TWI888256B - Testing processing equipment - Google Patents

Abstract

The testing processing equipment has a supply device, a collection device, and a testing device. The testing device includes a moving mechanism, a detecting mechanism, a first testing mechanism, and a second testing mechanism. The moving mechanism picks up plural round-shaped electronic components from the supply device and moves them through the detecting mechanism located at the moving path. The positions of the electronic components are imaged by the detecting mechanism so that the moving mechanism can insert the electronic components into the first testing members of the first testing mechanism precisely. The first testing members undergoes a first test on the electronic components, and further moves them to the second testing members of the second testing mechanism for the second test.

Description

Testing equipment

The present invention provides a testing operation equipment for improving testing accuracy and production efficiency.

Nowadays, electronic components with light emitting diodes (LEDs) have been widely used in various electronic devices, such as display devices or small-sized lamps. Depending on the work requirements, the types of electronic components are diverse, such as square, semicircular or full-circular. Please refer to Figure 1, the electronic component 10 is full-circular, with a plurality of LEDs 11 embedded on the top surface, and a plurality of contacts 12 and calibration points 13 on the bottom surface. Since the electronic component 10 undergoes multiple processing steps, in order to ensure product quality, the electronic component 10 must perform electrical testing and optical testing operations. Therefore, a large number of precisely tiny round electronic components 10 are carried on a tray or a carrier (not shown) to a testing device (not shown). However, under the condition that the electronic component 10 is round, the tray or the carrier cannot limit the deviation and rotation of the electronic component 10. , causing the fully circular electronic component 10 to rotate inside the carrier during the process of transporting the electronic component 10 to the test device, so that the angular position of the calibration point 13 of the electronic component 10 does not conform to the preset test angular position, that is, it cannot conform to the test angular position of the test socket of the test device, resulting in that the contact 12 of the fully circular electronic component 10 cannot be accurately aligned to contact the transmission component of the test socket, thereby affecting the test accuracy.

The first object of the present invention is to provide a testing operation equipment, including a machine, a feeding device , a receiving device, a testing device and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating a plurality of electronic components to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating a plurality of electronic components that have been tested; the testing device is arranged on the machine and is provided with at least one material transfer mechanism, at least one detection mechanism, at least one first testing mechanism and at least one second testing mechanism , at least one material transfer mechanism can transfer and place multiple electronic components in the material feeding device or/and the material receiving device, at least one detection mechanism can take the multiple electronic components transferred by the material transfer mechanism and detect the placement angle to improve the test accuracy, at least one first test mechanism can hold the multiple electronic components to be tested moved by the material transfer mechanism and perform a first test operation on the multiple electronic components, at least one second test mechanism and one of the first test mechanism are displaced toward the other, and the second test mechanism can perform a second test operation on the multiple electronic components of the first test mechanism; the central control device controls and integrates the actions of each device to perform automated operations.

The second object of the present invention is to provide a testing operation equipment, wherein the first testing mechanism of the testing device is equipped with a plurality of first testers, and at least one material moving mechanism includes a first material moving mechanism, a second material moving mechanism and a third material moving mechanism. The first material moving mechanism can move the electronic components to be tested of the feeding device into the second material moving mechanism, and the second material moving mechanism can move the plurality of electronic components to be tested from the feeding position to the picking position of the second path along the first path. The third material moving mechanism can take out the plurality of electronic components to be tested from the second material moving mechanism at the picking position, and move them along the second path to the detection mechanism and the plurality of first testers of the first testing mechanism, thereby shortening the test action sequence to improve production efficiency.

The third object of the present invention is to provide a testing operation equipment, wherein the first testing mechanism of the testing device includes a first driver, a second driver, a movable seat and a plurality of first testers, the plurality of first testers are respectively configured with an electrically connected first circuit board and a first testing seat with a first transmission component, the first and second drivers can drive the movable seat to carry the plurality of first testers and the plurality of electronic components to move in the Y-Z direction toward the plurality of second testers of the second testing mechanism, so that the plurality of first testers can not only perform the first testing operation on the plurality of electronic components, but also enable the plurality of electronic components to perform the second testing operation on the plurality of second testers, thereby improving the testing throughput.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to Figures 2 and 3. The testing operation equipment of the present invention includes a machine 20, a feeding device 30, a receiving device 40, a testing device 50 and a central control device (not shown). The central control device is used to control and integrate the actions of various devices to perform automated operations.

The feeding device 30 is mounted on the machine 20 and is provided with at least one feeder to accommodate a plurality of electronic components to be tested; in this embodiment, the feeder of the feeding device 30 holds a plurality of fully round electronic components 60 to be tested. The receiving device 40 is mounted on the machine 20 and is provided with at least one receiver to accommodate a plurality of electronic components that have been tested; in this embodiment, the receiver of the receiving device 40 holds a plurality of electronic components that have been tested.

The testing device 50 is disposed on the machine 20, and includes at least one material transfer mechanism, at least one detection mechanism, at least one first testing mechanism, and at least one second testing mechanism.

At least one material transfer mechanism can take out a plurality of electronic components 60 to be tested from the material feeding device 30 , or take in and place a plurality of electronic components 60 to be tested and tested from the material feeding device 30 and the material receiving device 40.

According to the operation requirements, at least one material moving mechanism includes a first material moving mechanism, a second material moving mechanism and a third material moving mechanism. The first material moving mechanism can take out a plurality of electronic components 60 to be tested from the feeding device 30, the second material moving mechanism can carry the plurality of electronic components 60 moved in by the first material moving mechanism in the first path A1 and transport them to the second path A2, and the third material moving mechanism can transfer a plurality of electronic components 60 between the second material moving mechanism, the detection mechanism and the first testing mechanism along the second path A2.

Based on the above, at least one material moving mechanism further includes a fourth material moving mechanism, a fifth material moving mechanism and a sixth material moving mechanism. The fourth material moving mechanism can take out the multiple electronic components 60 that have been tested from the first testing mechanism along the second path A2. The fifth material moving mechanism can carry the multiple electronic components 60 that have been tested moved in by the fourth material moving mechanism along the second path A2, and move and transport the multiple electronic components 60 that have been tested along the third path A3. The sixth material moving mechanism can transfer the multiple electronic components 60 that have been tested between the fifth material moving mechanism and the material receiving device 40.

In this embodiment, the at least one material moving mechanism includes a first material moving mechanism, a second material moving mechanism, a third material moving mechanism, a fourth material moving mechanism, a fifth material moving mechanism, and a sixth material moving mechanism.

The first material transfer mechanism is provided with a first material transfer device 51 which is displaced in the X-Y-Z direction and has a plurality of picking parts. The picking parts are used to pick up and place electronic components 60. The first material transfer device 51 can take out a plurality of full-circular electronic components 60 from the feeder of the feeding device 30.

The second material transfer mechanism is provided with at least one second material transfer device 52 having a plurality of second bearing grooves for receiving a plurality of electronic components 60 to be tested. The second material transfer device 52 can be moved along the first path A1 from the feeding position to the second path A2 from the material taking position. In this embodiment, the second material transfer device 52 can be reciprocated in the Y direction along the first path A1 between the feeding position of the first path A1 and the material taking position of the second path A2.

The third material moving mechanism is provided with a third material mover 53 which can be displaced in the X-Z direction along the second path A2 and has a plurality of picking parts. The picking parts are used to pick up and place the electronic components 60. The third material mover 53 can take out a plurality of fully circular electronic components 60 to be tested from the second material mover 52. Furthermore, the third material mover 53 is provided with a plurality of adjusting tools 531. The adjusting tools 531 can adjust the angular position of the electronic component 60 to be tested through the picking parts. The adjusting tool 531 can include a motor and a direct-coupled shaft or a motor and a transmission group, and the direct-coupled shaft or the transmission group drives the picking parts to rotate at an angle to adjust the angular position of the electronic component 60 to meet the preset test angle, which is not limited to this embodiment. According to the operation requirements, the adjustment device 531 can drive the pick-up piece and the electronic component 60 to make fine adjustments in the X-Y direction.

The fourth material transfer mechanism is provided with a fourth material transfer device 54 which can be displaced in the X-Z direction along the second path A2 and has a plurality of picking parts. The picking parts are used to pick up and place the electronic components 60. The fourth material transfer device 54 can take out a plurality of tested and fully circular electronic components 60 from the first testing mechanism and transfer them to the placing position of the second path A2.

The fifth material transfer mechanism is provided with at least one fifth material transfer device 55 having a plurality of fifth supporting grooves for supporting a plurality of electronic components 60 that have been measured. The fifth material transfer device 55 can be moved from the discharge position of the second path A2 along the third path A3 to the discharge position; in this embodiment, the fifth material transfer device 55 can be reciprocated in the Y direction along the third path A3 between the discharge position of the second path A2 and the discharge position of the third path A3.

The sixth material transfer mechanism is provided with a sixth material transfer device 56 which can be displaced in the X-Y-Z direction and has a plurality of picking parts. The picking parts are used to pick up and place electronic components 60. The sixth material transfer device 56 can pick up and place a plurality of measured full-circular electronic components 60 between the fifth material transfer device 55 and the material receiving device 40.

At least one detection mechanism is capable of capturing images of multiple electronic components 60 of at least one material transfer mechanism. Furthermore, the detection mechanism is provided with at least one imager in the second path A2 between the third material transfer mechanism and the first test mechanism, which is capable of capturing images of multiple electronic components 60 to be tested transferred by the third material transfer mechanism. In this embodiment, the detection mechanism is provided with multiple imagers 57 in the second path A2, and the multiple imagers 57 are located between the material transfer position and the first test mechanism, and capture images of the full-circular electronic components 60 to be tested transferred by the third material transfer mechanism 53 from bottom to top, and the image data is transmitted to a processor (not shown) for analysis and determination of whether the placement angle of the electronic component 60 to be tested meets the preset test angle. Even better, it can detect whether the appearance and contacts of electronic components are damaged, dirty, etc.

The first testing mechanism is provided with a plurality of first testers for performing a first testing operation on a plurality of electronic components 60, and the second testing mechanism is provided with a plurality of second testers. One of the plurality of second testers and the plurality of first testers is displaced toward the other side so that the plurality of second testers perform a second testing operation on the plurality of electronic components 60 of the plurality of first testers.

The first testing mechanism includes a first driver, a second driver, a movable seat and a plurality of first testers. The first driver and the second driver can drive the movable seat to carry the plurality of first testers to move in the Y-Z direction toward the plurality of second testers of the second testing mechanism. The first tester is provided with an electrically connected first circuit board and a first testing seat with a first transmission component for holding and testing the electronic component 60.

In this embodiment, the first test mechanism is provided with a first actuator 581 arranged in the Y direction on the second path A2, and the driving stroke of the first actuator 581 includes the stroke from the second path A2 to the second test mechanism. The second actuator 582 is arranged on the first actuator 581 in the Z direction, and can be driven by the first actuator 581 to move in the Y direction. However, according to the operation requirements, the first actuator 581 and the second actuator 582 can be interchanged, which is not limited to this embodiment. The movable seat 583 is mounted on the second actuator 582, and can be driven by the second actuator 582 to move in the Z direction. A plurality of first testers are mounted on the movable seat 583, and can be driven by the first actuator 581 and the second actuator 582 to move in the Y-Z direction. Each first tester is provided with an electrically connected first circuit board 5841 and a first test seat 5842 with a first transmission component 5843. The first test seat 5842 is used to hold the electronic component 60 to perform the first test operation. According to the operation requirements, the first test seat 5842 is provided with at least one second transmission component 5844 electrically connected to the first circuit board 5841, and an electrically connected second circuit board 5845 and a third transmission component 5846 are provided on the bottom surface of the substrate 591 of the second test mechanism. When the first tester and the substrate 591 are relatively displaced, the third transmission component 5846 can be electrically connected to the second transmission component 5844. In addition, a plurality of exhaust parts 5831 are provided on the movable seat 583. The plurality of exhaust parts 5831 are connected to the plurality of first test seats 5842 and can respectively suck or release the electronic components 60 of the first test seats 5842.

The second test mechanism is provided with a substrate 591, and the substrate 591 has a height difference with the first tester. The substrate 591 is provided with a plurality of through holes 5911, and a plurality of second testers, which are integrating spheres 592, are mounted on the plurality of through holes 5911, so that the electronic components 60 on the first tester can communicate with the inside of the integrating sphere 592, so as to perform the second test operation.

Please refer to FIG. 2, FIG. 4 to FIG. 8. The testing operation equipment of the present invention is applied to test a fully circular electronic component 60. The top surface of the fully circular electronic component 60 (as shown in FIG. 7) is embedded with a plurality of LEDs 61, and the bottom surface is provided with a plurality of contacts 62 and calibration points. The testing operation equipment of the present invention can perform a first test operation of an electrical test and a second test operation of an optical test on the fully circular electronic component 60.

The first material mover 51 of the testing device is displaced in the X-Y-Z direction to take out a plurality of fully circular electronic components 60 to be tested from the feeding device 30, and is moved into the second material mover 52 located at the feeding position of the first path A1; the second material mover 52 is displaced in the Y direction from the feeding position along the first path A1 to the picking position of the second path A2; the third material mover 53 is displaced in the X-Z direction along the second path A2 to the picking position, and takes out a plurality of electronic components 60 to be tested from the second material mover 52.

The third material mover 53 transfers the electronic component 60 to be tested along the second path A2 to pass through the imager 57 of the detection mechanism. The imager 57 images the bottom surface of the fully circular electronic component 60 to be tested from bottom to top, and transmits the image data to a processor (not shown) for analysis and determination of whether the placement angle of the electronic component 60 meets the preset test angle. Since the third material mover 53 is equipped with a plurality of adjusters 531, the angle of the electronic component 60 to be tested can be adjusted individually according to the image data to meet the preset test angle. The third material mover 53 moves a plurality of electronic components 60 adjusted to the correct angular position into the first test seat 5842 of the first tester, and uses a plurality of vacuum parts 5831 of the movable seat 583 to suck the electronic components 60 into position, so that the contacts 61 of the electronic components 60 can effectively electrically contact the first transmission component 5843 of the first test seat 5842.

The first driver 581 and the second driver 582 of the first test mechanism drive the movable seat 583, the plurality of first test seats 5842 and the plurality of electronic components 60 to be tested to move in the Y-Z direction to the bottom of the substrate 591 of the second test mechanism, and move from the bottom to the top of the substrate 591, so that the electronic component 60 of the first test seat 5842 is located at the bottom of the through hole 5911 of the substrate 591, and the second transmission component 5844 is electrically contacted with the third transmission component 5846 of the second circuit board 5845. Since the LED 62 on the top surface of the electronic component 60 is relative to the inside of the integrating sphere 592, under the condition that the angular position of the electronic component 60 is correct, a first test operation of an electrical test and a second test operation of an optical test can be accurately performed on the first test seat 5842.

After the test is completed, the first driver 581 and the second driver 582 drive the movable seat 583 and the plurality of tested electronic components 60 to make a reverse displacement in the Y-Z direction to the second path A2, the fourth material transfer device 54 is displaced in the X-Z direction along the second path A2 to take out the plurality of tested electronic components 60 from the plurality of first test seats 5842, and is moved into the fifth material transfer device 55 located at the discharge position of the second path A2, the fifth material transfer device 55 carries the plurality of tested electronic components 60 and is displaced in the Y direction from the discharge position to the discharge position along the third path A3, so as to allow the sixth material transfer device 56 to take out the plurality of tested electronic components 60, the sixth material transfer device 56 is displaced in the X-Y-Z direction and transfers the plurality of tested electronic components 60 to the receiving device 40 for storage according to the test results.

[Knowledge] Electronic component 10 LED 11 Contact 12 Calibration point 13 [Invention] Machine 20 Feeding device 30 Receiving device 40 Testing device 50 First material mover 51 Second material mover 52 Third material mover 53 Adjustment tool 531 Fourth material mover 54 Fifth material mover 55 Sixth material mover 56 Imager 57 First driver 581 Second driver 582 Movable seat 583 Vacuum unit 5831 First circuit board 5841 First test seat 5842 First transmission member 5843 Second transmission member 5844 Second circuit board 5845 Third transmission member 5846 Substrate 591 Through hole 5911 Integral sphere 592 Electronic component 60 LED 61 Contact 62 First path A1 Second path A2 Third path A3

Figure 1: Schematic diagram of a conventional fully circular electronic component. Figure 2: Configuration diagram of the test equipment of the present invention. Figure 3: Schematic diagram of the test device. Figures 4 to 8: Schematic diagrams of the use of the test equipment.

20: Machine

30: Feeding device

40: Material receiving device

50:Testing equipment

51: First material transfer device

52: Second material transfer device

53: The third material transfer device

531: Adjustment tool

54: The fourth material transfer device

55: The fifth material transfer device

56: Sixth material transfer device

57: Imager

581: First drive

582: Second drive

583: Movable seat

5842: First test seat

591:Substrate

592: Points

60: Electronic components

A1: First path

A2: Second path

A3: The third path

Claims (8)

A testing operation equipment, comprising: a machine; a feeding device: arranged on the machine, and provided with at least one feeder for accommodating a plurality of electronic components to be tested; a receiving device: arranged on the machine, and provided with at least one receiving device for accommodating a plurality of the tested electronic components; a testing device: arranged on the machine, and comprising at least one material transfer mechanism, at least one detection mechanism, at least one first testing mechanism and at least one second testing mechanism, wherein the at least one material transfer mechanism comprises a first material transfer mechanism , a second material transfer mechanism and a third material transfer mechanism, the first material transfer mechanism can pick up and place the plurality of electronic components on the feeding device or/and the receiving device, the second material transfer mechanism can carry the plurality of electronic components to be tested moved in by the first material transfer mechanism on the first path and transport them to the second path, the third material transfer mechanism can transfer the plurality of electronic components between the second material transfer mechanism, the detection mechanism and the first testing mechanism along the second path, and at least one third material transfer device having a plurality of pick-up parts and a plurality of adjusters is provided , so that the plurality of pick-up parts can take out the plurality of electronic components to be tested from the second material transfer mechanism, and the plurality of adjustment devices can be used to adjust the angular position of the plurality of electronic components to be tested. The at least one detection mechanism is provided with at least one imager in the second path between the third material transfer mechanism and the first testing mechanism, which can capture the plurality of electronic components to be tested transferred by the third material transfer mechanism. The first testing mechanism is provided with a plurality of first testers to perform a first testing operation on the plurality of electronic components. The second testing mechanism is provided with a plurality of second testers. One of the plurality of second testers and the plurality of first testers is displaced toward the other, so that the plurality of second testers can perform a second testing operation on the plurality of electronic components of the plurality of first testers. Central control device: used to control and integrate the actions of various devices to perform automated operations. As described in claim 1, the second material transfer mechanism of the testing operation equipment is provided with at least one second material transfer device having a plurality of second receiving slots for receiving the plurality of electronic components, and the second material transfer device can be moved from a material feeding position to a material picking position of the second path along the first path. The testing operation equipment as described in claim 1, wherein the at least one material moving mechanism further includes a fourth material moving mechanism, a fifth material moving mechanism and a sixth material moving mechanism, wherein the fourth material moving mechanism can be displaced along the second path to take out the plurality of electronic components that have been tested from the first testing mechanism, the fifth material moving mechanism can carry the plurality of electronic components that have been tested moved in by the fourth material moving mechanism along the second path, and displace along the third path to carry the plurality of electronic components that have been tested, and the sixth material moving mechanism can transfer the plurality of electronic components that have been tested between the fifth material moving mechanism and the material receiving device. As described in claim 3, the fifth material transfer mechanism is provided with at least one fifth material transfer device having a plurality of fifth receiving slots for receiving the plurality of electronic components that have been tested, and the fifth material transfer device can be moved from the discharge position of the second path along the third path to the discharge position for the sixth material transfer mechanism to take out the plurality of electronic components that have been tested. The testing operation equipment as described in any one of claims 1 to 4, wherein the first testing mechanism includes a first driver, a second driver, a movable seat and a plurality of first testers, the first driver and the second driver can drive the movable seat to carry the plurality of first testers to move in the Y-Z direction toward the plurality of second testers, and the first tester is provided with an electrically connected first circuit board and a first testing seat with a first transmission device for holding and testing the electronic component. In the testing operation equipment as described in claim 5, the second testing mechanism is provided with a substrate having a plurality of through holes, wherein the plurality of through holes are used for mounting a plurality of second testers which are integrating spheres, and the electronic components of the first testing mechanism are connected to the interior of the integrating sphere. In the testing operation equipment as described in claim 6, the first test socket of the first testing mechanism is provided with at least one second transmission component electrically connected to the first circuit board, and the second circuit board and the third transmission component electrically connected are provided on the substrate, and when the first tester and the substrate are relatively displaced, the third transmission component can be electrically connected to the second transmission component. As described in claim 5, the movable base of the testing operation equipment is provided with a plurality of exhaust parts, which can respectively suck or release the electronic components of the first tester.

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