TWI884088B - Wafer cold-expansion apparatus - Google Patents

Abstract

The present invention provides a wafer cold-expansion apparatus, which includes a workbench, a lifting mechanism corresponding in position to the workbench, and a cooling chamber assembled to the lifting mechanism. The workbench is configured to fix a blue tape for enabling a wafer adhered on the blue tape to correspond in position to a processing hole of the workbench. The cooling chamber is configured to receive a dry gas that has a temperature lower than 0℃ and a dew point temperature lower than -10℃. When the workbench is fixed with the blue tape, the cooling chamber can be moved to abut against a backside of the blue tape for jointly define a lower processing space that can receive the dry gas to continuously cool down the blue tape by a predetermined period, and then the cooling chamber can be upwardly moved to stretch the blue tape for completing a splitting process of the wafer.

Description

Wafer cooling and expansion equipment

The present invention relates to a wafer cooling and expansion device, and in particular to a wafer cooling and expansion device for performing cooling processing on a blue film.

Existing wafer cooling and expansion equipment focuses on how to process the wafer to achieve the chip splitting operation, but this architecture has encountered a development bottleneck and is gradually unable to keep up with the ever-changing semiconductor progress. Therefore, the inventor believes that the above defects can be improved, and has conducted intensive research and applied scientific principles to finally propose a reasonable design and effective improvement of the above defects.

The embodiment of the present invention provides a wafer cooling and expansion device, which can effectively improve the defects that may be produced by the existing wafer cooling and expansion device.

The present invention discloses a wafer cold expansion device, which is used to perform a splitting operation on a wafer bonded to the front side of a blue film. The wafer cold expansion device comprises: a workbench, which is formed with a through-shaped work hole; wherein the workbench is used for setting the blue film so that the position of the wafer corresponds to the work hole; a mask module, which is installed on the workbench; wherein the mask module and the workbench are used to press and fix The invention relates to a blue film having a plurality of blue film portions, wherein the blue film has a plurality of blue film portions, and the plurality of blue film portions are provided on the blue film surface. The plurality of blue film portions are provided on the blue film surface, and the plurality of blue film portions are provided on the blue film surface. The plurality of blue film portions are provided on the blue film surface, and the plurality of blue film portions are provided on the blue film surface. The plurality of blue film portions are provided on the blue film surface, and the plurality of blue film portions are provided on the blue film surface. The lifting mechanism moves between a cooling position and a pressing position relative to the working hole; and a cooling mechanism is connected to the cooling cavity, and the cooling mechanism is used to input a dry gas with a temperature below 0°C and a dew point temperature below -10°C into the cooling cavity; wherein, when the mask module and the blue film form the upper working space, the cooling cavity can move to the cooling position to press against the The back of the blue film is used to form a lower working space for receiving the dry gas to continuously cool the blue film for a preset time to enhance the bonding strength between the blue film and the wafer; wherein, after the blue film is cooled by the dry gas in the lower working space for the preset time, the cooling chamber can move up to the compressing position to expand and stretch the blue film to complete the wafer splitting operation.

The embodiment of the present invention also discloses a wafer cooling and expansion device, which is used to perform a splitting operation on a wafer bonded to the front side of a blue film, and the wafer cooling and expansion device includes: a workbench, formed with a through-shaped working hole; wherein the workbench is used to fix the blue film so that the position of the wafer corresponds to the working hole; a lifting mechanism, which is arranged corresponding to the workbench; and a cooling module, which includes: a cooling chamber, which is installed on the lifting mechanism and faces the working hole; wherein the cooling chamber can move between a cooling position and a pressing position relative to the working hole through the lifting mechanism; and a cooling mechanism, which is connected to the cooling chamber, and The refrigeration mechanism is used to input a dry gas with a temperature lower than 0°C and a dew point temperature lower than -10°C into the cooling chamber; wherein, when the workbench fixes the blue film, the cooling chamber can move to the cooling position to press against the back of the blue film to form a lower working space, which is used to receive the dry gas to continuously cool the blue film for a preset time to enhance the bonding strength between the blue film and the wafer; wherein, after the blue film is cooled by the dry gas in the lower working space for the preset time, the cooling chamber can move up to the pressing position to expand and stretch the blue film to complete the wafer splitting operation.

In summary, the wafer cooling and expansion device disclosed in the embodiment of the present invention cools the back side of the blue film through the cooling module to improve the bonding strength between the blue film and the wafer. After the blue film is stretched and expanded by the cooling chamber, the wafer splitting operation can be completed effectively and stably, and the occurrence of flying wafers can be effectively reduced.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention in any way.

The following is a specific embodiment to illustrate the implementation of the "wafer cooling and expansion equipment" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements or features, these elements or features should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one feature from another feature. In addition, the term "or" used herein may include any one or more combinations of the related listed items depending on the actual situation.

Please refer to Figures 1 to 11, which are an embodiment of the present invention. As shown in Figures 1 to 4, this embodiment discloses a wafer expansion device 100, which is used to perform a splitting operation on a wafer 300 bonded to the front side 201 of a blue tape 200. It should be noted that the blue tape 200 is a stretchable material and can also be called a die attach film (DAF), and the blue tape 200 has the property that the adhesion can be improved as its temperature decreases. Furthermore, the wafer 300 suitable for the wafer expansion device 100 can be in a state of being defined as multiple chips after being sliced (such as invisible laser cutting).

As shown in FIGS. 5 to 7 , the wafer cooling and expansion device 100 in this embodiment includes a workbench 1, a mask module 2 mounted on the workbench 1, a lifting mechanism 3 arranged corresponding to the workbench 1, a cooling module 4 mounted on the workbench 1, and a temperature recovery mechanism 5 arranged corresponding to the cooling module 4, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the wafer cooling and expansion device 100 may also omit the temperature recovery mechanism 5 according to actual needs.

The workbench 1 is formed with a through-hole 11, and the workbench 1 is used for the blue film 200 to be placed so that the position of the wafer 300 corresponds to the workbench 11. In addition, the wafer cooling and expansion equipment 100 can be further provided with a shell 6 under the workbench 1 so that components other than the mask module 2 are located inside the shell 6.

The mask module 2 and the workbench 1 are used to be pressed and fixed to the periphery of the blue film 200, so that the mask module 2 and the front side 201 of the blue film 200 together form an upper working space S1, which accommodates the wafer 300 therein. It should be noted that the mask module 2 can also be a part of the workbench 1, so that the workbench 1 can be used to fix the blue film 200, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the workbench 1 can also fix the blue film 200 through other fixing mechanisms according to actual needs, so that the mask module 2 can be omitted from the wafer cooling and expansion equipment 100.

The present embodiment describes one preferred embodiment of the mask module 2 in the following content, but is not limited thereto. The mask module 2 includes a cover body 21 pivotally connected to the workbench 1, a pressure ring 22 mounted on the outer ring portion 211 of the cover body 21, a plurality of pressurized elastic members 23, a fastening mechanism 24 mounted on the workbench 1 and the outer ring portion 211, and a heating mechanism 25 mounted inside the cover body 21.

In more detail, one side of the outer ring portion 211 of the cover body 21 is hinged to the workbench 1 so that the cover body 21 can rotate relative to the workbench 1 (such as Figures 4 and 5). Furthermore, the fastening mechanism 24 is used to fix the other side of the outer ring portion 211 to the workbench 1 so that the pressure ring 22 can be used to press the periphery of the blue film 200 to the workbench 1. Among them, a plurality of pressurizing elastic members 23 (such as springs) are installed between the pressure ring 22 and the outer ring portion 211 of the cover body 21, so that the pressure ring 22 can increase its pressure on the blue film 200 through a plurality of pressurizing elastic members 23.

In addition, the heating mechanism 25 is disposed at the top of the cover 21 in this embodiment, and the heating mechanism 25 faces the working hole 11 of the workbench 1, so that the heating mechanism 25 can be used to heat the air in the cover 21. Furthermore, the heating method of the heating mechanism 25 (such as hot air heating or infrared heating) can be adjusted and changed according to actual needs, and the present invention is not limited here.

The mask module 2 and the lifting mechanism 3 are respectively located at opposite sides of the workbench 1 (e.g., the mask module 2 is located above the workbench 1, and the lifting mechanism 3 is located below the workbench 1), and the lifting mechanism 3 is arranged corresponding to the cooling module 4.

The cooling module 4 includes a cooling chamber 41 mounted on the lifting mechanism 3, and a cooling mechanism 42 connected to the cooling chamber 41. The cooling chamber 41 faces the working hole 11, and the cooling chamber 41 can move between a cooling position (such as FIG. 8) and a pressing position (such as FIG. 9) relative to the working hole 11 through the lifting mechanism 3. Furthermore, the cooling mechanism 42 can be used to input a dry gas G with a temperature lower than 0°C and a dew point temperature lower than -10°C into the cooling chamber 41.

As described above, when the mask module 2 and the blue film 200 form the upper working space S1, the cooling chamber 41 can be moved to the cooling position (through the lifting mechanism 3) to press against the back side 202 of the blue film 200 to form a lower working space S2 (such as FIG. 8 ), which is used to receive the dry gas G to continuously cool the blue film 200 for a preset time (such as 20 seconds to 30 seconds) to enhance the bonding strength between the blue film 200 and the wafer 300.

Furthermore, after the blue film 200 is cooled by the dry gas G in the lower working space S2 for the preset time, the cooling chamber 41 can move up to the pressing position (such as FIG. 9 ) (through the lifting mechanism 3) to expand and stretch the blue film 200 to complete the splitting operation of the wafer 300. In other words, after the blue film 200 is stretched and expanded, the multiple chips 301 of the wafer 300 are separated from each other, and the bonding strength between the blue film 200 and the wafer 300 is improved, so that the multiple chips 301 are firmly adhered to the blue film 200 and are not easy to produce flying chips.

Accordingly, the wafer cooling and expansion equipment 100 in this embodiment cools the back side 202 of the blue film 200 through the cooling module 4, so as to improve the bonding strength between the blue film 200 and the wafer 300. After the blue film 200 is stretched and expanded by the cooling chamber 41, the wafer 300 can be effectively and stably split and the occurrence of flying wafers can be effectively reduced. Furthermore, the wafer cooling and expansion equipment 100 adopts a different method for processing the wafer 300 than before, which not only breaks through the technical prejudice in this field, but also can shorten the time of the splitting operation to within 1 minute, which is conducive to improving the overall productivity.

In addition, the reheating mechanism 5 is disposed outside the cooling chamber 41, and the reheating mechanism 5 is described in this embodiment as including a plurality of infrared heaters surrounding the outside of the cooling chamber 41, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the reheating mechanism 5 can also heat the cooling chamber 41 by blowing hot air.

Among them, after the wafer cooling and expansion equipment 100 completes the splitting operation (such as: Figure 10), the temperature recovery mechanism 5 can heat the cooling chamber 41 to a standby temperature, which is preferably 15°C to 18°C lower than the ambient dew point temperature, so as to avoid condensation of water droplets on the surface of the cooling chamber 41 and facilitate the next splitting operation.

It should be noted that in order for the cooling module 4 to evenly cool the back side 202 of the blue film 200 in a shorter time and quickly return the temperature to the standby temperature after the splitting operation is completed, the cooling module 4 preferably has at least part of the following structural features, but the present invention is not limited thereto.

Further, as shown in FIGS. 5 to 7 , the cooling chamber 41 in this embodiment includes a first chamber R1 and a second chamber R2 in an annular shape surrounding the first chamber R1. In this embodiment, the first chamber R1 is connected (or communicated) to the refrigeration mechanism 42 to receive the dry gas G output by the refrigeration mechanism 42 (e.g., FIG. 8 ). Furthermore, the second chamber R2 is connected to the top edge of the first chamber R1 and is connected (or communicated) to the refrigeration mechanism 42 to allow the dry gas G to flow back to the refrigeration mechanism 42.

Accordingly, when the cooling chamber 41 moves to the cooling position (such as FIG. 8 ), the top edge of the second chamber R2 presses against the back side 202 of the blue film 200, so that the first chamber R1, the second chamber R2, and the blue film 200 together form the lower working space S2 (or in other words, the lower working space S2 at this time includes the first chamber R1 and the second chamber R2), and the top edge of the first chamber R1 is spaced from the back side 202 of the blue film 200 and faces the portion of the blue film 200 to which the wafer 300 is adhered.

From another perspective, as shown in FIG. 2 and FIG. 8 , the cooling chamber 41 includes a bottom plate 411, an inner annular wall 412 connected to the bottom plate 411, a flow equalizing plate 413 fixed to the top of the inner annular wall 412, and an outer annular wall 414 connected to the bottom plate 411 and surrounding the inner annular wall 412. In this embodiment, the bottom plate 411 is connected to the refrigeration mechanism 42, and the inner annular wall 412 surrounds the portion of the bottom plate 411 connected to the refrigeration mechanism 42 (e.g., the center portion of the bottom plate 411), and the outer annular wall 414 is also connected to the refrigeration mechanism 42. That is, the bottom plate 411 , the inner annular wall 412 , and the flow equalizing plate 413 together constitute the first chamber R1 , and the bottom plate 411 , the inner annular wall 412 , and the outer annular wall 414 together constitute the second chamber R2 .

Furthermore, the refrigeration mechanism 42 includes a refrigerator 421 for generating the dry gas G, and an input pipe 422 and at least one return pipe 423 connected to the refrigerator 421. The input pipe 422 connects the refrigerator 421 and the bottom plate 411, so that the dry gas G generated by the refrigerator 421 flows to the first chamber R1. Furthermore, at least one return pipe 423 connects the refrigerator 421 and the outer ring wall 414, so that the dry gas G in the second chamber R2 flows back to the refrigerator 421.

Accordingly, when the cooling chamber 41 moves to the cooling position (such as FIG. 8 ), the top end of the outer ring wall 414 presses against the back side 202 of the blue film 200 so that the first chamber R1, the second chamber R2, and the blue film 200 together form the lower working space S2, and the current equalizing plate 413 is separated from the back side 202 of the blue film 200 and faces the portion of the blue film 200 to which the wafer 300 is adhered.

In addition, as shown in FIG11 , the wafer cooling and expansion equipment 100 can also connect the refrigeration mechanism 42 to the mask module 2 according to actual needs; for example, the refrigeration mechanism 42 is provided with an input pipeline 422 to connect to the cover body 21 and the refrigerator (not shown in FIG11 ). Accordingly, when the mask module 2 and the blue film 200 form the upper working space S1, the upper working space S1 can be used to receive the dry gas G, thereby increasing the cooling speed of the blue film 200.

[Technical Effects of the Embodiments of the Invention]

In summary, the wafer cooling and expansion device disclosed in the embodiment of the present invention cools the back side of the blue film through the cooling module to improve the bonding strength between the blue film and the wafer. After the blue film is stretched and expanded by the cooling chamber, the wafer splitting operation can be completed effectively and stably, and the occurrence of flying wafers can be effectively reduced.

The above disclosed contents are only preferred feasible embodiments of the present invention and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

100: Wafer cooling and expansion equipment 1: Workbench 11: Working hole 2: Mask module 21: Cover body 211: Outer ring 22: Compression ring 23: Pressurized elastic part 24: Fastening mechanism 25: Heating mechanism 3: Lifting mechanism 4: Cooling module 41: Cooling chamber 411: Bottom plate 412: Inner ring wall 413: Flow plate 414: Outer ring wall 42: Refrigeration mechanism 421: Refrigerator 422: Input pipeline 423: Return pipeline 5: Reheating mechanism 6: Outer shell 200: Blue film 201: Front 202: Back 300: Wafer 301: Chip S1: Upper working space S2: Lower working space G: Dry gas R1: First chamber R2: Second chamber

FIG1 is a three-dimensional schematic diagram of a wafer cooling and expansion device according to an embodiment of the present invention.

FIG. 2 is an exploded schematic diagram of FIG. 1 .

FIG. 3 is an exploded schematic diagram of FIG. 1 from another viewing angle.

FIG. 4 is a three-dimensional schematic diagram of a wafer cooling and expansion device provided with a blue film and a wafer according to an embodiment of the present invention.

FIG5 is a three-dimensional schematic diagram of the mask module of FIG4 when it is closed.

FIG. 6 is a schematic cross-sectional view along the section line VI-VI of FIG. 5 .

FIG. 7 is a partial enlarged schematic diagram of FIG. 6 .

FIG8 is a schematic diagram of the subsequent operation of FIG7.

FIG. 9 is a schematic diagram of the subsequent operation of FIG. 8 .

FIG. 10 is a schematic diagram of the subsequent operation of FIG. 9 .

FIG. 11 is a schematic cross-sectional view of another embodiment of the wafer cooling and expansion device of the present invention.

100: Wafer cooling and expansion equipment

1: Workbench

11: Working hole

2: Mask module

21: Mask body

211: Outer Ring Department

22: Compression ring

23: Pressurized elastic parts

24: Fastening mechanism

25: Heating mechanism

3: Lifting mechanism

41: Cooling chamber

411: Base plate

412: Inner ring wall

413: Current balancing plate

414: Outer Ring Wall

422: Input pipeline

423: Return pipe

5: Temperature recovery mechanism

6: Shell

200: Blue film

201: Front

202: Back

300: Wafer

S1: Upper work space

S2: Lower working space

G: Dry gas

R1: First chamber

R2: Second chamber

Claims (10)

A wafer cooling and expansion device is used to perform a splitting operation on a wafer bonded to the front side of a blue film, and the wafer cooling and expansion device comprises: A workbench, formed with a through-shaped working hole; wherein the workbench is used for the blue film to be set so that the position of the wafer corresponds to the working hole; A mask module, mounted on the workbench; wherein the mask module and the workbench are used to be pressed and fixed to the periphery of the blue film so that the mask module and the front side of the blue film together form an upper working space, which accommodates the wafer therein; A lifting mechanism, set corresponding to the workbench, and the mask module and the lifting mechanism are respectively located on opposite sides of the workbench; and A cooling module, comprising: A cooling chamber, mounted on the lifting mechanism and facing the working hole; wherein the cooling chamber can move between a cooling position and a pressing position relative to the working hole through the lifting mechanism; and A cooling mechanism, connected to the cooling chamber, and the cooling mechanism is used to input a dry gas with a temperature below 0°C and a dew point temperature below -10°C into the cooling chamber; wherein, when the mask module and the blue film form the upper working space, the cooling chamber can move to the cooling position to press against the back of the blue film to form a lower working space together, which is used to receive the dry gas to continuously cool the blue film for a preset time to enhance the bonding strength between the blue film and the wafer; Among them, after the blue film is cooled by the dry gas in the lower working space for the preset time, the cooling chamber can move up to the pressing position to expand and stretch the blue film to complete the wafer splitting operation. The wafer cooling and expansion equipment as described in claim 1, wherein the cooling chamber comprises: a first chamber connected to the refrigeration mechanism for receiving the dry gas output by the refrigeration mechanism; and a second chamber in a ring shape and surrounding the first chamber; wherein the second chamber is connected to the top edge of the first chamber and connected to the refrigeration mechanism for the dry gas to flow back to the refrigeration mechanism; wherein when the cooling chamber moves to the cooling position, the top edge of the second chamber presses against the back side of the blue film, so that the first chamber, the second chamber, and the blue film together form the lower working space, and the top edge of the first chamber is spaced from the back side of the blue film and faces the part of the blue film to which the wafer is adhered. The wafer cooling and expansion equipment as described in claim 1, wherein the cooling chamber comprises: a bottom plate connected to the refrigeration mechanism; an inner annular wall connected to the bottom plate and surrounding the portion of the bottom plate connected to the refrigeration mechanism; a flow equalizing plate fixed to the top end of the inner annular wall so that the bottom plate, the inner annular wall, and the flow equalizing plate together constitute a first chamber; and an outer annular wall connected to the bottom plate and surrounding the inner annular wall so that the bottom plate, the inner annular wall, and the outer annular wall together constitute a second chamber; When the cooling chamber moves to the cooling position, the top of the outer ring wall presses against the back of the blue film, so that the first chamber, the second chamber, and the blue film together form the lower working space, and the current equalizing plate is spaced from the back of the blue film and faces the part of the blue film where the wafer is adhered. The wafer cooling and expansion equipment as described in claim 3, wherein the refrigeration mechanism comprises: a cooler for generating the dry gas; an input pipeline connecting the cooler and the bottom plate so that the dry gas generated by the cooler flows to the first chamber; and at least one return pipeline connecting the cooler and the outer ring wall so that the dry gas in the second chamber flows back to the cooler. The wafer cooling and expansion equipment as described in claim 1, wherein the wafer cooling and expansion equipment includes a temperature recovery mechanism arranged on the outer side of the cooling chamber; wherein, after the wafer cooling and expansion equipment completes the wafer splitting operation, the temperature recovery mechanism can heat the cooling chamber to a standby temperature that is 15°C to 18°C lower than the ambient dew point temperature. The wafer cooling and expansion equipment as described in claim 1, wherein the mask module comprises: a cover body, pivotally connected to the workbench; a pressure ring, mounted on the outer ring portion of the cover body, and the pressure ring is used to press the periphery of the blue film to the workbench; and a plurality of pressurized elastic members, which are mounted between the pressure ring and the outer ring portion of the cover body. As described in claim 6, the wafer cooling and expansion equipment, wherein one side of the outer ring portion of the cover body is hinged to the workbench, and the mask module includes a fastening mechanism installed on the workbench and the outer ring portion, which is used to fix the other side of the outer ring portion to the workbench. The wafer cooling and expansion equipment as described in claim 6, wherein the mask module includes a heating mechanism installed in the cover body, which faces the working hole and is used to heat the air in the cover body. The wafer cooling and expansion equipment as described in claim 1, wherein the refrigeration mechanism is connected to the mask module so that when the mask module and the blue film form the upper working space, the upper working space can be used to receive the dry gas. A wafer cooling and expansion device is used to perform a splitting operation on a wafer bonded to the front side of a blue film, the wafer cooling and expansion device comprising: a workbench, formed with a through-hole; wherein the workbench is used to fix the blue film so that the position of the wafer corresponds to the work hole; a lifting mechanism, arranged corresponding to the workbench; and a cooling module, comprising: a cooling chamber, mounted on the lifting mechanism and facing the work hole; wherein the cooling chamber can move between a cooling position and a pressing position relative to the work hole through the lifting mechanism; and A cooling mechanism is connected to the cooling chamber, and the cooling mechanism is used to input a dry gas with a temperature lower than 0°C and a dew point temperature lower than -10°C into the cooling chamber; Wherein, when the workbench fixes the blue film, the cooling chamber can move to the cooling position to press against the back of the blue film to form a lower working space, which is used to receive the dry gas to continuously cool the blue film for a preset time to enhance the bonding strength between the blue film and the wafer; Wherein, after the blue film is cooled by the dry gas in the lower working space for the preset time, the cooling chamber can move up to the pressing position to expand and stretch the blue film to complete the wafer splitting operation.

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