TWI886708B - Bonding device and bonding method - Google Patents

Abstract

A bonding device and a bonding method are provided. The bonding device includes: a movable object pick-up platform configured to move a first component; a carrying platform configured to move a second component; an image acquisition apparatus configured to read an alignment mark of the first component and an alignment mark of the second component disposed on two sides of the image acquisition apparatus, respectively. The alignment mark of the first component after reading and the alignment mark of the second component after reading are located in a same coordinate system. Based on coordinate information of the alignment mark of the first component, coordinate information of the alignment mark of the second component, and preset calibration information, the bonding device is configured to determine an alignment difference between the first component and the second component; based on the alignment difference, the bonding device is configured to drive the movable object pick-up platform and/or the carrying platform to adjust and perform an alignment compensation operation, so as to align and bond the first component and the second component.

Description

A keying device and a keying method

The present invention relates to the field of semiconductor manufacturing, and in particular to a bonding device and a bonding method.

This invention claims priority to the following application: Chinese mainland patent application number 202311684199X filed on December 7, 2023. The application is hereby incorporated by reference in its entirety.

As semiconductor technology enters the post-Moore era, chip structures are developing in a three-dimensional direction to meet the needs of high integration and high performance. Among them, the use of bonding technology to achieve the manufacture of stacked chips is one of the important technologies of "super-Moore's Law". Bonding accuracy is an important parameter of the bonding process and has a significant impact on the application of the bonding process.

The present invention provides a bonding device and a bonding method to effectively shorten the time consumption, and is conducive to improving the bonding efficiency and productivity.

In order to solve the above technical problems, the first technical solution provided by the present invention is: providing a keying device, comprising: a movable object-picking platform, a carrying platform, and an image acquisition device; the movable object-picking platform is configured to move a first component; the carrying platform is configured to move a second component; the image acquisition device is configured to read the alignment marks of the first component and the second component on both sides of the image acquisition device, respectively, wherein the alignment marks of the first component and the second component after reading are respectively read. The alignment marks of the first and second components are located in the same coordinate system, and the keying device determines the alignment difference between the first component and the second component based on the coordinate information of the alignment mark of the first component, the coordinate information of the alignment mark of the second component, and the calibration information preset by the image acquisition device; wherein, the keying device drives the movable pickup platform and/or the carrying platform to adjust based on the alignment difference to perform the alignment compensation operation, so that the first component and the second component are aligned and keyed.

In some embodiments, the image acquisition device is a top-down image acquisition device, including: a top-down image acquisition component and a bottom-down image acquisition component, wherein the top-down image acquisition component responds to the image acquisition device being driven to the working position, and the top-down image acquisition component is configured to identify at least one alignment mark of the first element; the bottom-down image acquisition component responds to the image acquisition device being driven to the working position, and the bottom-down image acquisition component is configured to identify at least one alignment mark of the second element; wherein the keying device determines the coordinate difference based on at least one alignment mark of the first element and at least one alignment mark of the second element, and then determines the alignment difference between the first element and the second element according to the coordinate difference and the calibration information preset by the image acquisition device.

In some embodiments, the upward image acquisition component includes: an upward image acquisition unit and a first reflection unit; the upward image acquisition unit responds to the image acquisition device being driven to the working position, and the upward image acquisition unit is configured to identify at least one alignment mark of the first element; the first reflection unit responds to the upward image acquisition unit identifying at least one alignment mark of the first element, and the first reflection unit transmits at least one alignment mark of the first element to the correction coordinate system. The downward image acquisition component includes a downward image acquisition unit and a second reflection unit; the downward image acquisition unit responds to the image acquisition device being driven to the working position, and the downward image acquisition unit is configured to identify at least one alignment mark of the second element; the second reflection unit responds to the downward image acquisition unit identifying at least one alignment mark of the second element, and the second reflection unit transmits at least one alignment mark of the second element to the calibration coordinate system.

In some embodiments, the keying device is further configured to adjust the first element and the second element in the alignment position based on the alignment mark of the first element and the alignment mark of the second element identified by the image acquisition device, so that the first element and the second element in the alignment position are aligned in the height direction.

In some embodiments, in response to the keying device performing an alignment compensation operation, the first element and the second element aligned at the alignment position are configured to move to the keying position, and the image acquisition device is configured to identify the alignment mark of the first element and the alignment mark of the second element at the keying position, obtain the difference between the alignment marks of the first element and the second element, and use the comparison result of the difference with the preset calibration information as the alignment difference to perform the alignment compensation operation.

In some embodiments, in response to the keying device performing a keying operation, the keying device adjusts the movable access platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the alignment position, and moves the movable access platform and/or the supporting platform in a height direction so that the first component and the second component are driven. In response to the keying device performing the keying operation, the keying device moves the movable pick-up platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position, and adjusts the movable pick-up platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component.

In some embodiments, after aligning the first element and the second element in the majority alignment position, and before moving the first element and/or the second element in the height direction, the image acquisition device is driven to the initial position.

In some embodiments, the keying device further includes a platform, which includes a base and a platform frame, wherein the platform frame is arranged on the base, the movable access platform is arranged on the platform frame, and the supporting platform is arranged on the base, and the movable access platform and/or the supporting platform are configured to be movable along the X direction, the Y direction, and the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable access platform and/or the supporting platform.

To solve the above technical problems, the second technical solution provided by the present invention is: providing a bonding method, comprising: reading the alignment mark of a first component and the alignment mark of a second component, wherein the first component and the second component are located on different sides, and the alignment mark of the first component and the alignment mark of the second component after reading are located in the same coordinate system; determining the alignment difference between the first component and the second component according to the coordinate information of the alignment mark of the first component, the coordinate information of the alignment mark of the second component and the preset calibration information; the bonding device drives the first component and/or the second component to adjust based on the alignment difference to perform an alignment compensation operation, so that the first component and the second component are aligned and bonded.

In some embodiments, the obtaining of the alignment mark of the first component and the alignment mark of the second component includes: in response to the keying device performing a keying operation, driving the movable pick-up platform of the keying device to pick up and move the first component to the alignment position, and driving the supporting platform of the keying device to carry and move the second component to the alignment position; driving the image acquisition device of the keying device to the working position, and respectively identifying the alignment mark of the first component and the alignment mark of the second component in the calibration coordinate system.

In some embodiments, in response to the keyboard device performing an alignment compensation operation, the first element and the second element are driven to an alignment position, and the first element and the second element at the alignment position are adjusted so that the first element and the second element at the alignment position are aligned in the height direction.

In some embodiments, in response to the keyboard device performing the alignment compensation operation, the image acquisition device of the keyboard device is driven to a working position; the upward image acquisition component of the image acquisition device is used to identify at least one alignment mark of the first element, and the downward image acquisition component of the image acquisition device is used to identify at least one alignment mark of the second element; at least one alignment mark of the first element and at least one alignment mark of the second element are transferred to the same coordinate system to obtain the coordinate difference between the alignment mark of the first element and the alignment mark of the second element; the comparison result of the coordinate difference and the preset calibration information is used as the alignment difference to perform the alignment compensation operation.

In some embodiments, in response to the bonding device performing a bonding operation, the first component is configured as a chip or wafer to be bonded, and the second component is configured as a wafer or wafer to be bonded; the first component and the second component are moved to an alignment position using a movable pick-up platform and/or a carrying platform of the bonding device, and an alignment compensation operation is performed to align the first component and the second component driven to the alignment position.

In some embodiments, the movable pick-up platform and/or the supporting platform of the keying device is used to move the first component and the second component to the alignment position, and perform an alignment compensation operation to align the first component and the second component driven to the alignment position, including: adjusting the movable pick-up platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the alignment position, and then The movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position; or the movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform an alignment compensation operation on the first component and the second component.

In some embodiments, before the first element and the second element are aligned, the bonding method further includes: driving the image acquisition device of the bonding device from the initial position to the working position to read the alignment mark of the first element and the second element in the alignment position; after the first element and the second element are aligned, the bonding method further includes: driving the image acquisition device from the working position to the initial position to perform a subsequent alignment compensation operation or bonding operation.

Different from the prior art, the bonding device provided by the present invention is provided with an integrated image acquisition device, and the image acquisition device can obtain the alignment identification of the first component and the second component on different sides in the same coordinate system, and then compare it with the calibration information to determine the alignment difference between the first component and the second component, so that the bonding device completes the alignment of the first component and the second component based on the alignment difference and performs bonding. At the same time, it is not necessary to perform multiple alignments for each second component to be bonded, which effectively shortens the time consumption and is conducive to improving bonding efficiency and productivity.

△ x ₁ : First X-axis difference

△ x ₂ : Second X-axis difference

△ y ₁ : First Y-axis difference

△ y ₂ : Second Y-axis difference

△α: Angle deviation

10: Keying device

100: Movable access table

110: First drive assembly

200: Loading platform

210: Second drive assembly

300: Image acquisition device

310: Upward image acquisition component

311: Upward image acquisition unit

312: First reflection unit

320: Downward-view image acquisition component

321: Downward-looking image acquisition unit

322: Second reflection unit

330: Image acquisition driver

400: First element

500: Second component

600: Machine

610: Base

620: Machine frame

700: Supply platform

B1: First alignment mark

B2: Second alignment mark

L1: First connection

L2: Second connection

L3: The third connection

S10,S20,S30:Methods

T1: The third alignment standard

T2: The fourth alignment standard

X,Y,Z: axis (direction)

α1: First angle

α2: Second angle

In order to more clearly explain the technical solutions in the embodiments of the present invention, the following will briefly introduce the figures required for the description of the embodiments. Obviously, the figures described below are only some embodiments of the present invention. For those with ordinary knowledge in this field, other figures can be obtained based on these figures without making any progressive efforts, including:

Figure 1 is a schematic structural diagram of the first embodiment of the keying device of the present invention;

Figure 2 is a schematic structural diagram of the second embodiment of the keying device of the present invention;

Figure 3 is a schematic diagram of the structure for aligning the mark and transmitting it to the same plane;

Figure 4 is a schematic diagram of the calibration coordinate system corresponding to the keying device in the present invention;

Figure 5 is a schematic diagram of the process of the first embodiment of the bonding method of the present invention;

Figure 6 is a schematic diagram of the keyboard device of the present invention determining the coordinate information of the first element and the second element;

FIG7 is a schematic diagram of the process of the keying device of the present invention keying the first element to the preset surface position of the second element;

FIG8 is a schematic diagram of the coordinate information in the calibration coordinate system when the first element is keyed to the preset surface position of the second element in the present invention.

The following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by the ordinary knowledge in this field without making progressive labor are within the scope of protection of the present invention.

The terms "first", "second", and "third" in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units not listed, or may optionally also include other steps or units inherent to these processes, methods, products or apparatuses.

Reference to "embodiments" herein means that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described herein may be combined with other embodiments.

The present invention is described in detail below with reference to the drawings and embodiments.

Please refer to Figure 1, which is a structural schematic diagram of the first embodiment of the keying device provided by the present invention.

As shown in FIG1 , the keying device 10 includes: a movable object-picking platform 100, a supporting platform 200, and an image acquisition device 300; the movable object-picking platform 100 is configured to pick up and move a first component 400, the supporting platform 200 is configured to carry and move a second component 500, and the image acquisition device 300 is configured to read the first component 400 and the second component on both sides of the image acquisition device, respectively. 500, wherein the read alignment mark of the first element 400 and the alignment mark of the second element 500 are located in the same coordinate system, and the keying device 10 determines the alignment difference between the first element 400 and the second element 500 based on the coordinate information of the alignment mark of the first element 400, the coordinate information of the alignment mark of the second element 500 and the calibration information preset by the image acquisition device 300.

The keying device 10 drives the movable object-picking platform 100 and/or the carrying platform 200 to adjust based on the alignment difference to perform the alignment compensation operation, so that the first element 400 and the second element 500 are aligned and keyed; the alignment difference is the coordinate difference between the first element 400 and the second element 500 in the same coordinate system; the calibration information is the coordinate system (measurement) ratio of the image acquisition device 300, which can be determined by the internal parameters and/or external parameters of the image acquisition device 300.

In some embodiments, the movable object-collecting platform 100 can be disposed on the platform frame 620, and the image acquisition device 300 can also be disposed on the platform frame 620, and the platform frame 620 is disposed on the base 610.

It can be understood that in some embodiments, the first component 400 can be a wafer to be bonded or a chip to be bonded; correspondingly, the second component 500 can be a wafer to be bonded or a chip to be bonded.

It should be noted that FIG. 1 only shows an embodiment in which the movable access platform 100 is disposed on the top of the platform frame 620 and the supporting platform 200 is disposed on the base 610; in another embodiment, the movable access platform 100 can be disposed on the base 610 and the supporting platform 200 can be disposed on the platform frame 620, specifically to realize moving the first component 400 and the second component 500 to the alignment position, therefore, the positions of the movable access platform 100 and the supporting platform 200 are not limited in the present invention.

Specifically, in response to the picking operation performed by the keying device 10, the keying device 10 drives the movable pick-up platform 100 to first pick up the first component 400 to be keyed at the picking position, and then drives the movable pick-up platform 100 to the alignment position; and the keying device 10 also drives the supporting platform 200 carrying the second component 500 to be keyed to the alignment position, and after the first component 400 and the second component 500 reach the alignment position, , driving the image acquisition device 300 to the working position, and in response to the image acquisition device 300 being driven to the working position, the image acquisition device 300 can simultaneously identify and read the alignment mark of the first component 400 and the alignment mark of the second component 500 on both sides of the image acquisition device 300; and the alignment mark of the first component 400 and the alignment mark of the second component 500 after reading are located in the same coordinate system and obtains the coordinate information of the alignment mark of the first element in the coordinate system, and obtains the coordinate information of the alignment mark of the second element in the coordinate system; the keying device 10 determines the alignment difference between the first element 400 and the second element 500 based on the coordinate information of the alignment mark of the first element, the coordinate information of the alignment mark of the second element, and the calibration information preset by the image acquisition device 300; after obtaining the alignment After the difference is determined, the keying device 10 drives the movable access platform 100 and/or the supporting platform 200 to adjust based on the alignment difference to perform an alignment compensation operation to align the first element 400 and the second element 500, and moves the movable access platform 100 and/or the supporting platform 200 in the height direction after alignment, such as moving downward, so that the first element 400 and the second element 500 after moving downward contact and keying.

In some embodiments, the first component 400 may be moved vertically to the bonding position and then the alignment compensation operation may be performed to align the first component and the second component, and finally the first component 400 may be moved downward to bond the first component 400 and the second component 500.

In other embodiments, the alignment compensation operation can be performed while moving in the height direction, so that the first element 400 and the second element 500 can be aligned while moving in the height direction, thereby improving the bonding efficiency.

The picking position is the position where the movable pick-up platform 100 picks up the first component 400, the alignment position is the position where the first component 400 and the second component 500 are aligned; the working position is the position where the image acquisition device 300 obtains the alignment mark of the first component 400 and the second component 500, which is generally located between the first component 400 and the second component 500 before keying. More precisely, the working position is the position between the first component 400 and the second component 500 when the first component 400 and the second component 500 move to the alignment position.

In addition, the same coordinate system where the alignment mark of the first element 400 and the alignment mark of the second element 500 are located can be the same camera field of view, that is, the alignment mark of the first element 400 and the alignment mark of the second element 500 are transmitted to the same camera field of view, and thus, the coordinate system is set in the camera field of view, and the coordinate information of the first alignment mark and the coordinate information of the second alignment mark are determined.

In some embodiments, the movable access platform 100 can be driven for adjustment, the supporting platform 200 can be driven for adjustment, or the movable access platform 100 and the supporting platform 200 can be driven for adjustment at the same time, so that the first element 400 can be quickly aligned with the second element 500.

In some embodiments, the movable object-collecting platform 100 drives the first element 400 to move in the height direction, such as moving downward, and before moving downward, the keying device 10 is required to drive the image acquisition device 300 to the initial position, that is, to take the image acquisition device 300 away from the working position to avoid the image acquisition device 300 blocking the first element 400 during the downward movement.

That is, it is only necessary to obtain the alignment mark of the first component 400 and the alignment mark of the second component 500 once, and then the alignment difference between the first component 400 and the second component 500 can be determined according to the alignment mark of the first component, the alignment mark of the second component and the preset calibration information, and then the alignment between the first component 400 and the second component 500 can be completed once according to the alignment difference, thus avoiding the time-consuming problem caused by multiple alignments.

In this embodiment, the bonding device provided by the present invention is provided with an integrated image acquisition device, and the image acquisition device can obtain the alignment identification of the first element and the second element on different sides in the same coordinate system, and then compare it with the preset calibration information. The bonding device determines the alignment difference between the first element 400 and the second element 500, so that the bonding device can complete the alignment of the first element 400 and the second element 500 and perform bonding at one time based on the alignment difference, and there is no need to perform multiple alignments for each second element 500 to be bonded, which effectively shortens the time consumption and is conducive to improving the bonding efficiency and productivity.

Refer to Figure 2, which is a structural schematic diagram of the second embodiment of the keying device provided by the present invention.

As shown in FIG. 2 , the keying device 10 includes: a movable object-picking platform 100, a supporting platform 200, an image acquisition device 300, and a machine platform 600; wherein the movable object-picking platform 100 is configured to pick up and move the first component 400, the supporting platform is configured to carry and move the second component 500, and the image acquisition device 300 is configured to read the alignment marks of the first component 400 and the second component 500 on both sides of the image acquisition device 300, respectively, wherein the alignment marks of the first component 400 and the alignment marks of the second component 500 after reading are located in the same coordinate system, and the keying device 100 is configured to pick up and move the first component 400, the supporting platform is configured to carry and move the second component 500, and the image acquisition device 300 is configured to read the alignment marks of the first component 400 and the second component 500 on both sides of the image acquisition device 300, respectively. The combined device determines the alignment difference between the first element 400 and the second element 500 based on the coordinate information of the alignment mark of the first element 400, the coordinate information of the alignment mark of the second element 500, and the preset calibration information of the image acquisition device 300; the machine platform 600 includes a base 610 and a machine platform frame 620, the machine platform frame 620 is arranged on the base 610, the movable object-picking platform 100 is arranged on the machine platform frame 620 and faces the base 610, the carrying platform 200 is arranged on the base 610, and the image acquisition device 300 is arranged on the machine platform frame 620 and faces the base 610.

It should be noted that FIG. 2 only shows an embodiment in which the movable access platform 100 is arranged on the top of the platform frame and the supporting platform 200 is arranged on the base; in another embodiment, the movable access platform 100 can be arranged on the base and the supporting platform 200 is arranged on the platform frame, specifically to realize the movement of the first component 400 and the second component 500 to the keying position, therefore, the positions of the movable access platform 100 and the supporting platform 200 are not limited in the present invention.

In some embodiments, the keying device is configured to adjust the first element 400 and the second element 500 at the alignment position based on the alignment mark of the first element 400 and the alignment mark of the second element 500 identified by the image acquisition device 300, so that the first element 400 and the second element 500 at the alignment position are aligned in the height direction.

Furthermore, in response to the keying device performing an alignment compensation operation, the first element 400 and the second element 500 aligned at the alignment position are configured to move to the keying position, and the image acquisition device 300 is configured to identify the alignment mark of the first element 400 and the alignment mark of the second element 500 at the keying position, obtain the difference between the alignment mark of the first element 400 and the alignment mark of the second element 500, and use the comparison result of the difference with the preset calibration information as the alignment difference to perform the alignment compensation operation.

In some embodiments, in response to the keying device performing a keying operation, the keying device adjusts the movable access platform 100 and/or the supporting platform 200 based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500 in the alignment position, and moves the movable access platform 100 and/or the supporting platform 200 in the height direction so that the first component 400 and the second component 500 are driven to the keying position;

Furthermore, in response to the keying device performing a keying operation, the keying device moves the movable access platform 100 and/or the supporting platform 200 in the height direction so that the first component 400 and the second component 500 are driven to the keying position, and at the same time, the movable access platform 100 and/or the supporting platform 200 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500.

In some embodiments, the image acquisition device 300 is a top-down image acquisition device, that is, it can obtain images with an upward viewing angle and images with a downward viewing angle at the same time; specifically, it includes an upward image acquisition component 310 and a downward image acquisition component 320.

Among them, in response to the image acquisition device 300 being driven to the working position, the upward image acquisition component 310 is configured to identify at least one alignment mark of the first element 400 in the calibration coordinate system, which can be two, such as a first alignment mark and a second alignment mark; and the downward image acquisition component 320 is configured to identify at least one alignment mark of the second element 500 in the calibration coordinate system, which can also be two, such as a third alignment mark and a fourth alignment mark. Taking an alignment mark as an example, the upward image acquisition component 310 recognizes the first alignment mark of the first element 400, and the downward image acquisition component 320 recognizes the third alignment mark of the second element 500, and based on the first alignment mark and the third alignment mark, that is, the first alignment mark and the third alignment mark collected are directly in the calibration coordinate system, and then the coordinate difference between the first element 400 and the second element 500 in the calibration coordinate system is determined, and then the coordinate difference is compared with the preset calibration information, and then the alignment difference between the first element 400 and the second element 500 is determined.

The upward image acquisition component 310 may include an upward image acquisition unit 311 and a first reflection unit 312. In response to the image acquisition device 300 being driven to the working position, the upward image acquisition unit 311 is configured to identify at least one alignment mark of the first element 400; in response to the upward image acquisition unit 311 identifying at least one alignment mark of the first element 400, the first reflection unit 312 transmits at least one alignment mark of the first element 400 to the calibration coordinate system; the downward image acquisition component 320 may include a downward image acquisition unit 321 and a second reflection unit 312. Element 322, in response to the image acquisition device 300 being driven to the working position, the downward image acquisition unit 321 is configured to identify at least one alignment mark of the second element 500; in response to the downward image acquisition unit 321 identifying at least one alignment mark of the second element 500, the second reflection unit 322 transmits at least one alignment mark of the second element 500 to the calibration coordinate system, thereby determining the coordinate difference between the alignment mark of the first element 400 and the alignment mark of the second element 500 in the calibration coordinate system, thereby determining the alignment difference between the first element 400 and the second element 500.

In some embodiments, in order to obtain a larger viewing angle, the distribution of the alignment mark is not restricted, that is, there are multiple alignment marks to be identified, then there can be multiple upward image acquisition units 311, and there can also be multiple downward image acquisition units 321, so as to achieve the alignment marks required for obtaining the first element 400 and the second element 500.

In addition, the first reflection unit 312 and the second reflection unit 322 may also have a plurality of reflection mirrors, specifically to achieve the purpose of transmitting the alignment mark of the first element 400 and the alignment mark of the second element 500 to the calibration coordinate system in the same plane.

For a clearer presentation, the alignment mark is transferred to the same plane and described below with a diagram.

Refer to Figure 3, which is a schematic diagram of the structure of aligning the mark to be transmitted to the same plane.

As shown in FIG. 3 , an upward image acquisition unit, a downward image acquisition unit, two first reflection units, and two second reflection units are used as an example for explanation; after the upward image acquisition unit 311 recognizes and obtains the alignment mark of the first element 400, the alignment mark of the first element 400 is transmitted to the plane through the two first reflection units 312, and the downward image acquisition unit 321 recognizes and obtains the alignment mark of the second element 500. After the alignment mark, the alignment mark of the second element 500 is transmitted to the same plane through the two second reflection units 322, and then the coordinate difference between the alignment marks of the first element 400 and the second element 500 can be obtained in the calibration coordinate system of the plane, and then the coordinate difference is compared with the calibration information, that is, the coordinate difference is compared with the coordinate system ratio, and then the alignment difference between the first element 400 and the second element 500 is determined.

In some embodiments, after the first element 400 and the second element 500 in the alignment position are aligned, and before the first element 400 and/or the second element 500 are moved in the height direction, the image acquisition device needs to be driven to the initial position to prevent the image acquisition device from affecting subsequent keying operations.

The movable object-collecting platform 100 is configured to be movable along the X and Y directions of the horizontal plane, and along the height direction Z, and to rotate in a vertical plane perpendicular to the horizontal plane; the supporting platform 200 is configured to be movable along the X and Y directions of the horizontal plane, and along the height direction Z, and to rotate in a vertical plane perpendicular to the horizontal plane; the image acquisition device 300 is configured to be rotatable on the horizontal plane, wherein the rotation axis of the rotation direction is located outside the working position, specifically to realize that the image acquisition device 300 can be rotated to the working position or to the initial position.

In some embodiments, the image acquisition device 300 can move in the height direction and can also move in the X direction and Y direction of the horizontal plane.

Among them, the X direction and the Y direction are the intersecting directions in the same horizontal plane. If the X direction and the Y direction are perpendicular to each other in the same horizontal plane, the height direction is the direction perpendicular to the horizontal plane, that is, the vertical direction, and the rotation direction is the rotation in the horizontal plane.

In some embodiments, the movable pickup platform 100 can be a pick-up member that can be flipped, that is, after picking up the first component 400 at the picking position, it is flipped so that the keying surface of the first component 400 faces the first driving assembly 110, and after reaching the keying position, the pick-up member is flipped again so that the keying surface of the first component 400 faces the second component 500, so as to avoid the keying surface of the first component 400 being damaged during the moving process.

Among them, the keying position is the position corresponding to the keying of the first component 400 and the second component 500, the position corresponding to the alignment mark read by the image acquisition device 300 is the working position, that is, the position corresponding to the first component 400 and the second component 500, and the initial position is the position of the image acquisition device 300 in the non-working state.

In some embodiments, a seismic isolation and shock absorbing device may be provided at the bottom of the base 610 to eliminate the vibration caused by the supporting platform 200 when the second element 500 to be keyed is moved and during the keying process, thereby improving the stability of the keying device 10.

In some embodiments, the keying device 10 further includes a first drive assembly 110 and a second drive assembly 210, wherein the first drive assembly 110 is disposed on the platform frame and connected to the movable access platform 100, and the first drive assembly 110 is configured to carry the movable access platform 100 to move along the X direction and the Y direction of the horizontal plane, and to move along the height direction, and to rotate in a vertical plane perpendicular to the horizontal plane; the second drive assembly 210 is disposed on the base and connected to the supporting platform 200, and the second drive assembly 210 is configured to carry the supporting platform 200 to move along the X direction and the Y direction of the horizontal plane, and to move along the height direction, and to rotate in a vertical plane perpendicular to the horizontal plane.

In order to facilitate timely replacement of related components when a fault occurs, the first drive assembly 110 can be detachably mounted on the platform frame 620; the second drive assembly 210 can also be detachably mounted on the base 610.

It should be noted that the first drive assembly 110 and the second drive assembly 210 may also include: a motor, for example, a linear motor or a rotary motor, to provide power for the corresponding drive parts. It is understandable that the structural design of the first drive assembly 110 in the embodiment of the present invention may also refer to the specific structure in the relevant technology, as long as the movable object-picking platform 100 can be moved in the X direction and the Y direction in the horizontal plane and the function of positioning with nanometer-level precision can be achieved, and the present invention does not make specific restrictions. Correspondingly, the structural design of the second drive assembly 210 may also refer to the specific structure in the relevant technology, as long as the corresponding function can be achieved.

Optionally, the X direction, the Y second direction, and the Z direction (height direction) are perpendicular to each other. Specifically, the Y direction may be parallel to the direction where the Y axis is located, the X direction may be parallel to the direction where the X axis is located, and the Z direction may be parallel to the direction where the Z axis is located.

Optionally, the supporting platform 200 may also be a single-stage motion mechanism or other types of motion mechanisms, as long as it can move the second element 500 to be bonded to the preset surface position corresponding to the first element 400 to be bonded and bond to the preset surface position of the first element 400 to be bonded while meeting specific precision requirements.

In some embodiments, the keying device 10 may further include a supply platform 700, which is disposed on the base 610 and is configured to provide the first component 400 to be keyed to the movable pick-up platform 100, that is, a plurality of first components 400 to be keyed are placed on the supply platform 700, and the movable pick-up platform 100 picks up the first component 400 on the supply platform 700 at the picking position, and then carries the first component 400 to the alignment position for alignment.

The following describes the working process of the keying device 10.

Specifically, the top-view image acquisition component 310 of the image acquisition device 300 has a first viewing angle and is configured to read at least one alignment mark of the first component 400 to be keyed, and the bottom-view image acquisition component 320 of the image acquisition device 300 has a second viewing angle and is configured to read at least one alignment mark of the second component 500 to be keyed; the first component includes the first alignment mark and the second component includes the third alignment mark as an example for explanation, such as the first alignment mark B1 and the third alignment mark T1. The image acquisition device 300 can be arranged on the platform frame 620. After the movable object-picking platform 100 carries the first component 400 to be bonded to the alignment position, and the carrying platform carries the second component 500 to be bonded to the alignment position, the bonding device 10 drives the image acquisition device 300 to the working position, that is, the image acquisition device 300 arrives below the first component 400 and is located above the second component 500, and then obtains the first pair of corresponding components 400 through the upward image acquisition component 310. The alignment mark B1 is obtained, and the third alignment mark T1 corresponding to the second element 500 is obtained through the downward image acquisition component 320; then the alignment mark of the first element 400 is transmitted to the calibration coordinate system through the first reflection unit 312, and the alignment mark of the second element 500 is transmitted to the calibration coordinate system through the second reflection unit 322, and the coordinate information of each alignment mark is obtained respectively, and then the coordinate difference is determined according to the coordinate information, and compared with the calibration information to determine the alignment difference between the first element 400 and the second element 500.

At this time, the first viewing angle can also be called the upward viewing angle, and the second viewing angle can also be called the downward viewing angle; it can be understood that the image acquisition device 300 may not limit the connection relationship with other components, as long as the image acquisition device 300 is in the working position between the first component 400 and the second component 500 when obtaining the alignment mark of the first component 400 and the alignment mark of the second component 500.

In some embodiments, the image acquisition device 300 further includes an image acquisition driver 330, one end of which is connected to the platform frame 620, and the other end of which is connected to the image acquisition device 300. Before the first element 400 and the second element 500 are aligned, the image acquisition device 300 is driven to move from the initial position to the working position so that the image acquisition device 300 can obtain the first element through the upward image acquisition assembly 310. 400, and obtain the third and fourth alignment marks of the second element 500 through the downward image acquisition component 320; and after the alignment of the first element 400 and the second element 500 is completed, the image acquisition device 300 is driven to move from the working position to the initial position, so as to avoid the image acquisition device 300 affecting the related operations during the subsequent alignment compensation operation or the keying operation.

In order to better express the relationship between the first alignment identifier and the second alignment identifier, a coordinate system can be established.

Refer to Figure 4, which is a schematic diagram of the calibration coordinate system corresponding to the keying device in the present invention.

As shown in FIG. 4 , after obtaining the first alignment mark B1 corresponding to the first element 400 and the third alignment mark T1 corresponding to the second element 500, the first alignment mark B1 and the third alignment mark T1 are transmitted to the same plane through the reflection unit, and a calibration coordinate system is defined in the plane based on the calibration information of the image acquisition device 300, and then the coordinate information corresponding to the first alignment mark B1 and the third alignment mark T1 in the calibration coordinate system is obtained, such as B1( x _B1 , y _B1 ), T1( x _T1 , y _T1 ), and then calculate the coordinate difference based on the coordinate information of each alignment mark, and determine the alignment difference between the first component and the second component with the calibration information, and then determine the key alignment position of the first component 400 and the second component 500 according to the alignment difference, so that the first component 400 and the second component 500 are keyed according to the key alignment position.

In this embodiment, an integrated image acquisition device is provided, and the image acquisition device can obtain the alignment identification of the first element and the second element in the calibration coordinate system within the same camera field of view, and then compare it with the calibration information, and the bonding device determines the alignment difference between the first element and the second element, so that the bonding device completes the alignment of the first element and the second element and performs bonding based on the alignment difference. At the same time, there is no need to perform multiple alignments for each second element to be bonded, which effectively shortens the time consumption, and is conducive to improving bonding efficiency and productivity.

Furthermore, the image acquisition device and the upper and lower image acquisition cameras in the present invention can simultaneously obtain the alignment marks of the upper and lower directions, and then transmit the alignment marks of the upper and lower directions to the same camera field of view, so that the distribution of the alignment marks of the first component 400 to be bonded and the alignment marks of the second component 500 to be bonded is not restricted. Therefore, the influence of the alignment marks of the first component 400 to be bonded and the alignment marks of the second component 500 to be bonded on the size of the camera field of view is effectively reduced.

Furthermore, the bonding device of the present invention forms a motion closed loop through the cooperation of the first driving assembly, the second driving assembly and the displacement collection assembly, so that the supporting platform can achieve nano-level precision positioning, thereby effectively improving the bonding accuracy.

Based on the above-mentioned keying device, the following describes a method for keying the second element 500 and the first element 400 using the above-mentioned keying device.

Refer to Figure 5, which is a schematic diagram of the process of the bonding method of the present invention. The following is a detailed description of each step of the bonding method provided in this embodiment in combination with Figure 5 and Figure 5.

Specifically, as shown in FIG5 , the keying method can be applied to a keying device as in any of the above embodiments, and the keying method includes the following steps:

Method S10, reading the alignment mark of the first component and the alignment mark of the second component, wherein the first component and the second component are located on different sides, and the alignment mark of the first component and the alignment mark of the second component after reading are located in the same coordinate system.

In order to reduce the number of operations of reading alignment marks, after obtaining the alignment marks in the upward and downward directions, all alignment marks can be transferred to the same plane, that is, the alignment marks in the upward and downward directions corresponding to the marks in the same camera field of view.

Specifically, the movable pick-up platform 100 is driven to move to the picking position, and the first component 400 to be keyed on the supply platform 700 is picked up. After the first component 400 to be keyed is picked up, the movable pick-up platform 100 is driven to move to the alignment position. At the same time, the carrying platform 200 is driven to carry the second component 500 to move to the alignment position. At this time, the first component 400 corresponds to the second component 500. Because the keying positions of the components are different, the alignment of the first component 400 and the second component 500 may be deviated, and keying cannot be performed directly. Therefore, alignment calibration is required first; that is, the image acquisition device 300 is driven to move to the alignment position, so that the upward image acquisition component 310 of the image acquisition device 300 corresponds to the first element 400, and the downward image acquisition component 320 of the image acquisition device 300 corresponds to the second element 500, that is, the image acquisition device 300 is driven to move between the first element 400 and the second element 500, so that the first element 400 and the second element 500 can appear in the camera field of view of the image acquisition device 300 at the same time and the corresponding alignment mark can be read. At this time, the upward image acquisition component 310 in the image acquisition device 300 can read the first alignment mark B1 on the first component 400 to be bonded, and the downward image acquisition component 320 in the image acquisition device 300 can read the third alignment mark T1 of the second component 500 to be bonded.

Furthermore, the calibration coordinate system is defined through the calibration information of the image acquisition device 300, and the coordinate information corresponding to the first alignment mark B1 and the second alignment mark B2 and the third alignment mark T1 and the fourth alignment mark T2 in the calibration coordinate system is obtained.

The calibration information is the coordinate system (measurement) ratio of the image acquisition device 300, which can be determined by the internal parameters and/or external parameters of the image acquisition device 300.

Refer to Figure 6, which is a schematic diagram of the keyboard device in the present invention determining the coordinate information of the first element and the second element.

As shown in FIG6 , the first element may have two alignment marks, such as the first alignment mark B1 and the second alignment mark B2, and the second element may have two alignment marks, such as the third alignment mark T1 and the fourth alignment mark T2. Because the alignment mark of the first element and the alignment mark of the second element are both in the same plane, a unified coordinate system, i.e., a calibration coordinate system, is established to determine the positional relationship between the alignment marks; for example , using the calibration information corresponding to the image acquisition device to determine an origin in the camera field of view to define a calibration coordinate system, including an X-axis and a Y-axis, wherein the origin can be a boundary intersection, the X-axis can be a straight line in the X-direction, and the Y-axis can be a straight line in the Y-direction; and then obtaining coordinate information corresponding to the first alignment mark B1 and the second alignment mark B2 and the third alignment mark T1 and the fourth alignment mark T2 in the calibration coordinate system, such as B1( x _B1 , y _B1 ), B2( x _B2 , y _B2 ), T1( x _T1 , y _T1 ), T2( x _T2 , y _T2 ).

In order to determine whether the first element and the second element are aligned, it is necessary to determine based on the coordinate information in the calibration coordinate system.

Method S20, determining the alignment difference between the first element and the second element according to the coordinate information of the alignment mark of the first element, the coordinate information of the alignment mark of the second element and the preset calibration information.

Among them, the coordinate information of the alignment mark of the first element is the coordinate of the alignment mark in the calibration coordinate system, the coordinate information of the alignment mark of the second element is the coordinate of the alignment mark in the calibration coordinate system, and the default calibration information is the coordinate system (measurement) ratio determined by the image acquisition device based on the internal reference.

Continuing to refer to FIG. 4 , in the calibration coordinate system, including the X-axis and the Y-axis, the first connection line between the first alignment mark B1 of the first element 400 and the third alignment mark T1 of the second element 500 is set to L1. According to the preset calibration information, the coordinate information of the first alignment mark B1 is determined to be B1 ( x _B1 , y _B1 ), and the coordinate information of the third alignment mark T1 is determined to be T1 ( x _T1 , y _T1 ). Then, according to the distance information of the first connection line L1 and the angular relationship between the first connection line L1 and the X-axis and the Y-axis, the difference information between the first element 400 and the second element 500 can be determined.

Continuing to refer to FIG. 6 , in the calibration coordinate system, the second line between the first alignment mark B1 and the second alignment mark B2 of the first component 400 to be bonded is set to L2, and the first angle between the second line L2 and the X-axis direction in the calibration coordinate system is α1; the third line between the third alignment mark T1 and the fourth alignment mark T2 of the second component 500 to be bonded is set to L3, and the third line L3 and the calibration coordinate system are α1. The second angle between the X-axes in the coordinate system is α2, and the angle deviation △α between the first element 400 to be bonded and the second element 500 to be bonded in the calibration coordinate system is the difference between the first angle α1 and the second angle α2, that is, △α is the absolute value of (α2-α1), and the alignment difference between the first element 400 and the second element 500 can be determined based on the angle deviation and the coordinate difference between the alignment marks.

Specifically, after obtaining the coordinate information of the first alignment mark B1 and the second alignment mark B2 of the first element, and the coordinate information of the third alignment mark T1 and the fourth alignment mark T2 of the second element, a difference calculation is performed to obtain the coordinate difference between the alignment marks, that is, the absolute value of the first X-axis difference △ x ₁ between the first alignment mark B1 and the third alignment mark T1 on the X-axis, △ x ₁ =( x _B1 - x _T1 ), and the absolute value of the second X-axis difference △ x ₂ between the second alignment mark B2 and the fourth alignment mark T2 on the X-axis, △ x ₂ =( x _B2 - x _T2 ), as well as the absolute value of the first Y-axis difference value △ y ₁ between the first alignment mark B1 and the third alignment mark T1 on the Y-axis, △ y ₁ =( y _B1 - y _T1 ), the absolute value of the second Y-axis difference value △ y ₂ between the second alignment mark B2 and the fourth alignment mark T2 on the X-axis, △ y ₂ =( y _B2 - y _T2 ), and the absolute value of the angular deviation value △ α between the second connecting line L2 and the third connecting line L3, △ α =(α2-α1). Then, the first X-axis difference △ x ₁ , the second X-axis difference △ x ₂ , the first Y-axis difference △ y ₁ , the second Y-axis difference △ y ₂ , the angle deviation △ α and the coordinate system (measurement) ratio are compared to determine the alignment difference between the first component 400 and the second component 500 .

That is, the key _alignment position of the first element 400 and the second element 500 can be determined according to the first X-axis difference △ x ₁ , the second X-axis difference △ x ₂ , the first Y-axis difference △ y ₁ , the second Y-axis difference △ y 2 and the angle deviation △ α, and then the alignment difference between the first element 400 and the second element 500 can be determined by combining the above differences with the calibration information preset by the image acquisition device 300.

In some embodiments, the height difference between the first element 400 and the second element 500 can be determined based on the first distance between the first element 400 and the image acquisition device 300 and the second distance between the second element and the image acquisition device 300, and then the first element 400 can be moved in the height direction based on the height difference, such as moving the first element 400 downward so that the first element 400 and the second element 500 are in contact, avoiding damage to the first element 400 and the second element 500 due to excessive downward movement, or avoiding failure to complete keying due to insufficient downward movement.

Method S30: The bonding device drives the first element and/or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

Refer to Figures 7 and 8. Figure 7 is a schematic diagram of the process of the keying device in the present invention keying the first element to the preset surface position of the second element, and Figure 8 is a schematic diagram of the coordinate information in the calibration coordinate system when the first element in the present invention is keyed to the preset surface position of the second element.

In order to make the first component align with the second component, the movable object-picking platform 100 can be driven to drive the first component 400 to move, and the carrying platform 200 can also be driven to drive the second component to move; that is, in response to the key device performing the alignment compensation operation, the first component 400 and the second component 500 are driven to the alignment position, and the first component 400 and the second component 500 at the alignment position are adjusted so that the first component 400 and the second component 500 at the alignment position are aligned in the height direction, thereby facilitating The alignment mark of the first element 400 is identified by the upward image acquisition unit of the image acquisition device, and the alignment mark of the second element 500 is identified by the downward image acquisition component 320 of the image acquisition device, and then the alignment mark of the first element 400 and the alignment mark of the second element 500 are transferred to the same plane to obtain the corresponding coordinate difference; and the comparison result of the coordinate difference and the preset calibration information is used as the alignment difference to perform the alignment compensation operation, so that the first element 400 is aligned with the second element 500.

In some embodiments, in response to the bonding device performing a bonding operation, the first component 400 is configured as a chip or wafer to be bonded, and the second component 500 is configured as a wafer or wafer to be bonded; the first component 400 and the second component 500 are moved to an alignment position using a movable pick-up platform and/or a loading platform, and an alignment compensation operation is performed to align the first component 400 and the second component 500 driven to the alignment position.

The movable access platform 100 and/or the supporting platform 200 are adjusted based on the alignment difference to perform an alignment compensation operation on the first element 400 and the second element 500 in the alignment position, and then the movable access platform 100 is moved in the height direction so that the first element 400 and the second element 500 are driven to the keying position; or the movable access platform 100 and/or the supporting platform 200 are moved in the height direction so that the first element 400 and the second element 500 are driven to the keying position, and the movable access platform 100 and/or the supporting platform 200 are adjusted based on the alignment difference to perform an alignment compensation operation on the first element 400 and the second element 500.

In some embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the movable pick-up platform 100 is driven to move in the X-axis direction according to the X-axis coordinate difference, and the movable pick-up platform 100 is driven to move in the Y-axis direction according to the Y-axis coordinate difference.

Furthermore, the movable object-picking platform 100 can be driven to perform fine adjustment according to the angle deviation value △α, and the alignment position of the first element 400 and the second element 500 can be determined according to the preset calibration information of the image acquisition device 300, so that the first element 400 and the second element 500 are aligned.

In other embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the supporting platform 200 is driven to move in the X-axis direction according to the X-axis coordinate difference, and the supporting platform 200 is driven to move in the Y-axis direction according to the Y-axis coordinate difference.

In other embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the supporting platform 200 and the movable object-picking platform 100 are simultaneously driven to move in the X-axis direction according to the X-axis coordinate difference, and the supporting platform 200 and the movable object-picking platform 100 are simultaneously driven to move in the Y-axis direction according to the Y-axis coordinate difference.

Furthermore, the supporting platform 200 and the movable object-collecting platform 100 can be simultaneously driven for fine adjustment according to the angle deviation value △α, and the alignment position of the first element 400 and the second element 500 can be determined according to the preset calibration information of the image acquisition device 300, so that the first element 400 and the second element 500 are aligned.

As shown in FIG7, after the first element 400 and the second element 500 are aligned, the movable object-picking platform 100 is driven to move in the height direction based on the height difference, such as moving downward, so as to drive the first element 400 to move downward, and the first element 400 after moving downward contacts the second element 500 on the supporting platform 200, and performs keying. The coordinate information of the first alignment mark B1 of the first element 400 and the third alignment mark T1 of the second element 500 after keying in the calibration coordinate system is shown in FIG8.

In some embodiments, before the first element 400 and the second element 500 are aligned, the image acquisition device 300 of the keying device needs to be driven from the initial position to the working position so that the image acquisition device 300 reads the alignment marks of the first element and the second element in the alignment position; and after the first element 400 and the second element 500 are aligned, the image acquisition device 300 is driven from the working position to the initial position so as to perform subsequent alignment compensation operations or keying operations to avoid the first element 400 being blocked during the downward movement process.

Specifically, the first element 400 and the second element 500 are aligned, and before the first element 400 moves in the height direction, such as before moving down, the keying device 10 drives the image acquisition device 300 from the working position to the initial position, and then drives the second driving assembly 210 to carry the first element 400 on the movable object-collecting platform 100 to move down, and the downward movement is carried out according to the height difference, so that the first element 400 contacts the second element on the supporting platform 200 and performs keying.

In this embodiment, the obtained alignment mark of the first element and the alignment mark of the second element are transmitted to the same coordinate system to determine the coordinate information of the alignment mark of the first element and the alignment mark of the second element in the same coordinate system, so that the alignment difference between the first element and the second element can be determined according to the coordinate information, and then the first element and/or the second element are adjusted according to the alignment difference to align the first element and the second element; that is, the keying method in the present invention is applied to the above-mentioned keying device, and therefore has the same beneficial effects as the keying device, which will not be described in detail here.

The above is only the implementation method of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process change made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

10: Keying device

100: Movable access table

200: Loading platform

300: Image acquisition device

400: First element

500: Second component

610: Base

620: Machine frame

Claims (12)

A keyboard device, the improvement of which comprises: a movable object-picking platform, configured to move a first component; a carrying platform, configured to move a second component; an image acquisition device, configured to read the alignment marks of the first component and the second component on both sides of the image acquisition device, respectively, wherein the alignment marks of the first component and the alignment marks of the second component after reading are located in the same coordinate system, and the keyboard device moves the first component based on the alignment marks of the first component. The image acquisition device is a top-down image acquisition device, comprising a top-down image acquisition device, a top-down image acquisition device, and a bottom-down image acquisition device. The top-down image acquisition device comprises a top-down image acquisition device, a top-down image acquisition device, and a bottom-down image acquisition device. The top-down image acquisition device comprises a top-down image acquisition device, a top-down image acquisition device, and a bottom-down image acquisition device. The upward image acquisition component comprises: an upward image acquisition unit, in response to the image acquisition device being driven to the working position, the upward image acquisition unit is configured to identify at least one alignment mark of the first element; a first reflection unit, in response to the upward image acquisition unit identifying at least one alignment mark of the first element, the first reflection unit transmits at least one alignment mark of the first element to the first reflection unit; The downward image acquisition component includes: a downward image acquisition unit, which is configured to identify at least one alignment mark of the second element in response to the image acquisition device being driven to the working position; a second reflection unit, which transmits at least one alignment mark of the second element to the correction coordinate system in response to the downward image acquisition unit identifying at least one alignment mark of the second element. The keying device as described in claim 1, wherein the keying device is further configured to adjust the first element and the second element in the alignment position based on the alignment mark of the first element and the alignment mark of the second element respectively identified by the image acquisition device, so that the first element and the second element in the alignment position are aligned in the height direction. A bonding device as described in claim 2, wherein, in response to the bonding device performing an alignment compensation operation, the first element and the second element aligned at the alignment position are configured to move to the bonding position, and the image acquisition device is configured to identify the alignment mark of the first element and the alignment mark of the second element at the bonding position, obtain the difference between the alignment marks of the first element and the second element, and use the comparison result of the difference with the preset calibration information as the alignment difference to perform the alignment compensation operation. A keying device as described in claim 3, wherein, in response to the keying device performing a keying operation, the keying device adjusts the movable pick-up platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the alignment position, and moves the movable pick-up platform and/or the supporting platform in the height direction so that the first component and the second component are aligned. The component is driven to the keying position; in response to the keying device performing the keying operation, the keying device moves the movable pick-up platform and/or the supporting platform in the height direction so that the first component and the second component are driven to the keying position, and adjusts the movable pick-up platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component. A keying device as described in claim 4, wherein after the first element and the second element in the alignment position are aligned, and before the first element and/or the second element are moved in the height direction, the image acquisition device is driven to the initial position. The keying device as described in claim 1, further comprising: a platform, including a base and a platform frame, wherein the platform frame is arranged on the base, the movable access platform is arranged on the platform frame, the supporting platform is arranged on the base, the movable access platform and/or the supporting platform are configured to be movable along the X direction, the Y direction, and the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable access platform and/or the supporting platform. A bonding method, which is improved in that it is applied to a bonding device, comprises: reading an alignment mark of a first component and an alignment mark of a second component, wherein the first component and the second component are located at different sides, and the alignment mark of the first component and the alignment mark of the second component after reading are located in the same coordinate system; determining an alignment difference between the first component and the second component according to coordinate information of the alignment mark of the first component, coordinate information of the alignment mark of the second component and preset calibration information; the bonding device drives the first component and/or the second component to adjust based on the alignment difference to perform an alignment compensation operation, so that the first component and the second component are aligned and bonded; wherein, In response to the keyboard device performing the alignment compensation operation, the image acquisition device of the keyboard device is driven to the working position; the upward image acquisition component of the image acquisition device is used to identify at least one alignment mark of the first element, and the downward image acquisition component of the image acquisition device is used to identify at least one alignment mark of the second element; the at least one alignment mark of the first element and the at least one alignment mark of the second element are transferred to the same coordinate system to obtain the coordinate difference between the at least one alignment mark of the first element and the at least one alignment mark of the second element; the comparison result of the coordinate difference and the preset calibration information is used as the alignment difference to perform the alignment compensation operation. The bonding method as described in claim 7, wherein the reading of the alignment mark of the first component and the alignment mark of the second component includes: in response to the bonding device performing the bonding operation, driving the movable pick-up platform of the bonding device to pick up and move the first component to the alignment position, and driving the supporting platform of the bonding device to carry and move the second component to the alignment position; driving the image acquisition device of the bonding device to the working position, and respectively identifying the alignment mark of the first component and the alignment mark of the second component in the calibration coordinate system. A bonding method as described in claim 7, wherein, in response to the bonding device performing an alignment compensation operation, the first element and the second element are driven to an alignment position, and the first element and the second element at the alignment position are adjusted so that the first element and the second element at the alignment position are aligned in the height direction. A bonding method as described in claim 7, wherein, in response to the bonding device performing a bonding operation, the first component is configured as a chip or wafer to be bonded, and the second component is configured as a wafer or wafer to be bonded; the first component and the second component are moved to an alignment position using a movable pick-up platform and/or a carrying platform of the bonding device, and an alignment compensation operation is performed to align the first component and the second component driven to the alignment position. The bonding method as claimed in claim 10, wherein the movable pick-up platform and/or the supporting platform of the bonding device is used to move the first component and the second component to an alignment position, and an alignment compensation operation is performed to align the first component and the second component driven to the alignment position, including: adjusting the movable pick-up platform and/or the supporting platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the alignment position. The movable access platform and/or the supporting platform are then moved in the height direction so that the first component and the second component are driven to the keying position; or the movable access platform and/or the supporting platform are moved in the height direction so that the first component and the second component are driven to the keying position, and the movable access platform and/or the supporting platform are adjusted based on the alignment difference to perform an alignment compensation operation on the first component and the second component. A bonding method as described in claim 7, wherein, before the first element and the second element are aligned, the bonding method further includes: driving the image acquisition device of the bonding device from the initial position to the working position to read the alignment mark of the first element and the second element in the alignment position; after the first element and the second element are aligned, the bonding method further includes: driving the image acquisition device from the working position to the initial position to perform a subsequent alignment compensation operation or bonding operation.

Images