TWI884093B - Supply duct for test chamber - Google Patents

Abstract

The present invention relates to a technology for regulating the temperature of electronic components contained in a test chamber used for testing electronic components. According to the present invention, a supply duct for supplying temperature-regulating air to a containing space of the test chamber is formed by a guide portion, a discharge portion, and a connection portion, and the moving direction of the temperature-regulating air is converted at the connection portion, thereby realizing uniform supply of air at each position of the containing space, and a spray duct for spraying temperature-regulating air is provided in the containing space in a state of facing a test board one-to-one, thereby realizing tight temperature control of the electronic components, thereby improving the reliability of the test.

Description

Supply tubing for test chambers

The present invention relates to a test board capable of loading electronic components and electrically connected to a test machine, and a test chamber capable of adjusting the temperature of the electronic components electrically connected to the test machine after accommodating the test board.

The electronic components produced are tested by testing machines and classified into good and bad products, and only good products are shipped.

Since electronic components can be used in a variety of environments, it is necessary to maintain a harsh high-temperature temperature environment when testing electronic components. Therefore, the electronic components are housed in a containment space within a sealable test chamber, and thermal stress is applied to the electronic components by keeping the containment space in a harsh temperature environment. Of course, the electronic components are electrically connected to the test machine while in the containment space. Of course, since a harsh temperature environment is not necessarily a high-temperature environment, it may also be a low-temperature environment, and the daily temperature environment may be a normal temperature, all equipment that can test various situations is required.

In addition, the electrical connection distance between the tester and the electronic components should be as short as possible. The reason is that if the electrical connection distance between the tester and the electronic components is long, the electrical signal may be distorted or noisy, and data may be lost, making it difficult to ensure the reliability of the test.

Of course, there are tests that do not cause any particular problems even if the electrical connection distance between the tester and the electronic component is long. However, there are also tests that may cause the above-mentioned problems if the electrical connection distance between the tester and the electronic component is long and require high-speed testing.

For example, in the case of a long-time burn-in test, even if the electrical connection distance between the tester and the electronic component is long, no particular problems have occurred so far. Here, the burn-in test is a test performed under a high temperature (85 to 125 degrees) stress to the electronic component in order to find potential defects in the electronic component. The reason is that there has been no high-speed test in the burn-in test step, and there has been no need to perform it.

Burn-in testing not only applies high temperature, but also applies electrical stress such as voltage and current higher than the actual use conditions of electronic components for a long time. For such a burn-in test, a test machine, a burn-in board, and a burn-in chamber are required.

A burn-in board is a type of test board that can load a plurality of electronic components and be electrically connected to a tester. The burn-in board has placement sockets, circuits, and connectors for electrically connecting the electronic components to the tester.

A burn-in chamber is a type of test chamber that has a storage space for storing a test board carrying electronic components, and can establish a temperature environment for applying thermal stress to the electronic components stored in the storage space.

FIG. 1 illustrates a structure in which a burn-in board BIB housed in a burn-in chamber is electrically connected to a tester TESTER.

As shown in FIG. 1 , in order to electrically connect the electronic component D to the tester TESTER, it is necessary to equip the terminal for placing the socket S (see FIG. 2 ), the circuit EC, the connector C, and the connection component CE (a connection portion existing in a path passing through the wall of the burn-in chamber). That is, the distance of the connection circuit for connecting the electronic component D to the tester TESTER is long, and multiple connection elements are interposed. Therefore, it is impossible to perform a test that may cause problems if the electrical connection distance between the tester TESTER and the electronic component D is long, or a test that requires a quick and immediate response, through the existing burn-in tester.

For example, for electronic components such as memory semiconductor elements, unlike in the past, additional test items related to electronic components are required, which require not only simple ON/OFF level tests, but also tests on how fast data can be read or stored (for example, large-capacity data such as videos), how fast it can be displayed on the screen, and whether it can operate normally. In addition, these tests need to be performed in a very short time, so the connection distance between the electronic components and the tester must be short. Therefore, in addition to the burn-in test system, other additional test systems are required, which leads to waste of resources, time and manpower.

Furthermore, with the development of electronic components, the possibility cannot be ruled out that the circuit EC of the burn-in board has various electronic components required for testing, in which case the various electronic components are exposed to the harsh temperature environment established in the containment space of the test chamber, which may cause damage or shorten the life.

In addition, tests that require a shorter time or tests due to upgrades or additional test projects of electronic components may require more precise control of the temperature of electronic components. Since the temperature of the tested electronic components is related to the reliability of the test, the temperature conditions for each electronic component required in various tests need to be accurately managed to avoid exceeding the allowable error range. [Prior Art Literature]

[Patent Documents] Korean Granted Patent 10-1164116 Korean Publication Patent 10-2003-0029266 Korean Publication Patent 10-2005-0055685

The present invention has the following objects.

First, a technique is provided to prevent the circuits of the test board from being stimulated by the surrounding heat.

Second, a technology for a test chamber is provided in which an auxiliary test different from a main test performed by a tester is performed on an electronic component while the electronic component is housed in the test chamber.

Third, a technology is provided that enables a response signal to be appropriately sent from an electronic component to an electrical connection tester even if noise or the like may occur in a connection circuit between the electrical connection tester and the electronic component.

Fourth, a technology is provided that can realize real-time temperature control of electronic components in consideration of the situation where a test is performed quickly in a short time.

Fifth, a technology is provided that enables all electronic components to be tested under the same temperature regulation as much as possible even if the electronic components housed in the test chamber are located in independent and separated spaces.

According to the first form of the test board of the present invention, it includes: a board body, which carries electronic components and has a circuit for relaying electrical signals between the electronic components and a tester; a connector, which is coupled to one side of the board body and electrically connected to the circuit, and is electrically connected to the tester, thereby electrically connecting the circuit to the tester; and a mask material, which forms an insulating space on the opposite side of the surface carrying the electronic components in order to prevent the electronic components located in the circuit from being subjected to external heat, wherein the electronic components located in the circuit are exposed to the side of the insulating space.

The circuit includes at least any one of the following components: an auxiliary tester electrically connected to the electronic components mounted on the board body, and performing auxiliary tests on the electronic components that are different from the main tests performed by the tester; or an amplifier electrically connected to the electronic components mounted on the board body, and amplifying response signals from the electronic components to the tester and sending them to the tester, wherein the response signal is feedback to the test signal applied from the tester to the electronic components.

The mask material has a supply hole for supplying a temperature-adjusting fluid to the heat-insulating space, and a recovery hole for recovering the temperature-adjusting fluid used to adjust the temperature of the electronic components located in the circuit from the heat-insulating space.

The mask material may include a transfer plate for transferring cool air to the electronic components.

The transfer plate is a metal material with good thermal conductivity. In the mask material, the periphery of the transfer plate is formed by an insulator, so that the cold air existing in the transfer plate is concentrated and conducted toward the electronic components located in the circuit.

The test board according to the second form of the present invention comprises: a board body, which carries electronic components and has a circuit for relaying electrical signals between the electronic components and the tester; and a connector, which is coupled to one side of the board body and electrically connected to the circuit, and is also electrically connected to the tester, thereby electrically connecting the circuit to the tester, wherein the circuit includes at least any one of the following components: an auxiliary tester, and An electronic component mounted on the board body is electrically connected to perform an auxiliary test on the electronic component that is different from the main test performed by the tester; or an amplifier is electrically connected to the electronic component mounted on the board body to amplify a response signal from the electronic component to the tester and send it to the tester, wherein the response signal is feedback to the test signal applied from the tester to the electronic component.

According to the first form of the test chamber of the present invention, the test chamber comprises: a chamber body having a storage space with one side open and used to store a test board loaded with electronic components; and a temperature regulating device used to regulate the temperature of the electronic components loaded on the test board stored in the chamber body, wherein the chamber body has: a support rail used to support the test board stored in the storage space, and the support rail is configured to be divided into: a first area, if the test board is stored in the storage space, the storage space is temperature-regulated by the temperature regulating device; a second area separated from the first area, the electronic components loaded on the test board are exposed to the side of the first area, and the second area is blocked from air exchange with the first area by the test board.

The chamber body further includes: an injection pipe for injecting a temperature regulating fluid for regulating the temperature of the second region into the second region; and an intake pipe for inhaling the temperature regulating fluid supplied through the injection pipe from the second region.

The test plate is the test plate mentioned above, and the chamber body further includes: a supply pipe for supplying a temperature regulating fluid of a predetermined temperature to an insulating space located in the test plate; and a recovery pipe for recovering the temperature regulating fluid supplied to the insulating space through the supply pipe.

The temperatures of the first area, the heat-insulating space, and the second area can be controlled differently from each other. Alternatively, when testing at a high temperature, the temperature of the first area can be controlled to be the highest, and the temperature of the heat-insulating space can be controlled to be lower than the temperature of the second area. When testing at a low temperature, the temperature of the first area can be controlled to be the lowest, and the temperature of the heat-insulating space can be higher than or equal to the temperature of the second area.

It also includes: an opening and closing door, which opens or closes the receiving space by opening and closing one side of the chamber body, wherein the first area and the second area are open to the side of the opening and closing door, and by opening and closing the opening and closing door, the first area and the second area are also opened or closed to the side of the opening and closing door.

The chamber body further includes a buffer plate, which divides the second area into two parts, thereby forming a heat insulation space toward the test plate side and a buffer space toward the opposite side of the test plate.

The chamber body also includes at least any one of the following structures: an auxiliary test machine, which is electrically connected to the test board contained in the containing space, and performs auxiliary tests on the electronic components that are different from the main tests performed by the test machine; or an amplifier, which is electrically connected to the test board contained in the containing space, and amplifies the response signal from the electronic components to the test machine and sends it to the test machine, wherein the response signal is feedback for the test signal applied from the test machine to the electronic components, and the auxiliary test machine or the amplifier is exposed to the second area side.

The chamber body further includes: a transmission device for transmitting the cold air of the temperature regulating fluid to the electronic components located on the test board, and the transmission device is located in the second area.

The transfer device includes: a cooling plate for transferring cold air to the electronic components located on the test board; and a lifter for lifting and lowering the cooling plate so that the cooling plate is in a state capable of transferring cold air to the electronic components, or releasing the contact between the cooling plate and the test board so that the test board is in a state capable of being removed from the accommodation space.

The cooling plates are provided in plurality, so that the plurality of cooling plates correspond to one test plate.

According to the present invention, there are the following effects.

First, it can protect the circuits of the test board or other electronic components required for testing from the surrounding thermal stimulation, thereby preventing them from being damaged and extending their life.

Second, the ability to run secondary tests concurrently with the primary test saves resources and reduces overall testing time, thereby increasing processing capacity.

Third, even if noise occurs, the response signal fed back from the electronic components can be properly input to the tester, thereby improving the reliability of the tester.

Fourth, the temperature of the electronic components can be quickly and appropriately controlled through the duct structure, and the electronic components located on the test board can be cooled by heat conduction without the test board obstructing the path in and out of the test chamber, so that instant and precise temperature control of electronic components such as auxiliary testers can be achieved, thereby shortening the test step time and ensuring the reliability of tests that need to be performed quickly.

Fifth, by cooling the electronic components using a cooling plate and conductive bumps corresponding to each electronic component, the thermal state of all electronic components can be made uniform, thereby further improving the reliability of the test.

With reference to the drawings, the preferred embodiment of the present invention is described. For the sake of brevity, the description of repeated or substantially identical structures is omitted or compressed as much as possible. <Description of the test board - Example of the test board equipped with a heat insulation space>

FIG2 is a plane perspective view of a test board TB that can be accommodated in a test chamber according to the present invention, FIG3 is a bottom perspective view of the test board TB of FIG2 , FIG4 (a) and (b) are respectively a plane exploded perspective view and a bottom exploded perspective view of the test board TB of FIG2 , and FIG5 is a conceptual side view of the test board TB of FIG2 .

As shown in FIG. 2 to FIG. 5 , the test board TB includes a board body BB, a connector C, an auxiliary tester AT, and a mask material SE.

The board body BB can carry electronic components and includes a placement socket S and a circuit board CB.

The placement sockets S are used to load the electronic components to be tested, and are arranged in a plurality of rows and columns. In this embodiment, the placement sockets S are arranged in 8 rows with 12 in each row. Therefore, a total of 96 electronic components are loaded on the board body BB in a form where each placement socket S is loaded one at a time. Of course, the number of placement sockets S can be presented differently on each test board TB according to the implementation form.

The circuit board CB has a circuit EC (see FIG. 5 ) for relaying electrical signals between the electronic components and the tester. The placement socket S is electrically connected to the circuit EC, so that the electronic components placed in the placement socket S can be electrically connected to the tester through the circuit EC.

The connector C is coupled to one side of the board body BB and electrically connected to the circuit EC, and is also electrically connected to the tester, thereby electrically connecting the circuit EC to the tester. Therefore, if the connector C is electrically connected to the tester, the electronic component is electrically connected to the tester by placing the socket S, the circuit EC, the connector C and the connection component (refer to the prior art).

The auxiliary tester AT is provided on the bottom side of the circuit board CB in a manner exposed downward, and is electrically connected to the electronic components placed on the placement sockets S through the circuit EC, thereby performing an auxiliary test different from the main test performed by the tester. Here, the main test may be, for example, a burn-in test, and the auxiliary test may be, for example, a test of the electrical operating characteristics of the electronic components with a shorter test time. Such an auxiliary tester AT can generate a signal for the auxiliary test and apply it to the electronic components, and is implemented by directly sending the response signal from the electronic components to the tester, or by amplifying the response signal and sending it to the tester. Therefore, the auxiliary tester AT is preferably provided one at each placement socket S. However, according to the embodiment, as shown in FIG4(b), it is also possible to fully consider the case where one auxiliary tester AT corresponds to multiple placement sockets S. Of course, as shown in FIG4(b), when one auxiliary tester AT corresponds to multiple placement sockets S, in order to make all the test conditions the same, it is preferable to make the distances between the auxiliary tester AT and the multiple placement sockets the same. In addition, since the auxiliary tester AT is electrically connected to the circuit EC, it can also be interpreted as an electronic component constituting the circuit EC.

The shielding material SE is provided to form a heat-insulating space IS on the side where the auxiliary tester AT is located. Here, although the auxiliary tester AT is provided on the circuit board CB, since it is provided on the side opposite to the side where the placement socket S where the electronic components are located is provided, the heat-insulating space IS formed by the shielding material SE is located on the side opposite to the side where the electronic components are loaded. Such a shielding material SE has a supply hole SH and a recovery hole RH for supplying a temperature regulating fluid to the heat-insulating space IS and recovering the temperature regulating fluid from the heat-insulating space IS in order to adjust the temperature of the heat-insulating space IS. Here, the temperature regulating fluid may be air at room temperature, dry air at room temperature, a gas obtained by mixing dry air at room temperature with a low-temperature gas (LN2 gas), or a single low-temperature gas, etc. The reason for setting the types of fluids in such a variety of ways is that the test temperature can be high temperature, normal temperature, low temperature, etc., and the type of temperature regulating fluid and the temperature of the temperature regulating fluid can be different according to the various test temperature conditions mentioned above. For example, if condensation is expected, dry air should be supplied, otherwise it is okay to put in ordinary air. And, if it is a normal temperature situation, the same fluid at the same temperature can be supplied in the same way through all injection positions, or different fluids can be supplied according to the injection position. That is, there can be a temperature difference or no temperature difference according to the injection position (area).

For reference, although a supply device for supplying the temperature adjustment fluid may be provided in the test chamber 100, a fluid supply system built in a factory as a main facility may also be used.

The supply hole SH is divided into two arrangements and is formed to supply the temperature regulating fluid to the insulation space IS.

The recovery holes RH are arranged in such a way that four holes are allocated to each supply hole SH, so that a total of eight holes are divided into four holes each, and are used to recover the temperature regulating fluid used to regulate the temperature of the auxiliary tester AT to the supply device after it flows into the insulation space IS through the supply hole SH.

In consideration of the design of the piping for supplying and recovering the temperature-controlling fluid, the connection structure of the supply hole SH and the recovery hole RH with the piping (a structure in which the supply hole and the recovery hole can be connected to the respective pipings at the same time through a single installation operation), etc., the supply hole SH and the recovery hole RH are preferably formed in the same direction. Therefore, in order to prevent the temperature-controlling fluid supplied to the insulating space IS through the supply hole SH from being directly recovered to the supply device through the recovery hole RH, the test plate TB is preferably additionally equipped with a supply pipe ST that can supply and recover the temperature-controlling fluid supplied through the supply hole SH in a manner that spreads throughout the insulating space IS.

The supply pipe ST can be provided on the opposite side of the supply hole SH and the recovery hole RH to spray the temperature regulating fluid. Furthermore, the supply pipe ST can also be provided to form a plurality of spray holes along the length direction of the supply pipe ST so that the temperature regulating fluid is uniformly sprayed into the insulating space IS. Here, it is preferable to consider that the plurality of spray holes are formed at a position that can directly and intensively spray toward the auxiliary test machine AT (or, electronic components such as amplifiers). Of course, it is also possible to fully consider designing by the following indirect spraying method: the temperature regulating fluid supplied through the supply pipe ST is sprayed toward the bottom surface of the insulating space IS, thereby assimilating the temperature of the entire insulating space IS, and then regulating the temperature of the electronic components.

Furthermore, the supply hole SH and the recovery hole RH are preferably formed on the side of the connector C. The reason is that when the test board TB accommodated in the test chamber is pressurized to electrically connect the test board TB to the test machine, the supply hole SH and the recovery hole RH are also connected to the flow path of the piping located in the test chamber, so that two operations (electrical connection operation and flow path connection operation) can be performed at the same time, which is convenient and has a stable structure. That is, it is preferable to have the following arrangement structure: when the test board TB is installed in the test chamber, the test board TB is pushed, so that the connector C is electrically connected to the test machine, and at this time, the supply hole SH and the recovery hole RH can also be tightly connected to the flow path of the piping located in the test chamber.

According to the test board TB of the aforementioned structure, before or after the main test is performed, or at a certain interruption time in the procedure of the main test (when the time required for the auxiliary test is ensured), the auxiliary test performed by the auxiliary tester AT is performed at that time. When the auxiliary test is performed in this way, the auxiliary tester AT generates a test signal and applies it to the electronic component, and sends the response signal fed back from the electronic component to the tester through the circuit EC and the connector C. At this time, the auxiliary tester AT can amplify the response signal and send it to the tester. Of course, depending on the implementation, it is also possible to fully consider the situation where the auxiliary tester AT only plays the role of generating a test signal and applying it to the electronic component, and the circuit EC is constructed in such a way that the response signal fed back from the electronic component is directly sent to the tester.

For reference, the power required to drive the auxiliary tester AT can be received from the tester.

Next, the use of the test board TB is explained. If a plurality of test boards TB loaded with electronic components are accommodated in the test chamber, the supply hole SH and the recovery hole RH are tightly connected to the flow path of the piping provided in the test chamber, and the electronic components are electrically connected to the test machine through the circuit EC and the connector C. In the state as described above, the main test can be performed by the test machine, and as described above, the auxiliary test can also be performed by the auxiliary test machine AT. In addition, in order to apply thermal stress to the electronic components, for example, since the storage space in the test chamber maintains a high temperature environment, the temperature regulating fluid is continuously supplied to the insulating space IS and then recovered. Therefore, regardless of the temperature environment of the storage space in the test chamber, the auxiliary test machine AT can maintain an appropriate temperature. For example, referring to the case of a burn-in test, the temperature of the electronic components is set to a high temperature for the main test, and since the auxiliary test machine AT may generate heat itself during the auxiliary test, in order to cope with such a situation, it may be preferable to consider supplying a low-temperature temperature regulating fluid including LN2 gas to the insulation space IS.

In addition, the above embodiment describes the case where the auxiliary tester AT generates a test signal. However, depending on the type of test, it is also possible to consider receiving an auxiliary test signal for auxiliary testing from the tester, and instead, to construct an amplifier in the circuit to amplify the response signal fed back from the electronic component corresponding to the auxiliary test signal and send it to the tester. That is, it is also possible to fully consider equipping the circuit EC of the test board TB with an amplifier instead of equipping the auxiliary tester AT. <Explanation of the test chamber-Example of equipping the test chamber with a heat-insulating space>

Although the above description of the test board TB describes the case where the heat insulating space is formed in the test board TB, the heat insulating space or buffer space for protecting the electronic components of the auxiliary tester etc. can be formed by a structure located in the test chamber. In this case, although the test board TB can also be equipped with a heat insulating space, it is also possible not to be equipped. The test chamber according to the present invention is divided into the following embodiments for description. 1. First embodiment of the test chamber

As shown in the schematic diagram of FIG. 6 , the test chamber 100 according to the present embodiment includes a chamber body 110 , an opening and closing door 120 , and a temperature adjustment device 130 .

The chamber body 110 has a storage space ES (dashed line inner area) for storing a test board TB carrying electronic components. One side of the storage space ES (the front side in FIG. 6 ) is open, so that the test board TB can be supplied to the storage space ES or recovered from the storage space ES. In addition, the test board TB stored in the storage space ES is electrically connected to the test machine through a connecting component. At this time, in order to ensure a tight connection between the test board TB and the test machine, it is necessary to push the test board TB and properly install it in the storage space ES. Such a chamber body 110 is equipped with a support rail 111 and a dividing plate 112.

The support rail 111 guides the movement of the test board TB when the test board TB is moved into or out of the storage space ES, and also supports the test board TB stored in the storage space ES.

The partition plate 112 divides the storage space ES into a plurality of independent spaces SS. The plurality of independent spaces SS formed by the partition plate 112 can block air movement between each other, and one test board TB can be stored in one independent space SS.

In addition, since the support rail 111 is provided between the dividing plates 112 on the upper and lower sides, as shown in the reference diagram of FIG7 , if the test board TB is installed in the independent space SS, the independent space SS can be divided into the first area 1S on the upper side and the second area 2S on the lower side with the test board TB placed in the middle. At this time, it is most ideal that the first area 1S and the second area 2S are separated into mutually thermally isolated areas where the exchange of air between them is blocked. That is, each independent space SS is separated into the first area 1S and the second area 2S by the test board TB, the support rail 111 and the dividing plate 112, and the second area 2S located below the test board TB functions as a heat-insulating space. Of course, the electronic components (auxiliary tester or amplifier, etc.) located on the test board TB are exposed to the second region 2S side.

In this embodiment, since the second area 2S formed under the test board TB by the dividing plate 112 is open toward the opening and closing door 120, the opening and closing door 120 should also be closed when the opening and closing door 120 is closed. To this end, the opening and closing door 120 is equipped with a loading member 121, so that the independent space SS can be sealed by closing the opening and closing door 120, and at the same time, the first area 1S and the second area 2S are also separated to cut off the heat transfer caused by mutual convection. Therefore, when the test board TB is arranged in the independent space SS and the open and close door 120 is closed, the air movement between the first area 1S and the second area 2S is blocked, so that the first area 1S can function as a setting space for setting the temperature of electronic components, and the second area 2S can function as an insulating space or a buffer space that is not affected by the temperature of the setting space or is only affected by conduction, etc.

Furthermore, in order to adjust the temperature of the second area 2S functioning as an insulating space or a buffer space, the chamber body 110 forms an injection hole IH and an intake hole OH for supplying a temperature adjustment fluid on the inner wall constituting the storage space ES. Accordingly, the chamber body 110 is equipped with an injection pipe IP and an intake pipe OP.

Of course, the injection pipe IP is provided to inject the temperature regulating fluid for regulating the temperature of the second zone 2S into the second zone 2S, and the suction pipe OP is provided to enable the supply device to inhale the temperature regulating fluid supplied to the second zone 2S through the injection pipe IP from the second zone 2S.

For reference, in the present embodiment, since the dividing plate 112 is prepared in the test chamber 100, the flow path formed by the pipes IP and OP located in the test chamber 100 can maintain a stable connection state with the ejection hole IH and the suction hole OH, so that the design of the formation position can be freely performed. That is, the ejection hole IH and the suction hole OH can be formed in opposite directions to each other, and can also be set in any direction in consideration of the design with other structures. In addition, since the flow path of the pipes IP and OP maintains a fixed connection state with the ejection hole IH and the suction hole OH, it is possible to ensure a stable flow path for recovering the temperature regulating fluid after supplying it to the insulating space or buffer space serving as the second area 2S.

As mentioned above, the opening and closing door 120 opens or closes the storage space ES by opening and closing the open side of the chamber main body 110. Of course, when the test board TB is moved into the storage space ES or moved out of the storage space ES, the storage space ES must be opened, and when the electronic components are tested, the storage space ES must be closed. In addition, in this embodiment, the independent space SS is separated into the first area 1S and the second area 2S by the test board TB. Such first area 1S and second area 2S are of course open to the side of the opening and closing door 120, and by opening and closing the opening and closing door 120, the first area 1S and the second area 2S are also opened or closed to the side of the opening and closing door 120.

The temperature control device 130 controls the temperature of the electronic components exposed to the first area by supplying temperature control air to the first area. Such a temperature control device 130 is described in detail in the following table of contents.

As described above, this embodiment can be appropriately applied to a case where the electronic components such as the auxiliary tester AT constituting the circuit EC are exposed toward one side (bottom) of the test board TB. The circuit EC or the auxiliary tester AT here is the same as the description of the test board TB above. 2. Second embodiment

The test chamber 100 according to this embodiment also includes a chamber body 110 , an opening and closing door 120 , and a temperature adjustment device 130 .

Similar to the first embodiment, the chamber body 110 includes a supporting rail 111 and a dividing plate 112 , and further includes an auxiliary testing machine 113 .

The test chamber 100, the opening and closing door 120, the supporting rail 111, and the dividing plate 112 in this embodiment have the same functions as those in the first embodiment described above, so their description is omitted.

However, in this embodiment, as shown in reference to FIG8 , the difference from the first embodiment is that an auxiliary tester 113 is provided in the test chamber 100. Therefore, in the case according to this embodiment, the circuit EC of the test board TB is not provided with electronic components such as the auxiliary tester AT. However, when the test board TB is installed in the test chamber 100, the auxiliary tester 113 located in the test chamber 100 should have a connection structure capable of being electrically connected to the circuit EC of the test board TB.

As an example of a connection structure, the following structure may be used: the circuit EC of the test board TB is provided with a terminal that can be flexibly advanced and retreated, so that when the test board TB is completely installed in the storage space ES, the circuit EC of the test board TB is electrically connected to the auxiliary tester 113. Such a structure may consider using a terminal of a ball plunger, etc. Of course, it is also possible to fully consider providing the terminal that can be flexibly advanced and retreated on the auxiliary tester 113 side.

In addition, as another example of the connection structure, the following structure may be used: as schematically shown in FIG8 , if the test board TB is mounted on the support rail 111 and enters the independent space SS, the auxiliary test machine 113 is raised by a lift 114 such as a cylinder or a motor, and then the circuit EC of the test board TB is electrically connected to the auxiliary test machine 113. Therefore, according to the situation of this example, the test chamber 100 needs to be equipped with a separate lift 114 for raising and lowering the auxiliary test machine 113.

As described above in the additional description of the test board TB, in this embodiment, the auxiliary tester 113 can also be replaced by an amplifier. 3. Third embodiment

The test chamber 100 according to this embodiment also includes a chamber body 110, an opening and closing door 120, and a temperature adjustment device 130. In addition, the chamber body 110 includes a support rail 111 and a partition plate 112. This embodiment is the same as the first embodiment described above, but as shown in the schematic conceptual diagram of FIG9, the difference is that the test board TB has an auxiliary tester AT and a heat insulation space IS according to the examples of FIGS. 2 to 5.

Therefore, in the case of the present embodiment, the second area 2S formed between the test board TB and the dividing plate 112 functions as a buffer space for reinforcing the heat insulating function of the heat insulating space IS. That is, the auxiliary tester AT provided on the test board TB is not exposed to the buffer space serving as the second area 2S, but is only exposed to the heat insulating space IS located on the test board TB.

The second area 2S as a buffer space performs a function of blocking the movement of heat conducted from the lower independent space SS to the test board TB mounted in the upper independent space SS by heat conduction, etc. Here, the structure capable of conducting heat from the lower independent space SS to the upper independent space SS will be described later.

In addition, according to the present example, the test chamber 100 has a supply pipe SP and a recovery pipe RP for supplying the temperature regulating fluid to the heat insulating space IS of the test board TB or recovering the temperature regulating fluid from the heat insulating space IS, and has an injection pipe IP and an intake pipe OP for supplying the temperature regulating fluid to the second area 2S functioning as a buffer space or recovering the supplied temperature regulating fluid from the second area 2S. Of course, for the sake of convenience of explanation, the conceptual diagram of FIG. 9 shows that all the pipes SP, RP, IP, and OP are visible, but preferably, the supply pipe SP and the recovery pipe RP are arranged toward the connector C side of the test board TB corresponding to the supply hole SH and the recovery hole RH of the test board TB in FIG. 2.

According to one example, the temperature of the heat-insulating space IS exposed to the auxiliary test machine AT is controlled at about 5 degrees, and the second area 2S serving as a buffer space is controlled at room temperature or about 25 degrees, thereby saving energy. That is, the temperature of the temperature-regulating fluid sprayed to the second area 2S serving as a buffer space through the spraying pipe IP is set to be lower than the temperature of the first area 1S, and higher than the temperature of the temperature-regulating fluid supplied to the heat-insulating space IS through the supply pipe SP. Of course, even in this case, the temperatures of a plurality of areas separated from each other may be the same or different depending on the temperature conditions used for testing or the heating conditions of electronic components such as the auxiliary test machine AT or amplifiers, and the types of the supplied temperature-regulating fluids may be appropriately mixed according to the conditions.

Of course, although the dividing plate 112 can be omitted as in the variation of FIG. 10 and the insulation space IS and the buffer space AS can be provided entirely on the test plate TB, in this case, the thickness of the test plate TB becomes too thick, and thus it may be difficult to maneuver or manage the test plate TB and to design the position of the piping to be provided in the test chamber 100.

Furthermore, as shown in the variation of FIG. 11 , the following structure can also be considered: instead of providing the heat insulating space IS on the test board TB, the partition plate 112 and the buffer plate 115 are placed in the test chamber 100, so that the heat insulating space IS and the buffer space AS can be fully equipped. ＜Explanation of the temperature control technology of electronic components＞

The above examples focus on the technology for regulating the temperature of electronic components such as auxiliary testers AT, 113. However, the temperature of electronic components is closely related to the temperature regulation of electronic components mounted on the mounting socket S. The temperature regulation of electronic components is performed by the temperature regulation device 130, which will be described in more detail.

As mentioned in the previous technology, electronic components are tested while maintaining a predetermined temperature environment. However, as electronic components become more highly integrated and advanced, more and more self-heating occurs in electronic components, so the need to adjust the temperature of electronic components even during testing is increasing. In addition, as mentioned above, in the case of configuring an additional auxiliary tester AT, 113 or amplifier, it is expected that the heat generated in the electronic element will affect the electronic component through conduction, etc. In addition, it is necessary to divide the accommodation space ES into independent spaces SS in which the movement of heat caused by mutual convection is blocked, so that the temperature of all the electronic components accommodated needs to be controlled within the same range. Therefore, it is necessary to consider new technologies for more precise temperature control of the electronic components being tested.

Generally, electronic components mounted on the test board TB installed in the storage space ES should be tested under a state of being controlled by an artificially established temperature environment. Therefore, the test chamber 100 should be equipped with a temperature control device 130 for controlling the temperature of the electronic components mounted on the test board TB installed in the chamber body 110. By means of such a temperature regulating device 130, an artificially regulated temperature environment is established in the storage space ES. To this end, as shown in the schematic diagram of FIG12, the following method has been adopted in the past: the temperature regulating air supplied by the temperature regulating device 130 is sprayed from one side wall of the test chamber 100 toward the storage space ES (refer to the arrow), so that the air passes between each test board TB and uniformly controls the temperature of the entire storage space ES (refer to the patent publication No. 10-2010-0093896). However, for the form shown in FIG12, since the temperature regulating air cannot be directly sprayed to the electronic component mounted on the mounting socket S, but moves to the upper side of the electronic component, it has the disadvantage that the temperature regulation cannot be achieved directly and immediately, but can only be achieved indirectly.

In addition, according to the test chamber 100 described as an embodiment of the test chamber 100 described above, the storage space ES is divided into a plurality of independent spaces SS, and the independent space SS is divided into a first area 1S on the upper side and a second area 2S on the lower side with the test board TB placed in the middle. In addition, the electronic components placed on the mounting socket S are exposed to the first area 1S on the upper side. Therefore, the temperature adjustment of the electronic components must be performed through the first area 1S. Therefore, as in the test chamber 100 described above, by utilizing the structure in which the storage space ES is divided into a plurality of independent spaces SS and the independent spaces SS are again divided by the test board TB, a new form of temperature adjustment device 130 constituting an important feature of the present invention can be provided.

FIG. 13 illustrates a new type of temperature control device 130 that can be applied to the test chamber 100.

13 , the temperature control device 130 provided in the test chamber 100 according to the present invention includes an air supplier 131, a supply conduit 132, a control plate, a spray conduit 134, and a branch conduit 135.

The air supply device 131 supplies temperature-adjusting air for adjusting the temperature of the storage space ES. The air supply device 131 supplies the temperature-adjusting air from one side P1 and draws the temperature-adjusting air passing through the storage space ES from the other side P2.

The supply duct 132 is provided to distribute and supply the temperature-adjusting air supplied from the air supplier 131 to a plurality of positions in the accommodating space ES, that is, positions corresponding to the respective independent spaces SS. As shown in the partial view of FIG. 14 , such a supply duct 132 can be divided into a discharge portion 132a, a guide portion 132b, a connection portion 132c, and a reentry portion 132d.

The discharge portion 132a has discharge holes DH: _DH1 , ..., _DH2 for discharging the temperature adjustment air, and the discharge holes DH are formed at positions corresponding to the individual independent spaces SS. For reference, the temperature adjustment air discharged through the discharge holes DH is supplied to the ejection duct 134 via a branch duct 135 described later.

The guide portion 132b guides the temperature-adjusting air from the air supplier 131 to the exhaust portion 132a.

The connecting portion 132c connects the exhaust portion 132a and the guide portion 132b so that the moving direction of the air moving in the exhaust portion 132a and the moving direction of the air moving in the guide portion 132b are switched 180 degrees.

For reference, as described in the example of Fig. 15, the guide portion 132b may not be provided, and the temperature-adjusting air supplied from the air supplier 131 may be directly introduced into the straight-line discharge portion 132a whose end is blocked. However, in the case of the example of Fig. 15, according to Bernoulli's theorem, the pressure difference between the area where the exhaust hole _DH1 close to the air supplier 131 is located and the area where the exhaust hole _DH2 far from the air supplier 131 is located is large, so it may be difficult to evenly distribute the temperature-adjusting air to each ejection duct 134. That is, in the example of Fig. 15, since the velocity of the temperature-adjusting air decreases and the air pressure increases as the distance from the air supplier 131 increases, there is a large difference in the discharge amount of the temperature-adjusting air through each discharge hole _DH1 , ..., DH2 _. Of course, in the case of Fig. 15, if the sizes of the discharge holes _DH1 , ..., _DH2 are formed differently or an adjusting plate is configured to adjust the sizes of the discharge holes _DH1 , ..., _DH2 , the discharge amount can be controlled to a certain extent, but it may be difficult to control the complicated flow of the temperature-adjusting air only by adjusting the sizes of the discharge holes _DH1 , ..., _DH2 .

Therefore, as shown in FIG14, in this embodiment, the design is as follows: by utilizing the phenomenon that the movement direction of the temperature regulating air is changed 180 degrees at the connecting portion 132c and the movement of the temperature regulating air is stagnant in this area, the air pressure in the area where the first exhaust hole _DH1 is located and the air pressure in the area where the last exhaust hole _DH2 is located on the movement line of the temperature regulating air can be as uniform as possible.

The re-entry portion 132d is provided so that the temperature-adjusting air enters the guide portion 132b after passing through the last discharge hole _DH2 to realize the circulation of the temperature-adjusting air in the supply duct 132. By providing the re-entry portion 132d in a manner that the end of the discharge portion 132a is not closed as described above, the pressure difference between the area where the first discharge hole _DH1 is located and the area where the last discharge hole _DH2 is located is further reduced on the air movement line, and the pressure in the areas where all the discharge holes DH: _DH1 , ..., _DH2 are located can be more uniform. For reference, as shown in FIG16, when the supply duct 132 is formed into a U-shape, air stagnation occurs in the connection portion 132c that changes the moving direction of the air, but since the air pressure in the area where the last discharge hole _DH2 is located is the largest, the amount of air discharged from the last discharge hole _DH2 is the largest. In this case, the electronic components respectively accommodated in each independent space SS may have temperature deviation. Therefore, as shown in FIG14, in this embodiment, the end of the discharge portion 132a is opened and connected to the guide portion 132b, so that according to the Bernoulli theorem, the air pressure in the area where the last discharge hole _DH2 is located is reduced, and then the air pressures in the areas where all the discharge holes DH: _DH1 , ..., _DH2 are located can be equalized.

In addition, the discharge portion 132a and the guide portion 132b are provided together on one side with the storage space ES as the reference, so that not only the overall width of the device can be reduced, but also the design of the reentry portion 132d can be simply solved. Of course, from the perspective of reducing the overall width of the device, it is preferable that the distance between the discharge portion 132a and the storage space ES and the distance between the guide portion 132b and the storage space ES on the side are the same. That is, as shown in FIG. 17 , when viewed from a plane, the distance from the center line C ₁ of the discharge portion 132a to the center line C ₂ of the storage space ES and the distance from the center line C ₁ of the guide portion 132b to the center line C ₂ of the storage space ES are designed to be the same. However, depending on the implementation, the distance between the discharge portion 132a and the storage space ES and the distance between the guide portion 132b and the storage space ES may be different by making the areas of the flow paths of the discharge portion 132a and the guide portion 132b different.

Next, referring to the partial view of FIG. 18 in which a part of the supply duct 132 is exploded, the regulating plate 133 is provided to perform the function of a valve for adjusting the size of the discharge hole DH. The reason for this is that, considering that even in the various arrangements mentioned above, there may still be a pressure difference in each area of the discharge portion 132a, the temperature-adjusting air is evenly distributed to the ejection duct 134 by adjusting the size of the discharge hole DH individually. That is, due to the complex fluid mechanics in the discharge portion 132a, a pressure difference may occur in each area in the discharge hole DH, and for this reason, the amount of temperature-adjusting air discharged from each discharge hole DH may be different from each other. Therefore, the size of the discharge hole DH is adjusted by the adjustment plate 133 (specifically, the discharge area of the air passing through the discharge hole is adjusted), so that the temperature adjustment air can be evenly distributed to the injection duct 134. Of course, if the size of the discharge hole DH is formed differently according to the position in consideration of fluid mechanics, the adjustment plate 133 can be omitted. However, when the size of the discharge hole DH is formed differently, it is necessary to consider various variables such as flow velocity, flow rate, and cross-sectional area of the flow path, and depending on the test temperature environment conditions, the flow velocity or flow rate may act as a variable, resulting in a test failure. Therefore, it is better and easier to consider the case of adjusting the size of the discharge hole DH using the adjustment plate 133.

In this embodiment, the size of the discharge hole can be set by the operator by sliding the adjustment plate 133, so for such setting, as shown in Figure 18, a case where one side surface F of the supply duct 132 is provided in a detachable manner is described as an example. However, depending on the implementation, it is also possible to consider a case where the supply duct 132 is provided as an integral body and the adjustment plate 133 is provided so as to be automatically operated by a separate drive source.

As shown in reference to FIG. 19 , the spray ducts 134 are located in the storage space ES at predetermined intervals and are arranged in a one-to-one facing manner on a plurality of test boards TB. In this embodiment, one adjustment plate 133 is accommodated in an independent space SS, so as to face the test board TB located in the independent space SS. That is, the spray surface of the spray duct 134 that sprays the temperature-adjusting air faces the surface on which the electronic components of the test board TB are placed (the surface on which the placement socket is provided). Such a spray duct 134 must spray the temperature-adjusting air coming from the supply duct 131 and the branch duct 135 toward the test board TB. For this purpose, as shown in FIG. 20 , a spray hole IH is formed in the spray duct 134 so as to correspond one-to-one to the electronic components loaded on the test board TB. According to the present embodiment, as described with reference to FIG. 19 , since the spray duct 134 is located on the upper side of the independent space SS, if the independent space SS is separated by the test board TB, it will be located in the first area 1S and face the electronic components loaded on the test board TB. Therefore, the air sprayed from the spray duct 134 is sprayed directly toward the electronic components, and only the temperature of the first area 1S of the independent space SS is adjusted. Since the air sprayed from the spray duct 134 is sprayed directly toward the electronic components, the temperature of the electronic components can be controlled at a faster speed than in the past. Furthermore, the first area 1S, which is a space that needs to adjust the temperature, is narrower than before, so that correspondingly faster temperature adjustment can be achieved, thereby reducing energy consumption. Furthermore, the air sprayed to the first area 1S through the spray duct 134 moves to the recovery chamber RR located outside the independent space SS, and is then recovered to the air supplier 131.

In addition, as shown in FIG. 20, the ejection duct 134 is provided with a guide member 134a which guides the movement of the temperature adjustment air so that the inflowing temperature adjustment air is evenly distributed to the ejection holes 1H for ejection.

The guide member 134a includes a transfer plate TP and a securing plate GP.

The conversion plate TP is provided to convert the direction of the temperature control air flowing in along the direction of arrow a.

The ensuring plate GP blocks the temperature-regulating air from passing through the corresponding position, thereby ensuring the moving path in such a manner that the temperature-regulating air after the direction is changed by the conversion plate TP passes through the entire area of the injection duct 134 (see arrow b).

While the guide member 134a is provided as described above, as shown in FIG. 20, the ejection hole IH is formed in a region other than the path (refer to arrow a) where the temperature-adjusting air flows into the ejection duct 134 and reaches the conversion plate TP. That is, the ejection hole IH is not formed on the path (arrow a) where the temperature-adjusting air flows into the ejection duct 134 and reaches the conversion plate TP. Therefore, the temperature-adjusting air flowing into the ejection duct 134 changes its moving direction through the conversion plate TP, and then, as shown in arrow b, bypasses the path blocked by the securing plate GP and flows back through the entire ejection surface where the ejection hole IH is located, so that the temperature-adjusting air can be ejected more uniformly through each ejection hole IH.

The branch duct 135 is provided to provide a path for the temperature adjustment air discharged from the supply duct 132 through the discharge holes DH to move to the ejection duct 134, and is provided in plurality to form flow paths branching from the supply duct 132 in the same number as the discharge holes DH.

According to the temperature control device 130 as described above, the temperature control air supplied by the air supply 131 flows into the spray duct 134 through the supply duct 132 and the branch duct 135, and then sprays into the independent space SS through the spray hole IH. In addition, the temperature control air sprayed into the independent space SS establishes the temperature environment of the independent space SS while adjusting the temperature of the electronic components, and then flows outward and is recovered to the air supply 131 again through the recovery chamber RR.

According to the above description, the case where the heat insulating space IS of the test board TB or the second area 2S (used as a heat insulating space or a buffer space) provided in the test chamber 100 is separated from the first area 1S through the test board TB has been described. However, the heat insulating space IS or the second area 2S may also be affected by the thermal environment of the first area 1S or the temperature state of the electronic components established by the temperature adjustment device 130 due to the fine gaps or heat conduction that may exist in the test board TB. Therefore, as mentioned above, in order to protect the electronic components such as the auxiliary tester AT, 113, etc., it is necessary to control the temperature of the heat insulating space IS or the second area 2S to be different from the temperature of the first area 1S.

For reference, the second area 2S of the independent space SS located on the upper side is separated from the first area 1S of the independent space SS located on the lower side by the dividing plate 112, but the heat of the high temperature of the first area 1S of the independent space SS located on the lower side may also move to the second area 2S of the independent space SS located on the upper side by conduction, etc. Therefore, it is preferable to set the aforementioned buffer space so as not to be directly affected by the high temperature established in the first area 1S of the independent space SS located on the lower side. At this time, in order to save energy, the temperature of the buffer space can be preferably considered to be higher than the temperature of the insulation space IS and lower than the temperature of the first area 1S.

According to the present embodiment described above, as shown in Fig. 19, a structure is adopted in which one spray duct 134 is arranged in each independent space SS. However, as shown in Fig. 21, when the storage space ES is not divided into each independent space SS by a separate dividing plate 112, the temperature control device 130 according to the present invention having a structure for directly spraying temperature control air toward the electronic components can also be applied.

Furthermore, referring to the features of the test chamber 100 according to the present invention with reference to FIGS. 19 and 21 above, it can be seen that a plurality of test boards TB can be accommodated in the accommodation space ES in a form of being arranged in a vertical direction with a spacing therebetween, and the spray ducts 134 are arranged in a one-to-one facing manner on the plurality of test boards TB. Therefore, the spray ducts 134 other than the spray ducts 134 located on one side (the upper side in this embodiment) are located between the test boards TB adjacent to each other.

In addition, the temperature-adjusting air that passes through the reentry portion 132d and passes through the exhaust portion 132a may merge again with the guide portion 132b after passing through the exhaust portion 132a. Therefore, a deviation may occur between the temperature of the temperature-adjusting air supplied from the air supplier 131 and the temperature of the temperature-adjusting air sprayed from the spray duct 134. And, if a deviation occurs between the temperatures of the temperature-adjusting air at two locations as described above, it may be impossible to test electronic components under the actually required temperature conditions. In order to prevent this, as shown in reference to FIG. 13, it is preferable to provide a first temperature sensor _TS1 for sensing the temperature of the temperature-adjusting air supplied from the air supply 131 and a second temperature sensor _TS2 for sensing the temperature of the temperature-adjusting air sprayed from the spray duct 134. In this case, the temperature deviation sensed by the _two temperature sensors _TS1 and TS2 is continuously monitored, and the temperature of the temperature-adjusting air supplied from the air supply 131 is adjusted whenever necessary, thereby enabling the temperature of the electronic components to be controlled more precisely. <References>

As mentioned above, the first area 1S should be used to establish a temperature environment for regulating the temperature of electronic components, and the heat-insulating space IS should be used to establish a temperature environment for regulating the temperature of electronic components that generate heat, such as auxiliary testers AT, 113 or amplifiers. In addition, the buffer space AS (including the example in which the second area functions as a buffer space) needs to establish a temperature environment in which the thermal state of the first area 1S below does not affect the heat-insulating space IS.

Therefore, when considering various test temperature conditions, the first zone IS, the insulation space IS and the buffer space AS (the second zone when the second zone functions as a buffer space) must be able to be controlled to different temperatures.

For example, depending on the test temperature conditions, the temperature of each space 1S, IS, and AS can be controlled in various forms.

When the high temperature test is performed, the temperature of the first area 1S can be the highest, and the temperature of the insulation space IS can be the lowest. At this time, the temperature of the buffer space AS has a value between the temperature of the first area 1S and the temperature of the insulation space IS.

However, during the low temperature test, the temperature of the first area 1S is the lowest, and in order to prevent condensation, the temperature of the insulation space IS should be controlled to be higher than the temperature of the first area 1S. At this time, since the buffer space AS is connected to the first area 1S on the lower side, the temperature of the insulation space IS needs to be controlled to be higher than the temperature of the buffer space AS, or at least the same as each other. Of course, during the low temperature test, in order to prevent condensation, a dry temperature adjustment fluid needs to be supplied to the insulation space IS.

In the above description, in order to adjust the temperature of the electronic components, a temperature regulating fluid is sprayed toward the electronic components. However, more precise temperature control of the electronic components may be required. In this case, modifications such as the modifications described below may be required regarding the test board TB and the test chamber 100. ＜Modifications＞ 1. Modifications regarding the test board

As described with reference to the perspective view of FIG. 22 and the cross-sectional view of FIG. 23 , the test board TB according to this variation takes an example in which the test board TB itself has the heat insulating space IS.

The test board TB according to this variation has the following structure: a socket S is provided on the upper side of the circuit board CB, and an auxiliary tester AT (or other electronic components) is provided on the lower side of the circuit board CB. Based on such a basic structure, the test board TB according to this variation also includes a heat conductor TE and a conductive protrusion CP, and the mask material SE also has characteristics.

The heat conductor TE is a heat pad made of a non-metallic material with excellent thermal conductivity and is provided at the bottom of the auxiliary tester AT. Such a heat conductor TE is non-metallic and soft, so that it can compensate for errors caused by manufacturing tolerances or design tolerances of the corresponding test chamber 100 structure described later.

The conductive protrusion CP is made of a metallic material with excellent thermal conductivity and is disposed on the lower side of the heat conductor.

The above heat conductor TE and the conductive protrusion CP are used to conduct the cold air from the cooling plate 141 (see FIG. 24 ) to be described later to the auxiliary tester AT. Therefore, although it can be equipped as a single structure of a single conductive component, as described later, in order to add the function of shock absorption and buffering, it is preferable to additionally constitute the heat conductor TE of non-metallic material and soft. In addition, the upper and lower thicknesses of the heat conductor TE and the conductive protrusion CP can be reduced or increased corresponding to the upper and lower thicknesses of the auxiliary tester AT of the paired test board TB. For example, comparing (a) and (b) of Figure 23, as mentioned above, an amplifier AP can also be provided instead of the auxiliary tester AT, and different electronic components can be used according to the type of electronic components to be tested, the type of tester, or the range of amplification, and since their sizes and heights may all be different, problems caused by size changes of electronic components can be prevented by changing the upper and lower thicknesses of the heat conductor TE and the conductive protrusion CP.

The shield material SE is basically provided to form a heat insulating space IS in the area where the auxiliary tester AT is located, and also has the function of transferring the cold air from the cooling plate 141 to the conductive protrusion CP. To this end, the shield material SE includes a transfer plate DP, an outer wall plate EP and a partition plate GP.

The transfer plate DP transfers the cold air from the cooling plate 141 to the conductive protrusion CP, and finally transfers the cold air to the auxiliary test machine AT, and is formed of a metal material with good thermal conductivity. Therefore, the conductive protrusion CP may also have a structure formed integrally on the transfer plate DP. In this example, the reason for adding the heat conductor TE and the conductive protrusion CP instead of adopting a structure in which the transfer plate DP directly contacts the lower surface of the auxiliary test machine AT is to prevent damage to the auxiliary test machine AT caused by the impact when the cooling plate contacts the mask material SE (function of the heat conductor) and to minimize the loss of cold air by concentrating the cold air (function of the conductive protrusion). These reasons will be explained in detail later.

The outer wall plate EP, the transfer plate DP and the partition plate GP together form the heat-insulating space IS, and in order to maintain rigidity, it is preferably made of metal material.

The partition plate GP is sandwiched between the transfer plate DP and the outer wall plate EP, thereby performing the function of preventing the cold air of the transfer plate DP from being transferred to the outer wall plate EP. To this end, the partition plate GP is preferably formed of a non-conductive insulator material. That is, the shield material SE is equipped with a partition plate GP formed of an insulator around the transfer plate DP, so that the cold air existing in the transfer plate DP does not escape to other locations but is concentratedly transferred toward the auxiliary tester AT as an electronic component through the conductive protrusion CP.

For reference, the mask material SE is provided with a shape formed with a facing groove FG, so that the transfer plate DP side contacting the cooling plate 141 at the lower side is located at the upper side relative to the lower end, and the cooling plate 141 has a structure for inserting into or detaching from the facing groove FG. This will be described in detail later. 2. Description of the additional structure of the test chamber

FIG. 24 illustrates a portion of a test chamber 100 paired with the test board TB of FIG. 22 .

The test chamber 100 of FIG24 is equipped with a transfer device 140 of the auxiliary test machine AT for transferring cold air of the temperature regulating fluid from the supply device to the test board TB. The transfer device 140 is located in the second area 2S of the first area 1S and the second area 2S divided by the independent space SS through the test board TB. Here, the supply device may be a cooler, and the temperature regulating fluid may be low-temperature nitrogen.

The transfer device 140 includes a cooling plate 141 , an elastic component 142 , a support frame 143 , and an elevator 144 .

A moving path MR through which the temperature regulating fluid passes is formed on the cooling plate 141, and the cooling plate 141 is made of a metal material with good thermal conductivity. Therefore, the cooling plate 141 has a structure in which the temperature regulating fluid at a low temperature passes through the moving path MR, and the cooling plate 141 is cooled. Here, one side of the moving path MR is connected to the injection pipe IP, and the other side is connected to the suction pipe OP. At this time, the injection pipe IP and the suction pipe OP are preferably equipped with flexibility that can be bent softly. The reason is that the lifting operation by the elevator 144 should not be interfered.

The upper end of the elastic member 142 contacts the cooling plate 141 , and the lower end contacts the supporting frame 143 , thereby elastically supporting the cooling plate 141 relative to the supporting frame 143 .

The support frame 143 supports the elastic member 142. Also, the upper surface of the support frame 143 is spaced apart from the lower surface of the cooling plate 141 by a predetermined distance d. Therefore, the lower surface of the cooling plate 141 is not in direct contact with the upper surface of the support frame 143.

The elevator 144 raises and lowers the support frame 143, thereby finally raising and lowering the separated cooling plate 141 through the elastic member 142. 3. Working Description

First, as shown in Fig. 24, if the test board TB is inserted into the test chamber 100, the independent space SS is divided into the first area 1S and the second area 2S. At this time, during the process of inserting the test board TB into the test chamber 100, the cooling plate 141 is kept in the lowered state, so that the test board TB can be properly inserted into the independent space SS of the test chamber 100 without interference from the cooling plate 141.

Thereafter, when testing the electronic components, the lifter 144 operates to raise the cooling plate 141, and as shown in FIG25, the cooling plate 141 contacts the transfer plate DP. In this process, the elastic member 142 absorbs the contact impact between the cooling plate 141 and the transfer plate DP, thereby preventing damage to the auxiliary tester AT or other structures located on the test board TB. Furthermore, even if the horizontality of the transfer plate DP is reduced due to assembly manufacturing tolerance, the elastic member 142 compensates for it, thereby achieving close contact between the transfer plate DP and the cooling plate 141, thereby increasing the transfer force of the cold air.

If the temperature of the auxiliary tester AT rises due to testing of the electronic components, the supply device supplies cooling fluid accordingly, and if the cooling plate 141 is cooled by the cooling fluid, the cold air of the cooling plate 141 is transferred to the auxiliary tester AT via the transfer plate DP, the transfer protrusion CP and the heat conductor TE. As a result, the temperature of the auxiliary tester AT drops to an appropriate level.

Afterwards, when the test is completed, the elevator 144 operates to lower the cooling plate 141, so that the test board TB can be separated from the independent space SS and removed from the test board TB.

In addition, in the above embodiment, a case where a test board TB is equipped with a cooling plate 141 is illustrated as an example. However, as shown in FIG. 26 , a case where a test board TB is equipped with a corresponding plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, and 141f can be considered. That is, each of the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f has a smaller plane area than the plane area of the test board TB. However, by providing a plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f corresponding to one test board TB as described above, even if there are various mechanical tolerances, the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f can be elastically supported by the elastic member 142, thereby making the close contact between the transfer plate DP and the cooling plates 141a, 141b, 141c, 141d, 141e, 141f even closer.

As mentioned above, although the present invention has been specifically described based on the embodiments with reference to the drawings, the above embodiments only illustrate the preferred embodiments of the present invention, and therefore it should not be understood that the present invention is limited to the above embodiments. The scope of rights of the present invention should be understood in accordance with the scope of the patent application and its equivalent scope.

TB: Test board BB: Board body EC: Circuit AT: Auxiliary tester C: Connector SE: Masking material DP: Transfer plate IS: Insulation space 100: Test chamber 110: Chamber body ES: Storage space SS: Independent space 120: Opening and closing door 130: Temperature control device 131: Air supply 132: Supply duct 132a: Discharge part 132b: Guide part 132c: Connection part 132d: Re-entry part DH: Discharge hole 134: Jet duct 134a: Guide part TP: Conversion plate GP: Guarantee plate IH: Jet hole 135: Branch duct 140: Delivery device

FIG. 1 is a reference diagram for explaining the connection structure between the tester and the electronic components in the burn-in test.

Figure 2 is a plan view of the test board.

FIG. 3 is a perspective view of the bottom surface of the test board of FIG. 2 .

FIG. 4 is an exploded perspective view of the test board of FIG. 2 .

FIG. 5 is a conceptual side view of the test board of FIG. 2 .

FIG. 6 is a front perspective view of a test chamber according to an embodiment.

FIG. 7 is a reference diagram for explaining an independent space of the test chamber of FIG. 6 .

8 and 9 are reference diagrams for explaining a test chamber according to another embodiment.

10 and 11 are reference diagrams for explaining variations of a test plate and a test chamber.

FIG. 12 is a reference diagram for explaining the prior art related to temperature regulation of electronic components.

FIG. 13 is a partial perspective view of a temperature regulating device provided in a test chamber according to the present invention.

FIG. 14 is a partial view of a supply conduit used in the temperature control device of FIG. 13 .

15 and 16 are reference diagrams for explaining the advantages of the supply conduit of FIG. 14 .

FIG. 17 is a reference diagram for explaining the position of the supply conduit of FIG. 14 .

FIG. 18 is a partially exploded perspective view of the supply conduit of FIG. 14 .

FIG. 19 is a reference diagram for explaining the arrangement relationship between the supply conduit and the receiving space of FIG. 14 .

FIG. 20 is a partially exploded perspective view of the injection duct used in the temperature control device of FIG. 13 .

FIG. 21 is a reference diagram for explaining another example of a test chamber to which the temperature adjustment device of FIG. 13 is applied.

22 to 26 are reference diagrams for explaining other modified examples of the present invention.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

131: air supplier 132: supply pipe 132a: discharge part 132b: guide part 132c: connection part 132d: reentry part DH, _DH1 , _DH2 : discharge hole

Claims (4)

A supply duct for a test chamber, comprising: an exhaust portion having exhaust holes for exhausting air at positions corresponding to a plurality of positions; a guide portion for guiding temperature-regulating air from an air supplier to the exhaust portion; a connecting portion for connecting the guide portion and the exhaust portion; and a re-entry portion for allowing the temperature-regulating air passing through the exhaust portion to re-enter the guide portion so that the temperature-regulating air can circulate in the supply duct; wherein the moving direction of the temperature-regulating air is converted in the connecting portion so that the moving direction of the temperature-regulating air in the exhaust portion is different from the moving direction of the temperature-regulating air in the guide portion, A portion of the temperature-adjusting air moving in the discharge portion is discharged through the discharge hole in a direction perpendicular to the moving direction of the temperature-adjusting air in the discharge portion, and the remaining portion of the temperature-adjusting air re-enters the guide portion through the re-entry portion and can circulate. According to claim 1, the supply duct for a test chamber, the discharge portion and the guide portion are arranged together on one side based on the receiving space. According to claim 2, the supply duct for a test chamber, wherein the connecting portion changes the moving direction of the temperature-regulating air entering through the guide portion by 180 degrees, and the distance between the discharge portion and the receiving space is the same as the distance between the guide portion and the receiving space. According to the supply duct for a test chamber as described in claim 1, the air supplier is located on the upper side of the guide portion, and the temperature-adjusting air that enters the upper portion of the guide portion through the air supplier moves downward and enters the connecting portion through the lower portion of the guide portion. In the connecting portion, the moving direction of the temperature-adjusting air changes from downward to upward and enters the discharge portion. In the re-entry portion, the moving direction of the temperature-adjusting air changes from upward to downward and re-enters the guide portion.