TWI886761B - Continuous manufacturing device and method with substrate cleaning function - Google Patents

Abstract

The invention discloses a continuous manufacturing device and method with substrate cleaning function. A laser drilling apparatus (process) performs a laser drilling operation in a substrate to form a hole, and a desmearing apparatus (process) performs a desmear cleaning operation at the hole of the substrate. Furthermore, a film sticking apparatus (process) performs a film sticking operation of a dry film on the substrate, and an exposure and developing apparatus (process) perform an exposure and developing operation on the dry film of the substrate. In addition, a stripping and desmearing apparatus (process) sequentially performs a stripping operation on the dry film of the substrate and a desmearing cleaning operation on a smear of the dry film in a continuous manner or an on-line manner.

Description

Continuous manufacturing equipment and method with substrate cleaning function

The present invention relates to a manufacturing technology for substrates, and in particular to a continuous manufacturing device and method with substrate cleaning function.

In the manufacturing and cleaning method of the substrate, the desmearing station at the front end is generally used to clean the through holes of the substrate, and then the chemical copper plating (abbreviated as "cupric") operation of the substrate, the film lamination operation of the substrate dry film, the exposure operation of the dry film, the development operation of the dry film and the electroplating operation of the substrate are carried out in sequence, and then the stripping operation of the substrate dry film is carried out at the stripping station at the back end.

However, after the dry film on the substrate is stripped, the dry film on the substrate is usually not clean or has residual dry film. Therefore, the substrate needs to be moved from the stripping station at the back end to the degumming station at the front end to perform the degumming cleaning operation of the dry film, and then the substrate needs to be moved from the degumming station at the front end to the micro-etching station at the back end to perform the micro-etching operation of the substrate through the second off-line method.

FIG1 is a schematic diagram of the process of the substrate manufacturing and cleaning method in the prior art, and includes the following steps S01 to S11.

As shown in step S01 to step S02, a through hole is first formed in the substrate, and then the through hole of the substrate is cleaned by degumming residue at the front end degumming residue station.

As shown in step S03 to step S07, the chemical copper plating (copperization) operation of the substrate, the film lamination operation of the substrate, the exposure operation of the dry film, the development operation of the dry film and the electroplating operation of the substrate are performed in sequence.

As shown in step S08 to step S09, the dry film of the substrate is stripped at the rear film stripping station. At this time, the dry film of the substrate may be stripped uncleanly or have residual dry film. Therefore, the substrate needs to be moved from the rear film stripping station to the front glue removal station through the first off-line method to perform glue removal and cleaning of the dry film of the substrate in the front glue removal station (see step S02).

As shown in step S10 to step S11, when the degumming and cleaning operation of the dry film is completed, the substrate is moved from the front-end degumming station to the rear-end micro-etching station through a second off-line method to perform the micro-etching operation of the substrate at the rear-end micro-etching station.

In other words, the conventional technology requires the front-end degumming station to perform degumming cleaning operations on both the through-holes and the dry film of the substrate, which will lead to an increase in the workload of the front-end degumming station and a slow processing speed.

Furthermore, the conventional technology requires the substrate to be moved from the film stripping station at the back end to the degumming station at the front end through the first off-line method to perform the degumming and cleaning operation of the dry film, and then the substrate is moved from the degumming station at the front end to the micro-etching station at the back end through the second off-line method to perform the micro-etching operation of the substrate, resulting in the overall operation of the substrate being quite complicated, unsmooth and consuming a lot of movement time.

In addition, conventional technology cannot rapidly manufacture and clean substrates in a continuous or on-line manner, and will also increase the risk of substrates being damaged, destroyed or lost during the secondary off-line process, thereby reducing the substrate manufacturing yield.

Therefore, how to overcome the above-mentioned problems of known technology has become a difficult problem that the industry needs to overcome urgently.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a continuous manufacturing device with a substrate cleaning function, which includes: a laser drilling device and a desmearing device, wherein the laser drilling device performs a laser drilling operation on the substrate to form a through hole, and then the desmearing device performs a desmearing and cleaning operation on the desmearing at the through hole of the substrate; a film pasting device, an exposure device and a developing device, wherein after the desmearing device performs a desmearing and cleaning operation on the desmearing at the through hole of the substrate, The film laminating device performs the film laminating operation on the substrate, and then the exposure device and the developing device respectively perform the exposure operation and the developing operation on the dry film of the substrate; and the film stripping and glue residue removal device, after the exposure device and the developing device respectively perform the exposure operation and the developing operation on the dry film of the substrate, the film stripping and glue residue removal device sequentially performs the film stripping operation on the dry film of the substrate and the glue residue removal operation on the dry film in a continuous manner or on-line manner.

The present invention also provides a continuous manufacturing method with a substrate cleaning function, which includes: using a laser drilling process to perform a laser drilling operation on a substrate to form a through hole, and then using a desmearing process to perform a desmearing and cleaning operation on the through hole of the substrate; after using the desmearing and cleaning operation on the through hole of the substrate, using a filming process to perform a dry film filming operation on the substrate. , and then use the exposure process and the development process to perform exposure and development operations on the dry film of the substrate respectively; and after using the exposure process and the development process to perform exposure and development operations on the dry film of the substrate respectively, use the film stripping and glue residue removal process to perform film stripping operations on the dry film of the substrate and glue residue removal and cleaning operations on the glue residue of the dry film in a continuous manner or on-line manner.

The aforementioned continuous manufacturing equipment and method with substrate cleaning function further includes using a layer-adding device or a pressing device to perform a layer-adding operation or a pressing operation on the core board of the substrate to form a multi-layer board before using a laser drilling device (laser drilling process) to perform a laser drilling operation on the substrate to form a through hole.

The aforementioned continuous manufacturing equipment and method with substrate cleaning function further includes using a desmearing device (desmearing process) to perform desmearing and cleaning operations on the through-holes of the substrate, and then using a chemical copper plating material to perform a chemical copper plating operation on the substrate or the through-holes to form a copper layer.

The aforementioned continuous manufacturing equipment and method with substrate cleaning function further includes using an exposure device (exposure process) and a developing device (developing process) to perform exposure and development operations on the dry film of the substrate, and then using a plating device (plating process) to perform plating operations on the substrate to form a plating layer.

The aforementioned continuous manufacturing equipment and method with substrate cleaning function further includes using a film stripping and desmearing device (film stripping and desmearing process) to perform film stripping operations on the dry film of the substrate and desmearing and cleaning operations on the glue residue of the dry film in a continuous manner or on-line manner, and then using a micro-etching device (micro-etching process) to perform micro-etching operations on the surface of the substrate.

As can be seen from the above, the continuous manufacturing equipment and method with substrate cleaning function described in the present invention mainly designs "stripping the dry film on the substrate" and "removing the glue residue from the dry film" in a common process or continuous manufacturing procedure, that is, using the film stripping and glue residue removal device (film stripping and glue residue removal process) in a continuous manner or in-line (o n-line) method is used to sequentially perform film stripping operations on the dry film of the substrate and glue residue removal and cleaning operations on the dry film, and only after completing this common process or continuous manufacturing procedure can the micro-etching device (micro-etching process) be used to perform micro-etching operations on the surface of the substrate, thereby ensuring that there will be no glue residue left after the glue residue removal and cleaning operations on the dry film of the substrate. At the same time, the present invention can efficiently and quickly manufacture and clean substrates, and can also improve the processing speed of the glue residue removal and cleaning operations on the dry film, and can also effectively reduce the possibility of damage, destruction or loss of the substrate during the manufacturing and cleaning process, thereby improving the manufacturing yield of the substrate.

Furthermore, the present invention can use a laser drilling device (laser drilling process) to automatically perform laser drilling operations on the substrate to form through holes, and then use a desmearing device (desmearing process) to perform desmearing and cleaning operations on the through holes of the substrate, which is conducive to quickly removing the desmearing at the through holes of the substrate.

In addition, the present invention can use a film laminating device (film laminating process) to automatically perform a dry film laminating operation on a substrate, and then use an exposure device (exposure process) and a developing device (developing process) to effectively perform an exposure operation and a developing operation on the dry film of the substrate.

10: Continuous production equipment

11: Add-on device

12: Pressing device

13: Laser drilling device

14: Glue residue removal device

15:Chemical copper plating materials

16: Film sticking device

17: Exposure device

18: Development device

19: Electroplating device

20: Film stripping and glue residue removal device

21: Micro-etching device

30:Substrate

31: Core board

32:Multi-layer board

33:Through hole

34: glue residue

35: Copper layer

36: Dry film

37: Electroplating

38: glue residue

S01 to S11: Steps

S21 to S31: Steps

Figure 1 is a schematic diagram of the process of substrate manufacturing and cleaning methods in the prior art.

Figure 2 is a block diagram of the continuous manufacturing equipment with substrate cleaning function described in the present invention.

Figure 3 is a schematic diagram of the process of the continuous manufacturing method with substrate cleaning function described in the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the restrictive conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first" and "second" used in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantial changes to the technical content, should also be regarded as the scope of implementation of the present invention.

FIG2 is a block diagram of the continuous manufacturing equipment 10 with substrate cleaning function of the present invention. As shown in the figure, the continuous manufacturing equipment 10 with substrate cleaning function may include or sequentially include at least one (such as multiple) layer-building device 11, a pressing device 12, a laser drilling device 13, a degumming device 14, at least one (such as multiple) chemical copper plating material 15, a film-attaching device 16, an exposure device 17, a developing device 18, an electroplating device 19, a film stripping and degumming device 20 and a micro-etching device 21, and can adopt, for example, semi-additive process (SAP) or modified semi-additive process (MSAP) to manufacture substrate 30. At the same time, the "at least one" mentioned in the present invention means more than one (such as one, two, three or four or more), and "plurality" means more than two (such as two, three, four or ten or more).

In detail, the continuous manufacturing equipment 10 with substrate cleaning function can include substrate manufacturing function and substrate cleaning function at the same time, so that in the overall process of manufacturing and cleaning the substrate 30, the continuous manufacturing equipment 10 with substrate cleaning function can quickly manufacture and clean the substrate 30 in a continuous manner or in an on-line manner, and this continuous manner or on-line manner can be a non-interrupted manner, a non-off-line manner, etc.

The build-up device 11 or the pressing device 12 can be used for the build-up operation or the pressing operation of the core board 31 of the substrate 30 to form a multi-layer board 32. For example, the build-up device 11 can form a build-up film (such as ABF build-up film) or an insulating build-up film by coating or spraying a build-up material. The laminating device 12 may be a laminating machine, a composite laminating machine, etc., for laminating a build-up film or an insulating build-up film, and the build-up film or insulating build-up film to be laminarized may be provided in the form of a film material and directly laminarized, or may be a build-up film or insulating build-up film formed by coating or spraying a build-up material. In other words, the continuous manufacturing equipment 10 with a substrate cleaning function may include a build-up device 11 and/or a laminating device 12. The multi-layer board 32 may be a multi-layer substrate, a multi-layer printed circuit board (PCB), a multi-layer circuit structure, etc., and multi-layer represents at least two layers (such as two, three, four or five layers or more).

Laser drilling device 13: can perform laser drilling operation on substrate 30 (such as multi-layer board 32) to form at least one (such as multiple) through hole 33, and the laser drilling operation of this laser drilling device 13 will form or leave slag 34 at the through hole 33 of substrate 30. For example, laser drilling device 13 can be a laser drilling machine, laser micro-hole processing machine, etc., and through hole 33 can be an opening, opening, conductive hole, through hole, blind hole, groove, etc.

Glue removal device 14: can be installed on the front end of the glue removal station, so that the glue removal device 14 can remove glue residue 34 at the through hole 33 of the substrate 30 (such as the multi-layer board 32). For example, the glue removal device 14 can be a glue removal machine, a plasma glue removal device, etc.

Chemical copper plating material 15: can be used for chemical copper plating (abbreviated as "copper plating") operation of substrate 30 (such as multi-layer board 32) or its through hole 33 to form copper layer 35 and conductive through hole or conductive blind hole. For example, chemical copper plating material 15 can be chemical copper plating solution, etc., and copper layer 35 can be copper foil, copper wire, copper line layer, etc.

Film pasting device 16: After the desmearing device 14 performs desmearing and cleaning operations on the through hole 33 of the substrate 30 (such as a multi-layer board), the film pasting device 16 performs a film pasting operation (such as lamination or covering operation) of the dry film 36 on the substrate 30 or its copper layer 35. For example, the film pasting device 16 can be a film pasting machine, an automatic film pasting machine, an (automatic) laminating machine, etc., and the dry film 36 can be a photoresist layer, a dry film photoresist, a photoresist dry film, an etching resist, a negative photoresist dry film, a negative water-soluble dry film photoresist, etc.

Exposure device 17 and development device 18: can sequentially perform exposure operation and development operation on the dry film 36 of the substrate 30 to form a patterned dry film 36. For example, the exposure device 17 can be an exposure machine, an automatic exposure machine, etc., and the development device 18 can be a developer, an automatic developer, a photoresist developer, etc.

In different embodiments, the exposure device 17 and the developing device 18 may be different devices, but the two may also be integrated into a single exposure and developing device having both exposure and developing functions.

Electroplating device 19: Electroplating operation can be performed on substrate 30 to form electroplated layer 37. For example, electroplating device 19 can be a substrate electroplating device, etc., and electroplated layer 37 can be an electroplated gold layer or an electroplated copper layer, etc.

The film stripping and glue residue removal device 20 can be arranged on the rear end of the film stripping and glue residue removal station, so that after the exposure device 17 and the developing device 18 sequentially perform the exposure operation and the developing operation on the dry film 36 of the substrate 30, the film stripping and glue residue removal device 20 sequentially performs the film stripping operation on the dry film 36 of the substrate 30 and performs the glue residue removal and cleaning operation on the glue residue 38 of the dry film 36 in a continuous manner or on-line manner. Because the glue residue 38 of the dry film 36 will be formed or remain after the film stripping and glue residue removal device 20 performs the film stripping operation on the dry film 36 of the substrate 30, the film stripping and glue residue removal device 20 needs to be used again to perform the glue residue removal and cleaning operation on the glue residue 38 of the dry film 36. For example, the continuous mode or the online mode may be an uninterrupted mode, a non-offline mode, etc.

In different embodiments, the film stripping and glue residue removal device 20 can be a single film stripping and glue residue removal device having both film stripping and glue residue removal cleaning functions, or a combination of a film stripping device having a film stripping function and a glue residue removal device having a glue residue removal cleaning function. For example, the film stripping device can be a film stripping machine, an automatic film stripping machine, a dry film stripping agent, etc., and the glue residue removal device can be a glue residue removal machine, a plasma glue residue removal device, etc.

Micro-etching device 21: can be set on the micro-etching station at the rear end, so that after the film stripping and desmearing device 20 sequentially strips the dry film 36 of the substrate 30 and desmears the glue residue 38 of the dry film 36 in a continuous manner or on-line manner, the micro-etching device 21 uses the micro-etching material to perform micro-etching on the surface of the substrate 30, and this micro-etching operation can clean or remove oxides, stains, grease, etc. on the surface of the substrate 30. For example, the micro-etching material can be a micro-etching agent, a micro-etching solution, etc.

Substrate 30: can be a semiconductor substrate, silicon substrate, aluminum substrate, glass substrate, ceramic substrate, copper foil substrate, printed circuit board (PCB), carrier, hard board, soft board, carrier, etc., and the core board 31 of substrate 30 can be a core layer, core substrate, single-layer board, double-layer board, etc.

It should be noted that the substrate 30 is not the subject of protection of the present invention. Therefore, the present invention does not illustrate or limit the actual product, structure, composition, components, materials, features or functions of the substrate 30, but only describes the basic components or common components of the substrate 30 (such as the core board 31, the multi-layer board 32, the through hole 33, the slag 34, the copper layer 35, the dry film 36, the electroplating layer 37, the slag 38, etc.).

In addition, in practical applications, the substrate 30 of the present invention may include various products, structures, components, elements, materials, features or functions, etc., rather than being limited to the basic components or common components (such as core board 31, multi-layer board 32, through hole 33, slag 34, copper layer 35, dry film 36, electroplating layer 37, slag 38, etc.) shown in FIG. 2 of the present invention, and will be described.

FIG3 is a schematic diagram of the process of the continuous manufacturing method with substrate cleaning function described in the present invention, and is described together with FIG2. At the same time, the main technical contents of the continuous manufacturing method with substrate cleaning function are as follows. The remaining technical contents are the same as the detailed description of the continuous manufacturing equipment 10 with substrate cleaning function shown in FIG2 above, and will not be repeated here.

The continuous manufacturing method with substrate cleaning function can include substrate manufacturing function and substrate cleaning function at the same time, so that during the whole process of manufacturing and cleaning the substrate 30, the continuous manufacturing method with substrate cleaning function can quickly manufacture and clean the substrate 30 in a continuous manner or an on-line manner, and this continuous manner or on-line manner can be a non-interrupted manner, a non-off-line manner, etc.

The continuous manufacturing method with substrate cleaning function can sequentially execute the following steps S21 to S31 in a continuous or on-line manner, and can also adjust and increase or decrease the order and number of steps from S21 to S31 according to different requirements or actual processes.

As shown in step S21 of FIG. 3 , a core board 31 of a substrate 30 is provided.

As shown in step S22 of FIG. 3 , a layer-adding device 11 or a pressing device 12 uses a pressing process to add layers or press the core board 31 of the substrate 30 to form a multi-layer board 32.

As shown in step S23 of FIG. 3 , the laser drilling device 13 uses a laser drilling process to perform a laser drilling operation on the substrate 30 (such as a multi-layer board 32) to form at least one (such as multiple) through holes 33, and the laser drilling operation of the laser drilling device 13 will form or leave slag 34 at the through hole 33 of the substrate 30.

As shown in step S24 of FIG. 3 , the desmearing device 14 at the front end desmearing station can use a desmearing process to perform a desmearing and cleaning operation on the through hole 33 of the substrate 30 (such as a multi-layer board 32).

As shown in step S25 of FIG. 3 , a chemical copper plating material 15 or a chemical copper plating process is used to perform a chemical copper plating (abbreviated as "copper plating") operation on a substrate 30 (such as a multi-layer board 32) or its through hole 33 to form a copper layer 35.

As shown in step S26 of FIG. 3 , the film laminating device 16 uses a film laminating process to perform a dry film 36 laminating operation (such as lamination or covering operation) on the substrate 30 or its copper layer 35 .

As shown in step S27 to step S28 of FIG. 3 , the exposure device 17 first uses an exposure process to expose the dry film 36 of the substrate 30, and then the developing device 18 uses a developing process to develop the dry film 36 of the substrate 30 to form a patterned dry film 36.

As shown in step S29 of FIG. 3 , the electroplating device 19 uses an electroplating process to perform electroplating on the substrate 30 to form an electroplating layer 37.

As shown in step S30 of FIG. 3 , the film stripping and degumming device 20 at the rear end of the film stripping and degumming station can use the film stripping and degumming process to sequentially perform film stripping operations on the dry film 36 of the substrate 30 and degumming and cleaning operations on the glue residue 38 of the dry film 36 in a continuous manner or on-line manner. Because the film stripping process of the film stripping and degumming device 20 will form or remain the glue residue 38 of the dry film 36 after the film stripping operation on the dry film 36 of the substrate 30, the degumming and degumming process of the film stripping and degumming device 20 is required to perform degumming and cleaning operations on the glue residue 38 of the dry film 36.

As shown in step S31 of FIG. 3 , the micro-etching device 21 on the rear micro-etching station can use a micro-etching process to perform micro-etching operations on the surface of the substrate 30, and this micro-etching operation can clean or remove oxides, stains, grease, etc. on the surface of the substrate 30.

In summary, the continuous manufacturing equipment and method with substrate cleaning function described in the present invention has at least the following characteristics, advantages or technical effects.

1. The present invention can use a laser drilling device (laser drilling process) to automatically perform laser drilling operations on a substrate to form a through hole, and then use a desmearing device (desmearing process) to perform desmearing and cleaning operations on the through hole of the substrate, which is conducive to quickly removing the desmearing at the through hole of the substrate.

Second, the present invention can use a film laminating device (film laminating process) to automatically perform dry film laminating operations on a substrate, and then use an exposure device (exposure process) and a developing device (developing process) to effectively perform exposure operations and developing operations on the dry film of the substrate.

3. The present invention can design "stripping the dry film on the substrate" and "removing the glue residue from the dry film" into a common process or continuous manufacturing procedure, that is, using a stripping and desmearing device (stripping and desmearing process) to strip the dry film on the substrate and remove the glue residue from the dry film in a continuous manner or on-line manner, and only after completing this common process or continuous manufacturing procedure can the micro-etching device (micro-etching process) be used to perform micro-etching on the surface of the substrate, thereby ensuring that there will be no problem of residual glue residue after removing the glue residue from the dry film on the substrate.

4. The prior art requires the front-end degumming station to perform degumming and cleaning operations on both the through-holes and the dry film of the substrate, resulting in an increase in the workload of the degumming and cleaning operations at the degumming and cleaning stations and a slow processing speed. In contrast, the present invention directly uses a film stripping and degumming device (film stripping and degumming process) at the back-end film stripping and degumming stations to perform film stripping and degumming and cleaning operations on the dry film and its glue residue in a continuous or on-line manner, so that the substrate can be efficiently and quickly manufactured and cleaned, and the processing speed of the degumming and cleaning operations on the glue residue of the dry film can also be improved.

5. The prior art requires the substrate to be repeatedly moved back and forth between the front-end degumming station and the back-end film stripping station through the first off-line method and the second off-line method, which makes the overall operation of the substrate quite complicated, not smooth and consumes a lot of movement time. In contrast, the present invention directly uses a film stripping and degumming device (film stripping and degumming process) to perform film stripping and degumming cleaning operations on the dry film and its glue residue of the substrate in a continuous manner or on-line manner, which can make the overall operation of the substrate quite smooth and does not consume a lot of substrate movement time.

6. The prior art cannot rapidly produce and clean substrates in a continuous or on-line manner, and will also increase the risk of substrates being damaged, destroyed or lost during the secondary off-line process, thereby reducing the substrate production yield. In contrast, the present invention directly uses a film stripping and degumming device (film stripping and degumming process) to sequentially strip the dry film and its glue residue on the substrate in a continuous or on-line manner, thereby rapidly producing and cleaning the substrate, and effectively reducing the risk of substrates being damaged, destroyed or lost during the production and cleaning process, thereby improving the substrate production yield.

7. The present invention can use a film stripping and glue residue removal device (film stripping and glue residue removal process) to perform film stripping operations on the dry film of the substrate and glue residue removal operations on the dry film in a continuous manner or in an online manner, and then use a micro-etching device (micro-etching process) and a micro-etching material to perform micro-etching operations on the surface of the substrate, so as to effectively clean or remove oxides, stains, grease, etc. on the surface of the substrate.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the attached patent application scope.

10: Continuous production equipment

11: Add-on device

12: Pressing device

13: Laser drilling device

14: Glue residue removal device

15:Chemical copper plating materials

16: Film sticking device

17: Exposure device

18: Development device

19: Electroplating device

20: Film stripping and glue residue removal device

21: Micro-etching device

30:Substrate

31: Core board

32: Multi-layer board

33:Through hole

34: glue residue

35: Copper layer

36: Dry film

37: Electroplating

38: glue residue

Claims (10)

A continuous manufacturing equipment with substrate cleaning function includes: The laser drilling device and the desmearing device are used to perform laser drilling on the substrate to form a through hole, and then the desmearing device is used to perform desmearing and cleaning operations on the desmearing at the through hole of the substrate; The film laminating device, exposure device and developing device are used to laminating the substrate with a dry film after the desmearing device performs the desmearing and cleaning operation on the through hole of the substrate, and then the exposure device and the developing device perform the exposure operation and the developing operation on the dry film of the substrate respectively; and The film stripping and glue residue removal device is used to strip the dry film of the substrate and remove the glue residue from the dry film in a continuous or online manner after the exposure device and the development device respectively perform the exposure operation and the development operation on the dry film of the substrate. The continuous manufacturing equipment with substrate cleaning function as described in claim 1 further includes a layer-adding device or a pressing device, which adds layers or presses the core board of the substrate to form a multi-layer board by the layer-adding device or the pressing device before the laser drilling device performs the laser drilling operation on the substrate to form the through hole. The continuous manufacturing equipment with substrate cleaning function as described in claim 1 further includes a chemical copper plating material. After the desmearing device performs the desmearing cleaning operation on the through hole of the substrate, the chemical copper plating material performs a chemical copper plating operation on the substrate or the through hole to form a copper layer. The continuous manufacturing equipment with substrate cleaning function as described in claim 1 further includes an electroplating device, which performs an electroplating operation on the substrate to form an electroplated layer after the exposure device and the developing device perform the exposure operation and the developing operation on the dry film of the substrate. The continuous manufacturing equipment with substrate cleaning function as described in claim 1 further includes a micro-etching device, which uses a micro-etching material to perform micro-etching on the surface of the substrate after the film stripping and desmearing device sequentially performs the film stripping operation on the dry film of the substrate and the desmearing cleaning operation on the glue residue of the dry film in the continuous manner or in-line manner. A continuous manufacturing method with substrate cleaning function includes: Use a laser drilling process to perform laser drilling operations on the substrate to form a through hole, and then use a desmearing process to perform a desmearing and cleaning operation on the through hole of the substrate; After using the desmearing process to perform the desmearing cleaning operation on the through hole of the substrate, using the film laminating process to perform the dry film laminating operation on the substrate, and then using the exposure process and the development process to perform the exposure operation and the development operation on the dry film of the substrate respectively; and After the exposure process and the development process are used to perform the exposure operation and the development operation on the dry film of the substrate respectively, the film stripping and degumming process is used to sequentially perform the film stripping operation on the dry film of the substrate and the degumming and cleaning operation on the degumming residue of the dry film in a continuous manner or in an online manner. The continuous manufacturing method with substrate cleaning function as described in claim 6 further includes using a layer-adding device or a pressing process to perform a layer-adding operation or a pressing operation on the core board of the substrate to form a multi-layer board before using the laser drilling process to perform the laser drilling operation on the substrate to form the through hole. The continuous manufacturing method with substrate cleaning function as described in claim 6 further includes performing a chemical copper plating operation on the substrate or the through hole using a chemical copper plating material to form a copper layer after performing the desmearing cleaning operation on the smear at the through hole of the substrate using the desmearing process. The continuous manufacturing method with substrate cleaning function as described in claim 6 further includes performing an exposure operation and a development operation on the dry film of the substrate using the exposure process and the development process, and then performing an electroplating operation on the substrate using an electroplating process to form an electroplated layer. The continuous manufacturing method with substrate cleaning function as described in claim 6 further includes using the film stripping and desmearing process to sequentially perform the film stripping operation on the dry film of the substrate and the desmearing cleaning operation on the glue residue of the dry film in the continuous manner or in-line manner, and then using the micro-etching process to perform micro-etching operation on the surface of the substrate.

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