TWI888000B - Method for manufacturing resin molded product, molding die and resin molding device - Google Patents

Abstract

A method for producing a resin molded product, which suppresses the generation of wrinkles in a mold release film during compression molding using a mold release film, and suppresses the generation of resin protrusions that fall off when the resin molded product is transported after the resin molding. In the manufacturing method of the resin molded product of the present invention, the resin molding process is a process of arranging a molding object between an upper mold and a lower mold (200), arranging a mold release film on the bottom and side of the cavity (200A), and arranging a resin material on the mold release film, and then closing the molding mold and performing resin molding by compression molding to manufacture the resin molded product; the conveying process is a process of opening the molding mold after the resin molding process, taking the resin molded product out of the molding mold and conveying it, and forming a step difference (201D) with a depth below the thickness of the mold release film at a position adjacent to the inner peripheral surface of the lower mold side part (201) on the upper surface of the lower mold side part (201).

Description

Method for manufacturing resin molded product, molding die and resin molding device

The present invention relates to a method for manufacturing a resin molded product, a molding die and a resin molding device.

In the manufacture of resin molded products, compression molding utilizing a molding die is widely used. In addition, in this compression molding, in order to prevent the resin from leaking out of the molding die, a mold release film is sometimes used.

Patent document 1 describes a structure in which, in a lower mold of a molding die that uses a mold release film for compression molding, a protrusion is formed on the outer peripheral edge of the upper surface of the lower mold bottom surface component (compression mold), and a step difference is formed on the inner peripheral surface of the lower mold side surface component (frame type). According to the description of patent document 1, by this structure, when the mold is closed for compression molding with the mold release film arranged on the upper surface of the lower mold, wrinkles generated on the mold release film can be removed. By preventing wrinkles from being generated on the mold release film, defects of resin molded products caused by the wrinkles can be suppressed.

Prior art documents Patent documents Patent document 1: Japanese Patent Publication No. 2013-180461

Problems to be solved

However, in the molding die described in Patent Document 1, protrusions corresponding to the step difference of the lower mold side member remain on the outer periphery of the resin molded product after the resin is molded. If such protrusions remain, there is a risk that the protrusions will fall off when the resin molded product is taken out of the molding die and transported. The falling of such protrusions may become a major cause of defective products or a major cause of stopping the operation of the resin molding device, which may reduce productivity.

Therefore, an object of the present invention is to provide a method for manufacturing a resin molded product, a molding die, and a resin molding device that can suppress the generation of wrinkles in a mold release film during compression molding using a mold release film, and suppress the generation of resin protrusions that fall off when the resin molded product is transported after the resin molding.

Solution

In order to achieve the above-mentioned purpose, the manufacturing method of the resin molded product of the present invention is a manufacturing method of the resin molded product using a molding mold, wherein the molding mold includes an upper mold and a lower mold, the upper mold and the lower mold are arranged opposite to each other, the lower mold includes a lower mold bottom surface component and a lower mold side surface component, a cavity is formed by a space surrounded by the upper surface of the lower mold bottom surface component and the inner periphery of the lower mold side surface component, the upper surface of the lower mold bottom surface component forms the bottom surface of the cavity, and the inner periphery of the lower mold side surface component forms the side surface of the cavity, the manufacturing method of the resin molded product includes a resin molding process and a conveying process, The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a mold release film on the bottom and side of the cavity, and placing a resin material on the mold release film, and then closing the molding mold and performing resin molding by compression molding to manufacture the resin molded product. The conveying process is a process of opening the molding mold after the resin molding process, taking the resin molded product out of the molding mold and conveying it. On the upper surface of the lower mold side member, at a portion adjacent to the inner peripheral surface of the lower mold side member, a step difference of a depth below the thickness of the mold release film is formed.

The first molding die of the present invention is the molding die used in the method for producing a resin molded product of the present invention.

The second molding die of the present invention is a compression molding die for a manufacturing method of a resin molded product, wherein the molding die includes an upper mold and a lower mold, the upper mold and the lower mold are arranged opposite to each other, the lower mold includes a lower mold bottom surface component and a lower mold side surface component, a cavity is formed by a space surrounded by the upper surface of the lower mold bottom surface component and the inner periphery of the lower mold side surface component, the upper surface of the lower mold bottom surface component forms the bottom surface of the cavity, and the inner periphery of the lower mold side surface component forms the side surface of the cavity, In the manufacturing method of the resin molded product, a molding object is arranged between the upper mold and the lower mold, a mold release film is arranged on the bottom and side of the cavity, and the molding mold is clamped and the resin is molded by compression molding in a state where a resin material is arranged on the mold release film, thereby manufacturing the resin molded product, and a step difference of a depth below the thickness of the mold release film is formed on the upper surface of the lower mold side member at a portion adjacent to the inner peripheral surface of the lower mold side member.

In addition, hereinafter, unless otherwise specified, "the molding die of the present invention" includes both the first molding die of the present invention and the second molding die of the present invention.

The resin molding device of the present invention is a resin molding device comprising: the molding die of the present invention; and a clamping mechanism for clamping the upper mold and the lower mold of the molding die.

Effect of invention

The present invention can provide a method for manufacturing a resin molded product, a molding die, and a resin molding device that can suppress the generation of wrinkles in the mold release film during compression molding using the mold release film, and suppress the generation of resin protrusions that fall off when the resin molded product is transported after the resin molding.

In the present invention, the molding die is not particularly limited, and may be, for example, a metal die or a ceramic die.

In the present invention, when referring to the "suppression" of the generation of resin protrusions, the relaxation of the release film, the generation of wrinkles in the release film, etc., unless otherwise specified, it is not limited to the case where the occurrence of these phenomena is suppressed to a smaller level, but also includes the case where the occurrence of these phenomena is reduced to zero.

In the present invention, the resin molded product is not particularly limited, and for example, it may be an electronic component formed by resin-sealing electronic elements such as ICs and semiconductor chips (hereinafter sometimes referred to as "chips"). More specifically, for example, by resin-sealing a chip, the chip can become a resin-sealed electronic component (also referred to as an electronic component or package as a finished product. Hereinafter, it is sometimes referred to as an "electronic component"). In addition, generally speaking, an "electronic component" can refer to the state of a chip before resin sealing and the state of a chip sealed with resin. However, in the present invention, a chip before resin sealing is referred to as an "electronic element", and a chip after resin sealing is referred to as an "electronic component" (electronic component as a finished product). That is, in the present invention, "chip" and "electronic element" have the same meaning, and specifically, for example, IC, semiconductor chip, semiconductor element for power control, resistor element, capacitor element and other chips can be cited. In addition, "semiconductor element" refers to a circuit element made of semiconductor as a material, for example. The "chip" or "electronic element" in the present invention is not particularly limited as long as it is a chip before resin sealing, and it does not need to be in a chip form.

In the present invention, there are no particular restrictions on the resin material before molding and the resin after molding, and for example, it can be a thermosetting resin such as epoxy resin or silicone resin, or it can be a thermoplastic resin. In addition, it can also be a composite material that partially contains a thermosetting resin or a thermoplastic resin. In the present invention, as the form of the resin material before molding, for example, powdered resin (including granular resin), liquid resin, sheet resin, flat resin, etc. can be cited. In addition, in the present invention, the liquid resin can be liquid at room temperature, and also includes a molten resin that is melted by heating to become liquid. The form of the resin can be any form as long as it can be supplied to the cavity or tank of the molding mold, etc., and it can also be in other forms.

Next, the specific implementation of the present invention will be described based on the attached drawings. For the convenience of description, each figure is drawn schematically, and appropriate omissions, exaggerations, etc. are made.

[Implementation method 1]

In this embodiment, an example of the molding die of the present invention and an example of a method for producing a resin molded product using the same are described.

FIG. 1 shows an example of the structure of the molding die of the present invention. FIG. 1(a) is a plan view (top view). FIG. 1(b) is a cross-sectional view observed along the I-I direction of FIG. 1(a). However, in FIG. 1 , for the sake of simplicity, the upper mold of the molding die is omitted, and the lower mold is also simplified.

As shown in FIG. 1 , the molding die includes a lower die 200. Although not shown, the molding die includes an upper die as described above. The upper die and the lower die 200 are arranged so that the lower surface of the upper die and the upper surface of the lower die 200 face each other. The structure of the upper die is not particularly limited, and for example, it may be a structure capable of fixing the molding object on the lower surface of the upper die as shown in FIGS. 2 to 7 described later.

As shown in the figure, the lower mold 200 includes a lower mold bottom member 202 and a lower mold side member 201. The space surrounded by the upper surface of the lower mold bottom member 202 and the inner periphery of the lower mold side member 201 forms a cavity 200A. The upper surface of the lower mold bottom member 202 forms the bottom surface of the cavity 200A, and the inner periphery of the lower mold side member 201 forms the side surface of the cavity 200A. As described in Figures 2 to 7 described later, a molding object is arranged between the upper mold and the lower mold 200, a mold release film is arranged on the bottom surface and the side surface of the cavity 200A, and a resin material is arranged on the mold release film. The molding mold is closed, and the resin is molded by compression molding to manufacture a resin molded product.

In the lower mold 200 of FIG. 1 , no protrusions are formed on the outer periphery of the upper surface of the lower mold bottom member 202 so that the surface is flat.

On the upper surface of the lower mold side member 201, a step 201D having a depth less than the thickness of the mold release film is formed at a position adjacent to the inner peripheral surface of the lower mold side member 201. The outer end of the step 201D is located on the inner side of the outer edge of the configuration area α of the molding object. In addition, an exhaust groove 201C extending further outward than the step 201D is formed on the upper surface of the lower mold side member 201. The exhaust groove 201C is a groove formed on the upper surface of the lower mold side member 201. There are a plurality of exhaust grooves 201C, which are radially formed on a portion of the periphery of the step 201D. In FIG. 1 , the step 201D is connected to the exhaust groove 201C. The outer end of the exhaust groove 201C is located outside the outer edge of the arrangement area α of the molding object. For example, the gas (air, etc.) in the cavity 200A can be released into the exhaust groove 201C. In addition, for example, the mold release film can also be sucked through the exhaust groove 201C.

The width W1 of the step 201D (the distance from the side in contact with the inner peripheral surface of the lower mold side member 201 to the opposite side) is not particularly limited, but is preferably 0.05 mm or more from the viewpoint of more easily suppressing the generation of wrinkles on the mold release film. The upper limit is not particularly limited, but depends on the distance from the end surface of the molding object (such as a substrate) to the step 201D, and is, for example, 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 4 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, or 0.1 mm or less.

In FIG. 1 , the step 201D is formed on the upper surface of the lower mold side member 201 over the entire circumference (all the parts) of the part adjacent to the inner circumference of the lower mold side member 201. However, the present invention is not limited thereto, and the step 201D may not be formed over the entire circumference. For example, the step 201D may be provided only in a part of the part adjacent to the inner circumference of the lower mold side member 201 on the upper surface of the lower mold side member 201, and the step 201D may not be provided in a part. Specifically, for example, a structure may be adopted in which the step 201D is not provided in a part of the part where even a very small amount of the resin material is not allowed to leak.

Furthermore, a through hole 201A and a through hole 201B are formed on the upper surface of the lower mold side member 201. The through hole 201A is arranged at a portion of the outer side of the step 201D and the exhaust groove 201C, and penetrates from the upper surface of the lower mold side member 201 to the lower surface. As shown in the figure, the through hole 201A has the following structure: a groove having a V-shaped cross section when viewed from the side is formed on the upper surface of the lower mold side member 201, and a plurality of through holes having a circular planar shape are formed at the bottom of the V-shaped groove. The through hole 201B is arranged in a manner surrounding the entire circumference of the outer side of the through hole 201A, and penetrates from the upper surface of the lower mold side member 201 to the lower surface. 2 to 7, the mold release film can be sucked through the through hole 201A and the through hole 201B and adsorbed on the cavity surface of the cavity 200A. In addition, as described later, a resin for resin molding can be stored in the cavity 200A.

Next, the manufacturing method of the resin molded product of the present invention using the molding die of Fig. 1 and the resin molding device of the present invention including the molding die is described by way of example using the schematic process cross-sectional views of Fig. 2 to Fig. 7. In Fig. 2 to Fig. 7, the same components as those in Fig. 1 are represented by the same symbols. However, for the convenience of illustration, the shapes and the like may be different from those in Fig. 1.

First, the structure of the resin molding device is explained using FIG2. As shown in the figure, the molding mold in the resin molding device has an upper mold 100 in addition to the lower mold 200 shown in FIG1. Furthermore, as shown in FIG1, the resin molding device includes an external gas shielding component 300 and a mold release film adsorption mechanism (not shown) in addition to the molding mold. The mold surface of the upper mold 100 and the mold surface of the lower mold 200 are opposite to each other. The upper mold 100 is fixed to the lower surface of the upper mold holding component 110. The lower mold 200 is fixed to the upper surface of the lower mold holding component 210. As described later, the upper mold 100 is a mold that fixes the substrate 10. The substrate 10 is equivalent to the "molding object" of the present invention. As described later, the lower mold 200 is a mold that forms a cavity on the mold surface and adsorbs the mold release film on the mold surface. The external gas shielding member 300 is mounted on the lower surface of the upper mold holding member 110 and the upper surface of the lower mold holding member 210 in a manner of surrounding the upper mold 100 and the lower mold 200. As described later, the external gas shielding member 300 can surround the molding mold (upper mold 100 and lower mold 200) together with the upper mold holding member 110 and the lower mold holding member 210, thereby isolating them from the outside air.

The upper mold 100 is formed by installing a film pressing member 103 and a clamp 104 on the upper mold main body 102. The film pressing member 103 is installed on the lower part of the upper mold main body 102 via the upper mold elastic member 103s. In this embodiment, a spring is used as the upper mold elastic member. The film pressing member 103 can move up and down by the extension and contraction of the upper mold elastic member 103s. And, as described later, the demolding film can be pressed against the lower mold side member 201 by the film pressing member 103. As shown in the figure, the clamp 104 can clamp and fix the substrate 10 between the lower surface of the upper mold main body 102 and the clamp 104. In addition, the arrangement positions of the film pressing member 103 and the clamp 104 are not limited to the arrangement shown in FIG. 2 and are arbitrary.

The upper mold body 102 and the upper mold holding member 110 are provided with through holes 100B and 300B which penetrate from the upper surface to the lower surface thereof. The lower end of the through hole 100B is opened on the fixing surface of the substrate 10 on the lower surface of the upper mold body 102. As described later, by reducing the pressure by sucking the inside of the through hole 100B, the substrate 10 can be adsorbed on the upper mold body 102. The lower end of the through hole 300B is opened on the peripheral portion of the fixing surface of the substrate 10. As described later, by reducing the pressure by sucking the inside of the through hole 300B, the space surrounded by the external gas shielding member 300 can be made into a negative pressure.

As shown in FIG1 , the lower mold 200 has a lower mold bottom member 202 and a lower mold side member 201. The lower mold side member 201 is mounted on the peripheral portion of the upper surface of the lower mold bottom member 202 via the lower mold elastic member 201s. In the present embodiment, a spring is used as the lower mold elastic member. The lower mold side member 201 can move up and down by the extension and contraction of the lower mold elastic member 201s. In addition, as shown in the figure, a cavity 200A is formed by a space surrounded by the central portion of the upper surface of the lower mold bottom member 202 (a portion where the lower mold side member 201 is not mounted) and the inner side of the lower mold side member 201. As described later, a resin for resin molding can be accommodated in the cavity 200A.

As described above, no protrusions are formed on the outer periphery of the upper surface of the lower mold bottom member 202 so that the surface is flat.

The step 201D and the exhaust groove 201C described in Fig. 1 are formed on the upper surface of the lower mold side member 201. The arrangement and structure of the step 201D and the exhaust groove 201C are as described in Fig. 1, respectively.

As described above, the lower mold side member 201 is provided with through holes 201A and 201B. In addition, the lower mold bottom member 202 and the lower mold holding member 210 are provided with a through hole 200B. The lower end of the through hole 200B opens from the lower surface of the lower mold bottom member 202 to the lower surface of the lower mold holding member 210, and the other end is connected to the gap between the lower mold bottom member 202 and the lower mold side member 201, and forms the through hole 200B together with the gap. The through hole 201A penetrates the lower mold holding member 210, and then penetrates from the lower surface of the lower mold bottom member 202 to the upper surface of the inner edge of the lower mold side member 201. The through hole 201B penetrates the lower mold holding member 210 and further penetrates from the lower surface of the lower mold bottom member 202 to the upper surface of the outer edge of the lower mold side member 201. As described later, the mold release film can be adsorbed onto the mold surface of the lower mold 200 by using a mold release film adsorption mechanism to reduce the pressure. Then, as described later, resin molding is performed in a state where the mold release film is adsorbed between the mold surface of the upper mold 100 and the mold surface of the lower mold 200. In addition, the lower mold side member 201 may or may not have a through hole for adsorbing the mold release film, and even if it has a through hole, its arrangement is arbitrary.

Although not shown, as the release film adsorption mechanism, a vacuum pump or the like can be used. In addition, although not shown, the resin molding device further includes a conveying mechanism that opens the molding die after the resin is molded, takes out the resin molded product from the molding die, and conveys it.

The external air shielding member 300 is respectively mounted on the periphery of the upper mold holding member 110 and the lower mold holding member 210. Elastic O-rings 300A are respectively provided between the upper mold holding member 110 and the upper external air shielding member 300, between the upper external air shielding member 300 and the lower external air shielding member 300, and between the lower external air shielding member 300 and the lower mold holding member 210.

Next, an example of a resin molding method using the resin molding device is described. First, as shown in FIG. 2 , the substrate 10 is clamped and fixed by the lower surface of the upper mold body 102 and the clamp 104. As described above, the substrate 10 is equivalent to the "molding object" of the present invention. As shown in the figure, a chip 10a is fixed on the lower surface of the substrate 10 (the surface on the opposite side of the upper mold body 102 from the fixed surface). During resin molding, the chip 10a can be resin-sealed to manufacture an electronic component (resin molded product). However, the present invention is not limited to this, and for example, components such as chips may not be fixed on the substrate. In addition, for example, other components other than the chip (such as metal wires, etc.) may also be fixed on the substrate. Furthermore, as shown in the figure, the release film 11 is transported to the position of the mold surface of the lower mold 200 together with the resin material 20a carried thereon. The means and method for placing the resin material 20a on the release film 11 are not particularly limited, and for example, a feeder or other known means and methods may be used appropriately. The means and method for conveying the release film 11 and the resin material 20a to the position of the mold surface of the lower mold 200 are not particularly limited, and for example, a loader or other known means and methods may be used appropriately. In addition, the resin material 20a is a granular resin in the present embodiment, but is not limited thereto, and may be, for example, a sheet-like resin, a liquid resin, a flat-plate-like resin, a semi-solid fluid resin, or the like.

Next, as shown in FIG. 3 and FIG. 4 , the mold release film adsorption process is performed. First, as shown in FIG. 3 , the mold release film 11 and the resin material 20a are handed over to the lower mold 200. Furthermore, as shown by arrows 201a and 201b, the inside of the through holes 201A and 201B in the lower mold side member 201 is depressurized by using a mold release film adsorption mechanism (not shown). The mold release film adsorption mechanism is not particularly limited, and it may be, for example, a vacuum pump or the like. As a result, the mold release film 11 is adsorbed on the upper surface of the lower mold side member 201, and tension is applied to the mold release film 11 arranged on the cavity 200A, so that the wrinkles of the mold release film are stretched. At this time, by forming the step difference 201D on the lower mold side member 201, the mold release film is stretched by the step difference 201D, thereby further promoting the elongation of the mold release film. As a result, the loosening of the mold release film is suppressed. Therefore, the generation of wrinkles on the mold release film can be suppressed, and the defects of the resin molded product caused by the wrinkles can also be suppressed. In addition, by forming the exhaust groove 201C on the lower mold side member 201, the loosening of the mold release film and the generation of wrinkles can be further suppressed, and the defects of the resin molded product caused by the wrinkles can be suppressed.

Furthermore, as shown by arrow 200b in FIG4, the through hole 200B connected to the gap between the lower mold side member 201 and the lower mold bottom member 202 is depressurized and sucked by the mold release film adsorption mechanism. As a result, further tension is applied to the mold release film 11, the wrinkles are stretched, and the mold release film 11 is adsorbed on the cavity surface of the cavity 200A. As a result, the mold release film 11 is arranged on the bottom and side surfaces of the cavity 200A. As a result, as shown in the figure, the resin material 20a is placed (arranged) in the cavity 200A in a state of being placed (arranged) on the mold release film 11. In addition, at this time, as shown in the figure, it is preferred to arrange the mold release film 11 at least on the upper surface of the step difference 201D of the lower mold side member 201. In addition, the order of adsorbing the release film 11 to the lower mold 200 is not limited to the above order, as long as the release film 11 can be adsorbed on the cavity surface of the cavity 200A without wrinkles, and can be appropriately changed according to the type of the release film 11.

In addition, as shown by arrow 100b in FIG. 4 , the inside of the through hole 100B of the upper mold body 102 is depressurized and sucked by a molding object adsorption mechanism (not shown). The molding object adsorption mechanism is not particularly limited, and may be, for example, a vacuum pump. As a result, the entire upper surface of the substrate 10 is adsorbed on the lower surface of the upper mold body 102 and is more firmly fixed. In addition, for example, the adsorption of the substrate 10 to the upper mold body 102 may also start at the stage of FIG. 2 or FIG. 3 .

In addition, in the present embodiment, as a mechanism for holding (fixing) the substrate (molding object) on the upper mold, in addition to clamping by the clamp, decompression adsorption is also used. As a result, the force of adsorbing the substrate is increased, and the force of peeling off the release film is also increased. However, in the present invention, the mechanism for holding the molding object on the upper mold is not limited to this, and for example, clamping can also be performed only by the clamp.

In this embodiment, the molding die is always preheated by a heater (not shown) provided inside the molding die, and the resin material 20a begins to melt when it is placed in the mold cavity 200A together with the mold release film 11, and finally becomes a molten resin 20b. The molten resin 20b is equivalent to the molten "resin material". In addition, the preheating of the molding die may be performed before the mold release film adsorption process (FIG. 3-FIG. 4) or simultaneously with the mold release film adsorption process. In addition, the preheating of the molding die may also be started after the mold release film adsorption process.

Next, as shown in Fig. 5 to Fig. 7, the resin molding process and the conveying process are performed. In addition, as described above, the resin molding process is a process in which the molding object is arranged between the upper mold and the lower mold, a mold release film is arranged on the bottom and side of the cavity, and the resin material is arranged on the mold release film, and the molding mold is closed, and the resin is molded by compression molding to produce a resin molded product. As described above, the conveying process is a process in which the molding mold is opened after the resin molding process, and the resin molded product is taken out of the molding mold and conveyed.

First, the lower mold holding member 210 is raised, and the lower mold 200 is raised together with the external gas shielding member 300. Thus, as shown in FIG5, first, the upper and lower external gas shielding members 300 are closed by each O-ring 300A, and the molding die (upper mold 100 and lower mold 200) is isolated from the outside air by the upper mold holding member 110, the lower mold holding member 210 and the external gas shielding member 300. Hereinafter, the space S surrounded by the upper mold holding member 110, the lower mold holding member 210 and the external gas shielding member 300 is sometimes referred to as the "external gas shielding space". When the external gas shielding member 300 is closed, the film pressing member 103 contacts the lower mold side member 201 via the mold release film 11, and the mold release film 11 is clamped between the lower mold side member 201 and the film pressing member 103. At this time, the upper mold 100 and the lower mold 200 are not molded together, and the substrate 10 and the molten resin 20b are not in contact. In this state, as shown by the arrow 300b, the internal pressure reduction mechanism (not shown) of the external gas shielding member is used to reduce the pressure inside the through hole 300B of the upper mold 100. As a result, the external gas shielding space S becomes negative pressure. In addition, the internal pressure reducing mechanism of the external gas shielding component is not particularly limited, and it may be, for example, a vacuum pump, etc.

Then, as shown in FIG. 6 , the lower mold holding member 210 (lower mold 200) is further raised. As a result, the wafer 10a is immersed in the molten resin 20b, and the substrate 10 contacts the molten resin 20b. As a result, the molten resin 20b is filled in the cavity 200A, and the upper mold 100 and the lower mold 200 are clamped. At this time, since no protrusion is formed on the outer periphery of the upper surface of the lower mold bottom member 202 and the surface is flat, the height of the outer periphery of the upper surface of the lower mold bottom member 202 is lower than the height of the step 201D of the lower mold side member 201. As a result, in the manufactured resin molded product, no protrusion corresponding to the protrusion (step) on the outer periphery of the upper surface of the lower mold bottom member 202 is generated. Therefore, when the resin molded product is taken out of the molding die and transported, such protrusions will not fall off. Therefore, there is no risk that the falling of such protrusions will cause defective products or become the main cause of stopping the operation of the resin molding device, thereby reducing the risk of productivity. In addition, since the resin material is not wasted due to the generation of such protrusions, the yield is also good. In addition, since the effective area of the substrate 10 is not reduced, the substrate 10 can be effectively used.

In addition, as described above, the depth of the step 201D is less than the thickness of the release film 11. Thus, it is possible to suppress the phenomenon that the molten resin 20b enters the step 201D portion and solidifies to form a surplus resin portion (resin burr). In addition, if the depth of the step 201D is less than the thickness of the release film 11, even if the molten resin 20b enters the step 201D portion, the amount is very small. Therefore, even if a surplus resin portion as described above is formed, it will be a very thin and light surplus resin portion, so it is unlikely to cause a problem caused by the surplus resin portion falling off.

In addition, at this time, in a plan view, as long as the step 201D is formed at a position closer to the inside than the end surface of the substrate 10, for example, the distance W2 from the outer end surface of the step 201D to the end surface of the substrate 10 can be set to be 1 mm or more. The upper limit of the distance W2 is not particularly limited, and is, for example, 50 mm or less, 40 mm or less, 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 4 mm or less, 3 mm or less, or 2 mm or less. In addition, the distance W2 can also be expressed as the distance between the outer end surface of the step 201D and the outer edge of the configuration area of the molding object (substrate 10).

After the mold is closed, the pressure in the external gas shielding space S is restored to atmospheric pressure. In addition, the timing for returning the pressure in the external gas shielding space S to atmospheric pressure is only after the mold is closed and before the solidification of the molten resin 20b is completed.

Then, as shown in FIG. 7 , the molten resin 20 b is solidified to complete the resin molding process, produce the resin molded product, and the mold release film is peeled off from the resin molded product.

First, as shown in FIG6 , in the mold-clamped state, the molten resin 20b is solidified. For example, when the molten resin 20b is a thermosetting resin, the molding die may be further heated by the internal heater to form a solidified resin (solidified resin 20 shown in FIG7 ). In addition, for example, when the molten resin 20b is a thermoplastic resin, the molten resin 20b may be solidified by stopping the heating of the molding die and cooling it or by quenching the molding die to form a solidified resin 20. In addition, even after the mold is closed, a force is applied to the lower mold holding member 210 to raise the lower mold 200, so that the molten resin 20b is solidified while being compressed. Thus, a resin molded product 30 ( FIG. 7 ) including the substrate 10 , the wafer 10 a , and the cured resin 20 can be manufactured.

Then, the molding die is opened, and the resin molding product is taken out of the molding die and transported. Specifically, first, as shown in FIG. 7 , the lower mold holding member 210 is lowered, the lower mold 200 and the external gas shielding member 300 are lowered, and the upper mold 100 and the lower mold 200 are opened. As a result, as shown in the figure, the mold release film 11 in close contact with the solidified resin 20 is peeled off from the solidified resin 20. Then, the resin molding product 30 is taken out of the molding die and transported by the transport mechanism (not shown).

As described above, by implementing the method for manufacturing a resin molded product according to the present embodiment, it is possible to manufacture the resin molded product 30 in which one surface of the base material 10 is resin-molded using the curing resin 20.

According to the molding die of the present invention, for example, it is not dependent on molding conditions and there is no need to set a resin block outside the molding area. The demolding properties of the resin molded product and the demolding film can also be improved by an extremely simple structure.

[Implementation Method 2]

In this embodiment, an example of the overall structure of the resin molding apparatus of the present invention and a method for manufacturing a resin molded product using the apparatus is described.

Referring to FIG8 , an example of a resin molding method using the resin molding device 1 is described. In the resin molding device 1, a granular resin (see FIGS. 2 to 4 ) is used as the resin material 20a. First, in the substrate supply/storage module 41, the substrate 10 is sent from the substrate supply section 44 to the substrate mounting section 50 (see FIGS. 2 to 7 ). Next, the substrate conveying mechanism 51 is moved from the specified position S1 in the -Y direction to receive the substrate 10 from the substrate mounting section 50. The substrate conveying mechanism 51 is returned to the specified position S1. Next, in the three molding modules 42A to 42C provided in the resin molding device 1, for example, the substrate conveying mechanism 51 is moved along the +X direction to the specified position P1 of the molding module 42B. Next, in the molding module 42B, the substrate conveying mechanism 51 is moved in the -Y direction and stopped at a predetermined position C1 on the lower mold 200. Next, the substrate conveying mechanism 51 is raised to fix the substrate 10 on the upper mold 100. Then, the substrate conveying mechanism 51 is returned to the predetermined position S1 of the substrate supply/storage module 41.

In addition, as described later, the substrate conveying mechanism 51 can also be used as a "conveying mechanism" for taking out the resin molded product from the opened molding die after the resin is molded and conveying it.

Next, the material conveying mechanism 56 receives the release film 11 stored in the release film supplying mechanism 53 , conveys it to the lower mold 200 of the molding die of the molding die set 42B, and sets it in the cavity 200A of the lower mold 200 .

Next, the X-Y table 52 is moved from the predetermined position T1 in the -Y direction, and the X-Y table 52 is stopped at a predetermined position below the resin material storage frame 54. The resin material storage frame 54 is placed on the X-Y table 52. The X-Y table 52 on which the resin material storage frame 54 is placed is moved in the +X direction, and the resin material storage frame 54 is stopped at a predetermined position below the resin material feeding mechanism 55. By moving the X-Y table 52 in the X and Y directions, a predetermined amount of resin material 20a is supplied from the resin material feeding mechanism 55 to the resin material storage frame 54 (see FIGS. 2 to 4). The X-Y table 52 on which the resin material storage frame 54 is placed is returned to the predetermined position T1.

Next, the material conveying mechanism 56 is moved from the specified position M1 in the -Y direction to receive the resin material containing frame 54 placed on the X-Y worktable 52. The material conveying mechanism 56 is returned to the specified position M1. Next, the material conveying mechanism 56 is moved in the -X direction to the specified position P1 of the molding module 42B. Next, in the molding module 42B, the material conveying mechanism 56 is moved in the -Y direction and stops at the specified position C1 on the lower mold 200. The material conveying mechanism 56 is lowered to supply the resin material 20a to the upper surface of the mold release film 11 provided in the cavity 200A. After the supply is completed, the material conveying mechanism 56 is returned to the specified position M1.

Next, in the molding module 42B, the "resin molding step" in the method for manufacturing a resin molded product of the present invention is performed. In the "resin molding step", a substrate (molding object) 10 is arranged between the upper mold and the lower mold, a mold release film 11 is arranged on the bottom and side surfaces of the cavity 200A (see FIGS. 2 to 7 ), and the molding mold is clamped with the resin material arranged on the mold release film 11, and the resin is molded by compression molding to manufacture the resin molded product 30. In the present embodiment, the lower mold 200 is raised by the clamping mechanism 60, and the upper mold 100 and the lower mold 200 are clamped to perform resin molding to manufacture the resin molded product 30. More specifically, the "resin molding step" can be performed as described in, for example, FIGS. 5 to 7 .

After the resin molding process, the "conveying process" in the method for manufacturing the resin molded product of the present invention is performed. The conveying process is a process of opening the molding mold, taking out the resin molded product 30 from the molding mold, and conveying it. Specifically, first, after the resin molding is completed, the upper mold 100 and the lower mold 200 of the molding mold are opened. After the molding mold is opened, the substrate conveying mechanism 51 is moved from the specified position S1 of the substrate supply/storage module 41 to the specified position C1 on the lower mold 200 to receive the resin molded product 30. Then, the substrate conveying mechanism 51 is moved to hand over the resin molded product 30 to the substrate mounting portion 50. The resin molded product 30 is stored from the substrate mounting portion 50 into the resin molded product storage portion 45.

In this embodiment, three molding modules 42A, 42B, and 42C are arranged and installed along the X direction between the substrate supply/storage module 41 and the material supply module 43. However, the number of molding modules is not limited to three and is arbitrary. In addition, the substrate supply/storage module 41 and the material supply module 43 can also be set as one module, and one molding module 42A can be arranged and installed on the module along the X direction. In this way, the molding modules 42A, 42B, ... can be increased or decreased. Therefore, the structure of the resin molding device 1 can be optimized according to the production form and production volume, thereby achieving an increase in productivity.

In the present embodiment, a release film supply mechanism 53 for supplying the release film 11 is provided in the material supply module 43. However, the present invention is not limited thereto, and the release film supply mechanism 53 for supplying the release film 11 may be provided as a new release film supply module instead of in the material supply module 43. In this case, for example, the release film supply module may be installed between the molding module 42C and the material supply module 43 or beside the material supply module 43 on the opposite side of the molding module 42C. In this way, the resin molding device 1 can be configured by simply adding the release film supply module to the existing device.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, modified or selected for use as needed without departing from the scope of the present invention.

Part or all of the above-mentioned implementation method may also be described as the following notes, but is not limited to the following content.

(Note 1) A method for manufacturing a resin molded product using a molding die, wherein the molding die includes an upper mold and a lower mold, the upper mold and the lower mold are arranged opposite to each other, the lower mold includes a lower mold bottom surface component and a lower mold side surface component, a cavity is formed by a space surrounded by an upper surface of the lower mold bottom surface component and an inner periphery of the lower mold side surface component, the upper surface of the lower mold bottom surface component forms the bottom surface of the cavity, and the inner periphery of the lower mold side surface component forms the side surface of the cavity, the method for manufacturing a resin molded product includes a resin molding step and a conveying step, The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a mold release film on the bottom and side of the cavity, and placing a resin material on the mold release film, and then closing the molding mold and performing resin molding by compression molding to manufacture the resin molded product. The conveying process is a process of opening the molding mold after the resin molding process, taking the resin molded product out of the molding mold and conveying it. On the upper surface of the lower mold side member, at a portion adjacent to the inner peripheral surface of the lower mold side member, a step difference of a depth below the thickness of the mold release film is formed.

(Note 2) The method for manufacturing a resin molded product according to Note 1, wherein the resin molding step is performed in a state where the mold release film is disposed at least on the upper surface of the step difference of the lower mold side member.

(Supplementary Note 3) The method for manufacturing a resin molded product according to Supplementary Note 1 or 2, wherein the step difference of the lower mold side member is formed into a ring shape.

(Note 4) A method for manufacturing a resin molded product according to any one of Notes 1 to 3, wherein the outer end of the step difference of the lower mold side member is located inward of the outer edge of the arrangement area of the molding object.

(Note 5) A method for manufacturing a resin molded product according to any one of Notes 1 to 4, wherein an exhaust groove extending outward from the step difference is formed on the upper surface of the lower mold side member.

(Note 6) According to the method for manufacturing a resin molded product described in Note 5, in the lower mold side member, the step difference is connected to the exhaust groove.

(Note 7)

According to the method for manufacturing a resin molded product as described in Appendix 5 or 6, the outer end portion of the exhaust groove is located at a position further outward than the outer edge of the arrangement area of the molding object.

(Supplementary Note 8) A method for manufacturing a resin molded product according to any one of Supplementary Notes 1 to 7, wherein in the resin molding step, the molding object is arranged on the lower surface of the upper mold.

(Appendix 9) A molding die used in the method for manufacturing a resin molded product as described in any one of Appendices 1 to 8.

(Note 10) A compression molding die for a method of manufacturing a resin molded product, The molding die includes an upper die and a lower die, The upper die and the lower die are arranged opposite to each other, The lower die includes a lower die bottom member and a lower die side member, A cavity is formed by a space surrounded by an upper surface of the lower die bottom member and an inner periphery of the lower die side member, the upper surface of the lower die bottom member forms the bottom surface of the cavity, and the inner periphery of the lower die side member forms the side surface of the cavity, In the manufacturing method of the resin molded product, a molding object is arranged between the upper mold and the lower mold, a mold release film is arranged on the bottom and side of the cavity, and the molding mold is clamped and the resin is molded by compression molding to manufacture the resin molded product. On the upper surface of the lower mold side member, a step difference of a depth below the thickness of the mold release film is formed at a portion adjacent to the inner peripheral surface of the lower mold side member.

(Supplement 11) A resin molding device comprising the molding die described in Supplement 9 or 10; and a mold clamping mechanism for clamping the upper mold and the lower mold in the molding die.

(Note 12) The resin molding device according to Note 11 further includes a conveying mechanism for taking out the resin molded product from the mold that has been opened and conveying it after the resin is molded.

This application claims priority based on Japanese Patent Application No. 2023-035729 filed on March 8, 2023, the disclosure of which is incorporated herein in its entirety.

1: Resin molding device 10: Substrate (molding object) 10a: Wafer 11: Mold release film 20: Solidified resin (molded resin) 20a: Resin material 20b: Molded resin 30: Resin molded product 41: Substrate supply/storage module 42A, 42B, 42C: Molding module 43: Material supply module 44: Substrate supply unit 45: Resin molded product storage unit 50: Substrate placement unit 51: Substrate conveying mechanism 52: X-Y workbench 53: Mold release film supply mechanism 54: Resin material storage frame 55: Resin material input mechanism 56: Material conveying mechanism 60: Mold clamping mechanism 100: Upper mold 100B: Through hole 100b: Arrow 102: Upper mold body 103: Film pressing part 103s: Upper mold elastic part 104: Clamp 110: Upper mold holding part 200: Lower mold 200A: Cavity 200B: Through hole 200b: Arrow 201A, 201B: Through hole 201a, 201b: Arrow 201C: Exhaust groove 201D: Step difference 201: Lower mold side part 201s: Lower mold elastic part 202: Lower mold bottom part 210: Lower mold holding part 300: External gas shielding part 300B: Through hole 300b: Arrow α: Configuration area of molding object C1, M1, P1, T1, S1: Specified position S: External gas shielding space W1: Step width W2: Distance from the outer end of the step to the end of the substrate X, Y, Z: Direction

Fig. 1 is a diagram showing an example of the structure of a molding die of the present invention. Fig. 1(a) is a plan view. Fig. 1(b) is a cross-sectional view.

FIG. 2 is a cross-sectional view illustrating one step in the method for producing a resin molded article of the present invention.

FIG3 is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present invention.

FIG. 4 is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present invention.

FIG5 is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present invention.

FIG6 is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present invention.

FIG. 7 is a cross-sectional view illustrating another step in the method for producing a resin molded article of the present invention.

FIG8 is a plan view showing an example of the structure of the resin molding device of the present invention.

200: Lower mold

200A: Cavity

201A, 201B: Through hole

201C: Exhaust slot

201D: Step Difference

201: Lower mold side parts

202: Bottom surface part of the lower mold

α: Configuration area of the molding object

W1: Step width 201D

Claims (12)

A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using a molding mold, wherein the molding mold includes an upper mold and a lower mold, the upper mold and the lower mold are arranged opposite to each other, the lower mold includes a lower mold bottom surface component and a lower mold side surface component, a cavity is formed by a space surrounded by the upper surface of the lower mold bottom surface component and the inner periphery of the lower mold side surface component, the upper surface of the lower mold bottom surface component forms the bottom surface of the cavity, and the inner periphery of the lower mold side surface component forms the side surface of the cavity, the method for manufacturing a resin molded product includes a resin molding process and a conveying process, The resin molding process is a process of placing a molding object between the upper mold and the lower mold, placing a mold release film on the bottom and side of the cavity, and placing a resin material on the mold release film, and then closing the molding mold and performing resin molding by compression molding to manufacture the resin molded product. The conveying process is a process of opening the molding mold after the resin molding process, taking the resin molded product out of the molding mold and conveying it. On the upper surface of the lower mold side member, at a portion adjacent to the inner peripheral surface of the lower mold side member, a step difference of a depth below the thickness of the mold release film is formed. The method for manufacturing a resin molded product as described in claim 1, wherein the resin molding step is performed in a state where the mold release film is arranged on at least the upper surface of the step difference of the lower mold side member. A method for manufacturing a resin molded product as described in claim 1 or 2, wherein the step difference of the lower mold side member is formed in a ring shape. A method for manufacturing a resin molded product as described in claim 1 or 2, wherein the outer end portion of the step difference of the lower mold side member is located closer to the inside than the outer edge of the arrangement area of the molding object. A method for manufacturing a resin molded product as described in claim 1 or 2, wherein an exhaust groove extending outward from the step difference is formed on the upper surface of the lower mold side member. A method for manufacturing a resin molded product as described in claim 5, wherein in the lower mold side member, the step difference is connected to the exhaust groove. A method for manufacturing a resin molded product as described in claim 5, wherein the outer end portion of the exhaust groove is located further outward than the outer edge of the configuration area of the molding object. A method for producing a resin molded product as described in claim 1 or 2, wherein in the resin molding step, the molding object is arranged on the lower surface of the upper mold. A molding die used in the method for manufacturing a resin molded product as described in any one of claims 1 to 8. A molding die is a compression molding die used in a method for manufacturing a resin molded product, wherein the molding die includes an upper die and a lower die, the upper die and the lower die are arranged opposite to each other, the lower die includes a lower die bottom surface component and a lower die side surface component, a cavity is formed by a space surrounded by an upper surface of the lower die bottom surface component and an inner periphery of the lower die side surface component, the upper surface of the lower die bottom surface component forms the bottom surface of the cavity, and the inner periphery of the lower die side surface component forms the side surface of the cavity, In the manufacturing method of the resin molded product, a molding object is arranged between the upper mold and the lower mold, a mold release film is arranged on the bottom and side of the cavity, and the molding mold is clamped and the resin is molded by compression molding to manufacture the resin molded product. On the upper surface of the lower mold side member, a step difference of a depth below the thickness of the mold release film is formed at a portion adjacent to the inner peripheral surface of the lower mold side member. A resin molding device, comprising: The molding die of claim 9 or 10; and A mold clamping mechanism for clamping the upper mold and the lower mold in the molding die. The resin molding device as described in claim 11 further includes a conveying mechanism for taking out the resin molded product from the opened molding mold and conveying it after the resin is molded.

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