CN201210784Y - Heat radiator - Google Patents

Abstract

A heat radiator comprises a containing part, a driving part and a conducting part, wherein a module needing heat radiation is arranged in the containing part, two opposite side walls of the containing part are respectively provided with a liquid guide port, a liquid medium is contained in the containing part, the driving part comprises a pump, a motor and a fan which are linked, the wind direction of the fan directly faces to a cold row, the conducting part comprises a cold row and a guide pipe, the middle section of the guide pipe is folded in a plurality of ways, two ports of the guide pipe are respectively inserted into the containing part through the liquid guide ports and are communicated with the containing part, the cold row is positioned above the guide pipe, and the fan is positioned below the guide pipe. The CPU or other functional chips and modules are immersed in the liquid medium and cooled by the circulative flow drive, so that the heat energy generated by the CPU or other functional chips and modules is effectively carried away and cooled, the noise is low, and the data processing capacity of the CPU or other functional chips and modules is effectively improved and stabilized.

Description

a radiator

technical field

The invention relates to a radiator, in particular to a radiator for cooling functional modules such as a CPU or other electronic products on a computer.

Background technique

Please refer to FIG. 1 , which is a schematic structural diagram of a conventional heat sink 10 . Usually, the heat sink or heat dissipation duct used on the computer cooperates with the fan 12 through an aluminum alloy or copper alloy structure to dissipate the heat generated by the CPU (Central processing unit, central processing unit) or other functional modules during operation, thereby reducing the CPU temperature. Or the temperature of other functional modules to ensure the normal operation of the computer. However, there are many disadvantages in this heat dissipating structure for the CPU or other functional modules of the computer, for example, the noise generated during its work is relatively large; on the other hand, due to the rapid development of technology, the CPU or other functional modules will soon be replaced Upgrading and updating, therefore, the heat dissipation effect of the above-mentioned heat dissipation structure cannot cope with the CPU or other functional modules with faster and faster computing speeds in time.

Contents of the invention

The technical problem to be solved by the present invention is to provide a heat sink, which can effectively take away and cool the heat energy generated by the CPU or other functional chips and modules of the computer, and has low noise, and effectively improves and stabilizes the CPU or other heat sinks. Data processing capabilities of functional chips and modules.

In order to solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a heat sink, including a housing part, a driving part and a conducting part, a module to be dissipated is arranged in the housing part, and the opposite sides of the housing part There is a liquid guide port on each of the two side walls, the accommodating part contains a liquid medium, the driving part includes a linked pump, motor and fan, and the wind direction of the fan directly faces the The cold row, the conduction part includes a cold row and a conduit, the middle section of the conduit has multiple turns, and the two ports of the conduit are respectively inserted into the accommodating part through the liquid guide port and connected with the accommodating The parts are connected, the cold row is located above the duct, and the fan is located below the duct.

The accommodating part includes a housing, the housing is a hollow container with an opening above it, and a plurality of screw holes are opened around the opening of the upper end of the housing, the driving part includes an upper cover, and the upper The periphery of the cover is provided with a plurality of screw holes corresponding to the screw holes of the housing.

Under the inside of the housing, a boss extends inward from the inner side wall of the housing to form a module accommodating portion, the boss is provided with a plurality of screw holes, and the module accommodating portion The shape corresponds to the module it will house.

The accommodating part also includes a pressure ring and a sealing ring, the shape of the opening of the sealing ring corresponds to the shape of the module, and a plurality of screw holes are opened on the periphery of the pressure ring, which are connected with the bosses. Corresponding to multiple screw holes.

A transparent observation window is opened on a side wall of the housing.

The bottoms of the four edges of the housing are respectively provided with mounting bases, and each of the mounting bases is respectively provided with mounting base holes.

A liquid injection port is arranged on the upper surface of the upper cover, and the liquid injection port is a double-layer structure made of silica gel.

A boss extends downward from one side of the cold row, and a screw hole is provided on the boss, and a screw hole is also arranged between two screw holes on the periphery of the upper cover. The holes correspond to the screw holes on the boss, and the cold row is designed in a U-shaped cycle.

The inside of the upper cover is provided with a liquid medium expansion space, and the liquid medium expansion space is a plurality of continuous protrusions protruding from the inner surface of the upper cover.

A box body is further arranged, and the liquid medium used for cooling another functional module is housed in the box body. Two liquid medium conduits respectively extend from one side wall of the box body, and the liquid medium conduits are respectively inserted into the The inside of the accommodating portion communicates with the interior of the accommodating portion, and the box body is connected to the other functional module.

The beneficial effects of the present invention are: immerse the CPU or other functional chips and modules of the computer in the liquid medium, and drive the cooling through a circulatory flow, and effectively take away the heat energy generated by the CPU or other functional chips and modules of the computer. And cooling, and low noise, and effectively improve and stabilize the data processing capability of CPU or other functional chips, modules.

Description of drawings

Fig. 1 is the structural representation of existing a kind of radiator;

Fig. 2 is the three-dimensional exploded view of radiator of the present invention;

Fig. 3 is the schematic diagram of cross-sectional structure of the assembled radiator of the present invention;

Fig. 4 is the structural schematic diagram of the radiator of the present invention after assembly;

Fig. 5 is a structural schematic diagram of another embodiment of the radiator of the present invention.

Detailed ways

The radiator of the utility model is suitable for the CPU, functional chips, modules of computers, or other electronic products that need to dissipate heat.

Please refer to FIG. 2, which is a three-dimensional exploded view of the radiator of the present invention. The radiator 02 of the present invention includes an accommodating part 20 , a driving part 30 and a conducting part 40 . Wherein, the accommodating portion 20 includes a housing 21 , the housing 21 is a hollow container with an opening above it, and a plurality of screw holes 213 are provided around the upper opening of the housing 21 . Under the inside of the housing 21, a boss extends inwardly from the inner side wall of the housing 21, thereby forming a CPU accommodating portion 212. The CPU accommodating portion 212 is a hollow ring design, and its shape is similar to that of the CPU 50 to be accommodated. Correspondingly, it is advisable to just accommodate the CPU50. A plurality of screw holes 2120 are defined on the CPU accommodating portion 212 . A transparent observation window 214 is opened on a side wall of the housing 21 for observing the amount of the liquid medium, so as to ensure the normal operation of the CPU 50 . The bottoms of the four edges of the housing 21 are respectively provided with installation feet 211 , and each installation foot 211 is respectively provided with installation foundation holes 2110 . The accommodating part 20 also includes a pressing ring 220 and a sealing ring 221 . The shape of the opening 2210 that the seal ring 221 has corresponds to the shape of the chip portion of the CPU 50 . The pressure ring 220 has an opening 2201 , and a plurality of screw holes 2202 are defined on the periphery of the pressure ring 220 . The screw holes 2202 correspond to the screw holes 2120 of the CPU accommodating portion 212 . A liquid guiding port 215 is respectively opened on two opposite side walls of the casing 21 .

The driving part 30 includes a pump 31 , an upper cover 32 , a motor 33 and a fan 34 . A plurality of screw holes 320 are defined on the periphery of the upper cover 32 , and the screw holes 320 correspond to the screw holes 213 of the casing 21 . In addition, a screw hole 321 is provided between the two screw holes 320 on the periphery of the upper cover 32 . A liquid injection port 322 is arranged on the upper surface of the upper cover 32. The liquid injection port 322 is a double-layer structure made of silica gel. When in use, the liquid can be injected by directly inserting the needle. When not in use, it can ensure sealing and Does not drain fluid. The motor 33 is disposed below the fan 34 for driving the fan 34 to rotate.

The conducting part 40 includes a cold row 41 and a conduit 42 . A boss 410 extends downward from one side of the cold row 41 , and a screw hole 4101 is defined on the boss 410 , and the screw hole 4101 corresponds to the screw hole 321 of the upper cover 32 . The cold row 41 is a U-shaped circulation design. The conduit 42 includes a bent inlet and an outlet, and the middle section has multiple turns.

Please refer to Fig. 3 and Fig. 4 together. Fig. 3 is a schematic diagram of the cross-sectional structure of the radiator of the present invention after assembly; Fig. 4 is a schematic diagram of the structure of the radiator of the present utility model after assembly. When assembling, first place the CPU50 in the CPU accommodating part 212, then respectively press the sealing ring 221 and the pressure ring 220, make the screw hole 2202 correspond to the screw hole 2120 of the CPU accommodating part 212, and screw the pressure ring 220 fixed, thereby preventing liquid media from escaping. Wherein, the pins of the CPU 50 pass through the casing 21 and protrude outward. The fan 34 , the motor 33 and the pump 31 are linked together, and the wind direction of the fan 34 directly corresponds to the effect of the cooling radiator 41 . The upper cover 32 is placed between the motor 33 and the pump 31, and then the upper cover 32 is placed on the casing 21. The screw holes 320 of the upper cover 32 correspond to the screw holes 213 of the casing 21 respectively, and are connected by screws 60. fixed. The inlet port and the outlet port of the conduit 42 are respectively inserted into the liquid guide ports 215 on the two side walls of the casing 21 . Finally, the cold row 41 is rotated above the conduit 42 , and the screw holes 4101 of the cold row 41 correspond to the screw holes 321 of the upper cover 32 , and are fixed by screws. So far, the installation of the radiator of the present utility model is completed. The liquid medium contained in the casing 21 can be injected through the liquid injection port 322 , and the amount of the injected liquid medium can be judged through the observation window 214 .

The liquid medium in the shell 21 is circulated by the driving of the pump 31, and after being cooled in the cold row 41, it is circulated back into the shell 21 through the conduit 42, so as to achieve the effect of circulating cooling of the liquid medium. In addition, the nozzle of the conduit 42 is arranged beside the CPU 50 , and the nozzle adopts a flat-mouth design for increasing the flow area and cooling speed of the liquid medium directly above the CPU 50 .

Please refer to FIG. 5 , which is a structural schematic view of another embodiment of the radiator of the present invention. A box body 701 is placed on the functional module 70 , and a liquid medium for cooling the functional module 70 is contained in the box body 701 . Two liquid medium conduits 7010 and 7012 respectively extend from one side wall of the box body 701. The liquid medium conduits 7010 and 7012 are respectively inserted into the casing 21 and communicate with the inside of the casing 21, wherein the liquid medium conduit 7010 The liquid medium conduit 7010 is an inflow pipe of the liquid medium, and the liquid medium conduit 7010 is an outflow pipe of the liquid medium, which is used to realize the circulating flow of the liquid medium, thereby cooling the functional module 70 .

It can be understood that the interior of the upper cover 32 may be provided with a liquid medium expansion space (not shown in the figure), and the liquid medium expansion space may be a plurality of continuous protrusions protruding from the inner surface of the upper cover 32 to prevent excessive liquid medium. And affect the normal work of the radiator. In addition, the liquid medium in the radiator described in the present invention can use the insulating oil currently used in electrical equipment, because the insulating oil has good insulation, high dielectric strength, small dielectric loss factor, and good transmission heat and fluidity. The housing 21 and the upper cover 32 may also be connected and fixed by other means, such as clamping, etc., and are not limited to fixing by screws.

The radiator described in the utility model can effectively take away the heat energy generated by the CPU or other functional chips and modules of the computer during operation to realize cooling, reduce noise and improve the processing efficiency of the CPU or other functional chips and modules .

The above-mentioned cases are only preferred implementation cases of the present utility model, and are not intended to limit the scope of the present invention. Therefore, all equivalent changes made in any voltage level according to the shape, structure and principle of the present invention should be covered by the present invention. within the protection scope of the present invention.

Claims (10)

1. A heat sink, comprising an accommodating portion, a driving portion and a conduction portion, a module to be dissipated is arranged in the accommodating portion, and it is characterized in that: each of the two opposite side walls of the accommodating portion is provided with A liquid guide port, the accommodating part contains a liquid medium, the drive part includes a linked pump, motor and fan, the wind direction of the fan directly faces the cold row, and the conduction part includes a cooling row and conduit, the middle section of the conduit has multiple turns, and the two ports of the conduit are respectively inserted into the accommodating part through the liquid guide port and communicated with the accommodating part, and the cold row is located at above the duct, and the fan is located below the duct. 2. The heat sink according to claim 1, characterized in that: the accommodating portion comprises a housing, the housing is a hollow container with an opening above it, and openings are provided around the opening of the upper end of the housing. A plurality of screw holes, the driving part includes an upper cover, and a plurality of screw holes are opened on the periphery of the upper cover, corresponding to the screw holes of the casing. 3. The heat sink according to claim 2, characterized in that: a boss extends inwardly from the inner side wall of the housing under the interior of the housing to form a module accommodating portion, and the protrusion A plurality of screw holes are arranged on the table, and the shape of the module accommodating part corresponds to the module to be accommodated. 4. The heat sink according to claim 3, characterized in that: the accommodating part further comprises a pressing ring and a sealing ring, the shape of the opening of the sealing ring corresponds to the shape of the module, and the pressing ring A plurality of screw holes are provided on the periphery of the ring, corresponding to the plurality of screw holes of the boss. 5. The heat sink according to claim 1, wherein a transparent observation window is opened on one side wall of the accommodating portion. 6. The heat sink according to claim 1, characterized in that: the bottoms of the four edges of the accommodating portion are respectively provided with mounting feet, and each of the mounting feet is respectively provided with a mounting hole. 7. The radiator according to claim 2, characterized in that: a liquid injection port is arranged on the upper surface of the upper cover, and the liquid injection port is a double-layer structure made of silica gel. 8. The heat sink according to claim 2, characterized in that: a boss extends downward from one side of the cold row, and a screw hole is opened on the boss, and the outer periphery of the upper cover There is also a screw hole between the two screw holes, which corresponds to the screw hole on the boss, and the cold row is U-shaped circulation design. 9. The radiator according to claim 2, characterized in that: the interior of the upper cover is provided with a liquid medium expansion space, and the liquid medium expansion space is a plurality of continuous protrusions protruding from the inner surface of the upper cover. surface. 10. The heat sink according to claim 1, characterized in that: a box is further arranged, and a liquid medium for cooling another functional module is housed in the box, and one side wall of the box is respectively Two liquid medium conduits are extended, and the liquid medium conduits are respectively inserted into the accommodating part and communicate with the inside of the accommodating part, and the box body is connected with the other functional module.

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