TWI888034B - Probe card trimming device - Google Patents
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- TWI888034B TWI888034B TW113107924A TW113107924A TWI888034B TW I888034 B TWI888034 B TW I888034B TW 113107924 A TW113107924 A TW 113107924A TW 113107924 A TW113107924 A TW 113107924A TW I888034 B TWI888034 B TW I888034B
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Abstract
Description
本揭露有關於IC檢測,尤其是用於修整IC檢測用探針卡的一種探針卡研磨裝置。The present disclosure relates to IC testing, and more particularly to a probe card polishing device for trimming a probe card used for IC testing.
現今的晶圓在晶圓廠量產後,在出貨之前必須測試晶圓上各晶片功能為正常。一般而言,晶圓上約上萬個IC測試點,必須藉由探針卡檢測。探針卡具有一電路板以及陣列立設在電路板一面上的複數探針,探針對應前述的各測試點,這些的探針的尖端必須位於同一平面上。以這些的探針同時接觸晶圓表面上的該些測試點而能夠同時檢測。After the wafers are mass-produced in the wafer factory, they must be tested for normal function of each chip on the wafer before they are shipped. Generally speaking, there are about tens of thousands of IC test points on the wafer, which must be tested by a probe card. The probe card has a circuit board and a plurality of probes arranged in an array on one side of the circuit board. The probes correspond to the aforementioned test points, and the tips of these probes must be located on the same plane. These probes can simultaneously touch the test points on the surface of the wafer to enable simultaneous testing.
但探針卡經使用後其各探針磨損程度不一而使這些的探針的尖端不在同一平面上,因而無法正確量測造成晶圓的良率不佳。因此,探針卡經磨損至不堪使用時必須研磨該些探針之尖端使這些的探針的尖端位於同一平面。However, after the probe card is used, the wear degree of each probe tip is different, so that the tips of these probe tips are not on the same plane, so that the wafer yield cannot be measured correctly. Therefore, when the probe card is worn to the point of being unusable, the tips of these probe tips must be ground so that the tips of these probe tips are on the same plane.
一般的研磨方式係將砂紙放置於磨針盤上,再將探針放置於砂紙上並沿圓形路徑種移動磨針盤進行研磨。研磨後通常以肉眼確認,故容易誤判。如何有效率且準確地判讀探針尖端位置,是本領亟待解決的課題。The general grinding method is to place sandpaper on a grinding plate, then place the probe on the sandpaper and move the grinding plate along a circular path to grind. After grinding, it is usually confirmed by the naked eye, so it is easy to misjudge. How to efficiently and accurately judge the position of the probe tip is a problem that needs to be solved urgently.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。In view of this, the inventors have conducted intensive research and applied theories to the above-mentioned existing technologies to try their best to solve the above-mentioned problems, which has become the goal of the inventors' improvement.
本揭露提供用於修整IC檢測用探針卡的一種探針卡研磨裝置。The present disclosure provides a probe card polishing device for trimming a probe card for IC testing.
本揭露提供一種探針卡研磨裝置,包其含一外殼、一機體及一攝影組件。外殼具有一定位平面及一工作窗口,定位平面位於外殼頂部,工作窗口位於且定位平面上且連通外殼之內部。機體容置在外殼之內,機體具有一升降滑軌、一升降平台、一抬升致動器、一轉向滑軌、一旋轉盤、一驅動馬達及一凸輪,升降平台設置在升降滑軌,抬升致動器的作動方向垂直於升降滑軌,轉向滑軌傾斜配置且連接在升降平台及抬升致動器之間,旋轉盤對應工作窗口之位置可平移地設置在升降平台,驅動馬達及凸輪設置在升降平台且凸輪連接在旋轉盤及驅動馬達之間。攝影組件包含一鏡頭以及一反光鏡,鏡頭的軸向朝向反光鏡配置,且反光鏡之法線方向與鏡頭的軸向之夾角等於反光鏡之法線方向與定位平面之夾角。The present disclosure provides a probe card grinding device, which includes a housing, a body and a camera assembly. The housing has a positioning plane and a working window, the positioning plane is located on the top of the housing, and the working window is located on the positioning plane and connected to the interior of the housing. The body is accommodated in the outer shell, and the body has a lifting slide, a lifting platform, a lifting actuator, a steering slide, a rotating disk, a driving motor and a cam. The lifting platform is arranged on the lifting slide, the actuation direction of the lifting actuator is perpendicular to the lifting slide, the steering slide is tilted and connected between the lifting platform and the lifting actuator, the rotating disk is arranged on the lifting platform in a translational manner at a position corresponding to the working window, the driving motor and the cam are arranged on the lifting platform, and the cam is connected between the rotating disk and the driving motor. The photographic assembly includes a lens and a reflector, the axis of the lens is arranged toward the reflector, and the angle between the normal direction of the reflector and the axis of the lens is equal to the angle between the normal direction of the reflector and the positioning plane.
本揭露供一實施例中,探針卡研磨裝置更包含一第一平面滑軌及一第二平面滑軌,第一平面滑軌設置在升降平台上,第二平面滑軌設置在第一平面滑軌上,旋轉盤設置在第二平面滑軌上,且第一平面滑軌及第二平面滑軌相互垂直配置。In an embodiment of the present disclosure, the probe card grinding device further includes a first plane slide rail and a second plane slide rail, the first plane slide rail is arranged on the lifting platform, the second plane slide rail is arranged on the first plane slide rail, the rotating plate is arranged on the second plane slide rail, and the first plane slide rail and the second plane slide rail are arranged perpendicular to each other.
本揭露供一實施例中,攝影組件更包含一光源,光源與反光鏡相對地配置在升降平台的二側。In an embodiment of the present disclosure, the photographic assembly further includes a light source, and the light source and the reflective mirror are disposed on two sides of the lifting platform opposite to each other.
本揭露供一實施例中,反光鏡上附設有一補光燈,補光燈之投射方向朝向光源配置,且補光燈之投射方向相對於光源之投射方向偏斜配置。補光燈之投射方向相對於光源之投射方向偏斜10度至20度。In one embodiment of the present disclosure, a fill light is attached to the reflector, the projection direction of the fill light is arranged toward the light source, and the projection direction of the fill light is arranged obliquely relative to the projection direction of the light source. The projection direction of the fill light is inclined by 10 to 20 degrees relative to the projection direction of the light source.
本揭露供一實施例中,攝影組件包含一升降致動器,鏡頭設置在升降致動器上而能夠相對於反光鏡移動。In one embodiment of the present disclosure, a photographic assembly includes a lifting actuator, and a lens is disposed on the lifting actuator and can move relative to a reflective mirror.
本揭露供一實施例中,攝影組件包含一移動平台及一平移致動器,移動平台設置在平移致動器上,反光鏡及升降致動器設置在移動平台上。In an embodiment of the present disclosure, a photographic assembly includes a moving platform and a translation actuator, the moving platform is disposed on the translation actuator, and the reflector and the lifting actuator are disposed on the moving platform.
本揭露供一實施例中,鏡頭的軸向直立配置且反光鏡之法線方向與鏡頭的軸向之夾角為45度。In one embodiment of the present disclosure, the lens is arranged vertically in the axial direction and the angle between the normal direction of the reflective mirror and the axial direction of the lens is 45 degrees.
本揭露之探針卡研磨裝置,其鏡頭可以經由反光鏡由升降平台之側向擷取位於工作窗口的探針之影像,藉此可以配置較大倍率的鏡頭以便於判讀該些探針之尖端位置,而且鏡頭不會在升降平台的一側橫向凸出過長。The lens of the probe card grinding device disclosed in the present invention can capture the image of the probe located at the working window from the side of the lifting platform through a reflective mirror, thereby configuring a lens with a larger magnification to facilitate the judgment of the tip position of the probes, and the lens will not protrude too long horizontally on one side of the lifting platform.
在本揭露的描述中,需要理解的是,術語「前側」、「後側」、「左側」、「右側」、「前端」、「後端」、「末端」、「縱向」、「橫向」、「垂向」、「頂部」、「底部」等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅係為了便於描述本揭露和簡化描述,並非指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不應理解為對本揭露的限制條件。In the description of the present disclosure, it is necessary to understand that the terms "front", "rear", "left", "right", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limiting condition for the present disclosure.
使用於此且未另外定義,「實質上」及「大約」等用語係用於描述及敘述小變化。當結合於一事件或情況,該用語可包含事件或情況發生精確的當下、以及事件或情況發生至一接近的近似點。例如,當結合於一數值,該用語可包含一變化範圍小於或等於該數值之±10%,如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%、或小於或等於±0.05%。As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When used in conjunction with an event or circumstance, the terms may include the exact time at which the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation. For example, when used in conjunction with a numerical value, the terms may include a variation range of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.
有關本揭露之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本揭露。The detailed description and technical contents of the present disclosure are described below with the help of drawings. However, the attached drawings are only used for illustration and are not used to limit the present disclosure.
參閱圖1至圖4,本揭露提供一種探針卡研磨裝置,其至少包含有一外殼100、一機體200及攝影組件300。於本實施例中,外殼100為金屬製的中空立方殼體,外殼100具有一定位平面110及一工作窗口111,而且於本實施例中其定位平面110位於外殼100的頂面,工作窗口111位於定位平面110上且連通外殼100之內部。於本實施例中,定位平面110用於承載探針卡10之電路板11以將探針卡10定位,探針卡10之探針11則容納在工作窗口111以利進行修整作業。Referring to FIGS. 1 to 4 , the present disclosure provides a probe card polishing device, which at least includes a
為了便說明,在本揭露實施例中所提及之滑軌皆包含軌道及該置在軌道上的滑塊,滑塊及軌道能夠相對地線性移動,滑軌之二側係指軌道及滑塊的其中之一者以及另一者,滑軌之縱向指軌道之縱向。在本揭露實施例中所提及之致動器皆包含馬達驅動的螺桿以及螺接於螺桿的螺母,螺桿旋轉時能夠推動螺母使螺桿與螺母相對地線性移動,致動器的二端係指螺桿及螺母的其中之一者以及另一者,致動器之縱向指螺桿之縱向。For the sake of explanation, the slide rails mentioned in the disclosed embodiments all include the rail and the slider placed on the rail. The slider and the rail can move linearly relative to each other. The two sides of the slide rail refer to one of the rail and the slider and the other. The longitudinal direction of the slide rail refers to the longitudinal direction of the rail. The actuators mentioned in the disclosed embodiments all include a screw driven by a motor and a nut screwed to the screw. When the screw rotates, it can push the nut to make the screw and the nut move linearly relative to each other. The two ends of the actuator refer to one of the screw and the nut and the other. The longitudinal direction of the actuator refers to the longitudinal direction of the screw.
參閱圖1至圖3,於本實施例中,機體200容置在外殼100之內,機體200至少具有一升降滑軌210、一升降平台220、一抬升致動器230、一轉向滑軌240、一旋轉盤250、一驅動馬達261及一凸輪262。具體而言,機體200還具有一底座201以供設置前述的元件。1 to 3 , in this embodiment, the
參閱圖4,升降滑軌210立設在底座201上,升降平台220設置在升降滑軌210,也就是說,升降滑軌210的二側分別連接於底座201及升降平台220,藉此使得升降平台220能夠沿著升降滑軌210的縱向升降移動。參閱圖5,抬升致動器230的作動方向垂直於升降滑軌210,具體而言,抬升致動器230的作動方向沿其縱向,抬升致動器230水平設置在底座201上,抬升致動器230的縱向垂直於升降滑軌210的縱向。轉向滑軌240傾斜配置且轉向滑軌240的二側連接在該升降平台220及該抬升致動器230之間,具體而言,轉向滑軌240的一側連接升降平台220抬升致動器230的二端則分別連接轉向滑軌240的另一側以及底座201。Referring to FIG4 , the
參閱圖1至圖2,旋轉盤250水平設置在升降平台220上,旋轉盤250可在升降平台220上平移,且旋轉盤250對應工作窗口111之位置配置。參閱圖4至圖6,本揭露的探針卡研磨裝置更包含一第一平面滑軌251及一第二平面滑軌252,第一平面滑軌251設置在升降平台220上,第二平面滑軌252設置在該第一平面滑軌251上,該旋轉盤250設置在該第二平面滑軌252上,且該第一平面滑軌251及該第二平面滑軌252相互垂直配置,旋轉盤250藉由第一平面滑軌251及一第二平面滑軌252而容許在升降平台220上平移。具體而言,第一平面滑軌251的二側分別連接升降平台220上以及第二平面滑軌252的一側,第二平面滑軌252的另一側且連接旋轉盤250。1 and 2 , the rotating
參閱圖1、圖2及圖8,驅動馬達261及凸輪262皆設置在升降平台220上,而且凸輪262連接在旋轉盤250及該驅動馬達261之間,驅動馬達261連接凸輪262之中心軸以驅動凸輪262旋轉,凸輪262的一側且連接旋轉盤250(可能直接連接或以桿件連接),藉此,凸輪262被驅動馬達261驅動旋轉時能夠帶動旋轉盤250沿一圓形路徑繞行旋轉。參閱圖4,升降平台220可以升至接觸位於工作窗口111的探針11,當旋轉盤250旋轉時能夠以旋轉盤250定義的同一平面同時研磨該些探針11之尖端直到該些探針11之尖端位於同一平面。Referring to FIG. 1 , FIG. 2 and FIG. 8 , the
參閱圖2至圖4,攝影組件300配置在升降平台220的一側。攝影組件300至少包含一鏡頭310以及一反光鏡320,鏡頭310的軸向朝向反光鏡320配置,且如圖4所示,反光鏡320之法線方向與鏡頭310的軸向之夾角等於反光鏡320之法線方向與定位平面110之夾角,也就是說,平行於定位平面110之光線L可經由反光鏡320反射至鏡頭310(升降平台220可人以降下以容許光線L通過)。於本實施例中,鏡頭310的軸向直立配置,反光鏡320配置在升降平台220的一側,且反光鏡320之法線方向與該鏡頭310的軸向之夾角為45度,鏡頭310可以經由反光鏡320由升降平台220之側向擷取位於工作窗口111的探針11之影像,藉此可以配置較大倍率的鏡頭310以便於判讀該些探針11之尖端位置,而且鏡頭310不會在升降平台220的一側橫向凸出過長。Referring to FIGS. 2 to 4 , the
參閱圖2及圖4,本揭露的探針卡研磨裝置其攝影組件300更包含一光源400,該光源400與該反光鏡320相對地配置在該升降平台220的二側,光源400沿著平行於升降平台220的方向投射光線L至反光鏡320再反射至鏡頭310,藉此可增加擷取影像之背景亮度以利判讀。2 and 4 , the
參閱圖2、圖3及圖8,本揭露的探針卡研磨裝置其反光鏡320上附設有一補光燈330,補光燈330之投射方向朝向該光源400配置,且如疊所示補光燈330之投射方向相對於光源400之投射方向偏斜配置,藉此可以消除擷取影像中的陰影以利判讀。具體而言,前述之偏斜角範圍介於10度至20度之間,於本實施例中為12度。Referring to FIG. 2, FIG. 3 and FIG. 8, the probe card grinding device disclosed in the present invention has a
參閱圖3、圖6及圖7,本揭露的探針卡研磨裝置其攝影組件300包含一升降致動器341、一平移致動器342及一移動平台343,移動平台343設置在平移致動器342上,反光鏡320及該升降致動器341設置在移動平台343上。參閱圖6,反光鏡320能夠藉由平移致動器342驅動平移以對準待測位置。參閱圖7,鏡頭310設置在該升降致動器341上而能夠相對於該反光鏡320移動以利於對焦。Referring to FIG. 3, FIG. 6 and FIG. 7, the
參閱圖1,本揭露的探針卡研磨裝置可以更包含一顯示器500,顯示器500設置在外殼100的頂部,前述擷取的影像可以顯示器500以便於判讀。Referring to FIG. 1 , the probe card polishing device disclosed herein may further include a
以上所述僅為本創作之較佳實施例,非用以限定本創作之專利範圍,其他運用本創作之專利精神之等效變化,均應俱屬本創作之專利範圍。The above is only the preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Other equivalent variations that utilize the patent spirit of the present invention should all fall within the patent scope of the present invention.
100:外殼 110:定位平面 111:工作窗口 200:機體 201:底座 210:升降滑軌 220:升降平台 230:抬升致動器 240:轉向滑軌 250:旋轉盤 251:第一平面滑軌 252:第二平面滑軌 261:驅動馬達 262:凸輪 300:攝影組件 310:鏡頭 320:反光鏡 330:補光燈 341:升降致動器 342:平移致動器 343:移動平台 400:光源 500:顯示器 L:光線 100: housing 110: positioning plane 111: working window 200: machine body 201: base 210: lifting slide 220: lifting platform 230: lifting actuator 240: steering slide 250: rotating plate 251: first plane slide 252: second plane slide 261: driving motor 262: cam 300: camera assembly 310: lens 320: reflector 330: fill light 341: lifting actuator 342: translation actuator 343: moving platform 400: light source 500: display L: light
圖1係本揭露的探針卡研磨裝置之立體示意圖。FIG. 1 is a three-dimensional schematic diagram of the probe card polishing device disclosed in the present invention.
圖2係本揭露的探針卡研磨裝置其機體之立體示意圖。FIG. 2 is a three-dimensional schematic diagram of the probe card polishing device disclosed in the present invention.
圖3係本揭露的探針卡研磨裝置其攝影組件之側視圖。FIG. 3 is a side view of the photographic component of the probe card polishing device disclosed herein.
圖4係本揭露的探針卡研磨裝置之側視圖。FIG. 4 is a side view of the probe card polishing device of the present disclosure.
圖5係本揭露的探針卡研磨裝置其機體之剖視圖。FIG. 5 is a cross-sectional view of the probe card polishing device of the present disclosure.
圖6係本揭露的探針卡研磨裝置其攝影組件升降作動之示意圖。FIG. 6 is a schematic diagram showing the lifting motion of the photographic assembly of the probe card polishing device disclosed herein.
圖7係本揭露的探針卡研磨裝置其攝影組件平移作動之示意圖。FIG. 7 is a schematic diagram showing the translational motion of the photographic component of the probe card polishing device disclosed herein.
圖8係本揭露的探針卡研磨裝置之俯視圖。FIG. 8 is a top view of the probe card polishing device of the present disclosure.
200:機體 200: Body
201:底座 201: Base
220:升降平台 220: Lifting platform
230:抬升致動器 230: Lifting actuator
250:旋轉盤 250: Rotating plate
261:驅動馬達 261: Driving motor
262:凸輪 262: Cam
300:攝影組件 300:Photographic components
310:鏡頭 310: Lens
320:反光鏡 320: Mirror
330:補光燈 330:Fill light
343:移動平台 343: Mobile platform
400:光源 400: Light source
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113107924A TWI888034B (en) | 2024-03-05 | 2024-03-05 | Probe card trimming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113107924A TWI888034B (en) | 2024-03-05 | 2024-03-05 | Probe card trimming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI888034B true TWI888034B (en) | 2025-06-21 |
| TW202535598A TW202535598A (en) | 2025-09-16 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113107924A TWI888034B (en) | 2024-03-05 | 2024-03-05 | Probe card trimming device |
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| Country | Link |
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| TW (1) | TWI888034B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201221965A (en) * | 2010-06-25 | 2012-06-01 | Tokyo Electron Ltd | Parallelism adjusting mechanism of probe card and inspection apparatus |
| TW201704764A (en) * | 2015-07-16 | 2017-02-01 | 旺矽科技股份有限公司 | Probe device |
| TW201707851A (en) * | 2015-08-27 | 2017-03-01 | 羅振宏 | Grinding machine for optical observation function |
| TW201803689A (en) * | 2016-07-21 | 2018-02-01 | 創新服務股份有限公司 | Single-probe grinding machine capable of achieving fast burr trimming operation to enhance production efficiency and reduce manufacturing cost |
-
2024
- 2024-03-05 TW TW113107924A patent/TWI888034B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201221965A (en) * | 2010-06-25 | 2012-06-01 | Tokyo Electron Ltd | Parallelism adjusting mechanism of probe card and inspection apparatus |
| TW201704764A (en) * | 2015-07-16 | 2017-02-01 | 旺矽科技股份有限公司 | Probe device |
| TW201707851A (en) * | 2015-08-27 | 2017-03-01 | 羅振宏 | Grinding machine for optical observation function |
| TW201803689A (en) * | 2016-07-21 | 2018-02-01 | 創新服務股份有限公司 | Single-probe grinding machine capable of achieving fast burr trimming operation to enhance production efficiency and reduce manufacturing cost |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202535598A (en) | 2025-09-16 |
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