TWI887931B - Chip bonding device and bonding method - Google Patents

Abstract

A chip bonding device and a bonding method are provided. The device includes: a movable object pick-up platform configured to move a first component; a carrying platform configured to carry and move a second component; a correction assembly configured to provide a correction mark, where a fixed distance is maintained between the correction assembly and the first component or between the correction assembly and the second component; an image acquisition device configured to read an alignment mark of the first component and a correction mark and determine a first relative position relationship between the first component and the correction assembly based on the alignment mark of the first component and the correction mark, and further configured to read an alignment mark of the second component and the correction mark and determine a second relative position relationship between the second component and the correction assembly based on the alignment mark of the second component and the correction mark. The bonding device is configured to drive the movable object pick-up platform and/or the carrying platform to adjust based on an alignment difference.

Description

A chip bonding device and bonding method

The present invention relates to the field of semiconductor manufacturing, and in particular to a chip bonding device and bonding method.

This invention claims priority to the following application: Chinese mainland patent application number 2023116853130 filed on December 7, 2023. The application is hereby incorporated by reference in its entirety.

As semiconductor technology enters the post-Moore era, chip structures are developing in a three-dimensional direction to meet the needs of high integration and high performance. Among them, the use of bonding technology to achieve the manufacture of stacked chips is one of the important technologies of "super-Moore's Law". Bonding accuracy is an important parameter of the bonding process and has a significant impact on the application of the bonding process.

The present invention provides a chip bonding device and bonding method to effectively shorten the time consumption and help improve the bonding efficiency and productivity.

In order to solve the above technical problems, the first technical solution provided by the present invention is: providing a chip bonding device, comprising: a movable pick-up platform, a supporting platform, a calibration assembly, a first image acquisition device, and a second image acquisition device; the movable pick-up platform is configured to move the first component; the supporting platform is configured to carry and move the second component; the calibration assembly is configured to provide a calibration mark, and the calibration assembly maintains a fixed distance from the first component or the second component; the image acquisition device is configured to read the alignment mark of the first component and the calibration mark of the calibration assembly, and determine the alignment mark of the first component and the calibration mark based on the alignment mark of the first component and the calibration mark. The first relative position relationship between the first element and the calibration assembly is determined; and the second relative position relationship between the second element and the calibration assembly is determined based on the alignment mark of the second element and the calibration mark; wherein the keying device determines the alignment difference between the first element and the second element based on the first relative position relationship and the second relative position relationship, and drives the movable object-picking platform and/or the carrying platform to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and keyed.

In some embodiments, the calibration assembly is disposed on the movable access platform; in response to the alignment compensation operation performed by the key device, the calibration assembly is configured to be driven to a first position or a second position together with the movable access platform, so that the image acquisition device reads the alignment mark of the first element at the first position and the calibration mark of the calibration assembly to confirm the first relative position relationship; or the image acquisition device reads the alignment mark of the second element at the second position and the calibration mark of the calibration assembly to confirm the second relative position relationship; wherein the calibration assembly maintains a fixed distance from the first element.

In some embodiments, the calibration assembly is disposed on the carrier platform; in response to the keyboard device performing the alignment compensation operation, the calibration assembly is configured to be driven to a first position or a second position together with the carrier platform, so that the image acquisition device reads the alignment mark of the first element at the first position and the calibration mark of the calibration assembly to confirm the first relative position relationship; or the image acquisition device reads the alignment mark of the second element at the second position and the calibration mark of the calibration assembly to confirm the second relative position relationship; wherein the calibration assembly maintains a fixed distance from the second element.

In some embodiments, the image acquisition device includes a first field of view and a second field of view; in response to the key device performing the alignment compensation operation, the image acquisition device is configured to identify the alignment mark of the first element and the calibration mark of the calibration component in the first field of view, and to identify the alignment mark of the second element and the calibration mark of the calibration component in the second field of view.

In some embodiments, the second field of view of the image acquisition device is simultaneously located in the same direction of the correction component, the first element, and the second element; in response to the keying device performing the alignment compensation operation, the correction component is configured as a transparent, translucent, or through-hole correction sheet.

In some embodiments, the calibration assembly is detachably mounted on the movable retrieval table or the carrying platform.

In some embodiments, the image acquisition device includes a first image acquisition device and a second image acquisition device; in response to the keyboard device performing the alignment compensation operation, the movable pickup platform and the correction assembly are driven to a first position, and the first image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction assembly in the first field of view; then the movable pickup platform and the correction assembly are driven to a second position, and the second image acquisition device is configured to identify the alignment mark of the second element and the correction mark of the correction assembly in the second field of view.

In some embodiments, the first image acquisition device includes at least one first image acquisition unit, and the at least one first image acquisition unit determines the first field of view; the second image acquisition device includes at least one second image acquisition unit, and the at least one second image acquisition unit determines the second field of view.

In some embodiments, in response to determining the alignment difference between the first element and the second element, the calibration mark of the calibration assembly maintains the first relative position relationship with the alignment mark of the first element, the first element is driven to a second position, and the image acquisition device is configured to identify the alignment mark of the second element and the calibration mark of the calibration assembly, obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference, to perform the alignment compensation. Compensation operation; in response to determining the alignment difference between the first element and the second element, the correction mark of the correction component and the alignment mark of the second element maintain the second relative position relationship, the first element is driven to the second position, the image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction component, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation.

In some embodiments, in response to the keying device performing the keying operation, the keying device adjusts the movable access platform and/or the supporting platform based on the alignment difference to perform the alignment compensation operation on the first element and the second element in the second position, and then moves the movable access platform and/or the supporting platform in the height direction so that the first element and the second element are driven to the keying position; in response to the keying device performing the keying operation, the keying device moves the movable access platform and/or the supporting platform in the height direction so that the first element When the first component and the second component are driven to the keying position, the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component; in response to the keying device performing the keying operation, the keying device moves the movable access platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component.

In some embodiments, the keying device further includes a platform; the platform includes a base and a platform frame, wherein the platform frame is arranged on the base, the movable access platform is arranged on the platform frame, and the supporting platform is arranged on the base, and the movable access platform and/or the supporting platform are configured to be movable along the X direction, the Y direction, and the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable access platform and/or the supporting platform.

In some embodiments, the keying device further includes a first drive assembly and a second drive assembly, wherein the first drive assembly is arranged on the platform frame and connected to the movable access platform, and the first drive assembly is configured to carry the movable access platform to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane; the second drive assembly is arranged on the base and connected to the supporting platform, and the second drive assembly is configured to carry the supporting platform to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane.

In order to solve the above technical problems, the second technical solution provided by the present invention is: providing a keying method, applied to a keying device, comprising: obtaining an alignment mark of a first component and a calibration mark of a calibration assembly, and determining a first relative position relationship between the first component and the calibration assembly according to the coordinate information of the alignment mark of the first component and the coordinate information of the calibration mark; obtaining an alignment mark of a second component and a calibration mark of the calibration assembly, and determining a first relative position relationship between the first component and the calibration assembly according to the coordinate information of the alignment mark of the second component and the coordinate information of the calibration mark, determine the second relative position relationship between the second element and the calibration assembly, wherein the calibration assembly and the first element or the second element maintain a fixed distance; determine the alignment difference between the first element and the second element according to the first relative position relationship and the second relative position relationship; the keying device drives the first element and/or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and keyed.

In some embodiments, determining the first relative position relationship between the first component and the calibration assembly includes: in response to the keyboard device performing the alignment compensation operation, driving the movable object-picking platform of the keyboard device and the calibration assembly to the first position, using the keyboard device to identify the alignment mark of the first component and the calibration mark of the calibration assembly; determining the first relative position relationship based on the coordinate information of the alignment mark of the first component and the coordinate information of the calibration mark.

In some embodiments, the second component is carried and moved by the carrying platform of the keying device; the second relative position relationship between the second component and the calibration assembly is determined, including: in response to the keying device performing an alignment compensation operation, driving the carrying platform of the keying device and the calibration assembly to the second position, using the keying device to identify the alignment mark of the second component and the calibration mark of the calibration assembly; and determining the second relative position relationship according to the coordinate information of the alignment mark of the second component and the coordinate information of the calibration mark.

In some embodiments, in response to determining the alignment difference between the first element and the second element, the calibration mark of the calibration assembly maintains the first relative position relationship with the alignment mark of the first element, the first element is driven to a second position, and the image acquisition device is configured to identify the alignment mark of the second element and the calibration mark of the calibration assembly, obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference, to perform the alignment compensation. Compensation operation; in response to determining the alignment difference between the first element and the second element, the correction mark of the correction component and the alignment mark of the second element maintain the second relative position relationship, the first element is driven to the second position, the image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction component, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation.

In some embodiments, in response to the bonding device performing a bonding operation, the first element is configured as a chip or wafer to be bonded, and the second element is configured as a wafer or wafer to be bonded; the first element and the second element are moved to a second position using the movable pick-up platform and/or the carrying platform, and an alignment compensation operation is performed to align the first element and the second element driven to the second position.

In some embodiments, the movable access platform and/or the supporting platform are used to move the first component and the second component to the second position, and perform an alignment compensation operation to align the first component and the second component driven to the second position, including: adjusting the movable access platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the second position, and then moving the movable access platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position; or The movable access platform and/or the supporting platform are moved in the direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component; or the movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component.

In some embodiments, determining the alignment difference between the first element and the second element according to the first relative position relationship and the second relative position relationship includes: determining the angle deviation between the first element and the second element according to the first relative position relationship and the second relative position relationship; correcting the relative position of the first element and the second element according to the angle deviation; and determining the alignment difference between the first element and the second element according to the corrected relative position.

Different from the prior art, the keying device provided by the present invention obtains the first relative position relationship between the first element and the calibration component, and obtains the second relative position relationship between the second element and the calibration component by setting a calibration component for reference, and then determines the alignment difference between the first element and the second element according to the first relative position relationship and the second relative position relationship, so that the keying device completes the alignment of the first element and the second element based on the alignment difference and performs keying. At the same time, it is not necessary to perform multiple alignments for each second element to be keyed, which effectively shortens the time consumption, and is conducive to improving the keying efficiency and productivity.

△ x ₁ : First X-axis difference

△ x ₂ : Second X-axis difference

△ x ₃ : The third X-axis difference

△ x ₄ : Fourth X-axis difference

△ y ₁ : First Y-axis difference

△ y ₂ : Second Y-axis difference

△ y ₃ : The third Y-axis difference

△ y ₄ : Fourth Y-axis difference

△α1: first angle deviation

△α2: Second angle deviation

10: Keying device

100: Movable access table

110: First drive assembly

111: First drive element

112: Second drive element

113: Third drive element

20: First Component

200: Calibration components

30: Second element

300: Loading platform

310: Second drive assembly

400: Image acquisition device

410: First image acquisition device

420: Second image acquisition device

500: Machine

510: Base

520: Machine frame

600: Supply platform

B1: First alignment mark

B2: Second alignment mark

D1: First calibration mark

D2: Second calibration mark

L1: First connection

L2: Second connection

L3: The third connection

L4: The fourth connection

L5: The fifth link

L6: The Sixth Connection

S10,S20,S30,S40:Methods

T1: The third alignment standard

T2: The fourth alignment standard

X,Y,Z: axis (direction)

α1: First angle

α2: Second angle

α3: The third angle

α4: The fourth angle

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without making any progressive efforts, among which: FIG1 is a structural schematic diagram of the first embodiment of the keying device in the present invention; FIG2 is a structural schematic diagram of the second embodiment of the keying device in the present invention; FIG3 is a schematic diagram of a first coordinate system of a calibration mark corresponding to the keying device in the present invention; FIG4 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG5 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG6 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG7 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG8 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG9 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG10 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG11 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG12 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG13 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG14 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG15 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG16 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG17 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG18 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG19 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG11 is a schematic diagram of the first coordinate system of the keying device in the present invention; FIG FIG. 5 is a schematic diagram of the first coordinate system of two calibration marks corresponding to the keying device in the present invention; FIG. 6 is a schematic diagram of the second coordinate system of two calibration marks corresponding to the keying device in the present invention; FIG. 7 is a schematic diagram of the process of the first embodiment of the keying method in the present invention; FIG. 8 is a schematic diagram of the keying coordinate system corresponding to the keying device in the present invention; FIG. 9 is a schematic diagram of the keying process of the first element and the second element in the present invention; FIG. 10 is a schematic diagram of the coordinate information of the first element and the second element in the present invention after keying in the keying coordinate system.

The following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by the ordinary knowledge in this field without making progressive labor are within the scope of protection of the present invention.

The terms "first", "second", and "third" in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units not listed, or may optionally also include other steps or units inherent to these processes, methods, products or apparatuses.

Reference to "embodiments" herein means that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described herein may be combined with other embodiments.

The present invention is described in detail below with reference to the drawings and embodiments.

Please refer to Figure 1, which is a structural schematic diagram of the first embodiment of the keying device provided by the present invention.

As shown in FIG1 , the keying device 10 includes: a movable pick-up platform 100, a calibration assembly 200, a carrying platform 300, and an image acquisition device 400; the movable pick-up platform 100 is configured to pick up and move the first component 20; the calibration assembly 200 is configured to provide a calibration mark, and the calibration assembly 200 maintains a fixed distance from the first component 20 or the second component 30; the carrying platform 300 is configured to carry and move the second component 30; the image acquisition device 400 is configured to read the first component 20; The first element 20 has an alignment mark and a calibration mark of the calibration assembly 200, and determines the first relative position relationship between the first element 20 and the calibration assembly 200 based on the alignment mark of the first element 20 and the calibration mark of the calibration assembly 200, and is configured to read the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200, and determine the second relative position relationship between the second element 30 and the calibration assembly 200 based on the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200.

The keying device 10 determines the alignment difference between the first element 20 and the second element 30 based on the first relative position relationship and the second relative position relationship, and drives the movable object-picking platform 100 and/or the supporting platform 300 to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element 20 and the second element 30 are aligned before keying.

In some embodiments, after the first element 20 and the second element 30 are aligned, the movable access platform 100 is driven to move in the height direction, such as downward, so that the movable access platform carries the first element 20 downward to contact the second element 30 for keying.

In other embodiments, the first element 20 and the second element 30 can be aligned while the movable access platform is driven to move in the height direction, so that the first element 20 and the second element 30 are in contact and keyed.

In some other embodiments, the first element 20 and the second element 30 may be driven to the keying position first, and then the first element 20 and the second element 30 may be adjusted to perform an alignment compensation operation on the first element 20 and the second element 30.

In some embodiments, the keying device further includes a machine platform 500, and the machine platform 500 includes a base 510 and a machine platform frame 520; the machine platform frame is arranged on the base, the movable object-retrieving platform 100 is arranged on the machine platform frame, and the supporting platform 300 is arranged under the machine platform frame.

The base can be used to support the platform frame alone; the base can also be a whole supporting surface for supporting the platform frame and the supporting platform 300, that is, the movable object-collecting platform 100 is arranged on the platform frame and faces the base, and the supporting platform 300 is arranged on the base and faces the platform frame.

It should be noted that FIG. 1 only shows an embodiment in which the movable access platform 100 is arranged on the top of the platform frame and the supporting platform 300 is arranged on the base; in another embodiment, the movable access platform 100 can be arranged on the base and the supporting platform 300 can be arranged on the platform frame, specifically to realize the movement of the first element 20 and the second element 30 to the keying position. Therefore, the positions of the movable access platform 100 and the supporting platform 300 are not limited in the present invention.

In some embodiments, the calibration assembly 200 is detachably mounted on the movable access platform; in response to the key device performing the alignment compensation operation, the calibration assembly 200 is configured to be driven to the first position or the second position together with the movable access platform 100, and the image acquisition device 400 is configured to read the alignment mark of the first element 20 at the first position and the calibration mark of the calibration assembly 200, and determine whether the first element 20 and the calibration assembly 200 are aligned. The first relative position relationship between the second element 30 and the correction component 200 is determined; or the image acquisition device is configured to read the alignment mark of the second element 30 in the second position and the correction mark of the correction component 200 to determine the second relative position relationship between the second element 30 and the correction component 200; at this time and in the subsequent driving process, the correction component maintains a fixed distance with the first element, such as the first relative position relationship between the correction component 200 and the first element 20 is maintained.

The image acquisition device 400 includes a first field of view and a second field of view. In response to the key device performing an alignment compensation operation, the image acquisition device 400 is configured to use the first field of view to identify the alignment mark of the first element 20 and the calibration mark of the calibration component 200, and is configured to use the second field of view to identify the alignment mark of the second element 30 and the calibration mark of the calibration component 200.

For example, the image acquisition device 400 includes a single-viewing angle image acquisition unit. When identifying the alignment mark of the first element and the correction mark of the correction component, the viewing angle of the image acquisition device is oriented toward the first element and the correction component in the first position; when identifying the alignment mark of the second element and the correction mark of the correction component, the viewing angle of the image acquisition device is oriented toward the second element and the correction component in the second position; in some embodiments, the image acquisition device 400 may be an image acquisition unit with upper and lower viewing angles.

The second field of view of the image acquisition device 400 is located in the same direction of the calibration component 200 and the first element 20/second element 30. For example, when the second field of view is a downward viewing angle, the calibration component 200, the first element 20, and the second element 30 are vertically downward in the height direction, that is, the horizontal plane height of the image acquisition device 400 is higher than the horizontal plane height of the calibration component 200, the first element 20, and the second element 30. Because it may be necessary to obtain the alignment mark of the second element 30 through the calibration component 200, the calibration component 200 can be a transparent, translucent, or calibration sheet with a through hole.

In some embodiments, the second field of view of the image acquisition device 400 is simultaneously located between the calibration component 200 and the first element 20/second element 30. For example, the image acquisition device 400 is located between the calibration component 200 and the second element 30. Then, the calibration mark of the calibration component 200 and the alignment mark of the second element 30 can be obtained respectively, and then formed in a coordinate system. At this time, it is not necessary to pass through the calibration component 200. Therefore, the calibration component 200 can be an opaque flat plate without a through hole, as long as the calibration mark on the calibration component 200 can be obtained. It can be understood that the first viewing angle can also have a similar setting.

In order to facilitate the replacement of the calibration component 200, the calibration component 200 can be detachably arranged, such as detachably arranged on the movable object-collecting platform 100 or detachably arranged on the carrying platform 300.

It should be noted that FIG. 1 only shows that the calibration assembly 200 is disposed on the movable object-collecting platform 100 and moves together with the movable object-collecting platform 100. The calibration assembly 200 moves along with the movable object-collecting platform 100 and enters the first field of view of the first image acquisition device 410 and the second field of view of the second image acquisition device 420. In other embodiments, the calibration assembly 200 also moves along with the movable object-collecting platform 100. It can be fixedly installed on the machine frame, and the movable object-picking platform 100 can carry the first component 20 into the first field of view, and the carrying platform 300 can carry the second component 30 into the second field of view; in other embodiments, the calibration component 200 can also be installed together with the carrying platform 300; the calibration component 200 can also be provided with a movable part, which can be moved into the first field of view and into the second field of view. Specifically, the first image acquisition device 410 can simultaneously obtain the alignment mark of the first component 20 and the calibration mark of the calibration component 200 in the first field of view, and the second image acquisition device 420 can simultaneously obtain the alignment mark of the second component 30 and the calibration mark of the calibration component 200 in the second field of view.

It can be understood that in some embodiments, the first element 20 can be a wafer to be bonded or a chip to be bonded; correspondingly, the second element 30 can be a wafer to be bonded or a chip to be bonded.

There is at least one alignment mark on the first element, and if there are two, they are the first alignment mark B1 and the second alignment mark B2. There is at least one calibration mark on the calibration assembly, and if there are two, they are the first calibration mark D1 and the second calibration mark D2. There is at least one alignment mark on the second element 30, and if there are two, they are the third alignment mark T1 and the fourth alignment mark T2.

Specifically, in response to the keying device 10 performing a picking operation, the movable pick-up platform 100 is driven to the picking position and picks up the first component 20. After determining that the movable pick-up platform 100 has picked up the first component 20 to be keyed, the movable pick-up platform 100 is driven to the first position. At this time, the calibration component 200 also follows the movable pick-up platform 100 to the first position, and then the image acquisition device 400 identifies the first alignment mark B1 on the first component 20 in the first field of view and the first calibration mark D1 on the calibration component 200 at the alignment position, thereby determining the first relative position relationship corresponding to the first component 20 and the calibration component 200 in the first field of view.

After determining the first relative position relationship, the keying device 10 drives the movable object-picking platform 100 to move to the second position, that is, the movable object-picking platform 100 carries the calibration component 200 to the second position; at the same time, the carrying platform 300 carries the second component 30 to the second position, and drives the image acquisition device 400 to identify the third alignment mark T1 on the second component 30 in the second field of view at the keying position, and identify the first calibration mark D1 on the calibration component 200. Because the first calibration mark D1 and the third alignment mark T1 are in the second field of view at this time, the second relative position relationship corresponding to the second component 30 and the calibration component 200 is determined in the second field of view.

The first position is the position where the first element 20 and the calibration assembly 200 are located when the alignment mark of the first element 20 and the calibration mark of the calibration assembly 200 are obtained, and the second position is the position where the second element 30 and the calibration assembly 200 are located when the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200 are obtained.

In some embodiments, there may be at least two calibration marks on the calibration assembly 200, and there may also be at least two alignment marks on the first element 20 and the second element 30, such as the first calibration mark D1 and the second calibration mark D2, which can more clearly indicate the positional relationship between the first calibration mark D1 and the second calibration mark D2 and the first alignment mark B1 and the second alignment mark B2 of the first element, respectively, and the positional relationship between the first calibration mark D1 and the second calibration mark D2 and the third alignment mark T1 and the fourth alignment mark T2, and determine the difference between the first alignment mark B1 and the second alignment mark B2 and the third alignment mark T1 and the fourth alignment mark T2.

After obtaining the first relative position relationship and the second relative position relationship, the alignment difference between the first element 20 and the second element 30 is determined based on the calibration assembly 200, and then the movable access platform 100 and/or the supporting platform 300 are driven to adjust based on the alignment difference to perform an alignment compensation operation; that is, the movable access platform 100 and/or the supporting platform 300 are driven to perform an alignment compensation operation at the keying position, so that the first element 20 and the second element 30 are aligned, and then the movable access platform 100 is driven to move along the height direction with the first element 20, such as moving down, so that the aligned first element 20 and the second element 30 are keyed.

That is, it is only necessary to obtain the first relative position relationship between the first element 20 and the calibration assembly 200 and the second relative position relationship between the second element 30 and the calibration assembly 200 once, and then the alignment difference between the first element 20 and the second element 30 can be determined according to the first relative position relationship and the second relative position relationship, and then the alignment between the first element 20 and the second element 30 can be completed once according to the alignment difference, thus avoiding the time-consuming problem caused by multiple alignment, measurement, adjustment, re-alignment and measurement operations.

The picking position is the position where the movable picking platform 100 can pick up the first component 20. The alignment position is the position corresponding to the first alignment mark B1 and the second alignment mark B2 and the first calibration mark D1 and the second calibration mark D2 when the first image acquisition device 410 obtains the first component 20 at the first position. The keying position is the position corresponding to the third alignment mark T1 and the fourth alignment mark T2 and the first correction mark D1 when the second image acquisition device 420 obtains the second element 30 at the second position; after the movable object-picking platform 100 and/or the carrying platform 300 are aligned at the keying position, the first element 20 and the second element 30 can perform a keying operation; in some embodiments, when the first element 20 and the second element 30 are at the keying position, the alignment mark of the first element 20 and the alignment mark of the second element 30 are roughly aligned one by one.

In this embodiment, a calibration component for reference is provided to obtain a first relative position relationship between the first element and the calibration component, and a second relative position relationship between the second element and the calibration component, and then the alignment difference between the first element and the second element is determined based on the first relative position relationship and the second relative position relationship, so that the bonding device completes the alignment of the first element and the second element based on the alignment difference and performs bonding. At the same time, it is not necessary to perform multiple alignments for each second element to be bonded, which effectively shortens the time consumption, and is conducive to improving bonding efficiency and productivity.

Refer to Figure 2, which is a structural schematic diagram of the second embodiment of the keying device provided by the present invention.

As shown in FIG. 2 , the keying device 10 includes: a movable object-picking platform 100, a calibration assembly 200, a carrying platform 300, an image acquisition device 400, and a platform 500; wherein the platform 500 includes a base 510 and a platform frame 520; the platform frame 520 is disposed on the base 510, and the movable object-picking platform 100 is disposed on the platform frame 520 and faces the base 510. 10. The image acquisition device 400 may include a first image acquisition device 410 and a second image acquisition device 420. The first image acquisition device 410 may be disposed on a base 510 and facing a machine frame 520. The second image acquisition device 420 may be disposed on a machine frame 520 and facing the base 510. The supporting platform 300 is disposed on the base 510.

The movable access platform 100 is configured to be movable along the X direction, Y direction, and height direction Z of the horizontal plane, and can rotate in a vertical plane perpendicular to the horizontal plane, that is, the movable access platform 100 can carry the first element 20 and the calibration assembly 200 to move along the X direction, Y direction, and height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane; the carrying platform 300 is configured to be movable along the X direction, Y direction, and height direction Z of the horizontal plane , and can move in the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane, that is, the supporting platform 300 can carry the second component 30 to move along the X direction, Y direction, and height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane, and the first image acquisition device 410 is set on the base 510 and corresponds to the first position, and the second image acquisition device 420 is set on the platform frame 520 and corresponds to the second position.

It should be noted that FIG. 2 only shows an embodiment in which the calibration assembly 200 is arranged on the movable access platform 100 and maintains a fixed distance from the first element 20; in another embodiment, the calibration assembly 200 can also be arranged on the supporting platform 300 and maintain a fixed distance from the second element 30; or the calibration assembly 200 moves synchronously with the movable access platform 100 or the supporting platform 300, specifically, to achieve that the calibration assembly 200 and the first element 20 maintain a fixed distance, or the calibration assembly 200 and the second element 30 maintain a fixed distance.

It should be noted that FIG. 2 only shows an embodiment in which the first image acquisition device 410 is disposed on the base 510 and the second image acquisition device 420 is disposed on the machine frame 520; in another embodiment, the first image acquisition device 410 can be hoisted on the machine frame 520, and the second image acquisition device 420 can be disposed on the base 510. Specifically, the first image acquisition device 410 can obtain the alignment mark of the first element 20 and the calibration mark of the calibration component 200, and the second image acquisition device 420 can obtain the alignment mark of the second element 30 and the calibration mark of the calibration component 200. Therefore, the positions of the first image acquisition device 410 and the second image acquisition device 420 are not limited in the present invention.

Among them, the X direction and the Y direction are the intersecting directions in the same horizontal plane. If the X direction and the Y direction are perpendicular to the same horizontal plane, the height direction Z is the direction perpendicular to the horizontal plane.

In some embodiments, the movable pickup platform 100 can be a pick-up member that can be flipped, that is, after picking up the first component 20 at the picking position, it is flipped so that the keying surface of the first component 20 faces upward, and after reaching the keying position, the pick-up member is flipped again so that the keying surface of the first component 20 faces the second component 30, so as to avoid the keying surface of the first component 20 being damaged during the moving process.

In some embodiments, a seismic isolation and shock absorbing device may be provided at the bottom of the base 510 to eliminate the vibration caused by the supporting platform 300 when the second element 30 to be keyed is moved and during the keying process, thereby improving the stability of the keying device 10.

In some embodiments, the first image acquisition device 410 includes at least one first image acquisition unit, wherein the first image acquisition unit is an upward image acquisition unit. Taking a calibration mark and an alignment mark as an example, in response to the movable access platform 100 being driven to the first position, the upward image acquisition unit is configured to identify the first alignment mark B1 on the first element 20 carried by the movable access platform 100 at the first position, and the first calibration mark D1 on the calibration component 200. Because the first alignment mark B1 and the first calibration mark D1 are both within the first field of view, the first coordinate system can be established based on the first alignment mark B1 and the first calibration mark D1, and the coordinate information of each mark in the first coordinate system can be determined, thereby determining the first relative position relationship corresponding to the first element 20 and the calibration assembly 200.

Among them, the upward image acquisition unit can be one or more. When one upward image acquisition unit cannot obtain the first alignment mark B1 of the first component and the calibration mark of the calibration component 200 at the same time, or cannot obtain multiple alignment marks and multiple calibration marks at the same time, two or more upward image acquisition units can be set to meet the requirements of obtaining the first alignment mark B1 of the first component and the calibration mark of the calibration component 200 at the same time.

The first coordinate system includes an X-axis and a Y-axis. In the first coordinate system, the coordinate information of the first alignment mark B1 on the first element 20 is B1 ( x _B1 , y _B1 ), and the coordinate information of the first calibration mark D1 on the calibration assembly 200 is D1 ( x _D1 , y _D1 ).

Taking two correction marks and two alignment marks as an example, the first coordinate system includes an X-axis and a Y-axis. In the first coordinate system, the coordinate information of the first alignment mark B1 on the first element 20 is B1 ( x _B1 , y _B1 ), and the coordinate information of the second alignment mark B2 is B2 ( x _B2 , y _B2 ). The coordinate information of the first correction mark D1 on the correction component 200 is D1 ( x _D1 , y _D1 ), and the coordinate information of the second correction mark D2 is D2 ( x _D2 , y _D2 ).

In some embodiments, the second image acquisition device 420 includes at least one second image acquisition unit, and the second image acquisition unit is a downward image acquisition unit. In response to the key device performing the alignment compensation operation, the carrying platform 300 is driven to the second position, and the movable object-collecting platform 100 is driven to carry the calibration component 200 to the second position, and the downward image acquisition unit is configured to identify the third alignment mark T1 on the second element 30 at the second position, and identify the first calibration mark D1 on the calibration component 200. Because the third alignment mark T1 and the first calibration mark D1 are both within the second field of view, the second coordinate system can be established based on the third alignment mark T1 and the first calibration mark D1, and the coordinate information of each mark in the second coordinate system can be determined, thereby determining the second relative position relationship corresponding to the second element 30 and the calibration assembly 200.

The second coordinate system includes an X-axis and a Y-axis. In the second coordinate system, the coordinate information of the third alignment mark T1 on the second element 30 is T1 ( x _T1 , y _T1 ), and the coordinate information of the first calibration mark D1 on the calibration assembly 200 is D3 ( x _D3 , y _D3 ).

If there are two correction marks and two alignment marks, then the second coordinate system includes an X-axis and a Y-axis. In the second coordinate system, the coordinate information of the third alignment mark T1 on the second element 30 is T1 ( x _T1 , y _T1 ), the coordinate information of the fourth alignment mark T2 is T2 ( x _T2 , y _T2 ), the coordinate information of the first correction mark D1 on the correction assembly 200 is D3 ( x _D3 , y _D3 ), and the coordinate information of the second correction mark D2 is D4 ( x _D4 , y _D4 ).

In some embodiments, in response to the keying device 10 performing a keying operation, the keying device adjusts the movable access platform 100 and/or the supporting platform 300 based on the alignment difference to perform an alignment compensation operation on the first element 20 and the second element 30 in the second position, and then moves the movable access platform 100 and/or the supporting platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the keying position.

In response to the keying operation performed by the keying device 10, the keying device 10 moves the movable access platform 100 and/or the supporting platform 300 in the height direction so that the first component 20 and the second component 30 are driven to the keying position, and at the same time, the movable access platform 100 and/or the supporting platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30.

The bonding position is the position where the first element 20 and the second element 30 are bonded.

In some embodiments, the keying device 10 further includes a first drive assembly 110 and a second drive assembly 310, wherein the first drive assembly 110 is disposed on the platform frame and connected to the movable access platform, and the first drive assembly 110 is configured to carry the movable access platform 100 to move along the X direction, Y direction, and height direction of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane; the second drive assembly 310 is disposed on the base and connected to the supporting platform 300, and the second drive assembly is configured to carry the supporting platform 300 to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane.

Furthermore, the first driving assembly 110 may include a first driving member 111, a second driving member 112, and a third driving member 113.

Specifically, the first driving member 111 is movably arranged on the platform frame 520 and faces the base 510, the second driving member 112 is connected to the first driving member 111 and faces the base 510, and the third driving member 113 is connected to the second driving member 112 and the movable fetching platform 100, that is, the upper part of the third driving member 113 is connected to the second driving member 112, and the lower part of the third driving member 113 is connected to the movable fetching platform 100, and the movable fetching platform 100 and the third driving member 113 can be connected. It is a detachable connection and can be replaced in time when a fault occurs; wherein the first driving member 111 is configured to carry the second driving member 112, the third driving member 113 and the movable access platform 100 to move along the X direction and the Y direction of the horizontal plane, the second driving member 112 is configured to carry the third driving member 113 and the movable access platform 100 to move along the height direction, and the third driving member 113 is configured to carry the movable access platform 100 to rotate in the rotation direction of the horizontal plane.

In some embodiments, in order to facilitate timely replacement when a fault occurs, the first drive member 111 can be detachably arranged on the platform frame 520; the second drive member 112 and the first drive member 111 can also be detachably connected, and the third drive member 113 and the second drive member 112 can also be detachably connected.

In some embodiments, the first driver 111 may be an X/Y axis macro motion driver, used to realize the movement of the first driver 111 in the X direction and the Y direction of the horizontal plane, and perform nanometer-level coarse positioning; the second driver 112 may be a Z axis driver, used to realize the second driver 112 drives the movable fetching platform 100 to move in the height direction; the third driver 113 may be a rotation driver, used to realize the third driver 113 drives the movable fetching platform 100 to rotate in a vertical plane perpendicular to the horizontal plane, and realize the precise positioning of the movable fetching platform 100, wherein the third driver 113 can achieve micro-radian-level positioning accuracy.

Furthermore, the second drive assembly 310 can be an X/Y axis high-precision motion drive, which is movably arranged on the base 510, and the supporting platform 300 is arranged on the second drive assembly 310. The second drive assembly 310 is configured to carry the supporting platform 300 to move in the X direction and Y direction of the horizontal plane, that is, the second drive assembly 310 drives the supporting platform 300 to move on the base 510 and perform nano-level coarse positioning, so that the second component 30 on the supporting platform 300 is aligned with the first component 20 sucked by the movable object-picking platform 100.

It should be noted that the first drive member 111, the second drive member 112, the third drive member 113 and the second drive assembly 310 may also include: a motor, for example, a linear motor or a rotary motor, to provide power for the corresponding drive members. It is understandable that the structural design of the first drive member 111 in the embodiment of the present invention may also refer to the specific structure in the relevant technology, as long as the movable object-picking platform 100 can be moved in the X direction and the Y direction in the horizontal plane and the function of positioning with nanometer-level precision can be achieved, and the present invention does not make specific restrictions. Correspondingly, the structural design of the second drive member 112, the third drive member 113 and the second drive assembly 310 may also refer to the specific structure in the relevant technology, as long as the corresponding functions can be achieved.

Optionally, the X direction, the second Y direction, and the Z direction (height direction) are perpendicular to each other. Specifically, the Y direction can be parallel to the direction where the Y axis is located, the X direction can be parallel to the direction where the X axis is located, and the Z direction is parallel to the direction where the Z axis is located. Accordingly, the first drive member 111 is referred to as an X/Y axis macro motion drive member. The second drive member 112 and the third drive member 113 can also be referred to as a Z axis drive member and a rotation drive member, respectively. The second drive assembly 310 can also be referred to as an X/Y high-precision motion drive member.

Optionally, the supporting platform 300 may also be a single-stage motion mechanism or other types of motion mechanisms, as long as it can move the second element 30 to be bonded to the preset surface position corresponding to the first element 20 to be bonded and bond to the preset surface position of the first element 20 to be bonded while meeting specific precision requirements.

In some embodiments, the bonding device 10 may further include a supply platform 600, which is disposed on the base 510 and configured to provide the first component 20 to be bonded to the movable pick-up platform 100, that is, a plurality of first components 20 to be bonded are placed on the supply platform 600, and the movable pick-up platform 100 picks up the first component 20 on the supply platform 600 at the picking position, and then moves the first component 20 to the alignment position, so that the first image acquisition device 410 obtains the first alignment mark B1 on the first component 20 and the first calibration mark D1 on the calibration assembly 200.

The following describes the working process of the keying device 10.

Specifically, the first image acquisition device 410 has a first viewing angle and is configured to read at least one alignment mark on the first component 20 to be bonded and at least one calibration mark on the calibration component 200 at the alignment position; and the second image acquisition device 420 has a second viewing angle and is configured to read at least one alignment mark on the second component 30 to be bonded and at least one calibration mark on the calibration component 200 at the alignment position; the first component has a first alignment mark B1, the calibration component 200 has a first calibration mark D1, and the second component 30 has a third alignment mark T1 as an example for explanation.

In response to determining the alignment difference between the first element 20 and the second element 30, the calibration mark of the calibration assembly 200 maintains a first relative position relationship with the alignment mark of the first element 20, and the first element 20 is driven to a second position. The image acquisition device 400 is configured to identify the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200, and obtain the difference between the alignment mark of the first element 20 and the alignment mark of the second element 30 as the alignment difference to perform an alignment compensation operation; Or in response to determining the alignment difference between the first element 20 and the second element 30, the calibration mark of the calibration assembly 200 and the calibration mark of the second element 30 maintain a second relative position relationship, the first element 20 is driven to the second position, and the image acquisition device 400 is configured to identify the alignment mark of the first element 20 and the calibration mark of the calibration assembly 200, and obtain the difference between the alignment mark of the first element 20 and the alignment mark of the second element 30 as the alignment difference to perform the alignment compensation operation.

In addition, in response to the keying device performing a keying operation, the keying device adjusts the movable access platform 100 and/or the supporting platform 300 based on the alignment difference to perform an alignment compensation operation on the first element 20 and the second element 30 in the second position, and then moves the movable access platform 100 and/or the supporting platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the keying position; or in response to the keying device performing a keying operation, the keying device moves the movable access platform 100 and/or the supporting platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the keying position. When the two components 30 are driven to the keying position, the movable access platform 100 and/or the supporting platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30; or in response to the keying device performing a keying operation, the keying device moves the movable access platform 100 and/or the supporting platform 300 in the height direction so that the first component 20 and the second component 30 are driven to the keying position, and the movable access platform 100 and/or the supporting platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30.

The supply platform 600 and the first image acquisition device 410 are arranged on the base 510. When performing a keying task, the keying device 10 drives the first driving component 110 to carry the movable pick-up platform 100 to the picking position corresponding to the supply platform 600, and drives the second driving component 112 to move the movable pick-up platform 100 in the height direction, so as to move down, so that the movable pick-up platform 100 picks up the first component 20 to be keyed, and then drives the movable pick-up platform 100 to move. Move to the alignment position, that is, the identification position corresponding to the first image acquisition device 410; wherein, the calibration component 200 moves with the movable object-picking platform 100, so that the first alignment mark B1 on the first element 20 and the first calibration mark D1 on the calibration component 200 can be identified in the first camera field of view through the first image acquisition device 410, and the first coordinate system can be established, and then the coordinate information of each mark in the first coordinate system can be determined.

Refer to Figure 3, which is a schematic diagram of the first coordinate system of a calibration mark corresponding to the keying device in the present invention.

As shown in FIG3 , the first coordinate system includes an X-axis and a Y-axis. The coordinate information of the first alignment mark B1 in the first coordinate system is determined to be B1 ( x _B1 , y _B1 ), and the coordinate information of the first correction mark D1 is determined to be D1 ( x _D1 , y _D1 ). Then, the first relative position relationship corresponding to the first element 20 and the correction assembly 200 is determined based on the difference in the coordinate information.

Continuing to refer to FIG. 3, in the first coordinate system, the first connection line between the first alignment mark B1 of the first element 20 to be bonded and the first calibration mark D1 of the calibration assembly 200 is set as L1. Then, according to the distance relationship between the first connection line L1 and the angle relationship between the first connection line L1 and the X-axis and Y-axis, the first relative position relationship corresponding to the first element 20 and the calibration assembly 200 can be determined.

Refer to Figure 4, which is a schematic diagram of the first coordinate system of the two calibration marks corresponding to the keying device in the present invention.

As shown in Figure 4, the first coordinate system includes an X-axis and a Y-axis. The coordinate information of the first alignment mark B1 in the first coordinate system is determined to be B1 ( x _B1 , y _B1 ), the coordinate information of the second alignment mark B2 is determined to be B2 ( x _B2 , y _B2 ), the coordinate information of the first correction mark D1 is D1 ( x _D1 , y _D1 ), and the coordinate information of the second correction mark D2 is D2 ( x _D2 , y _D2 ), and then the first relative position relationship corresponding to the first element 20 and the correction assembly 200 is determined based on the difference in the coordinate information.

Continuing to refer to FIG. 4, in the first coordinate system, the second connection between the first alignment mark B1 and the second alignment mark B2 of the first element 20 to be bonded is set to L2, and the first angle between the second connection L2 and the X-axis direction in the first coordinate system is α1; the third connection between the first correction mark D1 and the second correction mark D2 of the correction assembly 200 is set to L3, and the second angle between the third connection L3 and the X-axis direction in the first coordinate system is α2. Then, the first angle deviation △α1 of the first element 20 to be bonded and the correction assembly 200 in the first coordinate system is the difference between the first angle α1 and the second angle α2, that is, △α1 is the absolute value of (α2-α1).

Specifically, after obtaining the coordinate information of the first alignment mark B1 and the second alignment mark B2 of the first element 20, and the first calibration mark D1 and the second calibration mark D2 of the calibration assembly 200, a difference calculation is performed, that is, the absolute _value of the first X-axis difference △ x1 between _B1 and _D1 on the X-axis, △ x1 = ( xB1 - xD1 ), the absolute _value of the second X-axis difference △ x2 between B2 and _D2 on the X- _axis , △ x2 = ( xB2 - xD2 ), and the absolute _value of the first Y-axis difference △ y1 _between B1 and D1 on _the Y-axis, △ y1 = ( yB1 - yD1 ), the absolute _value of _the second Y-axis difference △ _y2 between B2 and D2 on the X-axis, △ y2 = ( _yB2 - yD2). ₂ =( y _B2 - y _D2 ), and the absolute value of the first angular deviation △α1 between the second line L2 and the third line L3, △α1=(α2-α1), and then according to the first X- _{axis difference value △x1} , the second X-axis difference value △ x2 , _the first Y-axis difference value △ y1 , the _second Y-axis difference value △ y2 and _the first angular deviation △α1, the first relative position relationship between the first element 20 and the correction assembly 200 can be determined.

After determining the first related position relationship, the keying device 10 drives the carrying platform 300 to carry the second component 30 to the second position, and drives the movable object-picking platform 100 to carry the calibration component 200 to the second position, that is, the position corresponding to the second image acquisition device 420 when it is in the alignment position, and then drives the second image acquisition device 420 to identify the third alignment mark T1 on the second component 30 and the first calibration mark D1 on the calibration component 200 in the second field of view, and establish a second coordinate system, and then determine the coordinate information of each mark in the second coordinate system.

Refer to Figure 5, which is a schematic diagram of the second coordinate of a calibration mark corresponding to the keying device in the present invention.

As shown in Figure 5, the second coordinate system includes an X-axis and a Y-axis. The coordinate information of the third alignment mark T1 in the second coordinate system is determined to be T1 ( x _T1 , y _T1 ), and the coordinate information of the first correction mark D1 is determined to be D3 ( x _D3 , y _D3 ). Then, the second relative position relationship corresponding to the second element 30 and the correction assembly 200 is determined based on the difference in the coordinate information.

Continuing to refer to FIG. 5, in the second coordinate system, the fourth line between the third alignment mark T1 of the second element 30 to be bonded and the first calibration mark D1 of the calibration assembly 200 is set to L4. Then, according to the distance relationship of the fourth line L4 and the angle relationship between the fourth line L4 and the X-axis and the Y-axis, the second relative position relationship corresponding to the second element 30 and the calibration assembly 200 can be determined.

Refer to Figure 6, which is a schematic diagram of the second coordinate system of the two calibration marks corresponding to the keying device in the present invention.

As shown in Figure 6, the second coordinate system includes an X-axis and a Y-axis. The coordinate information of the third alignment mark T1 in the second coordinate system is determined to be T1 ( x _T1 , y _T1 ), the coordinate information of the fourth alignment mark T2 is T2 ( x _T2 , y _T2 ), the coordinate information of the first correction mark D1 is D3 ( x _D3 , y _D3 ), and the coordinate information of the second correction mark D2 is D4 ( x _D4 , y _D4 ), and then the second relative position relationship corresponding to the second element 30 and the correction assembly 200 is determined based on the difference in the coordinate information.

Continuing to refer to FIG. 6, in the second coordinate system, the fifth line between the third alignment mark T1 and the fourth alignment mark T2 of the second element 30 to be bonded is set to L5, and the third angle between the fifth line L5 and the X-axis direction in the second coordinate system is α3; the sixth line between the first calibration mark D1 and the second calibration mark D2 of the calibration assembly 200 is set to L6, and the fourth angle between the sixth line L6 and the X-axis direction in the second coordinate system is α4. Then, the second angle deviation △α2 of the second element 30 to be bonded and the calibration assembly 200 in the second coordinate system is the difference between the third angle α3 and the fourth angle α4, that is, △α2 is the absolute value of (α4-α3).

Specifically, after obtaining the third alignment mark T1 and the fourth alignment mark T2 of the second element 30 in the second coordinate system, and the coordinate information of the first correction mark D1 and the second correction mark D2 of the correction assembly 200, the difference calculation is performed, that is, the absolute value of the third X-axis difference △ x3 between T1 and D1 on _the X -axis, △x3 _{= ( xT1} - xD3 ), the absolute value of the fourth X-axis difference △ x4 between T2 and D2 on the X-axis, △x4 _{= (} xT2 - xD4 ₎ , and the third Y-axis difference _△ y3 _between T1 and D1 on the Y-axis, _△ y3 = ( yT1 - yD3 ), the absolute value of the fourth Y-axis difference △y4 between _T2 and _D2 on the X-axis, y ₄ , △ y ₄ =( y _T2 - y _D4 ) absolute value, and the second angular deviation △α2 between the fifth line L5 and the sixth line L6, △α2=(α4-α3) absolute value, and then according to the third X-axis difference value △ x ₃ , the fourth X-axis difference value △ x ₄ , the third Y-axis difference value △ y ₃ , the fourth Y-axis difference value △ y ₄ and the second angular deviation △α2, the second relative position relationship between the second element 30 and the correction assembly 200 can be determined.

Then, based on the first calibration mark D1 of the calibration assembly 200, the first coordinate system and the second coordinate system are merged into a bonded coordinate system, that is, the coordinate information D1 ( x _D1 , y _D1 ) of the first calibration mark D1 in the first coordinate system is equal to the coordinate information D3 ( x _D3 , y _D3 ) in the second coordinate system. ), and then obtain the coordinate information of the first alignment mark B1 of the first element 20 and the third alignment mark T1 of the second element 30 in the bonding coordinate system, and then perform difference calculation based on the coordinate information to determine the alignment difference between the first element 20 and the second element 30. Therefore, the movable picking platform and/or the supporting platform can be driven to adjust according to the alignment difference to perform the alignment compensation operation, so that the first element 20 and the second element 30 are aligned, and then bonding is performed; that is, the alignment difference between the first element 20 and the second element 30 is determined, and then the alignment between the first element 20 and the second element 30 can be completed at one time based on the alignment difference, thereby avoiding the time-consuming problem caused by multiple alignments.

Similarly, when the calibration assembly 200 has multiple calibration marks and the first element 20 and the second element 30 have multiple alignment marks, the first coordinate system and the second coordinate system can also be merged into a bonded coordinate system according to the above method.

In this embodiment, the first relative position relationship between the first element and the calibration element can be obtained through the calibration element as a reference, and the second relative position relationship between the second element and the calibration element can be obtained, and then the alignment difference between the first element and the second element can be determined based on the first relative position relationship and the second relative position relationship, so that the bonding device can complete the alignment of the first element and the second element based on the alignment difference and perform bonding. At the same time, it is not necessary to perform multiple alignments for each second element to be bonded, which effectively shortens the time consumption and is conducive to improving bonding efficiency and productivity.

Furthermore, in the present invention, the identification of the first element 20 and the calibration assembly 200 is obtained in the first field of view, and the identification of the second element 30 and the calibration assembly 200 is obtained in the second field of view, and the distribution of the alignment mark of the first element 20 to be bonded and the alignment mark of the second element 30 to be bonded is not restricted. Therefore, the influence of the alignment mark of the first element 20 to be bonded and the alignment mark of the second element 30 to be bonded on the alignment mark of the first element 20 to be bonded and the alignment mark of the second element 30 to be bonded is effectively reduced.

Furthermore, the keying device of the present invention forms a motion closed loop through the cooperation of the first driving assembly and the second driving assembly, so that the supporting platform can achieve nano-level precision positioning, thereby effectively improving the keying accuracy.

It can be understood that the bonding device in the embodiment of the present invention can not only be applied to chip-to-wafer bonding technology (Chip-To-Wafer, C2W), that is: in the bonding device described in the above embodiment, through the cooperation between the platform frame 520, the base 510, the supporting platform 300 and the movable access platform 100 in the platform 500, a high-precision moving platform is formed, and a motion closed loop is formed, so that the chip to be bonded is moved to the preset surface position of the wafer to be bonded, and bonded at the preset surface position of the wafer to be bonded. In some embodiments, the bonding device in the embodiments of the present invention can also be applied to wafer-to-wafer bonding technology (Wafer-To-Wafer, W2W), that is: in the bonding device described in the above embodiments, through the cooperation between the platform frame 520, the base 510, the supporting platform 300 and the movable object picking platform 100 in the platform 500, a high-precision moving platform is formed, and a motion closed loop is formed, so that the first wafer to be bonded is moved to the preset surface position of the second wafer to be bonded, and bonded to the preset surface position of the second wafer to be bonded. Its working principle and the technical effect to be achieved are basically the same as those applied to the chip-to-wafer bonding technology. The specific contents can refer to the relevant description in the above embodiments. Similarly, the bonding device in the embodiment of the present invention can also be applied to chip-to-chip bonding technology (Chip-To-Chip, C2C). Its working principle and technical effects to be achieved are basically the same as those applied to chip-wafer bonding technology. The specific contents can refer to the relevant description in the above embodiment.

Based on the above-mentioned keying device, the following describes a method for keying the second element 30 and the first element 20 using the above-mentioned keying device.

Refer to Figure 7, which is a schematic diagram of the process of the first embodiment of the bonding method of the present invention. The following is a detailed description of each step of the bonding method provided in the embodiment of the present invention in conjunction with the figure.

Specifically, as shown in FIG. 7, the keying method can be applied to a keying device as in any of the above embodiments, and the keying method includes the following steps:

Method S10, obtaining the alignment mark of the first component and the correction mark of the correction assembly, and determining the first relative position relationship between the first component and the correction assembly according to the coordinate information of the alignment mark of the first component and the coordinate information of the correction mark.

The operation flow of an embodiment of method S10 is as follows: in response to the keying device performing a keying operation, the movable pick-up platform of the keying device is driven to pick up the first component; the movable pick-up platform of the keying device is driven to the first position, and the image acquisition device of the keying device is used to identify the alignment mark of the first component and the calibration mark of the calibration assembly; according to the coordinate information of the alignment mark of the first component and the coordinate information of the calibration mark, the first relative position relationship is determined.

In order to reduce multiple alignment operations, it is necessary to obtain the alignment mark of the first element and the calibration mark of the calibration component in the first field of view in advance; the calibration component can be a transparent, translucent or calibration sheet with a through hole.

Specifically, the keying device 10 drives the movable pick-up platform 100 to move to the picking position, and drives the movable pick-up platform 100 to move in the height direction, such as moving downward, through the second driving member 112, to pick up the first component 20 to be keyed on the supply platform 600, and after picking up the first component 20 to be keyed, drives the movable pick-up platform 100 to move in the height direction, such as moving upward, through the second driving member 112, and drives the first driving member 11 The movable object-picking platform 100 is carried to a first position, and the first alignment mark B1 of the first component 20 and the first calibration mark D1 of the calibration assembly are identified in a first field of view through the image acquisition device 400 in the alignment position; a first coordinate system is established according to the first alignment mark B1 and the first calibration mark D1, and coordinate information of each mark in the first coordinate system is obtained, wherein in the first coordinate system, the coordinate information of the first alignment mark B1 is B1( x _B1 , y _B1 ), and the coordinate information of the first calibration mark D1 is D1( x _D1 , y _D1 ).

Continuing to refer to FIG. 3, in the first coordinate system, the first connection line between the first alignment mark B1 of the first element 20 to be bonded and the first calibration mark D1 of the calibration assembly is set to L1, then according to the distance relationship between the first connection line L1, the first relative position relationship corresponding to the first element 20 and the calibration assembly 200 can be determined; in some embodiments, the first relative position relationship corresponding to the first element 20 and the calibration assembly 200 can also be further accurately determined according to the angle relationship between the first connection line L1 and the X-axis and the Y-axis.

If the first element 20 and the calibration assembly have multiple alignment marks and calibration marks respectively, the first relative position relationship corresponding to the first element 20 and the calibration assembly 200 is determined according to the coordinate relationship in FIG4.

Method S20, obtaining the alignment mark of the second element and the correction mark of the correction assembly, and determining the second relative position relationship between the second element and the correction assembly according to the alignment mark and coordinate information of the second element and the coordinate information of the correction mark, wherein the correction assembly and the first element or the second element maintain a fixed distance.

The operation flow of the first embodiment of method S20 is as follows: in response to the keying operation performed by the keying device, the carrying platform 300 of the keying device is driven to the second position, and the movable object-collecting platform 100 carrying the calibration component 200 is driven to the second position, and the image acquisition device 400 of the keying device is used to identify the alignment mark of the second element 30 and the calibration mark of the calibration component; according to the coordinate information of the alignment mark of the second element and the coordinate information of the calibration mark, the second relative position relationship is determined.

Among them, before keying, alignment is required. In order to avoid multiple alignments, it is necessary to obtain the alignment mark of the second component and the calibration mark of the calibration assembly in advance to determine the second relative position relationship between the second component and the calibration assembly; or in order to speed up keying, keying can be performed while aligning.

Specifically, after obtaining the first relative position relationship, the supporting platform 300 is driven to carry the second component 30 to be keyed to the second position, and the first driving member is driven to drive the movable object-picking platform 100 to carry the calibration component 200 to the second position, and then the third alignment mark T1 of the second component 30 and the first calibration mark D1 of the calibration component are identified in the second field of view through the second image acquisition device 420; and a second coordinate system is established according to the third alignment mark T1 and the first calibration mark D1, and the coordinate information of each mark in the second coordinate system is obtained, wherein, in the second coordinate system, the coordinate information of the third alignment mark is T1 ( x _T1 , y _T1 ), and the coordinate information of the first calibration mark D1 is D3 ( x _D3 , y _D3 ), and then determine the second relative position relationship corresponding to the second element 30 and the calibration assembly 200 according to the difference in coordinate information.

Continuing to refer to FIG. 5, in the second coordinate system, the fourth line between the third alignment mark T1 of the second element 30 to be keyed and the first calibration component D1 of the calibration component 200 is set to L4, then according to the distance relationship of the fourth line L4, the second relative position relationship corresponding to the second element 30 and the calibration component 200 can be determined; further, according to the angle relationship between the fourth line L4 and the X-axis and the Y-axis, the second relative position relationship corresponding to the second element 30 and the calibration component 200 can be further accurately determined.

In some embodiments, in response to the keyboard device performing an alignment compensation operation, the calibration assembly 200 is driven to a second position, and the image acquisition device 400 of the keyboard device is used to identify the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200 to obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation; wherein the calibration mark of the calibration assembly maintains a first relative position relationship with the alignment mark of the first element.

In some embodiments, the movable access platform and/or the supporting platform are used to move the first component and the second component to the second position, and perform an alignment compensation operation to align the first component and the second component driven to the second position; specifically, the movable access platform 100 and/or the supporting platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30 in the second position, and then the movable access platform 100 and/or the supporting platform 300 are moved in the height direction. Move the access platform 100 and/or the carrying platform 300 so that the first element 20 and the second element 30 are driven to the keying position; or move the movable access platform 100 and/or the carrying platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the keying position, and adjust the movable access platform 100 and/or the carrying platform 300 based on the alignment difference to perform alignment compensation operation on the first element 20 and the second element 30.

Method S30, determining the alignment difference between the first element and the second element according to the first relative position relationship and the second relative position relationship.

The operation flow of the first embodiment of method S30 is as follows: according to the first relative position relationship and the second relative position relationship, determine the angle deviation between the first element and the second element; according to the angle deviation, correct the relative position of the first element and the second element; according to the corrected relative position, determine the alignment difference between the first element and the second element.

In order to determine the relative relationship between the first element and the second element, the first coordinate system and the second coordinate system need to be merged into a bonded coordinate system.

Specifically, based on the first calibration mark D1 of the calibration assembly, the first coordinate system and the second coordinate system are merged into a bonded coordinate system, that is, the coordinate information D1 ( x _D1 , y _D1 ) of the first calibration mark D1 in the first coordinate system is equal to the coordinate information D3 ( x _D3 , y _D3 ) in the second coordinate system, thereby obtaining the coordinate information of the first alignment mark B1 of the first element 20 and the third alignment mark T1 of the second element 30 in the bonded coordinate system, such as the coordinate information given above, and then performing the difference calculation based on the coordinate information.

If there is a calibration mark, the coordinate information of the calibration mark in the first coordinate system is equal to the coordinate information of the calibration mark in the second coordinate system, and then according to the first alignment mark of the first element 20 and the third alignment mark of the second element 30, the coordinate difference between the first element 20 and the second element 30 is determined as the alignment difference.

Refer to Figure 8, which is a schematic diagram of the keying coordinate system corresponding to the keying device of the present invention.

As shown in FIG8 , in the bonding coordinate system, based on the coordinate information ( x _B1 , y _B1 ) of the first alignment mark B1 and the coordinate information ( x _T1 , y _T1 ) of the third alignment mark T1, the X-axis difference and the Y-axis difference between the first element 20 and the second element 30 can be determined, and then the alignment difference between the first element and the second element can be determined based on the X-axis difference and the Y-axis difference.

Method S40: Based on the alignment difference, drive the first element and/or the second element to adjust to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

Refer to Figures 9 and 10. Figure 9 is a schematic diagram of the bonding process of the first element and the second element in the present invention, and Figure 10 is a schematic diagram of the coordinate information of the first element and the second element in the bonding coordinate system after bonding in the present invention.

As shown in FIG9 , after obtaining the alignment difference, the first element and/or the second element can be driven to perform bonding.

In response to determining the alignment difference between the first element 20 and the second element 30, the calibration mark of the calibration assembly 200 maintains a first relative position relationship with the alignment mark of the first element 20, the first element 20 is driven to a second position, the image acquisition device is configured to identify the alignment mark of the second element 30 and the calibration mark of the calibration assembly 200, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform an alignment compensation operation ; or, in response to determining the alignment difference between the first element 20 and the second element 30, the calibration mark of the calibration assembly 200 and the calibration mark of the second element 30 mark a second relative position, the first element is driven to the second position, and the image acquisition device is configured to identify the alignment mark of the first element 20 and the calibration mark of the calibration assembly 200, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation.

That is, the calibration mark of the calibration assembly 200 can maintain a first relative position relationship with the alignment mark of the first element 20, or the calibration mark of the calibration assembly 200 can maintain a second relative position relationship with the alignment mark of the second element 30, which can be set according to the actual situation.

In some embodiments, after obtaining the alignment difference, the first driving member 111 and the third driving member 113 can be driven to drive the first element 20 on the movable object-picking platform 100 to adjust, wherein the first driving assembly 110 is driven according to the X-axis difference and the Y-axis difference to perform the alignment compensation operation of the first element 20 and the second element 30, so that the first element 20 is aligned with the second element 30.

In other embodiments, after obtaining the alignment difference, the second drive assembly 310 can be driven according to the X-axis difference and the Y-axis difference to drive the second element on the carrier platform 300 to adjust, and perform the alignment compensation operation of the first element 20 and the second element 30 so that the first element 20 is aligned with the second element 30; and the first drive assembly 110 and/or the second drive assembly 310 can be driven according to the angle deviation determined by the first relative position relationship and the second relative position relationship to adjust the angle of the first element 20 and the second element 30.

In other embodiments, after obtaining the alignment difference, the first drive assembly 110 and the second drive assembly 310 can be driven simultaneously to drive the first element 20 and the second element 30 to adjust, and the alignment compensation operation of the first element 20 and the second element 30 can be performed more quickly, so that the first element 20 is aligned with the second element 30.

After the first element 20 is aligned with the second element 30, the first driving assembly 110 is driven to drive the movable access platform 100 to carry the first element 20 and move in the height direction, such as moving downward, so that the first element 20 after moving downward contacts and keys with the second element, so that the keying position of the first element 20 and the keying position of the second element are further keyed, as shown in Figure 10.

In this embodiment, the first relative position relationship between the first element 20 and the correction assembly 200 in the first field of view is obtained, and the second relative position relationship between the second element 30 and the correction assembly 200 in the second field of view is obtained. The alignment difference between the first element and the second element is determined according to the first relative position relationship and the second relative position relationship, and then the first element and/or the second element is adjusted according to the alignment difference to align the first element and the second element; that is, the keying method in the present invention is applied to the above-mentioned keying device, and therefore has the same beneficial effects as the keying device, which will not be described in detail here.

The above is only the implementation method of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process change made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

10: Keying device

100: Movable access table

20: First Component

200: Calibration components

30: Second element

300: Loading platform

400: Image acquisition device

510: Base

520: Machine frame

Claims (19)

A wafer bonding device, the improvement of which is that it comprises: a movable pick-up platform, configured to move a first component; a carrying platform, configured to carry and move a second component; a calibration assembly, configured to provide a calibration mark, the calibration assembly and the first component or the second component maintain a fixed distance; an image acquisition device, comprising a first image acquisition device and a second image acquisition device, the first image acquisition device being configured to simultaneously obtain an alignment mark of the first component and a calibration mark of the calibration assembly in its first field of view, and determining a first alignment between the first component and the calibration assembly based on the alignment mark of the first component and the calibration mark. The second image acquisition device is configured to simultaneously obtain the alignment mark of the second element and the correction mark of the correction assembly in its second field of view, and determine the second relative position relationship between the second element and the correction assembly based on the alignment mark of the second element and the correction mark; wherein the bonding device determines the alignment difference between the first element and the second element based on the first relative position relationship and the second relative position relationship, and drives the movable object-picking platform and/or the carrying platform to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded. The keying device as described in claim 1, wherein the correction component is arranged on the movable pick-up platform; in response to the keying device performing the alignment compensation operation, the correction component is configured to be driven to the first position or the second position together with the movable pick-up platform, and the image acquisition device is configured to read the alignment mark of the first element at the first position and the correction mark of the correction component to confirm the first relative position relationship; or the image acquisition device is configured to read the alignment mark of the second element at the second position and the correction mark of the correction component to confirm the second relative position relationship; wherein the correction component maintains a fixed distance from the first element. The keying device as described in claim 1, wherein the correction component is arranged on the supporting platform; in response to the keying device performing the alignment compensation operation, the correction component is configured to be driven to a first position or a second position together with the supporting platform, so that the image acquisition device reads the alignment mark of the first element at the first position and the correction mark of the correction component to confirm the first relative position relationship; or the image acquisition device reads the alignment mark of the second element at the second position and the correction mark of the correction component to confirm the second relative position relationship; wherein the correction component maintains a fixed distance from the second element. The keying device as claimed in claim 1, wherein: in response to the keying device performing the alignment compensation operation, the image acquisition device is configured to use the first field of view to identify the alignment mark of the first element and the correction mark of the correction component, and use the second field of view to identify the alignment mark of the second element and the correction mark of the correction component. A bonding device as described in claim 4, wherein the second field of view of the image acquisition device is simultaneously located in the same direction of the correction component, the first element, and the second element; in response to the bonding device performing the alignment compensation operation, the correction component is configured as a transparent, translucent, or through-hole correction sheet. A keying device as described in claim 5, wherein the calibration assembly is detachably mounted on the movable retrieval table or the carrying platform. A keying device as described in claim 4, wherein, in response to the keying device performing the alignment compensation operation, the movable pick-up platform and the correction assembly are driven to a first position, and the first image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction assembly in the first field of view; then the movable pick-up platform and the correction assembly are driven to a second position, and the second image acquisition device is configured to identify the alignment mark of the second element and the correction mark of the correction assembly in the second field of view. A keying device as described in claim 7, wherein the first image acquisition device includes at least one first image acquisition unit, and the at least one first image acquisition unit determines the first field of view; the second image acquisition device includes at least one second image acquisition unit, and the at least one second image acquisition unit determines the second field of view. A keying device as described in claim 1, wherein, in response to determining the alignment difference between the first element and the second element, the correction mark of the correction assembly maintains the first relative position relationship with the alignment mark of the first element, the first element is driven to a second position, and the image acquisition device is configured to identify the alignment mark of the second element and the correction mark of the correction assembly, obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference, to perform The alignment compensation operation; in response to determining the alignment difference between the first element and the second element, the correction mark of the correction component and the alignment mark of the second element maintain the second relative position relationship, the first element is driven to the second position, the image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction component, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation. A keying device as described in claim 9, wherein, in response to the keying device performing a keying operation, the keying device adjusts the movable pick-up platform and/or the supporting platform based on the alignment difference to perform the alignment compensation operation on the first component and the second component in the second position, and then moves the movable pick-up platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position; in response to the keying device performing the keying operation, the keying device moves the movable pick-up platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position. When the first element and the second element are driven to the keying position, the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first element and the second element; in response to the keying device performing the keying operation, the keying device moves the movable access platform and/or the supporting platform in the height direction so that the first element and the second element are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first element and the second element. The keying device as described in claim 1, further comprising: a platform, including a base and a platform frame, wherein the platform frame is arranged on the base, the movable access platform is arranged on the platform frame, and the supporting platform is arranged on the base, and the movable access platform and/or the supporting platform are configured to be movable along the X direction, the Y direction, and the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable access platform and/or the supporting platform. The keying device as described in claim 11, further comprising: a first driving assembly, arranged on the platform frame and connected to the movable access platform, the first driving assembly being configured to carry the movable access platform to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane; a second driving assembly, arranged on the base and connected to the supporting platform, the second driving assembly being configured to carry the supporting platform to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane. A bonding method, which is improved in that it is applied to a bonding device, comprises: obtaining an alignment mark of a first component and a calibration mark of a calibration assembly simultaneously in a first field of view, and determining a first relative position relationship between the first component and the calibration assembly according to coordinate information of the alignment mark of the first component and the coordinate information of the calibration mark; obtaining an alignment mark of a second component and a calibration mark of the calibration assembly simultaneously in a second field of view, and determining a first relative position relationship between the first component and the calibration assembly according to coordinate information of the alignment mark of the second component and the coordinate information of the calibration mark; The identified coordinate information is used to determine the second relative position relationship between the second element and the correction component, wherein the correction component and the first element or the second element maintain a fixed distance; the alignment difference between the first element and the second element is determined according to the first relative position relationship and the second relative position relationship; the keying device drives the first element and/or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and keyed. The bonding method as claimed in claim 13, wherein the determining the first relative position relationship between the first element and the calibration assembly comprises: in response to the bonding device performing the alignment compensation operation, driving the movable object-picking platform of the bonding device and the calibration assembly to the first position, using the image acquisition device of the bonding device to identify the alignment mark of the first element and the calibration mark of the calibration assembly; and determining the first relative position relationship according to the coordinate information of the alignment mark of the first element and the coordinate information of the calibration mark. The bonding method as claimed in claim 14, wherein the second element is carried and moved by the carrying platform of the bonding device; the second relative position relationship between the second element and the calibration component is determined, including: in response to the bonding device performing an alignment compensation operation, driving the carrying platform of the bonding device and the calibration component to the second position, using the image acquisition device of the bonding device to identify the alignment mark of the second element and the calibration mark of the calibration component; and determining the second relative position relationship according to the coordinate information of the alignment mark of the second element and the coordinate information of the calibration mark. A bonding method as described in claim 13, wherein, in response to determining the alignment difference between the first element and the second element, the correction mark of the correction assembly maintains the first relative position relationship with the alignment mark of the first element, the first element is driven to a second position, and the image acquisition device is configured to identify the alignment mark of the second element and the correction mark of the correction assembly, obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference, to perform The alignment compensation operation; in response to determining the alignment difference between the first element and the second element, the correction mark of the correction component and the alignment mark of the second element maintain the second relative position relationship, the first element is driven to the second position, the image acquisition device is configured to identify the alignment mark of the first element and the correction mark of the correction component, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation. A bonding method as described in claim 15, wherein, in response to the bonding device performing a bonding operation, the first component is configured as a chip or wafer to be bonded, and the second component is configured as a wafer or wafer to be bonded; the first component and the second component are moved to a second position using the movable pick-up platform and/or the carrying platform, and an alignment compensation operation is performed to align the first component and the second component driven to the second position. A bonding method as described in claim 17, wherein the first component and the second component are moved to a second position using the movable access platform and/or the supporting platform, and an alignment compensation operation is performed to align the first component and the second component driven to the second position, comprising: adjusting the movable access platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the second position, and then moving the movable access platform and/or the supporting platform in a height direction to drive the first component and the second component to a bonding position; or or the movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component; or the movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform the alignment compensation operation on the first component and the second component. The bonding method as described in claim 13, wherein the alignment difference between the first element and the second element is determined based on the first relative position relationship and the second relative position relationship, including: determining the angular deviation between the first element and the second element based on the first relative position relationship and the second relative position relationship; correcting the relative position of the first element and the second element based on the angular deviation; and determining the alignment difference between the first element and the second element based on the corrected relative position.

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