TWI868566B - Sandwich structure power supply module - Google Patents
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Abstract
Description
本揭露的實施例是關於電子元件,更具體地說,本發明是關於電源模組結構。The disclosed embodiments relate to electronic components, and more specifically, the present invention relates to a power module structure.
通常,電源轉換器用於將輸入功率轉換成具有合適電壓和電流的輸出功率提供給負載。多相電源轉換器包括多個並聯且錯相工作的功率級,因此其具有輸出電壓漣波小,瞬態反應快以及對輸入電容的額定漣波電流要求低的優點。由於上述優點,多相電源轉換器被廣泛應用於輸出大電流,低電壓的應用中,例如伺服器,微處理器等。Generally, a power converter is used to convert input power into output power with appropriate voltage and current for the load. A multiphase power converter includes multiple power stages connected in parallel and working in staggered phases, so it has the advantages of small output voltage ripple, fast transient response, and low rated ripple current requirement for input capacitors. Due to the above advantages, multiphase power converters are widely used in applications with large output current and low voltage, such as servers, microprocessors, etc.
現代GPU(圖形處理器)、CPU(中央處理器)的快速發展,對多相電源轉換器的電流能力提出了越來越高的要求。與此同時,這些處理器的體積則越做越小,也就是說,多相電源轉換器的體積相應地需要減小。越來越大的電流,越來越小的體積,又使得多相電源轉換器的散熱遇到了更高的挑戰。也就是說,需要有一種高電流密度、高效率並且具有出色的散熱能力的電源轉換器。The rapid development of modern GPUs (graphics processing units) and CPUs (central processing units) has put forward higher and higher requirements on the current capability of multi-phase power converters. At the same time, the size of these processors is getting smaller and smaller, which means that the size of multi-phase power converters needs to be reduced accordingly. The increasing current and decreasing size have made the heat dissipation of multi-phase power converters more challenging. In other words, a power converter with high current density, high efficiency and excellent heat dissipation capability is needed.
本發明的目的是提供一種具有夾層結構的電源模組,用以將電源電路系統中的電感、功率開關及其驅動器均堆疊整合在一個較小的模組中。The purpose of the present invention is to provide a power module with a sandwich structure, which is used to stack and integrate the inductor, power switch and driver in the power circuit system into a smaller module.
根據本發明一實施例的用於電源模組的電感組,包括:磁芯,頂視具有對稱結構,並且具有兩條通道由上至下貫穿磁芯,並分佈在磁芯頂視面的中軸線兩側,以及兩個線圈,分別穿過磁芯的兩通道,其中,每個線圈具有第一端和第二端,並且至少第一端和第二端之一彎折後在垂直於線圈長度的平面上延展。According to one embodiment of the present invention, an inductor group for a power module includes: a magnetic core having a symmetrical structure in a top view, and having two channels penetrating the magnetic core from top to bottom and distributed on both sides of the central axis of the top view surface of the magnetic core, and two coils passing through the two channels of the magnetic core respectively, wherein each coil has a first end and a second end, and at least one of the first end and the second end is bent and extended on a plane perpendicular to the length of the coil.
根據本發明一實施例的電源模組,包括前述電感組,還包括:PCB頂板,位於電感組之上;以及兩個功率裝置晶片,位於PCB頂板之上,其中所述兩個功率裝置晶片均具有至少一個引腳通過PCB頂板電連接至相應的線圈。A power module according to an embodiment of the present invention includes the aforementioned inductor group, and also includes: a PCB top board located on the inductor group; and two power device chips located on the PCB top board, wherein the two power device chips each have at least one pin electrically connected to a corresponding coil through the PCB top board.
在一個實施例中,電源模組還包括PCB底板,位於電感組之下;以及連接器,連接PCB頂板和PCB底板,其中,連接器具有多個金屬柱,分別焊接至PCB頂板和PCB底板的相應焊盤。In one embodiment, the power module further includes a PCB bottom plate, located below the inductor group; and a connector, connecting the PCB top plate and the PCB bottom plate, wherein the connector has a plurality of metal pillars, which are respectively welded to corresponding pads of the PCB top plate and the PCB bottom plate.
本發明的具有夾層結構的電源模組具有如下優點:(1)與現有技術中平鋪結構的電源模組相比,能夠減少PCB板上的面積,從而提高負載電流/功率密度;(2)通過電感的腳(線圈)來傳輸輸出電流,能夠減少輸出電流回路在PCB板上的走線,避免PCB板走線的高阻抗,從而提高電路效率;以及(3)本發明電源模組的功率裝置晶片在上,電感組在下的結構可以極大地受益於GPU、CPU和ASIC系統中通常採用的頂部冷卻系統。The power module with sandwich structure of the present invention has the following advantages: (1) compared with the power module with flat structure in the prior art, it can reduce the area on the PCB board, thereby improving the load current/power density; (2) by transmitting the output current through the legs (coils) of the inductor, it can reduce the routing of the output current loop on the PCB board and avoid the high impedance of the PCB board routing, thereby improving the circuit efficiency; and (3) the structure of the power module of the present invention with the power device chip on the top and the inductor group on the bottom can greatly benefit from the top cooling system commonly used in GPU, CPU and ASIC systems.
在接下來的說明中,一些具體的細節,例如實施例中的具體電路結構和這些電路元件的具體參數,都用於對本發明的實施例提供更好的理解。本技術領域的技術人員可以理解,即使在缺少一些細節或者其他方法、元件、材料等結合的情況下,本發明的實施例也可以被實現。此外,本文所稱「耦接」的含義為直接連接,或通過其他電路元件,間接連接。In the following description, some specific details, such as the specific circuit structures in the embodiments and the specific parameters of these circuit elements, are used to provide a better understanding of the embodiments of the present invention. Those skilled in the art can understand that the embodiments of the present invention can be implemented even in the absence of some details or in the combination of other methods, elements, materials, etc. In addition, the meaning of "coupled" referred to herein is directly connected or indirectly connected through other circuit elements.
下面描述的實施例將以具體的實施器件和應用背景為例對本發明各實施例的器件和工作方式進行闡述,以使本領域技術人員能夠更好地理解本發明。然而本領域的技術人員應當理解,這些說明只是示例性的,並不用於限定本發明的範圍。The embodiments described below will use specific implementation devices and application backgrounds as examples to illustrate the devices and working methods of various embodiments of the present invention, so that those skilled in the art can better understand the present invention. However, those skilled in the art should understand that these descriptions are only exemplary and are not intended to limit the scope of the present invention.
圖1繪示了現有的多相電源轉換器10的電路結構示意圖。如圖1所示,多相電源轉換器10包括控制器101、N個功率裝置103和N個電感L1,其中N是整數,並且N>1。如圖1所示,每個功率級102,也稱作每一相102,包括一個功率裝置103和一個電感L1。每個功率裝置103包括功率開關M1、M2以及用於驅動功率開關M1、M2的驅動器DR1。控制器101提供N相控制信號105-1~105-N分別控制N個功率裝置103,以控制N相102錯相工作,也就是說,N個電感L1依次從輸入端汲取能量,並依次提供能量給負載104。應當理解,在圖1中,多相電源轉換器10的各相輸出連接在一起提供能量給負載只是其中一種應用。在其他應用中,多相電源轉換器10也可以以多個單相電源轉換器的方式工作,也就是說每一相均可以單獨連接一個獨立負載,並提供不同的輸出電壓以滿足不同負載的需求。FIG1 shows a schematic diagram of the circuit structure of an existing
圖1所示的具有BUCK拓撲的功率級102僅作示例。本領域普通技術人員應當明白,具有其他拓撲結構的功率級也適用於本發明實施例的多相電源轉換器。The
在下述本發明實施例中,電感L1可以用耦合電感來實現,也可以用N個單電感來實現。In the following embodiments of the present invention, the inductor L1 may be implemented by a coupled inductor or by N single inductors.
當N=2時,多相電源轉換器10被用作雙相電源轉換器,或兩個獨立的電源轉換器。When N=2, the
圖2繪示了根據本發明一實施例的整合了雙相電源轉換器的具有夾層結構的電源模組20的結構示意圖。在圖1中,當N=2時,功率級102可採用電源模組20來實現。夾層結構的電源模組20包括:印刷電路板(Printed Circuit Board,PCB)底板201,位於電源模組20的底部;電感組206,位於PCB底板201上,包括兩個電感,其中,每個電感具有第一端和第二端;PCB頂板202,位於電感組206上;連接器204,具有多個金屬柱205,每個金屬柱205分別焊接至PCB頂板202和PCB底板201上相應的焊盤;以及兩個功率裝置晶片203,位於PCB頂板202的頂部之上,其中,每個功率裝置晶片203具有一個或多個引腳,通過PCB頂板202連接至電感組206中的電感的第二端;其中,每個電感具有線圈207,線圈207的兩端彎折至與線圈207的長度方向相垂直的平面上,並在PCB頂板202和PCB底板201上延展。FIG2 shows a schematic diagram of a power module 20 with a sandwich structure that integrates a dual-phase power converter according to an embodiment of the present invention. In FIG1 , when N=2, the
在圖2中,電源模組20進一步包括位於PCB頂板202上的分離設置的其他元件208。元件208例如包括電源轉換器10中的各種電阻、電容等,例如電源轉換器10輸入端用於提供脈衝電流的輸入電容、用於給功率開關驅動器和內部邏輯電路供電的濾波電容和電阻等。In FIG2 , the power module 20 further includes other components 208 that are separately arranged on the PCB top board 202. The components 208 include, for example, various resistors, capacitors, etc. in the
在一個實施例中,金屬柱205包括銅柱,用於將PCB底板201焊接至PCB頂板202。本領域普通技術人員應當明白,任何可用於電連接兩個PCB板的金屬柱均可以用於本發明。In one embodiment, the metal pillar 205 includes a copper pillar for soldering the PCB bottom plate 201 to the PCB top plate 202. A person skilled in the art should understand that any metal pillar that can be used to electrically connect two PCB boards can be used in the present invention.
電源模組20通常置於處理器的主板上,用於給主板上的器件提供電源。PCB底板201被焊接在主板上,電源模組20的部分引腳通過PCB底板201焊接至主板。在部分實施例中,PCB底板201也可以省略。電源模組20可通過連接器204和電感組206直接焊接至主板。The power module 20 is usually placed on the mainboard of the processor to provide power to the components on the mainboard. The PCB base plate 201 is welded on the mainboard, and some pins of the power module 20 are welded to the mainboard through the PCB base plate 201. In some embodiments, the PCB base plate 201 can also be omitted. The power module 20 can be directly welded to the mainboard through the connector 204 and the inductor group 206.
在本發明中,功率裝置晶片疊在電感組之上,如圖2所示,從而節省了電源轉換器10在PCB板上的面積。每一個功率裝置晶片203整合了如圖1所示的功率裝置103,即包括如圖1所示的功率開關M1、M2以及用於驅動功率開關M1、M2的驅動器DR1,以及圖1中未繪示的與輔助線圈相連接的電路等。功率裝置晶片203的引腳焊接至PCB頂板202的焊盤,之後PCB頂板202的焊盤通過電感組206和連接器204,再電連接至PCB底板201的焊盤上。這樣,通過PCB底板201,即可與功率裝置晶片203電連接。電源模組20還包括金屬片209,用於傳導如參考地之類的大電流信號。金屬片209包裹著電感組206的磁芯的部分面積,並同時焊接至PCB頂板202和PCB底板201。金屬片209的位置取決於功率裝置晶片203的接地引腳的位置。在圖2實施例中,金屬片209主要包裹在電感組206的側面,其兩端彎折,在電感組206的上下表面形成靠近PCB板上相應焊盤的焊接區,從而在水平面,即PCB板的平面上,用大面積的金屬片209替代PCB走線走大電流,降低電路損耗,提高電路效率。In the present invention, the power device chip is stacked on the inductor group, as shown in FIG2, thereby saving the area of the
圖3繪示了根據本發明一實施例的電感組30的三維分解圖。電感組30可用作圖2電源模組中的電感組206。如圖3所示,電感組30包括:磁芯,包括第一磁芯部分301和第二磁芯部分302,其中第一磁芯部分301和第二磁芯部分302組合在一起,在兩者的接合面形成兩通道303-1和303-2;以及線圈304-1和304-2,分別穿過通道303-1和303-2。FIG3 shows a three-dimensional exploded view of an inductor assembly 30 according to an embodiment of the present invention. The inductor assembly 30 can be used as the inductor assembly 206 in the power module of FIG2. As shown in FIG3, the inductor assembly 30 includes: a magnetic core, including a first magnetic core portion 301 and a second magnetic core portion 302, wherein the first magnetic core portion 301 and the second magnetic core portion 302 are combined together to form two channels 303-1 and 303-2 at the joint surface of the first magnetic core portion 301 and the second magnetic core portion 302; and coils 304-1 and 304-2, passing through the channels 303-1 and 303-2 respectively.
在圖3實施例中,當電感組30應用於圖2所示的電源模組20時,通道303-1和303-2平行於PCB底板201和PCB頂板202,即通道303-1和303-2具有沿著如圖2所示的軸線“A”的徑向。In the embodiment of FIG. 3 , when the inductor assembly 30 is applied to the power module 20 shown in FIG. 2 , the channels 303 - 1 and 303 - 2 are parallel to the PCB bottom plate 201 and the PCB top plate 202 , that is, the channels 303 - 1 and 303 - 2 have a radial direction along the axis “A” shown in FIG. 2 .
在圖3實施例中,線圈304-1具有第一端304-3彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202表面延展,並焊接至PCB頂板202,具有第二端304-5彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201表面延展,並焊接至PCB底板201。也就是說,線圈304-1的第一端304-3和第二端304-5沿著垂直於磁芯通道303-1和303-2的平面延展,其延展面的側邊同時也在PCB頂板202和PCB底板201的表面延展。同樣地,線圈304-2具有第一端304-4彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202的表面延展,並焊接至PCB頂板202,具有第二端304-6彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201的表面延展,並焊接至PCB底板201。也就是說,線圈304-2的第一端304-4和第二端304-6沿著垂直於磁芯通道303-1和303-2的平面延展,其延展面的側邊同時也在PCB頂板202和PCB底板201的表面延展。In the embodiment of FIG. 3 , the coil 304-1 has a first end 304-3
在圖3實施例中,磁芯的第一磁芯部分301和第二磁芯部分302的形狀並不對稱一致,其中,第一磁芯部分301具有平面形狀,第二磁芯部分302具有兩條溝道,通道303-1和303-2分別由第二磁芯部分302的兩條溝道和第一磁芯部分301的一個面301-1構成,如圖3所示。In the embodiment of FIG. 3 , the shapes of the first core portion 301 and the second core portion 302 of the magnetic core are not symmetrical, wherein the first core portion 301 has a planar shape, and the second core portion 302 has two grooves, and channels 303-1 and 303-2 are respectively formed by the two grooves of the second core portion 302 and a surface 301-1 of the first core portion 301, as shown in FIG. 3 .
在圖3實施例中,金屬片305-1和305-2具有L型。金屬片305-1和305-2的兩端分別焊接至PCB頂板202和PCB底板201。金屬片305-1和305-2焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,也即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。In the embodiment of FIG. 3 , the metal sheets 305-1 and 305-2 have an L shape. The two ends of the metal sheets 305-1 and 305-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. The ends of the metal sheets 305-1 and 305-2 welded to the PCB top plate 202 are
圖4繪示了根據本發明一實施例的電感組40的三維分解圖。電感組40可用作圖2電源模組中的電感組206。如圖4所示,電感組40包括:磁芯,包括第一磁芯部分401和第二磁芯部分402,其中第一磁芯部分401和第二磁芯部分402組合在一起,在兩者的接合面形成兩通道403-1和403-2;以及線圈404-1和404-2,分別穿過通道403-1和403-2。FIG4 shows a three-dimensional exploded view of an
在圖4實施例中,當電感組40應用於圖2所示的電源模組20時,通道403-1和403-2垂直於PCB底板201和PCB頂板202,即通道403-1和403-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 4 , when the
在圖4實施例中,線圈404-1具有第一端404-3彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202表面延展,並焊接至PCB頂板202,具有第二端404-5彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201表面延展,並焊接至PCB底板201。也就是說,線圈404-1的第一端404-3和第二端404-5沿著垂直於磁芯通道403-1和403-2的平面延展,其延展面同時也在PCB頂板202和PCB底板201的表面延展。同樣地,線圈404-2具有第一端404-4彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB頂板202的表面延展,並焊接至PCB頂板202,具有第二端404-6彎折90度在磁芯的表面延展,並覆蓋部分表面,該延展部分同時也相當於在PCB底板201的表面延展,並焊接至PCB底板201。也就是說,線圈404-2的第一端404-4和第二端404-6沿著垂直於磁芯通道403-1和403-2的平面延展,其延展面同時也在PCB頂板202和PCB底板201的表面延展。In the embodiment of FIG. 4 , the coil 404-1 has a first end 404-3 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top board 202, and is soldered to the PCB top board 202, and has a second end 404-5 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom board 201, and is soldered to the PCB bottom board 201. In other words, the first end 404-3 and the second end 404-5 of the coil 404-1 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extended surface also extends on the surface of the PCB top board 202 and the PCB bottom board 201. Similarly, the coil 404-2 has a first end 404-4 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB top board 202 and soldered to the PCB top board 202, and has a second end 404-6 bent 90 degrees and extending on the surface of the magnetic core, and covering a part of the surface, and the extended part is also equivalent to extending on the surface of the PCB bottom board 201 and soldered to the PCB bottom board 201. In other words, the first end 404-4 and the second end 404-6 of the coil 404-2 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and the extension surface also extends on the surface of the PCB top board 202 and the PCB bottom board 201.
在部分實施例中,線圈404-1的第二端404-5和線圈404-2的第二端404-6可以不彎折。線圈的第二端是否彎折,彎折的方向及延展面的形狀等,取決於PCB底板201上的相應的焊盤的位置,或無PCB底板202,則取決於電源模組20所處的主板上的相應焊盤的位置。In some embodiments, the second end 404-5 of the coil 404-1 and the second end 404-6 of the coil 404-2 may not be bent. Whether the second end of the coil is bent, the direction of the bend and the shape of the extended surface, etc., depends on the position of the corresponding pad on the PCB bottom plate 201, or if there is no PCB bottom plate 202, it depends on the position of the corresponding pad on the main board where the power module 20 is located.
在圖4實施例中,磁芯的第一磁芯部分401和第二磁芯部分402的形狀並不對稱一致,其中,第一磁芯部分401具有平面形狀,第二磁芯部分402具有兩條溝道,通道403-1和403-2分別由第二磁芯部分402的兩條溝道和第一磁芯部分401的一個面401-1構成。In the embodiment of FIG. 4 , the shapes of the
在圖4實施例中,金屬片405-1和405-2具有C型。金屬片405-1和405-2的兩端分別焊接至PCB頂板202和PCB底板201。金屬片405-1和405-2焊接至PCB底板201的一端彎折90度,並在磁芯表面延展,也即相當於在PCB底板201的表面延展,該延展面與PCB底板201的相應焊盤相焊接,以此來減少PCB底板201的走線及其走線阻抗。同樣的,金屬片405-1和405-2焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。In the embodiment of FIG. 4 , the metal sheets 405-1 and 405-2 have a C-shape. The two ends of the metal sheets 405-1 and 405-2 are respectively welded to the PCB top plate 202 and the PCB bottom plate 201. One end of the metal sheets 405-1 and 405-2 welded to the PCB bottom plate 201 is bent 90 degrees and extended on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB bottom plate 201. The extended surface is welded to the corresponding pad of the PCB bottom plate 201, thereby reducing the routing of the PCB bottom plate 201 and its routing impedance. Similarly, the metal sheets 405-1 and 405-2 are welded to one end of the PCB top plate 202 and bent 90 degrees to extend on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202, and are electrically connected to the ground pin of the power device chip 203 through the solder pad of the PCB top plate 202, thereby reducing the routing of the PCB top plate 202 and its routing impedance.
圖5繪示了根據本發明一實施例的電感組50的三維分解圖。電感組50可用作圖2電源模組中的電感組206。如圖5所示,電感組50包括:磁芯,包括第一磁芯部分501和第二磁芯部分502,其中第一磁芯部分501和第二磁芯部分502組合在一起,在兩者的接合面形成兩通道503-1和503-2;以及線圈504-1和504-2,分別穿過通道503-1和503-2。FIG5 shows a three-dimensional exploded view of an
在圖5實施例中,當電感組50應用於圖2所示的電源模組20時,通道503-1和503-2垂直於PCB底板201和PCB頂板202,即通道503-1和503-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 5 , when the
在圖5實施例中,金屬片505具有C型。金屬片505的兩端分別焊接至PCB頂板202和PCB底板201。金屬片505焊接至PCB底板201的一端彎折90度,並在磁芯表面延展,即相當於在PCB底板201的表面延展,該延展面與PCB底板201的相應焊盤相焊接,以此來減少PCB底板201的走線及其走線阻抗。同樣的,金屬片505焊接至PCB頂板202的一端彎折90度,在磁芯表面延展,即相當於在PCB頂板202的表面延展,並通過PCB頂板202的焊盤與功率裝置晶片203的接地引腳電連接,以此來減少PCB頂板202的走線及其走線阻抗。在圖5實施例中,金屬片505包裹磁芯側面的部分盡可能延展,增大面積,以減少自身阻抗。In the embodiment of FIG. 5 , the
與圖4所示的電感組40相比,圖5中的電感組50具有單片金屬片505用於電連接功率裝置晶片203的接地引腳至PCB底板201。與圖4相比,圖5中少了一金屬片,因此金屬片505以及線圈504-1和504-2在磁芯的上下表面可延展的面積更大,從而使功率裝置晶片203的接地引腳的分佈具有更大的靈活性。Compared with the
圖5中,磁芯的第一磁芯部分501和第二磁芯部分502與圖4中的磁芯結構相似,為敘述簡明之故,此處不再展開說明。In FIG. 5 , the first
圖6繪示了根據本發明一實施例的磁芯60的結構示意圖。在圖6中,磁芯60包括形狀對稱一致的第一磁芯部分601和第二磁芯部分602,其中,每個磁芯部分具有兩條溝道。當磁芯60用於圖3-圖5實施例的電感組時,兩個磁芯部分的溝道相覆合,形成兩條通道,以使線圈從中穿過。FIG6 shows a schematic diagram of the structure of a
圖7繪示了根據本發明一實施例的磁芯70的結構示意圖。在圖7中,磁芯70包括第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1~703-3。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1及703-2構建了第一通道704-1。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-2及703-3構建了第二通道704-2。從圖7中可看出,當有更多的第三磁芯部分時,可以構建更多的磁芯通道。第一磁芯部分701、第二磁芯部分702和第三磁芯部分703-1~703-3可以由不同的材料製作而成,從而提供更加靈活可調的電感-電流曲線。FIG. 7 shows a schematic diagram of the structure of a
在本發明的部分實施例中,磁芯的各磁芯部分可以由同種材料製作,但具有不同的形狀,也可以由不同的材料製作而成,如鐵氧體、鐵粉或其他合適的材料等,以期實現所需的電感-電流特性曲線,例如,在小電流時具有大電感值,在大電流時具有小電感值。小電流時具有大電感值可以使系統效率更高,而大電流時小電感值則可使系統的瞬態更好。In some embodiments of the present invention, the core parts of the magnetic core can be made of the same material but have different shapes, or made of different materials, such as ferrite, iron powder or other suitable materials, in order to achieve the desired inductance-current characteristic curve, for example, a large inductance value at a small current and a small inductance value at a large current. A large inductance value at a small current can make the system more efficient, while a small inductance value at a large current can make the system transient better.
為簡明闡述本發明原理之故,圖3-圖5的實施例中僅繪示具有雙通道,可以穿過雙線圈的磁芯。本領域普通技術人員應當知道,根據應用的需要,磁芯可以具有任意數量的通道,穿過任意數量的線圈,單通道或多通道均符合本發明主旨。For the purpose of briefly explaining the principle of the present invention, the embodiments of FIG. 3 to FIG. 5 only show a magnetic core having two channels through which two coils can be passed. A person skilled in the art should know that, according to the needs of the application, the magnetic core can have any number of channels through which any number of coils can be passed, and single or multiple channels are in line with the subject matter of the present invention.
在部分實施例中,在磁芯的不同磁芯部分之間可以存在氣隙以形成耦合電感。在部分實施例中,各磁芯部分之間沒有氣隙,從而形成多個單電感。In some embodiments, there may be air gaps between different core parts of the magnetic core to form coupled inductors. In some embodiments, there are no air gaps between the core parts, thereby forming multiple single inductors.
在本發明中,為了使電感組模組的表面平整,覆蓋磁芯表面的線圈及金屬片嵌入磁芯表面,如圖3~5所示。In the present invention, in order to make the surface of the inductor module flat, the coil and metal sheet covering the surface of the magnetic core are embedded in the surface of the magnetic core, as shown in Figures 3 to 5.
圖8繪示了根據本發明一實施例的電感80的三維分解圖。電感80可用作圖2電源模組中的電感206。如圖8所示,電感80包括:磁芯,包括第一磁芯部分801、第二磁芯部分802和第三磁芯部分803,其中,在第一磁芯部分801與第二磁芯部分802的相對面之間,以及第一磁芯部分801和第三磁芯部分803的相對面之間,分別形成通道801-1和801-2;以及線圈804-1和804-2分別穿過通道801-1和801-2。FIG8 shows a three-dimensional exploded view of an
在圖8實施例中,當電感80應用於圖2所示的電源模組20時,通道801-1和801-2垂直於PCB底板201和PCB頂板202,即通道801-1和801-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 8 , when the
在圖8實施例中,線圈804-1具有第一端804-3和第二端804-5。第一端804-3彎折90度,在磁芯的上表面延展並覆蓋部分磁芯上表面,第二端804-5與磁芯的下表面齊平。也就是說,第一端804-3在垂直於通道801-1和801-2的面上延展,並且該延展面被焊接到PCB頂板202。第二端804-5並無延展,直接焊接至PCB底板201。同樣的,線圈804-2具有第一端804-4和第二端804-6。第一端804-4彎折90度,向磁芯的上表面延伸並覆蓋部分磁芯上表面,第二端804-6與磁芯的下表面齊平。也就是說,第一端804-4在垂直於通道801-1和801-2的面上延展,並且該延展面被焊接到PCB頂板202。第二端804-6並無延展,直接焊接至PCB底板201。In the embodiment of FIG. 8 , the coil 804-1 has a first end 804-3 and a second end 804-5. The first end 804-3 is bent 90 degrees, extends on the upper surface of the magnetic core and covers a portion of the upper surface of the magnetic core, and the second end 804-5 is flush with the lower surface of the magnetic core. In other words, the first end 804-3 extends on a surface perpendicular to the channels 801-1 and 801-2, and the extended surface is welded to the PCB top plate 202. The second end 804-5 is not extended and is directly welded to the PCB bottom plate 201. Similarly, the coil 804-2 has a first end 804-4 and a second end 804-6. The first end 804-4 is bent 90 degrees, extends toward the upper surface of the magnetic core and covers a portion of the upper surface of the magnetic core, and the second end 804-6 is flush with the lower surface of the magnetic core. That is, the first end 804-4 extends on a surface perpendicular to the channels 801-1 and 801-2, and the extended surface is soldered to the PCB top plate 202. The second end 804-6 is not extended and is directly soldered to the PCB bottom plate 201.
在部分實施例中,線圈804-1的第二端804-5,以及線圈804-2的第二端804-6也可以同線圈804-1的第一端804-3及線圈804-2的第一端804-4一樣,彎折90度,在磁芯的下表面上延展。線圈的第二端是否彎折並延展,及其延展的方向和大小取決於電源模組的PCB底板上的相應焊盤的位置,若無PCB底板,則取決於電源模組所處的主板上的相應焊盤的位置。In some embodiments, the second end 804-5 of the coil 804-1 and the second end 804-6 of the coil 804-2 can also be bent 90 degrees and extended on the lower surface of the magnetic core, like the first end 804-3 of the coil 804-1 and the first end 804-4 of the coil 804-2. Whether the second end of the coil is bent and extended, and the direction and size of the extension depend on the position of the corresponding pad on the PCB bottom board of the power module. If there is no PCB bottom board, it depends on the position of the corresponding pad on the main board where the power module is located.
在圖8實施例中,磁芯包括第一磁芯部分801、第二磁芯部分802和第三磁芯部分803。從上往下看,第一磁芯部分801呈“H”型,兩條溝道分別處於第一磁芯部分801的兩個相背的側面。第二磁芯部分802和第三磁芯部分803呈長條形,分別嵌入兩條溝道,但不完全貼合,留出部分溝道空間形成通道801-1和801-2。在其他實施例中,第一磁芯部分801也可以具有其他在相背的兩個側面分佈溝道的對稱結構。In the embodiment of FIG8 , the magnetic core includes a first
為了使電感-電流特性曲線更加靈活可調,第一磁芯部分801、第二磁芯部分802和第三磁芯部分803可以採用不同的材料。例如,第一磁芯部分801可以是鐵氧體,第二磁芯部分802和第三磁芯部分803可以是鐵粉。應當理解,本領域技術人員可以根據應用所需的電感-電流特性曲線來選擇不同的磁芯材料。In order to make the inductance-current characteristic curve more flexible and adjustable, the first
在圖8實施例中,金屬片805-1、805-2和806從側面看呈“C”型。金屬片805-1、805-2和806用於焊接PCB頂板202和PCB底板201。如圖8所示,金屬片805-1、805-2和806的兩端均彎折90度並沿著PCB頂板202和PCB底板201延展。所述延展面焊接至PCB頂板202和PCB底板201的相應焊盤,從而可節省PCB板的內部走線,最小化PCB板內部走線帶來的高阻抗。在一個實施例中,所述金屬片805-1和805-2用於將功率裝置晶片203的接地引腳,通過PCB頂板202,電連接至PCB底板201或主板上。金屬片806用於將功率裝置晶片203的電源引腳(圖1所示的用於接收輸入電壓Vin的埠所對應的引腳),通過PCB頂板202,電連接至PCB底板201或主板上。In the embodiment of FIG8 , the metal sheets 805-1, 805-2 and 806 are in a “C” shape when viewed from the side. The metal sheets 805-1, 805-2 and 806 are used to weld the PCB top plate 202 and the PCB bottom plate 201. As shown in FIG8 , both ends of the metal sheets 805-1, 805-2 and 806 are bent 90 degrees and extended along the PCB top plate 202 and the PCB bottom plate 201. The extended surface is welded to the corresponding pads of the PCB top plate 202 and the PCB bottom plate 201, thereby saving the internal wiring of the PCB board and minimizing the high impedance caused by the internal wiring of the PCB board. In one embodiment, the metal sheets 805-1 and 805-2 are used to electrically connect the ground pins of the power device chip 203 to the PCB bottom plate 201 or the main board through the PCB top plate 202. The
圖9繪示了根據本發明一實施例的電感90的三維分解圖。電感90可用作圖2電源模組中的電感206。如圖9所示,電感90包括:磁芯901,頂視具有對稱結構,兩條通道901-1和901-2由上至下貫穿磁芯901,並且對稱地分佈在頂視面的中軸線“D”兩側;以及線圈902-1和902-2,分別穿過通道901-1和901-2。FIG9 shows a three-dimensional exploded view of an
在圖9實施例中,當電感90應用於圖2所示的電源模組20時,通道901-1和901-2垂直於PCB底板201和PCB頂板202,即通道901-1和901-2具有沿著如圖2所示的軸線“B”的徑向。In the embodiment of FIG. 9 , when the
在圖9實施例中,線圈902-1具有第一端902-3和第二端902-5。第一端902-3彎折90度,向磁芯的上表面延展並覆蓋部分磁芯上表面,第二端902-5與磁芯的下表面齊平。也就是說,第一端902-3在垂直於通道901-1和901-2的面上延展,並且該延展面被焊接到PCB頂板202。第二端902-5並無延展,直接焊接至PCB底板201。同樣的,線圈902-2具有第一端902-4和第二端902-6。第一端902-4彎折90度,向磁芯的上表面延展並覆蓋部分磁芯上表面,第二端902-6與磁芯的下表面齊平。也就是說,第一端902-4在垂直於通道901-1和901-2的面上延展,並且該延展面被焊接到PCB頂板202。第二端902-6並無延展,直接焊接至PCB底板201。In the embodiment of FIG. 9 , the coil 902-1 has a first end 902-3 and a second end 902-5. The first end 902-3 is bent 90 degrees, extending toward the upper surface of the magnetic core and covering a portion of the upper surface of the magnetic core, and the second end 902-5 is flush with the lower surface of the magnetic core. In other words, the first end 902-3 is extended on a surface perpendicular to the channels 901-1 and 901-2, and the extended surface is welded to the PCB top plate 202. The second end 902-5 is not extended, but is directly welded to the PCB bottom plate 201. Similarly, the coil 902-2 has a first end 902-4 and a second end 902-6. The first end 902-4 is bent 90 degrees, extending toward the upper surface of the magnetic core and covering a portion of the upper surface of the magnetic core, and the second end 902-6 is flush with the lower surface of the magnetic core. That is, the first end 902-4 extends on a surface perpendicular to the channels 901-1 and 901-2, and the extended surface is soldered to the PCB top plate 202. The second end 902-6 is not extended and is directly soldered to the PCB bottom plate 201.
在部分實施例中,線圈902-1的第二端902-5,以及線圈902-2的第二端902-6也可以同線圈902-1的第一端902-3及線圈902-2的第一端902-4一樣,彎折90度,在磁芯的下表面上延展。線圈的第二端是否彎折並延展,及其延展的方向和大小取決於電源模組的PCB底板上的相應焊盤的位置,若無PCB底板,則取決於電源模組所處的主板上的相應焊盤的位置。In some embodiments, the second end 902-5 of the coil 902-1 and the second end 902-6 of the coil 902-2 can also be bent 90 degrees and extended on the lower surface of the magnetic core, like the first end 902-3 of the coil 902-1 and the first end 902-4 of the coil 902-2. Whether the second end of the coil is bent and extended, and the direction and size of the extension depend on the position of the corresponding pad on the PCB bottom board of the power module. If there is no PCB bottom board, it depends on the position of the corresponding pad on the main board where the power module is located.
在圖9實施例中,金屬片903-1、903-2和904從側面看呈“C”型。金屬片903-1、903-2和904用於焊接PCB頂板202和PCB底板201。如圖9所示,金屬片903-1、903-2和904的兩端均彎折90度並沿著PCB頂板202和PCB底板201延展。延展面焊接至PCB頂板202和PCB底板201的相應焊盤,從而可節省PCB板的內部走線,最小化PCB板內部走線帶來的高阻抗。在一個實施例中,金屬片903-1和903-2用於將功率裝置晶片203的接地引腳,通過PCB頂板202,電連接至PCB底板201或主板上。金屬片904用於將功率裝置晶片203的電源引腳(圖1所示的用於接收輸入電壓Vin的引腳),通過PCB頂板202,電連接至PCB底板201或主板上。In the embodiment of FIG. 9 , the metal sheets 903-1, 903-2 and 904 are in a “C” shape when viewed from the side. The metal sheets 903-1, 903-2 and 904 are used to weld the PCB top plate 202 and the PCB bottom plate 201. As shown in FIG. 9 , both ends of the metal sheets 903-1, 903-2 and 904 are bent 90 degrees and extended along the PCB top plate 202 and the PCB bottom plate 201. The extended surface is welded to the corresponding pads of the PCB top plate 202 and the PCB bottom plate 201, thereby saving the internal wiring of the PCB board and minimizing the high impedance caused by the internal wiring of the PCB board. In one embodiment, metal sheets 903-1 and 903-2 are used to electrically connect the ground pins of the power device chip 203 to the PCB bottom plate 201 or the main board through the PCB top plate 202.
圖10繪示了根據本發明一實施例的電感100的三維分解圖。電感100可用作圖2電源模組中的電感206。如圖10所示,電感100包括:磁芯1001,頂視具有對稱結構,兩條通道1001-1和1001-2由上至下貫穿磁芯1001,並且對稱地分佈在頂視面的中軸線“D”兩側,其中,沿著通道1001-1和1001-2的磁芯外臂1001-5和1001-6上,分別分佈著兩道氣隙1001-3和1001-4;以及線圈1002-1和1002-2分別穿過通道1001-1和1001-2。FIG10 shows a three-dimensional exploded view of an
圖10中的電感100與圖9中的電感90類似,此處不再展開細述。兩者的差別主要在於圖10中的磁芯1001具有氣隙,因此比圖9中的磁芯901的磁阻更大。The
在本發明的各實施例中,磁芯或是磁芯的各個組成部分,最後組成一個立方體結構。本領域的技術人員應當知道,任何具有對稱的頂視面的磁芯都可以用於本發明,例如圓柱、六棱柱等等。In various embodiments of the present invention, the magnetic core or various components of the magnetic core finally form a cubic structure. Those skilled in the art should know that any magnetic core with a symmetrical top view can be used in the present invention, such as a cylinder, a hexagonal prism, etc.
在部分實施例中,圖8-10中的電感中覆於外表面的金屬層可以具有其他形狀,例如L型,也就是說金屬層的第一端彎折延展並焊接至PCB頂板,如圖3所示的金屬層305-1和305-2,第二端則無彎折。在部分實施例中,L型的金屬層也可以是第二端彎折延展並焊接至PCB底板或主板,即如圖3所示的金屬層305-1和305-2上下倒置,第一端則無彎折。In some embodiments, the metal layer covering the outer surface of the inductor in FIGS. 8-10 may have other shapes, such as L-shaped, that is, the first end of the metal layer is bent and extended and soldered to the PCB top board, such as the metal layers 305-1 and 305-2 shown in FIG3, and the second end is not bent. In some embodiments, the L-shaped metal layer may also be bent and extended at the second end and soldered to the PCB bottom board or main board, that is, the metal layers 305-1 and 305-2 shown in FIG3 are inverted, and the first end is not bent.
在本發明中,為了使電感的外表面平整,線圈裸露於電感外表面的部分以及覆蓋於電感外表面的金屬層,嵌入至電感的外表面,如圖3~5及8~10所示。In the present invention, in order to make the outer surface of the inductor flat, the portion of the coil exposed on the outer surface of the inductor and the metal layer covering the outer surface of the inductor are embedded into the outer surface of the inductor, as shown in FIGS. 3-5 and 8-10.
綜上,本發明的許多更改和變型方式顯然也是可行的。因此,應當理解的是,在申請專利範圍所限定的範圍內,本發明可以不用按照上述特定的描述來實施。同樣應當理解的是,上述公開只涉及到本發明一些優選實施例,在不脫離本發明申請專利範圍所限定的精神和範圍的前提下,可以對本發明作出更改。當只有一個優選實施例被公開,本領域普通技術人員不難想到其變型並將其付諸於實施,而不脫離於本發明申請專利範圍所限定的精神與範圍。In summary, many changes and variations of the present invention are obviously feasible. Therefore, it should be understood that within the scope defined by the patent application, the present invention may not be implemented according to the above specific description. It should also be understood that the above disclosure only relates to some preferred embodiments of the present invention, and changes may be made to the present invention without departing from the spirit and scope defined by the patent application of the present invention. When only one preferred embodiment is disclosed, it is not difficult for ordinary technicians in this field to think of its variations and put them into practice without departing from the spirit and scope defined by the patent application of the present invention.
10:多相電源轉換器 101:控制器 102:功率級 103:功率裝置 104:負載 M1,M2:功率開關 DR1:驅動器 L1,80,90,100:電感 20:電源模組 201:PCB底板 202:PCB頂板 203:功率裝置晶片 204:連接器 205:金屬柱 206:電感組 207,304-1,304-2,404-1,404-2,504-1,504-2,804-1,804-2,902-1,902-2,1002-1,1002-2:線圈 208:元件 209,305-1,305-2,405-1,405-2,505,805-1,805-2,806,902-1,903-2,904,1003-1,1003-2:金屬片 30,40,50:電感組 301,302,401,402,501,502,601,602,701,702,703-1,703-2,703-3,801,802,803:磁芯部分 303-1,303-2,403-1,403-2,503-1,503-2,704-1,704-2,801-1,801-2,901-1,901-2,1001-1,1001-2:通道 304-3,304-4,304-5,304-6,404-3,404-4,404-5,404-6,504-3,504-4,504-5,504-6,804-3,804-4,804-5,804-6,902-3,902-4,902-5,902-6,1002-3,1002-4,1002-5,1002-6:端點 301-1,401-1,501-1:面 60,70,901,1001:磁芯 1001-5,1001-6:磁芯外臂 1001-3,1001-4:氣隙 105-1~105-N:控制信號 10: Multiphase power converter 101: Controller 102: Power stage 103: Power device 104: Load M1, M2: Power switch DR1: Driver L1, 80, 90, 100: Inductor 20: Power module 201: PCB bottom plate 202: PCB top plate 203: Power device chip 204: Connector 205: Metal pillar 206: Inductor assembly 207, 304-1, 304-2, 404-1, 404-2, 504-1, 504-2, 804-1, 804-2, 902-1, 902-2, 1002-1, 1002-2: Coil 208: Components 209,305-1,305-2,405-1,405-2,505,805-1,805-2,806,902-1,903-2,904,1003-1,1003-2:Metal sheet 30,40,50:Inductor assembly 301,302,401,402,501,502,601,602,701,702,703-1,703-2,703-3,801,802,803:Core part 303-1,303-2,403-1,403-2,503-1,503-2,704-1,704-2,801-1,801-2,901-1,901-2,1001-1,1001-2: Channel 304-3,304-4,304-5,304-6,404-3,404-4,404-5,404-6,504-3,504-4,504-5,504-6,804-3,804-4,804-5,804-6,902-3,902-4,902-5,902-6,1002-3,1002-4,1002-5,1002-6: Endpoint 301-1,401-1,501-1: Surface 60,70,901,1001: Magnetic core 1001-5,1001-6: Magnetic core outer arm 1001-3,1001-4: Air gap 105-1~105-N: Control signal
為了更好的理解本發明,將根據以下附圖對本揭露進行詳細描述。其中相同的元件具有相同的附圖標記。以下附圖僅用於說明,因此可能僅繪示裝置的一部份,並且不一定按實際比例繪製。
[圖1]繪示了現有的多相電源轉換器10的電路示意圖;
[圖2]繪示了根據本發明一實施例的整合了雙相電源轉換器的具有夾層結構的電源模組20的示意圖;
[圖3]繪示了根據本發明一實施例的電感組30的三維分解圖;
[圖4]繪示了根據本發明一實施例的電感組40的三維分解圖;
[圖5]繪示了根據本發明一實施例的電感組50的三維分解圖;
[圖6]繪示了根據本發明一實施例的磁芯60的結構示意圖;
[圖7]繪示了根據本發明一實施例的磁芯70的結構示意圖;
[圖8]繪示了根據本發明一實施例的電感組80的三維分解圖;
[圖9]繪示了根據本發明一實施例的電感組90的三維分解圖;
[圖10]繪示了根據本發明一實施例的電感組100的三維分解圖。
In order to better understand the present invention, the present disclosure will be described in detail according to the following drawings. The same components have the same drawing numbers. The following drawings are for illustration only and may only show part of the device and may not be drawn to actual scale.
[Figure 1] shows a circuit diagram of an existing
80:電感 80: Inductor
801,802,803:磁芯部分 801,802,803: Magnetic core part
801-1,801-2:通道 801-1,801-2: Channel
804-1,804-2:線圈 804-1,804-2: Coil
804-3,804-4,804-5,804-6:端點 804-3,804-4,804-5,804-6: Endpoints
805-1,805-2,806:金屬片 805-1,805-2,806:Metal sheet
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| US17/588,630 | 2022-01-31 |
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