TWI886318B - Processing method of workpiece - Google Patents

Abstract

[Topic] Provide a new processing method that can process a plate-shaped workpiece with a rectangular front and back surface with higher precision. [Solution] A method for processing a workpiece is used when a workpiece in the form of a plate is processed using a work jig and a processing unit. The plate-shaped workpiece has a rectangular first surface with four sides and a rectangular second surface located on the opposite side of the first surface. The work jig has a holding surface. The processing unit processes the workpiece held on the work jig. The method for processing the workpiece includes the following steps: an acquisition step, in which the height of a region including the four sides of the workpiece is measured to obtain displacement information while the second side of the workpiece is held on the holding surface of the work jig, and the direction of the side in the XY plane parallel to the holding surface and the four XY coordinates indicating the positions of the four sides in the XY plane are obtained from the displacement information; and a processing step, in which the workpiece is processed according to the direction of the side and the four XY coordinates.

Description

Processing method of workpiece

The present invention relates to a method for processing a workpiece used when processing a plate-shaped workpiece having rectangular front and back surfaces.

Optical parts such as substrates constituting the screen of flat panel displays can be manufactured by processing a workpiece such as a glass plate that is transparent in the visible light region. When processing such a workpiece, a processing device such as a laser processing device that generates a high-output laser beam or a cutting device that mounts a ring-shaped cutting blade containing abrasive grains on a spindle can be used (see, for example, Patent Document 1).

Generally speaking, these processing devices extract the shape of the device or the like existing in the workpiece from the image obtained by photographing the workpiece with a camera, and confirm the position of the workpiece to be processed (the predetermined processing line). On the other hand, when processing a workpiece without a shape, for example, the workpiece is arranged at a predetermined position of a work clamp provided in the processing device, so that the predetermined position of the workpiece can be processed. Prior art literature Patent literature

Patent document 1: Japanese Patent Application Publication No. 2006-93333

Invention Problems to be Solved

However, although the transport mechanism for transporting the workpiece in the processing device is configured to carry the workpiece to the worktable with high accuracy, in reality, there are many cases where the position of the workpiece that has been carried in and the position of the target workpiece are offset by less than 5 mm. Therefore, in the above method of arranging the workpiece at a predetermined position of the worktable, it is not necessarily possible to process the workpiece with sufficiently high accuracy.

For example, when processing a workpiece with a circular front and back surface, the workpiece can be processed with higher accuracy by finding the position equivalent to the center of the circle from the positions of three points on the outer periphery. However, when processing a workpiece with a rectangular front and back surface, this method used for processing a workpiece with a circular front and back surface cannot be directly transferred to the workpiece.

Accordingly, the purpose of the present invention is to provide a new method for processing a workpiece that can process a plate-shaped workpiece with a rectangular front and back surface with higher precision. Means for solving the problem

According to one aspect of the present invention, a method for processing a workpiece can be provided, which is used when a workpiece in the form of a plate is processed using a work jig and a processing unit. The plate-shaped workpiece has a rectangular first surface with four sides and a rectangular second surface located on the opposite side of the first surface. The work jig has a holding surface. The processing unit processes the workpiece held on the work jig. The method for processing the workpiece includes the following steps: An acquisition step, in which the height of an area including the four sides of the workpiece is measured to obtain displacement information while the second side of the workpiece is held on the holding surface of the work jig, and the following are obtained from the displacement information: the direction of the side in an XY plane parallel to the holding surface, and four XY coordinates representing the positions of the four sides in the XY plane; and Processing step: Process the object according to the direction of the edge and the four XY coordinates.

In one aspect of the present invention, the acquisition step further includes the following steps: A direction acquisition step, wherein the height of an area including one side of the workpiece is measured on two straight lines passing through different positions in the Y direction and parallel to the X direction by moving the height measuring device and the work clamp relative to each other to obtain displacement information, and the XY coordinates of two positions where the side and the two straight lines intersect are calculated from the displacement information to obtain the direction of the side; The first coordinate acquisition step is to adjust the direction of the work clamp around the rotation axis perpendicular to the XY plane so that the direction of the edge acquired in the direction acquisition step becomes parallel to the Y direction, and then move the measuring device and the work clamp relative to each other, thereby measuring the height of the area including the two opposing edges of the workpiece on a straight line parallel to the X direction to obtain displacement information, and obtain two XY coordinates representing the two positions where the two opposing edges intersect the straight line from the above displacement information; and In the second coordinate acquisition step, the direction of the work clamp around the rotation axis is adjusted so that the direction of the side obtained in the direction acquisition step becomes perpendicular to the Y direction, and the measuring device and the work clamp are moved relative to each other, thereby measuring the height of the area including the other two sides of the workpiece facing each other on a straight line parallel to the X direction to obtain displacement information, and obtaining two XY coordinates representing the two positions where the other two sides facing each other intersect the straight line from the above displacement information.

Furthermore, in one aspect of the present invention described above, the acquisition step further includes the following steps: A first coordinate acquisition step, wherein the height of the region including the two opposing sides of the workpiece is measured on two straight lines at different positions in the Y direction and parallel to the X direction by moving the height measuring device and the worktable relative to each other to obtain displacement information, and more than three XY coordinates representing more than three positions where the two opposing sides intersect the two straight lines are obtained from the displacement information; The second coordinate acquisition step is to move the measuring device and the work clamp relative to each other in a state that the direction of the work clamp around the rotation axis perpendicular to the XY plane is perpendicular to the direction of the work clamp in the first coordinate acquisition step, thereby measuring the height of the area including the other two opposing sides of the workpiece on a straight line parallel to the X direction to obtain displacement information, and obtain two XY coordinates representing two positions where the other two opposing sides intersect the one straight line from the above displacement information; The direction acquisition step is to obtain the direction of one of the two opposing sides from the two XY coordinates obtained in the first coordinate acquisition step and representing two positions where one of the two opposing sides intersects the two straight lines; and The coordinate correction step is to correct the two XY coordinates of the two positions where the two sides facing each other and one of the two straight lines intersect, obtained in the first coordinate acquisition step, and the two XY coordinates obtained in the second coordinate acquisition step, according to the direction of the side obtained in the direction acquisition step, to obtain four corrected XY coordinates.

According to another aspect of the present invention, a method for processing a workpiece can be provided, which is used when a workpiece in the form of a plate is processed using a work jig and a processing unit. The plate-shaped workpiece has a rectangular first surface with four sides and a rectangular second surface located on the opposite side of the first surface. The work jig has a holding surface. The processing unit processes the workpiece held on the work jig. The method for processing the workpiece includes the following steps: An acquisition step, in which the direction of one side of the workpiece is acquired in an XY plane parallel to the holding surface from an image obtained by photographing an area including the side of the workpiece while the second side of the workpiece is held on the holding surface of the work clamp, and four XY coordinates representing the positions of the four sides in the XY plane are acquired from displacement information obtained by measuring the height of an area including the four sides of the workpiece; and a processing step, in which the workpiece is processed according to the direction of the side and the four XY coordinates. Effect of the invention

In the processing method of a workpiece of one layer and another layer of the present invention, since the direction of any edge of the first surface of the workpiece and the four XY coordinates representing the positions of the four edges of the first surface can be obtained, the workpiece can be processed with high precision based on these.

The form used to implement the invention

Hereinafter, the embodiments of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view showing a laser processing device (processing device) 2 used in the present embodiment. In FIG. 1 , some components of the laser processing device 2 are omitted. In addition, the X direction (front-back direction, processing feed direction), the Y direction (left-right direction, indexing feed direction), and the Z direction (vertical direction, cutting feed direction) used in the following description are perpendicular to each other.

As shown in Fig. 1, the laser processing device 2 has a base 4 supporting a plurality of components. A columnar or wall-shaped support structure 6 protruding upward is provided at the rear end of the base 4. In addition, a columnar housing portion 4a protruding upward is provided at the front corner of the base 4.

An opening is formed on the upper surface of the accommodating portion 4a. A space is formed on the inner side of the accommodating portion 4a that communicates with the outside through the opening of the upper surface, and accommodates a film cassette support platform 8 having a substantially flat upper surface and a lifting mechanism (not shown) for lifting the film cassette support platform 8. A film cassette 10 can be placed on the upper surface of the film cassette support platform 8 exposed from the opening of the accommodating portion 4a, and the aforementioned film cassette 10 can accommodate a plurality of workpieces 11.

The workpiece 11 is formed into a plate-like shape using a glass material that is transparent in the visible light region, for example, and has a rectangular first surface (front surface) 11a having four sides and a rectangular second surface (back surface) 11b located on the opposite side of the first surface 11a (see FIG. 4, etc.). The first surface 11a and the second surface 11b of the workpiece 11 are not provided with a device or the like.

Furthermore, a tape (cutting tape) 13 having a larger diameter than the workpiece 11 is attached to the second surface 11b of the workpiece 11. The outer peripheral portion of the tape 13 is fixed to a frame 15 arranged in a ring shape around the workpiece 11. That is, the workpiece 11 is accommodated in the cassette 10 in a state of being supported by the frame 15 via the tape 13.

However, there is no limitation on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate formed of a semiconductor material represented by silicon, ceramics, resin, metal, etc. may be used as the workpiece 11. Similarly, a device such as an IC (Integrated Circuit) or an LED (Light Emitting Diode) may be formed in the workpiece 11. In addition, the workpiece 11 may be supported on the frame 15 without being supported by the tape 13.

A positioning unit 12 is disposed adjacent to the accommodating portion 4a. The positioning unit 12 can align the approximate position of the frame 15 supporting the workpiece 11. The positioning unit 12 includes, for example, a pair of guide rails that approach and move away while maintaining a parallel state relative to the Y direction. Each guide rail has a bottom surface supporting the frame 15 and a side surface perpendicular to the bottom surface.

For example, the frame 15 removed from the film magazine 10 can be placed on the guide rail of the alignment unit 12 and the frame 15 can be clamped in the X direction by the guide rail to align the frame 15 (i.e., the workpiece 11) at a predetermined position. Above the alignment unit 12, a conveying unit 14 for conveying the frame 15 is arranged.

A moving mechanism (processing feed mechanism, indexing feed mechanism) 16 is arranged in the area on the side of the positioning unit 12. The moving mechanism 16 has a pair of Y-axis guide rails 18 fixed to the upper surface of the base 4 and substantially parallel to the Y direction. A Y-axis moving table 20 is slidably mounted on the Y-axis guide rails 18.

A nut portion (not shown) is provided on the lower surface of the Y-axis moving table 20. A Y-axis ball screw 22 roughly parallel to the Y-axis guide rail 18 is rotatably connected to the nut portion. A Y-axis pulse motor 24 is connected to one end of the Y-axis ball screw 22. As long as the Y-axis pulse motor 24 rotates the Y-axis ball screw 22, the Y-axis moving table 20 moves in the Y direction along the Y-axis guide rail 18.

A pair of X-axis guide rails 26 substantially parallel to the X direction are fixed to the upper surface of the Y-axis moving table 20. An X-axis moving table 28 is slidably mounted on the X-axis guide rails 26. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 28.

The nut portion is rotatably connected to an X-axis ball screw 30 that is substantially parallel to the X-axis guide rail 26. An X-axis pulse motor 32 is connected to one end of the X-axis ball screw 30. When the X-axis pulse motor 32 rotates the X-axis ball screw 30, the X-axis moving table 28 moves in the X-direction along the X-axis guide rail 26.

A θ table 34 is provided on the upper surface side of the X-axis moving table 28. The θ table 34 includes a table base 34a (see FIG. 4 etc.) configured to be rotatable around a rotation axis substantially parallel to the Z direction, and a rotation drive source (not shown) such as a motor connected to the table base 34a. A work clamp 36 can be fixed on the upper surface of the table base 34a.

The work clamp 36 includes a disc-shaped frame 38 (see FIG. 4, etc.) formed of a metal such as stainless steel. A recess 38a (see FIG. 4, etc.) having a circular opening at the upper end is formed on the upper surface side of the frame 38. A retaining plate 40 (see FIG. 4, etc.) formed of a porous disc and made of ceramic or the like is fixed to the recess 38a. The upper surface of the retaining plate 40 is substantially parallel to the X direction and the Y direction, and serves as a retaining surface 40a that retains the second surface 11b side of the workpiece 11 via the tape 13.

The lower surface of the holding plate 40 is connected to a suction source (not shown) such as an ejector through a flow path 38b or a valve (not shown) provided inside the frame 38. Therefore, as long as the tape 13 is brought into contact with the holding surface 40a, the valve is opened, and the negative pressure of the suction source is applied, the workpiece 11 is attracted to the work clamp 36 through the tape 13. Four clamps 42 are arranged around the work clamp 36 to fix the annular frame 15 supporting the workpiece 11 from all sides.

A support arm 6a protruding from the front surface of the support structure 6 is provided. An irradiation head (processing unit) 44 is arranged at the front end of the support arm 6a. The irradiation head 44 irradiates a laser beam 44a (see FIG. 8 ) generated by pulse oscillation of a laser oscillator (processing unit) (not shown) toward an object below.

Although there is no particular limitation on the wavelength of the laser beam 44a generated by the laser oscillator, in the present embodiment, a laser oscillator is used that can generate a laser beam 44a (a penetrating laser beam 44a) of a wavelength that can penetrate the workpiece 11. By focusing the laser beam 44a of such a wavelength on the inside of the workpiece 11 through, for example, the irradiation head 44, the inside of the workpiece 11 can be modified.

A camera (photographing unit) 46 is disposed in a region on one side of the irradiation head 44 in the X direction. The camera 46 includes a two-dimensional photo sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to light in the visible light region, and an imaging lens, and can photograph the upper surface side (first surface 11a side) of the workpiece 11 held by the workpiece 36, and generate an image of the workpiece 11.

An optical displacement measuring device (measurer) 48 for measuring the distance to an object by a laser beam is arranged in a region on one side of the camera 46 in the X direction. The displacement measuring device 48 includes, for example, an irradiation unit for irradiating a laser beam 48a (see FIG. 4 ) to an object below, and a light receiving unit for receiving the laser beam 48a reflected by the object, and can measure the height of the upper surface (first surface 11a) of the workpiece 11 held by the work clamp 36, and generate information on displacement (hereinafter referred to as displacement information).

The components such as the lifting mechanism for lifting and lowering the magazine support table 8, the alignment unit 12, the conveying unit 14, the Y-axis pulse motor 24 and the X-axis pulse motor 32 of the moving mechanism 16, the rotation drive source of the θ table 34, the valve connected to the work clamp 36, the irradiation head 44 or the laser oscillator, the camera 46, and the displacement measuring device 48 are respectively connected to the control unit 50. The control unit 50 controls the above-mentioned components in accordance with a series of processes required for processing the workpiece 11.

The control unit 50 may be, for example, a computer, which includes a computing unit 50a formed by a processing device such as a CPU (Central Processing Unit), and a memory unit 50b formed by a main memory device such as a DRAM (Dynamic Random Access Memory) or an auxiliary memory device such as a flash memory. The functions of the control unit 50 can be realized by operating the computing unit 50a and the like according to the software stored in the memory unit 50b. However, the functions of the control unit 50 may also be realized only by hardware.

For example, the workpiece 11 (frame 15) that has been taken out of the above-mentioned film cassette 10 and aligned at a predetermined position by the alignment unit 12 can be moved into the work clamp 36 by the conveying unit 14, and the second surface 11b side can be held by the holding surface 40a. At this time, due to the accuracy of the position of the tape 13 attached to the workpiece 11 or the accuracy of the conveying operation performed by the conveying unit 14, the following situation often occurs: the position of the workpiece 11 actually moved into the work clamp 36 is offset from the target position of the workpiece 11.

Therefore, in the present embodiment, the object 11 is processed after obtaining information such as the direction or position of the object 11 in a manner that eliminates the influence of such positional deviation. FIG. 2 is a flow chart showing the method for processing the object of the present embodiment. As shown in FIG. 2, in the method for processing the object of the present embodiment, the direction obtaining step ST11 is first performed. The direction obtaining step ST11 is to obtain the direction of the edge of the first surface 11a of the object 11. FIG. 3 is a plan view showing an overview of the direction obtaining step ST11. In addition, in FIG. 3, some elements such as the tape 13 have been omitted.

In the direction acquisition step ST11, the height of the region including at least one side 11c of the workpiece 11 is first measured to obtain displacement information, and the XY coordinates representing the position of the side 11c are calculated from the displacement information. FIG4 is a side view showing the state of measuring the height of the workpiece 11. In addition, FIG4 shows a part of the elements in cross section.

For example, as shown in Fig. 4, the control unit 50 moves the worktable 36 holding the workpiece 11 in the X direction while actuating the displacement measuring device 48 to obtain the relationship between the position and the height in the X direction. That is, the control unit 50 moves the displacement measuring device 48 and the worktable 36 relative to each other and measures the height of the area including the side 11c of the workpiece 11 on a straight line parallel to the X direction.

FIG5 is a diagram showing an example of displacement information obtained by such measurement. As described above, if the displacement measuring device 48 and the work clamp 36 are moved relative to each other, and the height of the area including the side 11c of the workpiece 11 is measured on a straight line parallel to the X direction, displacement information of the contour corresponding to the thickness of the workpiece 11 can be obtained along the straight line. The obtained displacement information is stored in the memory unit 50b.

More specifically, the height of the region including the side 11c of the workpiece 11 is first measured along the first straight line 21a shown in Fig. 3. Here, there is a large difference (height difference) between the height of the position A where the first straight line 21a and the side 11c intersect and the height of the position outside the workpiece 11 adjacent to the position A.

Accordingly, as shown in FIG5 , the X coordinate (X _{1 ) of position A can be calculated by extracting the position with the largest height difference from the obtained displacement information. Furthermore, the Y coordinate of any position on the first straight line 21 a parallel to the X direction is equal to any position. Therefore, the Y coordinate (Y 1 )} of position A can be calculated by using information indicating the position of the Y-axis moving table 20 (work clamp 36) during measurement.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X1 ) of the position A where the first straight line 21a intersects the side 11c, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y1 ) of the position A. The calculated coordinates ( _X1 , _Y1 ) of the position A are stored in the storage unit 50b.

After measuring the height of the area including the side 11c of the workpiece 11 along the first straight line 21a, the work table 36 (Y-axis moving table 20) is moved in the Y direction and the same measurement is performed. That is, the height of the area including the side 11c of the workpiece 11 is measured along the second straight line 21b that passes through a position different from the first straight line 21a in the Y direction and is parallel to the X direction.

Then, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₂ ) of the position B where the second straight line 21b intersects the side 11c, and uses the information indicating the position of the Y-axis moving table 20 (work clamp 36) during the measurement to calculate the Y coordinate (Y ₂ ) of the position B. The calculated coordinates (X ₂ ‚Y ₂ ) of the position B are stored in the storage unit 50b.

Furthermore, in this embodiment, although the position where the rotation axis of the work clamp 36 intersects with the XY plane parallel to the holding surface 40a is set as the origin (O) to calculate the coordinates representing each position, other positions may be set as the origin of the coordinate system.

After the coordinates (X ₁ ‚Y ₁ ) indicating the position A and the coordinates (X ₂ ‚Y ₂ ) indicating the position B are calculated, these are used to obtain the direction of the side 11c in the XY plane parallel to the holding surface 40a. For example, the calculation unit 50a applies the triangulation method to the coordinates (X ₁ ‚Y ₁ ) of the position A and the coordinates (X ₂ ‚Y ₂ ) of the position B to calculate the angle (θ ₁ ) formed by the side 11c and the Y direction. The calculated angle (θ ₁ ) is stored in the storage unit 50b as the direction of the side 11c.

Furthermore, the calculation unit 50a may also calculate the angle between the side 11c and the X direction as the direction of the side 11c. In addition, in the present embodiment, although the direction of the side 11c is obtained by using the coordinates of the position A where the first straight line 21a and the side 11c intersect and the coordinates of the position B where the second straight line 21b and the side 11c intersect, the direction of the side 11d may be obtained by using the coordinates of two positions on the side 11d facing the side 11c.

As shown in FIG2, after the direction acquisition step ST11, the first coordinate acquisition step ST12 is performed. The first coordinate acquisition step ST12 acquires two coordinates representing the positions of two opposing sides of the workpiece 11 in the XY plane parallel to the holding surface 40a. FIG6 is a plan view showing an overview of the first coordinate acquisition step ST12. In FIG6, some elements such as the tape 13 are omitted.

In the first coordinate acquisition step ST12, the control unit 50 first adjusts the direction of the work clamp 36 around the rotation axis perpendicular to the XY plane so that the direction of the side 11c acquired in the direction acquisition step ST11 becomes parallel to the Y direction. That is, from the state shown in FIG. 3, the work clamp 36 is rotated by an angle equivalent to _θ1 (in this embodiment, it is an angle of _θ1 in the clockwise direction in the plane viewing angle). Thereby, the opposite sides 11c and 11d of the workpiece 11 become parallel to the Y direction.

After that, the control unit 50 moves the worktable 36 holding the workpiece 11 in the X direction while actuating the displacement measuring device 48 to obtain the relationship between the position and the height in the X direction. That is, the displacement measuring device 48 and the worktable 36 are moved relative to each other, and the height of the area including the two opposing sides 11c and the side 11d of the workpiece 11 is measured on a straight line parallel to the X direction. The obtained displacement information is stored in the memory unit 50b.

More specifically, the height of the region including the opposing sides 11c and 11d of the workpiece 11 is first measured along the third straight line 21c shown in FIG6 . Here, there is a large difference between the height of the position C1 where the third straight line 21c intersects the side 11c and the height of the position adjacent to the position C1 outside the workpiece 11. Also, there is a large difference between the height of the position C2 where the third straight line 21c intersects the side 11d and the height of the position adjacent to the position C2 outside the workpiece 11.

Based on this, the X coordinate (X ₃₁ ) of position C1 and the X coordinate (X ₃₂ ) of position C2 can be calculated by extracting the position with the largest height difference from the obtained displacement information. Furthermore, the Y coordinate of any position on the third straight line 21c parallel to the X direction is equal to any position. Therefore, the Y coordinate (Y ₃ ) of position C1 and position C2 can be calculated by using information indicating the position of the Y-axis moving table 20 (work clamp 36) during measurement.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₃₁ ) of the position C1 where the third straight line 21c intersects the side 11c, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate (Y ₃ ) of the position C1. The calculated coordinates (X ₃₁ ‚Y ₃ ) of the position C1 are stored in the storage unit 50b.

Furthermore, the calculation unit 50a calculates the X coordinate (X ₃₂ ) of the position C2 where the third straight line 21c intersects the side 11d using the displacement information obtained by the measurement, and calculates the Y coordinate (Y ₃ ) of the position C2 using the information indicating the position of the Y-axis moving table 20 during the measurement. The calculated coordinates (X ₃₂ ‚Y ₃ ) of the position C2 are stored in the storage unit 50b.

As shown in FIG2, after the first coordinate acquisition step ST12, the second coordinate acquisition step ST13 is performed. The second coordinate acquisition step ST13 acquires two coordinates representing the positions of the other two opposing sides of the workpiece 11 in the XY plane parallel to the holding surface 40a. FIG7 is a plan view showing the outline of the second coordinate acquisition step ST13. In FIG7, some elements such as the tape 13 are omitted.

In the second coordinate acquisition step ST13, the control unit 50 first adjusts the direction of the work clamp 36 around the rotation axis perpendicular to the XY plane so that the direction of the side 11c acquired in the direction acquisition step ST11 becomes perpendicular to the Y direction. That is, from the state shown in FIG. 6, the work clamp 36 is rotated by an angle of 90° (in the present embodiment, an angle of 90° in the clockwise direction in a plane view). In this way, the opposite sides 11e and 11f of the workpiece 11 become parallel to the Y direction.

After that, the control unit 50 moves the worktable 36 holding the workpiece 11 in the X direction while actuating the displacement measuring device 48 to obtain the relationship between the position and the height in the X direction. That is, the displacement measuring device 48 and the worktable 36 are moved relative to each other, and the height of the area including the other two sides 11e and 11f of the workpiece 11 facing each other is measured on a straight line parallel to the X direction. The obtained displacement information is stored in the memory unit 50b.

More specifically, the height of the region including the opposite sides 11e and 11f of the workpiece 11 is first measured along the fourth straight line 21d shown in FIG7 . Here, there is a large difference between the height of the position D1 where the fourth straight line 21d intersects the side 11e and the height of the position adjacent to the position D1 outside the workpiece 11. Also, there is a large difference between the height of the position D2 where the fourth straight line 21d intersects the side 11f and the height of the position adjacent to the position D2 outside the workpiece 11.

Based on this, the X coordinate ( _X41 ) of position D1 and the X coordinate ( _X42 ) of position D2 can be calculated by extracting the position with the largest height difference from the obtained displacement information. Furthermore, the Y coordinate of any position on the fourth straight line 21d parallel to the X direction is equal to any position. Therefore, the Y coordinate ( _Y4 ) of position D1 and position D2 can be calculated by using information indicating the position of the Y-axis moving table 20 (work clamp 36) during measurement.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X41 ) of the position D1 where the fourth straight line 21d intersects the side 11e, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y4 ) of the position D1. The calculated coordinates ( _X41 , _Y4 ) of the position D1 are stored in the storage unit 50b.

Furthermore, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X42 ) of the position D2 where the fourth straight line 21d intersects the side 11f, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y4 ) of the position D2. The calculated coordinates ( _X42 , _Y4 ) of the position D2 are stored in the storage unit 50b.

As described above, after the height of the workpiece 11 is measured along the third straight line 21c, the worktable 36 is rotated by an angle equivalent to 90° when the height of the workpiece 11 is measured along the fourth straight line 21d. Therefore, even if the coordinates ( _X31 , _Y3 ) of the position C1 and the coordinates ( _{X32 , Y3} ) of the position C2, and the coordinates ( _X41 , _Y4 ) of the position D1 and the coordinates ( _X42 , Y4) of the position D2 are _{directly used} , the position of the workpiece 11 cannot be properly expressed.

Therefore, as shown in FIG. 2 , after the second coordinate acquisition step ST13 , a correction coordinate acquisition step ST14 is performed. The correction coordinate acquisition step ST14 corrects the coordinates (X ₃₁ , Y ₃ ) of position C1 and the coordinates (X ₃₂ , Y ₃ ) of position C2, and one of the coordinates (X ₄₁ , Y ₄ ) of position D1 and the coordinates (X ₄₂ , Y ₄ ) of position D2 to obtain the correction coordinates.

Specifically, for example, the calculation unit 50a performs a calculation process to rotate the coordinates of the position D1 ( _X41 , _Y4 ) and the coordinates of the position D2 ( _X42 , _Y4 ) by an angle equivalent to -90° (in this embodiment, an angle of 90° in the counterclockwise direction in a plane view), and obtains the corrected coordinates of the position D1 and the coordinates of the position D2 (corrected coordinates). The obtained corrected coordinates of the position D1 and the coordinates of the position D2 are stored in the storage unit 50b.

The shape of the workpiece 11 (the shape of the first surface 11a) is known to the control unit 50 of the laser processing device 2. Therefore, the control unit 50 can appropriately grasp the position of the workpiece 11 by using the coordinates of the position D1 and the coordinates of the position D2 obtained after correction and the coordinates of the position C1 ( _X31 , _Y3 ) and the coordinates of the position C2 ( _X32 , _Y3 ) mentioned above.

Furthermore, in the present embodiment, although the coordinates of the position D1 and the coordinates of the position D2 are obtained after correction, the coordinates of the position C1 and the coordinates of the position C2 may also be obtained after correction. In this case, the following situation will be achieved: corresponding to the coordinates of the position D1 ( _X41 , _Y4 ) and the coordinates of the position D2 ( _X42 , _Y4 ), the operation processing of rotating each of the coordinates of the position C1 ( _X31 , _Y3 ) and the coordinates of the position C2 ( _X32 , _Y3 ) by an angle equivalent to 90° (in the present embodiment, an angle of 90° in the clockwise direction in a plane viewing angle) is performed.

After the correction coordinate acquisition step ST14, the processing step ST15 is performed. The processing step ST15 uses the information about the position and direction of the workpiece 11 acquired in the above-mentioned series of acquisition steps (direction acquisition step ST11, first coordinate acquisition step ST12, second coordinate acquisition step ST13 and correction coordinate acquisition step ST14) to process the workpiece 11. That is, in the processing step ST15, the workpiece 11 is processed according to the direction of the edge and the four XY coordinates indicating the position of each edge. FIG8 is a side view showing the outline of the processing step ST15. In addition, in FIG8, a part of the elements is also shown in cross section.

In the processing step ST15 of the present embodiment, the interior of the object 11 to be processed is modified along the predetermined processing line. Specifically, first, the control unit 50 adjusts the direction of the work clamp 36 in consideration of the direction of the above-mentioned edge, and sets the predetermined processing line of the object to be parallel to the X direction. Next, the control unit 50 adjusts the position of the work clamp 36 in consideration of the above-mentioned four XY coordinates, and aligns the position of the irradiation head 44 above the extension line of the predetermined processing line of the object.

Then, as shown in FIG8 , while the laser beam 44a is irradiated from the irradiation head 44 toward the workpiece 11, the work clamp 36 is moved in the X direction. That is, the work clamp 36 and the irradiation head 44 are moved relative to each other in a direction parallel to the predetermined processing line. Here, the irradiation head 44 is adjusted so that, for example, the laser beam 44a is focused on the inside of the workpiece 11.

In this way, the inside of the object 11 can be modified by focusing the laser beam 44a (penetrating laser beam 44a) of a wavelength that penetrates the object 11 to the inside of the object 11, thereby forming a modified layer 17. In this embodiment, since the work clamp 36 and the irradiation head 44 are moved relative to each other to irradiate the laser beam 44a to the processing predetermined line, the modified layer 17 can be formed along the processing predetermined line. The above-mentioned operation is repeated until the object 11 is processed along all the processing predetermined lines.

As described above, in the processing method of the workpiece of the present embodiment, since the direction of the edge (edge 11c) of the first surface 11a of the workpiece 11 and the four XY coordinates of the position (position C1, position C2, position D1, and position D2) of each of the four edges (edge 11c, edge 11d, edge 11e, and edge 11f) of the first surface 11a are obtained, the workpiece 11 can be processed with high precision based on these.

Furthermore, in the processing method of the workpiece of the present embodiment, since the direction of the edge and the four XY coordinates are obtained by using the displacement measuring device 48 that measures the distance to the object, the position of the workpiece 11 can still be accurately grasped even in the case where, for example, the workpiece 11 is transparent or a structure (pattern) such as a device is not formed on the workpiece 11.

Thus, the processing method of the object 11 of this embodiment is very effective when it is not desired to irradiate the outer periphery of the object 11. In addition, the processing method of the object 11 of this embodiment can prevent the laser beam 44a from being irradiated to the outside of the object 11 by mistake.

Furthermore, the present invention is not limited by the description of the above-mentioned embodiments and can be implemented with various modifications. FIG. 9 is a flow chart showing the processing method of the first modified example. As shown in FIG. 9, in the processing method of the first modified example, a series of acquisition steps for acquiring the direction of the side of the object 11 and the four coordinates representing the positions of the four sides of the object 11 are different from the above-mentioned embodiments.

Specifically, the first coordinate acquisition step ST21 is performed first. The first coordinate acquisition step ST21 measures the height of the region including the two opposing sides of the workpiece 11 on two straight lines parallel to the X direction to obtain displacement information, and obtains three or more XY coordinates representing three or more positions where the two opposing sides and the two straight lines intersect from the displacement information. FIG. 10 is a plan view showing an overview of the first coordinate acquisition step ST21 of the first variant. In addition, in FIG. 10 , some elements such as the tape 13 are omitted.

In the first coordinate acquisition step ST21 of the first modification, the control unit 50 moves the worktable 36 holding the workpiece 11 in the X direction while actuating the displacement measuring device 48 to obtain the relationship between the position and the height in the X direction. That is, the displacement measuring device 48 and the worktable 36 are moved relative to each other, and the height of the region including the two opposing sides of the workpiece 11 is measured on a straight line parallel to the X direction. The obtained displacement information is stored in the memory unit 50b.

More specifically, the height of the region including the opposing sides 11c and 11d of the workpiece 11 is first measured along the first straight line 31a shown in FIG10. Here, there is a large difference between the height of the position E1 where the first straight line 31a intersects the side 11c and the height of the position adjacent to the position E1 outside the workpiece 11. Also, there is a large difference between the height of the position E2 where the first straight line 31a intersects the side 11d and the height of the position adjacent to the position E2 outside the workpiece 11.

Based on this, the X coordinate ( _X51 ) of position E1 and the X coordinate ( _X52 ) of position E2 can be calculated by extracting the position with the largest height difference from the obtained displacement information. Furthermore, the Y coordinate of any position on the first straight line 31a parallel to the X direction is equal to any position. Therefore, the Y coordinate ( _Y5 ) of position E1 and position E2 can be calculated by using information indicating the position of the Y-axis moving table 20 (work clamp 36) during measurement.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X51 ) of the position E1 where the first straight line 31a intersects the side 11c, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y5 ) of the position E1. The calculated coordinates ( _X51 , _Y5 ) of the position E1 are stored in the storage unit 50b.

Furthermore, the calculation unit 50a calculates the X coordinate (( _X52 )) of the position E2 where the first straight line 31a intersects the side 11d using the displacement information obtained by the measurement, and calculates the Y coordinate (Y5) of the position E2 using the information indicating the position of the Y-axis moving table ₂₀ during the measurement. The calculated coordinates ( _X52 , _Y5 ) of the position E2 are stored in the storage unit 50b.

After measuring the height of the area including the opposite sides 11c and 11d of the workpiece 11 along the first straight line 31a, the work table 36 (Y-axis moving table 20) is moved in the Y direction and the same measurement is performed. That is, the height of the area including the sides 11c and 11d of the workpiece 11 is measured along the second straight line 31b that passes through a different position in the Y direction from the first straight line 31a and is parallel to the X direction.

Furthermore, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X61 ) of the position F1 where the second straight line 31b intersects the side 11c, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y6 ) of the position F1. The calculated coordinates ( _X61 , _Y6 ) of the position F1 are stored in the storage unit 50b.

Furthermore, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X62 ) of the position F2 where the second straight line 31b intersects the side 11d, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate ( _Y6 ) of the position F2. The calculated coordinates ( _X62 , _Y6 ) of the position F2 are stored in the storage unit 50b.

Furthermore, in the first coordinate acquisition step ST21 of this first variant, although four XY coordinates representing the four positions where the first straight line 31a and the second straight line 31b intersect with the side 11c and the side 11d are acquired, in the present invention, any three of the four XY coordinates can be acquired.

As shown in FIG9 , after the first coordinate acquisition step ST21, the second coordinate acquisition step ST22 is performed. The second coordinate acquisition step ST22 measures the height of the region including the other two sides of the workpiece 11 facing each other on a straight line parallel to the X direction to obtain displacement information, and obtains two XY coordinates representing two positions where the other two sides facing each other intersect the straight line from the displacement information. FIG11 is a plan view showing an overview of the second coordinate acquisition step ST22 of the first variant. In addition, in FIG11 , some elements such as the tape 13 are omitted.

In the second coordinate acquisition step ST22, the direction of the work clamp 36 is first adjusted to be perpendicular to the direction of the work clamp 36 in the first coordinate acquisition step ST21. That is, the control unit 50 rotates the work clamp 36 from the state shown in FIG. 10 by an angle of 90° (in the first variant, an angle of 90° in the clockwise direction in a plane view).

After that, the control unit 50 moves the worktable 36 holding the workpiece 11 in the X direction while actuating the displacement measuring device 48 to obtain the relationship between the position and the height in the X direction. That is, the displacement measuring device 48 and the worktable 36 are moved relative to each other, and the height of the area including the other two sides of the workpiece 11 facing each other is measured on a straight line parallel to the X direction. The obtained displacement information is stored in the memory unit 50b.

More specifically, for example, the height of the region including the sides 11e and 11f facing each other of the workpiece 11 is measured along the third straight line 31c shown in FIG11. Here, there is a large difference between the height of the position G1 where the third straight line 31c intersects the side 11e and the height of the position adjacent to the position G1 outside the workpiece 11. Also, there is a large difference between the height of the position G2 where the third straight line 31c intersects the side 11f and the height of the position adjacent to the position G2 outside the workpiece 11.

Based on this, the X coordinate (X ₇₁ ) of position G1 and the X coordinate (X ₇₂ ) of position G2 can be calculated by extracting the position with the largest height difference from the obtained displacement information. Furthermore, the Y coordinate of any position on the third straight line 31c parallel to the X direction is equal to any position. Therefore, the Y coordinate (Y ₇ ) of position G1 and position G2 can be calculated by using information indicating the position of the Y-axis moving table 20 (work clamp 36) during measurement.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₇₁ ) of the position G1 where the third straight line 31c intersects the side 11e, and uses the information indicating the position of the Y-axis moving table 20 during the measurement to calculate the Y coordinate (Y ₇ ) of the position G1. The calculated coordinates (X ₇₁ ‚Y ₇ ) of the position G1 are stored in the storage unit 50b.

Furthermore, the calculation unit 50a calculates the X coordinate ( _X72 ) of the position G2 where the third straight line 31c intersects the side 11f using the displacement information obtained by the measurement, and calculates the Y coordinate (Y7) of the position G2 using the information indicating the position of the Y-axis moving table ₂₀ during the measurement. The calculated coordinates ( _X72 , _Y7 ) of the position G2 are stored in the storage unit 50b.

As shown in FIG9 , after the second coordinate acquisition step ST22, the direction acquisition step ST23 is performed. The direction acquisition step ST23 obtains the direction of one of the two opposing sides from the two XY coordinates obtained in the first coordinate acquisition step ST21 and representing the two positions where one of the two opposing sides intersects with the two straight lines.

For example, the calculation unit 50a applies the triangulation method to the coordinates (X ₅₁ ‚Y ₅ ) of the position E1 where the side 11c intersects the first straight line 31a and the coordinates (X ₆₁ ‚Y ₆ ) of the position F1 where the side 11c intersects the second straight line 31b to calculate the angle (θ ₂ ) between the side 11c and the Y direction. The calculated angle (θ ₂ ) is stored in the storage unit 50b as the direction of the side 11c.

Furthermore, the calculation unit 50a may calculate the angle between the side 11c and the X direction as the direction of the side 11c. Furthermore, the calculation unit 50a may apply the triangulation method to the coordinates ( _X52 , _Y5 ) of the position E2 where the side 11d intersects the first straight line 31a and the coordinates ( _X62 , _Y6 ) of the position F2 where the side 11d intersects the second straight line 31b to calculate the angle between the side 11d and the Y direction or the X direction.

After the direction acquisition step ST23, the correction coordinate acquisition step ST24 will be performed. The correction coordinate acquisition step ST24 will correct the two XY coordinates obtained in the first coordinate acquisition step ST21 and the two XY coordinates obtained in the second coordinate acquisition step ST22 according to the direction of the edge obtained in this direction acquisition step ST23 to obtain the corrected coordinates.

Specifically, for example, the calculation unit 50a performs a calculation process to rotate the coordinates ( _X51 , _Y5 ) of the position E1 where the side 11c intersects the first straight line 31a, and the coordinates ( _X52 , _Y5 ) of the position E2 where the side 11d intersects the first straight line 31a by an angle of _θ2 (in this embodiment, an angle of _θ2 in the clockwise direction in a plane view) to obtain the corrected coordinates of the position E1 and the coordinates of the position E2 (corrected coordinates). The corrected coordinates of the position E1 and the coordinates of the position E2 obtained are stored in the storage unit 50b.

Furthermore, the calculation unit 50a may also perform a calculation process to rotate the coordinates ( _X61 "Y6 _" ) of the position F1 where the side 11c intersects the second straight line 31b and the coordinates ( _X62 "Y6 _" ) of the position F2 where the side 11d intersects the second straight line 31b by an angle equal to _θ2 (in the present embodiment, an angle of _θ2 in the clockwise direction in a plane viewing angle) to obtain the corrected coordinates of the position F1 and the coordinates of the position F2.

Furthermore, the operation unit 50a performs an operation process to rotate the coordinates ( _X71 "Y7 _" ) of the position G1 where the side 11e intersects the third straight line 31c and the coordinates ( _X72 "Y7 _" ) of the position G2 where the side 11f intersects the third straight line 31c by an angle equivalent to _θ2-90 ° (in the present embodiment, an angle of _θ2-90 ° in the clockwise direction in a plane view) to obtain the corrected coordinates of the position G1 and the coordinates of the position G2 (corrected coordinates). The corrected coordinates of the position G1 and the coordinates of the position G2 are stored in the storage unit 50b.

The correction coordinates obtained in this way are positions E1, E2, G1, and G2, which indicate that the direction of the side 11c is adjusted to be parallel to the Y direction. Thus, by using such correction coordinates, the workpiece 11 can be processed with good accuracy. Furthermore, the correction coordinates indicating each position can be obtained by the same method, in a state where the direction of the side 11c is adjusted to be perpendicular to the Y direction.

After the correction coordinate acquisition step ST24, the processing step ST25 is performed. The processing step ST25 uses the information about the position and direction of the workpiece 11 acquired in the above series of acquisition steps (the first coordinate acquisition step ST21, the second coordinate acquisition step ST22, the direction acquisition step ST23, and the correction coordinate acquisition step ST24) to process the workpiece 11. That is, in the processing step ST25, the workpiece 11 is processed according to the direction of the edge and the four XY coordinates indicating the position of each edge. The specific procedure of the processing step ST25 is preferably the same as the processing step ST15 of the embodiment.

In the processing method of the workpiece of this first variant, since the direction of the edge (edge 11c) of the first surface 11a of the workpiece 11 and the four XY coordinates of the position (position E1, position E2, position G1 and position G2) of each of the four edges (edge 11c, edge 11d, edge 11e and edge 11f) of the first surface 11a can also be obtained, the workpiece 11 can be processed with high precision based on these.

Furthermore, in the processing method of the workpiece of the first variant, since the direction of the edge and the four XY coordinates are obtained by using the displacement measuring device 48 that measures the distance to the object, the position of the workpiece 11 can still be accurately grasped even in the case where, for example, the workpiece 11 is transparent or a structure (pattern) such as a device is not formed on the workpiece 11.

Thus, the first modified example of the processing method for processing an object 11 is extremely effective when it is not desired to irradiate the outer periphery of the object 11. In addition, the first modified example of the processing method for processing an object can prevent the laser beam 44a from being irradiated to the outside of the object 11 by mistake.

Furthermore, in the above-mentioned embodiment, although the direction of the edge of the first surface 11a of the workpiece 11 is obtained by obtaining displacement information using the displacement measuring device 48, the direction of the edge of the first surface 11a can also be obtained by, for example, using a camera 46 to photograph the workpiece 11.

That is, in the direction obtaining step of the processing method of the workpiece of the second modification, for example, the calculation unit 50a can calculate the coordinates of two positions on the edge from the image obtained by photographing the area including one edge of the workpiece 11 with the camera 46, thereby obtaining the direction of the edge. The other steps can also be the same as those of the above-mentioned embodiment.

Furthermore, in the above-mentioned embodiments and various modifications, although the second coordinate acquisition step ST13 or the second coordinate acquisition step ST22 is performed after the first coordinate acquisition step ST12 or the first coordinate acquisition step ST21, the order thereof may be reversed. Furthermore, in the above-mentioned first modification, although the direction acquisition step ST23 is performed after the second coordinate acquisition step ST22, the direction acquisition step ST23 may be performed after the first coordinate acquisition step ST21 and before the second coordinate acquisition step ST22.

Furthermore, in the above-mentioned embodiments and various modifications, although the modified layer 17 is formed on the workpiece 11 in the processing step ST15 or the processing step ST25, the workpiece 11 may be ablated by a laser beam in the processing step of the present invention. In this case, a laser processing device having a laser oscillator that can generate a laser beam of a wavelength that is absorbed by the workpiece 11 (absorptive laser beam) may be used.

Furthermore, in the processing step of the present invention, the workpiece 11 may be processed by cutting a ring-shaped cutting blade (processing unit) into the workpiece 11. The ring-shaped cutting blade is formed by fixing abrasive grains with a binder. In this case, for example, a cutting device (processing device) having a spindle (processing unit) for mounting the ring-shaped cutting blade is used instead of the irradiation head 44 or the laser oscillator.

Furthermore, in the above-mentioned embodiments and various variations, although an optical displacement meter 48 that uses a laser beam 48a to measure the distance to an object is used, such an optical displacement meter 48 may be replaced by a back pressure sensor or an ultrasonic sensor as a displacement meter (meter).

Furthermore, the processing methods of the workpiece of the above-mentioned embodiments and various modifications can also be implemented in a state where the relationship between the X direction and the Y direction is replaced within a range that does not cause a contradiction. For example, in the above-mentioned embodiments and various modifications, although the height of the area including any side is measured by moving the work clamp 36 and the displacement measuring device 48 relative to each other in the X direction, the height of the area including any side can also be measured by moving the work clamp 36 and the displacement measuring device 48 relative to each other in the Y direction.

Furthermore, the coordinates of any position of the workpiece 11 (for example, the coordinates of the center of gravity of the workpiece 11) can be obtained based on the direction of the edges or the four XY coordinates obtained in the above-mentioned implementation forms and various variations, and used for subsequent processing of the workpiece 11.

In addition, the above-mentioned embodiments and the structures and methods of various variations can be implemented with appropriate changes as long as they do not deviate from the scope of the purpose of the present invention.

2: Laser processing device (processing device) 4: Base 4a: Accommodation portion 6: Support structure 6a: Support arm 8: Cassette support table 10: Cassette 11: Workpiece 11a: First surface (front) 11b: Second surface (back) 11c, 11d, 11e, 11f: Side 12: Alignment unit 13: Tape (cutting tape) 14: Transport unit 15: Frame 16: Moving mechanism (processing feed mechanism, indexing feed mechanism) 17: modified layer 18: Y-axis guide rail 20: Y-axis moving table 21a, 31a: first straight line 21b, 31b: second straight line 21c, 31c: third straight line 21d: fourth straight line 22: Y-axis ball screw 24: Y-axis pulse motor 26: X-axis guide rail 28: X-axis moving table 30: X-axis ball screw 32: X-axis pulse motor 34: θ table 34a: table base 36: work clamp 38: frame 38a: recess 38b: flow path 40: holding plate 40a: holding surface 42: clamp 44: irradiation head (processing unit) 44a: laser beam 46: camera (photographing unit) 48: Displacement measuring device (measuring device) 48a: Laser beam 50: Control unit 50a: Calculation unit 50b: Memory unit A, B, C1, C2, D1, D2, E1, E2, F1, F2, G1, G2: Position O: Origin X, Y, Z: Directions X ₁ , X ₂ , X ₃₁ , X ₃₂ , X ₄₁ , X ₄₂ , X ₅₁ , X ₅₂ , X ₆₁ , X ₆₂ , X ₇₁ , X ₇₂ : Coordinates Y ₁ , Y ₂ , Y ₃ , Y ₄ , Y ₅ , Y ₆ , Y ₇ : Coordinates θ ₁ , θ ₂ : Angle ST11, ST23: Direction acquisition step ST12, ST21: First coordinate acquisition step ST13, ST22: Second coordinate acquisition step ST14, ST24: Correction coordinate acquisition step ST15, ST25: Processing step

FIG. 1 is a perspective view showing a laser processing device. FIG. 2 is a flow chart showing a processing method for a workpiece. FIG. 3 is a plan view showing an overview of a direction acquisition step. FIG. 4 is a side view showing a situation of measuring the height of a workpiece. FIG. 5 is a diagram showing an example of displacement information. FIG. 6 is a plan view showing an overview of a first coordinate acquisition step. FIG. 7 is a plan view showing an overview of a second coordinate acquisition step. FIG. 8 is a side view showing an overview of a processing step. FIG. 9 is a flow chart showing a processing method for a workpiece of a first variant. FIG. 10 is a plan view showing an overview of a first coordinate acquisition step of a first variant. FIG. 11 is a plan view showing an overview of a second coordinate acquisition step of a first variant.

ST11: Direction acquisition step

ST12: Step 1 of obtaining coordinates

ST13: Step 2 of obtaining coordinates

ST14: Correction coordinate acquisition step

ST15: Processing steps

Claims (4)

A method for processing a workpiece is used when a workpiece in the form of a plate is processed using a work jig and a processing unit. The plate-shaped workpiece has a rectangular first surface with four sides and a rectangular second surface located on the opposite side of the first surface. The work jig has a holding surface. The processing unit processes the workpiece held on the work jig. The method for processing the workpiece includes the following steps: An acquisition step, in which the height of an area including the four sides of the workpiece is measured to obtain displacement information while the second side of the workpiece is held on the holding surface of the work jig, and the following are obtained from the displacement information: the direction of the side in an XY plane parallel to the holding surface, and four XY coordinates representing the positions of the four sides in the XY plane; and Processing step: Process the object according to the direction of the edge and the four XY coordinates. The processing method of the workpiece as claimed in claim 1, wherein the obtaining step further includes the following steps: A direction obtaining step, wherein the height of the area including one side of the workpiece is measured on two straight lines passing through different positions in the Y direction and parallel to the X direction by moving the measuring device for measuring the height relative to the work clamp to obtain displacement information, and the XY coordinates of the two positions where the edge intersects the two straight lines are calculated from the above displacement information to obtain the direction of the edge; The first coordinate acquisition step is to adjust the direction of the work clamp around the rotation axis perpendicular to the XY plane so that the direction of the edge acquired in the direction acquisition step becomes parallel to the Y direction, and then move the measuring device and the work clamp relative to each other, thereby measuring the height of the area including the two opposing edges of the workpiece on a straight line parallel to the X direction to obtain displacement information, and obtain two XY coordinates representing the two positions where the two opposing edges intersect the straight line from the above displacement information; and In the second coordinate acquisition step, the direction of the work clamp around the rotation axis is adjusted so that the direction of the side obtained in the direction acquisition step becomes perpendicular to the Y direction, and the measuring device and the work clamp are moved relative to each other, thereby measuring the height of the area including the other two sides of the workpiece facing each other on a straight line parallel to the X direction to obtain displacement information, and obtaining two XY coordinates representing the two positions where the other two sides facing each other intersect the straight line from the above displacement information. The processing method of the workpiece as claimed in claim 1, wherein the obtaining step further includes the following steps: The first coordinate obtaining step, by moving the measuring device for measuring the height relative to the work clamp, and measuring the height of the area including the two opposite sides of the workpiece on two straight lines at different positions in the Y direction and parallel to the X direction to obtain displacement information, and obtaining more than three XY coordinates representing more than three positions where the two opposite sides intersect the two straight lines from the above displacement information; The second coordinate acquisition step is to move the measuring device and the work clamp relative to each other in a state that the direction of the work clamp around the rotation axis perpendicular to the XY plane is perpendicular to the direction of the work clamp in the first coordinate acquisition step, thereby measuring the height of the area including the other two opposing sides of the workpiece on a straight line parallel to the X direction to obtain displacement information, and obtain two XY coordinates representing two positions where the other two opposing sides intersect the one straight line from the above displacement information; The direction acquisition step is to obtain the direction of one of the two opposing sides from the two XY coordinates obtained in the first coordinate acquisition step and representing two positions where one of the two opposing sides intersects the two straight lines; and The coordinate correction step is to correct the two XY coordinates of the two positions where the two sides facing each other and one of the two straight lines intersect, obtained in the first coordinate acquisition step, and the two XY coordinates obtained in the second coordinate acquisition step, according to the direction of the side obtained in the direction acquisition step, to obtain four corrected XY coordinates. A method for processing a workpiece is used when a plate-shaped workpiece is processed using a work jig and a processing unit. The plate-shaped workpiece has a rectangular first surface with four sides and a rectangular second surface located on the opposite side of the first surface. The work jig has a holding surface. The processing unit processes the workpiece held on the work jig. The method for processing the workpiece includes the following steps: An acquisition step, in which the direction of one side of the workpiece in an XY plane parallel to the holding surface is acquired from an image obtained by photographing an area including the side of the workpiece, and four XY coordinates representing the positions of the four sides in the XY plane are acquired from displacement information obtained by measuring the height of the area including the four sides of the workpiece; and Processing step: Process the object according to the direction of the edge and the four XY coordinates.

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