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TWI545329B - An electronic component operating device, a working method, and a working device for its application - Google Patents

An electronic component operating device, a working method, and a working device for its application Download PDF

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Publication number
TWI545329B
TWI545329B TW103145792A TW103145792A TWI545329B TW I545329 B TWI545329 B TW I545329B TW 103145792 A TW103145792 A TW 103145792A TW 103145792 A TW103145792 A TW 103145792A TW I545329 B TWI545329 B TW I545329B
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Taiwan
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electronic component
sample
image capturing
image
image data
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TW103145792A
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Chinese (zh)
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TW201623985A (en
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zhi-xin Cai
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Hon Tech Inc
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Description

電子元件作業裝置、作業方法及其應用之作業設備 Electronic component working device, working method and application equipment thereof

本發明係提供一種利用移載機構於作業區之承置座內取出正確擺置之樣本件,以反向推知移載機構將樣本件置入於承置座前的樣本影像資料,並經比對機構進行比對作業後,即可使移載機構帶動電子元件之電性接點精準對位接觸承置座之電性傳輸件,而有效執行預設作業之電子元件作業裝置。 The invention provides a sample device for taking out a correctly placed sample in a bearing seat of a working area by using a transfer mechanism, and inferring backwards to the sample image data of the sample transfer device before placing the sample member in the mounting seat, and comparing After the comparison operation of the mechanism, the transfer mechanism can drive the electrical contact of the electronic component to accurately contact the electrical transmission component of the socket, and effectively execute the electronic component operation device of the preset operation.

在現今,電子元件積之尺寸日趨微小,其複數個電性接點之排列也相對密集,因此電子元件置入於作業區之承置座內的精準度要求相當高,若精準度稍有偏差,即使得電子元件無法在承置座內有效的執行作業,而降低作業的品質。 Nowadays, the size of electronic components is becoming smaller and smaller, and the arrangement of multiple electrical contacts is relatively dense. Therefore, the accuracy of placing electronic components in the mounting of the working area is quite high, and the accuracy is slightly deviated. That is, the electronic component cannot perform the work effectively in the socket, and the quality of the work is lowered.

以電子元件的測試分類機為例,請參閱第1圖,係為本申請人所申請之台灣專利第96149417號『可使電子元件精準對位之移載裝置』專利案,該測試分類機之機台上係配置有供料裝置10、輸入端輸送裝置11、作業區12、輸出端輸送裝置13及收料裝置14;該輸入端輸送裝置11係將供料裝置10上待測之電子元件分別輸送至作業區12內之供料載具121,該作業區12內之第一、二收料載具122、123上完測之電子元件,則依據檢測結果,由輸出端輸送裝置13輸送至收料裝置14分類放置;請參閱第2圖,該作業區12包含測試站124、取像機構125、位於測試站124一側之第一收料載具122、位於測試站124另一側之供料載具121及第二收料載具123、第一移載器126及第二移載器127;其中,該供料載具121之上方係設有複數個底面具鏤空孔且用以承置待測電子元件之承座1211,各承座1211係配置有複數個可為伺服馬達且呈不同軸向設置之調整件1212、1213、1214,而可利用調整件1212、1213、1214驅動承座 1211作X-Y兩軸向及θ角之位移,另於供料載具121之下方設有滑軌組1215,而可於輸入端輸送裝置將待測之電子元件置入各承座1211上後,利用滑軌組1215將待測之電子元件載送至取像機構125處取像,並以各調整件1212、1213、1214驅動承座1211作X-Y兩軸向及θ角之補償校正,而精確調整待測電子元件之擺置,該第一、二收料載具122、123則供承置完測之電子元件,該第一、二收料載具122、123係以固定的方式定位於相對測試站124的相關位置,以供第一、二移載器126、127及輸出端輸送裝置進行收料作業,該平行位於供料載具121側方之取像機構125,係為CCD取像器,並設置於機台之透明台板下方,且以線路連接至中央控制裝置,於供料載具121移載電子元件至取像機構125處取像後,將取像訊號傳輸至中央控制裝置,且經由中央控制裝置之比對,而運算出其偏差量,進而命令供料載具121之各承座1211作位置或角度之補償校正,使電子元件精準正確擺置,以供第一移載器126取出並移載置入於測試站124上執行檢測作業;惟,第一移載器126在供料載具121上取出並移載電子元件的過程中,第一移載器126將會因本身結構上的誤差或組裝間隙或移動上的定位問題,使得在移動至測試站124時,可能造成電子元件微幅偏移的現象,而無法準確置入於測試站124,亦即該設計雖可使電子元件精準正確擺置於供料載具121,但在第一移載器126移載置入於測試站124的重要階段中,卻可能造成電子元件微幅偏移的現象,這種情形對於現今講求小體積微電性接點的電子元件而言,精準度稍有偏差,即可能導致無法有效的執行作業,而降低作業的品質。 Taking the tester of the electronic component as an example, please refer to FIG. 1 , which is the patent case of the Taiwan Patent No. 96194417, which can be applied to the applicant, and the transfer device for accurately aligning electronic components. The feeding machine is provided with a feeding device 10, an input conveying device 11, a working area 12, an output conveying device 13 and a receiving device 14; the input conveying device 11 is an electronic component to be tested on the feeding device 10. The feeding carriers 121 are respectively delivered to the working area 12, and the electronic components that are completed on the first and second receiving carriers 122 and 123 in the working area 12 are transported by the output conveying device 13 according to the detection result. The storage device 14 is placed in a sorting manner; referring to FIG. 2, the working area 12 includes a test station 124, an image capturing mechanism 125, a first receiving carrier 122 on the side of the testing station 124, and another side of the testing station 124. The feeding carrier 121 and the second receiving carrier 123, the first transfer carrier 126 and the second transfer carrier 127; wherein the feeding carrier 121 is provided with a plurality of bottom mask hollow holes and used To support the socket 1211 of the electronic component to be tested, each of the sockets 1211 is configured with a plurality of And the servomotor can be adjusted as a member of different axially disposed 1212,1213,1214, 1212,1213,1214 and can be used to adjust the drive socket member 1211 is used for the displacement of the XY two-axis and the θ angle, and the slide rail group 1215 is disposed under the feeding carrier 121, and the electronic component to be tested is placed on each of the sockets 1211 at the input end conveying device. The electronic component to be tested is carried to the image capturing mechanism 125 by the slide group 1215, and the bearing 1212 is driven by the adjusting members 1212, 1213, and 1214 to compensate for the correction of the XY two-axis and the θ angle. Adjusting the arrangement of the electronic components to be tested, the first and second receiving carriers 122, 123 are for holding the tested electronic components, and the first and second receiving carriers 122, 123 are fixed in a fixed manner. Relative to the position of the test station 124, for the first and second transfer carriers 126, 127 and the output end conveying device to perform the receiving operation, the image capturing mechanism 125 located in the side of the feeding carrier 121 is taken as the CCD The image sensor is disposed under the transparent platen of the machine and connected to the central control device by a line. After the feeding carrier 121 transfers the electronic component to the image capturing mechanism 125, the image capturing signal is transmitted to the center. Control device, and through the comparison of the central control device, calculate the amount of deviation, and then command Each of the sockets 1211 of the material carrier 121 is compensated for position or angle, so that the electronic components are accurately and correctly placed for the first transfer carrier 126 to be taken out and transferred to the test station 124 for performing the inspection operation; During the removal and transfer of the electronic components by the first transfer 126 on the feeding carrier 121, the first transfer 126 will be moved due to structural errors or positioning problems on the assembly gap or movement. When the test station 124 is reached, the electronic component may be slightly offset, and it may not be accurately placed in the test station 124. That is, the design allows the electronic component to be accurately and correctly placed on the feeding carrier 121, but in the first A transfer 126 is placed in an important stage of the test station 124, but may cause a slight shift of the electronic components. This situation is accurate for today's electronic components that require small-sized micro-electric contacts. A slight deviation, which may result in the inability to perform the job effectively, reduces the quality of the job.

因此,請參閱第3、4、5圖,係為本申請人所申請之台灣專利第101146714號『電子元件作業單元、作業方法及其應用之作業設備』專利申請案,該作業單元20係於機台上設有移載取放裝置21、作業區22、取像裝置23、取樣比對裝置24及對位調整裝置25;該移載取放裝置21之第一移載取放器215的吸嘴2151係將電子元件26移載至作業區22之承置座222上方位置,該取樣比對裝置24之移動式取像器241係設有菱鏡組及CCD取像器,並可移動至作業區22之承置座222與第一移載取放器215間的位置,而透過菱鏡組同時對第一移 載取放器215上之電子元件26及作業區22之承置座222進行雙向的位置取像,再由CCD取像器攝取菱鏡組的影像,而獲致電子元件26及承置座222間相對位置的取像資料,最後再將該取像資料傳輸至取樣比對裝置24之控制器進行比對,若比對結果超出誤差值,則進一步由對位調整裝置25執行對位調整,完成對位調整後,再由取像裝置23之CCD取像器231取像,而獲得正確的樣本影像資料,並儲存於取樣比對裝置24之資料庫,從而於取樣比對裝置24建立樣本影像資料;當第一移載取放器215將待作業之電子元件26a移載至作業區22之承置座222的上方時,取像裝置23之CCD取像器231對第一移載取放器215上待作業之電子元件26a進行取像,並將該即時影像資料傳輸至取樣比對裝置24,該取樣比對裝置24即與資料庫中建立的樣本影像資料進行比對,若取像比對程序之比對結果超出誤差值時,第一移載取放器215上多層式調整平台之X軸向調整件252、Y軸向調整件254及角度調整件255可使電子元件26a於第一移載取放器215上進行水平位置之對位調整,完成對位調整程序後,該移載取放裝置21之Z軸向移動件2152係帶動第一移載取放器215將待作業之電子元件26a置入作業區22之承置座222內,使待作業電子元件26a的錫球電性接觸承置座222內之電性傳輸件223而執行電性測試作業;惟,該作業單元20雖於第一移載取放器215移載待作業電子元件26a至作業區22之承置座222上方位置後才進行即時影像資料的取像,亦即以對位前的最終位置進行取像,而可排除第一移載取放器215本身結構上的組裝誤差或移動定位等問題所造成的X-Y兩軸向及θ角之偏斜,但該第一移載取放器215作Z軸向位移將待作業電子元件26a移入作業區22之承置座222內的行程中,易因Z軸向移動件2152之組裝誤差或移動定位等問題,而導致待作業電子元件26a發生偏斜之情況,造成待作業電子元件26a的錫球仍無法準確對位承置座222內之電性傳輸件223,而影響測試品質之缺失;再者,該取樣比對裝置24之移動式取像器241於作水平向伸出取像時,易因本身結構上的組裝誤差或移動定位等問題,導致移動式取像器241發生偏斜擺置之情況,而無法準確取像,此易造成待作業電子元件26a的錫球無法準確對位承置座222內之電性傳輸件22 3,而影響測試品質之缺失。 Therefore, please refer to Figures 3, 4, and 5, which are the patent applications of the electronic component operating unit, the working method and the application device thereof of the Taiwan Patent No. 101146714, which is filed by the applicant. The machine is provided with a transfer pick-and-place device 21, a working area 22, an image capturing device 23, a sampling comparison device 24 and a registration adjusting device 25; the first transfer pick-and-place device 215 of the transfer pick-and-place device 21 The nozzle 2151 transfers the electronic component 26 to a position above the mounting seat 222 of the working area 22. The movable imager 241 of the sampling comparison device 24 is provided with a prism group and a CCD image picker, and is movable. The position between the socket 222 of the working area 22 and the first transfer pick-and-placer 215, and the first shift through the mirror group The electronic component 26 on the loading and unloading device 215 and the mounting base 222 of the working area 22 perform bidirectional positional image capturing, and the CCD image capturing device takes in the image of the lens group to obtain the electronic component 26 and the mounting base 222. The image data of the relative position is finally transmitted to the controller of the sampling comparison device 24 for comparison. If the comparison result exceeds the error value, the alignment adjustment device 25 performs the alignment adjustment to complete. After the alignment is adjusted, the CCD imager 231 of the image capturing device 23 takes an image to obtain the correct sample image data, and stores it in the database of the sampling comparison device 24, thereby establishing a sample image in the sampling comparison device 24. When the first transfer handler 215 transfers the electronic component 26a to be operated to the upper of the mounting base 222 of the working area 22, the CCD imager 231 of the image capturing device 23 picks up the first transfer. The electronic component 26a to be operated on the device 215 performs image capturing, and transmits the real-time image data to the sampling comparison device 24, and the sampling comparison device 24 compares with the sample image data established in the database, if the image is taken Comparison of the results of the comparison program exceeds the error value The X-axis adjustment member 252, the Y-axis adjustment member 254 and the angle adjustment member 255 of the multi-layer adjustment platform of the first transfer pick-and-place device 215 can make the electronic component 26a horizontal on the first transfer pick-and-place device 215. After the alignment adjustment of the position, the Z-axis moving member 2152 of the transfer pick-and-place device 21 drives the first transfer pick-and-place device 215 to place the electronic component 26a to be operated into the work area 22 In the mounting base 222, the solder ball of the electronic component 26a to be electrically contacted electrically contacts the electrical transmission member 223 in the mounting base 222 to perform an electrical test operation; however, the working unit 20 is in the first transfer loading and unloading operation. The device 215 transfers the image of the electronic component 26a to be placed above the mounting base 222 of the working area 22, and then performs image capturing of the real-time image data, that is, the final position before the alignment is performed, and the first transfer can be excluded. The deflection of the XY two-axis and the θ angle caused by the assembly error or the movement positioning of the pick-and-placer 215 itself, but the first transfer pick-and-placer 215 is displaced in the Z-axis to be operated by the electronic component 26a. Among the strokes moved into the socket 222 of the working area 22, it is easy to be grouped by the Z-axis moving member 2152. The problem of error or moving positioning causes the electronic component 26a to be deflected, so that the solder ball of the electronic component 26a to be operated still cannot accurately align the electrical transmission member 223 in the socket 222, thereby affecting the test quality. In addition, when the mobile image finder 241 of the sampling comparison device 24 is horizontally extended, the mobile image finder 241 is easily caused by the assembly error or the movement positioning of the structure. The situation of the skewed arrangement occurs, and the image cannot be accurately taken. This may cause the solder ball of the electronic component 26a to be accurately operated to accurately align the electrical transmission member 22 in the socket 222. 3, and affect the lack of test quality.

本發明之目的一,係提供一種電子元件作業裝置及作業方法,該作業裝置包含作業區、樣本單元、移載機構、取像機構及比對機構;該作業區之承置座係承置該樣本單元之樣本件,該樣本件之取樣點與承置座之電性傳輸件準確對位,該移載機構之取放器係於承置座取出正確擺置之樣本件,並移載至取像機構之預設取像位置進行取像作業,該取像機構係將取像之樣本影像資料傳輸至比對機構,該移載機構之取放器係將待作業之電子元件移載至取像機構之預設取像位置進行取像作業,並將取像之實際影像資料傳輸至比對機構,該比對機構係將實際影像資料與樣本影像資料進行比對,令移載機構上之待作業電子元件進行調整校正作業;藉此,利用移載機構於作業區之承置座內取出正確擺置之樣本件,並移載至預設取像位置取像,以反向推知樣本件移入承置座前之擺放位置及角度,作為日後移載電子元件之基準,即可使電子元件之電性接點精準對位接觸承置座之電性傳輸件,而有效執行預設作業,達到提升作業品質之實用效益。 An object of the present invention is to provide an electronic component working device and a working method, the working device comprising a working area, a sample unit, a transfer mechanism, an image capturing mechanism and a comparison mechanism; a sample piece of the sample unit, the sampling point of the sample piece is accurately aligned with the electrical transmission piece of the mounting seat, and the pick-and-place device of the transfer mechanism is taken out from the receiving seat to take out the correctly placed sample piece and transferred to the sample piece The image capturing operation is performed by the image capturing mechanism of the image taking mechanism, and the image capturing device transmits the image data of the image to the comparison mechanism, and the pick and place mechanism of the transferring mechanism transfers the electronic components to be operated to The image capturing operation is performed by the image capturing position of the image capturing mechanism, and the actual image data of the image capturing device is transmitted to the comparison mechanism, and the comparison image compares the actual image data with the sample image data to make the transfer mechanism The operation electronic component performs an adjustment and correction operation; thereby, the correct placement of the sample piece is taken out in the receiving seat of the working area by the transfer mechanism, and the image is transferred to the preset image capturing position to infer the sample in reverse. Moving into the bearing The position and angle of the front seat can be used as the benchmark for the future transfer of electronic components, so that the electrical contacts of the electronic components can accurately contact the electrical transmission members of the socket, and the preset operation can be effectively performed to achieve the improvement. Practical benefits of job quality.

本發明之目的二,係提供一種電子元件作業裝置及作業方法,該作業裝置之取像機構係以一為CCD之取像器於預設取像位置對樣本件進行取像,毋須搭配菱鏡組作雙向取像,達到節省成本之實用效益。 An object of the present invention is to provide an electronic component working device and a working method. The image capturing mechanism of the working device uses a CCD image capturing device to image the sample member at a preset image capturing position without using a mirror. The group makes two-way image acquisition, which achieves practical benefits of cost saving.

本發明之目的三,係提供一種應用電子元件作業裝置之作業設備,該作業設備包含供料裝置、收料裝置、作業裝置、輸入端輸送裝置、輸出端輸送裝置及中央控制裝置,該供料裝置係配置於機台上,用以容納至少一待作業之電子元件,該收料裝置係配置於機台上,用以容納至少一已作業之電子元件,該作業裝置係配置於機台上,並設有移載機構、作業區、取像機構及比對機構,用以對電子元件執行預設作業,該輸入端輸送裝置及輸出端輸送裝置係配置於機台上,用以將供料裝置上之電子元件輸入作業裝置,以及自作業裝置輸出電子元件至收料裝置,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A third object of the present invention is to provide a working device using an electronic component working device, which comprises a feeding device, a receiving device, a working device, an input end conveying device, an output end conveying device and a central control device, the feeding device The device is disposed on the machine platform for accommodating at least one electronic component to be operated, and the receiving device is disposed on the machine platform for accommodating at least one electronic component that has been operated, and the working device is disposed on the machine platform. And a transfer mechanism, an operation area, an image taking mechanism and a comparison mechanism for performing preset operations on the electronic components, wherein the input end conveying device and the output end conveying device are arranged on the machine table for The electronic component input operation device on the material device, and the electronic component output device from the operation device to the receiving device, the central control device is used to control and integrate the operation of each device to perform an automatic operation, thereby achieving the practical benefit of improving the operation efficiency.

〔習知〕 [study]

10‧‧‧供料裝置 10‧‧‧Feeding device

11‧‧‧輸入端輸送裝置 11‧‧‧Input conveyor

12‧‧‧作業區 12‧‧‧Working area

121‧‧‧供料載具 121‧‧‧Feeding vehicle

1211‧‧‧承座 1211‧‧ ‧ socket

1212‧‧‧調整件 1212‧‧‧Adjustment

1213‧‧‧調整件 1213‧‧‧Adjustment

1214‧‧‧調整件 1214‧‧‧Adjustment

1215‧‧‧滑軌組 1215‧‧‧Slide group

122‧‧‧第一收料載具 122‧‧‧First receiving vehicle

123‧‧‧第二收料載具 123‧‧‧Second receiving vehicle

124‧‧‧測試站 124‧‧‧Test Station

125‧‧‧取像機構 125‧‧‧Image agency

126‧‧‧第一移載器 126‧‧‧First Transfer Carrier

127‧‧‧第二移載器 127‧‧‧Second transfer device

13‧‧‧輸出端輸送裝置 13‧‧‧Output conveyor

14‧‧‧收料裝置 14‧‧‧ Receiving device

20‧‧‧作業單元 20‧‧‧Operating unit

21‧‧‧移載取放裝置 21‧‧‧Transfer pick and place device

215‧‧‧第一移載取放器 215‧‧‧First transfer picker

2151‧‧‧吸嘴 2151‧‧‧ nozzle

2152‧‧‧Z軸向移動件 2152‧‧‧Z axial moving parts

22‧‧‧作業區 22‧‧‧Working area

222‧‧‧承置座 222‧‧‧ socket

223‧‧‧電性傳輸件 223‧‧‧Electrical transmission parts

23‧‧‧取像裝置 23‧‧‧Image capture device

231‧‧‧CCD取像器 231‧‧‧CCD imager

24‧‧‧取樣比對裝置 24‧‧‧Sampling comparison device

241‧‧‧移動式取像器 241‧‧‧Mobile Imager

25‧‧‧對位調整裝置 25‧‧‧ alignment adjustment device

252‧‧‧X軸向調整件 252‧‧‧X axial adjustment

254‧‧‧Y軸向調整件 254‧‧‧Y axial adjustment

255‧‧‧角度調整件 255‧‧‧Angle adjustment

26、26a‧‧‧電子元件 26, 26a‧‧‧ Electronic components

〔本發明〕 〔this invention〕

30‧‧‧作業裝置 30‧‧‧Working device

31‧‧‧作業區 31‧‧‧Working area

311‧‧‧測試電路板 311‧‧‧Test circuit board

312‧‧‧承置座 312‧‧‧ 承座

3121‧‧‧電性傳輸件 3121‧‧‧Electrical transmission parts

32‧‧‧樣本單元 32‧‧‧sample unit

321‧‧‧樣本件 321‧‧‧samples

3211‧‧‧取樣點 3211‧‧‧Sampling point

322‧‧‧定位件 322‧‧‧ positioning parts

33‧‧‧移載機構 33‧‧‧Transportation agency

331‧‧‧第一供料載台 331‧‧‧First feeding stage

3311‧‧‧第一供料承座 3311‧‧‧First supply seat

332‧‧‧第一收料載台 332‧‧‧First receiving platform

3321‧‧‧第一收料承座 3321‧‧‧First receiving seat

333‧‧‧第一驅動源 333‧‧‧First drive source

3331‧‧‧Z軸向作動件 3331‧‧‧Z axial actuator

334‧‧‧第一取放器 334‧‧‧First pick and place

3341‧‧‧吸嘴 3341‧‧ ‧ nozzle

335‧‧‧第二供料載台 335‧‧‧Second feed stage

336‧‧‧第二取放器 336‧‧‧Second pick and place

337‧‧‧第二收料載台 337‧‧‧Second receiving platform

34‧‧‧取像機構 34‧‧‧Image agency

341‧‧‧第一取像器 341‧‧‧first imager

342‧‧‧第二取像器 342‧‧‧Second imager

343‧‧‧第三取像器 343‧‧‧ third imager

35‧‧‧比對機構 35‧‧‧Comparative agencies

351‧‧‧資料庫 351‧‧‧Database

352‧‧‧控制器 352‧‧‧ Controller

36‧‧‧調整機構 36‧‧‧Adjustment agency

361‧‧‧固定座 361‧‧‧ fixed seat

362‧‧‧X軸向調整件 362‧‧‧X axial adjustment

363‧‧‧第一滑動座 363‧‧‧First sliding seat

364‧‧‧Y軸向調整件 364‧‧‧Y axial adjustment

365‧‧‧角度調整件 365‧‧‧ Angle adjustment

366‧‧‧第二滑動座 366‧‧‧Second sliding seat

37‧‧‧電子元件 37‧‧‧Electronic components

40‧‧‧機台 40‧‧‧ machine

50‧‧‧供料裝置 50‧‧‧Feeding device

51‧‧‧供料承置器 51‧‧‧Feeder

60‧‧‧收料裝置 60‧‧‧ receiving device

61‧‧‧收料承置器 61‧‧‧Receipt receiver

70‧‧‧輸入端輸送裝置 70‧‧‧Input conveyor

71‧‧‧輸入端移料器 71‧‧‧Input shifter

80‧‧‧輸出端輸送裝置 80‧‧‧Output conveyor

81‧‧‧輸出端移料器 81‧‧‧Output shifter

第1圖:習知台灣第96149417號專利案於測試分類機之配置示意圖。 Figure 1: Schematic diagram of the configuration of the Taiwan Patent No. 96194417 in the test classification machine.

第2圖:習知台灣第96149417號專利案作業區之配置示意圖。 Figure 2: Schematic diagram of the configuration of the operating area of the Taiwan Patent No. 96194417.

第3圖:習知台灣第101146714號專利申請案之作業單元示意圖。 Figure 3: Schematic diagram of the operating unit of the Japanese Patent Application No. 101146714.

第4圖:習知台灣第101146714號專利申請案之使用示意圖(一)。 Figure 4: Schematic diagram of the use of the patent application of Taiwan Patent No. 101146714 (1).

第5圖:習知台灣第101146714號專利申請案之使用示意圖(二)。 Figure 5: Schematic diagram of the use of the patent application No. 101146714 (2).

第6圖:本發明作業裝置之各機構配置示意圖。 Figure 6 is a schematic view showing the configuration of each mechanism of the working device of the present invention.

第7圖:本發明作業裝置之局部示意圖。 Figure 7 is a partial schematic view of the working device of the present invention.

第8圖:本發明作業裝置之使用示意圖(一)。 Figure 8 is a schematic view showing the use of the working device of the present invention (1).

第9圖:本發明作業裝置之使用示意圖(二)。 Figure 9: Schematic diagram of the use of the working device of the present invention (2).

第10圖:本發明作業裝置之使用示意圖(三)。 Figure 10: Schematic diagram of the use of the working device of the present invention (3).

第11圖:本發明作業裝置之使用示意圖(四)。 Figure 11: Schematic diagram of the use of the working device of the present invention (4).

第12圖:本發明作業裝置之使用示意圖(五)。 Figure 12: Schematic diagram of the use of the working device of the present invention (5).

第13圖:本發明作業裝置之使用示意圖(六)。 Figure 13: Schematic diagram of the use of the working device of the present invention (6).

第14圖:本發明作業裝置之使用示意圖(七)。 Figure 14: Schematic diagram of the use of the working device of the present invention (7).

第15圖:本發明作業裝置應用於測試分類機之示意圖。 Fig. 15 is a schematic view showing the application of the working device of the present invention to a test sorter.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第6、7圖,本發明之作業裝置30包含作業區31、樣本單元32、移載機構33、取像機構34及比對機構35;該作業區31係設有至少一作業器,供置入待作業之電子元件,以對該電子元件執行預設作業,該預設作業可為印刷、模壓、外觀檢測或電性測試等,於本實施例中,該作業區31係執行電性測試作業,該作業器係設有測試電路板311,以及於測試電路板311上設有供電子元件對位置放之承置座312,該承置座312內並設有複數個連接至測試電路板311之電性傳輸件3121,電性傳輸件3121係與電子元件之電性接點相接觸而可執行電性測試作業;該樣本單元32係設有至少一樣本件321,並移入或移出作業區31之作業器,該樣本件321可為樣本治具或電子元件,並依據日後實際作業之電子元件的電性接點位置,而於樣本件321之相同位置精準設有取樣點3211,該取樣點3211可為記號點或 接腳或錫球等,於本實施例中,該樣本件321之取樣點3211係為記號點,並令取樣點3211之上方位置呈透明狀,以便由樣本件321之上方觀看或取像該取樣點3211,更進一步,為使樣本件321之取樣點3211準確對位承置座312之電性傳輸件3121,係於承置座312處裝配有至少一定位件322,該定位件322之內徑尺寸係配合樣本件321之外徑尺寸,當定位件322裝配在承置座312上時,係用以定位該樣本件321,使樣本件321之取樣點3211準確對位承置座312之電性傳輸件3121,於取樣作業完畢後,則可由承置座312上卸除定位件322;該移載機構33係設有至少一取放器,用以將作業區31內之樣本件321取出移載至取像機構34之預設取像位置,以及將待作業之電子元件移載至作業區32與取像機構34之預設取像位置,於本實施例中,該移載機構33係於作業區31之一側設有第一供料載台331及第一收料載台332,該第一供料載台331係設有至少一第一供料承座3311,以於供料位置承置待作業之電子元件,並移動至對應作業區31的側方,該第一收料載台332上係設有至少一第一收料承座3321,於對應作業區31的側方承置已作業之電子元件,並移動至收料位置,另該移載機構33係設有第一驅動源333,第一驅動源333係以Z軸向作動件3331裝配第一取放器334,並帶動第一取放器334作Y-Z軸向位移,使第一取放器334可於作業區31之承置座312內取出正確擺置的樣本件321,並移載至取像機構34之預設取像位置,又該第一取放器334係可移動至第一供料載台331,將第一供料載台331上之待作業電子元件移載至作業區31及取像機構34之預設取像位置,亦或將作業區31之已作業電子元件移載至第一收料載台332上;該取像機構34係設有至少一第一取像器341,用以對第一取放器334上之樣本件321或電子元件取像,並將取像資料傳輸至比對機構35,於本實施例中,該第一取像器341係為CCD,並對位於預設取像位置之樣本件321執行取像作業,並將樣本影像資料傳輸至比對機構35,亦或對位於預設取像位置之電子元件執行取像作業,並將該實際影像資料傳輸至比對機構35,更一步,可利用人工目視或取像作業,檢知樣本件321之取樣點3211是否準確對位於承置座312之 電性傳輸件3121,若以取像作業檢知樣本件321時,可於取像機構34設有第二取像器(圖未示出),以取像承置座312內之樣本件321,並將取像之對位影像資料傳輸至比對機構35,該第二取像器可獨立配置於機台上,亦或裝配於其他機構上,以於樣本件321置入承置座312內時,對樣本件321進行取像作業;該比對機構35係設有儲存樣本影像資料之資料庫351及執行比對之控制器352,而可將實際影像資料與樣本影像資料進行比對作業,更進一步,該控制器352可依據該對位影像資料,以判別樣本件321之取樣點3211是否準確對位承置座312之電性傳輸件3121;另為了使第一取放器334可以準確將電子元件置放於承置座312內,並使電子元件之電性接點可以精準接觸承置座312之電性傳輸件3121,該作業裝置30係設有調整機構36,當比對機構35之控制器352將實際影像資料與樣本影像資料進行比對,如超出誤差範圍時,則以調整機構36進行對位調整,該調整機構36係於第一取放器334上架置多層式的調整平台,該調整平台上方為固定座361,固定座361下方架設有一可由X軸向調整件362驅動作X軸向滑移之第一滑動座363,第一滑動座363下方再架設有一可由Y軸向調整件364驅動作Y軸向滑移及可由角度調整件365驅動作角度調整之第二滑動座366,第一取放器334取放電子元件之吸嘴3341則固定於第二滑動座366下方;由於多層式的調整平台已為習知的技術,因此其動作不再贅述,進而使得電子元件可於第一取放器334上進行調整作業;經由比對機構35進行比對,如未超出誤差範圍或超出誤差範圍而完成調整後之電子元件,則由第一取放器334移入承置座312,進而使電子元件之電性接點可以精準接觸承置座312之電性傳輸件3121。 In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail. For the following: Please refer to Figures 6 and 7. The working device 30 of the present invention includes a working area 31 and a sample. a unit 32, a transfer mechanism 33, an image taking mechanism 34 and a comparison mechanism 35; the work area 31 is provided with at least one operator for placing an electronic component to be operated to perform a preset operation on the electronic component, The preset operation may be printing, molding, appearance inspection or electrical test. In the embodiment, the working area 31 performs an electrical test operation, and the operator is provided with a test circuit board 311 and a test circuit board. The 311 is provided with a mounting base 312 for positioning the electronic component. The mounting base 312 is provided with a plurality of electrical transmission members 3121 connected to the test circuit board 311, and the electrical transmission component 3121 is connected to the electronic component. The electrical contact operation can be performed by contacting the electrical contacts; the sample unit 32 is provided with at least the same piece 321 and moved into or out of the working area 31, and the sample piece 321 can be a sample jig or an electronic component. And based on the actual operation of the electronics in the future The electrical contact position of the component, and the sampling point 3211 is precisely provided at the same position of the sample member 321 , and the sampling point 3211 can be a mark point or In the embodiment, the sampling point 3211 of the sample piece 321 is a mark point, and the position above the sampling point 3211 is transparent so as to be viewed or taken by the sample element 321 above. The sampling point 3211, further, in order to accurately align the sampling point 3211 of the sample member 321 with the electrical transmission member 3121 of the positioning socket 312, at least one positioning member 322 is mounted on the receiving base 312, and the positioning member 322 is The inner diameter is matched with the outer diameter of the sample member 321 . When the positioning member 322 is mounted on the receiving seat 312 , the sample member 321 is positioned to make the sampling point 3211 of the sample member 321 accurately align the receiving base 312 . The electrical transmission member 3121 can remove the positioning member 322 from the receiving seat 312 after the sampling operation is completed; the transfer mechanism 33 is provided with at least one pick-and-place device for sampling the sample in the working area 31. The 321 is taken out to the preset image capturing position of the image capturing mechanism 34, and the electronic component to be operated is transferred to the working image area 32 and the preset image capturing position of the image capturing mechanism 34. In this embodiment, the transfer position is performed. The mechanism 33 is provided with a first feeding stage 331 and a first receiving stage 3 on one side of the working area 31. 32. The first feeding platform 331 is provided with at least one first feeding socket 3311 for receiving the electronic component to be operated at the feeding position and moving to the side of the corresponding working area 31, the first At least one first receiving socket 3321 is disposed on the receiving platform 332, and the operated electronic components are placed on the side of the corresponding working area 31, and moved to the receiving position, and the transferring mechanism 33 is set. There is a first driving source 333, the first driving source 333 is equipped with a first axial picker 334 with a Z-axis actuating member 3331, and drives the first pick-and-placer 334 for YZ axial displacement, so that the first pick-and-placer 334 can The correctly placed sample piece 321 is taken out in the receiving base 312 of the working area 31 and transferred to the preset image taking position of the image taking mechanism 34, and the first pick and place 334 is movable to the first feeding position. The stage 331 transfers the electronic components to be operated on the first feeding stage 331 to the preset image capturing position of the working area 31 and the image capturing mechanism 34, or transfers the processed electronic components of the working area 31 to The first receiving stage 332 is disposed on the first receiving stage 34. The image capturing mechanism 34 is provided with at least one first image capturing unit 341 for the sample piece 321 or the electronic component on the first pick-and-placer 334. The image capturing device transmits the image capturing data to the comparison mechanism 35. In the embodiment, the first image capturing device 341 is a CCD, and the image capturing operation is performed on the sample member 321 located at the preset image capturing position. And transmitting the sample image data to the comparison mechanism 35, or performing an image capturing operation on the electronic component located at the preset image capturing position, and transmitting the actual image data to the comparison mechanism 35, and further, using manual visual inspection or The image capturing operation detects whether the sampling point 3211 of the sample piece 321 is accurate to be located in the receiving seat 312. The electrical transmission member 3121 can be provided with a second image capturing device (not shown) in the image capturing mechanism 34 to detect the sample member 321 in the image capturing operation. And the image data of the image is transmitted to the comparison mechanism 35, and the second image finder can be independently disposed on the machine table or assembled on other mechanisms to insert the sample piece 321 into the socket 312. The imaging device 321 is configured to perform image capturing operations. The comparison mechanism 35 is provided with a database 351 for storing sample image data and a controller 352 for performing comparison, and the actual image data can be compared with the sample image data. In operation, the controller 352 can determine whether the sampling point 3211 of the sample member 321 is accurately aligned with the electrical transmission member 312 of the positioning socket 312 according to the alignment image data; and in order to make the first pick-and-placer 334 The electronic component can be accurately placed in the socket 312, and the electrical contact of the electronic component can accurately contact the electrical transmission component 3121 of the socket 312. The working device 30 is provided with an adjustment mechanism 36. The controller 352 of the mechanism 35 enters the actual image data and the sample image data into For example, when the error is exceeded, the adjustment mechanism 36 performs the alignment adjustment. The adjustment mechanism 36 is mounted on the first pick-and-place 334 to mount a multi-layer adjustment platform. The upper surface of the adjustment platform is a fixed seat 361. The first sliding seat 363 is driven by the X-axis adjusting member 362 for X-axis sliding. The first sliding seat 363 is further provided with a Y-axis sliding member 364 for Y-axis sliding and can be driven by the Y-axis adjusting member 364. The angle adjusting member 365 drives the second sliding seat 366 for angle adjustment, and the nozzle 3341 of the first pick-and-placer 334 for taking and placing electronic components is fixed under the second sliding seat 366; since the multi-layer adjusting platform is known The technique is therefore not described again, so that the electronic component can be adjusted on the first pick-and-placer 334; the comparison mechanism 35 is compared, and the adjusted electronic component is completed without exceeding the error range or exceeding the error range. The component is moved into the socket 312 by the first pick-and-placer 334, so that the electrical contacts of the electronic component can accurately contact the electrical transmission component 3121 of the socket 312.

請參閱第8、9圖,本發明於執行作業前,係先進行樣本移入承置座程序,係將樣本單元32之樣本件321正確對位移入於作業區31之承置座312,於本實施例中,可以手動或取放器將樣本件321置入於定位件322,而利用定位件322使樣本件321正確擺置於承置座312內,使樣本件321之取樣點3211準確對位承置座312之電性傳輸件3121,更進一步,可利用取像機構34之一第二取像器 342對承置座312內之樣本件321進行取像動作,並將取像之對位影像資料傳輸至比對機構35,該比對機構35之控制器352依據該對位影像資料,以判別樣本件321之取樣點3211是否準確對位承置座312之電性傳輸件3121,若有準確對位,該移載機構33之第一取放器334係於承置座312內取出樣本件321,並移載至該取像機構34之預設取像位置,若無準確對位,則以手動或取放器調整樣本件321之擺放位置,以使樣本件321之取樣點3211準確對位承置座312之電性傳輸件3121;經由比對機構35判別樣本件321準確置入於承置座312後,該調整機構36係將X軸向調整件362、Y軸向調整件364及角度調整件365調整至預設之X-Y軸向位置及角度,於本實施例中,係進行將X軸向調整件362、Y軸向調整件364及角度調整件365調整歸零動作,於完成歸零動作後;接著執行樣本移出承置座程序,其移載機構33之取放器係於該作業區31之承置座312內取出正確擺置之樣本件321,並移載至預設取像位置,於本實施例中,該移載機構33之第一驅動源333係以Z軸向作動件3331帶動第一取放器334作Z軸向位移,使第一取放器334之吸嘴3341於承置座312內取出樣本件321,並將樣本件321移載至取像機構34之第一取像器341上方的預設取像位置,此時,該調整機構36之X軸向調整件362、Y軸向調整件364及角度調整件365仍保持歸零;樣本影像資料建構程序:該取像機構之取像器係對該預設取像位置處之樣本件取像,並將取像之樣本影像資料傳輸至該比對機構之資料庫,於該資料庫中建立樣本影像資料;於本實施例中,該取像機構34之第一取像器341即對位於預設取像位置之樣本件321執行取像作業,並將取像之樣本影像資料傳輸至比對機構35,以進一步儲存於比對機構35之資料庫351,從而於資料庫351中建立樣本影像資料,由於該移載機構33之第一取放器334係於承置座312內取出正確擺置之樣本件321,並將樣本件321移載至預設取像位置,換言之,當移載機構33之第一取放器334由預設取像位置處將樣本件321移載至承置座312內,即可使樣本件321正確擺置於承置座312內,因此,利用移載機構33於作業區31之承置座312內取出正確擺置之樣本件321,再由取像機 構34取像樣本件321,而可反向獲得移載機構33將樣本件321移入作業區31之承置座312前的樣本影像資料,以作為日後移載電子元件之擺放位置及角度的基準。 Referring to Figures 8 and 9, before the execution of the work, the sample is first moved into the mounting procedure, and the sample member 321 of the sample unit 32 is correctly displaced into the mounting seat 312 of the working area 31. In the embodiment, the sample member 321 can be placed into the positioning member 322 by a manual or pick-and-place device, and the sample member 321 is correctly placed in the receiving seat 312 by using the positioning member 322, so that the sampling point 3211 of the sample member 321 is accurately The electrical transmission member 3121 of the socket 312, and further, the second image pickup device of the image capturing mechanism 34 can be utilized. 342, the sample member 321 in the socket 312 is taken, and the image data of the image is transmitted to the comparison mechanism 35. The controller 352 of the comparison mechanism 35 determines the image according to the alignment image. Whether the sampling point 3211 of the sample member 321 is accurately aligned with the electrical transmission member 3121 of the positioning socket 312, if the alignment is accurately aligned, the first pick-and-place 334 of the transfer mechanism 33 is attached to the mounting seat 312 to take out the sample piece. And transferring to the preset image capturing position of the image capturing mechanism 34. If there is no accurate alignment, the position of the sample piece 321 is adjusted by a manual or a picker to make the sampling point 3211 of the sample piece 321 accurate. The electrical transmission member 3121 of the alignment bearing seat 312; after the comparison member 35 determines that the sample member 321 is accurately placed in the receiving seat 312, the adjusting mechanism 36 is an X-axis adjusting member 362 and a Y-axis adjusting member. 364 and the angle adjusting member 365 are adjusted to the preset XY axial position and angle. In the embodiment, the X-axis adjusting member 362, the Y-axis adjusting member 364 and the angle adjusting member 365 are adjusted to zero. After the completion of the zeroing action; then the sample removal program is carried out, and the transfer mechanism 33 is placed and removed. The sample member 321 is correctly placed in the receiving seat 312 of the working area 31, and is transferred to the preset image capturing position. In this embodiment, the first driving source 333 of the transferring mechanism 33 is The Z-axis actuating member 3331 drives the first pick-and-placer 334 to perform Z-axis displacement, so that the nozzle 3341 of the first pick-and-placer 334 takes out the sample member 321 in the receiving seat 312, and transfers the sample member 321 to The preset image capturing position of the first image capturing unit 341 of the image taking mechanism 34, at this time, the X-axis adjusting member 362, the Y-axis adjusting member 364 and the angle adjusting member 365 of the adjusting mechanism 36 remain zero; The sample image data constructing program: the image capturing device of the image capturing mechanism takes an image of the sample piece at the preset image capturing position, and transmits the sampled image data of the image to the database of the comparing institution, where the data is The sample image data is created in the library. In the embodiment, the first image finder 341 of the image capturing mechanism 34 performs an image capturing operation on the sample piece 321 located at the preset image capturing position, and the sample image data of the image is taken. And transmitted to the comparison mechanism 35 for further storage in the database 351 of the comparison mechanism 35, thereby being in the database 351 The sample image data is created, because the first pick-and-place 334 of the transfer mechanism 33 is taken out in the socket 312 to take out the correctly placed sample piece 321 and the sample piece 321 is transferred to the preset image taking position, in other words, When the first pick-and-place 334 of the transfer mechanism 33 transfers the sample member 321 into the socket 312 from the preset image capturing position, the sample member 321 can be correctly placed in the socket 312. The correctly placed sample piece 321 is taken out in the receiving seat 312 of the working area 31 by the transfer mechanism 33, and then the image taking machine The image 34 is taken as the sample piece 321 , and the sample image data of the sample holder 321 before the sample holder 321 is moved into the mounting seat 312 of the working area 31 can be reversely obtained as a reference for the position and angle of the rear transfer electronic component. .

請參閱第10、11圖,由於取像機構34已完成取像樣本件之作業,即可於作業區31之承置座312卸除該樣本單元之定位件及樣本件,以便後續正式執行電子元件測試作業;於執行測試作業時,為了使待作業之電子元件37可以精準對位放置於作業區31之承置座312內,係先進行電子元件取像程序,其係由移載機構33之取放器將待作業之電子元件移載至取像機構34之預設取像位置,該取像機構34之取像器即對待作業之電子元件37執行取像作業,並將取像之實際影像資料傳輸至比對機構35,於本實施例中,該移載機構33係以第一供料載台331之第一供料承座3311承置待作業之電子元件37,並載送至取像機構34之側方,移載機構33之第一驅動源333係帶動第一取放器334作Y軸向位移至第一供料載台331之上方,並以Z軸向作動件3331帶動第一取放器334作Z軸向向下位移,使第一取放器334之吸嘴3341於第一供料載台331之第一供料承座3311上取出待作業之電子元件37,該Z軸向作動件3331再帶動第一取放器334反向位移復位,該移載機構33之第一驅動源333係帶動第一取放器334作Y軸向位移,將待作業之電子元件37移載至取像機構34之預設取像位置,該取像機構34之第一取像器341係對待作業之電子元件37的電性接點進行取像作業,再將取像之實際影像資料傳輸至比對機構35;由於待作業電子元件37與樣本件均於相同之預設取像位置進行取像作業,接著進行比對程序,該比對機構35係對該實際影像資料與該資料庫351中的樣本影像資料進行比對,於本實施例中,由於資料庫351已建立有樣本影像資料,該比對機構35之控制器352係將實際影像資料與資料庫351中建立的樣本影像資料進行比對,如果比對結果在誤差值內,即可進行下一作業程序,若比對結果超出誤差值,則進一步執行對位調整程序。 Referring to FIGS. 10 and 11, since the image taking mechanism 34 has completed the operation of taking the image sample, the positioning member and the sample member of the sample unit can be removed from the receiving base 312 of the working area 31 for subsequent formal execution of the electronic components. In the test operation, in order to enable the electronic component 37 to be operated to be accurately placed in the socket 312 of the working area 31, the electronic component image capturing process is first performed, which is performed by the transfer mechanism 33. The pick-up device transfers the electronic component to be operated to the preset image capturing position of the image capturing mechanism 34. The image capturing device of the image capturing mechanism 34 performs the image capturing operation on the electronic component 37 to be operated, and the actual image capturing operation is performed. The image data is transmitted to the comparison mechanism 35. In the embodiment, the transfer mechanism 33 carries the electronic component 37 to be operated by the first supply holder 3311 of the first supply stage 331 and carries it to The first driving source 333 of the transfer mechanism 33 drives the first pick-and-placer 334 to be displaced in the Y-axis direction above the first feeding stage 331 and acts as the Z-axis actuating member 3331. The first pick-and-placer 334 is driven to perform a Z-axis downward displacement, so that the first pick-and-placer 334 The suction nozzle 3341 takes out the electronic component 37 to be operated on the first feeding socket 3311 of the first feeding stage 331, and the Z-axis actuating member 3331 drives the first pick-and-placer 334 to reverse displacement reset. The first driving source 333 of the carrier mechanism 33 drives the first pick-and-placer 334 for Y-axis displacement, and transfers the electronic component 37 to be operated to the preset image capturing position of the image capturing mechanism 34. The image capturing mechanism 34 The first image finder 341 is configured to perform an image capturing operation on the electrical contacts of the electronic component 37 to be operated, and then transmits the imaged actual image data to the comparison mechanism 35; since the electronic component 37 to be operated and the sample component are the same The image capturing operation is performed by the preset image capturing position, and then the comparing program is performed. The comparing mechanism 35 compares the actual image data with the sample image data in the database 351. In this embodiment, the data is The library 351 has established sample image data, and the controller 352 of the comparison mechanism 35 compares the actual image data with the sample image data established in the database 351, and if the comparison result is within the error value, the next step can be performed. An operating procedure, if the comparison result exceeds the error Value, the further implementation of the adjustment program position.

請參閱第12圖,當比對結果超出誤差值,該對位調整程序 係該調整機構36之X軸向調整件362、Y軸向調整件364及角度調整件365作X-Y軸向及角度之補償校正,使待作業之電子元件37於第一取放器334上進行對位調整程序,令待作業電子元件37之X-Y軸向位置及角度相同於取樣件之X-Y軸向位置及角度,以完成待作業之電子元件37之對位調整程序。 Please refer to Figure 12, when the comparison result exceeds the error value, the alignment adjustment procedure The X-axis adjustment member 362, the Y-axis adjustment member 364 and the angle adjustment member 365 of the adjustment mechanism 36 are compensated for the XY axial direction and the angle, so that the electronic component 37 to be operated is performed on the first pick-and-placer 334. The alignment adjustment program is such that the XY axial position and angle of the electronic component 37 to be operated are the same as the XY axial position and angle of the sampling member to complete the alignment adjustment procedure of the electronic component 37 to be operated.

請參閱第13圖,完成比對程序後,若比對結果在誤差值內或超出誤差值但完成對位調整程序,則接著進行置料執行作業程序,其係由移載機構33之取放器由預設取像位置將待作業電子元件37移載置入於作業區31之承置座312而執行預設作業,於本實施例中,由於移載機構33之第一取放器334係於預設取像位置將該樣本件移入作業區31之承置座312,該移載機構33之第一取放器334亦相同於預設取像位置將待作業電子元件37移入作業區31之承置座312,使待作業電子元件37相同於樣本件而可正確擺置於承置座312,使得待作業之電子元件37的電性接點可準確接觸承置座312內之電性傳輸件3121,以有效的執行電性測試作業,並獲致正確的測試結果。 Referring to Fig. 13, after the comparison procedure is completed, if the comparison result is within the error value or exceeds the error value but the alignment adjustment procedure is completed, then the nesting execution operation program is performed, which is taken by the transfer mechanism 33. The preset operation is performed by shifting the electronic component 37 to be placed in the mounting base 312 of the working area 31 by the preset image capturing position. In the present embodiment, the first pick-and-place 334 of the transfer mechanism 33 is used. The sample piece is moved into the receiving seat 312 of the working area 31 at the preset image capturing position, and the first pick-and-place 334 of the transfer mechanism 33 also moves the electronic component 37 to be moved into the working area in the same manner as the preset image capturing position. The mounting base 312 of the 31 makes the electronic component 37 to be operated identical to the sample component and can be correctly placed on the mounting base 312, so that the electrical contact of the electronic component 37 to be operated can accurately contact the electric power in the mounting base 312. The transmission member 3121 is effective for performing electrical test operations and obtaining correct test results.

請參閱第14圖,作業區31完成電子元件37的電性測試作業後,接著進行出料程序,其係由移載機構33將完成作業之電子元件37移出作業區31,於本實施例中,移載機構33之第一驅動源333係帶動第一取放器334將已作業之電子元件37移出作業區31之承置座312,並將已作業之電子元件37移載放置於第一收料載台332之第一收料承座3321上,第一收料載台332再將已作業之電子元件37移載至收料位置。 Referring to FIG. 14, after the work area 31 completes the electrical test operation of the electronic component 37, the discharge process is performed, and the electronic component 37 for completing the work is removed from the work area 31 by the transfer mechanism 33, in this embodiment. The first driving source 333 of the transfer mechanism 33 drives the first pick-and-place 334 to move the operated electronic component 37 out of the mounting base 312 of the working area 31, and the placed electronic component 37 is placed on the first position. On the first receiving receptacle 3321 of the receiving platform 332, the first receiving carrier 332 transfers the electronic component 37 already in operation to the receiving position.

請參閱第15圖,本發明之作業裝置30應用於作業設備時,以測試分類機為例,其係於機台40上設有供料裝置50、收料裝置60、作業裝置30、輸入端輸送裝置70及輸出端輸送裝置80;該供料裝置50係設有至少一供料承置器51,用以容納至少一待作業之電子元件;該收料裝置60係設有至少一收料承置器61,用以容納至少一已作業之電子元件;該輸入端輸送裝置70係設有至少一輸入端移料器71,用以將供料裝置50上待作業之電子元件分別輸送至作業裝置30之 第一供料載台331及第二供料載台335,第一供料載台331及第二供料載台335係將待作業之電子元件分別載送至作業裝置30之取像機構34的第一取像器341及第三取像器343側方,作業裝置30之移載機構33係以第一取放器334及第二取放器336分別於第一供料載台331及第二供料載台335取出待作業之電子元件,並移載至取像機構34的第一取像器341及第三取像器343取像,再移載至作業裝置30之作業區31執行測試作業,於完成測試作業後,移載機構33之第一取放器334及第二取放器336分別已作業之電子元件移載至第一收料載台332及第二收料載台337,第一收料載台332及第二收料載台337係將已作業之電子元件載出作業裝置30,輸出端輸送裝置80係設有至少一輸出端移料器81,用以於第一收料載台332及第二收料載台337取出已作業之電子元件,並依據測試結果,將已作業之電子元件輸送至收料裝置60分類放置,中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Referring to FIG. 15, when the working device 30 of the present invention is applied to a working device, the test sorting machine is taken as an example, and the feeding machine 50, the receiving device 60, the working device 30, and the input end are disposed on the machine table 40. The conveying device 70 and the output end conveying device 80; the feeding device 50 is provided with at least one feeding device 51 for accommodating at least one electronic component to be operated; the receiving device 60 is provided with at least one receiving material The receiver 61 is configured to receive at least one electronic component that has been operated; the input end conveyor 70 is provided with at least one input end shifter 71 for respectively conveying the electronic components to be operated on the feeding device 50 to Working device 30 The first feeding stage 331 and the second feeding stage 335, the first feeding stage 331 and the second feeding stage 335 are respectively carrying the electronic components to be operated to the image taking mechanism 34 of the working device 30. The first image finder 341 and the third image finder 343 are laterally disposed, and the transfer mechanism 33 of the working device 30 is respectively configured by the first pick-up unit 334 and the second pick-and-place unit 336 on the first feeding stage 331 and The second feeding stage 335 takes out the electronic components to be operated, and transfers them to the first image finder 341 and the third image finder 343 of the image taking mechanism 34 for image taking, and then transfers them to the working area 31 of the working device 30. After the test operation is completed, after the test operation is completed, the electronic components of the first pick-and-place 334 and the second pick-and-place 336 of the transfer mechanism 33 are respectively transferred to the first receiving stage 332 and the second receiving load. The stage 337, the first receiving stage 332 and the second receiving stage 337 are configured to carry the electronic component carrying operation device 30, and the output end conveying device 80 is provided with at least one output end shifter 81 for The electronic components that have been operated are taken out at the first receiving stage 332 and the second receiving stage 337, and the electronic components that have been operated are delivered to the test result according to the test result. The receiving device 60 is placed in a sorted manner, and the central control device is used to control and integrate the operations of the devices to perform automated operations, thereby achieving practical benefits of improving operational efficiency.

31‧‧‧作業區 31‧‧‧Working area

311‧‧‧測試電路板 311‧‧‧Test circuit board

312‧‧‧承置座 312‧‧‧ 承座

3121‧‧‧電性傳輸件 3121‧‧‧Electrical transmission parts

32‧‧‧樣本單元 32‧‧‧sample unit

321‧‧‧樣本件 321‧‧‧samples

3211‧‧‧取樣點 3211‧‧‧Sampling point

322‧‧‧定位件 322‧‧‧ positioning parts

33‧‧‧移載機構 33‧‧‧Transportation agency

331‧‧‧第一供料載台 331‧‧‧First feeding stage

3311‧‧‧第一供料承座 3311‧‧‧First supply seat

332‧‧‧第一收料載台 332‧‧‧First receiving platform

3321‧‧‧第一收料承座 3321‧‧‧First receiving seat

333‧‧‧第一驅動源 333‧‧‧First drive source

3331‧‧‧Z軸向作動件 3331‧‧‧Z axial actuator

334‧‧‧第一取放器 334‧‧‧First pick and place

3341‧‧‧吸嘴 3341‧‧ ‧ nozzle

34‧‧‧取像機構 34‧‧‧Image agency

341‧‧‧第一取像器 341‧‧‧first imager

35‧‧‧比對機構 35‧‧‧Comparative agencies

351‧‧‧資料庫 351‧‧‧Database

352‧‧‧控制器 352‧‧‧ Controller

36‧‧‧調整機構 36‧‧‧Adjustment agency

361‧‧‧固定座 361‧‧‧ fixed seat

362‧‧‧X軸向調整件 362‧‧‧X axial adjustment

363‧‧‧第一滑動座 363‧‧‧First sliding seat

364‧‧‧Y軸向調整件 364‧‧‧Y axial adjustment

365‧‧‧角度調整件 365‧‧‧ Angle adjustment

366‧‧‧第二滑動座 366‧‧‧Second sliding seat

Claims (10)

一種電子元件作業裝置,包含:作業區:係設有至少一承置座,以對待作業之電子元件執行預設的作業;樣本單元:係設有至少一樣本件,該樣本件係對位置入於該作業區之承置座;移載機構:係設有至少一取放器,以將該作業區之承置座內的樣本件移載至預設取像位置,以及將該待作業電子元件移載至該預設取像位置及該作業區之承置座;取像機構:係設有至少一取像器,以對該移載機構之取放器移載至該預設取像位置的該樣本件或該待作業電子元件取像,以獲得該樣本件之樣本影像資料或該待作業電子元件之實際影像資料;比對機構:係設有資料庫及控制器,該資料庫係儲存該樣本影像資料,該控制器係將該樣本影像資料與該取像機構傳輸之實際影像資料進行比對。 An electronic component working device comprises: a working area: at least one receiving seat is arranged to perform a preset operation on the electronic component to be operated; the sample unit is provided with at least the same piece, and the sample piece is located at a position a mounting base of the working area; a transfer mechanism: at least one pick-and-place device for transferring the sample piece in the receiving seat of the working area to a preset image taking position, and the electronic component to be operated Transferring to the preset image capturing position and the mounting seat of the working area; the image capturing mechanism: at least one image capturing device is provided to transfer the pick and place device of the transfer mechanism to the preset image capturing position Taking the sample piece or the electronic component to be processed to obtain the sample image data of the sample piece or the actual image data of the electronic component to be operated; the comparison mechanism: is provided with a database and a controller, and the database is provided The sample image data is stored, and the controller compares the sample image data with the actual image data transmitted by the image capturing mechanism. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該樣本單元係設有至少一定位件,以使該樣本件正確對位置入於該作業區之承置座。 The electronic component working device according to claim 1, wherein the sample unit is provided with at least one positioning member, so that the sample member is correctly positioned in the receiving seat of the working area. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該取像機構係設有第一取像器及第二取像器,該第一取像器係對預設取像位置處之該樣本件及該電子元件取像,並將取像之樣本影像資料傳輸至該比對機構,該第二取像器係對該作業區之承置座內的該樣本件取像,並將取像之對位影像資料傳輸至該比對機構。 The electronic component working device according to claim 1, wherein the image capturing mechanism is provided with a first image capturing device and a second image capturing device, wherein the first image capturing device is at a preset image capturing position. The sample member and the electronic component are imaged, and the sampled image data of the image is transmitted to the comparison mechanism, and the second imager is imaged by the sample member in the bearing seat of the working area, and The image data of the image to be taken is transmitted to the comparison mechanism. 依申請專利範圍第1或2項所述之電子元件作業裝置,其中,該作業區係設有具承置座之測試電路板,該承置座係供置入該樣本件或該具電性接點之電子元件,並設有至少一連接至該測試電路板之電性傳輸件,該樣本單元之樣本件係於相對應該待作業電子元件之電性接點位置設有取樣點。 The electronic component working device according to claim 1 or 2, wherein the working area is provided with a test circuit board having a socket for inserting the sample piece or the electrical component The electronic component of the contact is provided with at least one electrical transmission member connected to the test circuit board, and the sample component of the sample unit is provided with a sampling point corresponding to an electrical contact position of the electronic component to be operated. 依申請專利範圍第1項所述之電子元件作業裝置,更包含設有調整機構,於該比對機構將該電子元件之實際影像資料與該資料庫之樣本影像資料進行比對而有誤差時,對該電子元件可進行對位調整。 The electronic component working device according to claim 1, further comprising an adjusting mechanism, wherein the comparing device compares the actual image data of the electronic component with the sample image data of the database, and there is an error. The electronic component can be aligned. 依申請專利範圍第5項所述之電子元件作業裝置,其中,該調整機構係於該移載機構之取放器上架置多層式的調整平台,該調整平台上方為固定座,該固定座下方架設有一可由X軸向調整件驅動作X軸向滑移之第一滑動座,該第一滑動座下方再架設有一可由Y軸向調整件驅動作Y軸向滑移及可由角度調整件驅動作角度調整之第二滑動座,該取放器取放電子元件之吸嘴則固定於該第二滑動座下方,而直接於該取放器上對該電子元件進行對位調整。 The electronic component working device according to claim 5, wherein the adjusting mechanism is disposed on the pick-and-place device of the transfer mechanism, and the multi-layer adjusting platform is mounted on the pick-up mechanism, and the upper portion of the adjusting platform is a fixing seat, and the fixing seat is below The first sliding seat is driven by the X-axis adjusting member for X-axis sliding. The first sliding seat is further provided with a Y-axis adjusting member for Y-axis sliding and can be driven by the angle adjusting member. The angle-adjusted second sliding seat, the nozzle of the pick-and-place electronic component is fixed under the second sliding seat, and the electronic component is aligned directly on the pick-and-place device. 一種依申請專利範圍第1項所述之電子元件作業裝置的作業方法,包含有:樣本移入承置座程序:係將該樣本單元之樣本件正確對位移入於該作業區之承置座;樣本移出承置座程序:該移載機構之取放器係於該作業區之承置座內取出正確擺置之該樣本件,並移載至預設取像位置;樣本影像資料建構程序:該取像機構之取像器係對該預設取像位置處之樣本件取像,並將取像之樣本影像資料傳輸至該比對機構之資料庫,於該資料庫中建立樣本影像資料;電子元件取像程序:該移載機構之取放器係將待作業之電子元件移載至預設取像位置,該取像機構之取像器係對待作業之電子元件取像,並將取像之實際影像資料傳輸至該比對機構;比對程序:該比對機構係對該實際影像資料與該資料庫中的樣本影像資料進行比對;置料執行作業程序:完成該比對程序後,該移載機構之取放器由預設取像位置將該待作業之電子元件移入該作業區之承置座內執行預設作業。 The method for operating an electronic component working device according to claim 1, comprising: moving the sample into the socket: the sample of the sample unit is correctly displaced into the socket of the working area; The sample is removed from the socket program: the pick-and-place mechanism of the transfer mechanism is taken out in the socket of the working area to take out the correctly placed sample piece and transferred to the preset image taking position; the sample image data construction program: The image capturing device of the image capturing mechanism takes an image of the sample piece at the preset image capturing position, and transmits the sampled image data of the image to the database of the comparison mechanism, and establishes sample image data in the data library. Electronic component image capturing program: the pick and place mechanism of the transfer mechanism transfers the electronic component to be operated to a preset image capturing position, and the image capturing device of the image capturing mechanism takes an image of the electronic component to be operated, and The actual image data of the image is transmitted to the comparison mechanism; the comparison program: the comparison mechanism compares the actual image data with the sample image data in the database; and the storage execution operation program: complete the comparison After the program, The pick-and-place mechanism of the transfer mechanism moves the electronic component to be operated into the socket of the work area by a preset image taking position to perform a preset operation. 依申請專利範圍第7項所述之電子元件作業方法,其中,該樣本移入承置座程序係該樣本機構利用定位件使該樣本件對位移入於該承置座,該取像機構係以至少一第二取像器取像該承置座內之樣本件,並將 取像之對位影像資料傳輸至該比對機構,由該比對機構判別該樣本件是否準確置放於該承置座,於完成該樣本影像資料建構程序後,係將該樣本機構卸除。 The method of operating an electronic component according to claim 7, wherein the sample is moved into the socket program, and the sample mechanism uses the positioning member to displace the sample member into the holder, the image capturing mechanism is At least one second imager takes a sample piece in the holder and will The image data of the image is transmitted to the comparison mechanism, and the comparison mechanism determines whether the sample piece is accurately placed in the socket. After completing the construction process of the sample image data, the sample mechanism is removed. . 依申請專利範圍第7項所述之電子元件作業方法,其中,該比對程序若比對結果超出誤差值,則進一步執行對位調整程序,完成該調整程序後,再進行該置料執行作業程序。 The method for operating an electronic component according to claim 7, wherein if the comparison program exceeds the error value, the alignment adjustment program is further executed, and after the adjustment procedure is completed, the placement execution operation is performed. program. 一種應用電子元件作業裝置之作業設備,包含:機台;供料裝置:係配置於該機台上,並設有至少一供料承置器,用以承置待作業之電子元件;收料裝置:係配置於該機台上,並設有至少一收料承置器,用以承置已作業之電子元件;至少一依申請專利範圍第1項所述之電子元件作業裝置;輸入端輸送裝置:係配置於該機台上,並設有至少一輸入端移料器,以將該供料裝置上之待作業電子元件移載至該作業裝置;輸出端輸送裝置:係配置於該機台上,並設有至少一輸出端移料器,以將該作業裝置上之已作業電子元件依據作業結果分類放置於該收料裝置;中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。 An operation device for applying an electronic component working device, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for holding electronic components to be operated; receiving materials The device is disposed on the machine and is provided with at least one receiving device for accommodating the electronic components that have been operated; at least one electronic component working device according to claim 1 of the patent application; The conveying device is disposed on the machine table and is provided with at least one input end shifter for transferring the electronic component to be operated on the feeding device to the working device; the output end conveying device is configured And at least one output end shifter is arranged on the machine to classify the operated electronic components on the working device according to the operation result in the receiving device; the central control device is used for controlling and integrating the devices to actuate To perform automated work.
TW103145792A 2014-12-26 2014-12-26 An electronic component operating device, a working method, and a working device for its application TWI545329B (en)

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