the first direction.

此外,以一實施形態而言,本案係揭示一種基板固持器,其中,前述第1匯流條係具有相較於前述第1匯流條的延伸方向朝前述第1方向較長的長孔,前述第2匯流條係具有:第1規制構件,其係配置在對應前述長孔的位置的第1規制構件,且具有:當前述第1匯流條朝遠離前述中央開口的方向移動時與前述長孔的邊緣接觸的近位端、及當前述第1匯流條朝接近前述中央開口的方向移動時與前述長孔的邊緣接觸的遠位端。 In addition, in one embodiment, the present invention discloses a substrate holder, wherein the first bus bar has a long hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has: a first regulating member that is arranged at a position corresponding to the long hole and has: a proximal end that contacts the edge of the long hole when the first bus bar moves in a direction away from the central opening, and a distal end that contacts the edge of the long hole when the first bus bar moves in a direction close to the central opening.

此外,以一實施形態而言,本案係揭示一種基板固持器,其中,前述第2匯流條係具有:第2規制構件,該第2規制構件係具有:在前述第1規制構件的前述近位端與前述長孔的邊緣接觸的狀態下,規制前述第1匯流條接近前述中央開口的方向的移動的近位規制構件;及當前述第1規制構件的前述遠位端與前述長孔的邊緣接觸的狀態之時,規制前述第1匯流條遠離前述中央開口的方向的移動的遠位規制構件。 In addition, in one embodiment, the present invention discloses a substrate holder, wherein the second bus bar has a second regulating member, the second regulating member having a proximal regulating member for regulating the movement of the first bus bar in a direction close to the central opening when the proximal end of the first regulating member contacts the edge of the long hole; and a distal regulating member for regulating the movement of the first bus bar in a direction away from the central opening when the distal end of the first regulating member contacts the edge of the long hole.

此外,以一實施形態而言,本案係揭示一種鍍覆裝置,其係包含:上述任一者所記載之基板固持器;及位置調整機構,其係構成為調整前述第1匯流條對前述面板的位置。 In addition, in one embodiment, the present case discloses a coating device, which includes: a substrate holder as described in any one of the above; and a position adjustment mechanism, which is configured to adjust the position of the first bus bar relative to the panel.

此外,以一實施形態而言,本案係揭示一種鍍覆裝置,其中,前述位置調整機構係包含:用以把持前述第1匯流條的臂;用以使前述臂朝對前述中央開口接近及遠離的第1方向移動的第1驅動構件;及用以使前述臂朝前述第1匯流條的延伸方向及與前述第1方向呈正交的第2方向移動的第2驅動構件。 In addition, in one embodiment, the present case discloses a coating device, wherein the position adjustment mechanism comprises: an arm for holding the first bus bar; a first driving member for moving the arm toward a first direction approaching and moving away from the central opening; and a second driving member for moving the arm toward an extension direction of the first bus bar and a second direction orthogonal to the first direction.

此外,以一實施形態而言,本案係揭示一種鍍覆裝置,其中,前述臂係包含:用以按壓前述近位規制構件來解除前述第1匯流條的移動的規制的近位按壓構件、及用以按壓前述遠位規制構件來解除前述第1匯流條的移動的規制的遠位按壓構件。 In addition, in one embodiment, the present invention discloses a coating device, wherein the arm includes: a proximal pressing member for pressing the proximal regulating member to release the regulation of the movement of the first bus bar, and a distal pressing member for pressing the distal regulating member to release the regulation of the movement of the first bus bar.

210:基板固持器 210:Substrate holder

230:面板 230: Panel

234:框構件 234: Frame components

234a:中央開口 234a: Central opening

240:接觸構件 240: Contact components

242:第1匯流條 242: Busbar 1

243:饋電接點 243: Feedback contact

244:第2匯流條 244: Busbar No. 2

245:導引構件 245: Guiding component

Claims (7)

一種基板固持器,其係包含: 底板; 面板,其係用以連同前述底板一起夾著基板進行保持的面板,具有中央開口及包圍前述中央開口的框構件;及 接觸構件,其係具有:可對前述框構件移動地被安裝在前述框構件的第1匯流條、及被安裝在前述第1匯流條的饋電接點; 其中,前述中央開口係形成為矩形, 前述接觸構件係夾著矩形的前述中央開口而以一對被安裝在前述框構件、或以包圍矩形的前述中央開口的方式被安裝在前述框構件的4邊, 其中,前述接觸構件係另外包含:被固定在前述框構件的第2匯流條, 前述第1匯流條係可對前述第2匯流條移動地被安裝在前述第2匯流條。 A substrate holder, comprising: a bottom plate; a panel, which is used to hold a substrate together with the bottom plate, and has a central opening and a frame member surrounding the central opening; and a contact member, which has: a first bus bar mounted on the frame member movably relative to the frame member, and a feeder contact mounted on the first bus bar; wherein the central opening is formed in a rectangular shape, the contact member is mounted on the frame member in a pair with the rectangular central opening, or is mounted on the four sides of the frame member in a manner of surrounding the rectangular central opening, wherein the contact member further comprises: a second bus bar fixed to the frame member, The first bus bar is mounted on the second bus bar so as to be movable relative to the second bus bar. 如請求項1之基板固持器,其中,前述第1匯流條係構成為可朝對前述中央開口接近及遠離的第1方向移動, 前述第2匯流條係具有:導引構件,該導引構件係配置在前述第1匯流條的延伸方向的兩端的導引構件,且用以將前述第1匯流條的移動方向規制為前述第1方向。 The substrate holder of claim 1, wherein the first bus bar is configured to be movable in a first direction toward and away from the central opening, and the second bus bar has a guide member disposed at both ends of the extension direction of the first bus bar and used to control the movement direction of the first bus bar to the first direction. 如請求項2之基板固持器,其中,前述第1匯流條係具有相較於前述第1匯流條的延伸方向朝前述第1方向較長的長孔, 前述第2匯流條係具有:第1規制構件,其係配置在對應前述長孔的位置的第1規制構件,且具有:當前述第1匯流條朝遠離前述中央開口的方向移動時與前述長孔的邊緣接觸的近位端、及當前述第1匯流條朝接近前述中央開口的方向移動時與前述長孔的邊緣接觸的遠位端。 The substrate holder of claim 2, wherein the first bus bar has a long hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has: a first regulating member, which is a first regulating member arranged at a position corresponding to the long hole, and has: a proximal end that contacts the edge of the long hole when the first bus bar moves in a direction away from the central opening, and a distal end that contacts the edge of the long hole when the first bus bar moves in a direction close to the central opening. 如請求項3之基板固持器,其中,前述第2匯流條係具有:第2規制構件,該第2規制構件係具有:在前述第1規制構件的前述近位端與前述長孔的邊緣接觸的狀態下,規制前述第1匯流條接近前述中央開口的方向的移動的近位規制構件;及當前述第1規制構件的前述遠位端與前述長孔的邊緣接觸的狀態之時,規制前述第1匯流條遠離前述中央開口的方向的移動的遠位規制構件。A substrate holder as claimed in claim 3, wherein the second bus bar comprises: a second regulating member, which comprises: a proximal regulating member for regulating the movement of the first bus bar in a direction approaching the central opening when the proximal end of the first regulating member is in contact with the edge of the long hole; and a distal regulating member for regulating the movement of the first bus bar in a direction away from the central opening when the distal end of the first regulating member is in contact with the edge of the long hole. 一種鍍覆裝置,其係包含: 如請求項1~4中任一項之基板固持器;及 位置調整機構,其係構成為調整前述第1匯流條對前述面板的位置。 A coating device, comprising: A substrate holder as in any one of claims 1 to 4; and A position adjustment mechanism configured to adjust the position of the first bus bar relative to the panel. 如請求項5之鍍覆裝置,其中,前述位置調整機構係包含:用以把持前述第1匯流條的臂;用以使前述臂朝對前述中央開口接近及遠離的第1方向移動的第1驅動構件;及用以使前述臂朝前述第1匯流條的延伸方向及與前述第1方向呈正交的第2方向移動的第2驅動構件。A coating device as claimed in claim 5, wherein the position adjustment mechanism comprises: an arm for holding the first bus bar; a first driving member for moving the arm in a first direction approaching and away from the central opening; and a second driving member for moving the arm in an extension direction of the first bus bar and in a second direction orthogonal to the first direction. 一種鍍覆裝置,其係包含: 如請求項4之基板固持器;及 位置調整機構,其係構成為調整前述第1匯流條對前述面板的位置, 前述位置調整機構係包含:用以把持前述第1匯流條的臂;用以使前述臂朝對前述中央開口接近及遠離的第1方向移動的第1驅動構件;及用以使前述臂朝前述第1匯流條的延伸方向及與前述第1方向呈正交的第2方向移動的第2驅動構件, 前述臂係包含:用以按壓前述近位規制構件來解除前述第1匯流條的移動的規制的近位按壓構件、及用以按壓前述遠位規制構件來解除前述第1匯流條的移動的規制的遠位按壓構件。 A coating device, comprising: A substrate holder as claimed in claim 4; and A position adjustment mechanism, which is configured to adjust the position of the first bus bar relative to the panel, The position adjustment mechanism comprises: an arm for holding the first bus bar; a first driving member for moving the arm toward a first direction approaching and away from the central opening; and a second driving member for moving the arm toward an extension direction of the first bus bar and a second direction orthogonal to the first direction, The arm comprises: a proximal pressing member for pressing the proximal regulating member to release the regulation of the movement of the first bus bar, and a distal pressing member for pressing the distal regulating member to release the regulation of the movement of the first bus bar.
TW113102680A 2024-01-24 2024-01-24 Substrate holder and coating device TWI889165B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000003074A1 (en) 1998-07-10 2000-01-20 Ebara Corporation Plating device
US20190084777A1 (en) * 2016-03-22 2019-03-21 Ebara Corporation Substrate holder and plating apparatus
US20190390360A1 (en) * 2018-06-21 2019-12-26 Ebara Corporation Plating apparatus and plating method
TW202333293A (en) * 2018-06-27 2023-08-16 日商荏原製作所股份有限公司 Substrate holder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000003074A1 (en) 1998-07-10 2000-01-20 Ebara Corporation Plating device
US20190084777A1 (en) * 2016-03-22 2019-03-21 Ebara Corporation Substrate holder and plating apparatus
US20190390360A1 (en) * 2018-06-21 2019-12-26 Ebara Corporation Plating apparatus and plating method
TW202333293A (en) * 2018-06-27 2023-08-16 日商荏原製作所股份有限公司 Substrate holder

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