TWI885989B - Server and server cabinet - Google Patents

Abstract

The invention provides a server and a server cabinet. The server includes bottom casing. The bottom casing is provided with a first functional module, a power module and a fan module thereon. The server further comprises a liquid cooling module, directly in contact with the first functional module for cooling the first functional module. The power module and the fan module are located at a same side of the first functional module, a gap is located between the power module and the fan module, and the bottom casing is provided with a drip hole corresponding to a position where one end of the gap located farther away from the first functional module is located. Two first partition structures are provided at a periphery of the power module and a periphery of the fan module, respectively, the two first partition structures are configured to block liquid from entering into the power module and the fan module and guide the liquid to the drip hole for discharging the liquid when the liquid leaks from the liquid cooling module. The invention provides a server and server cabinet, which adopts dual heat dissipation of liquid cooling and air cooling, and can prevent liquid leakage from causing damage to other modules while having simple structure and being easily achieved.

Description

Servers and Server Units

The present invention relates to the field of server technology, and in particular to a server and a server unit.

The server generates a lot of heat during operation, causing its temperature to rise continuously, so it needs to be designed for heat dissipation. Good heat dissipation is the key to ensure efficient and stable operation of the server.

Traditional server heat dissipation methods mainly rely on air convection or fan heat dissipation, but in highly integrated, high-power density servers, these methods can no longer meet the heat dissipation requirements, and also cause problems such as high noise and low energy efficiency. To solve these problems, liquid cooling technology has gradually become a new trend in server heat dissipation. Liquid cooling technology removes the heat generated inside the server through liquid circulation, and has the advantages of high heat dissipation efficiency, low noise, and high energy efficiency.

However, in the actual application process of liquid cooling technology, if leakage occurs, it will cause damage to the hardware inside the server and may also cause safety hazards in the data center, thus restricting the application and development of liquid cooling technology in the server field.

The present invention provides a server and a server unit, which adopts a dual heat dissipation technology of liquid cooling and air cooling, and can prevent liquid leakage from causing damage to other modules; at the same time, the product structure is simple and easy to implement.

According to one aspect of the present invention, a server is provided, comprising a bottom shell, on which a first functional module, a power module and a fan module are arranged; and further comprising:

A liquid cooling module directly in contact with the first functional module, used for cooling the first functional module;

The power module and the fan module are located on the same side of the first functional module, and there is a gap between the power module and the fan module; a drip port is provided at a position of the bottom shell corresponding to the gap and far from one end of the first functional module;

The outer periphery of the power module and the outer periphery of the fan module are both provided with a first enclosure structure; the first enclosure structure is used to prevent liquid from entering the power module and the fan module when the liquid cooling module leaks, and guide the liquid to the drip port for discharge.

Optionally, the first enclosure structure includes a retaining wall and a diversion wall;

The retaining wall of the first enclosure structure is L-shaped; one side of one L-shaped retaining wall is located between the first functional module and the power module, and one side of the other L-shaped retaining wall is located between the first functional module and the fan module; the other sides of the two L-shaped retaining walls extend to the gap and are connected to the corresponding drainage wall;

The two drainage walls and the bottom shell together form a drainage groove extending to the dripping port.

Optionally, a second functional module is further disposed on the bottom shell, and the second functional module is located on the other side of the first functional module;

A second enclosure structure is arranged between the first functional module and the second functional module; the second enclosure structure is used to prevent liquid from entering the second functional module when the liquid cooling module leaks.

Optionally, the second enclosure structure includes a retaining wall; the retaining wall of the second enclosure structure is linear.

Optionally, the retaining wall includes a retaining wall body and waterproof glue;

The waterproof adhesive is attached to the surface of the retaining wall body to protect the retaining wall body.

Optionally, the height of the retaining wall body is not less than 5 mm.

Optionally, the height of the drainage wall is less than the height of the retaining wall; the material of the drainage wall is waterproof glue.

Optionally, the area of the bottom shell corresponding to the first functional module is assembled by riveting without holes.

According to another aspect of the present invention, a server unit is provided, comprising: a cabinet, a liquid contact device, and a plurality of servers according to any one of the above embodiments;

Multiple servers are stacked in a cabinet.

The liquid receiving device is located at the bottom of the cabinet and corresponds to the dripping ports of the plurality of servers; the liquid receiving device is used to collect liquid dripping from the dripping port of any server.

Optionally, the orthographic projections of the drip ports of the multiple servers on the horizontal plane completely overlap; or,

The center points of the orthographic projections of the dripping openings of the multiple servers on the horizontal plane completely overlap, and the sizes of the dripping openings of the multiple servers gradually decrease in the direction away from the horizontal plane.

The technical solution of the embodiment of the present invention designs the structure of the server so that the server includes a bottom case provided with a first functional module, a power module and a fan module, and a liquid cooling module directly in contact with the first functional module. The fan module and the liquid cooling module cooperate to dissipate heat from the first functional module, thus realizing the dual heat dissipation technology of liquid cooling and air cooling. The power module and the fan module are located on the same side of the first functional module, and there is a gap between the power module and the fan module; a dripping port is provided at a position of the bottom shell corresponding to the gap and far from one end of the first functional module; the outer periphery of the power module and the outer periphery of the fan module are both provided with a first enclosure structure; the first enclosure structure can prevent liquid from entering the power module and the fan module when the liquid cooling module leaks, and guide the liquid to the dripping port for discharge. In this way, it can prevent the leakage from causing damage to other modules. In addition, the product has a simple structure and is easy to implement. The first enclosure structure provided on the periphery of the power module and the periphery of the fan module has little impact on the product mold opening. Even if the existing mold opening structure is adopted, it is only necessary to install the first enclosure structure on the existing mold opening structure. Therefore, it has strong promotional applicability.

It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor to limit the scope of the present invention. Other features of the present invention will become easy to understand through the following description.

In order to enable a person with ordinary knowledge in the field to better understand the solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below in combination with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person with ordinary knowledge in the field without creative labor should belong to the scope of protection of the present invention.

It should be noted that the terms "first", "second", etc. in the specification and patent scope of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or apparatus.

Embodiment 1

FIG1 is a schematic diagram of a three-dimensional structure of a server provided by the first embodiment of the present invention. As shown in FIG1 , the server includes a bottom shell 10 and a top shell 20. The bottom shell 10 and the top shell 20 are combined to form a receiving cavity, and various modules of the server are arranged in the receiving cavity. The bottom shell 10 and the top shell 20 are used to protect various modules inside.

FIG2 is a schematic diagram of a top view of a server provided by the first embodiment of the present invention after removing the top shell. As shown in FIG2, a first functional module 101, a power module 102 and a fan module 103 are arranged on the bottom shell 10. The first functional module 101 can be understood as a module that needs to be cooled, including but not limited to a central processing unit (CPU), a graphics processing unit (GPU), and various chips. The power module 102 is used to supply power to other modules of the server. The fan module 103 can cool the first functional module 101 through a fan.

The server further includes a liquid cooling module 104 directly in contact with the first functional module 101, and the liquid cooling module 104 is used to cool the first functional module 101 to achieve heat dissipation of the first functional module 101. Specifically, the liquid cooling module 104 may include a cold plate, a liquid inlet pipe, and a liquid outlet pipe, wherein the cold plate is connected to the liquid inlet pipe and the liquid outlet pipe, respectively. Low-temperature liquid enters the cold plate through the liquid inlet pipe, and after the cold plate is in direct contact with the first functional module 101 for heat exchange, the high-temperature liquid flows out through the liquid outlet pipe.

However, since there may be a risk of liquid leakage at the interfaces between the liquid inlet pipe, the liquid outlet pipe and the cold plate, in order to prevent the leaked liquid from causing damage to other modules, the present invention provides a first enclosure structure 301 on the bottom shell 10.

In order to clearly illustrate the structure of the server, FIG3 is a partial enlarged view of area A in the server shown in FIG2. As shown in FIG3, the power module 102 and the fan module 103 are located on the same side of the first functional module 101, such as the power module 102 and the fan module 103 are located on the right side of the first functional module 101 in FIG3. There is a gap GAP between the power module 102 and the fan module 103 (as shown by the arrow in FIG3). A drip port 40 is provided at a position of the bottom shell 10 that corresponds to the gap GAP and is far from the first functional module 101. The shape of the drip port 40 is usually round or square.

The first enclosure structure 301 is disposed at the periphery of the power module 102 and the fan module 103. The first enclosure structure 301 is used to prevent liquid from entering the power module 102 and the fan module 103 when the liquid cooling module 104 leaks liquid, and guide the liquid to the drip port 40 for discharge.

In one embodiment, the liquid inlet pipe and the liquid outlet pipe of the liquid cooling module 104 can be arranged at the gap GAP to save space in the server.

Optionally, FIG. 4 is a partial enlarged view of area B in the server shown in FIG. 2. Referring to FIG. 2 and FIG. 4, a second functional module 105 is also provided on the bottom shell 10. The second functional module 105 can be understood as a module that does not require heat dissipation or a module that is not suitable for liquid cooling. The second functional module 105 is located on the other side of the first functional module 101, such as the second functional module 105 is located on the left side of the first functional module 101 in FIG. 4. Optionally, the number of the second functional module 105 is at least one.

A second enclosing structure 302 is disposed between the first functional module 101 and the second functional module 105 . The second enclosing structure 302 is used to prevent liquid from entering the second functional module 105 when the liquid cooling module 104 leaks liquid.

In one embodiment, FIG. 5 is a top view of an enclosure structure provided in Embodiment 1 of the present invention. As shown in Figure 5, the first enclosure structure 301 includes a retaining wall 301a and a drainage wall 301b. The retaining wall 301a of the first enclosure structure 301 is L-shaped; one side of one L-shaped retaining wall 301a is located between the first functional module 101 and the power module 102, and one side of the other L-shaped retaining wall 301a is located between the first functional module 101 and the fan module 103; the other sides of the two L-shaped retaining walls 301a both extend to the gap GAP and are connected to the corresponding drainage wall 301b. The two drainage walls 301 b and the bottom case 10 jointly form a drainage groove extending to the drip port 40 .

The second enclosure structure 302 includes a retaining wall; the retaining wall of the second enclosure structure 302 is linear.

Optionally, the height of the drainage wall 301b is less than the height of the L-shaped baffle 301a; the material of the drainage wall 301b is waterproof glue. In this way, the drainage wall 301b and the bottom shell 10 can jointly form a drainage groove extending to the drip port 40, while saving materials and reducing the space occupied by the gap GAP.

In one embodiment, FIG6 is a cross-sectional view of a retaining wall provided in the first embodiment of the present invention. As shown in FIG6, the retaining wall includes a retaining wall body 501 and a waterproof adhesive 502. The waterproof adhesive 502 is attached to the surface of the retaining wall body 501 to protect the retaining wall body 501. The waterproof adhesive 502 has the advantages of high flexibility, waterproof and moisture-proof, strong bonding strength, strong anti-cracking bonding strength, etc., and can play a good protective role on the retaining wall body 501.

Optionally, the height of the retaining wall body 501 is not less than 5 mm to improve the reliability of the retaining wall.

In one embodiment, the present invention does not limit the material of the baffle body 501. The baffle body 501 can be made of metal or metal alloy, or can be made of acrylic or elastic material. When the baffle body 501 is made of metal or metal alloy, the baffle body 501 can be formed integrally with the bottom shell 10 to improve the sealing between the baffle body 501 and the bottom shell 10; when the baffle body 501 is made of acrylic or elastic material, the baffle body 501 can be adhered to the bottom shell 10, so that the mold of the bottom shell 10 does not need to be changed, which is convenient for modifying the existing bottom shell 10.

Furthermore, in order to prevent the leaked liquid from affecting other servers, the area of the bottom shell 10 corresponding to the first functional module 101 is assembled in the form of non-hole riveting. FIG7 is a schematic diagram of a non-hole riveting provided by the first embodiment of the present invention. As shown in FIG7, the area of the bottom shell 10 corresponding to the first functional module 101 is assembled in the form of non-hole riveting, which prevents the liquid from dripping from the bottom shell 10 when the liquid cooling module 104 leaks.

An embodiment of the present invention provides a server, including a bottom shell, on which a first functional module, a power module and a fan module are arranged; further comprising: a liquid cooling module directly in contact with the first functional module, used for cooling the first functional module; the power module and the fan module are located on the same side of the first functional module, and there is a gap between the power module and the fan module; a drip port is arranged at a position of the bottom shell corresponding to one end of the gap far from the first functional module; the outer periphery of the power module and the outer periphery of the fan module are both arranged with a first enclosure structure; the first enclosure structure is used for preventing liquid from entering the power module and the fan module when the liquid cooling module leaks, and guiding the liquid to the drip port for discharge. The technical solution of the embodiment of the present invention designs the structure of the server so that the server includes a bottom case provided with a first functional module, a power module and a fan module, and a liquid cooling module directly in contact with the first functional module. The fan module and the liquid cooling module cooperate to dissipate heat from the first functional module, thus realizing the dual heat dissipation technology of liquid cooling and air cooling. The power module and the fan module are located on the same side of the first functional module, and there is a gap between the power module and the fan module; a dripping port is provided at a position of the bottom shell corresponding to the gap and far from one end of the first functional module; the outer periphery of the power module and the outer periphery of the fan module are both provided with a first enclosure structure; the first enclosure structure can prevent liquid from entering the power module and the fan module when the liquid cooling module leaks, and guide the liquid to the dripping port for discharge. In this way, it can prevent the leakage from causing damage to other modules. In addition, the product has a simple structure and is easy to implement. The first enclosure structure provided on the periphery of the power module and the periphery of the fan module has little impact on the product mold opening. Even if the existing mold opening structure is adopted, it is only necessary to install the first enclosure structure on the existing mold opening structure. Therefore, it has strong promotional applicability.

Embodiment 2

Fig. 8 is a schematic diagram of the structure of a server unit provided in the second embodiment of the present invention. Fig. 9 is a schematic diagram of the liquid connection of a server unit provided in the second embodiment of the present invention.

Referring to FIG8 and FIG9 , the server unit includes a cabinet 1, a liquid receiving device 2 and a plurality of servers 3 in the above-mentioned embodiment. The plurality of servers 3 are stacked in order in the cabinet 1; the liquid receiving device 2 is located at the bottom of the cabinet 1 and corresponds to the positions of the dripping ports of the plurality of servers 3; the liquid receiving device 2 is used to collect liquid dripping from the dripping port of any server 3.

In order for the liquid to drip smoothly, in one practicable manner, the orthographic projections of the dripping ports of the plurality of servers 3 on the horizontal plane completely overlap.

In another practicable manner, the center points of the orthographic projections of the drip openings of the multiple servers 3 on the horizontal plane completely overlap, and the sizes of the drip openings of the multiple servers 3 gradually decrease in the direction away from the horizontal plane. In this way, it is possible to prevent the liquid from splashing onto the bottom shell below when dripping.

The above specific implementation does not constitute a limitation on the protection scope of the present invention. It should be understood by those with ordinary knowledge in the field that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

10: bottom shell 20: top shell 101: first functional module 102: power module 103: fan module 104: liquid cooling module 105: second functional module 301: first enclosure structure 301a: L-shaped baffle 301b: drainage wall 302: second enclosure structure GAP: gap 40: drip port 501: baffle body 502: waterproof glue 1: cabinet 2: liquid contact device 3: server A, B: area

In order to more clearly explain the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those with ordinary knowledge in this field, other drawings can be obtained based on these drawings without creative labor. Figure 1 is a schematic diagram of the three-dimensional structure of a server provided in the first embodiment of the present invention; Figure 2 is a schematic diagram of the top structure of a server provided in the first embodiment of the present invention after removing the top shell; Figure 3 is a partial enlarged view of area A in the server shown in Figure 2; Figure 4 is a partial enlarged view of area B in the server shown in Figure 2; Figure 5 is a top view of a retaining structure provided in the first embodiment of the present invention; Figure 6 is a cross-sectional view of a retaining wall provided in the first embodiment of the present invention; Figure 7 is a schematic diagram of a hole-free riveting provided in the first embodiment of the present invention; Figure 8 is a schematic diagram of the structure of a server unit provided in the second embodiment of the present invention; Figure 9 is a schematic diagram of the liquid connection of a server unit provided in the second embodiment of the present invention.

10: Bottom shell

101: First functional module

102: Power module

103: Fan module

104: Liquid cooling module

105: Second functional module

A,B: Area

Claims (10)

A server comprises a bottom shell, on which a first functional module, a power module and a fan module are arranged; the server is characterized in that it also comprises: a liquid cooling module directly in contact with the first functional module, for cooling the first functional module; the power module and the fan module are located on the same side of the first functional module, and there is a gap between the power module and the fan module; a dripping port is arranged at a position of the bottom shell corresponding to an end of the gap far from the first functional module; a first enclosure structure is arranged on the periphery of the power module and the periphery of the fan module; the first enclosure structure is used to prevent liquid from entering the power module and the fan module when the liquid cooling module leaks, and guide the liquid to the dripping port for discharge. The server according to claim 1, wherein the first enclosure structure includes a retaining wall and a drainage wall; the retaining wall of the first enclosure structure is L-shaped; one side of one L-shaped retaining wall is located between the first functional module and the power module, and the other L-shaped retaining wall is located between the first functional module and the power module. One side of the retaining wall is located between the first functional module and the fan module; the other sides of the two L-shaped retaining walls extend to the gap and are connected to the corresponding drainage walls; the two drainage walls and the bottom shell together form a drainage groove extending to the drip port. The server as described in claim 1 is characterized in that a second functional module is also provided on the bottom shell, and the second functional module is located on the other side of the first functional module; a second enclosure structure is provided between the first functional module and the second functional module; and the second enclosure structure is used to prevent liquid from entering the second functional module when the liquid cooling module leaks. The server as described in claim 3 is characterized in that the second retaining structure includes a retaining wall; the retaining wall of the second retaining structure is linear. The server as described in claim 2 or 4 is characterized in that the baffle wall includes a baffle wall body and waterproof glue; the waterproof glue is attached to the surface of the baffle wall body to protect the baffle wall body. The server as described in claim 5 is characterized in that the height of the retaining wall body is not less than 5 mm. The server as described in claim 2 is characterized in that the height of the drainage wall is less than the height of the retaining wall; and the material of the drainage wall is waterproof glue. The server as described in claim 1 is characterized in that the area of the bottom shell corresponding to the first functional module is assembled by riveting without holes. A server unit, characterized in that it includes: a cabinet, a liquid receiving device and a plurality of servers as described in any one of claims 1 to 8; the plurality of servers are stacked in sequence in the cabinet; the liquid receiving device is located at the bottom of the cabinet and corresponds to the positions of the dripping ports of the plurality of servers; the liquid receiving device is used to collect liquid dripping from the dripping port of any one of the servers. The server unit as described in claim 9 is characterized in that the orthographic projections of the multiple dripping ports of the servers on the horizontal plane completely overlap; or, the center points of the orthographic projections of the multiple dripping ports of the servers on the horizontal plane completely overlap, and the sizes of the dripping ports of the multiple servers gradually decrease in the direction away from the horizontal plane.