TWI885320B - Sandwich structure power supply module - Google Patents
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Description
本揭露的實施例是關於電子元件,更具體地說,本發明是關於電源模組結構。The disclosed embodiments relate to electronic components, and more specifically, the present invention relates to a power module structure.
通常,電源轉換器用於將輸入功率轉換成具有合適電壓和電流的輸出功率提供給負載。多相電源轉換器包括多個並聯且錯相工作的功率級,因此其具有輸出電壓漣波小,瞬態反應快以及對輸入電容的額定漣波電流要求低的優點。由於上述優點,多相電源轉換器被廣泛應用於輸出大電流,低電壓的應用中,例如伺服器,微處理器等。Generally, a power converter is used to convert input power into output power with appropriate voltage and current for the load. A multiphase power converter includes multiple power stages connected in parallel and working in staggered phases, so it has the advantages of small output voltage ripple, fast transient response, and low rated ripple current requirement for input capacitors. Due to the above advantages, multiphase power converters are widely used in applications with large output current and low voltage, such as servers, microprocessors, etc.
現代GPU(圖形處理器)、CPU(中央處理器)的快速發展,對多相電源轉換器的電流能力提出了越來越高的要求。與此同時,這些處理器的體積則越做越小,也就是說,多相電源轉換器的體積相應地需要減小。越來越大的電流,越來越小的體積,又使得多相電源轉換器的散熱遇到了更高的挑戰。也就是說,需要有一種高電流密度、高效率並且具有出色的散熱能力的電源轉換器。The rapid development of modern GPUs (graphics processing units) and CPUs (central processing units) has put forward higher and higher requirements on the current capability of multi-phase power converters. At the same time, the size of these processors is getting smaller and smaller, which means that the size of multi-phase power converters needs to be reduced accordingly. The increasing current and decreasing size have made the heat dissipation of multi-phase power converters more challenging. In other words, a power converter with high current density, high efficiency and excellent heat dissipation capability is needed.
本發明的目的是提供一種具有夾層結構的電源模組,用以將電源電路系統中的電感、功率開關及其驅動器均堆疊整合在一個較小的模組中。The purpose of the present invention is to provide a power module with a sandwich structure, which is used to stack and integrate the inductor, power switch and driver in the power circuit system into a smaller module.
根據本發明一實施例的用於電源模組的電感組,包括:磁芯,具有N條通道由上至下貫穿磁芯,其中N為大於1的整數;N個線圈,分別穿過磁芯的N條通道;以及兩組金屬片,每組金屬片包括兩個金屬片,中間加入隔離層後貼合,兩組金屬片分別覆蓋於磁芯的兩個相背的側面,並且每組金屬片中的兩個金屬片分別電連接到不同的電位。According to an embodiment of the present invention, an inductor group for a power module includes: a magnetic core having N channels running through the magnetic core from top to bottom, wherein N is an integer greater than 1; N coils respectively passing through the N channels of the magnetic core; and two groups of metal sheets, each group of metal sheets including two metal sheets, which are bonded after adding an isolation layer in the middle, and the two groups of metal sheets respectively cover two opposite sides of the magnetic core, and the two metal sheets in each group of metal sheets are respectively electrically connected to different potentials.
根據本發明一實施例的電源模組,包括前述電感組,還包括:PCB頂板,位於電感組之上;以及N個功率裝置晶片,位於PCB頂板之上,其中每個功率裝置晶片均具有至少一個引腳通過PCB頂板電連接至相應的線圈。A power module according to an embodiment of the present invention includes the aforementioned inductor group, and further includes: a PCB top board located on the inductor group; and N power device chips located on the PCB top board, wherein each power device chip has at least one pin electrically connected to a corresponding coil through the PCB top board.
在一個實施例中,電源模組還包括:PCB底板,位於電感組之下;以及連接器,連接PCB頂板和PCB底板,其中,連接器具有多個金屬柱,分別焊接至PCB頂板和PCB底板的相應焊盤。In one embodiment, the power module further includes: a PCB bottom plate, located below the inductor group; and a connector, connecting the PCB top plate and the PCB bottom plate, wherein the connector has a plurality of metal columns, which are respectively welded to corresponding pads of the PCB top plate and the PCB bottom plate.
根據本發明一實施例的一種可用於電源模組的電感組,包括:磁芯,具有N條通道由上至下貫穿磁芯,其中N為大於1的整數;N個線圈,分別穿過磁芯的N條通道;以及第一金屬片、第二金屬片和第三金屬片,其中第一金屬片和第二金屬片分別覆蓋於磁芯的兩個相背的側面,第三金屬片覆蓋於磁芯的剩餘側面中的其中一個。According to one embodiment of the present invention, an inductor group that can be used in a power module includes: a magnetic core having N channels running through the magnetic core from top to bottom, wherein N is an integer greater than 1; N coils passing through the N channels of the magnetic core respectively; and a first metal sheet, a second metal sheet and a third metal sheet, wherein the first metal sheet and the second metal sheet respectively cover two opposite sides of the magnetic core, and the third metal sheet covers one of the remaining sides of the magnetic core.
本發明的具有夾層結構的電源模組具有如下優點:(1)與現有技術中平鋪結構的電源模組相比,能夠減少PCB板上的面積,從而提高負載電流/功率密度;(2)通過電感的腳(線圈)來傳輸輸出電流,能夠減少輸出電流回路在PCB板上的走線,避免PCB板走線的高阻抗,從而提高電路效率;以及(3)本發明電源模組的功率裝置晶片在上,電感組在下的結構可以極大地受益於GPU、CPU和ASIC系統中通常採用的頂部冷卻系統。The power module with sandwich structure of the present invention has the following advantages: (1) compared with the power module with flat structure in the prior art, it can reduce the area on the PCB board, thereby improving the load current/power density; (2) by transmitting the output current through the legs (coils) of the inductor, it can reduce the routing of the output current loop on the PCB board and avoid the high impedance of the PCB board routing, thereby improving the circuit efficiency; and (3) the structure of the power module of the present invention with the power device chip on the top and the inductor group on the bottom can greatly benefit from the top cooling system commonly used in GPU, CPU and ASIC systems.
在接下來的說明中,一些具體的細節,例如實施例中的具體電路結構和這些電路元件的具體參數,都用於對本發明的實施例提供更好的理解。本技術領域的技術人員可以理解,即使在缺少一些細節或者其他方法、元件、材料等結合的情況下,本發明的實施例也可以被實現。此外,本文所稱「耦接」的含義為直接連接,或通過其他電路元件,間接連接。In the following description, some specific details, such as the specific circuit structures in the embodiments and the specific parameters of these circuit elements, are used to provide a better understanding of the embodiments of the present invention. Those skilled in the art can understand that the embodiments of the present invention can be implemented even in the absence of some details or in the combination of other methods, elements, materials, etc. In addition, the meaning of "coupled" referred to herein is directly connected or indirectly connected through other circuit elements.
下面描述的實施例將以具體的實施器件和應用背景為例對本發明各實施例的器件和工作方式進行闡述,以使本領域技術人員能夠更好地理解本發明。然而本領域的技術人員應當理解,這些說明只是示例性的,並不用於限定本發明的範圍。The embodiments described below will use specific implementation devices and application backgrounds as examples to illustrate the devices and working methods of various embodiments of the present invention, so that those skilled in the art can better understand the present invention. However, those skilled in the art should understand that these descriptions are only exemplary and are not intended to limit the scope of the present invention.
圖1繪示了現有的多相電源轉換器10的電路結構示意圖。如圖1所示,多相電源轉換器10包括控制器101、N個功率裝置103和N個電感L1,其中N是整數,並且N>1。如圖1所示,每個功率級102,也稱作每一相102,包括一個功率裝置103和一個電感L1。每個功率裝置103包括功率開關M1、M2以及用於驅動功率開關M1、M2的驅動器DR1。控制器101提供N相控制信號105-1~105-N分別控制N個功率裝置103,以控制N相102錯相工作,也就是說,N個電感L1依次從輸入端汲取能量,並依次提供能量給負載104。應當理解,在圖1中,多相電源轉換器10的各相輸出連接在一起提供能量給負載只是其中一種應用。在其他應用中,多相電源轉換器10也可以以多個單相電源轉換器的方式工作,也就是說每一相均可以單獨連接一個獨立負載,並提供不同的輸出電壓以滿足不同負載的需求。FIG1 shows a schematic diagram of the circuit structure of an existing
圖1所示的具有BUCK拓撲的功率級102僅作示例。本領域普通技術人員應當明白,具有其他拓撲結構的功率級也適用於本發明實施例的多相電源轉換器。The
在下述本發明實施例中,電感L1可以用耦合電感來實現,也可以用N個單電感來實現。In the following embodiments of the present invention, the inductor L1 may be implemented by a coupled inductor or by N single inductors.
當N=2時,多相電源轉換器10被用作雙相電源轉換器,或兩個獨立的電源轉換器。When N=2, the
圖2繪示了根據本發明一實施例的整合了雙相電源轉換器的具有夾層結構的電源模組20的結構示意圖。在圖1中,當N=2時,功率級102可採用電源模組20來實現。夾層結構的電源模組20包括:印刷電路板(Printed Circuit Board,PCB)底板201,位於電源模組20的底部;電感組206,位於PCB底板201上,包括兩個電感,其中,每個電感具有第一端和第二端;PCB頂板202,位於電感組206上;連接器204,具有多個金屬柱205,每個金屬柱205分別焊接至PCB頂板202和PCB底板201上相應的焊盤;以及兩個功率裝置晶片203,位於PCB頂板202的頂部之上,其中,每個功率裝置晶片203具有一個或多個引腳,通過PCB頂板202連接至電感組206中的電感的第二端;其中,每個電感具有線圈207,線圈207的兩端彎折至與線圈207的長度方向相垂直的平面上,並在PCB頂板202和PCB底板201上延展。FIG2 shows a schematic diagram of a power module 20 with a sandwich structure that integrates a dual-phase power converter according to an embodiment of the present invention. In FIG1 , when N=2, the
在圖2中,電源模組20進一步包括位於PCB頂板202上的分離設置的其他元件208。元件208例如包括電源轉換器10中的各種電阻、電容等,例如電源轉換器10輸入端用於提供脈衝電流的輸入電容、用於給功率開關驅動器和內部邏輯電路供電的濾波電容和電阻等。In FIG2 , the power module 20 further includes other components 208 that are separately arranged on the PCB top board 202. The components 208 include, for example, various resistors, capacitors, etc. in the
在一個實施例中,金屬柱205包括銅柱,用於將PCB底板201焊接至PCB頂板202。本領域普通技術人員應當明白,任何可用於電連接兩個PCB板的金屬柱均可以用於本發明。In one embodiment, the metal pillar 205 includes a copper pillar for soldering the PCB bottom plate 201 to the PCB top plate 202. A person skilled in the art should understand that any metal pillar that can be used to electrically connect two PCB boards can be used in the present invention.
電源模組20通常置於處理器的主機板上,用於給主機板上的器件提供電源。PCB底板201被焊接在主機板上,電源模組20的部分引腳通過PCB底板201焊接至主機板。在部分實施例中,PCB底板201也可以省略。電源模組20可通過連接器204和電感組206直接焊接至主機板。The power module 20 is usually placed on the motherboard of the processor to provide power to the devices on the motherboard. The PCB base plate 201 is welded on the motherboard, and some pins of the power module 20 are welded to the motherboard through the PCB base plate 201. In some embodiments, the PCB base plate 201 can also be omitted. The power module 20 can be directly welded to the motherboard through the connector 204 and the inductor group 206.
在本發明中,功率裝置晶片疊在電感組之上,如圖2所示,從而節省了電源轉換器10在PCB板上的面積。每一個功率裝置晶片203整合了如圖1所示的功率裝置103,即包括如圖1所示的功率開關M1、M2以及用於驅動功率開關M1、M2的驅動器DR1,以及圖1中未繪示的與輔助線圈相連接的電路等。功率裝置晶片203的引腳焊接至PCB頂板202的焊盤,之後PCB頂板202的焊盤通過電感組206和連接器204,再電連接至PCB底板201的焊盤上。這樣,通過PCB底板201,即可與功率裝置晶片203電連接。電源模組20還包括金屬片209,用於傳導如參考地之類的大電流信號。金屬片209包裹著電感組206的磁芯的部分面積,並同時焊接至PCB頂板202和PCB底板201。金屬片209的位置取決於功率裝置晶片203的接地引腳的位置。在圖2實施例中,金屬片209主要包裹在電感組206的側面,其兩端彎折,在電感組206的上下表面形成靠近PCB板上相應焊盤的焊接區,從而在水平面,即PCB板的平面上,用大面積的金屬片209替代PCB走線走大電流,降低電路損耗,提高電路效率。In the present invention, the power device chip is stacked on the inductor group, as shown in FIG2, thereby saving the area of the
圖3繪示了根據本發明一實施例的電感組30的三維分解圖。電感組30可用作圖2電源模組中的電感組206。如圖3所示,電感組30包括:磁芯,包括第一磁芯部分301和第二磁芯部分302,其中第一磁芯部分301和第二磁芯部分302組合在一起,在兩者的接合面形成兩通道303-1和303-2;以及線圈304-1和304-2,分別穿過通道303-1和303-2。FIG3 shows a three-dimensional exploded view of an inductor assembly 30 according to an embodiment of the present invention. The inductor assembly 30 can be used as the inductor assembly 206 in the power module of FIG2. As shown in FIG3, the inductor assembly 30 includes: a magnetic core, including a first magnetic core portion 301 and a second magnetic core portion 302, wherein the first magnetic core portion 301 and the second magnetic core portion 302 are combined together to form two channels 303-1 and 303-2 at the joint surface of the first magnetic core portion 301 and the second magnetic core portion 302; and coils 304-1 and 304-2, passing through the channels 303-1 and 303-2 respectively.
在圖3實施例中,當電感組30應用於圖2所示的電源模組20時,通道303-1和303-2平行於PCB底板201和PCB頂板202,即通道303-1和303-2具有沿著如圖2所示的軸線“A”的徑向。In the embodiment of FIG. 3 , when the inductor assembly 30 is applied to the power module 20 shown in FIG. 2 , the channels 303 - 1 and 303 - 2 are parallel to the PCB bottom plate 201 and the PCB top plate 202 , that is, the channels 303 - 1 and 303 - 2 have a radial direction along the axis “A” shown in FIG. 2 .
在圖3實施例中,線圈304-1具有第一端304-3彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202表面延展,並焊接至PCB頂板202,具有第二端304-5彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201表面延展,並焊接至PCB底板201。也就是說,線圈304-1的第一端304-3和第二端304-5沿著垂直於磁芯通道303-1和303-2的平面延展,其延展面的側邊同時也在PCB頂板202和PCB底板201的表面延展。同樣地,線圈304-2具有第一端304-4彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202的表面延展,並焊接至PCB頂板202,具有第二端304-6彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201的表面延展,並焊接至PCB底板201。也就是說,線圈304-2的第一端304-4和第二端304-6沿著垂直於磁芯通道303-1和303-2的平面延展,其延展面的側邊同時也在PCB頂板202和PCB底板201的表面延展。In the embodiment of FIG. 3 , the coil 304-1 has a first end 304-3
在圖3實施例中,磁芯的第一磁芯部分301和第二磁芯部分302的形狀並不對稱一致,其中,第一磁芯部分301具有平面形狀,第二磁芯部分302具有兩條溝道,通道303-1和303-2分別由第二磁芯部分302的兩條溝道和第一磁芯部分301的一個面301-1構成,如圖3所示。In the embodiment of FIG. 3 , the shapes of the first core portion 301 and the second core portion 302 of the magnetic core are not symmetrical, wherein the first core portion 301 has a planar shape, and the second core portion 302 has two grooves, and channels 303-1 and 303-2 are respectively formed by the two grooves of the second core portion 302 and a surface 301-1 of the first core portion 301, as shown in FIG. 3 .
在圖3實施例中,金屬片305-1和305-2具有L型。金屬片305-1和305-2的兩端分別焊接至PCB頂板202和PCB底板201。金屬片305-1和305-2焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,也即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。In the embodiment of FIG. 3 , the metal sheets 305-1 and 305-2 have an L shape. The two ends of the metal sheets 305-1 and 305-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. The ends of the metal sheets 305-1 and 305-2 welded to the PCB top plate 202 are
圖4繪示了根據本發明一實施例的電感組40的三維分解圖。電感組40可用作圖2電源模組中的電感組206。如圖4所示,電感組40包括:磁芯,包括第一磁芯部分401和第二磁芯部分402,其中第一磁芯部分401和第二磁芯部分402組合在一起,在兩者的接合面形成兩通道403-1和403-2;以及線圈404-1和404-2,分別穿過通道403-1和403-2。FIG4 shows a three-dimensional exploded view of an
在圖4實施例中,當電感組40應用於圖2所示的電源模組20時,通道403-1和403-2垂直於PCB底板201和PCB頂板202,即通道403-1和403-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 4 , when the
在圖4實施例中,線圈404-1具有第一端404-3彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202表面延展,並焊接至PCB頂板202,具有第二端404-5彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201表面延展,並焊接至PCB底板201。也就是說,線圈404-1的第一端404-3和第二端404-5沿著垂直於磁芯通道403-1和403-2的平面延展,其延展面同時也在PCB頂板202和PCB底板201的表面延展。同樣地,線圈404-2具有第一端404-4彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202的表面延展,並焊接至PCB頂板202,具有第二端404-6彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201的表面延展,並焊接至PCB底板201。也就是說,線圈404-2的第一端404-4和第二端404-6沿著垂直於磁芯通道403-1和403-2的平面延展,其延展面同時也在PCB頂板202和PCB底板201的表面延展。In the embodiment of FIG. 4 , the coil 404-1 has a first end 404-3 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top board 202, and is soldered to the PCB top board 202, and has a second end 404-5 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom board 201, and is soldered to the PCB bottom board 201. In other words, the first end 404-3 and the second end 404-5 of the coil 404-1 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extended surface also extends on the surface of the PCB top board 202 and the PCB bottom board 201. Similarly, the coil 404-2 has a first end 404-4 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top board 202 and soldered to the PCB top board 202, and has a second end 404-6 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom board 201 and soldered to the PCB bottom board 201. In other words, the first end 404-4 and the second end 404-6 of the coil 404-2 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extension surface also extends on the surface of the PCB top board 202 and the PCB bottom board 201.
在部分實施例中,線圈404-1的第二端404-5和線圈404-2的第二端404-6可以不彎折。線圈的第二端是否彎折,彎折的方向及延展面的形狀等,取決於PCB底板201上的相應的焊盤的位置,或無PCB底板202,則取決於電源模組20所處的主機板上的相應焊盤的位置。In some embodiments, the second end 404-5 of the coil 404-1 and the second end 404-6 of the coil 404-2 may not be bent. Whether the second end of the coil is bent, the direction of the bend and the shape of the extended surface, etc., depends on the position of the corresponding pad on the PCB bottom plate 201, or if there is no PCB bottom plate 202, it depends on the position of the corresponding pad on the motherboard where the power module 20 is located.
在圖4實施例中,磁芯的第一磁芯部分401和第二磁芯部分402的形狀並不對稱一致,其中,第一磁芯部分401具有平面形狀,第二磁芯部分402具有兩條溝道,通道403-1和403-2分別由第二磁芯部分402的兩條溝道和第一磁芯部分401的一個面401-1構成。In the embodiment of FIG. 4 , the shapes of the
在圖4實施例中,金屬片405-1和405-2具有C型。金屬片405-1和405-2的兩端分別焊接至PCB頂板202和PCB底板201。金屬片405-1和405-2焊接至PCB底板201的一端彎折90度,並在磁芯表面延展,也即相當於在PCB底板201的表面延展,該延展面與PCB底板201的相應焊盤相焊接,以此來減少PCB底板201的走線及其走線阻抗。同樣的,金屬片405-1和405-2焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。In the embodiment of FIG. 4 , the metal sheets 405-1 and 405-2 have a C-shape. The two ends of the metal sheets 405-1 and 405-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. One end of the metal sheets 405-1 and 405-2 welded to the PCB bottom plate 201 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB bottom plate 201. The extended surface is welded to the corresponding pad of the PCB bottom plate 201, thereby reducing the routing of the PCB bottom plate 201 and its routing impedance. Similarly, the metal sheets 405-1 and 405-2 are welded to one end of the PCB top plate 202 and bent 90 degrees to extend on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202, and are electrically connected to the ground pin of the power device chip 203 through the solder pad of the PCB top plate 202, thereby reducing the routing of the PCB top plate 202 and its routing impedance.
圖5繪示了根據本發明一實施例的電感組50的三維分解圖。電感組50可用作圖2電源模組中的電感組206。如圖5所示,電感組50包括:磁芯,包括第一磁芯部分501和第二磁芯部分502,其中第一磁芯部分501和第二磁芯部分502組合在一起,在兩者的接合面形成兩通道503-1和503-2;以及線圈504-1和504-2,分別穿過通道503-1和503-2。FIG5 shows a three-dimensional exploded view of an
在圖5實施例中,當電感組50應用於圖2所示的電源模組20時,通道503-1和503-2垂直於PCB底板201和PCB頂板202,即通道503-1和503-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 5 , when the
在圖5實施例中,金屬片505具有C型。金屬片505的兩端分別焊接至PCB頂板202和PCB底板201。金屬片505焊接至PCB底板201的一端彎折90度,並在磁芯表面延展,即相當於在PCB底板201的表面延展,該延展面與PCB底板201的相應焊盤相焊接,以此來減少PCB底板201的走線及其走線阻抗。同樣的,金屬片505焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。在圖5實施例中,金屬片505包裹磁芯側面的部分盡可能延展,增大面積,以減少自身阻抗。In the embodiment of FIG. 5 , the
與圖4所示的電感組40相比,圖5中的電感組50具有單片金屬片505用於電連接功率裝置晶片203的接地引腳至PCB底板201。與圖4相比,圖5中少了一金屬片,因此金屬片505以及線圈504-1和504-2在磁芯的上下表面可延展的面積更大,從而使功率裝置晶片203的接地引腳的分佈具有更大的靈活性。Compared with the
圖5中,磁芯的第一磁芯部分501和第二磁芯部分502與圖4中的磁芯結構相似,為敘述簡明之故,此處不再展開說明。In FIG. 5 , the first
圖6繪示了根據本發明一實施例的磁芯60的結構示意圖。在圖6中,磁芯60包括形狀對稱一致的第一磁芯部分601和第二磁芯部分602,其中,每個磁芯部分具有兩條溝道。當磁芯60用於圖3-圖5實施例的電感組時,兩個磁芯部分的溝道相覆合,形成兩條通道,以使線圈從中穿過。FIG6 shows a schematic diagram of the structure of a
圖7繪示了根據本發明一實施例的磁芯70的結構示意圖。在圖7中,磁芯70包括第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1~703-3。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1及703-2構建了第一通道704-1。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-2及703-3構建了第二通道704-2。從圖7中可看出,當有更多的第三磁芯部分時,可以構建更多的磁芯通道。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1~703-3可以由不同的材料製作而成,從而提供更加靈活可調的電感-電流曲線。FIG. 7 shows a schematic diagram of the structure of a
在本發明的部分實施例中,磁芯的各磁芯部分可以由同種材料製作,但具有不同的形狀,也可以由不同的材料製作而成,如鐵氧體、鐵粉或其他合適的材料等,以期實現所需的電感-電流特性曲線,例如,在小電流時具有大電感值,在大電流時具有小電感值。小電流時具有大電感值可以使系統效率更高,而大電流時小電感值則可使系統的瞬態更好。In some embodiments of the present invention, the core parts of the magnetic core can be made of the same material but have different shapes, or made of different materials, such as ferrite, iron powder or other suitable materials, in order to achieve the desired inductance-current characteristic curve, for example, a large inductance value at a small current and a small inductance value at a large current. A large inductance value at a small current can make the system more efficient, while a small inductance value at a large current can make the system transient better.
為簡明闡述本發明原理之故,圖3-圖5的實施例中僅繪示具有雙通道,可以穿過雙線圈的磁芯。本領域普通技術人員應當知道,根據應用的需要,磁芯可以具有任意數量的通道,穿過任意數量的線圈,單通道或多通道均符合本發明主旨。For the purpose of briefly explaining the principle of the present invention, the embodiments of FIG. 3 to FIG. 5 only show a magnetic core having two channels through which two coils can be passed. A person skilled in the art should know that, according to the needs of the application, the magnetic core can have any number of channels through which any number of coils can be passed, and single or multiple channels are in line with the subject matter of the present invention.
在部分實施例中,在磁芯的不同磁芯部分之間可以存在氣隙以形成耦合電感。在部分實施例中,各磁芯部分之間沒有氣隙,從而形成多個單電感。In some embodiments, there may be air gaps between different core parts of the magnetic core to form coupled inductors. In some embodiments, there are no air gaps between the core parts, thereby forming multiple single inductors.
在本發明中,為了使電感組模組的表面平整,覆蓋磁芯表面的線圈及金屬片嵌入磁芯表面,如圖3~5所示。In the present invention, in order to make the surface of the inductor module flat, the coil and metal sheet covering the surface of the magnetic core are embedded in the surface of the magnetic core, as shown in Figures 3 to 5.
圖8繪示了根據本發明一實施例的電感80的三維分解圖。電感80可用作圖2電源模組中的電感206。如圖8所示,電感80包括:磁芯,頂視具有對稱結構,兩條通道801-1和801-2從磁芯801的上表面801-3貫穿到下表面801-4,並且對稱地分佈在頂視面的中軸線“D”兩側;以及線圈802-1和802-2分別穿過通道801-1和801-2。FIG8 shows a three-dimensional exploded view of an
在圖8實施例中,當電感80應用於圖2所示的電源模組20時,通道801-1和801-2垂直於PCB底板201和PCB頂板202,即通道801-1和801-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 8 , when the
在圖8實施例中,線圈802-1和802-2是直的條狀結構。In the embodiment of FIG. 8 , coils 802 - 1 and 802 - 2 are straight strip structures.
在圖8實施例中,金屬片803-1、803-2、805-1和805-2從側面看呈“C”型,緊貼磁芯801並部分包裹磁芯801。金屬片805-1、805-2和806用於焊接PCB頂板202和PCB底板201。如圖8所示,金屬片803-1、803-2、805-1和805-2的兩端均彎折90度並沿著PCB頂板202和PCB底板201延展。所述延展面焊接至PCB頂板202和PCB底板201的相應焊盤,從而可節省PCB板的內部走線,最小化PCB板內部走線帶來的高阻抗。在一個實施例中,金屬片803-1和803-2用於將功率裝置晶片203的電源引腳(圖1所示的用於接收輸入電壓Vin的引腳),通過PCB頂板202,電連接至PCB底板201或主機板上。金屬片805-1和805-2用於將功率裝置晶片203的接地引腳,通過PCB頂板202,電連接至PCB底板201或主機板上。在圖8實施例中,金屬片803-1和803-2兩端的中間部分挖空,留下兩邊的部分用於連接PCB板。相匹配地,金屬片805-1和805-2的兩端的兩邊部分挖空,留下中間部分用於連接PCB板。金屬片803-1和金屬片805-1中間加入隔離層804-1,貼合後覆蓋於磁芯801的一個側面上。同樣地,金屬片803-2和金屬片805-2中間加入隔離層804-2,貼合後覆蓋於磁芯801的另一個相背的側面上所述隔離層804-1用於防止金屬片803-1和金屬片805-1短路。隔離層804-2用於防止金屬片803-2和金屬片805-2短路。金屬片803-1、803-2、805-1和805-2上下兩端彎折並盡可能多地覆蓋磁芯801的上下表面,以儘量減少PCB板的內部走線,減小PCB板走線阻抗。同時,金屬片803-1、803-2、805-1和805-2盡可能寬,以減小金屬片自身的電阻。In the embodiment of FIG8 , the metal sheets 803-1, 803-2, 805-1 and 805-2 are “C” shaped when viewed from the side, closely attached to the
應當理解,在部分實施例中,金屬片803-1和803-2可以通過PCB頂板202電連接至功率裝置晶片203的接地引腳,而金屬片805-1和805-2可以通過PCB頂板202電連接至功率裝置晶片203的電源引腳,也就是說,金屬片803-1和803-2連接的電位,與金屬片805-1和805-2連接的電位,可以互換。It should be understood that in some embodiments, metal sheets 803-1 and 803-2 can be electrically connected to the ground pin of the power device chip 203 through the PCB top plate 202, and metal sheets 805-1 and 805-2 can be electrically connected to the power pin of the power device chip 203 through the PCB top plate 202, that is, the potential of the connection between metal sheets 803-1 and 803-2 and the potential of the connection between metal sheets 805-1 and 805-2 can be interchanged.
圖9繪示了根據本發明一實施例的電感90的三維分解圖。電感90可用作圖2電源模組中的電感206。電感組90與圖8中的電感組80相似,區別點在於,在圖9中,線圈902-1和902-2並非如圖8中的線圈801-1和801-2一樣是直的條狀結構。在圖9中,線圈902-1和902-2分別包括三個部分,其中第一部分902-A自上表面901-3延伸而下,並垂直於上表面901-3,第二部分902-B自下表面901-4延伸而上,並垂直於下表面901-4,第三部分902-C在中間連接第一部分902-A和902-B。在一個實施例中,第三部分902-C徑向平行於磁芯上表面901-3和下表面901-4。FIG. 9 shows a three-dimensional exploded view of an
圖10繪示了根據本發明一實施例的電感100的三維分解圖。電感100可用作圖2電源模組中的電感206。電感組100與圖9中的電感組90相似,區別點在於,在圖10中,每個線圈的第三部分1002-C足夠長,以至於線圈的第一部分1002-A和第二部分1002-B裸露於磁芯的表面,其中第一部分1002-A和第二部分1002-B的裸露面與磁芯的表面齊平,以使磁芯表面平整。FIG10 shows a three-dimensional exploded view of an
圖11示出了根據本發明一實施例的電感組110的三維分解圖。電感組110可用作圖2電源模組中的電感206。電感組110與圖10中的電感組100相似,區別點在於,在圖11中,每個線圈的第三部分1102-C足夠長,以至於線圈的第一部分1102-A和第二部分1102-B裸露於磁芯的表面,其中第一部分1102-A和第二部分1102-B的裸露面與磁芯的表面齊平,以使磁芯表面平整。在一個實施例中,第三部分1102-C徑向平行於磁芯上表面1101-3和下表面1101-4。FIG. 11 shows a three-dimensional exploded view of an
圖12示出了根據本發明一實施例的電感組120的三維分解圖。電感組120可用作圖2電源模組中的電感206。電感組120與圖10中的電感組100相似,區別點在於,在圖12中,金屬片1203-1、1203-2和1204並不彼此覆蓋。在圖12中,金屬片1203-1和1203-2覆蓋於磁芯1001的兩個相背的側面,而金屬片1204則覆蓋於剩餘的任意一個側面。從側面看,金屬片1203-1、1203-2和1204均呈“C”型,即每個金屬片兩端彎折90度後,包裹磁芯1001的上表面1001-3和下表面1001-4的部分區域。FIG. 12 shows a three-dimensional exploded view of an
在圖12實施例中,金屬片1203-1和1203-2連接至第一電位,而金屬片1204連接到第二電位。第一電位可以是功率裝置203的接地引腳的電位,第二電位可以是功率裝置203的電源引腳的電位,反之也是一樣。In the embodiment of FIG12 , metal sheets 1203-1 and 1203-2 are connected to a first potential, and
圖13示出了根據本發明一實施例的電感組130的三維分解圖。電感組130可用作圖2電源模組中的電感206。電感組130與圖12中的電感組120相似,區別點在於,在圖13中,電感組130包括更多的金屬片,即,電感組130包括金屬片1203-1、1203-2、1304-1和1304-2。在圖13中,金屬片1203-1和1203-2覆蓋於磁芯1001的兩個相背的側面,共同電連接至第一電位,而金屬片1304-1和1304-2分別覆蓋於剩餘的兩個相背側面,並共同電連接至第二電位。與圖12中的金屬片類似,從側面看,金屬片1203-1、1203-2、1304-1和1304-2均呈“C”型,即每個金屬片兩端彎折90度後,包裹磁芯1001的上表面1001-3和下表面1001-4的部分區域。更多的金屬層分佈為頂部PCB 202和底部PCB 201(或電源模組所在的主機板)的焊盤分佈提供了更大的靈活性。FIG13 shows a three-dimensional exploded view of an
在本發明不同實施例中,金屬片可以具有不同的造型來包裹磁芯。並且,當磁芯的形狀發生改變時,金屬片的造型也會發生相應的改變。應當理解,所述的金屬片和線圈,都互不接觸,以免發生短路。In different embodiments of the present invention, the metal sheet can have different shapes to wrap the magnetic core. Moreover, when the shape of the magnetic core changes, the shape of the metal sheet will also change accordingly. It should be understood that the metal sheet and the coil do not touch each other to avoid short circuit.
在部分實施例中,圖8-13中的金屬片可以具有不同的造型,例如“L”型,也就是說,金屬片的一端彎折並包括磁芯的上表面或下表面,即如圖3中的金屬片305-1和305-2所示。在部分實施例中,如圖8-13中的部分金屬片或金屬金屬片可以是平面造型,即沒有任何一端是彎折的。更進一步地,在部分實施例中,不同造型的金屬片,例如“C”型和平面型,只要其中間具有隔離層,就可以互相覆蓋組合在一起。In some embodiments, the metal sheets in FIGS. 8-13 may have different shapes, such as an "L" shape, that is, one end of the metal sheet is bent and includes the upper surface or the lower surface of the magnetic core, as shown in the metal sheets 305-1 and 305-2 in FIG. 3. In some embodiments, some metal sheets or metal sheets as shown in FIGS. 8-13 may be flat, that is, none of the ends are bent. Furthermore, in some embodiments, metal sheets of different shapes, such as a "C" shape and a flat shape, may be combined together as long as there is an isolation layer in the middle.
在本發明中,線圈從磁芯內部的通道穿過,意味著通道與線圈具有相匹配的形狀。在部分實施例中,線圈先塑型,然後再用磁芯材料包裹線圈來製造整個電感。In the present invention, the coil passes through a channel inside the magnetic core, which means that the channel and the coil have matching shapes. In some embodiments, the coil is first shaped and then the coil is wrapped with the magnetic core material to make the entire inductor.
在本發明部分實施例中,磁芯表面具有環氧樹脂塗層,以使磁芯與覆於其上的金屬層相隔離。In some embodiments of the present invention, the surface of the magnetic core has an epoxy coating to isolate the magnetic core from the metal layer covering it.
在本發明中,為了使電感的外表面平整,線圈裸露於電感外表面的部分以及覆蓋於電感外表面的金屬層,嵌入至電感的外表面,如圖3~5及8~13所示。In the present invention, in order to make the outer surface of the inductor flat, the portion of the coil exposed on the outer surface of the inductor and the metal layer covering the outer surface of the inductor are embedded into the outer surface of the inductor, as shown in FIGS. 3-5 and 8-13.
綜上,本發明的許多更改和變型方式顯然也是可行的。因此,應當理解的是,在申請專利範圍所限定的範圍內,本發明可以不用按照上述特定的描述來實施。同樣應當理解的是,上述公開只涉及到本發明一些優選實施例,在不脫離本發明申請專利範圍所限定的精神和範圍的前提下,可以對本發明作出更改。當只有一個優選實施例被公開,本領域普通技術人員不難想到其變型並將其付諸於實施,而不脫離於本發明申請專利範圍所限定的精神與範圍。In summary, many changes and variations of the present invention are obviously feasible. Therefore, it should be understood that within the scope defined by the patent application, the present invention may not be implemented according to the above specific description. It should also be understood that the above disclosure only relates to some preferred embodiments of the present invention, and changes may be made to the present invention without departing from the spirit and scope defined by the patent application of the present invention. When only one preferred embodiment is disclosed, it is not difficult for ordinary technicians in this field to think of its variations and put them into practice without departing from the spirit and scope defined by the patent application of the present invention.
10:多相電源轉換器 101:控制器 102:功率級 103:功率裝置 104:負載 M1,M2:功率開關 DR1:驅動器 L1,80,90,100:電感 20:電源模組 201:PCB底板 202:PCB頂板 203:功率裝置晶片 204:連接器 205:金屬柱 206:電感組. 207,304-1,304-2,404-1,404-2,504-1,504-2,802-1,802-2,902-1, 902-2,1002-1,1002-2,1102-1,1102-2:線圈 208:元件 209,305-1,305-2,405-1,405-2,505,803-1,803-2,805-1,805-2, 1203-1,1203-2,1204,1304-1,1304-2:金屬片 30,40,50,110:電感組 301,302,401,402,501,502,601,602,701,702,703-1,703-2, 703-3:磁芯部分 303-1,303-2,403-1,403-2,503-1,503-2,704-1,704-2,801-1, 801-2,901-1,901-2,1001-1,1001-2,1101-1,1101-2:通道 304-3,304-4,304-5,304-6,404-3,404-4,404-5,404-6,504-3, 504-4,504-5,504-6:端點 301-1,401-1,501-1:面 60,70,801,901,1001,1101:磁芯 801-3,801-4,901-3,901-4,1001-3,1001-4,1101-3,1101-4:表面 804-1,804-2:隔離層 902-A,902-B,902-C,1102-A,1102-B,1102-C:線圈部分 105-1~105-N:控制信號 10: Multiphase power converter 101: Controller 102: Power stage 103: Power device 104: Load M1, M2: Power switch DR1: Driver L1, 80, 90, 100: Inductor 20: Power module 201: PCB bottom plate 202: PCB top plate 203: Power device chip 204: Connector 205: Metal pillar 206: Inductor group. 207, 304-1, 304-2, 404-1, 404-2, 504-1, 504-2, 802-1, 802-2, 902-1, 902-2, 1002-1, 1002-2, 1102-1, 1102-2: Coil 208: Components 209,305-1,305-2,405-1,405-2,505,803-1,803-2,805-1,805-2, 1203-1,1203-2,1204,1304-1,1304-2: Metal sheets 30,40,50,110: Inductor 301,302,401,402,501,502,601,602,701,702,703-1,703-2, 703-3: Magnetic core 303-1,303-2,403-1,403-2,503-1,503-2,704-1,704-2,801-1, 801-2,901-1,901-2,1001-1,1001-2,1101-1,1101-2: Channel 304-3,304-4,304-5,304-6,404-3,404-4,404-5,404-6,504-3, 504-4,504-5,504-6: Endpoint 301-1,401-1,501-1: Surface 60,70,801,901,1001,1101: Core 801-3,801-4,901-3,901-4,1001-3,1001-4,1101-3,1101-4: Surface 804-1,804-2: Isolation layer 902-A,902-B,902-C,1102-A,1102-B,1102-C: Coil part 105-1~105-N: Control signal
為了更好的理解本發明,將根據以下附圖對本揭露進行詳細描述。其中相同的元件具有相同的附圖標記。以下附圖僅用於說明,因此可能僅繪示裝置的一部份,並且不一定按實際比例繪製。
[圖1]繪示了現有的多相電源轉換器10的電路示意圖;
[圖2]繪示了根據本發明一實施例的整合了雙相電源轉換器的具有夾層結構的電源模組20的示意圖;
[圖3]繪示了根據本發明一實施例的電感組30的三維分解圖;
[圖4]繪示了根據本發明一實施例的電感組40的三維分解圖;
[圖5]繪示了根據本發明一實施例的電感組50的三維分解圖;
[圖6]繪示了根據本發明一實施例的磁芯60的結構示意圖;
[圖7]繪示了根據本發明一實施例的磁芯70的結構示意圖;
[圖8]繪示了根據本發明一實施例的電感組80的三維分解圖;
[圖9]繪示了根據本發明一實施例的電感組90的三維分解圖;
[圖10]繪示了根據本發明一實施例的電感組100的三維分解圖。
[圖11]繪示了根據本發明一實施例的電感組110的三維分解圖。
[圖12]繪示了根據本發明一實施例的電感組120的三維分解圖。
[圖13]繪示了根據本發明一實施例的電感組130的三維分解圖。
In order to better understand the present invention, the present disclosure will be described in detail according to the following drawings. The same components have the same drawing numbers. The following drawings are for illustration only and may only show part of the device and may not be drawn to actual scale.
[Figure 1] shows a circuit diagram of an existing
80:電感 80: Inductor
801:磁芯 801: Magnetic core
801-1,801-2:通道 801-1,801-2: Channel
801-3,801-4:表面 801-3,801-4: Surface
802-1,802-2:線圈 802-1,802-2: Coil
803-1,803-2,805-1,805-2:金屬片 803-1,803-2,805-1,805-2:Metal sheet
804-1,804-2:隔離層 804-1,804-2: Isolation Layer
Claims (17)
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